US3572400A - Dispensing of fluids to small areas - Google Patents

Dispensing of fluids to small areas Download PDF

Info

Publication number
US3572400A
US3572400A US664703A US3572400DA US3572400A US 3572400 A US3572400 A US 3572400A US 664703 A US664703 A US 664703A US 3572400D A US3572400D A US 3572400DA US 3572400 A US3572400 A US 3572400A
Authority
US
United States
Prior art keywords
fluid
tip
slice
magnetic
pen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US664703A
Other languages
English (en)
Inventor
Bernard G Casner
Ray T Goulstone
Peter R Hance
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of US3572400A publication Critical patent/US3572400A/en
Assigned to AT & T TECHNOLOGIES, INC., reassignment AT & T TECHNOLOGIES, INC., CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE JAN. 3,1984 Assignors: WESTERN ELECTRIC COMPANY, INCORPORATED
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/68—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent
    • G11B5/70—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent on a base layer
    • G11B5/702—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent on a base layer characterised by the bonding agent
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/842—Coating a support with a liquid magnetic dispersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • air pressure is applied to a free piston located within the barrel of a pen that forces the magnetic fluid through the capillary tip of the pen onto the selected surface areas.
  • Methods and apparatus are provided for controlling the size and shape of the magnetic mark.
  • This invention relates generally to the manufacture of small, lightweight, nonmagnetic parts by subdividing a larger sheet of material into many such parts.
  • the invention is particularly concerned with an inspection system wherein parts formed from defective areas of a sheet are magnetically identified so that they can be magnetically separated from those parts that meet the inspection standards. More particularly, this invention relates to methods and apparatus for depositing a controlled quantity of a specially formulated, relatively high viscosity magnetic fluid on selected surface areas of a sheet of material, which deposit is of predetermined size and shape.
  • the slices are usually comprised of a rather hard, brittle material, such as silicon or germanium, thus the shaping of the wafers is readily accomplished by one of several known methods, such as by sawing the slice with a diamond-impregnated wheel, or by mounting the slice on a ruling engine, scribing fine lines with a diamond stylus, and then breaking the slice along the scribed lines.
  • ultrasonic cutting or gritblasting techniques are used in some applications.
  • a pattern of grid lines is etched through the oxide layer on the surface of a slice to outline the specific areas of the slice from which each individual wafer will be formed. Sensing elements of a test probe are then sequentially indexed from one area to the next, and certain of the electrical properties are measured. At the same time, or during a separate operation, an operator may inspect each outlined area under a microscope for any visible flaws that may appear on the surface of the slice.
  • One method of identifying the defective wafers utilizes a marking instrument, such as a pen, that, upon signal from the operator or the electrical testing device, will cause a small drop of ink to be deposited on the defective area.
  • the ink mark provides a visual identification the enables an operator to sort out the defective wafers.
  • the fluid will flow beyond the defective area and contaminate adjacent areas. This may be a particular problem in those instances where the slice has been etched with grid lines, since these etched lines will act as capillaries to feed magnetic fluid to other portions of the slice.
  • the magnetic suspension also must be capable of drying to a hard solid that will not smear when the wafers are touched or tumbled against each other.
  • volatile, quick drying vehicles it is undesirable to use volatile, quick drying vehicles in preparing the suspension, because if 3 the fluid dries too quickly at ambient conditions, the capillaries of the marking tip will clog, necessitating frequent shutdowns for replacement or cleaning of the marking tip.
  • a further object of this invention is to provide a sys tem for magnetically identifying selected areas of a sheet of material so that upon subdivision of the sheet into a plurality of small parts, the parts subdivided from the selected areas may be separated from the remaining parts.
  • a more specific object of this invention is to provide a system for magnetically identifying defective areas of semiconductor slices so that wafers formed from such defective areas can be automatically sorted from the remaining wafers.
  • Yet a further object of this invention is to provide an improved capillary device that will feed controlled quantities of magnetic particles and deposit them at precise loctaions on the surface of a sheet of material.
  • a further object of this invention is to provide a stable suspension comprised of magnetic particles in a liquid carrier that will not separate upon prolonged standing, that may be deposited with precision within a specific area, that will not flow out and contaminate adjacent areas, that will dry to a hard, nonsmearing solid, and that will feed through capillary devices without substantial clogging.
  • an improved magnetic marking fluid having a viscosity of between about 30 and 300 poises that is comprised of a suspension of magnetic particles in a substantially nonvolatile carrier liquid especially adapted to be fed by means of an improved marking device that, upon signal, will cause a metered amount of the magnetic fluid to be expressed and deposited with precision over selected areas on the surface of a sheet of material.
  • the marking device includes a free piston that, on its one face, engages the surface of the magnetic fluid contained within the marking device, and, on its other face, communicates with a source of air under pressure.
  • the marking device is movably mounted so that it may be. indexed to a position where its applicator tip is in close but nontouching proximity with the surface of the sheet of material, the amount of the magnetic fluid that is expressed, and the size, and to some extent, the shape, of the dot deposited on the surface, are controlled by regulating the delivery of the air under pressure to the disengaged face of the free piston while the applicator tip is so positioned.
  • the movement of the marking device and the delivery of air under pressure are controlled by signals received from electrical testing apparatus so that a dot of magnetic fluid will automatically be deposited at any point on the surface of the material that is found to be defective by the electrical testing apparatus.
  • FIG. 1 is a schematic flow sheet illustrating the general system of this invention
  • FIG. 2 is a schematic perspective view of the test apparatus and the magnetic marking device of this invention
  • FIG. 3 is an enlarged view of that portion of FIG. 2 enclosed in the phantom circle;
  • FIG. 4 is an enlarged schematic view, in section, of the magnetic marking device of this invention.
  • FIGS. 5 through 7 are greatly enlarged, somewhat schemtic views, in cross section, showing the applicator tip of the marking device and the object being marked, and depicting successive stages in the marking operation.
  • a semiconductor slice is initially prepared by cutting it from a large crystal usually grown from a Group IV element such as silicon or germanium. After the slice is carefully cleaned and polished, it is doped with materials such as elements from Groups III and IV of the Periodic Table to establish the desired number and types of p-n junctions.
  • the slice is now suitably prepared for subdivision into a number of wafers from which semiconductors, such as diodes and transistors, can be manufactured.
  • a hard oxide layer may be formed on its surface. Because the oxide layer is resistant to normal scribing apparatus, such as a diamond stylus, it has been found convenient to etch a grid line pattern, as with hydrofluoric acid, on the surface of the slice. Thus, not only is the hard oxide layer removed for cutting purposes, but also the individual areas of the surface of the slice from which each wafer is to be formed will be clearly identified for inspection.
  • the slice is mounted on testing apparatus so that it may be contacted with test probes.
  • the slice is indexed under the probes and, at each indexed position, a separate grid area (representing a future wafer) is contacted with the test probes for measurement of certain electrical properties.
  • each distinct area is also inspected for visible flaws under a microscope. Any area failing to pass inspection is identified by marking it with a fluid suspension of magnetic particles (hereinafter referred to for convenience as a magnetic fluid).
  • the slice is set aside, preferably in an oven, to allow the magnetic fluid to dry to a relatively hard, nonsmearing solid.
  • the slice is mounted on a ruling engine and fine lines are scribed within the etched grid lines by using a fine diamond-tipped stylus.
  • the slice is then broken into individual wafers by any convenient technique such as by placing the slice between two thin sheets of flexible material and then running a small roller back and forth over the surface of the enclosed slice.
  • the individual wafers After the individual wafers have been formed, they are sieved to remove random small chips and pieces as well as any oversize material. The middlings are then subjected to the influence of a magnetic field and the inferior Wafers containing a deposit of magnetic particles are separated from those wafers that have passed inspection.
  • FIGS. 2 and 3 The details of the inspection device are schematically illustrated in FIGS. 2 and 3.
  • a semiconductor slice 10 is mounted on the upper surface 11 of a movable platform 12. It is convenient to secure the slice 10 on the upper surface 11 by means of a vacuum. This can be accomplished by attaching a vacuum line (not shown) to a chamber (not shown) located within the platform 12. The vacuum chamber is placed in communication with the underside of slice 10 by providing air passageways through the upper surface 11. As indicated by the arrows in FIG. 2, the platform 12 is mounted for movement in a horizontal plane, either backwards and forwards or from side to side.
  • the slice 10 is etched with grid lines 1313 which define individual areas 14 14 from which individual wafers will be formed.
  • a pair of electrodes 16 is adapted to contact, upon signal, the surface of each of the areas 1414.
  • These electrodes 16 are suitably connected to an electrical test set 17 that measures certain of the electrical properties of the wafer. Since the electrical testing equipment forms no basis of this invention and is well known in the art, the details of its operation and construction are not described herein.
  • the output from the electrical test set 17 communicates via an electrical cable 18 to a magnetic fluid dispenser control 19.
  • An arm 21 is pivotally mounted in magnetic fluid dispenser control 19 at pivot point 20 for up and down movement and the arm 21 supports at its free end a pen 22.
  • the pen 22 includes a marking tip 23 and a barrel 24 that serves as a reservoir for a supply of magnetic fluid.
  • the upper end of the barrel 24 communicates with the magnetic fluid dispenser control 19 by means of an air line 26.
  • the pen 22 is comprised of a main body portion or barrel 24 having an internal bore of regular cross section, preferably circular.
  • the upper portion of the barrel 24 is provided with screw threads 28 in order that it may be removably secured in sealing relationship with a coupling member 29.
  • the upper portion of the coupling member 29 is drilled and tapped to receive a locking bolt 31 that enables removably securing air line 26 in sealing relationship with the coupling 29.
  • a passageway 32 is provided through the coupling 29 to provide for communication between the air line 26 and the interior of the pen barrel 24.
  • a fixture 33 may be provided to secure the air line 26 to the support arm 21.
  • a source of compressed air 34 communicates via a pressure regulator control valve 36- with air line 26 and is functionally associated with the magnetic fluid dispenser control 19 to apply compressed air at a regulated pressure to the interior of the pen 22.
  • the lower portion of the barrel 24 of the pen 22 is reduced in diameter and is adapted to receive the pen tip 23.
  • the pen tip 23 preferably is a capillary feed device having an orifice 37.
  • a suitable tip for marking wafer areas 1414 that are approximately 20 mils square can be readily prepared by removing the plunger from a commercially available inking pen tip sold under the trade designation of a 3/0 Leroy pen.
  • the outer diameter of this tip is approximately mils and the inner diameter approximately 3.5 mils.
  • a portion of the interior of the pen 22 is filled with a magnetic fluid 38 and a ball 39 is placed over its upper surface.
  • the diameter of the ball 39 closely corresponds to the interior diameter of the cylindrical barrel 24 so that it may move in fluid sealing relationship with the inner walls of the barrel 24.
  • the ball 39 acts as a free piston, and when compressed air is applied via air line 26 on the upper surface of the ball 39, pressure is exerted uniformly over the entire cross sectional area of the fluid 38, tending to force the fluid from the pen tip in a manner discussed in more detail hereinafter.
  • Other geometric shapes, such as cylinders, for example may be substituted for the ball, provided only that the shapes conform to the interior walls of the barrel 24 and will slide in substantial fluid sealing relationship therewith.
  • the free piston described above is an important element of the instant invention in that it enables the use of high viscosity magnetic fluids, as defined more fully hereinafter.
  • the viscosity of the magnetic fluid it is desirable for the viscosity of the magnetic fluid to be sutficiently high to prevent the solids from separating from the carrier liquid, to prevent the magnetic fluid from flowing or dripping, as by gravity, from the applicator tip, and to prevent the magnetic fluid from flowing from the defective area to adjacent areas of the slice.
  • a fluid having this desired viscosity will have a consistency similar to a heavy grease that will not flow to any appreciable extent due to its own weight.
  • the instant invention provides a system in which there is a cooperative relationship between the design of the free piston pen and the formulation and viscosity of the magnetic fluid.
  • a semiconductor slice 10 is placed on the upper surface 11 of the platform 12 and is held in position, as by means of a vacuum.
  • the platform 12 is initially adjusted so that the electrodes 16 are positioned over the surface of the first inscribed area of a row.
  • the sequence of operation remains the same.
  • the electrodes 16 move down into electrical contact with the surface of an inscribed area 14. Electrical measurements are taken and the electrodes are retracted from the surface of the inscribed area 14.
  • the semiconductor slice is then indexed to the next position so that the immediately adjacent inscribed area in the same row is moved under the electrodes 16.
  • the area previously tested moves into a position directly under the tip 23 of the pen 22.
  • the electrodes 16 again engage the surface of the slice 10 in order that the electrical properties of the area newly moved into position may be measured.
  • the magnetic fluid dispenser control 19 will receive a signal from the electrical test set 17, which causes the pen 22 to be lowered and applies a dot 40 of the mag netic fluid to the defective area.
  • the support arm 21 is activated, as by a solenoid 43 to cause the pen 22 to move downard a preset distance toward the slice 10, from a normal retracted position shown in FIG. 4 to a fluid-applying position shown in FIG. 6.
  • the compressed air source 34 is activated so that compressed air at a predetermined pressure is applied to the top of the ball 39.
  • the pressure is set in accordance with various parameters, such as the viscosity of the ink and the size of the dot 40 desired, by adjusting the regulator 36. In one typical example, using the magnetic fluid described hereinafter, the pressure is normal ly set within the range of about 1015 p.s.i. gauge.
  • the ink at the end of the applicator tip 23 swells by pressure into a rounded drop configuration 41 (referred to hereinafter as a bulge) depicted in FIG. 5.
  • a bulge 41 strikes the surface of the slice 10 (FIG. 6)
  • the surface tension is broken and the fluid wets the surface of the slice and flows out a limited distance in all directions around the center of the tip 23.
  • the full lowering of the applicator tip 23 assists in this regard by forcing an annular portion of the drop 41 against the surface of the slice and in spreading the fluid uniformly about the center of the tip.
  • the final clearance between the applicator tip 23 and the slice 10 is quite small (for example, 12 mils in the specific example, using the 3/0 Teroy applicator tip to make a 12-15 mil dot) to assist in applying and spreading the viscous fluid 38.
  • the final clearance of the applicator tip 23 will control the thickness of the dot 40 since the tip 23 will cause the fluid to be extruded under the side walls of the tip 23 and so be flattened to a thickness approximately corresponding to the clearance.
  • the dimensions (diameter) of the dot 40 may be governed quite closely, such as by the shape of the orifice 37 and by other process factors such as the air pressure and the time that the pressure is applied while the applicator tip is in the down position of FIG. 6. The longer that the air pressure is applied while the tip is down, the more fluid will flow out of the tip to increase the size of the dot 40.
  • the size is regulated in the specific example to be only slightly larger than the pen tip; for example, 12-15 mils for the magnetic dot using a mil O.D. pen tip to mark a 20 by 20 mil wafer area.
  • the dot 40 is made as large as is reasonably practical, without causing the fluid to flow over onto nondefective wafer areas.
  • the down time, dot size may be controlled either manually by an operator inspecting the process through a microscope, or automatically by an adjustable timer in automatic versions of the equipment. In the specific example given, the down time is set between about 50 and 200 milliseconds and, depending on the other variables, usually about 100 milliseconds.
  • the application of air pressure may be considered as a pulse, but preferably the supply of air is maintained at a constant pressure from a time somewhat prior to the tip 23 reaching its lowest point to a time just prior to the retracting of the tip. Just prior to retraction, the air pressure is shut off and the line 26 vented by the regulator 36, so that there will be no tendency for the fluid to continue to flow as the pen retracts.
  • the retracting step is depicted in FIG. 7, showing the irregularly rounded dot 40 left on the slice and a rounded portion 42 constituting an approximate, slightly smaller mirror image left at the tip of the pen as the pen retracts and the fluid portions 40 and 42 are broken.
  • the fluid 38 wets and adheres to the face of the pen tip 23 in preparation for the next marking operation. In starting up the system, several bursts of air may be required to force the fluid to wet the bottom face of the pen and to form itself into the rounded portion 42 in preparation for the subsequent formation of a bulge 41.
  • the above process controls are quite important in the successful practice of this invention. For example, if the final clearance between the tip 23 and the surface of the slice 14 is too great, the dot 40 will not be flattened and may flow in a slightly uncontrolled manner by wetting the surface of the slice. Conversely, if the tip 23 touches the surface of the slice, futher flow of fluid 38 through the tip 23 will be blocked or inhibited and a doughnut shaped dot will be deposited. Contact of the tip with the slice is also undesirable since it will blunt the tip and destroy its tolerances.
  • the fluid 38 be expressed (other than the initial bulge 41) only after the final clearnce between the tip 23 and the surface of the slice has been obtained. If the desired amount of fluid is expressed prior to this time, the fluid 38 will clim the side walls of the tip 23. This will result in several problens such as the proper amount of fluid may not be delivered to the surface of the slice or, on the other hand, the fluid 38 may accumulate on the tip and then, after a period of time, slough off of the tip in uncontrolled amounts at uncontrolled intervals.
  • the delayed action of the pen 22 in marking the slice after the inscribed area has been inspected and indexed away from the electrodes 16 is solely a matter of practicality since the space superjecent the inscribed areas is too limited to accomodate both a pair of electrodes 16 and a pen 22.
  • the slice 10 It is also desirable to inspect the semiconductor slice 10 for visual defects. This may be done conveniently in a second operation in which the slice is mounted on a platform 12 and is indexed from position to position as described above. In this case, however, the slice is viewed under a miscroscope by the operator and, when a fault is discovered, a signal is sent directly to the magnetic fluid dispenser 19 and a small dot 40 of magnetic fluid is deposited on the defective area in the same manner as described above.
  • the composition of the magnetic fluid is rather critical since its characteristics are important to the successful practice of this invention.
  • the magnetic fluid should have a high magnetic solids content to maximize the magnetic deposit on the wafer and it must have a sufficiently high viscosity to prevent the gravimetric separation of the magnetic particles from the carrier liquid, to prevent the fluid from flowing by gravity or dripping from the tip of the pen, and to prevent the fluid from flowing over the surface of the slice.
  • the viscosity of the fiuid must be sufficiently low to enable the fluid to be expressed by pressure through the small orifice '37 of the capillary marking device. It has been found that these conditions can be met if the fiuid has a viscosity, as measured on 3. Larry Viscometer at 25 C., of between about 30 and 300 poises and more particularly in a range of from about 55 and 75 poises.
  • a further requirement for the magnetic fluid is that it must dry to a reasonable hardness so that it will not smear when the slices are handled in later processing. This requirement is complicated by the fact that conventional quick-drying, volatile fluids will evaporate at the tip of the pen and will cause the small orifice to clog quite rapidly. It has been found, however, that if comparatively nonvolatile drying or semidrying oils are used as the vehicle, the magnetic fiuid will dry to a nonsmearing solid when deposited on a slice, but will not evaporate and clog the small orifice of the pen tip.
  • the vehicle may be a drying or semidrying oil, a drying or semidrying oil modified by a natural or synthetic resin, or a synthetic vehicle.
  • Particularly suitable are the vehicles known as lithographic vehicles or varnishes comprising a base capable of'fluid flow.
  • the base may be a bodied oil, such as boiled linseed oil, or a hydrocarbon, or an oil from the synthetic resinous materials such as alkyd resin or a phenol formaldehyde resin.
  • varnishes that are useful in the practice of this invention: linseed-modified phenol formaldehyde varnish; bodied linseed oil varnish; maleic-alkyd varnish; pentaerythritol alkyd varnish; and hydrocarbon varnishes.
  • the magnetic component of the marking fluid is preferably comprised of a ferromagnetic material such as magnetic iron or iron oxide in very finely divided fortrn.
  • a ferromagnetic material such as magnetic iron or iron oxide in very finely divided fortrn.
  • One particularly suitable iron oxide is marketed under the trade name IRN-lOO by the C. K. Williams Company, and is described as an acicular iron oxide prepared by known reduction and oxidation techniques.
  • a surfactant in the magnetic fluid to help the fluid wet the surface of a slice.
  • a surfactant Any of a number of well known surfactants may be used and soybean licithin may be mentioned by way of example as being particularly suitable.
  • the amount of magnetic particles present in the mag netic fluid is important in establishing the required properties of viscosity and flow. As discussed above, it is desired to include the maximum amount of magnetic particles that is possible without raising the viscosity of the fluid beyond acceptable limits of flow. Generally it may be said that the magnetic iron particles should be present in the liquid vehicle in an amount from about at least 45% to obtain a minimum acceptable viscosity and up to about 60% by Weight Without exceeding the maximum acceptable viscosity. More preferably, the magnetic particles should be present in an amount of from about 50% to 56% by weight. 53% :1% magnetic iron oxide by weight is almost ideal in the system for marking slices as described in detail hereinabove.
  • EXAMPLE Weight percent Linseed modified phenolic varnish 24 Linseed oil (bodied) 22 Iron oxide (IRN100) 53 Lecithin 1 Total 100
  • the above formulated magnetic fluid has a viscosity of about 60 to 65 poises as measured at 25 C. with a Laray Viscometer.
  • the fluid may be expressed, without dripping or running, through a 3/0 Leroy tip (3.5 mils internal diameter) when a pressure of to 12 psi. gauge is applied to the device of this invention having a free piston located over the fluid reservoir in the marking pen.
  • the fluid When the fluid is deposited as described in detail above with the apparatus of this invention, the fluid will wet the surface of an area about 10 to 15 mils in diameter but will not flow off of the surface of the Wafer and contaminate adjacent areas of a slice.
  • the magnetic fluid When dried in an oven, for example, at 200 C. for one hour, the magnetic fluid will dry to a relatively hard, nonsmearing solid. Further, the dot will tightly adhere to the surface of the slice and will not be dislodged in subsequent handling operations, such as in breaking the slice into wafers and the screening of the wafers.
  • the marking pen may be used for periods of several days. The tip will not clog, the magnetic particles will not separate from the carrier liquid, and channels will not be opened through the magnetic fluid contained in the reservoir of the pen.
  • a magnetic fluid suitable for use in the practice of this invention can also be prepared by thoroughly mixing 10% by weight linseed oil with a commercially available product as sold by the A. B. Dick Company under the trade designation 3-3101 Magnetic Black Ink.
  • the defective wafers may conveniently be separated from the unmarked ones, without any specific orientation being necessary, by magnetic methods.
  • Preferred magnetic sorting systems are disclosed in related, commonly assigned, copending application of the applicants, B. G. Casner and R. T. Goulstone, Ser. Nos. 664,704 and 665,169, filed Aug. 31, 1969 and Sept. 1, 1967 respectively.
  • Apparatus for delivering fluid to limited areas of the surface of a substrate comprising:
  • a hollow member in fluid communication at one of its ends with the tip and adapted to contain a supply of the fluid
  • the moving means comprises a support arm that is pivotally mounted at its one end for rotation in a substantially vertical plane and supports the tip and barrel at its other end, whereby the tip and the barrel can be moved vertically.
  • Apparatus according to claim 3 including motor means to effect the rotation of the movable support, whereby the tip can be indexed into and out of immediately adjacent, nontouching relationship with the surface of the substrate.
  • the pressure producing means comprises:
  • an air valve for controlling the flow of air under pressure from the source of air to the interior of the hollow member
  • a free piston mounted for reciprocation while in fluid sealing relationship with the interior side walls of said member.
  • Apparatus according to claim 5 in which a supply of the fluid is contained within the barrel portion adjacent the tip end of the barrel and the free piston is positioned between the supply of fluid and the air connection, whereby the fluid may be expressed through the marking tip by pressure exerted on the fluid by the free piston when the air valve is opened.
  • a method for delivering fluid to a limited area on the surface of a substrate in which method air under pressure is utilized to express the fluid through a capillary marking tip functionally associated with one end of a closed reservoir containing the fluid, comprising the steps of:
  • liquid vehicle is a drying oil, a semidrying oil, a drying oil modified by a natural resin, a semidrying oil modified by a nautral resin, a drying oil modified by a synthetic resin, a semidrying oil modified by a synthetic resin, or a synthetic vehicle.
  • the lithographic varnish is a linseed-modified phenol formaldehyde varnish; bodied linseed oil varnish; maleic alkyd varnish; pentaerythritol alkyd varnish; or a hydrocarbon varnish.
US664703A 1967-08-31 1967-08-31 Dispensing of fluids to small areas Expired - Lifetime US3572400A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US66470367A 1967-08-31 1967-08-31

Publications (1)

Publication Number Publication Date
US3572400A true US3572400A (en) 1971-03-23

Family

ID=24667101

Family Applications (1)

Application Number Title Priority Date Filing Date
US664703A Expired - Lifetime US3572400A (en) 1967-08-31 1967-08-31 Dispensing of fluids to small areas

Country Status (8)

Country Link
US (1) US3572400A (sv)
BE (1) BE720054A (sv)
DE (1) DE1796091B2 (sv)
ES (1) ES357883A1 (sv)
FR (1) FR1604366A (sv)
GB (1) GB1241675A (sv)
NL (2) NL6812380A (sv)
SE (2) SE6811183A0 (sv)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933187A (en) * 1974-03-05 1976-01-20 Stromberg-Carlson Corporation Controlled epoxy dispensing technique as related to transistor chip bonding
FR2288305A1 (fr) * 1974-10-14 1976-05-14 Unilever Nv Distributeur de liquide
US3963551A (en) * 1974-03-05 1976-06-15 Stromberg-Carlson Corporation Method for bonding semiconductor chips
FR2299625A1 (fr) * 1975-01-08 1976-08-27 Eastman Kodak Co Recipient, appare
US4041995A (en) * 1975-01-30 1977-08-16 Eastman Kodak Company Gas pressure-activated drop dispenser
US4365728A (en) * 1978-03-13 1982-12-28 Pilot Man-Nen-Hitsu Kabushiki Kaisha Liquid discharge apparatus
DE3122984A1 (de) * 1981-06-10 1983-01-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer helbleiterchip
US4400708A (en) * 1981-08-28 1983-08-23 Sachs Richard L Disposable inker cartridge and holder therefor
US4441532A (en) * 1982-05-03 1984-04-10 The United States Of America As Represented By The Secretary Of The Army Apparatus and method for generating single droplets
US4762594A (en) * 1987-01-29 1988-08-09 Medtest Systems, Inc. Apparatus and methods for sensing fluid components
WO1990005910A1 (en) * 1988-11-14 1990-05-31 I Stat Corp Wholly microfabricated biosensors and process for the manufacture and use thereof
US5063081A (en) * 1988-11-14 1991-11-05 I-Stat Corporation Method of manufacturing a plurality of uniform microfabricated sensing devices having an immobilized ligand receptor
US5086270A (en) * 1988-07-08 1992-02-04 Tokyo Electron Limited Probe apparatus
US5089229A (en) * 1989-11-22 1992-02-18 Vettest S.A. Chemical analyzer
US5212050A (en) * 1988-11-14 1993-05-18 Mier Randall M Method of forming a permselective layer
US5250262A (en) * 1989-11-22 1993-10-05 Vettest S.A. Chemical analyzer
US5334353A (en) * 1993-02-03 1994-08-02 Blattner Frederick R Micropipette device
US5525515A (en) * 1993-02-03 1996-06-11 Blattner; Frederick R. Process of handling liquids in an automated liquid handling apparatus
US5811314A (en) * 1996-06-07 1998-09-22 General Instrument Of Taiwan, Ltd. Magnetic ink and method for manufacturing and sifting out of defective dice by using the same
WO1998048935A1 (en) * 1997-04-25 1998-11-05 Minnesota Mining And Manufacturing Company Method and apparatus for depositing precisely metered quantities of an emulsion on a surface
US6241385B1 (en) 1994-05-06 2001-06-05 3M Innovative Properties Co Reversible chemical thermometer
US6306594B1 (en) 1988-11-14 2001-10-23 I-Stat Corporation Methods for microdispensing patterened layers
EP1399268A1 (en) * 2001-06-01 2004-03-24 Litrex Corporation Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
US20040140371A1 (en) * 2003-01-16 2004-07-22 Engel Harold J. Nozzle end configuration
US20050036911A1 (en) * 2003-08-12 2005-02-17 Sellers James M. Slide cartridge and reagent test slides for use with a chemical analyzer, and chemical analyzer for same
US6864675B2 (en) * 2000-12-22 2005-03-08 Nippon Foundry Inc. Mark forming method, mark forming apparatus and analyzing apparatus
US20070051191A1 (en) * 2005-09-05 2007-03-08 Hung-Yen Lin Wafer measuring fixture
WO2008115582A1 (en) * 2007-03-21 2008-09-25 Quidel Corporation Method of detecting a defective part or assembly using magnetic ink for marking during manufacturing
US20100254854A1 (en) * 2007-05-08 2010-10-07 Idexx Laboratories, Inc. Chemical analyzer
US8585989B2 (en) 2003-12-04 2013-11-19 Idexx Laboratories, Inc. Retaining clip for reagent test slides
CN106328555A (zh) * 2016-08-26 2017-01-11 扬州杰盈汽车芯片有限公司 一种应用于半导体的磁力喷墨测试工艺
US9797916B2 (en) 2014-01-10 2017-10-24 Idexx Laboratories, Inc. Chemical analyzer
US11977091B2 (en) 2020-07-10 2024-05-07 Idexx Laboratories Inc. Point-of-care medical diagnostic analyzer and devices, systems, and methods for medical diagnostic analysis of samples

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2182207B (en) * 1985-10-29 1988-12-14 Marconi Instruments Ltd Electrical circuit identification
US5101219A (en) * 1990-04-12 1992-03-31 Gerber Garment Technology, Inc. Long life pen and ink supply unit for x,y plotter and the like and related method of use
US6634504B2 (en) * 2001-07-12 2003-10-21 Micron Technology, Inc. Method for magnetically separating integrated circuit devices
DE102015105752B4 (de) * 2015-04-15 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung mit Reservoir für Markermaterial

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933187A (en) * 1974-03-05 1976-01-20 Stromberg-Carlson Corporation Controlled epoxy dispensing technique as related to transistor chip bonding
US3963551A (en) * 1974-03-05 1976-06-15 Stromberg-Carlson Corporation Method for bonding semiconductor chips
FR2288305A1 (fr) * 1974-10-14 1976-05-14 Unilever Nv Distributeur de liquide
FR2299625A1 (fr) * 1975-01-08 1976-08-27 Eastman Kodak Co Recipient, appare
US4041995A (en) * 1975-01-30 1977-08-16 Eastman Kodak Company Gas pressure-activated drop dispenser
US4365728A (en) * 1978-03-13 1982-12-28 Pilot Man-Nen-Hitsu Kabushiki Kaisha Liquid discharge apparatus
DE3122984A1 (de) * 1981-06-10 1983-01-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer helbleiterchip
US4400708A (en) * 1981-08-28 1983-08-23 Sachs Richard L Disposable inker cartridge and holder therefor
US4441532A (en) * 1982-05-03 1984-04-10 The United States Of America As Represented By The Secretary Of The Army Apparatus and method for generating single droplets
US4762594A (en) * 1987-01-29 1988-08-09 Medtest Systems, Inc. Apparatus and methods for sensing fluid components
US5086270A (en) * 1988-07-08 1992-02-04 Tokyo Electron Limited Probe apparatus
US5554339A (en) * 1988-11-14 1996-09-10 I-Stat Corporation Process for the manufacture of wholly microfabricated biosensors
US5837446A (en) * 1988-11-14 1998-11-17 I-Stat Corporation Process for the manufacture of wholly microfabricated biosensors
US5200051A (en) * 1988-11-14 1993-04-06 I-Stat Corporation Wholly microfabricated biosensors and process for the manufacture and use thereof
US5212050A (en) * 1988-11-14 1993-05-18 Mier Randall M Method of forming a permselective layer
US6306594B1 (en) 1988-11-14 2001-10-23 I-Stat Corporation Methods for microdispensing patterened layers
WO1990005910A1 (en) * 1988-11-14 1990-05-31 I Stat Corp Wholly microfabricated biosensors and process for the manufacture and use thereof
US5063081A (en) * 1988-11-14 1991-11-05 I-Stat Corporation Method of manufacturing a plurality of uniform microfabricated sensing devices having an immobilized ligand receptor
US5089229A (en) * 1989-11-22 1992-02-18 Vettest S.A. Chemical analyzer
US5250262A (en) * 1989-11-22 1993-10-05 Vettest S.A. Chemical analyzer
US5336467A (en) * 1989-11-22 1994-08-09 Vettest S.A. Chemical analyzer
US5525515A (en) * 1993-02-03 1996-06-11 Blattner; Frederick R. Process of handling liquids in an automated liquid handling apparatus
US5334353A (en) * 1993-02-03 1994-08-02 Blattner Frederick R Micropipette device
US6420184B1 (en) 1994-05-06 2002-07-16 3M Innovative Properties Company Process of making a reversible chemical thermometer
US6241385B1 (en) 1994-05-06 2001-06-05 3M Innovative Properties Co Reversible chemical thermometer
US5811314A (en) * 1996-06-07 1998-09-22 General Instrument Of Taiwan, Ltd. Magnetic ink and method for manufacturing and sifting out of defective dice by using the same
US5976252A (en) * 1997-04-25 1999-11-02 3M Innovative Properties Company Apparatus for depositing precisely metered quantities of an emulsion on a surface
WO1998048935A1 (en) * 1997-04-25 1998-11-05 Minnesota Mining And Manufacturing Company Method and apparatus for depositing precisely metered quantities of an emulsion on a surface
US6864675B2 (en) * 2000-12-22 2005-03-08 Nippon Foundry Inc. Mark forming method, mark forming apparatus and analyzing apparatus
EP1399268A1 (en) * 2001-06-01 2004-03-24 Litrex Corporation Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
EP1399268A4 (en) * 2001-06-01 2005-08-24 Litrex Corp CON U MICRO-POSITIONING SYSTEM FOR POLYMER ELECTROLUMINESCENT DIODE DISPLAYS, PRINTED CIRCUIT BOARDS AND THE LIKE
US6832733B2 (en) * 2003-01-16 2004-12-21 Harold J. Engel Nozzle end configuration
US20040140371A1 (en) * 2003-01-16 2004-07-22 Engel Harold J. Nozzle end configuration
US20050036911A1 (en) * 2003-08-12 2005-02-17 Sellers James M. Slide cartridge and reagent test slides for use with a chemical analyzer, and chemical analyzer for same
US8287823B2 (en) 2003-08-12 2012-10-16 Idexx Laboratories, Inc. Slide cartridge and reagent test slides for use with a chemical analyzer, and chemical analyzer for same
US7273591B2 (en) 2003-08-12 2007-09-25 Idexx Laboratories, Inc. Slide cartridge and reagent test slides for use with a chemical analyzer, and chemical analyzer for same
US20070297946A1 (en) * 2003-08-12 2007-12-27 Sellers James M Slide cartridge and reagent test slides for use with a chemical analyzer, and chemical analyzer for same
US8585989B2 (en) 2003-12-04 2013-11-19 Idexx Laboratories, Inc. Retaining clip for reagent test slides
US20070051191A1 (en) * 2005-09-05 2007-03-08 Hung-Yen Lin Wafer measuring fixture
US7431260B2 (en) * 2005-09-05 2008-10-07 Powerchip Semiconductor Corp. Wafer measuring fixture
WO2008115582A1 (en) * 2007-03-21 2008-09-25 Quidel Corporation Method of detecting a defective part or assembly using magnetic ink for marking during manufacturing
US8494787B2 (en) 2007-03-21 2013-07-23 Quidel Corporation Magnetic ink for marking defective parts or assemblies during manufacturing
US20080262644A1 (en) * 2007-03-21 2008-10-23 Mcleod Scot Magnetic ink for marking defective parts or assemblies during manufacturing
US20100254854A1 (en) * 2007-05-08 2010-10-07 Idexx Laboratories, Inc. Chemical analyzer
US9116129B2 (en) 2007-05-08 2015-08-25 Idexx Laboratories, Inc. Chemical analyzer
US9823109B2 (en) 2007-05-08 2017-11-21 Idexx Laboratories, Inc. Chemical analyzer
US9797916B2 (en) 2014-01-10 2017-10-24 Idexx Laboratories, Inc. Chemical analyzer
CN106328555A (zh) * 2016-08-26 2017-01-11 扬州杰盈汽车芯片有限公司 一种应用于半导体的磁力喷墨测试工艺
US11977091B2 (en) 2020-07-10 2024-05-07 Idexx Laboratories Inc. Point-of-care medical diagnostic analyzer and devices, systems, and methods for medical diagnostic analysis of samples

Also Published As

Publication number Publication date
FR1604366A (sv) 1971-11-08
DE1796091B2 (de) 1973-02-15
NL6812380A (sv) 1969-03-04
BE720054A (sv) 1969-02-03
SE401055B (sv) 1978-04-17
ES357883A1 (es) 1970-04-01
DE1796091A1 (de) 1972-02-24
SE6811183A0 (sv) 1969-03-01
NL7407603A (sv) 1974-08-26
GB1241675A (en) 1971-08-04

Similar Documents

Publication Publication Date Title
US3572400A (en) Dispensing of fluids to small areas
US3623603A (en) Magnetic identification and separation of small parts
US3345567A (en) Multipoint probe apparatus for electrically testing multiple surface points within small zones
US3599093A (en) Apparatus including a wire tipped probe for testing semiconductor wafers
KR20100132536A (ko) 광방출 조절 방법 및 광방출 조절 방법을 이용하여 제조된 장치
DE112018006577T5 (de) Ionenfräsvorrichtung und Ionenquellen-Justierverfahren für Ionenfräsvorrichtung
US3453545A (en) Probe assembly for testing semiconductor wafers including a wafer vibrator for effecting good test connections
DE2001534B2 (de) Reinigungseinrichtung fuer die kontaktflaechen von messkontakten in einem elektrischen pruefgeraet
US3507389A (en) Methods and apparatus for the magnetic separation of fine parts
US3474904A (en) Methods and apparatus for the magnetic separation of fine parts
US6186609B1 (en) Apparatus and method for dispensing ink on an object
US3627124A (en) Method for separating selected articles from an array
DE3932572A1 (de) Verfahren zur charakterisierung einer isolationsschicht und anordnung zum durchfuehren des verfahrens
US4021735A (en) Method and apparatus for making a metal to semiconductor contact
DE102020216544A1 (de) Sic-ingot-bearbeitungsverfahren und laserbearbeitungsvorrichtung
DE2349007A1 (de) Graviereinrichtung und gravierverfahren
DE2608427A1 (de) Verfahren zum aufkitten von halbleiterscheiben
JPH0118309Y2 (sv)
DE102011100984B3 (de) Verfahren zur Markierung von Halbleiter-Chips und Vorrichtung zur Markierung
DE102007015284A1 (de) Testvorrichtung für Halbleiterbauelemente
DE1794374A1 (de) Verfahren zum markieren und aussondern elektrisch schadhafter halbleiterbauelemente auf einer halbleiterscheibe
DE102006030589A1 (de) Positioniereinheit für optische und/oder elektrische Prüfsysteme
DE112013003093T5 (de) Messvorrichtung, Messverfahren und Elementherstellungsverfahren unter Verwendung des Messverfahrens
WO2012059365A1 (de) Vorrichtung und verfahren zum haltern und kontaktieren von wafern
DE1640492C (de) Verfahren und Vorrichtung zum Prüfen der Lotverbindungen von als Moduln ausge bildeten Schaltkreisen

Legal Events

Date Code Title Description
AS Assignment

Owner name: AT & T TECHNOLOGIES, INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868

Effective date: 19831229