US3550325A - Apparatus for providing a finished surface on workpieces - Google Patents

Apparatus for providing a finished surface on workpieces Download PDF

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Publication number
US3550325A
US3550325A US715350A US3550325DA US3550325A US 3550325 A US3550325 A US 3550325A US 715350 A US715350 A US 715350A US 3550325D A US3550325D A US 3550325DA US 3550325 A US3550325 A US 3550325A
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US
United States
Prior art keywords
workpiece
finishing
receiver
carrier
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US715350A
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English (en)
Inventor
Fred E Goetz
Perry R Druzba Jr
James R Hause
Gerard Seeley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
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International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of US3550325A publication Critical patent/US3550325A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement

Definitions

  • the apparatus includes a carrier having drive means for moving the carrier along a linear path of travel.
  • a rotatable mount which is carried by the carrier includes a depending workpiece receiver which is rotatably connected to the mount, the receiver being mounted eccentrically with respect to the carrier. Means are provided for imparting rotation to the mount and separate means such as springs are connected ybetween the receiver and the carrier so as to inhibit rotation of the receiver while permitting oscillation thereof.
  • the finishing table upon which the carriers ride may be provided with a plurality of finishing surfaces, each adapted for different finishing operations with intermediate cleaning surfaces to clean the workpiece of any residue adhering thereto from a previous finishing surface.
  • Another object of the present invention is to provide Patented Dec. 29, 1970 lCe a continuous finishing process and apparatus in which no one portion of the workpiece surface is abraded more than any other .portion of the surface.
  • Still another object of the present invention is to provide novel workpiece carriers to eliminate the necessity of using adhesives and/or waxes to retain the workpiece against the finishing surface.
  • Still another object of the present invention is to provide novel apparatus which will permit the surface of the workpiece being finished to seek its natural plane eliminating the necessity of providing coplaner surfaces.
  • Yet another object of the present invention is to provide workpiece receiver means which may be oscillated against a finishing surface while being subjected simultaneously to longitudinal movement along the finishing surface to form a continuous finishing line.
  • Another object of the present invention is to provide apparatus in which the rate of removal of the surface of the workpiece may be varied by changing the rate of oscillation along with velocity of rectilinear motion.
  • Still another object of the present invention is to provide a polishing table having a plurality of finishing surfaces which are easily changed so as to provide a fresh surface upon which the workpiece may be finished in a continuous manner.
  • FIG. 1 is a fragmentary perspective view illustrating a plurality of workpiece carriers constructed in accordance with the present invention and operating in accordance with the method of the present invention;
  • FIG. 2 is a fragmentary perspective view of a portion of the finishing table showing the manner in which workpieces may be removed from the workpiece holders as the holders move from left to right in FIG. l;
  • FIG. 3 is a fragmentary enlarged sectional view of a typical carrier of the present invention.
  • FIG. 4 is a fragmentary sectional view taken along lines 4 4 of FIG. 3, and as if FIG. 3 were not in section, with portions of the carrier removed to clarify the structure;
  • FIG. 5 is a schematic side elevational View of a process line for finishing the surface of a workpiece in accordance with the method of the present invention
  • FIG. 6 is a schematic plan view of a portion of the apparatus best illustrated in FIGS. 3 and 4, and showing in broken lines the oscillatory action of the workpiece receiver as the carrier progresses from left to right in FIG. 5;
  • FIG. 7 illustrates a modification of the carrier to provide an oscillatory motion to the workpiece receiver.
  • a finishing table 10 having a plurality of carriers thereon is shown progressing from left to right over a finishing surface 111.
  • the carrier 40 moves in the longitudinal direction, the workpieces held thereby are provided with an oscillatory motion so that all portions of the surface of the workpiece 12, bearing against thefinishing surface 11 will be exposed to substantially the same amount of travel.
  • the workpieces may be of any configuration, in the present instance the typical workpiece (shown in FIG. 2) is a fiat wafer of silicon approximately .010- .012" thick and 1.25 in diameter.
  • each of the carriers 40 is adapted to hold one or more workpieces 12 against the finishing surface 11 as the carrier is moved longitudinally of the finishing table 10, while simultaneously imparting to the article an oscillatory motion.
  • each carrier 40 includes a casing 41 having a cylindrical cavity 42 therein for accommodating a rotatable cylindrical mount 43.
  • the upper portion of the carrier includes an offset bracket 44 on which is mounted drive means, in the present instance, including a shaft 45 and pulley 46 adapted for engagement with a standard double-sided V-belt 47. As shown in FIG. 1, the V-belt 47 is driven by one or the other of sheaves 47A, 47B.
  • the shaft 45 includes a pin 48 at the lower end thereof for coupling thereto a spline extension 49 on the upper portion of the mount 43.
  • the extension 49 includes an elongated slot 50 which permits the mount 43 to move vertically relative to the pin 48, the downward vertical movement being limited by the upper edge 50A of the slot 50.
  • Circumscribing the cylindrical mount 43 is a ball bearing race 51 which permits rotation of the mount 43 as well as free vertical movement thereof.
  • workpiece receiver means 60 In order to engage the workpiece while permitting oscillation thereof relative to the carrier, workpiece receiver means 60 is provided.
  • the workpiece receiver means includes a housing ring 61 depending from and rotatably supported by a ball joint 62 connected to the mount 43.
  • the ball joint 62 accommodates for any misalignment due to an uneven surface on a wafer permitting the wafer to find its own plane for finishing.
  • the ring 61 includes at least one, in the present instance a plurality of depending workpiece holders 63, each of the workpiece holders including an adjustment screw 64 which passes through the ring 61 and is threaded into a sleeve 65 having at the lower end thereof a disc 66 substantially corresponding in contour to the shape of the workpiece 12, in the present instance a flat wafer 12.
  • a compression spring 67 Intermediate the disc 66 and the bottom of the ring 61 and Circumscribing the sleeve 65 is a compression spring 67, the compression spring acting upon the disc and ring to provide tensioning of the adjustment screw 64 to adjust the height of the disc for reasons which will become more evident hereinafter.
  • a stop 67A which stop limits the vertical adjustment of the disc 66.
  • Circumscribing each of the discs 66 is a floating ring 68 having a plurality of apertures 69 therein for receiving the workpieces 12, each of the apertures having a peripheral outline to accommodate the periphery of the workpiece to be finished.
  • the floating ring 68 includes a radially and circumferentially extending flange 70, the ring being free to fioat in the vertical plane but restricted as to its lateral movement due to the fit of the discs 66 in the apertures 69.
  • the ball joint 62 is connected eccentrically of the mount 43 so that as the mount is rotated as by rotation of the pulley 46 the receiver will tend to rotate about an axis eccentric to the carrier 40.
  • the motion of the receiver 60, and thus the workpieces 12 is shown schematically in FIG. 6.
  • restraining means In order to prevent the receiver from rotating in a circular manner about the ball joint 62, whereby outer portions of the workpiece receive a great increment of travel than inner portions across the finishing surface 11, it is necessary to provide restraining means to the workpiece receiver 60' so that the receiver moves in an elliptical path.
  • a fiange 71 To this end and projecting radially outwardly from opposite sides of the casing 41, is a fiange 71 having depending pads 72 thereon spaced from the receiver 60.
  • restraining means in the present instance comprising springs 73, which prevent the receiver 60 from rotating in a circular path about the ball joint 62.
  • carrier drive means in the present instance including a longitudinally extending threaded drive rod 78 which cooperates with a threaded drive receiving portion 79 extending outwardly from one of the fianges 71.
  • the adjustment screw 64 associated with each of the workpiece holders 63 is backed off raising the disc 66 until the disc is spaced a distance equal to the desired finished thickness of the workpiece 12 of the finished surface 11.
  • insertion of the wafers into the apertures 69 will cause the mount 43 to be elevated away from the upper slot edge 50A a distance equal to the amount of material expected to be removed from the individual wafers.
  • the full weight of the mount and receiver is brought to bear against the workpiece as it is oscillated and moved rectilinearly of the finishing surface until the desired amount of material is removed from the workpiece at which time the upper edge 50A of the slot abuts the pin 48 and the mount may descend no further.
  • a grinding surface 11A may be provided to perform a rough cutting operation on the workpiece or wafer 12, the grinding surface being composed of, for example, a diamond dust impregnated, or other conventional grinding surface suitable for performing a rough finishing operation depending on the type of finish desired and the composition of the workpiece.
  • the rough grinding operation may be accomplished by a recirculating abrasive slurry passed over the surface 11A, the means by which this is accomplished being set forth hereinafter in the description of the cleaning operation.
  • each successive carrier 40 will move into a cleaning station having a cleaning surface 11B in which water (deionized or detergent laden) may be supplied.
  • water deionized or detergent laden
  • the workpiece is of a material subject to deterioration by water
  • other solutions such as oil may be used.
  • the cleaning solution may be sprayed onto the surface 11B through nozzles adjacent the surface or may be supplied through a plurality of apertures 80 in the surface, the excess cleaning solution running off the cleaning surface 11B into troughs 81 on opposite longitudinal sides of the cleaning surfaces and thence through drilled apertures 82 into a basin 83 beneath the finishing table.
  • an immersible pump (not shown) may be immersed in the solution for providing a supply of liquid to the surface 11B through the apertures 80.
  • a liquid such as water or oil, loaded with lapping substances such as silicon carbide, boron, nitride particles etc. on the order of l0 microns, is supplied to the lapping surface 11C.
  • lapping substances such as silicon carbide, boron, nitride particles etc. on the order of l0 microns
  • the surface 11E being supplied with a slurry of, for example, cupric acid, silicon oxide or other polishing substances.
  • a slurry of, for example, cupric acid, silicon oxide or other polishing substances.
  • the type of surface for polishing will depend upon the individual workpiece being polished and if a slurry is desired a system such as heretofore described relative to the cleaning and lapping station, may be provided.
  • the wafer may be sub jected to an additional cleaning step to remove any of the material adhering thereto. It may be desirable to replace the finishing surface at predetermined intervals so that any imbedded particles in the finishing surface will not score and thus ruin other workpieces held in subse quent carriers.
  • the finishing surface 11 may be replaced at any of the stations in a manner shown in FIG. wherein the nishing surface includes an endless belt or the like positioned around rolls 84 which may be driven continuously or at periodic intervals or even moved periodically by hand to provide a fresh or new finishing surface for the carriers.
  • each of the carriers may be supplied with its own drive motor including a pair of contacts riding against a pair of energized rails, so that each of the motors is able to be varied as to its rotational speed. In this manner upon the carriers arriving at a different station along the table, the speed of oscillation may be appropriately varied.
  • finishing surfaces may be fixed, and even in cases of delicate workpieces such as wafers, if a slurry type system of grinding, lapping and polishing is provided at each of the stations so that the finishing surface is thoroughly cleansed of contamination, fixed surfaces of known types may be provided.
  • a common drive for each of the pulleys 46 is accomplished by the double sided V-belt 47.
  • Each of the carriers 40 as it moves onto the finishing table, is gently engaged by the V-belt so that oscillation of the workpiece receivers 60 is gradual and not sudden or jerky.
  • a like finishing table may be provided on the opposite side of the structure shown in FIG. l so that a new line of workpieces may be finished, the double sided V-belt 47 engaging like pulleys 46 associated with like carriers on the opposite side of the table.
  • each carrier moves towards an unloading station 90, it is disengaged from the V-belt 47, and the carrier moves into a guide chute defined by a pair of converging side rails 91 causing the workpiece receiver to be aligned along the central axis of the carrier.
  • a pair of longitudinally extending lift rails 92 is then engaged by the flange 70 circumscribing the fioating ring 68, raising the ring 68 until it engages the stops 67A depending from the lower surface of the housing ring 61.
  • a receiver 160 is shown schematically as being pivotally connected as by an eccentrically positioned ball joint 162 to a mount 143.
  • a link is connected to the receiver so that the ball joint may rotate relative to the link.
  • the opposite end 146 of the link is bifurcated to embrace a pin 147 which is mounted outboard of the mount 143.
  • the present invention provides a novel method of and apparatus for placing a finished surface on a workpiece in a continuous finishing process in such a manner that no one portion of the workpiece surface is abraded more than any other portion of the surface.
  • novel workpiece carriers eliminates the necessity of using adhesives and/or waxes to retain the workpiece against the finishing surface.
  • the provision of a ball joint type connection between the receiver and the rotating member permits the surface of the workpiece being finished to seek its natural plane.
  • Apparatus for providing a smooth surface on workpieces comprising a carrier including means for moving said carrier along a linear path of travel; a rotatable mount carried by said carrier and a depending workpiece receiver rotatably connected to said mount, one of said receiver and mount being eccentrically mounted with respect to said carrier; means for causing rotation of said mount, and means connected to said receiver and said carrier to inhibit rotation of said receiver while permitting oscillation thereof, whereby a workpiece ⁇ held by said receiver may be engaged and oscillated against a finishing surface in substantially coplanar yrelationship therewith.
  • said receiver includes a housing pivotally connected to and depending from said mount, at least one workpiece holder depending from said housing for receiving at least one workpiece.
  • Apparatus in accordance with claim 2 wherein said 'housing includes a ring, and adjustament means passing through said ring for accommodating variations in workpiece thickness.
  • Apparatus in accordance with claim 2 including a floating ring circumscribing said housing and having means defining an aperture therein for registry with said workpiece holder, and means restraining lateral movement of said ring while permitting vertical motion thereof.
  • Apparatus in accordance with claim 4 including stop means on one of said housing and ring, to thereby limit vertical movement of said ring with respect to said housing.
  • Apparatus in accordance with claim 1 including connecting means for connecting said mount to said rotation causing means, said connectingy means including means for permitting limited vertical displacement of said mount relative to the rotational axis thereof whereby the weight of said mount is brought to bear against said receiver When finishing said workpiece.
  • Apparatus in accordance with claim 1 including a ball joint interconnecting said receiver and said mount whereby a workpiece held by said receiver against said finishing surface will adjust said receiver for said coplanar relationship between said surface and said workiece.
  • Apparatus in accordance with claim 1 including means for for varying the linear speed of said carrier.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US715350A 1968-03-22 1968-03-22 Apparatus for providing a finished surface on workpieces Expired - Lifetime US3550325A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71535068A 1968-03-22 1968-03-22

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US3550325A true US3550325A (en) 1970-12-29

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US (1) US3550325A (de)
DE (1) DE1914082C3 (de)
FR (1) FR1600784A (de)
GB (1) GB1258514A (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US20040157539A1 (en) * 2002-07-26 2004-08-12 Stenftenagel John R. Scuffing machine for finishing wood products
CN110216574A (zh) * 2019-07-23 2019-09-10 杭州卢塔电器有限公司 一种智能锁外壳加工设备
CN110918338A (zh) * 2019-10-17 2020-03-27 福清市海威钓具有限公司 一种环保型鱼竿喷漆装置及喷漆工艺
CN112123197A (zh) * 2020-09-24 2020-12-25 郑州方铭高温陶瓷新材料有限公司 一种双轨道滑板砖平面研磨机
CN113997176A (zh) * 2021-10-21 2022-02-01 西安银马实业发展有限公司 磨头自浮动石材磨削抛光机

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354B (en) * 1983-07-15 1987-03-11 Helical Springs Limited Grinding apparatus
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
DE19756536A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zum Polieren von scheibenförmigen Werkstücken und Vorrichtung zur Durchführung des Verfahrens
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5593537A (en) * 1994-07-26 1997-01-14 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US20040157539A1 (en) * 2002-07-26 2004-08-12 Stenftenagel John R. Scuffing machine for finishing wood products
CN110216574A (zh) * 2019-07-23 2019-09-10 杭州卢塔电器有限公司 一种智能锁外壳加工设备
CN110918338A (zh) * 2019-10-17 2020-03-27 福清市海威钓具有限公司 一种环保型鱼竿喷漆装置及喷漆工艺
CN112123197A (zh) * 2020-09-24 2020-12-25 郑州方铭高温陶瓷新材料有限公司 一种双轨道滑板砖平面研磨机
CN112123197B (zh) * 2020-09-24 2024-03-22 郑州方铭高温陶瓷新材料有限公司 一种双轨道滑板砖平面研磨机
CN113997176A (zh) * 2021-10-21 2022-02-01 西安银马实业发展有限公司 磨头自浮动石材磨削抛光机
CN113997176B (zh) * 2021-10-21 2023-02-28 西安银马实业发展有限公司 磨头自浮动石材磨削抛光机

Also Published As

Publication number Publication date
DE1914082A1 (de) 1969-10-02
GB1258514A (de) 1971-12-30
FR1600784A (de) 1970-07-27
DE1914082B2 (de) 1979-07-05
DE1914082C3 (de) 1980-03-13

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