US3522038A - Copper base alloy - Google Patents

Copper base alloy Download PDF

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Publication number
US3522038A
US3522038A US648660A US3522038DA US3522038A US 3522038 A US3522038 A US 3522038A US 648660 A US648660 A US 648660A US 3522038D A US3522038D A US 3522038DA US 3522038 A US3522038 A US 3522038A
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present
alloys
base alloy
copper base
alloy
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US648660A
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Charles D Mclain
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Olin Corp
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Olin Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper

Definitions

  • the alloy of the present invention comprises a copper base alloy consisting essentially of from 1.5 to 3.5% iron, 0.02 to 0.21% silicon and the balance essentially copper.
  • the copper base alloy of the present invention effectively utilizes additional additives such as phosphorus in an amount from 0.01 to 0.15%, preferably from 0.01 to 0.10%, and zinc in an amount from 0.03 to 0.20%, preferably from 0.03 to 0.15%, and mixtures thereof. Throughout the ensuing specification all percentages are percentages by weight.
  • the alloys of the present invention have an unexpected improvement in electrical conductivity. Namely, there is readily obtained an IACS electrical conductivity in excess of 70% IACS, and a range of 75 to 81% IACS is readily attained. Furthermore, the alloys of the present invention have excellent annealing characteristics, with the ability to attain various strength levels as a result of different annealing treatments. In addition,
  • the alloys of the present invention attain high rolled temper strength levels. Still further the high electrical conductivity of the alloys of the present invention is coupled with excellent annealed tensile strength properties of approximately 65,000 p.s.i. and higher. The strength and physical properties of the alloys of the present invention are not significantly variable if small amounts of impurities are present. Still further the alloys of the present invention resist softening during soldering at 700 to 800 F. In addition to the foregoing, the alloys of the present invention are inexpensive and their excellent physical properties easily obtainable.
  • the composition of the alloys of the present invention is as stated heretofore.
  • the preferred iron content is from 1.7 to 3.0%, with an optimum from 1.8 to 2.9% and the preferred silicon content is from 0.03 to 0.20% with an optimum range being from 0.10 to 0.17%.
  • the percentage ranges of the alloying ingredients are important.
  • small amounts of additional alloying ingredients may be, of course, included in order to achieve particularly desirable results, for example, aluminum in an amount up to 0.07% and manganese in an amount up to 0.08%. Also, small amounts of impurities may, of course, be tolerated.
  • the alloys of the present invention attain improvement over conventional alloys in a wide range of processing. Naturally, however, particular processing will result in variation in properties.
  • the manner of casting the material is not particularly critical, with conventional casting methods for these types of alloys being readily utilizable, it being noted-that higher temperatures should be used in order to solutionize the iron. It is preferred to cast the alloy into billets of conventional size, subjecting them to hot working, as by rolling in the conventional size.
  • the alloy After casting the alloy should be hot rolled at an elevated temperature, i.e., from 800 to 1050 C., with a temperature ofabout 950 C. being preferred. The alloy should then be cold rolled to gage, with intermediate anneals, with cold reduction in excess of 50% between anneals being preferred. Annealing temperatures of from 400 to 600 C. are preferred, with annealing time at temperature preferably being a minimum of two (2) hours. Longer times may be utilized, if desired, for improved electrical conductivity. Continuous strand annealing of strip or mill products will achieve the same high level of physical properties as with Bell annealing, but will not achieve as high a level of electrical conductivity. Therefore, for development of both high annealed strength and electrical conductivity, final annealing and preferably in process annealing must be in batches with conventional furnace cooling, such as Bell annealing.
  • EXAMPLE I Alloys were prepared in the following manner. High purity copper and high purity iron were melted together in a low frequency, slot type induction furnace under a charcoal cover at approximately 1200 C. About 10% of the copper charge was held back and the melt was slightly overheated to about 1300 C. in order to put the iron into solution. High purity alloying additions were added when the molten mass was at about 1300 C. The and tensile strength. The results are shown in FIGS. 1 balance of the copper was added and the melt brought and 2.
  • FIG. 1 is a curve of Rockwell 1ST hardness to the pouring temperature of about 1200 C. The melt versus temperature and FIG. 2 is a curve of strength was then poured into a water-cooled ingot mold of versus temperature.
  • Alloys 1 and 2 prepared in Example I were processed as follows. The alloys were hot rolled at from 900 to 940 0., followed by a water spray quench to room temperature. The materials were then cold rolled to 0.100", bell annealed at 480600 C. (1 to 4 hours at EXAMPLE IV temperature), cold rolled to 0.050", bell annealed at 460 to 480 C. (1 to 3 hours at temperature), and cold rolled In this example three alloys were prepared in a manto 0.025" gage and bell annealed at 440 to 480 C. (1 ner after Example I, wherein the alloys had the followto 3 hours at temperature). g COmPOSItIOHSt TABLE IV Phosphorus, Iron, Silicon Zinc, Alloy percent percent percent percent percent percent Copper 6 0.021 2.3 0.13 0.08 Essentially balance. 7 2.4 0.14 Do. 8 0.025 2.4 D0,
  • the alloys were then tested for physical properties, The alloys were processed in the following manner. with the results being shown in the following table.
  • the five 1nch thick slabs were hot rolled at 925 C. to TABLE H 0.350", milled to 0.300", cold rolled to 0.100", annealed Yi m T 1 E t i 1 for two hours at 490 C., cold rolled to 0.050, annealed e ensie I at 440 C. for two hours and cold rolled to 0.025 and h t th l t o d t t Alloy if if s $5.11 E 530821: itta??? IIXICYS annealed for two hours at 440 C. 1 26 900 53 400 27 812 After each anneal the tensile strength and electrical 21:11:11-: 231100 501100 27.5 73.5 conductivity of each sample was determined and the results are shown in the following table.
  • a copper base alloy consisting essentially of from level, and then tested for softening temperature in the 1.5 to 3.5% iron, from 0.02 to 0.21% silicon, at least following manner.
  • the alloys were immersed in a salt one of the elements P and Zn, P being present in an bath at elevated temperatures from 600 to 800 F. for amount of 0.01 to 0.15% and Zn being present in an periods of time of 3 and 4 minutes.
  • the samples were amount of 0.03 to 0.2% Zn, balance copper, said alloy then tested for Rockwell 1ST hardness, yield strength having an IACS electrical conductivity of over 70%,
  • said alloy being in the rolled temper and having an annealed tensile strength of at least 65,000 p.s.i.
  • a copper base alloy consisting essentially of from 1.5 to 3.5% iron, from 0.02 to 0.21% silicon, from 0.01 to 0.15% phosphorus and the balance copper.
  • a copper base alloy consisting essentially of from 1.5 to 3.5% iron, from 0.02 to 0.21% silicon, from 0.03 to 0.20% zinc and the balance copper.
  • a copper base alloy according to claim 3 containing from 0.01 to 0.15% phosphorus.
  • a copper base alloy according to claim 4 having an IACS electrical conductivity of over 70%, being in the cold rolled and annealed temper and having an annealed tensile strength at least 65,000 p.s.i.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
US648660A 1967-06-26 1967-06-26 Copper base alloy Expired - Lifetime US3522038A (en)

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US64866067A 1967-06-26 1967-06-26

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US3522038A true US3522038A (en) 1970-07-28

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US648660A Expired - Lifetime US3522038A (en) 1967-06-26 1967-06-26 Copper base alloy

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US (1) US3522038A (de)
BE (1) BE717176A (de)
CH (1) CH513246A (de)
FR (1) FR1570993A (de)
GB (1) GB1185786A (de)
SE (1) SE341474B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0995808A1 (de) * 1998-03-10 2000-04-26 Mitsubishi Shindoh Corporation Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT385932B (de) * 1985-12-13 1988-06-10 Neumayer Karl Band- bzw. drahtfoermiges material
DE102007054418A1 (de) * 2007-11-13 2009-05-14 Wolf Neumann-Henneberg Elektrischer Leiter und Stanzgitter mit Stegleitern aus einem solchen elektrischen Leiter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB256457A (en) * 1925-12-21 1926-08-12 Michael George Corson Improved manufacture of copper alloys
US1778668A (en) * 1927-06-30 1930-10-14 Gen Electric Electrode
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor
US3039867A (en) * 1960-03-24 1962-06-19 Olin Mathieson Copper-base alloys

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB256457A (en) * 1925-12-21 1926-08-12 Michael George Corson Improved manufacture of copper alloys
US1778668A (en) * 1927-06-30 1930-10-14 Gen Electric Electrode
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor
US3039867A (en) * 1960-03-24 1962-06-19 Olin Mathieson Copper-base alloys

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0995808A1 (de) * 1998-03-10 2000-04-26 Mitsubishi Shindoh Corporation Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille
EP0995808A4 (de) * 1998-03-10 2006-04-12 Mitsubishi Shindoh Corp Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance

Also Published As

Publication number Publication date
CH513246A (de) 1971-09-30
SE341474B (de) 1971-12-27
BE717176A (de) 1968-12-27
FR1570993A (de) 1969-06-13
DE1758121A1 (de) 1972-03-30
DE1758121B2 (de) 1972-11-16
GB1185786A (en) 1970-03-25

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