US3405381A - Thin film resistor - Google Patents

Thin film resistor Download PDF

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Publication number
US3405381A
US3405381A US453098A US45309865A US3405381A US 3405381 A US3405381 A US 3405381A US 453098 A US453098 A US 453098A US 45309865 A US45309865 A US 45309865A US 3405381 A US3405381 A US 3405381A
Authority
US
United States
Prior art keywords
substrate
resistor
film
alloy
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US453098A
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English (en)
Inventor
Zandman Felix
Branin A Boyd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Intertechnology Inc
Original Assignee
Vishay Intertechnology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Intertechnology Inc filed Critical Vishay Intertechnology Inc
Priority to US453098A priority Critical patent/US3405381A/en
Priority to FR44454A priority patent/FR1464998A/fr
Priority to DE1590870A priority patent/DE1590870C3/de
Priority to GB1260/66A priority patent/GB1132562A/en
Priority to NL6602248A priority patent/NL6602248A/xx
Priority to US701794A priority patent/US3517436A/en
Application granted granted Critical
Publication of US3405381A publication Critical patent/US3405381A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/232—Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature

Definitions

  • the present invention relates to electrical components and especially resistors. It is particularly concerned with high-precision components, such as resistors capable of very high stability and a low, closely controlled temperature coeflicient of resistance.
  • An object of the present invention is to provide a precision electrical component such as a resistor overcoming the foregoing disadvantages.
  • a high-precision resistor is constructed by supporting a thin film of a selected metal alloy upon a substrate having known physical properties, the substrate being many times thicker 3,405,381 Patented Oct. 8, 1968 ICC than the metallic film (preferably, of the order of to 1,000 times thicker).
  • the metallic film is caused to have a predetermined pattern, such that electric current flows along a conducting path of very great length and extremely small width, this pattern preferably including a great number of parallel narrow linear path portions in a planar array.
  • the side of the substrate having thereon the resistor film of predetermined pattern is coated with an epoxy resin, and the opposite si-de of the substrate is similarly coated to equal thickness with epoxy resin of the same kind.
  • FIG. l is a plan view of the resistor
  • FIG. 2 is a cross-sectional view of said resistor taken on the line 2-2;
  • FIG. 3 is a magnified cross-sectional view showing in greater detail the encircled portion of FIG. 2;
  • FIG. 4 is a magnied fragmentary view diagrammatically illustrating one way in which lthe path resistance rnay be adjusted.
  • FIGS. 5 and 6- are a perspective view with part broken away and a cross-sectional view, respectively, of an encapsulated resistor embodiment of the present invention.
  • ⁇ a resistor o'f the present invention as illustrated in FIGS. l, 2 and 3, comprises a substrate 11 having an etched-pattern resistor layer of bulk metal iilrn 12 fixed to one surface thereof, Coatings 13 and 14 of a hard epoxy resin are ⁇ applied to the resistor surface and the opposite surface of the substrate.
  • the two opposite epoxy coatings are so related to each other ⁇ as to result in a sandwich which does not bend or warp as a consequence of changes of temperature or moisture absorption by the coatings.
  • the substrate 11 may be made of glass having a ternperature coeiiicient of expansion of the order of 3 parts per million per degree F.
  • substrate 11 may be of the order of 1A inch by 1A inch with a thickness of 0.04 inch.
  • the bulk metal film 12 may be made from a resistive alloy such as one of the Nichrome alloys, wherein nickel and chromium are the principal metals. This film may 1be of the order of 0.0001 inch thick.'
  • the metallic lilm 12 is photo-etched to a pattern which establishes a narrow conductive path of much greater total length than the dimensions of the face of substrate 11.
  • This step may be carried out after the film has been bonded to the substrate as by the laver 13 of plastic thereunder (FIG. 3), o-r it may be carried out when the metallic film is on a thinsupport suc-h as plastic layer 13 but before being bonded to substrate 11.
  • a photosensitive masking medium such as Kodak Photo-Resist (KPR).
  • etching process is then used to remove the exposed portions of the thin alloy film.
  • FIG. 1 One example of a suitable pattern for the film after etching is shown in FIG. 1.
  • the junctions o'f the fiexible leads and 20 are shown ⁇ at 16 and 17. These may be welded junctions, with reinforcing epoxy mounds.
  • a very low resistance path exists between these two junctions, extending -along the left side, across the top, and down the right side of film 12 as shown in said illustration.
  • the current is required to flow through narrow linear path portions 19 and 21.
  • the current path is further lengthened to pass through narrow linear portions 23 an-d 24.
  • narrow linear portions 23 an-d 24 may be included in the current path between terminal areas 16 and 17.
  • a transverse cut may be extended ⁇ across several of the gaps such as gaps 18 and 22 near theirends.
  • the pattern in which the film is exposed and etched may include several wider portions and portions of shorter lengths, so that an operator 4is enabled to complete the steps of bringing about the desired resistance value with the inclusion of one or more of the lower-resistance increments as may be needed. Examples of such wider and shorter portions in the film pattern for various amounts of incremental resistance are indicated at 27, 28, 29, 31, 32
  • FIG. 4 illustrates the protective reinforcement provided by the epoxy plastic material 13, 13 which embeds the metallic film 12.
  • the upper protective epoxy coating comprising layers 13 and 13 may have a total thickness of 0.001 inch.
  • Epoxy coating 13, 13 and the opposite epoxy coating 14 may be of equal thickness and identical characteristics in order that the stress contributions which they make to the flat surfaces of the glass substrate shall be balanced, and shall not tend to cause bending or warping of the glass substrate. Along with this elimination of bending, any tendency toward long-term dimensional instability due to stress relaxation is substantially overcome. Alternatively, the same resultl can be obtained by coatings of different material characteristics provided that their thicknesses are properly related.
  • the glass substrate has a temperature coefficient of expansion of the order of 3 parts per million per degree F.
  • the epoxy or other plastic coatings 13, 13', and 14 on top and bottom of the glass substrate lia-ve a much higher temperature coefficient of expansion, of the order of 40 parts per million per degree F. Furthermore, said epoxy coatings tend to expand or contract as their moisture content varies. Hence, the balanced application of the epoxy or other plastic to both sides prevents it from causing bending 0f the device.
  • The'modulus of elasticity of the glass substrate is many times higher than that of the epoxy material. Hence, the expansion and contraction of the unit in length and width are determined mainly by the temperature coefficient of expansion of the glass.
  • the modulus of elasticity of the epoxy is of the order of one-thirtieth of the modulus of elasticity of the glass substrate, the tendency of the epoxy to expand with vtemperature by a factor of ten ti-mes greater than the expansion of the glass is made comparatively small by the relative thinness of the epoxy material and its far lower modulus of elasticity.
  • the resistive alloy film etched in its predetermined pattern and bonded to the glass substrate, being of the order of one hundredth to one thousandth the thickness of the glass, exerts minimal influence upon the dimensional responsiveness of the unit to the changes of temperature and moisture.
  • the changes of resistance in the path ultimately determined in the patterned film between the junctions 16 and 17 is infiuenced by the ⁇ following factors:
  • the resistor may be made to have a reliable temperature coefiicient of resistivity as low as l part per million per degree C. in the vicinity of a desired design temperature such as 25 C., and to have an extremely low overall temperature coefiicient of resistivity throughout a range from C. to +175 C.
  • the alloy consisting primarily of nickel and chromium will have a greater temperature coefiicient of expansionA than the glass substrate.
  • the net sum effect of the resistance change component due to changing stress in the alloy film and the resistance change component due to expansion or contraction of the film is substantially equal to the temperature c0- efiicient of resistivity of the alloy under stress-free conditions, and of opposite sign, the overall temperature coefficient of resistivity of the device is substantially zero. Since the last-named factor is not linear, the device will have a predictable variation of its temperature coefficient of resistivity throughout the design temperature range.
  • the resistor made in accordance with the present invention may be encapsulated in a plastic or metal housing 36 wherein suitable potting material or materials are included to embed one or more resistor units such as that described above.
  • the resistor unit is provided with a sheath of soft rubber, polyurethane foam, or other very soft material.
  • soft material 37 may be used alone, filling the space inside case 36 surrounding the coa-d substrate, if desired; alternatively, the soft material 37 may in turn be surrounded by a hard filler 38 such as an epoxy.
  • the soft material 37 serves as a protective cushion by virtue of its very low modulus of elasticity.
  • the flexible ribbon conductors and 20 from the resistor element extend to terminals 39 and 41.
  • the soft cushion 37 and the fiexible conductors 15 and 20 the dimensional changes in the hardened potting material, which may be of the order of five to ten times greater than the dimensional changes which the resistor unit itself tends to undergo, are isolated and prevented from forcing the resistor unit to depart from its design characteristics.
  • resistor is miniature, it is suitable for use in applications where space is at a premium. It may be included as a part of a miniaturized circuit. Other portions of the circuit may be built directly upon the substrate of the resistor. Two or more resistors may be made on a common substrate. Where desired, a second resistor or resistance path may be disposed on the face of Ia substrate opposite the face on which the first resistance path is established.
  • the elements of the resistor may be made larger.
  • the principles of the present invention may be used in a device having a thickness of an .appreciable fraction of an inch, with a substrate tace area which may be as great as a square inch or greater.
  • the substrate may be a metal body, the resistive metallic film being insulated therefrom by plastic layer 13 in contact with the substrate.
  • a stable electrical component comprising a rigid substrate having two opposed flat surfaces, a metallic layer bonded to one of said fiat surfaces and having a tortuous path configuration for vconduction of electric current through a total path distance many times longer than the dimensions of the at surface to which it is bonded, said metallic layer being an alloy film of the order of one-hundredth to one-thousandth the thickness of said substrate and yhaving appreciable resistivity, and coatings of epoxy resin disposed on the two opposed surfaces of said substrate, one of said epoxy coatings abutting and embedding said alloy lm and the other epoxy coating abutting the opposite flat surface of said substrate, said epoxy coatings being thicker than said metallic layer, their thickness being of a lesser order of magnitude than the thickness of said substrate, the temperature coefcient of resistivity of said alloy in the temperature range from -55 to +175 C. being approximately equal to and tending to compensate for the incremental change of resistance thereof induced by the changing contraction and expansion and consequent changes of stress which the film udergoe
  • a stable electrical component as defined in claim 1, wherein said film comprises. an alloy comprising nickel and chromium as the principal constituents.
  • a stable, high-precision electrical component cornprising a substrate, a metallic resistive path bonded to one face of said substrate for conduction of electric current, said metallic resistive Ipath being of a much thinner order of magnitude than said substrate, and a pair of hard coatings symmetrically disposed about said substrate, said coatings being bonded to opposite faces of said substrate whereby one of said coatings embeds said metallic resistive path and said pair of coatings maintain balance with respect to their response to changes of temperature and moisture, further including a housing surrounding said substrate with its metallic film and coatings, said housing being spaced from said substrate, means filling the space between the housing and the coated substrate, said means including a pliable cushion of material having a very low modulus of elasticity, said cushion of material substantially enclosing said coated substrate .and being in contact therewith, whereby said coated substrate is enabled to expand or contract independently of said housing, an electrical conductor means extending from predetermined junction regions on said metallic film to the exterior of said housing, said conductor means including fiexible conductor portions within said

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Adjustable Resistors (AREA)
  • Measurement Of Force In General (AREA)
US453098A 1965-05-04 1965-05-04 Thin film resistor Expired - Lifetime US3405381A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US453098A US3405381A (en) 1965-05-04 1965-05-04 Thin film resistor
FR44454A FR1464998A (fr) 1965-05-04 1965-12-31 Procédé de fabrication de composants électriques et composants obtenus par ledit procédé
DE1590870A DE1590870C3 (de) 1965-05-04 1966-01-10 Elektrischer Präzisionswiderstand
GB1260/66A GB1132562A (en) 1965-05-04 1966-01-11 Precision resistor of great stability
NL6602248A NL6602248A (enrdf_load_stackoverflow) 1965-05-04 1966-02-22
US701794A US3517436A (en) 1965-05-04 1967-11-01 Precision resistor of great stability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US453098A US3405381A (en) 1965-05-04 1965-05-04 Thin film resistor

Publications (1)

Publication Number Publication Date
US3405381A true US3405381A (en) 1968-10-08

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US453098A Expired - Lifetime US3405381A (en) 1965-05-04 1965-05-04 Thin film resistor

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US (1) US3405381A (enrdf_load_stackoverflow)
DE (1) DE1590870C3 (enrdf_load_stackoverflow)
FR (1) FR1464998A (enrdf_load_stackoverflow)
GB (1) GB1132562A (enrdf_load_stackoverflow)
NL (1) NL6602248A (enrdf_load_stackoverflow)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601744A (en) * 1969-07-14 1971-08-24 Vishay Intertechnology Inc Variable resistor with strain-reducing attachment means for the substrate
US3761860A (en) * 1970-05-20 1973-09-25 Alps Electric Co Ltd Printed circuit resistor
US3824521A (en) * 1973-09-24 1974-07-16 Tdk Electronics Co Ltd Resistor
USRE28597E (en) * 1972-09-27 1975-10-28 Resistor
US3986082A (en) * 1975-02-14 1976-10-12 The United States Of America As Represented By The Secretary Of The Air Force Universal temperature controlled reference junction
US4053977A (en) * 1976-03-18 1977-10-18 Societe Francaise De L'electro-Resistance Method for etching thin foils by electrochemical machining to produce electrical resistance elements
JPS53131461A (en) * 1977-12-26 1978-11-16 Tdk Electronics Co Ltd Resistor and method of manufacturing the same
US4152689A (en) * 1978-02-13 1979-05-01 American Components Inc. Electrical resistor package which remains unaffected by ambient stresses and humidity
DE2912493A1 (de) * 1978-03-31 1979-10-11 Vishay Intertechnology Inc Praezisionswiderstand und verfahren zu seiner herstellung
US4172249A (en) * 1977-07-11 1979-10-23 Vishay Intertechnology, Inc. Resistive electrical components
US4250482A (en) * 1979-01-02 1981-02-10 Allen-Bradley Company Packaged electronic component and method of preparing the same
US4306217A (en) * 1977-06-03 1981-12-15 Angstrohm Precision, Inc. Flat electrical components
US4318072A (en) * 1979-09-04 1982-03-02 Vishay Intertechnology, Inc. Precision resistor with improved temperature characteristics
US4418474A (en) * 1980-01-21 1983-12-06 Barnett William P Precision resistor fabrication employing tapped resistive elements
US4570150A (en) * 1983-12-14 1986-02-11 Vishay Intertechnology, Inc. Precision resistor and method of making same
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US4840494A (en) * 1984-02-01 1989-06-20 Albert Koch Calibrated temperature sensor and method of calibrating same
US6094129A (en) * 1994-11-19 2000-07-25 Daimlerchrysler Ag PTC thermistor and a current limiter device having at least one PTC thermistor
US20020093417A1 (en) * 2000-10-20 2002-07-18 Reiner Gross Electrical resistor with thermal voltage prevention
US6529115B2 (en) 2001-03-16 2003-03-04 Vishay Israel Ltd. Surface mounted resistor
EP1422730A1 (en) * 2002-11-25 2004-05-26 Vishay Intertechnology, Inc. High precision power resistors
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US8466772B2 (en) 2008-08-27 2013-06-18 Vishay Israel, Ltd Precision variable resistor
CN105825988A (zh) * 2016-05-06 2016-08-03 广东欧珀移动通信有限公司 贴片电阻的封装方法以及贴片电阻
WO2018190868A1 (en) * 2017-04-14 2018-10-18 Hewlett-Packard Development Company, L.P. Substrate(s) enclosed by energy absorbing material(s)
CN112099612A (zh) * 2020-09-18 2020-12-18 联想(北京)有限公司 一种服务器主板、服务器及供电控制方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2168540A (en) * 1984-12-12 1986-06-18 George France Resistors capable of withstanding power surges

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751477A (en) * 1952-07-15 1956-06-19 Pittsburgh Plate Glass Co Electrical resistive device
US2822524A (en) * 1954-10-25 1958-02-04 Sanders Associates Inc Wave guide
US2939807A (en) * 1956-06-29 1960-06-07 Thermway Ind Inc Method of making a heating panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751477A (en) * 1952-07-15 1956-06-19 Pittsburgh Plate Glass Co Electrical resistive device
US2822524A (en) * 1954-10-25 1958-02-04 Sanders Associates Inc Wave guide
US2939807A (en) * 1956-06-29 1960-06-07 Thermway Ind Inc Method of making a heating panel

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601744A (en) * 1969-07-14 1971-08-24 Vishay Intertechnology Inc Variable resistor with strain-reducing attachment means for the substrate
US3761860A (en) * 1970-05-20 1973-09-25 Alps Electric Co Ltd Printed circuit resistor
USRE28597E (en) * 1972-09-27 1975-10-28 Resistor
US3824521A (en) * 1973-09-24 1974-07-16 Tdk Electronics Co Ltd Resistor
US3986082A (en) * 1975-02-14 1976-10-12 The United States Of America As Represented By The Secretary Of The Air Force Universal temperature controlled reference junction
US4053977A (en) * 1976-03-18 1977-10-18 Societe Francaise De L'electro-Resistance Method for etching thin foils by electrochemical machining to produce electrical resistance elements
US4306217A (en) * 1977-06-03 1981-12-15 Angstrohm Precision, Inc. Flat electrical components
US4172249A (en) * 1977-07-11 1979-10-23 Vishay Intertechnology, Inc. Resistive electrical components
JPS53131461A (en) * 1977-12-26 1978-11-16 Tdk Electronics Co Ltd Resistor and method of manufacturing the same
US4152689A (en) * 1978-02-13 1979-05-01 American Components Inc. Electrical resistor package which remains unaffected by ambient stresses and humidity
DE2912493A1 (de) * 1978-03-31 1979-10-11 Vishay Intertechnology Inc Praezisionswiderstand und verfahren zu seiner herstellung
FR2421447A1 (fr) * 1978-03-31 1979-10-26 Vishay Intertechnology Inc Resistance de precision perfectionnee et son procede de fabrication
US4250482A (en) * 1979-01-02 1981-02-10 Allen-Bradley Company Packaged electronic component and method of preparing the same
US4318072A (en) * 1979-09-04 1982-03-02 Vishay Intertechnology, Inc. Precision resistor with improved temperature characteristics
US4418474A (en) * 1980-01-21 1983-12-06 Barnett William P Precision resistor fabrication employing tapped resistive elements
US4570150A (en) * 1983-12-14 1986-02-11 Vishay Intertechnology, Inc. Precision resistor and method of making same
US4840494A (en) * 1984-02-01 1989-06-20 Albert Koch Calibrated temperature sensor and method of calibrating same
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US6094129A (en) * 1994-11-19 2000-07-25 Daimlerchrysler Ag PTC thermistor and a current limiter device having at least one PTC thermistor
US20020093417A1 (en) * 2000-10-20 2002-07-18 Reiner Gross Electrical resistor with thermal voltage prevention
US6529115B2 (en) 2001-03-16 2003-03-04 Vishay Israel Ltd. Surface mounted resistor
US20050083170A1 (en) * 2002-11-25 2005-04-21 Vishay Intertechnology Method of manufacturing a resistor
US20040100356A1 (en) * 2002-11-25 2004-05-27 Vishay Intertechnology High precision power resistors
US20040150505A1 (en) * 2002-11-25 2004-08-05 Vishay Intertechnology High precision power resistors
EP1422730A1 (en) * 2002-11-25 2004-05-26 Vishay Intertechnology, Inc. High precision power resistors
US6892443B2 (en) 2002-11-25 2005-05-17 Vishay Intertechnology Method of manufacturing a resistor
US7154370B2 (en) * 2002-11-25 2006-12-26 Vishay Intertechnology, Inc. High precision power resistors
US7278201B2 (en) 2002-11-25 2007-10-09 Vishay Intertechnology, Inc Method of manufacturing a resistor
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US8466772B2 (en) 2008-08-27 2013-06-18 Vishay Israel, Ltd Precision variable resistor
CN105825988A (zh) * 2016-05-06 2016-08-03 广东欧珀移动通信有限公司 贴片电阻的封装方法以及贴片电阻
WO2018190868A1 (en) * 2017-04-14 2018-10-18 Hewlett-Packard Development Company, L.P. Substrate(s) enclosed by energy absorbing material(s)
CN112099612A (zh) * 2020-09-18 2020-12-18 联想(北京)有限公司 一种服务器主板、服务器及供电控制方法

Also Published As

Publication number Publication date
DE1590870C3 (de) 1980-04-24
NL6602248A (enrdf_load_stackoverflow) 1966-11-07
DE1590870A1 (de) 1970-04-16
DE1590870B2 (de) 1975-04-03
FR1464998A (fr) 1967-01-06
GB1132562A (en) 1968-11-06

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