Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
  • C07D295/16—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms
  • C07D295/20—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms by radicals derived from carbonic acid, or sulfur or nitrogen analogues thereof
  • C07D295/21—Radicals derived from sulfur analogues of carbonic acid
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B61—RAILWAYS
  • B61D—BODY DETAILS OR KINDS OF RAILWAY VEHICLES
  • B61D3/00—Wagons or vans
  • B61D3/16—Wagons or vans adapted for carrying special loads
  • B61D3/18—Wagons or vans adapted for carrying special loads for vehicles
  • B61D3/182—Wagons or vans adapted for carrying special loads for vehicles specially adapted for heavy vehicles, e.g. public work vehicles, trucks, trailers
  • B61D3/184—Wagons or vans adapted for carrying special loads for vehicles specially adapted for heavy vehicles, e.g. public work vehicles, trucks, trailers the heavy vehicles being of the trailer or semi-trailer type
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D3/00—Electroplating: Baths therefor
  • C25D3/02—Electroplating: Baths therefor from solutions
  • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

• a further object is to provide additives for an acid copper electroplating process and bath whereby level electrodeposits may be obtained when using ordinary tap water.
• the compounds used in the baths have the formula wherein R and R are selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and together with N an aromatic heterocyclic residue, and R is selected from the group consisting of hydrogen, alkyl, cycloaliphatic aromatic and the group as above defined.
• the compounds used according to the invention may be prepared in a simple manner according to methods well known. They may be combined in the acid electroplating copper baths with the usual additives, especially with brightening agents. Especially satisfactory brightening agents have proven to be compounds which have at least one carbon atom exclusively surrounded by hetero atoms, to which a bivalent aliphatic or aromatic radical,
• N,N-diethyl-thiocarbamylmercaptomethyl-N'-phenylthiourea presents the best results in customary baths with high chlorine-ion concentration as well as in those which contain the specific brightening agents indicated above.
• the leveling agents used according to the invention are added in quantities of 0.001 to 20 g./l., preferably of 0.01 to 0.5 g./l. of bath liquor.
• the brightening agents, considered as especially favorable for the combination are added in a quantity of 0.05 to 5 g./l., preferably 0.1 to 0.5 g./l. of bath liquor.
• the copper-plating process is conducted in the generally customary temperatureand current density ranges.
• Example I l g./l. of the addition product of 13 mol of ethylene -mercapto-methyl-N-phenyl-thiourea with propansultone
• Example IV 0.4 g./l. of the reaction product of N,N-dietl1yl-thiocarbamyl-mercaptornethyl-N-phenylthiourea with propansultone were added to an acid copper bath of the same basic composition as in Example I.
• Example V An air agitated copper bath of the basic composition as in Example I with an addition of 0.08 g./l.
• Example 11 1 g./l. of the addition product of 18 mol of ethylene oxide to 1 mol of nonephenol as a wetting agent, 0.25 g./l. of the reaction product of N,N-bis-(diethyl-thiocarbamyl-mercaptomethyl)-thiourea with propansultone as a brightening agent and 0.1 g./l. of the compound No. l were added to an acid copper plating bath of the same composition as in Example I having a chlorine-ion concentration of 250 mg./l. The bath furnished, at a temperature tolerance of 10 to 35 C. in the current density range of 0.5 to 8 amp/dm.
• Example III 1 g./l. of the addition product of 18 mol of ethylene oxide in 1 mol of nonylphenyl as a wetting agent and 0.1 g./l. of the reaction product of N,N-dicthyl-thiocarbamylductile, pore-free glossy copper precipitates, which were not leveled, however.
• An acid copper electroplating bath for obtaining level electrodeposits comprising an aqueous solution of an inorganic copper salt and having a chlorine-ion concentration above 60 mg./l., containing as a leveling additive from 0.001 to 20 g./l. of an organic compound, of the formula S S R1 wherein R and R are selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and together with N an aromatic heterocyclic residue and R is selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and the group as above defined.
• the bath of claim 1 which further contains compounds as brightening agents having at least one carbon atom exclusively surrounded by hetero atoms, a member 5 selected from the group consisting of a bivalent aliphatic and aromatic radical with a sulfonic acid group being bound to said'carbon atom through a member selected from the group consisting of sulfur and nitrogen.
• leveling additive is 1 '-C2H5 Q NHCNHCIIz-SCN H II S S (4H5 5.
• leveling additive is C2115 CzHs /NC S--CHzNHfi-NH-CHzS-CN C9115 S S S ⁇ C2H5 6.
• leveling additive is CHr-CH:
• the leveling additive is CHe-CHa CHZ-CHfl N(
• the leveling additive is CHz-CH2 C2115 CH1 /CHNHfiNHOH-SQ-N oHz-o'rn s s C2Hn 9.
• the leveling additive is NH2C-NH-CH2SCN II I! S OH:
• An acid copper electroplating bath for obtaining level electrodeposits comprising an aqueous solution of an inorganic copper salt and having a chlorine-ion concentration above 60 mg./l., containing as a leveling additive from 0.01 to 0.5 g./l. an organic compound of the formula wherein R and R are selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and togetherwith N an aromatic heterocyclic residue and R is selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and the group NOSCH;- ll R1 s as above defined.
• a process for obtaining level copper electrodeposits from an acid copper electroplating bath comprising an aqueous solution of an inorganic copper salt and having a chlorine-ion concentration above 60 mg./l., containing as a leveling additive from 0.001 to 20 g./l. of an organic compound, of the formula R RzNH(IIJNHCHzS(FIN wherein R and R are selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and together .with N an aromatic heterocyclic residue and R is selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and the group /NCSCH- R1 S as above defined.
• leveling additive 15. The process of claim 12, wherein the leveling additive is 16. The process of claim 12 wherein the leveling additive is 17. The process of claim 12 wherein the leveling additive is 18. The process of claim 12 wherein the leveling additive is 19. The process of claim 12 wherein the leveling additive is our-on, out CHNH(!?NH-CHSCIN 20. The process of claim 12 wherein the leveling additive is S OH:
• R and R are selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and together with N an aromatic heterocyclic residue and R is selected from the group consisting of hydrogen, alkyl, cycloaliphatic, aromatic and the group as above defined.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Transportation (AREA)
• Mechanical Engineering (AREA)
• Electroplating And Plating Baths Therefor (AREA)
• Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

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Cited By (4)

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Citations (4)

• 1964
  • 1964-03-07 DE DED43821A patent/DE1248415B/de active Pending
• 1965
  • 1965-01-06 US US423822A patent/US3400059A/en not_active Expired - Lifetime
  • 1965-02-04 GB GB4814/65A patent/GB1036579A/en not_active Expired
  • 1965-02-05 NL NL656501501A patent/NL147194B/xx not_active IP Right Cessation
  • 1965-03-04 BR BR167577/65A patent/BR6567577D0/pt unknown
  • 1965-03-04 BE BE660606D patent/BE660606A/xx unknown
  • 1965-03-05 CH CH310965A patent/CH450859A/de unknown
  • 1965-03-05 SE SE2879/65A patent/SE303075B/xx unknown
  • 1965-03-05 FR FR8188A patent/FR1425983A/fr not_active Expired
  • 1965-03-05 AT AT195065A patent/AT254647B/de active

Patent Citations (4)

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