US3350287A - Method of preventing etch on cast iron in plating baths - Google Patents

Method of preventing etch on cast iron in plating baths Download PDF

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Publication number
US3350287A
US3350287A US291986A US29198663A US3350287A US 3350287 A US3350287 A US 3350287A US 291986 A US291986 A US 291986A US 29198663 A US29198663 A US 29198663A US 3350287 A US3350287 A US 3350287A
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cathode
current density
areas
plating
cast iron
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US291986A
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Bedi Ram Dev
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M&T Chemicals Inc
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M&T Chemicals Inc
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Priority to NL297569D priority Critical patent/NL297569A/xx
Priority to US291986A priority patent/US3350287A/en
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Priority to US291988A priority patent/US3415723A/en
Priority to CH1098763A priority patent/CH479716A/en
Priority to CH1233068A priority patent/CH477561A/en
Priority to CH1233168A priority patent/CH477562A/en
Priority to DE19631496894 priority patent/DE1496894A1/en
Priority to CH1232968A priority patent/CH493644A/en
Priority to FR946796A priority patent/FR1373907A/en
Priority to GB35313/63A priority patent/GB1064295A/en
Priority to SE09807/63A priority patent/SE339153B/xx
Priority to FR951345A priority patent/FR84638E/en
Priority to JP38057330A priority patent/JPS4820971B1/ja
Priority to DE19631496895 priority patent/DE1496895A1/en
Priority to CH1480563A priority patent/CH467868A/en
Priority to ES0295412A priority patent/ES295412A1/en
Priority to SE2022/64A priority patent/SE310970B/xx
Priority to GB10695/64A priority patent/GB1063781A/en
Priority to GB10696/64A priority patent/GB1063503A/en
Priority to GB10698/64A priority patent/GB1063782A/en
Priority to GB10697/64A priority patent/GB1064443A/en
Priority to GB10693/64A priority patent/GB1064296A/en
Priority to GB10694/64A priority patent/GB1064297A/en
Publication of US3350287A publication Critical patent/US3350287A/en
Application granted granted Critical
Priority to US725956A priority patent/US3573175A/en
Priority to US754105A priority patent/US3511758A/en
Priority to US786040A priority patent/US3477920A/en
Priority to US821135A priority patent/US3702809A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Definitions

  • This invention relates to plating and more particularly to a technique for preventing etching of cast iron cathodes at cathodic areas of lowcurrent density.
  • electroplating of various metals may be effected in baths of varying acidity and composition; many of these baths may contain chloride or fluoride together with oxidizing agents which may be an integral part of the bath or present as an additive.
  • oxidizing agents which may be an integral part of the bath or present as an additive.
  • it is necessary to control current density over the areas to be plated. Because of differences in area or geometry or accessibility, there may be portions of the cathode which have a current density low enough so that plating is not expected to and in fact does not occur. It has been found, particularly when the bath is acid and contains e.g.
  • etching is a problem. Specifically, the surface of these areas may be corroded during plating operations sufliciently to alter the dimensions substantially and/ or to spoil the appearance of the finished article. This is particularly true on cast iron if the low current density areas become anodic.
  • chromium plating for example may be effected by use of a bath containing chromic acid and sulfate optionally together with other compounds which may be employed to effect various desirable results.
  • Typical of these optional additive compounds may be fluorides or fluoride complexes.
  • illustrative chromium plating systems may include soluble catalyst systems containing e.g. chromic acid and sulfate such as sulfuric acid in amount sulficient to give the desired concentration of sulfate ion, or self-regulating baths, typically those containing silicofluorides together with sulfate.
  • soluble catalyst systems containing e.g. chromic acid and sulfate such as sulfuric acid in amount sulficient to give the desired concentration of sulfate ion, or self-regulating baths, typically those containing silicofluorides together with sulfate.
  • chromium onto cast iron from baths typified by the foregoing, it is common to operate at a temperature which may vary depending upon the current density, speed of plating, and type of plate desired. Commonly however the temperature of operation may be 34 C. 72 C. and typically 48 C.-63 C.
  • the cathodic current density may preferably be controlled to fall in the range of 8-100, and typically 12-50 a.s.d. (i.e. amperesper square decimeter) on the selected areas of high current density whereon plating may occur.
  • a.s.d. i.e. amperesper square decimeter
  • the current be set to provide a current density as noted, there will be places, typically interior portions, end portions, back portions, or crevices where the current density may -be c0nsiderably. lower, for example 1.6 or less and frequently 0.3-1.0 a.s.d. Such areas may even become anodic under certain conditions.
  • Other objects will be apparent to those skilled in the art on inspection of the following description.
  • the process of this invention for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density comprises placing an auxiliary electrode adjacent to the cathode areas of lowcathode current density whereon plating does not occur, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free. of etching during said plating.
  • Typical of the plate metal with which the process of this invention may find use may be the aforementioned chromium plate including hard, chromium plate.
  • This invention will be especially suitable for use with the noted chromium plating baths, including the, soluble or sparingly soluble catalyst-containing chromium plating baths, since it is with these baths that the problems of etching may be most severe because of the presence of chloride, fluoride, or silico-fluoride ions in the baths.
  • the cathodes which may be used in the practice of this invention may be those cast iron articles upon which a plate, typically a chromium plate is desired.
  • Cast iron as is well known, includes iron commonly containing carbon in amount greater than about 1.7 (typically 2%- 6%) and may include added alloying metals. This metal may be characterized by susceptibility to etching at low current density areasduring, e.g., chromium plating particularly when the baths employed are fluoride-containing chromium plating baths, or if the current actually becomes anodic on parts of these areas.
  • the auxiliary electrode may be placed adjacent to the cathode areas of low current density. Such areas, as will be apparent to those skilled in the art, may be e.g. rear or recessed areas, of the cathode or inside areas of the cathode. Preferably the auxiliary electrode may be placed quite close to the low current density cathode areas notedand as far away from the high current density cathode areas as is'conveniently possible.
  • the auxiliary electrode may preferably be shaped to permit positioning close to the noted areas. Preferably it may have the same configuration as .the areas adjacent to which it is to be positioned.
  • the auxiliary electrode may preferably beone which-is inert to the electrolyte solution. It may preferably be lead, lead alloys including lead-antimony, lead-tin, etc.
  • the auxiliary. electrode may be. maintained anodic to the lower current density areas of the cathode so that the current may fiow to the low current density areas of the plating cathode from the auxiliary electrode thus making the low current density areas uniformly cathodic, even though not at a high enough current density to cause plating.
  • This may be effected by placing the auxiliary electrode in an auxiliary circuit which includes an auxiliary power supply which is electrically connected to the cathode through a DC. ammeter which may measure the direction and flow of current in the auxiliary circuit.
  • the auxiliary power supply may be adjusted or set so that the flow of current in the chromium plating solution may be from the auxiliary electrode to the low current density area of the cathode.
  • auxiliary power will preferably be characterized by high internal impedance.
  • the plating current density on the cathode may vary, in case of chromium plating on cast iron, from about 9.5 a.s.d. to 60 a.s.d.
  • a plating solution 10 may be maintained in vessel 11 which contains a cylindrical cast iron cathode piece generally designated 12 to be electroplated on the outside surface 13.
  • Plating anodes 14 and 15, also suspended in solution 10 by standard means similar to that supporting cathode 12, may be in a plating circuit which includes conductors 16, joined to anodes 14 and 15, main power supply 17, and conductor 18 joined to cathode 12.
  • auxiliary electrode generally designated 19 which preferably in this embodiment may be concentric to the low current density areas 20 of cathode 12.
  • the auxiliary electrode 19 may be in an auxiliary circuit which may include conductor 23, ammeter 24, voltmeter 31, auxiliary power supply 25, and conductor 26; the latter may be connected as shown to conductor 18.
  • a piece of cast iron pipe 19 cm. long, cm. inside diameter, and 6 cm. outside diameter was chromium plated in a bath containing 225 g./l. chromic acid, 2.2 g./l. silicofluoride ion (added as K SiF and 1.08 g./l. sulfate ion (added as strontium sulfate).
  • the cast iron cathode 12 received a chromium deposit of 125 microns when plated at a current density of 50 a.s.d.
  • the polarizing current density, generated by the auxiliary power supply, at the low current density areas 20 of the cathode piece 12 was 8.5 a.s.d., which is generally insufficient to deposit chromium on cast iron.
  • the inside surface 20 of the cathode was found to be completely free of etching and had substantially nonexistent etch band markings.
  • the process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary electrode adjacent to the cathode areas of low cathode cur-rent density whereon plating does not occur, electrically connecting said auxiliary electrode to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said plating.
  • the process for electroplating a chromium plate onto a cast iron cathode having areas of low cathode current density whereon chromium plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary electrode adjacent to the cathode areas of low cathode current density whereon chromium plating does not occur, electrically connecting said auxiliary electrode to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the chromium plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said chromium plating.
  • the process for electroplating a chromium plate onto a cast iron cathode having areas of low cathode current density whereon chromium plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary lead electrode adjacent to the cathode areas of low cathode current density whereon chromium plating does not occur, electrically connecting said auxiliary electrode through an auxiliary power supply to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the chromium plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said chromium plating.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Prevention Of Electric Corrosion (AREA)

Description

Oct. 31, 1967 5501 3,350,287
METHOD OF PREVENTING ETCHON CAST IRON IN PLATING BATHS Filed July 1, 1965 25 24 AUXiLIARY POWER 1 SUPPLY 23 1 f MAIN Is as POWER SUPPLY 1 ii a- 1 N T lol'fl v 2o 2o I24 ,I2 4 z v d g United, States Patent 3,350,287 METHOD OF PREVENTING ETCH ON CAST IRON IN PLATING BATHS Ram Dev Bedi, Oak Park, Mich., assignor to M & T
Chemicals Inc., New York, N.Y., a corporation of Delaware Filed July 1, 1963, Ser. No. 291,986 7 Claims, (Cl. 204-147) This invention relates to plating and more particularly to a technique for preventing etching of cast iron cathodes at cathodic areas of lowcurrent density.
As is well known to those skilled in the art, electroplating of various metals, typically nickel, copper, tin, zinc, or chromium may be effected in baths of varying acidity and composition; many of these baths may contain chloride or fluoride together with oxidizing agents which may be an integral part of the bath or present as an additive. During plating of basis metals in such baths, it is necessary to control current density over the areas to be plated. Because of differences in area or geometry or accessibility, there may be portions of the cathode which have a current density low enough so that plating is not expected to and in fact does not occur. It has been found, particularly when the bath is acid and contains e.g. chloride or fluoride ions together with oxidizing agents, that in these low current density areas, etching is a problem. Specifically, the surface of these areas may be corroded during plating operations sufliciently to alter the dimensions substantially and/ or to spoil the appearance of the finished article. This is particularly true on cast iron if the low current density areas become anodic. The problem of etching maybe present in various baths, typified by chromium plating baths, nickel plating baths, =acid copper baths, acid tin baths, acid zinc baths containing halides or halide-complexes and frequently containing oxidizing agents, etc.; for purposes of convenience, reference will hereinafter be made to chromium plating baths.
As is well known to those skilled in the art, chromium plating for example may be effected by use of a bath containing chromic acid and sulfate optionally together with other compounds which may be employed to effect various desirable results. Typical of these optional additive compounds may be fluorides or fluoride complexes.
Other illustrative chromium plating systems may include soluble catalyst systems containing e.g. chromic acid and sulfate such as sulfuric acid in amount sulficient to give the desired concentration of sulfate ion, or self-regulating baths, typically those containing silicofluorides together with sulfate.
During plating of chromium onto cast iron from baths typified by the foregoing, it is common to operate at a temperature which may vary depending upon the current density, speed of plating, and type of plate desired. Commonly however the temperature of operation may be 34 C. 72 C. and typically 48 C.-63 C. The cathodic current density may preferably be controlled to fall in the range of 8-100, and typically 12-50 a.s.d. (i.e. amperesper square decimeter) on the selected areas of high current density whereon plating may occur. However, because of the irregular shape of many pieces which are to be chromium plated, it is not possible to maintain uniform desired current density over the entire piece. If the current be set to provide a current density as noted, there will be places, typically interior portions, end portions, back portions, or crevices where the current density may -be c0nsiderably. lower, for example 1.6 or less and frequently 0.3-1.0 a.s.d. Such areas may even become anodic under certain conditions.
It has been found that these areas of low current density of the cast iron cathode are etched during plating and especially so when the bath is a chromium plating bath which contains fluoride or silicofluoride ions which may be present in self-regulating high speed baths, soluble catalyst baths, or sparingly soluble catalyst chromium plating systems. In order to to eliminate this etching in chromium plating systems, it has heretofore been common to coat with tapes or waxes those portions of the cathode where low current density is anticipated. The use of such techniques is time consuming and expensive. Tapes or waxes must be carefully placed and removed, since any holes or spaces (including edge areas which may be undermined) in the protective covering will allow severe etching of the so-exposed metal to take place. Such tapes or waxes may be expensive to purchase and apply. Various other attempts to minimize low current density etching of cathodes in the noted plating baths have not been uniformly successful and there is today no economical etch perventive system which is completely satisfactory.
It is an object of this invention to provide a technique for preventing undesirable etching of cast iron in plating operations including e.g. chromium and nickel plating operations. Other objects will be apparent to those skilled in the art on inspection of the following description.
In'accordance with certain of its aspects, the process of this invention for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density comprises placing an auxiliary electrode adjacent to the cathode areas of lowcathode current density whereon plating does not occur, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free. of etching during said plating.
Typical of the plate metal with which the process of this invention may find use may be the aforementioned chromium plate including hard, chromium plate. This invention will be especially suitable for use with the noted chromium plating baths, including the, soluble or sparingly soluble catalyst-containing chromium plating baths, since it is with these baths that the problems of etching may be most severe because of the presence of chloride, fluoride, or silico-fluoride ions in the baths.
The cathodes which may be used in the practice of this invention may be those cast iron articles upon which a plate, typically a chromium plate is desired. Cast iron, as is well known, includes iron commonly containing carbon in amount greater than about 1.7 (typically 2%- 6%) and may include added alloying metals. This metal may be characterized by susceptibility to etching at low current density areasduring, e.g., chromium plating particularly when the baths employed are fluoride-containing chromium plating baths, or if the current actually becomes anodic on parts of these areas.
In practice of this invention, the auxiliary electrode may be placed adjacent to the cathode areas of low current density. Such areas, as will be apparent to those skilled in the art, may be e.g. rear or recessed areas, of the cathode or inside areas of the cathode. Preferably the auxiliary electrode may be placed quite close to the low current density cathode areas notedand as far away from the high current density cathode areas as is'conveniently possible. The auxiliary electrode may preferably be shaped to permit positioning close to the noted areas. Preferably it may have the same configuration as .the areas adjacent to which it is to be positioned.
The auxiliary electrode may preferably beone which-is inert to the electrolyte solution. It may preferably be lead, lead alloys including lead-antimony, lead-tin, etc.
Preferably the auxiliary. electrode may be. maintained anodic to the lower current density areas of the cathode so that the current may fiow to the low current density areas of the plating cathode from the auxiliary electrode thus making the low current density areas uniformly cathodic, even though not at a high enough current density to cause plating. This may be effected by placing the auxiliary electrode in an auxiliary circuit which includes an auxiliary power supply which is electrically connected to the cathode through a DC. ammeter which may measure the direction and flow of current in the auxiliary circuit. The auxiliary power supply may be adjusted or set so that the flow of current in the chromium plating solution may be from the auxiliary electrode to the low current density area of the cathode. This insures that the low current density areas may be protected from etching by being made cathodic at controlled current density, typically 0.1-9 a.s.d., preferably 46 a.s.d. The auxiliary power will preferably be characterized by high internal impedance.
During plating in practice of this invention, the plating current density on the cathode may vary, in case of chromium plating on cast iron, from about 9.5 a.s.d. to 60 a.s.d.
In an illustrative embodiment of the process of this invention, as shown in the attached drawing, a plating solution 10 may be maintained in vessel 11 which contains a cylindrical cast iron cathode piece generally designated 12 to be electroplated on the outside surface 13. Plating anodes 14 and 15, also suspended in solution 10 by standard means similar to that supporting cathode 12, may be in a plating circuit which includes conductors 16, joined to anodes 14 and 15, main power supply 17, and conductor 18 joined to cathode 12. There may also be suspended in the solution 10 the auxiliary electrode generally designated 19 which preferably in this embodiment may be concentric to the low current density areas 20 of cathode 12. The auxiliary electrode 19 may be in an auxiliary circuit which may include conductor 23, ammeter 24, voltmeter 31, auxiliary power supply 25, and conductor 26; the latter may be connected as shown to conductor 18.
In this illustrative example, a piece of cast iron pipe 19 cm. long, cm. inside diameter, and 6 cm. outside diameter was chromium plated in a bath containing 225 g./l. chromic acid, 2.2 g./l. silicofluoride ion (added as K SiF and 1.08 g./l. sulfate ion (added as strontium sulfate). During the period of 120 minutes, the cast iron cathode 12 received a chromium deposit of 125 microns when plated at a current density of 50 a.s.d.
The polarizing current density, generated by the auxiliary power supply, at the low current density areas 20 of the cathode piece 12 was 8.5 a.s.d., which is generally insufficient to deposit chromium on cast iron.
The inside surface 20 of the cathode was found to be completely free of etching and had substantially nonexistent etch band markings.
In a comparable (standard) chromium plating operation, without the auxiliary electrode 19, the inside surface 20 of the cathode was found to be badly etched and had substantial etch bands at each end.
As many embodiments of this invention may be made without departing from the spirit and scope thereof, it is to be understood that the invention includes all such modification and variations as come within the scope of the appended claims.
I claim:
1. The process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary electrode adjacent to the cathode areas of low cathode cur-rent density whereon plating does not occur, electrically connecting said auxiliary electrode to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said plating.
2. The process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density as claimed in claim 1 wherein the auxiliary electrode is lead.
3. The process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density as claimed in claim 1 wherein the cathodic current density applied from an auxiliary power supply onto the low current density areas of the cathode is 0.1 a.s.d. to 9 a.s.d.
4. The process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density as claimed in claim 1 wherein the cathodic current density applied from an auxiliary power supply onto the low current density areas of the cathode is 4 a.s.d. to 6 a.s.d.
5. The process for electroplating a chromium plate onto a cast iron cathode having areas of low cathode current density whereon chromium plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary electrode adjacent to the cathode areas of low cathode current density whereon chromium plating does not occur, electrically connecting said auxiliary electrode to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the chromium plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said chromium plating.
'6. The process for electroplating a chromium plate onto a cast iron cathode having areas of low cathode current density whereon chromium plating does not occur and selected areas of high cathode current density which comprises placing an auxiliary lead electrode adjacent to the cathode areas of low cathode current density whereon chromium plating does not occur, electrically connecting said auxiliary electrode through an auxiliary power supply to said cathode, maintaining said low current density areas of said cathode uniformly cathodic with respect to said auxiliary electrode, and plating the chromium plate onto said selected areas of the surface of said cathode, the said cathode areas of low current density remaining substantially free of etching during said chromium plating.
7. The process for electroplating a plate onto a cast iron cathode having areas of low cathode current density whereon plating does not occur and selected areas of high cathode current density as claimed in claim 6 wherein said electroplating is chromium plating from a bath containing chromic acid, sulfate ion, and fluoride ion.
References Cited UNITED STATES PATENTS 485,343 11/1892 Fletcher.
499,726 6/ 1893 Fletcher 204231 1,055,327 3/1913 Hering 204196 1,465,034 11/ 1921 Antisell 204231 2,508,523 5/1950 Krebs 204--l96 FOREIGN PATENTS 924,180 2/1955 Germany. 1,149,893 1/1958 France.
OTHER REFERENCES Hull: Metal Finishing, September 1944, page 545.
JOHN H. MACK, Primary Examiner.
HOWARD S. WILLIAMS, Examiner.
T. T-UNG, Assistant Examiner.

Claims (1)

1. THE PROCES FOR ELECTROPLATING A PLATE ONTO A CAST IRON CATHODE HAVING AREAS OF LOW CATHODE CURRENT DENSITY WHEREON PLATING DOES NOT OCCUR AND SELECTED AREAS OF HIGH CATHODE CURRENT DENSITY WHICH COMPRISES PLACING AN AUXILIARY ELECTRODE ADJACENT TO THE CATHODE AREAS OF LOW CATHODE CURRENT DENSITY WHEREON PLATING DOES NOT OCCUR, ELECTRICALLY CONNECTING SAID AUXILIARY ELECTRODE TO SAID CATHODE, MAINTAINING SAID LOW CURRENT DENSITY AREAS OF SAID CATHODE UNIFORMLY CATHODIC WITH RESPECT TO SAID AUXILIARY ELECTRODE, AND PLATINGD THE PLATE ONTO SAID SELECTED AREAS OF THE SURFACE OF SAID CATHODE, THE SAID CATHODE AREAS OF LOW CURRENT DENSITY REMAINING SUBSTANTIALLY FREE OF ETCHING DURING SAID PLATING.
US291986A 1962-09-06 1963-07-01 Method of preventing etch on cast iron in plating baths Expired - Lifetime US3350287A (en)

Priority Applications (27)

Application Number Priority Date Filing Date Title
NL297569D NL297569A (en) 1962-09-06
US291988A US3415723A (en) 1962-09-06 1963-07-01 Method of stop-off of cathode pieces in chromium plating baths
US291986A US3350287A (en) 1962-09-06 1963-07-01 Method of preventing etch on cast iron in plating baths
CH1233068A CH477561A (en) 1962-09-06 1963-09-05 Process for preventing etching in electroplating of steel and iron and apparatus for carrying out the process
CH1098763A CH479716A (en) 1962-09-06 1963-09-05 Process for preventing etching in electroplating metals
CH1233168A CH477562A (en) 1962-09-06 1963-09-05 Process for preventing etching in the electroplating of cast iron and apparatus for carrying out the process
DE19631496894 DE1496894A1 (en) 1962-09-06 1963-09-05 Process for electroplating base metals without etching
CH1232968A CH493644A (en) 1962-09-06 1963-09-05 Process for preventing etching in electroplating a metal and apparatus for carrying out the process
FR946796A FR1373907A (en) 1962-09-06 1963-09-06 Selective electroplating process
GB35313/63A GB1064295A (en) 1962-09-06 1963-09-06 Improvements in or relating to electroplating
SE09807/63A SE339153B (en) 1962-09-06 1963-09-06
FR951345A FR84638E (en) 1962-09-06 1963-10-22 Selective electroplating process
JP38057330A JPS4820971B1 (en) 1962-09-06 1963-10-28
DE19631496895 DE1496895A1 (en) 1962-09-06 1963-11-21 Method of covering the base metal in electroplating
CH1480563A CH467868A (en) 1962-09-06 1963-12-04 Method of covering metals during electroplating
ES0295412A ES295412A1 (en) 1963-07-01 1964-01-16 Apparatus for electrodeposition of a covered (Machine-translation by Google Translate, not legally binding)
SE2022/64A SE310970B (en) 1962-09-06 1964-02-19
GB10694/64A GB1064297A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating onto steel or iron
GB10696/64A GB1063503A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating on cast iron
GB10698/64A GB1063782A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating
GB10697/64A GB1064443A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating
GB10693/64A GB1064296A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating
GB10695/64A GB1063781A (en) 1962-09-06 1964-03-13 Improvements in or relating to electroplating
US725956A US3573175A (en) 1962-09-06 1968-05-01 Method of stopping-off plating in electroplating baths
US754105A US3511758A (en) 1962-09-06 1968-08-13 Method of preventing etch on steel and iron in plating baths
US786040A US3477920A (en) 1962-09-06 1968-12-23 Method of treating electrodes for use in electroplating baths
US821135A US3702809A (en) 1962-09-06 1969-05-01 Method of preventing etch in plating baths

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US22187962A 1962-09-06 1962-09-06
US29198763A 1963-07-01 1963-07-01
US29192563A 1963-07-01 1963-07-01
US29196063A 1963-07-01 1963-07-01
US29191763A 1963-07-01 1963-07-01
US291986A US3350287A (en) 1962-09-06 1963-07-01 Method of preventing etch on cast iron in plating baths
US291988A US3415723A (en) 1962-09-06 1963-07-01 Method of stop-off of cathode pieces in chromium plating baths
US72595668A 1968-05-01 1968-05-01
US75410568A 1968-08-13 1968-08-13
US78604068A 1968-12-23 1968-12-23
US82113569A 1969-05-01 1969-05-01

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US291988A Expired - Lifetime US3415723A (en) 1962-09-06 1963-07-01 Method of stop-off of cathode pieces in chromium plating baths
US291986A Expired - Lifetime US3350287A (en) 1962-09-06 1963-07-01 Method of preventing etch on cast iron in plating baths
US725956A Expired - Lifetime US3573175A (en) 1962-09-06 1968-05-01 Method of stopping-off plating in electroplating baths
US754105A Expired - Lifetime US3511758A (en) 1962-09-06 1968-08-13 Method of preventing etch on steel and iron in plating baths
US786040A Expired - Lifetime US3477920A (en) 1962-09-06 1968-12-23 Method of treating electrodes for use in electroplating baths
US821135A Expired - Lifetime US3702809A (en) 1962-09-06 1969-05-01 Method of preventing etch in plating baths

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US725956A Expired - Lifetime US3573175A (en) 1962-09-06 1968-05-01 Method of stopping-off plating in electroplating baths
US754105A Expired - Lifetime US3511758A (en) 1962-09-06 1968-08-13 Method of preventing etch on steel and iron in plating baths
US786040A Expired - Lifetime US3477920A (en) 1962-09-06 1968-12-23 Method of treating electrodes for use in electroplating baths
US821135A Expired - Lifetime US3702809A (en) 1962-09-06 1969-05-01 Method of preventing etch in plating baths

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JP (1) JPS4820971B1 (en)
CH (5) CH493644A (en)
DE (2) DE1496894A1 (en)
GB (7) GB1064295A (en)
NL (1) NL297569A (en)
SE (2) SE339153B (en)

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US6039858A (en) * 1998-07-22 2000-03-21 International Business Machines Corporation Plating process for x-ray mask fabrication
US6554976B1 (en) * 1997-03-31 2003-04-29 Tdk Corporation Electroplating apparatus
CN103088373A (en) * 2011-10-31 2013-05-08 肖云捷 Effective method for preventing scorching in electroplating process

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US3901771A (en) * 1973-07-11 1975-08-26 Inland Steel Co One-side electrocoating
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
US3959099A (en) * 1975-06-18 1976-05-25 Inland Steel Company Electrolytic method of producing one-side-only coated steel
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
JPS5321048A (en) * 1976-08-10 1978-02-27 Nippon Electric Co Constant current density plating device
US4071429A (en) * 1976-12-29 1978-01-31 Monsanto Company Electrolytic flow-cell apparatus and process for effecting sequential electrochemical reaction
US4292159A (en) * 1977-11-21 1981-09-29 Olin Corporation Cell having in situ reduction of electrode overvoltage
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4378282A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4545873A (en) * 1982-01-19 1985-10-08 Ciba-Geigy Ag Vessel for an unstable solution of a metal salt or complex and method for sealing such vessel
US5122256A (en) * 1991-05-24 1992-06-16 Waskiewicz Walter P Method for selectively coating surfaces of components
US5173170A (en) * 1991-06-03 1992-12-22 Eco-Tec Limited Process for electroplating metals
DE4442792A1 (en) * 1994-12-01 1996-06-05 Teves Gmbh Alfred Process for the production of a corrosion and wear protective oxide layer with a locally reduced layer thickness on the metal surface of a workpiece
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6197664B1 (en) 1999-01-12 2001-03-06 Fujitsu Limited Method for electroplating vias or through holes in substrates having conductors on both sides
US6193860B1 (en) * 1999-04-23 2001-02-27 Vlsi Technolgy, Inc. Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents
GB2351089B (en) * 1999-06-15 2001-04-18 Hong Kong Productivity Council Platinum electroforming/electroplating bath and method
GB2383337A (en) * 2001-12-21 2003-06-25 Accentus Plc Electroplating plant and method
US6923252B2 (en) * 2003-04-17 2005-08-02 The Regents Of The University Of California Borehole sounding device with sealed depth and water level sensors
US20080169199A1 (en) * 2007-01-17 2008-07-17 Chang Gung University Trivalent chromium electroplating solution and an electroplating process with the solution
US20090211914A1 (en) * 2008-02-21 2009-08-27 Ching-An Huang Trivalent Chromium Electroplating Solution and an Operational Method Thereof
CN103122470B (en) * 2011-11-17 2015-12-09 符士正 Automobile cast iron die plating solution
US9752232B2 (en) * 2015-05-13 2017-09-05 Dan Porodo Method of electrolessly plating nickel on tubulars

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US1055327A (en) * 1908-11-27 1913-03-11 Carl Hering Means for preventing corrosion of underground metallic structures.
US1465034A (en) * 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
DE924180C (en) * 1942-07-03 1955-02-28 Messerschmitt Boelkow Blohm Device for removing contaminants that have accumulated on valve cones, especially on exhaust valves of internal combustion engines, during operation
US2508523A (en) * 1946-09-11 1950-05-23 Krebs & Co Device for the protection of the cathodes of electrolytic cells
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US3424660A (en) * 1964-01-14 1969-01-28 Bayer Ag Process for chemical plating
US6554976B1 (en) * 1997-03-31 2003-04-29 Tdk Corporation Electroplating apparatus
US6039858A (en) * 1998-07-22 2000-03-21 International Business Machines Corporation Plating process for x-ray mask fabrication
US6287434B1 (en) 1998-07-22 2001-09-11 International Business Machines Corporation Plating cell apparatus for x-ray mask fabrication
CN103088373A (en) * 2011-10-31 2013-05-08 肖云捷 Effective method for preventing scorching in electroplating process

Also Published As

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CH493644A (en) 1970-07-15
US3415723A (en) 1968-12-10
US3573175A (en) 1971-03-30
GB1063503A (en) 1967-03-30
DE1496894A1 (en) 1969-08-14
US3702809A (en) 1972-11-14
US3477920A (en) 1969-11-11
NL297569A (en)
DE1496895A1 (en) 1969-09-18
GB1064296A (en) 1967-04-05
GB1063782A (en) 1967-03-30
CH467868A (en) 1969-01-31
SE339153B (en) 1971-09-27
GB1064295A (en) 1967-04-05
US3511758A (en) 1970-05-12
JPS4820971B1 (en) 1973-06-25
SE310970B (en) 1969-05-19
CH477561A (en) 1969-08-31
CH479716A (en) 1969-10-15
GB1063781A (en) 1967-03-30
CH477562A (en) 1969-08-31
GB1064297A (en) 1967-04-05
GB1064443A (en) 1967-04-05

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