US3192620A - Method of joining diamond to metal - Google Patents

Method of joining diamond to metal Download PDF

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Publication number
US3192620A
US3192620A US211831A US21183162A US3192620A US 3192620 A US3192620 A US 3192620A US 211831 A US211831 A US 211831A US 21183162 A US21183162 A US 21183162A US 3192620 A US3192620 A US 3192620A
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Prior art keywords
diamond
weight
tantalum
gold
alloy
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US211831A
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Huizing Albert
Hubert Jan Van Daal
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US Philips Corp
North American Philips Co Inc
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US Philips Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/363—Carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/403—Refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/932—Abrasive or cutting feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/939—Molten or fused coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S76/00—Metal tools and implements, making
    • Y10S76/12—Diamond tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12833—Alternative to or next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component

Definitions

  • This invention relates to a method of satisfactorily joining diamond to metal, for example, for manufacturing tools such as drills and chisels, and gramophone reproducing needles.
  • metals titanium and zirconium which, as is well-known, are used to this end as an intermediate layer. These metals were applied to diamond surfaces for example, by decomposition in vacuo from the hydrides, a further junction being established thereon with the aid of a coppersilver solder.
  • titanium and zirconium has the disadvantage that in the presence of air these metals readily enter into reaction while forming oxides and nitrides whereupon they are no longer capable of assisting in wetting the diamond. Consequently, in these cases, satisfactory junctions can only be obtained by using a high vacuum of at least 10- mm. of Hg, or an atmosphere of rare gas containing only a few p.p.m. of impurity.
  • titanium or zironium as an intermediate layer has a further limitation in that the solder to be used thereon must be of a composition such that a sufiiciently matched coefficient of expansion can be obtained. This is also the case with the titanium-containing soldering alloys applied directly to the diamond.
  • the invention has for its object to mitigate the abovementioned drawbacks.
  • a very satisfactorily adhering junction of a diamond to metal is obtained with the aid of an alloy of gold and at least 1% by weight of tantalum and/ or columbium.
  • the melting operation may be effected in a less high vacuum, for example 10* nun. of Hg, or in a rare-gas atmosphere of lower purity, than is the case with titanium or zircon-ium.
  • Alloys having a content of tantalum or niobium lower than approximately 1% by weight do not wet the diamond surface sufliciently.
  • a tantalum content exceeding 25% by weight is usually undesirable since such an alloy has too high a melting point, namely above 1500 C.,
  • the columbium content of the alloys had better not be raised higher than to approximately 10% by Weight.
  • the content is chosen lower than about 5% by weight.
  • diamond may be soldered to the most widely varying materials, irrespective of their coefiicients of expansion.
  • Suitable for use are, for example, quartz, silicon carbide, ceramic materials and metals such as molybdenum, tungsten and nickel. 1
  • alloys may readily be shaped into foil or wire, which may be useful in Working up.
  • a small diamond is degreased and clamped to one end of a molybdenum rod with the aid of a coiled spring of molybdenum wire. Subsequently, this end is immersed in vacuo or in an argon atmosphere into a molten alloy of 97% by weight of gold and 3% by weight of tantalum for one second at a temperature of approximately 1300 C. The alloy flows smoothly on the diamond and on the molybdenum. Subsequently, the diamond, which is very intimately connected to the molybdenum, is ground.
  • a chisel is manufactured by securing a diamond plate having a surface area of approximately A sq. cm. to a smoothly worked side face of a rod-shaped molybdenum holder with the aid of an alloy comprising by weight of gold and 5% by weight of tantalum.
  • the alloy is applied in the form of a foil approximately microns thick.
  • a piece of this foil a little larger than the surface of the diamond is laid on the molybdenum, the diamond being placed thereon so as to project partly from the holder.
  • the assembly is heated in vacuo to approximately 1400 C. with the aid of an inductive highfrequency generator while the diamond in this position is urged on the holder by a pin of ceramic material on a base of alumina.
  • a method of joining diamond to a metal comprising applying an alloy selected from the group consisting of gold-tantalum alloys containing from 1% to 25% by weight of tantalum and gold-columbium alloys containing from 1% to 10% by weight of columbium to opposing surfaces of said diamond and metal and melting said alloy in an inert atmosphere.
  • the alloy consists References Cited by the Examiner of gold and from 1% to 10% by Weight of columbium. UNITED STATES PATENTS 5.
  • the method of claim 1 wherein the alloy consists 2,739,375 3/56 Coxe 29 473'1 X of gold and from 1% to 5% by Weight of columbium. 2 979 13 l 4 1 s i 29 472 9 X 6.
  • An article comprising diamond soldered to a metal object, said solder consisting of an alloy selected from the 10 JOHN F. CAMPBELL, Primary Examiner.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Products (AREA)
  • Sealing Devices (AREA)

Description

United States Patent Claims priority, application Netherlands, Aug. 29, 1961,
268,734 6 Claims. (Cl. 29473.1)
This invention relates to a method of satisfactorily joining diamond to metal, for example, for manufacturing tools such as drills and chisels, and gramophone reproducing needles.
It is known that metals do not usually provide satisfactory junctions to diamond. This is mostly due to the fact that in the fluid state they do not wet the diamond or wet it inadequately.
Favourable exceptions in this respect are the metals titanium and zirconium which, as is well-known, are used to this end as an intermediate layer. These metals were applied to diamond surfaces for example, by decomposition in vacuo from the hydrides, a further junction being established thereon with the aid of a coppersilver solder.
It is also known that a satisfactory junction to diamond can be obtained directly if use is made of a copper-silver alloy having a titanium content.
The use of titanium and zirconium has the disadvantage that in the presence of air these metals readily enter into reaction while forming oxides and nitrides whereupon they are no longer capable of assisting in wetting the diamond. Consequently, in these cases, satisfactory junctions can only be obtained by using a high vacuum of at least 10- mm. of Hg, or an atmosphere of rare gas containing only a few p.p.m. of impurity.
Such ditficulties also occur when using the said titaniumcontaining solder alloys. Moreover the majority of materials are chemically attacked by these alloys in the matter state, which causes complications in manufacturing and working up these alloys.
Finally, the use of titanium or zironium as an intermediate layer has a further limitation in that the solder to be used thereon must be of a composition such that a sufiiciently matched coefficient of expansion can be obtained. This is also the case with the titanium-containing soldering alloys applied directly to the diamond.
The invention has for its object to mitigate the abovementioned drawbacks.
According to the invention a very satisfactorily adhering junction of a diamond to metal is obtained with the aid of an alloy of gold and at least 1% by weight of tantalum and/ or columbium.
Since these alloys are not particularly reactive, the melting operation may be effected in a less high vacuum, for example 10* nun. of Hg, or in a rare-gas atmosphere of lower purity, than is the case with titanium or zircon-ium.
Alloys having a content of tantalum or niobium lower than approximately 1% by weight do not wet the diamond surface sufliciently. A tantalum content exceeding 25% by weight is usually undesirable since such an alloy has too high a melting point, namely above 1500 C.,
3,192,62h Patented July 6, 1965 or is too brittle. Particularly satisfactory results are obtained with alloys having a tantalum content from 5% to 10% by weight, which flow out very smoothly on the diamond surface and have melt-ing points of approximately ll00 C. to 1300 C.
With a view to the increasing brittleness, the columbium content of the alloys had better not be raised higher than to approximately 10% by Weight. Preferably, the content is chosen lower than about 5% by weight.
With the aid of the alloys of gold and tantalum and/ or columbium, diamond may be soldered to the most widely varying materials, irrespective of their coefiicients of expansion. Suitable for use are, for example, quartz, silicon carbide, ceramic materials and metals such as molybdenum, tungsten and nickel. 1
The fact that in all these cases a junction of great rigidity is obtained which is not or substantially not sensitive to considerable temperature variations as already occur, for example, during cooling when the junction is manufactured, is possible connected with the ductility of the alloys concerned.
This property entails the further advantage that the alloys may readily be shaped into foil or wire, which may be useful in Working up.
Examples (1) When a gramophone reproducing needle is manufactured, one proceeds as follows:
A small diamond is degreased and clamped to one end of a molybdenum rod with the aid of a coiled spring of molybdenum wire. Subsequently, this end is immersed in vacuo or in an argon atmosphere into a molten alloy of 97% by weight of gold and 3% by weight of tantalum for one second at a temperature of approximately 1300 C. The alloy flows smoothly on the diamond and on the molybdenum. Subsequently, the diamond, which is very intimately connected to the molybdenum, is ground.
A similar result is achieved when using an alloy consisting of 97% by weight of gold and 3% by weight of columbiun.
(2) A chisel is manufactured by securing a diamond plate having a surface area of approximately A sq. cm. to a smoothly worked side face of a rod-shaped molybdenum holder with the aid of an alloy comprising by weight of gold and 5% by weight of tantalum. The alloy is applied in the form of a foil approximately microns thick.
A piece of this foil a little larger than the surface of the diamond is laid on the molybdenum, the diamond being placed thereon so as to project partly from the holder.
Subsequently, the assembly is heated in vacuo to approximately 1400 C. with the aid of an inductive highfrequency generator while the diamond in this position is urged on the holder by a pin of ceramic material on a base of alumina.
What is claimed is:
1. A method of joining diamond to a metal comprising applying an alloy selected from the group consisting of gold-tantalum alloys containing from 1% to 25% by weight of tantalum and gold-columbium alloys containing from 1% to 10% by weight of columbium to opposing surfaces of said diamond and metal and melting said alloy in an inert atmosphere.
'i v 0 L 2. The method of claim 1 wherein the alloy consists group consisting of gold-tantalum alloys containing from of gold and from 1% to 25% by weight of tantalum. 1% to 25% by weight of tantalum and gold-columbium 3. The method of claim 1 wherein the alloy consists alloys containing from 1% by 10% by Weight of tantalum.
of gold and from 5% to 10% by weight of tantalum.
4. The method of claim 1 wherein the alloy consists References Cited by the Examiner of gold and from 1% to 10% by Weight of columbium. UNITED STATES PATENTS 5. The method of claim 1 wherein the alloy consists 2,739,375 3/56 Coxe 29 473'1 X of gold and from 1% to 5% by Weight of columbium. 2 979 13 l 4 1 s i 29 472 9 X 6. An article comprising diamond soldered to a metal object, said solder consisting of an alloy selected from the 10 JOHN F. CAMPBELL, Primary Examiner.

Claims (2)

1. A METHOD OF JOINING DIAMOND TO A METAL COMPRISING APPLYING AN ALLOY SELECTED FROM THE GROUP CONSISTING OF GOLD-TANTALUM ALLOYS CONTAINING FROM 1% TO 25% BY WEIGHT OF TANTALUM AND GOLD-COLUMBIUM ALLOYS CONTAINING FROM 1% TO 10% BY WEIGHT OF COLUMBIUM TO OPPOSING SURFACES SAID DIAMOND AND METAL AND MELTING SAID ALLOY IN AN INERT ATMOSPHERE.
6. AN ARTICLE COMPRISING DIAMOND SOLDERED TO A METAL OBJECT, SAID SOLDER CONSISTING OF AN ALLOY SELECTED FROM THE GROUP CONSISTING OF GOLD-TANTALUM ALLOYS CONTAINING FROM 1% TO 25% BY WEIGHT OF TANTALUM AND GOLD-COLUMBIUM ALLOYS CONTAINING FROM 1% TO 10% BY WEIGHT OF TANTALUM.
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377696A (en) * 1965-07-26 1968-04-16 Gen Electric Bonding diamond to molybdenum
US3678568A (en) * 1969-07-02 1972-07-25 Philips Corp Method of securing diamond by brazing
US3856480A (en) * 1973-02-16 1974-12-24 Du Pont Diamond joined to metal
US3868750A (en) * 1974-03-21 1975-03-04 Du Pont Method of joining diamond to metal
US3940050A (en) * 1973-02-16 1976-02-24 E. I. Du Pont De Nemours And Company Method of joining diamond to metal
DE2534777A1 (en) * 1974-08-02 1976-03-04 Inst Materialovedenija Akademi PROCESS FOR SOLDERING METALS AND MATERIALS ON THE DIAMOND OR BORNITRIDE BASE AND SOLDER FOR CARRYING OUT THIS PROCESS
US4307984A (en) * 1979-11-19 1981-12-29 Patterson James A Cutting elements
US4661180A (en) * 1985-03-25 1987-04-28 Gte Valeron Corporation Method of making diamond tool
US4699142A (en) * 1985-06-21 1987-10-13 D. Drukker & Zn. N.V. Microsurgical suture needles
US4776862A (en) * 1987-12-08 1988-10-11 Wiand Ronald C Brazing of diamond
US4813246A (en) * 1985-03-07 1989-03-21 Camille Richards Method of setting precious and semiprecious stones
US4968326A (en) * 1989-10-10 1990-11-06 Wiand Ronald C Method of brazing of diamond to substrate
US5079102A (en) * 1989-07-14 1992-01-07 Sumitomo Electric Industries, Ltd. Tool using gold as a binder
US20050079358A1 (en) * 2003-10-08 2005-04-14 Frushour Robert H. Polycrystalline diamond composite
US20050079357A1 (en) * 2003-10-08 2005-04-14 Frushour Robert H. High abrasion resistant polycrystalline diamond composite

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4670025A (en) * 1984-08-13 1987-06-02 Pipkin Noel J Thermally stable diamond compacts

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739375A (en) * 1952-09-12 1956-03-27 Handy & Harman Joining of non-metallic materials and brazing filler rods therefor
US2979813A (en) * 1956-09-28 1961-04-18 Horizons Inc Joining of graphite members

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739375A (en) * 1952-09-12 1956-03-27 Handy & Harman Joining of non-metallic materials and brazing filler rods therefor
US2979813A (en) * 1956-09-28 1961-04-18 Horizons Inc Joining of graphite members

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377696A (en) * 1965-07-26 1968-04-16 Gen Electric Bonding diamond to molybdenum
US3678568A (en) * 1969-07-02 1972-07-25 Philips Corp Method of securing diamond by brazing
US3856480A (en) * 1973-02-16 1974-12-24 Du Pont Diamond joined to metal
US3940050A (en) * 1973-02-16 1976-02-24 E. I. Du Pont De Nemours And Company Method of joining diamond to metal
US3868750A (en) * 1974-03-21 1975-03-04 Du Pont Method of joining diamond to metal
DE2534777A1 (en) * 1974-08-02 1976-03-04 Inst Materialovedenija Akademi PROCESS FOR SOLDERING METALS AND MATERIALS ON THE DIAMOND OR BORNITRIDE BASE AND SOLDER FOR CARRYING OUT THIS PROCESS
US4307984A (en) * 1979-11-19 1981-12-29 Patterson James A Cutting elements
US4813246A (en) * 1985-03-07 1989-03-21 Camille Richards Method of setting precious and semiprecious stones
US4661180A (en) * 1985-03-25 1987-04-28 Gte Valeron Corporation Method of making diamond tool
US4699142A (en) * 1985-06-21 1987-10-13 D. Drukker & Zn. N.V. Microsurgical suture needles
US4776862A (en) * 1987-12-08 1988-10-11 Wiand Ronald C Brazing of diamond
US5079102A (en) * 1989-07-14 1992-01-07 Sumitomo Electric Industries, Ltd. Tool using gold as a binder
US4968326A (en) * 1989-10-10 1990-11-06 Wiand Ronald C Method of brazing of diamond to substrate
US20050079358A1 (en) * 2003-10-08 2005-04-14 Frushour Robert H. Polycrystalline diamond composite
US20050079357A1 (en) * 2003-10-08 2005-04-14 Frushour Robert H. High abrasion resistant polycrystalline diamond composite
US7517588B2 (en) 2003-10-08 2009-04-14 Frushour Robert H High abrasion resistant polycrystalline diamond composite
US7595110B2 (en) 2003-10-08 2009-09-29 Frushour Robert H Polycrystalline diamond composite

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GB1013337A (en) 1965-12-15
AT248833B (en) 1966-08-25
DK104333C (en) 1966-05-02
ES280309A1 (en) 1962-12-01

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