GB2163144A - Thermally stable diamond compacts - Google Patents

Thermally stable diamond compacts Download PDF

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Publication number
GB2163144A
GB2163144A GB08520183A GB8520183A GB2163144A GB 2163144 A GB2163144 A GB 2163144A GB 08520183 A GB08520183 A GB 08520183A GB 8520183 A GB8520183 A GB 8520183A GB 2163144 A GB2163144 A GB 2163144A
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Prior art keywords
diamond
alloy
diamond compact
percent
compact
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Granted
Application number
GB08520183A
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GB8520183D0 (en
GB2163144B (en
Inventor
Noel John Pipkin
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De Beers Industrial Diamond Division Pty Ltd
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De Beers Industrial Diamond Division Pty Ltd
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Priority to GB08520183A priority Critical patent/GB2163144B/en
Publication of GB8520183D0 publication Critical patent/GB8520183D0/en
Publication of GB2163144A publication Critical patent/GB2163144A/en
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Publication of GB2163144B publication Critical patent/GB2163144B/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013Au as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/007Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent between different parts of an abrasive tool
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/125Metallic interlayers based on noble metals, e.g. silver
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/126Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127The active component for bonding being a refractory metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/363Carbon
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/401Cermets
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Abstract

A thermally stable diamond compact which has an alloy of liquidus above 700 DEG C bonded to a surface thereof. The alloy contains at least 40 percent by weight of silver or gold or a combination thereof and 1 to 10 percent by weight of an active metal selected from the group of tungsten, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum and having a liquidus temperature above 700 DEG C.

Description

SPECIFICATION Thermally stable diamond compacts Background to the invention This invention relates to thermally stable diamond compacts.
Abrasive compacts are well known in the art and are used extensively in industry for the abrading of various workpieces. They consist essentially of a mass of abrasive particles present in an amount of at least 70%, preferably 80 to 90%, by volume of the compact bonded into a hard conglomerate.
Compacts are polycrystalline masses and can replace single large crystals.The abrasive particles of compacts are invariably ultra hard abrasives such as diamond and cubic boron nitride.
Abrasive compacts may contain a second phase or bonding matrix which contains a solvent (also known as a catalyst) useful in synthesising the particles.ln the case of diamond, examples of suitable solvents are metals of group VIII of the periodic table such as cobalt, nickel or iron or an alloy containing such a metal. The presence of these solvents in diamond compacts renders them thermally sensitive at temperatures above 700 C. In other words, at temperatures above 7000C degradation of the diamond is likely to occur.This, together with the differences in coefficients of thermal expansions of the diamond and solvent, causes structural degradation of the compact.The result is that the compact is substantially weakened or rendered useless as an abrasive.
United States Patent specification No. 4,224,380 describes a. method of leaching out a substantial quantity of solvent from a diamond compact. The resulting product is therefore substantially free of catalyst and is thermally more stable than the unleached product. Such a compact has an ability to withstand temperatures of up to 1200 C under vacuum without significant structural degradation of the compact occurring. The compact is known as a thermally stable compact.
Other thermally stable diamond compacts have been described in the literature and used commercially. For example European Patent Publication No. 0 116403 describes a thermally stable diamond compact comprising a mass of diamond particles present in an amount of 80 to 90% by volume of the body and a second phase present in an amount of 10 to 20% by volume of the body, the mass of diamond particles containing substantial diamond-to-diamond bonding to form a coherent skeletal mass and the second phase containing nickel and silicon, the nickel being in the form of nickel and/or nickel silicide and the silicon being in the form of silicon, silicon carbide, and/or nickel silicide.
A further example of thermally stable diamond compact is that described in the specification of British Patent Application No. 8508295. The ther mally stable diamond compact comprises a mass of diamond particles present in an amount of 80 to 90 percent by volume of the compact and a second phase present in an amount of 10 to 20 percent by volume of the insert, the mass of diamond particles containing substantial diamond-to-diamond bonding to form a coherent skeletal mass and the second phase consisting essentially of silicon, the silicon being in the form of silicon and/or silicon carbide.
European Patent Publication No. 0 104 063 describes a method of bonding a cubic boron nitride compact to a cemented carbide support. The method includes the steps of metallising a surface of the cubic boron nitride compact by bonding a layer of gold, silver or a gold or silver-based alloy to that surface and bonding the metallised surface to a surface of the cemented carbide support through a braze alloy having a liquidus temperature above 700 C. The preferred braze alloy contains at least 40 percent by weight silver, gold or a combination thereof, and 1 to 10 percent by weight of an active metal selected from the group of titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum. The disclosure of the specification is specifically limited to the bonding of a cubic boron nitride compact to a cemented carbide support.
The disclosures of the four specifications mentioned above are incorporated herein by reference.
Summary of the invention According to the present invention, there is provided a polycrystalline mass of diamond particles present in an amount of at least 70 percent by volume bonded into a hard conglomerate and being able to withstand a temperature of 12000C in a vacuum without any significant structural degradation of the compact occurring, the compact having bonded to a surface thereof an alloy layer, the alloy containing at least 40 percent by weight ofsil- ver or gold or a combination thereof and 1 to 10 percent by weight of an active metal selected from the group of tungsten, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum and having a liquidus temperature above 700 C.
Where the total amount of gold and/or silver and the active metal does not total 100 percent, the alloy will contain another metal or metals which do not reduce the liquidus temperature below 700 C.Typical of the other metals which may be used in the alloy are copper and the platinum group metals. Preferred other metals are copper and a combination of copper and palladium. However, other metals may be used, as will be clear to a person skilled in the art.
The diamond compact is thus a thermally stable diamond compact, examples of which are described in the specification above and are well known in the art. These compacts are capable of withstanding a temperature of 1200 C in a vacuum, for example a vacuum of 105 mbar or better, without any significant structural degradation of the compact occurring. Such compacts find particular application in abrasive tools where high temperatures are generated during use thereof, as for ex ample in dressing or trueing tools, or where high temperatures are required during manufacture of the tool, as for example in surface set or impregnated drill bits.
Detailed description of the invention As mentioned above, thermally stable diamond compacts are used in applications where high temperatures are generated in use or during manufacture of the tool. Such compacts are not easily wetted by conventional brazes and this is one of the reasons why they are as a general rule held mechanically in the working surface of the tool. For example, in a surface set drill bit the individual compacts, which may have a triangular, cubic, hex atonal or other useful shape, will be held mechanically in the matrix of the working surface bf the drill bit. It is desirable to supplement the mechanicat bond by a bond of a chemical or braze nature.
It has been found that the alloy specified above bonds extremely strongly to the diamond compact surface to which it is applied. Furthermore, the alloy it has been found, bonds readily to a variety of commercially available brazes and forms a braze bond with the matrix of conventional surface set and impregnated drill bits.
The alloy coated surface may be bonded readily to a cemented carbide support, either directly or through another commercially available braze.When another commercially available braze is used, it is preferably a high temperature braze such as a silver/copper/zinc/nickel/manganese braze or a copper/manganese/nickel/indium/tin braze both of which have a liquidus temperature above 700"C. The diamond compact, being thermally stable, can withstand such temperatures and the resulting braze bond is extremely strong. The invention thus enables a thermally stable diamond compact to be brazed to a tool or tool holder in contrast to uncoated thermally stable diamond compacts of the prior art.
The alloy will preferably contain 40 to 70 percent by weight of gold or silver or a combination thereof. Examples of suitable alloys are the following: 1. Gold and the active metal.
2. A silver/copper binary alloy containing the active metal.
3. A silver/copper/palladium ternary alloy containing the active metal, particularly titanium.
The thickness of the alloy layer is not critical, but it will generally~not exceed 200 microns in thickness.
The thermally stable diamond compact may be used in the form of small fragments having any one of a number of useful shapes such as cube, triangle or hexagon. For such compacts it is preferable that the alloy layer is bonded to at least 75 percent of the surface thereof.
The thermally stable diamond compact may also be provided in the form of a disc or segment of a disc having a major flat surface on each of opposite sides thereof. For such compacts it is preferable that at least one of the major flat surfaces has the alloy layer bonded to it the coated flat surface may be bonded to a cemented carbide support.
The alloy may be bonded to the surface of the diamond compact by contacting the surface with the alloy, for example in the form of a foil, and then raising the temperature of the coated compact to a temperature above the liquidus temperature of the alloy in a non-oxidising atmosphere. An example of a suitable non-oxidising atmosphere is a -vacuum of 10-4 mbar or better. To improve the wettability of the diamond compact surface, it is preferably first to apply a flashing of gold or silver to the compact surface before the alloy is bonded thereto. The gold or silver flashing will generally have a thickness of no more than- a few microns. A method of applying a gold or silver flashing prior to bonding the alloy to the surface is described fully in European Patent Publication No. 0 104 063.
The thermally stable diamond compact may be any known in the art, but is preferably one of the type described in British Patent Application No.
8508295.
The invention will further be described with reference to the following examples.
EXAMPLE 1 A diamond compact in disc form was produced using the method described in British Patent Application No. 8508295. the compact consisted of a mass of diamond particles contain ing a substantial amount of direct diamond-to-diamond bonding to form a coherent skeletal mass and a second phase consisting essentially of silicon in the form of elemental silicon and silicon carbide. The compact was a thermally stable diamond compact as discussed hereinbefore.
A major flat surface of the diamond compact was degreased in alcohol.- A 100 micron thick foil of a silver based alloy was placed on the degreased and etched surface of the diamond compact. The silver-based alloy contained 62% silver, 19% copper, 14% palladium and 5% titanium, all percentages being by weight. A cemented tungsten carbide disc was placed on the alloy foil to produce an unbonded stacks load of 50 to 100 gms was applied to the unbonded stack. The loaded stack was then heated in a vacuum of better than 10-4 mbar to 11000C and maintained at this temperature for 10 minutes.The stack was allowed to cool to ambient temperature. It was found that an excellent bond between the thermally stable diamond compact and the cemented carbide disc was obtained.
A similar bonded compact was produced using the same procedure, save that a flashing (0,1 mm thick) of gold was applied to the compact surface after degreasing. Again excellent bonding between compact and cemented carbide disc was obtained.
EXAMPLE2 A thermally stable diamond compact as described in Example 1 had a major flat surface degreased in alcohol. To this degreased and etched surface was applied a 100 micron thick foil of the same silver/copper/palladiumltitanium alloy.
The compact and foil were heated to 1100or in a vacuum of better than 10-4 mbar and held at this temperature for 5 minutes. The compact was cooled to ambient temperature. The alloy was found to bond -strongly to the diamond compact producing a metallised surface.
The metallised compact was positioned on the top of a cemented tungsten carbide disc with the metallised surface face down. Between the metallised surface and the cemented carbide disc was placed a 100 micron thick disc of Nicuman - 36 alloy (56Cu - 36Mn - 2Ni - 31n - 3Sn) having a melting range of 771 to 825 C. A load of about 50 to 100 gms was applied to the compact/carbide unbonded stack.
The stack was heated to 1000"C in a vacuum of better than 10-4 mbar and held at this temperature for 10 minutes. The stack was allowed to cool to ambient temperature.
It was found that the diamond compact was strongly bonded to the cemented carbide disc.
EXAMPLE 3 A thermally stable diamond compact as described in Example 1 was fragmented into a plurality of cubes. The cubes were degreased. in alcohol. The clean surfaces of the cubes then had applied to them a flashing, approximately 0,1 microns in thickness, of gold using standard sputtercoating techniques.
All but one surface of each cube was then wrapped in a foil of an alloy as described in Example 1. The wrapped cubes were heated to a temperature of 11000C in a vacuum of 10-4 mbar. This caused the alloy to melt and bond firmly to each cube. the gold flashing assisted in wetting the surfaces of the cubes and assisting in the bonding of the alloy to these surfaces. The alloy was found to be -very firmly bonded to the cubes exhibiting a shear strength in excess of 15kgmm-2.

Claims (9)

1. A diamond compact comprising a polycrystalline mass of diamond particles present in an amount of at least 70 percent by volume bonded into a hard conglomerate and being able to withstand a temperature of 1200or in a vacuum without any significant structural degradation of the compact occurring, the compact having bonded to a surface thereof an alloy layer, the alloy containing at least 40 percent by weight of silver or gold or a combination thereof and 1 to 10 percent by weight of an active metal selected from the group of tungsten, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum and having a liquids temperature above 700 C.
2. A diamond compact according to claim 1 wherein the alloy contains 40 to 70 percent by weight of silver or gold or a combination thereof.
3. A diamond compact according to claim 1 or claim 2 wherein the alloy contains silver, copper, palladium and titanium.
4. A diamond compact according to any one of the preceding claims wherein the alloy layer does not exceed 200 microns in thickness.
5. A diamond compact according to any one of the preceding claims wherein the alloy layer is bonded to at least 75 percent of the surface thereof.
6. A diamond compact according to claim 5 which has a cubic, triangular or hexagonal shape.
7. A diamond compact according to any one of claims 1 to 4 wherein the compact has the form of a disc or segment of a disc having a major flat surface on each of opposite sides thereof, at lease one of the major flat surfaces having the alloy layer bonded to it.
8. A diamond compact according to claim 7 wherein a cemented carbide support is bonded to a major flat surface thereof through the alloy layer.
9. A diamond compact according to claim 1 and substantially as herein described with reference to the illustrative examples.
GB08520183A 1984-08-13 1985-08-12 Thermally stable diamond compacts Expired GB2163144B (en)

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ZA846272 1984-08-13
GB08520183A GB2163144B (en) 1984-08-13 1985-08-12 Thermally stable diamond compacts

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GB8520183D0 GB8520183D0 (en) 1985-09-18
GB2163144A true GB2163144A (en) 1986-02-19
GB2163144B GB2163144B (en) 1988-12-07

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264643A2 (en) * 1986-10-17 1988-04-27 Degussa Aktiengesellschaft Method for coating surfaces with hard materials
US4850523A (en) * 1988-02-22 1989-07-25 General Electric Company Bonding of thermally stable abrasive compacts to carbide supports
EP0329954A2 (en) * 1988-02-22 1989-08-30 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication
FR2636621A1 (en) * 1988-09-21 1990-03-23 Ngk Spark Plug Co ASSEMBLY OF CERAMIC AND METAL, AS WELL AS ITS PROCESS FOR OBTAINING
EP0694510A3 (en) * 1994-07-29 1996-08-21 Saint Gobain Norton Ind Cerami Brazing of diamond film to tungsten carbide
EP0761623A2 (en) * 1995-08-31 1997-03-12 General Electric Company Diamond assembly
EP0931782A1 (en) * 1998-01-27 1999-07-28 De Beers Industrial Diamond Division (Proprietary) Limited Bonding a diamond compact to a cemented carbide substrate
US8672061B2 (en) 2008-01-09 2014-03-18 Smith International, Inc. Polycrystalline ultra-hard compact constructions
US8740048B2 (en) 2005-11-01 2014-06-03 Smith International, Inc. Thermally stable polycrystalline ultra-hard constructions
US9217296B2 (en) 2008-01-09 2015-12-22 Smith International, Inc. Polycrystalline ultra-hard constructions with multiple support members

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1588483A (en) * 1977-06-24 1981-04-23 De Beers Ind Diamond Abrasive compacts
EP0104063B1 (en) * 1982-09-16 1986-08-27 De Beers Industrial Diamond Division (Proprietary) Limited Abrasive bodies comprising boron nitride

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1588483A (en) * 1977-06-24 1981-04-23 De Beers Ind Diamond Abrasive compacts
EP0104063B1 (en) * 1982-09-16 1986-08-27 De Beers Industrial Diamond Division (Proprietary) Limited Abrasive bodies comprising boron nitride

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264643A3 (en) * 1986-10-17 1990-05-16 Degussa Aktiengesellschaft Method for coating surfaces with hard materials
EP0264643A2 (en) * 1986-10-17 1988-04-27 Degussa Aktiengesellschaft Method for coating surfaces with hard materials
US4850523A (en) * 1988-02-22 1989-07-25 General Electric Company Bonding of thermally stable abrasive compacts to carbide supports
EP0329954A2 (en) * 1988-02-22 1989-08-30 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication
US4899922A (en) * 1988-02-22 1990-02-13 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication
EP0329954A3 (en) * 1988-02-22 1991-04-10 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication
FR2636621A1 (en) * 1988-09-21 1990-03-23 Ngk Spark Plug Co ASSEMBLY OF CERAMIC AND METAL, AS WELL AS ITS PROCESS FOR OBTAINING
US5738698A (en) * 1994-07-29 1998-04-14 Saint Gobain/Norton Company Industrial Ceramics Corp. Brazing of diamond film to tungsten carbide
EP0694510A3 (en) * 1994-07-29 1996-08-21 Saint Gobain Norton Ind Cerami Brazing of diamond film to tungsten carbide
EP0761623A2 (en) * 1995-08-31 1997-03-12 General Electric Company Diamond assembly
EP0761623A3 (en) * 1995-08-31 1997-06-04 Gen Electric Diamond assembly
EP0931782A1 (en) * 1998-01-27 1999-07-28 De Beers Industrial Diamond Division (Proprietary) Limited Bonding a diamond compact to a cemented carbide substrate
US6213380B1 (en) 1998-01-27 2001-04-10 John Lloyd Collins Bonding a diamond compact to a cemented carbide substrate
US8740048B2 (en) 2005-11-01 2014-06-03 Smith International, Inc. Thermally stable polycrystalline ultra-hard constructions
US8672061B2 (en) 2008-01-09 2014-03-18 Smith International, Inc. Polycrystalline ultra-hard compact constructions
US9217296B2 (en) 2008-01-09 2015-12-22 Smith International, Inc. Polycrystalline ultra-hard constructions with multiple support members
US10364614B2 (en) 2008-01-09 2019-07-30 Smith International, Inc. Polycrystalline ultra-hard constructions with multiple support members

Also Published As

Publication number Publication date
GB8520183D0 (en) 1985-09-18
GB2163144B (en) 1988-12-07

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