US3069759A - Production of dispersion strengthened metals - Google Patents

Production of dispersion strengthened metals Download PDF

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US3069759A
US3069759A US24971A US2497160A US3069759A US 3069759 A US3069759 A US 3069759A US 24971 A US24971 A US 24971A US 2497160 A US2497160 A US 2497160A US 3069759 A US3069759 A US 3069759A
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copper
powder
particle size
matrix metal
alloys
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Nicholas J Grant
Klaus M Zwilsky
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof

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  • the present invention relates to dispersion strengthened metals and metal products, and in particular to wrought structural elements of copper group metals characterized by improved yield strength and improved resistance to creep combined with substantially high electrical and thermal conductivities.
  • Certain pure metals such as pure copper have certain valuable properties which make them attractive for many engineering applications.
  • the properties of major signiticance with respect to copper are electrical conductivity, thermal conductivity, resistance to corrosion, malleability and formability.
  • the addition of 1.5% silicon to substantially pure copper as a solid solution strengthener markedly reduces the thermal conductivity by about 85% and also reduces the electrical conductivity as referred to standard copper by about 88%, While increasing yield strength from about 8,000 p.s.i. to 15,000 p.s.i. (for a 1" round).
  • an addition of 3% Si also greatly reduces electrical conductivity by 93% and thermal con-' ductivity by about 90% while-increasing yield strength in the annealed condition for a one inch round to about 22,000 p.s.i.
  • Adding 5% aluminum to copper likewise adversely affects the conductivity properties by reducing electrical conductivity by about 82.5% and thermal conductivity by about 80%, while increasing yield strength in the annealed condition to about 20,000 to 25,000 p.s.i.
  • a further disadvantage of these copper alloys is their lack of high temperature stability at temperatures up to the melting point whereby their strength properties are adversely affected after prolonged heating.
  • heat exchangers in the form of tubing, fiat stock and, other shapes and as a material of construction for missiles where high strength copper of high thermal conductivity would be desirable as heat sinks in controlling the tem-.
  • dispersion strengthned metals or alloys with improved high temperature properties including resistance to softening at elevated temperatures.
  • Another object is to provide a wrought copper composition for use in the production of dispersion strengthened electrical or thermal conductive structural elements having improved strength properties.
  • a still further object is to provide a method for producing a copper composition or a structural element of copper characterized by the aforementioned improved properties.
  • FIG. 1 depicts hardness curves of several copper compositions within and outside the invention showing the elfect of annealing temperatures on the wrought mate. rial;
  • FIG. 2 shows graphically the effect of the ratio of matrix metal particle size to disperse phase particle size on the room temperature yield strength and the hour rupture life at 450 C. of the final wrought metal pro-' quizd from CuAl O compositions containing 5 and,
  • 10 vol. percent A1 0 FlG. 3 is a plot showing the affect of amount of dis perse phase on the room temperature yield strength and;
  • FIG. 4 is similar to FIG. 3 but differs in that it shows: the effect of the amount of disperse phase on the rupture stress of nickel.
  • the invention is applicable to the other copper group elements gold and silver, as well as to ductile metals generally, particularly those' metals having heat conductivities of atleast 0.2,based on.
  • the particle size of the matrix metal powder be correlated to that of the refractory hard phase or oxide in producing the desired com-position.
  • size of the disperse hard phase e.g. A1 0 should be smaller than the average particle size of the matrix metalto effect desired improvements in the final product by Working over .a ratio of size ranges in which the average size of the hard phase particles is 30 to 150 times smaller than that of the average' size of matrix metal powder and even as much as 30 to 250 times smaller.
  • the amount of hard phase particles employed to achieve optimum results ranges from about 3% to by volume, although improved results are obtainable over the range of about 3' to volume percent and even over the broader range of about 1 to 15% by volume.
  • the particle size of the disperse phase generally should not exceed 0.3 micron and more preferably should fall within the range of about 0.01 to 0.1 micron, e.g. 0.01 to 0.05 micron.
  • the broad range -as tothe ratio of average particle size of the matrix m'etalpowder to the disperse phase powder (30 t0 250) may be used with the broad or narrow ranges of the disperse phase composition, for example with either" l to 15volu1ne percent, 3 to l5 volume percent or 3 to 10 volume percent, etc.
  • the broad range -as tothe ratio of average particle size of the matrix m'etalpowder to the disperse phase powder (30 t0 250) may be used with the broad or narrow ranges of the disperse phase composition, for example with either" l to 15volu1ne percent, 3 to l5 volume percent or 3 to 10 volume percent, etc.
  • composition batches containing 1, 2.5, 3 5, 7.5 .and 10 volume percent of alumina were prepared by mixing a specified amount of a particular size copper powder with varying amounts of a particular size alumina powder.
  • Particularly good results were obtained, however, with a Waring Blendor operating at 15,000 rpm. for about 12, or 15 minutes and it was this latter method that was used in producing the various mixtures.
  • the blending was vgenerally followed by a hydrogen reduction treatmentat atemperature in the neighborhood of 260 C. or 300 C.
  • a preferred method comprised hydrostatically compacting the powder mixture by placing it in a rubber sleeve held in a perforated steel canister, the sleeve being closed at both ends Air was evacuated from the assembly. prior to pressing in order to prevent gas entrapment inside the compact.
  • hydrostatic pressing at about 35,000 p.s.i. (17.5 t.s.i.), a compact of considerable green strength was assured which enables the handling of the slug under ordinary operating conditions. 7 i
  • the slug was then removed from the bag and sintered under substantially non-oxidizing conditions, for example in'a reducing atmosphere of substantially pure hydrogen for about 1 hour at 500 C. followed by a further heating of 2 hours at about 950 C. Sintering may be avoided when the slug has high green strength but it is preferred the slug be sintered from 900 C. to 1000 C. As a result of the sintering, the slug had a shrinkage ranging from about 2% to 4% and yielded a sintered product having a -density of about of theoretical density.
  • the sintered product was enveloped in a sheath of copper, the space between the compact and the inner wall of the sheath being filled-with a spacing material, such as fine A1 0
  • the purpose of thersheath was to minimize oxidation during hot working, although subsequent tests indicated the sheath to be unnecessary where the sintered slug had a high. density.
  • the sheath was welded shut and thereafter hot extruded at a temperature of 760 C. to a final diameter ranging from about 0.3 to 0.375 inch, using an extrusion ratio of 21:1 in some instances and 29:1 in others. Extrusionratios for the sintered product may range fromabout 14 to about 29 to l, a ratio of 15 to 1 being a preferred minimum.
  • compositions employed in the test programs are given in Table 1 as, follows:
  • FIG. 1 compares the hardness of Cu Al O wrought alloys produced from minus 74 micron copper powder with alloys produced from one micron powder both of the alloys having the same .sizealumina powder, that is 0.018 mi-. cron, at 5% and 7.5% by volume, respectively.
  • alloys 5A and 6A (produced from minus 74 micron Cu) have. a lower base level of hardness than alloys 13 2rd 15 produced from one micron copper in accordance with the invention. Although the final alloys are the same compositionwise, nevertheless they exhibited different hardness levels, thus illustrating the importance of using finer copper particles having the correct size ratio to the alumina particles. It will be noted that both of the alloys within the invention (No. 13 and No. 15), and 7.5 volume percent Al O exhibited retained hardnesses after annealing at various temperatures of up to about 800 C.
  • alloy No. 13 at 450 C. 100 hour rupture life of alloy No. 13 at 450 C. was 5,000 p.s.i. higher than 5A.
  • alloy No. 7A containing 10 volume percent A1 0 is also markedly inferior to alloy No. 11 of the same composition, the former having been produced from coarse copper powder (minus 74 microns) and the latter from the much finer one micron copper powder. Note that both the yield strength and stress to rupture properties of No. 11 were more than doubled over No. 7A.
  • the alloys of the invention are markedly superior to pure copper. It is apparent from the foregoing that in order to achieve optimum results, the starting particle size of the matrix metal powder should not be coarse. As stated hereinbefore, the particle size should not exceed 20 microns and more preferably not exceed 5 microns.
  • the size ratio for the purposes of this invention should fall within the broad range of 30 to 250, generally within 30 to 150, and more preferably over the ratio of 50 to 100.
  • the importance of maintaining the correct size ratio will be appreciated reduces the conductivity values of copper to below 15% from Table 3 which follows: of the standard values.
  • Table 3 Concomitant with the improvement in hardness, improved strength properties at room temperature (yield Stress strength) and at elevated temperatures (stress to 100 hour v/o Size of o A1293 Y.S, for 100 rupture at 450 C.) were also obtained as will be ap- Alloy gfg 5mm) PM 3135 parent from Table 2 which compares the inferior results p.s.i. of alloys outside the invention, e.g. 1A to 10A, as well as pure copper, with alloys 11 to 15 provided by the ini8 $88 8% vention. 5 1 313 251000 31000 10 1 30.0 60,500 24,800 Table 2 10 5 150.0 59, 200 20. 000 5 1 55.5 48,400 18,000
  • FIG. 2 which illustrates the correlation 91mg 40 between strength properties and the starting matrix metal Pure opper 0 to oxide size ratio at 5 and 10 volume percent of disper- LO 801d, 1t Wlll.
  • particularly high peak properg 8 ties are obtainable within the size ratio range of 30 to 1 25460 4,000 2 250, particularly within the range of 50 to 100.
  • This pg 38,388 ggg g trend is indicated over the composition range of disperj 281300 121000 1 soid of about 1 to 15% and is indicated for other metal- 18.8 288 88g dispersoid systems, such as systems based on FeAl O 5 251000 81000 2 FeMgO, Cu--SiO Ni-A1 O and others.
  • ig-g ggggg giggg i Broadly speaking, we have observed that when the 1 481400 1 1 2 powder ratio is less than 30:1, for example, 1:1, heavy 33.383 288 short stringers of oxide obtain accompanied by little or no effective strengthening at elevated temperatures.
  • test bars employed in obtaining the room temperature yield strength and the rupture life data were machined from extruded rods and had a gauge section of 0.160 inch diameter and 1.0 inch long.
  • the threaded sections were either 20 or 34 -24.
  • the machined specimens were polished with emery paper following the machining operation. Where the specimens were used for obtaining rupture life data, each had a thermocouple wired at its center. Rupture life was obtained at various stresses at 450 C. from which the 100 rupture life was determined by interpolation for each alloy.
  • the oxide particles are so fine that they 001- lect extensively in the interstices between the metal particles and behave as a fluid on extrusion, whereby they are squeezed out and result in long stringers in the matrix. Because the particles tend to cluster together in the interstices, poor dispersion results in the extruded product and hence the desired properties are not obtained.
  • the compacts produced as aforementioned were then subjected to sintering in dry hydrogen for a minimum of 10 hours at 1525 F. After that they were each canned by insertion in a mild steel can and welded vacuum tight followed by extrusion at an elevated temperature. The extrusion ratio was about 16to 1'.
  • the alloys were then subjected to tensile tests at room and elevated temperatures and to long time stress rup ture testing. at 1200" F.
  • the results of th one tests are as follows:
  • R.T. (i6, 200 1, 200 13, 70 11,000 R.T. 68, S300 1, 200 16, 200 13, 800 ILT. 60, 900 l, 200 21, 300 18, 000 R.T. 104, 300 1, 200 26, 800 24, 000
  • the types of copper that can be employed in carrying out the invention include com--bital electrolytic, deoxidized copper (e.g. OFHC, oxygen free high conductivity copper), etc.
  • the invention is applicable to copper compositions of electrical and heat conductivities of at least 50% of the standard values for pure copper and preferably applicable to copper of at least 99.5% purity.
  • the. invention is applicable to the other copper group metals gold and silver and alloys based on Examples of such alloys are: 90% copper and 10% nickel, copper and 20% nickel; 70% copper and 30% nickel; 70% copper and- 30% gold; 65% copper, 30% gold and 5% nickel;
  • group metals nickel, iron and cobalt may also be dispersion strengthened.
  • platinum group alloys containing up to 50% rhodium; platinum-iridium alloys containing up to 30% iridium; platinum-nickel containng up to 6 or 10% nickel; platinum-palladium-ruthenium containing 77% to 10% platinum, 13% to 88% palladium, and 10% to 2% ruthenium; alloys of palladium-ruthenium containing up to 8% ruthenium; 60% palladium and 40% silver, and others.
  • refractory compound materials While alumina is preferred as the dispersoid, other types of refractory compound materials may be employed provided they are stable and insoluble in the ductile matrix metal, such as copper group metals (Cu, Ag, Au) or other metals, so as not to greatly adversely affect the electrical and thermal conductivities. Such materials should have melting points above 1500 C. and should not decompose during processing when mixed with copper or are not reduced by copper or wetted by copper oxide. Examples of such refractory materials in addition to Al O and SiO are ThO ZrO BeO, MgO, CeO TiO and carbides, borides, silicides and nitrides of certain of the refractory metals of groups IV, V and VI of the periodic table.
  • these materials may be employed over the same composition range indicated for A1203 and SiO With respect to the aforementioned type refractory oxides these may be defined for the purposes of this invention as those oxides having a melting point above 1500 C. and a negative free energy of formation at about 25 C. of at least about 90,000 calories per gram atom of oxygen and preferably at least about 110,000 calories per gram atom.
  • SiO has a negative free energy of formation at 25 C. of about 96,200, A1 of about 125,590, MgO of about 136,130, BeO of about 139,000, etc.
  • the refractory oxides be used in that form which is crystallographically stable at elevated temperatures, and, if not, to use process ing temperatures at which transformation does not occur.
  • gamma alumina tends to transform to the alpha at temperatures above 850 C., where large amounts of fine alumina is present, e.g. 10 volume percent of 0.02 micron size, agglomeration is apt to occur with a consequent falling off in physical properties. This can be avoided by using a larger particle size, e.g. 0.05 micron, and lower amounts of alumina, e.g. 5 to by volume. Or straight alpha alumina can be used from the start.
  • a given amount of the matrix metal powder and the dispersoid is blended uniformly together and the mixture then compacted at pressures of about 10 t.s.i. to t.s.i. (e.g. hydrostatically) to produce a slug of adequate green strength of density at least about 60% to 80% of true density.
  • the slug is sintered (depending upon the green strength the slug may or may not be sintered) under substantially non-oxidizing conditions (e.g. a reducing atmosphere of dry hydrogen, or in a vacuum, or in an inert atmosphere) at an elevated temperature below the melting point of the matrix metal, for example, in the case of copper at a temperature of at least about 500 C.
  • the sintering time and temperature should be sufficient to produce a sintered product of density at least 90%, for example 2 to 4 hours at 900 to 1000 C. for copper and higher temperatures for matrix metals of still higher melting points.
  • the sintered product is then subjected to hot working, preferably extrusion, by encasing the product in a ductile metal sheath such as copper where the matrix metal is copper, and the whole reduced in size sufficient to remove substantially all of the voids.
  • a ductile metal sheath such as copper where the matrix metal is copper, and the whole reduced in size sufficient to remove substantially all of the voids.
  • the sintered product prior to extrusion has a high density, e.g. about it) it may not be necessary to encase it in a sheath and may be extruded directly.
  • the extrusion ratio should be at least 15 to 1 and preferably should range from about 20 to 1 to 25 to 1 with extrusion pressures ranging from about 50 tons/sq. inch to tons/ sq. inch.
  • the initial hot working may comprise the forming of wire bar sizes from which wire of various sizes can thereafter be produced by other conventional working methods.
  • tube stock can be produced by extrusion for subsequent reduction to tube sizes for specific purposes such as heat exchanger elements, hollow cable stock, etc.
  • various other structural shapes may be extruded, such as angles, flats, square bar stock, and the like.
  • the product of the invention lends itself to any conventional means of production in common use for copper group metals.
  • Examples of other types of structural elements contemplated by the invention include such heat conductive elements as de-icers for air craft for use under conditions where resistance to creep at relatively high temperatures is important; supporting elements in electronic devices where good heat conductivity coupled with high temperature strength is an essential requirement and as electrical contacts where hardness and resistance to wear coupled with high electrical conductivity is important.
  • the invention is particularly applicable to the production of hard silver contacts and other wear resistant contact members.
  • One of the advantages of the invention is that the oxidation of pure matrix metals, such as copper, is improved.
  • the reason for this is that the fine oxide particles in the matrix metal appear to act as anchor points to hold the metal oxide on the surface and thereby prevent flaking which normally occurs on such metals as pure copper.
  • the invention is particularly applicable to the strengthening of metals in which it is desirable to maintain good or adequate heat and electrical conductivity, for example to such metals as those having thermal conductivities of at least 20% that of copper and resistivities not exceeding about 8 microhm-cm.
  • a method of producing a dispersion strengthened wrought metal product characterized by improved physical properties at room and elevated temperatures which comprises mixing a ductile matrix metal powder of average particle size ranging up to about 20 microns with about 1 to 15 volume percent of a refractory oxide powder whose negative free energy of the oxide at about 25 C. is at least about 90,000 calories per grame atom of oxygen and whose average particle size does not exceed about 0.3 micron and ranges from about 30 to 250 times smaller than the average particle size of said matrix metal powder, and fabricating said mixture into a dense wrought metal structure.
  • the average size of matrix metal powder ranges up to about 10 microns
  • the amount of refractory oxide powder ranges from about 3 to 15 volume percent and has an average particle size which ranges from about 30 to times smaller than the average particle size of the matrix metal powder.
  • the. matrix metal is selected from the group consisting ofcopper, silver, gold and copper-base, silver-base and gold-base alloys.
  • the matrix metal is selected from the group consisting of iron, nickel, cobalt and iron-base, nickel-base and cobalt-base alloys.
  • the average particle size of the matrix metal ranges up to about 5 microns, and wherein the amount of refractory oxide powder ranges from about 3 to 15 volume percent and has an average particle size 30 to 150 times smaller than the average particle size of the matrix metal powder.
  • the matrix metal is selected from the group consisting of Pt, Ir, Os, Pd, Rh and Ru and alloys based on these metals.
  • the average particle size of the matrix metal ranges up to about microns
  • the amount of refractory oxide powder ranges from about 3 to volume percent and has an average size 30to 150 timessmaller than the average particle size of the matrix metal powder.
  • a metallurgical powder composition mixture for use in the powder metallurgical production of dispersion strengthened metals by the fabrication of said composition into a dense wrought structure comprising separate particles of" aductile matrix metal powder of average I particle size ranging up to about 'micronsha'ving substantially uniformly 'mixed'j therewith separateparticles of about 1 toi1'5 volumepercent'of a refractory oxide'pow der whose ne'gative'free' energy of the oxid'e'at' about C. is at least about 90,000 calories per gram atom of oxygen. and whose average particle size does not exceed about 0.3 micronsand ranges from about to 250 times smaller than the average particle size of said matrix metal powder.
  • the metallurgical'powder composition of claim 12' wherein the matrix metal powder has an average particle size ranging up to about Smicrons and wherein the refractory oxide mixed therewith ranges from about 3 to 10 volume percent and has. an average particle size of about 0.01 to 0.1 micron, said average particle size being about 30 to. 150 times smaller than the average particle size of said .matrix metal powder.

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Cited By (20)

* Cited by examiner, † Cited by third party
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US3176386A (en) * 1961-10-26 1965-04-06 Grant Dispersion strengthening of metals
US3180742A (en) * 1961-06-27 1965-04-27 Dwight G Bennett Elevated temperature resistant ceramic structural adhesives
US3221853A (en) * 1962-08-29 1965-12-07 Raybestos Manhattan Inc Friction devices
DE1533236B1 (de) * 1965-02-09 1970-04-30 English Electric Co Ltd Verfahren zur Herstellung von dispersionsgehaerteten Werkstoffen
US3922180A (en) * 1970-04-01 1975-11-25 Bell Telephone Labor Inc Method for oxidation-hardening metal alloy compositions, and compositions and structures therefrom
US4038216A (en) * 1974-06-24 1977-07-26 Massachusetts Institute Of Technology Material and method of making secondary-electron emitters
US4312915A (en) * 1978-01-30 1982-01-26 Massachusetts Institute Of Technology Cermet film selective black absorber
US4374086A (en) * 1981-04-27 1983-02-15 The United States Of America As Represented By The Secretary Of The Navy Gold based material for electrical contact materials
US4442166A (en) * 1979-11-15 1984-04-10 Massachusetts Institute Of Technology Cermet film selective-black absorber
US4594101A (en) * 1983-05-10 1986-06-10 Toyota Jidosha Kabushiki Kaisha Fine composite powder material and method and apparatus for making the same
US5004498A (en) * 1988-10-13 1991-04-02 Kabushiki Kaisha Toshiba Dispersion strengthened copper alloy and a method of manufacturing the same
US5624475A (en) * 1994-12-02 1997-04-29 Scm Metal Products, Inc. Copper based neutron absorbing material for nuclear waste containers and method for making same
US6432871B1 (en) * 1998-10-17 2002-08-13 Xcellsis Gmbh Process for manufacturing a catalyst body for generating hydrogen and a catalyst body for generating hydrogen
WO2006110179A2 (en) 2004-10-27 2006-10-19 The University Of Cincinnati Particle reinforced noble metal matrix composite and method of making same
CN102796912A (zh) * 2012-08-24 2012-11-28 李艳 一种Al2O3弥散强化铜合金棒材的制备方法
CN105506329A (zh) * 2015-12-09 2016-04-20 中南大学 一种高Al2O3浓度Cu-Al2O3纳米弥散强化合金的制备方法
CN106834870A (zh) * 2017-02-15 2017-06-13 江苏省海洋资源开发研究院(连云港) Ni‑Al2O3复合材料近净成形方法
CN114193024A (zh) * 2021-11-16 2022-03-18 西安理工大学 增强铜基药芯焊丝及低碳钢表面强化的方法
CN114799155A (zh) * 2022-03-30 2022-07-29 河南科技大学 陶瓷颗粒强化难熔高熵合金的制备方法
US20230241677A1 (en) * 2006-10-27 2023-08-03 Tecnium, Llc Atomized picoscale composition aluminum alloy and method thereof

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DE3584165D1 (de) * 1985-09-11 1991-10-24 Degussa Werkstoff fuer verblendbaren zahnersatz.

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US2823988A (en) * 1955-09-15 1958-02-18 Sintercast Corp America Composite matter
US2840891A (en) * 1955-01-04 1958-07-01 John S Nachtman High temperature structural material and method of producing same
US2972529A (en) * 1958-05-12 1961-02-21 Du Pont Metal oxide-metal composition
US3019103A (en) * 1957-11-04 1962-01-30 Du Pont Process for producing sintered metals with dispersed oxides

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Publication number Priority date Publication date Assignee Title
US2840891A (en) * 1955-01-04 1958-07-01 John S Nachtman High temperature structural material and method of producing same
US2823988A (en) * 1955-09-15 1958-02-18 Sintercast Corp America Composite matter
US3019103A (en) * 1957-11-04 1962-01-30 Du Pont Process for producing sintered metals with dispersed oxides
US2972529A (en) * 1958-05-12 1961-02-21 Du Pont Metal oxide-metal composition

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180742A (en) * 1961-06-27 1965-04-27 Dwight G Bennett Elevated temperature resistant ceramic structural adhesives
US3176386A (en) * 1961-10-26 1965-04-06 Grant Dispersion strengthening of metals
US3221853A (en) * 1962-08-29 1965-12-07 Raybestos Manhattan Inc Friction devices
DE1533236B1 (de) * 1965-02-09 1970-04-30 English Electric Co Ltd Verfahren zur Herstellung von dispersionsgehaerteten Werkstoffen
US3922180A (en) * 1970-04-01 1975-11-25 Bell Telephone Labor Inc Method for oxidation-hardening metal alloy compositions, and compositions and structures therefrom
US4038216A (en) * 1974-06-24 1977-07-26 Massachusetts Institute Of Technology Material and method of making secondary-electron emitters
US4312915A (en) * 1978-01-30 1982-01-26 Massachusetts Institute Of Technology Cermet film selective black absorber
US4442166A (en) * 1979-11-15 1984-04-10 Massachusetts Institute Of Technology Cermet film selective-black absorber
US4374086A (en) * 1981-04-27 1983-02-15 The United States Of America As Represented By The Secretary Of The Navy Gold based material for electrical contact materials
US4594101A (en) * 1983-05-10 1986-06-10 Toyota Jidosha Kabushiki Kaisha Fine composite powder material and method and apparatus for making the same
US5004498A (en) * 1988-10-13 1991-04-02 Kabushiki Kaisha Toshiba Dispersion strengthened copper alloy and a method of manufacturing the same
US5624475A (en) * 1994-12-02 1997-04-29 Scm Metal Products, Inc. Copper based neutron absorbing material for nuclear waste containers and method for making same
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CN114799155A (zh) * 2022-03-30 2022-07-29 河南科技大学 陶瓷颗粒强化难熔高熵合金的制备方法
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