US2897584A - Gold plated electrical contact and similar elements - Google Patents
Gold plated electrical contact and similar elements Download PDFInfo
- Publication number
- US2897584A US2897584A US660955A US66095557A US2897584A US 2897584 A US2897584 A US 2897584A US 660955 A US660955 A US 660955A US 66095557 A US66095557 A US 66095557A US 2897584 A US2897584 A US 2897584A
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- United States
- Prior art keywords
- layer
- gold
- silver
- electrical contact
- similar elements
- Prior art date
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- Expired - Lifetime
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- 229910052737 gold Inorganic materials 0.000 title claims description 29
- 239000010931 gold Substances 0.000 title claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 28
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 230000004888 barrier function Effects 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 238000005494 tarnishing Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
Definitions
- This invention relates to the improvement of gold plated products where the gold is plated over silver.
- This tarnishing is not due to porosity of the gold layer since it does not appear in small spots or specks ⁇ although with respect to some ⁇ gold deposits, the porosity of the deposit may be a contributing factor.
- One method that has been used heretofore to overcome this defect is to increase the thickness of the gold deposit.
- One phase of this invention is based on the discovery that such surface tarnish in the gold plated products is due to the diffusion of silver through the gold layer.
- barrier metal between the silver and gold layers.
- the metals which may be employed as barrier metals are platinum, ruthenium, rhodium or palladium.
- a very thin layer of the barrier metal is suicient, for example, a deposit of 0000025 to 000005 in thickness is very satisfactory. This thickness of palladium or other platinum metal does not interfere with the electrical properties. With such a layer of barrier metal on the silver deposit the thickness of gold may be safely reduced to 000010 without sacrificing the protective value thereof and without making the product susceptible to tarnishing.
- Fig. 1 shows a typical electrical contact which may be advantageously plated according to the present invention.
- Fig. 2 is an enlarged cross sectional view of the surface region of a product similar to that of Fig. 1 made according to the present invention.
- the shape of the electrical plug element of Fig. l is not a part of the invention as the invention is applicable to any such element where corrosion is to be prevented and where good electrical Contact with a cooperating element such as a jack is desirable.
- the plug element 10 has a plug end portion and a hollow portion 12 at the opposite end wherein an electrical conductor may be soldered.
- the surface layer 23 of said element as shown in Fig. 2 is of gold. Beneath the layer of gold is the barrier layer 22 of palladium. A layer of platinum, rhodium, or ruthenium may be substituted for the palladium layer 22. Beneath the palladium layer 22 is the silver layer 21.
- the basis metal 20 may be brass, copper, etc.
- the following example further illustrates how the product is manufactured.
- Example A copper plug similar to that shown in Fig. 1 is provided.
- This plug is rst plated with silver to a thickness of about .0002, from a silver electrolyte solution containing, for example:
- a basis metal As an article of manufacture which is resistant to corrosion and to tarnishing by diffusion, a basis metal, a layer of silver deposited on said basis metal, a layer of gold about 00001 to 00002 thick on the outside surface thereof and a layer of about 0000025" to 000005" in thickness of a barrier metal selected from the group consisting of platinum, ruthenium, rhodium and palladiurn between the silver layer and the gold layer, said barrier metal layer being bonded to said silver at one side and to the gold layer at the other side thereof.
- an electrical contact element which is resistant to corrosion and to tarnishing by diffusion, a basis metal, a layer of silver deposited on said basis metal, a layer of gold about 00001" to 00002" thick on the outside surface thereof and a layer of about 0000025 to 000005" in thickness of palladitun between the silver layer and the gold layer, said palladium layer being bonded to said silver at one side and to the gold layer at the other side thereof.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
Aug- 4, 1959 K. scHuMPEL-r 2,897,584-
` GOLD PLATED ELECTRICAL CONTACT ND SIMILAR ELEMENTS Filed may 22. 1957 1N VENTOR. A64 n SUN/@0&7
WIM Y@ United States Patent GOLD PLATED ELECTRICAL CONTACT AND SllVIILAR ELEMENTS Karl Schumpelt, Union, NJ., assignor to Sel-Rex Corporation, Belleville, NJ., a corporation of New Jersey Application May 22, 1957, Serial No. 660,955
2 Claims. (Cl. 29-199) This invention relates to the improvement of gold plated products where the gold is plated over silver.
It is customary, for example, in the manufacture of slip ring assemblies and many electrical contacts to specify that a layer of gold, about 000010 to 000020" thick for example, be plated over a silver deposit (about .0002" thick for example). The gold layer is noncorrosive, attractive, is not fouled by electrical discharges, etc., and thus provides the best surface layer for such products. The silver layer beneath the gold layer cooperates with the latter to provide a double layer of noble metal of sutiicient thickness to prevent corrosion of the basis metal. After a certain time, however, such products discolor or tarnish showing, for example, large discolored blotches. This tarnishing is not due to porosity of the gold layer since it does not appear in small spots or specks` although with respect to some `gold deposits, the porosity of the deposit may be a contributing factor. One method that has been used heretofore to overcome this defect is to increase the thickness of the gold deposit.
One phase of this invention is based on the discovery that such surface tarnish in the gold plated products is due to the diffusion of silver through the gold layer.
Another phase of the invention is based on the discovery that the tarnish may be prevented by providing a very thin layer of barrier metal between the silver and gold layers. The metals which may be employed as barrier metals are platinum, ruthenium, rhodium or palladium. A very thin layer of the barrier metal is suicient, for example, a deposit of 0000025 to 000005 in thickness is very satisfactory. This thickness of palladium or other platinum metal does not interfere with the electrical properties. With such a layer of barrier metal on the silver deposit the thickness of gold may be safely reduced to 000010 without sacrificing the protective value thereof and without making the product susceptible to tarnishing.
In the drawing:
Fig. 1 shows a typical electrical contact which may be advantageously plated according to the present invention.
Fig. 2 is an enlarged cross sectional view of the surface region of a product similar to that of Fig. 1 made according to the present invention.
The shape of the electrical plug element of Fig. l is not a part of the invention as the invention is applicable to any such element where corrosion is to be prevented and where good electrical Contact with a cooperating element such as a jack is desirable. The plug element 10, however, has a plug end portion and a hollow portion 12 at the opposite end wherein an electrical conductor may be soldered. The surface layer 23 of said element as shown in Fig. 2 is of gold. Beneath the layer of gold is the barrier layer 22 of palladium. A layer of platinum, rhodium, or ruthenium may be substituted for the palladium layer 22. Beneath the palladium layer 22 is the silver layer 21. The basis metal 20 may be brass, copper, etc.
The following example further illustrates how the product is manufactured.
Example A copper plug similar to that shown in Fig. 1 is provided. This plug is rst plated with silver to a thickness of about .0002, from a silver electrolyte solution containing, for example:
Silver (as metal) g./liter 25-33 Free potassium cyanide do- 30-45 Potassium carbonate do 30-90 The resultant product is rinsed and then plated with a palladium to a thickness of about .0000025 to about .000005 from a palladium solution of the Pilet type (U.S. Patent 330,149) containing, for example,
Palladous chloride, PdCl2.2H-2O g./liter 3.7 Di-sodium` phosphate, Na2HPO4 do 100 Di ammonium phosphate,
2HPO4.12H2O ....d0 Boric acid do 2.5
or 4any other workable palladium plating bath that produces commercially acceptable deposits. Thereafter, the product is rinsed and a layer of gold 000010 to 000020" is deposited thereon. A satisfactory gold deposit is obtained from the cyanide gold baths such as disclosed in Modern Electroplating, The Electrochemical Society, 1942, pages 199-209. Such a bath, for example, contains the following ingredients:
Metallic gold (as cyanide) -..g/liter-- 4.2 KCN 0---- 15 Accelerated tarnishing tests show the resultant product to be resistant to tarnishing, whereas the same tests on commercially plated products, i.e., without palladium or other barrier metal layer, resulted in tarnishing of the parts.
Although the -gold formulation directly above gives good results, equivalent and better are obtained from other gold formulations, some of which are proprietary preparations.
The features and principles underlying the invention described above in connection with specific exempliiications will suggest to those skilled in the art many other modifications thereof. It is accordingly desired that the appended claims shall not be limited to any specific feature or details thereof.
I claim:
1. As an article of manufacture which is resistant to corrosion and to tarnishing by diffusion, a basis metal, a layer of silver deposited on said basis metal, a layer of gold about 00001 to 00002 thick on the outside surface thereof and a layer of about 0000025" to 000005" in thickness of a barrier metal selected from the group consisting of platinum, ruthenium, rhodium and palladiurn between the silver layer and the gold layer, said barrier metal layer being bonded to said silver at one side and to the gold layer at the other side thereof.
2. As an electrical contact element which is resistant to corrosion and to tarnishing by diffusion, a basis metal, a layer of silver deposited on said basis metal, a layer of gold about 00001" to 00002" thick on the outside surface thereof and a layer of about 0000025 to 000005" in thickness of palladitun between the silver layer and the gold layer, said palladium layer being bonded to said silver at one side and to the gold layer at the other side thereof.
References Cited in the le of this patent UNITED STATES PATENTS Jackson Dec. 10, 1929 Miller Jan. 23, 1951
Claims (1)
1. AS AN ARTICLE OF MANUFACTURE WHICH IS RESISTANT TO CORROSION AND TO TARNISHING BY DIFFUSION, A BASIS METAL, A LAYER OF SILVER DEPOSITED ON SAID BASIS METAL, A LAYER OF GOLD ABOUT .00001" TO .00002" THICK ON THE OUTSIDE SURFACE THEREOF AND A LAYER OF ABOUT .0000025" TO .000005" IN THICKNESS OF A BARRIER METAL SELECTED FROM THE GROUP CONSISTING OF PLATINUM, RUTHENIUM, RHODIUM AND PALLADIUM BETWEEN THE SILVER LAYER AND THE GOLD LAYER, SAID BARRIER METAL LAYER BEING BONDED TO SAID SILVER AT ONE SIDE AND TO THE GOLD LAYER AT THE OTHER SIDE THEREOF.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US660955A US2897584A (en) | 1957-05-22 | 1957-05-22 | Gold plated electrical contact and similar elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US660955A US2897584A (en) | 1957-05-22 | 1957-05-22 | Gold plated electrical contact and similar elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2897584A true US2897584A (en) | 1959-08-04 |
Family
ID=24651602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US660955A Expired - Lifetime US2897584A (en) | 1957-05-22 | 1957-05-22 | Gold plated electrical contact and similar elements |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2897584A (en) |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3162512A (en) * | 1961-03-21 | 1964-12-22 | Engelhard Ind Inc | Immersion plating with noble metals and the product thereof |
| US3188589A (en) * | 1961-03-20 | 1965-06-08 | Superior Electric Co | Electrical commutating surface |
| US3199189A (en) * | 1962-03-29 | 1965-08-10 | Alloys Unltd Inc | Gold alloy cladding |
| US3217404A (en) * | 1962-04-26 | 1965-11-16 | Int Nickel Co | Platinum metal fabrication |
| US3221393A (en) * | 1961-09-05 | 1965-12-07 | Victory Engineering Corp | Method of making bead type thermistors |
| US3293064A (en) * | 1962-07-23 | 1966-12-20 | Ling Temco Vought Inc | Method of making heat resistant article |
| US3432278A (en) * | 1965-07-16 | 1969-03-11 | Owens Illinois Inc | Composite metal article with a platinum coating |
| US3466158A (en) * | 1966-01-10 | 1969-09-09 | Int Nickel Co | Compound precious metal article having layer containing iridium or ruthenium |
| US3629776A (en) * | 1967-10-24 | 1971-12-21 | Nippon Kogaku Kk | Sliding thin film resistance for measuring instruments |
| US3671702A (en) * | 1971-03-15 | 1972-06-20 | Stromberg Carlson Corp | An electrical contact structure for a switch reed comprising gold and palladium layers |
| US3780247A (en) * | 1972-05-18 | 1973-12-18 | Bunker Ramo | Contact element having noble wear area |
| US3797108A (en) * | 1972-01-10 | 1974-03-19 | Bunker Ramo | Method for fabricating selectively plated electrical contacts |
| FR2468662A1 (en) * | 1979-11-05 | 1981-05-08 | Western Electric Co | METHOD OF ELECTRICALLY DEPOSITING PLATINUM SILVER AND METAL ALLOYS AND PRODUCT OBTAINED THEREBY |
| US4835067A (en) * | 1988-01-21 | 1989-05-30 | Electro Alloys Corp. | Corrosion resistant electroplating process, and plated article |
| US5045410A (en) * | 1985-12-13 | 1991-09-03 | Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung | Low phosphorus containing band-shaped and/or filamentary material |
| US5129143A (en) * | 1982-11-29 | 1992-07-14 | Amp Incorporated | Durable plating for electrical contact terminals |
| US5139890A (en) * | 1991-09-30 | 1992-08-18 | Olin Corporation | Silver-coated electrical components |
| WO1993006993A1 (en) * | 1991-09-30 | 1993-04-15 | Olin Corporation | Silver alloys for electrical connector coatings |
| US5595514A (en) * | 1994-07-19 | 1997-01-21 | Santa Barbara Research Center | Feedthrough pin and process for its preparation, and electrical feedthrough made therewith |
| US5709565A (en) * | 1995-03-17 | 1998-01-20 | Sumitomo Wiring Systems, Ltd. | Press-connecting terminal |
| WO1998017467A1 (en) * | 1996-10-18 | 1998-04-30 | Avon Products, Inc. | Multiple layered article having a bright copper layer |
| WO2007056575A3 (en) * | 2005-11-09 | 2007-11-22 | Hill Rom Services Inc | Pneumatic valve assembly for a patient support |
| US20170149157A1 (en) * | 2012-10-04 | 2017-05-25 | Fci Americas Technology Llc | Electrical contact including corrosion-resistant coating |
| US9698511B2 (en) | 2012-03-21 | 2017-07-04 | Enplas Corporation | Electric contact and socket for electrical part |
| US9770089B2 (en) | 2014-01-10 | 2017-09-26 | Fiskars Brands, Inc. | Variable mounting system for a knife sheath |
| CN108698374A (en) * | 2016-02-16 | 2018-10-23 | 思力柯集团 | Product including not nickeliferous coating and method |
| DE102023135976A1 (en) * | 2023-12-20 | 2025-06-26 | Diehl Metal Applications Gmbh | Process for manufacturing a component |
| US12351936B2 (en) | 2022-05-19 | 2025-07-08 | Te Connectivity Solutions Gmbh | Layered plating stack for improved contact resistance in corrosive environments |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US1738828A (en) * | 1925-03-02 | 1929-12-10 | Jackson Arthur Hews | Low-resistance permanent wire |
| US2539096A (en) * | 1949-09-19 | 1951-01-23 | Eitel Mccullough Inc | Electron tube and grid for the same |
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3188589A (en) * | 1961-03-20 | 1965-06-08 | Superior Electric Co | Electrical commutating surface |
| US3162512A (en) * | 1961-03-21 | 1964-12-22 | Engelhard Ind Inc | Immersion plating with noble metals and the product thereof |
| US3221393A (en) * | 1961-09-05 | 1965-12-07 | Victory Engineering Corp | Method of making bead type thermistors |
| US3199189A (en) * | 1962-03-29 | 1965-08-10 | Alloys Unltd Inc | Gold alloy cladding |
| US3217404A (en) * | 1962-04-26 | 1965-11-16 | Int Nickel Co | Platinum metal fabrication |
| US3293064A (en) * | 1962-07-23 | 1966-12-20 | Ling Temco Vought Inc | Method of making heat resistant article |
| US3432278A (en) * | 1965-07-16 | 1969-03-11 | Owens Illinois Inc | Composite metal article with a platinum coating |
| US3466158A (en) * | 1966-01-10 | 1969-09-09 | Int Nickel Co | Compound precious metal article having layer containing iridium or ruthenium |
| US3629776A (en) * | 1967-10-24 | 1971-12-21 | Nippon Kogaku Kk | Sliding thin film resistance for measuring instruments |
| US3671702A (en) * | 1971-03-15 | 1972-06-20 | Stromberg Carlson Corp | An electrical contact structure for a switch reed comprising gold and palladium layers |
| US3797108A (en) * | 1972-01-10 | 1974-03-19 | Bunker Ramo | Method for fabricating selectively plated electrical contacts |
| US3780247A (en) * | 1972-05-18 | 1973-12-18 | Bunker Ramo | Contact element having noble wear area |
| FR2468662A1 (en) * | 1979-11-05 | 1981-05-08 | Western Electric Co | METHOD OF ELECTRICALLY DEPOSITING PLATINUM SILVER AND METAL ALLOYS AND PRODUCT OBTAINED THEREBY |
| US5129143A (en) * | 1982-11-29 | 1992-07-14 | Amp Incorporated | Durable plating for electrical contact terminals |
| US5045410A (en) * | 1985-12-13 | 1991-09-03 | Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung | Low phosphorus containing band-shaped and/or filamentary material |
| US4835067A (en) * | 1988-01-21 | 1989-05-30 | Electro Alloys Corp. | Corrosion resistant electroplating process, and plated article |
| US5139890A (en) * | 1991-09-30 | 1992-08-18 | Olin Corporation | Silver-coated electrical components |
| WO1993006993A1 (en) * | 1991-09-30 | 1993-04-15 | Olin Corporation | Silver alloys for electrical connector coatings |
| US5595514A (en) * | 1994-07-19 | 1997-01-21 | Santa Barbara Research Center | Feedthrough pin and process for its preparation, and electrical feedthrough made therewith |
| US5709565A (en) * | 1995-03-17 | 1998-01-20 | Sumitomo Wiring Systems, Ltd. | Press-connecting terminal |
| WO1998017467A1 (en) * | 1996-10-18 | 1998-04-30 | Avon Products, Inc. | Multiple layered article having a bright copper layer |
| US5792565A (en) * | 1996-10-18 | 1998-08-11 | Avon Products, Inc. | Multiple layered article having a bright copper layer |
| WO2007056575A3 (en) * | 2005-11-09 | 2007-11-22 | Hill Rom Services Inc | Pneumatic valve assembly for a patient support |
| US20080282471A1 (en) * | 2005-11-09 | 2008-11-20 | Chambers Kenith W | Pneumatic Valve Assembly for a Patient Support |
| US8171588B2 (en) | 2005-11-09 | 2012-05-08 | Hill-Rom Services, Inc. | Pneumatic valve assembly for a patient support |
| US9698511B2 (en) | 2012-03-21 | 2017-07-04 | Enplas Corporation | Electric contact and socket for electrical part |
| US20170149157A1 (en) * | 2012-10-04 | 2017-05-25 | Fci Americas Technology Llc | Electrical contact including corrosion-resistant coating |
| US10056707B2 (en) * | 2012-10-04 | 2018-08-21 | Fci Usa Llc | Electrical contact including corrosion-resistant coating |
| US9770089B2 (en) | 2014-01-10 | 2017-09-26 | Fiskars Brands, Inc. | Variable mounting system for a knife sheath |
| CN108698374A (en) * | 2016-02-16 | 2018-10-23 | 思力柯集团 | Product including not nickeliferous coating and method |
| EP3416825A4 (en) * | 2016-02-16 | 2019-11-06 | Xtalic Corporation | Articles including nickel-free coating and methods |
| US12351936B2 (en) | 2022-05-19 | 2025-07-08 | Te Connectivity Solutions Gmbh | Layered plating stack for improved contact resistance in corrosive environments |
| DE102023135976A1 (en) * | 2023-12-20 | 2025-06-26 | Diehl Metal Applications Gmbh | Process for manufacturing a component |
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Legal Events
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| AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
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| AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
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