US2730491A - Method of electroplating cobalt-nickel composition - Google Patents

Method of electroplating cobalt-nickel composition Download PDF

Info

Publication number
US2730491A
US2730491A US283652A US28365252A US2730491A US 2730491 A US2730491 A US 2730491A US 283652 A US283652 A US 283652A US 28365252 A US28365252 A US 28365252A US 2730491 A US2730491 A US 2730491A
Authority
US
United States
Prior art keywords
plating
nickel
cobalt
alternating current
per liter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US283652A
Other languages
English (en)
Inventor
Walter E Moline
Richard M Clinehens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR Voyix Corp
National Cash Register Co
Original Assignee
NCR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL101173D priority Critical patent/NL101173C/xx
Application filed by NCR Corp filed Critical NCR Corp
Priority to US283652A priority patent/US2730491A/en
Priority to GB7501/53A priority patent/GB733252A/en
Priority to FR1076019D priority patent/FR1076019A/fr
Priority to CH311229D priority patent/CH311229A/fr
Priority to DEN7075A priority patent/DE956903C/de
Application granted granted Critical
Publication of US2730491A publication Critical patent/US2730491A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating

Definitions

  • 204-943 for recording use, preferably is applied to of the selected metal base, as such tape is well adapted to be supported and moved upon drums or reels relative to a pick-up or recording station, although wire, sheet, disc-like or cylindrical base members may be so plated.
  • Brass may be used, but it is inferior because the novel plating process, unless preceded by a short direct current plating period, tends to pit the surface of the brass by removal of zinc therefrom and requires preplating with cobalt-nickel, copper or nickel to prevent pitting.
  • One lead of the alternating current source is connected directly to a other lead is connected to two half-wave rectifiers of opposite phase connected in parallel and containing circuit elements which cause them to be unbalanced as to output so that the average platingphase current density is less than times and more than one time the average deplating phase current density.
  • the current density during the plating phase may range from 100 to 1400 amperes per square foot and the current density during the deplating phase may range from 32 to 480 ainperes per square foot.
  • the plating current may be obtained in any other manner than that specified as preferred, as, for instance, by super-imposing alternating current on direct current.
  • a superior grade of Phosphor-bronze suitable for making the base tape or other base forms is one having, in percentage, by Weight,
  • the percentages given for the Phosphor-bronze ingredients may'vary considerably without impairing the results obtained by the novel plating process.
  • the Phosphor-bronze of the type specified above as a preferred example is suitable for flexing about the drums or reels of supporting and driving members of a magnetic signal recording or reproducing machine.
  • addition agents include, first, either ortho-toluene sulfonamide or paratoluene sulfonamide or a mixture of them, and, second, boric acid.
  • a wetting agent such as sodium lauryl sulfate, is added in small quantity to the electrolyte.
  • Another object of the invention is to provide such a process in which the superior electroplating is brought about by the addition of certain chemical compounds to ordinary cobalt niekel plating solutions.
  • the invention includes certain novel steps and ingredients, a preferred embodiment of the process being hereinafter described with reference to a drawing which accompanies and forms a part of this specification.
  • Fig. 1 is a reproduction of the hysteresis loop traced by the beam of a cathode ray tube used to examine the magnetic characteristics of a Phosphor-bronze tape .001 of an inch in thickness and electro-plated with cobaltnickel composition to a thickness of .0004 of an inch on each side, without the use of the addition agents used in the novel process of this invention.
  • Fig. 2 is a reproduction of the hysteresis loop traced by the beam of a cathode ray tube used to examine, under the same circumstance as the tape of Fig. 1, the magnetic characteristics of a tape similar to the tape of Fig. 1 except that the plating bath contained the addition agents used in the novel process of this invention.
  • Fig. 3 is a reproduction of the trace made by a record ing X-ray .dittractionspectrometer instrument using a copper radiation "and examining a cobalt-nickel electroplated Phosphor-bronze tape of the type shown in Fig. 2, that is to say, one made with the use of the novel addition agents provided by the process of this invention.
  • Fig. 4 is a reproduction of the trace made with the same instrument as made the trace of Fig. 3 and with a similar tape and under the same conditions, except that the tape had been electro-plated in a bath not containing the novel addition agents provided by this process.
  • Fig. 5 is a circuit diagram for controlling the energy supply to an electrolytic bath, the dotted waveform of Fig. 6 being derived from this circuit.
  • Fig. 6 shows an alternating current wave symmetrical with respect to its axis, and also shows in dotted outline the plating and depleting phases thereof.
  • anelectrolyte consisting of the following ingredients given in grams per liter of aque ous solution.
  • the addition agents, ortho-toluene sulfonamide and paratoluene sulfonamide may be used in a mixture of any proportions or either may be used alone.
  • an alloy of cobaltnickel of 80%-85% cobalt content and the remainder nickel is superior magnetically.
  • the anode therefore, preferably is an alloy of cobalt and nickel in the proportion of 80%-85%, by weight, of cobalt and %-15%, by weight, of nickel.
  • the wetting agent is specified.
  • the aforementionad sodium lauryl sulfate may be used in an amount of 0.002 to 0.003 gram per liter of solution.
  • the anodes are bagged with cotton goods, or equivalent, to prevent but without the use of the specified novel addition agents provided by this process.
  • Figs. 3 and 4 show that the plating made on the tape represented by the hysteresis loop of Fig. 2 has a different lattice structure than the plating made on the tape represented by the hysteresis loop of Fig. 1.
  • These X-ray diffraction spectrometer traces are taken between 35 29 and 53 26 as it is in that region that the difference in the contamination of the electrolyte bath with particles of sludge formed as an undesirable product of the corrosion of the anode.
  • the total effective area of the anodes generally speaking, should be equal to the area of the cathode material undergoing plating.
  • the tape In processing a tape, the tape is passed through the bath in a conone side of tinuous run, the tape entering the bath at the tank, looping through the bath and leaving it on the other side of the tank, the anodes being disposed so both sides of the tape receive an equal amount of deposit.
  • the tape may be in the bath for approximately six minutes during which time it is subjected to, on the plating phase, preferably, a current density of 480 amperes per square foot and is subject to, on the reverse or deplating phase, a current density of 160 amperes per square foot, with a 60-cycle frequency, although the latter may be varied between and 400 cycles. Because the current is a consequent danger of burning the metal tape being plated.
  • the energized portion of the tape may be submerged in the electrolyte with the contacts protected from being plated by use of physical shielding.
  • the shielding may be in the form of a submerged cell which has an entrant slot and and exit slot through which the tape passes, yet affording an access to the electrolyte fluid which acts as a coolant.
  • Such cells may be made of plastic resinous material such as methyl methacrylate.
  • the cooling may also be accomplished, in case non-submerged contacts are used, by flowing electrolyte over the entrant tape between the contacts and the bath.
  • the metal base strip or tape may be subjected to a conventional cleaning bath before it is introduced into the plating bath. On emergence from the plating bath the tape is rinsed and dried. If it is found that the edges of the tape have a bead of the plating material formed along them, the bead may be cut off by a slitting machine which acts as an edge trimmer.
  • the plated tape made according to the above process is exceptionally adapted for having recorded thereon magnetic signals in the form of spots, although it is useful for receiving audio signals as well.
  • the tape, so plated, accordingto the preferred embodiment of this invention as just specified has a remanence of approximately 8700 Gausses and a coercivity of approximately 230 Oersteds, as compared with similar plating made in a bath without the special addition agents, as shown in Fig. l, where the remanence is only 5460 Gausses and the coercivity is 300 Oersteds.
  • the novel tape of this invention is easier to impress with a magnetic signal and it reproduces a larger signal than tapes made by similar electro-plating density used is so high there lattice structure is most noticeable.
  • the peak 20 near 45 29 having a d value of 2.04 is smaller in Fig. 3 than the corresponding peak 21 in Fig. 4 and the peak 22 at 52 29 in Fig. 3 representing the d value of 1.76 is absent in Fig. 4.
  • the presence of the high level around 47.8" 26 is indicative of superior magnetic quantities.
  • the difference between Figs. 3 and 4 postively indicates that there is a difference in the crystal structure of the plating produced by this novel process over plating made without the addition agent specified and stands as proof of the fact that the process of this invention provides a novel product.
  • the circuit of Fig. 5 permits independent adjustment of the plating and deplating current.
  • the input to this circuit is represented by the typical alternating current wave 27 of Fig. 6, symmetrical with respect to the alternating current time axis 28.
  • the alternating current input is applied to the control circuit between terminals 29 and 30.
  • terminal is positive with respect to terminal 29, and the plating current flows from the positive terminal along conductor 34 to the anode or plating electrode 35, located in the inert tank 36, containing solution 37. Since the cathode electrode 38, representing the work or plating recipient, is negative with respect to the anode is effected during this half cycle.
  • the plating current represented by the arrow 33, is returned to the other input terminal 29 by way of a path including an adjustable resistor 41 and a rectifier 42.
  • the current which is actually effective in providing the plating action is represented by the dotted voltage waveform 43 of Fig. 6.
  • the amplitude difference between the input wave 27 and the useful wave 43 is occasioned by the voltage drop across the resistor 41, neglecting, of course, any slight loss across the rectifier 42. Consequently, by adjusting the value of resistor 41, the magnitude of plating current can be selected as desired.
  • the deplating phase is established between points 32 and 43 of the time axis of Fig. 6. Reversal of the alternating current input wave 27 causes terminal 29 to become positive with respect to terminal 30.
  • the deplating current represented by the arrow 44, flows through rectifier 45 and adjustable resistor 46, from the cathode 38' to the anode 35, effecting the desired deplating of the recipient 38, and is returned over lead 34 to the now negative terminal 30.
  • the amplitude of this current during the deplating interval is represented by the dotted wave 47 of Fig. 6. The amplitude is independently adjusted by resistor 46, the value of which usually greatly exceeds that of resistor 41.
  • the ratio of plating to deplating current can be selected as desired, the resistor 41 usually being adjusted to zero or very nearly so, in order that the plating current approaches its maximum value and the resistor 48 set to a high value to provide a ratio within the range aforesaid.
  • the process may be used to make platings of different thicknesses depending upon the use to which they may be put and the process may be used within the limits specified, to plate any form of base material, with comparable results.
  • nickel-cobalt composition including the steps of preparing an electrolyte consisting of an aqueous vehicle in which has been dissolved nickel and cobalt salts so that the nickel content is from 10 to 75 grams per liter of solution and the cobalt content is from 25 to 75 grams per liter of solution and in which has been dissolved between 1 and 3' grams of atoluene sulfonamide per liter of solution, said toluene snlfonamide being taken from the group consisting of ortho-toluene sulfonamide and paratoluene sulfonamide, and boric acid in the amount of 5 to 45.0 grams per liter of solution; introducing the base metal into said electrolyte as the cathode; introducing an anode into the electrolyte; and passing, from an alternating current source, an alternating current between the electrodes, the connection from one electrode to the alternating current source being a direct connection, and the connection from the other electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
US283652A 1952-04-22 1952-04-22 Method of electroplating cobalt-nickel composition Expired - Lifetime US2730491A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL101173D NL101173C (enrdf_load_stackoverflow) 1952-04-22
US283652A US2730491A (en) 1952-04-22 1952-04-22 Method of electroplating cobalt-nickel composition
GB7501/53A GB733252A (en) 1952-04-22 1953-03-18 Method of electro-plating using a nickel-cobalt composition
FR1076019D FR1076019A (fr) 1952-04-22 1953-04-21 Pièce d'enregistrement magnétique et procédé pour son obtention
CH311229D CH311229A (fr) 1952-04-22 1953-04-21 Procédé pour le dépôt galvanique d'un revêtement au nickel et cobalt sur un métal de base en vue d'obtenir une pièce destinée à enregistrer les impulsions magnétiques, et pièce revêtue obtenue par ce procédé.
DEN7075A DE956903C (de) 1952-04-22 1953-04-23 Verfahren zum elektrolytischen UEberzieen eines nichtmagnetischen Metalls mit einer Nickel-Kobalt-Legierung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US283652A US2730491A (en) 1952-04-22 1952-04-22 Method of electroplating cobalt-nickel composition

Publications (1)

Publication Number Publication Date
US2730491A true US2730491A (en) 1956-01-10

Family

ID=23087005

Family Applications (1)

Application Number Title Priority Date Filing Date
US283652A Expired - Lifetime US2730491A (en) 1952-04-22 1952-04-22 Method of electroplating cobalt-nickel composition

Country Status (6)

Country Link
US (1) US2730491A (enrdf_load_stackoverflow)
CH (1) CH311229A (enrdf_load_stackoverflow)
DE (1) DE956903C (enrdf_load_stackoverflow)
FR (1) FR1076019A (enrdf_load_stackoverflow)
GB (1) GB733252A (enrdf_load_stackoverflow)
NL (1) NL101173C (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031648A (en) * 1960-05-25 1962-04-24 Ncr Co Magnetic data storage device
US3150939A (en) * 1961-07-17 1964-09-29 Ibm High density record carrier
US3569946A (en) * 1958-09-25 1971-03-09 Burroughs Corp Magnetic material and data store
US3867106A (en) * 1973-12-26 1975-02-18 Honeywell Inc Magnetic thin film data storage device and method of making
US4323629A (en) * 1979-07-17 1982-04-06 Matsushita Electric Industrial Co., Ltd. Metallic thin film magnetic recording medium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2619454A (en) * 1945-08-30 1952-11-25 Brush Dev Co Method of manufacturing a magnetic recording medium by electrodeposition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB584977A (en) * 1944-09-29 1947-01-28 London Scandinavian Metall Improvements in or relating to the electro-deposition of nickel and nickel alloys
US2451340A (en) * 1948-03-06 1948-10-12 Westinghouse Electric Corp Electroplating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2619454A (en) * 1945-08-30 1952-11-25 Brush Dev Co Method of manufacturing a magnetic recording medium by electrodeposition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3569946A (en) * 1958-09-25 1971-03-09 Burroughs Corp Magnetic material and data store
US3031648A (en) * 1960-05-25 1962-04-24 Ncr Co Magnetic data storage device
US3150939A (en) * 1961-07-17 1964-09-29 Ibm High density record carrier
US3867106A (en) * 1973-12-26 1975-02-18 Honeywell Inc Magnetic thin film data storage device and method of making
US4323629A (en) * 1979-07-17 1982-04-06 Matsushita Electric Industrial Co., Ltd. Metallic thin film magnetic recording medium

Also Published As

Publication number Publication date
FR1076019A (fr) 1954-10-21
GB733252A (en) 1955-07-06
DE956903C (de) 1957-01-24
NL101173C (enrdf_load_stackoverflow)
CH311229A (fr) 1955-11-30

Similar Documents

Publication Publication Date Title
US2619454A (en) Method of manufacturing a magnetic recording medium by electrodeposition
EP0471946A2 (en) High magnetic moment materials and process for fabrication of thin film heads
US3716464A (en) Method for electrodepositing of alloy film of a given composition from a given solution
US3141837A (en) Method for electrodepositing nickel-iron alloys
US3317410A (en) Agitation system for electrodeposition of magnetic alloys
US3480522A (en) Method of making magnetic thin film device
US3844909A (en) Magnetic film plated wire and substrates therefor
US3149058A (en) Bright gold plating process
US2730491A (en) Method of electroplating cobalt-nickel composition
US2515192A (en) Method of electroplating
US3370929A (en) Magnetic wire of iron and nickel on a copper base
US3518170A (en) Electrodeposition of iron group metals
US4108739A (en) Plating method for memory elements
US4159926A (en) Nickel plating
EP0361451B1 (en) Process for producing a thin alloy film having high saturation magnetic flux density
US1920964A (en) Electrodeposition of alloys
US3622469A (en) Method for edge-plating coupled film devices
EP0012326B1 (en) A method of electroplating nickel-iron alloys
US3239437A (en) Methods of depositing magnetic alloy films
US3152974A (en) Electroplating magnetic cobalt alloys
Srimathi et al. Electroplating of Fe-Ni alloys: a sulphate-amine bath
US20050082171A1 (en) Preparation of soft magnetic thin film
US3073762A (en) Electrodeposition of cobalt phosphorus alloys
US3463708A (en) Electrolytic bath for magnetic deposition
US20030085131A1 (en) Electro-deposition of high saturation magnetization Fe-Ni-Co films