US2649367A - Cadmium-free low fusing point alloy - Google Patents

Cadmium-free low fusing point alloy Download PDF

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Publication number
US2649367A
US2649367A US189044A US18904450A US2649367A US 2649367 A US2649367 A US 2649367A US 189044 A US189044 A US 189044A US 18904450 A US18904450 A US 18904450A US 2649367 A US2649367 A US 2649367A
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United States
Prior art keywords
cadmium
fusing point
point alloy
free low
low fusing
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Expired - Lifetime
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US189044A
Inventor
Jr Albert A Smith
John L Everhart
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American Smelting and Refining Co
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American Smelting and Refining Co
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Priority to US189044A priority Critical patent/US2649367A/en
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C28/00Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00

Definitions

  • Low melting point alloys composed of 32-34% 15 Bi, 42-44% In, '7-8% Pb and 15-18% Sn.

Description

Patented Aug. 18, 1953 I I,
UNITED STATES PATENT OFFICE CADMIUM-FREE LOW FUSING POINT ALLOY Albert A. Smith, Jr., Metuchen, and John L. Everhart, Linden, N. J assignors to American smelting and Refining Company, New York,
N. Y., a corporation of New Jersey No Drawing. Application October 7, 1950, Serial No. 189,044
1 Claim. (Cl. 75134) 1 2 This invention relates to alloys and more par- References Cited in the file of this patent tioularly to low fusing point alloys. UNITED STATES PATENTS It is an object of the invention to provide cadmium-free, low melting point alloys. Number Name Date In accordance with the invention, alloys are 5 2213,153 y Oct. 15, 1940 provided comprising, by weight, 32-34% Bi, OTHER REFERENCES 42-44% In, 7-8% Pb and 15-18% Sn, and have fusing points of approximately 59 C.
It will be observed from the compositions that these alloys do not contain cadmium and, accordingly, they are particularly suitable for certain Fusible Alloys Containing Tin, September appl1cat1ons as heat transfer media where v v 1949, 24 pages, page 3 relied on. Published by cadmmn? be .detnmental' the Tin Research Institute, Columbus, Ohio.
What 1s claimed 15:
Low melting point alloys composed of 32-34% 15 Bi, 42-44% In, '7-8% Pb and 15-18% Sn.
ALBERT A. SMITH, JR. JOHN L. EVERHART.
French, Industrial and Engineering Chemistry, vol. 2'7, December 1935; pages 1464 and 1465.
10 Smith, Metal Industry, October 26, 1945; page
US189044A 1950-10-07 1950-10-07 Cadmium-free low fusing point alloy Expired - Lifetime US2649367A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4083718A (en) * 1975-03-20 1978-04-11 Tokyo Shibaura Electric Co., Ltd. Bismuth-tin-indium-lead alloy
US4214903A (en) * 1975-03-20 1980-07-29 Tokyo Shibaura Electric Co., Ltd. Bismuth-tin-indium alloy
US5248476A (en) * 1992-04-30 1993-09-28 The Indium Corporation Of America Fusible alloy containing bismuth, indium, lead, tin and gallium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2218153A (en) * 1937-08-27 1940-10-15 Pray Res Corp Method of and and apparatus for effecting heat transfer from a molten material heat-carrying medium in the heat treatment of substances in the gaseous and vaporous state

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2218153A (en) * 1937-08-27 1940-10-15 Pray Res Corp Method of and and apparatus for effecting heat transfer from a molten material heat-carrying medium in the heat treatment of substances in the gaseous and vaporous state

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4083718A (en) * 1975-03-20 1978-04-11 Tokyo Shibaura Electric Co., Ltd. Bismuth-tin-indium-lead alloy
US4214903A (en) * 1975-03-20 1980-07-29 Tokyo Shibaura Electric Co., Ltd. Bismuth-tin-indium alloy
US5248476A (en) * 1992-04-30 1993-09-28 The Indium Corporation Of America Fusible alloy containing bismuth, indium, lead, tin and gallium

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