US2648628A - Electroplating of nickel - Google Patents
Electroplating of nickel Download PDFInfo
- Publication number
- US2648628A US2648628A US174375A US17437550A US2648628A US 2648628 A US2648628 A US 2648628A US 174375 A US174375 A US 174375A US 17437550 A US17437550 A US 17437550A US 2648628 A US2648628 A US 2648628A
- Authority
- US
- United States
- Prior art keywords
- nickel
- bath
- quinoline
- compounds
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 47
- 229910052759 nickel Inorganic materials 0.000 title description 20
- 238000009713 electroplating Methods 0.000 title description 2
- 150000001875 compounds Chemical class 0.000 claims description 38
- 150000003460 sulfonic acids Chemical class 0.000 claims description 11
- 239000003929 acidic solution Substances 0.000 claims description 10
- 229940124530 sulfonamide Drugs 0.000 claims description 10
- 150000003456 sulfonamides Chemical class 0.000 claims description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 9
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 9
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 8
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 8
- 238000004070 electrodeposition Methods 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 7
- -1 SULFONIMIDES Chemical class 0.000 claims description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 14
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 10
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 150000002815 nickel Chemical class 0.000 description 8
- SMUQFGGVLNAIOZ-UHFFFAOYSA-N quinaldine Chemical compound C1=CC=CC2=NC(C)=CC=C21 SMUQFGGVLNAIOZ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical group 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 4
- KHBQMWCZKVMBLN-UHFFFAOYSA-N Benzenesulfonamide Chemical compound NS(=O)(=O)C1=CC=CC=C1 KHBQMWCZKVMBLN-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- JJPSZKIOGBRMHK-UHFFFAOYSA-N 2,6-dimethylquinoline Chemical compound N1=C(C)C=CC2=CC(C)=CC=C21 JJPSZKIOGBRMHK-UHFFFAOYSA-N 0.000 description 2
- FVVXWRGARUACNW-UHFFFAOYSA-N 3-methylisoquinoline Chemical compound C1=CC=C2C=NC(C)=CC2=C1 FVVXWRGARUACNW-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Chemical group 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- JHRWWRDRBPCWTF-OLQVQODUSA-N captafol Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)C(Cl)Cl)C(=O)[C@H]21 JHRWWRDRBPCWTF-OLQVQODUSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000001741 organic sulfur group Chemical group 0.000 description 2
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical compound C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DTBDAFLSBDGPEA-UHFFFAOYSA-N 3-Methylquinoline Natural products C1=CC=CC2=CC(C)=CN=C21 DTBDAFLSBDGPEA-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- USQCUKQZXOWUDF-YWZLYKJASA-N 6-chloro-n-[(3s)-1-[(2s)-1-(4-methyl-5-oxo-1,4-diazepan-1-yl)-1-oxopropan-2-yl]-2-oxopyrrolidin-3-yl]naphthalene-2-sulfonamide Chemical compound O=C([C@@H](N1C([C@@H](NS(=O)(=O)C=2C=C3C=CC(Cl)=CC3=CC=2)CC1)=O)C)N1CCN(C)C(=O)CC1 USQCUKQZXOWUDF-YWZLYKJASA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 125000003047 N-acetyl group Chemical group 0.000 description 1
- BRMDATNYMUMZLN-UHFFFAOYSA-N Piloty's Acid Chemical compound ONS(=O)(=O)C1=CC=CC=C1 BRMDATNYMUMZLN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 150000008107 benzenesulfonic acids Chemical class 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ARFKGONNPZNFOM-UHFFFAOYSA-N n-methoxybenzenesulfonamide Chemical class CONS(=O)(=O)C1=CC=CC=C1 ARFKGONNPZNFOM-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- ABOYDMHGKWRPFD-UHFFFAOYSA-N phenylmethanesulfonamide Chemical class NS(=O)(=O)CC1=CC=CC=C1 ABOYDMHGKWRPFD-UHFFFAOYSA-N 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
Definitions
- My invention relates to improvements in the electro-deposition of nickel from aqueous acidic baths. It is particularly concerned with the utilization of mixtures of certain types of agents for the purpose of decreasing grain size and increasing the luster of the nickel plate or deposit, and it is especially concerned with the production of electrodeposits of brilliant, highly lustrous, ductile nickel plates.
- the agents of Table I are illustrative of the class of compounds, found to be useful in the practice of my present invention, in accordance with the formula where zero, 1 or 2, the compounds can contain one or two nuclear halogen groups or, where x is zero, the nucleus is unsubstituted.
- fi-bromo isoquinolme. 003-. 02 13. (S-methyl isoquinoline. .'003. 03 14. 2,4-dibromo quinoline 005-. 03 15. 2,4-dichloro quinoline 005-. 03 .16. 2,8-dimethyl guinqline. 005-. 03 17. 1,3-dimetl1yl1soqumol1ne .003 02 18. 3-methyl isoquii'ioline. 003-. 03 19. 2-methyl-8-bromo quinoline. 005-. 03 20. 2-,metl1yl-8-ch10r0 quinoline 005-. 03 21. 3-chloro-2-methyl quinoline. .005-. 03 22. 8-bromo-2-metl1y1 quinoline 005-. 03 23. l-methyl isoquinoline .003. 03
- the agents of Table II are illustrative of the class of compounds which are employed in conjunctionwith the agents of'Table I, in the practice of my invention.
- the agents of Table II fallinto thecategory of organic sulfonamides, sulfonimides and sulfonic acids. They have heretofore been used as brighteners in nickel plating baths as is disclosed in part, for example, in my prior Patents Nos. 2,191,813
- Benzene sulionamide m-carboxylic amide 0. l-3 11. 7-Aldehydo o-benzoyl sulfimide 0.1-3 l2. N-Acetyl benzene sulfonimide 0. 1-2 13. Methoxy benzene sulfonamides 0. 1-1 14. Hydroxymethyl benzene sulfonami 0. 1-2 15, Vinyl snlfmnmide 4-12 16. Allyl sulionamide i-12 17. Benzene sulfonic acids (mono-, di-, and tri-) 1-15 18. p-Brom benzene sulfcnic acid 3-6 19.
- Benzaldehyde sulionic acids (0, m, p) 2-6 20.
- p-Ohlor benzene sulfonic acid " l-l 24.
- Diphenyl sulfonic acid 1-5 25.
- Allyl sulfonic acid 4-12 It will be understood that said sulfonic brighteners may be utilized in their acid form or in the form of salts as, for example, nickel, sodium, potassium or other salts. Especially satisfactory, for use in the practice'of my present invention, are the compounds of Table II corresponding to numbers 1, 2, 3; 1s, 19, 21 and 2a, the latter particularly in the form of their nickel salts.
- the compounds of Table 11 used alone, produce reasonably bright deposits on buffed metals such as bufied brass. However, at least in the ordinary case, they do not accomplish the same dark, brittle, easily stained and have poor adherence characteristics at higher concentrations. If, however, the two different types of compounds represented in Tables I and II are used together in the baths, as I have indicated above, brilliant mirror-like, adherent and ductile deposits are obtained even over matte surfaces.
- the optimum concentration of the compounds will be found to fall within the range of about results on steel polished with 180 emery or on matte (but unburnt) copper plate of 0.0003- '0.0005 thickness but, rather, generally yield plates of somewhat dull and gray appearance in these cases.
- the compounds of Table I in the usual case, when used alone, give a different type of plate than that produced by the compounds of Table II.
- the plates produced with the compounds of Table I alone are fine grained and cloudy at very low concentrations, and are rather 0.005 to about 0.03 gram/liter.
- the compounds of Table II are likewise used in small proportions, in conjunction with the compounds of Table I, amounts of the order of about 0.1 gram/liter to 2 or 3 grams/liter being effective in the usual case. Higher proportions, up to saturation, can, however, be utilized. Ordinarily, it is unnecessary to exceed about 0.5%.
- the aqueous nickel plating baths may be of various types but, in all cases, they are acidic in character.
- the preferred baths are of the socalled acidic grey type which are capable of producing thick, adherent, ductile deposits, those of the Watts type or modifications thereof being particularly desirable.
- the nickel salts may comprise nickel chloride, nickel sulfate, nickel fluoborate, nickel sulfamate, or other nickel salts or mixtures of any two or more of said nickel salts, preferably in conjunction with bufier materials as, for example, boric acid. I prefer to utilize boric acid in the bath as it is, in general, the best cathode film buffer.
- buffers of acidic character may, however, be employed as, for example, formic acid, citric acid, fiuoboric acid, and the like, and such may be used either in place of or in conjunction with boric acid.
- concentration of the boric acid or its equivalent should be above 30 grams per liter, especially in baths operated at somewhat elevated temperatures.
- the baths may also contain various supplemental agents such as anti-pitting agents and the like.
- the baths can be operated at temperatures ranging from about room temperature to almost boiling but, in general, the preferred temperature is in the range of about 40 degrees C. to 65 degrees C. In general, the baths can be operated at pH values ranging from about 2 to about 5.5
- the preferred pH values are from 2.5 to 4.8.
- the cathode current density ranges are quite variable, a range of about 5 to several hundred amperes per square foot being utilizable, the optimum depending upon agitation,
- a bath for the electrodeposition of bright nickel comprising an aqueous acidic solution containing at least one nickel salt selected from the group consisting of nickel chloride and nickel sulfate, said bath also containing, in solution, not more than 1 5 grams per liter of at least one brightener selected from the group consisting of organic sulfonamides, sulfonimides, and sulfonic acids, and, in addition, from about 0.005 to about 0.04 gram per liter of a bath-soluble compound in accordance with the formula where represents a compound selected from the group consisting of guinoline, isoquinoline and C-methyl and ethyl homologues thereof, R is halogen, and .z: is zero to 2.
- a bath for the electrodeposition of bright nickel comprising an aqueous acidic solution of at least one nickel salt, said bath also containing. in solution, not more than about 15 grams per liter of at least onebrightener selected from the group consisting of organic su1fonamides,.sulfonimides, and sulfonic acids, and, in addition, .005-.04 gram per liter of Z-methyl quinoline.
- a bath for the electrodeposition of bright nickel comprising an aqueous acidic solution containing at least one nickel salt selected from the group consisting of nickel, chloride and nickel sulfate, said bath also containing, in 5010mm, not more than about 15 grams per liter of at least one brightenerselected from the group consisting of organic sulfonamides, sulfonimides, and .sulfonic acida'and, in addition, from about 0.005 to about 0.04 gram per liter of Z-methyl quinoline.
- a bath for the electrodeposition of bright nickel comprising an aqueous acidic solution con,- taining at least one nickel salt selected from the group consisting of nickel chloride, and nickel sulfate, said bath also containing, in solution, not more than about 15 grams per liter of at least one brightener selected from the group consisting of organic sulfonamides, sulfonimidea. and sulfonic'acids, and, in additiomfrom about 0.005 to about 0.04 gram per liter of a bath-soluble compound in accordance with the formula 0.04 gram per liter of a mixture of isoquinolineand 2-methyl quinoline.
- a method of electrodepositing nickel to obtain a fine-grained, ductile deposit of high brilliance which comprises electrolyzing an aqueous acidic solution containing at least one nickel salt selected from the group consisting of nickel chloride and nickel sulfate, said bath also containing, in solution, not more than about 15 grams per liter of at least one brightener selected from the group consisting of organic sulfonamides, sulfonimides, and sulfonic acids, and, in addition, from about 0.005 to about 0.04 gram per liter of a bathsoluble compound in accordance with the formula represents a compound selected from the group consisting of quinoline, isoquinoline and C- methyl and ethyl homologues thereof, R. is halogen, and :1: is zero to 2.
- a method of electrodepositing nickel to obtain a fine-grained, ductile deposit of high brilliance which comprises electrolyzing an aqueous acidic solution of at least one nickel salt, said bath also containing, in solution, not more than about 0.5% of at least one brightener selected from the group consisting of organic sulfonamides, sulfonimides, and sulfonic acids, and, in addition, from about 0.005 to about 0.04 gram per liter of Z-methyl quinoline.
- a method of electrodepositing nickel to obtain a fine-grained, ductile deposit of high brilliance which comprise electrolyzing an aqueous acidic solution containing at least one nickel salt selected from the group consisting of nickel chloride and nickel sulfate, said bath also containing, in solution, not more than about 5% of at least one brightener selected from the group consisting of organic sulfonamides, sulfonimides, and sulfonic acids, and, in addition, .005-04 gram per liter of a bath-soluble compound in accordance with the formula 8 where R is a halogen selected from the group consisting of chlorine and bromine, and a: is zero to 2.
- a bath for the electrodeposition of bright nickel comprising an aqueous acidic solution containing at least one nickel salt selected from the group consisting of nickel chloride and nickel sulfate, an additive for use in an amount of about .005 to about .04 gram per liter in combination with at least one brightener selected from the group consisting of organic sulfonamides,sulfonimides and sulfonic acids in an amount of not more than about 15 grams per liter in said bath, said additive consisting of a compound having the formula represents a compound selected from the group consisting of quinoline, isoquinoline and C-methyl and ethyl homologues thereof, R. is halogen, and a: is zero to 2.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE504701D BE504701A (en)van) | 1950-07-17 | ||
| US174375A US2648628A (en) | 1950-07-17 | 1950-07-17 | Electroplating of nickel |
| DEU621A DE888191C (de) | 1950-07-17 | 1950-09-24 | Bad und Verfahren zur galvanischen Vernicklung |
| NL162654A NL82355C (en)van) | 1950-07-17 | 1951-07-14 | |
| FR1130462D FR1130462A (fr) | 1950-07-17 | 1951-07-16 | Nickelage électrolytique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US174375A US2648628A (en) | 1950-07-17 | 1950-07-17 | Electroplating of nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2648628A true US2648628A (en) | 1953-08-11 |
Family
ID=22635933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US174375A Expired - Lifetime US2648628A (en) | 1950-07-17 | 1950-07-17 | Electroplating of nickel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US2648628A (en)van) |
| BE (1) | BE504701A (en)van) |
| DE (1) | DE888191C (en)van) |
| FR (1) | FR1130462A (en)van) |
| NL (1) | NL82355C (en)van) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4990226A (en) * | 1989-11-06 | 1991-02-05 | Gte Products Corporation | Electroplating wires with nickel at high-speed and a nickel fluoborate bath therefor |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE518440A (en)van) * | 1952-07-05 | |||
| DE1004009B (de) * | 1953-08-13 | 1957-03-07 | Dehydag Gmbh | Galvanische Baeder zur Herstellung von Metallueberzuegen |
| DE1032056B (de) * | 1954-08-09 | 1958-06-12 | Metal & Thermit Corp | Glanzvernickelungsbad |
| BE526095A (en)van) * | 1954-10-30 | |||
| NL205377A (en)van) * | 1955-03-16 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2238861A (en) * | 1938-07-06 | 1941-04-15 | Harshaw Chem Corp | Electrodeposition of metals |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE699021C (de) * | 1934-09-05 | 1940-11-21 | Ly Blasberg Geb Hillebrand | Verfahren zur Herstellung von glaenzenden Nickelueberzuegen |
| GB472514A (en) * | 1936-04-14 | 1937-09-24 | Harshaw Chem Corp | Improvements relating to the electro-deposition of nickel |
| GB525848A (en) * | 1939-03-02 | 1940-09-05 | Udylite Corp | Improvements in or relating to the electro-deposition of nickel |
| US2191813A (en) * | 1939-12-01 | 1940-02-27 | Udylite Corp | Electrodeposition of nickel from an acid bath |
| US2466677A (en) * | 1945-08-27 | 1949-04-12 | Udylite Corp | Electrodeposition of nickel from an acid bath |
-
0
- BE BE504701D patent/BE504701A/xx unknown
-
1950
- 1950-07-17 US US174375A patent/US2648628A/en not_active Expired - Lifetime
- 1950-09-24 DE DEU621A patent/DE888191C/de not_active Expired
-
1951
- 1951-07-14 NL NL162654A patent/NL82355C/xx active
- 1951-07-16 FR FR1130462D patent/FR1130462A/fr not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2238861A (en) * | 1938-07-06 | 1941-04-15 | Harshaw Chem Corp | Electrodeposition of metals |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4990226A (en) * | 1989-11-06 | 1991-02-05 | Gte Products Corporation | Electroplating wires with nickel at high-speed and a nickel fluoborate bath therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| BE504701A (en)van) | |
| FR1130462A (fr) | 1957-02-06 |
| DE888191C (de) | 1953-08-31 |
| NL82355C (en)van) | 1956-03-15 |
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