US2644787A - Electrodeposition of a magnetic coating - Google Patents

Electrodeposition of a magnetic coating Download PDF

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Publication number
US2644787A
US2644787A US137028A US13702850A US2644787A US 2644787 A US2644787 A US 2644787A US 137028 A US137028 A US 137028A US 13702850 A US13702850 A US 13702850A US 2644787 A US2644787 A US 2644787A
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Prior art keywords
ions
range
cobalt
concentration
bath
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Expired - Lifetime
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US137028A
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English (en)
Inventor
Theodore H Bonn
Jr Douglas Cary Wendell
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Eckert Mauchly Computer Corp
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Eckert Mauchly Computer Corp
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Priority to US137028A priority Critical patent/US2644787A/en
Priority to FR1030411D priority patent/FR1030411A/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
    • G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
    • G11B5/657—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing inorganic, non-oxide compound of Si, N, P, B, H or C, e.g. in metal alloy or compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/936—Chemical deposition, e.g. electroless plating

Definitions

  • This invention relates to the manufacture of magnetic record carriers such as Wires or tapes and is particularly concerned with a plating process for manufacturing such elements.
  • the improved process involves a combination of electroplating and chemical plating effected through the use of a bath containing nickel, cobalt and hypophosphite ions.
  • a very thin'uniform coating for example, having a thickness of 0.0002
  • thecarrier which may bemade of a great variety of non-magnetic 2 materials, such as brasses or bronzes, is made the cathode in a bath which will be described hereafter in detail. Since for the securing of thin deposits only a short period of exposure as cathode in the bath is required the process may be made a continuous one by causing the tape to move through the bath with electrical contact with one or more rollers to supply the current to tape.
  • One or more anodes are provided in the bath, which anodes may be formed of nickel, cobalt or nickel-cobalt alloys, or of platinum or some other metal which will either replenish the ions in solution or have no eifect upon the ion content.
  • the anode should be such as not to introduce deleterious cations into the solution as will be described more fully hereafter. While in accordance with what has been stated an electrolytic plating set-up is provided, the process is not strictly an electroplating one since deposition (including liberation of hydrogen) in excess of that to be expected from the current flow is produced by a reducing action on the metallic salts which are present in the bath.
  • the metallic carrier to be plated should be clean and this may be effected through the use of the conventional methods well known in the plating industry.
  • the solution which is used may be best described by reference to the ion concentrations of the essential constituents thereof.
  • the baths which maybe used may be 0.2N to 1.7N bivalent nickel ion content, 0.2N to 1.00N in bivalent cobalt ion content and 0.04N to 0.20N in hypophosphite ion (H2PO2) content.
  • H2PO2 hypophosphite ion
  • the normalities here indicated are in terms of the usual ones for the ions, 1. e., a bath normal in nickel or cobalt ion would contain one-half a gram atomic weight of the nickel or cobalt per liter, while the bath normal in hypophosphite ion content would contain one gram molecular weight of hypophosphite radical (H2PO2) per liter. It is further to be understood that the contents of ions referred to signify the total of the metals or hypophosphite group present without implying that the normalities given represent total dissociation of the salts which contain these ions.
  • the baths which may be used desirably contain other salts which contribute to increasing the conductivity such as sodium, ammonium or potassium chlorides, acetates, sulfates, citrates, or the like.
  • the amounts of these salts present do not appear to be at all critical and as an example there may be cited th presence in the bath of ammonium chloride in ranges from 0.3 to 3.0 molar concentrations.
  • Other salts, such as those mentioned, may be substituted in concentrations to give equivalent electrical conductivities.
  • the anions which are present, due to the acid radicals of the nickel and cobalt salts, are relatively immaterial and there may be involved one or more of such anions as chloride, sulfate, acetate, or the like. There are, of course, to be avoided the introduction of such anions as will precipitate the nickel or cobalt.
  • nitrate ion While in accordance with the above a large variety of anions may be present there are certain other ions, notably the nitrate ion, which should be excluded. If substantial amounts of nitrate ions are present the solution fails to operate properly. Generally speaking, non-essential constituents, which would oxidize hypophosphites, should be absent.
  • hypophosphite may be introduced in the form of any of the alkali salts such as sodium, potassium or ammonium hypophosphite, but since no advantage is gained by using other than the least expensive sodium hypophosphite,
  • the current density involved in the deposition is not critical and may range, for example, from to 200 amperes per square foot surface area of the carrier undergoing, at any instant, treatment in the bath.
  • the higher current densities involve losses due to hydrogen bubbling, though the bubbling, unless quite excessive, does not appear to have a deleterious effect on the coating.
  • the pH of the bath may lie within a rather broad range, i. e., 2 to 6, but best results are secured within the range of 3.0 to 4.2.
  • an acid such as hydrochloric, sulfuric or acetic acid, or other acid compatible with the constituents of the bath, or an alkali, such as ammonium hydroxide, may be added to cause the pH to fall in the desired range.
  • an alkali such as ammonium hydroxide
  • Potassium or sodium hydroxide may be used, but unless added cautiously with stirring they may cause local precipitation of the metallic hydroxides which redissolve with difficulty.
  • a bath producing a coating having this value of coercivity was 0.84N in nickel, 0.84N in cobalt, and 0.145N in hypophosphite ions. This bath contained ammonium chloride in 1.9 molar concentration. The anion associated with the nickel and cobalt was chloride and the hypophosphite was introduced in the form of the sodium salt.
  • the bath was used at a temperature of 50 C. with a current density of 50 amperes per square foot.
  • the pH was approximately 4.
  • the coating so obtained contained approximately 75% cobalt and 25% nickel.
  • coercivity of the same general magnitude may be obtained by varying the nickel ion content to the extent of plus or minus 15% of the value 0.84N stated, the cobalt ion content to the extent of plus or minus 15% of the value 0.84N stated, the hypophosphite ion content to the extent of plus 20% or minus 10% from the value 0.145N stated, or the ammonium chloride or other salt content to the extent of plus or minus 25% from the value 1.9 of molar concentration stated. (The percentages here given are to be understood as approximations only.)
  • the pH range, temperature variations and current density variations may be as described above without substantially affecting the results. Under these conditions a coercivity ranging upwardly from 600 oersteds may be secured and a remanence ranging upwardly from 4000 gauss may be obtained.
  • the foregoing bath compositions may be summarized in the following tabulation, a good composition being considered as one giving a coercivity of the plating in excess of 500 oersteds, and an acceptable composition being considered as one giving a coercivity of the plating in excess of 400 oer-
  • the deposition proceeds at a greater rate than would correspond to the chemical equivalent of the current used and it is, therefore, apparent that the deposition is at least in part due to the presence of the hypophosphite radical which exercises a reducing action on the metal salts.
  • hypophosphites will efiect plating by reduction of metallic salts at higher temperatureswithout the use of current once the depositionlhas been started; however, such depositions which occur at elevated temperatures at pH values of 8 to 9 are not satisfactory inasmuch as they do not produce coatings having suitable properties, the coatings requiring heat treatment to attain coercivities of values approximating 450 oersteds and this heat treatment giving rise'to non-uniformity in the magnetic properties of the coating throughout the length of a tape.
  • the combined electrolytic and chemical deposition produces results as aforementioned, including uniformity of coercivity along the length of the tape and the highly desirable magnetic properties.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath having a pH in the range of 2 to 6 and including as essential constituents nickel ions in a concentration in the range 0.2 to 1.7N, cobalt ions in a concentration in the range 0.2 to 1.0N, and hypophosphite ions in a concentration in the range 0.04 to 0.2N, said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel 10115.
  • the method for thedeposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath including as essential constituents nickel ions in a concentration in the range 0.2 to 1.7N, cobalt ions in a concentration in the range 0.2 to 1.0N, and hypophosphite ions in a concentration in the range 0.04 to 0.2N, said bath having a pH in the range 3.0 to 4.2, and said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath having a pH in the range of 3.0 to 4.2 and including as essential constituents nickel ions in a concentration in the range 0.2 to 1.7N, cobalt ions in a concentration in the range 0.2 to 1.0N, and hypophosphite ions in a concentration in the range 0.04 to 0.2N, the current densitybeing in the range of to 200 amperes per square foot of carrier surface area exposed in the bath, said electrolytic action being in the presence of the reducing action of the hypophosphiteions on the cobalt and nickel ions.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath containing nickel and cobalt chlorides and including as essential constituents nickel ions in a concentration in the range 0.2 to 1.7N, cobalt ions in a concentration in the range 0.2 to 1.0N, hypophosphite ions in a concentration in the range 0.04 to 0.2N, and ammonium chloride in a concentration in the range 0.3 to 3.0M, said bath having a pH in the range 3.0 to 4.2 and the current density being in the 6 range of 15 to 200 amperes per square foot of carrier surface area exposed in the bath, and said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • the method for the deposition of a mag-- netic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath having a pH in the range of 2 to 6 and including as essential constitutents nickel ions in a concentration in'the range 0.7 to 1.0N, cobalt ions in a concentration in the range 0.7 to 1.0N, and hypophosphite ions in a concentration in the range 0.130 to 0.175N, said electrolytic action being in the presence of the reducing action of the hypophospite ions on the cobalt and nickel ions.
  • the method for the depositionof a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath having a pH in the range of 3.0 to 4.2 and including as essential constituents nickel ions in a concentration in the range 0.7 to 1.0N, cobalt ions in a concentration in the range 0.7 to 1.0N, and hypophosphite ions in a concentration in the range 0.130 to 0.175N, the current density being in the range of 30 to amperes per square foot of carrier surface area exposed in the bath, said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • I 8 The method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath containing nickel and cobalt chlorides and including as essential constituents nickel ions in a concentration in the range of 0.7 to LON cobalt ions in a concentration in the range 0.7 to 1.0N, hydrophosphite ions in a concentration in the range 0.130 to 0.175N, and ammonium chloride in a concentration in the range 0.3 to 3.0M, said bath having a pH in the range of 3.0 to 4.2, and the current density being in the range of 30 to 80 amperes per square foot of carrier surface area exposed in the bath, and said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprisin subjectin said carrier as cathode to at least partial electrolytic action in an aqueous bath having a pH in the range of 2 to 6 and including as essential constituents nickel ions in a concentration approximately 0.84N, cobalt ions in a concentration approximately 0.84N, and by- .pophosphite ions in a concentration approxito 4.2 and including as essential constituents nickel ions in a concentration approximately 0.84N, cobalt ions in a concentration approximately 0.84N, and hypophosphite ions in a concentration approximately 0.145N, the current density being in the range of 15 to 200 amperes per square foot of carrier surface exposed in the :oath, said bath also containing ammonium chloride in a concentration approximately 1.9M, and said electrolytic action being in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath containing nickel and cobalt chlorides and including as essential constituents nickel ions in a concentration approximately 0.84N, cobalt ions in a concentration approximately 0.84N, and hypophosphite ions in a concentration approximately 0.145N, the current density being in the range of 30 to 80 amperes per square foot of carrier surface exposed in the bath, said bath also containing ammonium chloride in a concentration approximately 1.9M, said bath having a pH of approximately 4, and said 8 electrolytic actionbelng in the presence of the reducing action of the hypophosphite ions on the cobalt and nickel ions.
  • the method for the deposition of a magnetic coating on an electrically conductive carrier comprising subjecting said carrier as cathode to at least partial electrolytic action in an aqueous bath containing nickel and cobalt chloride and sodium hypophosphite and characterized by a pH of approximately 4 and including as essential constituents nickel ions in a concentration approximately 0.84N, cobalt ions in 'a concentration approximately 0.84N, hypo- THEODORE H. BONN. DOUGLAS CARY WENDELL, J R.

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  • Electroplating And Plating Baths Therefor (AREA)
US137028A 1950-01-05 1950-01-05 Electrodeposition of a magnetic coating Expired - Lifetime US2644787A (en)

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US137028A US2644787A (en) 1950-01-05 1950-01-05 Electrodeposition of a magnetic coating
FR1030411D FR1030411A (fr) 1950-01-05 1951-01-02 Fabrication de supports d'enregistrements magnétiques

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Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3047708A (en) * 1957-12-12 1962-07-31 Union Carbide Corp Electric arc welding method
DE1147817B (de) * 1960-10-05 1963-04-25 Sperry Rand Corp Verfahren zum galvanischen Abscheiden eines Nickel-Eisen-UEberzuges
US3152974A (en) * 1962-07-18 1964-10-13 Hughes Aircraft Co Electroplating magnetic cobalt alloys
US3202590A (en) * 1960-08-19 1965-08-24 Ibm Electrodeposition of cobalt-phosphorus alloys
US3227635A (en) * 1962-01-12 1966-01-04 Ibm Method of producing magnetic films
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
US3265596A (en) * 1963-02-11 1966-08-09 Ibm Cobalt-nickel alloy plating baths
US3268353A (en) * 1960-11-18 1966-08-23 Electrada Corp Electroless deposition and method of producing such electroless deposition
US3271276A (en) * 1962-10-31 1966-09-06 Sperry Rand Corp Electrodeposition of quaternary magnetic alloy of iron, nickel, antimony and phosphorus
US3282723A (en) * 1960-11-18 1966-11-01 Electrada Corp Electroless deposition and method of producing such electroless deposition
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3355267A (en) * 1964-02-12 1967-11-28 Kewanee Oil Co Corrosion resistant coated articles and processes of production thereof
US3433721A (en) * 1960-03-28 1969-03-18 Gen Electric Method of fabricating thin films
US3463708A (en) * 1966-06-20 1969-08-26 Mohawk Data Sciences Corp Electrolytic bath for magnetic deposition
US3470074A (en) * 1964-08-18 1969-09-30 Siemag Siegener Masch Bau Depositing zinc coatings
US3469973A (en) * 1964-10-02 1969-09-30 Int Standard Electric Corp Magnetic alloy for data storage devices
US3485725A (en) * 1965-10-08 1969-12-23 Ibm Method of increasing the deposition rate of electroless solutions
US3569946A (en) * 1958-09-25 1971-03-09 Burroughs Corp Magnetic material and data store
US3637471A (en) * 1969-01-29 1972-01-25 Burroughs Corp Method of electrodepositing ferromagnetic alloys
WO1982000666A1 (en) * 1980-08-12 1982-03-04 Macdermid Inc Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
US4381227A (en) * 1980-07-31 1983-04-26 Norton Company Process for the manufacture of abrasive-coated tools
US4404247A (en) * 1982-07-02 1983-09-13 Minnesota Mining And Manufacturing Company Protective covering for magnetic recording medium
US4472248A (en) * 1982-12-20 1984-09-18 Minnesota Mining And Manufacturing Company Method of making thin-film magnetic recording medium having perpendicular anisotropy
US4554219A (en) * 1984-05-30 1985-11-19 Burlington Industries, Inc. Synergistic brightener combination for amorphous nickel phosphorus electroplatings
US4652345A (en) * 1983-12-19 1987-03-24 International Business Machines Corporation Method of depositing a metal from an electroless plating solution
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
US5336391A (en) * 1987-09-02 1994-08-09 Ohmega Electronics, Inc. Method for producing a circuit board material employing an improved electroplating bath
US5454930A (en) * 1991-08-15 1995-10-03 Learonal Japan Inc. Electrolytic copper plating using a reducing agent
US6406611B1 (en) 1999-12-08 2002-06-18 University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
EP2753731A4 (fr) * 2011-09-09 2015-07-01 Macdermid Acumen Inc Dépôt électrolytique de couches magnétiques dures
US11585004B2 (en) * 2018-04-19 2023-02-21 Basf Se Composition for cobalt or cobalt alloy electroplating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2430581A (en) * 1944-11-29 1947-11-11 Rca Corp Metallizing nonmetallic bodies

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2430581A (en) * 1944-11-29 1947-11-11 Rca Corp Metallizing nonmetallic bodies

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3047708A (en) * 1957-12-12 1962-07-31 Union Carbide Corp Electric arc welding method
US3569946A (en) * 1958-09-25 1971-03-09 Burroughs Corp Magnetic material and data store
US3433721A (en) * 1960-03-28 1969-03-18 Gen Electric Method of fabricating thin films
US3202590A (en) * 1960-08-19 1965-08-24 Ibm Electrodeposition of cobalt-phosphorus alloys
DE1147817B (de) * 1960-10-05 1963-04-25 Sperry Rand Corp Verfahren zum galvanischen Abscheiden eines Nickel-Eisen-UEberzuges
US3119753A (en) * 1960-10-05 1964-01-28 Sperry Rand Corp Method of preparing thin magnetic films
US3268353A (en) * 1960-11-18 1966-08-23 Electrada Corp Electroless deposition and method of producing such electroless deposition
US3282723A (en) * 1960-11-18 1966-11-01 Electrada Corp Electroless deposition and method of producing such electroless deposition
US3227635A (en) * 1962-01-12 1966-01-04 Ibm Method of producing magnetic films
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
US3152974A (en) * 1962-07-18 1964-10-13 Hughes Aircraft Co Electroplating magnetic cobalt alloys
US3271276A (en) * 1962-10-31 1966-09-06 Sperry Rand Corp Electrodeposition of quaternary magnetic alloy of iron, nickel, antimony and phosphorus
US3265596A (en) * 1963-02-11 1966-08-09 Ibm Cobalt-nickel alloy plating baths
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3355267A (en) * 1964-02-12 1967-11-28 Kewanee Oil Co Corrosion resistant coated articles and processes of production thereof
US3470074A (en) * 1964-08-18 1969-09-30 Siemag Siegener Masch Bau Depositing zinc coatings
US3469973A (en) * 1964-10-02 1969-09-30 Int Standard Electric Corp Magnetic alloy for data storage devices
US3485725A (en) * 1965-10-08 1969-12-23 Ibm Method of increasing the deposition rate of electroless solutions
US3463708A (en) * 1966-06-20 1969-08-26 Mohawk Data Sciences Corp Electrolytic bath for magnetic deposition
US3637471A (en) * 1969-01-29 1972-01-25 Burroughs Corp Method of electrodepositing ferromagnetic alloys
US4381227A (en) * 1980-07-31 1983-04-26 Norton Company Process for the manufacture of abrasive-coated tools
WO1982000666A1 (en) * 1980-08-12 1982-03-04 Macdermid Inc Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
US4404247A (en) * 1982-07-02 1983-09-13 Minnesota Mining And Manufacturing Company Protective covering for magnetic recording medium
US4472248A (en) * 1982-12-20 1984-09-18 Minnesota Mining And Manufacturing Company Method of making thin-film magnetic recording medium having perpendicular anisotropy
US4652345A (en) * 1983-12-19 1987-03-24 International Business Machines Corporation Method of depositing a metal from an electroless plating solution
US4554219A (en) * 1984-05-30 1985-11-19 Burlington Industries, Inc. Synergistic brightener combination for amorphous nickel phosphorus electroplatings
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
US5336391A (en) * 1987-09-02 1994-08-09 Ohmega Electronics, Inc. Method for producing a circuit board material employing an improved electroplating bath
US5454930A (en) * 1991-08-15 1995-10-03 Learonal Japan Inc. Electrolytic copper plating using a reducing agent
US20020164262A1 (en) * 1998-12-09 2002-11-07 University Of Alabama In Huntsville And United States Government Nickel cobalt phosphorous low stress electroplating
US6406611B1 (en) 1999-12-08 2002-06-18 University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
EP2753731A4 (fr) * 2011-09-09 2015-07-01 Macdermid Acumen Inc Dépôt électrolytique de couches magnétiques dures
US11585004B2 (en) * 2018-04-19 2023-02-21 Basf Se Composition for cobalt or cobalt alloy electroplating

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