US20250251198A1 - Heat exchange device and heat exchange method - Google Patents

Heat exchange device and heat exchange method

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Publication number
US20250251198A1
US20250251198A1 US19/186,803 US202519186803A US2025251198A1 US 20250251198 A1 US20250251198 A1 US 20250251198A1 US 202519186803 A US202519186803 A US 202519186803A US 2025251198 A1 US2025251198 A1 US 2025251198A1
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US
United States
Prior art keywords
heat exchange
container
exchange device
solute
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US19/186,803
Other languages
English (en)
Inventor
Takanori Yamauchi
Yuta TAKEMOTO
Akihito TAMADA
Hidenobu Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKEMOTO, Yuta, TAMADA, Akihito, TSUJI, Hidenobu, YAMAUCHI, TAKANORI
Publication of US20250251198A1 publication Critical patent/US20250251198A1/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Definitions

  • the present disclosure relates to a heat exchange device and a heat exchange method.
  • a liquid e.g. water
  • a surfactant e.g. an alcohol
  • the alcohol evaporates faster, that is, turns into a gas faster, as compared to water in a high temperature area; on the other hand, the alcohol condenses faster, that is, turns into a liquid faster, as compared to water in a low-temperature area.
  • the alcohol described above undergoes phase transition between the gas and the liquid as described above. Accordingly, the heat pipe has needed to have strength that can withstand changes of the internal pressure of the heat pipe caused by the phase transition.
  • An object of the present disclosure is to provide a heat exchange device including a container, and a heat exchange method that eliminate the necessity for the container to have strength that can withstand changes of the internal pressure caused by phase transition of a solute between a gas and a liquid.
  • a heat exchange device includes: a container in which a gas, and a liquid having a solvent and a solute are sealed in, the solute influencing surface activity of an interface on which the liquid contacts the gas, and the liquid having surface tension that lowers as concentration of the solute increases, in which a high temperature area of the container is at a temperature lower than a boiling point of the solvent and a boiling point of the solute, and a low temperature area of the container is at a temperature lower than a solidification point of the solvent.
  • the heat exchange device can achieve an advantageous effect of eliminating the necessity for the container to have strength that can withstand changes of the internal pressure caused by phase transition of the solute between the gas and the liquid.
  • FIG. 1 A depicts the configuration of a heat exchange device NS according to a first embodiment.
  • FIG. 1 B depicts operation (No. 1) performed by the heat exchange device NS according to the first embodiment.
  • FIG. 1 C depicts operation (No. 2) performed by the heat exchange device NS according to the first embodiment.
  • FIG. 1 D depicts operation (No. 3) performed by the heat exchange device NS according to the first embodiment.
  • FIG. 2 A depicts the configuration of a heat exchange device ns according to a comparative example.
  • FIG. 2 B depicts operation (No. 1) performed by the heat exchange device ns according to the comparative example.
  • FIG. 2 C depicts operation (No. 2) performed by the heat exchange device ns according to the comparative example.
  • FIG. 2 D depicts operation (No. 3) performed by the heat exchange device ns according to the comparative example.
  • FIG. 3 A depicts the configuration of a heat exchange device NS according to a second embodiment.
  • FIG. 3 B depicts operation (No. 1) performed by the heat exchange device NS according to the second embodiment.
  • FIG. 3 C depicts operation (No. 2) performed by the heat exchange device NS according to the second embodiment.
  • FIG. 3 D depicts operation (No. 3) performed by the heat exchange device NS according to the second embodiment.
  • FIG. 4 A depicts the configuration of a heat exchange device NS according to a third embodiment.
  • FIG. 4 B depicts operation (No. 1) performed by the heat exchange device NS according to the third embodiment.
  • FIG. 4 C depicts operation (No. 2) performed by the heat exchange device NS according to the third embodiment.
  • FIG. 4 D depicts operation (No. 3) performed by the heat exchange device NS according to the third embodiment.
  • a heat exchange device NS according to a first embodiment is explained.
  • the heat exchange device NS according to the first embodiment basically can have the following configuration.
  • a container YK in which a gas KT, and a liquid ET having a solvent YB and a solute YS are sealed in is included, the solute YS influencing the surface activity of an interface on which the liquid ET contacts the gas KT, and the liquid ET having surface tension that lowers as the concentration of the solute YS increases, a high temperature area KR of the container YK is at a temperature lower than the boiling point of the solvent YB and the boiling point of the solute YS, and a low temperature area TR of the container YK is at a temperature lower than the solidification point of the solvent YB.
  • FIGS. 1 A to 1 D depict the configuration of and operation performed by the heat exchange device NS according to the first embodiment.
  • the configuration of the heat exchange device NS according to the first embodiment is explained with reference to FIG. 1 A .
  • the heat exchange device NS includes the container YK for performing heat exchange.
  • the container YK contains the liquid ET for heat exchange, and the gas KT.
  • the liquid ET has the solvent YB (e.g. water) and the solute YS (e.g. a surfactant (e.g. sodium dodecyl sulfate (SDS: Sodium Dodecyl Sulfate))).
  • a surfactant e.g. sodium dodecyl sulfate (SDS: Sodium Dodecyl Sulfate)
  • the container YK and the liquid ET are roughly classified into the high temperature area KR, which is at a relatively high temperature, and the low temperature area TR, which is at a relatively low temperature.
  • the high temperature area KR is at a temperature in a temperature range that is lower than the boiling point of the solvent YB and lower than the boiling point of the solute YS.
  • the low temperature area TR is at a temperature in a temperature range that includes the solidification point of the solvent YB and higher than the solidification point of the solute YS.
  • the solvent YB is water.
  • the high temperature area KR is at a temperature lower than 100 degrees, which is the boiling point of water.
  • the low temperature area TR is at a temperature equal to or greater than 0 degrees, which is the solidification point of water. It is desirable that, for example, a surfactant whose deposition temperature is lower than 0 degrees is used as the solute YS.
  • the gas KT is located inside the liquid ET; in other words, the gas KT is located at a position close to the center of the container YK. Due to the presence of the gas KT, there is an interface between the liquid ET and the gas KT that are in contact with each other. As a result, a capillary wave is generated.
  • the solvent YB turns into a solid KO, that is, solidified, and this causes the concentration of the solute YS (surfactant) to rise.
  • the solvent YB which has been the solid KO melts, and turns into the liquid ET, and this causes the concentration of the solute YS (surfactant) to lower.
  • FIGS. 2 A to 2 D depict the configuration of and operation performed by a heat exchange device ns according to a comparative example.
  • the heat exchange device ns according to the comparative example is a conventional dual-phase heat pipe, an example of which is a heat-pipe-type heat transfer device described in Patent Literature 1.
  • a liquid et e.g. water
  • a surfactant e.g. an alcohol
  • the surfactant evaporates faster, that is, vaporizes faster, as compared to the liquid et, in a high temperature area kr; on the other hand, the surfactant condenses faster, that is, liquefied faster, as compared to the liquid et, in a low temperature area tr.
  • the alcohol undergoes phase transition between a gas kt and the liquid et. Accordingly, the heat pipe, that is, a container yk, needs to have strength that can withstand changes of the internal pressure of the container yk caused by the phase transition.
  • the liquid ET undergoes phase transition between the liquid ET and the solid KO. Accordingly, the heat exchange device NS according to the first embodiment can achieve an advantageous effect of eliminating the necessity for the container YK to have strength that can withstand changes of the internal pressure caused by phase transition of the alcohol between the gas kt and the liquid et, unlike the heat exchange device ns according to the comparative example.
  • a micelle or a vesicle is used as the solute YS (surfactant) described above, and the concentration distribution of the solute YS may be made different by a phase change to an aggregate. While theoretically it is desirable that the higher the temperature, the less likely an aggregate is generated, but actually the higher the temperature, the more likely an aggregate is generated typically, it is expected that advantageous effects similar to advantageous effects of the heat exchange device NS according to the first embodiment mentioned above can be achieved.
  • a heat exchange device NS according to a second embodiment is explained.
  • the heat exchange device NS according to the second embodiment basically can have the following configuration.
  • a container YK in which a gas KT, and a liquid ET having a solvent YB and a solute YS are sealed in is included, the solute YS influencing the surface activity of an interface on which the liquid ET contacts the gas KT, and the liquid ET having surface tension that lowers as the concentration of the solute YS decreases, a high temperature area KR of the container YK is at a temperature lower than the boiling point of the solvent YB and the boiling point of the solute YS, and a low temperature area TR of the container YK is at a temperature lower than the solidification point of the solute YS.
  • FIGS. 3 A to 3 D depict the configuration of and operation performed by the heat exchange device NS according to the second embodiment.
  • the configuration of the heat exchange device NS according to the second embodiment is explained with reference to FIG. 3 A .
  • the heat exchange device NS includes the container YK for performing heat exchange.
  • the container YK contains the liquid ET for heat exchange, and the gas KT.
  • the liquid ET has the solvent YB (e.g. water).
  • the liquid ET has the solute YS (e.g. an electrolyte (e.g. sodium chloride (NaCl)).
  • the solidification point of the solute YS is lower than the solidification point of the solvent YB, and this makes the solute YS (electrolyte) solidify faster than the solvent YB in the low temperature area TR.
  • solute electrolyzed solute
  • solute electrolyzed solute
  • the low temperature area TR is at a temperature in a temperature range that makes the solute YS (electrolyte) remain partially undissolved, and makes the remaining solute YS deposited as a solid.
  • the high temperature area KR is at a temperature range that is lower than the boiling point of the solvent YB, and makes the solute YS (electrolyte) fully dissolved sufficiently.
  • the “solubility” described above is higher in the high temperature area KR as compared to the low temperature area TR.
  • the interfacial tension in the high temperature area KR is relatively high; on the other hand, the interfacial tension in the low temperature area TR is relatively low.
  • the heat exchange device NS according to the second embodiment can achieve an advantageous effect of eliminating the necessity for the container YK to have strength that can withstand changes of the internal pressure caused by phase transition of the alcohol between the gas and the liquid, unlike the container yk according to the comparative example (depicted in FIG. 2 ).
  • the internal diameter of the container YK (the radius of the container YK in the shorter-side direction) is greater than a minimum bubble radius (Laplace diameter) decided depending on the viscosity of the liquid ET so as to prevent generation of a layer including only the gas KT.
  • a heat exchange device NS according to a third embodiment is explained.
  • the heat exchange device NS according to the third embodiment basically can have the following configuration.
  • a container YK in which a gas KT, and a liquid ET having a solvent YB and a solute YS are sealed in is included, and in the container YK, the inner wall of the container YK has been subjected to a hydrophobic surface treatment at higher concentration in a low temperature area TR of the container YK as compared to a high temperature area KR of the container YK.
  • FIGS. 4 A to 4 D depict the configuration of and operation performed by the heat exchange device NS according to the third embodiment.
  • the configuration of the heat exchange device NS according to the third embodiment is explained with reference to FIG. 4 A .
  • the heat exchange device NS includes the container YK for performing heat exchange.
  • the container YK contains the liquid ET for heat exchange, and the gas KT.
  • the inside of the container YK has been subjected to a distributive surface treatment HS so as to control, as in the first embodiment and the second embodiment, the magnitude of the interfacial tension in the low temperature area TR and the magnitude of the interfacial tension in the high temperature area KR, instead of making the concentration of the solute YS (e.g. a surfactant) in the heat exchange device NS different as in the first embodiment, and instead of making the concentration of the solute YS (e.g. an electrolyte) in the heat exchange device NS different as in the second embodiment.
  • a distributive surface treatment HS so as to control, as in the first embodiment and the second embodiment, the magnitude of the interfacial tension in the low temperature area TR and the magnitude of the interfacial tension in the high temperature area KR, instead of making the concentration of the solute YS (e.g. a surfactant) in the heat exchange device NS different as in the first embodiment, and instead of making the concentration of the solute YS (
  • the inner wall surface of the container YK has been subjected to a hydrophobic surface treatment (e.g. a surface treatment using a silane compound) at relatively high concentration in the low temperature area TR; on the other hand, the inner wall surface of the container YK has been subjected to the hydrophobic surface treatment at relatively low concentration in the high temperature area KR.
  • a hydrophobic surface treatment e.g. a surface treatment using a silane compound
  • the rate constant of a phase change in the low temperature area TR increases relatively; on the other hand, the rate constant of a phase change in the high temperature area KR decreases relatively.
  • the heat exchange device NS according to the third embodiment can achieve an advantageous effect of eliminating the necessity for having strength that can withstand changes of the internal pressure caused by phase transition of the alcohol between the gas and the liquid, similarly to the heat exchange device NS according to the first embodiment and the second embodiment, unlike the container yk according to the comparative example (depicted in FIG. 2 ).
  • a heat exchange device NS according to a fourth embodiment is explained.
  • the heat exchange device NS according to the fourth embodiment basically can have the following configuration.
  • a container YK in which a gas KT, and a liquid ET having a solvent YB and a solute YS are sealed in is included, and the container YK is selectively irradiated with light, thereby lowering the surface tension of the liquid ET in a low temperature area TR of the container YK.
  • the configuration of the heat exchange device NS according to the fourth embodiment is similar to that of the heat exchange device NS according to the first embodiment or the like, except for the configuration related to selective irradiation with light described above.
  • control of surface tension similar to that for the heat exchange device NS according to the first embodiment or the like is performed by selectively irradiating, with light, a substance whose surface tension changes upon receiving radiated light, unlike the heat exchange device NS according to the first embodiment or the like.
  • control using light is described in the document, “Manipulation of small particles at solid liquid interface: light driven diffusioosmosis.”
  • Examples of the substance described above include a substance whose surface tension changes due to cis-trans isomerization using light whose wavelength is 360 nm.
  • the surface tension of the substance described above lowers when the substance is irradiated with light with a wavelength to be absorbed at double bonds. More specifically, by irradiating only the substance in the low temperature area TR with light, only the surface tension in the low temperature area TR lowers. On the other hand, without irradiating the substance in a high temperature area KR with light, the surface tension in the high temperature area KR remains unchanged.
  • the substance whose surface tension changes by receiving radiated light is used, and the substance is selectively irradiated with light, thereby selectively changing the surface tension.
  • a heat exchange device NS according to a fifth embodiment is explained.
  • the heat exchange device NS according to the fifth embodiment basically can have the following configuration.
  • a container YK in which a gas KT, and a liquid ET having a solvent YB and a solute YS are sealed in is included, and the potential in a low temperature area TR of the container YK and the potential in a high temperature area KR of the container YK are made different from each other, thereby lowering the surface tension of the liquid ET in the low temperature area TR of the container YK.
  • the configuration of the heat exchange device NS according to the fifth embodiment is similar to the configuration of the heat exchange device NS according to the first embodiment or the like except for the configuration related to the potential in the low temperature area TR of the container YK and the potential in the high temperature area KR of the container YK that are made different from each other.
  • control of surface tension similar to that of the heat exchange device NS according to the first embodiment or the like is performed using electricity unlike the heat exchange device NS according to the first embodiment or the like.
  • the heat exchange device NS according to the fifth embodiment has a structure in which a potential is applied to the liquid ET in the low temperature area TR, and, on the other hand, a potential is not applied to the liquid ET in the high temperature area KR. Thereby, the magnitude of the surface tension in the low temperature area TR and the magnitude of the surface tension in the high temperature area KR are made different from each other.
  • a plurality of electrodes are installed from the high temperature area KR to the low temperature area TR. It is made possible thereby to apply potentials to the liquid ET. More specifically, by applying a potential to the low temperature area TR, and, on the other hand, not applying a potential to the high temperature area KR, a surface tension distribution in which the surface tension in the low temperature area TR is lower than the surface tension in the high temperature area KR is achieved.
  • the surface tension is changed selectively by selectively applying a potential to the low temperature area TR and the high temperature area KR.
  • a heat exchange device including:
  • a heat exchange device including:
  • the heat exchange device according to supplementary note 1 or supplementary note 2 , in which the container has a radius greater than a minimum bubble radius determined depending on viscosity of the liquid.
  • a heat exchange device including:
  • a heat exchange device including:
  • a heat exchange device including:
  • a heat exchange method of performing heat exchange using the heat exchange device according to supplementary note 1 , 2 , 4 , 5 , or 6 .
  • the heat exchange device according to the present disclosure can be used for reducing the pressure-withstandability of the container.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
US19/186,803 2023-01-30 2025-04-23 Heat exchange device and heat exchange method Pending US20250251198A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002777 WO2024161437A1 (ja) 2023-01-30 2023-01-30 熱交換装置及び熱交換方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/002777 Continuation WO2024161437A1 (ja) 2023-01-30 2023-01-30 熱交換装置及び熱交換方法

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US20250251198A1 true US20250251198A1 (en) 2025-08-07

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Country Status (4)

Country Link
US (1) US20250251198A1 (https=)
JP (1) JP7630744B2 (https=)
DE (1) DE112023004826T5 (https=)
WO (1) WO2024161437A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502243A (https=) * 1973-05-14 1975-01-10
JPS5296456A (en) * 1976-02-10 1977-08-13 Sharp Corp Heat pipe
JPS5659191A (en) * 1979-10-19 1981-05-22 Hitachi Ltd Heat pipe
WO2015142607A1 (en) 2014-03-21 2015-09-24 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate
CN112648871B (zh) 2021-01-05 2024-10-22 大连理工大学 一种非均匀润湿性图案化吸液芯超薄平板热管

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JP7630744B2 (ja) 2025-02-17
WO2024161437A1 (ja) 2024-08-08
DE112023004826T5 (de) 2025-09-04
JPWO2024161437A1 (https=) 2024-08-08

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