US20230228956A1 - Optical transceiver with internal gas flow passage for heat dissipation - Google Patents
Optical transceiver with internal gas flow passage for heat dissipation Download PDFInfo
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- US20230228956A1 US20230228956A1 US17/578,137 US202217578137A US2023228956A1 US 20230228956 A1 US20230228956 A1 US 20230228956A1 US 202217578137 A US202217578137 A US 202217578137A US 2023228956 A1 US2023228956 A1 US 2023228956A1
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- United States
- Prior art keywords
- optical transceiver
- rib structure
- housing
- optical
- optical communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 92
- 230000017525 heat dissipation Effects 0.000 title description 8
- 238000004891 communication Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000011229 interlayer Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 7
- 238000013461 design Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/381—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres
- G02B6/3814—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres with cooling or heat dissipation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
Definitions
- the present disclosure relates to optical communication, more particularly to an optical transceiver.
- Optical modules such as optical transceivers
- optical transceivers are generally installed in electronic communication facilities in modern high-speed communication networks.
- an optical transceiver is inserted into a corresponding cage that is disposed in the communication facility in a pluggable manner.
- Different form factors for the optical transceivers such as XFP (10 Gigabit Small Form Factor Pluggable) used in 10 GB/s communication rate, QSFP (Quad Small Form-factor Pluggable), or others including QSFP28 and QSFP-DD (double density) at different communication rates have been made available.
- the internal design of an optical transceiver can have a large impact on the thermal performance of a QSFP-DD transceiver in a system.
- the goal of a system thermal design is to properly remove the heat, so that the internal components within the transceiver could stay within certain temperature ranges when operating to enhance optimal performance and reliability.
- FIG. 1 is a perspective view of an optical transceiver according to one embodiment of the present disclosure
- FIG. 2 is an exploded view of the optical transceiver in FIG. 1 ;
- FIG. 3 is a cross-sectional view of the optical transceiver in FIG. 1 ;
- FIG. 4 is a schematic view showing a flow path for heat dissipation in the optical transceiver of FIG. 1 ;
- FIG. 5 is a schematic view showing the optical transceiver in FIG. 1 where a heat sink is provided.
- FIG. 1 is a perspective view of an optical transceiver according to one embodiment of the present disclosure.
- FIG. 2 is an exploded view of the optical transceiver in FIG. 1 .
- FIG. 3 is a cross-sectional view of the optical transceiver in FIG. 1 .
- an optical transceiver 1 may include a housing 10 , an optical communication module 20 , a heat conductive module 30 and a rib structure 40 .
- the housing 10 includes an upper casing 110 and a lower casing 120 assembled together.
- the housing 10 may be configured to be inserted into a cage in pluggable manner for optical communication.
- the optical communication module 20 is accommodated in the housing 10 , and the optical communication module 20 may include a substrate 210 and an optical communication component 220 .
- the substrate 210 is, for example, a circuit board accommodated in the housing 10 .
- the substrate 210 may include one or more electrical interfaces 211 functioning as an electrical port of the optical transceiver 1 , and a fiber connector 212 , such as MPO, LC, CS or SN interface, functioning as a fiber optic port of the optical transceiver 1 opposite to the electrical port.
- the optical communication component 220 is provided between the substrate 210 and the upper casing 110 of the housing 10 .
- the optical communication component 220 may be a transmitter optical sub-assembly (TOSA) which may include a laser diode (LD) and monitor photodiode (MPD), or a receiver optical sub-assembly (ROSA) which may include a photodiode and a trans-impedance amplifier (TIA).
- TOSA transmitter optical sub-assembly
- MPD monitor photodiode
- ROSA receiver optical sub-assembly
- the optical communication component 220 may be electrically connected with a driver IC chip (not shown in the drawings) mounted on the substrate 210 .
- the heat conductive module 30 may include a carrier 310 mounted on the substrate 210 of the optical communication module 20 , and an interlayer element 320 provided between the upper casing 110 of the housing 10 and the optical communication module 20 .
- the optical communication component 220 is supported on and in thermal contact with the carrier 310 , and the carrier 310 is in thermal contact with the interlayer element 320 .
- the carrier 310 may feature lower thermal expansion coefficient and be made of high hardness material such as tungsten copper alloy.
- the interlayer element 320 may be a thermal pad or a copper plate.
- the rib structure 40 is mounted on an inner surface of the upper casing 110 of the housing 10 .
- the rib structure 40 may be monolithically formed on the upper casing 110 by molding process.
- the rib structure 40 may include a plurality of ribs 410 , and a gas flow passage 400 may be formed between each pair of adjacent ribs 410 of the rib structure 40 .
- the optical communication component 220 is in thermal contact with the housing 10 through the heat conductive module 30 and the rib structure 40 .
- the interlayer element 320 of the heat conductive module 30 may be provided between the rib structure 40 and the optical communication component 220 . At the same time, the interlayer element 320 may physically touch the ribs 410 .
- the optical communication component 220 may be in direct thermal contact with one side of the interlayer element 320 and/or in indirect thermal contact with the interlayer element 320 through the carrier 310 , and the other side of the interlayer element 320 may be in thermal contact with the rib structure 40 .
- FIG. 4 is a schematic view showing a flow path for heat dissipation in the optical transceiver of FIG. 1 .
- the gas flow passage 400 formed between each pair of adjacent ribs 410 of the rib structure 40 can help with the heat dissipation.
- the upper casing 110 of the housing 10 may define a gas inlet 111 and a plurality of gas outlets 112 .
- the gas inlet 111 is located close to the fiber connector 212 of the optical communication module 20 (the fiber optic port of the optical transceiver 1 ), and the gas outlet 112 is located close to the electrical interface 211 of the optical communication module 20 (the electrical port of the optical transceiver 1 ).
- a flow path P may be indicative of gas passing through the gas inlet 111 , the gas flow passage 400 , and the gas outlet 112 . It is worth noting that the housing may include a plurality of gas inlets or a plurality of gas outlets in another implementation.
- the optical communication component 220 is supposed to generate heat during its operation, and some amount of such heat is transferred through the heat conductive module 30 and the rib structure 40 to reach the upper casing 110 . Also, an external airflow can flow into the housing 10 through the gas inlet 111 by natural or forced convection, helping to transfer some of that heat based on the movement of airflow flowing through the gas flow passages 400 . At least a part of the heat generated over the course of the operation of the optical transceiver 1 might be properly flown out of the optical transceiver 1 through the gas outlet 112 .
- the interlayer element 320 of the heat conductive module 30 may be attached to the rib structure 40 by thermally conductive adhesive or electrically conductive adhesive for electromagnetic interference (EMI) shielding.
- thermally conductive adhesive could decrease the thermal contact resistance between the interlayer element 320 and the ribs 410 .
- electrically conductive adhesive can help preventing EMI.
- the interlayer element 320 may have a corresponding cross-sectional profile with the rib structure 40 .
- the interlayer element 320 in view of a vertical cross section, has substantially the same profile as the rib structure 40 , such that the interlayer element 320 can be considered to be in continuous contact with each rib 410 , thus decreasing the thermal contact resistance between the interlayer element 320 and the rib structure 40 .
- the rib structure 40 may include an enlarged section 420 where the gas flow passage 400 is enhanced in a direction from the rib structure 40 toward the substrate 210 of the optical communication module 20 .
- the left part of the rib structure 40 close to the fiber optic port, the gas flow passage 400 between adjacent ribs 410 may be associated with height H1 while the right part (enlarged section 420 ) of the rib structure 40 close to the electrical port may be associated with an increased height H2 (H2 is higher than H1).
- H2 is higher than H1
- the gas flow passage 400 at a region nearby the gas outlet 112 can therefore flow the gas (or air flow) at a higher flow rate of so as to improve the heat dissipation efficiency.
- the optical transceiver 1 may further include a heat sink 50 mounted on an outer surface of the housing 10 , as shown in FIG. 5 .
- the heat sink 50 more specifically a type 2A heat sink, may be mounted on the outer surface of the upper casing 110 . At least part of the heat sink 50 may be located above the gas inlet 111 , and the gas inlet 111 may be communicated with air channels formed in the heat sink 50 .
- the heat sink 50 can be served as a cover to prevent dust or other foreign objects from entering into the gas inlet 111 . Since the gas inlet 111 is protected without additional covers, it helps to reduce an overall size of the optical transceiver 1 .
- FIG. 5 is a schematic view showing the optical transceiver in FIG. 1 where a heat sink is provided. Another heat sink 2 on the housing 10 may be in thermal contact with the optical transceiver 1 .
- the heat sink 2 may be a copper board or include multiple fins.
- a rib structure on the inner surface of the housing provides a gas flow passage between each pair of adjacent ribs.
- the optical communication component When the optical communication component generates the heat during its operation, some amount of heat is transferred through the heat conductive module and the ribs to reach the housing. Also, some amount of heat can be transferred due to the movement of airflow flowing through the gas flow passage.
- the ribs on the housing provides thermal conduction for heat dissipation, and the gas flow passage formed by the rib structure provides thermal convection for heat dissipation, thereby helping to prevent heat accumulation.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
- The present disclosure relates to optical communication, more particularly to an optical transceiver.
- Optical modules, such as optical transceivers, are generally installed in electronic communication facilities in modern high-speed communication networks. In order to make flexible the design of an electronic communication facility and less burdensome the maintenance of the same, an optical transceiver is inserted into a corresponding cage that is disposed in the communication facility in a pluggable manner. Different form factors for the optical transceivers such as XFP (10 Gigabit Small Form Factor Pluggable) used in 10 GB/s communication rate, QSFP (Quad Small Form-factor Pluggable), or others including QSFP28 and QSFP-DD (double density) at different communication rates have been made available.
- The internal design of an optical transceiver can have a large impact on the thermal performance of a QSFP-DD transceiver in a system. The goal of a system thermal design is to properly remove the heat, so that the internal components within the transceiver could stay within certain temperature ranges when operating to enhance optimal performance and reliability.
- The present disclosure will become more fully understood from the detailed description given below and the accompanying drawings which are given by way of illustration only and thus are not intending to limit the present disclosure and wherein:
-
FIG. 1 is a perspective view of an optical transceiver according to one embodiment of the present disclosure; -
FIG. 2 is an exploded view of the optical transceiver inFIG. 1 ; -
FIG. 3 is a cross-sectional view of the optical transceiver inFIG. 1 ; -
FIG. 4 is a schematic view showing a flow path for heat dissipation in the optical transceiver ofFIG. 1 ; and -
FIG. 5 is a schematic view showing the optical transceiver inFIG. 1 where a heat sink is provided. - In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. According to the description, claims and the drawings disclosed in the specification, one skilled in the art may easily understand the concepts and features of the present disclosure. The following embodiments further illustrate various aspects of the present disclosure, but are not meant to limit the scope of the present disclosure.
- Please refer to
FIG. 1 throughFIG. 3 .FIG. 1 is a perspective view of an optical transceiver according to one embodiment of the present disclosure.FIG. 2 is an exploded view of the optical transceiver inFIG. 1 .FIG. 3 is a cross-sectional view of the optical transceiver inFIG. 1 . In this embodiment, anoptical transceiver 1 may include ahousing 10, anoptical communication module 20, a heatconductive module 30 and arib structure 40. - The
housing 10 includes anupper casing 110 and alower casing 120 assembled together. Thehousing 10 may be configured to be inserted into a cage in pluggable manner for optical communication. - The
optical communication module 20 is accommodated in thehousing 10, and theoptical communication module 20 may include asubstrate 210 and anoptical communication component 220. Thesubstrate 210 is, for example, a circuit board accommodated in thehousing 10. Thesubstrate 210 may include one or moreelectrical interfaces 211 functioning as an electrical port of theoptical transceiver 1, and afiber connector 212, such as MPO, LC, CS or SN interface, functioning as a fiber optic port of theoptical transceiver 1 opposite to the electrical port. Theoptical communication component 220 is provided between thesubstrate 210 and theupper casing 110 of thehousing 10. Theoptical communication component 220 may be a transmitter optical sub-assembly (TOSA) which may include a laser diode (LD) and monitor photodiode (MPD), or a receiver optical sub-assembly (ROSA) which may include a photodiode and a trans-impedance amplifier (TIA). Theoptical communication component 220 may be electrically connected with a driver IC chip (not shown in the drawings) mounted on thesubstrate 210. - The heat
conductive module 30 may include acarrier 310 mounted on thesubstrate 210 of theoptical communication module 20, and aninterlayer element 320 provided between theupper casing 110 of thehousing 10 and theoptical communication module 20. Theoptical communication component 220 is supported on and in thermal contact with thecarrier 310, and thecarrier 310 is in thermal contact with theinterlayer element 320. Thecarrier 310 may feature lower thermal expansion coefficient and be made of high hardness material such as tungsten copper alloy. Theinterlayer element 320 may be a thermal pad or a copper plate. - The
rib structure 40 is mounted on an inner surface of theupper casing 110 of thehousing 10. Specifically, therib structure 40 may be monolithically formed on theupper casing 110 by molding process. Therib structure 40 may include a plurality ofribs 410, and agas flow passage 400 may be formed between each pair ofadjacent ribs 410 of therib structure 40. Theoptical communication component 220 is in thermal contact with thehousing 10 through the heatconductive module 30 and therib structure 40. Specifically, theinterlayer element 320 of the heatconductive module 30 may be provided between therib structure 40 and theoptical communication component 220. At the same time, theinterlayer element 320 may physically touch theribs 410. Theoptical communication component 220 may be in direct thermal contact with one side of theinterlayer element 320 and/or in indirect thermal contact with theinterlayer element 320 through thecarrier 310, and the other side of theinterlayer element 320 may be in thermal contact with therib structure 40. -
FIG. 4 is a schematic view showing a flow path for heat dissipation in the optical transceiver ofFIG. 1 . In conjunction withFIG. 3 andFIG. 4 , thegas flow passage 400 formed between each pair ofadjacent ribs 410 of therib structure 40 can help with the heat dissipation. In detail, theupper casing 110 of thehousing 10 may define agas inlet 111 and a plurality ofgas outlets 112. Thegas inlet 111 is located close to thefiber connector 212 of the optical communication module 20 (the fiber optic port of the optical transceiver 1), and thegas outlet 112 is located close to theelectrical interface 211 of the optical communication module 20 (the electrical port of the optical transceiver 1). A flow path P may be indicative of gas passing through thegas inlet 111, thegas flow passage 400, and thegas outlet 112. It is worth noting that the housing may include a plurality of gas inlets or a plurality of gas outlets in another implementation. - The
optical communication component 220 is supposed to generate heat during its operation, and some amount of such heat is transferred through the heatconductive module 30 and therib structure 40 to reach theupper casing 110. Also, an external airflow can flow into thehousing 10 through thegas inlet 111 by natural or forced convection, helping to transfer some of that heat based on the movement of airflow flowing through thegas flow passages 400. At least a part of the heat generated over the course of the operation of theoptical transceiver 1 might be properly flown out of theoptical transceiver 1 through thegas outlet 112. - In this embodiment, the
interlayer element 320 of the heatconductive module 30 may be attached to therib structure 40 by thermally conductive adhesive or electrically conductive adhesive for electromagnetic interference (EMI) shielding. The attachment performed by thermally conductive adhesive could decrease the thermal contact resistance between theinterlayer element 320 and theribs 410. The attachment performed by electrically conductive adhesive can help preventing EMI. - In this embodiment, the
interlayer element 320 may have a corresponding cross-sectional profile with therib structure 40. As shown inFIG. 2 andFIG. 3 , in view of a vertical cross section, theinterlayer element 320 has substantially the same profile as therib structure 40, such that theinterlayer element 320 can be considered to be in continuous contact with eachrib 410, thus decreasing the thermal contact resistance between theinterlayer element 320 and therib structure 40. - In this embodiment, the
rib structure 40 may include an enlargedsection 420 where thegas flow passage 400 is enhanced in a direction from therib structure 40 toward thesubstrate 210 of theoptical communication module 20. As shown inFIG. 3 , the left part of therib structure 40 close to the fiber optic port, thegas flow passage 400 betweenadjacent ribs 410 may be associated with height H1 while the right part (enlarged section 420) of therib structure 40 close to the electrical port may be associated with an increased height H2 (H2 is higher than H1). Thegas flow passage 400 at a region nearby thegas outlet 112 can therefore flow the gas (or air flow) at a higher flow rate of so as to improve the heat dissipation efficiency. - In this embodiment, the
optical transceiver 1 may further include aheat sink 50 mounted on an outer surface of thehousing 10, as shown inFIG. 5 . In conjunction with bothFIG. 3 andFIG. 4 , theheat sink 50, more specifically a type 2A heat sink, may be mounted on the outer surface of theupper casing 110. At least part of theheat sink 50 may be located above thegas inlet 111, and thegas inlet 111 may be communicated with air channels formed in theheat sink 50. Theheat sink 50 can be served as a cover to prevent dust or other foreign objects from entering into thegas inlet 111. Since thegas inlet 111 is protected without additional covers, it helps to reduce an overall size of theoptical transceiver 1. -
FIG. 5 is a schematic view showing the optical transceiver inFIG. 1 where a heat sink is provided. Another heat sink 2 on thehousing 10 may be in thermal contact with theoptical transceiver 1. The heat sink 2 may be a copper board or include multiple fins. - As to devices for high-speed communication such as QSFP-DD 800G optical transceiver, since some active components with high output power, especially an optical subassembly, a single metallic element is insufficient to handle the entire heat dissipation. Due to a large amount of heat generated by the active components, heat accumulation may occur in the heat conductive component.
- According to the present disclosure, a rib structure on the inner surface of the housing provides a gas flow passage between each pair of adjacent ribs. When the optical communication component generates the heat during its operation, some amount of heat is transferred through the heat conductive module and the ribs to reach the housing. Also, some amount of heat can be transferred due to the movement of airflow flowing through the gas flow passage. The ribs on the housing provides thermal conduction for heat dissipation, and the gas flow passage formed by the rib structure provides thermal convection for heat dissipation, thereby helping to prevent heat accumulation.
- The embodiments are chosen and described in order to best explain the principles of the present disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the present disclosure and various embodiments with various modifications as are suited to the particular use being contemplated. It is intended that the scope of the present disclosure is defined by the following claims and their equivalents.
Claims (17)
Priority Applications (2)
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US17/578,137 US11852879B2 (en) | 2022-01-18 | 2022-01-18 | Optical transceiver with internal gas flow passage for heat dissipation |
CN202210329682.5A CN116500731A (en) | 2022-01-18 | 2022-03-31 | Optical transceiver |
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US17/578,137 US11852879B2 (en) | 2022-01-18 | 2022-01-18 | Optical transceiver with internal gas flow passage for heat dissipation |
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US20230228956A1 true US20230228956A1 (en) | 2023-07-20 |
US11852879B2 US11852879B2 (en) | 2023-12-26 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US12019291B2 (en) * | 2022-10-31 | 2024-06-25 | Mellanox Technologies Ltd. | Network interface device having a frame with a sloped top wall portion |
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