US20230207189A1 - Inductor component - Google Patents

Inductor component Download PDF

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Publication number
US20230207189A1
US20230207189A1 US17/748,276 US202217748276A US2023207189A1 US 20230207189 A1 US20230207189 A1 US 20230207189A1 US 202217748276 A US202217748276 A US 202217748276A US 2023207189 A1 US2023207189 A1 US 2023207189A1
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US
United States
Prior art keywords
conductor
conductors
pad
inductor component
disposed
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Pending
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US17/748,276
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English (en)
Inventor
Kwang Il Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PARK, KWANG IL
Publication of US20230207189A1 publication Critical patent/US20230207189A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/06—Cores, Yokes, or armatures made from wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral

Definitions

  • the present disclosure relates to an inductor component.
  • an inductor component is required in a microprocessor, and an inductor component having a Magnetic Inductor Array (MIA) structure with a plurality of conductor traces is used.
  • MIA Magnetic Inductor Array
  • the inductor component of the MIA structure is mounted on the package substrate and may form an inductor structure together with the conductor outside the inductor component.
  • An aspect of the present disclosure is to provide an inductor component advantageous for miniaturization while implementing sufficient inductance characteristics.
  • an inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad.
  • the second conductor is disposed to be shifted with respect to the first conductor in the first direction.
  • the first and second conductors may be provided as a plurality of first conductors and a plurality of second conductors, respectively, and the plurality of first conductors and the plurality of second conductors may be alternately disposed in one direction.
  • the one direction may be a third direction, perpendicular to the first and second directions.
  • the first and second conductors may be disposed to be shifted with respect to each other in the first direction in a range in which the first and second conductors partially overlap in the third direction.
  • the body may be free of an additional conductor connecting the first and second conductors.
  • the first pad and the first conductive via may be provided as a pair of first pads and a pair of first conductive vias, respectively, and the pair of first conductive vias may be connected to one end and the other end of the first conductor, respectively.
  • the second pad and the second conductive via may be provided as a pair of second pads and a pair of second conductive vias, respectively, and the pair of second conductive vias may be connected to one end and the other end of the second conductor, respectively.
  • One end and the other end of the first conductor may be a first pad area having a width greater than widths of other areas of the first conductor, and one end and the other end of the second conductor may be a second pad area having a width greater than widths of other areas of the second conductor.
  • the first and second pad areas partially overlap in the first direction.
  • the first and second conductors may be provided as a plurality of first conductors and a plurality of second conductors, respectively, and the plurality of first conductors and the plurality of second conductors may be arranged in the first direction.
  • an inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a first conductor having a rod shape, disposed in the body, and extending in the first direction, a second conductor having a coil shape and disposed adjacent to the first conductor in the body, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad.
  • the first and second conductors may be provided as a plurality of first conductors and a plurality of second conductors, respectively, and the plurality of first conductors and the plurality of second conductors may be alternately disposed in a third direction perpendicular to the first and second directions.
  • the first conductor may be provided as a plurality of first conductors, and at least two of the plurality of first conductors may have different lengths in the first direction.
  • the inductor component may further include a third conductor having a rod shape, disposed in the body, and extending in a third direction perpendicular to the first and second directions.
  • the third direction may be perpendicular to the first and second directions, and the first and second conductors may be disposed adjacent to each other in the third direction.
  • the second and third conductors may at least partially overlap in the first direction.
  • an inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad.
  • the first conductor is closer to the second surface of the body than the second conductor
  • the second conductor is closer to the first surface of the body than the first conductor.
  • FIG. 1 is a perspective view schematically illustrating an inductor component according to an embodiment
  • FIGS. 2 , 4 and 5 correspond to cross-sectional views of the inductor component of FIG. 1 ;
  • FIG. 3 is an enlarged view of area A in FIG. 2 ;
  • FIGS. 6 , 7 , 8 , 9 , and 10 illustrate shapes of first and second conductors that may be employed in modified examples.
  • first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples .
  • spatially relative terms such as “above,” “upper,” “below,” and “lower” may be used herein for ease of description to describe one element’s relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being “above” or “upper” relative to another element will then be “below” or “lower” relative to the other element. Thus, the term “above” encompasses both the above and below orientations depending on the spatial orientation of the device.
  • the device may also be oriented in other manners (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein are to be interpreted accordingly.
  • FIG. 1 is a perspective view schematically illustrating an inductor component according to an embodiment.
  • FIGS. 2 , 4 and 5 correspond to cross-sectional views of the inductor component of FIG. 1 .
  • FIG. 3 is an enlarged view of area A in FIG. 2 .
  • an inductor component 100 includes a body 110 , a first conductor 121 , a second conductor 122 , a first pad 131 , a second pad 132 , a first conductive via 141 , and a second conductive via 142 .
  • the second conductor 122 is disposed adjacent to the first conductor 121 and shifted in a first direction (X-direction) with respect to the first conductor 121 .
  • X-direction first direction
  • the body 110 may form the exterior of the inductor component 100 and may be formed to have a hexahedral shape as a whole.
  • the body 110 includes a first surface S 1 and a second surface S 2 opposing each other in the first direction (X-direction), and a third surface S 3 and a fourth surface S 4 connected to the first surface S 1 and the second surface S 2 and opposing each other in a second direction (Y-direction).
  • the third surface S 3 of the body 110 may be used as a mounting surface in disposing the inductor component 100 on another substrate or package.
  • the body 110 may include magnetic particles 111 and an insulating resin 112 .
  • the body 110 may be formed by laminating one or more magnetic composite sheets including an insulating resin and a magnetic metal powder dispersed in the insulating resin.
  • the insulating resin 112 may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, or the like alone or in combination.
  • the magnetic particles 111 may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), boron (B), and nickel (Ni).
  • the magnetic particles 111 may be formed using at least one or more of pure iron powder, Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Ni alloy powder, Fe—Ni—Mo alloy powder, Fe—Ni—Mo—Cu alloy powder, Fe—Co alloy powder, Fe—Ni—Co alloy powder, Fe—Cr alloy powder, Fe—Cr—Si alloy powder, Fe—Si—Cu—Nb alloy powder, Fe—Ni—Cr alloy powder, and Fe— Cr—Al alloy powder.
  • the magnetic particles 111 may be amorphous or crystalline.
  • the magnetic particles 111 may be Fe-Si-based amorphous alloy powder, but is not necessarily limited thereto.
  • the magnetic particles 11 may have an average diameter of about 0.1 ⁇ m to 30 ⁇ m, but is not limited thereto. On the other hand, in the present specification, the diameter may refer to a particle size distribution represented as D 90 , D 50 , or the like.
  • the first and second conductors 121 and 122 are disposed in the body 110 and extend in the first direction (X-direction) .
  • the first and second conductors 121 and 122 may have a rod shape formed in the first direction (X-direction), and may be formed of a metal having relatively high electrical conductivity, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or alloys thereof.
  • the rod shape may be a form in which the lengths of the first and second conductors 121 and 122 in the first direction (X-direction) are longer than those in other directions (Y-direction and Z-direction) .
  • the second conductor 122 is shifted in the first direction (X-direction) with respect to the first conductor 121 , and by using this shift arrangement method, a relatively larger number of conductors 121 and 122 may be included in the body 110 .
  • the shift arrangement of the first and second conductors 121 and 122 may indicate that one ends of the first and second conductors 121 and 122 adjacent to each other are spaced apart from each other with a predetermined distance S in the first direction (X-direction).
  • the first and second conductors 121 and 122 may be provided as a plurality of conductors, respectively, and may be alternately disposed in one direction.
  • the one direction may be a third direction (Z-direction) perpendicular to the first and second directions (X-direction and Y-direction).
  • the first and second conductors 121 and 122 may be disposed shifted in the first direction (X-direction) in a range in which some regions overlap in the third direction (Z-direction). That is, in the first direction (X-direction), the first conductor 121 may be closer to the second surface S 2 of the body 110 than the second conductor 122 , and the second conductor 122 may be closer to the first surface S 1 of the body 110 than the first conductor 121 .
  • the length of the body 110 in the first direction (X-direction) may be excessively increased, which may be disadvantageous in downsizing the inductor component 100 .
  • the first and second conductors 121 and 122 are interlocked with conductors present in the substrate and package to form an inductor structure as a whole.
  • the first and second conductors 121 and 122 may not be connected to each other in the body 110 .
  • an additional conductor connecting the first and second conductors 121 and 122 may not be present in the body 110 .
  • first conductor 121 and the second conductor 122 may be separated from each other within the body 110 .
  • the present embodiment illustrates the case in which the first and second conductors 121 and 122 are each 4 in one body 110 , and for example, a total of 8 conductors 121 and 122 are disposed; each of the first and second conductors 121 and 122 may be provided as one, two or three, respectively, and may also be provided with 5 or more.
  • the gap between the first and second conductors 121 and 122 may be reduced, and thus, a relatively larger number of conductors 121 and 122 may be disposed in one inductor component 100 .
  • two inductor components for example, two inductor components having four conductors, should be employed.
  • a larger number of conductors 121 and 122 may be disposed in one inductor component 100 .
  • one inductor component including eight conductors having a shift arrangement structure may have a length*width of about 2.4 mm*1.45 mm, and the mounting area may be reduced to a level of about 20%.
  • the length*width is about 2.4 mm*7.3 mm, and the mounting area may be reduced to about 24%.
  • the number and mounting area of the inductor components 100 may be reduced in a microprocessor or the like based on the same performance standard. Therefore, beneficial effects such as a reduced package size and reduced package assembly costs may be expected.
  • the first pad 131 and the second pad 141 are disposed on the third surface S 3 of the body 110 .
  • the first conductive via 141 extends in the second direction (Y-direction) to connect the first conductor 121 and the first pad 131 .
  • the second conductive via 142 extends in the second direction (Y-direction) to connect the second conductor 122 and the second pad 132 .
  • a pair of the first pads 131 and a pair of the first conductive vias 141 may be provided to be connected to one end and the other end of the first conductor 121 .
  • first pad 131 may not overlap the second pad 132 in any direction among the first direction (X-direction), the second direction (Y-direction), and the third direction (Z-direction).
  • the second pad 132 and the second conductive via 142 may be formed of a conductive material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or alloys thereof.
  • a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or alloys thereof.
  • pad areas P 1 and P 2 are formed in the first and second conductors 121 and 122 .
  • one end and the other end of the first conductor 121 are a first pad area P 1 that is greater than the other regions
  • one end and the other end of the second conductor 122 are a second pad area P 2 that is greater than the other regions.
  • the first conductive via 141 may be connected to the first pad area P 1 of the first conductor 121
  • the second conductive via 142 may be connected to the second pad area P 2 of the second conductor 122 .
  • the first and second conductors 121 and 122 may be disposed such that partial regions of the first and second pad areas P 1 and P 2 overlap in the first direction (X-direction) . As such, the first and second pad areas P 1 and P 2 partially overlap in the first direction (X-direction).
  • a gap between the first and second conductors 121 and 122 may be significantly reduced, and accordingly, the number of conductors 121 and 122 that may be disposed in the body 110 may increase, which has the effect of reducing the size of the inductor component 100 having the same performance.
  • the pad areas P 1 and P 2 used in the embodiment of FIG. 6 may also be applied to the embodiment of FIG. 7 described below.
  • a plurality of first conductors 121 are provided and arranged in the first direction (X-direction).
  • the second conductor 122 is provided as a plurality of second conductors 122 which are arranged in the first direction (X-direction) .
  • the number of the pads 131 and 132 and the conductive vias 141 and 142 may also increase according to the shapes of the first and second conductors 121 and 122 .
  • an inductor component 200 includes conductors having different shapes, for example, a rod-shaped conductor 221 and a coil-shaped conductor 222 .
  • a cross-section in the body 210 is illustrated, and FIG. 8 B illustrates a third surface S 3 of the body 210 .
  • the first conductor 221 has a rod shape extending in the first direction (X-direction), and the second conductor 222 disposed adjacent thereto has a coil shape.
  • a plurality of the first and second conductors 221 and 222 may be provided and may be alternately disposed in one direction.
  • the coil-shaped second conductor 222 may be supported by a support member 220 , and the second conductor 222 may be disposed on both the upper and lower surfaces of the support member 220 .
  • the support member 220 may be formed of an insulating material including at least one of a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, and a photoimageable dielectric resin.
  • the support member 220 may be formed of an insulating material in which at least one resin described above is impregnated with a reinforcing material such as glass fiber or an inorganic filler.
  • the support member 220 may be formed of an insulating material such as Copper Clad Laminate (CCL), an insulation material (Unclad CCL) in which copper foil has been removed from a copper clad laminate, Prepreg, Ajinomoto Build-up Film (ABF), FR-4, Bismaleimide Triazine (BT) film, a Photo Imageable Dielectric (PID) film, or the like.
  • CCL Copper Clad Laminate
  • UDF Ajinomoto Build-up Film
  • FR-4 Prepreg
  • Bismaleimide Triazine (BT) film a Photo Imageable Dielectric (PID) film, or the like.
  • PID Photo Imageable Dielectric
  • the inorganic filler at least one selected from the group consisting of silica (SiO 2 ), alumina (Al 2 O 3 ), silicon carbide (SiC), barium sulfate (BaSO 4 ), talc, mud, mica powder, aluminum hydroxide (Al(OH) 3 ), magnesium hydroxide (Mg(OH) 2 ), calcium carbonate (CaCO 3 ), magnesium carbonate (MgCO 3 ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO 3 ), barium titanate (BaTiO 3 ) and calcium zirconate (CaZrO 3 ) may be used.
  • silica SiO 2
  • alumina Al 2 O 3
  • silicon carbide SiC
  • BaSO 4 barium sulfate
  • talc mud
  • mica powder aluminum hydroxide (Al(OH) 3 ), magnesium hydroxide (Mg(OH) 2 ), calcium carbonate (Ca
  • the second conductor 222 may include a seed layer and an electrolytic plating layer.
  • the electrolytic plating layer may have a single-layer structure or a multilayer structure.
  • the electrolytic plating layer having a multilayer structure may be formed in a conformal film structure in which one electrolytic plating layer is covered by another electrolytic plating layer, and may also be formed in a shape in which another electrolytic plating layer is laminated on only one surface of one electrolytic plating layer.
  • the coil-shaped second conductor 222 may be formed of a conductive material such as, but is not limited thereto, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or alloys thereof.
  • the second conductor 222 having a coil shape may also have a coil structure of a winding type.
  • a first pad 231 and a second pad 232 are disposed on the third surface S 3 of the body 210 , and as in the previous embodiment, the first conductor 221 and the first pad 231 are connected by a first conductive via 241 , and the second conductor 222 and the second pad 232 are connected by a second conductive via 242 .
  • one end and the other end of the first conductor 221 may be formed as a first pad area P 1
  • one end and the other end of the second conductor 222 may be formed as a second pad area P 2 .
  • the width (e.g. , the width in the Z-direction) of the second pad area P 2 connected to the coil structure may be greater than the width of the first pad area P 2 .
  • the utilization of the inductor component 200 may increase.
  • more various conductors may be included.
  • the first conductor 221 the first conductors 221 having different lengths may be provided, and thus, the length of the overlap region thereof with the second conductor 222 may be adjusted.
  • a plurality of first conductors 221 may be provided, and at least two thereof may have different lengths in the first direction (X-direction) .
  • a rod-shaped conductor 223 disposed in another direction may be further provided.
  • the third conductor 223 has a rod shape and extends in a third direction (Z-direction) perpendicular to the first and second directions (X-direction and Y-direction). One end and the other end of the third conductor 223 may be formed as third pad areas P 3 .
  • the first and second conductors 221 and 222 are disposed adjacent to each other in the third direction (Z-direction), and at least some regions of the second and third conductors 222 and 223 may overlap each other in the first direction (Z-direction).
  • sufficient inductance characteristics and miniaturization of an inductor component may be improved.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
US17/748,276 2021-12-29 2022-05-19 Inductor component Pending US20230207189A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0191597 2021-12-29
KR1020210191597A KR20230101470A (ko) 2021-12-29 2021-12-29 인덕터 부품

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US17/748,276 Pending US20230207189A1 (en) 2021-12-29 2022-05-19 Inductor component

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US (1) US20230207189A1 (ja)
JP (1) JP2023098797A (ja)
KR (1) KR20230101470A (ja)
CN (1) CN116417218A (ja)

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KR102610728B1 (ko) 2018-07-30 2023-12-07 현대자동차주식회사 전해질 막에서의 이온의 이동 경향성 평가 방법 및 장치

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