US20230147894A1 - Circuitry for compensating for gain and/or phase mismatch between voltage and current monitoring paths - Google Patents

Circuitry for compensating for gain and/or phase mismatch between voltage and current monitoring paths Download PDF

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US20230147894A1
US20230147894A1 US17/690,327 US202217690327A US2023147894A1 US 20230147894 A1 US20230147894 A1 US 20230147894A1 US 202217690327 A US202217690327 A US 202217690327A US 2023147894 A1 US2023147894 A1 US 2023147894A1
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Prior art keywords
circuitry
monitoring path
compensation
impedance
voltage
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US11644521B1 (en
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Ryan A. Hellman
Viral Parikh
Siddharth Maru
Tejasvi Das
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Cirrus Logic International Semiconductor Ltd
Cirrus Logic Inc
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Cirrus Logic International Semiconductor Ltd
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Assigned to CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD. reassignment CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DAS, TEJASVI, HELLMAN, Ryan A., MARU, Siddharth, PARIKH, VIRAL
Priority to PCT/GB2022/052395 priority patent/WO2023084180A1/en
Priority to GB2402495.2A priority patent/GB2626678A/en
Assigned to CIRRUS LOGIC, INC. reassignment CIRRUS LOGIC, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14Measuring resistance by measuring current or voltage obtained from a reference source
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/217Class D power amplifiers; Switching amplifiers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08Measuring resistance by measuring both voltage and current
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/16Measuring impedance of element or network through which a current is passing from another source, e.g. cable, power line
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/03Indexing scheme relating to amplifiers the amplifier being designed for audio applications
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/375Circuitry to compensate the offset being present in an amplifier

Definitions

  • the present disclosure relates to circuitry comprising voltage and current monitoring paths.
  • Driver circuitry for driving loads such as audio transducers (e.g. speakers) or haptic transducers (e.g. actuators such as linear resonant actuators) often includes voltage detection (VMON) and current detection (IMON) circuit blocks, for detecting, respectively, a voltage across the load and a current through the load while the transducer is being driven by a playback signal such as an audio signal or a haptic waveform.
  • VMON voltage detection
  • IMON current detection
  • a playback signal is a drive signal that drives the transducer to generate a desired output such as an audio or haptic output.
  • the detected voltage and current can be used to calculate, estimate or otherwise determine an impedance of the transducer, which may be a complex impedance having resistive, inductive and capacitive components.
  • the determined impedance may be used in applications such as speaker protection while the playback signal is being provided to the transducer.
  • FIG. 1 is a schematic diagram showing an example of circuitry that includes voltage and current monitoring paths for monitoring a voltage across a load and a current through the load during operation of the circuitry to drive the load.
  • the circuitry which may be implemented as an integrated circuit (IC), is shown generally at 100 in FIG. 1 .
  • the circuitry 100 includes driver circuitry 110 configured to receive an input signal and to output a drive signal for driving a load 120 external to the IC.
  • driver circuitry 110 may comprise pulse width modulator (PWM) circuitry and class D amplifier circuitry
  • the load 120 which in this example is represented by a series combination of an inductor and a resistor, may be a transducer such as a speaker, an actuator (e.g. a resonant actuator such as a linear resonant actuator) or the like.
  • a transducer such as a speaker
  • an actuator e.g. a resonant actuator such as a linear resonant actuator
  • the circuitry 100 includes first and second terminals (e.g. contact pins, pads, balls or the like) 112 , 114 for coupling the circuitry 100 to the external load 120 .
  • first terminal 112 is coupled to the output of the driver circuitry 110 and the second terminal 114 is coupled to a first terminal of a current sense resistor 130 , such that when the load 120 is coupled to the first and second terminals 112 , 114 , the load 120 is coupled in series between the output of the driver circuitry 110 and the current sense resistor 130 .
  • a voltage monitoring path 140 is coupled to the load 120 .
  • the voltage monitoring path 140 comprises analog front end (AFE) circuitry 142 having inputs that are coupled in parallel with the load 120 and an output that is coupled to an input of analog to digital converter (ADC) circuitry 144 .
  • AFE analog front end
  • ADC analog to digital converter
  • FIG. 1 the AFE circuitry 142 is shown in FIG. 1 as having a single output, but it will be appreciated by those skilled in the art that the AFE circuitry 142 could have differential outputs coupled to inputs of the ADC circuitry 144 .
  • An output of the ADC circuitry 144 of the voltage monitoring path 140 is coupled to a first input of processing circuitry 150 .
  • the current sense resistor 130 is coupled in series with the load 120 (when the load 120 is coupled to the first and second terminals 112 , 114 ). In the illustrated example the current sense resistor 130 is connected in series between the load 120 and common mode buffer circuitry 160 , but it will be appreciated that in some examples the common mode buffer circuitry 160 may be omitted, in which case the current sense resistor 130 may be coupled in series between the load and a ground or 0 v supply node or rail.
  • a current monitoring path 170 is coupled to the current sense resistor 130 .
  • the current monitoring path 170 comprises analog front end (AFE) circuitry 172 having inputs that are coupled in parallel with the current sense resistor 130 and an output that is coupled to an input of analog to digital converter (ADC) circuitry 174 .
  • AFE analog front end
  • ADC analog to digital converter
  • FIG. 1 the AFE circuitry 172 is shown in FIG. 1 as having a single output, but it will be appreciated by those skilled in the art that the AFE circuitry 172 could have differential outputs coupled to inputs of the ADC circuitry 174 .
  • An output of the ADC circuitry 174 of the current monitoring path 170 is coupled to a second input of the processing circuitry 150 .
  • a reference signal of a predefined frequency and amplitude is supplied to the driver circuitry 110 to drive the load 120 .
  • the reference signal may be, for example, a sinusoidal voltage waveform of a predefined peak-to-peak amplitude and a predefined frequency, and may be generated by reference signal generator circuitry 180 , or alternatively may be a stored signal that is retrieved from memory or the like.
  • the voltage monitoring path 140 outputs a signal (e.g. a voltage) V mon indicative of the voltage across the load 120 to the processing circuitry 150
  • the current monitoring path 170 outputs a signal (e.g. a voltage) I mon indicative of the current through the load 120 .
  • the processing circuitry 150 generates an estimate Z est of the impedance of the load 120 based on the signals V mon , I mon received from the voltage monitoring path 140 and the current monitoring path 170 respectively. Additionally, the processing circuitry 150 may generate individual estimates for the resistance and reactance of the load 120 using amplitude and phase information from the signals received from the voltage monitoring path 140 and the current monitoring path 170 , and these estimates may be provided to downstream circuitry (not shown) for further use and/or processing.
  • the estimate Z est of the impedance of the load 120 may be used for a wide range of purposes during normal operation of the circuitry 100 to drive the load based on a drive signal output by the driver circuitry 110 .
  • the estimated impedance Z est may be used, in combination with one or both of the signals V mon , I mon , for estimating the position of a moving mass of the linear resonant actuator.
  • the estimated impedance Z est may be used, in combination with one or both of the signals V mon , I mon , in a speaker protection system to prevent damage to the speaker by limiting its excursion.
  • the invention provides circuitry comprising:
  • the circuitry may be configured to apply the compensation parameter in operation of the circuitry in a load driving mode of operation.
  • the compensation parameter may be a frequency domain compensation parameter.
  • the processing circuitry may comprise:
  • the processing circuitry may comprise a calculation block configured to generate the estimate of the impedance of the reference element based on the first and second frequency domain complex vectors and to compare the generated estimate to the predefined impedance of the reference element.
  • the circuitry may further comprise a compensation block configured to apply the compensation parameter to the first frequency domain complex vector or the second frequency domain complex vector.
  • the calculation block may be configured to calculate a gain mismatch ⁇ by dividing a ratio of the magnitude of the first complex vector to the magnitude of the second complex vector by the magnitude of the predefined impedance, and to calculate a phase mismatch ⁇ by subtracting the phase of a ratio of the first complex vector to the second complex vector from the phase of the predefined impedance.
  • the calculation block may be configured to calculate a first compensation coefficient B R and a second compensation coefficient B I , where:
  • the compensation parameter may comprise a compensation vector comprising the first and second compensation coefficients.
  • the compensation parameter may comprise a compensation vector comprising first and second temperature-dependent compensation coefficients.
  • the calculation block may be configured to select the first and second temperature-dependent compensation coefficients based on a detected temperature.
  • the temperature-dependent compensation coefficients may comprise predefined polynomials.
  • the compensation parameter may be a time domain compensation parameter.
  • the compensation parameter may comprise a parameter of an analog element of the voltage monitoring path or the current monitoring path.
  • the voltage monitoring path and the current monitoring path may each comprise analog front end (AFE) circuitry and analog to digital converter (ADC) circuitry.
  • AFE analog front end
  • ADC analog to digital converter
  • the compensation parameter may comprise a parameter of the AFE circuitry or the ADC circuitry.
  • the compensation parameter may comprise one or more of:
  • the compensation parameter may comprise one or more of:
  • the circuitry may be configured to apply the compensation parameter in operation of the circuitry in the compensation mode of operation.
  • the processing circuitry may be operative to:
  • the reference element may comprise a tantalum nitride resistor.
  • the circuitry may further comprise load selector circuitry for selectively coupling the voltage and current monitoring paths to the reference element or to a load according to the mode of operation of the circuitry.
  • the load selector circuitry may comprise a controllable switch network.
  • the current monitoring path may comprises a plurality of selectable current sense resistors.
  • the processing circuitry may be operative to determine a first compensation parameter with a first one of the plurality selectable current sense resistors selected
  • the processing circuitry may be operable to:
  • the invention provides an integrated circuit comprising circuitry according to the first aspect.
  • the invention provides a host device comprising circuitry according to the first aspect, wherein the host device comprises a laptop, notebook, netbook or tablet computer, a gaming device, a games console, a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player, a portable device, an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a games console a VR or AR device, a mobile telephone, a portable audio player or other portable device.
  • the host device comprises a laptop, notebook, netbook or tablet computer, a gaming device, a games console, a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player, a portable device, an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a games console a VR or AR device, a mobile telephone, a portable audio player or other portable device.
  • FIG. 1 is a schematic representation of circuitry including voltage and current monitoring paths
  • FIG. 2 is a schematic representation of circuitry including voltage and current monitoring paths and compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths;
  • FIG. 3 is a schematic representation of circuitry including voltage and current monitoring paths and alternative compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths;
  • FIG. 4 is a is a schematic diagram illustrating example analog front end (AFE) circuitry for the voltage and/or current monitoring path of the circuitry of FIG. 3 ;
  • FIG. 5 is a schematic representation of is a schematic diagram illustrating an example analog to digital converter (ADC) arrangement.
  • ADC analog to digital converter
  • an estimate Z est of the impedance of the load 120 can be generated by the processing circuitry 150 , e.g. by dividing a value of, or representing, the signal V mon output by the voltage monitoring path 140 by a value of, or representing, the signal I mon output by the current monitoring path 170 .
  • An estimate of the resistance of the load at a given frequency 120 can be generated (e.g., by the processing circuitry 150 ) by taking the real part of the result of this division, i.e., Re(V mon /I mon ) and an estimate of the inductance of the load at a given frequency 120 can be generated (e.g., by the processing circuitry 150 ) by taking the imaginary part of the result of this division, i.e., Im(V mon /I mon ).
  • the voltage monitoring path 140 may apply a gain to the signal received at the inputs of its AFE 142 , such that the digital signal V mon output by the voltage monitoring path 140 is a scaled digital representation of the voltage across the load 120 .
  • the current monitoring path 170 may apply a gain to the signal received at the inputs of its AFE 172 , such that the digital signal I mon output by the current monitoring path 170 is a scaled digital representation of the current through the load 120 .
  • the gain applied by the voltage monitoring path 140 differs from the gain applied by the current monitoring path 170 (i.e., if there is a gain mismatch between the two paths), the accuracy of the estimate Z est of the load impedance, and the accuracy of the estimates of the load resistance and load inductance will be adversely affected, because of the different scaling applied to the voltage across the load 120 and the current through the load 120 as a result of the gain mismatch between the voltage monitoring path 140 and the current monitoring path 170 .
  • FIG. 2 is a schematic representation of circuitry including voltage and current monitoring paths and compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths.
  • the circuitry shown generally at 200 in FIG. 2 , shares some elements in common with the driver circuitry 100 of FIG. 1 , and such common elements are denoted by common reference numerals in FIGS. 1 and 2 , and will not be described again in detail here.
  • the circuitry 200 may be implemented as an integrated circuit (IC), for example.
  • the circuitry 200 is operable in a calibration mode and a load driving mode.
  • the circuitry 200 is operable to measure or otherwise quantify a gain and/or a phase mismatch between a voltage monitoring path 130 and a current monitoring path 170 , and to compensate for any such gain and/or phase mismatch.
  • the circuitry 200 is operable to drive an external load 120 (e.g. a transducer such as a speaker or an actuator) with a drive signal, and to monitor the voltage across the load 120 and the current through the load 120 .
  • an external load 120 e.g. a transducer such as a speaker or an actuator
  • the circuitry 200 includes driver circuitry 110 of the kind described above with reference to FIG. 1 , configured to supply a drive signal to the load 120 during operation of the circuitry 200 in the load driving mode.
  • the circuitry 200 further includes a voltage monitoring path 140 , a current sense resistor 130 and a current monitoring path 170 of the kind described above with reference to FIG. 1 .
  • the circuitry 200 includes load selector circuitry 210 for selectively coupling either the first and second terminals 112 , 114 (and hence the external load 120 ) or a reference element 220 of a predetermined known impedance to the voltage monitoring path 140 and the current sense resistor 130 .
  • the load selector circuitry 210 may comprise, for example, a controllable switch network comprising switches that can be opened or closed to couple either the first and second terminals 112 , 114 or the reference element 210 to the voltage monitoring path 140 and the current sense resistor 130 .
  • Those skilled in the art will readily understand how to implement suitable load selector circuitry 210 .
  • the reference element 220 may have a small temperature coefficient, such that its impedance changes little with temperature, and may have high stability, such that its impedance changes little over time.
  • the reference element 220 may be, for example, a tantalum nitride resistor, which may be integrated into an IC with the other elements of the compensation circuitry 200 .
  • An output of the ADC circuitry 144 of the voltage monitoring path 140 is coupled to a first input of processing circuitry 230 , such that in use of the circuitry 200 during its calibration mode of operation, the voltage monitoring path 140 is configured to output a digital signal V mon indicative of the voltage across the reference element 220 to the processing circuitry 230 .
  • the voltage monitoring path 140 is configured to output a digital signal output a digital signal V mon indicative of the voltage across the load 120 to the processing circuitry 230 .
  • An output of the ADC circuitry 174 of the current monitoring path 170 is coupled to a second input of the processing circuitry 230 , such that in use of the circuitry 200 during its calibration mode of operation, the current monitoring path 170 is configured to output a digital signal I mon indicative of the current through the reference element 220 to the processing circuitry 230 .
  • the current monitoring path 170 is configured to output a digital signal output a digital signal I mon indicative of the current through the load 120 to the processing circuitry 230 .
  • the processing circuitry 230 includes a first discrete Fourier transform (DFT) block 232 , having an input that is coupled to an output of the voltage monitoring path 140 , and a first amplitude/phase compensation block 234 having an input that is coupled to an output of the first DFT block 232 .
  • An output of the first amplitude/phase compensation block 234 is coupled to a first input of a calculation block 250 .
  • DFT discrete Fourier transform
  • the processing circuitry 230 further includes a second DFT block 242 , having an input that is coupled to an output of the current monitoring path 170 , and a second amplitude/phase compensation block 244 having an input that is coupled to an output of the second DFT block 242 .
  • An output of the second amplitude/phase compensation block 234 is coupled to a second input of the calculation block 250 .
  • the compensation circuitry 200 further includes reference signal generator circuitry 260 , which in this example is configured to generate a digital reference signal.
  • An output of the reference signal generator circuitry 260 is coupled to an input of digital to analog converter (DAC) circuitry 270 , which is configured to convert the digital reference signal into an analog reference signal.
  • An output of the DAC circuitry 270 is coupled to a first terminal of the reference element 220 , such that the DAC circuitry 270 supplies the analog reference signal to the reference element 220 .
  • DAC digital to analog converter
  • the load selector circuitry 210 couples the reference element 220 to the voltage monitoring path 140 and the current sense resistor 130 .
  • the reference signal generator circuitry 260 generates a digital reference signal (e.g. a digital representation of a sinusoid) of known amplitude and frequency, which is converted into an analog reference signal by the DAC circuitry 270 and applied to the reference element 220 .
  • a digital signal V mon representing a voltage across the reference element 220 as a result of the applied reference signal is generated by the voltage monitoring path 140 and output to the first DFT block 232 .
  • the first DFT block 232 converts the digital time domain signal V mon into a frequency domain signal V monDFT , which is output to the first amplitude/phase compensation block 234 .
  • a digital signal I mon representing a current through the reference element 220 as a result of the applied reference signal is generated by the current monitoring path 170 and output to the second DFT block 242 .
  • the second DFT block 242 converts the digital time domain signal I mon into a frequency domain signal I monDFT , which is output to the second amplitude/phase compensation block 244 .
  • the calculation block 250 receives the frequency domain signals V monDFT , I monDFT output by the first and second amplitude/phase compensation blocks 234 , 244 and, based on these received signals, calculates an estimate Z est of the impedance of the reference element 220 .
  • the calculation block 250 then compares this estimate of the impedance of the reference element 220 to the predefined impedance Z known of the reference element 220 . If the calculated estimate of the impedance is equal to the predefined impedance (or is within a defined tolerance range around the predefined impedance), the calculation block 250 may determine that there is no gain or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 and thus that no compensation is required.
  • the calculation block 250 may determine that there is a gain and/or a phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 and thus that compensation is required.
  • the calculation block 250 determines, during operation of the circuitry 200 in its calibration mode, compensation coefficients to be applied by the first and/or the second gain and phase compensation blocks 234 , 244 during operation of the circuitry 200 in its load driving mode.
  • the first DFT block 232 generates a frequency domain representation V monDFT of the digital time domain signal V mon .
  • the calculation block 250 calculates a complex impedance vector for the reference element 220 based on the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks 232 , 242 respectively by dividing the first complex vector Vr+jVi by the second complex vector Ir+jli, i.e.
  • the estimated impedance Z est is equal to (or is within a defined tolerance range of) the predefined impedance Z known . If the estimated impedance Z est is not equal to (or is outside a defined tolerance range of) the predefined impedance Z known then a gain or phase mismatch exists between the voltage monitoring path 140 and the current monitoring path 170 .
  • a gain mismatch ⁇ can be defined as a ratio of the amplitude of the signal V mon to the amplitude of the signal I mon when the signals input to the AFE 142 of the voltage monitoring path 140 and to the AFE 172 of the current monitoring path 170 are identical.
  • the gain mismatch ⁇ can be directly calculated by the calculation block 250 from the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks respectively, by dividing a ratio of the magnitude of the first complex vector to the magnitude of the second complex vector by the magnitude of the predefined impedance Z known , i.e.:
  • a phase mismatch ⁇ can be defined as a difference between the phase of the signal V mon and the phase of the signal I mon .
  • the phase mismatch ⁇ can be directly calculated by the calculation block 250 from the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks respectively, by subtracting the phase of a ratio of the first complex vector to the second complex vector from the phase of the predefined impedance Z known , i.e:
  • the time domain signal Vmon can be represented in the frequency domain as a vector product of the first complex vector Vr+jVi (representing the signal in the absence of any gain or phase mismatch) and a mismatch vector ⁇ cos ⁇ +j ⁇ sin ⁇ representing any gain mismatch ⁇ and any phase mismatch ⁇ , i.e.
  • V monDFT ( Vr+jVi )( ⁇ cos ⁇ + j ⁇ sin ⁇ ) (4)
  • Z est (( Vr+jVi )( ⁇ cos ⁇ + j ⁇ sin ⁇ ))/( Ir+jli )
  • Compensation coefficients B R and B I can be calculated by the calculation block 150 as follows:
  • the compensation coefficients B RV and B IV calculated by the calculation block 150 during operation of the circuitry 200 in its calibration mode can be stored and applied, by the first amplitude/phase compensation block, to the complex vector V monDFT generated and output by the first DFT block 232 during operation of the circuitry 200 in its load driving mode to compensate for any gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 .
  • the compensation vector B RV +jB IV applied to the complex vector V monDFT has the effect of rotating the vector V monDFT to compensate for the gain and/or phase mismatch.
  • the first amplitude/phase compensation block 234 may be said to perform vector rotation on the vector V monDFT .
  • This vector rotation operation improves the accuracy of the estimate Z est of the load impedance and the accuracy of any estimate of the resistance and/or inductance of the load 120 generated by the calculation block 250 during operation of the circuitry 200 in its load driving mode.
  • the compensation coefficients B RV and B IV described above are applied by the first amplitude/phase compensation block 234 to the frequency domain representation of the signal output by the voltage monitoring path 140 .
  • compensation coefficients B RI and B II to be applied by the second amplitude/phase compensation block 244 to the frequency domain representation of the signal output by the current monitoring path 170 could be generated by the calculation block 250 using a process similar to that described above.
  • Such compensation coefficients B RI and B II could be applied instead of or in addition to the compensation coefficients B RV and B IV during operation of the circuitry 200 in its load driving mode to perform vector rotation of the vector I monDFT .
  • the gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 may vary with temperature.
  • temperature-dependent compensation coefficients may be defined:
  • the temperature-dependent compensation coefficients may be predefined and stored, e.g. in a memory 280 that forms part of the circuitry 200 or a host device incorporating the circuitry 200 .
  • the appropriate temperature-dependent compensation coefficient for the prevailing temperature T (as detected, for example, by a temperature sensor 290 that forms part of the circuitry 200 or a host device incorporating the circuitry 200 ) may then be selected retrieved by the calculation block 250 and used to determine or generate the compensation parameter (i.e. the compensation vector) to be applied by the first and/or second amplitude/phase compensation blocks 234 , 244 to compensate for a detected gain and/or phase mismatch.
  • gain and or/phase mismatch compensation is performed digitally in the frequency domain, by determining, during operation of the circuitry 200 in its calibration mode, one or more compensation parameters (which in this example are the compensation coefficients B RV and B IV and/or B RI and B II ) for compensating for a difference between the estimated impedance Z est and the predefined impedance Z known of the reference load 220 , and applying the determined compensation parameter(s) during operation of the circuitry 200 in its load driving mode.
  • one or more compensation parameters which in this example are the compensation coefficients B RV and B IV and/or B RI and B II .
  • gain and/or phase mismatch compensation may be performed in the time domain.
  • FIG. 3 is a schematic representation of circuitry including voltage and current monitoring paths and alternative compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths.
  • the circuitry shown generally at 300 in FIG. 3 , shares some elements in common with the driver circuitry 200 of FIG. 2 , and such common elements are denoted by common reference numerals in FIGS. 2 and 3 , and will not be described again in detail here.
  • the circuitry 300 may be implemented as an integrated circuit (IC), for example.
  • the circuitry 300 differs from the circuitry 200 in that its compensation circuitry 330 does not include first and second amplitude/phase compensation blocks.
  • the outputs of the first and second DFT blocks 232 , 242 are coupled directly to inputs of the calculation block 250 .
  • the calculation block 250 is configured to determine, based on a difference between the estimated impedance Z est of the reference load 220 (which is determined based on the signals V monDFT and I monDFT output by the first and second DFT blocks 232 , 242 as described above) and the predefined impedance Z known of the reference load 220 , one or more compensation parameters to be applied to analog elements of the voltage monitoring path 130 and/or the current monitoring path 170 .
  • the analog front end (AFE) circuitry 142 , 172 of the voltage and current monitoring paths 140 , 170 may include filter circuitry for attenuating out-of-band components.
  • the AFE circuitry 142 , 172 may include filter circuitry for attenuating components of the drive signal output by the driver circuitry 110 that are outside of the audio frequency range, e.g. components above 20 kHz.
  • the filter circuitry in the AFE circuitry 142 , 172 may also act as an anti-aliasing filter for the ADC circuitry 144 , 172 .
  • the circuitry 200 , 300 may include one or more additional current sense resistors, e.g., additional current sense resistors 130 - 1 , 130 - n (shown in dashed outline in FIGS. 2 and 3 ) that can be selectively coupled to the current monitoring path 170 in place of or in addition to the current sense resistor 130 (e.g., by means of suitable switches) for use in different applications of the circuitry 200 , 300 and/or with different loads 120 .
  • additional current sense resistors e.g., additional current sense resistors 130 - 1 , 130 - n (shown in dashed outline in FIGS. 2 and 3 ) that can be selectively coupled to the current monitoring path 170 in place of or in addition to the current sense resistor 130 (e.g., by means of suitable switches) for use in different applications of the circuitry 200 , 300 and/or with different loads 120 .
  • a first one 130 - 1 of the additional current sense resistors may be selected and coupled to the current monitoring path 170 in place of the current sense resistor 130 when a first load 120 (e.g., a speaker) is coupled to the circuitry 200 , 300
  • a different one 130 - n of the additional current sense resistors may be selected and coupled to the current monitoring path 170 when a different load 120 is coupled to the circuitry 200 , 300 .
  • one of the additional current sense resistors 130 - 1 , 130 - n may be selected in place of (or in addition to) the current sense resistor 130 after calibration of the circuitry 200 , 300 using the reference element 220 as described above, and after a first estimate of the impedance of the load 120 has been determined by the calculation block 250 during operation of the circuitry 200 , 300 in its load driving mode.
  • any difference between first estimate of the impedance of the load 120 and a second estimate of the impedance of the same load 120 subsequently calculated by the calculation block 250 during operation of the circuitry 200 , 300 in its load driving mode would be due to a gain error introduced by the selected additional current sense resistor 130 - 1 , 130 - n .
  • the circuitry 200 , 300 could perform an on the fly calibration operation with the load 120 in the manner described above, to compensate for any gain or phase mismatch that may have been introduced as a result of selecting the additional current sense resistor 130 - 1 , 130 - n.
  • FIG. 4 is a schematic diagram illustrating example AFE circuitry 142 for the voltage monitoring path 140 of the circuitry 300 .
  • the AFE circuitry 172 of the current monitoring path 170 may have the same configuration.
  • the AFE circuitry 142 in this example comprises amplifier circuitry 410 having first and second inputs configured to be coupled to the load 120 or reference load 220 (depending on the operating mode of the circuitry 300 .
  • a feedback arrangement is provided by an input resistor 412 coupled to a first input of the amplifier circuitry 410 and a feedback resistor 414 coupled between an output of the amplifier circuitry 410 and the input resistor 412 .
  • a gain of the amplifier circuitry 410 is dependent upon a ratio of the resistance of feedback resistor 414 to the resistance of the input resistor 412 .
  • the resistance of the feedback resistor 414 may be variable to permit adjustment of the gain of the amplifier circuitry 414 .
  • the feedback resistor 414 may be implemented by a metal-oxide semiconductor (MOS) device whose drain-source resistance can be adjusted by adjusting a voltage applied to the gate of the MOS device.
  • MOS metal-oxide semiconductor
  • the feedback resistor 414 may be implemented as a switched resistor arrangement comprising a plurality of switched resistors coupled in parallel, such that the total resistance of the switched resistor arrangement can be controlled by selectively opening and closing switches associated with the individual resistors.
  • the resistance of the input resistor 412 may be variable to permit adjustment of the gain of the amplifier circuitry 414 .
  • a variable input resistor be implemented by a metal-oxide semiconductor (MOS) device or a switched resistor arrangement of the kind described above.
  • Filter circuitry 420 is coupled to an output of the amplifier circuitry 410 .
  • the filter circuitry 420 comprises a resistor 422 having a first terminal coupled to an input of the filter circuitry 420 and a second terminal coupled to an output of the filter circuitry 420 , and a capacitor 424 coupled between the second terminal of the resistor 422 and a ground or 0 v connection. It will be appreciated, however, that other configurations of filter circuitry could be employed.
  • the frequency and phase response of the filter circuitry 420 are determined by the resistance of the resistor 422 and the capacitance of the capacitor 424 .
  • the resistance of the resistor 422 and the capacitance of the capacitor 424 may be variable to permit adjustment of the frequency and phase response of the filter circuitry 420 .
  • the resistor 422 may be implemented by a MOS device or a switched resistor arrangement of the kind described above.
  • the capacitor 424 may be implemented by a switched capacitor arrangement comprising a plurality of switched capacitors coupled in parallel, such that the total capacitance of the switched capacitor arrangement can be controlled by selectively opening and closing switches associated with the individual capacitors.
  • a transconductance of the amplifier circuitry 410 may be variable so as to adjust the bandwidth of the AFE circuitry 142 . Adjusting the bandwidth of the AFE circuitry 142 also changes the position of poles in the phase response of the AFE circuitry 142 .
  • FIG. 5 is a schematic diagram illustrating an example ADC arrangement for the ADC circuitry 144 of the voltage monitoring path 140 of the circuitry 300 .
  • the ADC circuitry 174 of the current monitoring path 170 may have the same configuration.
  • the ADC circuitry 144 receives a reference voltage V ref , which in this example is provided by low dropout regulator (LDO) circuitry 510 .
  • LDO low dropout regulator
  • the gain of the ADC circuitry 144 can be adjusted.
  • the calculation block 250 is configured to determine, based on a difference between the estimated impedance Z est of the reference load 220 and the predefined impedance Z known of the reference load 220 , one or more compensation parameters to be applied to analog elements of the voltage monitoring path 130 and/or the current monitoring path 170 .
  • the calculation block 250 may determine a capacitance of the capacitor 424 and/or a resistance of the resistor 422 of the filter circuitry 420 required to move a pole of the phase response of the filter circuitry 420 to compensate for the phase mismatch, and may output appropriate control signals to the filter circuitry 420 to adjust the capacitance of the capacitor 424 and/or the resistance of the resistor 422 accordingly.
  • the calculation block 250 may determine a transconductance of the amplifier circuitry 410 of the AFE circuitry 142 required to move a pole of the phase response of the AFE circuitry 142 to compensate for the phase mismatch.
  • the calculation block 250 may determine a resistance of the feedback resistor 414 and/or a resistance of the input resistor 412 required to adjust the gain of the AFE circuitry 142 , and may output appropriate control signals to the AFE circuitry 142 to adjust the resistance of the feedback resistor 414 and/or the input resistor 412 accordingly.
  • the calculation block 250 may determine a reference voltage V ref to be applied to the ADC circuitry 144 to adjust the gain of the ADC 144 to compensate for the gain mismatch, and may output appropriate control signals to the LDO circuitry 510 (or other circuitry that supplies the reference voltage V ref to the ADC circuitry 144 ) to adjust the reference voltage V ref accordingly.
  • calculation circuitry 250 is described as determining compensation parameters that are be applied to analog elements of the voltage monitoring path 140 , but it will be appreciated by those skilled in the art that the calculation circuitry 250 could, alternatively or additionally, determine compensation parameters that are applied to analog elements of the current monitoring path 170 .
  • the circuitry 200 , 300 may perform a verification cycle to confirm that the applied compensation parameter(s) have achieved the desired compensation effect.
  • the reference signal may again be applied to the reference element 220 , and the calculation block 250 may determine an estimated impedance Z est of the reference load 220 , based on the signals output by the first and second DFT blocks 232 , 242 .
  • This estimated impedance Z est is then compared by the calculation block 250 to the predefined impedance Z known of the reference element 220 . If the estimated impedance Z est is equal to (or is within a defined tolerance range of) the predefined impedance Z known , the compensation parameters that have been applied have achieved the desired compensation effect, and the circuitry 200 , 300 can now switch to operation in its load driving mode.
  • the estimated impedance Z est is not equal to (or is outside a defined tolerance range of) the predefined impedance Z known then a gain or phase mismatch still exists between the voltage monitoring path 140 and the current monitoring path 170 , and new compensation parameters may be calculated in the manner described above.
  • the circuitry 200 , 300 may be configured to perform calibration in the manner described above in response to particular trigger events, e.g. on start-up or power on of the circuitry 200 , 300 or in response to a change in operating conditions, e.g. a change in ambient temperature, supply voltage or the like. Additionally or alternatively, the circuitry may be configured to perform calibration in the manner described above periodically or in accordance with a predefined schedule.
  • determining one or more compensation parameters and applying the determined compensation parameter(s) in operation of the circuitry 200 , 300 in its load driving mode of operation improves the accuracy of an estimate Z est of the load impedance and the accuracy of any estimate of the resistance and/or inductance of the load 120 generated by the calculation block 250 during operation of the circuitry 200 , 300 in its load driving mode, as any gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 is compensated for by the application of the compensation parameter(s).
  • circuitry described above with reference to the accompanying drawings may be incorporated in a host device such as a laptop, notebook, netbook or tablet computer, a gaming device such as a games console or a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player or some other portable device, or may be incorporated in an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a VR or AR device, a mobile telephone, a portable audio player or other portable device.
  • a host device such as a laptop, notebook, netbook or tablet computer
  • a gaming device such as a games console or a controller for a games console
  • VR virtual reality
  • AR augmented reality
  • processor control code for example on a non-volatile carrier medium such as a disk, CD- or DVD-ROM, programmed memory such as read only memory (Firmware), or on a data carrier such as an optical or electrical signal carrier.
  • a non-volatile carrier medium such as a disk, CD- or DVD-ROM
  • programmed memory such as read only memory (Firmware)
  • a data carrier such as an optical or electrical signal carrier.
  • embodiments will be implemented on a DSP (Digital Signal Processor), ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array).
  • the code may comprise conventional program code or microcode or, for example code for setting up or controlling an ASIC or FPGA.
  • the code may also comprise code for dynamically configuring re-configurable apparatus such as re-programmable logic gate arrays.
  • the code may comprise code for a hardware description language such as VerilogTM or VHDL (Very high speed integrated circuit Hardware Description Language).
  • VerilogTM Very high speed integrated circuit Hardware Description Language
  • VHDL Very high speed integrated circuit Hardware Description Language
  • the code may be distributed between a plurality of coupled components in communication with one another.
  • the embodiments may also be implemented using code running on a field-(re)programmable analogue array or similar device in order to configure analogue hardware.
  • references in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Accordingly, modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the systems and apparatuses may be integrated or separated.
  • each refers to each member of a set or each member of a subset of a set.

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Abstract

Circuitry comprising: a voltage monitoring path; a current monitoring path; a reference element of a predefined impedance; and processing circuitry, wherein in operation of the circuitry in a calibration mode of operation: the voltage monitoring path is operative to output a signal indicative of a voltage across the reference element in response to a reference signal applied to the reference element; the current monitoring path is operative to output a signal indicative of a current through the reference element in response to the reference signal; and the processing circuitry is operative to: receive the signal indicative of the voltage across the reference element and the signal indicative of the current through the reference element; generate an estimate of an impedance of the reference element; and determine a compensation parameter for an element of the circuitry for compensating for a difference between the estimate of the impedance and the predefined impedance of the reference element.

Description

    FIELD OF THE INVENTION
  • The present disclosure relates to circuitry comprising voltage and current monitoring paths.
  • BACKGROUND
  • Driver circuitry for driving loads such as audio transducers (e.g. speakers) or haptic transducers (e.g. actuators such as linear resonant actuators) often includes voltage detection (VMON) and current detection (IMON) circuit blocks, for detecting, respectively, a voltage across the load and a current through the load while the transducer is being driven by a playback signal such as an audio signal or a haptic waveform. In this context, a playback signal is a drive signal that drives the transducer to generate a desired output such as an audio or haptic output.
  • The detected voltage and current can be used to calculate, estimate or otherwise determine an impedance of the transducer, which may be a complex impedance having resistive, inductive and capacitive components. The determined impedance may be used in applications such as speaker protection while the playback signal is being provided to the transducer.
  • FIG. 1 is a schematic diagram showing an example of circuitry that includes voltage and current monitoring paths for monitoring a voltage across a load and a current through the load during operation of the circuitry to drive the load.
  • The circuitry, which may be implemented as an integrated circuit (IC), is shown generally at 100 in FIG. 1 . The circuitry 100 includes driver circuitry 110 configured to receive an input signal and to output a drive signal for driving a load 120 external to the IC.
  • In some examples the driver circuitry 110 may comprise pulse width modulator (PWM) circuitry and class D amplifier circuitry
  • The load 120, which in this example is represented by a series combination of an inductor and a resistor, may be a transducer such as a speaker, an actuator (e.g. a resonant actuator such as a linear resonant actuator) or the like.
  • The circuitry 100 includes first and second terminals (e.g. contact pins, pads, balls or the like) 112, 114 for coupling the circuitry 100 to the external load 120. In the illustrated example the first terminal 112 is coupled to the output of the driver circuitry 110 and the second terminal 114 is coupled to a first terminal of a current sense resistor 130, such that when the load 120 is coupled to the first and second terminals 112, 114, the load 120 is coupled in series between the output of the driver circuitry 110 and the current sense resistor 130.
  • A voltage monitoring path 140 is coupled to the load 120. In the illustrated example the voltage monitoring path 140 comprises analog front end (AFE) circuitry 142 having inputs that are coupled in parallel with the load 120 and an output that is coupled to an input of analog to digital converter (ADC) circuitry 144. For clarity the AFE circuitry 142 is shown in FIG. 1 as having a single output, but it will be appreciated by those skilled in the art that the AFE circuitry 142 could have differential outputs coupled to inputs of the ADC circuitry 144. An output of the ADC circuitry 144 of the voltage monitoring path 140 is coupled to a first input of processing circuitry 150.
  • The current sense resistor 130 is coupled in series with the load 120 (when the load 120 is coupled to the first and second terminals 112, 114). In the illustrated example the current sense resistor 130 is connected in series between the load 120 and common mode buffer circuitry 160, but it will be appreciated that in some examples the common mode buffer circuitry 160 may be omitted, in which case the current sense resistor 130 may be coupled in series between the load and a ground or 0 v supply node or rail.
  • A current monitoring path 170 is coupled to the current sense resistor 130. In this example the current monitoring path 170 comprises analog front end (AFE) circuitry 172 having inputs that are coupled in parallel with the current sense resistor 130 and an output that is coupled to an input of analog to digital converter (ADC) circuitry 174. Again, for clarity the AFE circuitry 172 is shown in FIG. 1 as having a single output, but it will be appreciated by those skilled in the art that the AFE circuitry 172 could have differential outputs coupled to inputs of the ADC circuitry 174. An output of the ADC circuitry 174 of the current monitoring path 170 is coupled to a second input of the processing circuitry 150.
  • To estimate the impedance of the load 120, a reference signal of a predefined frequency and amplitude is supplied to the driver circuitry 110 to drive the load 120. The reference signal may be, for example, a sinusoidal voltage waveform of a predefined peak-to-peak amplitude and a predefined frequency, and may be generated by reference signal generator circuitry 180, or alternatively may be a stored signal that is retrieved from memory or the like.
  • While the load 120 is being driven by the driver circuitry 110 based on the reference signal, the voltage monitoring path 140 outputs a signal (e.g. a voltage) Vmon indicative of the voltage across the load 120 to the processing circuitry 150, and the current monitoring path 170 outputs a signal (e.g. a voltage) Imon indicative of the current through the load 120.
  • The processing circuitry 150 generates an estimate Zest of the impedance of the load 120 based on the signals Vmon, Imon received from the voltage monitoring path 140 and the current monitoring path 170 respectively. Additionally, the processing circuitry 150 may generate individual estimates for the resistance and reactance of the load 120 using amplitude and phase information from the signals received from the voltage monitoring path 140 and the current monitoring path 170, and these estimates may be provided to downstream circuitry (not shown) for further use and/or processing.
  • The estimate Zest of the impedance of the load 120 may be used for a wide range of purposes during normal operation of the circuitry 100 to drive the load based on a drive signal output by the driver circuitry 110.
  • For example, if the load 120 is a linear resonant actuator the estimated impedance Zest may be used, in combination with one or both of the signals Vmon, Imon, for estimating the position of a moving mass of the linear resonant actuator.
  • Similarly, if the load 120 is a speaker the estimated impedance Zest may be used, in combination with one or both of the signals Vmon, Imon, in a speaker protection system to prevent damage to the speaker by limiting its excursion.
  • Typically such applications require a high degree of accuracy in the estimated impedance Zest.
  • SUMMARY
  • According to a first aspect, the invention provides circuitry comprising:
      • a voltage monitoring path;
      • a current monitoring path;
      • a reference element of a predefined impedance; and
      • processing circuitry,
        wherein in operation of the circuitry in a calibration mode of operation:
      • the voltage monitoring path is operative to output a signal indicative of a voltage across the reference element in response to a reference signal applied to the reference element;
      • the current monitoring path is operative to output a signal indicative of a current through the reference element in response to the reference signal; and
      • the processing circuitry is operative to:
        • receive the signal indicative of the voltage across the reference element and the signal indicative of the current through the reference element;
        • generate an estimate of an impedance of the reference element; and
        • determine a compensation parameter for an element of the circuitry for compensating for a difference between the estimate of the impedance and the predefined impedance of the reference element.
  • The circuitry may be configured to apply the compensation parameter in operation of the circuitry in a load driving mode of operation.
  • The compensation parameter may be a frequency domain compensation parameter.
  • The processing circuitry may comprise:
      • a first conversion block for converting the signal indicative of the voltage across the reference element into a first frequency domain complex vector; and
      • a second conversion block for converting the signal indicative of the current through the reference element into a second frequency domain complex vector.
  • The processing circuitry may comprise a calculation block configured to generate the estimate of the impedance of the reference element based on the first and second frequency domain complex vectors and to compare the generated estimate to the predefined impedance of the reference element.
  • The circuitry may further comprise a compensation block configured to apply the compensation parameter to the first frequency domain complex vector or the second frequency domain complex vector.
  • The calculation block may be configured to calculate a gain mismatch β by dividing a ratio of the magnitude of the first complex vector to the magnitude of the second complex vector by the magnitude of the predefined impedance, and to calculate a phase mismatch ϕ by subtracting the phase of a ratio of the first complex vector to the second complex vector from the phase of the predefined impedance.
  • The calculation block may be configured to calculate a first compensation coefficient BR and a second compensation coefficient BI, where:
  • B R = 1 β cos Φ ; and B I = - 1 β sin Φ ,
  • and the compensation parameter may comprise a compensation vector comprising the first and second compensation coefficients.
  • The compensation parameter may comprise a compensation vector comprising first and second temperature-dependent compensation coefficients.
  • The calculation block may be configured to select the first and second temperature-dependent compensation coefficients based on a detected temperature.
  • The temperature-dependent compensation coefficients may comprise predefined polynomials.
  • The compensation parameter may be a time domain compensation parameter.
  • The compensation parameter may comprise a parameter of an analog element of the voltage monitoring path or the current monitoring path.
  • The voltage monitoring path and the current monitoring path may each comprise analog front end (AFE) circuitry and analog to digital converter (ADC) circuitry.
  • The compensation parameter may comprise a parameter of the AFE circuitry or the ADC circuitry.
  • The compensation parameter may comprise one or more of:
      • a resistance of a resistor of filter circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path;
      • a capacitance of a capacitor of filter circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path; and
      • a transconductance of amplifier circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path.
  • The compensation parameter may comprise one or more of:
      • a resistance of a resistor of a feedback network of amplifier circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path; and
      • a reference voltage for the ADC circuitry of the voltage monitoring path or the current monitoring path.
  • The circuitry may be configured to apply the compensation parameter in operation of the circuitry in the compensation mode of operation.
  • The processing circuitry may be operative to:
      • with the compensation parameter applied, generate an estimate of an impedance of the reference element; and
      • compare the estimate of the impedance and the predefined impedance of the reference element.
  • The reference element may comprise a tantalum nitride resistor.
  • The circuitry may further comprise load selector circuitry for selectively coupling the voltage and current monitoring paths to the reference element or to a load according to the mode of operation of the circuitry.
  • The load selector circuitry may comprise a controllable switch network.
  • The current monitoring path may comprises a plurality of selectable current sense resistors.
  • In the calibration mode, the processing circuitry may be operative to determine a first compensation parameter with a first one of the plurality selectable current sense resistors selected
  • In a load driving mode of operation of the circuitry, the processing circuitry may be operable to:
      • generate a first estimate of an impedance of a load coupled to the circuitry with the first one of the plurality selectable current sense resistors selected; and
      • determine a second compensation parameter if a second estimate of the impedance of the load generated by the processing circuitry with a second one of the of the plurality of selectable current sense resistors selected differs from the first estimate of the impedance of the load.
  • According to a second aspect, the invention provides an integrated circuit comprising circuitry according to the first aspect.
  • According to a third aspect, the invention provides a host device comprising circuitry according to the first aspect, wherein the host device comprises a laptop, notebook, netbook or tablet computer, a gaming device, a games console, a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player, a portable device, an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a games console a VR or AR device, a mobile telephone, a portable audio player or other portable device.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Embodiments of the invention will now be described, strictly by way of example only, with reference to the accompanying drawings, of which:
  • FIG. 1 is a schematic representation of circuitry including voltage and current monitoring paths;
  • FIG. 2 is a schematic representation of circuitry including voltage and current monitoring paths and compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths;
  • FIG. 3 is a schematic representation of circuitry including voltage and current monitoring paths and alternative compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths;
  • FIG. 4 is a is a schematic diagram illustrating example analog front end (AFE) circuitry for the voltage and/or current monitoring path of the circuitry of FIG. 3 ; and
  • FIG. 5 is a schematic representation of is a schematic diagram illustrating an example analog to digital converter (ADC) arrangement.
  • DETAILED DESCRIPTION
  • In circuitry of the kind described above with reference to FIG. 1 , an estimate Zest of the impedance of the load 120 can be generated by the processing circuitry 150, e.g. by dividing a value of, or representing, the signal Vmon output by the voltage monitoring path 140 by a value of, or representing, the signal Imon output by the current monitoring path 170. An estimate of the resistance of the load at a given frequency 120 can be generated (e.g., by the processing circuitry 150) by taking the real part of the result of this division, i.e., Re(Vmon/Imon) and an estimate of the inductance of the load at a given frequency 120 can be generated (e.g., by the processing circuitry 150) by taking the imaginary part of the result of this division, i.e., Im(Vmon/Imon).
  • The voltage monitoring path 140 may apply a gain to the signal received at the inputs of its AFE 142, such that the digital signal Vmon output by the voltage monitoring path 140 is a scaled digital representation of the voltage across the load 120. Similarly, the current monitoring path 170 may apply a gain to the signal received at the inputs of its AFE 172, such that the digital signal Imon output by the current monitoring path 170 is a scaled digital representation of the current through the load 120.
  • If the gain applied by the voltage monitoring path 140 differs from the gain applied by the current monitoring path 170 (i.e., if there is a gain mismatch between the two paths), the accuracy of the estimate Zest of the load impedance, and the accuracy of the estimates of the load resistance and load inductance will be adversely affected, because of the different scaling applied to the voltage across the load 120 and the current through the load 120 as a result of the gain mismatch between the voltage monitoring path 140 and the current monitoring path 170.
  • Similarly, if a phase shift imparted by the voltage monitoring path 140 differs from a phase shift imparted by the current monitoring path 170, the accuracy of the estimates of the load resistance and load inductance will be adversely affected.
  • Thus, to generate accurate estimates of the load impedance, load resistance and load inductance, it is necessary to compensate for any gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 of the circuitry 100.
  • FIG. 2 is a schematic representation of circuitry including voltage and current monitoring paths and compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths.
  • The circuitry, shown generally at 200 in FIG. 2 , shares some elements in common with the driver circuitry 100 of FIG. 1 , and such common elements are denoted by common reference numerals in FIGS. 1 and 2 , and will not be described again in detail here. The circuitry 200 may be implemented as an integrated circuit (IC), for example.
  • The circuitry 200 is operable in a calibration mode and a load driving mode. In the calibration mode the circuitry 200 is operable to measure or otherwise quantify a gain and/or a phase mismatch between a voltage monitoring path 130 and a current monitoring path 170, and to compensate for any such gain and/or phase mismatch. In the load driving mode the circuitry 200 is operable to drive an external load 120 (e.g. a transducer such as a speaker or an actuator) with a drive signal, and to monitor the voltage across the load 120 and the current through the load 120.
  • Thus the circuitry 200 includes driver circuitry 110 of the kind described above with reference to FIG. 1 , configured to supply a drive signal to the load 120 during operation of the circuitry 200 in the load driving mode. The circuitry 200 further includes a voltage monitoring path 140, a current sense resistor 130 and a current monitoring path 170 of the kind described above with reference to FIG. 1 .
  • The circuitry 200 includes load selector circuitry 210 for selectively coupling either the first and second terminals 112, 114 (and hence the external load 120) or a reference element 220 of a predetermined known impedance to the voltage monitoring path 140 and the current sense resistor 130. The load selector circuitry 210 may comprise, for example, a controllable switch network comprising switches that can be opened or closed to couple either the first and second terminals 112, 114 or the reference element 210 to the voltage monitoring path 140 and the current sense resistor 130. Those skilled in the art will readily understand how to implement suitable load selector circuitry 210.
  • The reference element 220 may have a small temperature coefficient, such that its impedance changes little with temperature, and may have high stability, such that its impedance changes little over time. In some examples the reference element 220 may be, for example, a tantalum nitride resistor, which may be integrated into an IC with the other elements of the compensation circuitry 200.
  • An output of the ADC circuitry 144 of the voltage monitoring path 140 is coupled to a first input of processing circuitry 230, such that in use of the circuitry 200 during its calibration mode of operation, the voltage monitoring path 140 is configured to output a digital signal Vmon indicative of the voltage across the reference element 220 to the processing circuitry 230. During operation of the circuitry 200 in its load driving mode the voltage monitoring path 140 is configured to output a digital signal output a digital signal Vmon indicative of the voltage across the load 120 to the processing circuitry 230.
  • An output of the ADC circuitry 174 of the current monitoring path 170 is coupled to a second input of the processing circuitry 230, such that in use of the circuitry 200 during its calibration mode of operation, the current monitoring path 170 is configured to output a digital signal Imon indicative of the current through the reference element 220 to the processing circuitry 230. During operation of the circuitry 200 in its load driving mode the current monitoring path 170 is configured to output a digital signal output a digital signal Imon indicative of the current through the load 120 to the processing circuitry 230.
  • The processing circuitry 230 includes a first discrete Fourier transform (DFT) block 232, having an input that is coupled to an output of the voltage monitoring path 140, and a first amplitude/phase compensation block 234 having an input that is coupled to an output of the first DFT block 232. An output of the first amplitude/phase compensation block 234 is coupled to a first input of a calculation block 250.
  • The processing circuitry 230 further includes a second DFT block 242, having an input that is coupled to an output of the current monitoring path 170, and a second amplitude/phase compensation block 244 having an input that is coupled to an output of the second DFT block 242. An output of the second amplitude/phase compensation block 234 is coupled to a second input of the calculation block 250.
  • The compensation circuitry 200 further includes reference signal generator circuitry 260, which in this example is configured to generate a digital reference signal. An output of the reference signal generator circuitry 260 is coupled to an input of digital to analog converter (DAC) circuitry 270, which is configured to convert the digital reference signal into an analog reference signal. An output of the DAC circuitry 270 is coupled to a first terminal of the reference element 220, such that the DAC circuitry 270 supplies the analog reference signal to the reference element 220. It will be appreciated by those skilled in the art that the digital reference signal generator circuitry 250 and the DAC circuitry 270 could be replaced, in other examples, with analog reference signal generator circuitry.
  • In operation of the circuitry 200 in its calibration mode, the load selector circuitry 210 couples the reference element 220 to the voltage monitoring path 140 and the current sense resistor 130. The reference signal generator circuitry 260 generates a digital reference signal (e.g. a digital representation of a sinusoid) of known amplitude and frequency, which is converted into an analog reference signal by the DAC circuitry 270 and applied to the reference element 220.
  • A digital signal Vmon representing a voltage across the reference element 220 as a result of the applied reference signal is generated by the voltage monitoring path 140 and output to the first DFT block 232. The first DFT block 232 converts the digital time domain signal Vmon into a frequency domain signal VmonDFT, which is output to the first amplitude/phase compensation block 234.
  • Similarly, a digital signal Imon representing a current through the reference element 220 as a result of the applied reference signal is generated by the current monitoring path 170 and output to the second DFT block 242. The second DFT block 242 converts the digital time domain signal Imon into a frequency domain signal ImonDFT, which is output to the second amplitude/phase compensation block 244.
  • The calculation block 250 receives the frequency domain signals VmonDFT, ImonDFT output by the first and second amplitude/phase compensation blocks 234, 244 and, based on these received signals, calculates an estimate Zest of the impedance of the reference element 220. The calculation block 250 then compares this estimate of the impedance of the reference element 220 to the predefined impedance Zknown of the reference element 220. If the calculated estimate of the impedance is equal to the predefined impedance (or is within a defined tolerance range around the predefined impedance), the calculation block 250 may determine that there is no gain or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 and thus that no compensation is required.
  • On the other hand, if the calculated estimate of the impedance is not equal to the predefined impedance (or is not within a defined tolerance range around the predefined impedance), the calculation block 250 may determine that there is a gain and/or a phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 and thus that compensation is required.
  • To compensate for the gain and/or phase mismatch the calculation block 250 determines, during operation of the circuitry 200 in its calibration mode, compensation coefficients to be applied by the first and/or the second gain and phase compensation blocks 234, 244 during operation of the circuitry 200 in its load driving mode.
  • As noted above, the first DFT block 232 generates a frequency domain representation VmonDFT of the digital time domain signal Vmon. In this example the first DFT block 232 generates a first complex vector VmonDFT=Vr+jVi representing the digital time domain signal Vmon output by the voltage monitoring path 140. Similarly, the second DFT block 242 in this example generates a second complex vector ImonDFT=Ir+jli representing the digital time domain signal Imon output by the current monitoring path 170.
  • The calculation block 250 calculates a complex impedance vector for the reference element 220 based on the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks 232, 242 respectively by dividing the first complex vector Vr+jVi by the second complex vector Ir+jli, i.e.

  • Z est=(Vr+jVi)/(Ir+jli)  (1)
  • If there is no gain or phase mismatch, the estimated impedance Zest is equal to (or is within a defined tolerance range of) the predefined impedance Zknown. If the estimated impedance Zest is not equal to (or is outside a defined tolerance range of) the predefined impedance Zknown then a gain or phase mismatch exists between the voltage monitoring path 140 and the current monitoring path 170.
  • A gain mismatch β can be defined as a ratio of the amplitude of the signal Vmon to the amplitude of the signal Imon when the signals input to the AFE 142 of the voltage monitoring path 140 and to the AFE 172 of the current monitoring path 170 are identical. The gain mismatch β can be directly calculated by the calculation block 250 from the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks respectively, by dividing a ratio of the magnitude of the first complex vector to the magnitude of the second complex vector by the magnitude of the predefined impedance Zknown, i.e.:

  • β=(|Vr+jVi|/|Ir+jli|)/|Z known|  (2)
  • A phase mismatch ϕ can be defined as a difference between the phase of the signal Vmon and the phase of the signal Imon. The phase mismatch ϕ can be directly calculated by the calculation block 250 from the first and second complex vectors Vr+jVi, Ir+jli output by the first and second DFT blocks respectively, by subtracting the phase of a ratio of the first complex vector to the second complex vector from the phase of the predefined impedance Zknown, i.e:

  • ϕ=ϕZ known−(Vr+jVi)/(Ir+jli)  (3)
  • Thus, if a gain and/or phase mismatch exists between the voltage monitoring path 140 and the current monitoring path 170, then the time domain signal Vmon can be represented in the frequency domain as a vector product of the first complex vector Vr+jVi (representing the signal in the absence of any gain or phase mismatch) and a mismatch vector β cos ϕ+jβ sin ϕ representing any gain mismatch β and any phase mismatch ϕ, i.e.

  • V monDFT=(Vr+jVi)(β cos ϕ+jβ sin ϕ)  (4)
  • The complex impedance estimate output by the calculation block 250 would thus be

  • Z est=((Vr+jVi)(β cos ϕ+jβ sin ϕ))/(Ir+jli)
  • In order to compensate for the gain and/or phase mismatch, the (β cos ϕ-jβ sin ϕ) term in Zest must be cancelled.
  • Compensation coefficients BR and BI can be calculated by the calculation block 150 as follows:
  • B R = 1 β cos Φ B I = - 1 β sin Φ
  • These compensation coefficients can then be applied to the complex vector VmonDFT output by the first DFT block 232 by the first amplitude/phase compensation block 234 to generate a compensated complex vector Vmoncmp in which any gain and/or phase mismatch is compensated, by multiplying the complex vector VmonDFT by a compensation vector BRV+jBIV=1/β cos ϕ−j1/β sin ϕ. Thus:
  • V moncmp = ( Vr + jVi ) ( βcosΦ + j βsinΦ ) ( 1 β cos Φ - j 1 β sin Φ ) = Vr + jVi
  • The compensation coefficients BRV and BIV calculated by the calculation block 150 during operation of the circuitry 200 in its calibration mode can be stored and applied, by the first amplitude/phase compensation block, to the complex vector VmonDFT generated and output by the first DFT block 232 during operation of the circuitry 200 in its load driving mode to compensate for any gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170.
  • As will be appreciated by those of ordinary skill in the art, applying the compensation vector BRV+jBIV to the complex vector VmonDFT has the effect of rotating the vector VmonDFT to compensate for the gain and/or phase mismatch. Thus the first amplitude/phase compensation block 234 may be said to perform vector rotation on the vector VmonDFT.
  • This vector rotation operation improves the accuracy of the estimate Zest of the load impedance and the accuracy of any estimate of the resistance and/or inductance of the load 120 generated by the calculation block 250 during operation of the circuitry 200 in its load driving mode.
  • The compensation coefficients BRV and BIV described above are applied by the first amplitude/phase compensation block 234 to the frequency domain representation of the signal output by the voltage monitoring path 140. As will be appreciated by those of ordinary skill in the art, compensation coefficients BRI and BII to be applied by the second amplitude/phase compensation block 244 to the frequency domain representation of the signal output by the current monitoring path 170 could be generated by the calculation block 250 using a process similar to that described above. Such compensation coefficients BRI and BII could be applied instead of or in addition to the compensation coefficients BRV and BIV during operation of the circuitry 200 in its load driving mode to perform vector rotation of the vector ImonDFT.
  • In some cases the gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 may vary with temperature. Thus, temperature-dependent compensation coefficients may be defined:
  • B R ( T ) = 1 β ( T ) cos ( Φ ( T ) ) B I ( T ) = - 1 β ( T ) sin ( Φ ( T ) )
  • These temperature-dependent compensation coefficients may be approximated with Nth order polynomials of the form:

  • B R(T)≈b r0 +b r1(T−25)+b r2(T−25)2 + . . . b rN(t−25)N

  • B I(T)≈b i0 +b i1(T−25)+b i2(T−25)2 + . . . b iN(t−25)N
  • The temperature-dependent compensation coefficients may be predefined and stored, e.g. in a memory 280 that forms part of the circuitry 200 or a host device incorporating the circuitry 200. The appropriate temperature-dependent compensation coefficient for the prevailing temperature T (as detected, for example, by a temperature sensor 290 that forms part of the circuitry 200 or a host device incorporating the circuitry 200) may then be selected retrieved by the calculation block 250 and used to determine or generate the compensation parameter (i.e. the compensation vector) to be applied by the first and/or second amplitude/phase compensation blocks 234, 244 to compensate for a detected gain and/or phase mismatch.
  • In the circuitry 200 of FIG. 2 , gain and or/phase mismatch compensation is performed digitally in the frequency domain, by determining, during operation of the circuitry 200 in its calibration mode, one or more compensation parameters (which in this example are the compensation coefficients BRV and BIV and/or BRI and BII) for compensating for a difference between the estimated impedance Zest and the predefined impedance Zknown of the reference load 220, and applying the determined compensation parameter(s) during operation of the circuitry 200 in its load driving mode.
  • In other examples gain and/or phase mismatch compensation may be performed in the time domain.
  • FIG. 3 is a schematic representation of circuitry including voltage and current monitoring paths and alternative compensation circuitry for compensating for gain and/or phase mismatch between the voltage and current monitoring paths.
  • The circuitry, shown generally at 300 in FIG. 3 , shares some elements in common with the driver circuitry 200 of FIG. 2 , and such common elements are denoted by common reference numerals in FIGS. 2 and 3 , and will not be described again in detail here. The circuitry 300 may be implemented as an integrated circuit (IC), for example.
  • The circuitry 300 differs from the circuitry 200 in that its compensation circuitry 330 does not include first and second amplitude/phase compensation blocks.
  • Instead, the outputs of the first and second DFT blocks 232, 242 are coupled directly to inputs of the calculation block 250.
  • The calculation block 250 is configured to determine, based on a difference between the estimated impedance Zest of the reference load 220 (which is determined based on the signals VmonDFT and ImonDFT output by the first and second DFT blocks 232, 242 as described above) and the predefined impedance Zknown of the reference load 220, one or more compensation parameters to be applied to analog elements of the voltage monitoring path 130 and/or the current monitoring path 170.
  • The analog front end (AFE) circuitry 142, 172 of the voltage and current monitoring paths 140, 170 may include filter circuitry for attenuating out-of-band components. For example, in audio applications where the load 120 is a speaker, the AFE circuitry 142, 172 may include filter circuitry for attenuating components of the drive signal output by the driver circuitry 110 that are outside of the audio frequency range, e.g. components above 20 kHz. The filter circuitry in the AFE circuitry 142, 172 may also act as an anti-aliasing filter for the ADC circuitry 144, 172.
  • In some examples, the circuitry 200, 300 may include one or more additional current sense resistors, e.g., additional current sense resistors 130-1, 130-n (shown in dashed outline in FIGS. 2 and 3 ) that can be selectively coupled to the current monitoring path 170 in place of or in addition to the current sense resistor 130 (e.g., by means of suitable switches) for use in different applications of the circuitry 200, 300 and/or with different loads 120. Thus, for example, a first one 130-1 of the additional current sense resistors may be selected and coupled to the current monitoring path 170 in place of the current sense resistor 130 when a first load 120 (e.g., a speaker) is coupled to the circuitry 200, 300, and a different one 130-n of the additional current sense resistors may be selected and coupled to the current monitoring path 170 when a different load 120 is coupled to the circuitry 200, 300.
  • In some situations, one of the additional current sense resistors 130-1, 130-n may be selected in place of (or in addition to) the current sense resistor 130 after calibration of the circuitry 200, 300 using the reference element 220 as described above, and after a first estimate of the impedance of the load 120 has been determined by the calculation block 250 during operation of the circuitry 200, 300 in its load driving mode.
  • Any difference between first estimate of the impedance of the load 120 and a second estimate of the impedance of the same load 120 subsequently calculated by the calculation block 250 during operation of the circuitry 200, 300 in its load driving mode would be due to a gain error introduced by the selected additional current sense resistor 130-1, 130-n. To compensate for any such gain error, the circuitry 200, 300 could perform an on the fly calibration operation with the load 120 in the manner described above, to compensate for any gain or phase mismatch that may have been introduced as a result of selecting the additional current sense resistor 130-1, 130-n.
  • FIG. 4 is a schematic diagram illustrating example AFE circuitry 142 for the voltage monitoring path 140 of the circuitry 300. The AFE circuitry 172 of the current monitoring path 170 may have the same configuration.
  • The AFE circuitry 142 in this example comprises amplifier circuitry 410 having first and second inputs configured to be coupled to the load 120 or reference load 220 (depending on the operating mode of the circuitry 300. A feedback arrangement is provided by an input resistor 412 coupled to a first input of the amplifier circuitry 410 and a feedback resistor 414 coupled between an output of the amplifier circuitry 410 and the input resistor 412. As will be appreciated by those of ordinary skill in the art, a gain of the amplifier circuitry 410 is dependent upon a ratio of the resistance of feedback resistor 414 to the resistance of the input resistor 412.
  • The resistance of the feedback resistor 414 may be variable to permit adjustment of the gain of the amplifier circuitry 414.
  • For example, the feedback resistor 414 may be implemented by a metal-oxide semiconductor (MOS) device whose drain-source resistance can be adjusted by adjusting a voltage applied to the gate of the MOS device.
  • Alternatively the feedback resistor 414 may be implemented as a switched resistor arrangement comprising a plurality of switched resistors coupled in parallel, such that the total resistance of the switched resistor arrangement can be controlled by selectively opening and closing switches associated with the individual resistors.
  • Alternatively or additionally, the resistance of the input resistor 412 may be variable to permit adjustment of the gain of the amplifier circuitry 414. Such a variable input resistor be implemented by a metal-oxide semiconductor (MOS) device or a switched resistor arrangement of the kind described above.
  • Filter circuitry 420 is coupled to an output of the amplifier circuitry 410. In this example the filter circuitry 420 comprises a resistor 422 having a first terminal coupled to an input of the filter circuitry 420 and a second terminal coupled to an output of the filter circuitry 420, and a capacitor 424 coupled between the second terminal of the resistor 422 and a ground or 0 v connection. It will be appreciated, however, that other configurations of filter circuitry could be employed.
  • As will be appreciated by those of ordinary skill in the art, the frequency and phase response of the filter circuitry 420 are determined by the resistance of the resistor 422 and the capacitance of the capacitor 424. The resistance of the resistor 422 and the capacitance of the capacitor 424 may be variable to permit adjustment of the frequency and phase response of the filter circuitry 420.
  • For example, the resistor 422 may be implemented by a MOS device or a switched resistor arrangement of the kind described above. The capacitor 424 may be implemented by a switched capacitor arrangement comprising a plurality of switched capacitors coupled in parallel, such that the total capacitance of the switched capacitor arrangement can be controlled by selectively opening and closing switches associated with the individual capacitors.
  • Additionally or alternatively a transconductance of the amplifier circuitry 410 may be variable so as to adjust the bandwidth of the AFE circuitry 142. Adjusting the bandwidth of the AFE circuitry 142 also changes the position of poles in the phase response of the AFE circuitry 142.
  • FIG. 5 is a schematic diagram illustrating an example ADC arrangement for the ADC circuitry 144 of the voltage monitoring path 140 of the circuitry 300. The ADC circuitry 174 of the current monitoring path 170 may have the same configuration.
  • As shown in FIG. 5 , the ADC circuitry 144 receives a reference voltage Vref, which in this example is provided by low dropout regulator (LDO) circuitry 510.
  • By adjusting the reference voltage Vref, the gain of the ADC circuitry 144 can be adjusted.
  • As noted above, the calculation block 250 is configured to determine, based on a difference between the estimated impedance Zest of the reference load 220 and the predefined impedance Zknown of the reference load 220, one or more compensation parameters to be applied to analog elements of the voltage monitoring path 130 and/or the current monitoring path 170.
  • For example, to compensate for any phase mismatch between the voltage monitoring path 140 and the current monitoring path 170, the calculation block 250 may determine a capacitance of the capacitor 424 and/or a resistance of the resistor 422 of the filter circuitry 420 required to move a pole of the phase response of the filter circuitry 420 to compensate for the phase mismatch, and may output appropriate control signals to the filter circuitry 420 to adjust the capacitance of the capacitor 424 and/or the resistance of the resistor 422 accordingly.
  • Alternatively or additionally, the calculation block 250 may determine a transconductance of the amplifier circuitry 410 of the AFE circuitry 142 required to move a pole of the phase response of the AFE circuitry 142 to compensate for the phase mismatch.
  • To compensate for any gain mismatch between the voltage monitoring path 140 and the current monitoring path 170, the calculation block 250 may determine a resistance of the feedback resistor 414 and/or a resistance of the input resistor 412 required to adjust the gain of the AFE circuitry 142, and may output appropriate control signals to the AFE circuitry 142 to adjust the resistance of the feedback resistor 414 and/or the input resistor 412 accordingly.
  • Alternatively or additionally, the calculation block 250 may determine a reference voltage Vref to be applied to the ADC circuitry 144 to adjust the gain of the ADC 144 to compensate for the gain mismatch, and may output appropriate control signals to the LDO circuitry 510 (or other circuitry that supplies the reference voltage Vref to the ADC circuitry 144) to adjust the reference voltage Vref accordingly.
  • In the discussion above the calculation circuitry 250 is described as determining compensation parameters that are be applied to analog elements of the voltage monitoring path 140, but it will be appreciated by those skilled in the art that the calculation circuitry 250 could, alternatively or additionally, determine compensation parameters that are applied to analog elements of the current monitoring path 170.
  • In both the digital gain/phase mismatch compensation example described above with reference to FIG. 2 and the analog gain/phase mismatch compensation example described above with reference to FIGS. 3-5 , after the compensation parameter(s) have been applied by the calculation circuitry 250, the circuitry 200, 300 may perform a verification cycle to confirm that the applied compensation parameter(s) have achieved the desired compensation effect.
  • Thus, after determining and applying the compensation parameter(s), the reference signal may again be applied to the reference element 220, and the calculation block 250 may determine an estimated impedance Zest of the reference load 220, based on the signals output by the first and second DFT blocks 232, 242. This estimated impedance Zest is then compared by the calculation block 250 to the predefined impedance Zknown of the reference element 220. If the estimated impedance Zest is equal to (or is within a defined tolerance range of) the predefined impedance Zknown, the compensation parameters that have been applied have achieved the desired compensation effect, and the circuitry 200, 300 can now switch to operation in its load driving mode. On the other hand, if the estimated impedance Zest is not equal to (or is outside a defined tolerance range of) the predefined impedance Zknown then a gain or phase mismatch still exists between the voltage monitoring path 140 and the current monitoring path 170, and new compensation parameters may be calculated in the manner described above.
  • The circuitry 200, 300 may be configured to perform calibration in the manner described above in response to particular trigger events, e.g. on start-up or power on of the circuitry 200, 300 or in response to a change in operating conditions, e.g. a change in ambient temperature, supply voltage or the like. Additionally or alternatively, the circuitry may be configured to perform calibration in the manner described above periodically or in accordance with a predefined schedule.
  • As will be appreciated from the foregoing disclosure, determining one or more compensation parameters and applying the determined compensation parameter(s) in operation of the circuitry 200, 300 in its load driving mode of operation improves the accuracy of an estimate Zest of the load impedance and the accuracy of any estimate of the resistance and/or inductance of the load 120 generated by the calculation block 250 during operation of the circuitry 200, 300 in its load driving mode, as any gain and/or phase mismatch between the voltage monitoring path 140 and the current monitoring path 170 is compensated for by the application of the compensation parameter(s).
  • The circuitry described above with reference to the accompanying drawings may be incorporated in a host device such as a laptop, notebook, netbook or tablet computer, a gaming device such as a games console or a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player or some other portable device, or may be incorporated in an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a VR or AR device, a mobile telephone, a portable audio player or other portable device.
  • The skilled person will recognise that some aspects of the above-described apparatus and methods may be embodied as processor control code, for example on a non-volatile carrier medium such as a disk, CD- or DVD-ROM, programmed memory such as read only memory (Firmware), or on a data carrier such as an optical or electrical signal carrier. For many applications, embodiments will be implemented on a DSP (Digital Signal Processor), ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array). Thus the code may comprise conventional program code or microcode or, for example code for setting up or controlling an ASIC or FPGA. The code may also comprise code for dynamically configuring re-configurable apparatus such as re-programmable logic gate arrays. Similarly the code may comprise code for a hardware description language such as Verilog™ or VHDL (Very high speed integrated circuit Hardware Description Language). As the skilled person will appreciate, the code may be distributed between a plurality of coupled components in communication with one another. Where appropriate, the embodiments may also be implemented using code running on a field-(re)programmable analogue array or similar device in order to configure analogue hardware.
  • It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. The word “comprising” does not exclude the presence of elements or steps other than those listed in a claim, “a” or “an” does not exclude a plurality, and a single feature or other unit may fulfil the functions of several units recited in the claims. Any reference numerals or labels in the claims shall not be construed so as to limit their scope.
  • As used herein, when two or more elements are referred to as “coupled” to one another, such term indicates that such two or more elements are in electronic communication or mechanical communication, as applicable, whether connected indirectly or directly, with or without intervening elements.
  • This disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Similarly, where appropriate, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Moreover, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Accordingly, modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the systems and apparatuses may be integrated or separated. Moreover, the operations of the systems and apparatuses disclosed herein may be performed by more, fewer, or other components and the methods described may include more, fewer, or other steps. Additionally, steps may be performed in any suitable order. As used in this document, “each” refers to each member of a set or each member of a subset of a set.
  • Although exemplary embodiments are illustrated in the figures and described below, the principles of the present disclosure may be implemented using any number of techniques, whether currently known or not. The present disclosure should in no way be limited to the exemplary implementations and techniques illustrated in the drawings and described above.
  • Unless otherwise specifically noted, articles depicted in the drawings are not necessarily drawn to scale.
  • All examples and conditional language recited herein are intended for pedagogical objects to aid the reader in understanding the disclosure and the concepts contributed by the inventor to furthering the art, and are construed as being without limitation to such specifically recited examples and conditions. Although embodiments of the present disclosure have been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the disclosure.
  • Although specific advantages have been enumerated above, various embodiments may include some, none, or all of the enumerated advantages. Additionally, other technical advantages may become readily apparent to one of ordinary skill in the art after review of the foregoing figures and description.
  • To aid the Patent Office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to note that they do not intend any of the appended claims or claim elements to invoke 35 U.S.C. § 112(f) unless the words “means for” or “step for” are explicitly used in the particular claim.

Claims (21)

1. Circuitry comprising:
a voltage monitoring path;
a current monitoring path;
a reference element of a predefined impedance; and
processing circuitry,
wherein in operation of the circuitry in a calibration mode of operation:
the voltage monitoring path is operative to output a signal indicative of a voltage across the reference element in response to a reference signal applied to the reference element;
the current monitoring path is operative to output a signal indicative of a current through the reference element in response to the reference signal; and
the processing circuitry is operative to:
receive the signal indicative of the voltage across the reference element and the signal indicative of the current through the reference element;
generate an estimate of an impedance of the reference element; and
determine a compensation parameter for an element of the circuitry for compensating for a difference between the estimate of the impedance and the predefined impedance of the reference element.
2. Circuitry according to claim 1, wherein the circuitry is configured to apply the compensation parameter in operation of the circuitry in a load driving mode of operation.
3. Circuitry according to claim 1, wherein the compensation parameter is a frequency domain compensation parameter.
4. Circuitry according to claim 3, wherein the processing circuitry comprises:
a first conversion block for converting the signal indicative of the voltage across the reference element into a first frequency domain complex vector; and
a second conversion block for converting the signal indicative of the current through the reference element into a second frequency domain complex vector,
wherein the processing circuitry comprises a calculation block configured to generate the estimate of the impedance of the reference element based on the first and second frequency domain complex vectors and to compare the generated estimate to the predefined impedance of the reference element.
5. Circuitry according to claim 4, wherein the circuitry further comprises a compensation block configured to apply the compensation parameter to the first frequency domain complex vector or the second frequency domain complex vector.
6. Circuitry according to claim 4, wherein the calculation block is configured to calculate a gain mismatch β by dividing a ratio of the magnitude of the first complex vector to the magnitude of the second complex vector by the magnitude of the predefined impedance, and to calculate a phase mismatch ϕ by subtracting the phase of a ratio of the first complex vector to the second complex vector from the phase of the predefined impedance.
7. Circuitry according to claim 6, wherein the calculation block is configured to calculate a first compensation coefficient BR and a second compensation coefficient BI, where:
B R = 1 β cos Φ ; and B I = - 1 β sin Φ ,
and wherein the compensation parameter comprises a compensation vector comprising the first and second compensation coefficients.
8. Circuitry according to claim 5, wherein the compensation parameter comprises a compensation vector comprising first and second temperature-dependent compensation coefficients, wherein the calculation block is configured to select the first and second temperature-dependent compensation coefficients based on a detected temperature.
9. Circuitry according to claim 8, wherein the temperature-dependent compensation coefficients comprise predefined polynomials.
10. Circuitry according to claim 1, wherein the compensation parameter is a time domain compensation parameter.
11. Circuitry according to claim 10, wherein the compensation parameter comprises a parameter of an analog element of the voltage monitoring path or the current monitoring path.
12. Circuitry according to claim 11, wherein the voltage monitoring path and the current monitoring path each comprise analog front end (AFE) circuitry and analog to digital converter (ADC) circuitry, and wherein the compensation parameter comprises a parameter of the AFE circuitry or the ADC circuitry.
13. Circuitry according to claim 12, wherein the compensation parameter comprises one or more of:
a resistance of a resistor of filter circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path;
a capacitance of a capacitor of filter circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path; and
a transconductance of amplifier circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path.
14. Circuitry according to claim 12, wherein the compensation parameter comprises one or more of:
a resistance of a resistor of a feedback network of amplifier circuitry of the AFE circuitry of the voltage monitoring path or the current monitoring path; and
a reference voltage for the ADC circuitry of the voltage monitoring path or the current monitoring path.
15. Circuitry according to claim 1, wherein the circuitry is configured to apply the compensation parameter in operation of the circuitry in the compensation mode of operation, wherein the processing circuitry is operative to:
with the compensation parameter applied, generate an estimate of an impedance of the reference element; and
compare the estimate of the impedance and the predefined impedance of the reference element.
16. Circuitry according to claim 1, wherein the reference element comprises a tantalum nitride resistor.
17. Circuitry according to claim 1, further comprising load selector circuitry for selectively coupling the voltage and current monitoring paths to the reference element or to a load according to the mode of operation of the circuitry.
18. Circuitry according to claim 17, wherein the load selector circuitry comprises a controllable switch network.
19. Circuitry according to claim 17, wherein the current monitoring path comprises a plurality of selectable current sense resistors, wherein:
in the calibration mode, the processing circuitry is operative to determine a first compensation parameter with a first one of the plurality selectable current sense resistors selected; and
in a load driving mode of operation of the circuitry, the processing circuitry is operable to:
generate a first estimate of an impedance of a load coupled to the circuitry with the first one of the plurality selectable current sense resistors selected; and
determine a second compensation parameter if a second estimate of the impedance of the load generated by the processing circuitry with a second one of the of the plurality of selectable current sense resistors selected differs from the first estimate of the impedance of the load.
20. An integrated circuit comprising circuitry according to claim 1.
21. A host device comprising circuitry according to claim 1, wherein the host device comprises a laptop, notebook, netbook or tablet computer, a gaming device, a games console, a controller for a games console, a virtual reality (VR) or augmented reality (AR) device, a mobile telephone, a portable audio player, a portable device, an accessory device for use with a laptop, notebook, netbook or tablet computer, a gaming device, a games console a VR or AR device, a mobile telephone, a portable audio player or other portable device.
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