US20230123068A1 - Circuit Board Assembly - Google Patents
Circuit Board Assembly Download PDFInfo
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- US20230123068A1 US20230123068A1 US17/529,410 US202117529410A US2023123068A1 US 20230123068 A1 US20230123068 A1 US 20230123068A1 US 202117529410 A US202117529410 A US 202117529410A US 2023123068 A1 US2023123068 A1 US 2023123068A1
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- circuit board
- connector
- processor
- connecting wire
- connecting module
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- 230000008054 signal transmission Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Definitions
- the present disclosure relates to a circuit board assembly, and more particularly to a circuit board assembly for reducing the signal transmission path.
- FIG. 1 illustrates a traditional circuit board assembly 10 .
- all signals of each circuit board 11 are transmitted through a backplane 12 to another circuit board 11 , resulting in overlong signal transmission. Therefore, it has negative impacts on the high-frequency and the high-speed data transmissions.
- each circuit board 11 is connected to the backplane 12 by at least one backplane connector 13 .
- adopting multiple backplane connectors 13 results in low quality of high-frequency transmission and high overall manufacturing cost of the circuit board assembly 10 .
- the objective of the present disclosure is providing a circuit board assembly for reducing the signal transmission path to improve the high-frequency and the high-speed data transmissions and lower the manufacturing cost thereof.
- a circuit board assembly includes a first circuit board, a second circuit board and a first connecting module.
- the first connecting module includes a first connecting wire, a first connector and a second connector.
- the first circuit board includes a first processor, and the second circuit board includes a second processor.
- one end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board.
- one end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board.
- the first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
- a circuit board assembly of another embodiment includes a first circuit board, a second circuit board and a first connecting module.
- the first connecting module includes a first connecting wire, a first connector and a second connector.
- the first circuit board includes a first processor, and the second circuit board includes a second processor and at least one second through hole.
- the first connecting wire passes through the second through hole.
- one end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board.
- one end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board.
- the first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
- the circuit board assembly further includes at least one the third circuit board.
- the third circuit board is placed between the first circuit board and the second circuit board.
- the third circuit board includes at least one third through hole. The first connecting wire passes through the third through hole.
- the circuit board assembly further includes a second connecting module.
- the third circuit board also includes a third processor.
- the second connecting module includes a second connecting wire, a third connector and a fourth connector. One end of the third connector is connected to one end of the second connecting wire. The other end of the third connector is connected to the first circuit board. One end of the fourth connector is connected to the other end of the second connecting wire. The other end of the fourth connector is connected to the third circuit board.
- the third connector is adjacent to the first processor, and the fourth connector is adjacent to the third processor.
- the circuit board assembly further includes a third connecting module.
- the third connecting module includes a third connecting wire, a fifth connector and a sixth connector.
- One end of the fifth connector is connected to one end of the third connecting wire.
- the other end of the fifth connector is connected to the second circuit board.
- One end of the sixth connector is connected to the other end of the third connecting wire.
- the other end of the sixth connector is connected to the third circuit board.
- the fifth connector is adjacent to the second processor, and the sixth connector is adjacent to the third processor.
- the first connector and the second connector are X-Beam connectors.
- the first connecting wire is a flexible printed circuit board.
- first connector and the second connector are fixed to the first circuit board and the second circuit board by fasteners, respectively.
- first connector and the second connector are fixed to the first circuit board and the second circuit board by latches, respectively.
- FIG. 1 illustrates a traditional circuit board assembly 10
- FIG. 2 A illustrates a circuit board assembly 20 of the first embodiment
- FIG. 2 B illustrates a schematic view of a connector fixed to a circuit board by latches
- FIG. 3 illustrates a circuit board assembly 30 of the second embodiment
- FIG. 4 illustrates a circuit board assembly 40 of the third embodiment
- FIG. 5 A illustrates a schematic view of a circuit board assembly 50 and a support structure 8 ;
- FIG. 5 B illustrates an explosion diagram of the circuit board assembly 50 and the support structure 8 ;
- FIG. 6 A to FIG. 6 D illustrate a flow chart for manufacturing the circuit board assembly 50 .
- FIG. 2 A illustrates a circuit board assembly 20 of the first embodiment.
- the circuit board assembly 20 includes a first circuit board 21 , a second circuit board 22 and a first connecting module 25 .
- the first circuit board 21 includes a first processor 21 C
- the second circuit board 22 includes a second processor 22 C.
- the first processor 21 C is disposed at the center of the first circuit board 21 .
- the first processor 21 C is disposed elsewhere outside the center of the first circuit board 21
- the second processor 22 C is also disposed elsewhere outside the center of the second circuit board 22 .
- the first connecting module 25 includes a first connecting wire 25 L, a first connector 251 and a second connector 252 .
- the first connecting wire 25 L is such as a flexible printed circuit board.
- the first connector 251 and the second connector 252 are such as X-Beam connectors.
- the X-Beam connector having the advantages of high current carrying capacity and high-speed data transmissions is a product launched by Neoconix, Inc. in 2015 .
- One end of the first connector 251 is connected to one end of the first connecting wire 25 L, and the other end of the first connector 251 is fixed to the first circuit board 21 by fasteners.
- one end of the second connector 252 is connected to the other end of the first connecting wire 25 L, and the other end of the second connector 252 is fixed to the second circuit board 22 by fasteners.
- the fasteners are to achieve the fixing effect by screwing a bolt into a tapped hole.
- the first connector 251 is fixed to the first circuit board 21 by latches
- the second connector 252 is also fixed to the second circuit board 22 by latches.
- the first connector 251 is embedded in a setting area 21 B.
- a cover 21 A is locked down to the setting area 21 B so that the cover 21 A tightly presses the first connector 251 .
- the second connector 252 is embedded in a setting area 22 B.
- a cover 22 A is locked down to the setting area 22 B so that the cover 22 A tightly presses the second connector 252 .
- the first connector 251 is adjacent to the first processor 21 C. Furthermore, besides being connected to the second circuit board 22 , the second connector 252 is adjacent to the second processor 22 C. Therefore, the first connecting module 25 can receive a signal from the first processor 21 C at the nearest position of the first processor 21 C, and the signal is directly transmitted to the vicinity of the second processor 22 C of the second circuit board 22 via the first connecting module 25 , significantly shorten the signal transmission path.
- the circuit board assembly 20 has positive impacts on the high-frequency and the high-speed data transmissions.
- the circuit board assembly 20 does not have the backplane 12 and a plurality of backplane connectors 13 . As a result, the circuit board assembly 20 is made in a lower manufacturing cost.
- FIG. 3 illustrates a circuit board assembly 30 of the second embodiment.
- the differences between the circuit board assembly 30 and the circuit board assembly 20 are the second circuit board 22 of the circuit board assembly 30 further including a second opening 22 H and the first connecting wire 25 L of the circuit board assembly 30 passing through the second through hole 22 H.
- the first connecting module 25 is able to being directly connected to the second processor 22 C. Therefore, via the second through hole 22 H, the first connecting module 25 is directly connected to the vicinity of the second processor 22 C, greatly reducing the signal transmission path.
- FIG. 4 illustrates a circuit board assembly 40 of the third embodiment.
- the differences between the circuit board assembly 40 and the circuit board assembly 20 are the circuit board assembly 40 including a third circuit board 23 and a second connecting module 26 and a third connecting module 27 .
- the third circuit board 23 is placed between the first circuit board 21 and the second circuit board 22 .
- the third circuit board 23 further includes a third processor 23 C.
- the second connecting module 26 of the circuit board assembly 40 includes a second connecting wire 26 L, a third connector 261 and a fourth connector 262 .
- One end of the third connector 261 is connected to one end of the second connecting wire 26 L.
- the other end of the third connector 261 is connected to the first circuit board 21 .
- the third connector 261 is adjacent to the first processor 21 C.
- one end of the fourth connector 262 is connected to the other end of the second connecting wire 26 L.
- the other end of the fourth connector 262 is connected to the third circuit board 23 .
- the fourth connector 262 is adjacent to the third processor 23 C. Therefore, the second connecting module 26 can first receive a signal from the first processor 21 C at the nearest position of the first processor 21 C. And, the second connecting module 26 is directly connected to the vicinity of the third processor 23 C of the third circuit board 23 . In other words, compared to the prior art, the signal transmission path between the first circuit board 21 and the third circuit board 23 is greatly shortened.
- the third connecting module 27 of the circuit board assembly 40 includes a third connecting wire 27 L, a fifth connector 271 and a sixth connector 272 .
- One end of the fifth connector 271 is connected to one end of the third connecting wire 27 L.
- the other end of the fifth connector 271 is connected to the second circuit board 22 .
- the fifth connector 271 is adjacent to the second processor 22 C.
- One end of the sixth connector 272 is connected to the other end of the third connecting wire 27 L.
- the other end of the sixth connector 272 is connected to the third circuit board 23 .
- the sixth connector 272 is adjacent to the third processor 23 C. Therefore, the third connecting module 27 can receive a signal from the second processor 22 C at the nearest position of the second processor 22 C. And, the third connecting module 27 is directly connected to the vicinity of the third processor 23 C of the third circuit board 23 .
- the signal transmission path between the second circuit board 22 and the third circuit board 23 is greatly shortened.
- the third circuit board 23 includes a third through hole 23 H.
- the first connecting wire 25 L are passed through the third through hole.
- the first connecting module 25 is also able to being directly connected to the second processor 22 C. Therefore, via the third through hole 23 H, the first connecting module 25 is directly connected to the vicinity of the second processor 22 C. As a result, the signal transmission path between the first circuit board 21 and the second circuit board 22 is greatly shortened.
- FIG. 5 A illustrates a schematic view of a circuit board assembly 50 and a support structure 8 .
- FIG. 5 B illustrates an explosion diagram of the circuit board assembly 50 and the support structure 8 .
- the circuit board assembly 50 further includes a fourth connecting module 51 , a fifth connecting module 52 , a sixth connecting module 53 and another third circuit board 24 .
- the circuit boards disposed between the first circuit board 21 and the second circuit board 22 are all defined as the third circuit board, and different symbols are used to distinguish them.
- the third circuit board 24 is disposed between the second circuit board 22 and the third circuit board 23 .
- the third circuit board 24 includes a third processor 24 C and a plurality of third through hole 24 H.
- the first connecting module 25 connects the first circuit board 21 and the second circuit board 22 by passing through the third through hole 23 H and the third through hole 24 H. Therefore, the signal transmission path between the first circuit board 21 and the second circuit board 22 is greatly shortened.
- the third connecting module 27 passes through the third through hole 24 H to connect the second circuit board 22 and the third circuit board 23 . Furthermore, the first circuit board 21 and the third circuit board 23 of the circuit board assembly 50 are also connected by the second connecting module 26 .
- the fourth connecting module 51 connects the first circuit board 21 and the third circuit board 24 by passing through the third through hole 23 H.
- the fifth connecting module 52 connects the first third circuit board 23 and the second third circuit board 24
- the sixth connecting module 53 connects the second circuit board 22 and the third circuit board 24 . Therefore, the signal is transmitted in the shortest path between each circuit board in the circuit board assembly 50 .
- FIG. 2 A and FIG. 3 illustrate the embodiment of two circuit boards
- FIG. 4 illustrates the embodiment of three circuit boards
- FIG. 5 A illustrates the embodiment of four circuit boards.
- the scope of the present invention includes but is not limited to those embodiments illustrated in FIG. 2 A , FIG. 3 , FIG. 4 and FIG. 5 A .
- the support structure 8 includes two locking plates 81 , four supporting columns 82 and a plurality of support bushings 83 .
- the four supporting columns 82 and the plurality of support bushings 83 are used to fix and keep the first circuit board 21 , the second circuit board 22 , the third circuit board 23 , and the third circuit board 24 in their corresponding positions in the circuit board assembly 50 .
- the two locking plates 81 of the support structure 8 are placed below the first circuit board 21 and above the second circuit board 22 , respectively.
- the upper and lower locking plates 81 are used to fix and keep the four supporting columns 82 .
- the first circuit board 21 , the second circuit board 22 , the third circuit board 23 , and the third circuit board 24 are fixed by the backplane 12 and the backplane connectors 13 in FIG. 1 .
- the backplane 12 and the backplane connectors 13 are only used for fixing the circuit board assembly 50 and not used for signal transmission in the embodiment.
- FIG. 6 A A locking plate 81 , four supporting columns 82 , four support bushings 83 , and a first circuit board 21 are provided.
- the four support columns 82 are disposed at the locking plate 81 .
- the four supporting columns 82 respectively are passed through the four corners of the first circuit board 21 so that the first circuit board 21 is disposed above the locking plate 81 .
- one ends of the first connecting module 25 , the second connecting module 26 and the fourth connecting module 51 are connected to the first circuit board 21 .
- the connection points of the first connecting module 25 , the second connecting module 26 , and the fourth connecting module 51 to the first circuit board 21 are adjacent to the first processor 21 C.
- each of the four interval rings 83 is placed around or sheathing the corresponding supporting column 82 so that each interval ring 83 is disposed above the first circuit board 21 .
- the third circuit board 23 , the fifth connecting module 52 and the third connecting module 27 are provided.
- the four supporting columns 82 respectively are passed through the four corners of the third circuit board 23 .
- the third circuit board 23 is above the first circuit board 21 .
- the first connecting module 25 and the fourth connecting module 51 are passed through the third through hole 23 H of the third circuit board 23 .
- the other end of the second connecting module 26 is connected to the lower surface of the third circuit board 23 .
- one ends of the fifth connecting module 52 and the third connecting module 27 are connected to the upper surface of the third circuit board 23 .
- the connection point between the fifth connecting module 52 and the third circuit board 23 and the connection point between the third connecting module 27 and the third circuit board 23 are adjacent to the third processor 23 C.
- the second third circuit board 24 and the sixth connecting module 53 are provided.
- the four supporting columns 82 respectively are passed through the four corners of the third circuit board 24 .
- the third circuit board 24 is above the third circuit board 23 .
- the first connecting module 25 and the third connecting module 27 are passed through the third through hole 24 H of the third circuit board 24 .
- one end of the sixth connecting module 53 is connected to the lower surface of the third circuit board 24 .
- the connection point between the sixth connecting module 53 and the third circuit board 24 is adjacent to the third processor 24 C.
- the other ends of the fifth connecting module 52 and fourth connecting module 51 are connected to the lower surface of the third circuit board 23 .
- the second circuit board 22 is provided.
- the four supporting columns 82 respectively are passed through the four corners of the second circuit board 22 .
- the second circuit board 22 is above the third circuit board 24 .
- the other ends of the first connecting module 25 , the third connecting module 27 and the sixth connecting module 53 are connected to the lower surface of the second circuit board 22 .
- the connection points of the first connecting module 25 , the third connecting module 27 and the sixth connecting module 53 to the second circuit board 22 are adjacent to the second processor 22 C. In this way, the manufacture of the circuit board assembly 50 in the embodiment is completed.
- the circuit board assembly in the present disclosure can reduce the signal transmission path, have positive impacts on the high-frequency and the high-speed data transmissions, and lower the manufacturing cost thereof.
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Abstract
Description
- The present disclosure relates to a circuit board assembly, and more particularly to a circuit board assembly for reducing the signal transmission path.
- Please refer to
FIG. 1 .FIG. 1 illustrates a traditional circuit board assembly 10. In the server of the conventional data center, all signals of eachcircuit board 11 are transmitted through abackplane 12 to anothercircuit board 11, resulting in overlong signal transmission. Therefore, it has negative impacts on the high-frequency and the high-speed data transmissions. - Furthermore, each
circuit board 11 is connected to thebackplane 12 by at least onebackplane connector 13. However, adoptingmultiple backplane connectors 13 results in low quality of high-frequency transmission and high overall manufacturing cost of the circuit board assembly 10. - Therefore, how to design a circuit board assembly for reducing the signal transmission path is worth considering for a person having ordinary skill in the art.
- The objective of the present disclosure is providing a circuit board assembly for reducing the signal transmission path to improve the high-frequency and the high-speed data transmissions and lower the manufacturing cost thereof.
- To achieve the foregoing and other objects, a circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. Furthermore, one end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. In addition, one end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
- To achieve the foregoing and other objects, a circuit board assembly of another embodiment is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor and at least one second through hole. The first connecting wire passes through the second through hole. Furthermore, one end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. In addition, one end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
- In some embodiment, the circuit board assembly further includes at least one the third circuit board. The third circuit board is placed between the first circuit board and the second circuit board. The third circuit board includes at least one third through hole. The first connecting wire passes through the third through hole.
- In some embodiment, the circuit board assembly further includes a second connecting module. The third circuit board also includes a third processor. The second connecting module includes a second connecting wire, a third connector and a fourth connector. One end of the third connector is connected to one end of the second connecting wire. The other end of the third connector is connected to the first circuit board. One end of the fourth connector is connected to the other end of the second connecting wire. The other end of the fourth connector is connected to the third circuit board. The third connector is adjacent to the first processor, and the fourth connector is adjacent to the third processor.
- In some embodiment, the circuit board assembly further includes a third connecting module. The third connecting module includes a third connecting wire, a fifth connector and a sixth connector. One end of the fifth connector is connected to one end of the third connecting wire. The other end of the fifth connector is connected to the second circuit board. One end of the sixth connector is connected to the other end of the third connecting wire. The other end of the sixth connector is connected to the third circuit board. The fifth connector is adjacent to the second processor, and the sixth connector is adjacent to the third processor.
- In some embodiment, the first connector and the second connector are X-Beam connectors.
- In some embodiment, the first connecting wire is a flexible printed circuit board.
- In some embodiment, the first connector and the second connector are fixed to the first circuit board and the second circuit board by fasteners, respectively.
- In some embodiment, the first connector and the second connector are fixed to the first circuit board and the second circuit board by latches, respectively.
- The present disclosure has the following advantages:
- 1. Reducing the signal transmission path;
- 2. Improving the high-frequency and the high-speed data transmissions;
- 3. Lowering the manufacturing cost.
- The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
-
FIG. 1 illustrates a traditional circuit board assembly 10; -
FIG. 2A illustrates acircuit board assembly 20 of the first embodiment; -
FIG. 2B illustrates a schematic view of a connector fixed to a circuit board by latches; -
FIG. 3 illustrates acircuit board assembly 30 of the second embodiment; -
FIG. 4 illustrates acircuit board assembly 40 of the third embodiment; -
FIG. 5A illustrates a schematic view of acircuit board assembly 50 and asupport structure 8; -
FIG. 5B illustrates an explosion diagram of thecircuit board assembly 50 and thesupport structure 8; and -
FIG. 6A toFIG. 6D illustrate a flow chart for manufacturing thecircuit board assembly 50. - Please refer to
FIG. 2A .FIG. 2A illustrates acircuit board assembly 20 of the first embodiment. Thecircuit board assembly 20 includes afirst circuit board 21, asecond circuit board 22 and a first connectingmodule 25. Thefirst circuit board 21 includes afirst processor 21C, and thesecond circuit board 22 includes asecond processor 22C. InFIG. 2A , thefirst processor 21C is disposed at the center of thefirst circuit board 21. However, in other embodiments, thefirst processor 21C is disposed elsewhere outside the center of thefirst circuit board 21, and thesecond processor 22C is also disposed elsewhere outside the center of thesecond circuit board 22. - Furthermore, the first connecting
module 25 includes a first connectingwire 25L, afirst connector 251 and asecond connector 252. The first connectingwire 25L is such as a flexible printed circuit board. Thefirst connector 251 and thesecond connector 252 are such as X-Beam connectors. The X-Beam connector having the advantages of high current carrying capacity and high-speed data transmissions is a product launched by Neoconix, Inc. in 2015. - Please refer to
FIG. 2A . One end of thefirst connector 251 is connected to one end of the first connectingwire 25L, and the other end of thefirst connector 251 is fixed to thefirst circuit board 21 by fasteners. In addition, one end of thesecond connector 252 is connected to the other end of the first connectingwire 25L, and the other end of thesecond connector 252 is fixed to thesecond circuit board 22 by fasteners. In the embodiment, the fasteners are to achieve the fixing effect by screwing a bolt into a tapped hole. - In other embodiments, as shown in
FIG. 2B , thefirst connector 251 is fixed to thefirst circuit board 21 by latches, and thesecond connector 252 is also fixed to thesecond circuit board 22 by latches. In detail, thefirst connector 251 is embedded in asetting area 21B. Next, acover 21A is locked down to thesetting area 21B so that thecover 21A tightly presses thefirst connector 251. In the same or similar way, thesecond connector 252 is embedded in asetting area 22B. Then, acover 22A is locked down to thesetting area 22B so that thecover 22A tightly presses thesecond connector 252. As a result, it is advantageous for thefirst connector 251 and thesecond connector 252 to be quickly connected to or detached from the corresponding circuit board. - In the embodiment, in addition to being connected to the
first circuit board 21, thefirst connector 251 is adjacent to thefirst processor 21C. Furthermore, besides being connected to thesecond circuit board 22, thesecond connector 252 is adjacent to thesecond processor 22C. Therefore, the first connectingmodule 25 can receive a signal from thefirst processor 21C at the nearest position of thefirst processor 21C, and the signal is directly transmitted to the vicinity of thesecond processor 22C of thesecond circuit board 22 via the first connectingmodule 25, significantly shorten the signal transmission path. Thus, thecircuit board assembly 20 has positive impacts on the high-frequency and the high-speed data transmissions. - Please refer to
FIG. 1 . Compared to traditional circuit board assembly 10, thecircuit board assembly 20 does not have thebackplane 12 and a plurality ofbackplane connectors 13. As a result, thecircuit board assembly 20 is made in a lower manufacturing cost. - Please refer to
FIG. 3 .FIG. 3 illustrates acircuit board assembly 30 of the second embodiment. The differences between thecircuit board assembly 30 and thecircuit board assembly 20 are thesecond circuit board 22 of thecircuit board assembly 30 further including asecond opening 22H and the first connectingwire 25L of thecircuit board assembly 30 passing through the second throughhole 22H. Specifically, in thecircuit board assembly 30, by making the hole on the circuit board the first connectingmodule 25 is able to being directly connected to thesecond processor 22C. Therefore, via the second throughhole 22H, the first connectingmodule 25 is directly connected to the vicinity of thesecond processor 22C, greatly reducing the signal transmission path. - Please refer to
FIG. 4 .FIG. 4 illustrates acircuit board assembly 40 of the third embodiment. The differences between thecircuit board assembly 40 and thecircuit board assembly 20 are thecircuit board assembly 40 including athird circuit board 23 and a second connectingmodule 26 and a third connectingmodule 27. Thethird circuit board 23 is placed between thefirst circuit board 21 and thesecond circuit board 22. Thethird circuit board 23 further includes athird processor 23C. - The second connecting
module 26 of thecircuit board assembly 40 includes a second connectingwire 26L, athird connector 261 and afourth connector 262. One end of thethird connector 261 is connected to one end of the second connectingwire 26L. The other end of thethird connector 261 is connected to thefirst circuit board 21. Thethird connector 261 is adjacent to thefirst processor 21C. - In addition, one end of the
fourth connector 262 is connected to the other end of the second connectingwire 26L. The other end of thefourth connector 262 is connected to thethird circuit board 23. Thefourth connector 262 is adjacent to thethird processor 23C. Therefore, the second connectingmodule 26 can first receive a signal from thefirst processor 21C at the nearest position of thefirst processor 21C. And, the second connectingmodule 26 is directly connected to the vicinity of thethird processor 23C of thethird circuit board 23. In other words, compared to the prior art, the signal transmission path between thefirst circuit board 21 and thethird circuit board 23 is greatly shortened. - Moreover, the third connecting
module 27 of thecircuit board assembly 40 includes a third connectingwire 27L, afifth connector 271 and asixth connector 272. One end of thefifth connector 271 is connected to one end of the third connectingwire 27L. The other end of thefifth connector 271 is connected to thesecond circuit board 22. Thefifth connector 271 is adjacent to thesecond processor 22C. - One end of the
sixth connector 272 is connected to the other end of the third connectingwire 27L. The other end of thesixth connector 272 is connected to thethird circuit board 23. Thesixth connector 272 is adjacent to thethird processor 23C. Therefore, the third connectingmodule 27 can receive a signal from thesecond processor 22C at the nearest position of thesecond processor 22C. And, the third connectingmodule 27 is directly connected to the vicinity of thethird processor 23C of thethird circuit board 23. The signal transmission path between thesecond circuit board 22 and thethird circuit board 23 is greatly shortened. - Please refer to
FIG. 4 . Thethird circuit board 23 includes a third throughhole 23H. The first connectingwire 25L are passed through the third through hole. In other words, in thecircuit board assembly 40, by making the hole on the circuit board the first connectingmodule 25 is also able to being directly connected to thesecond processor 22C. Therefore, via the third throughhole 23H, the first connectingmodule 25 is directly connected to the vicinity of thesecond processor 22C. As a result, the signal transmission path between thefirst circuit board 21 and thesecond circuit board 22 is greatly shortened. - In the above embodiment, it is not mentioned how to fix and position each circuit board in the circuit board assembly. The following introduces how to use the
support structure 8 to fix and position each circuit board with reference toFIG. 5A andFIG. 5B . - Please refer to
FIG. 5A andFIG. 5B .FIG. 5A illustrates a schematic view of acircuit board assembly 50 and asupport structure 8.FIG. 5B illustrates an explosion diagram of thecircuit board assembly 50 and thesupport structure 8. Compared to thecircuit board assembly 40, are thecircuit board assembly 50 further includes a fourth connectingmodule 51, a fifth connectingmodule 52, a sixth connectingmodule 53 and anotherthird circuit board 24. In the embodiment, the circuit boards disposed between thefirst circuit board 21 and thesecond circuit board 22 are all defined as the third circuit board, and different symbols are used to distinguish them. Thethird circuit board 24 is disposed between thesecond circuit board 22 and thethird circuit board 23. Thethird circuit board 24 includes athird processor 24C and a plurality of third throughhole 24H. The first connectingmodule 25 connects thefirst circuit board 21 and thesecond circuit board 22 by passing through the third throughhole 23H and the third throughhole 24H. Therefore, the signal transmission path between thefirst circuit board 21 and thesecond circuit board 22 is greatly shortened. - In the embodiment, the third connecting
module 27 passes through the third throughhole 24H to connect thesecond circuit board 22 and thethird circuit board 23. Furthermore, thefirst circuit board 21 and thethird circuit board 23 of thecircuit board assembly 50 are also connected by the second connectingmodule 26. - Moreover, the fourth connecting
module 51 connects thefirst circuit board 21 and thethird circuit board 24 by passing through the third throughhole 23H. The fifth connectingmodule 52 connects the firstthird circuit board 23 and the secondthird circuit board 24, and the sixth connectingmodule 53 connects thesecond circuit board 22 and thethird circuit board 24. Therefore, the signal is transmitted in the shortest path between each circuit board in thecircuit board assembly 50. - In the above,
FIG. 2A andFIG. 3 illustrate the embodiment of two circuit boards,FIG. 4 illustrates the embodiment of three circuit boards andFIG. 5A illustrates the embodiment of four circuit boards. However, the scope of the present invention includes but is not limited to those embodiments illustrated inFIG. 2A ,FIG. 3 ,FIG. 4 andFIG. 5A . - Please refer to
FIG. 5A andFIG. 5B . Thesupport structure 8 includes two lockingplates 81, four supportingcolumns 82 and a plurality ofsupport bushings 83. The four supportingcolumns 82 and the plurality ofsupport bushings 83 are used to fix and keep thefirst circuit board 21, thesecond circuit board 22, thethird circuit board 23, and thethird circuit board 24 in their corresponding positions in thecircuit board assembly 50. The twolocking plates 81 of thesupport structure 8 are placed below thefirst circuit board 21 and above thesecond circuit board 22, respectively. The upper andlower locking plates 81 are used to fix and keep the four supportingcolumns 82. - In other embodiment, the
first circuit board 21, thesecond circuit board 22, thethird circuit board 23, and thethird circuit board 24 are fixed by thebackplane 12 and thebackplane connectors 13 inFIG. 1 . However, thebackplane 12 and thebackplane connectors 13 are only used for fixing thecircuit board assembly 50 and not used for signal transmission in the embodiment. - Hereinafter, the manufacturing or assembly method of the
circuit board assembly 50 is described. First, please refer toFIG. 6A . A lockingplate 81, four supportingcolumns 82, foursupport bushings 83, and afirst circuit board 21 are provided. The foursupport columns 82 are disposed at the lockingplate 81. The four supportingcolumns 82 respectively are passed through the four corners of thefirst circuit board 21 so that thefirst circuit board 21 is disposed above the lockingplate 81. Next, one ends of the first connectingmodule 25, the second connectingmodule 26 and the fourth connectingmodule 51 are connected to thefirst circuit board 21. The connection points of the first connectingmodule 25, the second connectingmodule 26, and the fourth connectingmodule 51 to thefirst circuit board 21 are adjacent to thefirst processor 21C. Furthermore, each of the four interval rings 83 is placed around or sheathing the corresponding supportingcolumn 82 so that eachinterval ring 83 is disposed above thefirst circuit board 21. - Please refer to
FIG. 6B . Thethird circuit board 23, the fifth connectingmodule 52 and the third connectingmodule 27 are provided. The four supportingcolumns 82 respectively are passed through the four corners of thethird circuit board 23. In addition, thethird circuit board 23 is above thefirst circuit board 21. Then, the first connectingmodule 25 and the fourth connectingmodule 51 are passed through the third throughhole 23H of thethird circuit board 23. Then, the other end of the second connectingmodule 26 is connected to the lower surface of thethird circuit board 23. Next, one ends of the fifth connectingmodule 52 and the third connectingmodule 27 are connected to the upper surface of thethird circuit board 23. The connection point between the fifth connectingmodule 52 and thethird circuit board 23 and the connection point between the third connectingmodule 27 and thethird circuit board 23 are adjacent to thethird processor 23C. - Please refer to
FIG. 6C . The secondthird circuit board 24 and the sixth connectingmodule 53 are provided. The four supportingcolumns 82 respectively are passed through the four corners of thethird circuit board 24. In addition, thethird circuit board 24 is above thethird circuit board 23. Then, the first connectingmodule 25 and the third connectingmodule 27 are passed through the third throughhole 24H of thethird circuit board 24. Thereafter, one end of the sixth connectingmodule 53 is connected to the lower surface of thethird circuit board 24. After that, the connection point between the sixth connectingmodule 53 and thethird circuit board 24 is adjacent to thethird processor 24C. Next, the other ends of the fifth connectingmodule 52 and fourth connectingmodule 51 are connected to the lower surface of thethird circuit board 23. - Please refer to
FIG. 6D . Thesecond circuit board 22 is provided. The four supportingcolumns 82 respectively are passed through the four corners of thesecond circuit board 22. Thesecond circuit board 22 is above thethird circuit board 24. The other ends of the first connectingmodule 25, the third connectingmodule 27 and the sixth connectingmodule 53 are connected to the lower surface of thesecond circuit board 22. The connection points of the first connectingmodule 25, the third connectingmodule 27 and the sixth connectingmodule 53 to thesecond circuit board 22 are adjacent to thesecond processor 22C. In this way, the manufacture of thecircuit board assembly 50 in the embodiment is completed. - In summary, compared to prior art, the circuit board assembly in the present disclosure can reduce the signal transmission path, have positive impacts on the high-frequency and the high-speed data transmissions, and lower the manufacturing cost thereof.
- Although the description above contains many specifics, these are merely provided to illustrate the invention and should not be construed as limitations of the invention's scope. Thus, it will be apparent to those skilled, in the art that various modifications and variations can be made in the system and processes of the present disclosure without departing from the spirit or scope of the invention.
Claims (16)
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US18/455,782 US20230413441A1 (en) | 2021-10-14 | 2023-08-25 | Circuit board assembly |
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US18/455,782 Division US20230413441A1 (en) | 2021-10-14 | 2023-08-25 | Circuit board assembly |
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TWI824318B (en) | 2023-12-01 |
US20230413441A1 (en) | 2023-12-21 |
TW202316280A (en) | 2023-04-16 |
US11825604B2 (en) | 2023-11-21 |
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