WO2014071695A1 - Electronic equipment - Google Patents

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Publication number
WO2014071695A1
WO2014071695A1 PCT/CN2013/001368 CN2013001368W WO2014071695A1 WO 2014071695 A1 WO2014071695 A1 WO 2014071695A1 CN 2013001368 W CN2013001368 W CN 2013001368W WO 2014071695 A1 WO2014071695 A1 WO 2014071695A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
rigid circuit
side
connector
rigid
Prior art date
Application number
PCT/CN2013/001368
Other languages
French (fr)
Chinese (zh)
Inventor
倪勇
殷雪冰
Original Assignee
北京忆恒创源科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201210450948.8A priority Critical patent/CN103809678B/en
Priority to CN201210450948.8 priority
Priority to CN201210449174.7A priority patent/CN103809673B/en
Priority to CN201210449174.7 priority
Application filed by 北京忆恒创源科技有限公司 filed Critical 北京忆恒创源科技有限公司
Publication of WO2014071695A1 publication Critical patent/WO2014071695A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10159Memory
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Abstract

An electronic equipment includes a first rigid circuit board, a second rigid circuit board and a flexible circuit board. The flexible circuit board transfers electric signals between the first rigid circuit board and the second rigid circuit board. The first rigid circuit board has a first edge and a second edge which are opposite to each other. The flexible circuit board has a third edge and a fourth edge which are opposite to each other. The third edge of the flexible circuit board is coupled to the first edge of the first rigid circuit board, and the fourth edge of the flexible circuit board is coupled to a first region of the second rigid circuit board. The width of the fourth edge is larger than the width of the first edge.

Description

 Electronic equipment

 The present invention relates to electronic devices and, more particularly, to printed circuit board systems for solid state storage devices (SSDs). Background technique

 Similar to mechanical hard drives, solid-state storage devices (SSDs) are also high-capacity, non-volatile storage devices for computer systems. Solid-state storage devices generally use flash (Flash) as a storage medium. High-performance solid-state storage devices are used in high-performance computers.

 In the patent application WO2011085131A2, a solid state hard disk of expandable capacity as shown in Figs. 1A and 1B is provided. In Fig. 1A, a plurality of connectors 204, and a flash memory chip (not shown) are disposed on the main printed circuit board 205 of the solid state hard disk. The connector 204 is removably connectable to the daughter card. The daughter card can include a flash chip to provide additional storage capabilities to the solid state drive. Daughter cards 608, 610 are provided in Figure 1B, and each daughter card includes a flash chip 609 and a connector 607. Each daughter card is received through connector 606. Each of the daughter cards 608 and 610 can be connected to the main PCB (Printed Circuit Board) 601 alone or together. Controller 602 presents the capacity of the daughter card's flash chip to interface via interface 603. If both daughter cards 608 and 610 are plugged in, controller 602 can aggregate the capacity of flash chip 609 on each daughter card to be logically presented to the host.

 In the utility model patent CN201402611 Y, a solid state hard disk as shown in Fig. 2 is provided. The first rigid-coupling PCB 4 as a memory module includes a plurality of flash chips 41, and the second rigid-coupling P CB 5 as a main control board includes a control chip 51. The first rigid-flexible coupling PCB 4 includes a rigid PCB 42 and a flexible PCB. The second rigid-flexible coupling PCB 5 includes a rigid PCB 52 and a flexible PCB 53. The first rigid-flexible coupling PCB 4 and the second rigid-flexible coupling PCB 5 realize signals on the first rigid-flexible coupling PCB 4 and the second rigid-flexible coupling PCB 5 through signal lines and via holes provided on the flexible PCB 43 and the flexible PCB 53 Connection. The flexible PCB 43 and the flexible P CB53 are as illustrated by the hatched areas in FIG. The flexible PCB 43 and the flexible PCB 53 as well as the rigid PC B 42 and the rigid PCB 52 can be formed in one process.

 A PCB with a flexible circuit board is provided in US2007165390A1, as shown in FIG. Figure 3 includes a first backplane 100, a second backplane 200, and a flexible transmission circuit (FPC, Flexible, Printed Cir cuit). The first bottom plate 100 and the second bottom plate 200 are separated from each other and transmit signals using the FPC. Electronic components 201, 202 may be mounted on the second backplane 200, and electronic components 101, 102, and a Micro Control Unit (MCU) may be mounted on the first backplane 100. The first bottom plate 100 includes an opening portion 300 formed in a region having a size D which is smaller than a maximum size (d) of the first bottom plate 100. The signal transmission portion FPC can extend from the opening portion 300.

 However, in order to increase the storage capacity of the storage device, it is necessary to arrange more memory chips in a limited space. But more memory chips require more leads to implement control, which is inconsistent with the limited space of the storage device. Also, there is a need to provide a storage device having a plurality of different storage capacities and/or different number of memory chips without significantly increasing the cost.

Summary of the invention According to a first aspect of the present invention, there is provided an electronic device comprising a first rigid circuit board, a second rigid circuit board and a flexible circuit board, the flexible circuit board being in the first rigid circuit board and the second Transmitting an electrical signal between the rigid circuit boards, the first rigid circuit board having opposite first and second sides; the flexible circuit board having opposite third and fourth sides; Three sides are coupled to the first side of the first rigid circuit board, the fourth side of the flexible circuit board is coupled to the first area of the second rigid circuit board; the width of the fourth side is greater than the The width of the first side.

 According to the electronic device of the first aspect of the invention, the flexible circuit board is provided with a connector for coupling the flexible circuit board to the first region of the second rigid circuit board; The first area is arranged with a connector corresponding to the first connector.

 According to the electronic device of the first aspect of the invention, the third side extends from the first side of the first rigid circuit board, and/or the fourth side is from the second rigid circuit board A region extends out.

 In an electronic device according to the first aspect of the invention, the first side of the first rigid circuit board is located above the first area.

 An electronic device according to the first aspect of the present invention, further comprising a first support base, the first support base pressing the connector on the second rigid circuit board, the first support base supporting The first side of the first rigid circuit board.

 According to the electronic device of the first aspect of the invention, the second support base is further included; the second support base supports the second side of the first rigid circuit board.

 According to the electronic device of the first aspect of the invention, the flexible circuit board is provided with a connector, and the plane of the flexible circuit board and the first rigid circuit board have first and second faces opposite to each other The connector is disposed on the first face, the connector is for coupling the flexible circuit board to the first region of the second rigid circuit board such that the connector faces the second rigid In the case of the circuit board, the first side of the first rigid circuit board faces away from the second rigid circuit board.

 According to the electronic device of the first aspect of the invention, the first rigid circuit board is provided with a memory, and the second rigid circuit board is provided with a controller and a host interface.

 According to the electronic device of the first aspect of the invention, the wiring on the flexible circuit board indicating the configuration of the first rigid circuit board is disposed.

 According to the electronic device of the first aspect of the invention, wherein the first rigid circuit board is rectangular, the first side and the second side are short sides of the rectangle.

 According to a second aspect of the present invention, there is provided a method for mounting an electronic device, the electronic device comprising a first rigid circuit board, a second rigid circuit board and a flexible circuit board, the flexible circuit board from the One side of a rigid circuit board extends, the method comprising: connecting a first connector disposed on the flexible circuit board with a second connector disposed on the second rigid circuit board; using the support to connect the first connection The device is pressed against the second rigid circuit board; the flexible circuit board is bent along the surface of the support base; and the first rigid circuit board is fixed to the support base.

 The method according to the second aspect of the invention, wherein a lower surface of the support base presses the first connector, and the first rigid circuit board is placed in a recess of an upper surface of the support base.

According to a third aspect of the present invention, an electronic device includes a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, a first flexible circuit board, and a second flexible circuit board; a flexible circuit board transmitting an electrical signal between the first rigid circuit board and the third rigid circuit board, the second flexible circuit board being between the second rigid circuit board and the third rigid circuit board Transmitting an electrical signal, the first rigid circuit board having opposite first and second sides; the second rigid circuit board having opposite third and fourth sides; the first flexible circuit board having opposite a fifth side, a fifth side coupled to the first side of the first rigid circuit board; the second flexible circuit board having an opposite seventh side, the seventh side coupled to a third side of the second rigid circuit board; the sixth side being coupled to the third rigid circuit board a first area, the eighth side is coupled to the second area of the rigid circuit board; a width of the sixth side is greater than a width of the first side, and a width of the eighth side is greater than the third side The width.

 An electronic device according to a third aspect of the invention, wherein the fifth side extends from a first side of the first rigid circuit board; the seventh side extends from a third side of the second rigid circuit board Out.

 The electronic device according to the third aspect of the present invention, wherein the sixth side of the first flexible circuit board is disposed with a first connector, and the eighth side of the second flexible circuit board is disposed with a second connector; a first connector for coupling the first flexible circuit board to a first region of the third rigid circuit board; the second connector for coupling the second flexible circuit board to the third rigid a second region of the circuit board; the first region is provided with a connector corresponding to the first connector, and the second region is provided with a connector corresponding to the second connector.

 According to the electronic device of the third aspect of the invention, the sixth side of the first flexible circuit board extends from the first region of the third rigid circuit board, and the eighth side of the second flexible circuit board Extending from a second region of the third circuit board.

 An electronic device according to a third aspect of the invention, wherein the first region is a portion of a ninth side of the third rigid circuit board, and/or the second region is a third rigid circuit board The ten side part.

 An electronic device according to a third aspect of the present invention, further comprising a first support base and a second support base, the first support base pressing the first connector on the third rigid circuit board, a second support base presses the second connector on the third rigid board; the first support base supports a first side of the first rigid circuit board, and the first support base further supports a a fourth side of the second rigid circuit board; the second support base supports a second side of the first rigid circuit board, and the second support base further supports a third side of the second rigid circuit board.

 The electronic device according to the third aspect of the present invention, wherein the first flexible circuit board and the plane in which the first rigid circuit board is located have first and second faces opposite to each other; the second flexible circuit board a plane facing the second rigid circuit board having third and fourth faces opposite to each other; the first connector being disposed on the first face, the second connector being disposed on the third face The first connector is for coupling the first flexible circuit board to the first region of the third rigid circuit board such that the first connector faces the third rigid circuit board a first side of the first rigid circuit board facing away from the third rigid circuit board; the second connector is for coupling the second flexible circuit board to a second area of the third rigid circuit board such that When the second connector faces the third rigid circuit board, the first surface of the second rigid circuit board faces away from the third rigid circuit board.

 An electronic apparatus according to a third aspect of the invention, wherein the first rigid circuit board is provided with a memory, the second rigid circuit board is provided with a memory, and the third rigid circuit board is provided with a controller and a host interface.

 An electronic apparatus according to a third aspect of the invention, wherein the memory capacity of the memory on the first rigid circuit board is twice the storage capacity of the memory on the second rigid circuit board.

 An electronic device according to a third aspect of the invention, wherein a first side of the first rigid circuit board is located above the first area, and a third side of the second rigid circuit board is located in the second area The fourth side of the second rigid circuit board is located above the first area, and the second side of the first rigid circuit board is located above the second area.

 An electronic apparatus according to a third aspect of the invention, wherein the first flexible circuit board is provided with wiring indicating a storage capacity of a memory on the first rigid circuit board, the second flexible circuit board being provided with an indication Wiring of the storage capacity of the memory on the second rigid circuit board.

According to a fourth aspect of the present invention, a method for mounting an electronic device including a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, a first flexible circuit board, and a a flexible circuit board, the first flexible circuit board extending from one side of the first rigid circuit board, the second a flexible circuit board onion extending from one side of the second wake-up circuit board, the method comprising: disposing a first connector disposed on the first flexible circuit board and a second connector disposed on the third rigid circuit board Connecting the first connector to the third rigid circuit board using the first support; bending the first flexible circuit board along the surface of the first support; a circuit board is fixed on the first support; a third connector disposed on the second flexible circuit board is connected to a fourth connector disposed on the third rigid circuit board; The third connector is pressed against the third rigid circuit board: bending the second flexible circuit board along a surface of the second support base; fixing the second rigid circuit board to the second Fixing the second rigid circuit board on the first support base; and fixing the first rigid circuit board to the second support base.

 A method according to a fourth aspect of the invention, wherein a lower surface of the first support base is pressed against the first connector, and the first rigid circuit board is placed on an upper surface of the first support base a first recess; a lower surface of the second support base compresses the third connector, and the second rigid circuit board is placed in a first recess of an upper surface of the second support base; The first rigid circuit board is placed in a second recess of the upper surface of the second support base, and the second rigid circuit board is placed in the first slot of the upper surface of the first support base.

 According to a fifth aspect of the present invention, a storage device includes a first circuit board, a second circuit board, and a third circuit board; and the first circuit board is provided with one or more memory chips, One or more memory chips are disposed on the second circuit board, and the controller and the host interface are disposed on the third circuit board; the first circuit board is coupled with the third circuit board, and the second circuit board is Coupling with the third circuit board such that one or more memory chips disposed on the first circuit board and one disposed on the second circuit board are accessed by the controller via the host interface Or a plurality of memory chips; the capacity of the memory chips on the first circuit board is twice the capacity of the memory chips on the second circuit board.

 A memory device according to a fifth aspect of the invention, wherein the first circuit board is coupled to the third circuit board by a first connector disposed on the third circuit board, the second circuit board being disposed by A second electrical connection on the third circuit board is coupled to the third circuit board.

 A memory device according to a fifth aspect of the invention, wherein the one or more pins of the first connector are for transmitting a signal indicating a capacity of a memory chip on the first circuit board, and/or the One or more pins of the two connectors are used to transmit signals indicative of the capacity of the memory chips on the second circuit board.

 A memory device according to a fifth aspect of the invention, wherein the first circuit board is coupled to the third circuit board by a first connector and a second connector disposed on the third circuit board, the a second circuit board is coupled to the third circuit board through a third connector and a fourth connector disposed on the third circuit board, wherein the first connector is the same as the third connector The second connector is the same as the fourth connector. The memory device according to the fifth aspect of the present invention, wherein the first connector and/or the second connector are used for one or more pins Transmitting, by the signal indicating the capacity of the memory chip on the first circuit board, one or more pins of the third connector and/or the fourth connector for transmitting the indication of the second circuit board The signal of the capacity of the memory chip.

 A memory device according to a fifth aspect of the present invention, further comprising a first flexible circuit board for coupling the first circuit board to the third circuit board, and a second flexible circuit board The second flexible circuit board is for coupling the second circuit board to the third circuit board.

A storage device according to a fifth aspect of the present invention, wherein the first circuit board has opposite first and second sides; the second circuit board has opposite third and fourth sides; a flexible circuit board having an opposite fifth side sixth side, the fifth side being coupled to the first side of the first circuit board; the second flexible ohmic circuit board having an opposite seventh side eighth The seventh side is coupled to the third side of the second circuit board: the sixth side is coupled to the first connector of the third circuit board, and the eighth side is coupled to the third side a second connector of the circuit board; a width of the sixth side is greater than a width of the first side, and a width of the eighth side is greater than a width of the third side; a first side of the first circuit board is above the first connector, and a third side of the second circuit board is above the second connector; A fourth side of the second circuit board is above the first connector, and a second side of the first circuit board is above the second connector.

 A memory device according to a fifth aspect of the present invention, wherein the fifth side extends from a first side of the first circuit board; the seventh side extends from a third side of the second circuit board .

 A storage device according to a fifth aspect of the present invention, further comprising a first support base and a second support base, the first support base fastening the sixth side of the first flexible circuit board to the first connector The second support base fastens the eighth side of the second flexible circuit board to the second connector; the first support base supports the first side of the first circuit board, The first support base further supports a fourth side of the second circuit board; the second support base supports a second side of the first circuit board, and the second support base further supports the second circuit board The third side.

 A memory device according to a fifth aspect of the invention, comprising a plurality of said first circuit boards and / or a plurality of said second circuit boards.

 According to the storage device of the fifth aspect of the present invention, the fourth circuit board is provided with one or more memory chips, and the fourth circuit board is coupled with the third circuit board such that the host interface is Accessing one or more memory chips disposed on the fourth circuit board by the controller; a capacity of the memory chip on the fourth circuit board is two of a capacity of the memory chip on the second circuit board The capacity of the memory chip on the fourth circuit board is the same as the capacity of the memory chip on the second circuit board.

 According to a sixth aspect of the present invention, a storage device includes a first circuit board, a second circuit board, and a third circuit board; the first circuit board is provided with a plurality of memory chips, and the second circuit a plurality of memory chips are disposed on the board, and the controller and the host interface are disposed on the third circuit board; the first circuit board is coupled with the third circuit board, and the second circuit board is the same as the first The three circuit boards are coupled to each other such that a plurality of memory chips disposed on the first circuit board and a plurality of memory chips disposed on the second circuit board are accessed by the controller via the host interface; The plurality of memory chips on the first circuit board are configured as a first channel and a second channel, the first channel includes a first number of memory chips, and the second channel includes a second number of memory chips The first quantity is different from the second quantity.

 A storage device according to a sixth aspect of the present invention, wherein the first circuit board further includes a third channel, the third channel includes a third number of memory chips, and the third number is different from the first Quantity.

 According to the storage device of the sixth aspect of the present invention, the plurality of memory chips on the second circuit board are configured as a fourth channel and a fifth channel, and the fourth channel includes a fourth number of memory chips. The fifth channel includes a fifth number of memory chips, the first number being different from the fifth number.

 A memory device according to a sixth aspect of the invention, wherein the number of the plurality of memory chips on the second circuit board is different from the number of the plurality of memory chips on the first circuit board.

 A memory device according to a sixth aspect of the invention, wherein the first circuit board is coupled to the third circuit board by a first connector disposed on the third circuit board, the second circuit board Coupling to the third circuit board by a second electrical connection disposed on the third circuit board; and the first connector is identical to the second connector such that the first circuit board is configurable A second connector on the third circuit board is coupled to the third circuit board, the second circuit board being coupleable to the third by a first electrical connection disposed on the third circuit board Circuit board.

 A memory device according to a sixth aspect of the present invention, wherein the one or more pins of the first connector are for transmitting a signal indicating a number of memory chips on the first circuit board; the second connection One or more pins of the device are used to transmit signals indicative of the number of memory chips on the second circuit board.

A memory device according to a sixth aspect of the invention, wherein the one or more pins of the first connector are for transmitting a signal indicating the number of memory chips each channel of the first circuit board has : One or more pins of the second connector are used to transmit signals indicative of the number of memory chips each channel on the second circuit board has.

 A memory device according to a sixth aspect of the invention, wherein the memory chip has the same storage capacity. According to a seventh aspect of the present invention, a storage device is provided, comprising: a controller, a first memory channel and a second memory channel; the first memory channel and the second memory channel are respectively coupled to the controller; The first memory channel includes a first number of memory chips, and the second memory channel includes a second number of memory chips, the first number being different than the second number.

 A memory device according to a seventh aspect of the present invention, wherein the first number of memory chips are coupled to the controller through a shared first bus, and the second number of memory chips are coupled to the shared second bus The controller. DRAWINGS

 The invention and its preferred modes of use, together with further objects and advantages thereof, will be best understood from the following detailed description of the exemplary embodiments.

 1A, 1B are solid state hard disks of expandable capacity according to the prior art;

 2 is a solid state hard disk including a rigid PCB and a flexible PCB according to the prior art;

 3 is another electronic device including a rigid PCB and a flexible PCB according to the prior art; FIG. 4 is a front view of a memory device in accordance with an embodiment of the present invention;

 5A is a front elevational view of a circuit daughter board of a memory device in accordance with an embodiment of the present invention;

 5B-5E are side views of a memory device circuit daughter board in accordance with an embodiment of the present invention;

 5 F-5 J is a schematic diagram of a connection manner of a flash chip of a circuit sub-board of a memory device and a control circuit according to an embodiment of the present invention;

 6A is a side view showing a manner of connecting a daughter board of a storage device to a motherboard according to an embodiment of the present invention;

 6B is a side view showing another connection manner of a daughter board and a mother board of the memory device according to an embodiment of the present invention;

 7 is a front elevational view showing a connection mode of a daughter board of a memory device and a flexible circuit board according to an embodiment of the present invention;

 Figure 8 is another front elevational view of a storage device in accordance with an embodiment of the present invention;

 Figure 9 is a perspective view of a memory device in accordance with an embodiment of the present invention;

 Figure 10 is a top plan view of a memory device in accordance with an embodiment of the present invention;

 11A, 1 IB. I 1C are perspective views of a support for a storage device according to an embodiment of the present invention; FIG. 12 is another perspective view of a storage device according to an embodiment of the present invention;

 Figure 13 is a front elevational view of a memory device in accordance with another embodiment of the present invention;

 Figure 14 is a front elevational view of a memory device in accordance with yet another embodiment of the present invention. detailed description

4 is a front elevational view of a memory device in accordance with an embodiment of the present invention. The memory device shown in FIG. 4 includes a circuit mother board 400. The circuit motherboard 400 is a circuit board having a PCIE half-height card form that can be connected to a computer through a PCIE slot. Circuit boards 410, 420, and 430 are disposed on the circuit mother board 400. In one embodiment, flash circuit chips 41, 413, 423, and 43 433 are disposed on circuit boards 410, 420, and 430, respectively, such that circuit boards 410, 420, and 430 are provided to the storage device shown in FIG. storage capacity. Also disposed on the circuit motherboard 400 is a flash controller (not shown) for controlling access to the flash chips on the circuit boards 410, 420 and 430 and processing interface commands from the computer. Although shown in Figure 4, A memory device with a PCIE interface of a flash memory chip, but those skilled in the art will appreciate that it is merely an example, and the present invention is applicable to a variety of electronic devices having other functions, and can be coupled to a computer through various interfaces. , Multiple interfaces including but not limited to SATA (Serial Advanced Technology Attachment), USB (Universal Serial Bus), PCIE (Peripheral Component Interconnect Express), SCSI (Small Computer System Interface, Small Computing System 4), IDE (Integrated Drive Electronics), etc. Moreover, the present invention is also applicable to other types of memory chips including flash memories, such as phase change memories, resistive memories, ferroelectric memories, and the like.

 As shown in FIG. 4, the circuit boards 410 and 420 are arranged in opposite directions to each other, and the circuit boards 410 and 430 are arranged in the same direction. Thereby, more flash chips can be arranged on the circuit mother board 400 having a specific size. Moreover, the circuit boards 410, 420 and 430 have the same outer dimensions and the same interface, so that the circuit boards 410, 420 and 430 can be replaced with each other, and other circuit boards can be used instead of the circuit boards 410, 420. With 430.

 Figure 5A is a front elevational view of a daughter board of a storage device embodying an embodiment of the present invention. The circuit daughter card 410 of Figure 4 is more clearly shown in Figure 5A. Circuit daughter cards 420 and 430 may have the same physical form as circuit daughter card 410, but may have the same or a different storage capacity than circuit daughter card 410. In a preferred example, the circuit daughter card 420 has twice the storage capacity of the circuit daughter card 410. Flash chip chips 411, 412, and 413 are disposed on the circuit daughter card 410. In one example, a flash chip is also disposed on the unillustrated side of the circuit daughter card 410. The flash chips 411, 412, and 413 may be flash chips having the same capacity, or may be flash chips having different capacities. The flash chips on circuit daughter card 410 can be organized into multiple channels, each of which includes two or other numbers of flash chips. The individual channels are in parallel with each other and can simultaneously transfer data to or receive data from the circuit mother board 400. A plurality of other flash chips having other numbers can also be arranged on the circuit daughter card 410.

 In the case where the flash memory chips 411, 412, and/or 413 can be accommodated, the size of the circuit daughter card 410 is set as small as possible so that a larger number of circuit daughter cards can be disposed on the circuit mother board 400, thereby improving the storage device. capacity. Since a plurality of circuit daughter cards 410, 420, and/or 430 can be disposed on the circuit mother board, and the circuit daughter cards 410, 420, and 430 can have different capacities from each other, the storage device can have a plurality of different storage capacities. combination. Referring to Table 1, when circuit daughter cards 410, 420, and 430 can have both I92GB (Giga Byte) and 394GB storage capacities, and when up to six circuit daughter cards 410, 420, or 430 can be placed on circuit motherboard 400, , a storage device with a variety of different storage capacities is available. Although a configuration of a memory device including 4 to 6 circuit daughter cards is shown in Table 1, an I block-3 block circuit daughter card may be disposed on the circuit mother board 400 to provide more different storage. capacity.

 Table 1 Storage device storage capacity table

 Subcard combination

 Storage capacity m

 192GB 384GB

 4 0 768GB

 5 0 960GB

 6 0 1152GB

 δ 1 1 44GB

 4 2 15 6GB

 3 3 1728GB

 2 4 1920GB

 1 5 2112GB

0 6 2:304GB Thus, by providing circuit subcards of two different storage capacities, a storage device having a plurality of different capacities is obtained, which can meet the needs of a plurality of different occasions.

 Moreover, since the circuit daughter cards 410, 420 and 430 have the same physical form, the mounting of the circuit daughter cards 41 0, 420 and 430 on the circuit mother board 400 is interchangeable, thereby simplifying the installation process and, When one of the multiple circuit daughter cards fails, it can also be easily replaced. And, by replacing the existing circuit daughter card on the circuit board 400 with a circuit daughter card of a larger capacity and/or higher performance (access speed, reliability, etc.), updating or upgrading of the storage device can be easily realized.

 Those skilled in the art will appreciate that circuit daughter cards having three or more different storage capacities can also be provided, thereby providing a storage device having a greater variety of storage capacities. For example, referring to Table 2, a different number of memory chips (for example, 3-6 memory chips) may be disposed on the circuit daughter board 410, thereby providing 192 GB each with a memory capacity of 64 GB per memory chip. , 256GB, 320GB, and 384GB of storage capacity for the circuit daughter card. By providing a plurality of circuit daughter cards having different storage capacities, a storage device having a wider variety of storage capacities can be obtained. Obviously, if each of the memory chips on circuit board 410 has a different storage capacity, a storage device having a further plurality of different combinations of storage capacities can be provided.

 Table 2 Circuit daughter card storage capacity table

Figure imgf000010_0001

 5B-5E are side views of a circuit daughter board 410 of a memory device embodying an embodiment of the present invention. In FIG. 5B, memory chips 411, 412, 413 > 414, 415, and 416 are disposed on circuit sub-board 410. The circuit daughter board in Figure 5B provides 384GB of storage capacity when each memory chip provides 64GB of storage capacity. In FIG. 5C, memory chips 411, 412, 413, 414, and 415 are disposed on the circuit sub-board 410. The circuit daughter board in Figure 5C provides 320 GB of storage capacity when each memory chip provides 64 GB of storage capacity. In Fig. 5D, memory chips 411, 412, 413, and 414 are disposed on the circuit sub-board 410. The circuit daughter board in Figure 5D provides 256 GB of storage capacity when each memory chip provides 64 GB of storage capacity. In Fig. 5E, memory chips 411, 412, and 413 are disposed on the circuit sub-board 410. The circuit daughter board in Figure 5E provides 192GB of storage capacity when each memory chip provides 64GB of storage capacity.

 Continuing to refer to Figures 5F-5J, Figures 5F-5J are schematic illustrations of the manner in which the flash chip of circuit sub-board 41 0 of the memory device is coupled to control circuit 660, in accordance with an embodiment of the present invention. In order to facilitate the parallelism of operation of a plurality of flash memory chips, and to save 10 resources of the control circuit 660 required to control a plurality of flash memory chips, a plurality of flash memory chips on the circuit board 410 are arranged in a plurality of channels. A plurality of flash chips are arranged in each channel, a plurality of flash chips in each channel share data and/or control buses, and in order to be able to access individual flash chips, multiple flash chips within each channel (and/or/or The chip enable (CE) port of the die can be individually controlled by the control circuit 660.

 Referring to Fig. 5F, three channels are arranged on the circuit board 410. Flash chips 411, 414 are included in the first channel and coupled to control circuit 660 via a shared bus 490. The control circuit 660 can independently control the CE ports of the flash chips 411, 414. Flash memory chips 412, 415 are included in the second channel and coupled to control circuit 660 via a shared bus 492. Control circuit 660 can independently control the CE ports of flash chips 412, 415. Flash chips 413, 416 are included in the third channel and coupled to control circuit 660 via a shared bus 494. Control circuit 660 can independently control the CE ports of flash chips 413, 416.

Alternatively, there may be other numbers of flash chips on each channel. Referring to FIG. 5G, flash chips 411, 412, and 413 are included in the first channel and coupled to control circuit 660 via a shared bus 490. Control Circuitry 660 can independently control the CE ports of flash chips 411, 412, and 413. Flash chips 414, 41 5 and 416 are included in the second channel and coupled to control circuit 660 via a shared bus 494. Control circuit 660 can independently control flash memory chips 414, 415 and 416 ό CE ports.

 Still alternatively, there may be a different number of flash chips on each channel. Referring to Figure 5, flash chips 411, 414 are included in the first channel and coupled to control circuit 660 via a shared bus 490. The control circuit 660 can independently control the CE port of the flash chip 411.414. Flash memory chips 412, 415 are included in the second channel and coupled to control circuit 660 via a shared bus 492. The control circuit 660 can independently control the CE ports of the flash chips 412, 415. Flash chip 413 is included in the third channel and coupled to control circuit 660 via bus 494. The control circuit 660 can control the CE port of the flash chip 4 I 3 . Note that in Figure 5, no flash chip 416 is provided, which corresponds to the example provided in Figure 5C. It is also noted that in FIG. 5A, two flash chips are arranged in the first channel and the second channel, and in the third channel, only one flash chip is disposed, that is, each channel has a different number of Flash chip. It should be noted that although there are different numbers of flash chips on each channel, the storage capacity on each channel can be the same or different. When the flash chip 41 415 in Fig. 5 has the same storage capacity, the storage capacity on the third channel is half of the storage capacity of the first channel. The flash chip 413 can also be provided such that its storage capacity is twice that of the flash chips 411, 412, 414 or 415, so that the storage capacity on each channel is the same.

 It should still be noted that although in the embodiment of FIG. 5A, the flash chip 416 is not included, in the corresponding circuit daughter board 410 of FIG. 5C, preferably, the circuit daughter board 410 of FIG. 5A is provided. The same interface layout. That is, while in the circuit daughter board 410 of Figure 5C, there is no need to provide leads in the interface to the CE port of the flash chip 416, it is advantageous to provide the same interface arrangement for a variety of different circuit daughter boards, which would allow Different circuit daughter boards are coupled to the connectors of the circuit mother board 400, thereby increasing the flexibility of the memory device and simplifying the installation process of the memory device 400 because the circuit daughter board 410 having a specific memory capacity or number of flash memory chips is not limited Mounted on a specific motherboard connector.

 In one embodiment, in the interface of the circuit daughter board 410, three leads are provided, each of which transmits an electrical signal through which one of the first channel, the second channel, and the third channel is disposed on one of the channels. Flash chip or 2 flash chips. Other ways of indicating the configuration of the circuit daughter board 410 will also be appreciated by those skilled in the art. For example, in the interface of the circuit daughter board 410, two leads are provided, which can pass four different states of "00", "01", "10", and "11", each state indicating one of the circuit daughter boards 410. Specific configuration. Also indicated by the interface leads may be the number of memory chips on circuit board 410 or the memory capacity provided on circuit board 410.

 Referring to Figure 51, flash chips 411, 414 are included in the first channel and coupled to control circuit 660 via a shared bus 490. The control circuit 660 can independently control the CE ports of the flash chips 411, 414. Flash chip 412 is included in the second channel and coupled to control circuit 660 via bus 492. Control circuit 660 can control the CE port of flash chip 412. Flash chip 413 is included in the third channel and coupled to control circuit 660 via bus 494. The control circuit 660 can control the CE port of the flash chip 413. Note that in FIG. 5A, the flash chips 415 and 416 are not provided, which corresponds to the example provided in FIG. 5D. Referring to FIG. 5J, the flash chip 411 is included in the first channel. And coupled to control circuit 660 via bus 490. Control circuit 660 can independently control the CE port of flash chip 411. Flash chip 412 is included in the second channel and coupled to control circuit 660 via bus 492. Control circuit 660 can be independent The CE port of the flash chip 412 is controlled. The flash chip 413 is included in the third channel and coupled to the control circuit 660 via the bus 494. The control circuit 660 can independently control the CE port of the flash chip 413. Note that in Figure 5J, Flash memory chips 414, 415 and 416 are not provided, which correspond to the example provided in Figure 5E.

6A illustrates a connection between a circuit daughter board of a memory device and a circuit mother board in accordance with an embodiment of the present invention. Side view. Flash memory chips 411, 412, and 413 are disposed on the circuit sub-board 410. On the side of the circuit daughter board 410 opposite the flash chips 41, 412 and 413, one or more flash chips may also be arranged. Connectors 510, 520 are disposed on the circuit mother board 400 for connection with the connectors 530 and 540, respectively, thereby coupling the circuit board 410 to the circuit mother board 400. Connectors 530 and 540 are disposed at one end of flexible circuit boards 550 and 560, respectively, and the other ends of flexible circuit boards 550, 560 extend from opposite sides of circuit board 410. Flexible circuit boards 550 and 560 can be formed with circuit board 410 in a single process. Since the connectors 510, 540 are respectively connected to the connectors 510, 520, the signal lines transmitted by each of the connectors 530 and 540 can be half the number of signal lines required to access the circuit daughter board 410, thereby, the connector 530 and The size of 540 can be smaller to reduce the space occupied on circuit motherboard 400. Since the circuit mother board 400 and the circuit board 410 are connected through the connectors 510, 520, 530, and 540, the circuit board 410 is replaceable.

 By way of example, it is also possible to couple the flexible circuit boards 550 and 560 without the connectors 510, 520, 530 and 540, but to provide an open area on the circuit mother board 400 and to have the flexible circuit boards 550, 560 from the circuit mother board 400. The upper open area extends. Alternatively, the flexible circuit boards 550, 560 are respectively extended from opposite sides of the circuit mother board 400, and the flexible circuit boards 550, 560 and the circuit mother board 400 are formed in one process.

 Still by way of example, flexible circuit boards 550, 560 can also be coupled to circuit daughter board 410 via connectors. Connectors are also provided on opposite sides of the circuit daughter card 410 for connecting the flexible circuit boards 550, 560.

 Figure 6B shows a side view of another way of connecting a circuit daughter board of a memory device to a circuit motherboard in accordance with an embodiment of the present invention. Flash memory chips 411, 412, and 413 are disposed on the circuit sub-board 410. On the side of the circuit board 410 opposite the flash chips 411, 412 and 413, one or more flash chips may also be arranged. On the side of the circuit daughter board 410 opposite the flash chips 411, 412 and 413, one or more flash chips may also be arranged. A connector 620 is disposed on the circuit motherboard 400 for connection to the connector 630 to couple the circuit daughter board 410 to the circuit mother board 400. The connector 630 is disposed at one end of the flexible circuit board 640, and the other end of the flexible circuit board 640 extends from opposite sides of the circuit board 410. The flexible circuit board 640 can be formed in one process with the circuit daughter board 410. Since the connector 630 is connected to the connector 620, the signal line transmitted by the connector 630 can be the total number of signal lines required to access the circuit daughter board 410, so that larger sized connectors 630 and 620 are required. In a preferred embodiment, to provide a reliable connection between the flexible circuit board 640 and the circuit motherboard 400, the connector 630 is sized larger than the length of the flexible circuit board 640 from the junction of the circuit daughter card 410. In this case, the flexible circuit board 640 has a trapezoidal shape, which will be further described in FIG. Although the use of a single connector 630 to connect the circuit daughter board 410 to the circuit motherboard 400 requires a connector of a larger size, it is convenient to install because the circuit daughter card 410 can be connected to the installation operation only once. The circuit board 400, and the end of the circuit daughter card 410 without the connector provides space for the mounting operation.

 By way of example, an open area may also be provided on the circuit mother board 400 such that the flexible circuit board 640 extends from the open area on the circuit mother board 400. Alternatively, the flexible circuit board 640 is respectively extended from the opposite sides of the circuit mother board 400, and the flexible circuit board 640 and the circuit mother board 400 are formed in one process.

 Still by way of example, flexible circuit board 640 can also be coupled to circuit daughter board 410 via a connector. A connector is also provided on the circuit daughter card 410 for connecting the flexible circuit board 640.

 In order to increase the space utilization of the circuit mother board 400, the connector 620 is placed close to one side of the circuit mother board 400. And the circuit daughter card 410 is placed perpendicular to the side.

7 is a front elevational view showing the manner in which the circuit daughter board 410 of the memory device is connected to the flexible circuit board 640, in accordance with an embodiment of the present invention. Flash memory chips 411, 412, and 413 are disposed on the circuit sub-board 410. Flexible circuit board 640 has opposing sides 681 and 682. One side 681 of the flexible circuit board 640 extends from one side of the circuit sub-board 41 0 . A connector 630 is disposed on the side 682 of the flexible circuit board 640 opposite the side 681 for connection to the circuit mother board 400. Since the signal line transmitted by the connector 630 can be an access circuit daughter board All of the signal lines required for 410 are such that the length of the side 682 is greater than the length of the side 681, thereby allowing a sufficient number of signal lines to be accommodated in the connector 63 0 and ensuring connection reliability of the flexible circuit board 640 and the circuit mother board 400.

 It is also noted that in FIG. 7, the flexible circuit board 640 extending from one side of the circuit daughter card 410 forms a plane with the circuit daughter card 410, and the connector 630 and the flash memory chips 411, 412 and/or 413 are in the plane. The same side. Referring to FIG. 6B, when the flexible circuit board 640 is connected to the circuit mother board 400, the flexible circuit board is bent such that the connector 630 faces the circuit mother board 400, and the flash memory chips 411, 412, and/or 413 are facing away from the circuit mother board. 400. In Figure 8, this will be further described.

 Circuit board 410 can have a variety of storage capacities. The wiring connected to the circuit mother board 400 is provided in the flexible circuit board 640 and the connector 630 to indicate the storage capacity of the circuit board 410 to the controller on the circuit mother board. When the circuit daughter board 410 has two different storage capacities, such as one of 192 GB and 384 GB, a wiring can be provided to the circuit board by coupling the wiring to the high or low level on the circuit board 410. The controller on 400 indicates whether the storage capacity of the circuit daughter board 410 is 192 GB or 384 GB. It is also possible to reserve more than one wire to indicate the storage capacity of the circuit daughter board 410. In another example, circuit board 410 encodes the memory capacity information thereon and passes the encoded information to a controller on circuit board 400. In still another example, the control circuitry on the circuit board 400 can access the flash chips 411, 412, and 413 to obtain the storage capacity of each of the flash chips, thereby obtaining the storage capacity of the circuit daughter board 410. Those skilled in the art will also appreciate that in the manner in which the circuit daughter board 410 and the circuit motherboard 400 are connected as shown in FIG. 6A, wiring may also be provided in the connectors 530 and/or 540 to the circuit mother board 400. The storage capacity of the circuit daughter board 410 is indicated, and the connector 530 and the connector 540 have the same physical dimensions and wiring arrangement.

 Figure 8 is another front elevational view of a memory device in accordance with an embodiment of the present invention. Circuit board 410 is shown coupled to circuit board 400 via flexible circuit board 640 and connector 630 disposed on flexible circuit board 640. It is noted that in Figure 8, connector 630 faces circuit board 400 and flash chips 411, 412 and/or 413 are facing away from circuit board 400. The connector 630 is connected to a connector (not shown) disposed on one side of the circuit mother board. In the preferred embodiment, the connector 630 is disposed on the longer side of the circuit motherboard 400 and the circuit daughter board 410 is perpendicular to the longer side of the circuit motherboard 400. Thereby, a plurality of circuit sub-boards 410 can be arranged in parallel on the circuit mother board 400. The flexible circuit board 640 is bent such that one side thereof extends from one side of the circuit sub-board 410, and the connector 630 faces the circuit mother board 400 and is connected to the circuit mother board 400. When the flexible circuit board 640 is in an unbent state, the connector 630 faces the same side as the flash chips 411, 412, and/or 413. In Fig. 8, the circuit sub-board 410 is parallel to the circuit mother board 400, and the circuit sub-board 410 and the circuit mother board 400 are spatially separated from each other. The space between the circuit daughter board 410 and the circuit mother board 400 can be used for the mounting of the circuit board 410. Through this space, a force can be applied to the back side of the connector 630 to mount the connector 630 to the connector on the circuit board 400.

 As can also be seen in Figure 8, the length of the connector 630 is greater than one side of the circuit daughter board 410 from which the flexible circuit board 640 extends. That is, the length of one side of the flexible circuit board 640 connected to the circuit sub-board 410 is smaller than the length of one side of the flexible circuit board on which the connector 630 is disposed.

9 is a perspective view of a memory device in accordance with an embodiment of the present invention. The circuit daughter boards 4 10 and 420 are shown in FIG. 9 to be connected to the circuit mother board 400 by a flexible circuit board 640 (not shown) and a flexible circuit board 642. Flash memory chips 411, 412, and 413 are disposed on the circuit sub-board 410, and flash memory chips 421, 422, and 423 are disposed on the circuit sub-board 420. One or more flash chips may also be disposed on one side of the circuit daughter boards 410, 420 facing the circuit mother board 400. The connector 630 is disposed on the flexible circuit board 640 and is connectable to a connector 620 disposed on the circuit mother board. The connector 632 is disposed on the flexible circuit board 642 and is connectable to a connector 622 disposed on the circuit mother board. Preferably, the flexible circuit board 642 is the same flexible circuit board as the flexible circuit board 640, and the connector 632 is the same as the connector 630, and the connector 622 is connected to the connector 620. As such, the circuit daughter board 410 and the circuit daughter board 420 are interchangeably connected to the circuit mother board 400.

 When the circuit daughter board 420 is connected to the connector 622 through the connector 632 and the circuit board 410 is connected to the connector 620 through the connector 630, the side 415 of the circuit board 410 is located above the connector 632, and the circuit board 420 The edge 425 is located above the connector 630. A flexible circuit board 640 (not shown) extends from the side 417 of the circuit board 410 opposite the side 415, and the flexible circuit board 642 extends from the side 427 of the circuit board 420 opposite the side 425. In this manner, although the length of the connectors 630, 632 is greater than the edge 417 of the circuit daughter board 410 and the side 427 of the circuit daughter board 420, since the spaces corresponding to the connectors 630 and 632 are shared by the circuit daughter boards 410 and 420, This makes it possible to arrange more circuit daughter cards on the circuit mother board 400.

 Also, when the circuit boards 410, 420 are mounted on the circuit mother board 400, since the flexible circuit boards 640 and 642 can be in a non-bent state, it is convenient to apply a force to the back sides of the connectors 630 and 632 to Connected to connectors 620 and 622, respectively. Next, the flexible circuit boards 640 and 642, make the circuit boards 410 and 420 parallel to the circuit board 400, thereby reducing the space occupied by the memory devices formed by the circuit boards and the circuit boards 410, 420.

 Since the circuit boards 410 and 420 are parallel to each other and face to end, and share the space formed by the connectors 630 and 632, the circuit boards 410 and 420 can be regarded as a circuit board group.

 Figure 10 is a top plan view of a memory device in accordance with an embodiment of the present invention. In FIG. 10, circuit daughter boards 410, 420, and 430 are shown. Circuit board 430 may be a circuit board having the same physical shape as circuit boards 410, 420, but having the same circuit board 410, 420 or Different storage capacity. The circuit board 41 0 is connected to the circuit mother board 400 via a flexible circuit board 640, a connector 630, and a connector 620. The circuit daughter board 4 30 is connected to the circuit mother board 400 via a flexible circuit board 644, a connector 634, and a connector 624. The connector 63 4 is disposed on the flexible circuit board 644, and the connector 624 is disposed on the circuit mother board 400. Preferably, connectors 620 and 624 are placed on the same line along the long sides of circuit motherboard 400. The edge 417 of the circuit daughter board 410, the side 425 of the circuit daughter board 420, and the side 437 of the circuit board 430 are placed on substantially the same straight line. As shown in FIG. 10, since the flexible circuit board 640 is trapezoidal, that is, the length of the connector 630 is greater than the length of the side 417, the side 425 of the circuit daughter card 420 can be located below the connector 630 and separated from the connector 630. And the side 425 and the side 417 are on substantially the same straight line.

 The circuit daughter board 410 and the circuit daughter board 420 form a circuit daughter board group. In a preferred embodiment, the circuit daughter board assembly is secured to the circuit board 400 by a shared support base to reduce reliability issues associated with sway of the circuit board. This will be further described in Figures 11A, 1 IB. 11C and 12. As well, those skilled in the art will recognize that the use of a support base will not affect the operation of the storage device. The circuit daughter board 430 can form a circuit daughter board group with another circuit daughter board (not shown).

 As an example, it can also be seen from Figure 10 that although the length of the connector 630 is greater than the length of the side 417, it is less than the sum of the lengths of the side 417 and the side 425, so that the length of the connector 630 is suitable for ensuring the reliability of the connection. And has a smaller size to reduce the manufacturing cost of the connector 630.

11A, 11B, 11C are perspective views of a support base 1100 for a storage device in accordance with an embodiment of the present invention. The support base 1100 includes side walls 1110, 1112 that are disposed opposite to each other and are parallel to each other for coupling the support base 1100 and the circuit mother board 400. In one example, screw holes are formed in the side walls 1110 and 1112 to further secure the support base to the motherboard 400 by bolts. The support also includes a plate 1120. Plate 1120 is vertically coupled between side walls 1110 and 1112. The plate 1120 and the side walls 1 I 10, 1120 may be integrally formed. The plate 1120 has opposing first and second surfaces 1122, 1124. The first surface 1122 faces away from the circuit mother board 400 and is used to support two circuit daughter boards, the second surface 1124 facing the circuit mother board 400 and for compressing the connectors disposed on the flexible circuit board. There is a protrusion I 132 in the direction perpendicular to the first surface 1122 for dividing the two circuit daughter boards > and limiting the movement of the circuit daughter board. A second protrusion 1134 is formed in a direction parallel to the first surface 1122. The coupling relationship between the support base 1100, the circuit boards 410, 420, and the circuit mother board 400 will be further described in FIG. Although described above in connection with Figures I 1A, 1 IB, I IC A particular structure of the support 1100, those skilled in the art will appreciate that a support or other component having other configurations can be utilized to provide a secure connection between the circuit daughter boards 410 and/or 420 and the circuit motherboard 400.

 Figure 12 is another perspective view of a memory device in accordance with an embodiment of the present invention. In contrast to the storage device shown in Figure 9, support seats 1100 and 1200 are also shown in Figure 12. In Fig. 12, the support base 1100 is shown below the connector 632 for clarity, and the support base 1200 is shown below the connector 630. At the time of installation, and in the installed storage device, the support 1100 is used to press the connector 632 against the connector 622, and the support base 1200 is used to press the connector 630 against the connector 620.

 Connector 632 is coupled to connector 622 during installation. The support 1100 is then placed on the back of the connector 632 and the second surface 1124 of the plate 1120 of the support is pressed against the connector 632. In one example, the two side walls of the support base 1100 can also be secured to the circuit board 400 by bolts. Similar to the support 1100, the support base 1200 presses the connector 630 against the connector 620.

 The face 1229 of the support 1100 is perpendicular to the first surface 1122 (see Figs. 1 IA, 11B and 1 IC) and the second surface 1124 and is located opposite the protrusion 1134 (see Figs. 11A, 11B and 11C).

 The board 1120 of the support base 100 is used to fill the space between the connector 632, the flexible circuit board 642 and the circuit boards 4 10, 420, and to support the circuit boards 410 and 420. The protrusion 1132 divides the plate 1120 into slots 1 217 and 1218. After the support 1100 is pressed against the connector 632, the flexible circuit board 642 is bent along the face 1229, and the side of the circuit daughter card 420 near the side 427 is placed on the slot 1218 of the support 1100. The slot 1218 is disposed such that the circuit daughter card 420 is placed in the slot 1218 and the movement of the circuit daughter card 420 is restricted by the protrusion 1132 and the side wall of the support base 1100.

 Similarly, after the support base 1200 is pressed against the connector 630, the flexible circuit board 640 (not shown in FIG. 2) is bent, so that the side of the circuit daughter board 410 near the side 417 is placed on the support base 1200. a surface. The side of the circuit daughter board 420 near the side 425 is placed on the first surface of the support base 1200, and the second surface of the support base 1 200 is used to compress the connector 630. And placing the side of the circuit daughter card 410 near the side 415 on the slot 1217 of the support base 1100. The slot 1217 is arranged such that the circuit daughter card 410 is placed in the slot 1217 and the movement of the circuit daughter card 410 is restricted by the protrusion 1132 and the other side wall of the support base 1100.

 The support bases 1100, 1200 limit the movement of the circuit daughter cards 410, 420 in a direction perpendicular to the circuit mother board 400, thereby improving the reliability of the storage device. In a preferred embodiment, circuit boards 410 and 420 are also secured to support base 1100 via screws 1134 by screws. In a similar manner, circuit boards 410 and 420 are secured to support base 1200.

Figure 13 is a front elevational view of a memory device in accordance with another embodiment of the present invention. The memory device shown in FIG. The circuit mother board 400 is a circuit board having a PCIE half-height card form that can be connected to a computer through a PC1E slot. Circuit boards 410, 420, 430, and 440 are disposed on the circuit mother board 400. In one embodiment, flash circuit chips 41, 413, 421-423, 43 433, and 44 443 are disposed on circuit boards 410, 420, 430, and 440, respectively, such that circuit boards 410, 420, 430, and 440 are oriented. The storage device shown in Figure 13 provides storage capacity. Although three flash memory chips are placed on each of the circuit daughter boards 410-440 in FIG. 13, those skilled in the art will appreciate that other numbers of flash memory chips can also be placed on the circuit daughter boards 410-440, such as A flash memory chip is placed on the surface of the circuit daughter board 410 opposite to the surface on which the flash memory chips 411-413 are located. Also disposed on the circuit motherboard 400 is a control circuit 660 for controlling access to the flash chips on the circuit boards 410, 420, 430, and 440 and processing interface commands from the computer. Also disposed on the circuit mother board 400 are memories 662, 664, 666, and 668 such as DRAM (Dynamic Random Access Memory). Memory 662, 664, 666, and 668 can be coupled to control circuit 660. The control circuit 660 can be in the form of an FPGA (Field-programmable gate array), an ASIC (Application Specific Integrated Circuit), or a combination thereof. Control circuit 660 can also include a processor or controller. One, two or more processor cores may be included in the control circuit 00, each processor core for controlling or accessing multiple circuits Part or all of the card. Each processor core can also be used to access or control some or all of the plurality of flash chips on the circuit daughter card.

 Connectors 628 and 629 are also disposed on the circuit mother board 400 as shown in FIG. The circuit daughter card can also be connected to the circuit mother board 400 via connectors 62 8 and 629, respectively. Thus, up to six circuit daughter cards can be connected to the circuit mother board 400 having the PCIE half-height card form as shown in FIG. Circuit daughter card 410 is coupled to circuit mother board 400 via flexible circuit board 640. Circuit daughter card 420 is coupled to circuit mother board 400 via flexible circuit board 642. Circuit daughter card 430 is coupled to circuit mother board 400 via flexible circuit board 644. Circuit daughter card 440 is coupled to circuit mother board 400 via flexible circuit board 646. In a similar manner, the circuit daughter card is also coupled to circuit mother board 400 via connector 628 or 629 via a flexible circuit board.

 A plurality of circuit daughter cards on the circuit mother board 400 are placed in parallel with each other. The long sides of the plurality of circuit daughter cards are placed along the short sides of the circuit board 400, and the short sides of the plurality of circuit daughter cards are placed along the long sides of the circuit mother board 400. The short sides of multiple circuit daughter cards are placed substantially in the same line. The circuit daughter card 410 opposes the end of the 420 and shares the space formed by the flexible circuit boards 640, 642 to form a circuit daughter card set. Circuit daughter card 430 is opposite the beginning and end of 440 and shares the space formed by flexible circuit boards 644, 646 to form a circuit daughter card set. Similarly, the circuit daughter cards connected to connectors 628 and 629 are also end to end and form a circuit daughter card set. There may be space between the plurality of circuit daughter cards and the circuit motherboard, in which other electronic components may be placed.

 In a preferred embodiment, a heat sink is also provided for transferring heat generated by the flash chip and/or control circuit 660 and/or memories 662, 664, 666 and 668 on the plurality of circuit daughter cards to the outside of the storage device .

 Figure 14 is a front elevational view of a memory device in accordance with yet another embodiment of the present invention. The memory device shown in Fig. 14 includes a circuit mother board 400. The circuit mother board 400 is a circuit board having a PC1E full-height card form that can be connected to a computer through a PC1E slot. Circuit boards 410, 420, 430, 440, 4 50, 460, 470, and 480 are disposed on the circuit mother board 400. In one embodiment, the flash sub-chips 410-480 are respectively disposed with flash memory chips 411-413. 421-423, 431-433, 441-443. 451-453. 461-463. 471-473 7 481-483, The circuit daughter boards 410-480 are caused to provide storage capacity to the storage device shown in FIG. Each of the circuit daughter boards 410-480 is connected to the circuit mother board 400 through a flexible circuit board, in particular, to a connector on the circuit mother board 400. The circuit daughter boards 410-480 are placed in two rows and four columns. The long sides of each of the circuit boards 410-480 are placed along the short side of the circuit board 400, and the short sides of each of the circuit boards 410-480 are placed in the direction of the long sides of the circuit board 400.

 The long sides of the circuit boards 410 and 420 are parallel and adjacent to each other, and the circuit boards 410 and 420 are opposed to each other to form a circuit sub-board group. The long sides of the circuit boards 430 and 440 are parallel and adjacent to each other, and the circuit boards 430 and 440 are opposed to each other to form a circuit sub-board group. The long sides of the circuit sub-boards 450 and 460 are parallel and adjacent to each other, and the circuit sub-boards 450 and 460 are opposed to each other to form a circuit sub-board group. The long sides of circuit boards 470 and 480 are parallel and adjacent to each other, and circuit board 470 is opposite the head and tail of 480 to form a circuit board group. In the PCIE full-height card form circuit mother board 400, up to six circuit boards can be arranged in the long side direction of the circuit mother board 400, and up to two circuits can be arranged in the short side direction of the circuit board 400. Daughter board.

 Connectors 628, 629, 688, and 689 are also disposed on the circuit mother board 400 as shown in FIG. The circuit daughter card can also be connected to the circuit mother board 400 via connectors 628, 629, 688 and 689, respectively. Thus, up to 12 circuit daughter cards can be connected to the circuit board 400 having the PCIE half-height card form as shown in FIG.

Also disposed on the circuit motherboard 400 are control circuits 660, 670 for controlling access to the flash chips on the circuit boards 410-480 and processing interface commands from the computer. Memory 662, 664, 666, 668, 672, 674, 676, and 678, such as DRAM, are also disposed on the circuit mother board 400. Memory 6 62-668 and 672-678 may be coupled to control circuits 660, 670, respectively, or shared between control circuits 660, 670. Control circuits 660, 670 can be in the form of an FPGA, an ASIC, or a combination thereof. Control circuit 6 60, 670 may also include a processor or controller. Each of the control circuits 660, 670 is used to control or access part or all of a plurality of circuit daughter cards, for example, the control circuit 660 is used to control or access the circuit daughter cards 4 1 0- 440, and the control circuit 670 is used to access Or control circuit daughter card 450-480. Control circuits 660, 670 can also be used to access or control some or all of the plurality of flash chips on the circuit daughter card.

 In a preferred embodiment, a heat sink is also provided for transferring heat generated by the flash chips and/or control circuits 660, 670 and/or memories 662-668, 672-678 on the plurality of circuit daughter cards to the storage Equipment for the evening.

 The description of the present invention has been presented for purposes of illustration and description. Many modifications and variations will be apparent to those skilled in the art.

Claims

Claim
 What is claimed is: 1. An electronic device comprising a first rigid circuit board, a second rigid circuit board and a flexible circuit board, the flexible circuit board transmitting a telecommunications station between the first rigid circuit board and the second rigid circuit board The first rigid circuit board has opposite first and second sides;
 The flexible circuit board has opposite third and fourth sides;
 The third side of the flexible circuit board is coupled to the first side of the first rigid circuit board,
 a fourth side of the flexible circuit board coupled to the first region of the second rigid circuit board;
 The width of the fourth side is greater than the width of the first side.
 2. The electronic device of claim 1
 a connector on the flexible circuit board, the connector for coupling the flexible circuit board to a first region of the second rigid circuit board; the first region being disposed with the first connector Corresponding connector.
 3. The electronic device of claim 1
 The third side extends from a first side of the first rigid circuit board and/or the fourth side extends from a first area of the second rigid circuit board.
 4. The electronic device of claim 1 wherein
 The first side of the first rigid circuit board is located above the first area.
 5. The electronic device of claim 2, further comprising a first support base,
 The first support base presses the connector against the second rigid circuit board,
 The first support base supports a first side of the first rigid circuit board.
 6. The electronic device of claim 5, further comprising a second support base;
 The second support base supports a second side of the first rigid circuit board.
 7. The electronic device of claim 3,
 a connector is disposed on the flexible circuit board, the flexible circuit board and the plane where the first rigid circuit board is located have a first surface and a second surface opposite to each other, and the connector is disposed on the first surface The connector is configured to couple the flexible circuit board to the first region of the second rigid circuit board such that when the connector faces the second rigid circuit board, the first rigid circuit board The first side faces away from the second rigid circuit board.
 8. An electronic device according to any of the preceding claims, wherein the first rigid circuit board is provided with a memory and the second rigid circuit board is provided with a controller and a host interface.
 9. An electronic device according to any of the preceding claims, wherein the flexible circuit board is provided with wiring indicating the configuration of the first rigid circuit board.
 An electronic device according to any of the preceding claims, wherein the first rigid circuit board is rectangular, and the first side and the second side are short sides of the rectangle.
1 1. A method for mounting an electronic device, the electronic device comprising a first rigid circuit board, a second a rigid circuit board and a flexible circuit board extending from one side of the first rigid circuit board, the method comprising:
 Connecting a first connector disposed on the flexible circuit board to a second connector disposed on the second rigid circuit board;
 Pressing the first connector to the second rigid circuit board using the support base;
 Bending the flexible circuit board along a surface of the support base;
 The first rigid circuit board is fixed to the support base.
 1 2. The method according to claim 1 , wherein a lower surface of the support base presses the first connector, and the first rigid circuit board is placed on a concave surface of an upper surface of the support base In the slot.
1 3. An electronic device comprising a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, a first flexible circuit board and a second flexible circuit board;
 The first flexible circuit board transmits an electrical signal between the first rigid circuit board and the third rigid circuit board,
 The second flexible circuit board transmits an electrical signal between the second rigid circuit board and the third rigid circuit board,
 The first rigid circuit board has opposite first and second sides;
 The second rigid circuit board has opposite third and fourth sides;
 The first flexible circuit board has an opposite fifth side sixth side, and the fifth side is coupled to the first side of the first rigid circuit board;
 The second flexible circuit board has an opposite seventh side, the seventh side being coupled to the third side of the second rigid circuit board;
 The sixth side is coupled to a first region of the third rigid circuit board, the eighth side being coupled to a second region of the rigid circuit board;
 The width of the sixth side is greater than the width of the first side, and the width of the eighth side is greater than the width of the third side.
 1 4. The electronic device according to claim 13, wherein
 The fifth side extends from the first side of the first rigid circuit board;
 The seventh side extends from a third side of the second rigid circuit board.
 The electronic device according to claim 13, wherein
a first connector is disposed on a sixth side of the first flexible circuit board, and a second connector is disposed on an eighth side of the second flexible circuit board; the first connector is configured to use the first flexible circuit a board coupled to the first region of the third rigid circuit board; the second connector for coupling the second flexible circuit board to a second region of the third rigid circuit board; the first area arrangement There is a connector corresponding to the first connector, and the second region is provided with a connector corresponding to the second connector.
1 . The electronic device according to claim 13 , wherein a sixth side of the first flexible circuit board extends from a first region of the third rigid circuit board, and the second flexible circuit board The eighth side extends from the second region of the third circuit board.
 1 1. The electronic device according to claim 13, wherein the first region is a portion of a ninth side of the third rigid circuit board, and/or the second region is the third rigid circuit The tenth part of the board
The electronic device according to claim 15, further comprising a first support base and a second support base, the first support base pressing the first connector on the third rigid circuit board The second support base presses the second connector on the third rigid plate;
 The first support base supports a first side of the first rigid circuit board, and the first support base further supports a fourth side of the second rigid circuit board;
 The second support base supports a second side of the first rigid circuit board, and the second support base further supports a third side of the second rigid circuit board.
 The electronic device according to claim 15 or 18, wherein
 a plane in which the first flexible circuit board and the first rigid circuit board are located have first and second faces opposite to each other; a plane in which the second flexible circuit board and the second rigid circuit board are located have each other The opposite third and fourth sides;
 The first connector is disposed on the first surface, the second connector is disposed on the third surface; the first connector is configured to couple the first flexible circuit board to the first a first region of the three rigid circuit board, such that the first connector faces the third rigid circuit board, the first surface of the first rigid circuit board faces away from the third rigid circuit board;
 The second connector is for coupling the second flexible circuit board to a second region of the third rigid circuit board such that the second connector faces the third rigid circuit board, the second The first side of the rigid circuit board faces away from the third rigid circuit board.
 The electronic device according to any one of claims 1 to 3, wherein a memory is disposed on the first rigid circuit board, and a memory is disposed on the second rigid circuit board, the third rigid circuit board A controller and host interface are arranged on the top.
 An electronic device according to claim 20, wherein a storage capacity of the memory on the first rigid circuit board is twice the storage capacity of the memory on the second rigid circuit board.
 22. The electronic device according to claim 13, wherein a first side of the first rigid circuit board is located above the first area, and a third side of the second rigid circuit board is located in the second Above the region; a fourth side of the second rigid circuit board is above the first area, and a second side of the first rigid circuit board is above the second area.
The electronic device according to any one of claims 1 to 3, wherein the first flexible circuit board is provided with a wiring indicating a storage capacity of a memory on the first rigid circuit board, the second flexibility A wiring indicating a storage capacity of a memory on the second rigid circuit board is disposed on the circuit board.
24. A method for mounting an electronic device, the electronic device comprising a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, a first flexible circuit board, and a second flexible circuit board, A flexible circuit board extending from one side of the first rigid circuit board, the second flexible circuit board extending from one side of the second rigid wake circuit board, the method comprising:
 Connecting a first connector disposed on the first flexible circuit board to a second connector disposed on the third rigid circuit board;
 Pressing the first connector onto the third rigid circuit board using the first support;
 Bending the first flexible circuit board along a surface of the first support;
 Fixing the first rigid circuit board to the first support base;
 Connecting a third connector disposed on the second flexible circuit board to a fourth connector disposed on the third rigid circuit board;
 Pressing the third connector onto the third rigid circuit board using a second support;
 Bending the second flexible circuit board along a surface of the second support base;
 Fixing the second rigid circuit board to the second support base;
 Fixing the second rigid circuit board to the first support base;
 Fixing the first rigid circuit board to the second support base.
 25. The method according to claim 24, wherein a lower surface of the first support base presses the first connector, and the first rigid circuit board is placed on an upper surface of the first support base The first ω groove; the lower surface of the second support base compresses the third connector, and the second rigid circuit board is placed in the first groove of the upper surface of the second support base The first rigid circuit board is placed in a second recess of the upper surface of the second support base, and the second rigid circuit board is placed in the first recess of the upper surface of the first support base .
PCT/CN2013/001368 2012-11-11 2013-11-11 Electronic equipment WO2014071695A1 (en)

Priority Applications (4)

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CN201210450948.8A CN103809678B (en) 2012-11-11 2012-11-11 Electronic equipment
CN201210450948.8 2012-11-11
CN201210449174.7A CN103809673B (en) 2012-11-11 2012-11-11 Electronic equipment
CN201210449174.7 2012-11-11

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US20070165390A1 (en) * 2005-12-02 2007-07-19 Samsung Electronics Co., Ltd. Printed circuit board
CN101192443A (en) * 2006-12-01 2008-06-04 宇瞻科技股份有限公司 Extensible hard disc module
CN201402611Y (en) * 2009-05-12 2010-02-10 成都市华为赛门铁克科技有限公司 Solid-state disk
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