CN103809678B - Electronic equipment - Google Patents

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Publication number
CN103809678B
CN103809678B CN201210450948.8A CN201210450948A CN103809678B CN 103809678 B CN103809678 B CN 103809678B CN 201210450948 A CN201210450948 A CN 201210450948A CN 103809678 B CN103809678 B CN 103809678B
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China
Prior art keywords
circuit
circuit board
flexible pcb
adapter
rigid circuit
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CN201210450948.8A
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CN103809678A (en
Inventor
倪勇
殷雪冰
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Beijing Memblaze Technology Co Ltd
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Beijing Memblaze Technology Co Ltd
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Priority to CN201210450948.8A priority Critical patent/CN103809678B/en
Priority to PCT/CN2013/001368 priority patent/WO2014071695A1/en
Publication of CN103809678A publication Critical patent/CN103809678A/en
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Abstract

Electronic equipment, including the first rigid circuit board, second rigid circuit board and flexible PCB, described flexible PCB transmits the signal of telecommunication between described first rigid circuit board and described second rigid circuit board, described first rigid circuit board have relative first while and when second;Described flexible PCB have relative the 3rd while and when the 4th;When being coupled to the first of described first rigid circuit board, the first area of described second rigid circuit board is coupled on the 4th side of described flexible PCB to the 3rd of described flexible PCB;Described 4th while width be more than described first while width.

Description

Electronic equipment
Technical field
The present invention relates to electronic equipment, more particularly, the present invention relate to solid storage device(Solid Storage Device,SSD)Printed circuit board system.
Background technology
Similar, the solid storage device with mechanical type hard disk(SSD)It is also the Large Copacity, non-volatile for computer system Property storage device.Solid storage device is typically with flash memory(Flash)As storage medium.High performance solid storage device by with In high-performance computer.
In patent application WO2011085131A2, there is provided the solid state hard disc of the expansible capacity as shown in Figure 1A, 1B. In Figure 1A, multiple adapters 204 are disposed with the main printed circuit board 205 of solid state hard disc, and flash chip(Not shown). Adapter 204 can be removably attached to subcard.Subcard may include flash chip, to provide additional storage to solid state hard disc Ability.Subcard 608,610 is provided, each subcard includes flash chip 609 and adapter 607 in Figure 1B.By adapter 606 Receive each subcard.Each subcard 608 and 610 can be connected to main PCB individually or together(Printed Circuit Board, print Printed circuit board)601.The capacity of the flash chip of subcard is presented to main frame by interface 603 by controller 602.If subcard 608 He 610 are inserted into, and the capacity of the flash chip 609 on controller 602 each subcard of polymerizable is logically to present to main frame.
In utility model patent CN201402611Y, there is provided solid state hard disc as shown in Figure 2.As memory module First Coupled Rigid-flexible PCB 4 includes multiple flash chips 41, and the second Coupled Rigid-flexible PCB 5 as master control borad includes controlling core Piece 51.First Coupled Rigid-flexible PCB 4 includes rigid PCB 42 and flexible PCB 43, and the second Coupled Rigid-flexible PCB 5 includes rigid PCB 52 and flexible PCB 53.First Coupled Rigid-flexible PCB 4 and the second Coupled Rigid-flexible PCB 5 passes through flexible PCB 43 and flexible PCB 53 The holding wire of upper setting and via realize the connection of the signal on the first Coupled Rigid-flexible PCB 4 and the second Coupled Rigid-flexible PCB 5.Soft Property PCB 43 and flexible PCB 53 are as described in the diagonal line hatches region in Fig. 2.Flexible PCB 43 and flexible PCB 53 and rigidity PCB 42 and rigid PCB 52 can be formed in time processing.
Provide the PCB with flexible PCB in US2007165390A1, as shown in Figure 3.Fig. 3 includes, and first Base plate 100, the second base plate 200 and signal transmission flexible circuit(FPC,Flexible,Printed Circuit).First base plate 100 is disconnected from each other with the second base plate 200, and transmits signal using FPC.Second base plate 200 can be installed electronic component 201, 202, electronic component 101,102 can be installed on the first base plate 100, and micro-control unit(MCU, Micro Control Unit).First base plate 100 includes opening portion 300, and it is formed at the region with dimension D, and dimension D is less than the first base plate 100 Full-size(d).Signal transmission part FPC can be extended from opening portion 300.
However, being the memory capacity improving storage device, need to arrange more storage chips in limited space.But More storage chips need more leads to implement control, and this space limited with storage device contradicts.Furthermore, it is desirable to The storage device with multiple different memory sizes and/or different storage chip quantity is provided, and does not dramatically increase cost.
Content of the invention
According to the first aspect of the invention, there is provided a kind of electronic equipment, including the first rigid circuit board, the second rigid electric Road plate and flexible PCB, described flexible PCB passes between described first rigid circuit board and described second rigid circuit board Pass the signal of telecommunication, described first rigid circuit board have relative first while and when second;Described flexible PCB has relative 3rd while and when the 4th;The 3rd of described flexible PCB is when being coupled to the first of described first rigid circuit board, described soft The first area of described second rigid circuit board is coupled on 4th side of property circuit board;The width on described 4th side is more than described the The width on one side.
In electronic equipment according to the first aspect of the invention, described flexible PCB is disposed with adapter, described company Connect device for described flexible PCB being coupled to the first area of described second rigid circuit board;Described first area is disposed with The adapter corresponding with described first adapter.
In electronic equipment according to the first aspect of the invention, described 3rd side is from the first of described first rigid circuit board While extending, and/or described 4th side is extended from the first area of described second rigid circuit board.
In electronic equipment according to the first aspect of the invention, the first side of wherein said first rigid circuit board is located at institute State the top of first area.
In electronic equipment according to the first aspect of the invention, also include the first support base, described first support base is by institute State adapter to be pressed on described second rigid circuit board, described first supports first of the first rigid circuit board described in seat supports Side.
In electronic equipment according to the first aspect of the invention, also include the second support base;Described second support seat supports Second side of described first rigid circuit board.
In electronic equipment according to the first aspect of the invention, described flexible PCB is disposed with adapter, described soft Property circuit board with described first rigid circuit board be located plane there is the first face relative to each other and the second face, described adapter It is arranged on described first face, described adapter is used for being coupled to described flexible PCB the of described second rigid circuit board One region is so that when described adapter is towards described second rigid circuit board, the first face of described first rigid circuit board is dorsad Described second rigid circuit board.
In electronic equipment according to the first aspect of the invention, described first rigid circuit board is disposed with memorizer, and It is disposed with controller and HPI on described second rigid circuit board.
In electronic equipment according to the first aspect of the invention, wherein said flexible PCB is disposed with instruction described the The wiring of the configuration of one rigid circuit board.
In electronic equipment according to the first aspect of the invention, wherein said first rigid circuit board is rectangle, described While being the minor face of described rectangle with described second side.
According to the second aspect of the invention, there is provided a kind of method for installing electronic equipment, described electronic equipment bag Include the first rigid circuit board, the second rigid circuit board and flexible PCB, described flexible PCB is from described first rigid circuit Plate while extending, methods described includes:By the first adapter being arranged on flexible PCB be arranged in second rigidity The second adapter on circuit board is connected;Using support base, the first adapter is pressed on described second rigid circuit board; By described flexible PCB along described support base surface curvature;And described first rigid circuit board is fixed on described support On seat.
Method according to the second aspect of the invention, the lower surface of wherein said support base compresses described first adapter, And described first rigid circuit board be placed on described support base the groove of upper surface in.
According to the third aspect of the invention we, there is provided a kind of electronic equipment, including the first rigid circuit board, the second rigid electric Road plate, the 3rd rigid circuit board, the first flexible PCB and the second flexible PCB;Described first flexible PCB is described The signal of telecommunication is transmitted, described second flexible PCB is described second between first rigid circuit board and described 3rd rigid circuit board The signal of telecommunication is transmitted, described first rigid circuit board has relative first between rigid circuit board and described 3rd rigid circuit board While and when second;Described second rigid circuit board have relative the 3rd while and when the 4th;Described first flexible PCB has , when the 6th, the described 5th when being coupled to the first of described first rigid circuit board for relative the 5th;Described second flexible electrical Road plate has relative the 7th when the 8th, and the described 7th when being coupled to the 3rd of described second rigid circuit board;Described The first area of described 3rd rigid circuit board is coupled on six sides, and the secondth area of described rigid circuit board is coupled on described 8th side Domain;Described 6th while width be more than described first while width, the described 8th while width be more than the described 3rd while width.
Electronic equipment according to the third aspect of the invention we, wherein said 5th side is from the of described first rigid circuit board While extending;Described 7th extends while from the 3rd of described second rigid circuit board.
Electronic equipment according to the third aspect of the invention we, wherein, the 6th side of described first flexible PCB is disposed with First adapter, the 8th side of described second flexible PCB is disposed with the second adapter;Described first adapter is used for institute State the first area that the first flexible PCB is coupled to described 3rd rigid circuit board;Described second adapter is used for described the Two flexible PCBs are coupled to the second area of described 3rd rigid circuit board;Described first area is disposed with described first even Connect the corresponding adapter of device, described second area is disposed with the adapter corresponding with described second adapter.
Electronic equipment according to the third aspect of the invention we, wherein, the 6th side of described first flexible PCB is from described The first area of the 3rd rigid circuit board is extended, and the 8th side of described second flexible PCB is from the of described tertiary circuit plate Two regions are extended.
Electronic equipment according to the third aspect of the invention we, wherein said first area is described 3rd rigid circuit board The part on the 9th side, and/or described second area is the part of the odd plots of land that can be cultivated of described 3rd rigid circuit board.
Electronic equipment according to the third aspect of the invention we, also includes the first support base and the second support base, and described first Described first adapter is pressed on described 3rd rigid circuit board support base, and described second support base connects described second Device is pressed in described 3rd rigid plate;Described first the first side supporting the first rigid circuit board described in seat supports, described the One support base also supports the 4th side of described second rigid circuit board;Described second supports the first rigid circuit board described in seat supports The second side, described second support base also supports the 3rd side of described second rigid circuit board.
Electronic equipment according to the third aspect of the invention we, wherein, described first flexible PCB is with described first rigidly The plane that circuit board is located has the first face relative to each other and the second face;Described second flexible PCB and described second rigidity The plane that circuit board is located has the 3rd face relative to each other and fourth face;Described first adapter is arranged in described first face On, described second adapter is arranged on described 3rd face;Described first adapter is used for described first flexible PCB coupling Close the first area of described 3rd rigid circuit board so that when described first adapter is towards described three rigid circuit board, First face of described first rigid circuit board dorsad described 3rd rigid circuit board;Described second adapter is used for described second Flexible PCB is coupled to the second area of described 3rd rigid circuit board so that described second adapter is firm towards the described 3rd During property circuit board, the first face dorsad described 3rd rigid circuit board of described second rigid circuit board.
Electronic equipment according to the third aspect of the invention we, wherein said first rigid circuit board is disposed with memorizer, It is disposed with memorizer on described second rigid circuit board, described 3rd rigid circuit board is disposed with controller and HPI.
Electronic equipment according to the third aspect of the invention we, the storage of the memorizer on wherein said first rigid circuit board Capacity is two times of the memory capacity of memorizer on described second rigid circuit board.
Electronic equipment according to the third aspect of the invention we, the first side of wherein said first rigid circuit board is positioned at described The top of first area, the 3rd side of described second rigid circuit board is located at the top of described second area;
4th side of described second rigid circuit board is located at the top of described first area, described first rigid circuit board Second side is located at the top of described second area.
Electronic equipment according to the third aspect of the invention we, wherein said first flexible PCB is disposed with instruction described The wiring of the memory capacity of the memorizer on the first rigid circuit board, described second flexible PCB is disposed with instruction described the The wiring of the memory capacity of the memorizer on two rigid circuit boards.
According to the fourth aspect of the invention, there is provided a kind of method for installing electronic equipment, described electronic equipment bag Include the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexible PCB and the second flexible circuit Plate, described first flexible PCB extending from described first rigid circuit board, described second flexible PCB Herba Alii fistulosi institute State second just wake up circuit board while extending, methods described includes:Be arranged on the first flexible PCB first is connected Device is connected with the second adapter being arranged on the 3rd rigid circuit board;Using the first support base, the first adapter is pressed on On described 3rd rigid circuit board;By described first flexible PCB along described first support base surface curvature;By described One rigid circuit board is fixed on described first support base;By the 3rd adapter being arranged on the second flexible PCB and arrangement The 4th adapter on the 3rd rigid circuit board is connected;Using the second support base, described 3rd adapter is pressed on described On 3rd rigid circuit board;By described second flexible PCB along described second support base surface curvature;Firm by described second Property circuit board is fixed on described second support base;Described second rigid circuit board is fixed on described first support base;With And described first rigid circuit board is fixed on described second support base.
Method according to the fourth aspect of the invention, described first connection of lower surface compression of wherein said first support base Device, and described first rigid circuit board is placed in the first groove of the upper surface of described first support base;Described second The lower surface of support seat compresses described 3rd adapter, and described second rigid circuit board is placed on the upper of described second support base In first groove on surface;Described first rigid circuit board is positioned in the second groove of the upper surface of described second support base, Described second rigid circuit board is positioned in the first groove of the upper surface of described first support base.
According to the fifth aspect of the invention, there is provided a kind of storage device, including first circuit board, second circuit board and Three-circuit plate;One or more memory chips are disposed with described first circuit board, described second circuit board is disposed with one Individual or multiple memory chips, described tertiary circuit plate is disposed with controller and HPI;The same institute of described first circuit board State tertiary circuit plate to be coupled, described second circuit board is coupled so that via described HPI with described tertiary circuit plate One or more memory chips of being arranged on described first circuit board by described controller access and be arranged in described One or more memory chips on second circuit board;The capacity of the memory chip on described first circuit board is described Two times of the capacity of the memory chip on two circuit boards.
Storage device according to the fifth aspect of the invention, wherein said first circuit board is by being arranged in described 3rd electricity The first adapter on the plate of road is coupled to described tertiary circuit plate, and described second circuit board is by being arranged in described tertiary circuit plate On second electrical connection be coupled to described tertiary circuit plate.
Storage device according to the fifth aspect of the invention, one or more pins of wherein said first adapter are used for Transmission indicates the signal of the capacity of memory chip on described first circuit board, and/or one of described second adapter or Multiple pins are used for the signal that transmission indicates the capacity of memory chip on described second circuit board.
Storage device according to the fifth aspect of the invention, wherein said first circuit board is by being arranged in described 3rd electricity The first adapter on the plate of road and the second adapter are coupled to described tertiary circuit plate, and described second circuit board is by being arranged in State the 3rd adapter on tertiary circuit plate and the 4th adapter is coupled to described tertiary circuit plate, wherein said first adapter Identical with described 3rd adapter, described second adapter is identical with described 4th adapter.
Storage device according to the fifth aspect of the invention, wherein said first adapter and/or described second adapter One or more pins be used for transmission indicate described first circuit board on the capacity of memory chip signal, the described 3rd One or more pins of adapter and/or described 4th adapter are used for transmission and indicate the memorizer on described second circuit board The signal of the capacity of chip.
Storage device according to the fifth aspect of the invention, also includes the first flexible PCB and the second flexible PCB, Described first flexible PCB is used for for described first circuit board being coupled to described tertiary circuit plate, described second flexible PCB For described second circuit board is coupled to described tertiary circuit plate.
Storage device according to the fifth aspect of the invention, wherein, described first circuit board have the first relative side and Second side;Described second circuit board have relative the 3rd while and when the 4th;Described first flexible PCB has relative Five when the 6th, and the described 5th when being coupled to the first of described first circuit board;Described second flexible PCB has relatively The 7th when the 8th, the described 7th when being coupled to the 3rd of described second circuit board;Described 6th side is coupled to described First adapter of three-circuit plate, the second adapter of described tertiary circuit plate is coupled on described 8th side;Described 6th side Width be more than described first side width, the described 8th while width be more than the described 3rd while width;Described first circuit board The first side be located at the top of described first adapter, the 3rd side of described second circuit board is located at the upper of described second adapter Side;4th side of described second circuit board is located at the top of described first adapter, and the second side of described first circuit board is located at The top of described second adapter.
Storage device according to the fifth aspect of the invention, wherein, described 5th side is from the first of described first circuit board While extending;Described 7th extends while from the 3rd of described second circuit board.
Storage device according to the fifth aspect of the invention, also includes the first support base and the second support base, and described first 6th side of described first flexible PCB is fastened on described first adapter support base, and described second support base will be described 8th side of the second flexible PCB is fastened on described second adapter;Described first supports first circuit board described in seat supports The first side, described first support base also supports the 4th side of described second circuit board;Described second supports the described in seat supports Second side of one circuit board, described second support base also supports the 3rd side of described second circuit board.
Storage device according to the fifth aspect of the invention, including multiple described first circuit boards and/or multiple described Two circuit boards.
Storage device according to the fifth aspect of the invention, described 4th circuit board is disposed with one or more storages Device chip, described 4th circuit board is coupled so that via described HPI by described control with described tertiary circuit plate Device accesses the one or more memory chips being arranged on described 4th circuit board;Storage core on described 4th circuit board The capacity of piece is the storage on two times of the capacity of the memory chip on described second circuit board, or described 4th circuit board The capacity of device chip is identical with the capacity of the memory chip on described second circuit board.
According to the sixth aspect of the invention, there is provided a kind of storage device, including first circuit board, second circuit board and Three-circuit plate;Multiple memory chips are disposed with described first circuit board, described second circuit board is disposed with multiple storages Device chip, described tertiary circuit plate is disposed with controller and HPI;Described first circuit board is with described tertiary circuit plate It is coupled, described second circuit board is coupled so that via described HPI by described control with described tertiary circuit plate Device accesses the multiple memory chips being arranged on described first circuit board and is arranged in multiple on described second circuit board Memory chip;The plurality of memory chip on described first circuit board is configured to first passage and second channel, described First passage includes the memory chip of the first quantity, and described second channel includes the memory chip of the second quantity, and described One quantity is different from described second quantity.
Storage device according to the sixth aspect of the invention, wherein, described first circuit board also includes third channel, institute State the memory chip that third channel includes the 3rd quantity, described 3rd quantity is different from described first quantity.
Storage device according to the sixth aspect of the invention, wherein, the plurality of memorizer on described second circuit board Chip is configured to fourth lane and Five-channel, and described fourth lane includes the memory chip of the 4th quantity, and the described 5th leads to Road includes the memory chip of the 5th quantity, and described 4th quantity is different from described 5th quantity.
Storage device according to the sixth aspect of the invention, wherein, the plurality of memorizer on described second circuit board The quantity of chip is different from the quantity of the plurality of memory chip on described first circuit board.
Storage device according to the sixth aspect of the invention, wherein, wherein said first circuit board is described by being arranged in The first adapter on tertiary circuit plate is coupled to described tertiary circuit plate, and described second circuit board is by being arranged in the described 3rd Described tertiary circuit plate is coupled in the second electrical connection on circuit board;And described first adapter and described second adapter phase With so that described first circuit board can be coupled to described 3rd electricity by the second adapter being arranged on described tertiary circuit plate Road plate, described second circuit board can be coupled to described tertiary circuit by the first electrical connection being arranged on described tertiary circuit plate Plate.
Storage device according to the sixth aspect of the invention, wherein, one or more pins of described first adapter are used Indicate the signal of the quantity of the memory chip on described first circuit board in transmission;Described second adapter one or more Pin is used for the signal that transmission indicates the quantity of memory chip on described second circuit board.
Storage device according to the sixth aspect of the invention, wherein, one or more pins of described first adapter are used Indicate the signal of the quantity of the memory chip that each channel on described first circuit board has in transmission;Described second even The one or more pins connecing device are used for the memory chip that transmission indicates that each channel on described second circuit board has Quantity signal.
Storage device according to the sixth aspect of the invention, wherein memory chip have identical memory capacity.
According to the seventh aspect of the invention, there is provided a kind of storage device, including controller, first memory passage and Two storage channels;Described first memory passage and described second memory passage are respectively coupled to described controller;Described First memory passage includes the memory chip of the first quantity, and described second memory passage includes the memorizer of the second quantity Chip, described first quantity is different from described second quantity.
Storage device according to the seventh aspect of the invention, wherein, the memory chip of described first quantity passes through to share The first bus be coupled to described controller, the memory chip of described second quantity is coupled to institute by the second shared bus State controller.
Brief description
When reading together with accompanying drawing, by reference to the detailed description to illustrative embodiment below, will be best understood by The present invention and preferred use pattern and its further objects and advantages, wherein accompanying drawing includes:
Figure 1A, 1B are the solid state hard discs of the expansible capacity according to prior art;
Fig. 2 is the solid state hard disc including rigid PCB and flexible PCB according to prior art;
Fig. 3 is another kind of electronic equipment including rigid PCB and flexible PCB according to prior art;
Fig. 4 is the front view of storage device according to an embodiment of the invention;
Fig. 5 A is the front view of the circuit daughter board of storage device according to an embodiment of the invention;
Fig. 5 B-5E is the side view of memory circuit daughter board according to an embodiment of the invention;
Fig. 5 F-5J is the flash chip of circuit daughter board and the control circuit of storage device according to an embodiment of the invention The schematic diagram of connected mode;
Fig. 6 A shows the side-looking of the connected mode of the daughter board of storage device and motherboard according to an embodiment of the invention Figure;
Fig. 6 B shows the daughter board of storage device and another connected mode of motherboard according to an embodiment of the invention Side view;
Fig. 7 shows the daughter board of storage device and the connected mode of flexible PCB according to an embodiment of the invention Front view;
Fig. 8 is another front view of storage device according to an embodiment of the invention;
Fig. 9 is the axonometric chart of storage device according to an embodiment of the invention;
Figure 10 is the top view of storage device according to an embodiment of the invention;
Figure 11 A, 11B, 11C are the axonometric charts of the support base for storage device according to an embodiment of the invention;
Figure 12 is another axonometric chart of storage device according to an embodiment of the invention;
Figure 13 is the front view of storage device according to another embodiment of the present invention;And
Figure 14 is the front view of storage device according to still another embodiment of the invention.
Specific embodiment
Fig. 4 is the front view of storage device according to an embodiment of the invention.It is female that storage device shown in Fig. 4 includes circuit Plate 400.Circuit motherboard 400 is the circuit board with the high card form of PCIE half, and it can be connected to computer by PCIE slot. Circuit daughter board 410,420 and 430 is disposed with circuit motherboard 400.In one embodiment, on circuit daughter board 410,420 and 430 It is respectively disposed with flash chip 411-413,421-423 and 431-433 so that circuit daughter board 410,420,430 is to shown in Fig. 4 Storage device provide memory capacity.Circuit motherboard 400 there also is provided flash controller(Not shown), in order to control to electricity The access of the flash chip on way plate 410,420 and 430, and process the interface command from computer.Although showing in the diagram Go out the storage device with PCIE interface including flash chip, but one of ordinary skill in the art will be it is realized that it be only one Plant citing, present invention can be suitably applied to the various electronic with other functions, and can be coupled to by multiple interfaces mode Computer, multiple interfaces include but is not limited to SATA(Serial Advanced Technology Attachment, serial is high Level Technical Appendix)、USB(Universal Serial Bus, USB (universal serial bus))、PCIE(Peripheral Component Interconnect Express, quick peripheral assembly interconnecting)、SCSI(Small Computer System Interface, Small computer system interface)、IDE(Integrated Drive Electronics, integrated drive electronics)Deng.And, It is suitable for the other kinds of storage chip beyond inclusion flash memory, for example, phase transition storage, Memister, ferrum Electrical storage etc..
As shown in figure 4, circuit daughter board 410 and 420 arranges, circuit daughter board 410 is with 430 with identical with opposite directions Direction arrangement.So that more flash chips can be arranged on the circuit motherboard 400 with specific dimensions.And, electricity Way plate 410,420 and 430 has identical overall dimensions and identical interface so that between circuit daughter board 410,420 and 430 Can be substituted for one another, it would however also be possible to employ other circuit daughter board replacement circuit daughter boards 410,420 and 430.
Fig. 5 A is the front view of the daughter board of storage device implementing embodiments of the invention.It is shown more clearly by Fig. 5 A Circuit subcard 410 in Fig. 4.Circuit subcard 420 and 430 can have and circuit subcard 410 identical physical aspect, but can have There is the memory capacity identical or different with circuit subcard 410.In preferred example, the memory capacity of circuit subcard 420 is electricity Two times of way card 410.Flash chip 411,412 and 413 is disposed with circuit subcard 410.In one example, in circuit The unshowned one side of subcard 410, is also disposed with flash chip.Flash chip 411,412 can be to have identical capacity with 413 Flash chip or the flash chip with different capabilities.Flash chip on circuit subcard 410 can be organized as many Individual passage, each passage includes the flash chip of two or other quantity.Each passage is parallel, can be simultaneously to electricity Road motherboard 400 transmission data or from circuit motherboard 400 receiving data.Circuit subcard 410 also can be arranged with other quantity Multiple flash chips.
In the case of can accommodating flash chip 411,412 and/or 413, the size of circuit subcard 410 is arranged and must try one's best Little, so that greater number of circuit subcard can be arranged on circuit motherboard 400, thus improving the capacity of storage device.Due to can Arrange polylith circuit subcard 410,420 and/or 430 on circuit motherboard, and circuit subcard 410,420 and 430 can have that This different capacity, thus, storage device can have the combination of multiple different memory capacity.Referring to table 1, when circuit subcard 410th, 420 and 430 can have 192GB(Giga Byte)During with two kinds of memory capacity of 394GB, and when can be in circuit motherboard 400 During the most 6 pieces of circuit subcards 410,420 or 430 of upper arrangement, the storage device with multiple different memory sizes can be obtained.Although Show the configuration including 4 pieces of storage devices to 6 pieces of circuit subcards in Table 1, but it is also possible on circuit motherboard 400 1 piece -3 pieces circuit subcards of arrangement, to provide more different memory capacity.
Table 1 storage device memory capacity table
Thus, by providing the circuit subcard of two kinds of different memory sizes, obtained the storage with multiple different capabilities Equipment, can meet the demand of multiple difference occasions.
And, because circuit subcard 410,420 and 430 has identical physical aspect, thus circuit subcard 410,420 with 430 installations on circuit motherboard 400 are interchangeable, thus simplifying the process of installation, and, when multiple circuit subcards it One when breaking down it is also possible to easily change.And, by with more Large Copacity and/or higher performance(Access speed, reliability Property etc.)Circuit subcard replacement circuit motherboard 400 on existing circuit subcard, be easily achieved the renewal to storage device or Upgrading.
One of ordinary skill in the art are by it is realized that the circuit with three or more different memory sizes can also be provided Subcard, thus the storage device with more kinds of memory capacity can be provided.For example, referring to table 2, can cloth on circuit daughter board 410 Put the storage chip of varying number(For example, 3-6 storage chip), thus, in each storage chip, there is 64GB memory capacity In the case of, it is possible to provide it is respectively provided with the circuit subcard of 192GB, 256GB, 320GB and 384GB memory capacity.And pass through to carry For multiple circuit subcards with different memory sizes, the storage device with more kinds of different memory sizes can be obtained.Obviously, If each storage chip on circuit daughter board 410 has different memory capacity, can provide have further multiple not The storage device of same memory capacity combination.
Table 2 circuit subcard memory capacity table
Chip capacity Number of chips Subcard capacity
64GB 3 192GB
64GB 4 256GB
64GB 5 320GB
64GB 6 384GB
Fig. 5 B-5E is the side view of the circuit daughter board 410 of storage device implementing embodiments of the invention.In figure 5b, Storage chip 411,412,413,414,415 and 416 is disposed with circuit daughter board 410.When each storage chip provides 64GB During memory capacity, the circuit daughter board in Fig. 5 B can provide the memory capacity of 384GB.In figure 5 c, circuit daughter board 410 is disposed with Storage chip 411,412,413,414 and 415.When each storage chip provides 64GB memory capacity, the circuit in Fig. 5 C Daughter board can provide the memory capacity of 320GB.In figure 5d, circuit daughter board 410 is disposed with storage chip 411,412,413 and 414.When each storage chip provides 64GB memory capacity, the circuit daughter board in Fig. 5 D can provide the memory capacity of 256GB.? In Fig. 5 E, circuit daughter board 410 is disposed with storage chip 411,412 and 413.When each storage chip provides 64GB storage to hold During amount, the circuit daughter board in Fig. 5 E can provide the memory capacity of 192GB.
With continued reference to Fig. 5 F-5J, Fig. 5 F-5J is the circuit daughter board 410 of storage device according to an embodiment of the invention The schematic diagram of the connected mode of flash chip and control circuit 660.In order to promote the concurrency of the operation of multiple flash chips, with And save the I/O resource controlling the control circuit 660 required for multiple flash chips, by the multiple flash memory cores on circuit daughter board 410 Piece is arranged in multiple passages.It is disposed with multiple flash chips, the multiple flash chips in each passage are altogether in each passage With data and/or controlling bus, and the multiple flash chips in order to access each flash chip, in each passage(With/ Or tube core)Chip enable(Chip Enable,CE)Port, can be individually controlled by control circuit 660.
Referring to Fig. 5 F, circuit daughter board 410 is disposed with 3 passages.Flash chip 411,414 includes in first passage, And control circuit 660 is coupled to by the bus 490 sharing.Control circuit 660 can be with independently controlled flash chip 411,414 CE port.Flash chip 412,415 is included in the second channel, and is coupled to control circuit by the bus 492 sharing 660.Control circuit 660 can be with the CE port of independently controlled flash chip 412,415.Flash chip 413,416 is included In triple channel, and control circuit 660 is coupled to by the bus 494 sharing.Control circuit 660 can be with independently controlled flash memory core The CE port of piece 413,416.
Alternatively, each passage can there is the flash chip of other quantity.Referring to Fig. 5 G, flash chip 411,412 with 413 are included in first passage, and are coupled to control circuit 660 by the bus 490 sharing.Control circuit 660 can be independent Ground controls the CE port of flash chip 411,412 and 413.Flash chip 414,415 and 416 is included in the second channel, and leads to Cross the bus 494 sharing and be coupled to control circuit 660.Control circuit 660 can with independently controlled flash chip 414,415 with 416 CE port.
Still alternatively, each passage can have the flash chip of varying number.Referring to Fig. 5 H, flash chip 411, 414 are included in first passage, and are coupled to control circuit 660 by the bus 490 sharing.Control circuit 660 can be independent Ground controls the CE port of flash chip 411,414.Flash chip 412,415 is included in the second channel, and total by share Line 492 is coupled to control circuit 660.Control circuit 660 can be with the CE port of independently controlled flash chip 412,415.Flash memory Chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can control sudden strain of a muscle Deposit the CE port of chip 413.Notice in fig. 5h, flash chip 416 is not provided, it corresponds to the example providing in figure 5 c Son.Again it was noticed that in fig. 5h, in first passage and second channel, it is disposed with 2 flash chips, and in third channel, Only it is disposed with 1 flash chip, i.e. the flash chip of varying number is had on each passage.Although it is pointed out that every The flash chip of varying number is had on individual passage, but the memory capacity on each passage can be the same or different.Work as figure When flash chip 411-415 in 5H has identical memory capacity, the memory capacity on third channel is depositing of first passage The half of storage capacity.Flash chip 413 can also be provided so that its memory capacity is flash chip 411,412,414 or 415 Two times, so that the memory capacity on each passage is identical.
Although still it is pointed out that in the embodiment of Fig. 5 H, not including flash chip 416, in phase therewith It is preferable that providing the circuit daughter board 410 identical interface arrangement with Fig. 5 B in the circuit daughter board 410 of corresponding Fig. 5 C.Though that is, The right circuit daughter board 410 in Fig. 5 C is it is not necessary to provide the lead of the CE port being coupled to flash chip 416 in the interface, but is It is favourable that multiple different circuit daughter boards provide identical interface arrangement, and this will allow on the adapter of circuit motherboard 400 Coupling different circuit daughter boards, thus improving the motility of storage device, and simplifying the installation process of storage device 400, because Circuit daughter board 410 for having particular memory capacity or flash chip quantity is not limited to be arranged on specific motherboard connector.
In one embodiment, in the interface of circuit daughter board 410,3 leads are provided, every lead is transmitted by it 1 flash chip or 2 sudden strains of a muscle are disposed with one of signal of telecommunication instruction first passage, second channel and third channel passage Deposit chip.One of ordinary skill in the art may also be appreciated that the mode of the configuration of other indicating circuit daughter boards 410.For example, in electricity In the interface of way plate 410, provide 2 leads, it can transmit " 00 ", " 01 ", " 10 " and " 11 " four kinds of different states, A kind of particular configuration of each condition indication circuit daughter board 410.Indicated by service wire, can also be on circuit daughter board 410 Storage chip quantity, or on circuit daughter board 410 provide memory capacity.
Referring to Fig. 5 I, flash chip 411,414 is included in first passage, and is coupled to control by the bus 490 sharing Circuit 660 processed.Control circuit 660 can be with the CE port of independently controlled flash chip 411,414.Flash chip 412 includes In second channel, and control circuit 660 is coupled to by bus 492.Control circuit 660 can control the CE of flash chip 412 Port.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can To control the CE port of flash chip 413.Notice in fig. 5h, flash chip 415 and 416 is not provided, it corresponds to The example providing in Fig. 5 D.
Referring to Fig. 5 J, flash chip 411 is included in first passage, and is coupled to control circuit 660 by bus 490. Control circuit 660 can be with the CE port of independently controlled flash chip 411.Flash chip 412 is included in the second channel, and leads to Cross bus 492 and be coupled to control circuit 660.Control circuit 660 can be with the CE port of independently controlled flash chip 412.Flash memory Chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be independently Control the CE port of flash chip 413.Notice in fig. 5j, do not provide flash chip 414,415 and 416, it corresponds to The example providing in Fig. 5 E.
Fig. 6 A shows the circuit daughter board of storage device according to an embodiment of the invention and the connected mode of circuit motherboard Side view.Flash chip 411,412 and 413 is disposed with circuit daughter board 410.With flash chip on circuit daughter board 410 411st, 412 side relative with 413, also can be disposed with one or more flash chips.Circuit motherboard 400 is disposed with connection Device 510,520, is respectively connected with for same adapter 530 and 540, thus circuit daughter board 410 is coupled to circuit motherboard 400. Adapter 530 and 540 is respectively arranged in one end of flexible PCB 550 and 560, the other end of flexible PCB 550,560 from The relative both sides of circuit daughter board 410 are extended.Flexible PCB 550 and 560, can with circuit daughter board 410 in time processing shape Become.Due to being connected respectively to adapter 510,520 by adapter 530,540, thus each adapter 530 and 540 is transmitted Holding wire can be access circuit daughter board 410 desired signal line half quantity, thus, the size of adapter 530 and 540 can With less, so that the space occupying to be reduced on circuit motherboard 400.Due to circuit is connected with 540 by adapter 510,520,530 Motherboard 400 is with circuit daughter board 410 so that circuit daughter board 410 is removable.
As an example it is also possible to not couple flexible PCB 550 and 560 with 540 using adapter 510,520,530, But open area is set on circuit motherboard 400, and make opening from circuit motherboard 400 for the flexible PCB 550,560 Region is extended.Or, so that flexible PCB 550,560 is each extended over out from the relative both sides of circuit motherboard 400, and soft Property circuit board 550,560 formed in time processing with circuit motherboard 400.
Still as an example, flexible PCB 550,560 also can be connected to circuit daughter board 410 by adapter.And in electricity The relative both sides of way card 410 are also provided with adapter, for connecting flexible PCB 550,560.
Fig. 6 B shows that the circuit daughter board of storage device according to an embodiment of the invention is connected with the another kind of of circuit motherboard Connect the side view of mode.Flash chip 411,412 and 413 is disposed with circuit daughter board 410.With sudden strain of a muscle on circuit daughter board 410 Deposit chip 411,412 side relative with 413, also can be disposed with one or more flash chips.With sudden strain of a muscle on circuit daughter board 410 Deposit chip 411,412 side relative with 413, also can be disposed with one or more flash chips.Circuit motherboard 400 is arranged There is adapter 620, be connected for same adapter 630, thus circuit daughter board 410 is coupled to circuit motherboard 400.Adapter 630 one end being arranged in flexible PCB 640, the other end of flexible PCB 640 extends from the relative both sides of circuit daughter board 410 Go out.Flexible PCB 640, can be formed in time processing with circuit daughter board 410.Due to connection is connected to by adapter 630 Device 620, thus the holding wire that transmitted of adapter 630 can be the entire quantity of access circuit daughter board 410 desired signal line, from And, it is desirable to provide the adapter 630 and 620 of large-size.In a preferred embodiment, for provide flexible PCB 640 with Being reliably connected between circuit motherboard 400, and the size of adapter 630 is set larger than flexible PCB 640 from circuit Block the length of 410 connections.In the case, flexible PCB 640 is trapezoidal, will be further described in the figure 7.Though So connecting circuit daughter board 410 using single connector 630 needs larger sized adapter with circuit motherboard 400, but can carry Come the convenience to install, because only once mounting operation need to be carried out it is possible to circuit subcard 410 is connected to circuit motherboard 400, And the one end not having adapter on circuit subcard 410 provides space for installation operation.
As an example it is also possible to arrange open area on circuit motherboard 400, and make flexible PCB 640 from circuit Open area on motherboard 400 is extended.Or, so that flexible PCB 640 is prolonged respectively from the relative both sides of circuit motherboard 400 Stretch out, and flexible PCB 640 is formed with circuit motherboard 400 in time processing.
Still as an example, flexible PCB 640 also can be connected to circuit daughter board 410 by adapter.And in circuit It is also provided with adapter, for connecting flexible PCB 640 on card 410.
In order to improve the space availability ratio of circuit motherboard 400, adapter 620 is arranged adjacent to the one of circuit motherboard 400 Side.And circuit subcard 410 is placed perpendicular to this side.
Fig. 7 shows circuit daughter board 410 and the flexible PCB 640 of storage device according to an embodiment of the invention The front view of connected mode.Flash chip 411,412 and 413 is disposed with circuit daughter board 410.Flexible PCB 640 has Relative side 681 and 682.One side 681 of flexible PCB 640 from circuit daughter board 410 while extending.In flexible PCB 640 with when 681 is relative 682 on be disposed with adapter 630, be connected for same circuit motherboard 400.Due to adapter 630 holding wires being transmitted can be the whole holding wires needed for access circuit daughter board 410, thus when 682 length is more than 681 length, so that can accommodate sufficient amount of holding wire in adapter 630, and ensures flexible PCB 640 and circuit The connection reliability of motherboard 400.
It is also noted that in the figure 7, from the flexible PCB 640 extending and the circuit subcard of circuit subcard 410 410 define a plane, and adapter 630 and flash chip 411,412 and/or 413 are in the same side of this plane.Here is joined See Fig. 6 B, when flexible PCB 640 is connected to circuit motherboard 400, flexible circuit plate benging is so that adapter 630 direction Circuit motherboard 400, and flash chip 411,412 and/or 413 dorsad circuit motherboard 400.In fig. 8, this will be retouched further State.
Circuit daughter board 410 can have multiple memory capacity.By arranging in flexible PCB 640 and adapter 630 It is connected to the wiring of circuit motherboard 400, with the memory capacity to the controller indicating circuit daughter board 410 on circuit motherboard.Work as electricity Way plate 410 has two kinds of different memory capacity, such as one of 192GB and 384GB, can arrange a wiring, by should High level or low level are coupled in wiring on circuit daughter board 410, come to the controller indicating circuit daughter board on circuit main board 400 410 memory capacity is 192GB or 384GB.The storage carrying out indicating circuit daughter board 410 more than a wiring can also be retained hold Amount.In another example, storage capacity information thereon is encoded by circuit daughter board 410, and the information transmission after coding is given Controller on circuit motherboard 400.In still another example, the control circuit on circuit motherboard 400 may have access to flash memory core Piece 411,412 and 413, to obtain the memory capacity of each flash chip, thus obtain the memory capacity of circuit daughter board 410.Institute Belong to skilled person would also recognize that, in the connected mode with circuit motherboard 400 for the circuit daughter board 410 as shown in Figure 6A, Also wiring can be provided in adapter 530 and/or 540, with the memory capacity to circuit motherboard 400 indicating circuit daughter board 410, and Adapter 530 and adapter 540 is made to have identical overall dimensions and wiring arrangement.
Fig. 8 is another front view of storage device according to an embodiment of the invention.Circuit daughter board 410 is shown in Fig. 8 It is connected on circuit motherboard 400 with the adapter 630 being arranged on flexible PCB 640 by flexible PCB 640.Need to refer to Go out, in fig. 8, adapter 630 is towards circuit daughter board 400, and flash chip 411,412 and/or 413 dorsad circuit motherboard 400. Adapter 630 is connected to the adapter on the one side being arranged in circuit motherboard(Not shown).In a preferred embodiment, adapter 630 longer one side being arranged in circuit motherboard 400, and circuit daughter board 410 is perpendicular to the longer sides of circuit motherboard 400.Thus can Parallel arranged multiple circuit daughter board 410 on circuit motherboard 400.Flexible PCB 640 bends so that it is while from circuit daughter board 410 while extending, and adapter 630 is towards circuit motherboard 400, and is connected to circuit motherboard 400.In flexible PCB 640 when being in unbent condition, and adapter 630 and flash chip 411,412 and/or 413 are towards the same side.In Fig. 8, circuit Plate 410 is paralleled with circuit motherboard 400, and circuit daughter board 410 is spatially separated from each other with circuit motherboard 400.In circuit daughter board Space between 410 and circuit motherboard 400 can be used for the installation of circuit daughter board 410.By this space, can be to adapter 630 Back side applying power, thus adapter 630 is installed on the adapter on circuit motherboard 400.
It can further be seen that the length of adapter 630 is more than one side of circuit daughter board 410, flexible PCB 640 from Fig. 8 Extend from this side.That is, flexible PCB 640 connects the length on one side of circuit daughter board 410, arranges less than on flexible PCB The length on one side of adapter 630.
Fig. 9 is the axonometric chart of storage device according to an embodiment of the invention.Circuit daughter board 410 and 420 is shown in Fig. 9 Flexible PCB 640 can be passed through(Not shown)It is connected on circuit motherboard 400 with flexible PCB 642.On circuit daughter board 410 It is disposed with flash chip 411,412 and 413, circuit daughter board 420 is disposed with flash chip 421,422 and 423.Circuit daughter board 410th, 420 one or more flash chips can also be disposed with towards the side of circuit motherboard 400.Adapter 630 is arranged in soft On property circuit board 640, and can be connected with the adapter 620 being arranged on circuit motherboard.Adapter 632 is arranged in flexible circuit On plate 642, and can be connected with the adapter 622 being arranged on circuit motherboard.Preferably, flexible PCB 642 is and flexibility Circuit board 640 identical flexible PCB, and adapter 632 is identical with adapter 630, adapter 622 and adapter 620 phase With so that circuit daughter board 410 and circuit daughter board 420 are convertibly connected to circuit motherboard 400.
When circuit daughter board 420 is connected to adapter 622 by adapter 632, and circuit daughter board 410 passes through adapter 630 When being connected to adapter 620, the side 415 of circuit daughter board 410 is located at the top of adapter 632, and the side 425 of circuit daughter board 420 Top positioned at adapter 630.Flexible PCB 640(Not shown)Prolong with when 415 is relative 417 from circuit daughter board 410 Stretch out, and flexible PCB 642 extends with when 425 is relative 427 from circuit daughter board 420.In this way although connecting The length of device 630,632 be more than circuit daughter board 410 while 417 with circuit daughter board 420 while 427, but due to adapter 630 with Space corresponding to 632 is shared by circuit daughter board 410 and 420 so that more circuit can be arranged on circuit motherboard 400 Card.
And, when being installed to circuit daughter board 410,420 on circuit motherboard 400, due to flexible PCB 640 and 642 Can be at un-flexed state, to the back side applying power of adapter 630 and 632, be connected respectively to such that it is able to easily Adapter 620 and 622.Next, flexible flexible PCB 640 and 642, make circuit daughter board 410 and 420 and circuit motherboard 400 is parallel, thus reducing the space occupied by the storage device being made up of circuit motherboard and circuit daughter board 410,420.
Because circuit daughter board 410 is parallel to each other with 420 and relative from beginning to end, and the sky that shared adapter 630 and 632 is formed Between, thus circuit daughter board 410 and 420 can be regarded as a circuit daughter board group.
Figure 10 is the top view of storage device according to an embodiment of the invention.In fig. 10 it is shown that circuit daughter board 410th, 420 and 430, circuit daughter board 430 can be the circuit daughter board with circuit daughter board 410,420 with same physical profile, but Have and the identical or different memory capacity of circuit daughter board 410,420.Circuit daughter board 410 is via flexible PCB 640, adapter 630th, adapter 620 is connected to circuit motherboard 400.Circuit daughter board 430 is via flexible PCB 644, adapter 634, adapter 624 are connected to circuit motherboard 400.Adapter 634 is arranged on flexible PCB 644, and adapter 624 is arranged in circuit motherboard On 400.Preferably, adapter 620 and 624 is placed on the same line along the long side of circuit motherboard 400.The side of circuit daughter board 410 417th, circuit daughter board 420 while 425 with circuit daughter board 430 while 437, be placed on basic same straight line.As shown in Figure 10, Because flexible PCB 640 is trapezoidal, that is, the length of adapter 630 be more than while 417 length so that circuit subcard 420 while 425 lower sections that can be located at adapter 630, and being separated with adapter 630, and while 425 with while 417 be in substantially with always On line.
Circuit daughter board 410 constitutes a circuit daughter board group with circuit daughter board 420.In a preferred embodiment, by shared Support base, circuit daughter board group is fixed to circuit motherboard 400, is asked because of the brought reliability of rocking of circuit daughter board with reducing Topic.Figure 11 A, 11B, 11C and 12 will be further described.And, one of ordinary skill in the art will be it is realized that do not make Will not impact the work of storage device with support base.Circuit daughter board 430 can be with another circuit daughter board(Not shown)Constitute electricity Way plate group.
As an example, although it can also be seen that the length of adapter 630 is more than the length on side 417 from Figure 10, little In while 417 with while 425 length sum so that the length of adapter 630 is adapted to ensure that the reliability being connected and has less Size, to reduce the manufacturing cost of adapter 630.
Figure 11 A, 11B, 11C are the axonometric charts of the support base 1100 for storage device according to an embodiment of the invention. Support base 1100 includes side wall 1110,1112, and side wall 1110 is oppositely arranged with 1112, and parallel to each other, for coupling support base 1100 with circuit motherboard 400.In one example, side wall 1110 and 1112 has screw, further will by bolt Support base is fixed on motherboard 400.Support base also includes plate 1120.Plate 1120 vertical coupled between side wall 1110 and 1112.Plate 1120 be may be integrally formed with side wall 1110,1120.Plate 1120 has relative first surface 1122 and second surface 1124.First Surface 1122 dorsad circuit motherboard 400, and for support two pieces of circuit daughter boards, second surface 1124 towards circuit motherboard 400, and It is arranged in the adapter on flexible PCB for compression.Projection 1132 is had on the direction perpendicular to first surface 1122, uses In two circuit daughter boards of segmentation, and the movement of limiting circuit daughter board.It is upwardly formed second in the side parallel to first surface 1122 Projection 1134.Will be described with fig. 12 between support base 1100, circuit daughter board 410,420 and circuit motherboard 400 Coupled relation.Although describe the support base 1100 with ad hoc structure, art technology above in conjunction with Figure 11 A, 11B, 11C Personnel will readily appreciate that using the support base with other structures or like, to provide circuit daughter board 410 and/or 420 Being reliably connected and circuit motherboard 400 between.
Figure 12 is another axonometric chart of storage device according to an embodiment of the invention.Set with the storage shown in Fig. 9 For comparing, also go out support base 1100 and 1200 in fig. 12.In fig. 12, for purposes of clarity, support base 1100 is shown Go out the lower section in adapter 632, support base 1200 is shown in the lower section of adapter 630.And when mounted, and after mounting Storage device in, support base 1100 be used for adapter 632 is pressed on adapter 622, and support base 1200 be used for will connect Connect device 630 to be pressed on adapter 620.
In installation process, adapter 632 is connected with adapter 622.Then, support base 1100 is placed on connection The back side of device 632, and make the second surface 1124 of the plate 1120 of support base compress adapter 632.In one example, also may be used By bolt, two side walls of support base 1100 to be fixed on circuit motherboard 400.With support base 1100 analogously, prop up Adapter 630 is pressed on adapter 620 support seat 1200.
Face 1229 and the first surface 1122 of support base 1100(Referring to Figure 11 A, 11B and 11C)Hang down with second surface 1124 Directly, and be located at and projection 1134(Referring to Figure 11 A, 11B and 11C)Contrary direction.
The plate 1120 of support base 1100 be used for filling adapter 632, flexible PCB 642 and circuit daughter board 410,420 it Between space, and support circuit daughter board 410 and 420.Plate 1120 is divided into groove 1217 and 1218 by projection 1132.By support base After 1100 are pressed on adapter 632, flexible PCB 642 is bent along face 1229, and the close side by circuit subcard 420 427 side is placed on the groove 1218 of support base 1100.Setting groove 1218 makes circuit subcard 420 just be placed on groove 1218 In, and the movement by projection 1132 and the side wall limiting circuit subcard 420 of support base 1100.
Similarly, after support base 1200 being pressed on adapter 630, bend flexible PCB 640(Do not show in Figure 12 Go out), make the side on the close side 417 of circuit daughter board 410 be placed on the first surface of support base 1200.And make circuit daughter board 420 The side on close side 425 be placed on the first surface of support base 1200, and the second surface of support base 1200 is used for compression even Connect device 630.And the side on the close side 415 of circuit subcard 410 is placed on the groove 1217 of support base 1100.Setting groove 1217 make circuit subcard 410 just be placed in groove 1217, and are limited by another side wall of projection 1132 and support base 1100 The movement of circuit subcard 410.
Support base 1100,1200 limits shifting on the direction perpendicular to circuit motherboard 400 for the circuit subcard 410,420 Dynamic, thus improve the reliability of storage device.In a preferred embodiment, also by screw by circuit daughter board 410 and 420 warps It is fixed on support base 1100 by projection 1134.In a similar manner, circuit daughter board 410 and 420 is fixed on support base 1200 On.
Figure 13 is the front view of storage device according to another embodiment of the present invention.Storage device shown in Figure 13 includes Circuit motherboard 400.Circuit motherboard 400 is the circuit board with the high card form of PCIE half, and it can be connected to by PCIE slot Computer.Circuit daughter board 410,420,430 and 440 is disposed with circuit motherboard 400.In one embodiment, circuit daughter board 410th, it is respectively disposed with flash chip 411-413,421-423,431-433 and 441-443 on 420,430 and 440 so that electricity Storage device shown in Figure 13 for the way plate 410,420,430 and 440 provides memory capacity.Although figure 13 illustrates in electricity Three pieces of flash chips are placed on each of way plate 410-440, one of ordinary skill in the art will recognize can also be in circuit The flash chip of other quantity is placed on plate 410-440, for example, circuit daughter board 410 is located with flash chip 411-413 Flash chip is placed on the relative surface in surface.Control circuit 660 be there also is provided on circuit motherboard 400, in order to control to electricity The access of the flash chip on way plate 410,420,430 and 440, and process the interface command from computer.Circuit motherboard Such as DRAM is there also is provided on 400(Dynamic Random Access Memory, dynamic RAM)Storage Device 662,664,666 and 668.Memorizer 662,664,666 and 668 can be coupled to control circuit 660.Control circuit 660 is permissible It is FPGA(Field-programmable gate array, field programmable gate array)、ASIC(Application Specific Integrated Circuit, application specific integrated circuit)Or the form of a combination thereof.Control circuit 660 also may be used To include processor or controller.One, two or more processor core, each processor is may include in control circuit 600 Core is used for controlling or accessing the part or all of of multiple circuit subcards.Each processor core can also be used for accessing or control circuit Multiple flash chips on card part or all of.
Adapter 628 and 629 be there also is provided as shown in fig. 13 that on circuit motherboard 400.By adapter 628 and 629 also Respectively circuit subcard can be connected to circuit motherboard 400.Thus, there is PCIE half high card form as shown in fig. 13 that On circuit motherboard 400, up to 6 pieces circuit subcards can be connected.It is female that circuit subcard 410 is connected to circuit by flexible PCB 640 Plate 400.Circuit subcard 420 is connected to circuit motherboard 400 by flexible PCB 642.Circuit subcard 430 passes through flexible PCB 644 are connected to circuit motherboard 400.Circuit subcard 440 is connected to circuit motherboard 400 by flexible PCB 646.With similar side Formula, circuit subcard is connected to circuit motherboard 400 also by flexible PCB via adapter 628 or 629.
Multiple circuit subcards placement parallel to each other on circuit motherboard 400.The long edge circuit motherboard of multiple circuit subcards 400 minor face is placed, and the minor face of multiple circuit subcards is placed along the long side of circuit motherboard 400.The minor face of multiple circuit subcards is big Place along same straight line on body.Circuit subcard 410 is relative with 420 head and the tail, and the sky that shared flexible PCB 640,642 is formed Between, thus forming circuit subcard group.Circuit subcard 430 is relative with 440 head and the tail, and shared flexible PCB 644,646 formation Space, thus form circuit subcard group.Similarly, it is connected to adapter 628 also relative from beginning to end with 629 circuit subcard, and shape Become circuit subcard group.Can have space between multiple circuit subcards and circuit motherboard, other electronics units can be arranged within this space Part.
In a preferred embodiment, also provide heat abstractor, for by the flash chip on multiple circuit subcards and/or control Circuit 660 processed and/or heat transfer produced by memorizer 662,664,666 and 668 are to outside storage device.
Figure 14 is the front view of storage device according to still another embodiment of the invention.Storage device shown in Figure 14 includes Circuit motherboard 400.Circuit motherboard 400 is the circuit board with PCIE overall height card form, and it can be connected to by PCIE slot Computer.Circuit daughter board 410,420,430,440,450,460,470 and 480 is disposed with circuit motherboard 400.Implement at one In example, circuit daughter board 410-480 is respectively disposed with flash chip 411-413,421-423,431-433,441-443,451- 453rd, 461-463,471-473 and 481-483 are so that storage device shown in Figure 14 for the circuit daughter board 410-480 provides and deposits Storage capacity.Each of circuit daughter board 410-480 is connected to circuit motherboard 400 by flexible PCB, especially, is connected to circuit Adapter on motherboard 400.Circuit daughter board 410-480 is placed as two row, four row.The length of each of circuit daughter board 410-480 The short side direction of edge circuit motherboard 400 is placed, and the minor face of each of circuit daughter board 410-480, along the length of circuit motherboard 400 The direction on side is placed.
Circuit daughter board 410 is parallel to each other and adjacent with 420 long side, and circuit daughter board 410 is relative with 420 head and the tail, constitutes Circuit daughter board group.Circuit daughter board 430 is parallel to each other and adjacent with 440 long side, and circuit daughter board 430 is relative with 440 head and the tail, structure Become circuit daughter board group.Circuit daughter board 450 is parallel to each other and adjacent with 460 long side, and circuit daughter board 450 is relative with 460 head and the tail, Constitute circuit daughter board group.Circuit daughter board 470 is parallel to each other and adjacent with 480 long side, and circuit daughter board 470 and 480 head and the tail phases Right, constitute circuit daughter board group.In there is PCIE overall height card form circuit motherboard 400, in the long side direction of circuit motherboard 400, Up to 6 circuit daughter boards can be arranged, and the short side direction in circuit motherboard 400, up to 2 circuit daughter boards can be arranged.
Adapter 628,629,688 and 689 be there also is provided on circuit motherboard 400 as shown in figure 14.By adapter 628th, 629,688 and 689 respectively circuit subcard can also be connected to circuit motherboard 400.Thus, in having as shown at 14 On the circuit motherboard 400 of the high card form of PCIE half, up to 12 pieces circuit subcards can be connected.
Control circuit 660,670 be there also is provided on circuit motherboard 400, in order to control on circuit daughter board 410-480 The access of flash chip, and process the interface command from computer.The storage of such as DRAM be there also is provided on circuit motherboard 400 Device 662,664,666,668,672,674,676 and 678.Memorizer 662-668 and 672-678 can be respectively coupled to control Circuit 660,670, also can share between control circuit 660,670.Control circuit 660,670 can be FPGA, ASIC or The form of a combination thereof.Control circuit 660,670 can also include processor or controller.Every in control circuit 660,670 Individual for controlling or accessing the part or all of of multiple circuit subcards, for example, control circuit 660 be used for control or access circuit son Card 410-440, and control circuit 670 is used for accessing or control circuit subcard 450-480.Control circuit 660,670 can also be used for Access or control circuit subcard on multiple flash chips part or all of.
In a preferred embodiment, also provide heat abstractor, for by the flash chip on multiple circuit subcards and/or control Circuit 660,670 processed and/or heat transfer produced by memorizer 662-668,672-678 are to outside storage device.
In order to illustrate and the purpose that describes and present the description of this invention, and be not intended to disclosed shape Formula limit or the restriction present invention.To one of ordinary skill in the art, many adjustment and change are obvious.

Claims (6)

1. a kind of electronic equipment, including the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexibility Circuit board and the second flexible PCB,
Described first flexible PCB transmits the signal of telecommunication between described first rigid circuit board and described 3rd rigid circuit board,
Described second flexible PCB transmits the signal of telecommunication between described second rigid circuit board and described 3rd rigid circuit board,
Described first rigid circuit board have relative first while and when second;
Described second rigid circuit board have relative the 3rd while and when the 4th;
Described first flexible PCB have relative the 5th while and when the 6th;5th side coupling of described first flexible PCB To the first side of described first rigid circuit board,
Described second flexible PCB has relative the 7th when the 8th, and described second rigid circuit is coupled on described 7th side 3rd side of plate;
The first area of described 3rd rigid circuit board, described 8th side coupling are coupled in 6th side of described first flexible PCB Close the second area of described 3rd rigid circuit board;
Described 6th while width be more than described first while width, the described 8th while width be more than the described 3rd while width Degree;
The 5th of described first flexible board extends while from the first of described first rigid circuit board, and described 6th side is from described The first area of the 3rd rigid circuit board extends;7th side of described second flexible PCB is from described second rigid circuit board 3rd side is extended, and the 8th side of described second flexible PCB is extended from the second area of described tertiary circuit plate;
First side of described first rigid circuit board be located at described first area top, the 3rd of described second rigid circuit board the Side is located at the top of described second area;
4th side of described second rigid circuit board be located at described first area top, the second of described first rigid circuit board Side is located at the top of described second area;And
First rigid circuit board is parallel to each other with the second rigid circuit board, and shared first flexible PCB and the second flexible circuit The space that plate is formed.
2. electronic equipment according to claim 1, also includes the first support base,
Described first support seat supports described in the first rigid circuit board first while with described second rigid plate the 4th while.
3. electronic equipment according to claim 2, also includes the second support base;
Described second support seat supports described in the first rigid circuit board second while with described second rigid plate the 3rd while.
4. the electronic equipment according to any preceding claim, described first rigid circuit board and described second rigidity It is disposed with memorizer on circuit board, and be disposed with controller and HPI on described 3rd rigid circuit board.
5. electronic equipment according to claim 4, wherein said first flexible PCB is disposed with instruction described first The wiring of the configuration of rigid circuit board;And be disposed with described second flexible PCB and indicate described second rigid circuit board The wiring of configuration.
6. electronic equipment according to claim 5, wherein said first rigid circuit board is rectangle, described first side and institute State the minor face that the second side is described rectangle.
CN201210450948.8A 2012-11-11 2012-11-11 Electronic equipment Active CN103809678B (en)

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CN103809678B true CN103809678B (en) 2017-03-08

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CN104538225A (en) * 2014-12-31 2015-04-22 福建联迪商用设备有限公司 Electrical switch structure and electronic equipment

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CN201402611Y (en) * 2009-05-12 2010-02-10 成都市华为赛门铁克科技有限公司 Solid-state disk
CN102117097A (en) * 2009-12-31 2011-07-06 比亚迪股份有限公司 Mobile terminal and circuit board thereof
CN202206485U (en) * 2011-08-21 2012-04-25 深圳市同兴达科技有限公司 LCD (Liquid Crystal Display) module with FPC (Flexible Printed Circuit) connector assembly and test interface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201402611Y (en) * 2009-05-12 2010-02-10 成都市华为赛门铁克科技有限公司 Solid-state disk
CN102117097A (en) * 2009-12-31 2011-07-06 比亚迪股份有限公司 Mobile terminal and circuit board thereof
CN202206485U (en) * 2011-08-21 2012-04-25 深圳市同兴达科技有限公司 LCD (Liquid Crystal Display) module with FPC (Flexible Printed Circuit) connector assembly and test interface

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