CN202995542U - Storage device - Google Patents
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- CN202995542U CN202995542U CN 201220592371 CN201220592371U CN202995542U CN 202995542 U CN202995542 U CN 202995542U CN 201220592371 CN201220592371 CN 201220592371 CN 201220592371 U CN201220592371 U CN 201220592371U CN 202995542 U CN202995542 U CN 202995542U
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Abstract
A storage device comprises a first circuit board, a second circuit board and a third circuit board. A plurality of storage chips are disposed on the first circuit board. A plurality of storage chips are disposed on the second circuit board. A controller and a master connector are disposed on the third circuit board. The first circuit board is coupled with the third circuit board. The second circuit board is coupled with the third circuit board. Therefore, the storage chips on the first circuit board and the storage chips on the second circuit board are accessed through the controller and the master connector. The storage chips on the first circuit chip are configured into a first channel and a second channel. The first channel includes a first amount of storage chips. The second channel includes a second amount of storage chips. The first amount is different from the second amount.
Description
Technical field
The present invention relates to electronic equipment, more specifically, the present invention relates to the printed circuit board system for solid storage device (Solid Stora ge Device, SSD).
Background technology
Similar with the mechanical type hard disk, solid storage device (SSD) is also large capacity, the non-volatile memory device for computer system.Solid storage device generally with flash memory (Flash) as storage medium.High performance solid storage device is used to high-performance computer.
In patented claim WO2011085131A2, provide the solid state hard disc of the capacity expanded as shown in Figure 1A, 1B.In Figure 1A, be furnished with a plurality of connectors 204 on the main printed circuit board 205 of solid state hard disc, and the flash chip (not shown).Connector 204 can be connected to subcard removedly.Subcard can comprise flash chip, so that additional storage capacity to be provided to solid state hard disc.Subcard 608,610 is provided in Figure 1B, and each subcard comprises flash chip 609 and connector 607.Receive each subcard by connector 606.Each subcard 608 and 610 can be separately or together is connected to main PCB (Printed Circuit Board, printed circuit board (PCB)) 601.Controller 602 is presented to main frame with the capacity of the flash chip of subcard by interface 603.If subcard 608 and 610 all is inserted into, the capacity of the flash chip 609 on each subcard of controller 602 polymerizables is logically to present to main frame.
In utility model patent CN201402611Y, provide solid state hard disc as shown in Figure 2.The first Coupled Rigid-flexible PCB 4 as memory module comprises a plurality of flash chips 41, and comprises control chip 51 as the second Coupled Rigid-flexible PCB 5 of master control borad.The first Coupled Rigid-flexible PCB 4 comprises that rigidity PCB 42 and flexible PCB 43, the second Coupled Rigid-flexible PCB 5 comprise rigidity PCB 52 and flexible PCB 53.The first Coupled Rigid-flexible PCB 4 be connected Coupled Rigid-flexible PCB 5 and be connected the first Coupled Rigid-flexible PCB 4 with via hole and be connected the connection of the signal on Coupled Rigid-flexible PCB 5 by flexible PCB 43 and the signal wire that arranges on flexible PCB is connected.Flexible PCB 43 and flexible PCB 53 are as described in the diagonal line hatches zone in Fig. 2.Flexible PCB 43 and flexible PCB 53 and rigidity PCB 42 and rigidity PCB 52 can form in time processing.
Provide the PCB with flexible PCB in US2007165390A1, as shown in Figure 3.Fig. 3 comprises, the first base plate 100, the second base plate 200 and signal transmission flexible circuit (FPC, Flexible, Printed Cir cuit).The first base plate 100 and the second base plate 200 are disconnected from each other, and use the FPC transmission of signal.But installing electronic elements 201,202 on the second base plate 200, but on the first base plate 100 installing electronic elements 101,102, and micro-control unit (MCU, Micro Control Unit).The first base plate 100 comprises opening portion 300, and it is formed on the zone with dimension D, and dimension D is less than the full-size (d) of the first base plate 100.Signal hop FPC can extend from opening portion 300.
Yet, for improving the memory capacity of memory device, need to arrange more storage chip in limited space.But more storage chip needs more lead-in wire implement to control, and this contradicts with memory device limited space.And, the memory device with multiple different memory sizes and/or different storage chip quantity need to be provided, and significantly not increase cost.
Summary of the invention
According to a first aspect of the invention, a kind of electronic equipment is provided, comprise the first rigid circuit board, the second rigid circuit board and flexible PCB, described flexible PCB transmits electric signal between described the first rigid circuit board and described the second rigid circuit board, described the first rigid circuit board has relative first side and Second Edge; Described flexible PCB has the 3rd relative limit and the 4th limit; The first side of described the first rigid circuit board is coupled on the 3rd limit of described flexible PCB, and the first area of described the second rigid circuit board is coupled on the 4th limit of described flexible PCB; The width on described the 4th limit is greater than the width of described first side.
In electronic equipment according to a first aspect of the invention, be furnished with connector on described flexible PCB, described connector is for the first area that described flexible PCB is coupled to described the second rigid circuit board; Described first area is furnished with the connector corresponding with described the first connector.
In electronic equipment according to a first aspect of the invention, extend from the first side of described the first rigid circuit board on described the 3rd limit, and/or extend from the first area of described the second rigid circuit board on described the 4th limit.
In electronic equipment according to a first aspect of the invention, the first side of wherein said the first rigid circuit board is positioned at the top of described first area.
In electronic equipment according to a first aspect of the invention, also comprise the first supporting seat, described the first supporting seat is pressed on described connector on described the second rigid circuit board, and described the first supporting seat supports the first side of described the first rigid circuit board.
In electronic equipment according to a first aspect of the invention, also comprise the second supporting seat; Described the second supporting seat supports the Second Edge of described the first rigid circuit board.
In electronic equipment according to a first aspect of the invention, be furnished with connector on described flexible PCB, the plane at described flexible PCB and described the first rigid circuit board place has first surface respect to one another and second, described connector is arranged on described first surface, described connector is for the first area that described flexible PCB is coupled to described the second rigid circuit board, make described connector when described the second rigid circuit board, the first surface of described the first rigid circuit board is described the second rigid circuit board dorsad.
In electronic equipment according to a first aspect of the invention, be furnished with storer on described the first rigid circuit board, and be furnished with controller and host interface on described the second rigid circuit board.
In electronic equipment according to a first aspect of the invention, be furnished with the wiring of the configuration of described the first rigid circuit board of indication on wherein said flexible PCB.
In electronic equipment according to a first aspect of the invention, wherein said the first rigid circuit board is rectangle, and described first side and described Second Edge are the minor faces of described rectangle.
According to a second aspect of the invention, a kind of method for installing electronic equipment is provided, described electronic equipment comprises the first rigid circuit board, the second rigid circuit board and flexible PCB, described flexible PCB extends from one side of described the first rigid circuit board, and described method comprises: first connector that will be arranged on flexible PCB is connected with the second connector on being arranged in the second rigid circuit board; Use supporting seat that the first connector is pressed on described the second rigid circuit board; With the surface curvature of described flexible PCB along described supporting seat; And described the first rigid circuit board is fixed on described supporting seat.
Method according to a second aspect of the invention, the lower surface of wherein said supporting seat compresses described the first connector, and described the first rigid circuit board is placed in the groove of upper surface of described supporting seat.
According to a third aspect of the invention we, provide a kind of electronic equipment, comprised the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexible PCB and the second flexible PCB; Described the first flexible PCB transmits electric signal between described the first rigid circuit board and described the 3rd rigid circuit board, described the second flexible PCB transmits electric signal between described the second rigid circuit board and described the 3rd rigid circuit board, described the first rigid circuit board has relative first side and Second Edge; Described the second rigid circuit board has the 3rd relative limit and the 4th limit; Described the first flexible PCB has the 5th relative limit hexagon, and the first side of described the first rigid circuit board is coupled on described the 5th limit; Described the second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described the second rigid circuit board is coupled on described the 7th limit; Described hexagon is coupled to the first area of described the 3rd rigid circuit board, and the second area of described rigid circuit board is coupled on described the 8th limit; The width of described hexagon is greater than the width of described first side, and the width on described the 8th limit is greater than the width on described the 3rd limit.
Electronic equipment according to a third aspect of the invention we, extend from the first side of described the first rigid circuit board on wherein said the 5th limit; Extend from the 3rd limit of described the second rigid circuit board on described the 7th limit.
Electronic equipment according to a third aspect of the invention we, wherein, the hexagon of described the first flexible PCB is furnished with the first connector, and the 8th limit of described the second flexible PCB is furnished with the second connector; Described the first connector is for the first area that described the first flexible PCB is coupled to described the 3rd rigid circuit board; Described the second connector is used for described the second flexible PCB is coupled to the second area of described the 3rd rigid circuit board; Described first area is furnished with the connector corresponding with described the first connector, and described second area is furnished with the connector corresponding with described the second connector.
Electronic equipment according to a third aspect of the invention we, wherein, the hexagon of described the first flexible PCB extends from the first area of described the 3rd rigid circuit board, and extend from the second area of described tertiary circuit plate on the 8th limit of described the second flexible PCB.
Electronic equipment according to a third aspect of the invention we, wherein said first area are the parts on the 9th limit of described the 3rd rigid circuit board, and/or described second area is the part of the odd plots of land that can be cultivated of described the 3rd rigid circuit board.
Electronic equipment according to a third aspect of the invention we, also comprise the first supporting seat and the second supporting seat, described the first supporting seat is pressed on described the first connector on described the 3rd rigid circuit board, and described the second supporting seat is pressed on described the second connector on described the 3rd rigid plate; Described the first supporting seat supports the first side of described the first rigid circuit board, and described the first supporting seat also supports the 4th limit of described the second rigid circuit board; Described the second supporting seat supports the Second Edge of described the first rigid circuit board, and described the second supporting seat also supports the 3rd limit of described the second rigid circuit board.
Electronic equipment according to a third aspect of the invention we, wherein, the plane at described the first flexible PCB and described the first rigid circuit board place has first surface respect to one another and second; The plane at described the second flexible PCB and described the second rigid circuit board place has the 3rd and fourth face respect to one another; Described the first connector is arranged on described first surface, and described the second connector is arranged on described the 3rd; Described the first connector is for the first area that described the first flexible PCB is coupled to described the 3rd rigid circuit board, make described the first connector when described the 3rd rigid circuit board, the first surface of described the first rigid circuit board is described the 3rd rigid circuit board dorsad; Described the second connector is used for described the second flexible PCB is coupled to the second area of described the 3rd rigid circuit board, make described the second connector when described the 3rd rigid circuit board, the first surface of described the second rigid circuit board is described the 3rd rigid circuit board dorsad.
Electronic equipment according to a third aspect of the invention we is furnished with storer on wherein said the first rigid circuit board, is furnished with storer on described the second rigid circuit board, is furnished with controller and host interface on described the 3rd rigid circuit board.
Electronic equipment according to a third aspect of the invention we, the memory capacity of the storer on wherein said the first rigid circuit board are two times of memory capacity of the storer on described the second rigid circuit board.
Electronic equipment according to a third aspect of the invention we, the first side of wherein said the first rigid circuit board is positioned at the top of described first area, and the 3rd limit of described the second rigid circuit board is positioned at the top of described second area;
The 4th limit of described the second rigid circuit board is positioned at the top of described first area, and the Second Edge of described the first rigid circuit board is positioned at the top of described second area.
Electronic equipment according to a third aspect of the invention we, be furnished with the wiring of the memory capacity of the storer on described the first rigid circuit board of indication on wherein said the first flexible PCB, be furnished with the wiring of the memory capacity of the storer on described the second rigid circuit board of indication on described the second flexible PCB.
according to a forth aspect of the invention, a kind of method for installing electronic equipment is provided, described electronic equipment comprises the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexible PCB and the second flexible PCB, described the first flexible PCB extends from one side of described the first rigid circuit board, extend on one side of described second flexible PCB green onion the described second just awake circuit board, described method comprises: first connector that will be arranged on the first flexible PCB is connected with the second connector on being arranged in the 3rd rigid circuit board, use the first supporting seat that the first connector is pressed on described the 3rd rigid circuit board, with the surface curvature of described the first flexible PCB along described the first supporting seat, described the first rigid circuit board is fixed on described the first supporting seat, the 3rd connector that is arranged on the second flexible PCB is connected with the 4th connector on being arranged in the 3rd rigid circuit board, use the second supporting seat that described the 3rd connector is pressed on described the 3rd rigid circuit board, with the surface curvature of described the second flexible PCB along described the second supporting seat, described the second rigid circuit board is fixed on described the second supporting seat, described the second rigid circuit board is fixed on described the first supporting seat, and described the first rigid circuit board is fixed on described the second supporting seat.
Method according to a forth aspect of the invention, the lower surface of wherein said the first supporting seat compresses described the first connector, and described the first rigid circuit board is placed in first groove of upper surface of described the first supporting seat; Described the 3rd connector of the lower surface of described the second supporting seat compression, and described the second rigid circuit board is placed in first groove of upper surface of described the second supporting seat; Described the first rigid circuit board is positioned in second groove of upper surface of described the second supporting seat, and described the second rigid circuit board is positioned in first groove of upper surface of described the first supporting seat.
According to a fifth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; Be furnished with one or more memory chips on described first circuit board, be furnished with one or more memory chips on described second circuit board, be furnished with controller and host interface on described tertiary circuit plate; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in the one or more memory chips on described first circuit board via described host interface by described controller access and to be arranged in one or more memory chips on described second circuit board; The capacity of the memory chip on described first circuit board is two times of capacity of the memory chip on described second circuit board.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector that is arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on described tertiary circuit plate.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said the first connector are used for the signal of the capacity of the memory chip on the described first circuit board of transmission indication, and/or one or more pins of described the second connector are used for the signal of the capacity of the memory chip on the described second circuit board of transmission indication.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector and the second connector that is arranged on described tertiary circuit plate, described second circuit board is coupled to described tertiary circuit plate by the 3rd connector and the 4th connector that is arranged on described tertiary circuit plate, wherein said the first connector is identical with described the 3rd connector, and described the second connector is identical with described the 4th connector.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said the first connector and/or described the second connector are used for the signal of the capacity of the memory chip on the described first circuit board of transmission indication, and one or more pins of described the 3rd connector and/or described the 4th connector are used for the signal of the capacity of the memory chip on the described second circuit board of transmission indication.
Memory device according to a fifth aspect of the invention, also comprise the first flexible PCB and the second flexible PCB, described the first flexible PCB is used for described first circuit board is coupled to described tertiary circuit plate, and described the second flexible PCB is used for described second circuit board is coupled to described tertiary circuit plate.
Memory device according to a fifth aspect of the invention, wherein, described first circuit board has relative first side and Second Edge; Described second circuit board has the 3rd relative limit and the 4th limit; Described the first flexible PCB has the 5th relative limit hexagon, and the first side of described first circuit board is coupled on described the 5th limit; Described the second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second circuit board is coupled on described the 7th limit; Described hexagon is coupled to the first connector of described tertiary circuit plate, and the second connector of described tertiary circuit plate is coupled on described the 8th limit; The width of described hexagon is greater than the width of described first side, and the width on described the 8th limit is greater than the width on described the 3rd limit; The first side of described first circuit board is positioned at the top of described the first connector, and the 3rd limit of described second circuit board is positioned at the top of described the second connector; The 4th limit of described second circuit board is positioned at the top of described the first connector, and the Second Edge of described first circuit board is positioned at the top of described the second connector.
Memory device according to a fifth aspect of the invention, wherein, extend from the first side of described first circuit board on described the 5th limit; Extend from the 3rd limit of described second circuit board on described the 7th limit.
Memory device according to a fifth aspect of the invention, also comprise the first supporting seat and the second supporting seat, described the first supporting seat is fastened on the hexagon of described the first flexible PCB on described the first connector, and described the second supporting seat is fastened on the 8th limit of described the second flexible PCB on described the second connector; Described the first supporting seat supports the first side of described first circuit board, and described the first supporting seat also supports the 4th limit of described second circuit board; Described the second supporting seat supports the Second Edge of described first circuit board, and described the second supporting seat also supports the 3rd limit of described second circuit board.
Memory device according to a fifth aspect of the invention comprises a plurality of described first circuit boards and/or a plurality of described second circuit board.
Memory device according to a fifth aspect of the invention, be furnished with one or more memory chips on described the 4th circuit board, described the 4th circuit board is coupled with described tertiary circuit plate, makes via described host interface and is arranged in one or more memory chips on described the 4th circuit board by described controller access; The capacity of the memory chip on described the 4th circuit board is two times of capacity of the memory chip on described second circuit board, and perhaps the capacity of the memory chip on the capacity of the memory chip on described the 4th circuit board and described second circuit board is identical.
According to a sixth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; Be furnished with a plurality of memory chips on described first circuit board, be furnished with a plurality of memory chips on described second circuit board, be furnished with controller and host interface on described tertiary circuit plate; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in a plurality of memory chips on described first circuit board via described host interface by described controller access and to be arranged in a plurality of memory chips on described second circuit board; Described a plurality of memory chips on described first circuit board are configured to first passage and second channel, described first passage comprises the memory chip of the first quantity, described second channel comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
Memory device according to a sixth aspect of the invention wherein, also comprises third channel on described first circuit board, described third channel comprises the memory chip of the 3rd quantity, and described the 3rd quantity is different from described the first quantity.
Memory device according to a sixth aspect of the invention, wherein, described a plurality of memory chips on described second circuit board are configured to four-way and Five-channel, described four-way comprises the memory chip of the 4th quantity, described Five-channel comprises the memory chip of the 5th quantity, and described the 4th quantity is different from described the 5th quantity.
Memory device according to a sixth aspect of the invention, wherein, the quantity of the described a plurality of memory chips on described second circuit board is different from the quantity of the described a plurality of memory chips on described first circuit board.
Memory device according to a sixth aspect of the invention, wherein, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector that is arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on described tertiary circuit plate; And described the first connector is identical with described the second connector, make described first circuit board to be coupled to described tertiary circuit plate by the second connector that is arranged on described tertiary circuit plate, described second circuit board can be coupled to described tertiary circuit plate by being arranged in the electrical connection of first on described tertiary circuit plate.
Memory device according to a sixth aspect of the invention, wherein, one or more pins of described the first connector are used for the signal of the quantity of the memory chip on the described first circuit board of transmission indication; One or more pins of described the second connector are used for the signal of the quantity of the memory chip on the described second circuit board of transmission indication.
Memory device according to a sixth aspect of the invention, wherein, one or more pins of described the first connector are used for the signal of the quantity of the memory chip that each channel on the described first circuit board of transmission indication has; One or more pins of described the second connector are used for the signal of the quantity of the memory chip that each channel on the described second circuit board of transmission indication has.
Memory device according to a sixth aspect of the invention, wherein memory chip has identical memory capacity.
According to a seventh aspect of the invention, provide a kind of memory device, comprised controller, first memory passage and second memory passage; Described first memory passage and described second memory passage are coupled to respectively described controller; Described first memory passage comprises the memory chip of the first quantity, and described second memory passage comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
Memory device according to a seventh aspect of the invention, wherein, the memory chip of described the first quantity arrives described controller by the first bus coupling of sharing, and the second bus coupling that the memory chip of described the second quantity passes through to share is to described controller.
Description of drawings
When reading together with accompanying drawing, by the reference back detailed description to the embodiment of illustrating property, will understand best the present invention and preferably use pattern and its further purpose and advantage, wherein accompanying drawing comprises:
Figure 1A, 1B are the solid state hard discs according to the capacity expanded of prior art;
Fig. 2 is the solid state hard disc that comprises rigidity PCB and flexible PCB according to prior art;
Fig. 3 comprises the electronic equipment of rigidity PCB and flexible PCB according to the another kind of prior art;
Fig. 4 is the front elevation of memory device according to an embodiment of the invention;
Fig. 5 A is the front elevation of the circuit daughter board of memory device according to an embodiment of the invention;
Fig. 5 B-5E is the side view of memory circuit daughter board according to an embodiment of the invention;
Fig. 5 F-5J is the schematic diagram of the connected mode of the flash chip of circuit daughter board of memory device according to an embodiment of the invention and control circuit;
Fig. 6 A shows the side view of the connected mode of the daughter board of memory device according to an embodiment of the invention and motherboard;
Fig. 6 B shows the side view of another connected mode of the daughter board of memory device according to an embodiment of the invention and motherboard;
Fig. 7 shows the front elevation of the connected mode of the daughter board of memory device according to an embodiment of the invention and flexible PCB;
Fig. 8 is another front elevation of memory device according to an embodiment of the invention;
Fig. 9 is the stereographic map of memory device according to an embodiment of the invention;
Figure 10 is the vertical view of memory device according to an embodiment of the invention;
Figure 11 A, 11B, 11C are for the stereographic map of the supporting seat of memory device according to an embodiment of the invention;
Figure 12 is another stereographic map of memory device according to an embodiment of the invention;
Figure 13 is the front elevation of memory device according to another embodiment of the present invention; And
Figure 14 is the front elevation of memory device according to still another embodiment of the invention.
Embodiment
Fig. 4 is the front elevation of memory device according to an embodiment of the invention.Memory device shown in Figure 4 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with the high card form of PCIE half, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420 and 430 on circuit motherboard 400.In one embodiment, be furnished with respectively flash chip 411-413,421-423 and 431-433 on circuit daughter board 410,420 and 430, make circuit daughter board 410,420,430 provide memory capacity to memory device shown in Figure 4.Also be furnished with the flash controller (not shown) on circuit motherboard 400, in order to the access of control to the flash chip on circuit daughter board 410,420 and 430, and processing is from the interface command of computing machine.although figure 4 illustrates the memory device with PCIE interface that comprises flash chip, but one of ordinary skill in the art will recognize, it is only a kind of giving an example, the present invention is applicable to the various electronic with other functions, and can be coupled to computing machine by the multiple interfaces mode, multiple interfaces includes but not limited to SATA(Serial Advanced Technology Attach ment, Serial Advanced Technology Attachment), USB(Universal Serial Bus, USB (universal serial bus)), PCIE(Peripheral Component Interconnect Express, quick peripheral assembly interconnecting), SCSI(Small Computer System Interface, small computer system interface), IDE(Integrated Drive Electro nics, the integrated drive electronics) etc.And the present invention also is applicable to comprise the storage chip of flash memory other types in addition, for example, and phase transition storage, Memister, ferroelectric memory etc.
As shown in Figure 4, circuit daughter board 410 and 420 is with the opposite directions layout, and circuit daughter board 410 is arranged with identical direction with 430.Can arrange more flash chip thereby make on the circuit motherboard 400 with specific dimensions.And circuit daughter board 410,420 and 430 has identical physical dimension and identical interface, makes between circuit daughter board 410,420 and 430 and can replace each other, also can adopt other circuit daughter board replacement circuit daughter board 410,420 and 430.
Fig. 5 A is the front elevation of daughter board of implementing the memory device of embodiments of the invention.More clearly showed the circuit subcard 410 in Fig. 4 in Fig. 5 A.Circuit subcard 420 and 430 can have the physical aspect identical with circuit subcard 410, but can have the memory capacity identical or different with circuit subcard 410.In preferred example, the memory capacity of circuit subcard 420 is two times of circuit subcard 410.Be furnished with flash chip 411,412 and 413 on circuit subcard 410.In an example, the unshowned one side at circuit subcard 410 also is furnished with flash chip.Flash chip 411,412 and 413 can be the flash chip with same capability, can be also the flash chip with different capabilities.Flash chip on circuit subcard 410 can be organized as a plurality of passages, comprises the flash chip of two or other quantity on each passage.Each passage is parallel, can be simultaneously to circuit motherboard 400 the transmission of datas or from circuit motherboard 400 receive datas.Also can arrange a plurality of flash chips with other quantity on circuit subcard 410.
In the situation that can hold flash chip 411,412 and/or 413, arrange the size of circuit subcard 410 as far as possible little, in order to can arrange the circuit subcard of greater number on circuit motherboard 400, thereby improve the capacity of memory device.Owing to can arrange polylith circuit subcard 410,420 and/or 430 on circuit motherboard, and circuit subcard 410,420 and 430 can have the capacity that differs from one another, thereby memory device can have the combination of multiple different memory capacity.Referring to table 1, when circuit subcard 410,420 and 430 can have 192GB(Giga Byte) when two kinds of memory capacity of 394GB, and when arranging maximum 6 circuit subcards 410 on circuit motherboard 400,420 or 430 the time, can obtaining having the memory device of multiple different memory sizes.Comprise 4 to the configuration of the memory device of 6 circuit subcards although illustrated in table 1,, also can arrange 1-3 circuit subcard on circuit motherboard 400, so that how different memory capacity to be provided.
Table 1 memory device, stores capacities chart
Thus, by the circuit subcard of two kinds of different memory sizes is provided, obtain having the memory device of multiple different capabilities, can satisfy the demand of multiple different occasions.
And because circuit subcard 410,420 and 430 has identical physical aspect, thereby the installation of circuit subcard 410,420 and 430 on circuit motherboard 400 is interchangeable, thereby simplified the process of installing, and, when one of a plurality of circuit subcards break down, also can easily change.And, by with larger capacity and/or existing circuit subcard on the circuit subcard replacement circuit motherboard 400 of high-performance (access speed, reliability etc.) more, can easily realize renewal or upgrading to memory device.
One of ordinary skill in the art will recognize, the circuit subcard with three kinds or more kinds of different memory sizes also can be provided, thereby the memory device with more kinds of memory capacity can be provided.For example, referring to table 2, (for example can arrange the storage chip of varying number on circuit daughter board 410,3-6 storage chip), thereby, in the situation that each storage chip has 64GB memory capacity, can provide have respectively 192GB, 256GB, the circuit subcard of 320GB and 384GB memory capacity.And by multiple circuit subcard with different memory sizes is provided, can obtain having the memory device of more kinds of different memory sizes.Obviously, if each storage chip on circuit daughter board 410 has different memory capacity, can provide to have the memory device that further multiple different memory capacity makes up.
Table 2 circuit subcard memory capacity table
| Chip capacity | Number of chips | The subcard capacity |
| 64GB | 3 | 192GB |
| 64GB | 4 | |
| 64GB | ||
| 5 | 320GB | |
| 64GB | 6 | 384GB |
Fig. 5 B-5E is the side view of circuit daughter board 410 of implementing the memory device of embodiments of the invention.In Fig. 5 B, be furnished with storage chip 411,412,413,414,415 and 416 on circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board in Fig. 5 B can provide the memory capacity of 384GB.In Fig. 5 C, be furnished with storage chip 411,412,413,414 and 415 on circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board in Fig. 5 C can provide the memory capacity of 320GB.In Fig. 5 D, be furnished with storage chip 411,412,413 and 414 on circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board in Fig. 5 D can provide the memory capacity of 256GB.In Fig. 5 E, be furnished with storage chip 411,412 and 413 on circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board in Fig. 5 E can provide the memory capacity of 192GB.
Continuation is referring to Fig. 5 F-5J, and Fig. 5 F-5J is the schematic diagram of the connected mode of the flash chip of circuit daughter board 410 of memory device according to an embodiment of the invention and control circuit 660.For the concurrency of the operation that promotes a plurality of flash chips, and save the IO resource of controlling the needed control circuit 660 of a plurality of flash chips, a plurality of flash chips on circuit daughter board 410 are arranged in a plurality of passages.Be furnished with a plurality of flash chips in each passage, a plurality of flash chip shared datas and/or control bus in each passage, and in order to access each flash chip, chip enable (the Chip Enable of a plurality of flash chips (and/or tube core) in each passage, CE) port can be controlled individually by control circuit 660.
Referring to Fig. 5 F, be furnished with 3 passages on circuit daughter board 410.Flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by the bus 490 that shares.Control circuit 660 can be controlled flash chip 411,414 CE port independently.Flash chip 412,415 is included in second channel, and is coupled to control circuit 660 by the bus 492 that shares.Control circuit 660 can be controlled flash chip 412,415 CE port independently.Flash chip 413,416 is included in third channel, and is coupled to control circuit 660 by the bus 494 that shares.Control circuit 660 can be controlled flash chip 413,416 CE port independently.
The flash chip that other quantity can be arranged on each passage alternatively.Referring to Fig. 5 G, flash chip 411,412 and 413 is included in first passage, and is coupled to control circuit 660 by the bus 490 that shares.Control circuit 660 can be controlled flash chip 411,412 and 413 CE port independently.Flash chip 414,415 and 416 is included in second channel, and is coupled to control circuit 660 by the bus 494 that shares.Control circuit 660 can be controlled flash chip 414,415 and 416 CE port independently.
The flash chip that can have still alternatively, varying number on each passage.Referring to Fig. 5 H, flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by the bus 490 that shares.Control circuit 660 can be controlled flash chip 411,414 CE port independently.Flash chip 412,415 is included in second channel, and is coupled to control circuit 660 by the bus 492 that shares.Control circuit 660 can be controlled flash chip 412,415 CE port independently.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Noticing does not provide flash chip 416 in Fig. 5 H, it is corresponding to the example that provides in Fig. 5 C.Notice equally, in Fig. 5 H, in first passage and second channel, be furnished with 2 flash chips, and in third channel, only be furnished with 1 flash chip, that is, have the flash chip of varying number on each passage.Although it is pointed out that the flash chip that has varying number on each passage, the memory capacity on each passage can be the same or different.When the flash chip 411-415 in Fig. 5 H had identical memory capacity, the memory capacity on third channel was half of memory capacity of first passage.Also can provide flash chip 413, making its memory capacity is flash chip 411,412,414 or 415 two times, thereby makes the memory capacity on each passage identical.
Although still it is pointed out that not comprise flash chip 416 in the embodiment of Fig. 5 H,, in the circuit daughter board 410 of corresponding with it Fig. 5 C, preferably, provide the interface arrangement identical with the circuit daughter board 410 of Fig. 5 B.Namely, although the circuit daughter board 410 at Fig. 5 C, need to not provide the lead-in wire of the CE port that is coupled to flash chip 416 in interface, but be favourable for multiple different circuit daughter board provides identical interface arrangement, this will allow the different circuit daughter board of coupling on the connector of circuit motherboard 400, thereby improve the dirigibility of memory device, and simplified the installation process of memory device 400, be not limited to be arranged on specific motherboard connector because have the circuit daughter board 410 of particular memory capacity or flash chip quantity.
In one embodiment, in the interface of circuit daughter board 410, provide 3 lead-in wires, every lead-in wire is by being furnished with 1 flash chip or 2 flash chips on a passage in electric signal indication first passage, second channel and the third channel of its transmission.One of ordinary skill in the art also can recognize the mode of the configuration of other indicating circuit daughter boards 410.For example, in the interface of circuit daughter board 410, provide 2 lead-in wires, it can transmit " 00 ", " 01 ", " 10 " and " 11 " four kinds of different states, a kind of customized configuration of each condition indication circuit daughter board 410.Service wire is indicated, can also be the quantity of the storage chip on circuit daughter board 410, the memory capacity that perhaps provides on circuit daughter board 410.
Referring to Fig. 5 I, flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by the bus 490 that shares.Control circuit 660 can be controlled flash chip 411,414 CE port independently.Flash chip 412 is included in second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Noticing does not provide flash chip 415 and 416 in Fig. 5 H, it is corresponding to the example that provides in Fig. 5 D.
Referring to Fig. 5 J, flash chip 411 is included in first passage, and is coupled to control circuit 660 by bus 490.Control circuit 660 can be controlled the CE port of flash chip 411 independently.Flash chip 412 is included in second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412 independently.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413 independently.Notice in Fig. 5 J, flash chip 414,415 and 416 is not provided, and it is corresponding to the example that provides in Fig. 5 E.
Fig. 6 A shows the side view of the connected mode of the circuit daughter board of memory device according to an embodiment of the invention and circuit motherboard.Be furnished with flash chip 411,412 and 413 on circuit daughter board 410.With flash chip 411,412 and 413 relative sides, also can be furnished with one or more flash chips on circuit daughter board 410.Be furnished with connector 510,520 on circuit motherboard 400, be used for being connected respectively with 540 with connector 530, thereby circuit daughter board 410 is coupled to circuit motherboard 400. Connector 530 and 540 is arranged in respectively an end of flexible PCB 550 and 560, and flexible PCB 550,560 the other end extend from circuit daughter board 410 relative both sides.Flexible PCB 550 and 560 can form in time processing with circuit daughter board 410.Owing to being connected respectively to connector 510,520 by connector 530,540, thereby the signal wire that each connector 530 and 540 transmits can be half quantity of access circuit daughter board 410 desired signal lines, thereby, connector 530 and 540 size can be less, to reduce the space that occupies on circuit motherboard 400.Owing to passing through connector 510,520,530 and 540 connecting circuit motherboards 400 and circuit daughter boards 410, it is removable making circuit daughter board 410.
As an example, can be not yet with connector 510,520,530 and 540 be coupled flexible PCB 550 and 560, but on circuit motherboard 400, the open area is set, and makes the open area of flexible PCB 550,560 from the circuit motherboard 400 extend.Perhaps, flexible PCB 550,560 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 550,560 and circuit motherboard 400 form in time processing.
Still as an example, flexible PCB 550,560 also can be connected to circuit daughter board 410 by connector.And in circuit subcard 410 relative both sides, connector is set also, be used for connecting flexible PCB 550,560.
Fig. 6 B shows the side view of the another kind of connected mode of the circuit daughter board of memory device according to an embodiment of the invention and circuit motherboard.Be furnished with flash chip 411,412 and 413 on circuit daughter board 410.With flash chip 411,412 and 413 relative sides, also can be furnished with one or more flash chips on circuit daughter board 410.With flash chip 411,412 and 413 relative sides, also can be furnished with one or more flash chips on circuit daughter board 410.Be furnished with connector 620 on circuit motherboard 400, be used for being connected with connector 630, thereby circuit daughter board 410 is coupled to circuit motherboard 400.Connector 630 is arranged in an end of flexible PCB 640, and the other end of flexible PCB 640 extends from circuit daughter board 410 relative both sides.Flexible PCB 640 can form in time processing with circuit daughter board 410.Owing to being connected to connector 620 by connector 630, thereby the signal wire that connector 630 transmits can be the entire quantity of access circuit daughter board 410 desired signal lines, thereby, the connector 630 and 620 of large-size need to be provided.In a preferred embodiment, for being provided at reliable connection the between flexible PCB 640 and circuit motherboard 400, and arrange the size of connector 630 greater than the length of flexible PCB 640 from circuit subcard 410 connections.In the case, flexible PCB 640 is trapezoidal, will be described further in Fig. 7.Although use single connector 630 connecting circuit daughter boards 410 and circuit motherboard 400 to need larger sized connector, but can bring the convenience of installation, because only need carry out the one-step installation operation, just circuit subcard 410 can be connected to circuit motherboard 400, and not have an end of connector to provide the space for fitting operation on circuit subcard 410.
As an example, also can on circuit motherboard 400, the open area be set, and make flexible PCB 640 extend from the open area on circuit motherboard 400.Perhaps, flexible PCB 640 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 640 form in time processing with circuit motherboard 400.
Still as an example, flexible PCB 640 also can be connected to circuit daughter board 410 by connector.And connector also is set on circuit subcard 410, be used for connecting flexible PCB 640.
In order to improve the space availability ratio of circuit motherboard 400, arrange connector 620 near one side of circuit motherboard 400.And make circuit subcard 410 place perpendicular to this limit.
Fig. 7 shows the circuit daughter board 410 of memory device according to an embodiment of the invention and the front elevation of the connected mode of flexible PCB 640.Be furnished with flash chip 411,412 and 413 on circuit daughter board 410.Flexible PCB 640 has relative limit 681 and 682.Extend from one side of circuit daughter board 410 on one side 681 of flexible PCB 640.Be furnished with connector 630 on the limit 682 relative with limit 681 of flexible PCB 640, be used for being connected with circuit motherboard 400.The signal wire that transmits due to connector 630 can be the required whole signal wires of access circuit daughter board 410, thereby the length on limit 682 is greater than the length on limit 681, thereby make the signal wire that can hold sufficient amount in connector 630, and guarantee the connection reliability of flexible PCB 640 and circuit motherboard 400.
Be also noted that in Fig. 7, extended flexible PCB 640 has formed a plane with circuit subcard 410 from one side of circuit subcard 410, and connector 630 and flash chip 411,412 and/or 413 the same sides on this plane.Referring to Fig. 6 B, when flexible PCB 640 was connected to circuit motherboard 400, flexible PCB was crooked, makes connector 630 towards circuit motherboard 400 at this, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.In Fig. 8, will further describe this.
Circuit daughter board 410 can have multiple memory capacity.By the wiring that is connected to circuit motherboard 400 is set in flexible PCB 640 and connector 630, with the memory capacity of the controller indicating circuit daughter board 410 on circuit motherboard.When circuit daughter board 410 has two kinds of different memory capacity, for example one of 192GB and 384GB, a wiring can be set, by this wiring being coupled to high level or low level on circuit daughter board 410, the memory capacity of the controller indicating circuit daughter board 410 on the circuit main board 400 is 192GB or 384GB.Also can keep the memory capacity of coming indicating circuit daughter board 410 more than a wiring.In another example, circuit daughter board 410 is with the coding of the storage capacity information on it, and the information after encoding passes to the controller on circuit motherboard 400.In another example still, the addressable flash chip 411 of the control circuit on circuit motherboard 400,412 and 413 obtaining the memory capacity of each flash chip, thereby obtains the memory capacity of circuit daughter board 410.One of ordinary skill in the art also will recognize, in the connected mode of as shown in Figure 6A circuit daughter board 410 and circuit motherboard 400, also can provide wiring in connector 530 and/or 540, with the memory capacity to circuit motherboard 400 indicating circuit daughter boards 410, and make connector 530 and connector 540 have identical physical dimension and wiring arrangement.
Fig. 8 is another front elevation of memory device according to an embodiment of the invention.Circuit daughter board 410 has been shown in Fig. 8 to be connected on circuit motherboard 400 by flexible PCB 640 and the connector 630 that is arranged on flexible PCB 640.It may be noted that in Fig. 8, connector 630 is towards circuit daughter board 400, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.Connector 630 is connected to the connector (not shown) on the one side that is arranged in circuit motherboard.In a preferred embodiment, connector 630 is arranged in the on one side long of circuit motherboard 400, and circuit daughter board 410 is perpendicular to the longer sides of circuit motherboard 400.Thereby can be on circuit motherboard 400 a plurality of circuit daughter boards 410 of parallel arranged.Flexible PCB 640 bendings, one side make it on one side from the extending of circuit daughter board 410, and connector 630 is towards circuit motherboard 400, and be connected to circuit motherboard 400.When flexible PCB 640 is in not case of bending, connector 630 with flash chip 411,412 and/or 413 towards the same side.In Fig. 8, circuit daughter board 410 parallels with circuit motherboard 400, and circuit daughter board 410 is spatially separated from one another with circuit motherboard 400.Space between circuit daughter board 410 and circuit motherboard 400 can be used for the installation of circuit daughter board 410.By this space, can apply power to the back side of connector 630, thereby connector 630 is installed on connector on circuit motherboard 400.
Can also see from Fig. 8, the length of connector 630 is greater than one side of circuit daughter board 410, and flexible PCB 640 extends from this limit.That is, the length on one side of flexible PCB 640 connecting circuit daughter boards 410 is less than arranging the length on one side of connector 630 on flexible PCB.
Fig. 9 is the stereographic map of memory device according to an embodiment of the invention. Circuit daughter board 410 and 420 has been shown in Fig. 9 can be not shown by flexible PCB 640() and flexible PCB 642 be connected on circuit motherboard 400.Be furnished with flash chip 411,412 and 413 on circuit daughter board 410, be furnished with flash chip 421,422 and 423 on circuit daughter board 420.Circuit daughter board 410,420 sides towards circuit motherboard 400 also can be furnished with one or more flash chips.Connector 630 is arranged on flexible PCB 640, and can be arranged in circuit motherboard on connector 620 be connected.Connector 632 is arranged on flexible PCB 642, and can be arranged in circuit motherboard on connector 622 be connected.Preferably, flexible PCB 642 is flexible PCBs identical with flexible PCB 640, and connector 632 is identical with connector 630, and connector 622 is identical with connector 620, thereby makes circuit daughter board 410 and circuit daughter board 420 be connected to convertibly circuit motherboard 400.
When circuit daughter board 420 is connected to connector 622 by connector 632, and circuit daughter board 410 is when being connected to connector 620 by connector 630, the limit 415 of circuit daughter board 410 is positioned at the top of connector 632, and the limit 425 of circuit daughter board 420 is positioned at the top of connector 630.Flexible PCB 640(is not shown) extend from the limit 417 relative with limit 415 of circuit daughter board 410, and flexible PCB 642 extends from the limit 427 relative with limit 425 of circuit daughter board 420.In this way, although connector 630,632 length are greater than the limit 417 of circuit daughter board 410 and the limit 427 of circuit daughter board 420, but shared by circuit daughter board 410 and 420 due to connector 630 and 632 corresponding spaces, make and to arrange more circuit subcard on circuit motherboard 400.
And, when being installed to circuit daughter board 410,420 on circuit motherboard 400, because flexible PCB 640 and 642 can be in non-case of bending, thereby can be easily apply power to the back side of connector 630 and 632, it is connected respectively to connector 620 and 622.Next, flexible flexible PCB 640 and 642 makes circuit daughter board 410 parallel with circuit motherboard 400 with 420, thereby reduces the occupied space of memory device that is made of circuit motherboard and circuit daughter board 410,420.
Be parallel to each other with 420 due to circuit daughter board 410 and head and the tail relative, and Share interlinkage device 630 and 632 formed spaces, thereby circuit daughter board 410 and 420 can be regarded as a circuit daughter board group.
Figure 10 is the vertical view of memory device according to an embodiment of the invention.In Figure 10, show circuit daughter board 410,420 and 430, circuit daughter board 430 can be to have the circuit daughter board of same physical profile with circuit daughter board 410,420, but has and circuit daughter board 410,420 identical or different memory capacity.Circuit daughter board 410 is connected to circuit motherboard 400 via flexible PCB 640, connector 630, connector 620.Circuit daughter board 430 is connected to circuit motherboard 400 via flexible PCB 644, connector 634, connector 624.Connector 634 is arranged on flexible PCB 644, and connector 624 is arranged on circuit motherboard 400.Preferably, connector 620 and 624 is placed on same straight line along circuit motherboard 400 long limit.The limit 437 of the limit 417 of circuit daughter board 410, the limit of circuit daughter board 420 425 and circuit daughter board 430 is placed on basic same straight line.As shown in figure 10, because flexible PCB 640 is trapezoidal, namely the length of connector 630 is greater than the length on limit 417, makes the limit 425 of circuit subcard 420 can be positioned at the below of connector 630, and be separated with connector 630, and limit 425 is on substantially same straight line with limit 417.
As an example, also can see from Figure 10, although the length of connector 630 is greater than the length on limit 417, less than the length sum of limit 417 with limit 425, make the length of connector 630 be suitable for guaranteeing the reliability that connects and have less size, to reduce the manufacturing cost of connector 630.
Figure 11 A, 11B, 11C are for the stereographic map of the supporting seat 1100 of memory device according to an embodiment of the invention.Supporting seat 1100 comprises side wall 1110,1112, and side wall 1110 and 1112 is oppositely arranged, and parallel to each other, is used for coupling supporting seat 1100 and circuit motherboard 400.In an example, have screw on side wall 1110 and 1112, further supporting seat is fixed in motherboard 400 by bolt.Supporting seat also comprises plate 1120.Plate 1120 is vertical coupled between side wall 1110 and 1112.Plate 1120 can be integrally formed with side wall 1110,1120.Plate 1120 has relative first surface 1122 and second surface 1124.First surface 1122 is circuit motherboard 400 dorsad, and be used for to support two circuit daughter boards, and second surface 1124 is towards circuit motherboard 400, and is used for compressing the connector that is arranged on flexible PCB.Projection 1132 is arranged on the direction perpendicular to first surface 1122, be used for cutting apart two circuit daughter boards, and the movement of limiting circuit daughter board.Form the second projection 1134 on the direction that is parallel to first surface 1122.To further describe in Figure 12 supporting seat 1100, circuit daughter board 410,420 and circuit motherboard 400 between coupled relation.Although the above has described the supporting seat 1100 with ad hoc structure in conjunction with Figure 11 A, 11B, 11C, one of ordinary skill in the art will recognize can adopt supporting seat or the like with other structures, provide circuit daughter board 410 and/or 420 with circuit motherboard 400 between reliable the connection.
Figure 12 is another stereographic map of memory device according to an embodiment of the invention.Compare with the memory device shown in Fig. 9, also gone out supporting seat 1100 and 1200 in Figure 12.In Figure 12, for purpose clearly, supporting seat 1100 is illustrated in the below of connector 632, supporting seat 1200 is illustrated in the below of connector 630.And when mounted, and in the memory device after installation, supporting seat 1100 is used for connector 632 is pressed on connector 622, and supporting seat 1200 is used for connector 630 is pressed on connector 620.
In installation process, connector 632 is connected with connector 622.Then, supporting seat 1100 is placed on the back side of connector 632, and the second surface 1124 of the plate 1120 of supporting seat is compressed connector 632.In an example, can also pass through bolt, two side walls of supporting seat 1100 are fixed on circuit motherboard 400.With the similar ground of supporting seat 1100, supporting seat 1200 is pressed on connector 630 on connector 620.
The face 1229 of supporting seat 1100 with first surface 1122(referring to Figure 11 A, 11B and 11C) vertical with second surface 1124, and be positioned at projection 1134(referring to Figure 11 A, 11B and 11C) opposite direction.
The plate 1120 of supporting seat 1100 is used for filling the space between connector 632, flexible PCB 642 and circuit daughter board 410,420, and support circuit daughter board 410 and 420.Projection 1132 is divided into groove 1217 and 1218 with plate 1120.After being pressed on supporting seat 1100 on connector 632, flexible PCB 642 along face 1229 bendings, and is placed on a side on the close limit 427 of circuit subcard 420 on the groove 1218 of supporting seat 1100.Groove 1218 is set makes circuit subcard 420 just be placed in groove 1218, and by the movement of projection 1132 with the side wall limiting circuit subcard 420 of supporting seat 1100.
Similarly, after being pressed on supporting seat 1200 on connector 630, not shown in crooked flexible PCB 640(Figure 12), make the side on the close limit 417 of circuit daughter board 410 be placed on the first surface of supporting seat 1200.And a side that makes the close limit 425 of circuit daughter board 420 is placed on the first surface of supporting seat 1200, and the second surface of supporting seat 1200 is used for pressed connector 630.And a side on the close limit 415 of circuit subcard 410 is placed on the groove 1217 of supporting seat 1100.Groove 1217 is set makes circuit subcard 410 just be placed in groove 1217, and by the movement of projection 1132 with another side wall limiting circuit subcard 410 of supporting seat 1100.
Supporting seat 1100,1200 has limited circuit subcard 410,420 perpendicular to the movement on the direction of circuit motherboard 400, thereby has improved the reliability of memory device.In a preferred embodiment, also by screw, circuit daughter board 410 and 420 is fixed on supporting seat 1100 via projection 1134.In a similar fashion, circuit daughter board 410 and 420 is fixed on supporting seat 1200.
Figure 13 is the front elevation of memory device according to another embodiment of the present invention.Memory device shown in Figure 13 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with the high card form of PCIE half, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420,430 and 440 on circuit motherboard 400.In one embodiment, be furnished with respectively flash chip 411-413,421-423,431-433 and 441-443 on circuit daughter board 410,420,430 and 440, make circuit daughter board 410,420,430 and 440 provide memory capacity to memory device shown in Figure 13.Although figure 13 illustrates and place three flash chips on each of circuit daughter board 410-440, one of ordinary skill in the art will recognize also can place the flash chip of other quantity on circuit daughter board 410-440, for example, placing flash chip on circuit daughter board 410 with on the surperficial relative surface at flash chip 411-413 place.Also be furnished with control circuit 660 on circuit motherboard 400, in order to the access of control to the flash chip on circuit daughter board 410,420,430 and 440, and processing is from the interface command of computing machine.Also be furnished with the Memory such as DRAM(Dynamic Random Access on circuit motherboard 400, dynamic RAM) storer 662,664,666 and 668.Storer 662,664,666 and 668 can be coupled to control circuit 660.Control circuit 660 can be FPGA(Field-programmable gate array, field programmable gate array), ASIC(Application Specific Integrated Circuit, the application specific integrated circuit) or the form of its combination.Control circuit 660 also can comprise processor or controller.Can comprise one, two or more processor core in control circuit 600, each processor core is used for controlling or accessing the part or all of of a plurality of circuit subcards.Each processor core also can be used for accessing or the control circuit subcard on a plurality of flash chips partly or entirely.
Also be furnished with connector 628 and 629 on circuit motherboard 400 as shown in figure 13.Can also will respectively the circuit subcard be connected to circuit motherboard 400 by connector 628 and 629.Thereby, on the circuit motherboard 400 with the high card form of PCIE half as shown in figure 13, can connect nearly 6 circuit subcards.Circuit subcard 410 is connected to circuit motherboard 400 by flexible PCB 640.Circuit subcard 420 is connected to circuit motherboard 400 by flexible PCB 642.Circuit subcard 430 is connected to circuit motherboard 400 by flexible PCB 644.Circuit subcard 440 is connected to circuit motherboard 400 by flexible PCB 646.In a similar fashion, the circuit subcard also is connected to circuit motherboard 400 by flexible PCB via connector 628 or 629.
A plurality of circuit subcards placement parallel to each other on circuit motherboard 400.The minor face of the long edge circuit motherboard 400 of a plurality of circuit subcards is placed, and the minor face of a plurality of circuit subcards is placed along the long limit of circuit motherboard 400.The minor face of a plurality of circuit subcards is placed along same straight line substantially.Circuit subcard 410 is relative with 420 head and the tail, and shared flexible PCB 640,642 spaces that form, thus formation circuit subcard group.Circuit subcard 430 is relative with 440 head and the tail, and shared flexible PCB 644,646 spaces that form, thus formation circuit subcard group.Similarly, be connected to connector 628 relative with 629 circuit subcard also head and the tail, and formation circuit subcard group.Can have the space between a plurality of circuit subcards and circuit motherboard, can arrange other electronic components in this space.
In a preferred embodiment, also provide heat abstractor, be used for the flash chip on a plurality of circuit subcards and/or control circuit 660 and/or storer 662,664,666 and 668 heats that produce are delivered to the memory device outside.
Figure 14 is the front elevation of memory device according to still another embodiment of the invention.Memory device shown in Figure 14 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with PCIE overall height card form, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420,430,440,450,460,470 and 480 on circuit motherboard 400.In one embodiment, be furnished with respectively flash chip 411-413,421-423,431-433,441-443,451-453,461-463,471-473 and 481-483 on circuit daughter board 410-480, make circuit daughter board 410-480 provide memory capacity to memory device shown in Figure 14.Each of circuit daughter board 410-480 is connected to circuit motherboard 400 by flexible PCB, especially, is connected to the connector on circuit motherboard 400.Circuit daughter board 410-480 is placed as two row, four row.The short side direction of the long edge circuit motherboard 400 of each of circuit daughter board 410-480 is placed, and each the minor face of circuit daughter board 410-480, along the direction placement on the long limit of circuit motherboard 400.
Also be furnished with connector 628,629,688 and 689 on circuit motherboard 400 as shown in figure 14.Can also will respectively the circuit subcard be connected to circuit motherboard 400 by connector 628,629,688 and 689.Thereby, on the circuit motherboard 400 with the high card form of PCIE half as shown in 14, can connect nearly 12 circuit subcards.
Also be furnished with control circuit 660,670 on circuit motherboard 400, in order to the access of control to the flash chip on circuit daughter board 410-480, and processing is from the interface command of computing machine.Also be furnished with the storer 662,664,666,668,672,674,676 and 678 such as DRAM on circuit motherboard 400.Storer 662-668 and 672-678 can be coupled to respectively control circuit 660,670, also can share between control circuit 660,670.Control circuit 660,670 can be the form of FPGA, ASIC or its combination.Control circuit 660,670 also can comprise processor or controller.Each in control circuit 660,670 is used for controlling or accessing the part or all of of a plurality of circuit subcards, and for example, control circuit 660 is used for controlling or access circuit subcard 410-440, and control circuit 670 is used for access or control circuit subcard 450-480.Control circuit 660,670 also can be used for accessing or the control circuit subcard on a plurality of flash chips partly or entirely.
In a preferred embodiment, also provide heat abstractor, be used for the flash chip on a plurality of circuit subcards and/or control circuit 660,670 and/or the heat that produces of storer 662-668,672-678 be delivered to the memory device outside.
Represented the description of this invention for the purpose that illustrates and describe, and be not intended to disclosed form limit or restriction the present invention.To one of ordinary skill in the art, many adjustment and variation are apparent.
Claims (17)
1. a memory device, comprise first circuit board, second circuit board and tertiary circuit plate;
Be furnished with a plurality of memory chips on described first circuit board, be furnished with a plurality of memory chips on described second circuit board, be furnished with controller and host interface on described tertiary circuit plate;
Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in a plurality of memory chips on described first circuit board via described host interface by described controller access and to be arranged in a plurality of memory chips on described second circuit board;
Described a plurality of memory chips on described first circuit board are configured to first passage and second channel, described first passage comprises the memory chip of the first quantity, described second channel comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
2. memory device according to claim 1, wherein,
Also comprise third channel on described first circuit board, described third channel comprises the memory chip of the 3rd quantity, and described the 3rd quantity is different from described the first quantity.
3. memory device according to claim 1 and 2, wherein,
Described a plurality of memory chips on described second circuit board are configured to four-way and Five-channel, described four-way comprises the memory chip of the 4th quantity, described Five-channel comprises the memory chip of the 5th quantity, and described the 4th quantity is different from described the 5th quantity.
4. memory device according to claim 3, wherein,
The quantity of the described a plurality of memory chips on described second circuit board is different from the quantity of the described a plurality of memory chips on described first circuit board.
5. described memory device one of according to claim 1 and 2, wherein,
Wherein said first circuit board is coupled to described tertiary circuit plate by the first connector that is arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by the second connector that is arranged on described tertiary circuit plate; And
Described the first connector is identical with described the second connector, make described first circuit board to be coupled to described tertiary circuit plate by the second connector that is arranged on described tertiary circuit plate, described second circuit board can be coupled to described tertiary circuit plate by the first connector that is arranged on described tertiary circuit plate.
6. memory device according to claim 5, wherein,
One or more pins of described the first connector are used for the signal of the quantity of the memory chip on the described first circuit board of transmission indication;
One or more pins of described the second connector are used for the signal of the quantity of the memory chip on the described second circuit board of transmission indication.
7. memory device according to claim 5, wherein,
One or more pins of described the first connector are used for the signal of the quantity of the memory chip that each channel on the described first circuit board of transmission indication has;
One or more pins of described the second connector are used for the signal of the quantity of the memory chip that each channel on the described second circuit board of transmission indication has.
8. memory device according to claim 6, wherein,
One or more pins of described the first connector are used for the signal of the quantity of the memory chip that each channel on the described first circuit board of transmission indication has;
One or more pins of described the second connector are used for the signal of the quantity of the memory chip that each channel on the described second circuit board of transmission indication has.
9. memory device according to claim 1 and 2, wherein memory chip has identical memory capacity.
10. memory device according to claim 3, wherein memory chip has identical memory capacity.
11. memory device according to claim 4, wherein memory chip has identical memory capacity.
12. memory device according to claim 5, wherein memory chip has identical memory capacity.
13. memory device according to claim 6, wherein memory chip has identical memory capacity.
14. memory device according to claim 7, wherein memory chip has identical memory capacity.
15. memory device according to claim 8, wherein memory chip has identical memory capacity.
16. a memory device comprises controller, first memory passage and second memory passage;
Described first memory passage and described second memory passage are coupled to respectively described controller;
Described first memory passage comprises the memory chip of the first quantity, and described second memory passage comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
17. memory device according to claim 16, wherein,
The memory chip of described the first quantity arrives described controller by the first bus coupling of sharing, and the second bus coupling that the memory chip of described the second quantity passes through to share is to described controller.
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| CN 201220592371 CN202995542U (en) | 2012-11-11 | 2012-11-11 | Storage device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071694A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限 公司 | Storage device |
| WO2014071695A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限公司 | Electronic equipment |
| CN103809672A (en) * | 2012-11-11 | 2014-05-21 | 北京忆恒创源科技有限公司 | Memory device |
-
2012
- 2012-11-11 CN CN 201220592371 patent/CN202995542U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071694A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限 公司 | Storage device |
| WO2014071695A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限公司 | Electronic equipment |
| CN103809672A (en) * | 2012-11-11 | 2014-05-21 | 北京忆恒创源科技有限公司 | Memory device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 100192 room A302, building B-2, Dongsheng Science Park, Zhongguancun, 66 xixiaokou Road, Haidian District, Beijing Patentee after: Beijing yihengchuangyuan Technology Co.,Ltd. Address before: 312, building D, entrepreneurship Park, No. 2, Shangdi Information Road, Haidian District, Beijing 100085 Patentee before: BEIJING MEMBLAZE TECHNOLOGY Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130612 |