CN103809674A - Storage equipment - Google Patents
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- CN103809674A CN103809674A CN201210449387.XA CN201210449387A CN103809674A CN 103809674 A CN103809674 A CN 103809674A CN 201210449387 A CN201210449387 A CN 201210449387A CN 103809674 A CN103809674 A CN 103809674A
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Abstract
The invention discloses storage equipment, which comprises a first circuit board, a second circuit board and a third circuit board, wherein one or more memory chips are arranged on the first circuit board; one or more memory chips are arranged on the second circuit board; a controller and a host interface are arranged on the third circuit board; the first circuit board is coupled to the third circuit board, and the second circuit board is coupled to the third circuit board, so that the one or more memory chips on the first circuit board and the one or more memory chips on the second circuit board are accessed by virtue of the host interface through the controller; the capacity of the memory chips on the first circuit board is twice that of the memory chips on the second circuit board.
Description
Technical field
The present invention relates to electronic equipment, more specifically, the present invention relates to the printed circuit board system for solid storage device (Solid Storage Device, SSD).
Background technology
Similar with mechanical type hard disk, solid storage device (SSD) is also large capacity, the non-volatile memory device for computer system.Solid storage device is generally using flash memory (Flash) as storage medium.High performance solid storage device is used to high-performance computer.
In patented claim WO2011085131A2, provide the solid state hard disc of the capacity expanded as shown in Figure 1A, 1B.In Figure 1A, on the main printed circuit board 205 of solid state hard disc, be furnished with multiple connectors 204, and flash chip (not shown).Connector 204 can be connected to subcard removedly.Subcard can comprise flash chip, so that additional storage capacity to be provided to solid state hard disc.Subcard 608,610 is provided in Figure 1B, and each subcard comprises flash chip 609 and connector 607.Receive each subcard by connector 606.Each subcard 608 and 610 can be connected to separately or together main PCB (Printed Circuit Board, printed circuit board (PCB)) 601.Controller 602 is presented to main frame by the capacity of the flash chip of subcard by interface 603.If subcard 608 and 610 is all inserted into, the capacity of the flash chip 609 on the each subcard of controller 602 polymerizable is logically to present to main frame.
In utility model patent CN201402611Y, provide solid state hard disc as shown in Figure 2.The first Coupled Rigid-flexible PCB 4 as memory module comprises multiple flash chips 41, and comprises control chip 51 as the second Coupled Rigid-flexible PCB 5 of master control borad.The first Coupled Rigid-flexible PCB 4 comprises that rigidity PCB 42 and flexible PCB 43, the second Coupled Rigid-flexible PCB 5 comprise rigidity PCB 52 and flexible PCB 53.The first Coupled Rigid-flexible PCB 4 and the second Coupled Rigid-flexible PCB 5 realize the connection of the signal on the first Coupled Rigid-flexible PCB 4 and the second Coupled Rigid-flexible PCB 5 by the signal wire and the via hole that arrange on flexible PCB 43 and flexible PCB 53.Flexible PCB 43 and flexible PCB 53 are as described in the diagonal line hatches region in Fig. 2.Flexible PCB 43 and flexible PCB 53 and rigidity PCB 42 and rigidity PCB 52 can form in time processing.
In US2007165390A1, provide the PCB with flexible PCB, as shown in Figure 3.Fig. 3 comprises, the first base plate 100, the second base plate 200 and signal transmission flexible circuit (FPC, Flexible, Printed Circuit).The first base plate 100 and the second base plate 200 are disconnected from each other, and use FPC transmission of signal.Can installing electronic elements 201,202 on the second base plate 200, can installing electronic elements 101,102 on the first base plate 100, and micro-control unit (MCU, Micro Control Unit).The first base plate 100 comprises opening portion 300, and it is formed on the region with dimension D, and dimension D is less than the full-size (d) of the first base plate 100.Signal hop FPC can extend from opening portion 300.
But, for improving the memory capacity of memory device, need in limited space, arrange more storage chip.But more storage chip needs more lead-in wire to implement to control, and this space limited with memory device contradicts.And, the memory device with multiple different memory sizes and/or different storage chip quantity need to be provided, and significantly not increase cost.
Summary of the invention
According to a first aspect of the invention, a kind of electronic equipment is provided, comprise the first rigid circuit board, the second rigid circuit board and flexible PCB, described flexible PCB transmits electric signal between described the first rigid circuit board and described the second rigid circuit board, and described the first rigid circuit board has relative first side and Second Edge; Described flexible PCB has the 3rd relative limit and the 4th limit; The first side of described the first rigid circuit board is coupled on the 3rd limit of described flexible PCB, the first area that described the second rigid circuit board is coupled on the 4th limit of described flexible PCB; The width on described the 4th limit is greater than the width of described first side.
In electronic equipment according to a first aspect of the invention, on described flexible PCB, be furnished with connector, the first area of described connector for described flexible PCB is coupled to described the second rigid circuit board; Described first area is furnished with the connector corresponding with described the first connector.
In electronic equipment according to a first aspect of the invention, extend from the first side of described the first rigid circuit board on described the 3rd limit, and/or extend from the first area of described the second rigid circuit board on described the 4th limit.
In electronic equipment according to a first aspect of the invention, the first side of wherein said the first rigid circuit board is positioned at the top of described first area.
In electronic equipment according to a first aspect of the invention, also comprise the first supporting seat, described the first supporting seat is pressed on described connector on described the second rigid circuit board, and described the first supporting seat supports the first side of described the first rigid circuit board.
In electronic equipment according to a first aspect of the invention, also comprise the second supporting seat; Described the second supporting seat supports the Second Edge of described the first rigid circuit board.
In electronic equipment according to a first aspect of the invention, on described flexible PCB, be furnished with connector, the plane at described flexible PCB and described the first rigid circuit board place has first surface respect to one another and second, described connector is arranged on described first surface, the first area of described connector for described flexible PCB is coupled to described the second rigid circuit board, make described connector in the time of described the second rigid circuit board, the first surface of described the first rigid circuit board is described the second rigid circuit board dorsad.
In electronic equipment according to a first aspect of the invention, on described the first rigid circuit board, be furnished with storer, and be furnished with controller and host interface on described the second rigid circuit board.
In electronic equipment according to a first aspect of the invention, on wherein said flexible PCB, be furnished with the wiring of the configuration of described the first rigid circuit board of indication.
In electronic equipment according to a first aspect of the invention, wherein said the first rigid circuit board is rectangle, and described first side and described Second Edge are the minor faces of described rectangle.
According to a second aspect of the invention, a kind of method for installing electronic equipment is provided, described electronic equipment comprises the first rigid circuit board, the second rigid circuit board and flexible PCB, described flexible PCB extends from one side of described the first rigid circuit board, and described method comprises: the first connector being arranged on flexible PCB is connected with the second connector being arranged on the second rigid circuit board; Use supporting seat that the first connector is pressed on described the second rigid circuit board; Surface curvature by described flexible PCB along described supporting seat; And described the first rigid circuit board is fixed on described supporting seat.
Method according to a second aspect of the invention, the lower surface of wherein said supporting seat compresses described the first connector, and described the first rigid circuit board is placed in the groove of upper surface of described supporting seat.
According to a third aspect of the invention we, provide a kind of electronic equipment, comprised the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexible PCB and the second flexible PCB; Described the first flexible PCB transmits electric signal between described the first rigid circuit board and described the 3rd rigid circuit board, described the second flexible PCB transmits electric signal between described the second rigid circuit board and described the 3rd rigid circuit board, and described the first rigid circuit board has relative first side and Second Edge; Described the second rigid circuit board has the 3rd relative limit and the 4th limit; Described the first flexible PCB has the 5th relative limit hexagon, and the first side of described the first rigid circuit board is coupled on described the 5th limit; Described the second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described the second rigid circuit board is coupled on described the 7th limit; Described hexagon is coupled to the first area of described the 3rd rigid circuit board, and the second area of described rigid circuit board is coupled on described the 8th limit; The width of described hexagon is greater than the width of described first side, and the width on described the 8th limit is greater than the width on described the 3rd limit.
Electronic equipment according to a third aspect of the invention we, extend from the first side of described the first rigid circuit board on wherein said the 5th limit; Extend from the 3rd limit of described the second rigid circuit board on described the 7th limit.
Electronic equipment according to a third aspect of the invention we, wherein, the hexagon of described the first flexible PCB is furnished with the first connector, and the 8th limit of described the second flexible PCB is furnished with the second connector; The first area of described the first connector for described the first flexible PCB is coupled to described the 3rd rigid circuit board; Described the second connector is for being coupled to described the second flexible PCB the second area of described the 3rd rigid circuit board; Described first area is furnished with the connector corresponding with described the first connector, and described second area is furnished with the connector corresponding with described the second connector.
Electronic equipment according to a third aspect of the invention we, wherein, the hexagon of described the first flexible PCB extends from the first area of described the 3rd rigid circuit board, and extend from the second area of described tertiary circuit plate on the 8th limit of described the second flexible PCB.
Electronic equipment according to a third aspect of the invention we, wherein said first area is the part on the 9th limit of described the 3rd rigid circuit board, and/or described second area is the part of the odd plots of land that can be cultivated of described the 3rd rigid circuit board.
Electronic equipment according to a third aspect of the invention we, also comprise the first supporting seat and the second supporting seat, described the first supporting seat is pressed on described the first connector on described the 3rd rigid circuit board, and described the second supporting seat is pressed on described the second connector in described the 3rd rigid plate; Described the first supporting seat supports the first side of described the first rigid circuit board, and described the first supporting seat also supports the 4th limit of described the second rigid circuit board; Described the second supporting seat supports the Second Edge of described the first rigid circuit board, and described the second supporting seat also supports the 3rd limit of described the second rigid circuit board.
Electronic equipment according to a third aspect of the invention we, wherein, the plane at described the first flexible PCB and described the first rigid circuit board place has first surface respect to one another and second; The plane at described the second flexible PCB and described the second rigid circuit board place has the 3rd and fourth face respect to one another; Described the first connector is arranged on described first surface, and described the second connector is arranged on described the 3rd; The first area of described the first connector for described the first flexible PCB is coupled to described the 3rd rigid circuit board, make described the first connector in the time of described the 3rd rigid circuit board, the first surface of described the first rigid circuit board is described the 3rd rigid circuit board dorsad; Described the second connector is for being coupled to described the second flexible PCB the second area of described the 3rd rigid circuit board, make described the second connector in the time of described the 3rd rigid circuit board, the first surface of described the second rigid circuit board is described the 3rd rigid circuit board dorsad.
Electronic equipment according to a third aspect of the invention we, is furnished with storer on wherein said the first rigid circuit board, on described the second rigid circuit board, is furnished with storer, on described the 3rd rigid circuit board, is furnished with controller and host interface.
Electronic equipment according to a third aspect of the invention we, the memory capacity of the storer on wherein said the first rigid circuit board is two times of memory capacity of the storer on described the second rigid circuit board.
Electronic equipment according to a third aspect of the invention we, the first side of wherein said the first rigid circuit board is positioned at the top of described first area, and the 3rd limit of described the second rigid circuit board is positioned at the top of described second area;
The 4th limit of described the second rigid circuit board is positioned at the top of described first area, and the Second Edge of described the first rigid circuit board is positioned at the top of described second area.
Electronic equipment according to a third aspect of the invention we, on wherein said the first flexible PCB, be furnished with the wiring of the memory capacity of the storer on described the first rigid circuit board of indication, on described the second flexible PCB, be furnished with the wiring of the memory capacity of the storer on described the second rigid circuit board of indication.
According to a forth aspect of the invention, a kind of method for installing electronic equipment is provided, described electronic equipment comprises the first rigid circuit board, the second rigid circuit board, the 3rd rigid circuit board, the first flexible PCB and the second flexible PCB, described the first flexible PCB extends from one side of described the first rigid circuit board, described in described the second flexible PCB green onion, extend on second one side of just having waken up circuit board, described method comprises: the first connector being arranged on the first flexible PCB is connected with the second connector being arranged on the 3rd rigid circuit board, use the first supporting seat that the first connector is pressed on described the 3rd rigid circuit board, surface curvature by described the first flexible PCB along described the first supporting seat, described the first rigid circuit board is fixed on described the first supporting seat, the 3rd connector being arranged on the second flexible PCB is connected with the 4th connector being arranged on the 3rd rigid circuit board, use the second supporting seat that described the 3rd connector is pressed on described the 3rd rigid circuit board, surface curvature by described the second flexible PCB along described the second supporting seat, described the second rigid circuit board is fixed on described the second supporting seat, described the second rigid circuit board is fixed on described the first supporting seat, and described the first rigid circuit board is fixed on described the second supporting seat.
Method according to a forth aspect of the invention, the lower surface of wherein said the first supporting seat compresses described the first connector, and described the first rigid circuit board is placed in first groove of upper surface of described the first supporting seat; The lower surface of described the second supporting seat compresses described the 3rd connector, and described the second rigid circuit board is placed in first groove of upper surface of described the second supporting seat; Described the first rigid circuit board is positioned in second groove of upper surface of described the second supporting seat, and described the second rigid circuit board is positioned in first groove of upper surface of described the first supporting seat.
According to a fifth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; On described first circuit board, be furnished with one or more memory chips, on described second circuit board, be furnished with one or more memory chips, on described tertiary circuit plate, be furnished with controller and host interface; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in the one or more memory chips on described first circuit board and to be arranged in the one or more memory chips on described second circuit board by described controller access via described host interface; The capacity of the memory chip on described first circuit board is two times of capacity of the memory chip on described second circuit board.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector being arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on described tertiary circuit plate.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said the first connector are for transmitting the signal of the capacity of indicating the memory chip on described first circuit board, and/or one or more pins of described the second connector are for transmitting the signal of the capacity of indicating the memory chip on described second circuit board.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector and the second connector that are arranged on described tertiary circuit plate, described second circuit board is coupled to described tertiary circuit plate by the 3rd connector and the 4th connector that are arranged on described tertiary circuit plate, wherein said the first connector is identical with described the 3rd connector, and described the second connector is identical with described the 4th connector.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said the first connector and/or described the second connector are for transmitting the signal of the capacity of indicating the memory chip on described first circuit board, and one or more pins of described the 3rd connector and/or described the 4th connector are for transmitting the signal of the capacity of indicating the memory chip on described second circuit board.
Memory device according to a fifth aspect of the invention, also comprise the first flexible PCB and the second flexible PCB, described the first flexible PCB is for described first circuit board is coupled to described tertiary circuit plate, and described the second flexible PCB is for being coupled to described tertiary circuit plate by described second circuit board.
Memory device according to a fifth aspect of the invention, wherein, described first circuit board has relative first side and Second Edge; Described second circuit board has the 3rd relative limit and the 4th limit; Described the first flexible PCB has the 5th relative limit hexagon, and the first side of described first circuit board is coupled on described the 5th limit; Described the second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second circuit board is coupled on described the 7th limit; Described hexagon is coupled to the first connector of described tertiary circuit plate, and the second connector of described tertiary circuit plate is coupled on described the 8th limit; The width of described hexagon is greater than the width of described first side, and the width on described the 8th limit is greater than the width on described the 3rd limit; The first side of described first circuit board is positioned at the top of described the first connector, and the 3rd limit of described second circuit board is positioned at the top of described the second connector; The 4th limit of described second circuit board is positioned at the top of described the first connector, and the Second Edge of described first circuit board is positioned at the top of described the second connector.
Memory device according to a fifth aspect of the invention, wherein, extend from the first side of described first circuit board on described the 5th limit; Extend from the 3rd limit of described second circuit board on described the 7th limit.
Memory device according to a fifth aspect of the invention, also comprise the first supporting seat and the second supporting seat, described the first supporting seat is fastened on the hexagon of described the first flexible PCB on described the first connector, and described the second supporting seat is fastened on the 8th limit of described the second flexible PCB on described the second connector; Described the first supporting seat supports the first side of described first circuit board, and described the first supporting seat also supports the 4th limit of described second circuit board; Described the second supporting seat supports the Second Edge of described first circuit board, and described the second supporting seat also supports the 3rd limit of described second circuit board.
Memory device according to a fifth aspect of the invention, comprises multiple described first circuit boards and/or multiple described second circuit board.
Memory device according to a fifth aspect of the invention, on described the 4th circuit board, be furnished with one or more memory chips, described the 4th circuit board is coupled with described tertiary circuit plate, makes to be arranged in the one or more memory chips on described the 4th circuit board via described host interface by described controller access; The capacity of the memory chip on described the 4th circuit board is two times of capacity of the memory chip on described second circuit board, or the capacity of memory chip on described the 4th circuit board is identical with the capacity of the memory chip on described second circuit board.
According to a sixth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; On described first circuit board, be furnished with multiple memory chips, on described second circuit board, be furnished with multiple memory chips, on described tertiary circuit plate, be furnished with controller and host interface; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in the multiple memory chips on described first circuit board and to be arranged in the multiple memory chips on described second circuit board by described controller access via described host interface; Described multiple memory chips on described first circuit board are configured to first passage and second channel, described first passage comprises the memory chip of the first quantity, described second channel comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
Memory device according to a sixth aspect of the invention, wherein, also comprises third channel on described first circuit board, described third channel comprises the memory chip of the 3rd quantity, and described the 3rd quantity is different from described the first quantity.
Memory device according to a sixth aspect of the invention, wherein, described multiple memory chips on described second circuit board are configured to four-way and Five-channel, described four-way comprises the memory chip of the 4th quantity, described Five-channel comprises the memory chip of the 5th quantity, and described the 4th quantity is different from described the 5th quantity.
Memory device according to a sixth aspect of the invention, wherein, the quantity of the described multiple memory chips on described second circuit board is different from the quantity of the described multiple memory chips on described first circuit board.
Memory device according to a sixth aspect of the invention, wherein, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector being arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on described tertiary circuit plate; And described the first connector is identical with described the second connector, make described first circuit board to be coupled to described tertiary circuit plate by the second connector being arranged on described tertiary circuit plate, described second circuit board can be coupled to described tertiary circuit plate by being arranged in the electrical connection of first on described tertiary circuit plate.
Memory device according to a sixth aspect of the invention, wherein, one or more pins of described the first connector are for transmitting the signal of the quantity of indicating the memory chip on described first circuit board; One or more pins of described the second connector are for transmitting the signal of the quantity of indicating the memory chip on described second circuit board.
Memory device according to a sixth aspect of the invention, wherein, the signal of the quantity of the memory chip that one or more pins of described the first connector have for the each channel transmitting on the described first circuit board of indication; The signal of the quantity of the memory chip that one or more pins of described the second connector have for the each channel transmitting on the described second circuit board of indication.
Memory device according to a sixth aspect of the invention, wherein memory chip has identical memory capacity.
According to a seventh aspect of the invention, provide a kind of memory device, comprised controller, first memory passage and second memory passage; Described first memory passage and described second memory passage are coupled to respectively described controller; Described first memory passage comprises the memory chip of the first quantity, and described second memory passage comprises the memory chip of the second quantity, and described the first quantity is different from described the second quantity.
Memory device according to a seventh aspect of the invention, wherein, the memory chip of described the first quantity arrives described controller by the first bus coupling of sharing, and the second bus coupling that the memory chip of described the second quantity passes through to share is to described controller.
Accompanying drawing explanation
In the time reading together with accompanying drawing, by reference to the detailed description of the embodiment to illustrating property below, will understand best the present invention and preferably use pattern and its further object and advantage, wherein accompanying drawing comprises:
Figure 1A, 1B are the solid state hard discs according to the capacity expanded of prior art;
Fig. 2 is the solid state hard disc that comprises rigidity PCB and flexible PCB according to prior art;
Fig. 3 is the electronic equipment that comprises rigidity PCB and flexible PCB according to the another kind of prior art;
Fig. 4 is the front elevation of memory device according to an embodiment of the invention;
Fig. 5 A is the front elevation of the circuit daughter board of memory device according to an embodiment of the invention;
Fig. 5 B-5E is the side view of memory circuit daughter board according to an embodiment of the invention;
Fig. 5 F-5J is the flash chip of circuit daughter board of memory device according to an embodiment of the invention and the schematic diagram of the connected mode of control circuit;
Fig. 6 A shows the side view of the daughter board of memory device and the connected mode of motherboard according to an embodiment of the invention;
Fig. 6 B shows the side view of the daughter board of memory device and another connected mode of motherboard according to an embodiment of the invention;
Fig. 7 shows the front elevation of the daughter board of memory device and the connected mode of flexible PCB according to an embodiment of the invention;
Fig. 8 is another front elevation of memory device according to an embodiment of the invention;
Fig. 9 is the stereographic map of memory device according to an embodiment of the invention;
Figure 10 is the vertical view of memory device according to an embodiment of the invention;
Figure 11 A, 11B, 11C are for the stereographic map of the supporting seat of memory device according to an embodiment of the invention;
Figure 12 is another stereographic map of memory device according to an embodiment of the invention;
Figure 13 is the front elevation of memory device according to another embodiment of the present invention; And
Figure 14 is the front elevation of memory device according to still another embodiment of the invention.
Embodiment
Fig. 4 is the front elevation of memory device according to an embodiment of the invention.Memory device shown in Fig. 4 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with the high card form of PCIE half, and it can be connected to computing machine by PCIE slot.On circuit motherboard 400, be furnished with circuit daughter board 410,420 and 430.In one embodiment, on circuit daughter board 410,420 and 430, be furnished with respectively flash chip 411-413,421-423 and 431-433, make circuit daughter board 410,420,430 provide memory capacity to the memory device shown in Fig. 4.On circuit motherboard 400, be also furnished with flash controller (not shown), in order to control the access to the flash chip on circuit daughter board 410,420 and 430, and process the interface command from computing machine.Although figure 4 illustrates the memory device with PCIE interface that comprises flash chip, but one of ordinary skill in the art will recognize, it is only for example a kind of, the present invention is applicable to the various electronic with other functions, and can be coupled to computing machine by multiple interfaces mode, multiple interfaces includes but not limited to SATA(Serial Advanced Technology Attach ment, Serial Advanced Technology Attachment), USB(Universal Serial Bus, USB (universal serial bus)), PCIE(Peripheral Component Interconnect Express, quick peripheral assembly interconnecting), SCSI(Small Computer System Interface, small computer system interface), IDE(Integrated Drive Electro nics, integrated drive electronics) etc.And the present invention is also applicable to comprise the storage chip of flash memory other types in addition, for example, phase transition storage, Memister, ferroelectric memory etc.
As shown in Figure 4, circuit daughter board 410 and 420 is with opposite directions layout, and circuit daughter board 410 is arranged with identical direction with 430.Thereby make on the circuit motherboard 400 with specific dimensions, to arrange more flash chip.And circuit daughter board 410,420 and 430 has identical physical dimension and identical interface, make can replace each other between circuit daughter board 410,420 and 430, also can adopt other circuit daughter board replacement circuit daughter board 410,420 and 430.
Fig. 5 A is the front elevation of implementing the daughter board of the memory device of embodiments of the invention.In Fig. 5 A, more clearly show the circuit subcard 410 in Fig. 4.Circuit subcard 420 can have the physical aspect identical with circuit subcard 410 with 430, but can have the memory capacity identical or different with circuit subcard 410.In preferred example, the memory capacity of circuit subcard 420 is two times of circuit subcard 410.On circuit subcard 410, be furnished with flash chip 411,412 and 413.In an example, in the unshowned one side of circuit subcard 410, be also furnished with flash chip.Flash chip 411,412 and 413 can be the flash chip with same capability, can be also the flash chip with different capabilities.Flash chip on circuit subcard 410 can be organized as multiple passages, comprises the flash chip of two or other quantity on each passage.Each passage is parallel, can transmit data or receive data from circuit motherboard 400 to circuit motherboard 400 simultaneously.On circuit subcard 410, also can arrange multiple flash chips with other quantity.
In the situation that can holding flash chip 411,412 and/or 413, the size of circuit subcard 410 is arranged as far as possible littlely, to can arrange the circuit subcard of greater number on circuit motherboard 400, thereby improve the capacity of memory device.Owing to can arrange polylith circuit subcard 410,420 and/or 430 on circuit motherboard, and circuit subcard 410,420 and 430 can have the capacity differing from one another, thereby memory device can have the combination of multiple different memory capacity.Referring to table 1, when circuit subcard 410,420 and 430 can have 192GB(Giga Byte) when two kinds of memory capacity of 394GB, and when can arrange maximum 6 circuit subcards 410,420 or 430 on circuit motherboard 400 time, can obtain having the memory device of multiple different memory sizes.Although in table 1, illustrate and comprised 4 configurations to the memory device of 6 circuit subcards,, also can on circuit motherboard 400, arrange 1-3 circuit subcard, so that how different memory capacity to be provided.
Table 1 memory device, stores capacities chart
Thus, by the circuit subcard of two kinds of different memory sizes is provided, obtain having the memory device of multiple different capabilities, can meet the demand of multiple different occasions.
And because circuit subcard 410,420 has identical physical aspect with 430, thereby the installation of circuit subcard 410,420 and 430 on circuit motherboard 400 is interchangeable, thereby simplify the process of installing, and, in the time that one of multiple circuit subcards break down, also can easily change.And, by with larger capacity and/or existing circuit subcard on the circuit subcard replacement circuit motherboard 400 of high-performance (access speed, reliability etc.) more, can easily realize renewal or upgrading to memory device.
One of ordinary skill in the art will recognize, the circuit subcard with three kinds or more kinds of different memory sizes also can be provided, thereby the memory device with more kinds of memory capacity can be provided.For example, referring to table 2, (for example on circuit daughter board 410, can arrange the storage chip of varying number, 3-6 storage chip), thereby, in the situation that each storage chip has 64GB memory capacity, can provide there is respectively 192GB, 256GB, the circuit subcard of 320GB and 384GB memory capacity.And by the multiple circuit subcard with different memory sizes is provided, can obtain having the memory device of more kinds of different memory sizes.Obviously,, if the each storage chip on circuit daughter board 410 has different memory capacity, can provide the memory device with further multiple different memory capacity combination.
Table 2 circuit subcard memory capacity table
| Chip capacity | Number of chips | Subcard capacity |
| 64GB | 3 | 192GB |
| 64GB | 4 | 256GB |
| 64GB | 5 | 320GB |
| 64GB | 6 | 384GB |
Fig. 5 B-5E is the side view of implementing the circuit daughter board 410 of the memory device of embodiments of the invention.In Fig. 5 B, on circuit daughter board 410, be furnished with storage chip 411,412,413,414,415 and 416.In the time that each storage chip provides 64GB memory capacity, the circuit daughter board in Fig. 5 B can provide the memory capacity of 384GB.In Fig. 5 C, on circuit daughter board 410, be furnished with storage chip 411,412,413,414 and 415.In the time that each storage chip provides 64GB memory capacity, the circuit daughter board in Fig. 5 C can provide the memory capacity of 320GB.In Fig. 5 D, on circuit daughter board 410, be furnished with storage chip 411,412,413 and 414.In the time that each storage chip provides 64GB memory capacity, the circuit daughter board in Fig. 5 D can provide the memory capacity of 256GB.In Fig. 5 E, on circuit daughter board 410, be furnished with storage chip 411,412 and 413.In the time that each storage chip provides 64GB memory capacity, the circuit daughter board in Fig. 5 E can provide the memory capacity of 192GB.
Continue referring to Fig. 5 F-5J, Fig. 5 F-5J is the flash chip of circuit daughter board 410 of memory device according to an embodiment of the invention and the schematic diagram of the connected mode of control circuit 660.In order to promote the concurrency of operation of multiple flash chips, and save the IO resource of controlling the needed control circuit 660 of multiple flash chips, the multiple flash chips on circuit daughter board 410 are arranged in multiple passages.In each passage, be furnished with multiple flash chips, multiple flash chip shared datas and/or control bus in each passage, and in order to access each flash chip, chip enable (the Chip Enable of the multiple flash chips (and/or tube core) in each passage, CE) port, can be controlled individually by control circuit 660.
Referring to Fig. 5 F, on circuit daughter board 410, be furnished with 3 passages.Flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412,415 is included in second channel, and is coupled to control circuit 660 by shared bus 492.Control circuit 660 can be controlled the CE port of flash chip 412,415 independently.Flash chip 413,416 is included in third channel, and is coupled to control circuit 660 by shared bus 494.Control circuit 660 can be controlled the CE port of flash chip 413,416 independently.
Alternatively, on each passage, can there is the flash chip of other quantity.Referring to Fig. 5 G, flash chip 411,412 and 413 is included in first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,412 and 413 independently.Flash chip 414,415 and 416 is included in second channel, and is coupled to control circuit 660 by shared bus 494.Control circuit 660 can be controlled the CE port of flash chip 414,415 and 416 independently.
Still alternatively, on each passage, can there is the flash chip of varying number.Referring to Fig. 5 H, flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412,415 is included in second channel, and is coupled to control circuit 660 by shared bus 492.Control circuit 660 can be controlled the CE port of flash chip 412,415 independently.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Notice in Fig. 5 H, flash chip 416 is not provided, and it is corresponding to the example providing in Fig. 5 C.Notice equally, in Fig. 5 H, in first passage and second channel, be furnished with 2 flash chips, and in third channel, be only furnished with 1 flash chip, that is, on each passage, there is the flash chip of varying number.Although it is pointed out that the flash chip on each passage with varying number, the memory capacity on each passage can be the same or different.In the time that the flash chip 411-415 in Fig. 5 H has identical memory capacity, the memory capacity on third channel is the half of the memory capacity of first passage.Flash chip 413 also can be provided, and making its memory capacity is two times of flash chip 411,412,414 or 415, thereby makes the memory capacity on each passage identical.
Although still it is pointed out that in the embodiment of Fig. 5 H, do not comprise flash chip 416,, in the circuit daughter board 410 of Fig. 5 C answering in contrast, preferably, provide the interface arrangement identical with the circuit daughter board 410 of Fig. 5 B.; although at the circuit daughter board 410 of Fig. 5 C; the lead-in wire of the CE port that is coupled to flash chip 416 need to be provided in interface; but be favourable for multiple different circuit daughter board provides identical interface arrangement; this will allow the circuit daughter board that is coupled different on the connector of circuit motherboard 400; thereby improve the dirigibility of memory device; and simplified the installation process of memory device 400, be not limited to be arranged on specific motherboard connector because there is the circuit daughter board 410 of particular memory capacity or flash chip quantity.
In one embodiment, in the interface of circuit daughter board 410, provide 3 lead-in wires, every lead-in wire is by being furnished with 1 flash chip or 2 flash chips on a passage in electric signal indication first passage, second channel and the third channel of its transmission.One of ordinary skill in the art also can recognize the mode of the configuration of other indicating circuit daughter boards 410.For example, in the interface of circuit daughter board 410, provide 2 lead-in wires, it can transmit " 00 ", " 01 ", " 10 " and " 11 " four kinds of different states, a kind of customized configuration of each condition indication circuit daughter board 410.Service wire is indicated, can also be the quantity of the storage chip on circuit daughter board 410, or the memory capacity providing on circuit daughter board 410.
Referring to Fig. 5 I, flash chip 411,414 is included in first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412 is included in second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Notice in Fig. 5 H, flash chip 415 and 416 is not provided, and it is corresponding to the example providing in Fig. 5 D.
Referring to Fig. 5 J, flash chip 411 is included in first passage, and is coupled to control circuit 660 by bus 490.Control circuit 660 can be controlled the CE port of flash chip 411 independently.Flash chip 412 is included in second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412 independently.Flash chip 413 is included in third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413 independently.Notice in Fig. 5 J, flash chip 414,415 and 416 is not provided, and it is corresponding to the example providing in Fig. 5 E.
Fig. 6 A shows the side view of the circuit daughter board of memory device and the connected mode of circuit motherboard according to an embodiment of the invention.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.A side relative with flash chip 411,412 and 413 on circuit daughter board 410, also can be furnished with one or more flash chips.On circuit motherboard 400, be furnished with connector 510,520, be connected respectively with 540 for same connector 530, thereby circuit daughter board 410 is coupled to circuit motherboard 400. Connector 530 and 540 is arranged in respectively one end of flexible PCB 550 and 560, and the other end of flexible PCB 550,560 extends from the relative both sides of circuit daughter board 410. Flexible PCB 550 and 560 can form with circuit daughter board 410 in time processing.Owing to being connected respectively to connector 510,520 by connector 530,540, thereby the signal wire that each connector 530 and 540 transmits can be the half quantity of access circuit daughter board 410 desired signal lines, thereby, the size of connector 530 and 540 can be less, to reduce the space occupying on circuit motherboard 400.Owing to passing through connector 510,520,530 and 540 connecting circuit motherboards 400 and circuit daughter boards 410, it is removable making circuit daughter board 410.
As an example, can be not yet with connector 510,520,530 and 540 flexible PCB 550 and 560 that is coupled, but on circuit motherboard 400, open area is set, and the open area of flexible PCB 550,560 from circuit motherboard 400 is extended.Or, flexible PCB 550,560 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 550,560 and circuit motherboard 400 form in time processing.
Still as an example, flexible PCB 550,560 also can be connected to circuit daughter board 410 by connector.And in the relative both sides of circuit subcard 410, connector is also set, for connecting flexible PCB 550,560.
Fig. 6 B shows the side view of the circuit daughter board of memory device and the another kind of connected mode of circuit motherboard according to an embodiment of the invention.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.A side relative with flash chip 411,412 and 413 on circuit daughter board 410, also can be furnished with one or more flash chips.A side relative with flash chip 411,412 and 413 on circuit daughter board 410, also can be furnished with one or more flash chips.On circuit motherboard 400, be furnished with connector 620, be connected for same connector 630, thereby circuit daughter board 410 is coupled to circuit motherboard 400.Connector 630 is arranged in one end of flexible PCB 640, and the other end of flexible PCB 640 extends from the relative both sides of circuit daughter board 410.Flexible PCB 640 can form with circuit daughter board 410 in time processing.Owing to being connected to connector 620 by connector 630, thereby the signal wire that connector 630 transmits can be the entire quantity of access circuit daughter board 410 desired signal lines, thereby, the connector 630 and 620 of large-size need to be provided.In a preferred embodiment, for reliable connection the between flexible PCB 640 and circuit motherboard 400 is provided, and the size of connector 630 is arranged to such an extent that be greater than the length of flexible PCB 640 from circuit subcard 410 connections.In the case, flexible PCB 640 is trapezoidal, in Fig. 7, will be described further.Although use single connector 630 connecting circuit daughter boards 410 and circuit motherboard 400 to need larger sized connector, but can bring the convenience of installation, because only need carry out one-step installation operation, just circuit subcard 410 can be connected to circuit motherboard 400, and the one end that there is no connector on circuit subcard 410 provides space for fitting operation.
As an example, also can on circuit motherboard 400, open area be set, and the open area of flexible PCB 640 from circuit motherboard 400 extended.Or, flexible PCB 640 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 640 forms in time processing with circuit motherboard 400.
Still as an example, flexible PCB 640 also can be connected to circuit daughter board 410 by connector.And connector is also set on circuit subcard 410, for connecting flexible PCB 640.
In order to improve the space availability ratio of circuit motherboard 400, connector 620 is arranged near one side of circuit motherboard 400.And circuit subcard 410 is placed perpendicular to this limit.
Fig. 7 shows the circuit daughter board 410 of memory device and the front elevation of the connected mode of flexible PCB 640 according to an embodiment of the invention.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.Flexible PCB 640 has relative limit 681 and 682.Extend from one side of circuit daughter board 410 on one side 681 of flexible PCB 640.On the limit 682 relative with limit 681 of flexible PCB 640, be furnished with connector 630, be connected for same circuit motherboard 400.The signal wire transmitting due to connector 630 can be the required whole signal wires of access circuit daughter board 410, thereby the length on limit 682 is greater than the length on limit 681, thereby make can hold in connector 630 signal wire of sufficient amount, and guarantee the connection reliability of flexible PCB 640 and circuit motherboard 400.
Be also noted that in Fig. 7, formed a plane from the extended flexible PCB 640 in one side of circuit subcard 410 with circuit subcard 410, and connector 630 and flash chip 411,412 and/or 413 the same sides in this plane.At this, referring to Fig. 6 B, in the time that flexible PCB 640 is connected to circuit motherboard 400, flexible PCB bending, makes connector 630 towards circuit motherboard 400, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.In Fig. 8, will further describe this.
Circuit daughter board 410 can have multiple memory capacity.By the wiring that is connected to circuit motherboard 400 is set in flexible PCB 640 and connector 630, with the memory capacity of the controller indicating circuit daughter board 410 on circuit motherboard.When circuit daughter board 410 has two kinds of different memory capacity, one of for example 192GB and 384GB, a wiring can be set, by this wiring being coupled on circuit daughter board 410 to high level or low level, be 192GB or 384GB to the memory capacity of the controller indicating circuit daughter board 410 on circuit main board 400.Also can retain the memory capacity of carrying out indicating circuit daughter board 410 more than a wiring.In another example, circuit daughter board 410 is encoded the storage capacity information on it, and the information after coding is passed to the controller on circuit motherboard 400.In another example still, the addressable flash chip 411,412 and 413 of control circuit on circuit motherboard 400, to obtain the memory capacity of each flash chip, thereby obtains the memory capacity of circuit daughter board 410.One of ordinary skill in the art also will recognize, in the connected mode of circuit daughter board 410 as shown in Figure 6A and circuit motherboard 400, also can in connector 530 and/or 540, provide wiring, with the memory capacity to circuit motherboard 400 indicating circuit daughter boards 410, and make connector 530 and connector 540 there is identical physical dimension and wiring arrangement.
Fig. 8 is another front elevation of memory device according to an embodiment of the invention.In Fig. 8, illustrate that circuit daughter board 410 is connected on circuit motherboard 400 by flexible PCB 640 and the connector 630 being arranged on flexible PCB 640.It may be noted that in Fig. 8, connector 630 is towards circuit daughter board 400, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.Connector 630 is connected to the connector (not shown) on the one side that is arranged in circuit motherboard.In a preferred embodiment, connector 630 is arranged in the on one side long of circuit motherboard 400, and circuit daughter board 410 is perpendicular to the longer sides of circuit motherboard 400.Thereby can be on circuit motherboard 400 the multiple circuit daughter boards 410 of parallel arranged.Flexible PCB 640 bendings, extend on one side it from one side of circuit daughter board 410, and connector 630 is towards circuit motherboard 400, and are connected to circuit motherboard 400.At flexible PCB 640 during in case of bending not, connector 630 with flash chip 411,412 and/or 413 towards the same side.In Fig. 8, circuit daughter board 410 parallels with circuit motherboard 400, and circuit daughter board 410 is spatially separated from one another with circuit motherboard 400.Space between circuit daughter board 410 and circuit motherboard 400 can be used for the installation of circuit daughter board 410.By this space, can apply power to the back side of connector 630, thereby connector 630 is installed on the connector on circuit motherboard 400.
From Fig. 8, can also see, the length of connector 630 is greater than one side of circuit daughter board 410, and flexible PCB 640 extends from this limit., the length on one side of flexible PCB 640 connecting circuit daughter boards 410, is less than the length of arranging one side of connector 630 on flexible PCB.
Fig. 9 is the stereographic map of memory device according to an embodiment of the invention.In Fig. 9, illustrated that circuit daughter board 410 and 420 can be not shown by flexible PCB 640() and flexible PCB 642 be connected on circuit motherboard 400.On circuit daughter board 410, be furnished with flash chip 411,412 and 413, on circuit daughter board 420, be furnished with flash chip 421,422 and 423.Circuit daughter board 410,420 also can be furnished with one or more flash chips towards a side of circuit motherboard 400.Connector 630 is arranged on flexible PCB 640, and can be connected with the connector 620 being arranged on circuit motherboard.Connector 632 is arranged on flexible PCB 642, and can be connected with the connector 622 being arranged on circuit motherboard.Preferably, flexible PCB 642 is flexible PCBs identical with flexible PCB 640, and connector 632 is identical with connector 630, connector 622 is identical with connector 620, thereby makes circuit daughter board 410 and circuit daughter board 420 be connected to convertibly circuit motherboard 400.
When circuit daughter board 420 is connected to connector 622 by connector 632, and circuit daughter board 410 is while being connected to connector 620 by connector 630, the limit 415 of circuit daughter board 410 is positioned at the top of connector 632, and the limit 425 of circuit daughter board 420 is positioned at the top of connector 630.Flexible PCB 640(is not shown) extend from the limit 417 relative with limit 415 of circuit daughter board 410, and flexible PCB 642 extends from the limit 427 relative with limit 425 of circuit daughter board 420.In this way, although the length of connector 630,632 is greater than the limit 417 of circuit daughter board 410 and the limit 427 of circuit daughter board 420, but shared by circuit daughter board 410 and 420 due to connector 630 and 632 corresponding spaces, make on circuit motherboard 400, to arrange more circuit subcard.
And, in the time that circuit daughter board 410,420 is installed on circuit motherboard 400, because flexible PCB 640 and 642 can be in non-case of bending, thereby can apply power to the back side of connector 630 and 632 easily, to be connected respectively to connector 620 and 622.Next, flexible flexible PCB 640 and 642, makes circuit daughter board 410 parallel with circuit motherboard 400 with 420, thereby reduces the occupied space of memory device being made up of circuit motherboard and circuit daughter board 410,420.
Due to circuit daughter board 410 be parallel to each other with 420 and head and the tail relative, and the space that forms of Share interlinkage device 630 and 632, thereby circuit daughter board 410 and 420 can be regarded as to a circuit daughter board group.
Figure 10 is the vertical view of memory device according to an embodiment of the invention.In Figure 10, show circuit daughter board 410,420 and 430, circuit daughter board 430 can be to have the circuit daughter board of same physical profile with circuit daughter board 410,420, but has the memory capacity identical or different with circuit daughter board 410,420.Circuit daughter board 410 is connected to circuit motherboard 400 via flexible PCB 640, connector 630, connector 620.Circuit daughter board 430 is connected to circuit motherboard 400 via flexible PCB 644, connector 634, connector 624.Connector 634 is arranged on flexible PCB 644, and connector 624 is arranged on circuit motherboard 400.Preferably, connector 620 and 624 is placed on same straight line along the long limit of circuit motherboard 400.The limit 437 of the limit 417 of circuit daughter board 410, the limit of circuit daughter board 420 425 and circuit daughter board 430, is placed on basic same straight line.As shown in figure 10, because flexible PCB 640 is trapezoidal, the length of connector 630 is greater than the length on limit 417, makes the limit 425 of circuit subcard 420 can be positioned at the below of connector 630, and be separated with connector 630, and limit 425 with limit 417 on substantially same straight line.
As an example, from Figure 10, also can see, although the length of connector 630 is greater than the length on limit 417, be less than the length sum on limit 417 and limit 425, make the length of connector 630 be suitable for guaranteeing the reliability connecting and thering is less size, to reduce the manufacturing cost of connector 630.
Figure 11 A, 11B, 11C are for the stereographic map of the supporting seat 1100 of memory device according to an embodiment of the invention.Supporting seat 1100 comprises side wall 1110,1112, and side wall 1110 and 1112 is oppositely arranged, and parallel to each other, for supporting seat 1100 and the circuit motherboard 400 of being coupled.In an example, on side wall 1110 and 1112, have screw, further supporting seat is fixed on to motherboard 400 by bolt.Supporting seat also comprises plate 1120.Plate 1120 is vertical coupled between side wall 1110 and 1112.Plate 1120 can be integrally formed with side wall 1110,1120.Plate 1120 has relative first surface 1122 and second surface 1124.First surface 1122 is circuit motherboard 400 dorsad, and for supporting two circuit daughter boards, and second surface 1124 is towards circuit motherboard 400, and for compressing the connector being arranged on flexible PCB.In the direction perpendicular to first surface 1122, there is projection 1132, for cutting apart two circuit daughter boards, and the movement of limiting circuit daughter board.In the direction that is parallel to first surface 1122, form the second projection 1134.In Figure 12 by the coupled relation further describing between supporting seat 1100, circuit daughter board 410,420 and circuit motherboard 400.Although described the supporting seat 1100 with ad hoc structure in conjunction with Figure 11 A, 11B, 11C above, one of ordinary skill in the art can adopt supporting seat or the like with other structures by recognizing, provide circuit daughter board 410 and/or 420 and circuit motherboard 400 between reliable connection.
Figure 12 is another stereographic map of memory device according to an embodiment of the invention.Compared with the memory device shown in Fig. 9, in Figure 12, also go out supporting seat 1100 and 1200.In Figure 12, for purposes of clarity, supporting seat 1100 is illustrated in to the below of connector 632, supporting seat 1200 is illustrated in to the below of connector 630.And when mounted, and in memory device after installation, supporting seat 1100 is for connector 632 being pressed on to connector 622, and supporting seat 1200 is for being pressed on connector 620 by connector 630.
In installation process, connector 632 is connected with connector 622.Then, supporting seat 1100 is placed on to the back side of connector 632, and the second surface 1124 of the plate 1120 of supporting seat is compressed connector 632.In an example, can also pass through bolt, two side walls of supporting seat 1100 are fixed on circuit motherboard 400.With the similar ground of supporting seat 1100, supporting seat 1200 is pressed on connector 630 on connector 620.
The face 1229 of supporting seat 1100 with first surface 1122(referring to Figure 11 A, 11B and 11C) vertical with second surface 1124, and be positioned at projection 1134(referring to Figure 11 A, 11B and 11C) contrary direction.
The plate 1120 of supporting seat 1100 is for filling the space between connector 632, flexible PCB 642 and circuit daughter board 410,420, and support circuit daughter board 410 and 420.Plate 1120 is divided into groove 1217 and 1218 by projection 1132.After supporting seat 1100 is pressed on connector 632, flexible PCB 642, along face 1229 bendings, and is placed on a side on the close limit 427 of circuit subcard 420 on the groove 1218 of supporting seat 1100.Groove 1218 is set circuit subcard 420 is placed in groove 1218 just, and the movement with the side wall limiting circuit subcard 420 of supporting seat 1100 by projection 1132.
Similarly, after supporting seat 1200 is pressed on connector 630, not shown in bending flexible PCB 640(Figure 12), make a side on the close limit 417 of circuit daughter board 410 be placed on the first surface of supporting seat 1200.And a side that makes the close limit 425 of circuit daughter board 420 is placed on the first surface of supporting seat 1200, and the second surface of supporting seat 1200 is for pressed connector 630.And a side on the close limit 415 of circuit subcard 410 is placed on the groove 1217 of supporting seat 1100.Groove 1217 is set circuit subcard 410 is placed in groove 1217 just, and the movement with another side wall limiting circuit subcard 410 of supporting seat 1100 by projection 1132.
Supporting seat 1100,1200 has limited the movement of circuit subcard 410,420 in the direction perpendicular to circuit motherboard 400, thereby has improved the reliability of memory device.In a preferred embodiment, also by screw, circuit daughter board 410 and 420 is fixed on supporting seat 1100 via projection 1134.In a similar fashion, circuit daughter board 410 and 420 is fixed on supporting seat 1200.
Figure 13 is the front elevation of memory device according to another embodiment of the present invention.Memory device shown in Figure 13 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with the high card form of PCIE half, and it can be connected to computing machine by PCIE slot.On circuit motherboard 400, be furnished with circuit daughter board 410,420,430 and 440.In one embodiment, on circuit daughter board 410,420,430 and 440, be furnished with respectively flash chip 411-413,421-423,431-433 and 441-443, make circuit daughter board 410,420,430 and 440 provide memory capacity to the memory device shown in Figure 13.Although figure 13 illustrates on circuit daughter board 410-440 each and place three flash chips, one of ordinary skill in the art also can place the flash chip of other quantity by recognizing on circuit daughter board 410-440, for example, on circuit daughter board 410, on the surface relative with the surface at flash chip 411-413 place, place flash chip.On circuit motherboard 400, be also furnished with control circuit 660, in order to control the access to the flash chip on circuit daughter board 410,420,430 and 440, and process the interface command from computing machine.On circuit motherboard 400, be also furnished with the Memory such as DRAM(Dynamic Random Access, dynamic RAM) storer 662,664,666 and 668.Storer 662,664,666 and 668 can be coupled to control circuit 660.Control circuit 660 can be FPGA(Field-programmable gate array, field programmable gate array), ASIC(Application Specific Integrated Circuit, application specific integrated circuit) or the form of its combination.Control circuit 660 also can comprise processor or controller.In control circuit 600, can comprise one, two or more processor core, each processor core is for controlling or access the part or all of of multiple circuit subcards.Each processor core also can be used for multiple flash chips on access or control circuit subcard partly or entirely.
On circuit motherboard 400 as shown in figure 13, be also furnished with connector 628 and 629.Can also will respectively circuit subcard be connected to circuit motherboard 400 by connector 628 and 629.Thereby, on the circuit motherboard 400 with the high card form of PCIE half as shown in figure 13, can connect nearly 6 circuit subcards.Circuit subcard 410 is connected to circuit motherboard 400 by flexible PCB 640.Circuit subcard 420 is connected to circuit motherboard 400 by flexible PCB 642.Circuit subcard 430 is connected to circuit motherboard 400 by flexible PCB 644.Circuit subcard 440 is connected to circuit motherboard 400 by flexible PCB 646.In a similar fashion, circuit subcard is also connected to circuit motherboard 400 by flexible PCB via connector 628 or 629.
Multiple circuit subcards placement parallel to each other on circuit motherboard 400.The minor face of the long edge circuit motherboard 400 of multiple circuit subcards is placed, and the minor face of multiple circuit subcards is placed along the long limit of circuit motherboard 400.The minor face of multiple circuit subcards is placed along same straight line substantially.Circuit subcard 410 is relative with 420 head and the tail, and the space of shared flexible PCB 640,642 formation, thereby forms circuit subcard group.Circuit subcard 430 is relative with 440 head and the tail, and the space of shared flexible PCB 644,646 formation, thereby forms circuit subcard group.Similarly, be connected to connector 628 also from beginning to end relative with 629 circuit subcard, and form circuit subcard group.Between multiple circuit subcards and circuit motherboard, can there is space, in this space, can arrange other electronic components.
In a preferred embodiment, also provide heat abstractor, be delivered to memory device outside for the heat that the flash chip on multiple circuit subcards and/or control circuit 660 and/or storer 662,664,666 and 668 are produced.
Figure 14 is the front elevation of memory device according to still another embodiment of the invention.Memory device shown in Figure 14 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with PCIE overall height card form, and it can be connected to computing machine by PCIE slot.On circuit motherboard 400, be furnished with circuit daughter board 410,420,430,440,450,460,470 and 480.In one embodiment, on circuit daughter board 410-480, be furnished with respectively flash chip 411-413,421-423,431-433,441-443,451-453,461-463,471-473 and 481-483, make circuit daughter board 410-480 provide memory capacity to the memory device shown in Figure 14.The each of circuit daughter board 410-480 is connected to circuit motherboard 400 by flexible PCB, especially, is connected to the connector on circuit motherboard 400.Circuit daughter board 410-480 is placed as to two row, four row.The short side direction of each long edge circuit motherboard 400 of circuit daughter board 410-480 is placed, and each minor face of circuit daughter board 410-480, along the direction placement on the long limit of circuit motherboard 400.
The long limit of circuit daughter board 410 and 420 is parallel to each other and adjacent, and circuit daughter board 410 is relative with 420 head and the tail, forming circuit daughter board group.The long limit of circuit daughter board 430 and 440 is parallel to each other and adjacent, and circuit daughter board 430 is relative with 440 head and the tail, forming circuit daughter board group.The long limit of circuit daughter board 450 and 460 is parallel to each other and adjacent, and circuit daughter board 450 is relative with 460 head and the tail, forming circuit daughter board group.The long limit of circuit daughter board 470 and 480 is parallel to each other and adjacent, and circuit daughter board 470 is relative with 480 head and the tail, forming circuit daughter board group.Having in PCIE overall height card form circuit motherboard 400, at the long side direction of circuit motherboard 400, can arrange nearly 6 circuit daughter boards, and at the short side direction of circuit motherboard 400, can arrange nearly 2 circuit daughter boards.
On circuit motherboard 400 as shown in figure 14, be also furnished with connector 628,629,688 and 689.Can also will respectively circuit subcard be connected to circuit motherboard 400 by connector 628,629,688 and 689.Thereby, on the circuit motherboard 400 with the high card form of PCIE half as shown in 14, can connect nearly 12 circuit subcards.
On circuit motherboard 400, be also furnished with control circuit 660,670, in order to control the access to the flash chip on circuit daughter board 410-480, and process the interface command from computing machine.On circuit motherboard 400, be also furnished with the storer 662,664,666,668,672,674,676 and 678 such as DRAM.Storer 662-668 and 672-678 can be coupled to respectively control circuit 660,670, also can between control circuit 660,670, share.Control circuit 660,670 can be the form of FPGA, ASIC or its combination.Control circuit 660,670 also can comprise processor or controller.In control circuit 660,670 each for control or access multiple circuit subcards partly or entirely, for example, control circuit 660 is for controlling or access circuit subcard 410-440, and control circuit 670 is for access or control circuit subcard 450-480.Control circuit 660,670 also can be used for multiple flash chips on access or control circuit subcard partly or entirely.
In a preferred embodiment, also provide heat abstractor, be delivered to memory device outside for the heat that the flash chip on multiple circuit subcards and/or control circuit 660,670 and/or storer 662-668,672-678 are produced.
Represent the description of this invention for the object illustrating and describe, and be not intended to disclosed form limit or restriction the present invention.To one of ordinary skill in the art, many adjustment and variation are apparent.
Claims (10)
1. a memory device, comprises first circuit board, second circuit board and tertiary circuit plate;
On described first circuit board, be furnished with one or more memory chips, on described second circuit board, be furnished with one or more memory chips, on described tertiary circuit plate, be furnished with controller and host interface;
Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in the one or more memory chips on described first circuit board and to be arranged in the one or more memory chips on described second circuit board by described controller access via described host interface;
The capacity of the memory chip on described first circuit board is two times of capacity of the memory chip on described second circuit board.
2. memory device according to claim 1, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector being arranged on described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on described tertiary circuit plate.
3. memory device according to claim 2, one or more pins of wherein said the first connector are for transmitting the signal of the capacity of indicating the memory chip on described first circuit board, and/or one or more pins of described the second connector are for transmitting the signal of the capacity of indicating the memory chip on described second circuit board.
4. memory device according to claim 1, wherein said first circuit board is coupled to described tertiary circuit plate by the first connector and the second connector that are arranged on described tertiary circuit plate, described second circuit board is coupled to described tertiary circuit plate by the 3rd connector and the 4th connector that are arranged on described tertiary circuit plate, wherein said the first connector is identical with described the 3rd connector, and described the second connector is identical with described the 4th connector.
5. memory device according to claim 4, one or more pins of wherein said the first connector and/or described the second connector are for transmitting the signal of the capacity of indicating the memory chip on described first circuit board, and one or more pins of described the 3rd connector and/or described the 4th connector are for transmitting the signal of the capacity of indicating the memory chip on described second circuit board.
6. according to claim 2, one of 3 described memory devices, also comprise the first flexible PCB and the second flexible PCB, described the first flexible PCB is for described first circuit board is coupled to described tertiary circuit plate, and described the second flexible PCB is for being coupled to described tertiary circuit plate by described second circuit board.
7. memory device according to claim 6, wherein,
Described first circuit board has relative first side and Second Edge;
Described second circuit board has the 3rd relative limit and the 4th limit;
Described the first flexible PCB has the 5th relative limit hexagon, and the first side of described first circuit board is coupled on described the 5th limit;
Described the second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second circuit board is coupled on described the 7th limit;
Described hexagon is coupled to the first connector of described tertiary circuit plate, and the second connector of described tertiary circuit plate is coupled on described the 8th limit;
The width of described hexagon is greater than the width of described first side, and the width on described the 8th limit is greater than the width on described the 3rd limit;
The first side of described first circuit board is positioned at the top of described the first connector, and the 3rd limit of described second circuit board is positioned at the top of described the second connector;
The 4th limit of described second circuit board is positioned at the top of described the first connector, and the Second Edge of described first circuit board is positioned at the top of described the second connector.
8. memory device according to claim 7, wherein,
Extend from the first side of described first circuit board on described the 5th limit;
Extend from the 3rd limit of described second circuit board on described the 7th limit.
9. memory device according to claim 8, also comprises the first supporting seat and the second supporting seat,
Described the first supporting seat is fastened on the hexagon of described the first flexible PCB on described the first connector, and described the second supporting seat is fastened on the 8th limit of described the second flexible PCB on described the second connector;
Described the first supporting seat supports the first side of described first circuit board, and described the first supporting seat also supports the 4th limit of described second circuit board;
Described the second supporting seat supports the Second Edge of described first circuit board, and described the second supporting seat also supports the 3rd limit of described second circuit board.
10. electronic equipment according to claim 1, comprises multiple described first circuit boards and/or multiple described second circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210449387.XA CN103809674B (en) | 2012-11-11 | 2012-11-11 | Storage device |
| PCT/CN2013/001367 WO2014071694A1 (en) | 2012-11-11 | 2013-11-11 | Storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210449387.XA CN103809674B (en) | 2012-11-11 | 2012-11-11 | Storage device |
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| Publication Number | Publication Date |
|---|---|
| CN103809674A true CN103809674A (en) | 2014-05-21 |
| CN103809674B CN103809674B (en) | 2017-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210449387.XA Active CN103809674B (en) | 2012-11-11 | 2012-11-11 | Storage device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105096993A (en) * | 2015-09-21 | 2015-11-25 | 联想(北京)有限公司 | Solid state drives, electronic equipment and information processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1508648A (en) * | 2002-12-17 | 2004-06-30 | 记忆科技(深圳)有限公司 | Laminated memory |
| DE102004039806B4 (en) * | 2003-08-13 | 2009-05-07 | Samsung Electronics Co., Ltd., Suwon | memory module |
| DE102005032061B4 (en) * | 2005-07-08 | 2009-07-30 | Qimonda Ag | Memory module, and memory module system |
| CN201402611Y (en) * | 2009-05-12 | 2010-02-10 | 成都市华为赛门铁克科技有限公司 | Solid-state disk |
| CN102280126B (en) * | 2010-06-13 | 2015-11-25 | 宇瞻科技股份有限公司 | The memory storage of expanding memory unit |
| CN202995540U (en) * | 2012-11-11 | 2013-06-12 | 北京忆恒创源科技有限公司 | Storage device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105096993A (en) * | 2015-09-21 | 2015-11-25 | 联想(北京)有限公司 | Solid state drives, electronic equipment and information processing method |
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| CN103809674B (en) | 2017-06-23 |
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Address after: 100192 room A302, building B-2, Dongsheng Science Park, Zhongguancun, 66 xixiaokou Road, Haidian District, Beijing Patentee after: Beijing yihengchuangyuan Technology Co.,Ltd. Address before: 312, building D, entrepreneurship Park, No. 2, Shangdi Information Road, Haidian District, Beijing 100085 Patentee before: BEIJING MEMBLAZE TECHNOLOGY Co.,Ltd. |