US20230072742A1 - Heat dissipation mechanism and method thereof - Google Patents
Heat dissipation mechanism and method thereof Download PDFInfo
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- US20230072742A1 US20230072742A1 US17/528,118 US202117528118A US2023072742A1 US 20230072742 A1 US20230072742 A1 US 20230072742A1 US 202117528118 A US202117528118 A US 202117528118A US 2023072742 A1 US2023072742 A1 US 2023072742A1
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- main body
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 194
- 230000007246 mechanism Effects 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 45
- 238000004512 die casting Methods 0.000 claims abstract description 44
- 229910000838 Al alloy Inorganic materials 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- 229910045601 alloy Inorganic materials 0.000 abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 14
- 239000000126 substance Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 238000013459 approach Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2218—Cooling or heating equipment for dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/14—Machines with evacuated die cavity
- B22D17/145—Venting means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/2092—Safety devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2209—Selection of die materials
Definitions
- the present invention is in related to a heat dissipation mechanism, more particularly to a heat dissipation mechanism for die-casting and over-molding.
- die-casting aluminum alloy is cheaper relatively.
- the material of aluminum alloy such as ADC12 has a better fluidity, so as to make thin members easily, but with worse conductivity.
- the shortcomings of a die casting process itself and impurities may produce some obstructions to the conductivity of the aluminum alloy.
- molding high thermal conductivity materials, as copper, extruded aluminum alloy, etc. increases cost and time. Therefore, adhering those high thermal conductivity materials on the locations where the aluminum alloy needs cooling will be an outstanding solution, and it is with the advantages of mass production, low cost, and high thermal conductivity.
- the present invention is to provide a heat dissipation mechanism and a method thereof. Disposing metals with high conductivities into a die casting mold makes a combination of die-casting molten aluminum alloy and the metals with high conductivities in order to figure out the problem for difficult to joint dissimilar metals and approach a better efficiency of heat dissipation simultaneously.
- a heat dissipation mechanism for connecting with at least one heat source comprises:
- a main body which is made by a material of alloy or metal through a die casting process, and has a first side and a second side that are corresponding to each other; and at least one heat dissipation block, disposed on the first side of the main body, made by a first high thermal conductivity material, and having a connecting surface that protrudes outside the main body, wherein the connecting surface directly or indirectly connects with the heat source; wherein the heat dissipation block connects with the main body by means of a first connecting structure, the first connecting structure having a first pair of interlock structures that are disposed in the main body and the heat dissipation block respectively.
- the heat dissipation mechanism further comprises a heat dissipation member that is disposed on the second side, and made by a second high thermal conductivity material, the heat dissipation member connecting with the main body through a second connecting structure that has a second pair of interlock structures, wherein the second pair of interlock structures are disposed in the main body and the heat dissipation member.
- the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes
- the second pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- Another heat dissipation mechanism for connecting with at least one heat source comprises:
- a main body which is made by a material of alloy or metal through a die casting process, and has a first side and a second side that are corresponding to each other; and a heat dissipation member, disposed on the second side of the main body, made by a second high thermal conductivity material, and having at least one protruding block that penetrates through the main body, wherein the protruding block is configured to connect with the heat source.
- the heat dissipation mechanism further comprises at least one heat dissipation block disposed on the first side of the main body, made by a first high thermal conductivity material, and connecting with the protruding block by means of a first connecting structure, wherein the heat dissipation block is between the protruding block and the heat source, and the protruding block directly or indirectly connects with the heat source via the heat dissipation block.
- the first connecting structure is composed of a first pair of interlock structures that are disposed in the protruding block and the heat dissipation block respectively.
- the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- the first high thermal conductivity material is copper.
- the second high thermal conductivity material is aluminum alloy, and the heat dissipation member is made by an extrusion process.
- the main body is made of aluminum alloy or magnesium alloy.
- the connecting surface of the heat dissipation block is through a surface treatment process in order to reduce a surface thermal resistance of the heat dissipation block.
- a method for manufacturing a heat dissipation mechanism comprises steps of:
- thermoelectric block (a) providing at least one heat dissipation block that has a first pair of interlock structures; (b) loading the heat dissipation block into a die casting mold and positioning therein; (c) extruding a molten or semi-melted alloy or metal into the die casting mold; (d) cooling down the die casting mold; and (e) opening the die casting mold for taking out a formed heat dissipation mechanism; wherein the heat dissipation block is made of a first high thermal conductivity material.
- the method for manufacturing the heat dissipation mechanism further comprises a step (a 2 ), after step (a), of: providing at least one heat dissipation member that has a second pair of interlock structures, and is made of a second high thermal conductivity material, wherein step (b) further has one more step of loading the heat dissipation member into the die casting mold and positioning therein.
- Another method for manufacturing a heat dissipation mechanism comprises steps of:
- the method for manufacturing the heat dissipation mechanism further comprises a step of: providing at least one heat dissipation block that is disposed on a surface of the protruding block, and is made of a first high thermal conductivity material, wherein step (b) further has one more step of loading the heat dissipation block into the die casting mold and positioning therein.
- the first high thermal conductivity material is copper.
- the second high thermal conductivity material is aluminum.
- step (c) is of: extruding a molten or semi-melted aluminum alloy or magnesium alloy into the die casting mold.
- FIG. 1 A and FIG. 1 B illustrate schematic views of a heat dissipation mechanism of the present invention
- FIG. 2 A illustrates a schematic lateral view of the heat dissipation mechanism of the present invention
- FIG. 2 B illustrates a schematic exploded lateral view of the heat dissipation mechanism of the present invention
- FIG. 3 A illustrates a schematic lateral sectional view of the heat dissipation mechanism of the present invention
- FIG. 3 B illustrates a schematic exploded view of the heat dissipation block of the present invention
- FIG. 4 illustrates a schematic view of another embodiment of the heat dissipation member and the heat dissipation block of the present invention
- FIG. 5 A illustrates a flow chart of the method for manufacturing the heat dissipation mechanism of the present invention
- FIG. 5 B illustrates a schematic entire view of the heat dissipation mechanism of the present invention
- FIG. 6 which illustrates a flow chart of another embodiment of the method for manufacturing the heat dissipation mechanism of the present invention
- FIG. 7 A illustrates a schematic view of a fisheye hole pair lock structure of the present invention.
- FIG. 7 B illustrates a schematic view of a zipper pair lock structure of the present invention.
- the heat dissipation mechanism 100 is adopted to connect with at least one heat source as electronic component or battery and has a main body 110 and at least one heat dissipation block 130 .
- the main body 110 further has a heat dissipation member 120 and is made by a material of alloy or metal through a die casting process, wherein the alloy can be aluminum alloy as ADC 12 or magnesium alloy as AZ91D.
- the main body 110 further has a first side 110 a and a second side 110 b that are corresponding to each other. In other words, the first side 110 a and the second side 110 b are two surfaces of the main body 110 , as shown in FIG. 1 A and FIG. 1 B respectively.
- the heat dissipation block 130 is disposed on the first side 110 a of the main body 110 and is made by a first high thermal conductivity material, such as copper. Further, the heat dissipation block 130 has a connecting surface 132 that protrudes outside the main body 110 , wherein the connecting surface 132 directly or indirectly connects with the heat source. More specifically, a surface of the heat dissipation block 130 is through a surface treatment process in order to reduce a surface thermal resistance of the heat dissipation block 130 .
- the heat dissipation block 130 is shaped as a flake and made of copper, and it is located where the main body 110 connecting with the heat source is. Talking to the embodiment, three heat dissipation blocks 130 connect with three heat sources respectively, such as CPU, GPU and battery. It is to be sure that the number of the heat source is variable for the persons skilled in the art.
- the heat dissipation member 120 is disposed on the second side 110 b and made by a second high thermal conductivity material.
- the heat dissipation member 120 is made of aluminum alloy, ex. 6063 aluminum alloy, and it is shaped as a fin-shaped heat sink through an extrusion process. Through the arrangement of disposing the heat dissipation member 120 on the second side 110 b , heat will be effectively guided to the air.
- Other embodiment may exclude the heat dissipation member 120 , instead to the heat dissipation mechanism 100 composed of the main body 110 and the heat dissipation blocks 130 .
- the heat dissipation block 130 is equipped with a first connecting structure 131 , and so does the heat dissipation member 120 .
- the heat dissipation member 120 has at least one second connecting structure 121 .
- the first connecting structure 131 has a first pair of interlock structures that are cooperated to each other and disposed in the main body 110 and the heat dissipation block 130 respectively.
- the second connecting structure 121 has a second pair of interlock structures that are cooperated to each other as well, wherein the second pair of interlock structures are disposed in the main body 110 and the heat dissipation member 120 .
- the first pair of interlock structures and the second pair of interlock structures are grooves, dovetail grooves, zippers, fisheye holes, etc.
- the first pair of interlock structures of the first connecting structure 131 are formed, and the first pair of interlock structures will be discussed later.
- the second pair of interlock structures of the second connecting structure 121 are formed, and the second pair of interlock structures will be discussed later.
- FIG. 2 A and FIG. 2 B which illustrate a schematic lateral view of the heat dissipation mechanism of the present invention and a schematic exploded lateral view of the heat dissipation mechanism of the present invention.
- the heat dissipation member 120 additionally has a dovetail groove 121
- the main body 110 has an interlocking and embedded structure 112 corresponding to the dovetail groove 121 .
- the second pair of interlock structures are composed of the dovetail groove 121 and the interlocking and embedded structure 112 , in order to connect the heat dissipation member 120 with the main body 110 .
- FIG. 3 A and FIG. 3 B which illustrate a schematic lateral sectional view of the heat dissipation mechanism of the present invention and a schematic exploded view of the heat dissipation block of the present invention.
- the first pair of interlock structures on the main body 110 and the heat dissipation block 130 are tightly cooperated with each other, such as the inclined surfaces 131 a of the heat dissipation block 130 and the dovetail groove 111 of the main body 110 .
- the second pair of interlock structures on the main body 110 and the heat dissipation member 120 is tightly cooperated with each other, such as the dovetail groove 121 a of the heat dissipation member 120 and the interlocking and embedded structure 112 of the main body 110 .
- the heat dissipation member 120 has an interlocking and embedded structure 121 b
- the main body 110 has a dovetail groove 112 a corresponding to the interlocking and embedded structure 121 b
- the number of the second pair of interlock structure between the heat dissipation member 120 and the main body 110 can be plural.
- the dovetail groove (concave structure) disposed on the main body 110 may not be limited thereto, and so does to the interlocking and embedded structure on the heat dissipation member 120 .
- the interlocking and embedded structure may be possible on the main body 110
- the dovetail groove (concave structure) is on the heat dissipation member 120 as another embodiment.
- the more second pair of interlock structures the more connecting efficiency of the heat dissipation member 120 and the main body 110 .
- such application of the dovetail groove and the interlocking and embedded structure forming the first connecting structure and the second connecting structure is not limited thereto, the concave structure with its relative structure or other structures cooperated with each other may be adopted.
- FIG. 7 A and FIG. 7 B which illustrate a schematic view of a fisheye hole pair lock structure of the present invention and a schematic view of a zipper pair lock structure of the present invention.
- a first substance 310 forms a fisheye hole 311
- a second substance 320 forms an interlocking and embedded structure 321 corresponding to the fisheye hole 311 , in order to connect the first substance 310 with the second substance 320 .
- FIG. 7 A and FIG. 7 B which illustrate a schematic view of a fisheye hole pair lock structure of the present invention and a schematic view of a zipper pair lock structure of the present invention.
- a first substance 310 forms a fisheye hole 311
- a second substance 320 forms an interlocking and embedded structure 321 corresponding to the fisheye hole 311 , in order to connect the first substance 310 with the second substance 320 .
- a first substance 410 forms a serial interlocking and embedded structure 411
- a second substance 420 forms an interlocking and embedded structure 421 corresponding to the serial interlocking and embedded structure 411 , in order to combine the first substance 410 with the second substance 420 .
- FIG. 4 which illustrates a schematic view of another embodiment of the heat dissipation member and the heat dissipation block of the present invention.
- a heat dissipation mechanism 200 has a main body 210 , a heat dissipation member 220 and at least one heat dissipation block 230 . Additionally, the heat dissipation member 220 has at least one protruding block 222 that penetrates through the main body 210 , wherein the protruding block 222 directly and indirectly connects with the heat source (not shown in FIG. 4 ).
- the heat dissipation block 230 is between the protruding block 222 and the heat source, but connects with the protruding block 222 .
- the heat dissipation block 230 even connects with the protruding block 222 via a first connecting structure 231 .
- the heat dissipation member 220 connects with the heat dissipation block 230 through the protruding block 222 so as to form an entire structure. It is beneficial to position the heat dissipation block 230 when going through a die casting process.
- the protruding block 222 is a heat transfer media for transferring the heat from the heat source to the heat dissipation member 220 via the heat dissipation block 230 .
- the fins of the heat dissipation member 220 may conduct and radiate the heat efficiently.
- the heat dissipation block 230 may be excluded, but with the protruding block 222 for directly connecting with the heat source.
- the heat dissipation block 230 is adhered to the protruding block 222 by welding, and the welding material is the role as the first connecting structure.
- FIG. 5 A and FIG. 5 B illustrate a flow chart of the method for manufacturing the heat dissipation mechanism 100 of the present invention and a schematic entire view of the heat dissipation mechanism of the present invention.
- the method has the steps of:
- the female mold 10 and the male mold 11 both have figures that are corresponding to the main body's 110 , the heat dissipation member's 120 and the heat dissipation block's 130 for positioning the heat dissipation block 130 and the heat dissipation member 120 .
- a plurality of grooves that correspond to the heat dissipation block 130 are disposed on the female mold 10 , in order to position the heat dissipation block 130 .
- a plurality of groove structures that correspond to the fins of the heat dissipation member 120 are disposed on the male mold 11 for positioning the heat dissipation member 120 .
- step (A 20 ) can be neglected, and only the heat dissipation block 130 is loaded into the die casting mold and positioned therein for step (A 30 ).
- step (A 30 ) clamping the female mold 10 and the male mold 11 , and then step (A 40 ): extruding a molten or semi-melted alloy or metal into the die casting mold, wherein the alloy is aluminum alloy; Practically, the female mold 10 or the male mold 11 is provided with an injection port, and the molten or semi-melted aluminum alloy solution can be squeezed and injected from the injection port.
- the heat dissipation member 120 and the heat dissipation block 130 are disposed into the die casting mold in advance, therefore the first connecting structure and the second connecting structure are formed as long as the molten or semi-melted alloy or metal is filled out the die casting mold.
- the interlocking and embedded structure 112 corresponds to the dovetail groove 121 , as shown in FIG.
- the main body 100 , the heat dissipation member 120 and the heat dissipation block 130 with different heat conductivities are tightly combined through the die casting process, in order to approach better heat dissipation.
- FIG. 6 which illustrates a flow chart of another embodiment of the method for manufacturing the heat dissipation mechanism 200 of the present invention.
- the method has the steps of:
- the heat dissipation mechanism 200 has the heat dissipation member 220 and the heat dissipation block 230 , which are connected with each other through the protruding block 222 .
- the protruding block 222 is a heat transfer media for transferring heat to the heat dissipation member 220 via the heat dissipation block 230 , so as to promote the efficiency of heat dissipation.
- the present invention puts the heat dissipation member and the heat dissipation block with high conductivities into the die casting mold. Therefore, the heat dissipation member and the heat dissipation block are combined with the molten aluminum alloy or magnesium alloy, and the heat dissipation mechanism formed in this way can increase the connection strength. On the other hand, a problem for difficult to joint dissimilar metals is solved, and combining metals with different high conductivities approaches a better efficiency of heat dissipation.
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Abstract
A heat dissipation mechanism for connecting with at least one heat source includes a main body and at least one heat dissipation block. The main body is made by a material of alloy or metal through a die casting process and has a first side and a second side that are corresponding to each other. The heat dissipation block is disposed on the first side of the main body, made by a first high thermal conductivity material, and having a connecting surface that protrudes outside the main body. The connecting surface directly or indirectly connects with the heat source. The heat dissipation block connects with the main body by means of a first connecting structure, the first connecting structure having a first pair of interlock structures that are disposed in the main body and the heat dissipation block respectively.
Description
- The present invention is in related to a heat dissipation mechanism, more particularly to a heat dissipation mechanism for die-casting and over-molding.
- Nowadays, the electronic products are full of our normal lives, but an important shortcoming of the electronic products is heat dissipation. We all know that a not proper temperature may decrease the efficiency of work. Regularly, to equip with heat dissipation devices or systems, as fans or cooling systems, generates a problem that is additional power cost. Hence, another direction of solving aforesaid shortcoming is the category of designing advanced mechanisms.
- Compared with other solutions, die-casting aluminum alloy is cheaper relatively. The material of aluminum alloy such as ADC12 has a better fluidity, so as to make thin members easily, but with worse conductivity. In addition, the shortcomings of a die casting process itself and impurities may produce some obstructions to the conductivity of the aluminum alloy. Further, molding high thermal conductivity materials, as copper, extruded aluminum alloy, etc., increases cost and time. Therefore, adhering those high thermal conductivity materials on the locations where the aluminum alloy needs cooling will be an outstanding solution, and it is with the advantages of mass production, low cost, and high thermal conductivity.
- Frankly speaking, the combination for connecting two metals with different properties is very difficult. Especially, an improper surface treatment process for two joint surfaces may cause a higher heat resistance than individual die-cast aluminum alloy parts'. That is, the efficiency of heat dissipation may be worse.
- As it can be seen, how to solve aforesaid shortcomings becomes an important issue to persons who are skilled in the art.
- The present invention is to provide a heat dissipation mechanism and a method thereof. Disposing metals with high conductivities into a die casting mold makes a combination of die-casting molten aluminum alloy and the metals with high conductivities in order to figure out the problem for difficult to joint dissimilar metals and approach a better efficiency of heat dissipation simultaneously.
- A heat dissipation mechanism for connecting with at least one heat source comprises:
- a main body, which is made by a material of alloy or metal through a die casting process, and has a first side and a second side that are corresponding to each other; and
at least one heat dissipation block, disposed on the first side of the main body, made by a first high thermal conductivity material, and having a connecting surface that protrudes outside the main body, wherein the connecting surface directly or indirectly connects with the heat source;
wherein the heat dissipation block connects with the main body by means of a first connecting structure, the first connecting structure having a first pair of interlock structures that are disposed in the main body and the heat dissipation block respectively. - Preferably, the heat dissipation mechanism further comprises a heat dissipation member that is disposed on the second side, and made by a second high thermal conductivity material, the heat dissipation member connecting with the main body through a second connecting structure that has a second pair of interlock structures, wherein the second pair of interlock structures are disposed in the main body and the heat dissipation member.
- Preferably, the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes, and the second pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- Another heat dissipation mechanism for connecting with at least one heat source comprises:
- a main body, which is made by a material of alloy or metal through a die casting process, and has a first side and a second side that are corresponding to each other; and
a heat dissipation member, disposed on the second side of the main body, made by a second high thermal conductivity material, and having at least one protruding block that penetrates through the main body, wherein the protruding block is configured to connect with the heat source. - Preferably, the heat dissipation mechanism further comprises at least one heat dissipation block disposed on the first side of the main body, made by a first high thermal conductivity material, and connecting with the protruding block by means of a first connecting structure, wherein the heat dissipation block is between the protruding block and the heat source, and the protruding block directly or indirectly connects with the heat source via the heat dissipation block.
- Preferably, the first connecting structure is composed of a first pair of interlock structures that are disposed in the protruding block and the heat dissipation block respectively.
- Preferably, the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- Preferably, the first pair of interlock structures are selected from the group consisting of: grooves, dovetail grooves, zippers, and fisheye holes.
- Preferably, the first high thermal conductivity material is copper.
- Preferably, the second high thermal conductivity material is aluminum alloy, and the heat dissipation member is made by an extrusion process.
- Preferably, the main body is made of aluminum alloy or magnesium alloy.
- Preferably, the connecting surface of the heat dissipation block is through a surface treatment process in order to reduce a surface thermal resistance of the heat dissipation block.
- A method for manufacturing a heat dissipation mechanism comprises steps of:
- (a) providing at least one heat dissipation block that has a first pair of interlock structures;
(b) loading the heat dissipation block into a die casting mold and positioning therein;
(c) extruding a molten or semi-melted alloy or metal into the die casting mold;
(d) cooling down the die casting mold; and
(e) opening the die casting mold for taking out a formed heat dissipation mechanism;
wherein the heat dissipation block is made of a first high thermal conductivity material. - Preferably, the method for manufacturing the heat dissipation mechanism further comprises a step (a2), after step (a), of: providing at least one heat dissipation member that has a second pair of interlock structures, and is made of a second high thermal conductivity material, wherein step (b) further has one more step of loading the heat dissipation member into the die casting mold and positioning therein.
- Another method for manufacturing a heat dissipation mechanism comprises steps of:
- (a) providing at least one heat dissipation member that has a protruding block;
(b) loading the heat dissipation member into a die casting mold and positioning therein;
(c) extruding a molten or semi-melted alloy or metal into the die casting mold;
(d) cooling down the die casting mold; and
(e) opening the die casting mold for taking a formed heat dissipation mechanism;
wherein the heat dissipation member is made of a second high thermal conductivity material. - Preferably, the method for manufacturing the heat dissipation mechanism further comprises a step of: providing at least one heat dissipation block that is disposed on a surface of the protruding block, and is made of a first high thermal conductivity material, wherein step (b) further has one more step of loading the heat dissipation block into the die casting mold and positioning therein.
- Preferably, the first high thermal conductivity material is copper.
- Preferably, the second high thermal conductivity material is aluminum.
- Preferably, step (c) is of: extruding a molten or semi-melted aluminum alloy or magnesium alloy into the die casting mold.
- Other and further features, advantages, and benefits of the invention will become apparent in the following description taken in conjunction with the following drawings. It is to be understood that the foregoing general description and following detailed description are exemplary and explanatory but are not to be restrictive of the invention.
- The accompanying drawings are incorporated in and constitute a part of this application and, together with the description, serve to explain the principles of the invention in general terms. Like numerals refer to like parts throughout the disclosure.
- The objects, spirits, and advantages of the preferred embodiments of the present invention will be readily understood by the accompanying drawings and detailed descriptions, wherein:
-
FIG. 1A andFIG. 1B illustrate schematic views of a heat dissipation mechanism of the present invention; -
FIG. 2A illustrates a schematic lateral view of the heat dissipation mechanism of the present invention; -
FIG. 2B illustrates a schematic exploded lateral view of the heat dissipation mechanism of the present invention; -
FIG. 3A illustrates a schematic lateral sectional view of the heat dissipation mechanism of the present invention; -
FIG. 3B illustrates a schematic exploded view of the heat dissipation block of the present invention; -
FIG. 4 illustrates a schematic view of another embodiment of the heat dissipation member and the heat dissipation block of the present invention; -
FIG. 5A illustrates a flow chart of the method for manufacturing the heat dissipation mechanism of the present invention; -
FIG. 5B illustrates a schematic entire view of the heat dissipation mechanism of the present invention; -
FIG. 6 , which illustrates a flow chart of another embodiment of the method for manufacturing the heat dissipation mechanism of the present invention; -
FIG. 7A illustrates a schematic view of a fisheye hole pair lock structure of the present invention; and -
FIG. 7B illustrates a schematic view of a zipper pair lock structure of the present invention. - In order to describe in detail the technical content, structural features, achieved objectives and effects of the instant application, the following detailed descriptions are given in conjunction with the drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the application and not to limit the scope of the instant application.
- With reference to
FIG. 1A andFIG. 1B , which illustrate schematic views of a heat dissipation mechanism of the present invention. Theheat dissipation mechanism 100 is adopted to connect with at least one heat source as electronic component or battery and has amain body 110 and at least oneheat dissipation block 130. For another embodiment, themain body 110 further has aheat dissipation member 120 and is made by a material of alloy or metal through a die casting process, wherein the alloy can be aluminum alloy as ADC 12 or magnesium alloy as AZ91D. Themain body 110 further has afirst side 110 a and asecond side 110 b that are corresponding to each other. In other words, thefirst side 110 a and thesecond side 110 b are two surfaces of themain body 110, as shown inFIG. 1A andFIG. 1B respectively. - Referring to
FIG. 1A , theheat dissipation block 130 is disposed on thefirst side 110 a of themain body 110 and is made by a first high thermal conductivity material, such as copper. Further, theheat dissipation block 130 has a connectingsurface 132 that protrudes outside themain body 110, wherein the connectingsurface 132 directly or indirectly connects with the heat source. More specifically, a surface of theheat dissipation block 130 is through a surface treatment process in order to reduce a surface thermal resistance of theheat dissipation block 130. - For further information, the
heat dissipation block 130 is shaped as a flake and made of copper, and it is located where themain body 110 connecting with the heat source is. Talking to the embodiment, three heat dissipation blocks 130 connect with three heat sources respectively, such as CPU, GPU and battery. It is to be sure that the number of the heat source is variable for the persons skilled in the art. - As shown in
FIG. 1B , theheat dissipation member 120 is disposed on thesecond side 110 b and made by a second high thermal conductivity material. For further discussions, theheat dissipation member 120 is made of aluminum alloy, ex. 6063 aluminum alloy, and it is shaped as a fin-shaped heat sink through an extrusion process. Through the arrangement of disposing theheat dissipation member 120 on thesecond side 110 b, heat will be effectively guided to the air. Other embodiment may exclude theheat dissipation member 120, instead to theheat dissipation mechanism 100 composed of themain body 110 and the heat dissipation blocks 130. - Besides, the
heat dissipation block 130 is equipped with a first connectingstructure 131, and so does theheat dissipation member 120. In other words, theheat dissipation member 120 has at least one second connectingstructure 121. The first connectingstructure 131 has a first pair of interlock structures that are cooperated to each other and disposed in themain body 110 and theheat dissipation block 130 respectively. The second connectingstructure 121 has a second pair of interlock structures that are cooperated to each other as well, wherein the second pair of interlock structures are disposed in themain body 110 and theheat dissipation member 120. The first pair of interlock structures and the second pair of interlock structures are grooves, dovetail grooves, zippers, fisheye holes, etc. - Practically, based on the shapes of the
main body 110 and theheat dissipation block 130 being corresponding to each other, the first pair of interlock structures of the first connectingstructure 131 are formed, and the first pair of interlock structures will be discussed later. In the same way, according to the shapes of themain body 110 and theheat dissipation member 120 being corresponding to each other also, the second pair of interlock structures of the second connectingstructure 121 are formed, and the second pair of interlock structures will be discussed later. - Regarding to
FIG. 2A andFIG. 2B , which illustrate a schematic lateral view of the heat dissipation mechanism of the present invention and a schematic exploded lateral view of the heat dissipation mechanism of the present invention. Theheat dissipation member 120 additionally has adovetail groove 121, and themain body 110 has an interlocking and embeddedstructure 112 corresponding to thedovetail groove 121. As it can be seen obviously, the second pair of interlock structures are composed of thedovetail groove 121 and the interlocking and embeddedstructure 112, in order to connect theheat dissipation member 120 with themain body 110. - As shown in
FIG. 3A andFIG. 3B , which illustrate a schematic lateral sectional view of the heat dissipation mechanism of the present invention and a schematic exploded view of the heat dissipation block of the present invention. There are twoinclined surfaces 131 a on the two edges of theheat dissipation block 130, and adovetail groove 111 of themain body 110 is just corresponding to the structure composed of the twoinclined surfaces 131 a, so that the first pair of interlock structures are assembled by thedovetail groove 111 and the structure composed of the twoinclined surface 131 a, in order to connect theheat dissipation block 130 with themain body 110. - That is to say, the first pair of interlock structures on the
main body 110 and theheat dissipation block 130 are tightly cooperated with each other, such as theinclined surfaces 131 a of theheat dissipation block 130 and thedovetail groove 111 of themain body 110. The second pair of interlock structures on themain body 110 and theheat dissipation member 120 is tightly cooperated with each other, such as thedovetail groove 121 a of theheat dissipation member 120 and the interlocking and embeddedstructure 112 of themain body 110. - According to
FIG. 2B andFIG. 3A , theheat dissipation member 120 has an interlocking and embeddedstructure 121 b, and themain body 110 has adovetail groove 112 a corresponding to the interlocking and embeddedstructure 121 b. The number of the second pair of interlock structure between theheat dissipation member 120 and themain body 110 can be plural. The dovetail groove (concave structure) disposed on themain body 110 may not be limited thereto, and so does to the interlocking and embedded structure on theheat dissipation member 120. For instance, the interlocking and embedded structure may be possible on themain body 110, and the dovetail groove (concave structure) is on theheat dissipation member 120 as another embodiment. In addition, the more second pair of interlock structures, the more connecting efficiency of theheat dissipation member 120 and themain body 110. Based on the embodiments inFIG. 2A ,FIG. 2B andFIG. 3A , such application of the dovetail groove and the interlocking and embedded structure forming the first connecting structure and the second connecting structure is not limited thereto, the concave structure with its relative structure or other structures cooperated with each other may be adopted. - With reference to
FIG. 7A andFIG. 7B , which illustrate a schematic view of a fisheye hole pair lock structure of the present invention and a schematic view of a zipper pair lock structure of the present invention. As shown inFIG. 7A , afirst substance 310 forms afisheye hole 311, and asecond substance 320 forms an interlocking and embeddedstructure 321 corresponding to thefisheye hole 311, in order to connect thefirst substance 310 with thesecond substance 320. According toFIG. 7B , afirst substance 410 forms a serial interlocking and embeddedstructure 411, and asecond substance 420 forms an interlocking and embeddedstructure 421 corresponding to the serial interlocking and embeddedstructure 411, in order to combine thefirst substance 410 with thesecond substance 420. - Regarding
FIG. 4 , which illustrates a schematic view of another embodiment of the heat dissipation member and the heat dissipation block of the present invention. Aheat dissipation mechanism 200 has amain body 210, aheat dissipation member 220 and at least oneheat dissipation block 230. Additionally, theheat dissipation member 220 has at least one protrudingblock 222 that penetrates through themain body 210, wherein the protrudingblock 222 directly and indirectly connects with the heat source (not shown inFIG. 4 ). - Further, the
heat dissipation block 230 is between theprotruding block 222 and the heat source, but connects with the protrudingblock 222. Theheat dissipation block 230 even connects with the protrudingblock 222 via a first connectingstructure 231. In other words, theheat dissipation member 220 connects with theheat dissipation block 230 through the protrudingblock 222 so as to form an entire structure. It is beneficial to position theheat dissipation block 230 when going through a die casting process. The protrudingblock 222 is a heat transfer media for transferring the heat from the heat source to theheat dissipation member 220 via theheat dissipation block 230. The fins of theheat dissipation member 220 may conduct and radiate the heat efficiently. For other embodiments, theheat dissipation block 230 may be excluded, but with the protrudingblock 222 for directly connecting with the heat source. - In other embodiments, the
heat dissipation block 230 is adhered to theprotruding block 222 by welding, and the welding material is the role as the first connecting structure. - Following will be the descriptions about the method for manufacturing the heat dissipation mechanism, and the numbers for those elements as aforesaid will be the same.
- Please refer to
FIG. 5A andFIG. 5B , which illustrate a flow chart of the method for manufacturing theheat dissipation mechanism 100 of the present invention and a schematic entire view of the heat dissipation mechanism of the present invention. The method has the steps of: - step (A10): providing the
heat dissipation block 130 that has a first pair ofinterlock structures 131, wherein theheat dissipation block 130 is made of a first high thermal conductivity material, such as copper;
step (A20): providing theheat dissipation member 120 that has at least one second pair ofinterlock structures 121, wherein theheat dissipation member 120 is made of a second high thermal conductivity material, such as aluminum alloy;
step (A30): loading theheat dissipation block 130 and theheat dissipation member 120 into a die casting mold and positioning therein;
Practically, theheat dissipation block 130 and theheat dissipation member 120 are positioned on afemale mold 10 and a male mold 11 respectively. Thefemale mold 10 and the male mold 11 both have figures that are corresponding to the main body's 110, the heat dissipation member's 120 and the heat dissipation block's 130 for positioning theheat dissipation block 130 and theheat dissipation member 120. For example, a plurality of grooves that correspond to theheat dissipation block 130 are disposed on thefemale mold 10, in order to position theheat dissipation block 130. With the same theory, a plurality of groove structures that correspond to the fins of theheat dissipation member 120 are disposed on the male mold 11 for positioning theheat dissipation member 120. In addition, step (A20) can be neglected, and only theheat dissipation block 130 is loaded into the die casting mold and positioned therein for step (A30).
after step (A30), clamping thefemale mold 10 and the male mold 11, and then
step (A40): extruding a molten or semi-melted alloy or metal into the die casting mold, wherein the alloy is aluminum alloy;
Practically, thefemale mold 10 or the male mold 11 is provided with an injection port, and the molten or semi-melted aluminum alloy solution can be squeezed and injected from the injection port.
step (A50): cooling down the die casting mold, when the molten or semi-melted alloy or metal is solidified, themain body 110 is formed according to the figures of the die casting mold; and
step (A60): opening the die casting mold for taking out a formedheat dissipation mechanism 100.
As a matter of fact, theheat dissipation member 120 and theheat dissipation block 130 are disposed into the die casting mold in advance, therefore the first connecting structure and the second connecting structure are formed as long as the molten or semi-melted alloy or metal is filled out the die casting mold. For example, the interlocking and embeddedstructure 112 corresponds to thedovetail groove 121, as shown inFIG. 2B , and thedovetail groove 111 corresponds to theinclined surface 131 a, as shown inFIG. 3A . As a conclusion, themain body 100, theheat dissipation member 120 and theheat dissipation block 130 with different heat conductivities are tightly combined through the die casting process, in order to approach better heat dissipation. - Regarding to
FIG. 6 , which illustrates a flow chart of another embodiment of the method for manufacturing theheat dissipation mechanism 200 of the present invention. The method has the steps of: - step (B10): providing at least one
heat dissipation member 220 and at least oneheat dissipation block 230, wherein theheat dissipation member 220 has aprotruding block 222 and is made of a second high thermal conductivity material as aluminum alloy, and theheat dissipation block 230 is positioned on a surface of theprotruding block 222 and is made of a first high thermal conductivity material as cooper;
step (B20): loading theheat dissipation member 220 and theheat dissipation block 230 into a die casting mold and positioning therein;
Practically, the die casting mold is similar to thefemale mold 10 and the male mold 11, so they will not be discussed hereinafter. In some other embodiments, theheat dissipation block 230 in both step (B10) and step (B20) can be neglected. That is, only theheat dissipation member 220 is loaded into the die casting mold and positioned therein.
step (B30): extruding a molten or semi-melted alloy or metal into the die casting mold;
step (B40): cooling down the die casting mold, thus the molten or semi-melted alloy or metal is solidified;
step (B50): opening the die casting mold for taking out a formedheat dissipation mechanism 200.
In fact, as shown inFIG. 4 , theheat dissipation mechanism 200 has theheat dissipation member 220 and theheat dissipation block 230, which are connected with each other through the protrudingblock 222. It is to be noted that the protrudingblock 222 is a heat transfer media for transferring heat to theheat dissipation member 220 via theheat dissipation block 230, so as to promote the efficiency of heat dissipation. - The present invention puts the heat dissipation member and the heat dissipation block with high conductivities into the die casting mold. Therefore, the heat dissipation member and the heat dissipation block are combined with the molten aluminum alloy or magnesium alloy, and the heat dissipation mechanism formed in this way can increase the connection strength. On the other hand, a problem for difficult to joint dissimilar metals is solved, and combining metals with different high conductivities approaches a better efficiency of heat dissipation.
- Although the invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for use in numerous other embodiments that will be apparent to persons skilled in the art. This invention is, therefore, to be limited only as indicated by the scope of the appended claims
Claims (25)
1. A heat dissipation mechanism for connecting with at least one heat source comprising:
a main body (110), which is made by a material of aluminum alloy or magnesium alloy through a die casting process, and has a first side (110 a) and a second side (110 b) that are corresponding to each other;
at least one heat dissipation block (130), disposed on the first side (110 a) of the main body (110), made by a first high thermal conductivity material, and having a connecting surface (132) that protrudes outside the main body (110), wherein the connecting surface (132) directly connects with the heat source; and
a heat dissipation member (220), disposed on the second side (110 b) of the main body (210), made by a second high thermal conductivity material;
wherein the main body (110), the heat dissipation block (130) and heat dissipation member are integrated together when the main body (110) is formed by the die casting process;
wherein the first high thermal conductivity material is copper, the second high thermal conductivity material is aluminum alloy.
2. (canceled)
3. (canceled)
4. A heat dissipation mechanism for connecting with at least one heat source comprising:
a main body (210), which is made by a material of aluminum alloy or magnesium alloy through a die casting process, and has a first side (110 a) and a second side (110 b) that are corresponding to each other;
a heat dissipation member (220), disposed on the second side (110 b) of the main body (210), made by a second high thermal conductivity material, and having at least one protruding block (222) whose side is surrounded by the main body (210); and
at least one heat dissipation block (230) disposed on the first side (110 a) of the main body (210), made by a first high thermal conductivity material, and connecting with the protruding block (222), wherein the heat dissipation block (230) is between the protruding block (222) and the heat source, and the protruding block (222) directly connects with the heat source;
wherein the first high thermal conductivity material is copper, the second high thermal conductivity material is aluminum alloy.
5. (canceled)
6. (canceled)
7. (canceled)
8. (canceled)
9. (canceled)
10. The heat dissipation mechanism according to claim 1 , wherein the thermal conductivity of the heat dissipation member (120) is higher than the thermal conductivity of the main body (110).
11. The heat dissipation mechanism according to claim 4 , wherein the thermal conductivity of the heat dissipation member (220) is higher than the thermal conductivity of the main body (210).
12. (canceled)
13. (canceled)
14. The heat dissipation mechanism according to claim 1 , wherein the connecting surface (132) of the heat dissipation block (130) is through a surface treatment process in order to reduce a surface thermal resistance of the heat dissipation block (130).
15. The heat dissipation mechanism according to claim 4 , wherein surface of the heat dissipation block (230) is through a surface treatment process in order to reduce a surface thermal resistance of the heat dissipation block (230).
16. A method for manufacturing a heat dissipation mechanism comprising steps of:
providing at least one heat dissipation block (130);
providing at least one heat dissipation member (120) that is made of a second high thermal conductivity material; and
loading the heat dissipation block (130), heat dissipation member (120) and molten or semi-melted aluminum alloy or magnesium alloy into a die casting mold, executing the die casting process and obtain an integrated heat dissipation mechanism (100);
wherein the heat dissipation block (130) is made of a first high thermal conductivity material,
wherein the first high thermal conductivity material is copper, the second high thermal conductivity material is aluminum alloy.
17. (canceled)
18. A method for manufacturing a heat dissipation mechanism comprising steps of:
providing at least one heat dissipation member (220) that has a protruding block (222);
providing at least one heat dissipation block (230) that is disposed on a surface of the protruding block (222), and is made of a first high thermal conductivity material; and
loading the heat dissipation member (220), the heat dissipation block (230) and molten or semi-melted aluminum alloy or magnesium alloy into a die casting mold executing the die casting process and obtain an integrated heat dissipation mechanism (200);
wherein the heat dissipation member (220) is made of a second high thermal conductivity material;
wherein the first high thermal conductivity material is copper, the second high thermal conductivity material is aluminum alloy.
19. (canceled)
20. (canceled)
21. (canceled)
22. (canceled)
23. (canceled)
24. (canceled)
25. (canceled)
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TW110132988A TWI785778B (en) | 2021-09-06 | 2021-09-06 | Heat dissipation mechanism and manufacturing method thereof |
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US20230072742A1 true US20230072742A1 (en) | 2023-03-09 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5562146A (en) * | 1995-02-24 | 1996-10-08 | Wakefield Engineering, Inc. | Method of and apparatus for forming a unitary heat sink body |
US20050006054A1 (en) * | 2002-01-16 | 2005-01-13 | Ryuuji Miyazaki | Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
US20070057365A1 (en) * | 2005-09-13 | 2007-03-15 | Luk-Shan Wong | Device for preventing low-melting-point heat-transfer medium from oxidization |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60117090A (en) * | 1983-11-30 | 1985-06-24 | Hitachi Ltd | Heat dissipation control device |
TWI220467B (en) * | 2003-01-21 | 2004-08-21 | Jau-Ming Chen | High efficiency heat dissipation sheet and manufacturing method of the same |
TWM241724U (en) * | 2003-08-13 | 2004-08-21 | Cpumate Inc | Improvement of bottom plate for heat sink |
JP4011598B2 (en) * | 2005-12-28 | 2007-11-21 | シャープ株式会社 | Heat sink and electronics |
TWM334311U (en) * | 2007-12-07 | 2008-06-11 | Kryokey Co Ltd | Assembly structure of plate-type heat-conducting element |
CN207086885U (en) * | 2017-07-03 | 2018-03-13 | 盐城市精工铸业股份有限公司 | A kind of shaped device of cast member |
-
2021
- 2021-09-06 TW TW110132988A patent/TWI785778B/en active
- 2021-10-25 CN CN202111252011.5A patent/CN115776801A/en active Pending
- 2021-11-16 US US17/528,118 patent/US20230072742A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5562146A (en) * | 1995-02-24 | 1996-10-08 | Wakefield Engineering, Inc. | Method of and apparatus for forming a unitary heat sink body |
US20050006054A1 (en) * | 2002-01-16 | 2005-01-13 | Ryuuji Miyazaki | Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
US20070057365A1 (en) * | 2005-09-13 | 2007-03-15 | Luk-Shan Wong | Device for preventing low-melting-point heat-transfer medium from oxidization |
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TW202310950A (en) | 2023-03-16 |
TWI785778B (en) | 2022-12-01 |
CN115776801A (en) | 2023-03-10 |
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