US20210033356A1

US20210033356A1 - Heat dissipating apparatus used in non-forced convection

Info

Publication number: US20210033356A1
Application number: US16/528,569
Authority: US
Inventors: Yi-Chuan Chen; Sheng-Chin CHAN
Original assignee: Taisol Electronics Co Ltd Group
Current assignee: Taisol Electronics Co Ltd Group
Priority date: 2019-07-31
Filing date: 2019-07-31
Publication date: 2021-02-04

Abstract

A heat dissipating apparatus used in non-forced convection includes a cooling plate assembly, an upper shielding plate, a lower shielding plate, a metal base, and heat pipes. The cooling plate assembly has a cutting opening. The upper and the lower shielding plates cover the cutting opening above and below the cooling plate assembly, respectively. The metal base is disposed below the lower shielding plate and has plural cooling fins. Each heat pipe has an evaporator section, a first condenser section, and a second condenser section. Each evaporator section is fixed to the metal base. Each condenser passes through the cooling plate assembly and is closed to two sides of the cutting opening. Therefore, the wind resistance is reduced and the friction between air flow and the cooling plates is decreased, which further enhances the whole performance of heat conduction and dissipation.

Description

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a heat dissipating apparatus and in particular to a heat dissipating apparatus which is used in non-forced convection.

Description of Prior Art

The fast development of the computers and various electronic products and the convenience they provide causes modern people to have the habit of long-term use. During the long-term operation of the computers and electronic products, if the heat generated cannot be dissipated quickly and properly, their service lives will be shorter.
The existing heat dissipating apparatus mainly comprises heat pipes, a cooling fin set, and a base. The base is used to be contact with a heat source. The cooling fin set has a plurality of cooling fins stacked mutually. The heat pipe comprises an evaporator section and a condenser section; the evaporator section is fixed to the base; the condenser section passes through the cooling fin set. Using the above configuration, a tower heat sink is formed. A fan is installed on a side of the cooling fin set during operation and the air flow by forced convection through the fan bring away the heat accumulated in the heat dissipating apparatus.
To increase the cooling performance of the heat dissipating apparatus, the industry has been taking advantage of space to arrange the cooling fins to increase the cooling area. However, when this heat dissipating apparatus is applied in the large electronic device or system such as the cloud server system, the location of the fan is not close to the heat dissipating apparatus and thus the air flow driven by the fan may arrive at the heat dissipating apparatus from a distance. Consequently, the heat will be accumulated at the middle of the cooling fin set. Also, the wind resistance occurs at this location to affect the air flow through the cooling fin set and further degrades the cooling performance.
In view of this, the inventor pays special attention to research with the application of related theory and tries to improve and overcome the above disadvantages regarding the prior art, which becomes the improvement target of the inventor.

SUMMARY OF THE INVENTION

One objective of the present invention is to provide a heat dissipating apparatus used in non-forced convection, which can reduce the wind resistance and decrease the friction between the air flow and the respective cooling plates. Further, the whole performance of heat conduction and dissipation can be improved.
Another objective of the present invention is to provide a heat dissipating apparatus used in non-forced convection in which the shielding plates are used to cover the top and the bottom of the cutting opening such that there is no interference between the air flow inside the cooling plate assembly and that among the respective cooling fins on the metal base.
To achieve the above objectives, the present invention provides a heat dissipating apparatus used in non-forced convection, which comprises a cooling plate assembly, an upper shielding plate, a lower shielding plate, a metal base, and a plurality of heat pipes. A cutting opening is formed at the center of the cooling plate assembly. The upper shielding plate covers the cutting opening correspondingly above the cooling plate assembly; the lower shielding plate covers the cutting opening correspondingly below the cooling plate assembly. The metal base is disposed below the lower shielding plate and has a plurality of cooling fins. Each heat pipe has an evaporator section, a first condenser section, and a second condenser section; the first and the second condenser sections individually extend from two ends of the evaporator section. Each of the evaporator sections is fixed to the metal base; the first condenser sections pass through the cooling plate assembly and are disposed close to one side of the cutting opening; the second condenser sections pass through the cooling plate assembly and are disposed close to the other side of the cutting opening.
The present invention also has the following effects. A gradually shrinking windward surface formed on the side of the cooling plate assembly has an excellent effect of guiding flow. Using the configuration of the first and the second condenser sections of any two adjacent heat pipes disposed inversely and dislocated from each other produces the effects of heat dissipation and heat balance. With the disposition of the handle assembly, the whole heat dissipating apparatus can be easily moved or installed.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 is an exploded view of the cooling plate assembly, the upper shielding plate, and the lower shielding plate of the present invention;

FIG. 2 is an assembled perspective view of the cooling plate assembly, the upper shielding plate, and the lower shielding plate of the present invention;

FIG. 3 is an exploded view of the heat dissipating apparatus of the present invention;

FIG. 4 is an assembled perspective view of the heat dissipating apparatus of the present invention;

FIG. 5 is a cross-sectional view along line 5-5 in FIG. 4;

FIG. 6 is a cross-sectional view along line 6-6 in FIG. 4;

FIG. 7 is a cross-sectional view along line 7-7 in FIG. 4;

FIG. 8 is an assembled perspective view of the heat dissipating apparatus according to another embodiment of the present invention; and

FIG. 9 is an assembled perspective view of the heat dissipating apparatus according to yet another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The detailed description and technical details of the present invention will be explained below with reference to accompanying figures. However, the accompanying figures are only for reference and explanation, but not to limit the scope of the present invention.
Please refer to FIGS. 1-7. The present invention provides a heat dissipating apparatus used in non-forced convection. The phrase of “non-forced convection” means there is no cooling fan directly installed on the periphery of the heat dissipating apparatus to provide the air flow by forced convection, but not exclusive of the fan installed at a distance. The heat dissipating apparatus of the present invention mainly comprises a cooling plate assembly 10, an upper shielding plate 20, a lower shielding plate 30, a metal base 40, and a plurality of heat pipes 50.
The cooling plate assembly 10 has a plurality of cooling plates 11 stacked mutually. The cooling plates 11 are made of material with high thermal conductivity such as aluminum, copper, or an alloy thereof. In the current embodiment, the cooling plate assembly 10 is roughly shaped as a cuboid and a cutting opening 12 is formed at the center of the cooling plate assembly 10 and through the respective cooling plates 11. Plural connecting holes 13 are formed on the cooling plate assembly 10 close to two sides of the cutting opening 12 and formed through the respective cooling plates 11. Besides, a surrounding wall 111 is formed around the perimeter of each of the connecting holes 13 of the respective cooling plates 11. A fluid channel 14 (refer to FIG. 6) is formed between any two adjacent cooling plates 11 through the corresponding surrounding wall 111 after the cooling plates 11 are mutually stacked. Also, the front end and the rear end of each of the cooling plates 11 are individually provided with an arced side 112 such that an effect of guiding flow is obtained at the front end and the rear end of the cooling plate assembly 10.
The upper shielding plate 20 is made of material with high thermal conductivity such as aluminum, copper, or an alloy thereof. The upper shielding plate 20 covers the cutting opening 12 correspondingly above the cooling plate assembly 10; that is, the upper shielding plate 20 may just cover the zone above the cutting opening 12. In the current embodiment, the shape of the upper shielding plate 20 is roughly similar to those of the cooling plates 11. Plural first throughholes 21 are formed on the upper shielding plate 20 corresponding to the connecting holes 13.
The lower shielding plate 30 is also made of material with high thermal conductivity such as aluminum, copper, or an alloy thereof. The lower shielding plate 30 covers the cutting opening 12 correspondingly below the cooling plate assembly 10; that is, the lower shielding plate 30 may just cover the zone below the cutting opening 12. In the current embodiment, the shape of the lower shielding plate 30 is roughly similar to those of the above-mentioned cooling plates 11. Plural second throughholes 31 are formed on the lower shielding plate 30 corresponding to the connecting holes 13.
The metal base 40 is disposed below the lower shielding plate 30 and mainly comprises a lower conductive seat 41 and an upper conductive seat 42 assembled with the lower conductive seat 41 correspondingly. The lower conductive seat 41 is made of material with high thermal conductivity such as copper or an alloy thereof and is in contact with a heat source (not shown) to conduct heat. Plural first grooves 411 are disposed on the top surface of the lower conductive seat 41. The upper conductive seat 42 is made of material with high thermal conductivity such as aluminum, or an alloy thereof; plural cooling fins 421 are disposed on the top surface of the upper conductive seat 42. Furthermore, plural second grooves 422 are disposed on the surface of the upper conductive seat 42 opposite to the cooling fins 421. The second grooves 422 are individually disposed corresponding to the first grooves 411.
In the current embodiment, the heat pipe 50 has a U-like shape. Each heat pipe 50 has an evaporator section 51, a first condenser section 52, and a second condenser section 53; the first and the second condenser sections 52, 53 individually extend from two ends of the evaporator section 51. Each of the evaporator sections 51 is fixed between the lower conductive seat 41 and the upper conductive seat 42, individually accommodated between the corresponding first grooves 411 and the corresponding second grooves 422. Each first condenser section 52 passes through the respective connecting holes 13 of the cooling plate assembly 10 and is disposed close to the front side of the cutting opening 12; each second condenser section 53 passes through the respective connecting holes 13 of the cooling plate assembly 10 and is disposed close to the rear side of the cutting opening 12. Any two adjacent first condenser sections 52 are disposed inversely and dislocated from each other in the cooling plate assembly 10. Likewise, any two adjacent second condenser section 53 are disposed inversely and dislocated from each other in the cooling plate assembly 10 such that the effects of heat dissipation and uniform heat distribution can be achieved.
The further description is as follows. Because the upper shielding plate 20 and the lower shielding plate 30 cover the zones above and below the cutting opening 12, respectively, the heat dissipated from the respective cooling fins 421 of the upper conductive seat 42 does not be transmitted into the cutting opening 12 such that there is no interference between the heat dissipated from the respective cooling fins 421 and that dissipated from the respective cooling plates 11.
Please refer to FIG. 8. The difference between the current embodiment and the previous embodiment of the heat dissipating apparatus used in non-forced convection is that the arc radii of the arced sides 112 of any two adjacent cooling plates 11 in the current embodiment can be different such that an uneven arced surface A is formed on a side of the cooling plate assembly 10A. In this way, the cooler air outside can be facilitated to flow into the cooling plate assembly 10A for heat exchange.
Please refer to FIG. 9. The difference between the current embodiment and the previous embodiment of the heat dissipating apparatus used in non-forced convection is that the current embodiment further has a handle assembly 60 which mainly comprises a frame 61, a bent plate 62, and a handle 63. The bent plate 62 has an L-like shape and has a bottom end attached to the side of the upper conductive seat 42 by plural screws. The other side of the bent plate 62 covers the top of the upper shielding plate 20 completely. The frame 61 is fixed above the bent plate 62 by plural screws. The handle 63 is fixed above the bent plate 62 by plural screws and disposed in the middle of the frame 61. Therefore, the whole heat dissipating apparatus can be easily moved or installed.
Further, in addition to the arced sides 112 disposed at the front end and the rear end of the cooling plates 11 as described in the previous embodiment, the straight sides 113 also can be disposed at the front end and the rear end of some of the cooling plates 11 in which the cooling plates 11 having arced sides 112 and having straight sides 113 are stacked alternately to form the cooling plate assembly 10B. In this way, the cooler air outside can be facilitated to flow into the cooling plate assembly 10B for heat exchange.
In summary, the heat dissipating apparatus used in non-forced convection of the present invention indeed achieves the expected objectives and overcomes the problems of the prior art. Also, the present invention is novel, useful, and non-obvious to be patentable. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.

Claims

What is claimed is:

1. A heat dissipating apparatus used in non-forced convection, comprising:

a cooling plate assembly having a cutting opening disposed at the center thereof;

an upper shielding plate covering the cutting opening correspondingly above the cooling plate assembly;

a lower shielding plate covering the cutting opening correspondingly below the cooling plate assembly;

a metal base disposed below the lower shielding plate and having a plurality of cooling fins; and

a plurality of heat pipes, each having an evaporator section, a first condenser section, and a second condenser section, wherein the first and the second condenser sections individually extend from two ends of the evaporator section, wherein each of the evaporator sections is fixed to the metal base, wherein the first condenser sections pass through the cooling plate assembly and are disposed close to one side of the cutting opening, wherein the second condenser sections pass through the cooling plate assembly and are disposed close to the other side of the cutting opening.

2. The heat dissipating apparatus used in non-forced convection according to claim 1, wherein the cooling plate assembly has a plurality of cooling plates stacked mutually, wherein a plurality of connecting holes are formed on the respective cooling plates close to two sides of the cutting opening, wherein the first and the second condenser sections individually pass through the respective connecting holes.

3. The heat dissipating apparatus used in non-forced convection according to claim 2, wherein a surrounding wall is formed around the perimeter of each of the connecting holes of the cooling plates, wherein a fluid channel is formed between any two adjacent cooling plates through the corresponding surrounding wall.

4. The heat dissipating apparatus used in non-forced convection according to claim 2, wherein a front end and a rear end of each of the cooling plates are individually provided with an arced side.

5. The heat dissipating apparatus used in non-forced convection according to claim 4, wherein the arc radii of the arced sides of any two adjacent cooling plates are different such that an uneven arced surface is formed on a side of the cooling plate assembly.

6. The heat dissipating apparatus used in non-forced convection according to claim 2, wherein a front end and a rear end of each of some cooling plates are individually provided with an arced side, wherein a front end and a rear end of each of the other cooling plates are individually provided with a straight side, wherein the cooling plates having arced sides and having straight sides are stacked alternately.

7. The heat dissipating apparatus used in non-forced convection according to claim 2, wherein a plurality of first throughholes are formed on the upper shielding plate corresponding to the connecting holes, wherein a plurality of second throughholes are formed on the lower shielding plate corresponding to the connecting holes, wherein the first and the second condenser sections pass through the first and the second throughholes.

8. The heat dissipating apparatus used in non-forced convection according to claim 1, wherein the first and the second condenser sections of any two adjacent heat pipes are disposed inversely and dislocated from each other in the cooling plate assembly.

9. The heat dissipating apparatus used in non-forced convection according to claim 1, wherein the metal base comprises a lower conductive seat and an upper conductive seat assembled with the lower conductive seat correspondingly, wherein the cooling fins are disposed on the upper conductive seat.

10. The heat dissipating apparatus used in non-forced convection according to claim 9, wherein a plurality of first grooves are formed on the lower conductive seat and a plurality of second grooves are formed on the upper conductive seat, wherein the second grooves are individually disposed corresponding to the first grooves to accommodate the evaporator sections of the heat pipes.

11. The heat dissipating apparatus used in non-forced convection according to claim 1, further comprising a handle assembly which is fixed to the metal base and covers the top of the upper shielding plate.

12. The heat dissipating apparatus used in non-forced convection according to claim 11, wherein the handle assembly comprises a frame, a bent plate, and a handle, wherein the bent plate is fixed to the metal base and bent and extended to cover the top of the upper shielding plate, wherein the frame is disposed above the bent plate, wherein the handle is fixed above the bent plate and disposed in the middle of the frame.