US20200302139A1 - Fingerprint identification device, fingerprint identification method, and method for manufacturing the fingerprint identification device - Google Patents

Fingerprint identification device, fingerprint identification method, and method for manufacturing the fingerprint identification device Download PDF

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Publication number
US20200302139A1
US20200302139A1 US16/342,213 US201916342213A US2020302139A1 US 20200302139 A1 US20200302139 A1 US 20200302139A1 US 201916342213 A US201916342213 A US 201916342213A US 2020302139 A1 US2020302139 A1 US 2020302139A1
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US
United States
Prior art keywords
thermosensitive
fingerprint identification
wires
wire layer
transverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/342,213
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English (en)
Inventor
Xiaoliang Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. reassignment WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Feng, Xiaoliang
Publication of US20200302139A1 publication Critical patent/US20200302139A1/en
Abandoned legal-status Critical Current

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    • G06K9/0002—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06K9/00087—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification

Definitions

  • the present disclosure relates to the field of display technologies, and more particularly to a fingerprint identification device, a fingerprint identification method, and a method for manufacturing the fingerprint identification device.
  • fingerprint identification devices are being used more and more widely in various electronic devices. For example, if a current smartphone including a fingerprint identification device is provided, a user can perform functions such as unlocking the smartphone and paying for bill for a fingerprint identification through the fingerprint identification device.
  • fingerprint identification devices of electronic devices usually use push-type fingerprint sensors, for example, mobile terminals such as APPLE'IPHONE 5S, IPHONE 6, and IPHONE 6S.
  • mobile terminals such as APPLE'IPHONE 5S, IPHONE 6, and IPHONE 6S.
  • fingerprint identification technologies have further appeared in a new trend, such as applications to full screens and in-cell display screens, etc.
  • Current fingerprint identification devices have certain defects and cannot meet higher requirements.
  • a fingerprint identification device including a fingerprint identification unit, a control circuit unit, and a connection component.
  • the fingerprint identification unit includes at least one thermosensitive wire layer and is configured to sense a fingerprint of a user's finger through the at least one thermosensitive wire layer.
  • the control circuit unit is disposed at one side of the fingerprint identification unit and is electrically connected to the fingerprint identification unit.
  • the connection component is connected to the fingerprint identification unit and the control circuit unit.
  • the at least one thermosensitive wire layer includes a first thermosensitive wire layer and a second thermosensitive wire layer, the first thermosensitive wire layer includes a plurality of longitudinal thermosensitive wires, the second thermosensitive wire layer includes a plurality of transverse thermosensitive wires, and the longitudinal thermosensitive wires and the transverse thermosensitive wires intersect to define a plurality of sensing regions. Two ends of each of the longitudinal thermosensitive wires and two ends of each of the transverse thermosensitive wires are electrically connected to the control circuit unit.
  • a material of the longitudinal thermosensitive wires and a material of the transverse thermosensitive wires are selected from the group consisting of at least one of copper, silver, nickel, platinum, a cobalt base alloy, a nickel base alloy, and a ferrous alloy.
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, and the insulating layer is disposed at an intersection of the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the fingerprint identification unit further includes a protective layer disposed on the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the present disclosure further provides a fingerprint identification device including a fingerprint identification unit, a control circuit unit, and a connection component.
  • the fingerprint identification unit includes at least one thermosensitive wire layer and is configured to sense a fingerprint of a user's finger through the at least one thermosensitive wire layer.
  • the control circuit unit is disposed at one side of the fingerprint identification unit and is electrically connected to the fingerprint identification unit.
  • the connection component is connected to the fingerprint identification unit and the control circuit unit.
  • the at least one thermosensitive wire layer includes a first thermosensitive wire layer and a second thermosensitive wire layer
  • the first thermosensitive wire layer includes a plurality of longitudinal thermosensitive wires
  • the second thermosensitive wire layer includes a plurality of transverse thermosensitive wires
  • the longitudinal thermosensitive wires and the transverse thermosensitive wires intersect to define a plurality of sensing regions.
  • two ends of each of the longitudinal thermosensitive wires and two ends of each of the transverse thermosensitive wires are electrically connected to the control circuit unit.
  • a material of the longitudinal thermosensitive wires and a material of the transverse thermosensitive wires are selected from the group consisting of at least one of copper, silver, nickel, platinum, a cobalt base alloy, a nickel base alloy, and a ferrous alloy.
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, and the insulating layer is disposed at an intersection of the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the fingerprint identification unit further includes a protective layer disposed on the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the present disclosure further provides a fingerprint identification method applied to the fingerprint identification device.
  • the fingerprint identification method includes sensing the fingerprint of the user's finger using the at least one thermosensitive wire layer, when the at least one thermosensitive wire layer senses the fingerprint of the user's finger, using the at least one thermosensitive wire layer to sense a temperature change and feedback, to the control circuit unit, a resistance change, using the control circuit unit to determine a fingerprint pattern of the user's finger according to an amount of the resistance change and collect the fingerprint pattern, matching the fingerprint pattern with a preset fingerprint pattern, and if the fingerprint pattern and the preset fingerprint pattern match, it is determined that an identification of the fingerprint pattern is successful.
  • the at least one thermosensitive wire layer includes a first thermosensitive wire layer and a second thermosensitive wire layer
  • the first thermosensitive wire layer includes a plurality of longitudinal thermosensitive wires
  • the second thermosensitive wire layer includes a plurality of transverse thermosensitive wires
  • the longitudinal thermosensitive wires and the transverse thermosensitive wires intersect to define a plurality of sensing regions.
  • two ends of each of the longitudinal thermosensitive wires and two ends of each of the transverse thermosensitive wires are electrically connected to the control circuit unit.
  • a material of the longitudinal thermosensitive wires and a material of the transverse thermosensitive wires are selected from the group consisting of at least one of copper, silver, nickel, platinum, a cobalt base alloy, a nickel base alloy, and a ferrous alloy.
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, and the insulating layer is disposed at an intersection of the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the fingerprint identification unit further includes a protective layer disposed on the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the present disclosure further provides a method for manufacturing a fingerprint identification device.
  • the method for manufacturing the fingerprint identification device includes providing a fingerprint identification unit, wherein the fingerprint identification unit includes at least one thermosensitive wire layer and is configured to sense a fingerprint of a user's finger through the at least one thermosensitive wire layer, forming a control circuit unit at one side of the fingerprint identification unit, wherein the control circuit unit is electrically connected to the fingerprint identification unit, and forming a connection component, wherein the connection component connects the fingerprint identification unit and the control circuit unit.
  • the at least one thermosensitive wire layer includes a first thermosensitive wire layer and a second thermosensitive wire layer
  • the first thermosensitive wire layer includes a plurality of longitudinal thermosensitive wires
  • the second thermosensitive wire layer includes a plurality of transverse thermosensitive wires
  • the longitudinal thermosensitive wires and the transverse thermosensitive wires intersect to define a plurality of sensing regions.
  • a material of the longitudinal thermosensitive wires and a material of the transverse thermosensitive wires are selected from the group consisting of at least one of copper, silver, nickel, platinum, a cobalt base alloy, a nickel base alloy, and a ferrous alloy.
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, and the insulating layer is disposed at an intersection of the longitudinal thermosensitive wires and the transverse thermosensitive wires.
  • the fingerprint identification device, the fingerprint identification method, and the method for manufacturing the fingerprint identification device of the embodiments of the present disclosure can realize fingerprint identification through at least one thermosensitive wire layer and can intuitively feedback sensitivity and precision of fingerprint graphics and fingerprint identification.
  • FIG. 1 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic structural diagram of a fingerprint identification unit according to an embodiment of the present disclosure.
  • FIG. 3 is a schematic structural diagram of a fingerprint identification unit according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram illustrating a resistance of at least one thermosensitive wire layer changes with temperature according to an embodiment of the present disclosure.
  • FIG. 5 is a block diagram of a fingerprint identification method according to an embodiment of the present disclosure.
  • FIG. 6 is a block diagram of a method for manufacturing a fingerprint identification device according to an embodiment of the present disclosure.
  • a fingerprint identification device 10 of an embodiment of the present disclosure includes a fingerprint identification unit 100 , a control circuit unit 200 , and a connection component 300 .
  • the fingerprint identification unit 100 includes at least one thermosensitive wire layer 110 and is configured to sense a fingerprint of a user's finger through the at least one thermosensitive wire layer 110 .
  • the control circuit unit 200 is disposed at one side of the fingerprint identification unit 100 and is electrically connected to the fingerprint identification unit 100 .
  • the connection component 300 is connected to the fingerprint identification unit 100 and the control circuit unit 200 .
  • the fingerprint identification device 10 of the embodiment of the present disclosure performs fingerprint identification through at least one thermosensitive wire layer 110 , the fingerprint identification device 10 can intuitively feedback sensitivity and precision of fingerprint graphics and fingerprint identification.
  • an electronic device includes the fingerprint identification device 10 .
  • control circuit unit 200 is, for example, an integrated circuit (IC) unit configured to process fingerprint identification related signals and/or messages.
  • IC integrated circuit
  • the at least one thermosensitive wire layer 110 includes a first thermosensitive wire layer 112 and a second thermosensitive wire layer 114 .
  • the first thermosensitive wire layer 112 includes a plurality of longitudinal thermosensitive wires 113
  • the second thermosensitive wire layer 114 includes a plurality of transverse thermosensitive wires 115 .
  • the longitudinal thermosensitive wires 113 and the transverse thermosensitive wires 115 intersect to define a plurality of sensing regions 116 .
  • thermosensitive wires 113 and a material of the transverse thermosensitive wires 115 are electrically connected to the control circuit unit 200 .
  • a material of the longitudinal thermosensitive wires 113 and a material of the transverse thermosensitive wires 115 are selected from the group consisting of at least one of copper, silver, nickel, platinum, a cobalt base alloy, a nickel base alloy, and a ferrous alloy.
  • the fingerprint identification unit 100 further includes a substrate 120 and an insulating layer 130 .
  • the first thermosensitive wire layer 112 and the second thermosensitive wire layer 114 are disposed on the substrate 120 .
  • the insulating layer 130 is disposed at an intersection of the longitudinal thermosensitive wires 113 and the transverse thermosensitive wires 115 .
  • the fingerprint identification unit 100 further includes a protective layer 140 disposed on the longitudinal thermosensitive wires 113 and the transverse thermosensitive wires 115 .
  • a resistance of the at least one thermosensitive wire layer 110 changes significantly with temperature. Because the at least one thermosensitive wire layer 110 changes with temperature, as illustrated in FIG. 4 , as a temperature of the at least one thermosensitive wire layer 110 rises, the resistance of the at least one thermosensitive wire layer 110 decreases. With this property, when a finger touches a surface of the fingerprint identification device 10 , there is a temperature difference at a contact surface of the fingerprint identification device 10 due to presence of a fingerprint peak and a fingerprint valley, thereby causing a resistance change of the at least one thermosensitive wire layer 110 . According to a resistance signal, the control circuit unit 200 in FIG. 1 converts into a graphic message.
  • a thermistor can sense a temperature change of 0.001 K at the lowest, and the test sensitivity is high.
  • a position of a grid line defined by the first thermosensitive wire layer 112 and the second thermosensitive wire layer 114 realizes positioning of a temperature change point.
  • an embodiment of the present disclosure further provides a fingerprint identification method 500 applied to the fingerprint identification device 10 .
  • the fingerprint identification method 500 includes: at a block 510 , sensing the fingerprint of the user's finger using the at least one thermosensitive wire layer 110 , at a block 520 , when the at least one thermosensitive wire layer 110 senses the fingerprint of the user's finger, using the at least one thermosensitive wire layer 110 to sense a temperature change and feedback, to the control circuit unit 200 , a resistance change, at a block 530 , using the control circuit unit 200 to determine a fingerprint pattern of the user's finger according to an amount of the resistance change and collect the fingerprint pattern, at a block 540 , matching the fingerprint pattern with a preset fingerprint pattern, and at a block 550 , if the fingerprint pattern and the preset fingerprint pattern match, it is determined that an identification of the fingerprint pattern is successful.
  • the user's finger touches a screen surface of the electronic device, and the at least one thermosensitive wire layer 110 senses a temperature change, and a resistance of the at least one thermosensitive wire layer 110 changes, and the resistance change fed back by the at least one thermosensitive wire layer 110 is processed by the control circuit unit 200 .
  • the control circuit unit 200 performs graphical deformation and correlates with current fingerprint patterns to implement unlocking or password service of the electronic device.
  • an embodiment of the present disclosure further provides a method 600 for manufacturing the fingerprint identification device 10 .
  • the method 600 for manufacturing the fingerprint identification device 10 includes: at a block 610 , providing the fingerprint identification unit 100 , wherein the fingerprint identification unit 100 includes the at least one thermosensitive wire layer 110 and is configured to sense a fingerprint of a user's finger through the at least one thermosensitive wire layer 110 , at a block 620 , forming the control circuit unit 200 at one side of the fingerprint identification unit 100 , wherein the control circuit unit 200 is electrically connected to the fingerprint identification unit 100 , and at a block 630 , forming the connection component 300 , wherein the connection component 300 connects the fingerprint identification unit 100 and the control circuit unit 200 .
  • the first thermosensitive wire layer 112 and the second thermosensitive wire layer 114 are formed on the substrate 120 .
  • the insulating layer 130 is disposed at an intersection of the first thermosensitive wire layer 112 and the second thermosensitive wire layer 114 for insulation protection.
  • the first thermosensitive wire layer 112 is formed on the substrate 120 , and a wire shape thereof is formed by a process such as plating, exposure, etching, or the like.
  • the insulating layer 130 is formed, and if an inorganic insulating film is used, a pattern can be formed by a process such as plating, exposure, etching, or the like. If an organic insulating film is used, the organic insulating film can be molded by exposure.
  • the second thermosensitive wire layer 114 is formed, and a wire pattern thereof is formed by a process such as plating, exposure, etching, or the like.
  • the protective layer 140 is formed, and an inorganic insulating film or an organic insulating film can also be used.
  • the substrate 120 may be a glass substrate, a ceramic substrate, a polyimide (PI) substrate, a polyethylene terephthalate (PET) substrate, or a cycloolefin polymer (COP) substrate or the like.
  • the substrate 120 may have transparent material or non-transparent material.
  • the substrate 120 having transparent material can be placed on a surface of a display screen of an electronic device, or the display screen itself can be used as the substrate 120 .
  • the above process can be used as a general process, but is not limited to the above process. It is also possible to produce a film pattern of the same performance by processes such as embossing, letterpress printing, and laser etching.
  • the embodiment of the present disclosure provides a fingerprint identification device that can be used independently or combined with a display screen of an electronic device to adapt to a full-screen design.
  • a fingerprint coordinate map is established by using a thermosensitive material, and a fingerprint position and shape are sensed by different temperatures of contact with the finger, thereby implementing the fingerprint identification technology.
  • fingerprint identification can realize fingerprint identification through at least one thermosensitive wire layer and can intuitively feedback sensitivity and precision of fingerprint graphics and fingerprint identification.
  • the manufacturing process thereof is simple, materials used thereof are easy to obtain, and the process operation thereof is convenient.
  • the fingerprint identification device can be attached to a target product (for example, an electronic device) as an external product, or can be made as a process layer inside the target product.

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
US16/342,213 2018-11-13 2019-03-19 Fingerprint identification device, fingerprint identification method, and method for manufacturing the fingerprint identification device Abandoned US20200302139A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811348779.0A CN109376685A (zh) 2018-11-13 2018-11-13 指纹识别装置、指纹识别方法及指纹识别装置的制造方法
PCT/CN2019/078627 WO2020098194A1 (zh) 2018-11-13 2019-03-19 指纹识别装置、指纹识别方法及指纹识别装置的制造方法

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CN109376685A (zh) * 2018-11-13 2019-02-22 武汉华星光电半导体显示技术有限公司 指纹识别装置、指纹识别方法及指纹识别装置的制造方法

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FR2755526B1 (fr) * 1996-11-05 1999-01-22 Thomson Csf Systeme de lecture d'empreintes digitales avec resistances de chauffage integrees
CN103530609B (zh) * 2013-10-11 2017-07-04 北京京东方光电科技有限公司 一种指纹识别元件、显示屏及显示装置
CN104751106B (zh) * 2013-12-30 2019-09-13 比亚迪股份有限公司 指纹传感器及指纹传感器的控制方法
CN103942534B (zh) * 2014-03-26 2017-08-25 南昌欧菲光科技有限公司 生物特征识别传感器及包含其的电子设备
CN104021371B (zh) * 2014-05-20 2018-04-06 南昌欧菲生物识别技术有限公司 电子设备
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CN109376685A (zh) * 2018-11-13 2019-02-22 武汉华星光电半导体显示技术有限公司 指纹识别装置、指纹识别方法及指纹识别装置的制造方法

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WO2020098194A1 (zh) 2020-05-22

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