WO2020098194A1 - 指纹识别装置、指纹识别方法及指纹识别装置的制造方法 - Google Patents

指纹识别装置、指纹识别方法及指纹识别装置的制造方法 Download PDF

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Publication number
WO2020098194A1
WO2020098194A1 PCT/CN2019/078627 CN2019078627W WO2020098194A1 WO 2020098194 A1 WO2020098194 A1 WO 2020098194A1 CN 2019078627 W CN2019078627 W CN 2019078627W WO 2020098194 A1 WO2020098194 A1 WO 2020098194A1
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Prior art keywords
heat
sensitive
fingerprint identification
fingerprint
wire
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PCT/CN2019/078627
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English (en)
French (fr)
Inventor
冯校亮
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武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/342,213 priority Critical patent/US20200302139A1/en
Publication of WO2020098194A1 publication Critical patent/WO2020098194A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a fingerprint identification device, a fingerprint identification method, and a method of manufacturing the fingerprint identification device.
  • fingerprint recognition devices have been more and more widely used in various electronic devices. If there is a smart phone with a fingerprint identification device, the user can use the fingerprint identification device to realize functions such as smart phone unlocking and fingerprint identification payment.
  • the fingerprint recognition device of the electronic device usually uses a push-type fingerprint sensor, for example, iPhone5s, iPhone6, iPhone6s and other mobile terminals of Apple Inc. of the United States.
  • a push-type fingerprint sensor for example, iPhone5s, iPhone6, iPhone6s and other mobile terminals of Apple Inc. of the United States.
  • new trends in fingerprint recognition technology have also appeared, such as being used in full screens and embedded in display screens.
  • the existing fingerprint recognition devices have certain defects and cannot meet higher requirements.
  • the fingerprint recognition device of the electronic device usually uses a push-type fingerprint sensor, for example, iPhone5s, iPhone6, iPhone6s and other mobile terminals of Apple Inc. of the United States.
  • a push-type fingerprint sensor for example, iPhone5s, iPhone6, iPhone6s and other mobile terminals of Apple Inc. of the United States.
  • new trends in fingerprint recognition technology have also appeared, such as being used in full screens and embedded in display screens.
  • the existing fingerprint recognition devices have certain defects and cannot meet higher requirements.
  • a fingerprint recognition device including:
  • a fingerprint recognition unit includes at least one heat-sensitive wire layer, and the fingerprint recognition unit is used to sense a fingerprint of a user's finger through the at least one heat-sensitive wire layer;
  • a control circuit unit provided on one side of the fingerprint identification unit and electrically connected to the fingerprint identification unit;
  • the at least one heat-sensitive wire layer includes a first heat-sensitive wire layer and a second heat-sensitive wire layer, the first heat-sensitive wire layer includes a plurality of longitudinal heat-sensitive wires, and the second heat-sensitive wire layer includes a plurality of A strip of lateral heat-sensitive wires, the longitudinal heat-sensitive wires and the lateral heat-sensitive wires are arranged crosswise to define a plurality of sensing areas;
  • both ends of the longitudinal heat-sensitive wire and both ends of the transverse heat-sensitive wire are electrically connected to the control circuit unit.
  • the material of the longitudinal thermal conductor and the material of the lateral thermal conductor are selected from at least one of copper, silver, nickel, platinum, cobalt-based, nickel-based, and iron-based .
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, the insulating layer It is arranged at the intersection of the longitudinal thermosensitive wire and the lateral thermosensitive wire.
  • the fingerprint identification unit further includes a protective layer, the protective layer is disposed on the longitudinal thermal conductor and the lateral thermal conductor.
  • This disclosure also provides a fingerprint recognition device, including:
  • a fingerprint recognition unit includes at least one heat-sensitive wire layer, and the fingerprint recognition unit is used to sense a fingerprint of a user's finger through the at least one heat-sensitive wire layer;
  • a control circuit unit provided on one side of the fingerprint identification unit and electrically connected to the fingerprint identification unit;
  • a connection component connects the fingerprint identification unit and the control circuit unit.
  • the at least one heat-sensitive wire layer includes a first heat-sensitive wire layer and a second heat-sensitive wire layer.
  • the first heat-sensitive wire layer includes a plurality of longitudinal heat-sensitive wires.
  • the second heat-sensitive wire layer includes a plurality of transverse heat-sensitive wires, and the longitudinal heat-sensitive wires and the transverse heat-sensitive wires are arranged crosswise to define a plurality of sensing areas.
  • the two ends of the longitudinal thermosensitive wire and the two ends of the lateral thermosensitive wire are electrically connected to the control circuit unit.
  • the material of the longitudinal thermal conductor and the material of the lateral thermal conductor are selected from at least one of copper, silver, nickel, platinum, cobalt-based, nickel-based, and iron-based .
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, the insulating layer It is arranged at the intersection of the longitudinal thermosensitive wire and the lateral thermosensitive wire.
  • the fingerprint identification unit further includes a protective layer, the protective layer is disposed on the longitudinal thermal conductor and the lateral thermal conductor.
  • the present disclosure also discloses a fingerprint identification method, which is applied to the fingerprint identification device as described above and includes:
  • thermosensitive wire layer Using the at least one thermosensitive wire layer to sense the fingerprint of the user's finger;
  • the at least one heat-sensitive wire layer senses the fingerprint of the user's finger
  • the at least one heat-sensitive wire layer is used to sense a change in temperature and feed back the change in resistance to the control circuit unit;
  • control circuit unit uses the control circuit unit to determine the fingerprint pattern of the user's finger according to the change amount of the resistance, and collect the fingerprint pattern
  • the at least one heat-sensitive wire layer includes a first heat-sensitive wire layer and a second heat-sensitive wire layer.
  • the first heat-sensitive wire layer includes a plurality of longitudinal heat-sensitive wires.
  • the second heat-sensitive wire layer includes a plurality of transverse heat-sensitive wires, and the longitudinal heat-sensitive wires and the transverse heat-sensitive wires are arranged crosswise to define a plurality of sensing areas.
  • the two ends of the longitudinal thermosensitive wire and the two ends of the lateral thermosensitive wire are electrically connected to the control circuit unit.
  • the material of the longitudinal thermal conductor and the material of the lateral thermal conductor are selected from at least one of copper, silver, nickel, platinum, cobalt-based, nickel-based, and iron-based .
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, the insulating layer It is arranged at the intersection of the longitudinal thermosensitive wire and the lateral thermosensitive wire.
  • the fingerprint identification unit further includes a protective layer, the protective layer is disposed on the longitudinal thermal conductor and the lateral thermal conductor.
  • the disclosure also provides a method for manufacturing a fingerprint identification device, including:
  • the fingerprint identification unit includes at least one thermosensitive wire layer and a fingerprint for sensing a user's finger through the at least one thermosensitive wire layer;
  • control circuit unit Forming a control circuit unit on one side of the fingerprint identification unit, the control circuit unit being electrically connected to the fingerprint identification unit;
  • a connection assembly is formed, which connects the fingerprint identification unit and the control circuit unit.
  • the at least one heat-sensitive wire layer includes a first heat-sensitive wire layer and a second heat-sensitive wire layer.
  • the first heat-sensitive wire layer includes a plurality of longitudinal heat-sensitive wires.
  • the second heat-sensitive wire layer includes a plurality of transverse heat-sensitive wires, and the longitudinal heat-sensitive wires and the transverse heat-sensitive wires are arranged crosswise to define a plurality of sensing areas.
  • the material of the longitudinal thermal conductor and the material of the lateral thermal conductor are selected from at least one of copper, silver, nickel, platinum, cobalt-based, nickel-based, and iron-based .
  • the fingerprint identification unit further includes a substrate and an insulating layer, the first thermosensitive wire layer and the second thermosensitive wire layer are disposed on the substrate, the insulating layer It is arranged at the intersection of the longitudinal thermosensitive wire and the lateral thermosensitive wire.
  • the fingerprint identification is implemented through at least one thermal wire layer, which can be intuitively feedback The sensitivity and precision of fingerprint graphics and fingerprint recognition.
  • FIG. 1 shows a schematic structural diagram of a fingerprint identification device according to an embodiment of the present disclosure
  • FIG. 2 shows a schematic structural diagram of a fingerprint identification unit according to an embodiment of the present disclosure
  • FIG. 3 shows a schematic structural diagram of a fingerprint recognition unit according to an embodiment of the present disclosure
  • thermosensitive wire layer 4 shows a schematic diagram of the resistance change of at least one thermosensitive wire layer according to an embodiment of the present disclosure as the temperature changes;
  • FIG. 5 shows a flow block diagram of a fingerprint identification method according to an embodiment of the present disclosure.
  • FIG. 6 shows a flow block diagram of a method of manufacturing a fingerprint identification device according to an embodiment of the disclosure.
  • a fingerprint recognition device 10 includes a fingerprint recognition unit 100, a control circuit unit 200, and a connection assembly 300.
  • the fingerprint recognition unit 100 includes at least one heat-sensitive wire layer 110.
  • the fingerprint recognition unit 100 is used to sense the fingerprint of the user's finger through at least one heat-sensitive wire layer 110.
  • the control circuit unit 200 is disposed on one side of the fingerprint recognition unit 100 and electrically connected to the fingerprint recognition unit 100.
  • the connection assembly 300 connects the fingerprint recognition unit 100 and the control circuit unit 200.
  • the fingerprint recognition device 10 of the embodiment of the present disclosure realizes fingerprint recognition through at least one heat-sensitive wire layer 110, the fingerprint pattern can be intuitively fed back, and the fingerprint recognition has high sensitivity and precision.
  • the electronic device includes the fingerprint recognition device 10.
  • control circuit unit 200 is, for example, an integrated circuit (integrated circuit, IC) unit, used to process fingerprint identification related signals and / or messages.
  • IC integrated circuit
  • At least one heat-sensitive wire layer 110 includes a first heat-sensitive wire layer 112 and a second heat-sensitive wire layer 114.
  • the first heat-sensitive wire layer 112 includes a plurality of longitudinal heat-sensitive wires 113
  • the second heat-sensitive wire layer 114 includes a plurality of lateral heat-sensitive wires 115.
  • the longitudinal heat-sensitive wires 113 and the transverse heat-sensitive wires 115 are arranged crosswise to form vertical and horizontal grid lines and define a plurality of sensing areas 116.
  • the two ends of the longitudinal heat-sensitive wire 113 and the two ends of the lateral heat-sensitive wire 115 are electrically connected to the control circuit unit 200.
  • the material of the longitudinal heat-sensitive wire 113 and the material of the lateral heat-sensitive wire 115 are selected from at least one of copper, silver, nickel, platinum, cobalt-based, nickel-based, and iron-based.
  • the fingerprint recognition unit 100 further includes a substrate 120 and an insulating layer 130.
  • the first heat-sensitive wire layer 112 and the second heat-sensitive wire layer 114 are disposed on the substrate 120.
  • the insulating layer 130 is provided at the intersection of the longitudinal heat-sensitive wire 113 and the lateral heat-sensitive wire 115.
  • the fingerprint recognition unit 100 further includes a protective layer 140.
  • the protective layer 140 is provided on the longitudinal heat-sensitive wire 113 and the lateral heat-sensitive wire 115.
  • the resistance of at least one thermistor layer 110 changes significantly with temperature.
  • the temperature of at least one thermosensitive wire layer 110 changes with temperature, its resistance will change.
  • the resistance of at least one thermosensitive wire layer 110 decreases .
  • the control circuit unit 200 in FIG. 1 is converted into a graphic message.
  • the thermistor can sense the temperature change of 0.001K at least, and the test sensitivity is high.
  • the position of the temperature change point can be achieved by the position of the grid line defined by the first thermistor layer 112 and the second thermistor layer 114.
  • an embodiment of the present disclosure further provides a fingerprint identification method 500, which is applied to the fingerprint identification device 10 and includes:
  • Block 510 using at least one thermosensitive wire layer 110 to sense the fingerprint of the user's finger,
  • Block 520 when at least one heat-sensitive wire layer 110 senses the fingerprint of the user's finger, at least one heat-sensitive wire layer 110 is used to sense the temperature change and feed back the change in resistance to the control circuit unit 200,
  • control circuit unit 200 is used to determine the fingerprint pattern of the user's finger according to the change in resistance, and collect the fingerprint pattern
  • Block 540 matching the fingerprint pattern with the preset fingerprint pattern
  • Block 550 if the fingerprint pattern matches the preset fingerprint pattern, it is determined that the fingerprint pattern recognition is successful.
  • At least one heat-sensitive wire layer 110 senses a temperature change, the resistance of at least one heat-sensitive wire layer 110 changes, and the resistance change feedback by at least one heat-sensitive wire layer 110 passes through the control circuit
  • the unit 200 processes and performs graphical deformation, and compares with the existing fingerprint pattern to realize unlocking or password service of the electronic device.
  • an embodiment of the present disclosure further provides a method 600 for manufacturing a fingerprint identification device 10, including:
  • the fingerprint recognition unit 100 includes at least one heat-sensitive wire layer 110 and a fingerprint for sensing a user's finger through the at least one heat-sensitive wire layer 110.
  • a control circuit unit 200 is formed on one side of the fingerprint recognition unit 100, the control circuit unit 200 is electrically connected to the fingerprint recognition unit 100, and
  • connection assembly 300 is formed, which connects the fingerprint recognition unit 100 and the control circuit unit 200.
  • the first heat-sensitive wire layer 112 and the second heat-sensitive wire layer 114 are formed on the substrate 120, and the first heat-sensitive wire layer 112 and the second An insulating layer 130 is provided at the intersection of the heat-sensitive wire layer 114 for insulation protection.
  • a first heat-sensitive wire layer 112 is formed on the substrate 120, and a wire shape is formed through processes such as coating, exposure, and etching.
  • the insulating layer 130 is formed, and if an inorganic insulating film is used, a pattern can be formed by coating, exposure, etching and other processes. If an organic insulating film is used, it can be formed only by exposure.
  • the second heat-sensitive wire layer 114 is formed, and a wire pattern is formed through processes such as coating, exposure, and etching.
  • the protective layer 140 is formed, and an inorganic insulating film or an organic insulating film can also be used.
  • the substrate 120 may be a glass substrate, a ceramic substrate, polyimide (polyimide, PI) substrate, polyethylene terephthalate (PET) substrate, cycloolefin polymer (cycloolefin) polymer, COP) substrate, etc.
  • the substrate 120 may be a transparent material or a non-transparent material.
  • the substrate 120 of transparent material may be placed on the surface of the display screen of the electronic device, or the display screen itself may be used as the substrate 120.
  • the above process can be used as a general process, but it is not limited to the above process.
  • Film patterns with the same effect can also be produced by processes such as embossing, relief printing, and laser etching.
  • the embodiments of the present disclosure propose a fingerprint identification device, which can be used independently or combined with a display screen of an electronic device to adapt to a full-screen design.
  • thermosensitive material is used to establish a fingerprint coordinate map, and the location and shape of the fingerprint are sensed by the temperature different from the contact with the finger, thereby implementing the fingerprint recognition technology.
  • the fingerprint identification is realized through at least one heat-sensitive wire layer, and the fingerprint pattern and the fingerprint identification can be intuitively fed back with high sensitivity and precision.
  • the manufacturing process is simple, the materials used are easy to obtain, and the process operation is convenient.
  • the fingerprint recognition device can be attached to the target product (such as an electronic device) as an external product, or can be manufactured as a process layer inside the target product.

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Abstract

一种指纹识别装置（10）、指纹识别方法以及指纹识别装置（10）的制造方法。指纹识别装置（10）包括指纹识别单元（100）、控制电路单元（200）以及连接组件（300）。指纹识别单元（100）包括至少一热敏导线层及用于通过至少一热敏导线层感测用户手指的指纹。控制电路单元（200）设置在指纹识别单元（100）的一侧以及电性连接指纹识别单元（100）。连接组件（300）连接指纹识别单元（100）和控制电路单元（200）。

Description

指纹识别装置、指纹识别方法及指纹识别装置的制造方法 技术领域
本揭示涉及显示技术领域，特别涉及一种指纹识别装置、指纹识别方法以及指纹识别装置的制造方法。
 背景技术
随着科技的发展，指纹识别装置已经越来越广泛地运用于各类电子设备。如现有设有指纹识别装置的智能手机，用户可通过指纹识别装置实现智能手机解锁及指纹识别支付等功能。
目前，电子设备的指纹识别装置通常采用按压式指纹传感器，例如，美国苹果公司的iPhone5s、iPhone6、iPhone6s等移动终端。随着技术的发展，指纹识别技术也出现了新的趋势，例如应用于全面屏及嵌入在显示屏内部等，现有的指纹识别装置存在一定的缺陷，无法满足更高的要求。
故，有需要提供一种指纹识别装置、指纹识别方法以及指纹识别装置的制造方法，以解决现有技术存在的问题。
 技术问题
目前，电子设备的指纹识别装置通常采用按压式指纹传感器，例如，美国苹果公司的iPhone5s、iPhone6、iPhone6s等移动终端。随着技术的发展，指纹识别技术也出现了新的趋势，例如应用于全面屏及嵌入在显示屏内部等，现有的指纹识别装置存在一定的缺陷，无法满足更高的要求。
 技术解决方案
为解决上述技术问题，本揭示提供一指纹识别装置，包括:
指纹识别单元，包括至少一热敏导线层，所述指纹识别单元用于通过所述至少一热敏导线层感测用户手指的指纹；
控制电路单元，设置在所述指纹识别单元的一侧以及电性连接所述指纹识别单元；以及
连接组件，连接所述指纹识别单元和所述控制电路单元；
其中所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域；
其中所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
于本揭示其中的一实施例中，所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
于本揭示其中的一实施例中，所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
于本揭示其中的一实施例中，所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
本揭示还提供一指纹识别装置，包括:
指纹识别单元，包括至少一热敏导线层，所述指纹识别单元用于通过所述至少一热敏导线层感测用户手指的指纹；
控制电路单元，设置在所述指纹识别单元的一侧以及电性连接所述指纹识别单元；以及
连接组件，连接所述指纹识别单元和所述控制电路单元。
于本揭示其中的一实施例中，所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
于本揭示其中的一实施例中，所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
于本揭示其中的一实施例中，所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
于本揭示其中的一实施例中，所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
于本揭示其中的一实施例中，所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
本揭示还一指纹识别方法，应用于如所述的指纹识别装置，包括:
使用所述至少一热敏导线层感测所述用户手指的所述指纹；
当所述至少一热敏导线层感测到所述用户手指的所述指纹时，使用所述至少一热敏导线层感应温度的变化并反馈电阻的变化量给所述控制电路单元；
使用所述控制电路单元根据所述电阻的变化量而判断出所述用户手指的指纹图形，并采集所述指纹图形；
将所述指纹图形与预设指纹图形进行匹配；以及
如果所述指纹图形和所述预设指纹图形匹配，则判断所述指纹图形识别成功。
于本揭示其中的一实施例中，所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
于本揭示其中的一实施例中，所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
于本揭示其中的一实施例中，所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
于本揭示其中的一实施例中，所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
于本揭示其中的一实施例中，所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
本揭示还提供一指纹识别装置的制造方法，包括:
提供指纹识别单元，所述指纹识别单元包括至少一热敏导线层及用于通过所述至少一热敏导线层感测用户手指的指纹；
在所述指纹识别单元的一侧形成控制电路单元，所述控制电路单元电性连接所述指纹识别单元；以及
形成连接组件，所述连接组件连接所述指纹识别单元和所述控制电路单元。
于本揭示其中的一实施例中，所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
于本揭示其中的一实施例中，所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
于本揭示其中的一实施例中，所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
 有益效果
相较于现有技术，为解决上述技术问题，由于本揭示的实施例的指纹识别装置、指纹识别方法以及指纹识别装置的制造方法，通过至少一热敏导线层实现指纹识别，可以直观反馈出指纹图形、指纹识别的灵敏度高及精准。
 附图说明
图1显示根据本揭示的一实施例的指纹识别装置的结构示意图；
图2显示根据本揭示的一实施例的指纹识别单元的结构示意图；
图3显示根据本揭示的一实施例的指纹识别单元的结构示意图；
图4显示根据本揭示的一实施例的至少一热敏导线层随着温度的变化，其电阻变化的示意图；
图5显示根据本揭示的一实施例的指纹识别方法的流程方块图；以及
图6显示根据本揭示的一实施例的指纹识别装置的制造方法的流程方块图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本揭示可用以实施的特定实施例。
为了让本揭示的上述及其他目的、特征、优点能更明显易懂，下文将特举本揭示优选实施例，并配合所附图式，作详细说明如下。再者，本揭示所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧层、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。
在图中，结构相似的单元是以相同标号表示。
参照图1-2，本揭示的一实施例的指纹识别装置10包括指纹识别单元100、控制电路单元200以及连接组件300。指纹识别单元100包括至少一热敏导线层110。指纹识别单元100用于通过至少一热敏导线层110感测用户手指的指纹。控制电路单元200设置在指纹识别单元100的一侧以及电性连接指纹识别单元100。连接组件300连接指纹识别单元100和控制电路单元200。
由于本揭示的实施例的指纹识别装置10通过至少一热敏导线层110实现指纹识别，可以直观反馈出指纹图形、指纹识别的灵敏度高及精准。
具体地，电子设备包括指纹识别装置10。
具体地，控制电路单元200例如为集成电路(integrated circuit, IC)单元，用来处理指纹识别相关信号及或讯息。
参照图1-3，具体地，至少一热敏导线层110包括第一热敏导线层112及第二热敏导线层114。第一热敏导线层112包括多条纵向热敏导线113，第二热敏导线层114包括多条横向热敏导线115。纵向热敏导线113和横向热敏导线115交叉设置以形成纵横网格线及定义出多个感应区域116。
具体地，纵向热敏导线113的两端和横向热敏导线115的两端电性连接控制电路单元200。纵向热敏导线113的材料和横向热敏导线115的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
具体地，指纹识别单元100还包括基板120及绝缘层130。第一热敏导线层112和第二热敏导线层114设置于基板120上。绝缘层130设置于纵向热敏导线113和横向热敏导线115的交点处。指纹识别单元100还包括保护层140。保护层140设置于纵向热敏导线113和横向热敏导线115上。
参照图1-4，具体地，至少一热敏导线层110的电阻随着温度的变化而有显着变化。由于至少一热敏导线层110随着温度的变化，其电阻会有所变化，如图4所示，随着至少一热敏导线层110的温度上升，至少一热敏导线层110的电阻下降。利用这个属性，当手指接触到指纹识别装置10的表面时，由于指纹峰和指纹谷的存在，使得在指纹识别装置10的接触表面会有温差，从而引起至少一热敏导线层110的电阻变化，根据电阻讯号，由图1中的控制电路单元200转换为图形讯息。热敏电阻最低可以感测到0.001K的温度变化，测试灵敏高，通过第一热敏导线层112和第二热敏导线层114所定义的网格线位置，从而实现温度变化点的定位。
参照图5，本揭示的实施例还提供一指纹识别方法500，应用于所述的指纹识别装置10，包括:
方块510，使用至少一热敏导线层110感测用户手指的指纹，
方块520，当至少一热敏导线层110感测到用户手指的指纹时，使用至少一热敏导线层110感应温度的变化并反馈电阻的变化量给控制电路单元200，
方块530，使用控制电路单元200根据电阻的变化量而判断出用户手指的指纹图形，并采集指纹图形，
方块540，将指纹图形与预设指纹图形进行匹配，以及
方块550，如果指纹图形和预设指纹图形匹配，则判断指纹图形识别成功。
具体地，用户手指触摸电子设备的屏幕表面，至少一热敏导线层110感应到温度变化，至少一热敏导线层110的电阻发生变化，至少一热敏导线层110反馈的电阻变化通过控制电路单元200处理，进行图形化变形，与已有指纹图案进行相关对比，从而实现电子设备的解锁或密码服务。
参照图1及图6，本揭示的实施例还提供一指纹识别装置10的制造方法600，包括:
方块610，提供指纹识别单元100，所述指纹识别单元100包括至少一热敏导线层110及用于通过至少一热敏导线层110感测用户手指的指纹，
方块620，在指纹识别单元100的一侧形成控制电路单元200，控制电路单元200电性连接指纹识别单元100，以及
方块630，形成连接组件300，连接组件300连接指纹识别单元100和控制电路单元200。
具体地，参照图2及图3，在本揭示的实施例中，在基板120上制作第一热敏导线层112和第二热敏导线层114，在第一热敏导线层112和第二热敏导线层114交点处有绝缘层130，做绝缘保护用。
具体地，首先在基板120上制作第一热敏导线层112，通过镀膜、曝光、蚀刻等工艺形成导线形状。之后，制作绝缘层130，如果采用无机绝缘膜可通过镀膜、曝光、蚀刻等工艺形成图形。如果采用有机绝缘膜，则只需曝光即可成型。之后，制作第二热敏导线层114，通过镀膜、曝光、蚀刻等工艺形成导线图案。之后，制作保护层140，同样可以采用无机绝缘膜或有机绝缘膜。
具体地，基板120可以是玻璃基板、陶瓷基板、聚酰亚胺(polyimide, PI)基板、聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)基板、环烯烃聚合物(cycloolefin polymer, COP)基板等。基板120可以是透明材质，也可以是非透明材质。透明材质的基板120可以放置于电子设备的显示屏表面，也可以显示屏本身作为基板120。
以上工艺可做为通用工艺，但又不局限于以上工艺。也可以通过压印、凸版印刷、激光蚀刻等工艺均可制作同等效果的膜层图案。
本揭示的实施例提出指纹识别装置，可以独立使用，也可以与电子设备的显示屏结合在一起，适应全屏化设计。
本揭示的实施例，采用热敏材料建立指纹坐标地图，通过与手指接触所受到的温度不同而感知指纹位置和形状，以此来实现指纹识别技术。
由于本揭示的实施例的指纹识别装置、指纹识别方法以及指纹识别装置的制造方法，通过至少一热敏导线层实现指纹识别，可以直观反馈出指纹图形、指纹识别的灵敏度高及精准。此外，制作工艺简单，所使用材料容易取得，便于工艺操作。指纹识别装置可以作为外挂产品贴附于目标产品(例如电子设备)上，也可以作为工艺层制作在目标产品的内部。
尽管已经相对于一个或多个实现方式示出并描述了本揭示，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本揭示包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能（例如其在功能上是等价的）的任意组件（除非另外指示），即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外，尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开，但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且，就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言，这样的术语旨在以与术语“包含”相似的方式包括。
以上仅是本揭示的优选实施方式，应当指出，对于本领域普通技术人员，在不脱离本揭示原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本揭示的保护范围。

Claims (20)

  1. 一种指纹识别装置，包括:
    指纹识别单元，包括至少一热敏导线层，所述指纹识别单元用于通过所述至少一热敏导线层感测用户手指的指纹；
    控制电路单元，设置在所述指纹识别单元的一侧以及电性连接所述指纹识别单元；以及
    连接组件，连接所述指纹识别单元和所述控制电路单元；
    其中所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域；
    其中所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
  2. 如权利要求1所述的指纹识别装置，其中所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
  3. 如权利要求1所述的指纹识别装置，其中所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
  4. 如权利要求3所述的指纹识别装置，其中所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
  5. 一种指纹识别装置，包括:
    指纹识别单元，包括至少一热敏导线层，所述指纹识别单元用于通过所述至少一热敏导线层感测用户手指的指纹；
    控制电路单元，设置在所述指纹识别单元的一侧以及电性连接所述指纹识别单元；以及
    连接组件，连接所述指纹识别单元和所述控制电路单元。
  6. 如权利要求5所述的指纹识别装置，其中所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
  7. 如权利要求6所述的指纹识别装置，其中所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
  8. 如权利要求6所述的指纹识别装置，其中所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
  9. 如权利要求6所述的指纹识别装置，其中所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
  10. 如权利要求9所述的指纹识别装置，其中所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
  11.      一种指纹识别方法，应用于如权利要求1所述的指纹识别装置，包括:
    使用所述至少一热敏导线层感测所述用户手指的所述指纹；
    当所述至少一热敏导线层感测到所述用户手指的所述指纹时，使用所述至少一热敏导线层感应温度的变化并反馈电阻的变化量给所述控制电路单元；
    使用所述控制电路单元根据所述电阻的变化量而判断出所述用户手指的指纹图形，并采集所述指纹图形；
    将所述指纹图形与预设指纹图形进行匹配；以及
    如果所述指纹图形和所述预设指纹图形匹配，则判断所述指纹图形识别成功。
  12. 如权利要求11所述的指纹识别方法，其中所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
  13. 如权利要求12所述的指纹识别方法，其中所述纵向热敏导线的两端和所述横向热敏导线的两端电性连接所述控制电路单元。
  14. 如权利要求12所述的指纹识别方法，其中所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
  15. 如权利要求12所述的指纹识别方法，其中所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
  16. 如权利要求15所述的指纹识别方法，其中所述指纹识别单元还包括保护层，所述保护层设置于所述纵向热敏导线和所述横向热敏导线上。
  17.     一种指纹识别装置的制造方法，包括:
    提供指纹识别单元，所述指纹识别单元包括至少一热敏导线层及用于通过所述至少一热敏导线层感测用户手指的指纹；
    在所述指纹识别单元的一侧形成控制电路单元，所述控制电路单元电性连接所述指纹识别单元；以及
    形成连接组件，所述连接组件连接所述指纹识别单元和所述控制电路单元。
  18. 如权利要求17所述的指纹识别装置的制造方法，其中所述至少一热敏导线层包括第一热敏导线层及第二热敏导线层，所述第一热敏导线层包括多条纵向热敏导线，所述第二热敏导线层包括多条横向热敏导线，所述纵向热敏导线和所述横向热敏导线交叉设置以定义出多个感应区域。
  19. 如权利要求18所述的指纹识别装置的制造方法，其中所述纵向热敏导线的材料和所述横向热敏导线的材料选自铜、银、镍、铂、钴基、镍基以及铁基中的至少一种。
  20. 如权利要求18所述的指纹识别装置的制造方法，其中所述指纹识别单元还包括基板及绝缘层，所述第一热敏导线层和所述第二热敏导线层设置于所述基板上，所述绝缘层设置于所述纵向热敏导线和所述横向热敏导线的交点处。
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