US20200148563A1 - Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water - Google Patents

Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water Download PDF

Info

Publication number
US20200148563A1
US20200148563A1 US16/739,071 US202016739071A US2020148563A1 US 20200148563 A1 US20200148563 A1 US 20200148563A1 US 202016739071 A US202016739071 A US 202016739071A US 2020148563 A1 US2020148563 A1 US 2020148563A1
Authority
US
United States
Prior art keywords
water
persulfate
fluidly connected
reactor vessel
organic carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/739,071
Inventor
Steve D. Sitkiewitz
Gary M. Carmignani
Lee W. Frederick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evoqua Water Technologies LLC
Original Assignee
Evoqua Water Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2007/070416 external-priority patent/WO2007146671A2/en
Application filed by Evoqua Water Technologies LLC filed Critical Evoqua Water Technologies LLC
Priority to US16/739,071 priority Critical patent/US20200148563A1/en
Publication of US20200148563A1 publication Critical patent/US20200148563A1/en
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EVOQUA WATER TECHNOLOGIES LLC, NEPTUNE BENSON, INC.
Priority to US17/461,262 priority patent/US20210387878A1/en
Assigned to EVOQUA WATER TECHNOLOGIES LLC, NEPTUNE BENSON, INC. reassignment EVOQUA WATER TECHNOLOGIES LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK N.A., AS COLLATERAL AGENT
Abandoned legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/722Oxidation by peroxides
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/30Treatment of water, waste water, or sewage by irradiation
    • C02F1/32Treatment of water, waste water, or sewage by irradiation with ultraviolet light
    • C02F1/325Irradiation devices or lamp constructions
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/20Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/42Treatment of water, waste water, or sewage by ion-exchange
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/44Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • C02F1/441Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by reverse osmosis
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/44Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • C02F1/444Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/46Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/469Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
    • C02F1/4693Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis electrodialysis
    • C02F1/4695Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis electrodialysis electrodeionisation
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/66Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02Non-contaminated water, e.g. for industrial water supply
    • C02F2103/04Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/001Upstream control, i.e. monitoring for predictive control
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/003Downstream control, i.e. outlet monitoring, e.g. to check the treating agents, such as halogens or ozone, leaving the process
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/20Total organic carbon [TOC]

Definitions

  • the present disclosure generally relates to a process for the purification of water used in semiconductor manufacturing. More specifically, the present disclosure relates to a process that uses ultraviolet activated persulfate to decompose organic compounds in both pure and spent process water streams in semiconductor manufacturing facilities.
  • U.S. Pat. No. 5,571,419 discloses a method of producing Ultra Pure Water (UPW) having a low concentration of organic matter.
  • the purification method requires the following process for the water to be treated: (1) pH adjustment to less than 4.5, (2) addition of an oxidizing agent (such as a persulfate salt), (3) heating of the water to preferably a minimum of 110° C. and more preferably to 120° to 170° C., and (4) cooling the water to the temperature required for use.
  • an oxidizing agent such as a persulfate salt
  • the present disclosure describes UV activation of persulfate salt to produce high oxidation potential radicals at ambient temperature, in non-pH adjusted water to purify UPW prior to discharge from the Point of Distribution (POD), prior to the Point of Connection (POC) (typically labeled as the Point of Use or POU), and to purify spent UPW for reuse on a continuous basis.
  • POD Point of Distribution
  • POC Point of Connection
  • This disclosure is a process used for the decomposition of carbon-containing compounds in water.
  • This process reduces total organic carbon (TOC) in water through the addition of a persulfate salt upstream of an ultraviolet light source.
  • the ultraviolet light is absorbed by the persulfate—converting the persulfate into sulfate radicals.
  • the sulfate radicals oxidize TOC, converting the contributing compounds into CO 2 and mineral salts.
  • This disclosure describes the use of the UV/persulfate oxidation process for the purification of water used in semiconductor manufacturing and the production of UPW in general.
  • the process uses a standard photochemical reactor either a plug flow (PFR) or a stirred tank (CSTR) or a combination of both.
  • PFR plug flow
  • CSTR stirred tank
  • the most cost-effective design is expected to be a CSTR with immersed UV lamps.
  • Multiple reactors can be used in series to improve reagent utilization.
  • a method of reducing TOC in semiconductor process water is disclosed.
  • FIG. 1A is a schematic view of an advanced oxidation system in accordance with one or more embodiments
  • FIG. 1B is a block schematic diagram of a semiconductor industry UPW system showing possible locations in which the advanced oxidation system could be employed in accordance with one or more embodiments;
  • FIG. 2 is a graph showing the absorption spectrum for aqueous persulfate
  • FIG. 3 is a graph showing the effect of urea concentration on decomposition performance for plug flow reactor, with persulfate at 0.5 ppm and a 0.9 minute residence time;
  • FIG. 4 is a graph showing the results of a simulated pilot test of the system to treat spent rinse water in accordance with one or more embodiments.
  • FIG. 1A is a schematic view showing the elements comprising the UV activated oxidation process for reducing organic carbon in semiconductor process water, generally denominated AOP 100 herein.
  • TOC decomposition performance is controlled by the size of the reaction vessel, the intensity and amount of UV light used, and the amount of persulfate injected.
  • the system configuration includes a source of untreated water 110 , which is fed into a chemical reactor vessel 120 through one or more fluid inlets 130 .
  • Persulfate from a persulfate anion addition system 140 is also fed into the reactor vessel, the system including a persulfate feed tank 150 , a fluid inlet 160 , and a feed pump 170 .
  • One or more UV lights 180 , 190 are disposed within the vessel enclosure, as is a chemical solution mixer 200 .
  • the reactor vessel may be a continuous-stirred tank reactor (CSTR). This keeps down cost and increases system simplicity. However, a plug flow reactor (PFR) may be preferred in situations where space (system footprint) is at a premium. Alternatively, a CSTR can be used in series with a PFR 210 having UV lights 220 to increase system efficacy.
  • CSTR continuous-stirred tank reactor
  • the treated water is discharged either directly (in the case of a single reactor system) through one or more discharge outlets 230 for further use, or into the PFR for further treatment and subsequent discharge from a terminal discharge outlet 240 .
  • the treated water 250 is sampled at discharge by a TOC analyzer 260 , which adjusts and controls the persulfate feed pump 170 according to the needs of the system.
  • FIG. 1B shows AOP 100 implementation in a typical semiconductor UPW production system 470 when employed in the production of UPW prior to the POD 360 and also prior to the POC 380 to produce ultra low level TOC (i.e. ⁇ POD level) for critical POU usage 390 .
  • FIG. 1B also shows AOP 100 implementation when employed in the purification of spent UPW 440 from semiconductor fabrication.
  • Treated reuse UPW 460 can be blended with raw feed water 270 to produce the required blended feed flow 280 to the UPW production system 470 .
  • the treated reuse UPW 460 can be blended with UPW at any point within the UPW production system 470 .
  • the Pretreatment System treats the blended feed flow by combining various technologies, as required, for suspended solids reduction, initial organic compound reduction, chlorine removal and pH adjustment to produce feed water 300 with the proper characteristics for efficient production of UPW in the Make-Up System 310 .
  • the Make-Up System process typically includes Heat Exchange (HX), Ultra-Filtration (UF), Membrane Filtration (MF), 1 st Pass Reverse Osmosis (RO), 2 nd Pass RO, Electro-deionization (EDI), Ion Exchange (IX), Membrane De-Aeration (MD-A) or Vacuum De-Aeration (VD-A), and UV Sterilization (UV) to produce the required Make-Up water quality 320 with a flow equal or greater than the total average usage at the POU ( 370 plus 390 ).
  • Make-Up water stored in DI Storage 330 provides limited backup when the Make-Up System is out of service or when the average POU UPW usage exceeds the capacity of the Make-Up System.
  • UPW from DI Storage is pumped 340 through the Polish System 350 at a flow rate greater than UPW peak usage at the combined POU.
  • UPW in the Polish System is purified using HX, EDI, IX, UV, MF, and UF to produce UPW per POD 360 quality specifications as required at the non-critical POU 370 .
  • Certain critical fab processes 390 such as photolithography, require UPW with an impurity level less than produced at the POD 360 .
  • POU System(s) 410 are installed at the POC(s) to the critical fab process(es).
  • the POU System can include HX, RO, EDI, IX, MD-A, pressure control, UV, MF, and UF, as required to meet fab-specific UPW specifications at the POC(s).
  • the sum of non-critical and critical fab UPW usage equals the combined fab UPW usage.
  • UPW not used at the combined POU is returned 400 to DI Storage.
  • Certain fab UPW usage produces spent UPW water not economically suitable for reuse 420 (due to high levels of suspended solids, chemicals, etc.) that is sent to waste treatment.
  • Most spent UPW 430 is primarily contaminated with TOC that can be purified in a Reuse System 440 and forwarded 460 for blending with raw feedwater 270 . Water not meeting specifications for blending 450 is sent to waste treatment.
  • the AOP 100 can be employed at any point in the UPW production system 470 , consisting of the Pretreatment System, the Make-Up System, the DI Storage, and the Polish System.
  • the AOP 100 in the UPW production system 470 may be located on the product stream of the 1 st Pass RO. At this point the feedwater to the AOP 100 has significantly reduced levels of suspended solids, ionized solids, microorganisms, and TOC, all of which enhance the performance of the AOP 100 .
  • the TOC in the AOP 100 product should be controlled so that the TOC at the POD 360 and non-critical POU 370 is less than specification.
  • Product water from AOP 100 is directed to following unit processes in the UPW production system 470 , where oxidation products from the AOP process are removed.
  • the AOP 100 can be employed at any point between the POD 360 and the POC 380 to critical POU 390 to reduce TOC to the specification required by POU 390 . Additional unit processes, similar to those found in the UPW production system 470 may be employed to remove oxidation products produced in the AOP 100 , or to meet other specifications for the POU 390 not achieved with UPW delivered from the POD 360 .
  • the AOP 100 can be employed in the Reuse System 440 to reduce TOC in segregated, spent UPW 430 to produce Reuse UPW 460 suitable for reuse in the UPW System or for other uses. Suspended solids reduction in the reuse feedwater 430 using MF or UF may be employed to improve the efficiency of the AOP 100 . Ionized solids reduction using RO, EDI, or IX in part of, or all of the Reuse UPW 460 may be employed to meet use specifications of the Reuse UPW.
  • a feed forward signal to the persulfate addition system may be supplied by a TOC analyzer disposed on the inlet end of the water to be treated.
  • the performance of the reactor is a function of the following design parameters: (1) residence time; (2) reactor radius (light path length); (3) lamp linear energy density; (4) energy wavelength; (5) persulfate concentration; and, (6) TOC composition and concentration.
  • the reactor design is selected after determining the amount of persulfate that needs to decompose to effect the required TOC decomposition.
  • the persulfate decomposition fraction and addition rate is established by optimizing the design parameters for capital cost, operating cost and available footprint.
  • Increasing the reactor radius increases the residence time and increases the distance between the lamps and the reactor walls.
  • the incremental reactor volume further from the lamps is less effective for persulfate decomposition due to lower photon flux.
  • the effect of increased reactor radius is then a function of the effective absorption of the water. If the water absorbs little of the light, then increasing the reactor radius has a larger impact on performance.
  • the residence time varies as a square of the radius, but because the view factor scales inversely with the distance from the lamp, photon flux varies as 1/r. Accordingly, if UV power is relatively more expensive than tank size, the tank radius should be set so that little UV light reaches the tank walls.
  • the effect of light energy input, or linear energy density of the lamp, is also straightforward. As more light is added to the reactor more persulfate will be decomposed. The amount of persulfate decomposed generally scales linearly with energy input. Energy input can be varied by changing the number of lamps used and the choice of lamp. For example, a standard low pressure mercury lamp, used for both photolysis and biological control, has a 254 nm output of about 0.2 W/cm. Amalgam lamps are available that give 0.4 and 0.6 W/cm. And medium pressure mercury lamps typically give 15 W/cm in the 200-260 nm range.
  • FIG. 2 graphically shows the absorption spectrum 500 for aqueous persulfate.
  • persulfate absorbs a larger fraction of light as the wavelength is reduced.
  • At 254 nm very little of the light is absorbed.
  • Using 220 nm light would result in much more light absorption for a given path-length.
  • Adjusting the UV to a wavelength where persulfate absorbs stronger improves performance in situations where some fraction of the light is not absorbed before reaching the reactor vessel wall. The extra absorbed light translates directly to more persulfate decomposed and improved performance.
  • a lower limit on wavelength is set by the water absorption of photons which occurs strongly below ⁇ 190 nm.
  • the TOC decomposition performance depends on the feed rate of persulfate.
  • the amount of persulfate required for a given performance depends on: (a) specific chemicals contributing to TOC; (b) concentration of these chemicals; and (c) TOC decomposition performance required.
  • the amount of persulfate needed is also affected if there are other chemicals in the water that absorb UV (lowering the effective quantum efficiency of persulfate degradation) or that are oxidized by sulfate radicals (thus competing with TOC for sulfate radicals.) Generally, cleaner water allows for more efficient TOC control.
  • Tests indicate that for a given target chemical the absolute reaction rate is low order in the target chemical concentration.
  • a given persulfate feed rate and UV power generates a number of radicals which, over a narrow target chemical concentration, decompose a fixed amount of the target compound independent of the concentration of the target compound.
  • FIG. 3 graphically shows the effect of urea concentration on performance for a fixed residence time and persulfate feed rate 600 .
  • the data were generated using a plug flow reactor with a 254 nm lamp. The data show that the absolute amount of urea decomposed at 10 ppb was only twice that decomposed at 2 ppb. As with other AOPs, some oxidant-to-target molar ratio will be required to achieve a required performance. This affect contrasts with many chemical processes where the reaction rate scales proportionally to the target chemical concentration.
  • the results 700 of the pilot study are summarized as FIG. 4 .
  • the results can be organized by the three IPA concentrations examined. Note that there is a difference between IPA concentration and TOC concentration; IPA is only 60% carbon so 1.5 ppm IPA is equivalent to 915 ppb TOC.
  • Moderate IPA Tests The relationship between persulfate addition and IPA decomposition is also linear at the moderate TA concentration (2.4 ppm) tested. Nearly 100% decomposition is achieved using 200 ppm persulfate using the 20 minute residence time CSTR. The additive requirements are increased somewhat when the residence time of the CSTR is decreased to 15 minutes.
  • the disclosure herein shows that a system directed to treating semiconductor process water to reduce total organic compounds in the water.
  • the system includes a chemical reactor vessel and a persulfate anion addition system upstream of the chemical reactor vessel, and employs light energy to oxidize the aqueous persulfate. It may be used to treat pure water for semiconductor manufacturing, and to decompose TOC to less than 5 ppb, or to below 1 ppb. However, it may also be employed to treat semiconductor-manufacturing wastewater, and in such an implementation, it is used to decompose TOC to a concentration sufficiently low to allow reuse of the water.
  • the persulfate feed rate is controlled by a TOC analyzer based on a feed back signal from effluent TOC analysis. Alternatively, it may be controlled by a feed forward signal from analysis of the TOC in the untreated feed water. In yet another alternative, it may be controlled by both.
  • a method for treating semiconductor process water to reduce total organic compounds comprises the steps of (1) providing a source of semiconductor manufacturing water with a TOC concentration higher than required for ultrapure uses; (2) mixing aqueous persulfate anions with the semiconductor manufacturing water in a chemical reactor vessel; (3) exposing the persulfate anion and water mixture to ultraviolet light for a predetermined residence time; and (4) discharging the treated water for further treatment required for ultrahigh purity uses.
  • the method may be used when the semiconductor manufacturing water is pure water, and the process may be employed to decompose TOC to less than 5 ppb, or to less than 1 ppb.
  • the method may be used in treating semiconductor manufacturing waste water, and the process is used to decompose TOC to a concentration sufficiently low to allow reuse of the water, and further processing may be effected to remove dissolved solids and dissolved gases.
  • the introduction of persulfate into the reaction vessel may be controlled using either a feed back signal from effluent TOC analysis, or a feed forward signal from analysis of the TOC in the untreated feed water, or both.
  • the TOC analyzer would be disposed between the source of water to be treated and the chemical reactor vessel, and in the latter, the TOC analyzer would be disposed anywhere downstream of the chemical reactor vessel, including on the discharge outlet itself or anywhere prior to the point of use or re-use.

Abstract

In a system for decomposing organic compounds in water for use in semiconductor manufacturing, a chemical reactor vessel having a fluid inlet and a fluid outlet, a persulfate anion addition system upstream of the reactor vessel, and a light emitting device contained within the reactor vessel. The light emitting device provides light capable of decomposing persulfate anions.

Description

    RELATED APPLICATIONS
  • This application is a continuation-in-part of pending U.S. patent application Ser. No. 12/303,596, filed Dec. 5, 2008, and titled ULTRAVIOLET LIGHT ACTIVATED OXIDATION PROCESS FOR THE REDUCTION OF ORGANIC CARBON IN SEMICONDUCTOR PROCESS WATER, which patent application is a national stage entry under 35 U.S.C. § 371 of PCT/US07/70416 filed Jun. 5, 2007, and titled ULTRAVIOLET LIGHT ACTIVATED OXIDATION PROCESS FOR THE REDUCTION OF ORGANIC CARBON IN SEMICONDUCTOR PROCESS WATER which claims priority to U.S. Provisional Application Ser. No. 60/811,220 filed Jun. 6, 2006, and titled ULTRAVIOLET LIGHT ACTIVATED OXIDATION PROCESS FOR THE REDUCTION OF TOTAL ORGANIC CARBON IN ULTRAPURE WATER, which patent applications are hereby incorporated herein by reference in their entireties for all purposes.
  • FIELD OF THE DISCLOSURE
  • The present disclosure generally relates to a process for the purification of water used in semiconductor manufacturing. More specifically, the present disclosure relates to a process that uses ultraviolet activated persulfate to decompose organic compounds in both pure and spent process water streams in semiconductor manufacturing facilities.
  • BACKGROUND
  • Reducing TOC in water using ultraviolet light activated aqueous persulfate is known. It is an established method of decomposing organic compounds in water and is discussed in, for instance, U.S. Pat. No. 4,277,438, to Ejzak, which teaches a batch process of preparing water samples for the measurement of TOC by: (1) persulfate addition, (2) irradiation with an extreme dose of UV (which also heats the sample) to activate the persulfate to oxidize any TOC to carbon dioxide and water. U.S. Pat. No. 5,443,991, by Godec et al, teaches a similar method.
  • U.S. Pat. No. 5,571,419, to Obata et al, discloses a method of producing Ultra Pure Water (UPW) having a low concentration of organic matter. The purification method requires the following process for the water to be treated: (1) pH adjustment to less than 4.5, (2) addition of an oxidizing agent (such as a persulfate salt), (3) heating of the water to preferably a minimum of 110° C. and more preferably to 120° to 170° C., and (4) cooling the water to the temperature required for use.
  • The prior art also includes references showing an advanced oxidation process to destroy organic compounds in wastewater, including U.S. Pat. No. 5,762,808, to Peyton, and U.S. Pat. No. 6,096,283 to Cooper et al.
  • However, despite improvements in this technology, there remains a need for an improved method of producing a reliable, continuous source of low TOC UPW for the semiconductor industry and other industries that require ultrapure water with controlled total organic carbon. The present disclosure describes UV activation of persulfate salt to produce high oxidation potential radicals at ambient temperature, in non-pH adjusted water to purify UPW prior to discharge from the Point of Distribution (POD), prior to the Point of Connection (POC) (typically labeled as the Point of Use or POU), and to purify spent UPW for reuse on a continuous basis.
  • SUMMARY
  • This disclosure is a process used for the decomposition of carbon-containing compounds in water. This process reduces total organic carbon (TOC) in water through the addition of a persulfate salt upstream of an ultraviolet light source. The ultraviolet light is absorbed by the persulfate—converting the persulfate into sulfate radicals. The sulfate radicals oxidize TOC, converting the contributing compounds into CO2 and mineral salts.
  • This disclosure describes the use of the UV/persulfate oxidation process for the purification of water used in semiconductor manufacturing and the production of UPW in general.
  • The process uses a standard photochemical reactor either a plug flow (PFR) or a stirred tank (CSTR) or a combination of both. The most cost-effective design is expected to be a CSTR with immersed UV lamps. Multiple reactors can be used in series to improve reagent utilization.
  • A method of reducing TOC in semiconductor process water is disclosed.
  • Other features of the disclosure, regarding organization and method of operation, together with further objects and advantages thereof will be better understood from the following description considered in connection with the accompanying drawings, in which embodiments of the disclosure are illustrated by way of example. It is to be expressly understood, however, that the drawings are for illustration and description only and are not intended as a definition of the limits of the disclosure. The various features of the disclosure are pointed out with particularity in the claims annexed to and forming part of this disclosure.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The disclosure will be better understood and objects other than those set forth above will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein:
  • FIG. 1A is a schematic view of an advanced oxidation system in accordance with one or more embodiments;
  • FIG. 1B is a block schematic diagram of a semiconductor industry UPW system showing possible locations in which the advanced oxidation system could be employed in accordance with one or more embodiments;
  • FIG. 2 is a graph showing the absorption spectrum for aqueous persulfate;
  • FIG. 3 is a graph showing the effect of urea concentration on decomposition performance for plug flow reactor, with persulfate at 0.5 ppm and a 0.9 minute residence time; and
  • FIG. 4 is a graph showing the results of a simulated pilot test of the system to treat spent rinse water in accordance with one or more embodiments.
  • DETAILED DESCRIPTION
  • Referring to FIGS. 1 through 4, wherein like reference numerals refer to like components in the various views, FIG. 1A is a schematic view showing the elements comprising the UV activated oxidation process for reducing organic carbon in semiconductor process water, generally denominated AOP 100 herein. TOC decomposition performance is controlled by the size of the reaction vessel, the intensity and amount of UV light used, and the amount of persulfate injected. The system configuration includes a source of untreated water 110, which is fed into a chemical reactor vessel 120 through one or more fluid inlets 130. Persulfate from a persulfate anion addition system 140 is also fed into the reactor vessel, the system including a persulfate feed tank 150, a fluid inlet 160, and a feed pump 170. One or more UV lights 180, 190 are disposed within the vessel enclosure, as is a chemical solution mixer 200.
  • The reactor vessel may be a continuous-stirred tank reactor (CSTR). This keeps down cost and increases system simplicity. However, a plug flow reactor (PFR) may be preferred in situations where space (system footprint) is at a premium. Alternatively, a CSTR can be used in series with a PFR 210 having UV lights 220 to increase system efficacy.
  • The treated water is discharged either directly (in the case of a single reactor system) through one or more discharge outlets 230 for further use, or into the PFR for further treatment and subsequent discharge from a terminal discharge outlet 240. The treated water 250 is sampled at discharge by a TOC analyzer 260, which adjusts and controls the persulfate feed pump 170 according to the needs of the system.
  • FIG. 1B shows AOP 100 implementation in a typical semiconductor UPW production system 470 when employed in the production of UPW prior to the POD 360 and also prior to the POC 380 to produce ultra low level TOC (i.e. <POD level) for critical POU usage 390. FIG. 1B also shows AOP 100 implementation when employed in the purification of spent UPW 440 from semiconductor fabrication.
  • Treated reuse UPW 460 can be blended with raw feed water 270 to produce the required blended feed flow 280 to the UPW production system 470. Alternatively, the treated reuse UPW 460 can be blended with UPW at any point within the UPW production system 470. The Pretreatment System treats the blended feed flow by combining various technologies, as required, for suspended solids reduction, initial organic compound reduction, chlorine removal and pH adjustment to produce feed water 300 with the proper characteristics for efficient production of UPW in the Make-Up System 310. The Make-Up System process typically includes Heat Exchange (HX), Ultra-Filtration (UF), Membrane Filtration (MF), 1st Pass Reverse Osmosis (RO), 2nd Pass RO, Electro-deionization (EDI), Ion Exchange (IX), Membrane De-Aeration (MD-A) or Vacuum De-Aeration (VD-A), and UV Sterilization (UV) to produce the required Make-Up water quality 320 with a flow equal or greater than the total average usage at the POU (370 plus 390). Make-Up water stored in DI Storage 330 provides limited backup when the Make-Up System is out of service or when the average POU UPW usage exceeds the capacity of the Make-Up System. UPW from DI Storage is pumped 340 through the Polish System 350 at a flow rate greater than UPW peak usage at the combined POU. UPW in the Polish System is purified using HX, EDI, IX, UV, MF, and UF to produce UPW per POD 360 quality specifications as required at the non-critical POU 370. Certain critical fab processes 390, such as photolithography, require UPW with an impurity level less than produced at the POD 360. To meet this requirement, POU System(s) 410 are installed at the POC(s) to the critical fab process(es). The POU System can include HX, RO, EDI, IX, MD-A, pressure control, UV, MF, and UF, as required to meet fab-specific UPW specifications at the POC(s). The sum of non-critical and critical fab UPW usage equals the combined fab UPW usage. UPW not used at the combined POU is returned 400 to DI Storage. Certain fab UPW usage produces spent UPW water not economically suitable for reuse 420 (due to high levels of suspended solids, chemicals, etc.) that is sent to waste treatment. Most spent UPW 430 is primarily contaminated with TOC that can be purified in a Reuse System 440 and forwarded 460 for blending with raw feedwater 270. Water not meeting specifications for blending 450 is sent to waste treatment.
  • The AOP 100 can be employed at any point in the UPW production system 470, consisting of the Pretreatment System, the Make-Up System, the DI Storage, and the Polish System.
  • The AOP 100 in the UPW production system 470 may be located on the product stream of the 1st Pass RO. At this point the feedwater to the AOP 100 has significantly reduced levels of suspended solids, ionized solids, microorganisms, and TOC, all of which enhance the performance of the AOP 100. The TOC in the AOP 100 product should be controlled so that the TOC at the POD 360 and non-critical POU 370 is less than specification. Product water from AOP 100 is directed to following unit processes in the UPW production system 470, where oxidation products from the AOP process are removed.
  • The AOP 100 can be employed at any point between the POD 360 and the POC 380 to critical POU 390 to reduce TOC to the specification required by POU 390. Additional unit processes, similar to those found in the UPW production system 470 may be employed to remove oxidation products produced in the AOP 100, or to meet other specifications for the POU 390 not achieved with UPW delivered from the POD 360.
  • The AOP 100 can be employed in the Reuse System 440 to reduce TOC in segregated, spent UPW 430 to produce Reuse UPW 460 suitable for reuse in the UPW System or for other uses. Suspended solids reduction in the reuse feedwater 430 using MF or UF may be employed to improve the efficiency of the AOP 100. Ionized solids reduction using RO, EDI, or IX in part of, or all of the Reuse UPW 460 may be employed to meet use specifications of the Reuse UPW.
  • As an alternative or addition to a feed back signal from a TOC/TDS analyzer disposed on the effluent discharge, a feed forward signal to the persulfate addition system may be supplied by a TOC analyzer disposed on the inlet end of the water to be treated. The performance of the reactor is a function of the following design parameters: (1) residence time; (2) reactor radius (light path length); (3) lamp linear energy density; (4) energy wavelength; (5) persulfate concentration; and, (6) TOC composition and concentration.
  • The reactor design is selected after determining the amount of persulfate that needs to decompose to effect the required TOC decomposition. The persulfate decomposition fraction and addition rate is established by optimizing the design parameters for capital cost, operating cost and available footprint.
  • The decomposition of persulfate to sulfate radicals and the subsequent reaction of the radicals with organic compounds is a homogeneous set of reactions. The longer the fluid retention time in the reactor, the greater the amount of activating UV light absorbed. Thus, residence time affects the fraction of the feed persulfate that will be decomposed and, consequently, the amount of organic material that will be oxidized.
  • Increasing the reactor radius increases the residence time and increases the distance between the lamps and the reactor walls. The incremental reactor volume further from the lamps is less effective for persulfate decomposition due to lower photon flux. However, because the light must pass through more water, more photons are absorbed, resulting in better use of the input UV. The effect of increased reactor radius is then a function of the effective absorption of the water. If the water absorbs little of the light, then increasing the reactor radius has a larger impact on performance. The residence time varies as a square of the radius, but because the view factor scales inversely with the distance from the lamp, photon flux varies as 1/r. Accordingly, if UV power is relatively more expensive than tank size, the tank radius should be set so that little UV light reaches the tank walls.
  • The effect of light energy input, or linear energy density of the lamp, is also straightforward. As more light is added to the reactor more persulfate will be decomposed. The amount of persulfate decomposed generally scales linearly with energy input. Energy input can be varied by changing the number of lamps used and the choice of lamp. For example, a standard low pressure mercury lamp, used for both photolysis and biological control, has a 254 nm output of about 0.2 W/cm. Amalgam lamps are available that give 0.4 and 0.6 W/cm. And medium pressure mercury lamps typically give 15 W/cm in the 200-260 nm range.
  • The wavelength of light employed is also a critical design variable. FIG. 2 graphically shows the absorption spectrum 500 for aqueous persulfate. As shown in FIG. 2, persulfate absorbs a larger fraction of light as the wavelength is reduced. At 254 nm very little of the light is absorbed. Using 220 nm light would result in much more light absorption for a given path-length. Adjusting the UV to a wavelength where persulfate absorbs stronger improves performance in situations where some fraction of the light is not absorbed before reaching the reactor vessel wall. The extra absorbed light translates directly to more persulfate decomposed and improved performance. A lower limit on wavelength is set by the water absorption of photons which occurs strongly below ˜190 nm.
  • For a given reactor design, the TOC decomposition performance depends on the feed rate of persulfate. The amount of persulfate required for a given performance depends on: (a) specific chemicals contributing to TOC; (b) concentration of these chemicals; and (c) TOC decomposition performance required.
  • The amount of persulfate needed is also affected if there are other chemicals in the water that absorb UV (lowering the effective quantum efficiency of persulfate degradation) or that are oxidized by sulfate radicals (thus competing with TOC for sulfate radicals.) Generally, cleaner water allows for more efficient TOC control.
  • The method may be demonstrated by the following examples, which are provided for purposes of illustration only, and do not limit the scope of the disclosure described herein.
  • EXAMPLE 1
  • Tests indicate that for a given target chemical the absolute reaction rate is low order in the target chemical concentration. A given persulfate feed rate and UV power generates a number of radicals which, over a narrow target chemical concentration, decompose a fixed amount of the target compound independent of the concentration of the target compound.
  • FIG. 3 graphically shows the effect of urea concentration on performance for a fixed residence time and persulfate feed rate 600. The data were generated using a plug flow reactor with a 254 nm lamp. The data show that the absolute amount of urea decomposed at 10 ppb was only twice that decomposed at 2 ppb. As with other AOPs, some oxidant-to-target molar ratio will be required to achieve a required performance. This affect contrasts with many chemical processes where the reaction rate scales proportionally to the target chemical concentration.
  • These data are an example of using the process to remove a relatively difficult to oxidize compound from an ultra-pure water stream.
  • EXAMPLE 2
  • A series of tests was conducted to test the stirred tank (CSTR) design concept with simulated spent rinse water. Isopropanol (IPA) was used as the target compound since it has been shown to be difficult to decompose and is a major component of spent rinse water. The objective of the study was to determine if 1-5 ppm TOC could be reduced to <5 ppb.
  • The results 700 of the pilot study are summarized as FIG. 4. The results can be organized by the three IPA concentrations examined. Note that there is a difference between IPA concentration and TOC concentration; IPA is only 60% carbon so 1.5 ppm IPA is equivalent to 915 ppb TOC.
  • Low IPA Tests—At the lowest IPA concentration tested (1.5 ppm), the persulfate addition required to achieve the target effluent TOC is reasonable. The effect of increased additive addition on performance is linear up to 100% IPA decomposition with a single 20 minute residence time CSTR. By adding a one minute residence time plug flow reactor (PFR) in series after the CSTR, the performance is improved by decomposing the residual persulfate. In other words, some of the additive is not decomposed in the CSTR and is passed on and decomposed in the PFR. Additive addition of 75 ppm is sufficient to destroy essentially all of the IPA with the two reactors in series.
  • Moderate IPA Tests—The relationship between persulfate addition and IPA decomposition is also linear at the moderate TA concentration (2.4 ppm) tested. Nearly 100% decomposition is achieved using 200 ppm persulfate using the 20 minute residence time CSTR. The additive requirements are increased somewhat when the residence time of the CSTR is decreased to 15 minutes.
  • High IPA Tests—At the highest IPA concentration (4.9 ppm) the amount of persulfate required to achieve the 99+% decomposition requirement is significant. The relationship between additive addition and decomposition performance is also not linear. The effect of higher persulfate concentrations on performance is diminished as 100% decomposition is approached. Although this IPA concentration is higher than is expected for the intended application, the ability to attain near complete decomposition for higher IPA concentrations in water gives a desirable flexibility to the process.
  • Collectively, these tests show that the technology is viable for spent rinse water treatment using a simple CSTR photochemical reactor of sufficient residence time and modest UV energy input.
  • The disclosure herein shows that a system directed to treating semiconductor process water to reduce total organic compounds in the water. The system includes a chemical reactor vessel and a persulfate anion addition system upstream of the chemical reactor vessel, and employs light energy to oxidize the aqueous persulfate. It may be used to treat pure water for semiconductor manufacturing, and to decompose TOC to less than 5 ppb, or to below 1 ppb. However, it may also be employed to treat semiconductor-manufacturing wastewater, and in such an implementation, it is used to decompose TOC to a concentration sufficiently low to allow reuse of the water. In each implementation, the persulfate feed rate is controlled by a TOC analyzer based on a feed back signal from effluent TOC analysis. Alternatively, it may be controlled by a feed forward signal from analysis of the TOC in the untreated feed water. In yet another alternative, it may be controlled by both.
  • Further, a method is provided for treating semiconductor process water to reduce total organic compounds, and this method comprises the steps of (1) providing a source of semiconductor manufacturing water with a TOC concentration higher than required for ultrapure uses; (2) mixing aqueous persulfate anions with the semiconductor manufacturing water in a chemical reactor vessel; (3) exposing the persulfate anion and water mixture to ultraviolet light for a predetermined residence time; and (4) discharging the treated water for further treatment required for ultrahigh purity uses. The method may be used when the semiconductor manufacturing water is pure water, and the process may be employed to decompose TOC to less than 5 ppb, or to less than 1 ppb. Furthermore, the method may be used in treating semiconductor manufacturing waste water, and the process is used to decompose TOC to a concentration sufficiently low to allow reuse of the water, and further processing may be effected to remove dissolved solids and dissolved gases.
  • In effecting the process, the introduction of persulfate into the reaction vessel may be controlled using either a feed back signal from effluent TOC analysis, or a feed forward signal from analysis of the TOC in the untreated feed water, or both. In the former case, the TOC analyzer would be disposed between the source of water to be treated and the chemical reactor vessel, and in the latter, the TOC analyzer would be disposed anywhere downstream of the chemical reactor vessel, including on the discharge outlet itself or anywhere prior to the point of use or re-use.
  • While the particular apparatus and method herein shown and disclosed in detail is fully capable of attaining the objects and providing the advantages stated herein, it is to be understood that it is merely illustrative of an embodiment and that no limitations are intended concerning the detail of construction or design shown other than as defined in the appended claims.
  • Accordingly, the proper scope of the present disclosure should be determined only by the broadest interpretation of the appended claims so as to encompass obvious modifications as well as all relationships equivalent to those illustrated in the drawings and described in the specification.

Claims (14)

1.-25. (canceled)
26. A water treatment system, comprising:
a source of water for semiconductor manufacturing;
a point of use fluidly connected downstream of the source of water; and
an advanced oxidation process system fluidly connected downstream from the source of water for semiconductor manufacturing, the advanced oxidation comprising:
a chemical reactor vessel;
a persulfate addition system fluidly connected to the chemical reactor vessel;
a light emitting device positioned within the chemical reactor vessel; and
a total organic carbon analyzer configured to receive an input signal of a total organic carbon measurement and configured to provide an output signal to control the persulfate addition system in response to the input signal.
27. The system of claim 26, wherein the persulfate addition system comprises a persulfate feed tank and a persulfate feed pump fluidly connected to the persulfate feed tank and configured to deliver persulfate to the chemical reactor vessel.
28. The system of claim 27, further comprising a polish system with at least one of a heat exchanger, an electro-deionization unit, an ion exchange unit, an ultraviolet sterilization system, a membrane filtration unit, and an ultra-filtration membrane.
29. The system of claim 28, wherein the source of water for semiconductor manufacturing comprises at least one of a source of raw feed water, a source of spent ultrapure water, and a blended feed comprising a mixture of the raw feed water and spent ultrapure water.
30. The system of claim 29, further comprising a pretreatment system fluidly connected to the source of water and including at least one of a suspended solids removal system, an organic compound reduction system, a chlorine removal system, a pH adjustment system, and a carbon dioxide reduction system.
31. The system of claim 30, further comprising a deionized water storage system fluidly connected upstream of the polish system.
31. The system of claim 31, further comprising a make-up system with a first-pass reverse osmosis unit and a second-pass reverse osmosis unit, and wherein the advanced oxidation process system is fluidly connected downstream of the first-pass reverse osmosis unit and upstream of the second-pass reverse osmosis unit.
32. The system of claim 31, wherein the advanced oxidation process system is fluidly connected upstream of the polish system.
33. The system of claim 31, wherein the advanced oxidation process system is positioned within the polish system.
34. The system of claim 31, wherein the advanced oxidation process system is fluidly connected downstream of the polish system.
35. The system of claim 31, wherein the total organic carbon analyzer is disposed upstream of the chemical reactor vessel.
36. The system of claim 35, wherein the total organic carbon analyzer is further configured to provide an output signal to increase persulfate delivered to the chemical reactor vessel in response to an input signal indicating that the total organic carbon measurement exceeds 5 ppb.
37. The system of claim 35, wherein the total organic carbon analyzer is further configured to provide an output signal to increase persulfate delivered to the chemical reactor vessel in response to an input signal indicating that the total organic carbon measurement exceeds 1 ppb.
US16/739,071 2006-06-06 2020-01-09 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water Abandoned US20200148563A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/739,071 US20200148563A1 (en) 2006-06-06 2020-01-09 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US17/461,262 US20210387878A1 (en) 2006-06-06 2021-08-30 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US81122006P 2006-06-06 2006-06-06
PCT/US2007/070416 WO2007146671A2 (en) 2006-06-06 2007-06-05 Ultaviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US30359608A 2008-12-05 2008-12-05
US14/169,928 US10343939B2 (en) 2006-06-06 2014-01-31 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US16/504,942 US10550020B2 (en) 2006-06-06 2019-07-08 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US16/739,071 US20200148563A1 (en) 2006-06-06 2020-01-09 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US16/504,942 Continuation US10550020B2 (en) 2006-06-06 2019-07-08 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/461,262 Continuation US20210387878A1 (en) 2006-06-06 2021-08-30 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Publications (1)

Publication Number Publication Date
US20200148563A1 true US20200148563A1 (en) 2020-05-14

Family

ID=59086228

Family Applications (3)

Application Number Title Priority Date Filing Date
US14/169,928 Active 2031-01-16 US10343939B2 (en) 2006-06-06 2014-01-31 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US16/504,942 Active US10550020B2 (en) 2006-06-06 2019-07-08 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US16/739,071 Abandoned US20200148563A1 (en) 2006-06-06 2020-01-09 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US14/169,928 Active 2031-01-16 US10343939B2 (en) 2006-06-06 2014-01-31 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US16/504,942 Active US10550020B2 (en) 2006-06-06 2019-07-08 Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water

Country Status (1)

Country Link
US (3) US10343939B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10343939B2 (en) 2006-06-06 2019-07-09 Evoqua Water Technologies Llc Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US9365435B2 (en) 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Actinic radiation reactor
US8741155B2 (en) 2007-04-03 2014-06-03 Evoqua Water Technologies Llc Method and system for providing ultrapure water
US9725343B2 (en) 2007-04-03 2017-08-08 Evoqua Water Technologies Llc System and method for measuring and treating a liquid stream
US9365436B2 (en) 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Method of irradiating a liquid
US8961798B2 (en) 2007-04-03 2015-02-24 Evoqua Water Technologies Llc Method for measuring a concentration of a compound in a liquid stream
US10494281B2 (en) 2015-01-21 2019-12-03 Evoqua Water Technologies Llc Advanced oxidation process for ex-situ groundwater remediation
US11161762B2 (en) 2015-01-21 2021-11-02 Evoqua Water Technologies Llc Advanced oxidation process for ex-situ groundwater remediation
KR102576272B1 (en) * 2015-05-07 2023-09-07 에보쿠아 워터 테크놀로지스 엘엘씨 Advanced Oxidation Treatment Method for Deaeration of Reactor Vessel
CN111453900A (en) * 2020-04-27 2020-07-28 苏州华新达饮品技术有限公司 Ultrapure water treatment process
US11021384B1 (en) 2020-12-12 2021-06-01 GreenSource Fabrication LLC Zero liquid discharge recycling system for PCB FAB, general metal finishing, and chemical milling
CN113735346A (en) * 2021-09-13 2021-12-03 中新联科环境科技(安徽)有限公司 Method for treating organic chemical wastewater

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277438A (en) * 1979-09-04 1981-07-07 Astro Resources Corporation Method and apparatus for measuring the amount of carbon and other organics in an aqueous solution
US5571419A (en) * 1993-02-03 1996-11-05 Kurita Water Insustries Ltd. Method of producing pure water
US20060124558A1 (en) * 2004-12-15 2006-06-15 Kouame Yao B Water disinfection system using simultaneous multiple disinfectants

Family Cites Families (260)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE262139C (en)
US2008684A (en) 1931-10-27 1935-07-23 Mixing Equipment Company Inc Emulsifying unit
US2249263A (en) 1937-09-20 1941-07-15 Laval Separator Co De Apparatus for treating oils
US2212260A (en) 1938-02-12 1940-08-20 Brothman Abraham Dispersion device and the like
US2268461A (en) 1940-11-06 1941-12-30 Jeffrey Mfg Co Apparatus for producing flocculation
US2556014A (en) 1948-04-23 1951-06-05 Jeffrey Mfg Co Water treating apparatus
US2686110A (en) 1951-02-15 1954-08-10 Standard Oil Dev Co Reactor
US2740696A (en) 1951-03-30 1956-04-03 Exxon Research Engineering Co Polymerization apparatus unit
US2651582A (en) 1952-12-22 1953-09-08 Cellulose Fibers Inc Method of making a cuprammonium cellulose solution
NL113908C (en) 1956-05-16
US2833624A (en) 1956-10-02 1958-05-06 Du Pont Production of chlorine dioxide
US3252689A (en) 1964-06-10 1966-05-24 Diamond Alkali Co Method and apparatus for mixing and distributing liquids
US3389970A (en) 1967-02-15 1968-06-25 Edward G. Scheibel Liquid-liquid extraction column having rotatable pumping impeller assemblies
US3536646A (en) 1967-03-13 1970-10-27 Dow Chemical Co Method for polymer dilution
OA03094A (en) 1968-07-11 1970-12-15 P P I South African Pulp And P Improvements to the delignification and bleaching of cellulose pulps with gaseous oxygen.
US3559959A (en) 1968-08-13 1971-02-02 Monsanto Co Impeller and mixer-settler apparatus
US3702298A (en) 1970-09-10 1972-11-07 Eco Sciences Inc Method of disinfecting with divalent and trivalent metal germicide
UST896051I4 (en) 1970-11-12 1972-03-28 Zjl fxx mss mss^h disperstbzg,osi for making microporous materials
US3747899A (en) 1971-08-16 1973-07-24 Monsanto Co Mixer
US3756570A (en) 1971-09-29 1973-09-04 W Buhner Apparatus for continuous dispersion and homogenization of predominantly viscous substances
US3852234A (en) 1972-02-28 1974-12-03 Nalco Chemical Co Process and apparatus for dissolving water soluble polymers and gums in water involving inversion of water-in-oil emulsions
US3794817A (en) 1972-10-31 1974-02-26 Foxboro Co Adaptive non-linear control system
US3870631A (en) 1973-03-29 1975-03-11 Barber Colman Co Apparatus and method for wet oxidation of organic matter
US3965027A (en) 1974-03-11 1976-06-22 Calgon Corporation Scale inhibition and corrosion inhibition
US4016078A (en) 1975-03-06 1977-04-05 The Dow Chemical Company Header block for tubular membrane permeator modules
US4146676A (en) 1975-03-12 1979-03-27 Olin Corporation Granular calcium hypochlorite coated with a low melting inorganic salt by spray graining
US4087360A (en) 1975-09-24 1978-05-02 Olin Corporation Method of inhibiting scale formation
DE2625149C3 (en) 1976-06-04 1981-01-08 Hoechst Ag, 6000 Frankfurt Process and device for the continuous production of vinyl chloride polymers in aqueous emulsion
CA1079423A (en) 1976-11-16 1980-06-10 Raymond J. P. Brouzes Process for treatment waste waters
US4217145A (en) 1977-01-12 1980-08-12 Gaddis Preston G Process for admixing polymer emulsions with water to produce highly viscous liquids
US4113688A (en) 1977-12-14 1978-09-12 Hercules Incorporated Process for rapidly dissolving gels of water-soluble polymers by extrusion, cutting and then slurrying under high shearing forces
JPS54109939A (en) 1978-02-15 1979-08-29 Mitsui Petrochem Ind Ltd Oxidation reactor for preparing aromatic carboxylic acid
US4280912A (en) 1978-05-22 1981-07-28 Darco Water Systems, Inc. Water purification unit and method
US4171166A (en) 1978-06-26 1979-10-16 Morehouse Industries, Inc. Dispersing apparatus with grooved impeller
DE2930442A1 (en) 1978-07-29 1980-02-07 Furukawa Electric Co Ltd WASTEWATER TREATMENT METHOD
US4218147A (en) 1978-08-21 1980-08-19 Nalco Chemical Company Apparatus for diluting concentrated polymer solutions
DE2851013C2 (en) 1978-11-24 1983-12-08 Katadyn Produkte AG, Wallisellen, Zürich Disinfection device for flowing medium
US4234440A (en) 1979-01-02 1980-11-18 Basf Wyandotte Corporation Hydroxybenzoic acid as pH buffer and corrosion inhibitor for antifreeze containing organosilicone-silicate polymers
LU80951A1 (en) 1979-02-20 1979-06-18 Fospur Ltd PRODUCTION OF DANGEROUS CHEMICAL SUBSTANCES
US4233265A (en) 1979-07-25 1980-11-11 Olin Corporation Liquid polymer hydration
US4241016A (en) 1979-10-09 1980-12-23 Basf Wyandotte Corporation Hydroxybenzoic acid as pH buffer and corrosion inhibitor for antifreeze containing organosiloxane-silicate copolymers
US4340489A (en) 1980-04-07 1982-07-20 International Environmental, Inc. Wastewater treatment process with pH adjustment
US4300909A (en) 1980-08-22 1981-11-17 Krumhansl Mark U Process control
US4433701A (en) 1981-07-20 1984-02-28 Halliburton Company Polymer flood mixing apparatus and method
CA1178720A (en) 1981-12-16 1984-11-27 Walter Sencza Continuous polymer feed system for a waste water treatment plant
DE3379978D1 (en) 1982-01-05 1989-07-06 Univ Manchester Corrosion monitoring
US4456512A (en) 1982-03-10 1984-06-26 The Dow Chemical Company Photochemical reactor and method
US4522502A (en) 1982-10-22 1985-06-11 Stran Corporation Mixing and feeding apparatus
US4402836A (en) 1982-12-01 1983-09-06 The United States Of America As Represented By The Secretary Of The Air Force Method for treating contaminated wastewater
US4581074A (en) 1983-02-03 1986-04-08 Mankina Nadezhda N Method for cleaning internal heat transfer surfaces of boiler tubes
JPS59150589A (en) 1983-02-17 1984-08-28 Raizaa Kogyo Kk Purification of service or waste water and apparatus therefor
US4550011A (en) 1983-07-01 1985-10-29 Mccollum Roy L Sample flow cell for automatic halogen and pH control for water reservoirs
US4913822A (en) 1983-10-26 1990-04-03 Betz Laboratories, Inc. Method for control of scale and inhibition of corrosion in cooling water systems
US4868127A (en) 1984-01-10 1989-09-19 Anatel Corporation Instrument for measurement of the organic carbon content of water
JPS60202792A (en) 1984-03-28 1985-10-14 Kurita Water Ind Ltd Apparatus for oxidation and reduction treatment
US4648043A (en) 1984-05-07 1987-03-03 Betz Laboratories, Inc. Computerized system for feeding chemicals into water treatment system
US4664528A (en) 1985-10-18 1987-05-12 Betz Laboratories, Inc. Apparatus for mixing water and emulsion polymer
US4701055A (en) 1986-02-07 1987-10-20 Fluid Dynamics, Inc. Mixing apparatus
JPS62193696A (en) 1986-02-20 1987-08-25 Nomura Micro Sci Kk Production of extremely pure water
GB8611518D0 (en) 1986-05-12 1986-06-18 Manchester Inst Science Tech Corrosion monitoring
US4752740A (en) 1986-05-19 1988-06-21 Steininger Jacques M Electronic water chemistry analysis device with linear bargraph readouts
US4778280A (en) 1986-06-25 1988-10-18 Stranco, Inc. Mixing apparatus
US4719252A (en) 1986-07-22 1988-01-12 Drew Chemical Co. Process and apparatus for forming polymeric solutions
US4747978A (en) 1986-08-07 1988-05-31 Ppg Industries, Inc. Calcium hypochlorite compositions
US4798702A (en) 1986-09-10 1989-01-17 Tucker Robert E Sterilizer unit for fluid media and process
IT1202425B (en) 1987-01-26 1989-02-09 Giuseppe Bianchi ELECTROCHEMICAL DEOXYGENATION PROCESS FOR THE CONTROL OF CORROSION IN DEIONIZED WATERS
US5382367A (en) 1987-08-07 1995-01-17 Zinkan Enterprises Co. Method of treating cooling water systems
US5061456A (en) 1987-08-25 1991-10-29 Stranco, Inc. Polymer activation apparatus
US5135968A (en) 1990-10-10 1992-08-04 Stranco, Ltd. Methods and apparatus for treating wastewater
US5316031A (en) 1987-08-25 1994-05-31 Brazelton Carl L Valve with independent control of discharge through plurality of orifices
US5164429A (en) 1987-08-25 1992-11-17 Stranco, Inc. Polymer activation apparatus
US5018871A (en) 1989-07-19 1991-05-28 Stranco, Inc. Polymer dilution and activation apparatus
JPH01122903A (en) 1987-11-06 1989-05-16 Tosoh Corp Granular substance of calcium hypochlorite and production thereof
US4990260A (en) 1988-01-28 1991-02-05 The Water Group, Inc. Method and apparatus for removing oxidizable contaminants in water to achieve high purity water for industrial use
BR8907320A (en) 1988-03-17 1991-03-19 Comalco Alu METAL SURFACE PROTECTION
DE3851951T2 (en) 1988-03-31 1995-02-23 Orbisphere Lab Inc Wilmington Amperometric measurement method Amperometric measurement method.
GB8814222D0 (en) 1988-06-15 1988-07-20 Total Pool Chemicals Ltd Improvement in/relating to sanitation of swimming pool water
US4980032A (en) 1988-08-12 1990-12-25 Alameda Instruments, Inc. Distillation method and apparatus for reprocessing sulfuric acid
US4952376A (en) 1988-09-13 1990-08-28 Peroxidation Systems, Inc. Oxidation chamber
US5024766A (en) 1988-11-09 1991-06-18 Shahzad Mahmud Point of use deionized water purification unit
US5068040A (en) 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
DE3914024A1 (en) 1989-04-28 1990-10-31 Bruno Bachhofer METHOD FOR TREATING WATER, IN PARTICULAR BATHING WATER
US5116509A (en) 1989-09-08 1992-05-26 Millipore Corporation Electrodeionization and ultraviolet light treatment method for purifying water
US5112521A (en) 1989-10-10 1992-05-12 Olin Corporation Calcium hypochlorite compositions containing phosphonobutane polycarboxylic acid salts
US5004549A (en) 1989-10-10 1991-04-02 Olin Corporation Method for inhibiting scale formation using calcium hypochlorite compositions
US5230822A (en) 1989-11-15 1993-07-27 Lever Brothers Company, Division Of Conopco, Inc. Wax-encapsulated particles
US4977292A (en) 1989-12-15 1990-12-11 W. R. Grace & Co.-Conn. 4-phosphonomethyl-2-hydroxy-2-oxo-1,4,2-oxazaphosphorinane N-oxide and water-soluble salts thereof
JPH0647105B2 (en) 1989-12-19 1994-06-22 株式会社荏原総合研究所 Purification method and device for pure water or ultrapure water
US5132094A (en) 1990-03-02 1992-07-21 Sievers Instruments, Inc. Method and apparatus for the determination of dissolved carbon in water
US5820823A (en) 1990-03-02 1998-10-13 Sievers Instruments, Inc. Method and apparatus for the measurement of dissolved carbon
US5798271A (en) 1990-03-02 1998-08-25 Sievers Instruments, Inc. Apparatus for the measurement of dissolved carbon in deionized water
US5000866A (en) 1990-03-26 1991-03-19 First Brands Corporation Antifreeze compositions containing alkane tetracarboxylic acid for use with hard water
US5069885A (en) 1990-04-23 1991-12-03 Ritchie David G Photocatalytic fluid purification apparatus having helical nontransparent substrate
CH681179A5 (en) 1990-04-24 1993-01-29 Ingold Messtechnik Ag
US5118422A (en) 1990-07-24 1992-06-02 Photo-Catalytics, Inc. Photocatalytic treatment of water
FR2672058B1 (en) 1991-01-24 1995-04-28 Univ Nancy COMPOSITION OF FERROUS METAL CORROSION INHIBITOR, PROCESS FOR PREPARING THE SAME, AND USE THEREOF.
IT1251524B (en) 1991-03-18 1995-05-16 Vincenzo Lagana METHOD FOR THE PASSIVATION OF METAL SURFACES AFFECTED BY CONDITIONS AND CORROSION PROMOTING AGENTS
US5262963A (en) 1991-06-28 1993-11-16 Imc Fertilizer, Inc. Automatic control system for phosphoric acid plant
DE4138421C2 (en) 1991-11-22 1993-12-02 Degussa Process for reducing pollutants in water by means of hydrogen peroxide under UV irradiation
US5580578A (en) 1992-01-27 1996-12-03 Euro-Celtique, S.A. Controlled release formulations coated with aqueous dispersions of acrylic polymers
JP2696636B2 (en) 1992-02-05 1998-01-14 株式会社東芝 UV irradiation device with mixed flow plate
US5302356A (en) 1992-03-04 1994-04-12 Arizona Board Of Reagents Acting On Behalf Of University Of Arizona Ultrapure water treatment system
US5213694A (en) 1992-04-08 1993-05-25 American Hydro Systems, Inc. Water treatment control system for treating cooling tower makeup water
KR960016302B1 (en) 1992-05-15 1996-12-09 마쯔시다덴기산교 가부시기가이샤 Apparatus and method for production of pure water
DE651730T1 (en) 1992-07-23 1996-03-14 Diversey Corp METHOD AND DEVICE FOR MONITORING MICROORGANISMS.
DE69302253T2 (en) 1992-10-29 1996-09-19 Babcock & Wilcox Co Passivation of metal tubes
US5422014A (en) 1993-03-18 1995-06-06 Allen; Ross R. Automatic chemical monitor and control system
US5536395A (en) 1993-03-22 1996-07-16 Amway Corporation Home water purification system with automatic disconnecting of radiant energy source
DE4312417A1 (en) 1993-04-16 1994-10-20 Henkel Kgaa Method for increasing the corrosion resistance of stainless steel
US5332511A (en) 1993-06-25 1994-07-26 Olin Corporation Process of sanitizing swimming pools, spas and, hot tubs
US5972196A (en) 1995-06-07 1999-10-26 Lynntech, Inc. Electrochemical production of ozone and hydrogen peroxide
US5518629A (en) 1993-07-29 1996-05-21 Betz Laboratories, Inc. Methods for controlling scale formation in acqueous systems
US5980758A (en) 1993-08-05 1999-11-09 Nalco Chemical Company Method and composition for inhibiting growth of microorganisms including peracetic acid and a non-oxidizing biocide
CA2129489C (en) 1993-08-05 2000-10-10 Judy G. Lazonby Method and composition for inhibiting growth of microorganisms including peracetic acid and a non-oxidizing biocide
US5658467A (en) 1993-08-05 1997-08-19 Nalco Chemical Company Method and composition for inhibiting growth of microorganisms including peracetic acid and a non-oxidizing biocide
US5785867A (en) 1993-08-05 1998-07-28 Nalco Chemical Company Method and composition for inhibiting growth of microorganisms including peracetic acid and a non-oxidizing biocide
US5306432A (en) 1993-08-09 1994-04-26 Great Lakes Biochemical Co., Inc. Water purification
US5439595A (en) 1993-08-25 1995-08-08 Downey, Jr.; Wayne F. Water decontamination method using peroxide photolysis ionizer
US5320748A (en) 1993-09-02 1994-06-14 Dupuis Joseph A Acid dispensing system for a swimming pool
GB2281742A (en) 1993-09-09 1995-03-15 Grace W R & Co Biocidal composition
US5573662A (en) 1993-09-13 1996-11-12 Nomura Micro Science Co., Ltd. Apparatus for treatment of low-concentration organic waste water
WO1995009815A1 (en) 1993-10-06 1995-04-13 Water Recovery Plc Uv apparatus for fluid treatment
US5501801A (en) 1993-11-30 1996-03-26 Board Of Control Of Michigan Technology University Method and apparatus for destroying organic compounds in fluid
CA2132930A1 (en) 1993-12-03 1995-06-04 Louis Szabo Uv water sterilizer with turbulence generator
US5575920A (en) 1994-03-11 1996-11-19 Betzdearborn Inc. Method of inhibiting scale and controlling corrosion in cooling water systems
US5470480A (en) 1994-05-09 1995-11-28 Eka Nobel, Inc. Process for treating waste water effluent
DE19517039C2 (en) 1994-10-25 2002-07-18 Guenther O Schenck Device for oxidative photopurification
JPH08126886A (en) 1994-10-28 1996-05-21 Japan Organo Co Ltd Production of ultrapure water and device therefor
AU708957B2 (en) 1995-03-30 1999-08-19 Bioquest Llc SPA halogen generator
DE19530086C2 (en) 1995-08-16 1998-08-20 Robert Prof Dr Fleischmann Process for the physical-chemical process water treatment of surface and waste water
FR2742080B1 (en) 1995-12-07 1998-01-16 Lorraine Laminage AQUEOUS SOLUTION FOR TREATING STEEL SHEETS
GB2306463B (en) 1995-11-03 1999-03-10 Triogen Ltd Water purification
US5785845A (en) 1995-11-09 1998-07-28 Colaiano; Robert Water purifying system
JP3747504B2 (en) 1996-02-23 2006-02-22 栗田工業株式会社 Copper pitting corrosion prevention method
US5855791A (en) 1996-02-29 1999-01-05 Ashland Chemical Company Performance-based control system
US5683654A (en) 1996-03-22 1997-11-04 Nalco Chemical Co Process to manufacture stabilized alkali or alkaline earth metal hypobromite and uses thereof in water treatment to control microbial fouling
US5770039A (en) 1996-05-03 1998-06-23 Ecolab Inc. Method and apparatus for measuring and controlling active oxygen concentration in a bleach environment
US5820256A (en) 1996-05-30 1998-10-13 Stranco, Inc. Motorless mixer
US6083387A (en) 1996-06-20 2000-07-04 Burnham Technologies Ltd. Apparatus for the disinfection of fluids
US20020153319A1 (en) 1997-08-12 2002-10-24 Debasish Mukhopadhyay Method and apparatus for high efficiency reverse osmosis operation
US5895565A (en) 1996-10-04 1999-04-20 Santa Barbara Control Systems Integrated water treatment control system with probe failure detection
US5873997A (en) 1996-10-18 1999-02-23 The Academy Of Natural Sciences Of Philadelphia Bioreactor and method of measuring contaminants in an aqueous environment
US5790934A (en) 1996-10-25 1998-08-04 E. Heller & Company Apparatus for photocatalytic fluid purification
US5849985A (en) 1997-01-14 1998-12-15 Fmc Corporation Use of persulfate to destroy haloform
US5858246A (en) 1997-01-14 1999-01-12 Fountainhead Technologies, Inc. Method of water purification with oxides of chlorine
US5779912A (en) 1997-01-31 1998-07-14 Lynntech, Inc. Photocatalytic oxidation of organics using a porous titanium dioxide membrane and an efficient oxidant
US5800732A (en) 1997-02-07 1998-09-01 Diversey Lever, Inc. All-in-one treatment agent for cooling water
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
US5858249A (en) 1997-02-21 1999-01-12 Higby; Loren P. Electrochemical insolubilization of anionic arsenic method and apparatus
US5783092A (en) 1997-03-18 1998-07-21 Bio-Lab, Inc. Water treatment method
US5888374A (en) 1997-05-08 1999-03-30 The University Of Chicago In-situ process for the monitoring of localized pitting corrosion
US5947596A (en) 1997-06-10 1999-09-07 U.S. Filter/Stranco Dry powder batch activation system
US5882526A (en) 1997-06-12 1999-03-16 Great Lakes Chemical Corporation Methods for treating regulated waters with low levels of oxidizing halogens and hydrogen peroxides
US6780328B1 (en) 1997-06-20 2004-08-24 Li Zhang Fluid purification devices and methods employing deionization followed by ionization followed by deionization
JP3398572B2 (en) 1997-07-11 2003-04-21 株式会社片山化学工業研究所 Failure prevention method for aluminum brass pipes serving as seawater flow paths
US6030842A (en) 1997-07-21 2000-02-29 Environmental Test Systems, Inc. Method, composition and device for the determination of free halogens in aqueous fluids
AUPO819697A0 (en) 1997-07-23 1997-08-14 Australian Nuclear Science & Technology Organisation Photo-assisted oxidation of inorganic species in aqueous solutions
JPH1133542A (en) 1997-07-25 1999-02-09 Toto Ltd Method and apparatus for purifying water
JPH1199395A (en) 1997-07-29 1999-04-13 Japan Organo Co Ltd Treatment of organic matter containing water
US5866013A (en) 1997-08-12 1999-02-02 Betzdearborn Inc. Method for inhibiting scale and controlling corrosion in cooling water systems
JP3491666B2 (en) 1997-08-19 2004-01-26 オルガノ株式会社 Method and apparatus for controlling TOC component removal
US6015229A (en) 1997-09-19 2000-01-18 Calgon Carbon Corporation Method and apparatus for improved mixing in fluids
US6063638A (en) 1997-09-25 2000-05-16 Small Family 1992 Revocable Trust Wet chemical oxidation technique and apparatus for water impurity
EP1045816A2 (en) 1997-11-07 2000-10-25 Bioquest LLC Amperometric halogen control system
US5814233A (en) 1997-11-10 1998-09-29 Great Lakes Chemical Corporation Compositions and methods for treating water
US5985155A (en) 1997-11-14 1999-11-16 Autopilot Systems, Inc. Method and apparatus for automatic adjustment of halogen production in a water treatment system
US6015484A (en) 1997-11-26 2000-01-18 Gamry Instruments, Inc. Detection of pitting corrosion
IL122388A (en) 1997-12-01 2004-05-12 Atlantium Lasers Ltd Method and device for disinfecting liquids or gases
CA2253679A1 (en) 1998-01-26 1999-07-26 Elf Atochem S.A. Stainless steel passivation in an organosulfonic acid medium
JPH11290878A (en) 1998-02-16 1999-10-26 Japan Organo Co Ltd Control method for removing toc component
US6146538A (en) 1998-02-23 2000-11-14 United States Filter Corporation Method of inhibiting scale formation
US6096283A (en) 1998-04-03 2000-08-01 Regents Of The University Of California Integrated system for the destruction of organics by hydrolysis and oxidation with peroxydisulfate
US6799883B1 (en) 1999-12-20 2004-10-05 Air Liquide America L.P. Method for continuously blending chemical solutions
US6444474B1 (en) 1998-04-22 2002-09-03 Eltron Research, Inc. Microfluidic system for measurement of total organic carbon
US6773608B1 (en) 1998-05-13 2004-08-10 Uv Pure Technologies Inc. Ultraviolet treatment for aqueous liquids
US6120698A (en) 1998-05-15 2000-09-19 Advanced Water Technology, Inc. Balanced water purification composition
US6132593A (en) 1998-06-08 2000-10-17 Tan; Yong-Jun Method and apparatus for measuring localized corrosion and other heterogeneous electrochemical processes
IL125592A (en) 1998-07-30 2004-06-01 Argad Eyal Water Treat Technol Water treatment
US6245229B1 (en) 1998-07-31 2001-06-12 Amway Corporation Point-of-use water treatment system
US6045706A (en) 1998-08-19 2000-04-04 U.S. Filter/Stranco Calcium hypochlorite feeder
US6315950B1 (en) 1998-09-04 2001-11-13 Hach Company Controlling chlorination of wastewater and chloramination of drinking water
DE19844179B4 (en) 1998-09-28 2004-08-19 Usf Wallace & Tiernan Gmbh Procedure for stopping the addition of disinfectant to water
DE69915679T2 (en) 1998-12-10 2005-02-17 Baker-Hughes Inc., Houston METHOD AND SYSTEM FOR CORROSION MEASUREMENT THROUGH DETERMINATION OF THE ELECTROCHEMICAL NOISE
US6068012A (en) 1998-12-29 2000-05-30 Ashland, Inc. Performance-based control system
DE19900805C2 (en) 1999-01-12 2002-06-13 Infineon Technologies Ag Method and device for producing ultrapure water
US6159552A (en) 1999-01-14 2000-12-12 Rutgers, The State University Inorganic conversion coatings for ferrous substrate
US6143184A (en) 1999-03-02 2000-11-07 United States Filter Corporation Air and water purification using continuous breakpoint halogenation
US6409926B1 (en) 1999-03-02 2002-06-25 United States Filter Corporation Air and water purification using continuous breakpoint halogenation and peroxygenation
US6149819A (en) 1999-03-02 2000-11-21 United States Filter Corporation Air and water purification using continuous breakpoint halogenation and peroxygenation
US6090296A (en) 1999-03-17 2000-07-18 Oster; Stephen P. Method and apparatus for UV-oxidation of toxics in water and UV-disinfection of water
CN1192817C (en) 1999-04-27 2005-03-16 栗田工业株式会社 Apparatus for producing water containing dissolved ozone
NL1012217C2 (en) 1999-06-02 2000-12-06 Peter Willem Appel Water treatment plant.
US6251289B1 (en) 1999-06-03 2001-06-26 Grt, Inc. Treatment of contaminated liquids with oxidizing gases and liquids
US6596148B1 (en) 1999-08-04 2003-07-22 Mykrolis Corporation Regeneration of plating baths and system therefore
US6503464B1 (en) 1999-08-12 2003-01-07 Sipec Corporation Ultraviolet processing apparatus and ultraviolet processing method
DE19949434A1 (en) 1999-10-08 2001-04-12 F A F Fuzzy Applikationen Gmbh Fuzzy logic controlled ultra-violet and hydrogen peroxide waste water treatment process
ATE289569T1 (en) 1999-11-19 2005-03-15 Isolyser Co METHOD AND DEVICE FOR THE TREATMENT OF WASTEWATER STREAMS MADE OF WATER-SOLUBLE POLYMERS
US6902653B2 (en) 1999-11-22 2005-06-07 Titan Technologies Apparatus and method for photocatalytic purification and disinfection of fluids
US6942779B2 (en) 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
US6419817B1 (en) 2000-06-22 2002-07-16 United States Filter Corporation Dynamic optimization of chemical additives in a water treatment system
MXPA02012886A (en) 2000-06-22 2003-05-14 United States Filter Corp Corrosion control utilizing a hydrogen peroxide donor.
US6716359B1 (en) 2000-08-29 2004-04-06 United States Filter Corporation Enhanced time-based proportional control
CN1219467C (en) 2000-10-27 2005-09-21 Apit股份有限公司 Method and device for sterilising liquid
US6803587B2 (en) 2001-01-11 2004-10-12 Waterhealth International, Inc. UV water disinfector
US20040112838A1 (en) 2001-02-09 2004-06-17 United States Filter Corporation System and method for optimized control of multiple oxidizers
US6620315B2 (en) 2001-02-09 2003-09-16 United States Filter Corporation System for optimized control of multiple oxidizer feedstreams
JP2002282850A (en) * 2001-03-26 2002-10-02 Mitsubishi Electric Corp Ultrapure water producing equipment
US7320756B2 (en) 2001-05-05 2008-01-22 Debasish Mukhopadhyay Method and apparatus for treatment of feedwaters by membrane separation under acidic conditions
US6776926B2 (en) 2001-08-09 2004-08-17 United States Filter Corporation Calcium hypochlorite of reduced reactivity
AU2002338039B2 (en) 2001-10-04 2007-08-16 Toray Industries, Inc. Hollow fiber film and method for production thereof
WO2003031338A2 (en) 2001-10-09 2003-04-17 Photoscience Japan Corporation Apparatus for the treatment of water with elongated uv lamp
US6991735B2 (en) 2002-02-26 2006-01-31 Usfilter Corporation Free radical generator and method
US7108781B2 (en) 2002-02-26 2006-09-19 Usfilter Corporation Enhanced air and water purification using continuous breakpoint halogenation with free oxygen radicals
AU2003226190A1 (en) 2002-04-01 2003-10-20 Ondeo Degremont, Inc. Apparatus for irradiating fluids with uv
US20050173341A1 (en) 2002-05-03 2005-08-11 Pall Corporation Blended polymer media for treating aqueous fluids
AU2003295718A1 (en) 2002-11-25 2004-06-18 Purstream Technologies, Inc. Wet and dry weather water flows disinfection system
US7875247B2 (en) 2002-11-27 2011-01-25 Novatron, Inc. UV flux multiplication system for sterilizing air, medical devices and other materials
DE10326490A1 (en) 2003-06-10 2005-01-05 Marc Flettner The water treatment unit
US7632410B2 (en) 2003-08-21 2009-12-15 Christopher Heiss Universal water purification system
US6951617B2 (en) 2003-09-16 2005-10-04 Purepise Technologies, Inc. Method and apparatus for controlling flow profile to match lamp fluence profile
US20050103717A1 (en) 2003-11-13 2005-05-19 United States Filter Corporation Water treatment system and method
EP1707538A4 (en) 2004-01-22 2008-05-21 Idemitsu Kosan Co Method for treating raw water containing hardly decomposable substance
CA2559068C (en) 2004-03-10 2011-01-25 Trojan Technologies Inc. System for predicting reduction in concentration of a target material in a flow of fluid
EP1737501A4 (en) 2004-03-12 2009-09-02 Trojan Techn Inc Fluid treatment system
US20050199483A1 (en) 2004-03-15 2005-09-15 Hach Company System and method for the on-demand on-line treatment of water
US6991733B2 (en) 2004-05-25 2006-01-31 Industrial Technology Research Institute Process for removing organics from ultrapure water
US7390399B2 (en) 2004-12-21 2008-06-24 Siemens Water Technologies Holding Corp. Water treatment control systems and methods of use
US8147673B2 (en) 2005-01-18 2012-04-03 Severn Trent De Nora, Llc System and process for treatment and de-halogenation of ballast water
US20060169646A1 (en) 2005-02-03 2006-08-03 Usfilter Corporation Method and system for treating water
CA2606190A1 (en) 2005-04-27 2006-11-02 Hw Process Technologies, Inc. Treating produced waters
CN2807782Y (en) 2005-05-26 2006-08-23 东莞市家家电器厂有限公司 UV light lamp for aquarium
US7695631B2 (en) 2005-06-22 2010-04-13 Truox, Inc. Composition and method for reducing chemical oxygen demand in water
US9808544B2 (en) 2005-08-31 2017-11-07 Ultraviolet Sciences, Inc. Ultraviolet light treatment chamber
WO2007146671A2 (en) 2006-06-06 2007-12-21 Fluid Lines Ultaviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US10343939B2 (en) 2006-06-06 2019-07-09 Evoqua Water Technologies Llc Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US7507973B2 (en) 2006-11-02 2009-03-24 Calgon Carbon Corporation UV treatment reactor
US9365436B2 (en) 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Method of irradiating a liquid
US8753522B2 (en) 2007-04-03 2014-06-17 Evoqua Water Technologies Llc System for controlling introduction of a reducing agent to a liquid stream
US20080245737A1 (en) * 2007-04-03 2008-10-09 Siemens Water Technologies Corp. Method and system for providing ultrapure water
US8741155B2 (en) 2007-04-03 2014-06-03 Evoqua Water Technologies Llc Method and system for providing ultrapure water
US8961798B2 (en) 2007-04-03 2015-02-24 Evoqua Water Technologies Llc Method for measuring a concentration of a compound in a liquid stream
US9365435B2 (en) 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Actinic radiation reactor
CA2689646A1 (en) 2007-06-04 2008-12-11 David T. Schwartzel Aqueous treatment apparatus utilizing precursor materials and ultrasonics to generate customized oxidation-reduction-reactant chemistry environments in electrochemical cells and/or similar devices
US7862728B2 (en) 2007-09-27 2011-01-04 Water Of Life, Llc. Ultraviolet water purification system
US8529770B2 (en) 2007-09-27 2013-09-10 Water Of Life, Llc. Self-contained UV-C purification system
US20090145855A1 (en) 2007-12-06 2009-06-11 Novapure Systems Inc. Water Purifier System and Method
KR100874130B1 (en) 2008-01-30 2008-12-15 (주)동남이엔지 Purification device using photocatalyst
FR2934586B1 (en) 2008-07-29 2010-08-27 Otv Sa METHOD AND APPARATUS FOR TREATING WASTE WATER WITH A VIEW TO BREAKING THE ENDOCRINE DISRUPTIVE EFFECT AND / OR THE TOXIC OR GENOTOXIC EFFECT.
US20100118301A1 (en) 2008-11-13 2010-05-13 Petroleum Analyzer Company, L.P. System for analyzing a sample or a sample component and method for making and using same
AU2009319794B2 (en) 2008-11-26 2013-12-05 De Nora Water Technologies, LLC Method and apparatus for use of mixing elements in wastewater/ recycle water UV disinfection system
CN201473358U (en) 2009-05-07 2010-05-19 西南科技大学 Vortex photocatalysis sewage pretreatment device
WO2010132859A1 (en) 2009-05-14 2010-11-18 Omni Water Solutions Llc Self-contained portable multi-mode water treatment system and methods
KR101220199B1 (en) 2009-05-16 2013-01-09 페트라트론 아이엔씨 Electrolytic synthesis of hydrogen peroxide directly from water and application thereof
US8266736B2 (en) 2009-07-16 2012-09-18 Watkins Manufacturing Corporation Drop-in chlorinator for portable spas
US8591730B2 (en) 2009-07-30 2013-11-26 Siemens Pte. Ltd. Baffle plates for an ultraviolet reactor
US8557188B2 (en) 2010-01-12 2013-10-15 Yang Zhen Lo Unitized photocatalytic air sterilization device
US8357305B2 (en) 2010-03-30 2013-01-22 Earth Renaissance Technologies, Llc Acidification pre-treatment for UV water disinfection
US20110318237A1 (en) 2010-06-26 2011-12-29 Richard Woodling Ultraviolet reactor baffle design for advanced oxidation process and ultraviolet disinfection
TWI433964B (en) 2010-10-08 2014-04-11 Water Star Inc Multi-layer mixed metal oxide electrode and method for making same
ES2373601B1 (en) 2011-10-14 2013-02-08 I.D. Electroquímica, S.L. WATER CLEANING PROCEDURE WITHOUT SALT CONTRIBUTION AND WATER CLEANING REACTOR.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277438A (en) * 1979-09-04 1981-07-07 Astro Resources Corporation Method and apparatus for measuring the amount of carbon and other organics in an aqueous solution
US5571419A (en) * 1993-02-03 1996-11-05 Kurita Water Insustries Ltd. Method of producing pure water
US20060124558A1 (en) * 2004-12-15 2006-06-15 Kouame Yao B Water disinfection system using simultaneous multiple disinfectants

Also Published As

Publication number Publication date
US20200002198A1 (en) 2020-01-02
US20140144821A1 (en) 2014-05-29
US10550020B2 (en) 2020-02-04
US10343939B2 (en) 2019-07-09

Similar Documents

Publication Publication Date Title
US10550020B2 (en) Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US8652336B2 (en) Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
JP6722253B2 (en) Method and system for providing ultrapure water
US6991735B2 (en) Free radical generator and method
US6991733B2 (en) Process for removing organics from ultrapure water
US8926842B2 (en) Water treatment system and method using high pressure advanced oxidation process with unreacted ozone reusing
US8877067B2 (en) Method and arrangement for a water treatment
JP6752692B2 (en) Water treatment method and equipment
JP6752693B2 (en) Water treatment method and equipment
JP2010510873A (en) Water treatment equipment using pulsed UV lamp
JPH1199395A (en) Treatment of organic matter containing water
US10160675B1 (en) Process for filtering and treating an MTBE-contaminated aqueous liquid
JP7289206B2 (en) Boron removal device, boron removal method, pure water production device, and pure water production method
US20210387878A1 (en) Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
JPH1199394A (en) Method for removing organic matter in water
US11814304B2 (en) Ultraviolet treatment method and system
JP3259557B2 (en) How to remove organic matter
JPH1128482A (en) Production of pure water
CN117623530A (en) Ultra-pure water preparation process system and method for deeply degrading TOC
Parka et al. Comparative evaluation of the elimination of taste and odor substances via UV/H
WO2023081206A1 (en) Water treatment with photocatalytic technology
Yue Modelling and design of photochemical reactors for water purification
Ried et al. Which Advanced Oxidation Process is Best? An Effective Method for Micropollutant Removal in Contaminated Groundwater
JP2007196176A (en) Treatment method and arrangement of organic arsenic-containing waste water

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, NEW YORK

Free format text: SECURITY INTEREST;ASSIGNORS:EVOQUA WATER TECHNOLOGIES LLC;NEPTUNE BENSON, INC.;REEL/FRAME:055848/0689

Effective date: 20210401

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCB Information on status: application discontinuation

Free format text: ABANDONMENT FOR FAILURE TO CORRECT DRAWINGS/OATH/NONPUB REQUEST

AS Assignment

Owner name: NEPTUNE BENSON, INC., RHODE ISLAND

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK N.A., AS COLLATERAL AGENT;REEL/FRAME:063787/0943

Effective date: 20230524

Owner name: EVOQUA WATER TECHNOLOGIES LLC, PENNSYLVANIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK N.A., AS COLLATERAL AGENT;REEL/FRAME:063787/0943

Effective date: 20230524