US20190383450A1 - Lighting systems with high color rendering index and uniform planar illumination - Google Patents
Lighting systems with high color rendering index and uniform planar illumination Download PDFInfo
- Publication number
- US20190383450A1 US20190383450A1 US16/480,867 US201816480867A US2019383450A1 US 20190383450 A1 US20190383450 A1 US 20190383450A1 US 201816480867 A US201816480867 A US 201816480867A US 2019383450 A1 US2019383450 A1 US 2019383450A1
- Authority
- US
- United States
- Prior art keywords
- lighting device
- led
- light
- circuit board
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
- F21V9/35—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material at focal points, e.g. of refractors, lenses, reflectors or arrays of light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H05B33/086—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
Definitions
- LEDs Light emitting diodes
- the LEDs typically emit light in a narrow spectrum (e.g., a spectrum that is smaller 200 nanometers in size) that is dependent upon the bandgap energy of the semiconductor material that forms the p-n junction.
- a narrow spectrum e.g., a spectrum that is smaller 200 nanometers in size
- an LED formed using one semiconductor material may emit light of a different color (and thereby in a different spectrum) than an LED formed using another semiconductor material.
- White light has a broad spectrum (e.g., a spectrum that is larger than 200 nanometers in size), unlike the light typically emitted from a single LED.
- White light may be formed by mixing light with different colors (and thereby different spectrums) together.
- white light may be formed by mixing red, green, and blue light or blue and yellow light.
- Inexpensive LEDs that create white light typically use an LED configured to emit blue light (a blue LED) that is coated with a yellow phosphor. The yellow phosphor coating converts a portion of the blue light from the LED into yellow light. The mixture of the blue and yellow light forms white light.
- a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface.
- the lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit broad spectrum light having a first color rendering index (CRI) value toward the top surface of the lighting device, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the top surface of the lighting device, the at least one photo-luminescent material being configured to increase the CRI of the broad spectrum light emitted by the LED from the first CRI value to a second CRI value that is higher than the first CRI value, and at least one elastomer encapsulating at least part of the circuit board.
- LED light emitting diode
- CRI color rendering index
- the LED is a white phosphor-converted LED configured to emit white light.
- the broad spectrum light has a spectrum that is at least 200 nanometers in size.
- the second CRI value is at least 95.
- the at least one photo-luminescent material is configured to increase an R9 color rendering value of the broad spectrum light emitted by the LED from a first R9 color rendering value to a second R9 color rendering value that is higher than the first R9 color rendering value.
- the second R9 color rendering value is at least 95.
- the at least one photo-luminescent material is configured to change a color correlated temperature (CCT) of the broad spectrum light emitted by the LED from a first CCT value to a second CCT value that is different from the first value.
- CCT color correlated temperature
- the first CCT value is higher than the second CCT value.
- the first CCT value is at least 4000 degrees Kelvin (K) and the second CCT value is no more than 3000 degrees K.
- the first CCT value is lower than the second CCT value.
- the at least one photo-luminescent material is configured to absorb at least some light with a wavelength below 500 nanometers and emit at least some light with a wavelength above 500 nanometers.
- the lighting device is constructed to operate in both indoor installations and outdoor installations. In some embodiments, the lighting device is no more than 5/8 inches tall. In some embodiments, the lighting device is no more than 3 inches wide and no more than 6 inches long.
- the at least one elastomer comprises a first elastomer disposed between the circuit board and a bottom surface of the lighting device and a second elastomer disposed between the circuit board and the top surface of the lighting device that is different from the first elastomer.
- the at least one photo-luminescent material is distributed through at least part of the second elastomer.
- the first elastomer has different heat dissipation properties and the second elastomer.
- the first elastomer is more porous than the second elastomer.
- the at least one photo-luminescent material is formed as a sheet that is at least partially encapsulated by the at least one elastomer.
- the lighting device further comprises scattering particles disposed between the circuit board and the top surface of the lighting device and configured to scatter at least some broad spectrum light emitted from the LED. In some embodiments, the scattering particles are distributed through at least part of the at least one elastomer.
- the lighting device has an efficiency rating of at least 100 lumens per watt.
- the at least one photo-luminescent material comprises at least one member selected from the group consisting of: a phosphor, a silicate, and a quantum dot.
- the at least one photo-luminescent material comprises an organic material.
- the lighting device is constructed as a lighting strip and wherein the LED mounted to the circuit board is a first LED of a plurality of LEDs mounted to the circuit board along a length of the lighting strip.
- the lighting device is configured to provide light within a 3-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip.
- the lighting device is configured to provide light within a 2-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip.
- a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface.
- the lighting device comprises a circuit board, a plurality of light emitting diodes (LEDs) mounted to the circuit board and each configured to emit light toward the top surface of the lighting device, at least one first photo-luminescent material disposed over a first LED of the plurality of LEDs and configured to change at least one characteristic of the light emitted by the first LED, at least one second photo-luminescent material disposed over a second LED of the plurality of LEDs and configured to change at least one characteristic of the light emitted by the second LED, the at least one second photo-luminescent material being different from the at least one first photo-luminescent material, and at least one elastomer encapsulating at least part of the circuit board.
- LEDs light emitting diodes
- At least one of the plurality of LEDs is configured to emit narrow spectrum light that has a spectrum of no more than 200 nanometers in size. In some embodiments, at least one of the plurality of LEDs is configured to emit broad spectrum light that has a spectrum of at least 200 nanometers in size. In some embodiments, the light emitted from the first LED has a different spectrum of the light emitted from the second LED.
- a grow light configured to emit light to stimulate plant growth.
- the grow light comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light toward a top surface of the lighting device, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the top surface of the lighting device, the at least one photo-luminescent material being configured to absorb at least some light from the LED having a wavelength below 500 nanometers (nm) and emit at least some light having a wavelength between 625 nm and 675 nm, and at least one elastomer encapsulating at least part of the circuit board and being in direct contact with a top surface of the LED.
- LED light emitting diode
- the LED is configured to emit broad spectrum light that has a spectrum of at least 200 nanometers in size and includes light having a wavelength below 500 nm. In some embodiments, the LED is configured to emit narrow spectrum light that has a spectrum of no more than 200 nanometers in size and includes light having a wavelength below 500 nm. In some embodiments, the at least one photo-luminescent material is configured to absorb at least some light having a wavelength below 500 nm emitted by the LED.
- a lighting device having a top surface configured to provide light, a bottom surface opposite the top surface, a first lateral surface between the top and bottom surfaces, and a second lateral surface opposite the first lateral surface between the top and bottom surfaces is provided.
- the lighting device comprises a tray comprising a base that forms the bottom surface of the lighting device, a first sidewall that extends from the base and forms the first lateral surface of the lighting device, a second sidewall that extends from the base and forms the second lateral surface of the lighting device, and an overhang that extends from the second sidewall towards the first sidewall and is parallel to the base, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board at a location that is under the overhang that extends from the second sidewall of the tray and being configured to emit broad spectrum light, and at least one elastomer that encapsulates at least part of the second surface of circuit board and is in contact with the first and second sidewalls of the tray.
- LED light emitting diode
- the lighting device further comprises at least one photo-luminescent material disposed between the second surface of the circuit board and the top surface of the lighting device and configured to change at least one characteristic of the broad spectrum light emitted by the LED.
- the at least one characteristic comprises a characteristic selected from the list consisting of: a color correlated temperature, a color rendering index value, and an R9 color rendering value.
- the at least one photo-luminescent material is at least partially encapsulated by the at least one elastomer.
- the lighting device is constructed such that the light from the LED that reaches the top surface without being reflected by another surface of the lighting device is at an angle above the critical angle for total internal reflection.
- a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface.
- the lighting device comprises a tray comprising a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board and configured to emit broad spectrum light up to a maximum emission angle, a lens disposed over the LED configured to increase the maximum emission angle from a first value to a second value that is larger than the first value, a first elastomer that encapsulates at least part of the second surface of the circuit board and is in contact with only a first portion of the lens such that a second portion of the lens is left exposed, and
- LED light emitting
- the lens comprises a cavity that faces the circuit board and wherein the LED is disposed within the cavity.
- the LED is a white phosphor-converted LED configured to emit white light.
- the broad spectrum light has a spectrum that is at least 200 nanometers in size.
- the first value is no more than ⁇ 60 degrees and the second value is at least ⁇ 80 degrees.
- the lighting device further comprises a sleeve that receives the tray and comprises a bottom side disposed under the base of the tray and a top side disposed above the first and second sides of the tray so as to form an air gap between the second portion of the lens and the top side of the sleeve.
- the diffuser is in disposed on the top surface of the sleeve.
- the sleeve is constructed from silicone.
- the tray is constructed from silicone.
- the distance between the top surface and the bottom surface of the lighting device is no more than 5 ⁇ 8 inches. In some embodiments, the top and bottom surfaces are each no more than 3 inches wide and no more than 6 inches long.
- the diffuser comprises a second elastomer that is different from the first elastomer.
- the first elastomer has a first refractive index and the second elastomer has a second refractive index that is different from the first refractive index.
- the first refractive index is smaller than the second refractive index.
- the diffuser comprises a plurality of scattering particles distributed throughout the second elastomer.
- the diffuser comprises at least one photo-luminescent material at least partially encapsulated by the second elastomer.
- the at least one photo-luminescent material comprises at least one member selected from the group consisting of: a phosphor, a silicate, and a quantum dot.
- the diffuser comprises a pigment distributed throughout the second elastomer.
- a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface.
- the lighting device comprises a tray comprising a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board and configured to emit broad spectrum light up to a maximum emission angle, a lens disposed over the LED configured to increase the maximum emission angle from a first value to a second value that is larger than the first value, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the lens, the at least one photo-luminescent material being configured to change at least one characteristic of the light from the LED, a first LED emitting diode
- the at least one photo-luminescent material is configured to change at least one of: a color rendering index, an R9 color rendering value, and a color correlated temperature of the broad spectrum light emitted by the LED.
- FIG. 1A shows a top view of an example lighting system, according to some embodiments of the technology described herein;
- FIG. 1B shows a bottom view of the example lighting system of FIG. 1A , according to some embodiments of the technology described herein;
- FIG. 2A shows a cross-sectional view of an example lighting device, according to some embodiments of the technology described herein;
- FIG. 2B shows a cross-sectional view of another example lighting device, according to some embodiments of the technology described herein;
- FIG. 2C shows a cross-sectional view of another example lighting device, according to some embodiments of the technology described herein;
- FIG. 3 shows a cross-sectional view of an example lighting device with integrated lenses, according to some embodiments of the technology described herein;
- FIG. 4 shows a top view of a deconstructed version of the lighting device of FIG. 3 , according to some embodiments of the technology described herein;
- FIG. 5 shows a cross-sectional view of an example lens, according to some embodiments of the technology described herein;
- FIG. 6 is a graph showing the power efficiency requirements of high color rendering index (CRI) light sources, according to some embodiments of the technology described herein;
- FIG. 7 is a graph showing the spectrum of light emitted by example lighting devices with different elastomer configurations, according to some embodiments of the technology described herein;
- FIG. 8 is a graph showing the spectrum of light emitted by example lighting devices with different photo-luminescent materials, according to some embodiments of the technology described herein;
- FIG. 9 is a graph showing the spectrum of light emitted by each component of an example lighting device for a back lighting unit (BLU), according to some embodiments of the technology described herein;
- FIG. 10 is a graph showing the spectrum of another example lighting device for a BLU, according to some embodiments of the technology described herein.
- FIG. 11 is a graph showing the spectrum of light emitted by an example lighting device compared with the spectrum of light absorbed by different chlorophylls and beta carotene, according to some embodiments of the technology described herein.
- inexpensive white LEDs generally are constructed as white phosphor-converted LEDs where a blue LED is covered with a phosphor coating that converts a portion of the blue light from the LED to yellow light so as to create white light.
- these white phosphor-converted LEDs generally emit white light with a low color rendering index (CRI) value because the phosphor coating may allow a substantial portion of the blue light emitted from the LED to remain unconverted.
- CRI color rendering index
- the CRI value of the white light emitted by a phosphor-converted LED is improved by adding a red LED that emits red light that mixes with the white light emitted by the phosphor-converted LED to increase the red component of the white light.
- the increased red component may balance out the large blue component of the white light emitted from the phosphor-converted LED and, thereby, increase the CRI value of the white light.
- the inventors have appreciated that the conventional approach to produce white light with a high CRI value is expensive, complex, and inefficient.
- pairing the white phosphor-converted LEDs with red LEDs increases the total LED count in a lighting device, which increases the total cost of the device and the complexity of the electrical connections between each of the LEDs in the device.
- the addition of the red LED decreases the power efficiency of the device (e.g., measured in lumens per watt) because the power consumption of the red LED is not balanced out by the small boost to the total lumens provided by the additional red light.
- aspects of the present disclosure relate to lighting systems that produce broad spectrum light (e.g., white light) with a high CRI value (e.g., a CRI value of at least 95) using only broad spectrum LEDs (e.g., white phosphor-converted LEDs).
- broad spectrum LEDs e.g., white phosphor-converted LEDs
- the lighting systems disclosed herein may have high power efficiency ratings that exceed the present and upcoming standards for LED lighting device power efficiency standards.
- FIG. 6 shows the power efficiency requirements for LED lighting devices proposed as part of the Codes and Standards Enhancement (CASE) Initiative Program.
- the minimum power efficiency for LED lighting devices with a minimum CRI of 95 on sale between 2017 and 2019 is approximately 55 lumens per watt and the minimum power efficiency for LED lighting devices with a minimum CRI of 95 sold in 2019 and thereafter is 65 lumens per watt.
- the lighting systems described herein may provide high CRI white light with power efficiencies that far exceed these standards. For example, the lighting systems described herein may have power efficiencies in excess of 100 lumens per watt.
- the CRI value of white light emitted by white LEDs is improved through the use of photo-luminescent materials.
- the photo-luminescent materials may be configured to be emit light in a first spectrum in response to being excited by light in a second different spectrum.
- the photo-luminescent materials may be configured to absorb blue light and emit light with a longer wavelength (e.g., yellow light, red light, etc.). Thereby, the photo-luminescent materials may reduce the large blue component of the white light emitted by the white phosphor-converted LED and increase the components of light with longer wavelengths (e.g., red light).
- the resulting white light may have a substantially higher CRI than the white light emitted by the white phosphor-converted LED.
- photo-luminescent materials may include a phosphor (e.g., neodymium-doped yttrium aluminum garnet (Nd:YAG)), a silicate, and quantum dots (e.g., Cadmium-free quantum dots).
- the photo-luminescent material may be an organic material and/or comprise organic compounds. Additionally (or alternatively), the photo-luminescent material may be an inorganic material and/or comprise inorganic compounds.
- the white LED in combination with the photo-luminescent material may be integrated into a lighting system in any of a variety of ways.
- the lighting system may be implemented as an LED strip system comprising a plurality of interconnected LED strips each with a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately 5 ⁇ 8 inches.
- the LED strips may comprise a circuit board onto which an LED may be mounted.
- the LED may be configured to emit broad spectrum light (e.g., light has a spectrum that is at least 200 nanometers in size such as white light) having a first CRI value.
- At least one photo-luminescent material may be disposed between the LED mounted to the circuit board and the top surface of the lighting device increases the CRI of the broad spectrum light emitted by the LED from the first CRI value (e.g., no more than 80) to a higher, second CRI value (e.g., at least 95).
- the components of the LED strip may be at least partially encapsulated with an elastomer, such as silicone, to protect the components from the environment.
- LED lighting devices are generally unsuitable for direct viewing.
- the individual LEDs integrated into the device are generally discernable to a viewer because of their light intensity relative to other locations on the LED lighting device.
- LED lighting devices are generally employed in applications where the lighting device is not directly visible.
- the LED lighting device may be positioned such that only the reflected light from the LEDs can be seen by a viewer.
- aspects of the present disclosure relate to LED lighting devices that provide uniform (or near uniform) planar illumination along the LED lighting device.
- these LED lighting devices may be employed in direct view applications, such as in recessed slots, unlike conventional LED lighting devices.
- the LED lighting devices may be configured to provide uniform (or near uniform) planar illumination in any of a variety of ways.
- a lens may be placed over each LED in the lighting device that increases the maximum emission angle of the light from the LED to improve the distribution of the light.
- the LED may emit light with a maximum emission angle of no more than ⁇ 60 degrees and the lens may increase the maximum emission angle of at least ⁇ 80 degrees.
- a diffuser may be employed that diffuses the light from the lenses using any of a variety of materials, such as scattering particles.
- the lens in combination with the diffuser may be integrated into a lighting system in any of a variety of ways.
- the lighting system may be implemented as an LED strip system comprising a plurality of interconnected LED strips each with a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately 5 ⁇ 8 inches.
- the LED strips may comprise a tray having a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall.
- a circuit board may be disposed in the tray with an LED mounted thereon that faces the top of the lighting device.
- a lens may be disposed over the LED that is configured to increase the maximum emission angle of the light from the LED.
- the LED strip may be at least partially encapsulated with an elastomer that is in contact with the circuit board, the sidewalls of the tray, and only a portion of the lens such that part of the lens is left exposed (e.g., exposed to air).
- a diffuser may be disposed above the lens and configured to diffuse the light.
- FIGS. 1A and 1l B show top and bottom views, respectively, of an example lighting system 100 .
- the lighting system 100 is constructed as a strip lighting system that comprises a plurality of electrically coupled lighting devices 102 .
- the length of the lighting system 100 may be customized by adding (or removing) lighting devices 102 .
- Each of the lighting devices 102 may comprise LED assemblies 106 mounted to a circuit board that is at least partially encapsulated in at least one elastomer (e.g., silicone).
- the LED assemblies 106 may be electrically coupled via the circuit board to connectors 104 mounted on each end of the circuit board.
- the connector 104 may electrically couple each LED assemblies 106 to an external device such as another lighting device 102 or a power adapter.
- the LED assemblies 106 may receive power from the external device via the connector 104 and emit light.
- the lighting devices 102 in the lighting system 100 may have particular dimensions to enable a wide range of applications.
- the lighting devices 102 may be sized for mounting in recessed slots that are no more than 1 inch deep.
- the lighting devices 102 may have, for example, a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately 5 ⁇ 8 inches. Thereby, the lighting devices 102 may easily fit within the recessed slots.
- the lighting devices 102 may be constructed with other dimensions.
- the lighting devices 102 may, in some embodiments, have a height in excess of approximately 5 ⁇ 8 inches.
- the LED assemblies 106 may comprise an LED that is configured to emit light, such as a white phosphor-converted LED.
- the LED assemblies 106 may (or may not) comprise additional elements that change at least one characteristic of the light emitted by the LED.
- Example characteristics of the light emitted by the LED that may be changed include: a color correlated temperature (CCT) value, a CRI value, an R9 color index value, and an angle of emission. Any of a variety of elements may be employed to change the characteristics of the light emitted by the LED such as lenses, photo-luminescent materials, and/or scattering particles.
- One or more components of the lighting device 102 may be mounted to a circuit board (e.g., a printed circuit board).
- a circuit board e.g., a printed circuit board
- the LED assemblies 106 and/or the connectors 104 may be mounted to the circuit board.
- the circuit board may comprise one or more conductors to electrically couple the components mounted to the circuit board.
- the circuit board may be flexible to enable the lighting device 102 to bend to conform to uneven surfaces.
- the circuit board may be at least partially encapsulated in at least one elastomer, such as a silicone and/or a rubber.
- the elastomer may insulate the circuit board and/or components mounted to the circuit board, such as the LED assembly 106 and the connector 104 , from the external environment.
- the lighting system 100 may be employed in both indoor and outdoor applications.
- FIGS. 2A-2C shows a cross-section of an example implementation of the lighting device 102 shown in FIG. 1 that is designed to provide white light with a high CRI.
- the lighting device comprises a tray 202 that is configured to receive a circuit board 210 with an LED 212 mounted thereon.
- An elastomer 214 may be potted over the circuit board 210 to at least partially encapsulate the circuit board 210 and secure the circuit board 210 to the lighting device.
- a photo-luminescent material layer 216 is disposed on top of the elastomer 214 and may be configured to change at least one characteristic of the light emitted by the LED 212 such as CRI, R9 color rendering value, and/or CCT.
- Another elastomer 218 may be potted over the photo-luminescent material layer 216 to separate the photo-luminescent material layer 216 from the environment.
- the tray 202 may comprise a base 206 onto which the circuit board 210 may be disposed and sidewalls 208 that extend upward from the base 206 .
- the sidewalls 208 may be parallel to each other and/or perpendicular to the base 206 .
- the base 206 may form a bottom surface of the lighting device while the sidewalls 208 may form the lateral surfaces of the lighting device.
- the tray 202 may be constructed from any of a variety of materials.
- the tray 202 may be constructed from an elastomer such as silicone.
- the elastomer may be manufactured through an extrusion process (e.g., a silicone extrusion process).
- the elastomer employed to construct the tray 202 may be different from the elastomers 214 and/or 218 .
- the elastomer in the tray 202 may be more porous than the elastomers 214 and/or 218 to provider greater heat dissipation capability to dissipate heat from the circuit board 210 and/or the LED 212 .
- the tray 202 may comprise an overhang 220 that extends from one of the sidewalls 208 towards another sidewall 208 as shown in FIG. 2C .
- the overhang 220 may be parallel to the base 206 .
- the LED 212 may be mounted to the circuit board 210 at a location that is under the overhang 220 . Thereby, the LED 212 may be obscured from view. Further, the overhang 220 may be long enough such that the light ray 222 emitted at the maximum emission angle of the LED 212 does not directly leave the lighting device.
- the light ray 222 may reach the top surface of the elastomer 218 at such an angle that the light ray 222 is reflected back from the top surface (e.g., because the angle is above the critical angle for total internal reflection (TIR)). Thereby, all of the light emitted by the LED 212 may be reflected off of at least one surface in the lighting device before leaving the top surface of the elastomer 218 .
- TIR critical angle for total internal reflection
- the circuit board 210 may be configured to electrically couple the LED 212 to one or more other components.
- the circuit board may comprise conductors that electrically couple the LED 212 to a connector mounted to the circuit board (e.g., connector 204 in FIG. 1A ).
- the circuit board 210 may be, for example, an FR4 649 printed circuit board (PCB). Additionally (or alternatively), the circuit board may be a flexible circuit board 210 to permit the lighting device to bend without breaking.
- the LED 212 may be configured to emit broad spectrum light, such as light with a spectrum that is at least 200 nanometers (nm) in size (e.g., 200 nm, 225 nm, 250 nm, 275 nm, 300 nm, etc.).
- the broad spectrum light may be, for example, white light.
- the LED 212 may be construed in any of a variety of ways to generate the broad spectrum light.
- the LED 212 may be constructed as a white phosphor-converted LED.
- the LED 212 may be configured to emit narrow spectrum light in some embodiments, such as light with a spectrum that is less than 200 nm in size.
- the LED 212 may be constructed as a blue LED without a phosphor coating.
- the elastomer 214 may be potted over the circuit board 210 to hold the circuit board 210 in-place in the lighting device.
- the elastomer 214 may, in some embodiments, be in direct contact with the LED 212 . Allowing the elastomer 214 to be in direct contact with the LED 212 may, for example, change the spectrum of the light emitted by the LED 212 because the elastomer 214 may have a refractive index that is higher than air (e.g., a refractive index of approximately 1.5).
- FIG. 7 shows the difference between the spectrums of the light emitted from the LED 212 when the light is emitted directly into elastomer 214 instead of air.
- a first line 702 shows the spectrum of light from the LED 212 that is emitted directly into elastomer 214 and a second line 704 shows the spectrum of light from the LED 212 that is emitted directly into air.
- the blue component between approximately 425 nm and 475 nm of the light from the LED 212 is substantially increased when the light is emitted directly into the elastomer 214 .
- the additional blue component of the light from the LED 212 may be advantageously employed to excite photo-luminescent materials in the photo-luminescent material layer 216 . Thereby, the blue component of the light from the LED 212 may be converted into light with longer wavelengths, such as yellow and/or red light, by the photo-luminescent material layer 216 .
- the photo-luminescent material layer 216 may comprise one or more photo-luminescent materials that are configured to emit light in a first spectrum in response to being excited by light in a second different spectrum.
- the photo-luminescent materials may be configured to absorb light with a shorter wavelength, such as blue light, and emit light with a longer wavelength, such as yellow and/or red light.
- the particular photo-luminescent materials and their respective proportions in the photo-luminescent material layer 216 may depend on, for example, the desired spectrum of light to be generated by the lighting device.
- Example photo-luminescent materials include a phosphor (e.g., neodymium-doped yttrium aluminum garnet (Nd:YAG)), a silicate, and a quantum dot (e.g., a Cadmium free quantum dot).
- the photo-luminescent material may be an organic material and/or comprise organic compounds such as any of the color conversion materials described in U.S. Patent Publication No. 2017/0137627. Additionally (or alternatively), the photo-luminescent material may be an inorganic material and/or comprise inorganic compounds.
- the photo-luminescent material layer 216 may be constructed in any of a variety of ways.
- the photo-luminescent material layer 216 may be formed as a sheet (e.g., as a foil) that is sandwiched between elastomer 214 and 218 and comprises a set of one or more photo-luminescent materials as shown in FIGS. 2A and 2C .
- the photo-luminescent material layer 216 may be constructed as a plurality of separate elements (e.g., separate circular sheets) that are each disposed over an LED on the circuit board 210 .
- the separate elements may be uniquely configured for the specific LED that the respective element is disposed over (e.g., a first element with a first composition may be disposed over a first LED and a second element with a second, different composition may be disposed over a second, different LED).
- the photo-luminescent material layer 216 may comprise a set of one or more photo-luminescent materials distributed through a polymer (e.g., silicone) that is sandwiched between elastomer 214 and 218 as shown in FIG. 2B .
- FIG. 8 shows the changes to the light spectrum that may be created by the photo-luminescent materials in the photo luminescent layer 216 .
- a first line 802 shows the spectrum of light from a white phosphor-converted LED without any change from a photo-luminescent material
- a second line 804 shows the spectrum of light from the white phosphor-converted LED after passing through a first quantum dot material
- a third line 806 shows the spectrum of light from the white phosphor-converted LED after passing through a different, second quantum dot material.
- Table 1 A summary of the changes in the spectrum caused by each of the first and second quantum dot materials is shown in Table 1 below:
- the composition of the photo-luminescent material layer 216 may be customize to achieve a desired light spectrum for any of a variety of different applications.
- the photo-luminescent material layer 216 may be designed to provide light suitable for black light units (BLUs) in display applications.
- the LED 212 may be configured to emit narrow spectrum light (e.g., blue light) and the photo-luminescent material layer 216 may be configured to absorb some of the blue light and, in turn, emit light with a longer wavelength (e.g., green, yellow, orange, and/or red light).
- BLUs black light units
- the ratio of the red quantum dot material to the green quantum dot material may be 80:20 (i.e., there are 80 parts of red quantum dot material for every 20 parts of green quantum dot material).
- line 902 shows the spectrum of light from a blue LED
- line 904 shows the spectrum light from the yellow green phosphor material
- line 906 shows the spectrum of light emitted by the excited red quantum dot material
- line 908 shows the spectrum of light emitted by the excited green quantum dot material
- line 910 that shows the resulting spectrum of the lighting device (e.g., a combination of the spectrums of the blue LED, the phosphor, the red quantum dot material, and the green quantum dot material).
- Other combinations of materials may be employed to achieve a similar spectrum.
- the green quantum dot material may be removed entirely and replaced with additional red quantum dot material. Thereby, the photo-luminescent layer 216 may omit the green quantum dot material altogether.
- the photo-luminescent material layer 216 for a lighting device being employed in BLUs where the LED 212 emits light with a broad spectrum may be designed differently.
- FIG. 10 shows the spectrum of another example lighting device suitable for a BLU that is constructed using a broad spectrum LED.
- line 1002 shows the light spectrum of a white phosphor-converted LED formed from a blue LED coated in a yellow phosphor coating
- line 1004 shows the light spectrum of a white phosphor-converted LED formed from a blue LED coated in a red phosphor coating paired with a photo-luminescent material in the photo-luminescent material layer 216 that is configured to absorb some of the blue light and emit green light.
- the light spectrum of the light from the phosphor-converted LED and photo-luminescent material layer 216 produces light with a warmer color temperature than employing the white phosphor-converted LED alone.
- the spectrum of a lighting device may be adjusted to achieve a desired light spectrum by varying the types and/or concentrations of photo-luminescent materials in the photo-luminescent material layer 216 .
- the red component of the light emitted by the lighting device may be increased by adding a red quantum dot material to the photo-luminescent merial layer 216 .
- the lighting device described herein may be employed to create light for any of a variety of applications.
- the composition of the photo-luminescent material layer 216 may be designed for grow light applications.
- the lighting devices described herein may be constructed as grow lights configured to stimulate plant growth.
- the spectrum of the light generated by the lighting device may, for example, closely match the spectrum of light absorbed by plants.
- Such a spectrum may be achieved by, for example, selecting a narrow spectrum LED that emits light with a wavelength below 500 nm (e.g., a blue LED) or a broad spectrum LED that emits a substantial portion light with a wavelength below 500 nm (e.g., a phosphor-converted white LED) for the LED 212 and adding photo-luminescent materials to the photo-luminescent material layer 216 that absorb some of the light below 500 nm from the LED and emit orange and/or red light (e.g., light with a spectrum between 600 nm and 700 nm).
- a narrow spectrum LED that emits light with a wavelength below 500 nm
- a broad spectrum LED that emits a substantial portion light with a wavelength below 500 nm
- a phosphor-converted white LED e.g., a phosphor-converted white LED
- FIG. 11 shows the spectrum of light emitted by an example grow light compared with the spectrum of light absorbed by different chlorophylls and beta carotene.
- line 1102 shows the spectrum of light absorbed by beta carotene
- line 1104 shows the spectrum of light absorbed by chlorophyll A
- line 1106 shows the spectrum of light absorbed by chlorophyll B
- line 1108 shows the spectrum of light the example grow light.
- the spectrum of the light from the example grow light closely approximates the light absorbed by chlorophyll A and chlorophyll B. Further, the spectrum includes little light in portions of the spectrum that a plant would not absorb (e.g., between 525 and 600 nm) to improve the power efficiency of the grow light.
- the photo-luminescent material layer 216 may comprise any of a variety of photo-luminescent materials. Further, the particular composition of the photo-luminescent material layer 216 may vary based on the desired light spectrum, which may vary based on the particular application.
- the photo-luminescent material layer 216 may be covered by the elastomer 218 .
- the elastomer 218 may be, for example, silicone.
- the elastomer 218 may have the same or different characteristics, such as refractive index, relative to the elastomer 214 . For example, the elastomer 218 may have a different (e.g., higher or lower) refractive index than the elastomer 214 .
- photo-luminescence materials may be integrated into portions of the lighting device separate from the photo-luminescence material layer 216 .
- the elastomer 218 and/or the elastomer 214 may comprise a photo-luminescence material such as a phosphor.
- other materials separate from photo-luminescence materials such as scattering particles and/or pigments, may be integrated into any of the following components of the lighting device: the elastomer 214 , the elastomer 218 , the photo-luminescence material layer 216 , and/or the tray 202 .
- the lighting device shown in FIGS. 2A-2C may be manufactured in any of a variety of ways.
- the lighting device may be manufactured by, for example, performing the following steps: (1) mounting the electronic components (e.g., the LED 212 ) to the circuit board 210 ; (2) inserting the circuit board into the tray 202 ; (3) potting the elastomer 214 over the circuit board 210 in the tray 202 ; (4) depositing the photo-luminescent material layer 216 on the elastomer 214 ; and (5) potting the elastomer 218 over the photo-luminescent material layer 216 ; and (6) packaging the lighting device.
- the electronic components e.g., the LED 212
- the lighting device may be configured to provide uniform planar illumination in some embodiments. Thereby, the location of the LEDs within the lighting device may be indistinguishable to a viewer.
- These lighting devices may be employed in any of a variety of direct view applications including architectural lighting, commercial lighting, hospitality lighting, residential lighting, office lighting, hallway lighting, bath lighting, and vanity lighting.
- the lighting device may be employed in 1 inch slot to create a glare free, architectural lighting accent within 5 ⁇ 8 inch deep drywall.
- the plaster in aluminum extrusion within 5 ⁇ 8′′ deep may house 1-2 lighting devices.
- These lighting devices may be constructed as strips, such as the LED strips shown in FIGS. 1A and 1B , that may advantageously allow the lighting devices to achieve continuous runs in various installation situations such as: outside corners, inside corners, T-connections, and fully seamless corners.
- the lighting device may employ any of a variety of devices to provide uniform planar illumination such as lenses and diffusive elements.
- FIGS. 3 and 4 shows an example implementation of lighting device 102 that provides uniform planar illumination.
- FIG. 3 shows an example cross-section of the example lighting device
- FIG. 4 shows a deconstructed version of the example lighting device.
- the lighting device comprises a tray 302 into which a circuit board 304 with LEDs 306 mounted thereon may be disposed.
- the tray 302 , circuit board 304 , and LEDs 306 may be constructed similarly (or identically) to the tray 202 , the circuit board 210 , and the LED 212 , respectively, described above.
- the circuit board 306 may comprise a connector 402 that may electrically couple the LEDs 306 mounted on the circuit board 306 to an external power source.
- a lens 308 may be disposed over the LEDs 306 (e.g., so as to provide an air gap between the LEDs 306 and an inner surface of the lens 308 ) and configured to increase a maximum emission angle of light from the LED 306 .
- the lens 308 may be only partially encapsulated in an elastomer 312 so as to expose a top portion of the lens 308 to air.
- a sleeve 310 may be slid over the tray 302 so as to provide an air gap 314 between the top of the lens 308 and the top side of the sleeve 310 .
- a diffuser 316 may be disposed on the sleeve 310 that is configured to diffuse light from the LEDs 308 .
- the lenses 308 may be configured to increase a maximum emission angle of light from the LEDs 308 .
- the maximum emission angle of light from the LEDs 308 may be no more than ⁇ 60 degrees and the lens 308 may increase the maximum emission angle of the light from the LEDs to at least ⁇ 80 degrees.
- the lens 308 may be configured to increase a light intensity at higher angles.
- the light intensity from the LED 306 at ⁇ 60 degrees may be a first value and the lens 308 may increase the light intensity at ⁇ 60 degrees to a second value that is higher than the first value.
- An example construction of the lenses 308 is shown in FIG. 5 by lens 504 that is disposed over the LED 502 .
- the lens 504 comprises a cavity 503 into which the LED 502 may be disposed.
- the cavity 503 may form an air gap between the LED 502 and an inner surface of the lens 504 .
- Additional materials may be disposed in the cavity 503 between the LED 502 and the inner surface of the lens 504 that are configured to change a characteristic of the light from the LED such as any of the scattering particles, photo-luminescence materials, and/or pigments described herein. These materials may be, for example, integrated into a polymer to form a monolithic element that may be disposed between the LED 502 and the inner surface of the lens 504 .
- the lens 504 is configured to increase the maximum angle of emission to ⁇ 80 degrees resulting in light being emitted over a span of 160 degrees in the light distribution pattern 500 . It should be appreciated that the example construction of the lens 308 in FIG. 5 is only one possible implementation and that the lens 504 may be implemented in any of a variety of ways.
- the elastomer 312 may encapsulate the top surface of the circuit board 304 and only a portion of the lenses 308 .
- the elastomer 312 may only be in contact with a bottom portion of the outer surface of the lens 308 while leaving an upper portion of the outer surface of the lens 308 exposed to air. Leaving a portion of the lens 308 may advantageously improve the performance the lens by, for example, maximizing a difference in refractive index of the lens 308 itself and the material into which the light from the lens propagates (e.g., air).
- the elastomer 312 may be constructed from any of a variety of materials, such as silicone.
- the elastomer 312 may have a lower refractive index such as a refractive index of approximately 1.4.
- the sleeve 310 may be constructed as to be a hollow rectangle prism that surrounds the tray 302 and the components mounted therein.
- the sleeve 310 may be constructed from an elastomer, such as silicone.
- the sleeve 310 may be constructed from an extruding process (e.g., a silicone extruding process).
- the diffuser 316 may be constructed to diffuse the light from the lenses 308 so as to provide uniform (or near uniform) planar illumination.
- the diffuser 316 may be configured to diffuse light using any of a variety of techniques.
- the diffuser 316 may comprise scattering particles that are configured to scatter light that are distributed throughout an elastomer (e.g., silicone) with a different (e.g., lower or higher) refractive index than the elastomer 312 .
- the refractive index of the elastomer 312 may have a refractive index of approximately 1.4 and the refractive index of the elastomer in the diffuser 316 may be approximately 1.5.
- the scattering particles may advantageously allow the diffuser 316 to be thin while still allowing the diffuser to effectively diffuse the light from the LEDs.
- the entire lighting device (including the diffuser) may be no more than 5 ⁇ 8 inches tall. Thereby, the lighting device may easily be mounted in 1 inch recessed slots without protruding from the slot.
- Any of a variety of scattering particles may be employed such as Barium Sulfate (BaSO 4 ) and/or Titanium Dioxide (TiO 2 ).
- the diffuser 316 may comprise one or more materials that are configured to change a characteristic of the light such as any of the photo-luminescence materials described herein and/or pigments.
- the lighting device shown in FIGS. 3 and 4 may be manufactured in any of a variety of ways.
- the lighting device may be manufactured by, for example, performing the following steps: (1) mounting the electronic components (e.g., the LED 306 and/or the connector 402 ) to the circuit board 304 ; (2) inserting the circuit board into the tray 302 ; (3) placing the lenses 308 over the LEDs 306 ; (4) potting the elastomer 312 over the circuit board 304 in the tray 302 ; (5) inserting the tray 302 into the sleeve 310 ; (6) potting the material that comprises the diffuser 316 (e.g., an elastomer with scattering particles, photo-luminescence materials, and/or pigments) over the sleeve 310 ; and (7) packaging the lighting device.
- the electronic components e.g., the LED 306 and/or the connector 402
- the lighting device may be manufactured by, for example, performing the following steps: (1) mounting the electronic components (e.
- the lighting devices described herein may be designed to achieve any of a variety of desired light output characteristics.
- the lighting devices described herein may be designed for a range of CCT values such as, 2,700 degrees K, 3,000 degrees K, 3,500 degrees K, 4,000 degrees K, and 5,000 degrees K; a range of CRI values such as any value between 90 and 100; a range of R9 color rendering values such as any value between 90 and 100; a range of light intensity values such as a range of 270-480 lumens per 12 inch section of lighting devices (e.g., per pair of two 6 inch lighting devices); a range of power consumption levels such as any wattage up to 9 Watts; and a range of voltage levels such as 24 Volts.
- the lighting devices may be configured to be dimmable via any of a variety of external dimmable electronic drivers. Still yet further, the lighting device may configured to provide light within a 3-step Macadam ellipse and/or a 2-step Macadam ellipse of a predefined color coordinate. For example, the lighting device may be configured as a lighting strip configured to provide light within a 3-step Macadam ellipse and/or a 2-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip.
- the terms “approximately,” “about,” and “substantially” may be used to mean within ⁇ 20% of a target value in some embodiments, within ⁇ 10% of a target value in some embodiments, within ⁇ 5% of a target value in some embodiments, and yet within ⁇ 2% of a target value in some embodiments.
- the terms “approximately,” “about,” and “substantially” may include the target value.
Abstract
Description
- This application claims the benefit under 35 U.S.C. § 119(e) of each of U.S. Provisional Application Ser. No. 62/451,612, titled “FLEXIBLE LINEAR STRIP” filed on Jan. 27, 2017 and U.S. Provisional Application Ser. No. 62/451,616, titled “RECESS SLOT LIGHTING” filed on Jan. 27, 2017, each of which is hereby incorporated herein by reference in its entirety.
- Light emitting diodes (LEDs) are typically formed from a semiconductor material that is doped to create a p-n junction. The LEDs typically emit light in a narrow spectrum (e.g., a spectrum that is smaller 200 nanometers in size) that is dependent upon the bandgap energy of the semiconductor material that forms the p-n junction. For example, an LED formed using one semiconductor material may emit light of a different color (and thereby in a different spectrum) than an LED formed using another semiconductor material.
- White light has a broad spectrum (e.g., a spectrum that is larger than 200 nanometers in size), unlike the light typically emitted from a single LED. White light may be formed by mixing light with different colors (and thereby different spectrums) together. For example, white light may be formed by mixing red, green, and blue light or blue and yellow light. Inexpensive LEDs that create white light (a white LED) typically use an LED configured to emit blue light (a blue LED) that is coated with a yellow phosphor. The yellow phosphor coating converts a portion of the blue light from the LED into yellow light. The mixture of the blue and yellow light forms white light.
- According to at least one aspect, a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface is provided. The lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit broad spectrum light having a first color rendering index (CRI) value toward the top surface of the lighting device, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the top surface of the lighting device, the at least one photo-luminescent material being configured to increase the CRI of the broad spectrum light emitted by the LED from the first CRI value to a second CRI value that is higher than the first CRI value, and at least one elastomer encapsulating at least part of the circuit board.
- In some embodiments, the LED is a white phosphor-converted LED configured to emit white light. In some embodiments, the broad spectrum light has a spectrum that is at least 200 nanometers in size.
- In some embodiments, the second CRI value is at least 95. In some embodiments, the at least one photo-luminescent material is configured to increase an R9 color rendering value of the broad spectrum light emitted by the LED from a first R9 color rendering value to a second R9 color rendering value that is higher than the first R9 color rendering value. In some embodiments, the second R9 color rendering value is at least 95.
- In some embodiments, the at least one photo-luminescent material is configured to change a color correlated temperature (CCT) of the broad spectrum light emitted by the LED from a first CCT value to a second CCT value that is different from the first value. In some embodiments, the first CCT value is higher than the second CCT value. In some embodiments, the first CCT value is at least 4000 degrees Kelvin (K) and the second CCT value is no more than 3000 degrees K. In some embodiments, the first CCT value is lower than the second CCT value. In some embodiments, the at least one photo-luminescent material is configured to absorb at least some light with a wavelength below 500 nanometers and emit at least some light with a wavelength above 500 nanometers.
- In some embodiments, the lighting device is constructed to operate in both indoor installations and outdoor installations. In some embodiments, the lighting device is no more than 5/8 inches tall. In some embodiments, the lighting device is no more than 3 inches wide and no more than 6 inches long.
- In some embodiments, the at least one elastomer comprises a first elastomer disposed between the circuit board and a bottom surface of the lighting device and a second elastomer disposed between the circuit board and the top surface of the lighting device that is different from the first elastomer. In some embodiments, the at least one photo-luminescent material is distributed through at least part of the second elastomer. In some embodiments, the first elastomer has different heat dissipation properties and the second elastomer. In some embodiments, the first elastomer is more porous than the second elastomer.
- In some embodiments, the at least one photo-luminescent material is formed as a sheet that is at least partially encapsulated by the at least one elastomer. In some embodiments, the lighting device further comprises scattering particles disposed between the circuit board and the top surface of the lighting device and configured to scatter at least some broad spectrum light emitted from the LED. In some embodiments, the scattering particles are distributed through at least part of the at least one elastomer.
- In some embodiments, the lighting device has an efficiency rating of at least 100 lumens per watt. In some embodiments, the at least one photo-luminescent material comprises at least one member selected from the group consisting of: a phosphor, a silicate, and a quantum dot. In some embodiments, the at least one photo-luminescent material comprises an organic material.
- In some embodiments, the lighting device is constructed as a lighting strip and wherein the LED mounted to the circuit board is a first LED of a plurality of LEDs mounted to the circuit board along a length of the lighting strip. In some embodiments, the lighting device is configured to provide light within a 3-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip. In some embodiments, the lighting device is configured to provide light within a 2-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip.
- According to at least one aspect, a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface is provided. The lighting device comprises a circuit board, a plurality of light emitting diodes (LEDs) mounted to the circuit board and each configured to emit light toward the top surface of the lighting device, at least one first photo-luminescent material disposed over a first LED of the plurality of LEDs and configured to change at least one characteristic of the light emitted by the first LED, at least one second photo-luminescent material disposed over a second LED of the plurality of LEDs and configured to change at least one characteristic of the light emitted by the second LED, the at least one second photo-luminescent material being different from the at least one first photo-luminescent material, and at least one elastomer encapsulating at least part of the circuit board.
- In some embodiments, at least one of the plurality of LEDs is configured to emit narrow spectrum light that has a spectrum of no more than 200 nanometers in size. In some embodiments, at least one of the plurality of LEDs is configured to emit broad spectrum light that has a spectrum of at least 200 nanometers in size. In some embodiments, the light emitted from the first LED has a different spectrum of the light emitted from the second LED.
- According to at least one aspect, a grow light configured to emit light to stimulate plant growth is provided. The grow light comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light toward a top surface of the lighting device, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the top surface of the lighting device, the at least one photo-luminescent material being configured to absorb at least some light from the LED having a wavelength below 500 nanometers (nm) and emit at least some light having a wavelength between 625 nm and 675 nm, and at least one elastomer encapsulating at least part of the circuit board and being in direct contact with a top surface of the LED.
- In some embodiments, the LED is configured to emit broad spectrum light that has a spectrum of at least 200 nanometers in size and includes light having a wavelength below 500 nm. In some embodiments, the LED is configured to emit narrow spectrum light that has a spectrum of no more than 200 nanometers in size and includes light having a wavelength below 500 nm. In some embodiments, the at least one photo-luminescent material is configured to absorb at least some light having a wavelength below 500 nm emitted by the LED.
- According to at least one aspect, a lighting device having a top surface configured to provide light, a bottom surface opposite the top surface, a first lateral surface between the top and bottom surfaces, and a second lateral surface opposite the first lateral surface between the top and bottom surfaces is provided. The lighting device comprises a tray comprising a base that forms the bottom surface of the lighting device, a first sidewall that extends from the base and forms the first lateral surface of the lighting device, a second sidewall that extends from the base and forms the second lateral surface of the lighting device, and an overhang that extends from the second sidewall towards the first sidewall and is parallel to the base, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board at a location that is under the overhang that extends from the second sidewall of the tray and being configured to emit broad spectrum light, and at least one elastomer that encapsulates at least part of the second surface of circuit board and is in contact with the first and second sidewalls of the tray.
- In some embodiments, the lighting device further comprises at least one photo-luminescent material disposed between the second surface of the circuit board and the top surface of the lighting device and configured to change at least one characteristic of the broad spectrum light emitted by the LED. In some embodiments, the at least one characteristic comprises a characteristic selected from the list consisting of: a color correlated temperature, a color rendering index value, and an R9 color rendering value. In some embodiments, the at least one photo-luminescent material is at least partially encapsulated by the at least one elastomer. In some embodiments, the lighting device is constructed such that the light from the LED that reaches the top surface without being reflected by another surface of the lighting device is at an angle above the critical angle for total internal reflection.
- According to at least one aspect, a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface is provided. The lighting device comprises a tray comprising a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board and configured to emit broad spectrum light up to a maximum emission angle, a lens disposed over the LED configured to increase the maximum emission angle from a first value to a second value that is larger than the first value, a first elastomer that encapsulates at least part of the second surface of the circuit board and is in contact with only a first portion of the lens such that a second portion of the lens is left exposed, and a diffuser disposed between the lens and the top surface of the lighting device and being configured to diffuse the broad spectrum light.
- In some embodiments, the lens comprises a cavity that faces the circuit board and wherein the LED is disposed within the cavity. In some embodiments, the LED is a white phosphor-converted LED configured to emit white light. In some embodiments, the broad spectrum light has a spectrum that is at least 200 nanometers in size. In some embodiments, the first value is no more than ±60 degrees and the second value is at least ±80 degrees.
- In some embodiments, the lighting device further comprises a sleeve that receives the tray and comprises a bottom side disposed under the base of the tray and a top side disposed above the first and second sides of the tray so as to form an air gap between the second portion of the lens and the top side of the sleeve. In some embodiments, the diffuser is in disposed on the top surface of the sleeve. In some embodiments, the sleeve is constructed from silicone. In some embodiments, the tray is constructed from silicone.
- In some embodiments, the distance between the top surface and the bottom surface of the lighting device is no more than ⅝ inches. In some embodiments, the top and bottom surfaces are each no more than 3 inches wide and no more than 6 inches long.
- In some embodiments, the diffuser comprises a second elastomer that is different from the first elastomer. In some embodiments, the first elastomer has a first refractive index and the second elastomer has a second refractive index that is different from the first refractive index. In some embodiments, the first refractive index is smaller than the second refractive index. In some embodiments, the diffuser comprises a plurality of scattering particles distributed throughout the second elastomer. In some embodiments, the diffuser comprises at least one photo-luminescent material at least partially encapsulated by the second elastomer. In some embodiments, the at least one photo-luminescent material comprises at least one member selected from the group consisting of: a phosphor, a silicate, and a quantum dot. In some embodiments, the diffuser comprises a pigment distributed throughout the second elastomer.
- According to at least one aspect, a lighting device having a top surface configured to provide light and a bottom surface opposite the top surface is provided. The lighting device comprises a tray comprising a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall, a circuit board disposed in the tray having a first side in contact with the base and a second side that is opposite the first side, a light emitting diode (LED) mounted to the second side of the circuit board and configured to emit broad spectrum light up to a maximum emission angle, a lens disposed over the LED configured to increase the maximum emission angle from a first value to a second value that is larger than the first value, at least one photo-luminescent material disposed between the LED mounted to the circuit board and the lens, the at least one photo-luminescent material being configured to change at least one characteristic of the light from the LED, a first elastomer that encapsulates at least part of the second surface of the circuit board and is in contact with only a first portion of the lens such that a second portion of the lens is left exposed, and a diffuser disposed between the lens and the top surface of the lighting device and being configured to diffuse the broad spectrum light.
- In some embodiments, the at least one photo-luminescent material is configured to change at least one of: a color rendering index, an R9 color rendering value, and a color correlated temperature of the broad spectrum light emitted by the LED.
- Various aspects and embodiments will be described with reference to the following figures. It should be appreciated that the figures are not necessarily drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing.
-
FIG. 1A shows a top view of an example lighting system, according to some embodiments of the technology described herein; -
FIG. 1B shows a bottom view of the example lighting system ofFIG. 1A , according to some embodiments of the technology described herein; -
FIG. 2A shows a cross-sectional view of an example lighting device, according to some embodiments of the technology described herein; -
FIG. 2B shows a cross-sectional view of another example lighting device, according to some embodiments of the technology described herein; -
FIG. 2C shows a cross-sectional view of another example lighting device, according to some embodiments of the technology described herein; -
FIG. 3 shows a cross-sectional view of an example lighting device with integrated lenses, according to some embodiments of the technology described herein; -
FIG. 4 shows a top view of a deconstructed version of the lighting device ofFIG. 3 , according to some embodiments of the technology described herein; -
FIG. 5 shows a cross-sectional view of an example lens, according to some embodiments of the technology described herein; -
FIG. 6 is a graph showing the power efficiency requirements of high color rendering index (CRI) light sources, according to some embodiments of the technology described herein; -
FIG. 7 is a graph showing the spectrum of light emitted by example lighting devices with different elastomer configurations, according to some embodiments of the technology described herein; -
FIG. 8 is a graph showing the spectrum of light emitted by example lighting devices with different photo-luminescent materials, according to some embodiments of the technology described herein; -
FIG. 9 is a graph showing the spectrum of light emitted by each component of an example lighting device for a back lighting unit (BLU), according to some embodiments of the technology described herein; -
FIG. 10 is a graph showing the spectrum of another example lighting device for a BLU, according to some embodiments of the technology described herein; and -
FIG. 11 is a graph showing the spectrum of light emitted by an example lighting device compared with the spectrum of light absorbed by different chlorophylls and beta carotene, according to some embodiments of the technology described herein. - As discussed above, inexpensive white LEDs generally are constructed as white phosphor-converted LEDs where a blue LED is covered with a phosphor coating that converts a portion of the blue light from the LED to yellow light so as to create white light. However, these white phosphor-converted LEDs generally emit white light with a low color rendering index (CRI) value because the phosphor coating may allow a substantial portion of the blue light emitted from the LED to remain unconverted. As a result, the white light emitted from such inexpensive LEDs has a large blue component that decreases the CRI value of the white light. Conventionally, the CRI value of the white light emitted by a phosphor-converted LED is improved by adding a red LED that emits red light that mixes with the white light emitted by the phosphor-converted LED to increase the red component of the white light. The increased red component may balance out the large blue component of the white light emitted from the phosphor-converted LED and, thereby, increase the CRI value of the white light.
- The inventors have appreciated that the conventional approach to produce white light with a high CRI value is expensive, complex, and inefficient. In particular, pairing the white phosphor-converted LEDs with red LEDs increases the total LED count in a lighting device, which increases the total cost of the device and the complexity of the electrical connections between each of the LEDs in the device. Further, the addition of the red LED decreases the power efficiency of the device (e.g., measured in lumens per watt) because the power consumption of the red LED is not balanced out by the small boost to the total lumens provided by the additional red light.
- Accordingly, aspects of the present disclosure relate to lighting systems that produce broad spectrum light (e.g., white light) with a high CRI value (e.g., a CRI value of at least 95) using only broad spectrum LEDs (e.g., white phosphor-converted LEDs). Thereby, the additional cost, complexity, and power inefficiency created by pairing white phosphor-converted LEDs with red LEDs may be eliminated. Further, the lighting systems disclosed herein may have high power efficiency ratings that exceed the present and upcoming standards for LED lighting device power efficiency standards.
FIG. 6 shows the power efficiency requirements for LED lighting devices proposed as part of the Codes and Standards Enhancement (CASE) Initiative Program. As shown, the minimum power efficiency for LED lighting devices with a minimum CRI of 95 on sale between 2017 and 2019 is approximately 55 lumens per watt and the minimum power efficiency for LED lighting devices with a minimum CRI of 95 sold in 2019 and thereafter is 65 lumens per watt. The lighting systems described herein may provide high CRI white light with power efficiencies that far exceed these standards. For example, the lighting systems described herein may have power efficiencies in excess of 100 lumens per watt. - In some embodiments, the CRI value of white light emitted by white LEDs (e.g., white phosphor-converted LEDs) is improved through the use of photo-luminescent materials. The photo-luminescent materials may be configured to be emit light in a first spectrum in response to being excited by light in a second different spectrum. For example, the photo-luminescent materials may be configured to absorb blue light and emit light with a longer wavelength (e.g., yellow light, red light, etc.). Thereby, the photo-luminescent materials may reduce the large blue component of the white light emitted by the white phosphor-converted LED and increase the components of light with longer wavelengths (e.g., red light). The resulting white light may have a substantially higher CRI than the white light emitted by the white phosphor-converted LED. Any of a variety of photo-luminescent materials may be employed. Example photo-luminescent material may include a phosphor (e.g., neodymium-doped yttrium aluminum garnet (Nd:YAG)), a silicate, and quantum dots (e.g., Cadmium-free quantum dots). The photo-luminescent material may be an organic material and/or comprise organic compounds. Additionally (or alternatively), the photo-luminescent material may be an inorganic material and/or comprise inorganic compounds.
- The white LED in combination with the photo-luminescent material may be integrated into a lighting system in any of a variety of ways. In some embodiments, the lighting system may be implemented as an LED strip system comprising a plurality of interconnected LED strips each with a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately ⅝ inches. In these embodiments, the LED strips may comprise a circuit board onto which an LED may be mounted. The LED may be configured to emit broad spectrum light (e.g., light has a spectrum that is at least 200 nanometers in size such as white light) having a first CRI value. At least one photo-luminescent material may be disposed between the LED mounted to the circuit board and the top surface of the lighting device increases the CRI of the broad spectrum light emitted by the LED from the first CRI value (e.g., no more than 80) to a higher, second CRI value (e.g., at least 95). The components of the LED strip may be at least partially encapsulated with an elastomer, such as silicone, to protect the components from the environment.
- The inventors have additionally appreciated that LED lighting devices are generally unsuitable for direct viewing. In particular, the individual LEDs integrated into the device are generally discernable to a viewer because of their light intensity relative to other locations on the LED lighting device. As a result, LED lighting devices are generally employed in applications where the lighting device is not directly visible. For example, the LED lighting device may be positioned such that only the reflected light from the LEDs can be seen by a viewer.
- Accordingly, aspects of the present disclosure relate to LED lighting devices that provide uniform (or near uniform) planar illumination along the LED lighting device. Thereby, these LED lighting devices may be employed in direct view applications, such as in recessed slots, unlike conventional LED lighting devices. The LED lighting devices may be configured to provide uniform (or near uniform) planar illumination in any of a variety of ways. In some embodiments, a lens may be placed over each LED in the lighting device that increases the maximum emission angle of the light from the LED to improve the distribution of the light. For example, the LED may emit light with a maximum emission angle of no more than ±60 degrees and the lens may increase the maximum emission angle of at least ±80 degrees. Additionally, a diffuser may be employed that diffuses the light from the lenses using any of a variety of materials, such as scattering particles.
- The lens in combination with the diffuser may be integrated into a lighting system in any of a variety of ways. In some embodiments, the lighting system may be implemented as an LED strip system comprising a plurality of interconnected LED strips each with a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately ⅝ inches. In these embodiments, the LED strips may comprise a tray having a base that is parallel to the bottom surface of the lighting device, a first sidewall that extends from the base towards the top surface of the lighting device, and a second sidewall that extends from the base towards the top surface of the lighting device and is parallel to the first sidewall. A circuit board may be disposed in the tray with an LED mounted thereon that faces the top of the lighting device. A lens may be disposed over the LED that is configured to increase the maximum emission angle of the light from the LED. The LED strip may be at least partially encapsulated with an elastomer that is in contact with the circuit board, the sidewalls of the tray, and only a portion of the lens such that part of the lens is left exposed (e.g., exposed to air). A diffuser may be disposed above the lens and configured to diffuse the light.
- It should be appreciated that the embodiments described herein may be implemented in any of numerous ways. Examples of specific implementations are provided below for illustrative purposes only. It should be appreciated that these embodiments and the features/capabilities provided may be used individually, all together, or in any combination of two or more, as aspects of the technology described herein are not limited in this respect.
-
FIGS. 1A and 1l B show top and bottom views, respectively, of anexample lighting system 100. As shown, thelighting system 100 is constructed as a strip lighting system that comprises a plurality of electrically coupledlighting devices 102. Thereby, the length of thelighting system 100 may be customized by adding (or removing)lighting devices 102. Each of thelighting devices 102 may comprise LEDassemblies 106 mounted to a circuit board that is at least partially encapsulated in at least one elastomer (e.g., silicone). TheLED assemblies 106 may be electrically coupled via the circuit board toconnectors 104 mounted on each end of the circuit board. In turn, theconnector 104 may electrically couple eachLED assemblies 106 to an external device such as anotherlighting device 102 or a power adapter. TheLED assemblies 106 may receive power from the external device via theconnector 104 and emit light. - The
lighting devices 102 in thelighting system 100 may have particular dimensions to enable a wide range of applications. In some embodiments, thelighting devices 102 may be sized for mounting in recessed slots that are no more than 1 inch deep. In these embodiments, thelighting devices 102 may have, for example, a length of no more than approximately 6 inches, a width of no more than approximately 3 inches, and a height of no more than approximately ⅝ inches. Thereby, thelighting devices 102 may easily fit within the recessed slots. It should be appreciated that thelighting devices 102 may be constructed with other dimensions. For example, thelighting devices 102 may, in some embodiments, have a height in excess of approximately ⅝ inches. - The
LED assemblies 106 may comprise an LED that is configured to emit light, such as a white phosphor-converted LED. TheLED assemblies 106 may (or may not) comprise additional elements that change at least one characteristic of the light emitted by the LED. Example characteristics of the light emitted by the LED that may be changed include: a color correlated temperature (CCT) value, a CRI value, an R9 color index value, and an angle of emission. Any of a variety of elements may be employed to change the characteristics of the light emitted by the LED such as lenses, photo-luminescent materials, and/or scattering particles. - One or more components of the
lighting device 102 may be mounted to a circuit board (e.g., a printed circuit board). For example, theLED assemblies 106 and/or theconnectors 104 may be mounted to the circuit board. The circuit board may comprise one or more conductors to electrically couple the components mounted to the circuit board. The circuit board may be flexible to enable thelighting device 102 to bend to conform to uneven surfaces. - The circuit board may be at least partially encapsulated in at least one elastomer, such as a silicone and/or a rubber. The elastomer may insulate the circuit board and/or components mounted to the circuit board, such as the
LED assembly 106 and theconnector 104, from the external environment. Thereby, thelighting system 100 may be employed in both indoor and outdoor applications. - Each of
FIGS. 2A-2C shows a cross-section of an example implementation of thelighting device 102 shown inFIG. 1 that is designed to provide white light with a high CRI. As shown, the lighting device comprises atray 202 that is configured to receive acircuit board 210 with anLED 212 mounted thereon. Anelastomer 214 may be potted over thecircuit board 210 to at least partially encapsulate thecircuit board 210 and secure thecircuit board 210 to the lighting device. A photo-luminescent material layer 216 is disposed on top of theelastomer 214 and may be configured to change at least one characteristic of the light emitted by theLED 212 such as CRI, R9 color rendering value, and/or CCT. Anotherelastomer 218 may be potted over the photo-luminescent material layer 216 to separate the photo-luminescent material layer 216 from the environment. - The
tray 202 may comprise a base 206 onto which thecircuit board 210 may be disposed andsidewalls 208 that extend upward from thebase 206. Thesidewalls 208 may be parallel to each other and/or perpendicular to thebase 206. The base 206 may form a bottom surface of the lighting device while thesidewalls 208 may form the lateral surfaces of the lighting device. Thetray 202 may be constructed from any of a variety of materials. For example, thetray 202 may be constructed from an elastomer such as silicone. In this example, the elastomer may be manufactured through an extrusion process (e.g., a silicone extrusion process). The elastomer employed to construct thetray 202 may be different from theelastomers 214 and/or 218. For example, the elastomer in thetray 202 may be more porous than theelastomers 214 and/or 218 to provider greater heat dissipation capability to dissipate heat from thecircuit board 210 and/or theLED 212. - In some embodiments, the
tray 202 may comprise anoverhang 220 that extends from one of thesidewalls 208 towards anothersidewall 208 as shown inFIG. 2C . Theoverhang 220 may be parallel to thebase 206. In these embodiments, theLED 212 may be mounted to thecircuit board 210 at a location that is under theoverhang 220. Thereby, theLED 212 may be obscured from view. Further, theoverhang 220 may be long enough such that the light ray 222 emitted at the maximum emission angle of theLED 212 does not directly leave the lighting device. Instead, the light ray 222 may reach the top surface of theelastomer 218 at such an angle that the light ray 222 is reflected back from the top surface (e.g., because the angle is above the critical angle for total internal reflection (TIR)). Thereby, all of the light emitted by theLED 212 may be reflected off of at least one surface in the lighting device before leaving the top surface of theelastomer 218. - The
circuit board 210 may be configured to electrically couple theLED 212 to one or more other components. For example, the circuit board may comprise conductors that electrically couple theLED 212 to a connector mounted to the circuit board (e.g., connector 204 inFIG. 1A ). Thecircuit board 210 may be, for example, an FR4 649 printed circuit board (PCB). Additionally (or alternatively), the circuit board may be aflexible circuit board 210 to permit the lighting device to bend without breaking. - The
LED 212 may be configured to emit broad spectrum light, such as light with a spectrum that is at least 200 nanometers (nm) in size (e.g., 200 nm, 225 nm, 250 nm, 275 nm, 300 nm, etc.). The broad spectrum light may be, for example, white light. TheLED 212 may be construed in any of a variety of ways to generate the broad spectrum light. For example, theLED 212 may be constructed as a white phosphor-converted LED. It should be appreciated that theLED 212 may be configured to emit narrow spectrum light in some embodiments, such as light with a spectrum that is less than 200 nm in size. For example, theLED 212 may be constructed as a blue LED without a phosphor coating. - The
elastomer 214 may be potted over thecircuit board 210 to hold thecircuit board 210 in-place in the lighting device. Theelastomer 214 may, in some embodiments, be in direct contact with theLED 212. Allowing theelastomer 214 to be in direct contact with theLED 212 may, for example, change the spectrum of the light emitted by theLED 212 because theelastomer 214 may have a refractive index that is higher than air (e.g., a refractive index of approximately 1.5).FIG. 7 shows the difference between the spectrums of the light emitted from theLED 212 when the light is emitted directly intoelastomer 214 instead of air. In particular, afirst line 702 shows the spectrum of light from theLED 212 that is emitted directly intoelastomer 214 and asecond line 704 shows the spectrum of light from theLED 212 that is emitted directly into air. As shown, the blue component between approximately 425 nm and 475 nm of the light from theLED 212 is substantially increased when the light is emitted directly into theelastomer 214. The additional blue component of the light from theLED 212 may be advantageously employed to excite photo-luminescent materials in the photo-luminescent material layer 216. Thereby, the blue component of the light from theLED 212 may be converted into light with longer wavelengths, such as yellow and/or red light, by the photo-luminescent material layer 216. - The photo-
luminescent material layer 216 may comprise one or more photo-luminescent materials that are configured to emit light in a first spectrum in response to being excited by light in a second different spectrum. For example, the photo-luminescent materials may be configured to absorb light with a shorter wavelength, such as blue light, and emit light with a longer wavelength, such as yellow and/or red light. The particular photo-luminescent materials and their respective proportions in the photo-luminescent material layer 216 may depend on, for example, the desired spectrum of light to be generated by the lighting device. Example photo-luminescent materials include a phosphor (e.g., neodymium-doped yttrium aluminum garnet (Nd:YAG)), a silicate, and a quantum dot (e.g., a Cadmium free quantum dot). The photo-luminescent material may be an organic material and/or comprise organic compounds such as any of the color conversion materials described in U.S. Patent Publication No. 2017/0137627. Additionally (or alternatively), the photo-luminescent material may be an inorganic material and/or comprise inorganic compounds. - The photo-
luminescent material layer 216 may be constructed in any of a variety of ways. For example, the photo-luminescent material layer 216 may be formed as a sheet (e.g., as a foil) that is sandwiched betweenelastomer FIGS. 2A and 2C . In another example, the photo-luminescent material layer 216 may be constructed as a plurality of separate elements (e.g., separate circular sheets) that are each disposed over an LED on thecircuit board 210. Thereby, the separate elements may be uniquely configured for the specific LED that the respective element is disposed over (e.g., a first element with a first composition may be disposed over a first LED and a second element with a second, different composition may be disposed over a second, different LED). In yet another example, the photo-luminescent material layer 216 may comprise a set of one or more photo-luminescent materials distributed through a polymer (e.g., silicone) that is sandwiched betweenelastomer FIG. 2B . -
FIG. 8 shows the changes to the light spectrum that may be created by the photo-luminescent materials in thephoto luminescent layer 216. In particular, afirst line 802 shows the spectrum of light from a white phosphor-converted LED without any change from a photo-luminescent material, asecond line 804 shows the spectrum of light from the white phosphor-converted LED after passing through a first quantum dot material, and athird line 806 shows the spectrum of light from the white phosphor-converted LED after passing through a different, second quantum dot material. A summary of the changes in the spectrum caused by each of the first and second quantum dot materials is shown in Table 1 below: -
TABLE 1 Element in FIG. 8 Light Source CCT CRI R9 802 No photo-luminescent material 4000 86 25 804 First Quantum Dot material 3300 91 45 806 Second Quantum Dot material 2000 96 80
As shown, the first quantum dot material increases the CRI, CCT, and R9 color rendering value of the white light by reducing the blue component of the white light and the second quantum dot material further increases the CRI, CCT, and R9 color rendering value of the white light by further reducing the blue component of the white light in addition to increasing the red component of the white light. - The composition of the photo-
luminescent material layer 216 may be customize to achieve a desired light spectrum for any of a variety of different applications. For example, the photo-luminescent material layer 216 may be designed to provide light suitable for black light units (BLUs) in display applications. In this example, theLED 212 may be configured to emit narrow spectrum light (e.g., blue light) and the photo-luminescent material layer 216 may be configured to absorb some of the blue light and, in turn, emit light with a longer wavelength (e.g., green, yellow, orange, and/or red light).FIG. 9 shows the spectrum of light emitted by each component of such a lighting device that employs a red quantum dot material, a green quantum dot material, and yellow green (e.g., CIE Color Coordinates of x=3.14 and y=0.584) phosphor material in the photo-luminescent material layer 216. The ratio of the red quantum dot material to the green quantum dot material may be 80:20 (i.e., there are 80 parts of red quantum dot material for every 20 parts of green quantum dot material). InFIG. 9 ,line 902 shows the spectrum of light from a blue LED,line 904 shows the spectrum light from the yellow green phosphor material,line 906 shows the spectrum of light emitted by the excited red quantum dot material,line 908 shows the spectrum of light emitted by the excited green quantum dot material, andline 910 that shows the resulting spectrum of the lighting device (e.g., a combination of the spectrums of the blue LED, the phosphor, the red quantum dot material, and the green quantum dot material). Other combinations of materials may be employed to achieve a similar spectrum. For example, the green quantum dot material may be removed entirely and replaced with additional red quantum dot material. Thereby, the photo-luminescent layer 216 may omit the green quantum dot material altogether. - The photo-
luminescent material layer 216 for a lighting device being employed in BLUs where theLED 212 emits light with a broad spectrum (instead of a narrow spectrum) may be designed differently.FIG. 10 shows the spectrum of another example lighting device suitable for a BLU that is constructed using a broad spectrum LED. In particular,line 1002 shows the light spectrum of a white phosphor-converted LED formed from a blue LED coated in a yellow phosphor coating andline 1004 shows the light spectrum of a white phosphor-converted LED formed from a blue LED coated in a red phosphor coating paired with a photo-luminescent material in the photo-luminescent material layer 216 that is configured to absorb some of the blue light and emit green light. As shown, the light spectrum of the light from the phosphor-converted LED and photo-luminescent material layer 216 produces light with a warmer color temperature than employing the white phosphor-converted LED alone. - As should be appreciated from the foregoing description, the spectrum of a lighting device may be adjusted to achieve a desired light spectrum by varying the types and/or concentrations of photo-luminescent materials in the photo-
luminescent material layer 216. For example, the red component of the light emitted by the lighting device may be increased by adding a red quantum dot material to the photo-luminescent merial layer 216. Thereby, the lighting device described herein may be employed to create light for any of a variety of applications. - In some embodiments, the composition of the photo-
luminescent material layer 216 may be designed for grow light applications. Thereby, the lighting devices described herein may be constructed as grow lights configured to stimulate plant growth. In these embodiments, the spectrum of the light generated by the lighting device may, for example, closely match the spectrum of light absorbed by plants. Such a spectrum may be achieved by, for example, selecting a narrow spectrum LED that emits light with a wavelength below 500 nm (e.g., a blue LED) or a broad spectrum LED that emits a substantial portion light with a wavelength below 500 nm (e.g., a phosphor-converted white LED) for theLED 212 and adding photo-luminescent materials to the photo-luminescent material layer 216 that absorb some of the light below 500 nm from the LED and emit orange and/or red light (e.g., light with a spectrum between 600 nm and 700 nm). Further, theLED 212 may be in direct contact with theelastomer 214 to increase the component of short wavelength light (e.g., light with a wavelength below 500 nm) as described above with reference toFIG. 7 .FIG. 11 shows the spectrum of light emitted by an example grow light compared with the spectrum of light absorbed by different chlorophylls and beta carotene. In particular,line 1102 shows the spectrum of light absorbed by beta carotene,line 1104 shows the spectrum of light absorbed by chlorophyll A,line 1106 shows the spectrum of light absorbed by chlorophyll B, andline 1108 shows the spectrum of light the example grow light. As shown, the spectrum of the light from the example grow light closely approximates the light absorbed by chlorophyll A and chlorophyll B. Further, the spectrum includes little light in portions of the spectrum that a plant would not absorb (e.g., between 525 and 600 nm) to improve the power efficiency of the grow light. - As should be appreciated from the foregoing, the photo-
luminescent material layer 216 may comprise any of a variety of photo-luminescent materials. Further, the particular composition of the photo-luminescent material layer 216 may vary based on the desired light spectrum, which may vary based on the particular application. Returning toFIGS. 2A-2C , the photo-luminescent material layer 216 may be covered by theelastomer 218. Theelastomer 218 may be, for example, silicone. Theelastomer 218 may have the same or different characteristics, such as refractive index, relative to theelastomer 214. For example, theelastomer 218 may have a different (e.g., higher or lower) refractive index than theelastomer 214. - It should be appreciated that photo-luminescence materials may be integrated into portions of the lighting device separate from the photo-
luminescence material layer 216. For example, theelastomer 218 and/or theelastomer 214 may comprise a photo-luminescence material such as a phosphor. Additionally (or alternatively), other materials separate from photo-luminescence materials, such as scattering particles and/or pigments, may be integrated into any of the following components of the lighting device: theelastomer 214, theelastomer 218, the photo-luminescence material layer 216, and/or thetray 202. - The lighting device shown in
FIGS. 2A-2C may be manufactured in any of a variety of ways. The lighting device may be manufactured by, for example, performing the following steps: (1) mounting the electronic components (e.g., the LED 212) to thecircuit board 210; (2) inserting the circuit board into thetray 202; (3) potting theelastomer 214 over thecircuit board 210 in thetray 202; (4) depositing the photo-luminescent material layer 216 on theelastomer 214; and (5) potting theelastomer 218 over the photo-luminescent material layer 216; and (6) packaging the lighting device. - As discussed above, the lighting device may be configured to provide uniform planar illumination in some embodiments. Thereby, the location of the LEDs within the lighting device may be indistinguishable to a viewer. These lighting devices may be employed in any of a variety of direct view applications including architectural lighting, commercial lighting, hospitality lighting, residential lighting, office lighting, hallway lighting, bath lighting, and vanity lighting. For example, the lighting device may be employed in 1 inch slot to create a glare free, architectural lighting accent within ⅝ inch deep drywall. In this example, the plaster in aluminum extrusion within ⅝″ deep may house 1-2 lighting devices. These lighting devices may be constructed as strips, such as the LED strips shown in
FIGS. 1A and 1B , that may advantageously allow the lighting devices to achieve continuous runs in various installation situations such as: outside corners, inside corners, T-connections, and fully seamless corners. - The lighting device may employ any of a variety of devices to provide uniform planar illumination such as lenses and diffusive elements.
FIGS. 3 and 4 shows an example implementation oflighting device 102 that provides uniform planar illumination. In particular,FIG. 3 shows an example cross-section of the example lighting device andFIG. 4 shows a deconstructed version of the example lighting device. As shown, the lighting device comprises atray 302 into which acircuit board 304 withLEDs 306 mounted thereon may be disposed. Thetray 302,circuit board 304, andLEDs 306 may be constructed similarly (or identically) to thetray 202, thecircuit board 210, and theLED 212, respectively, described above. Thecircuit board 306 may comprise aconnector 402 that may electrically couple theLEDs 306 mounted on thecircuit board 306 to an external power source. Alens 308 may be disposed over the LEDs 306 (e.g., so as to provide an air gap between theLEDs 306 and an inner surface of the lens 308) and configured to increase a maximum emission angle of light from theLED 306. Thelens 308 may be only partially encapsulated in anelastomer 312 so as to expose a top portion of thelens 308 to air. Asleeve 310 may be slid over thetray 302 so as to provide anair gap 314 between the top of thelens 308 and the top side of thesleeve 310. Adiffuser 316 may be disposed on thesleeve 310 that is configured to diffuse light from theLEDs 308. - The
lenses 308 may be configured to increase a maximum emission angle of light from theLEDs 308. For example, the maximum emission angle of light from theLEDs 308 may be no more than ±60 degrees and thelens 308 may increase the maximum emission angle of the light from the LEDs to at least ±80 degrees. Additionally, thelens 308 may be configured to increase a light intensity at higher angles. For example, the light intensity from theLED 306 at ±60 degrees may be a first value and thelens 308 may increase the light intensity at ±60 degrees to a second value that is higher than the first value. An example construction of thelenses 308 is shown inFIG. 5 bylens 504 that is disposed over theLED 502. As shown, thelens 504 comprises acavity 503 into which theLED 502 may be disposed. Thecavity 503 may form an air gap between theLED 502 and an inner surface of thelens 504. Additional materials may be disposed in thecavity 503 between theLED 502 and the inner surface of thelens 504 that are configured to change a characteristic of the light from the LED such as any of the scattering particles, photo-luminescence materials, and/or pigments described herein. These materials may be, for example, integrated into a polymer to form a monolithic element that may be disposed between theLED 502 and the inner surface of thelens 504. - The
lens 504 is configured to increase the maximum angle of emission to ±80 degrees resulting in light being emitted over a span of 160 degrees in thelight distribution pattern 500. It should be appreciated that the example construction of thelens 308 inFIG. 5 is only one possible implementation and that thelens 504 may be implemented in any of a variety of ways. - The
elastomer 312 may encapsulate the top surface of thecircuit board 304 and only a portion of thelenses 308. For example, theelastomer 312 may only be in contact with a bottom portion of the outer surface of thelens 308 while leaving an upper portion of the outer surface of thelens 308 exposed to air. Leaving a portion of thelens 308 may advantageously improve the performance the lens by, for example, maximizing a difference in refractive index of thelens 308 itself and the material into which the light from the lens propagates (e.g., air). Theelastomer 312 may be constructed from any of a variety of materials, such as silicone. Theelastomer 312 may have a lower refractive index such as a refractive index of approximately 1.4. - The
sleeve 310 may be constructed as to be a hollow rectangle prism that surrounds thetray 302 and the components mounted therein. Thesleeve 310 may be constructed from an elastomer, such as silicone. Thesleeve 310 may be constructed from an extruding process (e.g., a silicone extruding process). - The
diffuser 316 may be constructed to diffuse the light from thelenses 308 so as to provide uniform (or near uniform) planar illumination. Thediffuser 316 may be configured to diffuse light using any of a variety of techniques. In some embodiments, thediffuser 316 may comprise scattering particles that are configured to scatter light that are distributed throughout an elastomer (e.g., silicone) with a different (e.g., lower or higher) refractive index than theelastomer 312. For example, the refractive index of theelastomer 312 may have a refractive index of approximately 1.4 and the refractive index of the elastomer in thediffuser 316 may be approximately 1.5. The scattering particles may advantageously allow thediffuser 316 to be thin while still allowing the diffuser to effectively diffuse the light from the LEDs. For example, the entire lighting device (including the diffuser) may be no more than ⅝ inches tall. Thereby, the lighting device may easily be mounted in 1 inch recessed slots without protruding from the slot. Any of a variety of scattering particles may be employed such as Barium Sulfate (BaSO4) and/or Titanium Dioxide (TiO2). Additionally (or alternatively), thediffuser 316 may comprise one or more materials that are configured to change a characteristic of the light such as any of the photo-luminescence materials described herein and/or pigments. - The lighting device shown in
FIGS. 3 and 4 may be manufactured in any of a variety of ways. The lighting device may be manufactured by, for example, performing the following steps: (1) mounting the electronic components (e.g., theLED 306 and/or the connector 402) to thecircuit board 304; (2) inserting the circuit board into thetray 302; (3) placing thelenses 308 over theLEDs 306; (4) potting theelastomer 312 over thecircuit board 304 in thetray 302; (5) inserting thetray 302 into thesleeve 310; (6) potting the material that comprises the diffuser 316 (e.g., an elastomer with scattering particles, photo-luminescence materials, and/or pigments) over thesleeve 310; and (7) packaging the lighting device. - It should be appreciated that the lighting devices described herein may be designed to achieve any of a variety of desired light output characteristics. For example, the lighting devices described herein may be designed for a range of CCT values such as, 2,700 degrees K, 3,000 degrees K, 3,500 degrees K, 4,000 degrees K, and 5,000 degrees K; a range of CRI values such as any value between 90 and 100; a range of R9 color rendering values such as any value between 90 and 100; a range of light intensity values such as a range of 270-480 lumens per 12 inch section of lighting devices (e.g., per pair of two 6 inch lighting devices); a range of power consumption levels such as any wattage up to 9 Watts; and a range of voltage levels such as 24 Volts. Further, the lighting devices may be configured to be dimmable via any of a variety of external dimmable electronic drivers. Still yet further, the lighting device may configured to provide light within a 3-step Macadam ellipse and/or a 2-step Macadam ellipse of a predefined color coordinate. For example, the lighting device may be configured as a lighting strip configured to provide light within a 3-step Macadam ellipse and/or a 2-step Macadam ellipse of a predefined color coordinate along the length of the lighting strip.
- Various aspects of the present disclosure may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
- Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.
- The terms “approximately,” “about,” and “substantially” may be used to mean within ±20% of a target value in some embodiments, within ±10% of a target value in some embodiments, within ±5% of a target value in some embodiments, and yet within ±2% of a target value in some embodiments. The terms “approximately,” “about,” and “substantially” may include the target value.
- Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
- Having described above several aspects of at least one embodiment, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be object of this disclosure. Accordingly, the foregoing description and drawings are by way of example only.
Claims (60)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/480,867 US11296057B2 (en) | 2017-01-27 | 2018-01-26 | Lighting systems with high color rendering index and uniform planar illumination |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762451616P | 2017-01-27 | 2017-01-27 | |
US201762451612P | 2017-01-27 | 2017-01-27 | |
US16/480,867 US11296057B2 (en) | 2017-01-27 | 2018-01-26 | Lighting systems with high color rendering index and uniform planar illumination |
PCT/US2018/015449 WO2018140727A1 (en) | 2017-01-27 | 2018-01-26 | Lighting systems with high color rendering index and uniform planar illumination |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2018/015449 A-371-Of-International WO2018140727A1 (en) | 2017-01-27 | 2018-01-26 | Lighting systems with high color rendering index and uniform planar illumination |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/653,988 Continuation US11658163B2 (en) | 2017-01-27 | 2022-03-08 | Lighting systems with high color rendering index and uniform planar illumination |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190383450A1 true US20190383450A1 (en) | 2019-12-19 |
US11296057B2 US11296057B2 (en) | 2022-04-05 |
Family
ID=62978045
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/480,867 Active US11296057B2 (en) | 2017-01-27 | 2018-01-26 | Lighting systems with high color rendering index and uniform planar illumination |
US17/653,988 Active US11658163B2 (en) | 2017-01-27 | 2022-03-08 | Lighting systems with high color rendering index and uniform planar illumination |
US18/303,849 Pending US20230260974A1 (en) | 2017-01-27 | 2023-04-20 | Lighting systems with high color rendering index and uniform planar illumination |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/653,988 Active US11658163B2 (en) | 2017-01-27 | 2022-03-08 | Lighting systems with high color rendering index and uniform planar illumination |
US18/303,849 Pending US20230260974A1 (en) | 2017-01-27 | 2023-04-20 | Lighting systems with high color rendering index and uniform planar illumination |
Country Status (3)
Country | Link |
---|---|
US (3) | US11296057B2 (en) |
CN (1) | CN110998880A (en) |
WO (1) | WO2018140727A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10989372B2 (en) | 2017-03-09 | 2021-04-27 | Ecosense Lighting Inc. | Fixtures and lighting accessories for lighting devices |
US11022279B2 (en) | 2016-03-08 | 2021-06-01 | Ecosense Lighting Inc. | Lighting system with lens assembly |
US11028980B2 (en) | 2013-10-30 | 2021-06-08 | Ecosense Lighting Inc. | Flexible strip lighting apparatus and methods |
US11041609B2 (en) | 2018-05-01 | 2021-06-22 | Ecosense Lighting Inc. | Lighting systems and devices with central silicone module |
US11202920B2 (en) * | 2018-12-07 | 2021-12-21 | Ledvance Llc | Luminaire for enhanced color rendition and wellness |
US11296057B2 (en) | 2017-01-27 | 2022-04-05 | EcoSense Lighting, Inc. | Lighting systems with high color rendering index and uniform planar illumination |
US11353200B2 (en) | 2018-12-17 | 2022-06-07 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11404610B2 (en) * | 2019-05-22 | 2022-08-02 | Electronic Theatre Controls, Inc. | Light fixture with broadband and narrow band emitters |
KR20200139307A (en) | 2019-06-03 | 2020-12-14 | 삼성전자주식회사 | Light emitting device, backlight unit and display apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090026913A1 (en) * | 2007-07-26 | 2009-01-29 | Matthew Steven Mrakovich | Dynamic color or white light phosphor converted LED illumination system |
US20120146066A1 (en) * | 2009-06-27 | 2012-06-14 | Michael Albert Tischler | High efficiency leds and led lamps |
US20120170303A1 (en) * | 2009-06-24 | 2012-07-05 | Noam Meir | Illumination apparatus with high conversion efficiency and methods of forming the same |
US20150062892A1 (en) * | 2013-08-29 | 2015-03-05 | Soraa, Inc. | Circadian friendly led light source |
US20170309795A1 (en) * | 2014-10-08 | 2017-10-26 | Seoul Semiconductor Co., Ltd. | Light emitting device |
Family Cites Families (330)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3262250A (en) | 1963-08-29 | 1966-07-26 | American Air Filter Co | Collector cell for electrostatic precipitator |
JPS535350B1 (en) | 1964-07-24 | 1978-02-25 | ||
US4445164A (en) | 1982-05-05 | 1984-04-24 | Cherry Electrical Products Corporation | Lighted key module assembly |
US4580859A (en) | 1984-12-20 | 1986-04-08 | Illinois Tool Works Inc. | Light-emitting diode holder assembly |
US4603496A (en) | 1985-02-04 | 1986-08-05 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
US4837927A (en) | 1985-04-22 | 1989-06-13 | Savage John Jun | Method of mounting circuit component to a circuit board |
US4727648A (en) | 1985-04-22 | 1988-03-01 | Savage John Jun | Circuit component mount and assembly |
JPH0625906Y2 (en) | 1989-10-16 | 1994-07-06 | ヒロセ電機株式会社 | socket |
US5241457A (en) | 1991-01-18 | 1993-08-31 | Nippon Sheet Glass Co., Ltd. | Rear window stop lamp for motor vehicles |
US5174649B1 (en) | 1991-07-17 | 1998-04-14 | Precision Solar Controls Inc | Led lamp including refractive lens element |
EP0592746B1 (en) | 1992-10-14 | 1997-03-19 | International Business Machines Corporation | Encapsulated light emitting diode and method for encapsulating the same |
FR2697485B1 (en) | 1992-11-02 | 1995-01-20 | Valeo Vision | Signaling light with modular luminous elements, for a motor vehicle. |
FR2697484B1 (en) | 1992-11-02 | 1995-01-20 | Valeo Vision | Modular element for the production of traffic lights for motor vehicles. |
US5387901A (en) | 1992-12-10 | 1995-02-07 | Compaq Computer Corporation | Led indicating light assembly for a computer housing |
US5450664A (en) | 1993-11-18 | 1995-09-19 | The Whitaker Corporation | Electrical connector for mid-cable termination |
US5632551A (en) | 1994-07-18 | 1997-05-27 | Grote Industries, Inc. | LED vehicle lamp assembly |
US5628557A (en) | 1995-06-16 | 1997-05-13 | Shining Blick Enterprises Co., Ltd. | Assembly tube light for window display |
US5658066A (en) | 1995-07-20 | 1997-08-19 | Linear Lighting Corp. | Joining system for sectional lighting assembly |
US5821695A (en) | 1996-08-06 | 1998-10-13 | Appleton Electric Company | Encapsulated explosion-proof pilot light |
US6582103B1 (en) | 1996-12-12 | 2003-06-24 | Teledyne Lighting And Display Products, Inc. | Lighting apparatus |
US5871272A (en) | 1997-01-28 | 1999-02-16 | Streamlight, Incorporated | Flashlight with rotatable lamp head |
US6806659B1 (en) | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
US6720745B2 (en) | 1997-08-26 | 2004-04-13 | Color Kinetics, Incorporated | Data delivery track |
US20040052076A1 (en) | 1997-08-26 | 2004-03-18 | Mueller George G. | Controlled lighting methods and apparatus |
US7132804B2 (en) | 1997-12-17 | 2006-11-07 | Color Kinetics Incorporated | Data delivery track |
US6530674B2 (en) | 1998-05-15 | 2003-03-11 | Dean Grierson | Method and apparatus for joining and aligning fixtures |
ATE253761T1 (en) | 1998-09-04 | 2003-11-15 | Wynne Willson Gottelier Ltd | DEVICE AND METHOD FOR PROVIDING A LINEAR EFFECT |
US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
US6752505B2 (en) | 1999-02-23 | 2004-06-22 | Solid State Opto Limited | Light redirecting films and film systems |
EP1089069A3 (en) | 1999-10-01 | 2001-08-29 | CorkOpt Limited | Linear illumination |
JP4286404B2 (en) | 1999-10-15 | 2009-07-01 | 東京エレクトロン株式会社 | Matching device and plasma processing apparatus |
US6283612B1 (en) | 2000-03-13 | 2001-09-04 | Mark A. Hunter | Light emitting diode light strip |
JP4406490B2 (en) * | 2000-03-14 | 2010-01-27 | 株式会社朝日ラバー | Light emitting diode |
US6354714B1 (en) | 2000-04-04 | 2002-03-12 | Michael Rhodes | Embedded led lighting system |
US7550935B2 (en) | 2000-04-24 | 2009-06-23 | Philips Solid-State Lighting Solutions, Inc | Methods and apparatus for downloading lighting programs |
JP3481599B2 (en) | 2000-07-14 | 2003-12-22 | 京都電機器株式会社 | Linear lighting device |
US6481130B1 (en) | 2000-08-11 | 2002-11-19 | Leotek Electronics Corporation | Light emitting diode linear array with lens stripe for illuminated signs |
US6426704B1 (en) | 2000-08-17 | 2002-07-30 | Power Signal Technologies, Inc. | Modular upgradable solid state light source for traffic control |
US6527422B1 (en) | 2000-08-17 | 2003-03-04 | Power Signal Technologies, Inc. | Solid state light with solar shielded heatsink |
AU2001283424A1 (en) | 2000-08-17 | 2002-02-25 | Power Signal Technologies, Inc. | Glass-to-metal hermetically led array in a sealed solid state light |
US6450662B1 (en) | 2000-09-14 | 2002-09-17 | Power Signal Technology Inc. | Solid state traffic light apparatus having homogenous light source |
US6439743B1 (en) | 2000-10-05 | 2002-08-27 | Power Signal Technologies Inc. | Solid state traffic light apparatus having a cover including an integral lens |
US6473002B1 (en) | 2000-10-05 | 2002-10-29 | Power Signal Technologies, Inc. | Split-phase PED head signal |
US6474839B1 (en) | 2000-10-05 | 2002-11-05 | Power Signal Technology Inc. | LED based trough designed mechanically steerable beam traffic signal |
JP2002163907A (en) | 2000-11-24 | 2002-06-07 | Moriyama Sangyo Kk | Lighting system and lighting unit |
US20020117692A1 (en) | 2001-02-27 | 2002-08-29 | Lin Wen Chung | Moisture resistant LED vehicle light bulb assembly |
US6749310B2 (en) | 2001-09-07 | 2004-06-15 | Contrast Lighting Services, Inc. | Wide area lighting effects system |
US20030058658A1 (en) | 2001-09-26 | 2003-03-27 | Han-Ming Lee | LED light bulb with latching base structure |
US6682211B2 (en) | 2001-09-28 | 2004-01-27 | Osram Sylvania Inc. | Replaceable LED lamp capsule |
US7011421B2 (en) | 2001-10-18 | 2006-03-14 | Ilight Technologies, Inc. | Illumination device for simulating neon lighting through use of fluorescent dyes |
US6880952B2 (en) | 2002-03-18 | 2005-04-19 | Wintriss Engineering Corporation | Extensible linear light emitting diode illumination source |
US7093958B2 (en) | 2002-04-09 | 2006-08-22 | Osram Sylvania Inc. | LED light source assembly |
US6773138B2 (en) | 2002-04-09 | 2004-08-10 | Osram Sylvania Inc. | Snap together automotive led lamp assembly |
US6851832B2 (en) | 2002-05-21 | 2005-02-08 | Dwayne A. Tieszen | Led tube light housings |
AU2003234661A1 (en) | 2002-06-03 | 2003-12-19 | Everbrite, Inc. | Led accent lighting units |
JP4048844B2 (en) | 2002-06-17 | 2008-02-20 | カシオ計算機株式会社 | Surface light source and display device using the same |
US6824296B2 (en) | 2002-07-02 | 2004-11-30 | Leviton Manufacturing Co., Inc. | Night light assembly |
US6896381B2 (en) | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
US7595113B2 (en) | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
US6893144B2 (en) | 2003-01-30 | 2005-05-17 | Ben Fan | Waterproof assembly for ornamental light string |
US6827469B2 (en) | 2003-02-03 | 2004-12-07 | Osram Sylvania Inc. | Solid-state automotive lamp |
WO2004071143A1 (en) | 2003-02-07 | 2004-08-19 | Matsushita Electric Industrial Co., Ltd. | Socket for led light source and lighting system using the socket |
JP4182783B2 (en) | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | LED package |
US6979097B2 (en) | 2003-03-18 | 2005-12-27 | Elam Thomas E | Modular ambient lighting system |
DE10313956A1 (en) | 2003-03-27 | 2004-10-07 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Coupling element for elongated lamps and lighting system with this coupling element |
KR101148332B1 (en) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | High powered light emitter packages with compact optics |
DE10324909B4 (en) | 2003-05-30 | 2017-09-07 | Osram Opto Semiconductors Gmbh | Housing for a radiation-emitting component, method for its production and radiation-emitting component |
WO2005004202A2 (en) | 2003-06-24 | 2005-01-13 | Gelcore Llc | Full spectrum phosphor blends for white light generation with led chips |
US6882111B2 (en) | 2003-07-09 | 2005-04-19 | Tir Systems Ltd. | Strip lighting system incorporating light emitting devices |
US7300173B2 (en) | 2004-04-08 | 2007-11-27 | Technology Assessment Group, Inc. | Replacement illumination device for a miniature flashlight bulb |
US6914194B2 (en) | 2003-10-29 | 2005-07-05 | Ben Fan | Flexible LED cable light |
EP1711739A4 (en) | 2004-01-28 | 2008-07-23 | Tir Technology Lp | Directly viewable luminaire |
US7326583B2 (en) | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
US7210957B2 (en) | 2004-04-06 | 2007-05-01 | Lumination Llc | Flexible high-power LED lighting system |
US20050286265A1 (en) | 2004-05-04 | 2005-12-29 | Integrated Illumination Systems, Inc. | Linear LED housing configuration |
US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US20050280016A1 (en) | 2004-06-17 | 2005-12-22 | Mok Thye L | PCB-based surface mount LED device with silicone-based encapsulation structure |
US7261435B2 (en) | 2004-06-18 | 2007-08-28 | Acuity Brands, Inc. | Light fixture and lens assembly for same |
US7481552B2 (en) | 2004-06-18 | 2009-01-27 | Abl Ip Holding Llc | Light fixture having a reflector assembly and a lens assembly for same |
US7530716B2 (en) | 2004-06-18 | 2009-05-12 | Acuity Brands, Inc. | Light fixture |
US20060134440A1 (en) | 2004-10-27 | 2006-06-22 | Crivello James V | Silicone encapsulants for light emitting diodes |
US7858408B2 (en) | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
US7314770B2 (en) | 2004-11-18 | 2008-01-01 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
DE102004062989A1 (en) | 2004-12-22 | 2006-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lighting device with at least one light emitting diode and vehicle headlights |
US20060146531A1 (en) | 2004-12-30 | 2006-07-06 | Ann Reo | Linear lighting apparatus with improved heat dissipation |
US7857482B2 (en) | 2004-12-30 | 2010-12-28 | Cooper Technologies Company | Linear lighting apparatus with increased light-transmission efficiency |
US7159997B2 (en) | 2004-12-30 | 2007-01-09 | Lo Lighting | Linear lighting apparatus with increased light-transmission efficiency |
JP4547276B2 (en) | 2005-01-24 | 2010-09-22 | シチズン電子株式会社 | Planar light source |
US20060187653A1 (en) | 2005-02-10 | 2006-08-24 | Olsson Mark S | LED illumination devices |
CA2620750A1 (en) | 2005-05-20 | 2006-11-23 | Tir Technology Lp | Cove illumination module and system |
US7766518B2 (en) | 2005-05-23 | 2010-08-03 | Philips Solid-State Lighting Solutions, Inc. | LED-based light-generating modules for socket engagement, and methods of assembling, installing and removing same |
US7703951B2 (en) | 2005-05-23 | 2010-04-27 | Philips Solid-State Lighting Solutions, Inc. | Modular LED-based lighting fixtures having socket engagement features |
US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US7575332B2 (en) | 2005-06-21 | 2009-08-18 | Eastman Kodak Company | Removable flat-panel lamp and fixture |
US8690368B1 (en) | 2005-08-22 | 2014-04-08 | Michael Shipman | Cavity filled lightpipe for illuminating keys of a keyboard |
JP4945106B2 (en) | 2005-09-08 | 2012-06-06 | スタンレー電気株式会社 | Semiconductor light emitting device |
US7572027B2 (en) | 2005-09-15 | 2009-08-11 | Integrated Illumination Systems, Inc. | Interconnection arrangement having mortise and tenon connection features |
US7296912B2 (en) | 2005-09-22 | 2007-11-20 | Pierre J Beauchamp | LED light bar assembly |
KR100717720B1 (en) | 2005-10-10 | 2007-05-11 | 유양산전 주식회사 | Lamp apparatus for a induction lamp |
US20070092736A1 (en) | 2005-10-21 | 2007-04-26 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
US20070103902A1 (en) | 2005-11-08 | 2007-05-10 | Yu-Hsiang Hsiao | Lighting fixture |
US8465175B2 (en) | 2005-11-29 | 2013-06-18 | GE Lighting Solutions, LLC | LED lighting assemblies with thermal overmolding |
KR101263502B1 (en) | 2006-03-27 | 2013-05-13 | 엘지디스플레이 주식회사 | Light Emitting Diode Back Light Unit and Liquid Crystal Display Device having thereof |
JP2007311445A (en) | 2006-05-17 | 2007-11-29 | Stanley Electric Co Ltd | Semiconductor light-emitting device, and manufacturing method thereof |
US7876489B2 (en) | 2006-06-05 | 2011-01-25 | Pixtronix, Inc. | Display apparatus with optical cavities |
US9179579B2 (en) | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
US8080828B2 (en) | 2006-06-09 | 2011-12-20 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED with window layer and phosphor layer |
US7712926B2 (en) | 2006-08-17 | 2010-05-11 | Koninklijke Philips Electronics N.V. | Luminaire comprising adjustable light modules |
US20080049445A1 (en) | 2006-08-25 | 2008-02-28 | Philips Lumileds Lighting Company, Llc | Backlight Using High-Powered Corner LED |
US8052303B2 (en) | 2006-09-12 | 2011-11-08 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US9564070B2 (en) | 2006-10-05 | 2017-02-07 | GE Lighting Solutions, LLC | LED backlighting system for cabinet sign |
EP1943551A2 (en) | 2006-10-06 | 2008-07-16 | Qualcomm Mems Technologies, Inc. | Light guide |
JP2010507218A (en) | 2006-10-19 | 2010-03-04 | フィリップス ソリッド−ステート ライティング ソリューションズ インコーポレイテッド | Networkable LED-based lighting fixture and method for supplying and controlling power thereto |
CN101165566A (en) | 2006-10-20 | 2008-04-23 | 鸿富锦精密工业(深圳)有限公司 | Direct type backlight module group |
US7549786B2 (en) | 2006-12-01 | 2009-06-23 | Cree, Inc. | LED socket and replaceable LED assemblies |
US20080144322A1 (en) | 2006-12-15 | 2008-06-19 | Aizar Abdul Karim Norfidathul | LED Light Source Having Flexible Reflectors |
US8066402B2 (en) | 2006-12-24 | 2011-11-29 | Brasscorp Limited | LED lamps including LED work lights |
US20080165530A1 (en) | 2007-01-10 | 2008-07-10 | Westerveld Johannes Hendrikus | Illuminative apparatus |
US7727009B2 (en) | 2007-02-15 | 2010-06-01 | Tyco Electronics Canada Ulc | Panel mount light emitting element assembly |
US7667408B2 (en) | 2007-03-12 | 2010-02-23 | Cirrus Logic, Inc. | Lighting system with lighting dimmer output mapping |
US7733439B2 (en) | 2007-04-30 | 2010-06-08 | Qualcomm Mems Technologies, Inc. | Dual film light guide for illuminating displays |
US7540761B2 (en) | 2007-05-01 | 2009-06-02 | Tyco Electronics Corporation | LED connector assembly with heat sink |
RU2490540C2 (en) | 2007-05-07 | 2013-08-20 | Конинклейке Филипс Электроникс Нв | Led-based lighting fixture purposed for surface illumination with improved heat dissipation and fabricability |
US7991257B1 (en) | 2007-05-16 | 2011-08-02 | Fusion Optix, Inc. | Method of manufacturing an optical composite |
US8066403B2 (en) | 2007-06-21 | 2011-11-29 | Nila Inc. | Modular lighting arrays |
US20090109539A1 (en) | 2007-07-09 | 2009-04-30 | Bruno Devos | Display panel with improved reflectivity |
US7810955B2 (en) | 2007-07-19 | 2010-10-12 | Lumination Llc | Linear LED illumination system |
US8791631B2 (en) | 2007-07-19 | 2014-07-29 | Quarkstar Llc | Light emitting device |
US7972038B2 (en) | 2007-08-01 | 2011-07-05 | Osram Sylvania Inc. | Direct view LED lamp with snap fit housing |
WO2009036001A1 (en) | 2007-09-10 | 2009-03-19 | Lighting Science Group Corporation | Warm white lighting device |
DE102007043355A1 (en) | 2007-09-12 | 2009-03-19 | Lumitech Produktion Und Entwicklung Gmbh | LED module, LED bulb and LED light for energy-efficient reproduction of white light |
US8154864B1 (en) | 2007-09-14 | 2012-04-10 | Daktronics, Inc. | LED display module having a metallic housing and metallic mask |
US20090126792A1 (en) | 2007-11-16 | 2009-05-21 | Qualcomm Incorporated | Thin film solar concentrator/collector |
US7731396B2 (en) | 2007-12-21 | 2010-06-08 | Tpr Enterprises, Ltd. | LED socket string |
US7762829B2 (en) | 2007-12-27 | 2010-07-27 | Tyco Electronics Corporation | Connector assembly for termination of miniature electronics |
US7791326B2 (en) | 2007-12-28 | 2010-09-07 | Texas Instruments Incorporated | AC-powered, microprocessor-based, dimming LED power supply |
US20090185389A1 (en) | 2008-01-18 | 2009-07-23 | Osram Sylvania Inc | Light guide for a lamp |
GB0801509D0 (en) * | 2008-01-28 | 2008-03-05 | Photonstar Led Ltd | Light emitting system with optically transparent thermally conductive element |
GB2457016A (en) | 2008-01-29 | 2009-08-05 | Wei-Jen Tseng | Fairy light |
US8022634B2 (en) | 2008-02-05 | 2011-09-20 | Intersil Americas Inc. | Method and system for dimming AC-powered light emitting diode (LED) lighting systems using conventional incandescent dimmers |
CA2623604C (en) | 2008-02-21 | 2010-05-18 | Wei-Jen Tseng | Socket for fairy light |
US7726840B2 (en) | 2008-03-04 | 2010-06-01 | Tempo Industries, Inc. | Modular LED lighting fixtures |
WO2009116012A2 (en) | 2008-03-19 | 2009-09-24 | I2Ic Corporation | A directional linear light source |
CN101539275A (en) | 2008-03-19 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Illuminating apparatus and light engine thereof |
US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
CN101577298A (en) | 2008-05-07 | 2009-11-11 | 富准精密工业(深圳)有限公司 | Light emitting diode and packaging method thereof |
CN101586740B (en) | 2008-05-23 | 2012-02-01 | 富准精密工业(深圳)有限公司 | Light emitting diode (LED) module |
DE102008026622B4 (en) | 2008-06-03 | 2011-06-16 | Siemens Aktiengesellschaft | Displacement device for an X-ray C-arm |
US8105853B2 (en) | 2008-06-27 | 2012-01-31 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
CN101614384A (en) | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light emitting diode |
US20110255287A1 (en) | 2008-07-08 | 2011-10-20 | Li Qing Charles | Connectors for led strip lighting |
US8262250B2 (en) | 2008-07-08 | 2012-09-11 | Virginia Optoelectronics, Inc. | Modular LED lighting systems and flexible or rigid strip lighting devices |
US8641229B2 (en) | 2008-07-08 | 2014-02-04 | Virginia Optoelectronics, Inc. | Waterproof flexible and rigid LED lighting systems and devices |
JP4489843B2 (en) * | 2008-08-07 | 2010-06-23 | パナソニック株式会社 | LIGHTING LENS AND LIGHT EMITTING DEVICE, SURFACE LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME |
US7942540B2 (en) | 2008-08-08 | 2011-05-17 | Xicato, Inc. | Color tunable light source |
CN101655220B (en) | 2008-08-19 | 2012-12-19 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
US7859190B2 (en) | 2008-09-10 | 2010-12-28 | Bridgelux, Inc. | Phosphor layer arrangement for use with light emitting diodes |
US7952114B2 (en) | 2008-09-23 | 2011-05-31 | Tyco Electronics Corporation | LED interconnect assembly |
US8129735B2 (en) | 2008-09-24 | 2012-03-06 | Koninklijke Philips Electronics N.V. | LED with controlled angular non-uniformity |
KR100974942B1 (en) | 2008-10-21 | 2010-08-11 | 주식회사 트루와이드 | LED Streetlight |
US8297788B2 (en) | 2008-12-08 | 2012-10-30 | Avx Corporation | Card edge LED strip connector and LED assembly |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US7923907B2 (en) | 2009-01-19 | 2011-04-12 | Osram Sylvania Inc. | LED lamp assembly |
US7922364B2 (en) | 2009-03-10 | 2011-04-12 | Osram Sylvania, Inc. | LED lamp assembly |
CN101852400A (en) | 2009-03-31 | 2010-10-06 | 富准精密工业(深圳)有限公司 | Lamp |
CA2689403A1 (en) | 2009-04-02 | 2010-10-02 | Abl Ip Holding, Llc | Light fixture |
CA2758525A1 (en) | 2009-04-16 | 2010-10-21 | Koninklijke Philips Electronics N.V. | A light guide apparatus |
WO2010124028A2 (en) | 2009-04-21 | 2010-10-28 | Vasylyev Sergiy V | Light collection and illumination systems employing planar waveguide |
US8697458B2 (en) | 2009-04-22 | 2014-04-15 | Shat-R-Shield, Inc. | Silicone coated light-emitting diode |
US8348460B2 (en) | 2009-05-01 | 2013-01-08 | Abl Ip Holding Llc | Lighting apparatus with several light units arranged in a heatsink |
US8113680B2 (en) | 2009-05-05 | 2012-02-14 | Lightology, Llc | Light fixture with directed LED light |
US8052310B2 (en) | 2009-05-14 | 2011-11-08 | Tyco Electronics Corporation | Lighting device |
US8724054B2 (en) | 2009-05-27 | 2014-05-13 | Gary Wayne Jones | High efficiency and long life optical spectrum conversion device and process |
CN101582476B (en) | 2009-06-04 | 2012-02-01 | 旭丽电子(广州)有限公司 | Light emitting diode and support module thereof |
US8168998B2 (en) | 2009-06-09 | 2012-05-01 | Koninklijke Philips Electronics N.V. | LED with remote phosphor layer and reflective submount |
US8575646B1 (en) | 2009-06-11 | 2013-11-05 | Applied Lighting Solutions, LLC | Creating an LED package with optical elements by using controlled wetting |
CN101592291A (en) | 2009-06-26 | 2009-12-02 | 惠州市斯科电气照明有限公司 | LED lamp preparation method that a kind of colour temperature is adjustable and LED lamp |
WO2011004320A1 (en) | 2009-07-09 | 2011-01-13 | Koninklijke Philips Electronics N.V. | Free form lighting module |
US8547035B2 (en) | 2009-07-15 | 2013-10-01 | Crestron Electronics Inc. | Dimmer adaptable to either two or three active wires |
EP2467637B1 (en) | 2009-08-19 | 2016-01-13 | Koninklijke Philips N.V. | A lighting device and a lens suitable for such a lighting device |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US8070314B2 (en) | 2009-08-27 | 2011-12-06 | Orgatech Omegalux, Inc. | Push fit waterproof interconnect for lighting fixtures |
JP2011054373A (en) | 2009-09-01 | 2011-03-17 | Sony Corp | Variable illumination apparatus |
US20110062470A1 (en) | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Reduced angular emission cone illumination leds |
CN201590432U (en) | 2009-09-30 | 2010-09-22 | 红蝶科技(深圳)有限公司 | Single-color LED encapsulation structure with high light-emitting rate and projection optical engine using same |
KR101028304B1 (en) | 2009-10-15 | 2011-04-11 | 엘지이노텍 주식회사 | Light emitting apparatus |
CN101714604A (en) * | 2009-11-13 | 2010-05-26 | 南京大学 | Broad-spectrum white-light LED structure and growing method |
EP2327929A1 (en) | 2009-11-25 | 2011-06-01 | Hella KGaA Hueck & Co. | Light unit for vehicles and mounting method |
KR20120050280A (en) | 2010-11-10 | 2012-05-18 | (주)플레넷아이엔티 | Led lamp having the dimming funtion or the sensibility lighting control function |
US8172436B2 (en) | 2009-12-01 | 2012-05-08 | Ullman Devices Corporation | Rotating LED light on a magnetic base |
US8118454B2 (en) | 2009-12-02 | 2012-02-21 | Abl Ip Holding Llc | Solid state lighting system with optic providing occluded remote phosphor |
US8235549B2 (en) | 2009-12-09 | 2012-08-07 | Tyco Electronics Corporation | Solid state lighting assembly |
US8210715B2 (en) | 2009-12-09 | 2012-07-03 | Tyco Electronics Corporation | Socket assembly with a thermal management structure |
US8070326B2 (en) | 2010-01-07 | 2011-12-06 | Osram Sylvania Inc. | Free-form lens design to apodize illuminance distribution |
US8773007B2 (en) | 2010-02-12 | 2014-07-08 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
US20130313965A1 (en) | 2010-02-18 | 2013-11-28 | Walsin Lihwa Corporation | Light Emitting Diode Unit |
US9091422B2 (en) | 2010-02-25 | 2015-07-28 | B/E Aerospace, Inc. | LED lighting element |
EP2530751A4 (en) | 2010-03-10 | 2013-10-23 | Panasonic Corp | Led-packaging resin body, led device, and method for manufacturing led device |
US8177385B2 (en) | 2010-03-11 | 2012-05-15 | Silvio Porciatti | T-bar for suspended ceiling with heat dissipation system for LED lighting |
KR20110106033A (en) | 2010-03-22 | 2011-09-28 | 오대권 | Drinking cups |
JP2011204658A (en) | 2010-03-24 | 2011-10-13 | Mitsuboshi Denki Seisakusho:Kk | Screwed-in lamp socket for low-temperature use |
JP2011204495A (en) | 2010-03-26 | 2011-10-13 | Panasonic Corp | Light source device, and image display device |
WO2011121845A1 (en) | 2010-03-31 | 2011-10-06 | シャープ株式会社 | Illumination apparatus and plant cultivation apparatus |
MX2012012462A (en) | 2010-04-26 | 2012-11-30 | Xicato Inc | Led-based illumination module attachment to a light fixture. |
EP2990718B1 (en) | 2010-04-27 | 2019-06-05 | Cooper Technologies Company | Linkable linear light emitting diode system |
WO2011139768A2 (en) | 2010-04-28 | 2011-11-10 | Cooper Technologies Company | Linear led light module |
TWM389811U (en) | 2010-05-12 | 2010-10-01 | Ledtech Electronics Corp | Illumination structure and lamp tube structure for generating plural specifically directional light sources |
CN102269351B (en) | 2010-06-04 | 2013-07-10 | 泰科电子(上海)有限公司 | Light-emitting diode (LED) lamp |
US20110303935A1 (en) | 2010-06-10 | 2011-12-15 | Foxsemicon Integrated Technology, Inc. | Light source module with luminescence in lens |
TWI400812B (en) | 2010-06-30 | 2013-07-01 | 晶元光電股份有限公司 | Electromagnetic wave gathering device and solar cell module with the same |
US8454193B2 (en) | 2010-07-08 | 2013-06-04 | Ilumisys, Inc. | Independent modules for LED fluorescent light tube replacement |
CN201739849U (en) | 2010-07-08 | 2011-02-09 | 鸿坤科技股份有限公司 | Light-emitting diode (LED) luminarie |
CN101997074A (en) | 2010-07-30 | 2011-03-30 | 晶科电子(广州)有限公司 | LED (Light Emitting Diode) surface patch type encapsulating structure based on silicon base plate and encapsulating method thereof |
EP2599202B1 (en) | 2010-07-30 | 2014-03-19 | Cirrus Logic, Inc. | Powering high-efficiency lighting devices from a triac-based dimmer |
US8602608B2 (en) | 2010-08-27 | 2013-12-10 | Tyco Electronics Nederland B.V. | Light module |
US8348478B2 (en) | 2010-08-27 | 2013-01-08 | Tyco Electronics Nederland B.V. | Light module |
US20120051048A1 (en) | 2010-08-31 | 2012-03-01 | U.S. Led, Ltd. | Retrofit for Non-LED Lighting Fixture |
WO2012034107A2 (en) | 2010-09-10 | 2012-03-15 | Robe Lighting Inc | A reconfigurable luminaire |
US8676284B2 (en) | 2010-10-15 | 2014-03-18 | Novanex, Inc. | Method for non-invasive blood glucose monitoring |
CN102454895A (en) | 2010-10-28 | 2012-05-16 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp |
CN101975345B (en) | 2010-10-28 | 2013-05-08 | 鸿富锦精密工业(深圳)有限公司 | LED (Light Emitting Diode) fluorescent lamp |
TWI483435B (en) * | 2010-11-29 | 2015-05-01 | Epistar Corp | Light emitting device |
US8425065B2 (en) | 2010-12-30 | 2013-04-23 | Xicato, Inc. | LED-based illumination modules with thin color converting layers |
IT1403915B1 (en) | 2011-02-04 | 2013-11-08 | Luxall S R L | LED, OLED, EL LIGHT SOURCES, ENCAPSULATED FOR CO-EXTRUSION IN A COLD VULCANIZABLE SILICONE ELASTOMER INCLUDING THERMOCONDUCTIVE MATERIALS AND ITS PREPARATION PROCESS |
US8314566B2 (en) | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
WO2012154275A1 (en) | 2011-02-25 | 2012-11-15 | Illumitex. Inc. | Plant growth lighting device and method |
CN202040752U (en) | 2011-03-24 | 2011-11-16 | 北京益泰金天光电技术有限公司 | Structure for fixing LED (light-emitting diode) |
US9016895B2 (en) | 2011-03-30 | 2015-04-28 | Innovative Lighting, Inc. | LED lighting fixture with reconfigurable light distribution pattern |
US8969894B2 (en) | 2011-04-15 | 2015-03-03 | Tsmc Solid State Lighting Ltd. | Light emitting diode with a micro-structure lens having a ridged surface |
WO2012143611A1 (en) | 2011-04-18 | 2012-10-26 | Marimils Oy | Illuminated stripe and illuminated stripe system |
US9029887B2 (en) | 2011-04-22 | 2015-05-12 | Micron Technology, Inc. | Solid state lighting devices having improved color uniformity and associated methods |
US8921875B2 (en) | 2011-05-10 | 2014-12-30 | Cree, Inc. | Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods |
US9022603B1 (en) | 2011-05-13 | 2015-05-05 | Cooper Technologies Company | Systems, methods, and devices for sealing LED light sources in a light module |
US8893144B2 (en) | 2011-05-16 | 2014-11-18 | Sap Se | Systems and methods for parallel execution of a portion of a script by interpreting comments in the script as parallel control statements |
US8525190B2 (en) | 2011-06-15 | 2013-09-03 | Cree, Inc. | Conformal gel layers for light emitting diodes |
US8876325B2 (en) | 2011-07-01 | 2014-11-04 | Cree, Inc. | Reverse total internal reflection features in linear profile for lighting applications |
US8545045B2 (en) | 2011-07-12 | 2013-10-01 | Rev-A-Shelf Company, Llc | Modular LED lighting systems and kits |
US8789988B2 (en) | 2011-07-21 | 2014-07-29 | Dan Goldwater | Flexible LED light strip for a bicycle and method for making the same |
US9845943B2 (en) | 2011-07-22 | 2017-12-19 | Guardian Glass, LLC | Heat management subsystems for LED lighting systems, LED lighting systems including heat management subsystems, and/or methods of making the same |
US8820964B2 (en) | 2011-08-02 | 2014-09-02 | Abl Ip Holding Llc | Linear lighting system |
JP2013077811A (en) | 2011-09-14 | 2013-04-25 | Nitto Denko Corp | Sealing sheet, manufacturing method of sealing sheet, light emitting diode device, and manufacturing method of light emitting diode device |
US9133993B2 (en) | 2011-09-30 | 2015-09-15 | Philip Eric Devorris | Moisture protected illuminated light strip |
US9995444B2 (en) | 2011-10-17 | 2018-06-12 | Ecosense Lighting Inc. | Linear LED light housing |
US8797480B2 (en) | 2011-10-18 | 2014-08-05 | Dai Nippon Printing Co., Ltd. | Light guide plate, surface light source device, and display device |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
US20130214691A1 (en) | 2011-12-30 | 2013-08-22 | Willis Electric Co., Ltd. | Encapsulated light-emitting diode lamp |
WO2013108814A1 (en) | 2012-01-17 | 2013-07-25 | 大日本印刷株式会社 | Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body |
US9151477B2 (en) | 2012-02-03 | 2015-10-06 | Cree, Inc. | Lighting device and method of installing light emitter |
TWI441359B (en) | 2012-03-14 | 2014-06-11 | Univ Nat Central | Light-emitting diode packaging structure of low angular correlated color temperature deviation |
US20130249387A1 (en) * | 2012-03-20 | 2013-09-26 | Chia-Fen Hsin | Light-emitting diodes, packages, and methods of making |
US8702265B2 (en) | 2012-04-05 | 2014-04-22 | Michael W. May | Non-curvilinear LED luminaries |
US9188290B2 (en) | 2012-04-10 | 2015-11-17 | Cree, Inc. | Indirect linear fixture |
JP5814175B2 (en) | 2012-04-16 | 2015-11-17 | 信越化学工業株式会社 | Thermosetting silicone resin composition for LED reflector, LED reflector and optical semiconductor device using the same |
US8864347B2 (en) | 2012-04-17 | 2014-10-21 | Tempo Industries, Llc | Concatenatable linear LED lighting fixtures |
US9065024B2 (en) | 2012-05-01 | 2015-06-23 | Bridgelux, Inc. | LED lens design with more uniform color-over-angle emission |
US8876322B2 (en) | 2012-06-20 | 2014-11-04 | Journée Lighting, Inc. | Linear LED module and socket for same |
US20150145406A1 (en) | 2012-06-28 | 2015-05-28 | Intematix Corporation | Solid-state linear lighting arrangements including light emitting phosphor |
US9980350B2 (en) | 2012-07-01 | 2018-05-22 | Cree, Inc. | Removable module for a lighting fixture |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
US8950901B2 (en) | 2012-08-10 | 2015-02-10 | Enttec Pty Ltd. | Lighting assembly and methods of assembling same |
CN111007681B (en) * | 2012-08-22 | 2023-03-07 | 首尔半导体株式会社 | Surface light source device and display device |
US8748202B2 (en) | 2012-09-14 | 2014-06-10 | Bridgelux, Inc. | Substrate free LED package |
KR101979825B1 (en) | 2012-11-19 | 2019-05-17 | 서울반도체 주식회사 | Light emitting device and electronic appratus comprising the same |
WO2014082262A1 (en) | 2012-11-29 | 2014-06-05 | Simm Mingji | Light emitting diode encapsulation structure |
US9307588B2 (en) | 2012-12-17 | 2016-04-05 | Ecosense Lighting Inc. | Systems and methods for dimming of a light source |
KR102024291B1 (en) | 2012-12-18 | 2019-09-23 | 엘지이노텍 주식회사 | Lamp unit and vehicle lamp apparatus for using the same |
TW201425820A (en) | 2012-12-24 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Light source and LED automobile lamp with the light source |
CN103090277B (en) * | 2013-01-30 | 2015-08-19 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal indicator |
US9353919B2 (en) | 2013-02-01 | 2016-05-31 | Zhengming WU | White LED lamp secondary encapsulation structure capable of reducing blue-light hazards |
CA2809709C (en) | 2013-03-14 | 2018-02-13 | Cledlight Semiconductor Lighting Co., Ltd. | Rotational mounting for linear led light |
US9874333B2 (en) | 2013-03-14 | 2018-01-23 | Cree, Inc. | Surface ambient wrap light fixture |
US10584860B2 (en) | 2013-03-14 | 2020-03-10 | Ideal Industries, Llc | Linear light fixture with interchangeable light engine unit |
US9470395B2 (en) | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
US9052075B2 (en) | 2013-03-15 | 2015-06-09 | Cree, Inc. | Standardized troffer fixture |
WO2014146054A1 (en) | 2013-03-15 | 2014-09-18 | Jones Gary W | Ambient spectrum light conversion device |
WO2014145644A2 (en) | 2013-03-15 | 2014-09-18 | Spanard Jan-Marie | Methods of tuning light emitting devices and tuned light emitting devices |
WO2014146029A1 (en) * | 2013-03-15 | 2014-09-18 | Jones Gary W | Multispectral therapeutic light source |
US9429283B2 (en) | 2013-04-15 | 2016-08-30 | Tempo Industries, Llc | Adjustable length articulated LED light fixtures |
WO2014172162A1 (en) | 2013-04-15 | 2014-10-23 | Dow Corning Corporation | Light emitting assembly with spectrum-shifting reflectance and method |
US9546781B2 (en) | 2013-04-17 | 2017-01-17 | Ever Venture Solutions, Inc. | Field-serviceable flat panel lighting device |
US9115858B2 (en) | 2013-05-09 | 2015-08-25 | Inspired LED, LLC | Extended length flexible LED light strip system |
WO2014183113A2 (en) | 2013-05-10 | 2014-11-13 | Abl Ip Holding Llc | Silicone optics |
US9453958B2 (en) | 2013-06-17 | 2016-09-27 | Dai Nippon Printing Co., Ltd. | Light guide plate and illumination apparatus |
US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
KR20150015900A (en) | 2013-08-02 | 2015-02-11 | 김 스티븐 | Led chip-on-board type rigid flexible pcb and rigid flexible heat spreader sheet pad and heat-sink structure using the same |
US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
US9976710B2 (en) | 2013-10-30 | 2018-05-22 | Lilibrand Llc | Flexible strip lighting apparatus and methods |
KR20150059494A (en) | 2013-11-22 | 2015-06-01 | 삼성전자주식회사 | Method of manufacturing optical film for reducing color shift, organic light emitting display employing the optical film and method of manufacturing the organic light emitting display |
US10612747B2 (en) | 2013-12-16 | 2020-04-07 | Ideal Industries Lighting Llc | Linear shelf light fixture with gap filler elements |
US10100988B2 (en) | 2013-12-16 | 2018-10-16 | Cree, Inc. | Linear shelf light fixture with reflectors |
US9565769B2 (en) * | 2014-02-19 | 2017-02-07 | Elemental LED, Inc. | LED linear lighting kit |
RU2672643C2 (en) | 2014-03-28 | 2018-11-16 | Асахи Раббер Инк. | Light distribution lens |
AU2015247456B2 (en) * | 2014-04-18 | 2020-05-07 | Dva Holdings Llc | Lighting assembly |
US20150316219A1 (en) | 2014-05-01 | 2015-11-05 | CoreLed Systems, LLC | High-pass filter for led lighting |
CN104037276A (en) * | 2014-06-24 | 2014-09-10 | 合肥工业大学 | Multi-layer white light LED (Light Emitting Diode) device with gradient refractive indexes and packaging method thereof |
US20160076743A1 (en) | 2014-09-15 | 2016-03-17 | Linear Lighting Corp. | Dimmable, high-efficiency led linear lighting system with interchangeable features |
JP6582382B2 (en) | 2014-09-26 | 2019-10-02 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
JP6544513B2 (en) | 2014-11-19 | 2019-07-17 | 三菱ケミカル株式会社 | Spot lighting device |
US9869450B2 (en) | 2015-02-09 | 2018-01-16 | Ecosense Lighting Inc. | Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector |
US10801696B2 (en) | 2015-02-09 | 2020-10-13 | Ecosense Lighting Inc. | Lighting systems generating partially-collimated light emissions |
KR20160098580A (en) * | 2015-02-09 | 2016-08-19 | 삼성전자주식회사 | Optical device and light source module having the same |
US9651227B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Low-profile lighting system having pivotable lighting enclosure |
US10184648B2 (en) | 2015-05-04 | 2019-01-22 | Terralux, Inc. | Adjustable and reconfigurable light source |
US10584831B2 (en) | 2015-06-04 | 2020-03-10 | Eaton Intelligent Power Limited | Luminaire for use in harsh and hazardous locations |
US20170009957A1 (en) | 2015-07-09 | 2017-01-12 | Cree, Inc. | Linear led lighting system with controlled distribution |
US10030825B2 (en) | 2015-08-03 | 2018-07-24 | Philips Lighting Holding B.V. | Lighting assembly with an optical element for reducing color over angle variation |
US10519314B2 (en) | 2015-11-16 | 2019-12-31 | StoreDot Ltd. | Red-enhanced white LCD displays comprising sol-gel-based color conversion films |
US11047534B2 (en) | 2016-01-28 | 2021-06-29 | EcoSense Lighting, Inc. | Multizone mixing cup illumination system |
CN109642718B (en) | 2016-01-28 | 2020-10-16 | 生态照明公司 | Illumination with multi-zone fusion cup |
US10197226B2 (en) | 2016-01-28 | 2019-02-05 | Ecosense Lighting Inc | Illuminating with a multizone mixing cup |
US9825206B2 (en) | 2016-02-25 | 2017-11-21 | Toyoda Gosei, Co., Ltd. | Light-emitting device |
CN111108616B (en) | 2016-03-08 | 2024-03-15 | 科鲁斯公司 | Lighting system with lens assembly |
JP6678312B2 (en) | 2016-04-22 | 2020-04-08 | パナソニックIpマネジメント株式会社 | Lighting equipment |
BR112019000942B1 (en) | 2016-07-22 | 2022-11-08 | Syngenta Participations Ag | COMPOUND COMPRISING OXADIAZOLE DERIVATIVES AND THEIR USE, AGROCHEMICAL COMPOSITION AND METHOD FOR CONTROLLING OR PREVENTING INFESTATION OF USEFUL PLANTS BY PHYTOPATHOGENIC MICRO-ORGANISMS |
US10267972B2 (en) | 2016-10-25 | 2019-04-23 | Svv Technology Innovations, Inc. | Shaped light guide illumination devices |
FR3058203A1 (en) | 2016-10-27 | 2018-05-04 | Nicolas Chaume | LIGHT EMITTING LIGHT EMITTING APPARATUS |
WO2018140727A1 (en) | 2017-01-27 | 2018-08-02 | Lilibrand Llc | Lighting systems with high color rendering index and uniform planar illumination |
WO2018157166A1 (en) | 2017-02-27 | 2018-08-30 | Lilibrand Llc | Tunable white lighting systems |
US20180328552A1 (en) | 2017-03-09 | 2018-11-15 | Lilibrand Llc | Fixtures and lighting accessories for lighting devices |
CN108562965B (en) | 2018-01-10 | 2020-08-25 | 京东方科技集团股份有限公司 | Backlight module and display device |
US10461231B2 (en) | 2018-02-27 | 2019-10-29 | Lumens Co., Ltd. | Method for fabricating LED package |
ES1211538Y (en) | 2018-04-06 | 2018-07-26 | Ohmio Servicios Integrales S L | LED STRIP ENCAPSULATED WITHOUT POWER SUPPLY |
CN114981592A (en) | 2018-05-01 | 2022-08-30 | 生态照明公司 | Lighting system and device with central silicone module |
US20200144468A1 (en) | 2018-07-11 | 2020-05-07 | Lilibrand Llc | Systems including an led and a light guide |
WO2021021234A1 (en) | 2019-08-01 | 2021-02-04 | Lilibrand Llc | Lighting systems including photo-luminescent material |
WO2020131933A1 (en) | 2018-12-17 | 2020-06-25 | Lilibrand Llc | Strip lighting systems which comply with ac driving power |
WO2020127163A1 (en) | 2018-12-21 | 2020-06-25 | Signify Holding B.V. | Filament lamp |
US20210338861A1 (en) | 2020-04-13 | 2021-11-04 | Ecosense Lighting Inc. | System and method for reducing microbial load using violet light |
-
2018
- 2018-01-26 WO PCT/US2018/015449 patent/WO2018140727A1/en active Application Filing
- 2018-01-26 CN CN201880021170.4A patent/CN110998880A/en active Pending
- 2018-01-26 US US16/480,867 patent/US11296057B2/en active Active
-
2022
- 2022-03-08 US US17/653,988 patent/US11658163B2/en active Active
-
2023
- 2023-04-20 US US18/303,849 patent/US20230260974A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090026913A1 (en) * | 2007-07-26 | 2009-01-29 | Matthew Steven Mrakovich | Dynamic color or white light phosphor converted LED illumination system |
US20120170303A1 (en) * | 2009-06-24 | 2012-07-05 | Noam Meir | Illumination apparatus with high conversion efficiency and methods of forming the same |
US20120146066A1 (en) * | 2009-06-27 | 2012-06-14 | Michael Albert Tischler | High efficiency leds and led lamps |
US20150062892A1 (en) * | 2013-08-29 | 2015-03-05 | Soraa, Inc. | Circadian friendly led light source |
US20170309795A1 (en) * | 2014-10-08 | 2017-10-26 | Seoul Semiconductor Co., Ltd. | Light emitting device |
Non-Patent Citations (1)
Title |
---|
Meir 8272758, of record * |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11028980B2 (en) | 2013-10-30 | 2021-06-08 | Ecosense Lighting Inc. | Flexible strip lighting apparatus and methods |
US11359796B2 (en) | 2016-03-08 | 2022-06-14 | Korrus, Inc. | Lighting system with lens assembly |
US11022279B2 (en) | 2016-03-08 | 2021-06-01 | Ecosense Lighting Inc. | Lighting system with lens assembly |
US11867382B2 (en) | 2016-03-08 | 2024-01-09 | Korrus, Inc. | Lighting system with lens assembly |
US11060702B2 (en) | 2016-03-08 | 2021-07-13 | Ecosense Lighting Inc. | Lighting system with lens assembly |
US11512838B2 (en) | 2016-03-08 | 2022-11-29 | Korrus, Inc. | Lighting system with lens assembly |
US11296057B2 (en) | 2017-01-27 | 2022-04-05 | EcoSense Lighting, Inc. | Lighting systems with high color rendering index and uniform planar illumination |
US11658163B2 (en) | 2017-01-27 | 2023-05-23 | Korrus, Inc. | Lighting systems with high color rendering index and uniform planar illumination |
US11339932B2 (en) | 2017-03-09 | 2022-05-24 | Korrus, Inc. | Fixtures and lighting accessories for lighting devices |
US10989372B2 (en) | 2017-03-09 | 2021-04-27 | Ecosense Lighting Inc. | Fixtures and lighting accessories for lighting devices |
US11578857B2 (en) | 2018-05-01 | 2023-02-14 | Korrus, Inc. | Lighting systems and devices with central silicone module |
US11041609B2 (en) | 2018-05-01 | 2021-06-22 | Ecosense Lighting Inc. | Lighting systems and devices with central silicone module |
US11202920B2 (en) * | 2018-12-07 | 2021-12-21 | Ledvance Llc | Luminaire for enhanced color rendition and wellness |
US11353200B2 (en) | 2018-12-17 | 2022-06-07 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
US11708966B2 (en) | 2018-12-17 | 2023-07-25 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
Also Published As
Publication number | Publication date |
---|---|
WO2018140727A1 (en) | 2018-08-02 |
US20230260974A1 (en) | 2023-08-17 |
US11658163B2 (en) | 2023-05-23 |
US11296057B2 (en) | 2022-04-05 |
CN110998880A (en) | 2020-04-10 |
US20220336424A1 (en) | 2022-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11658163B2 (en) | Lighting systems with high color rendering index and uniform planar illumination | |
US11894351B2 (en) | Tunable white lighting systems | |
EP2095438B1 (en) | Lighting device and lighting method | |
US8648546B2 (en) | High efficiency lighting device including one or more saturated light emitters, and method of lighting | |
KR101499269B1 (en) | Lighting devices, methods of lighting, light filters and methods of filtering light | |
US7821194B2 (en) | Solid state lighting devices including light mixtures | |
US7918581B2 (en) | Lighting device and lighting method | |
US8646948B1 (en) | LED lighting fixture | |
US9512970B2 (en) | Photoluminescence wavelength conversion components | |
US8779653B2 (en) | Lighting device with reverse tapered heatsink | |
US20140175966A1 (en) | Led lamp | |
US9416924B2 (en) | Light emission module | |
US11107857B2 (en) | Light emitting diodes, components and related methods | |
KR20140116536A (en) | Lighting device and method of lighting | |
US9841161B2 (en) | Lens for light emitter, light source module, lighting device, and lighting system | |
KR20160079973A (en) | Light source module | |
KR101884599B1 (en) | Light emitting device package, lighting device and lighting system comprising the same | |
JP2015106502A (en) | Luminaire | |
US9328876B2 (en) | High efficiency LED lamp | |
KR101862589B1 (en) | Lighting module | |
CN110690206A (en) | White LED element with double primary colors and low blue light and white LED assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
AS | Assignment |
Owner name: LILIBRAND LLC, NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEIR, NOAM;MEIR, ARIEL;SIGNING DATES FROM 20200104 TO 20200110;REEL/FRAME:051594/0036 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
AS | Assignment |
Owner name: ECOSENSE LIGHTING INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LILIBRAND LLC;REEL/FRAME:052626/0030 Effective date: 20200211 |
|
AS | Assignment |
Owner name: ECOSENSE LIGHTING INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LILIBRAND LLC;REEL/FRAME:054288/0219 Effective date: 20201001 |
|
AS | Assignment |
Owner name: ECOSENSE LIGHTING INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LILIBRAND LLC;REEL/FRAME:054195/0140 Effective date: 20201001 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
AS | Assignment |
Owner name: KORRUS, INC., CALIFORNIA Free format text: NUNC PRO TUNC ASSIGNMENT;ASSIGNOR:ECOSENSE LIGHTING INC.;REEL/FRAME:059239/0614 Effective date: 20220105 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |