US20190371704A1 - Package carrier having a mesh gas-permeable structure disposed in the through hole - Google Patents
Package carrier having a mesh gas-permeable structure disposed in the through hole Download PDFInfo
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- US20190371704A1 US20190371704A1 US16/029,659 US201816029659A US2019371704A1 US 20190371704 A1 US20190371704 A1 US 20190371704A1 US 201816029659 A US201816029659 A US 201816029659A US 2019371704 A1 US2019371704 A1 US 2019371704A1
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- package carrier
- circuit layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
Definitions
- the invention relates to a carrier structure, and particularly relates to a package carrier.
- a package carrier mainly consists of a plurality of circuit layers, wherein a heat-generating element, such as a chip, is mostly disposed on an upper surface of the package carrier. Since the heat-generating element generates heat easily in operation, the operation performance of the heat-generating element is easily affected. For heat-dissipating path of conventional package carrier, the heat is dissipated mainly in a thickness direction (perpendicular to plane). However, the heat-dissipating method is still insufficient because it cannot quickly transmit the heat energy generated by the heat-generating element, which causes that the temperature of the package carrier continues to increase and thus affecting the reliability of the heat-generating element.
- the invention provides a package carrier having a better heat-dissipating effect.
- the package carrier of the invention includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask.
- the multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The through holes connect the upper and the lower surfaces.
- the gas-permeable structure is in the form of a mesh and disposed in at least one through hole.
- the first outer circuit layer is disposed on the upper surface of the multilayer circuit structure and at least covers the upper surface.
- the second outer circuit layer is disposed on the lower surface of the multilayer circuit structure and at least covers the lower surface.
- the first solder mask is disposed on the first outer circuit layer and has at least one first opening.
- the first opening exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure.
- the second solder mask is disposed on the second outer circuit layer and has at least one second opening. The second opening exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.
- the multilayer circuit structure includes a core layer, a first dielectric layer, a second dielectric layer, a first inner circuit layer and a second inner circuit layer.
- the core layer has a first surface and a second surface opposite to each other.
- the first dielectric layer is disposed on the first surface of the core layer.
- the second dielectric layer is disposed on the second surface of the core layer.
- the first inner circuit layer is disposed on the first dielectric layer.
- the second inner circuit layer is disposed on the second dielectric layer.
- the core layer includes a core dielectric layer, a first patterned copper foil layer and a second patterned copper foil layer.
- the core dielectric layer has a first side surface and a second side surface opposite to each other.
- the first patterned copper foil layer is disposed on the first side surface of the core dielectric layer, and exposes a portion of the first side surface.
- the second patterned copper foil layer is disposed on the second side surface of the core dielectric layer, and exposes a portion of the second side surface.
- the package carrier further includes a seed layer covering the upper surface and lower surface of the multilayer circuit structure and an inner wall of the through holes.
- the material of the gas-permeable structure includes metal or ceramics.
- the gas-permeable structure has a first side and a second side opposite to each other.
- the first outer circuit layer and the second outer circuit layer further completely cover the first side and the second side of the gas-permeable structure.
- the gas-permeable structure has a first side and a second side opposite to each other.
- the first outer circuit layer and the second outer circuit layer further partially cover the first side and the second side of the gas-permeable structure.
- the package carrier further includes a metal block disposed in one of the through holes, and has a top surface and a bottom surface opposite to each other.
- the first outer circuit layer and the second outer circuit layer further completely cover the top surface and the bottom surface of the metal block.
- the package carrier further includes a first surface treatment layer and a second surface treatment player.
- the first surface treatment layer is disposed on the first outer circuit layer exposed by the first solder mask.
- the second surface treatment layer is disposed on the second outer circuit layer exposed by the second solder mask.
- the first solder mask and the second solder mask respectively cover an exposed portion of the multilayer circuit structure.
- the gas-permeable structure is in the form of a mesh and disposed in the through holes of the multilayer circuit structure, and the opening of the solder mask is disposed corresponding to the gas-permeable structure.
- the gas-permeable structure not only can dissipate heat in a thickness direction (i.e., Z direction) of the package carrier, but also can dissipate heat in a plane direction (i.e., X-Y direction) of the package carrier with the design of mesh.
- the package carrier of the invention increases the heat-dissipating area through the configuration of the gas-permeable structure, thereby improving the heat-dissipating effect.
- FIG. 1 A illustrates a schematic cross-sectional view of a package carrier according to an embodiment of the invention.
- FIG. 1B illustrates a schematic cross-sectional view of the package carrier of FIG. 1A carrying a heat-generating element and a heat-dissipating element.
- FIG. 2A illustrates a schematic cross-sectional view of a package carrier according to another embodiment of the invention.
- FIG. 2B illustrates a schematic cross-sectional view of the package carrier in FIG. 2A carrying a heat-generating element and a heat-dissipating element.
- FIG. 3A illustrates a schematic cross-sectional view of a package carrier according to yet another embodiment of the invention.
- FIG. 3B illustrates a schematic cross-sectional view of the package carrier in FIG. 3A carrying a heat-generating element and a heat-dissipating element.
- FIG. 1A illustrates a schematic cross-sectional view of a package carrier according to an embodiment of the invention.
- a package carrier 100 a includes a plurality of multilayer circuit structure 110 , at least one gas-permeable structure 120 (only two gas-permeable structures are shown in FIG. 1A ), a first outer circuit layer 130 a, a second outer circuit layer 140 a, a first solder mask 150 and a second solder mask 160 .
- the multilayer circuit structure 110 has an upper surface S 1 and a lower surface S 2 opposite to each other and a plurality of through holes T (only two through holes are shown in FIG. 1A ).
- the through holes T connect the upper surface S 1 and the lower surface S 2 .
- the gas-permeable structure 120 is in the form of a mesh and respectively disposed in the through holes T.
- the first outer circuit layer 130 a is disposed on the upper surface S 1 of the multilayer circuit structure 110 and at least covers the upper surface S 1 .
- the second outer circuit layer 140 a is disposed on the lower surface S 2 of the multilayer circuit structure 110 and at least covers the lower surface S 2 .
- the first solder mask 150 is disposed on the first outer circuit layer 130 a and has at least one first opening 152 (only two openings are shown in FIG. 1A ).
- the first opening 152 exposes a portion of the first outer circuit layer 130 a and is disposed corresponding to the gas-permeable structure 120 .
- the second solder mask 160 is disposed on the second outer circuit layer 140 a and has at least one second opening 162 (only two openings are shown in
- the second opening 162 exposes a portion of the second outer circuit layer 140 a and is disposed corresponding to the gas-permeable structure 120 .
- the multilayer circuit structure 110 of the embodiment includes a core layer 112 , a first dielectric layer 113 , a second dielectric layer 115 , a first inner circuit layer 114 and a second inner circuit layer 116 .
- the core layer 112 has a first surface 112 a and a second surface 112 b opposite to each other, wherein the core layer 112 includes a core dielectric layer CD, a first patterned copper foil layer CL 1 and a second patterned copper coil layer CL 2 .
- the core dielectric layer CD has a first side surface C 1 and a second side surface C 2 opposite to each other.
- the first patterned copper foil layer CL 1 is disposed on the first side surface C 1 of the core dielectric layer CD, and exposes a portion of the first side surface C 1 .
- the second patterned copper foil layer CL 2 is disposed on the second side surface C 2 of the core dielectric layer CD, and exposes a portion of the second side surface C 2 .
- the first dielectric layer 113 is disposed on the first surface 112 a of the core layer 112
- the second dielectric layer 115 is disposed on the second surface 112 b of the core layer 112 .
- the first inner circuit layer 114 is disposed on the first dielectric layer 113
- the second inner circuit layer 116 is disposed on the second dielectric layer 115 .
- the package carrier 100 a of the embodiment further includes a seed layer 170 , wherein the seed layer 170 covers the upper surface S 1 and the lower surface S 2 of the multilayer circuit structure 110 and the inner wall of the through holes T.
- the seed layer 170 is disposed between the first outer circuit layer 130 a and the first inner circuit layer 114 , the second outer circuit layer 140 a and the second inner circuit layer 116 , and the multilayer circuit structure 110 and the gas-permeable structure 120 .
- the gas-permeable structure 120 is disposed in the through holes T and has a first side 122 and a second side 124 opposite to each other.
- the material of the gas-permeable structure 120 is, for example, metal or ceramics, wherein the metal is, for example, gold, silver, copper, aluminum or other metals having higher thermal conductivity.
- the first outer circuit layer 130 a and the second outer circuit layer 140 a of the embodiment are not patterned and completely cover the first side 122 and the second side 124 of the gas-permeable structure 120 .
- first solder mask 150 and the second solder mask 160 of the embodiment are respectively disposed on the first outer circuit layer 130 a and the second outer circuit layer 140 a, and respectively penetrate through the first outer circuit layer 130 a and the second outer circuit layer 140 a to be connected to the first dielectric layer 113 and the second dielectric layer 115 of the multilayer circuit structure 110 .
- first solder mask 150 and the second solder mask 160 respectively cover the exposed portion of the multilayer circuit structure 110 .
- the first opening 152 of the first solder mask 150 and the second opening 162 of the second solder mask 160 respectively expose a portion of the first outer circuit layer 130 a and a portion of the second outer circuit layer 140 a.
- the package carrier 100 a of the embodiment further includes a first surface treatment layer 190 and a second surface treatment layer 195 .
- the first surface treatment layer 190 is disposed on the first outer circuit layer 130 a exposed by the first solder mask 150 .
- the second surface treatment layer 195 is disposed on the second outer circuit layer 140 a exposed by the second solder mask 160 .
- the gas-permeable structure 120 of the embodiment is in the form of a mesh and disposed in the through holes T of the multilayer circuit structure 110 , and the first opening 152 of the first solder mask 150 and the second opening 162 of the second solder mask 160 are disposed corresponding to the first side 122 and the second side 124 of the gas-permeable structure 120 , in this manner, the gas-permeable structure 120 not only can dissipate heat in the thickness direction (i.e., Z direction) of the package carrier 100 a, but also can dissipate heat in the plane direction (i.e., X-Y direction) of the package carrier 100 a through the design of mesh.
- the package carrier 100 a of the embodiment increases the heat-dissipating area through the configuration of the gas-permeable structure 120 , thereby increasing the heat-dissipating effect.
- a heat-dissipating fin 20 may be disposed on the first surface treatment layer 190
- the heat-generating element 10 may be disposed on the second surface treatment layer 195 .
- the heat generated by the heat-generating element 10 may be transmitted to the heat-dissipating fin 20 through the second surface treatment layer 195 , the second outer circuit layer 140 a, the gas-permeable structure 120 , the first outer circuit layer 130 a and the first surface treatment layer 190 in sequence.
- the mesh-shaped gas-permeable structure 120 not only can dissipate heat in the thickness direction (i.e., Z direction) of the package carrier 100 a but also can dissipate heat in the plane direction (i.e., X-Y direction) of the package carrier 100 a. Accordingly, the package carrier 100 a of the embodiment can increase the heat-dissipating area through the configuration of the gas-permeable structure 120 , thereby improving the heat-dissipating effect.
- FIG. 2A illustrates a schematic cross-sectional view of a package carrier according to another embodiment of the invention.
- FIG. 2B illustrates a schematic cross-sectional view of the package carrier in FIG. 2A carrying a heat-generating element and a heat-dissipating element.
- a package carrier 100 b of the embodiment is similar to the package carrier 100 a in FIG. 1A , and the difference between the two is that a first outer circuit layer 130 b and a second outer circuit layer 140 b of the embodiment partially cover the first side 122 and the second side 124 of the gas-permeable structure 120 .
- first outer circuit layer 130 b and the second outer circuit layer 140 b of the embodiment are patterned structures respectively, and the first outer circuit layer 130 b and the second outer circuit layer 140 b respectively expose a portion of the first side 122 and a portion of the second side 124 of the gas-permeable structure 120 .
- the heat-dissipating fin 20 may be disposed on the first surface treatment layer 190
- the heat-generating element 10 may be disposed on the second surface treatment layer 195 .
- the heat generated by the heat-generating element 10 may be dissipated in the thickness direction (i.e., Z direction) of the package carrier 100 b by the gas-permeable structure 120 , and the heat energy in the package carrier 100 b may be dissipated in the plane direction (i.e., X-Y direction) of the package carrier 100 b through the mesh-shaped gas-permeable structure 120 , and outer air A can directly pass through the gas-permeable structure 120 to dissipate the heat in the package carrier 100 b.
- the embodiment increases the heat-dissipating area through the configuration of the gas-permeable structure 120 , thereby improving the heat-dissipating effect of the package carrier 100 b.
- FIG. 3A illustrates a schematic cross-sectional view of a package carrier according to yet another embodiment of the invention.
- FIG. 3B illustrates a schematic cross-sectional view of the package carrier in FIG. 3A carrying a heat-generating element and a heat-dissipating element.
- a package carrier 100 c in the embodiment is similar to the package carrier 100 a in FIG. 1A , and the difference between the two is that the package carrier 100 c in the embodiment further includes a metal block 180 , wherein the metal block 180 is disposed in one of the through holes T, and the metal block 180 has a top surface 182 and a bottom surface 184 opposite to each other.
- first outer circuit layer 130 c and the second outer circuit layer 140 c further completely cover the top surface 182 and the bottom surface 184 of the metal block 180 .
- first outer circuit layer 130 c and the second outer circuit layer 140 c respectively expose the first side 122 and the second side 124 of the gas-permeable structure 120 .
- the heat-dissipating fin 20 may be disposed on the first surface treatment layer 190
- the heat-generating element 10 may be disposed on the second surface treatment layer 195 .
- the heat generated by the heat-generating element 10 may be transmitted to the heat-dissipating fin 20 through the second surface treatment layer 195 , the second outer circuit layer 140 c, the metal block 180 , the first outer circuit layer 130 c and the first surface treatment layer 190 in sequence. That is, the heat may be dissipated in the thickness direction (i.e., Z direction) of the package carrier 100 c through the metal block 180 .
- the heat energy in the package carrier 100 c may be dissipated in the plane direction (i.e., X-Y direction) of the package carrier 100 c through the mesh-shaped gas-permeable structure 120 , and outer air A can directly pass through the gas-permeable structure 120 to dissipate the heat in the package carrier 100 c.
- the package carrier 100 c in the embodiment may have a better heat-dissipating effect.
- a fan can be selectively disposed on the second side of the gas-permeable structure, thereby increasing air circulation and further improving the heat-dissipating effect of the package carrier.
- the gas-permeable structure is in the form of a mesh and disposed in the through holes of the multilayer circuit structure, and the opening of the solder mask is disposed corresponding to the gas-permeable structure.
- the gas-permeable structure not only can dissipate heat in a thickness direction (i.e., Z direction) of the package carrier, but also can dissipate heat in a plane direction (i.e., X-Y direction) of the package carrier with the design of mesh.
- the package carrier of the invention increases the heat-dissipating area through the configuration of the gas-permeable structure, thereby improving the heat-dissipating effect.
Abstract
Description
- This application claims the priority benefit of Taiwan application serial no. 107118580, filed on May 30, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- The invention relates to a carrier structure, and particularly relates to a package carrier.
- Generally, a package carrier mainly consists of a plurality of circuit layers, wherein a heat-generating element, such as a chip, is mostly disposed on an upper surface of the package carrier. Since the heat-generating element generates heat easily in operation, the operation performance of the heat-generating element is easily affected. For heat-dissipating path of conventional package carrier, the heat is dissipated mainly in a thickness direction (perpendicular to plane). However, the heat-dissipating method is still insufficient because it cannot quickly transmit the heat energy generated by the heat-generating element, which causes that the temperature of the package carrier continues to increase and thus affecting the reliability of the heat-generating element.
- The invention provides a package carrier having a better heat-dissipating effect.
- The package carrier of the invention includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The through holes connect the upper and the lower surfaces. The gas-permeable structure is in the form of a mesh and disposed in at least one through hole. The first outer circuit layer is disposed on the upper surface of the multilayer circuit structure and at least covers the upper surface. The second outer circuit layer is disposed on the lower surface of the multilayer circuit structure and at least covers the lower surface. The first solder mask is disposed on the first outer circuit layer and has at least one first opening. The first opening exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. The second solder mask is disposed on the second outer circuit layer and has at least one second opening. The second opening exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.
- According to an embodiment of the invention, the multilayer circuit structure includes a core layer, a first dielectric layer, a second dielectric layer, a first inner circuit layer and a second inner circuit layer. The core layer has a first surface and a second surface opposite to each other. The first dielectric layer is disposed on the first surface of the core layer. The second dielectric layer is disposed on the second surface of the core layer. The first inner circuit layer is disposed on the first dielectric layer. The second inner circuit layer is disposed on the second dielectric layer.
- According to an embodiment of the invention, the core layer includes a core dielectric layer, a first patterned copper foil layer and a second patterned copper foil layer. The core dielectric layer has a first side surface and a second side surface opposite to each other. The first patterned copper foil layer is disposed on the first side surface of the core dielectric layer, and exposes a portion of the first side surface. The second patterned copper foil layer is disposed on the second side surface of the core dielectric layer, and exposes a portion of the second side surface.
- According to an embodiment of the invention, the package carrier further includes a seed layer covering the upper surface and lower surface of the multilayer circuit structure and an inner wall of the through holes.
- According to an embodiment of the invention, the material of the gas-permeable structure includes metal or ceramics.
- According to an embodiment of the invention, the gas-permeable structure has a first side and a second side opposite to each other. The first outer circuit layer and the second outer circuit layer further completely cover the first side and the second side of the gas-permeable structure.
- According to an embodiment of the invention, the gas-permeable structure has a first side and a second side opposite to each other. The first outer circuit layer and the second outer circuit layer further partially cover the first side and the second side of the gas-permeable structure.
- According to an embodiment of the invention, the package carrier further includes a metal block disposed in one of the through holes, and has a top surface and a bottom surface opposite to each other. The first outer circuit layer and the second outer circuit layer further completely cover the top surface and the bottom surface of the metal block.
- According to an embodiment of the invention, the package carrier further includes a first surface treatment layer and a second surface treatment player. The first surface treatment layer is disposed on the first outer circuit layer exposed by the first solder mask. The second surface treatment layer is disposed on the second outer circuit layer exposed by the second solder mask.
- According to an embodiment of the invention, the first solder mask and the second solder mask respectively cover an exposed portion of the multilayer circuit structure.
- Based on the above, in the design of the package carrier of the invention, the gas-permeable structure is in the form of a mesh and disposed in the through holes of the multilayer circuit structure, and the opening of the solder mask is disposed corresponding to the gas-permeable structure. In this manner, the gas-permeable structure not only can dissipate heat in a thickness direction (i.e., Z direction) of the package carrier, but also can dissipate heat in a plane direction (i.e., X-Y direction) of the package carrier with the design of mesh. Briefly, the package carrier of the invention increases the heat-dissipating area through the configuration of the gas-permeable structure, thereby improving the heat-dissipating effect.
- To make the above features and advantages of the invention more comprehensible, embodiments accompanied with drawings are described in detail as follows.
-
FIG. 1 A illustrates a schematic cross-sectional view of a package carrier according to an embodiment of the invention. -
FIG. 1B illustrates a schematic cross-sectional view of the package carrier ofFIG. 1A carrying a heat-generating element and a heat-dissipating element. -
FIG. 2A illustrates a schematic cross-sectional view of a package carrier according to another embodiment of the invention. -
FIG. 2B illustrates a schematic cross-sectional view of the package carrier inFIG. 2A carrying a heat-generating element and a heat-dissipating element. -
FIG. 3A illustrates a schematic cross-sectional view of a package carrier according to yet another embodiment of the invention. -
FIG. 3B illustrates a schematic cross-sectional view of the package carrier inFIG. 3A carrying a heat-generating element and a heat-dissipating element. -
FIG. 1A illustrates a schematic cross-sectional view of a package carrier according to an embodiment of the invention. Referring toFIG. 1A , in the embodiment, apackage carrier 100 a includes a plurality ofmultilayer circuit structure 110, at least one gas-permeable structure 120 (only two gas-permeable structures are shown inFIG. 1A ), a firstouter circuit layer 130 a, a secondouter circuit layer 140 a, afirst solder mask 150 and asecond solder mask 160. Themultilayer circuit structure 110 has an upper surface S1 and a lower surface S2 opposite to each other and a plurality of through holes T (only two through holes are shown inFIG. 1A ). The through holes T connect the upper surface S1 and the lower surface S2. The gas-permeable structure 120 is in the form of a mesh and respectively disposed in the through holes T. The firstouter circuit layer 130 a is disposed on the upper surface S1 of themultilayer circuit structure 110 and at least covers the upper surface S1. The secondouter circuit layer 140 a is disposed on the lower surface S2 of themultilayer circuit structure 110 and at least covers the lower surface S2. Thefirst solder mask 150 is disposed on the firstouter circuit layer 130 a and has at least one first opening 152 (only two openings are shown inFIG. 1A ). Thefirst opening 152 exposes a portion of the firstouter circuit layer 130 a and is disposed corresponding to the gas-permeable structure 120. Thesecond solder mask 160 is disposed on the secondouter circuit layer 140 a and has at least one second opening 162 (only two openings are shown in -
FIG. 1A ). Thesecond opening 162 exposes a portion of the secondouter circuit layer 140 a and is disposed corresponding to the gas-permeable structure 120. - Specifically, the
multilayer circuit structure 110 of the embodiment includes acore layer 112, a firstdielectric layer 113, asecond dielectric layer 115, a firstinner circuit layer 114 and a secondinner circuit layer 116. Thecore layer 112 has afirst surface 112 a and asecond surface 112 b opposite to each other, wherein thecore layer 112 includes a core dielectric layer CD, a first patterned copper foil layer CL1 and a second patterned copper coil layer CL2. The core dielectric layer CD has a first side surface C1 and a second side surface C2 opposite to each other. The first patterned copper foil layer CL1 is disposed on the first side surface C1 of the core dielectric layer CD, and exposes a portion of the first side surface C1. The second patterned copper foil layer CL2 is disposed on the second side surface C2 of the core dielectric layer CD, and exposes a portion of the second side surface C2. Thefirst dielectric layer 113 is disposed on thefirst surface 112 a of thecore layer 112, and thesecond dielectric layer 115 is disposed on thesecond surface 112 b of thecore layer 112. The firstinner circuit layer 114 is disposed on thefirst dielectric layer 113, and the secondinner circuit layer 116 is disposed on thesecond dielectric layer 115. - Furthermore, in order to electrically connect the first patterned copper foil layer CL1, the second patterned copper foil layer CL2, the first
inner circuit layer 114 and the secondinner circuit layer 116, thepackage carrier 100 a of the embodiment further includes aseed layer 170, wherein theseed layer 170 covers the upper surface S1 and the lower surface S2 of themultilayer circuit structure 110 and the inner wall of the through holes T. Herein, as shown inFIG. 1A , theseed layer 170 is disposed between the firstouter circuit layer 130 a and the firstinner circuit layer 114, the secondouter circuit layer 140 a and the secondinner circuit layer 116, and themultilayer circuit structure 110 and the gas-permeable structure 120. The gas-permeable structure 120 is disposed in the through holes T and has afirst side 122 and asecond side 124 opposite to each other. Herein, the material of the gas-permeable structure 120 is, for example, metal or ceramics, wherein the metal is, for example, gold, silver, copper, aluminum or other metals having higher thermal conductivity. As shown inFIG. 1A , the firstouter circuit layer 130 a and the secondouter circuit layer 140 a of the embodiment are not patterned and completely cover thefirst side 122 and thesecond side 124 of the gas-permeable structure 120. - Additionally, the
first solder mask 150 and thesecond solder mask 160 of the embodiment are respectively disposed on the firstouter circuit layer 130 a and the secondouter circuit layer 140 a, and respectively penetrate through the firstouter circuit layer 130 a and the secondouter circuit layer 140 a to be connected to thefirst dielectric layer 113 and thesecond dielectric layer 115 of themultilayer circuit structure 110. In other words, thefirst solder mask 150 and thesecond solder mask 160 respectively cover the exposed portion of themultilayer circuit structure 110. Thefirst opening 152 of thefirst solder mask 150 and thesecond opening 162 of thesecond solder mask 160 respectively expose a portion of the firstouter circuit layer 130 a and a portion of the secondouter circuit layer 140 a. In order to prevent the firstouter circuit layer 130 a and the secondouter circuit layer 140 a respectively exposed by thefirst opening 152 and thesecond opening 162 from being oxidized, thepackage carrier 100 a of the embodiment further includes a firstsurface treatment layer 190 and a secondsurface treatment layer 195. The firstsurface treatment layer 190 is disposed on the firstouter circuit layer 130 a exposed by thefirst solder mask 150. The secondsurface treatment layer 195 is disposed on the secondouter circuit layer 140 a exposed by thesecond solder mask 160. - Since the gas-
permeable structure 120 of the embodiment is in the form of a mesh and disposed in the through holes T of themultilayer circuit structure 110, and thefirst opening 152 of thefirst solder mask 150 and thesecond opening 162 of thesecond solder mask 160 are disposed corresponding to thefirst side 122 and thesecond side 124 of the gas-permeable structure 120, in this manner, the gas-permeable structure 120 not only can dissipate heat in the thickness direction (i.e., Z direction) of thepackage carrier 100 a, but also can dissipate heat in the plane direction (i.e., X-Y direction) of thepackage carrier 100 a through the design of mesh. In brief, thepackage carrier 100 a of the embodiment increases the heat-dissipating area through the configuration of the gas-permeable structure 120, thereby increasing the heat-dissipating effect. - In application of the
package carrier 100 a, referring toFIG. 1B , a heat-dissipatingfin 20 may be disposed on the firstsurface treatment layer 190, and the heat-generatingelement 10 may be disposed on the secondsurface treatment layer 195. The heat generated by the heat-generatingelement 10 may be transmitted to the heat-dissipatingfin 20 through the secondsurface treatment layer 195, the secondouter circuit layer 140 a, the gas-permeable structure 120, the firstouter circuit layer 130 a and the firstsurface treatment layer 190 in sequence. Herein, the mesh-shaped gas-permeable structure 120 not only can dissipate heat in the thickness direction (i.e., Z direction) of thepackage carrier 100 a but also can dissipate heat in the plane direction (i.e., X-Y direction) of thepackage carrier 100 a. Accordingly, thepackage carrier 100 a of the embodiment can increase the heat-dissipating area through the configuration of the gas-permeable structure 120, thereby improving the heat-dissipating effect. - It is to be explained that, the following embodiment has adopted component notations and part of the contents from the previous embodiment, wherein the same notations are used for representing the same or similar components, and descriptions of the same technical contents are omitted. The descriptions regarding the omitted part may be referred to the previous embodiments, and thus are not repeated herein.
-
FIG. 2A illustrates a schematic cross-sectional view of a package carrier according to another embodiment of the invention.FIG. 2B illustrates a schematic cross-sectional view of the package carrier inFIG. 2A carrying a heat-generating element and a heat-dissipating element. Referring toFIG. 1A andFIG. 2A , apackage carrier 100 b of the embodiment is similar to thepackage carrier 100 a inFIG. 1A , and the difference between the two is that a firstouter circuit layer 130 b and a secondouter circuit layer 140 b of the embodiment partially cover thefirst side 122 and thesecond side 124 of the gas-permeable structure 120. In other words, the firstouter circuit layer 130 b and the secondouter circuit layer 140 b of the embodiment are patterned structures respectively, and the firstouter circuit layer 130 b and the secondouter circuit layer 140 b respectively expose a portion of thefirst side 122 and a portion of thesecond side 124 of the gas-permeable structure 120. - In application of the
package carrier 100 b, referring toFIG. 2B , the heat-dissipatingfin 20 may be disposed on the firstsurface treatment layer 190, and the heat-generatingelement 10 may be disposed on the secondsurface treatment layer 195. - The heat generated by the heat-generating
element 10 may be dissipated in the thickness direction (i.e., Z direction) of thepackage carrier 100 b by the gas-permeable structure 120, and the heat energy in thepackage carrier 100 b may be dissipated in the plane direction (i.e., X-Y direction) of thepackage carrier 100 b through the mesh-shaped gas-permeable structure 120, and outer air A can directly pass through the gas-permeable structure 120 to dissipate the heat in thepackage carrier 100 b. In brief, the embodiment increases the heat-dissipating area through the configuration of the gas-permeable structure 120, thereby improving the heat-dissipating effect of thepackage carrier 100 b. -
FIG. 3A illustrates a schematic cross-sectional view of a package carrier according to yet another embodiment of the invention.FIG. 3B illustrates a schematic cross-sectional view of the package carrier inFIG. 3A carrying a heat-generating element and a heat-dissipating element. Referring toFIG. 1A andFIG. 3A , apackage carrier 100 c in the embodiment is similar to thepackage carrier 100 a inFIG. 1A , and the difference between the two is that thepackage carrier 100 c in the embodiment further includes ametal block 180, wherein themetal block 180 is disposed in one of the through holes T, and themetal block 180 has atop surface 182 and abottom surface 184 opposite to each other. Herein, the firstouter circuit layer 130 c and the secondouter circuit layer 140 c further completely cover thetop surface 182 and thebottom surface 184 of themetal block 180. In other words, the firstouter circuit layer 130 c and the secondouter circuit layer 140 c respectively expose thefirst side 122 and thesecond side 124 of the gas-permeable structure 120. - In application of the
package carrier 100 c, referring toFIG. 3B , the heat-dissipatingfin 20 may be disposed on the firstsurface treatment layer 190, and the heat-generatingelement 10 may be disposed on the secondsurface treatment layer 195. The heat generated by the heat-generatingelement 10 may be transmitted to the heat-dissipatingfin 20 through the secondsurface treatment layer 195, the secondouter circuit layer 140 c, themetal block 180, the firstouter circuit layer 130 c and the firstsurface treatment layer 190 in sequence. That is, the heat may be dissipated in the thickness direction (i.e., Z direction) of thepackage carrier 100 c through themetal block 180. The heat energy in thepackage carrier 100 c may be dissipated in the plane direction (i.e., X-Y direction) of thepackage carrier 100 c through the mesh-shaped gas-permeable structure 120, and outer air A can directly pass through the gas-permeable structure 120 to dissipate the heat in thepackage carrier 100 c. In brief, thepackage carrier 100 c in the embodiment may have a better heat-dissipating effect. - Certainly, in other embodiments that are not shown, a fan can be selectively disposed on the second side of the gas-permeable structure, thereby increasing air circulation and further improving the heat-dissipating effect of the package carrier.
- In summary, in the design of the package carrier of the invention, the gas-permeable structure is in the form of a mesh and disposed in the through holes of the multilayer circuit structure, and the opening of the solder mask is disposed corresponding to the gas-permeable structure. In this manner, the gas-permeable structure not only can dissipate heat in a thickness direction (i.e., Z direction) of the package carrier, but also can dissipate heat in a plane direction (i.e., X-Y direction) of the package carrier with the design of mesh. Briefly, the package carrier of the invention increases the heat-dissipating area through the configuration of the gas-permeable structure, thereby improving the heat-dissipating effect.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (10)
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US16/683,266 US11373927B2 (en) | 2018-05-30 | 2019-11-14 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole |
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TW107118580 | 2018-05-30 | ||
TW107118580A | 2018-05-30 | ||
TW107118580A TWI653911B (en) | 2018-05-30 | 2018-05-30 | Package carrier |
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US16/683,266 Continuation-In-Part US11373927B2 (en) | 2018-05-30 | 2019-11-14 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole |
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US10515870B1 US10515870B1 (en) | 2019-12-24 |
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US16/029,659 Active US10515870B1 (en) | 2018-05-30 | 2018-07-09 | Package carrier having a mesh gas-permeable structure disposed in the through hole |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11450597B2 (en) * | 2019-06-10 | 2022-09-20 | Phoenix Pioneer Technology Co., Ltd. | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same |
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US11373927B2 (en) | 2018-05-30 | 2022-06-28 | Unimicron Technology Corp. | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole |
CN112635432A (en) * | 2019-10-09 | 2021-04-09 | 欣兴电子股份有限公司 | Package substrate and manufacturing method thereof |
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TWI505755B (en) * | 2012-04-13 | 2015-10-21 | Subtron Technology Co Ltd | Package carrier and manufacturing method thereof |
US10106672B2 (en) | 2012-07-07 | 2018-10-23 | Dexerials Corporation | Heat conductive sheet |
TWI544850B (en) | 2014-07-02 | 2016-08-01 | 欣興電子股份有限公司 | Manufacturing method of circuit structure embedded with heat-dissipation block |
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2018
- 2018-05-30 TW TW107118580A patent/TWI653911B/en active
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Cited By (1)
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US11450597B2 (en) * | 2019-06-10 | 2022-09-20 | Phoenix Pioneer Technology Co., Ltd. | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same |
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TWI653911B (en) | 2019-03-11 |
US10515870B1 (en) | 2019-12-24 |
TW202005481A (en) | 2020-01-16 |
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