US20190311180A1 - Face sensing module and computing device using same - Google Patents
Face sensing module and computing device using same Download PDFInfo
- Publication number
- US20190311180A1 US20190311180A1 US16/003,030 US201816003030A US2019311180A1 US 20190311180 A1 US20190311180 A1 US 20190311180A1 US 201816003030 A US201816003030 A US 201816003030A US 2019311180 A1 US2019311180 A1 US 2019311180A1
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- Prior art keywords
- infrared
- camera
- side portion
- sensing module
- computing device
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/2224—Studio circuitry; Studio devices; Studio equipment related to virtual studio applications
- H04N5/2226—Determination of depth image, e.g. for foreground/background separation
-
- G06K9/00255—
-
- G06K9/00288—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/161—Detection; Localisation; Normalisation
- G06V40/166—Detection; Localisation; Normalisation using acquisition arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/172—Classification, e.g. identification
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H04N5/2252—
-
- H04N5/2253—
-
- H04N5/2258—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Definitions
- the present disclosure relates to facial recognition technology.
- a computing device such as a smart phone, with facial recognition includes a housing, a depth sensor, and an RGB camera.
- the depth sensor and the RGB camera are mounted inside the housing and at the top front of the computing device to facilitate face recognition when a user looks at the computing device.
- the depth sensor captures data as to depth of the user's face
- the RGB camera is configured to capture data as to color of the user's face.
- the depth sensor includes two infrared cameras.
- the infrared cameras and the RGB camera need to be optically aligned inside the housing. However, optical alignment of the infrared cameras and the RGB camera is often difficult. Additionally, the infrared cameras and the RGB camera may become misaligned due to handling and other everyday forces applied to the computing device.
- FIG. 1A is a top perspective view of an embodiment of a face sensing module.
- FIG. 1B is a bottom perspective view of the face sensing module of FIG. 1A .
- FIG. 2 is a schematic front view of an embodiment of a computing device including the face sensing module of FIG. 1A .
- FIG. 3A is a top perspective exploded view of the face sensing module of FIG. 1A .
- FIG. 3B is a bottom perspective exploded view of the face sensing module of FIG. 1A .
- FIGS. 4A-4D are top perspective views of steps of assembly of the face sensing module of FIG. 1A .
- a computing device 200 includes a housing 230 , a speaker 220 , and a face sensing module 100 .
- the computing device 200 may include more or less components than as described.
- the computing device 200 may be a smart phone, tablet, laptop, or other device.
- the computing device 200 is a smart phone.
- the face sensing module 100 adjacent to the speaker 220 , is mounted inside the housing 230 for face recognition when a user looks at the computing device 200 .
- the face sensing module 100 includes a frame 110 , a depth sensor 120 , and an RGB camera unit 150 .
- the depth sensor 120 and the RGB camera unit 150 are secured to the frame 110 as a modular structure.
- the frame 110 is made of a rigid material, such as metal or hard plastic, that is resistant to deformation.
- the frame 110 includes a first side portion 111 , a second side portion 112 , and a cross portion 113 .
- the cross portion 113 is connected between the first side portion 111 and the second side portion 112 .
- the first side portion 111 , the cross portion 113 , and the second side portion 112 are positioned in a straight line.
- the first side portion 111 has a first infrared camera receiving opening 111 a and an RGB camera receiving opening 111 b .
- the second side portion 112 has a second infrared camera receiving opening 112 a .
- the cross portion 113 has a light opening 113 a .
- the cross portion 113 is recessed for receiving the speaker 220 or other components inside the housing 230 .
- the depth sensor 120 captures data on the depth of the user's face.
- the depth sensor 120 includes a first infrared camera unit 121 , a second infrared camera unit 122 , and an infrared light emitting unit 140 .
- the first infrared camera unit 121 is mounted on the first side portion 111 of the frame 110 .
- the first infrared camera unit 121 includes a first camera mount 121 b , a first infrared camera 121 a , a first circuit board 121 c , and a first connector 131 .
- the first camera mount 121 b is received in the first infrared camera receiving opening 111 a of the first side portion 111 .
- the first infrared camera 121 a is secured to the first camera mount 121 b .
- the first circuit board 121 c connects the first infrared camera 121 a to the first connector 131 .
- the first connector 131 is located outside of the first side portion 111 .
- the first infrared camera 121 a is electrically connected to components inside the housing 230 , through the first connector 131 .
- the second infrared camera unit 122 is mounted on the second side portion 112 of the frame 110 .
- the second infrared camera unit 122 includes a second camera mount 122 b , a second infrared camera 122 a , a second circuit board 122 c , and a second connector 132 .
- the second camera mount 122 b is received in the second infrared camera receiving opening 112 a of the second side portion 112 .
- the second infrared camera 122 a is secured to the second camera mount 122 b .
- the second circuit board 122 c connects the second infrared camera 122 a to the second connector 132 .
- the second connector 132 is located outside of the second side portion 112 .
- the second infrared camera 122 a is electrically connected to components inside the housing 230 , through the second connector 132 .
- the infrared light emitting unit 140 is mounted on the cross portion 113 of the frame 110 .
- the infrared light emitting unit 140 includes an infrared emitter 141 , an infrared controller 142 , and an infrared guide 143 .
- the infrared emitter 141 and the infrared controller 142 are coupled to a side portion 122 d of the second circuit board 122 c , and are located under the cross portion 113 .
- the infrared emitter 141 corresponds to the light opening 113 a of the cross portion 113 .
- the infrared emitter 141 is an LED device.
- the infrared controller 142 is configured to control the infrared emitter 141 .
- the infrared guide 143 is mounted over the cross portion 113 , and covers the light opening 113 a of the cross portion 113 . Infrared light emitted by the infrared emitter 141 is emitted outside of the housing 230 through the infrared guide 143 .
- the infrared guide 143 is columnar, and is made of a transparent and flexible material.
- the infrared guide 143 can be bent inside the housing 230 to guide the infrared light emitted by the infrared emitter 141 to a specific portion of the housing 230 according to the design of the computing device 200 .
- the infrared guide 143 is a silicone stick.
- the RGB camera unit 150 is mounted on the first side portion 111 of the frame 110 .
- the RGB camera unit 150 is configured to capture data as to color of the user's face.
- the RGB camera unit 150 includes a third camera mount 152 , an RGB camera 151 , a third circuit board 154 , and a third connector 153 .
- the third camera mount 152 is received in the RGB camera receiving opening 111 b of the first side portion 111 .
- the RGB camera 151 is secured to the third camera mount 152 .
- the third circuit board 154 connects the RGB camera 151 to the third connector 153 .
- the third connector 153 is located outside of the first side portion 111 .
- the RGB camera 151 is electrically connected to components inside the housing 230 , through the third connector 153 .
- the first infrared camera 121 a , the second infrared camera 122 a , and the RGB camera 151 can be optically aligned together after being mounted on the frame 110 and before being mounted inside the housing 230 . Optical alignment of the first infrared camera 121 a , the second infrared camera 122 a , and the RGB camera 151 outside of the housing 230 is thus easier. Additionally, the frame 110 holds the first infrared camera 121 a , the second infrared camera 122 a , and the RGB camera 151 to ensure against displacement/misalignment.
- FIGS. 4A-4D show assembly steps of the face sensing module 100 .
- the infrared emitter 141 and the infrared controller 142 of the infrared light emitting unit 140 are coupled to the second circuit board 122 c of the second infrared camera unit 122 , to produce a first semi-finished product 100 A.
- the first semi-finished product 100 A and the first infrared camera unit 121 are assembled on the frame 110 such that the first camera mount 121 b is received in the first infrared camera receiving opening 111 a .
- the second camera mount 122 b is received in the second infrared camera receiving opening 112 a , and the infrared emitter 141 corresponds to the light opening 113 a .
- the first infrared camera 121 a and the second infrared camera 122 a are then optically aligned, and then adhesive used to secure the first infrared camera unit 121 and the second infrared camera unit 122 to the frame 110 , to produce a second semi-finished product 100 B.
- the RGB camera unit 150 is assembled on the second semi-finished product 100 B such that the third camera mount 152 is received in the RGB camera receiving opening 111 b .
- the RGB camera 151 is then optically aligned, and then adhesive used to secure the RGB camera unit 150 to the frame 110 , to produce a third semi-finished product 100 C.
- the infrared guide 143 of the infrared light emitting unit 140 is assembled on the third semi-finished product 100 C such that the infrared guide 143 corresponds to the infrared emitter 141 , thereby completing the assembly.
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Vascular Medicine (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Studio Devices (AREA)
Abstract
Description
- The present disclosure relates to facial recognition technology.
- A computing device, such as a smart phone, with facial recognition includes a housing, a depth sensor, and an RGB camera. The depth sensor and the RGB camera are mounted inside the housing and at the top front of the computing device to facilitate face recognition when a user looks at the computing device. The depth sensor captures data as to depth of the user's face, and the RGB camera is configured to capture data as to color of the user's face. The depth sensor includes two infrared cameras. The infrared cameras and the RGB camera need to be optically aligned inside the housing. However, optical alignment of the infrared cameras and the RGB camera is often difficult. Additionally, the infrared cameras and the RGB camera may become misaligned due to handling and other everyday forces applied to the computing device.
- Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1A is a top perspective view of an embodiment of a face sensing module. -
FIG. 1B is a bottom perspective view of the face sensing module ofFIG. 1A . -
FIG. 2 is a schematic front view of an embodiment of a computing device including the face sensing module ofFIG. 1A . -
FIG. 3A is a top perspective exploded view of the face sensing module ofFIG. 1A . -
FIG. 3B is a bottom perspective exploded view of the face sensing module ofFIG. 1A . -
FIGS. 4A-4D are top perspective views of steps of assembly of the face sensing module ofFIG. 1A . - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
- In
FIGS. 1A-2 , acomputing device 200 includes ahousing 230, aspeaker 220, and aface sensing module 100. Thecomputing device 200 may include more or less components than as described. Thecomputing device 200 may be a smart phone, tablet, laptop, or other device. In the present embodiment, thecomputing device 200 is a smart phone. Theface sensing module 100, adjacent to thespeaker 220, is mounted inside thehousing 230 for face recognition when a user looks at thecomputing device 200. - With reference to
FIGS. 3A-3B , theface sensing module 100 includes aframe 110, adepth sensor 120, and anRGB camera unit 150. Thedepth sensor 120 and theRGB camera unit 150 are secured to theframe 110 as a modular structure. - The
frame 110 is made of a rigid material, such as metal or hard plastic, that is resistant to deformation. Theframe 110 includes afirst side portion 111, asecond side portion 112, and across portion 113. Thecross portion 113 is connected between thefirst side portion 111 and thesecond side portion 112. Thefirst side portion 111, thecross portion 113, and thesecond side portion 112 are positioned in a straight line. Thefirst side portion 111 has a first infrared camera receiving opening 111 a and an RGB camera receiving opening 111 b. Thesecond side portion 112 has a second infrared camera receiving opening 112 a. Thecross portion 113 has a light opening 113 a. Thecross portion 113 is recessed for receiving thespeaker 220 or other components inside thehousing 230. - The
depth sensor 120 captures data on the depth of the user's face. Thedepth sensor 120 includes a firstinfrared camera unit 121, a secondinfrared camera unit 122, and an infraredlight emitting unit 140. - The first
infrared camera unit 121 is mounted on thefirst side portion 111 of theframe 110. The firstinfrared camera unit 121 includes afirst camera mount 121 b, a firstinfrared camera 121 a, afirst circuit board 121 c, and afirst connector 131. Thefirst camera mount 121 b is received in the first infrared camera receiving opening 111 a of thefirst side portion 111. The firstinfrared camera 121 a is secured to thefirst camera mount 121 b. Thefirst circuit board 121 c connects the firstinfrared camera 121 a to thefirst connector 131. Thefirst connector 131 is located outside of thefirst side portion 111. The firstinfrared camera 121 a is electrically connected to components inside thehousing 230, through thefirst connector 131. - The second
infrared camera unit 122 is mounted on thesecond side portion 112 of theframe 110. The secondinfrared camera unit 122 includes asecond camera mount 122 b, a secondinfrared camera 122 a, asecond circuit board 122 c, and asecond connector 132. Thesecond camera mount 122 b is received in the second infraredcamera receiving opening 112 a of thesecond side portion 112. The secondinfrared camera 122 a is secured to thesecond camera mount 122 b. Thesecond circuit board 122 c connects the secondinfrared camera 122 a to thesecond connector 132. Thesecond connector 132 is located outside of thesecond side portion 112. The secondinfrared camera 122 a is electrically connected to components inside thehousing 230, through thesecond connector 132. - The infrared
light emitting unit 140 is mounted on thecross portion 113 of theframe 110. The infraredlight emitting unit 140 includes aninfrared emitter 141, aninfrared controller 142, and aninfrared guide 143. Theinfrared emitter 141 and theinfrared controller 142 are coupled to aside portion 122 d of thesecond circuit board 122 c, and are located under thecross portion 113. Theinfrared emitter 141 corresponds to thelight opening 113 a of thecross portion 113. Theinfrared emitter 141 is an LED device. Theinfrared controller 142 is configured to control theinfrared emitter 141. Theinfrared guide 143 is mounted over thecross portion 113, and covers thelight opening 113 a of thecross portion 113. Infrared light emitted by theinfrared emitter 141 is emitted outside of thehousing 230 through theinfrared guide 143. Theinfrared guide 143 is columnar, and is made of a transparent and flexible material. Theinfrared guide 143 can be bent inside thehousing 230 to guide the infrared light emitted by theinfrared emitter 141 to a specific portion of thehousing 230 according to the design of thecomputing device 200. Preferably, theinfrared guide 143 is a silicone stick. - The
RGB camera unit 150 is mounted on thefirst side portion 111 of theframe 110. TheRGB camera unit 150 is configured to capture data as to color of the user's face. TheRGB camera unit 150 includes athird camera mount 152, anRGB camera 151, athird circuit board 154, and athird connector 153. Thethird camera mount 152 is received in the RGBcamera receiving opening 111 b of thefirst side portion 111. TheRGB camera 151 is secured to thethird camera mount 152. Thethird circuit board 154 connects theRGB camera 151 to thethird connector 153. Thethird connector 153 is located outside of thefirst side portion 111. TheRGB camera 151 is electrically connected to components inside thehousing 230, through thethird connector 153. - The first
infrared camera 121 a, the secondinfrared camera 122 a, and theRGB camera 151 can be optically aligned together after being mounted on theframe 110 and before being mounted inside thehousing 230. Optical alignment of the firstinfrared camera 121 a, the secondinfrared camera 122 a, and theRGB camera 151 outside of thehousing 230 is thus easier. Additionally, theframe 110 holds the firstinfrared camera 121 a, the secondinfrared camera 122 a, and theRGB camera 151 to ensure against displacement/misalignment. -
FIGS. 4A-4D show assembly steps of theface sensing module 100. - In
FIG. 4A , theinfrared emitter 141 and theinfrared controller 142 of the infraredlight emitting unit 140 are coupled to thesecond circuit board 122 c of the secondinfrared camera unit 122, to produce a firstsemi-finished product 100A. - In
FIG. 4B , the firstsemi-finished product 100A and the firstinfrared camera unit 121 are assembled on theframe 110 such that thefirst camera mount 121 b is received in the first infraredcamera receiving opening 111 a. Thesecond camera mount 122 b is received in the second infraredcamera receiving opening 112 a, and theinfrared emitter 141 corresponds to thelight opening 113 a. The firstinfrared camera 121 a and the secondinfrared camera 122 a are then optically aligned, and then adhesive used to secure the firstinfrared camera unit 121 and the secondinfrared camera unit 122 to theframe 110, to produce a secondsemi-finished product 100B. - In
FIG. 4C , theRGB camera unit 150 is assembled on the secondsemi-finished product 100B such that thethird camera mount 152 is received in the RGBcamera receiving opening 111 b. TheRGB camera 151 is then optically aligned, and then adhesive used to secure theRGB camera unit 150 to theframe 110, to produce a thirdsemi-finished product 100C. - In
FIG. 4D , theinfrared guide 143 of the infraredlight emitting unit 140 is assembled on the thirdsemi-finished product 100C such that theinfrared guide 143 corresponds to theinfrared emitter 141, thereby completing the assembly. - The embodiments shown and described above are only examples. Many details are often found in this field of art thus many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107112341A | 2018-04-10 | ||
TW107112341A TWI661361B (en) | 2018-04-10 | 2018-04-10 | Sensing module and electronic devices thereof |
TW107112341 | 2018-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190311180A1 true US20190311180A1 (en) | 2019-10-10 |
US10452895B1 US10452895B1 (en) | 2019-10-22 |
Family
ID=67764055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/003,030 Active US10452895B1 (en) | 2018-04-10 | 2018-06-07 | Face sensing module and computing device using same |
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Country | Link |
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US (1) | US10452895B1 (en) |
TW (1) | TWI661361B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190289278A1 (en) * | 2018-03-13 | 2019-09-19 | Hon Hai Precision Industry Co., Ltd. | Three-dimensional sensing module and computing device using same |
US10893175B2 (en) * | 2019-02-27 | 2021-01-12 | Bendix Commercial Vehicle Systems Llc | Shadowless camera housing |
US10924648B2 (en) * | 2018-06-02 | 2021-02-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic assembly and electronic device |
FR3116686A1 (en) * | 2020-11-26 | 2022-05-27 | Faurecia Interieur Industrie | Image capture device and vehicle comprising such an image capture device |
US11425236B2 (en) * | 2020-02-21 | 2022-08-23 | Lg Electronics Inc. | Mobile terminal |
US11438496B2 (en) * | 2020-06-30 | 2022-09-06 | Samsung Electro-Mechanics Co., Ltd. | Multi-camera module |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7187711B2 (en) * | 2020-07-29 | 2022-12-12 | 深▲せん▼市康冠商用科技有限公司 | Infrared touch panel bezel for attaching functional parts and display terminal using it |
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US7602942B2 (en) * | 2004-11-12 | 2009-10-13 | Honeywell International Inc. | Infrared and visible fusion face recognition system |
EP2203865A2 (en) * | 2007-09-24 | 2010-07-07 | Apple Inc. | Embedded authentication systems in an electronic device |
KR101695809B1 (en) * | 2009-10-09 | 2017-01-13 | 엘지전자 주식회사 | Mobile terminal and method for controlling thereof |
CN201699888U (en) * | 2010-06-24 | 2011-01-05 | 柯名会 | Face identification monitoring device |
US20140192158A1 (en) * | 2013-01-04 | 2014-07-10 | Microsoft Corporation | Stereo Image Matching |
US9690984B2 (en) * | 2015-04-14 | 2017-06-27 | Microsoft Technology Licensing, Llc | Two-dimensional infrared depth sensing |
TWM532588U (en) * | 2016-07-13 | 2016-11-21 | zhi-xing Xu | Portable electronic device and image capturing module thereof |
TWM532699U (en) * | 2016-07-13 | 2016-11-21 | zhi-xing Xu | Portable electronic device and image capturing module thereof |
TWM550941U (en) * | 2017-05-22 | 2017-10-21 | Azurewave Technologies Inc | Portable electronic device and its image capturing module and carrying component |
TWM553428U (en) * | 2017-07-10 | 2017-12-21 | Azurewave Technologies Inc | Portable electronic device and its image capturing module and image sensing component |
US10371504B2 (en) * | 2017-09-29 | 2019-08-06 | Abl Ip Holding Llc | Light fixture commissioning using depth sensing device |
-
2018
- 2018-04-10 TW TW107112341A patent/TWI661361B/en not_active IP Right Cessation
- 2018-06-07 US US16/003,030 patent/US10452895B1/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190289278A1 (en) * | 2018-03-13 | 2019-09-19 | Hon Hai Precision Industry Co., Ltd. | Three-dimensional sensing module and computing device using same |
US10924648B2 (en) * | 2018-06-02 | 2021-02-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic assembly and electronic device |
US10893175B2 (en) * | 2019-02-27 | 2021-01-12 | Bendix Commercial Vehicle Systems Llc | Shadowless camera housing |
US11425236B2 (en) * | 2020-02-21 | 2022-08-23 | Lg Electronics Inc. | Mobile terminal |
US11438496B2 (en) * | 2020-06-30 | 2022-09-06 | Samsung Electro-Mechanics Co., Ltd. | Multi-camera module |
FR3116686A1 (en) * | 2020-11-26 | 2022-05-27 | Faurecia Interieur Industrie | Image capture device and vehicle comprising such an image capture device |
US11889198B2 (en) | 2020-11-26 | 2024-01-30 | Faurecia Interieur Industrie | Image capture device and vehicle comprising such an image capture device |
Also Published As
Publication number | Publication date |
---|---|
TW201944286A (en) | 2019-11-16 |
TWI661361B (en) | 2019-06-01 |
US10452895B1 (en) | 2019-10-22 |
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