US20190289752A1 - Cooling system - Google Patents
Cooling system Download PDFInfo
- Publication number
- US20190289752A1 US20190289752A1 US16/242,845 US201916242845A US2019289752A1 US 20190289752 A1 US20190289752 A1 US 20190289752A1 US 201916242845 A US201916242845 A US 201916242845A US 2019289752 A1 US2019289752 A1 US 2019289752A1
- Authority
- US
- United States
- Prior art keywords
- heat
- pipe
- generating component
- heat sink
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20881—Liquid coolant with phase change
Definitions
- the present disclosure relates to autonomous driving technology, and more particularly, to a cooling system.
- vehicle-mounted computer servers for decision making and controlling are provided on such vehicle.
- the vehicle-mounted computer servers could have more powerful functions, with not only high computing capabilities and high processing efficiencies, but also capabilities of running stably for a long time (e.g., high anti-vibration capability and excellent cooling effect).
- a vehicle-mounted computer server may have a larger number of components to be installed therein, e.g., a number of sets of core components, such as a number of Central Processing Units (CPUs), a number of Graphics Processing Units (GPUs), a number of expansion cards, one or more power sources, and the like.
- a number of sets of core components such as a number of Central Processing Units (CPUs), a number of Graphics Processing Units (GPUs), a number of expansion cards, one or more power sources, and the like.
- heat generating components Due to a limited space in a vehicle, these core components may typically be arranged densely and compactly in a case having a limited space. However, some components (referred to as “heat generating components” hereinafter) will generate heat during their operation. A heat generating component may malfunction as its temperature increases. Thus, it is desired to dissipate the heat generated by the heat generating component timely, so as to ensure that the core component can function normally.
- a cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to a heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
- FIG. 1 is a schematic diagram showing a structure of a cooling system according to some embodiments of the present disclosure
- FIG. 2A and FIG. 2B are schematic diagrams showing a structure of a first set of fans and a structure of a second set of fans, respectively;
- FIG. 3A is a schematic diagram showing a structure of a first heat sink including a plurality of sets of heat pipes according to some embodiments of the present disclosure
- FIG. 3B is a schematic diagram showing a structure of a first mounting device according to some embodiments of the present disclosure
- FIG. 3C is a schematic diagram showing a heat pipe mounted on a heat generating component via a first mounting device according to some embodiments of the present disclosure
- FIG. 3D is a schematic diagram showing a plurality of sets of heat pipes provided on respective heat generating components according to some embodiments of the present disclosure
- FIG. 3E is a schematic diagram showing a structure of a cooling system according to some embodiments of the present disclosure.
- FIG. 4A and FIG. 4B are schematic diagrams each showing a structure of a first heat sink including a turbofan heat sink according to some embodiments of the present disclosure
- FIG. 5 is a schematic diagram showing a structure of a first heat sink including a water cooling device according to some embodiments of the present disclosure.
- FIG. 6 is a schematic diagram showing a layer of cooling fins provided on a surface of a graphics card according to some embodiments of the present disclosure.
- the present disclosure provides a cooling system, capable of cooling a heat generating component in a computer server quickly, so as to ensure that the heat generating component can function stably.
- a first heat sink may transfer the heat generated by the heat generating component directly to the second heat sink, and then the first set of fans and the second set of fans generate a high-pressure airflow for cooling the second heat sink.
- the first heat sink may transfer the heat generated by the heat generating component directly and quickly to the second heat sink, so as to increase the speed of heat dissipation and ensure that the heat generating component may function stably.
- the second heat sink is arranged near the air outlet on the outer shell of the case, such that the high-pressure airflow may dissipate the heat on the second heat sink quickly to the outside of the case, thereby further increasing the speed of heat dissipation and improving the cooling effect.
- the cooling system according to the embodiment of the present disclosure may be applied to a vehicle-mounted computer server in an unmanned vehicle, a computer server in an unmanned plane, a computer server in an unmanned ship, a robot, or any other computer servers for which heat dissipation is desired.
- the present disclosure is not limited to any specific application scenario.
- FIG. 1 is a schematic diagram showing a structure of a cooling system according to an embodiment of the present disclosure
- the cooling system is provided within a case including a heat generating component.
- An air inlet and an air outlet are provided on two panels on opposite sides of an outer shell of the case, respectively.
- the cooling system includes a first set of fans 1 , a first heat sink 2 , a second heat sink 3 and a second set of fans 4 .
- the first set of fans 1 is mounted on an inward-facing side of the air inlet on the outer shell of the case.
- the second set of fans 4 is mounted on an inward-facing side of the air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans 1 , a high-pressure airflow from the air inlet to the air outlet.
- the first heat sink 2 is connected to the heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to the second heat sink 3 .
- the second heat sink 3 is mounted on an inward-facing side of the second set of fans 4 and cooled by the high-pressure airflow.
- the first set of fans 1 and the second set of fans 4 may each include a plurality of fans.
- the number of fans in each set may be configured flexibly depending on actual requirements. For example, the more components for which heat dissipation is desired, or the larger the space for which heat dissipation is desired, the more fans may to be mounted.
- FIG. 2A is a schematic diagram showing a structure of the first set of fans 1 .
- FIG. 2B is a schematic diagram showing a structure of the second set of fans 4 .
- the first set of fans 1 and the second set of fans 4 each include four fans.
- the second heat sink 3 may be configured as cooling fins formed in one piece, or a plurality of sets of cooling fins. This may be configured flexibly by those skilled in the art depending on actual requirements and the present disclosure is not limited to any of these configurations.
- the first heat sink 2 may have any of the following structures.
- the first heat sink 2 includes a plurality of sets of heat pipes 21 , each set of heat pipes 21 corresponding to one heat generating component.
- the first heat sink 2 includes a plurality of turbofan heat sinks 22 each corresponding to one heat generating component.
- the first heat sink 2 includes at least one water cooling device 23 each corresponding to a plurality of heat generating components.
- the first heat sink 2 includes at least one set of heat pipes 21 and at least one turbofan heat sink 22 , each set of heat pipes 21 corresponding to one heat generating component and each turbofan heat sink 22 corresponding to one heat generating component.
- the first heat sink 2 includes at least one set of heat pipes 21 and at least one water cooling device 23 , each set of heat pipes 21 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components.
- the first heat sink 2 includes at least one turbofan heat sink 22 and at least one water cooling device 23 , each turbofan heat sink 22 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components.
- the first heat sink 2 includes at least one set of heat pipes 21 , at least one turbofan heat sink 22 and at least one water cooling device 23 , each set of heat pipes 21 corresponding to one heat generating component, each turbofan heat sink 22 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components.
- the first heat sink 2 includes a plurality of sets of heat pipes 21 .
- Each set of heat pipes 21 corresponds to one heat generating component, and includes at least one heat pipe each having one end 21 a connected to the one heat generating component and another end 21 b connected to the second heat sink.
- each GPU may correspond to a set of four copper heat pipes each having a diameter of 8 mm.
- the heat generating component may have its surface coated with a layer of thermally conductive silicone grease.
- the one end 21 a of each heat pipe in each set of heat pipes may be connected to the heat generating component via a first mounting device.
- the first mounting device may have a structure shown in FIG. 3B .
- the first mounting device includes a heat pipe base c 1 and a heat pipe cover c 2 .
- the heat pipe base c 1 is mounted fixedly on the thermally conductive silicone grease for the heat generating component, and has a plurality of grooves or slots provided on its top for mounting the heat pipes.
- the one end 21 a of each heat pipe in each set of heat pipes is pressed tightly onto the heat pipe base c 1 by the heat pipe cover c 2 , as shown in FIG. 3C .
- the heat pipe base c 1 and the heat pipe cover c 2 may be fastened to each other by screws or bolts.
- FIG. 3D is a schematic diagram showing a structure in which a plurality of sets of heat pipes are provided on respective heat generating components.
- FIG. 3E is a schematic diagram showing a structure of a cooling system including a first set of fans 1 , a first heat sink 2 , a second heat sink 3 and a second set of fans 4 .
- the first mounting device may include a heat pipe base and a heat pipe cover.
- the heat pipe base is mounted fixedly on the thermally conductive silicone grease for the heat generating component, and the heat pipe cover has at least one groove or slot provided at its bottom for mounting the at least one heat pipe.
- the one end 21 a of each heat pipe in each set of heat pipes is pressed tightly onto the heat pipe base by the heat pipe cover.
- the heat pipe base and the heat pipe cover may be fastened to each other by screws or bolts.
- the first mounting device may include a heat pipe base, which is mounted fixedly on the thermally conductive silicone grease for the heat generating component.
- the one end 21 a of each heat pipe in each set of heat pipes is welded to the heat pipe base.
- each of the heat pipe cover c 2 and the heat pipe base c 1 of the above first mounting device may have its surface coated uniformly with a layer of thermally conductive silicone grease, and/or the one end 21 a of the heat pipe may have its surface coated uniformly with a layer of thermally conductive silicone grease.
- the heat pipe may include a pipe shell, a wick within the pipe shell and a pipe cover for sealing the pipe shell.
- the pipe shell may be filled with a volatile liquid having a low boiling point.
- the wick may be made of a porous material.
- air may be drawn out to form a negative pressure of 1.3*10 ⁇ 1 ⁇ 1.3*10 ⁇ 4 Pa inside the pipe shell and then the pipe shell may be filled with the volatile liquid having the low boiling point.
- the pipe shell is sealed with the pipe cover.
- the principle of the heat pipe absorbing the heat from the heat generating component and transferring the absorbed heat to the second heat sink 3 may be as follows.
- the liquid in the wick is vaporized into vapor and the heat generated by the heat generating component may be absorbed during the vaporization of the liquid.
- the vapor flows towards the other end 21 b of the heat pipe, subject to a small pressure, and is liquefied into a liquid when meeting the second heat sink 3 having a relatively low temperature at the other end 21 b (as the second heat sink 3 is continuously cooled by the high-pressure airflow, it has a lower temperature than the heat pipe).
- heat is released to the second heat sink 3 .
- the liquid flows back to the one end 21 a , subject to a capillary force of the wick. Cyclically in this way, the heat generated by the heat generating component may be transferred to the second heat sink 3 .
- the material of the heat pipe and the type of the liquid may be any of the following: 1) the pipe shell of the heat pipe may be made of copper and the liquid may be water; 2) the pipe shell of the heat pipe may be made of carbon steel and the liquid may be water; 3) the pipe shell of the heat pipe may be made of a composite of steel and copper and the liquid may be water; 4) the pipe shell of the heat pipe may be made of aluminum and the liquid may be acetone; or 5) the pipe shell of the heat pipe may be made of stainless steel and the liquid may be sodium.
- each heat pipe in each set of heat pipes may be connected to the second heat sink 3 by means of welding.
- the heat pipe may have a shape of a prism, e.g., a cylinder or cuboid, and the present disclosure is not limited thereto.
- the first heat sink 2 includes a plurality of turbofan heat sinks 22 each corresponding to one heat generating component.
- Each of the plurality of turbofan heat sinks 22 includes a cooling fin 22 a connected to the heat generating component and a turbofan 22 b .
- the turbofan 22 b has an air outlet facing a same direction as the high-pressure airflow.
- the turbofan 22 b draws air to blow heat on the cooling fin 22 a to the second heat sink 3 , as shown in FIG. 4B .
- the heat generating component may have its surface coated with a layer of thermally conductive silicone grease.
- the cooling fin 22 a of the turbofan heat sink 22 may be mounted fixedly on the thermally conductive silicone grease for the heat generating component.
- the first heat sink 2 includes at least one water cooling device each including a water cooling pipe 23 a and a water tank 23 b arranged cyclically.
- the water cooling pipe 23 a has a water inlet and a water outlet each connected to the water tank 23 b .
- Water in the water cooling pipe 23 a when flowing through one heat generating component, carries heat generated by the one heat generating component to the second heat sink 3 and then flows from the second heat sink 3 and through a next heat generating component.
- the heat generating component may have its surface coated with a layer of thermally conductive silicone grease.
- the water cooling pipe 23 a may be mounted on the thermally conductive silicone grease for the heat generating component via a second mounting device.
- the water cooling pipe 23 a may be twisted spirally around the second heat sink 3 , or may be arranged in the second heat sink 3 in a U-shaped structure (as shown in FIG. 5 ).
- the second mounting device may include a heat pipe base and a heat pipe cover.
- the heat pipe base may be mounted on the thermally conductive silicone grease for the heat generating component and have at least one groove or slot provided on its top for mounting the at least one water cooling pipe 23 a (the groove may be U-shaped, L-shaped or V-shaped and the present disclosure is not limited to any of these shapes).
- the water cooling pipe 23 a may be pressed tightly onto the heat pipe base by the heat pipe cover.
- the structure of the second mounting device may be identical to, or similar with, that of the first mounting device and details thereof will be omitted here.
- each of the heat pipe cover and the heat pipe base of the above second mounting device may have its surface coated uniformly with a layer of thermally conductive silicone grease, and/or one end of the water cooling pipe 23 a that is connected to the heat generating component may have its surface coated uniformly with a layer of thermally conductive silicone grease.
- the first heat sink 2 includes at least one set of heat pipes 21 and at least one turbofan heat sink 22 , each set of heat pipes 21 corresponding to one heat generating component and each turbofan heat sink 22 corresponding to one heat generating component.
- the heat pipe 21 and the turbofan heat sink 22 reference can be made to the above embodiments and details thereof will be omitted here.
- some of the heat generating components in the case may each have a turbofan heat sink 22 provided thereon and some of the heat generating components in the case may each have heat pipes 21 provided thereon.
- each CPU on a motherboard may correspond to a turbofan heat sink 22
- each GPU on a graphics card may correspond to a set of heat pipes 21
- each power source may correspond to a set of heat pipes 21 .
- each CPU on a motherboard may correspond to a set of heat pipes 21 and each GPU on a graphics card may correspond to a turbofan heat sink 22 .
- some of CPUs on a motherboard may correspond to a set of heat pipes 21 while some of the CPUs may correspond to a turbofan heat sink 22
- some of GPUs on a graphics card can correspond to a set of heat pipes 21 while some of the GPUs may correspond to a turbofan heat sink 22 .
- This can be selected flexibly by those skilled in the art depending on actual requirements and the present disclosure is not limited thereto.
- a layer of cooling fins may be provided on a surface of a motherboard, for absorbing heat generated by other components on the motherboard. Additionally or alternatively, a layer of cooling fins may be provided on a surface of a graphics card, for absorbing heat generated by other components on the graphics card. The layer of cooling fins provided on the surface of the motherboard and the layer of cooling fins provided on the surface of the graphics card may be cooled using a high-pressure airflow. As shown in FIG. 6 , a layer of cooling fins is provided on a surface of a graphics card.
Abstract
Description
- The present disclosure relates to autonomous driving technology, and more particularly, to a cooling system.
- Currently, in order to achieve autonomous driving of a vehicle, typically one or even more vehicle-mounted computer servers for decision making and controlling are provided on such vehicle. As complicated techniques are involved in autonomous driving, it is desired that the vehicle-mounted computer servers could have more powerful functions, with not only high computing capabilities and high processing efficiencies, but also capabilities of running stably for a long time (e.g., high anti-vibration capability and excellent cooling effect). Hence, compared with ordinary computer servers, a vehicle-mounted computer server may have a larger number of components to be installed therein, e.g., a number of sets of core components, such as a number of Central Processing Units (CPUs), a number of Graphics Processing Units (GPUs), a number of expansion cards, one or more power sources, and the like.
- Due to a limited space in a vehicle, these core components may typically be arranged densely and compactly in a case having a limited space. However, some components (referred to as “heat generating components” hereinafter) will generate heat during their operation. A heat generating component may malfunction as its temperature increases. Thus, it is desired to dissipate the heat generated by the heat generating component timely, so as to ensure that the core component can function normally.
- According to some embodiments of the present disclosure, a cooling system is provided. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to a heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
- The figures are provided for facilitating further understanding of the present disclosure. The figures constitute a portion of the description and can be used in combination with the embodiments of the present disclosure to interpret, rather than limiting, the present disclosure. In the figures:
-
FIG. 1 is a schematic diagram showing a structure of a cooling system according to some embodiments of the present disclosure; -
FIG. 2A andFIG. 2B are schematic diagrams showing a structure of a first set of fans and a structure of a second set of fans, respectively; -
FIG. 3A is a schematic diagram showing a structure of a first heat sink including a plurality of sets of heat pipes according to some embodiments of the present disclosure; -
FIG. 3B is a schematic diagram showing a structure of a first mounting device according to some embodiments of the present disclosure; -
FIG. 3C is a schematic diagram showing a heat pipe mounted on a heat generating component via a first mounting device according to some embodiments of the present disclosure; -
FIG. 3D is a schematic diagram showing a plurality of sets of heat pipes provided on respective heat generating components according to some embodiments of the present disclosure; -
FIG. 3E is a schematic diagram showing a structure of a cooling system according to some embodiments of the present disclosure; -
FIG. 4A andFIG. 4B are schematic diagrams each showing a structure of a first heat sink including a turbofan heat sink according to some embodiments of the present disclosure; -
FIG. 5 is a schematic diagram showing a structure of a first heat sink including a water cooling device according to some embodiments of the present disclosure; and -
FIG. 6 is a schematic diagram showing a layer of cooling fins provided on a surface of a graphics card according to some embodiments of the present disclosure. - In the following, the solutions according to the embodiments of the present disclosure will be described clearly and completely with reference to the figures, such that the solutions can be better understood by those skilled in the art. Obviously, the embodiments described below are only some, rather than all, of the embodiments of the present disclosure. All other embodiments that can be obtained by those skilled in the art based on the embodiments described in the present disclosure without any inventive efforts are to be encompassed by the scope of the present disclosure.
- The present disclosure provides a cooling system, capable of cooling a heat generating component in a computer server quickly, so as to ensure that the heat generating component can function stably. With the cooling system according to the present disclosure, a first heat sink may transfer the heat generated by the heat generating component directly to the second heat sink, and then the first set of fans and the second set of fans generate a high-pressure airflow for cooling the second heat sink. With the cooling system according to the present disclosure, on one hand, the first heat sink may transfer the heat generated by the heat generating component directly and quickly to the second heat sink, so as to increase the speed of heat dissipation and ensure that the heat generating component may function stably. On the other hand, the second heat sink is arranged near the air outlet on the outer shell of the case, such that the high-pressure airflow may dissipate the heat on the second heat sink quickly to the outside of the case, thereby further increasing the speed of heat dissipation and improving the cooling effect.
- The cooling system according to the embodiment of the present disclosure may be applied to a vehicle-mounted computer server in an unmanned vehicle, a computer server in an unmanned plane, a computer server in an unmanned ship, a robot, or any other computer servers for which heat dissipation is desired. The present disclosure is not limited to any specific application scenario.
- Referring to
FIG. 1 , which is a schematic diagram showing a structure of a cooling system according to an embodiment of the present disclosure, the cooling system is provided within a case including a heat generating component. An air inlet and an air outlet are provided on two panels on opposite sides of an outer shell of the case, respectively. The cooling system includes a first set of fans 1, afirst heat sink 2, asecond heat sink 3 and a second set offans 4. - The first set of fans 1 is mounted on an inward-facing side of the air inlet on the outer shell of the case.
- The second set of
fans 4 is mounted on an inward-facing side of the air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans 1, a high-pressure airflow from the air inlet to the air outlet. - The
first heat sink 2 is connected to the heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to thesecond heat sink 3. - The
second heat sink 3 is mounted on an inward-facing side of the second set offans 4 and cooled by the high-pressure airflow. - In some embodiments of the present disclosure, the first set of fans 1 and the second set of
fans 4 may each include a plurality of fans. The number of fans in each set may be configured flexibly depending on actual requirements. For example, the more components for which heat dissipation is desired, or the larger the space for which heat dissipation is desired, the more fans may to be mounted.FIG. 2A is a schematic diagram showing a structure of the first set of fans 1.FIG. 2B is a schematic diagram showing a structure of the second set offans 4. InFIGS. 2A and 2B , the first set of fans 1 and the second set offans 4 each include four fans. - In some embodiments of the present disclosure, the
second heat sink 3 may be configured as cooling fins formed in one piece, or a plurality of sets of cooling fins. This may be configured flexibly by those skilled in the art depending on actual requirements and the present disclosure is not limited to any of these configurations. - In some embodiments of the present disclosure, the
first heat sink 2 may have any of the following structures. - Structure 1: The
first heat sink 2 includes a plurality of sets ofheat pipes 21, each set ofheat pipes 21 corresponding to one heat generating component. - Structure 2: The
first heat sink 2 includes a plurality of turbofan heat sinks 22 each corresponding to one heat generating component. - Structure 3: The
first heat sink 2 includes at least one water cooling device 23 each corresponding to a plurality of heat generating components. - Structure 4: The
first heat sink 2 includes at least one set ofheat pipes 21 and at least one turbofan heat sink 22, each set ofheat pipes 21 corresponding to one heat generating component and each turbofan heat sink 22 corresponding to one heat generating component. - Structure 5: The
first heat sink 2 includes at least one set ofheat pipes 21 and at least one water cooling device 23, each set ofheat pipes 21 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components. - Structure 6: The
first heat sink 2 includes at least one turbofan heat sink 22 and at least one water cooling device 23, each turbofan heat sink 22 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components. - Structure 7: The
first heat sink 2 includes at least one set ofheat pipes 21, at least one turbofan heat sink 22 and at least one water cooling device 23, each set ofheat pipes 21 corresponding to one heat generating component, each turbofan heat sink 22 corresponding to one heat generating component and each water cooling device 23 corresponding to a plurality of heat generating components. - In the following, the
above Structures above heat pipe 21, turbofan heat sink 22 and water cooling device 23 can be better understood by those skilled in the art. - Referring to
FIG. 3A , which is a schematic diagram showing an exemplary structure of afirst heat sink 2 according to an embodiment of the present disclosure, thefirst heat sink 2 includes a plurality of sets ofheat pipes 21. Each set ofheat pipes 21 corresponds to one heat generating component, and includes at least one heat pipe each having one end 21 a connected to the one heat generating component and anotherend 21 b connected to the second heat sink. - In an embodiment of the present disclosure, for different heat generating components, different numbers of heat pipes may be included in their corresponding sets of heat pipes. For example, the higher the power of the heat generating component is, the larger number of heat pipes its corresponding set of heat pipes will include. For example, each GPU may correspond to a set of four copper heat pipes each having a diameter of 8 mm.
- In order to further increase the contact area between the heat pipes and the heat generating component and thus the speed at which the heat pipes absorb the heat, in an embodiment of the present disclosure, the heat generating component may have its surface coated with a layer of thermally conductive silicone grease. The one
end 21 a of each heat pipe in each set of heat pipes may be connected to the heat generating component via a first mounting device. - In an example, the first mounting device may have a structure shown in
FIG. 3B . As shown, the first mounting device includes a heat pipe base c1 and a heat pipe cover c2. The heat pipe base c1 is mounted fixedly on the thermally conductive silicone grease for the heat generating component, and has a plurality of grooves or slots provided on its top for mounting the heat pipes. The oneend 21 a of each heat pipe in each set of heat pipes is pressed tightly onto the heat pipe base c1 by the heat pipe cover c2, as shown inFIG. 3C . The heat pipe base c1 and the heat pipe cover c2 may be fastened to each other by screws or bolts. -
FIG. 3D is a schematic diagram showing a structure in which a plurality of sets of heat pipes are provided on respective heat generating components. -
FIG. 3E is a schematic diagram showing a structure of a cooling system including a first set of fans 1, afirst heat sink 2, asecond heat sink 3 and a second set offans 4. - Of course, in another example, the first mounting device may include a heat pipe base and a heat pipe cover. The heat pipe base is mounted fixedly on the thermally conductive silicone grease for the heat generating component, and the heat pipe cover has at least one groove or slot provided at its bottom for mounting the at least one heat pipe. The one
end 21 a of each heat pipe in each set of heat pipes is pressed tightly onto the heat pipe base by the heat pipe cover. The heat pipe base and the heat pipe cover may be fastened to each other by screws or bolts. - Of course, in another example, the first mounting device may include a heat pipe base, which is mounted fixedly on the thermally conductive silicone grease for the heat generating component. The one
end 21 a of each heat pipe in each set of heat pipes is welded to the heat pipe base. - In order to further increase the speed of heat dissipation, in an embodiment of the present disclosure, each of the heat pipe cover c2 and the heat pipe base c1 of the above first mounting device may have its surface coated uniformly with a layer of thermally conductive silicone grease, and/or the one
end 21 a of the heat pipe may have its surface coated uniformly with a layer of thermally conductive silicone grease. - In an embodiment of the present disclosure, the heat pipe may include a pipe shell, a wick within the pipe shell and a pipe cover for sealing the pipe shell. The pipe shell may be filled with a volatile liquid having a low boiling point.
- In an embodiment of the present disclosure, the wick may be made of a porous material.
- In an embodiment of the present disclosure, air may be drawn out to form a negative pressure of 1.3*10−1˜1.3*10−4 Pa inside the pipe shell and then the pipe shell may be filled with the volatile liquid having the low boiling point. When the wick is filled with the liquid, the pipe shell is sealed with the pipe cover.
- The principle of the heat pipe absorbing the heat from the heat generating component and transferring the absorbed heat to the
second heat sink 3 may be as follows. When the oneend 21 a of the heat pipe is heated, the liquid in the wick is vaporized into vapor and the heat generated by the heat generating component may be absorbed during the vaporization of the liquid. The vapor flows towards theother end 21 b of the heat pipe, subject to a small pressure, and is liquefied into a liquid when meeting thesecond heat sink 3 having a relatively low temperature at theother end 21 b (as thesecond heat sink 3 is continuously cooled by the high-pressure airflow, it has a lower temperature than the heat pipe). During the liquefaction of the vapor, heat is released to thesecond heat sink 3. The liquid flows back to the oneend 21 a, subject to a capillary force of the wick. Cyclically in this way, the heat generated by the heat generating component may be transferred to thesecond heat sink 3. - In an embodiment of the present disclosure, the material of the heat pipe and the type of the liquid may be any of the following: 1) the pipe shell of the heat pipe may be made of copper and the liquid may be water; 2) the pipe shell of the heat pipe may be made of carbon steel and the liquid may be water; 3) the pipe shell of the heat pipe may be made of a composite of steel and copper and the liquid may be water; 4) the pipe shell of the heat pipe may be made of aluminum and the liquid may be acetone; or 5) the pipe shell of the heat pipe may be made of stainless steel and the liquid may be sodium.
- In an embodiment of the present disclosure, the
other end 21 b of each heat pipe in each set of heat pipes may be connected to thesecond heat sink 3 by means of welding. - Preferably, in an embodiment of the present disclosure, the heat pipe may have a shape of a prism, e.g., a cylinder or cuboid, and the present disclosure is not limited thereto.
- Referring to
FIG. 4A , which shows another exemplary structure of afirst heat sink 2 according to an embodiment of the present disclosure, thefirst heat sink 2 includes a plurality of turbofan heat sinks 22 each corresponding to one heat generating component. Each of the plurality of turbofan heat sinks 22 includes a coolingfin 22 a connected to the heat generating component and aturbofan 22 b. Theturbofan 22 b has an air outlet facing a same direction as the high-pressure airflow. Theturbofan 22 b draws air to blow heat on the coolingfin 22 a to thesecond heat sink 3, as shown inFIG. 4B . - In order to further increase the contact area between the turbofan heat sink 22 and the heat generating component and thus the speed at which the heat is absorbed, in an embodiment of the present disclosure, the heat generating component may have its surface coated with a layer of thermally conductive silicone grease. The cooling
fin 22 a of the turbofan heat sink 22 may be mounted fixedly on the thermally conductive silicone grease for the heat generating component. - Referring to
FIG. 5 , which shows another exemplary structure of afirst heat sink 2 according to an embodiment of the present disclosure, thefirst heat sink 2 includes at least one water cooling device each including awater cooling pipe 23 a and awater tank 23 b arranged cyclically. Thewater cooling pipe 23 a has a water inlet and a water outlet each connected to thewater tank 23 b. Water in thewater cooling pipe 23 a, when flowing through one heat generating component, carries heat generated by the one heat generating component to thesecond heat sink 3 and then flows from thesecond heat sink 3 and through a next heat generating component. - In an embodiment of the present disclosure, the heat generating component may have its surface coated with a layer of thermally conductive silicone grease. The
water cooling pipe 23 a may be mounted on the thermally conductive silicone grease for the heat generating component via a second mounting device. Thewater cooling pipe 23 a may be twisted spirally around thesecond heat sink 3, or may be arranged in thesecond heat sink 3 in a U-shaped structure (as shown inFIG. 5 ). The present disclosure is not limited to any of these arrangements. Here, the second mounting device may include a heat pipe base and a heat pipe cover. The heat pipe base may be mounted on the thermally conductive silicone grease for the heat generating component and have at least one groove or slot provided on its top for mounting the at least onewater cooling pipe 23 a (the groove may be U-shaped, L-shaped or V-shaped and the present disclosure is not limited to any of these shapes). Thewater cooling pipe 23 a may be pressed tightly onto the heat pipe base by the heat pipe cover. The structure of the second mounting device may be identical to, or similar with, that of the first mounting device and details thereof will be omitted here. - In order to further increase the speed of heat dissipation, in an embodiment of the present disclosure, each of the heat pipe cover and the heat pipe base of the above second mounting device may have its surface coated uniformly with a layer of thermally conductive silicone grease, and/or one end of the
water cooling pipe 23 a that is connected to the heat generating component may have its surface coated uniformly with a layer of thermally conductive silicone grease. - According to an embodiment of the present disclosure, in a further example of a
first heat sink 2, thefirst heat sink 2 includes at least one set ofheat pipes 21 and at least one turbofan heat sink 22, each set ofheat pipes 21 corresponding to one heat generating component and each turbofan heat sink 22 corresponding to one heat generating component. For the structures of theheat pipe 21 and the turbofan heat sink 22, reference can be made to the above embodiments and details thereof will be omitted here. - For example, some of the heat generating components in the case may each have a turbofan heat sink 22 provided thereon and some of the heat generating components in the case may each have
heat pipes 21 provided thereon. For example, each CPU on a motherboard may correspond to a turbofan heat sink 22, each GPU on a graphics card may correspond to a set ofheat pipes 21, and each power source may correspond to a set ofheat pipes 21. As another example, each CPU on a motherboard may correspond to a set ofheat pipes 21 and each GPU on a graphics card may correspond to a turbofan heat sink 22. As yet another example, some of CPUs on a motherboard may correspond to a set ofheat pipes 21 while some of the CPUs may correspond to a turbofan heat sink 22, and some of GPUs on a graphics card can correspond to a set ofheat pipes 21 while some of the GPUs may correspond to a turbofan heat sink 22. This can be selected flexibly by those skilled in the art depending on actual requirements and the present disclosure is not limited thereto. - In order to further improve the efficiency of heat dissipation, in an embodiment of the present disclosure, a layer of cooling fins may be provided on a surface of a motherboard, for absorbing heat generated by other components on the motherboard. Additionally or alternatively, a layer of cooling fins may be provided on a surface of a graphics card, for absorbing heat generated by other components on the graphics card. The layer of cooling fins provided on the surface of the motherboard and the layer of cooling fins provided on the surface of the graphics card may be cooled using a high-pressure airflow. As shown in
FIG. 6 , a layer of cooling fins is provided on a surface of a graphics card. - While the embodiments of the present disclosure have been described above, further alternatives and modifications can be made to these embodiments by those skilled in the art in light of the basic inventive concept of the present disclosure. The claims as attached are intended to cover the above embodiments and all these alternatives and modifications that fall within the scope of the present disclosure.
- Obviously, various modifications and variants can be made to the present disclosure by those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, these modifications and variants are to be encompassed by the present disclosure if they fall within the scope of the present disclosure as defined by the claims and their equivalents.
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/217,817 US11632880B2 (en) | 2017-11-08 | 2021-03-30 | Cooling system |
US18/298,430 US20230247805A1 (en) | 2017-11-08 | 2023-04-11 | Cooling system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711088430.3A CN107885295A (en) | 2017-11-08 | 2017-11-08 | A kind of cooling system |
CN201711088430.3 | 2017-11-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/217,817 Continuation US11632880B2 (en) | 2017-11-08 | 2021-03-30 | Cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190289752A1 true US20190289752A1 (en) | 2019-09-19 |
US10973152B2 US10973152B2 (en) | 2021-04-06 |
Family
ID=61779319
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/242,845 Active US10973152B2 (en) | 2017-11-08 | 2019-01-08 | Cooling system |
US17/217,817 Active 2039-01-11 US11632880B2 (en) | 2017-11-08 | 2021-03-30 | Cooling system |
US18/298,430 Pending US20230247805A1 (en) | 2017-11-08 | 2023-04-11 | Cooling system |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/217,817 Active 2039-01-11 US11632880B2 (en) | 2017-11-08 | 2021-03-30 | Cooling system |
US18/298,430 Pending US20230247805A1 (en) | 2017-11-08 | 2023-04-11 | Cooling system |
Country Status (2)
Country | Link |
---|---|
US (3) | US10973152B2 (en) |
CN (1) | CN107885295A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11073877B2 (en) * | 2019-07-12 | 2021-07-27 | Huawei Technologies Co., Ltd. | In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle |
US11147192B2 (en) * | 2019-12-23 | 2021-10-12 | Baidu Usa Llc | Fluid cooling system for an enclosed electronic package |
US11412638B2 (en) * | 2020-12-01 | 2022-08-09 | Quanta Computer Inc. | Cooling for server with high-power CPU |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111381645A (en) * | 2018-12-29 | 2020-07-07 | 北京图森智途科技有限公司 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
CN116301243B (en) * | 2023-05-10 | 2023-09-05 | 苏州浪潮智能科技有限公司 | Water-cooling auxiliary heat dissipation device, storage equipment, server and computer |
CN116367480B (en) * | 2023-06-02 | 2023-08-08 | 成都贡爵微电子有限公司 | High-isolation airtight microwave assembly |
Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528454A (en) * | 1994-12-29 | 1996-06-18 | Compuserve Incorporated | Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same |
US5949646A (en) * | 1998-07-31 | 1999-09-07 | Sun Microsystems, Inc. | Compact computer having a redundant air moving system and method thereof |
US5986882A (en) * | 1997-10-16 | 1999-11-16 | Compaq Computer Corporation | Electronic apparatus having removable processor/heat pipe cooling device modules therein |
US6174841B1 (en) * | 1998-10-02 | 2001-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat-reducing silicone grease composition and semiconductor device using the same |
US20020036890A1 (en) * | 2000-09-25 | 2002-03-28 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
US20040070949A1 (en) * | 2002-09-25 | 2004-04-15 | Hironori Oikawa | Electronic device having a heat dissipation member |
US20050047086A1 (en) * | 2003-08-27 | 2005-03-03 | Elias Gedamu | Heat dissipation apparatus and method |
US20050061485A1 (en) * | 2002-07-09 | 2005-03-24 | Kazuo Hirafuji | Heat exchanger |
US6888725B2 (en) * | 2000-12-11 | 2005-05-03 | Fujitsu Limited | Electronics device unit |
US20050231913A1 (en) * | 2004-04-19 | 2005-10-20 | Hewlett-Packard Development Company, L.P. | External liquid loop heat exchanger for an electronic system |
US20050241802A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Liquid loop with flexible fan assembly |
US20050241810A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Controllable flow resistance in a cooling apparatus |
US20060012955A1 (en) * | 2004-07-19 | 2006-01-19 | Wade Vinson | System and method for cooling electronic devices |
US20060262505A1 (en) * | 2005-05-19 | 2006-11-23 | Cooler Master Co. Ltd. | Water-cooling heat dissipator |
US7142424B2 (en) * | 2004-04-29 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Heat exchanger including flow straightening fins |
US20070070604A1 (en) * | 2005-09-28 | 2007-03-29 | Kentaro Tomioka | Cooling device and electronic apparatus having cooling device |
US20080123298A1 (en) * | 2006-11-24 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Apparatus |
US20090025909A1 (en) * | 2007-07-25 | 2009-01-29 | Tsung-Hsien Huang | Cooler module |
US20090168331A1 (en) * | 2006-05-19 | 2009-07-02 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20100097760A1 (en) * | 2008-10-20 | 2010-04-22 | Kaveh Azar | Impingement Cooling |
US20100177477A1 (en) * | 2009-01-13 | 2010-07-15 | Hon Hai Precision Industry Co., Ltd. | Adjustable retention load plate of electrical connector assembly |
US20100300652A1 (en) * | 2009-05-27 | 2010-12-02 | Hon Hai Precision Industry Co., Ltd | Heat Dissipating System |
US20110164384A1 (en) * | 2010-01-06 | 2011-07-07 | Sun Microsystems, Inc. | Tandem fan assembly with airflow-straightening heat exchanger |
US20120047917A1 (en) * | 2010-08-27 | 2012-03-01 | Alexander Rafalovich | MODULAR REFRIGERATOR and ICEMAKER |
US20130141865A1 (en) * | 2011-12-03 | 2013-06-06 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20130155622A1 (en) * | 2011-12-16 | 2013-06-20 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipation apparatus |
US8564951B1 (en) * | 2012-09-07 | 2013-10-22 | Fujitsu Limited | Electronic apparatus and cooling module mounted in that electronic apparatus |
US20130329357A1 (en) * | 2012-06-08 | 2013-12-12 | Apple Inc. | Gaskets for thermal ducting around heat pipes |
US20140160679A1 (en) * | 2012-12-11 | 2014-06-12 | Infinera Corporation | Interface card cooling uisng heat pipes |
US20140198438A1 (en) * | 2013-01-14 | 2014-07-17 | Deeder M. Aurongzeb | Information handling system chassis with anisotropic conductance |
US20140268553A1 (en) * | 2013-03-15 | 2014-09-18 | Silicon Graphics International Corp. | System for cooling multiple in-line central processing units in a confined enclosure |
US20140268550A1 (en) * | 2013-03-13 | 2014-09-18 | Silicon Graphics International Corp. | Server with heat pipe cooling |
US20140321056A1 (en) * | 2011-12-01 | 2014-10-30 | Nec Corporation | Electronic substrate housing equipment and electric apparatus |
US20150212556A1 (en) * | 2014-01-28 | 2015-07-30 | Dell Products L.P. | Multi-component shared cooling system |
US20160007501A1 (en) * | 2013-03-22 | 2016-01-07 | Fujitsu Limited | Cooling system and electronic device |
US20160018139A1 (en) * | 2014-07-21 | 2016-01-21 | Phononic Devices, Inc. | Integration of thermosiphon tubing into accept heat exchanger |
US9261310B2 (en) * | 2007-04-16 | 2016-02-16 | Stephen Fried | Gas cooled condensers for loop heat pipe like enclosure cooling |
US20170127573A1 (en) * | 2015-11-04 | 2017-05-04 | Fujitsu Limited | Information processing device and container for data center |
US9910231B2 (en) * | 2016-01-04 | 2018-03-06 | Infinera Corporation | Stacked cage optical module heat relay system |
US20180292145A1 (en) * | 2017-04-11 | 2018-10-11 | Cooler Master Co., Ltd. | Communication-type thermal conduction device |
US20180372419A1 (en) * | 2017-04-11 | 2018-12-27 | Cooler Master Co., Ltd. | Heat transfer device |
US20190203983A1 (en) * | 2018-01-02 | 2019-07-04 | Lg Electronics Inc. | Cooling apparatus using thermoelectric modules |
US10349561B2 (en) * | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
US10571199B2 (en) * | 2015-07-14 | 2020-02-25 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5106237B2 (en) | 2008-05-02 | 2012-12-26 | オリンパス株式会社 | Wireless power supply system |
CN201369011Y (en) * | 2009-03-13 | 2009-12-23 | 广东新创意专利发展有限公司 | Power supply heat dissipation device for computer |
US8893384B2 (en) * | 2011-06-28 | 2014-11-25 | Asia Vital Components Co., Ltd. | Heat pipe manufacturing method |
CN204464810U (en) * | 2015-01-22 | 2015-07-08 | 上海国城能源科技有限公司 | A kind of high-tension switch cabinet with radiator structure |
CN205384573U (en) * | 2016-02-20 | 2016-07-13 | 宜春学院 | Novel multi -functional computer radiator |
CN205810782U (en) * | 2016-05-17 | 2016-12-14 | 深圳市金飞越数码有限公司 | A kind of high efficiency and heat radiation IC plate encapsulating structure |
CN205809805U (en) * | 2016-05-28 | 2016-12-14 | 南安普敦咨询服务有限公司 | A kind of high-availability computer heat sink |
-
2017
- 2017-11-08 CN CN201711088430.3A patent/CN107885295A/en active Pending
-
2019
- 2019-01-08 US US16/242,845 patent/US10973152B2/en active Active
-
2021
- 2021-03-30 US US17/217,817 patent/US11632880B2/en active Active
-
2023
- 2023-04-11 US US18/298,430 patent/US20230247805A1/en active Pending
Patent Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528454A (en) * | 1994-12-29 | 1996-06-18 | Compuserve Incorporated | Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same |
US5986882A (en) * | 1997-10-16 | 1999-11-16 | Compaq Computer Corporation | Electronic apparatus having removable processor/heat pipe cooling device modules therein |
US5949646A (en) * | 1998-07-31 | 1999-09-07 | Sun Microsystems, Inc. | Compact computer having a redundant air moving system and method thereof |
US6174841B1 (en) * | 1998-10-02 | 2001-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat-reducing silicone grease composition and semiconductor device using the same |
US20020036890A1 (en) * | 2000-09-25 | 2002-03-28 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
US6888725B2 (en) * | 2000-12-11 | 2005-05-03 | Fujitsu Limited | Electronics device unit |
US20050061485A1 (en) * | 2002-07-09 | 2005-03-24 | Kazuo Hirafuji | Heat exchanger |
US20040070949A1 (en) * | 2002-09-25 | 2004-04-15 | Hironori Oikawa | Electronic device having a heat dissipation member |
US20050047086A1 (en) * | 2003-08-27 | 2005-03-03 | Elias Gedamu | Heat dissipation apparatus and method |
US20050231913A1 (en) * | 2004-04-19 | 2005-10-20 | Hewlett-Packard Development Company, L.P. | External liquid loop heat exchanger for an electronic system |
US20050241802A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Liquid loop with flexible fan assembly |
US20050241810A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Controllable flow resistance in a cooling apparatus |
US7142424B2 (en) * | 2004-04-29 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Heat exchanger including flow straightening fins |
US20060012955A1 (en) * | 2004-07-19 | 2006-01-19 | Wade Vinson | System and method for cooling electronic devices |
US20060262505A1 (en) * | 2005-05-19 | 2006-11-23 | Cooler Master Co. Ltd. | Water-cooling heat dissipator |
US20070070604A1 (en) * | 2005-09-28 | 2007-03-29 | Kentaro Tomioka | Cooling device and electronic apparatus having cooling device |
US20090168331A1 (en) * | 2006-05-19 | 2009-07-02 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20080123298A1 (en) * | 2006-11-24 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Apparatus |
US9261310B2 (en) * | 2007-04-16 | 2016-02-16 | Stephen Fried | Gas cooled condensers for loop heat pipe like enclosure cooling |
US20090025909A1 (en) * | 2007-07-25 | 2009-01-29 | Tsung-Hsien Huang | Cooler module |
US20100097760A1 (en) * | 2008-10-20 | 2010-04-22 | Kaveh Azar | Impingement Cooling |
US20100177477A1 (en) * | 2009-01-13 | 2010-07-15 | Hon Hai Precision Industry Co., Ltd. | Adjustable retention load plate of electrical connector assembly |
US20100300652A1 (en) * | 2009-05-27 | 2010-12-02 | Hon Hai Precision Industry Co., Ltd | Heat Dissipating System |
US20110164384A1 (en) * | 2010-01-06 | 2011-07-07 | Sun Microsystems, Inc. | Tandem fan assembly with airflow-straightening heat exchanger |
US20120047917A1 (en) * | 2010-08-27 | 2012-03-01 | Alexander Rafalovich | MODULAR REFRIGERATOR and ICEMAKER |
US20140321056A1 (en) * | 2011-12-01 | 2014-10-30 | Nec Corporation | Electronic substrate housing equipment and electric apparatus |
US20130141865A1 (en) * | 2011-12-03 | 2013-06-06 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20130155622A1 (en) * | 2011-12-16 | 2013-06-20 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipation apparatus |
US20130329357A1 (en) * | 2012-06-08 | 2013-12-12 | Apple Inc. | Gaskets for thermal ducting around heat pipes |
US8564951B1 (en) * | 2012-09-07 | 2013-10-22 | Fujitsu Limited | Electronic apparatus and cooling module mounted in that electronic apparatus |
US20140160679A1 (en) * | 2012-12-11 | 2014-06-12 | Infinera Corporation | Interface card cooling uisng heat pipes |
US20140198438A1 (en) * | 2013-01-14 | 2014-07-17 | Deeder M. Aurongzeb | Information handling system chassis with anisotropic conductance |
US20140268550A1 (en) * | 2013-03-13 | 2014-09-18 | Silicon Graphics International Corp. | Server with heat pipe cooling |
US20140268553A1 (en) * | 2013-03-15 | 2014-09-18 | Silicon Graphics International Corp. | System for cooling multiple in-line central processing units in a confined enclosure |
US20160007501A1 (en) * | 2013-03-22 | 2016-01-07 | Fujitsu Limited | Cooling system and electronic device |
US20150212556A1 (en) * | 2014-01-28 | 2015-07-30 | Dell Products L.P. | Multi-component shared cooling system |
US20160018139A1 (en) * | 2014-07-21 | 2016-01-21 | Phononic Devices, Inc. | Integration of thermosiphon tubing into accept heat exchanger |
US10571199B2 (en) * | 2015-07-14 | 2020-02-25 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
US20170127573A1 (en) * | 2015-11-04 | 2017-05-04 | Fujitsu Limited | Information processing device and container for data center |
US9910231B2 (en) * | 2016-01-04 | 2018-03-06 | Infinera Corporation | Stacked cage optical module heat relay system |
US10349561B2 (en) * | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
US20180292145A1 (en) * | 2017-04-11 | 2018-10-11 | Cooler Master Co., Ltd. | Communication-type thermal conduction device |
US20180372419A1 (en) * | 2017-04-11 | 2018-12-27 | Cooler Master Co., Ltd. | Heat transfer device |
US20190203983A1 (en) * | 2018-01-02 | 2019-07-04 | Lg Electronics Inc. | Cooling apparatus using thermoelectric modules |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11073877B2 (en) * | 2019-07-12 | 2021-07-27 | Huawei Technologies Co., Ltd. | In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle |
US11726534B2 (en) | 2019-07-12 | 2023-08-15 | Huawei Technologies Co., Ltd. | In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle |
US11147192B2 (en) * | 2019-12-23 | 2021-10-12 | Baidu Usa Llc | Fluid cooling system for an enclosed electronic package |
US11412638B2 (en) * | 2020-12-01 | 2022-08-09 | Quanta Computer Inc. | Cooling for server with high-power CPU |
Also Published As
Publication number | Publication date |
---|---|
US10973152B2 (en) | 2021-04-06 |
US20210219464A1 (en) | 2021-07-15 |
US11632880B2 (en) | 2023-04-18 |
CN107885295A (en) | 2018-04-06 |
US20230247805A1 (en) | 2023-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11632880B2 (en) | Cooling system | |
US20190254196A1 (en) | Computer server | |
US8077463B2 (en) | Heat dissipating system | |
JP2018088433A (en) | Cooling system and cooling method for electronic equipment | |
US8773855B2 (en) | Heat-dissipating device and electric apparatus having the same | |
US8885336B2 (en) | Mounting structure and method for dissipating heat from a computer expansion card | |
US20070175610A1 (en) | Heat dissipating device | |
US20120291997A1 (en) | Liquid cooling device | |
US20120111538A1 (en) | Heat dissipation structure | |
CN110581114B (en) | Heat pipe, phase change material and immersed liquid cooling combined heat dissipation system | |
US20180195804A1 (en) | Integrated liquid cooling device and method thereof | |
TWM545361U (en) | Air-cooling and liquid-cooling composite heat dissipator | |
US20160095254A1 (en) | Managing heat transfer for electronic devices | |
CN209745070U (en) | Phase change heat dissipation device | |
US20180213679A1 (en) | Heat dissipation unit | |
CN102480899A (en) | Cooling device | |
US8783333B1 (en) | Cooling system | |
TW202045882A (en) | Immersion cooling apparatus | |
TWI796788B (en) | Open loop two-phase cooling system and condenser | |
US20220141997A1 (en) | Cooling of electronic components with an electrohydrodynamic flow unit | |
CN210630125U (en) | Electronic equipment | |
TWI771054B (en) | Server deivce | |
CN117241541A (en) | Cooling system and server | |
JP2015185709A (en) | Cooling device for electronic apparatus and electronic apparatus mounted with cooling device for electronic apparatus | |
CN105607713A (en) | Heat pipe type radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES GRANTED (ORIGINAL EVENT CODE: PTGR); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
AS | Assignment |
Owner name: TUSIMPLE, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MA, ZHIHUA;REEL/FRAME:051900/0139 Effective date: 20180719 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
AS | Assignment |
Owner name: TUSIMPLE, INC., CALIFORNIA Free format text: CHANGE OF NAME;ASSIGNOR:TUSIMPLE;REEL/FRAME:053428/0613 Effective date: 20190412 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
AS | Assignment |
Owner name: TUSIMPLE, CALIFORNIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE AND CORRESPONDENCE DATA PREVIOUSLY RECORDED AT REEL: 51900 FRAME: 139. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT;ASSIGNOR:MA, ZHIHUA;REEL/FRAME:054573/0276 Effective date: 20171221 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TUSIMPLE, INC.;REEL/FRAME:058779/0374 Effective date: 20220114 |