US20190267518A1 - Vehicle Luminaire, Vehicle Lamp, and Method for Manufacturing Vehicle Luminaire - Google Patents
Vehicle Luminaire, Vehicle Lamp, and Method for Manufacturing Vehicle Luminaire Download PDFInfo
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- US20190267518A1 US20190267518A1 US16/045,807 US201816045807A US2019267518A1 US 20190267518 A1 US20190267518 A1 US 20190267518A1 US 201816045807 A US201816045807 A US 201816045807A US 2019267518 A1 US2019267518 A1 US 2019267518A1
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- Prior art keywords
- optical element
- frame
- light
- convex part
- luminaire according
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/50—Waterproofing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/14—Bayonet-type fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Definitions
- Exemplary embodiments described herein relate to a vehicle luminaire, a vehicle lamp, and a method for manufacturing a vehicle luminaire.
- a vehicle luminaire including a socket and a light-emitting module provided at one end side of the socket is known.
- the light-emitting module includes a board, a light-emitting diode (LED) provided on the board, a frame surrounding the light-emitting diode, and a sealing part provided inside the frame and covering the light-emitting diode.
- LED light-emitting diode
- the sealing part is generally formed by filling the inside of the frame with a resin with translucency. In this case, if the surface of the sealing part opposite to the board side is a flat surface, light extracting efficiency may decrease.
- a technology of forming the surface of a sealing part opposite to a board side into a curved surface is suggested.
- the curved surface is simply formed by a resin supplied to the inside of a frame, the shape of the curved surface may vary so that predetermined light distribution characteristics may not be obtainable.
- a technology of forming a lens using a mold and bonding the lens onto a sealing part that is the inside of a frame is suggested.
- the lens is provided inside the frame, a gap needs to be provided between an inner wall of the frame and a circumferential edge of the lens. Therefore, a position of the lens may vary so that predetermined light distribution characteristics may not be obtainable.
- the resin for forming the sealing part may leak from the gap between the inner wall of the frame and the circumferential edge of the lens.
- the shape of a light-emitting surface of the lens may substantially change so that predetermined light distribution characteristics may not be obtainable.
- FIG. 1 is a schematic perspective view for illustrating a vehicle luminaire according to an exemplary embodiment
- FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1 ;
- FIG. 3 is a schematic cross-sectional view for illustrating an optical element according to a comparative example
- FIG. 4 is a schematic cross-sectional view for illustrating an optical element according to an exemplary embodiment
- FIGS. 5A and 5B are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment
- FIGS. 6A and 6B are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment
- FIGS. 7A to 7C are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment
- FIG. 8 is a schematic perspective view for illustrating a frame according to another exemplary embodiment.
- FIG. 9 is a schematic partial cross-sectional view for illustrating a vehicle lamp.
- a vehicle luminaire includes: a socket; a board provided at one end side of the socket; at least one light-emitting element provided on the board; a frame provided on the board, having a tube shape, and surrounding the light-emitting element; a sealing part provided inside the frame and covering the light-emitting element; and an optical element provided on the sealing part, at least a part of a circumferential edge being provided at an end face of the frame opposite to the board side.
- a vehicle luminaire 1 according to an exemplary embodiment can be provided, for example, in an automobile, a rail vehicle, and the like.
- the vehicle luminaire 1 provided in an automobile for example, those used in a front combination light (for example, one obtained by appropriately combining a daylight running lamp (DRL), a position lamp, a turn signal lamp, and the like), a rear combination light (for example, one obtained by appropriately combining a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, and the like), and the like can be exemplified.
- a front combination light for example, one obtained by appropriately combining a daylight running lamp (DRL), a position lamp, a turn signal lamp, and the like
- a rear combination light for example, one obtained by appropriately combining a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, and the like
- the application of the vehicle luminaire 1 is not limited thereto.
- FIG. 1 is a schematic perspective view for illustrating the vehicle luminaire 1 according to the exemplary embodiment.
- FIG. 2 is a cross-sectional view of the vehicle luminaire 1 taken along line A-A in FIG. 1 .
- the vehicle luminaire 1 includes a socket 10 , a light-emitting module 20 , a power-supply part 30 , and a heat transfer part 40 .
- the socket 10 has a mounting part 11 , a bayonet 12 , a flange 13 , and a thermal radiation fin 14 .
- the mounting part 11 is provided on the surface of the flange 13 opposite to the side at which the thermal radiation fin 14 is provided.
- the outer shape of the mounting part 11 can be a column shape.
- the outer shape of the mounting part 11 is, for example, a cylindrical shape.
- the mounting part 11 has a concave part 11 a opened to an end face opposite to the flange 13 side.
- a light-emitting module 20 is provided at a bottom face 11 a 1 of the concave part 11 a.
- At least one slit 11 b can be provided in the mounting part 11 .
- a corner part of the board 21 is provided inside the slit 11 b.
- the dimension (width dimension) of the slit 11 b in a circumferential direction of the mounting part 11 is slightly larger than the dimension of the corner part of the board 21 . Therefore, positioning of the board 21 can be performed by inserting the corner part of the board 21 to the inside of the slit 11 b.
- the planar shape of the board 21 can be increased. Therefore, the number of elements mounted on the board 21 can be increased.
- the mounting part 11 can be miniaturized, and further the vehicle luminaire 1 can be miniaturized.
- the bayonet 12 is provided at an outer side surface of the mounting part 11 .
- the bayonet 12 projects toward the outside of the vehicle luminaire 1 .
- the bayonet 12 faces the flange 13 .
- the bayonet 12 is provided in plural.
- the bayonet 12 is used when the vehicle luminaire 1 is mounted in a housing 101 of a vehicle lamp 100 .
- the bayonet 12 is used for twist lock.
- the flange 13 has a plate shape.
- the flange 13 can be formed, for example, in a disk shape.
- An outer side surface of the flange 13 is positioned at the outer side of the vehicle luminaire 1 than an outer side surface of the bayonet 12 .
- the thermal radiation fin 14 is provided at the side of the flange 13 opposite to the mounting part 11 side. At least one thermal radiation fin 14 can be provided. A plurality of thermal radiation fins are provided in the socket 10 illustrated in FIGS. 1 and 2 . The plurality of thermal radiation fins 14 can be provided side by side in a predetermined direction. The thermal radiation fin 14 can be formed in a plate shape.
- a hole 10 b into which a connector 105 is inserted is proved in the socket 10 .
- the connector 105 having a sealing member 105 a is inserted into the hole 10 b.
- the cross-sectional shape of the hole 10 b is a shape compatible with the cross-sectional shape of the connector 105 having the sealing member 105 a.
- Heat generated in the light-emitting module 20 is mainly transferred to the thermal radiation fin 14 through the mounting part 11 and the flange 13 .
- the heat transferred to the thermal radiation fin 14 is mainly discharged from the thermal radiation fin 14 to the outside.
- the socket 10 is preferably formed by a material having a high rate of heat conductivity.
- the socket 10 can be formed by a metal such as an aluminum alloy.
- the socket 10 can efficiently radiate the heat generated in the light-emitting module 20 and is desirably lightweight.
- the mounting part 11 , the bayonet 12 , the flange 13 , and the thermal radiation fin 14 are preferably formed by a resin with high heat conductivity.
- the resin with high heat conductivity includes, for example, a filler formed by a resin and an inorganic material.
- the resin with high heat conductivity is, for example, a resin obtained by mixing a filler formed by carbon or aluminum oxide with a resin such as polyethylene terephthalate (PET) or nylon.
- the mounting part 11 , the bayonet 12 , the flange 13 , and the thermal radiation fin 14 can be integrally molded with the power-supply part 30 using an insert molding method or the like.
- the heat generated in the light-emitting module 20 can be efficiently radiated using the socket 10 which contains a resin with high heat conductivity and in which the mounting part 11 , the bayonet 12 , the flange 13 , and the thermal radiation fin 14 are integrally molded. Further, the weight of the socket 10 can be decreased.
- the power-supply part 30 has a power-supply terminal 31 and an insulating part 32 .
- the power-supply terminal 31 can be formed in a rod-shape body.
- the power-supply terminal 31 projects from the bottom face 11 a 1 of the concave part 11 a.
- the power-supply terminal 31 is provided in plural.
- the plurality of power-supply terminals 31 can be provided side by side in a predetermined direction.
- the plurality of power-supply terminals 31 are provided inside the insulating part 32 .
- the insulating part 32 is provided between the power-supply terminal 31 and the socket 10 .
- the plurality of power-supply terminals 31 extend in the inside of the insulating part 32 and project from an end face of the insulating part 32 at the light-emitting module 20 side and an end face of the insulating part 32 at the thermal radiation fin 14 side.
- Ends of the plurality of power-supply terminals 31 at the light-emitting module 20 side are electrically and mechanically connected to a wiring pattern 21 a provided on the board 21 . That is, one end of the power-supply terminal 31 is soldered with the wiring pattern 21 a. The ends of the plurality of power-supply terminals 31 at the thermal radiation fin 14 side are exposed to the inside of the hole 10 b.
- the connector 105 is fitted to the plurality of power-supply terminals 31 exposed to the inside of the hole 10 b.
- the power-supply terminal 31 has electrical conductivity.
- the power-supply terminal 31 can be formed, for example, by a metal such as a copper alloy. Note that the numbers, shapes, arrangement, materials, and the like of the power-supply terminals 31 are not limited to the example, and can be changed as appropriate.
- the socket 10 is preferably formed by a material having a high rate of heat conductivity.
- the material having a high rate of heat conductivity has electrical conductivity in some cases.
- a resin with high heat conductivity containing a metal such as an aluminum alloy or a filler formed by carbon has electrical conductivity. Therefore, the insulating part 32 is provided to insulate between the power-supply terminal 31 and the socket 10 having electrical conductivity.
- the insulating part 32 also has a function of holding the plurality of power-supply terminals 31 .
- the socket 10 is formed by an insulating resin with high heat conductivity (for example, a resin with high heat conductivity containing a filler formed by aluminum oxide, or the like), the insulating part 32 may not be provided. In this case, the socket 10 holds the plurality of power-supply terminals 31 .
- the insulating part 32 has insulation property.
- the insulating part 32 can be formed by a resin with insulation property.
- a coefficient of thermal expansion of the material of the insulating part 32 is preferably set to be close to a coefficient of thermal expansion of the material of the socket 10 as much as possible. In this way, thermal stress generated between the insulating part 32 and the socket 10 can be reduced.
- the material of the insulating part 32 can be a resin with high heat conductivity contained in the socket 10 or a resin included in the resin with high heat conductivity.
- the insulating part 32 can be, for example, press-inserted into a hole 10 a provided in the socket 10 or attached to the inner wall of the hole 10 a.
- the socket 10 and the power-supply part 30 can also be integrally molded by an insert molding method.
- the heat transfer part 40 is provided between the board 21 and the bottom face 11 a 1 of the concave part 11 a.
- the heat transfer part 40 is provided at the bottom face 11 a 1 of the concave part 11 a through an attachment part. That is, the heat transfer part 40 is attached to the bottom face 11 a 1 of the concave part 11 a.
- An adhesive for attaching the heat transfer part 40 and the bottom face 11 a 1 of the concave part 11 a is preferably an adhesive having a high rate of heat conductivity.
- the adhesive can be an adhesive mixed with a filler using an inorganic material.
- the inorganic material is preferably a material having a high rate of heat conductivity (for example, ceramics such as aluminum oxide or aluminum nitride).
- a rate of heat conductivity of the adhesive can be set to, for example, 0.5 W/(m ⁇ K) or more and 10 W/(m ⁇ K) or less.
- the heat transfer part 40 can also be embedded in the bottom face 11 a 1 of the concave part 11 a by an insert molding method.
- the heat transfer part 40 can also be attached to the bottom face 11 a 1 of the concave part 11 a through a layer formed by heat conductive grease (thermal radiation grease).
- the type of heat conductive grease is not particularly limited, and for example, heat conductive grease obtained by mixing a filler using a material having a high rate of heat conductivity (for example, ceramics such as aluminum oxide or aluminum nitride) with modified silicone can be used.
- a rate of heat conductivity of the heat conductive grease can be set to, for example, 1 W/(m ⁇ K) or more and 5 W/(m ⁇ K) or less.
- the heat transfer part 40 is provided to facilitate transferring of the heat generated in the light-emitting module 20 to the socket 10 .
- the heat transfer part 40 is preferably formed by a material having a high rate of heat conductivity.
- the heat transfer part 40 has a plate shape and can be formed, for example, by a metal such as aluminum, an aluminum alloy, copper, or a copper alloy.
- the light-emitting module 20 has the board 21 , a light-emitting element 22 , a resistor 23 , a control element 24 , a frame 25 , a sealing part 26 , and an optical element 27 .
- the board 21 is provided at one end side of the socket 10 .
- the board 21 is provided at the heat transfer part 40 through an attachment part. That is, the board 21 is attached to the heat transfer part 40 .
- An adhesive can be, for example, the same as the adhesive for attaching the heat transfer part 40 and the bottom face 11 a 1 of the concave part 11 a.
- the board 21 has a plate shape.
- the planar shape of the board 21 can be, for example, a square shape.
- a material or a structure of the board 21 is not particularly limited.
- the board 21 can be formed by an inorganic material such as ceramics (for example, aluminum oxide, aluminum nitride, or the like), an organic material such as paper phenol or glass epoxy, or the like.
- the board 21 may employ a board obtained by coating a surface of a metal plate with an insulating material. Note that if the surface of the metal plate is coated with the insulating material, the insulating material may be formed by an organic material or an inorganic material.
- the board 21 is preferably formed using a material having a high rate of heat conductivity from the viewpoint of thermal radiation.
- a material having a high rate of heat conductivity for example, ceramics such as aluminum oxide or aluminum nitride, a resin with high heat conductivity, a material obtained by coating a surface of a metal plate with an insulating material, and the like can be exemplified.
- the board 21 may be formed of a single layer or multiple layers.
- the wiring pattern 21 a is provided on a surface of the board 21 .
- the wiring pattern 21 a can be formed, for example, by a material containing silver as a main component.
- the wiring pattern 21 a can be formed, for example, by silver or a silver alloy.
- the material of the wiring pattern 21 a is not limited to the material containing silver as a main component.
- the wiring pattern 21 a can also be formed, for example, by a material containing copper as a main component.
- the light-emitting element 22 is provided at the side of the board 21 opposite to the bottom face 11 a 1 side of the concave part 11 a.
- the light-emitting element 22 is provided on the board 21 .
- the light-emitting element 22 is electrically connected to the wiring pattern 21 a provided on the surface of the board 21 .
- the light-emitting element 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like. At least one light-emitting element 22 can be provided. If a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series to each other. In addition, the light-emitting element 22 is connected in series to the resistor 23 .
- the light-emitting element 22 can be a chip-shape light-emitting element.
- the chip-shape light-emitting element 22 can be mounted by a chip on board (COB). In this manner, a large number of light-emitting elements 22 can be provided in a narrow region. Therefore, the light-emitting module 20 can be miniaturized, and further the vehicle luminaire 1 can be miniaturized.
- the chip-shape light-emitting element 22 can be, for example, an upper electrode type light-emitting element, a top-and-bottom electrode type light-emitting element, a flip chip type light-emitting element, or the like.
- 1 and 2 is a top-and-bottom electrode type light-emitting element.
- An electrode of the upper electrode type light-emitting element or an upper electrode of the top-and-bottom electrode type light-emitting element can be electrically connected to the wiring pattern 21 a by a wiring 21 b.
- the light-emitting element 22 and the wiring pattern 21 a can be electrically connected, for example, by a wire bonding method.
- the flip chip type light-emitting element 22 can be mounted directly on the wiring pattern 21 a.
- the resistor 23 is provided at the side of the board 21 opposite to the bottom face 11 a 1 side of the concave part 11 a .
- the resistor 23 is provided on the board 21 .
- the resistor 23 is electrically connected to the wiring pattern 21 a provided on the surface of the board 21 .
- the resistor 23 can be, for example, a resistor such as a surface mount type resistor, a resistor having a lead wire (metal oxide film resistor), or a film type resistor formed by a screen printing method or the like. Note that the resistor 23 illustrated in FIG. 1 is a film type resistor.
- a material for the film type resistor can be, for example, ruthenium oxide (RuO 2 ).
- the film type resistor can be formed, for example, by a screen printing method and a calcination method. If the resistor 23 is the film type resistor, it is possible to increase a contact area between the resistor 23 and the board 21 . This makes it possible to improve heat-dissipation capability. In addition, a plurality of resistors 23 can be formed at once. Therefore, it is possible to improve productivity and suppress variation in resistance value in the plurality of resistors 23 .
- a forward voltage characteristic of the light-emitting element 22 varies, if an applied voltage between an anode terminal and a ground terminal is constant, variation occurs in brightness (light flux, luminance, luminous intensity, or illuminance) of light emitted from the light-emitting element 22 . Therefore, a value of current flowing through the light-emitting element 22 is set within a predetermined range by the resistor 23 so that the brightness of the light emitted from the light-emitting element 22 falls within a predetermined range. In this case, the value of current flowing through the light-emitting element 22 falls within the predetermined range by changing a resistance value of the resistor 23 .
- the resistor 23 is a surface mount type resistor, a resistor having a lead wire, or the like, the resistor 23 having an appropriate resistance value is selected depending on the forward voltage characteristic of the light-emitting element 22 . If the resistor 23 is a film type resistor, when a part of the resistor 23 is removed, the resistance value can be increased. For example, a part of the resistor 23 can be easily removed by irradiating the resistor 23 with laser light.
- the number, sizes, arrangement, and the like of the resistors 23 are not limited to the examples, and can be changed as appropriate depending on the number, specification, and the like of the light-emitting elements 22 .
- the control element 24 is provided at the side of the board 21 opposite to the bottom face 11 a 1 side of the concave part 11 a.
- the control element 24 is provided on the board 21 .
- the control element 24 is electrically connected to the wiring pattern 21 a provided on the surface of the board 21 .
- the control element 24 is provided so that a reverse voltage is not applied to the light-emitting element 22 and pulse noise from a reverse direction is not applied to the light-emitting element 22 .
- the control element 24 can be, for example, a diode.
- the control element 24 can be, for example, a surface mount type diode, a diode having a lead wire, or the like.
- the control element 24 illustrated in FIG. 1 is a surface mount type diode.
- a pull-down resistor can also be provided to detect disconnection of the light-emitting element 22 or to prevent the light-emitting element 22 from being wrongly turned on.
- a coating part covering the wiring pattern 21 a, the film type resistor, or the like can also be provided.
- the coating part can contain, for example, a glass material.
- the frame 25 is provided at the side of the board 21 opposite to the bottom face 11 a 1 side of the concave part 11 a .
- the frame 25 is provided on the board 21 .
- the frame 25 is attached to the board 21 .
- the frame 25 has a tube shape and has the light-emitting element 22 disposed inside.
- the frame 25 surrounds the plurality of light-emitting elements 22 .
- the frame 25 can be formed by a resin.
- the resin can be, for example, a thermoplastic resin such as polybutylene terephthalate (PBT), polycarbonate (PC), PET, nylon, polypropylene (PP), polyethylene (PE), or polystyrene (PS).
- particles of titanium oxide or the like are mixed with the resin so that the reflectance of light emitted from the light-emitting element 22 can be increased.
- a mixed material is not limited to particles of titanium oxide, and may be particles of a material having a high reflectance of the light emitted from the light-emitting element 22 .
- the frame 25 can also be formed, for example, by a white resin
- An inner wall surface of the frame 25 is a slope inclined in a direction away from a center axis of the frame 25 with increasing distance from the board 21 . Therefore, some of the light emitted from the light-emitting element 22 is reflected at the inner wall surface of the frame 25 and is emitted toward the front side of the vehicle luminaire 1 . That is, the frame 25 can have a function of defining a formation range of the sealing part 26 and a function of a reflector.
- the sealing part 26 is provided inside the frame 25 .
- the sealing part 26 is provided to cover the inside of the frame 25 . That is, the sealing part 26 is provided inside the frame 25 and covers the light-emitting element 22 , the wiring 21 b , and the like.
- the sealing part 26 can be formed by a material with translucency.
- the sealing part 26 can be formed, for example, by filling the inside of the frame 25 with a resin. The filling with the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser.
- a resin to be filled can be, for example, a silicone resin or the like.
- the sealing part 26 can include a phosphor.
- the phosphor can be, for example, an yttrium-aluminum-garnet-based (YAG-based) phosphor.
- YAG-based yttrium-aluminum-garnet-based
- the type of the phosphor can be changed as appropriate so that a predetermined emission color is obtainable depending on an application or the like of the vehicle luminaire 1 .
- the optical element 27 can be formed by a translucent material.
- the optical element 27 can be formed, for example, by a translucent resin such as a silicone resin, glass, or the like.
- the optical element 27 can be formed, for example, by a mold-forming method or the like.
- the optical element 27 is provided on the sealing part 26 and at least a part of the circumferential edge of the optical element 27 is provided at an end face 25 a of the frame 25 opposite to the board 21 side.
- the optical element 27 can be attached to at least any one of an end face 26 a of the sealing part 26 and the end face 25 a of the frame 25 .
- the optical element 27 for example, diffuses and condenses the light emitted from the light-emitting element 22 .
- the optical element 27 illustrated in FIGS. 1 and 2 is a convex lens.
- the optical element 27 as the convex lens condenses light so that predetermined light distribution characteristics are obtainable.
- the optical element 27 is not limited to the convex lens, and may be, for example, a concave lens or the like. Herein, description will be made using the case of the optical element 27 being the convex lens as an example.
- FIG. 3 is a schematic cross-sectional view for illustrating an optical element 127 according to a comparative example.
- the optical element 127 according to the comparative example is provided inside the frame 25 and on the end face 26 a of the sealing part 26 opposite to the board 21 side.
- positioning of the optical element 127 can be performed by fitting a circumferential edge of the optical element 127 to an opening of the frame 25 .
- a gap S is provided between the circumferential edge of the optical element 127 and the opening of the frame 25 .
- the position of the optical element 127 may vary by the gap S.
- the position of the end face 26 a of the sealing part 26 varies or the end face 26 a is tilted so that the position of the optical element 127 may also vary. If the position of the optical element 127 varies, predetermined light distribution characteristics may not be obtainable. Further, an adhesive for attaching the optical element 127 and the sealing part 26 or a material 26 b of the sealing part 26 before curing may leak through the gap S.
- the adhesive or the material 26 b of the sealing part 26 leaking through the gap S is attached to the circumferential edge or the like of the optical element 127 , the shape of a light-emitting surface of the optical element 127 substantively changes. Thus, predetermined light distribution characteristics may not be obtainable.
- FIG. 4 is a schematic cross-sectional view for illustrating the optical element 27 according to an exemplary embodiment.
- the optical element 27 is provided on the sealing part 26 and at least a part of the circumferential edge is provided at the end face 25 a of the frame 25 opposite to the board 21 side. If the optical element 27 is provided at the end face 25 a of the frame 25 , inclination of the optical element 27 can be suppressed. In addition, positioning of the optical element 27 can be performed using the exterior wall or the like of the frame 25 as a reference. In this case, the optical element 27 can be attached to a predetermined position using a jig or the like. For example, a center axis of the optical element 27 can overlap the center axis of the frame 25 .
- At least a part of the circumferential edge of the optical element 27 may be positioned at the outer side than the opening of the frame 25 .
- at least a part of the circumferential edge of the optical element 27 may be positioned on the inner wall of the frame 25 in planar view (when the light-emitting module 20 is viewed from above).
- at least a part of the circumferential edge of the optical element 27 may be positioned between the inner wall and the exterior wall of the frame 25 in planar view.
- at least a part of the circumferential edge of the optical element 27 may be positioned at the outer side than the exterior wall of the frame 25 in planar view.
- the circumferential edge of the optical element 27 is positioned at the outer side than the inner wall of the frame 25 , it is possible to stabilize the posture or position of the optical element 27 and to increase the contact area.
- the circumferential edge of the optical element 27 is positioned at the outer side than the inner wall of the frame 25 , light directly entering the circumferential edge of the optical element 27 becomes least. Therefore, even if the protruding adhesive or the protruding material 26 b is attached to the circumferential edge of the optical element 27 , changing of the light distribution characteristics can be suppressed.
- optical element 27 With the optical element 27 according to the exemplary embodiment, it becomes easier to obtain predetermined light distribution characteristics.
- FIGS. 5A and 5B are schematic cross-sectional views for illustrating the optical element 27 according to another exemplary embodiment.
- a convex part 27 a (corresponding to an example of the first convex part) projecting toward the sealing part 26 is provided in a center region on the surface of the optical element 27 at the board 21 side.
- the convex part 27 a is provided inside the frame 25 .
- a center axis of the convex part 27 a can overlap the center axis of the optical element 27 .
- the convex part 27 a can be integrally formed with the optical element 27 .
- the thickness of the convex part 27 a gradually decreases toward the circumferential edge of the optical element 27 . That is, the lateral surface of the convex part 27 a is inclined. As illustrated in FIG.
- the shape of the convex part 27 a can be a part of sphere, and as illustrated in FIG. 5B , the shape of the convex part 27 a can be a circular cone. Note that the shape of the convex part 27 a is not limited to the examples as long as the thickness gradually decreases toward the circumferential edge of the optical element 27 .
- the shape of the convex part 27 a can also be a truncated cone, a pyramid, a truncated pyramid, or the like.
- the convex part 27 a If the convex part 27 a is provided, the material 26 b of the sealing part 26 before curing is easy to eject outside the frame 25 . Therefore, when the optical element 27 is pressed against the material 26 b of the sealing part 26 before curing, air caught between the optical element 27 and the material 26 b is easy to discharge. In addition, excessive pressure acting on the light-emitting element 22 or the wiring 21 b can be suppressed.
- FIGS. 6A and 6B are schematic cross-sectional views for illustrating the optical element 27 according to another exemplary embodiment.
- a convex part 27 b (corresponding to an example of the second convex part) projecting toward the board 21 is provided in a circumferential edge region of the surface of the optical element 27 at the board 21 side.
- the convex part 27 b is provided outside the frame 25 .
- the shape of the convex part 27 b can be an annular shape.
- a center axis of the convex part 27 b can overlap the center axis of the optical element 27 ,
- the convex part 27 b can be integrally formed with the optical element 27 .
- the inside dimension of the convex part 27 b can be set to be slightly larger than the outside dimension of the frame 25 . In this way, positioning of the optical element 27 with respect to the frame 25 becomes easier.
- the shape of the convex part 27 b is a straight tube shape, positioning of the optical element 27 becomes easier.
- FIGS. 7A to 7C are schematic cross-sectional views for illustrating the optical element 27 according to another exemplary embodiment.
- a convex part 27 c (corresponding to an example of the third convex part) projecting toward the direction orthogonal to the center axis of the optical element 27 can be provided at the circumferential edge of the optical element 27 .
- a center axis of the convex part 27 c can overlap the center axis of the optical element 27 .
- the convex part 27 c can be integrally formed with the optical element 27 .
- the shape of the convex part 27 c can be an annular shape. If the convex part 27 c is provided, the adhesive or the material 26 b protruding outside the frame 25 is easy to flow to the board 21 side. Therefore, the posture of the optical element 27 can be stabilized.
- a concave part 27 c 1 can be provided on a surface of the convex part 27 c at the board 21 side.
- the convex part may be provided on the surface of the convex part 27 c at the board 21 side.
- the surface of the convex part 27 c at the board 21 side can be an inclined surface 27 c 2 .
- an inclined surface may be inclined in an opposite direction to that illustrated in FIG. 7C .
- the concave part 27 c 1 , the convex part, or the inclined surface 27 c 2 is provided, the adhesive or the material 26 b protruding outside the frame 25 coming around the circumferential edge of the optical element 27 can be suppressed.
- FIG. 8 is a schematic perspective view for illustrating the frame 25 according to another exemplary embodiment.
- a groove 25 b can be provided at the end face 25 a of the frame 25 .
- the groove 25 b opens to the end face 25 a and penetrates between the inner wall and the exterior wall of the frame 25 . It suffices to provide at least one groove 25 b. If the groove 25 b is provided, the excessive adhesive or the excessive material 26 b can be discharged from the lower position than the end face 25 a of the frame 25 to the outside of the frame 25 . Therefore, attachment of the adhesive or the material 26 b to the circumferential edge of the optical element 27 can be suppressed.
- the number, sizes, shapes, arrangement, and the like of the grooves 25 b are not limited to the examples, and can be changed as appropriate.
- a hole 25 c penetrating between the inner wall and the exterior wall of the frame 25 can also be provided near the end face 25 a. If the hole 25 c is provided, the similar effect to that of the groove 25 b can be attained.
- the convex part 27 a, the convex part 27 b, the convex part 27 c , the concave part 27 c 1 , the inclined surface 27 c 2 , the groove 25 b, the hole 25 c, and the like can be combined as appropriate.
- the example described above is an example in which the optical element 27 is molded in advance and the molded optical element 27 is bonded to at least any one of the sealing part 26 and the frame 25 .
- the optical element 27 can also be formed by supplying a resin onto the sealing part 26 .
- a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more can be supplied onto the sealing part 26 and a part of the supplied resin can be provided at the end face 25 a .
- the shape of the supplied resin is a dome shape.
- the sealing part 26 and the optical element 27 can also be continuously formed and the optical element 27 can be formed after curing the material 26 b of the sealing part 26 .
- the supplying of the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser.
- the amount of dimensional change of the optical element 27 in a direction orthogonal to the light-emitting surface of the light-emitting element 22 (the amount of dimensional change of the optical element 27 in a thickness direction) is larger at the circumferential edge side of the optical element 27 than at the center side of the optical element 27 . Therefore, the shape accuracy near the circumferential edge of the optical element 27 is prone to deteriorate. However, if the circumferential edge of the optical element 27 is provided at the end face 25 a of the frame 25 , primary light from the light-emitting element 22 being incident near the circumferential edge of the optical element 27 can be suppressed. Therefore, even if the shape accuracy near the circumferential edge of the optical element 27 slightly deteriorates, predetermined light distribution characteristics are obtainable.
- the optical element 27 is formed by supplying a resin, it is possible to significantly reduce a manufacturing cost.
- the molded optical element 27 it becomes further easier to obtain predetermined light distribution characteristics.
- the socket 10 is formed by an injection molding method, a die casting method, or the like.
- the power-supply part 30 is formed by press-inserting the plurality of power-supply terminals 31 into holes of the insulating part 32 or integrally molding the plurality of power-supply terminals 31 and the insulating part 32 by an insert molding method.
- the light-emitting module 20 is formed.
- the light-emitting element 22 , the resistor 23 , and the control element 24 are sequentially mounted on the board 21 having the wiring pattern 21 a.
- the light-emitting element 22 and the wiring pattern 21 a are electrically connected by a wire bonding method.
- the frame 25 is attached to the board 21 to surround the light-emitting element 22 .
- the sealing part 26 is formed by filling the inside of the frame 25 with a resin.
- the filling with the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser.
- the optical element 27 molded in advance is provided on the sealing part 26 .
- the optical element 27 can be attached to at least any one of the end face 26 a of the sealing part 26 and the end face 25 a of the frame 25 .
- the dome-shape optical element 27 can also be formed by supplying a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more onto the sealing part 26 .
- the sealing part 26 and the optical element 27 can also be continuously formed, and the optical element 27 can be formed after curing the material 26 b of the sealing part 26 .
- the supplying of the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser.
- the power-supply part 30 , the heat transfer part 40 , and the light-emitting module 20 are sequentially assembled in the socket 10 .
- the vehicle luminaire 1 can be manufactured.
- the method for manufacturing a vehicle luminaire according to an exemplary embodiment can include the following steps:
- a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more is supplied, and a part of the supplied resin is provided at the end face 25 a of the frame 25 opposite to the board 21 side.
- the vehicle lamp 100 is a front combination light provided in an automobile.
- the vehicle lamp 100 is not limited to the front combination light provided in the automobile.
- the vehicle lamp 100 may be a vehicle lamp provided in an automobile, a rail vehicle, or the like.
- FIG. 9 is a schematic partial cross-sectional view for illustrating the vehicle lamp 100 .
- the vehicle lamp 100 includes the vehicle luminaire 1 , the housing 101 , a cover 102 , an optical element part 103 , a sealing member 104 , and the connector 105 .
- the vehicle luminaire 1 is attached to the housing 101 .
- the housing 101 holds the mounting part 11 .
- the housing 101 has a box shape in which one end side is opened.
- the housing 101 can be formed, for example, by a resin which does not transmit light, or the like.
- An attachment hole 101 a is provided at the bottom face of the housing 101 .
- a part of the mounting part 11 on which the bayonet 12 is provided is inserted into the attachment hole 101 a.
- a concave part is provided at a circumferential edge of the attachment hole 101 a .
- the bayonet 12 provided at the mounting part 11 is inserted into the concave part. Note that, although the example in which the attachment hole 101 a is provided directly in the housing 101 is described, an attachment member having the attachment hole 101 a may be provided in the housing 101 .
- the cover 102 is provided to cover the opening of the housing 101 .
- the cover 102 can be formed by a resin with translucency, or the like.
- the cover 102 can also have a function of a lens or the like.
- the optical element part 103 reflects, diffuses, guides, and condenses the light emitted from the vehicle luminaire 1 , and forms a predetermined light distribution pattern.
- the optical element part 103 illustrated in FIG. 9 is a reflector.
- the optical element part 103 reflects the light emitted from the vehicle luminaire 1 to form a predetermined light distribution pattern.
- the sealing member 104 is provided between the flange 13 and the housing 101 .
- the sealing member 104 can be formed in an annular shape.
- the sealing member 104 can be formed by a material with elasticity such as rubber or a silicone resin.
- the sealing member 104 When the vehicle luminaire 1 is attached to the vehicle lamp 100 , the sealing member 104 is sandwiched between the flange 13 and the housing 101 . Therefore, an internal space of the housing 101 is sealed by the sealing member 104 . In addition, the bayonet 12 is pressed against the housing 101 by elastomeric force of the sealing member 104 . Therefore, detachment of the vehicle luminaire 1 from the housing 101 can be suppressed.
- the connector 105 is fitted to ends of the plurality of power-supply terminals 31 exposed to the inside of the hole 10 b.
- a power-supply or the like (not illustrated) is electrically connected to the connector 105 . Therefore, by fitting the connector 105 to the ends of the plurality of power-supply terminals 31 , the power-supply or the like (not illustrated) is electrically connected to the light-emitting element 22 .
- the connector 105 has a step portion. Then, the sealing member 105 a is attached to the step portion. The sealing member 105 a is provided to prevent water from infiltrating to the inside of the hole 10 b. When the connector 105 having the sealing member 105 a is inserted into the hole 10 b, the hole 10 b is watertightly sealed.
- the sealing member 105 a can be formed in an annular shape.
- the sealing member 105 a can be formed by a material with elasticity such as rubber or a silicone resin.
- the connector 105 can also be bonded to an element at the socket 10 side, for example, using an adhesive or the like.
Abstract
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2018-033110, filed on Feb. 27, 2018; the entire contents of which are incorporated herein by reference.
- Exemplary embodiments described herein relate to a vehicle luminaire, a vehicle lamp, and a method for manufacturing a vehicle luminaire.
- A vehicle luminaire including a socket and a light-emitting module provided at one end side of the socket is known. The light-emitting module includes a board, a light-emitting diode (LED) provided on the board, a frame surrounding the light-emitting diode, and a sealing part provided inside the frame and covering the light-emitting diode.
- The sealing part is generally formed by filling the inside of the frame with a resin with translucency. In this case, if the surface of the sealing part opposite to the board side is a flat surface, light extracting efficiency may decrease.
- In this regard, a technology of forming the surface of a sealing part opposite to a board side into a curved surface is suggested. However, if the curved surface is simply formed by a resin supplied to the inside of a frame, the shape of the curved surface may vary so that predetermined light distribution characteristics may not be obtainable.
- For this reason, a technology of forming a lens using a mold and bonding the lens onto a sealing part that is the inside of a frame is suggested. However, if the lens is provided inside the frame, a gap needs to be provided between an inner wall of the frame and a circumferential edge of the lens. Therefore, a position of the lens may vary so that predetermined light distribution characteristics may not be obtainable. In addition, the resin for forming the sealing part may leak from the gap between the inner wall of the frame and the circumferential edge of the lens. When the leaked resin is attached to the circumferential edge of the lens, the shape of a light-emitting surface of the lens may substantially change so that predetermined light distribution characteristics may not be obtainable.
- In this regard, there is a demand for development of a technology capable of obtaining predetermined light distribution characteristics.
-
FIG. 1 is a schematic perspective view for illustrating a vehicle luminaire according to an exemplary embodiment; -
FIG. 2 is a cross-sectional view taken along line A-A inFIG. 1 ; -
FIG. 3 is a schematic cross-sectional view for illustrating an optical element according to a comparative example; -
FIG. 4 is a schematic cross-sectional view for illustrating an optical element according to an exemplary embodiment; -
FIGS. 5A and 5B are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment; -
FIGS. 6A and 6B are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment; -
FIGS. 7A to 7C are schematic cross-sectional views for illustrating an optical element according to another exemplary embodiment; -
FIG. 8 is a schematic perspective view for illustrating a frame according to another exemplary embodiment; and -
FIG. 9 is a schematic partial cross-sectional view for illustrating a vehicle lamp. - A vehicle luminaire according to an exemplary embodiment includes: a socket; a board provided at one end side of the socket; at least one light-emitting element provided on the board; a frame provided on the board, having a tube shape, and surrounding the light-emitting element; a sealing part provided inside the frame and covering the light-emitting element; and an optical element provided on the sealing part, at least a part of a circumferential edge being provided at an end face of the frame opposite to the board side.
- Hereinafter, exemplary embodiments will be described with reference to the drawings. Note that identical constituent elements are given the same reference numerals throughout the drawings, and detailed description thereof will be omitted as appropriate.
- (Vehicle Luminaire)
- A vehicle luminaire 1 according to an exemplary embodiment can be provided, for example, in an automobile, a rail vehicle, and the like. As the vehicle luminaire 1 provided in an automobile, for example, those used in a front combination light (for example, one obtained by appropriately combining a daylight running lamp (DRL), a position lamp, a turn signal lamp, and the like), a rear combination light (for example, one obtained by appropriately combining a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, and the like), and the like can be exemplified. However, the application of the vehicle luminaire 1 is not limited thereto.
-
FIG. 1 is a schematic perspective view for illustrating the vehicle luminaire 1 according to the exemplary embodiment. -
FIG. 2 is a cross-sectional view of the vehicle luminaire 1 taken along line A-A inFIG. 1 . - As illustrated in
FIGS. 1 and 2 , the vehicle luminaire 1 includes asocket 10, a light-emitting module 20, a power-supply part 30, and aheat transfer part 40. - The
socket 10 has a mountingpart 11, abayonet 12, aflange 13, and athermal radiation fin 14. - The
mounting part 11 is provided on the surface of theflange 13 opposite to the side at which thethermal radiation fin 14 is provided. The outer shape of themounting part 11 can be a column shape. The outer shape of themounting part 11 is, for example, a cylindrical shape. Themounting part 11 has aconcave part 11 a opened to an end face opposite to theflange 13 side. A light-emitting module 20 is provided at abottom face 11 a 1 of theconcave part 11 a. - At least one
slit 11 b can be provided in themounting part 11. A corner part of theboard 21 is provided inside theslit 11 b. The dimension (width dimension) of theslit 11 b in a circumferential direction of themounting part 11 is slightly larger than the dimension of the corner part of theboard 21. Therefore, positioning of theboard 21 can be performed by inserting the corner part of theboard 21 to the inside of theslit 11 b. - Further, if the
slit 11 b is provided, the planar shape of theboard 21 can be increased. Therefore, the number of elements mounted on theboard 21 can be increased. Alternatively, since the outside dimension of themounting part 11 can be decreased, themounting part 11 can be miniaturized, and further the vehicle luminaire 1 can be miniaturized. - The
bayonet 12 is provided at an outer side surface of themounting part 11. The bayonet 12 projects toward the outside of the vehicle luminaire 1. Thebayonet 12 faces theflange 13. Thebayonet 12 is provided in plural. Thebayonet 12 is used when the vehicle luminaire 1 is mounted in ahousing 101 of avehicle lamp 100. Thebayonet 12 is used for twist lock. - The
flange 13 has a plate shape. Theflange 13 can be formed, for example, in a disk shape. An outer side surface of theflange 13 is positioned at the outer side of the vehicle luminaire 1 than an outer side surface of thebayonet 12. - The
thermal radiation fin 14 is provided at the side of theflange 13 opposite to themounting part 11 side. At least onethermal radiation fin 14 can be provided. A plurality of thermal radiation fins are provided in thesocket 10 illustrated inFIGS. 1 and 2 . The plurality ofthermal radiation fins 14 can be provided side by side in a predetermined direction. Thethermal radiation fin 14 can be formed in a plate shape. - Further, a
hole 10 b into which aconnector 105 is inserted is proved in thesocket 10. - The
connector 105 having a sealingmember 105 a is inserted into thehole 10 b. For this reason, the cross-sectional shape of thehole 10 b is a shape compatible with the cross-sectional shape of theconnector 105 having the sealingmember 105 a. - Heat generated in the light-emitting
module 20 is mainly transferred to thethermal radiation fin 14 through the mountingpart 11 and theflange 13. The heat transferred to thethermal radiation fin 14 is mainly discharged from thethermal radiation fin 14 to the outside. - Therefore, the
socket 10 is preferably formed by a material having a high rate of heat conductivity. For example, thesocket 10 can be formed by a metal such as an aluminum alloy. - Further, in recent years, the
socket 10 can efficiently radiate the heat generated in the light-emittingmodule 20 and is desirably lightweight. - For this reason, the mounting
part 11, thebayonet 12, theflange 13, and thethermal radiation fin 14 are preferably formed by a resin with high heat conductivity. The resin with high heat conductivity includes, for example, a filler formed by a resin and an inorganic material. The resin with high heat conductivity is, for example, a resin obtained by mixing a filler formed by carbon or aluminum oxide with a resin such as polyethylene terephthalate (PET) or nylon. - Further, the mounting
part 11, thebayonet 12, theflange 13, and thethermal radiation fin 14 can be integrally molded with the power-supply part 30 using an insert molding method or the like. - The heat generated in the light-emitting
module 20 can be efficiently radiated using thesocket 10 which contains a resin with high heat conductivity and in which the mountingpart 11, thebayonet 12, theflange 13, and thethermal radiation fin 14 are integrally molded. Further, the weight of thesocket 10 can be decreased. - The power-
supply part 30 has a power-supply terminal 31 and an insulatingpart 32. - The power-
supply terminal 31 can be formed in a rod-shape body. The power-supply terminal 31 projects from thebottom face 11 a 1 of theconcave part 11 a. The power-supply terminal 31 is provided in plural. The plurality of power-supply terminals 31 can be provided side by side in a predetermined direction. The plurality of power-supply terminals 31 are provided inside the insulatingpart 32. The insulatingpart 32 is provided between the power-supply terminal 31 and thesocket 10. The plurality of power-supply terminals 31 extend in the inside of the insulatingpart 32 and project from an end face of the insulatingpart 32 at the light-emittingmodule 20 side and an end face of the insulatingpart 32 at thethermal radiation fin 14 side. Ends of the plurality of power-supply terminals 31 at the light-emittingmodule 20 side are electrically and mechanically connected to awiring pattern 21 a provided on theboard 21. That is, one end of the power-supply terminal 31 is soldered with thewiring pattern 21 a. The ends of the plurality of power-supply terminals 31 at thethermal radiation fin 14 side are exposed to the inside of thehole 10 b. Theconnector 105 is fitted to the plurality of power-supply terminals 31 exposed to the inside of thehole 10 b. The power-supply terminal 31 has electrical conductivity. The power-supply terminal 31 can be formed, for example, by a metal such as a copper alloy. Note that the numbers, shapes, arrangement, materials, and the like of the power-supply terminals 31 are not limited to the example, and can be changed as appropriate. - As described above, the
socket 10 is preferably formed by a material having a high rate of heat conductivity. However, the material having a high rate of heat conductivity has electrical conductivity in some cases. For example, a resin with high heat conductivity containing a metal such as an aluminum alloy or a filler formed by carbon has electrical conductivity. Therefore, the insulatingpart 32 is provided to insulate between the power-supply terminal 31 and thesocket 10 having electrical conductivity. In addition, the insulatingpart 32 also has a function of holding the plurality of power-supply terminals 31. Note that if thesocket 10 is formed by an insulating resin with high heat conductivity (for example, a resin with high heat conductivity containing a filler formed by aluminum oxide, or the like), the insulatingpart 32 may not be provided. In this case, thesocket 10 holds the plurality of power-supply terminals 31. - The insulating
part 32 has insulation property. The insulatingpart 32 can be formed by a resin with insulation property. - Herein, in the case of the vehicle luminaire 1 provided in an automobile, a temperature in usage environment is −40° C. to 85° C. Therefore, a coefficient of thermal expansion of the material of the insulating
part 32 is preferably set to be close to a coefficient of thermal expansion of the material of thesocket 10 as much as possible. In this way, thermal stress generated between the insulatingpart 32 and thesocket 10 can be reduced. For example, the material of the insulatingpart 32 can be a resin with high heat conductivity contained in thesocket 10 or a resin included in the resin with high heat conductivity. - The insulating
part 32 can be, for example, press-inserted into ahole 10 a provided in thesocket 10 or attached to the inner wall of thehole 10 a. In addition, thesocket 10 and the power-supply part 30 can also be integrally molded by an insert molding method. - The
heat transfer part 40 is provided between theboard 21 and thebottom face 11 a 1 of theconcave part 11 a. Theheat transfer part 40 is provided at thebottom face 11 a 1 of theconcave part 11 a through an attachment part. That is, theheat transfer part 40 is attached to thebottom face 11 a 1 of theconcave part 11 a. - An adhesive for attaching the
heat transfer part 40 and thebottom face 11 a 1 of theconcave part 11 a is preferably an adhesive having a high rate of heat conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The inorganic material is preferably a material having a high rate of heat conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). A rate of heat conductivity of the adhesive can be set to, for example, 0.5 W/(m·K) or more and 10 W/(m·K) or less. - Further, the
heat transfer part 40 can also be embedded in thebottom face 11 a 1 of theconcave part 11 a by an insert molding method. In addition, theheat transfer part 40 can also be attached to thebottom face 11 a 1 of theconcave part 11 a through a layer formed by heat conductive grease (thermal radiation grease). The type of heat conductive grease is not particularly limited, and for example, heat conductive grease obtained by mixing a filler using a material having a high rate of heat conductivity (for example, ceramics such as aluminum oxide or aluminum nitride) with modified silicone can be used. A rate of heat conductivity of the heat conductive grease can be set to, for example, 1 W/(m·K) or more and 5 W/(m·K) or less. - The
heat transfer part 40 is provided to facilitate transferring of the heat generated in the light-emittingmodule 20 to thesocket 10. For this reason, theheat transfer part 40 is preferably formed by a material having a high rate of heat conductivity. Theheat transfer part 40 has a plate shape and can be formed, for example, by a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. - The light-emitting
module 20 has theboard 21, a light-emittingelement 22, aresistor 23, acontrol element 24, aframe 25, a sealingpart 26, and anoptical element 27. - The
board 21 is provided at one end side of thesocket 10. Theboard 21 is provided at theheat transfer part 40 through an attachment part. That is, theboard 21 is attached to theheat transfer part 40. An adhesive can be, for example, the same as the adhesive for attaching theheat transfer part 40 and thebottom face 11 a 1 of theconcave part 11 a. - The
board 21 has a plate shape. The planar shape of theboard 21 can be, for example, a square shape. A material or a structure of theboard 21 is not particularly limited. For example, theboard 21 can be formed by an inorganic material such as ceramics (for example, aluminum oxide, aluminum nitride, or the like), an organic material such as paper phenol or glass epoxy, or the like. In addition, theboard 21 may employ a board obtained by coating a surface of a metal plate with an insulating material. Note that if the surface of the metal plate is coated with the insulating material, the insulating material may be formed by an organic material or an inorganic material. If the amount of heat generated in the light-emittingelement 22 is large, theboard 21 is preferably formed using a material having a high rate of heat conductivity from the viewpoint of thermal radiation. As a material having a high rate of heat conductivity, for example, ceramics such as aluminum oxide or aluminum nitride, a resin with high heat conductivity, a material obtained by coating a surface of a metal plate with an insulating material, and the like can be exemplified. In addition, theboard 21 may be formed of a single layer or multiple layers. - Further, the
wiring pattern 21 a is provided on a surface of theboard 21. Thewiring pattern 21 a can be formed, for example, by a material containing silver as a main component. Thewiring pattern 21 a can be formed, for example, by silver or a silver alloy. However, the material of thewiring pattern 21 a is not limited to the material containing silver as a main component. Thewiring pattern 21 a can also be formed, for example, by a material containing copper as a main component. - The light-emitting
element 22 is provided at the side of theboard 21 opposite to thebottom face 11 a 1 side of theconcave part 11 a. The light-emittingelement 22 is provided on theboard 21. The light-emittingelement 22 is electrically connected to thewiring pattern 21 a provided on the surface of theboard 21. The light-emittingelement 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like. At least one light-emittingelement 22 can be provided. If a plurality of light-emittingelements 22 are provided, the plurality of light-emittingelements 22 can be connected in series to each other. In addition, the light-emittingelement 22 is connected in series to theresistor 23. - The light-emitting
element 22 can be a chip-shape light-emitting element. The chip-shape light-emittingelement 22 can be mounted by a chip on board (COB). In this manner, a large number of light-emittingelements 22 can be provided in a narrow region. Therefore, the light-emittingmodule 20 can be miniaturized, and further the vehicle luminaire 1 can be miniaturized. The chip-shape light-emittingelement 22 can be, for example, an upper electrode type light-emitting element, a top-and-bottom electrode type light-emitting element, a flip chip type light-emitting element, or the like. The light-emittingelement 22 illustrated inFIGS. 1 and 2 is a top-and-bottom electrode type light-emitting element. An electrode of the upper electrode type light-emitting element or an upper electrode of the top-and-bottom electrode type light-emitting element can be electrically connected to thewiring pattern 21 a by awiring 21 b. The light-emittingelement 22 and thewiring pattern 21 a can be electrically connected, for example, by a wire bonding method. The flip chip type light-emittingelement 22 can be mounted directly on thewiring pattern 21 a. - The
resistor 23 is provided at the side of theboard 21 opposite to thebottom face 11 a 1 side of theconcave part 11 a. Theresistor 23 is provided on theboard 21. Theresistor 23 is electrically connected to thewiring pattern 21 a provided on the surface of theboard 21. Theresistor 23 can be, for example, a resistor such as a surface mount type resistor, a resistor having a lead wire (metal oxide film resistor), or a film type resistor formed by a screen printing method or the like. Note that theresistor 23 illustrated inFIG. 1 is a film type resistor. - A material for the film type resistor can be, for example, ruthenium oxide (RuO2). The film type resistor can be formed, for example, by a screen printing method and a calcination method. If the
resistor 23 is the film type resistor, it is possible to increase a contact area between theresistor 23 and theboard 21. This makes it possible to improve heat-dissipation capability. In addition, a plurality ofresistors 23 can be formed at once. Therefore, it is possible to improve productivity and suppress variation in resistance value in the plurality ofresistors 23. - Here, since a forward voltage characteristic of the light-emitting
element 22 varies, if an applied voltage between an anode terminal and a ground terminal is constant, variation occurs in brightness (light flux, luminance, luminous intensity, or illuminance) of light emitted from the light-emittingelement 22. Therefore, a value of current flowing through the light-emittingelement 22 is set within a predetermined range by theresistor 23 so that the brightness of the light emitted from the light-emittingelement 22 falls within a predetermined range. In this case, the value of current flowing through the light-emittingelement 22 falls within the predetermined range by changing a resistance value of theresistor 23. - If the
resistor 23 is a surface mount type resistor, a resistor having a lead wire, or the like, theresistor 23 having an appropriate resistance value is selected depending on the forward voltage characteristic of the light-emittingelement 22. If theresistor 23 is a film type resistor, when a part of theresistor 23 is removed, the resistance value can be increased. For example, a part of theresistor 23 can be easily removed by irradiating theresistor 23 with laser light. The number, sizes, arrangement, and the like of theresistors 23 are not limited to the examples, and can be changed as appropriate depending on the number, specification, and the like of the light-emittingelements 22. - The
control element 24 is provided at the side of theboard 21 opposite to thebottom face 11 a 1 side of theconcave part 11 a. Thecontrol element 24 is provided on theboard 21. Thecontrol element 24 is electrically connected to thewiring pattern 21 a provided on the surface of theboard 21. Thecontrol element 24 is provided so that a reverse voltage is not applied to the light-emittingelement 22 and pulse noise from a reverse direction is not applied to the light-emittingelement 22. - The
control element 24 can be, for example, a diode. Thecontrol element 24 can be, for example, a surface mount type diode, a diode having a lead wire, or the like. Thecontrol element 24 illustrated inFIG. 1 is a surface mount type diode. - In addition, a pull-down resistor can also be provided to detect disconnection of the light-emitting
element 22 or to prevent the light-emittingelement 22 from being wrongly turned on. Further, a coating part covering thewiring pattern 21 a, the film type resistor, or the like can also be provided. The coating part can contain, for example, a glass material. - The
frame 25 is provided at the side of theboard 21 opposite to thebottom face 11 a 1 side of theconcave part 11 a. Theframe 25 is provided on theboard 21. Theframe 25 is attached to theboard 21. Theframe 25 has a tube shape and has the light-emittingelement 22 disposed inside. For example, theframe 25 surrounds the plurality of light-emittingelements 22. Theframe 25 can be formed by a resin. The resin can be, for example, a thermoplastic resin such as polybutylene terephthalate (PBT), polycarbonate (PC), PET, nylon, polypropylene (PP), polyethylene (PE), or polystyrene (PS). - Further, particles of titanium oxide or the like are mixed with the resin so that the reflectance of light emitted from the light-emitting
element 22 can be increased. Note that a mixed material is not limited to particles of titanium oxide, and may be particles of a material having a high reflectance of the light emitted from the light-emittingelement 22. In addition, theframe 25 can also be formed, for example, by a white resin - An inner wall surface of the
frame 25 is a slope inclined in a direction away from a center axis of theframe 25 with increasing distance from theboard 21. Therefore, some of the light emitted from the light-emittingelement 22 is reflected at the inner wall surface of theframe 25 and is emitted toward the front side of the vehicle luminaire 1. That is, theframe 25 can have a function of defining a formation range of the sealingpart 26 and a function of a reflector. - The sealing
part 26 is provided inside theframe 25. The sealingpart 26 is provided to cover the inside of theframe 25. That is, the sealingpart 26 is provided inside theframe 25 and covers the light-emittingelement 22, thewiring 21 b, and the like. The sealingpart 26 can be formed by a material with translucency. The sealingpart 26 can be formed, for example, by filling the inside of theframe 25 with a resin. The filling with the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser. A resin to be filled can be, for example, a silicone resin or the like. - Further, the sealing
part 26 can include a phosphor. The phosphor can be, for example, an yttrium-aluminum-garnet-based (YAG-based) phosphor. However, the type of the phosphor can be changed as appropriate so that a predetermined emission color is obtainable depending on an application or the like of the vehicle luminaire 1. - The
optical element 27 can be formed by a translucent material. Theoptical element 27 can be formed, for example, by a translucent resin such as a silicone resin, glass, or the like. Theoptical element 27 can be formed, for example, by a mold-forming method or the like. - The
optical element 27 is provided on the sealingpart 26 and at least a part of the circumferential edge of theoptical element 27 is provided at anend face 25 a of theframe 25 opposite to theboard 21 side. Theoptical element 27 can be attached to at least any one of anend face 26 a of the sealingpart 26 and the end face 25 a of theframe 25. Theoptical element 27, for example, diffuses and condenses the light emitted from the light-emittingelement 22. Theoptical element 27 illustrated inFIGS. 1 and 2 is a convex lens. Theoptical element 27 as the convex lens condenses light so that predetermined light distribution characteristics are obtainable. Note that theoptical element 27 is not limited to the convex lens, and may be, for example, a concave lens or the like. Herein, description will be made using the case of theoptical element 27 being the convex lens as an example. -
FIG. 3 is a schematic cross-sectional view for illustrating anoptical element 127 according to a comparative example. - As illustrated in
FIG. 3 , theoptical element 127 according to the comparative example is provided inside theframe 25 and on the end face 26 a of the sealingpart 26 opposite to theboard 21 side. - In this case, positioning of the
optical element 127 can be performed by fitting a circumferential edge of theoptical element 127 to an opening of theframe 25. However, practically, since a production error occurs in dimensions of theframe 25 and theoptical element 127, the fitting of the circumferential edge of theoptical element 127 to the opening of theframe 25 is difficult. Therefore, as illustrated inFIG. 3 , a gap S is provided between the circumferential edge of theoptical element 127 and the opening of theframe 25. - However, if the gap S is provided, as illustrated in
FIG. 3 , the position of theoptical element 127 may vary by the gap S. In addition, the position of the end face 26 a of the sealingpart 26 varies or the end face 26 a is tilted so that the position of theoptical element 127 may also vary. If the position of theoptical element 127 varies, predetermined light distribution characteristics may not be obtainable. Further, an adhesive for attaching theoptical element 127 and the sealingpart 26 or a material 26 b of the sealingpart 26 before curing may leak through the gap S. If the adhesive or the material 26 b of the sealingpart 26 leaking through the gap S is attached to the circumferential edge or the like of theoptical element 127, the shape of a light-emitting surface of theoptical element 127 substantively changes. Thus, predetermined light distribution characteristics may not be obtainable. -
FIG. 4 is a schematic cross-sectional view for illustrating theoptical element 27 according to an exemplary embodiment. - As illustrated in
FIG. 4 , theoptical element 27 is provided on the sealingpart 26 and at least a part of the circumferential edge is provided at the end face 25 a of theframe 25 opposite to theboard 21 side. If theoptical element 27 is provided at the end face 25 a of theframe 25, inclination of theoptical element 27 can be suppressed. In addition, positioning of theoptical element 27 can be performed using the exterior wall or the like of theframe 25 as a reference. In this case, theoptical element 27 can be attached to a predetermined position using a jig or the like. For example, a center axis of theoptical element 27 can overlap the center axis of theframe 25. - As illustrated in
FIG. 4 , at least a part of the circumferential edge of theoptical element 27 may be positioned at the outer side than the opening of theframe 25. For example, at least a part of the circumferential edge of theoptical element 27 may be positioned on the inner wall of theframe 25 in planar view (when the light-emittingmodule 20 is viewed from above). In addition, at least a part of the circumferential edge of theoptical element 27 may be positioned between the inner wall and the exterior wall of theframe 25 in planar view. Further, at least a part of the circumferential edge of theoptical element 27 may be positioned at the outer side than the exterior wall of theframe 25 in planar view. - In this case, if the circumferential edge of the
optical element 27 is positioned at the outer side than the inner wall of theframe 25, it is possible to stabilize the posture or position of theoptical element 27 and to increase the contact area. - Herein, if the circumferential edge of the
optical element 27 is positioned at the outer side than the inner wall of theframe 25, light directly entering the circumferential edge of theoptical element 27 becomes least. Therefore, even if the protruding adhesive or the protrudingmaterial 26 b is attached to the circumferential edge of theoptical element 27, changing of the light distribution characteristics can be suppressed. - In this case, if the circumferential edge of the
optical element 27 is positioned at the outer side than the exterior wall of theframe 25, the adhesive or the material 26 b protruding outside theframe 25 is easy to flow to theboard 21 side. Therefore, attachment of the adhesive or the material 26 b to the circumferential edge of theoptical element 27 can be suppressed. - With the
optical element 27 according to the exemplary embodiment, it becomes easier to obtain predetermined light distribution characteristics. -
FIGS. 5A and 5B are schematic cross-sectional views for illustrating theoptical element 27 according to another exemplary embodiment. - As illustrated in
FIGS. 5A and 5B , aconvex part 27 a (corresponding to an example of the first convex part) projecting toward the sealingpart 26 is provided in a center region on the surface of theoptical element 27 at theboard 21 side. Theconvex part 27 a is provided inside theframe 25. A center axis of theconvex part 27 a can overlap the center axis of theoptical element 27. Theconvex part 27 a can be integrally formed with theoptical element 27. The thickness of theconvex part 27 a gradually decreases toward the circumferential edge of theoptical element 27. That is, the lateral surface of theconvex part 27 a is inclined. As illustrated inFIG. 5A , the shape of theconvex part 27 a can be a part of sphere, and as illustrated inFIG. 5B , the shape of theconvex part 27 a can be a circular cone. Note that the shape of theconvex part 27 a is not limited to the examples as long as the thickness gradually decreases toward the circumferential edge of theoptical element 27. For example, the shape of theconvex part 27 a can also be a truncated cone, a pyramid, a truncated pyramid, or the like. - If the
convex part 27 a is provided, thematerial 26 b of the sealingpart 26 before curing is easy to eject outside theframe 25. Therefore, when theoptical element 27 is pressed against the material 26 b of the sealingpart 26 before curing, air caught between theoptical element 27 and the material 26 b is easy to discharge. In addition, excessive pressure acting on the light-emittingelement 22 or thewiring 21 b can be suppressed. -
FIGS. 6A and 6B are schematic cross-sectional views for illustrating theoptical element 27 according to another exemplary embodiment. - As illustrated in
FIGS. 6A and 6B , aconvex part 27 b (corresponding to an example of the second convex part) projecting toward theboard 21 is provided in a circumferential edge region of the surface of theoptical element 27 at theboard 21 side. Theconvex part 27 b is provided outside theframe 25. The shape of theconvex part 27 b can be an annular shape. A center axis of theconvex part 27 b can overlap the center axis of theoptical element 27, Theconvex part 27 b can be integrally formed with theoptical element 27. The inside dimension of theconvex part 27 b can be set to be slightly larger than the outside dimension of theframe 25. In this way, positioning of theoptical element 27 with respect to theframe 25 becomes easier. - As illustrated in
FIG. 6A , if the shape of theconvex part 27 b is a straight tube shape, positioning of theoptical element 27 becomes easier. - As illustrated in
FIG. 6B , if the inside dimension of theconvex part 27 b in a direction orthogonal to the center axis of theoptical element 27 increases toward the circumferential edge of theoptical element 27, the adhesive or the material 26 b protruding outside theframe 25 is easy to flow to theboard 21 side. Therefore, attachment of the adhesive or the material 26 b to the circumferential edge of theoptical element 27 can be suppressed. -
FIGS. 7A to 7C are schematic cross-sectional views for illustrating theoptical element 27 according to another exemplary embodiment. - As illustrated in
FIGS. 7A to 7C , aconvex part 27 c (corresponding to an example of the third convex part) projecting toward the direction orthogonal to the center axis of theoptical element 27 can be provided at the circumferential edge of theoptical element 27. - A center axis of the
convex part 27 c can overlap the center axis of theoptical element 27. Theconvex part 27 c can be integrally formed with theoptical element 27. The shape of theconvex part 27 c can be an annular shape. If theconvex part 27 c is provided, the adhesive or the material 26 b protruding outside theframe 25 is easy to flow to theboard 21 side. Therefore, the posture of theoptical element 27 can be stabilized. - As illustrated in
FIG. 7B , aconcave part 27 c 1 can be provided on a surface of theconvex part 27 c at theboard 21 side. Note that the convex part may be provided on the surface of theconvex part 27 c at theboard 21 side. - As illustrated in
FIG. 7C , the surface of theconvex part 27 c at theboard 21 side can be aninclined surface 27 c 2. Note that an inclined surface may be inclined in an opposite direction to that illustrated inFIG. 7C . - If the
concave part 27 c 1, the convex part, or theinclined surface 27 c 2 is provided, the adhesive or the material 26 b protruding outside theframe 25 coming around the circumferential edge of theoptical element 27 can be suppressed. -
FIG. 8 is a schematic perspective view for illustrating theframe 25 according to another exemplary embodiment. - As illustrated in
FIG. 8 , agroove 25 b can be provided at the end face 25 a of theframe 25. Thegroove 25 b opens to the end face 25 a and penetrates between the inner wall and the exterior wall of theframe 25. It suffices to provide at least onegroove 25 b. If thegroove 25 b is provided, the excessive adhesive or theexcessive material 26 b can be discharged from the lower position than the end face 25 a of theframe 25 to the outside of theframe 25. Therefore, attachment of the adhesive or the material 26 b to the circumferential edge of theoptical element 27 can be suppressed. - The number, sizes, shapes, arrangement, and the like of the
grooves 25 b are not limited to the examples, and can be changed as appropriate. - Further, a
hole 25 c penetrating between the inner wall and the exterior wall of theframe 25 can also be provided near the end face 25 a. If thehole 25 c is provided, the similar effect to that of thegroove 25 b can be attained. - The respective elements described above, for example, the
convex part 27 a, theconvex part 27 b, theconvex part 27 c, theconcave part 27 c 1, theinclined surface 27 c 2, thegroove 25 b, thehole 25 c, and the like can be combined as appropriate. - The example described above is an example in which the
optical element 27 is molded in advance and the moldedoptical element 27 is bonded to at least any one of the sealingpart 26 and theframe 25. - The
optical element 27 can also be formed by supplying a resin onto the sealingpart 26. For example, a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more (for example, a silicone resin) can be supplied onto the sealingpart 26 and a part of the supplied resin can be provided at the end face 25 a. In this case, the shape of the supplied resin is a dome shape. In addition, the sealingpart 26 and theoptical element 27 can also be continuously formed and theoptical element 27 can be formed after curing the material 26 b of the sealingpart 26. The supplying of the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser. - The amount of dimensional change of the
optical element 27 in a direction orthogonal to the light-emitting surface of the light-emitting element 22 (the amount of dimensional change of theoptical element 27 in a thickness direction) is larger at the circumferential edge side of theoptical element 27 than at the center side of theoptical element 27. Therefore, the shape accuracy near the circumferential edge of theoptical element 27 is prone to deteriorate. However, if the circumferential edge of theoptical element 27 is provided at the end face 25 a of theframe 25, primary light from the light-emittingelement 22 being incident near the circumferential edge of theoptical element 27 can be suppressed. Therefore, even if the shape accuracy near the circumferential edge of theoptical element 27 slightly deteriorates, predetermined light distribution characteristics are obtainable. - If the
optical element 27 is formed by supplying a resin, it is possible to significantly reduce a manufacturing cost. - However, if the molded
optical element 27 is used, it becomes further easier to obtain predetermined light distribution characteristics. - (Method for Manufacturing Vehicle Luminaire)
- Next, a method for manufacturing a vehicle luminaire will be described.
- The
socket 10 is formed by an injection molding method, a die casting method, or the like. - The power-
supply part 30 is formed by press-inserting the plurality of power-supply terminals 31 into holes of the insulatingpart 32 or integrally molding the plurality of power-supply terminals 31 and the insulatingpart 32 by an insert molding method. - Further, the light-emitting
module 20 is formed. - First, the light-emitting
element 22, theresistor 23, and thecontrol element 24 are sequentially mounted on theboard 21 having thewiring pattern 21 a. - Subsequently, the light-emitting
element 22 and thewiring pattern 21 a are electrically connected by a wire bonding method. - Subsequently, the
frame 25 is attached to theboard 21 to surround the light-emittingelement 22. - Subsequently, the sealing
part 26 is formed by filling the inside of theframe 25 with a resin. The filling with the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser. - Subsequently, the
optical element 27 molded in advance is provided on the sealingpart 26. Theoptical element 27 can be attached to at least any one of the end face 26 a of the sealingpart 26 and the end face 25 a of theframe 25. - Further, the dome-shape
optical element 27 can also be formed by supplying a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more onto the sealingpart 26. In this case, the sealingpart 26 and theoptical element 27 can also be continuously formed, and theoptical element 27 can be formed after curing the material 26 b of the sealingpart 26. The supplying of the resin can be performed, for example, using a liquid quantitative ejecting device such as a dispenser. - Next, the power-
supply part 30, theheat transfer part 40, and the light-emittingmodule 20 are sequentially assembled in thesocket 10. - In this way, the vehicle luminaire 1 can be manufactured.
- As described above, the method for manufacturing a vehicle luminaire according to an exemplary embodiment can include the following steps:
- a step of providing at least one light-emitting
element 22 and theframe 25 surrounding the light-emittingelement 22 on theboard 21; - a step of forming the sealing
part 26 covering the light-emittingelement 22 by filling the inside of theframe 25 with a resin; and - a step of forming the
optical element 27 by supplying a resin onto the sealingpart 26. - Further, in the step of forming the optical element, a resin having a thixotropic ratio (3 rpm/30 rpm) of 4 or more is supplied, and a part of the supplied resin is provided at the end face 25 a of the
frame 25 opposite to theboard 21 side. - (Vehicle Lamp)
- Next, the
vehicle lamp 100 will be illustrated. - Note that, in the following description, for example, description will be given using an example in which the
vehicle lamp 100 is a front combination light provided in an automobile. However, thevehicle lamp 100 is not limited to the front combination light provided in the automobile. Thevehicle lamp 100 may be a vehicle lamp provided in an automobile, a rail vehicle, or the like. -
FIG. 9 is a schematic partial cross-sectional view for illustrating thevehicle lamp 100. - As illustrated in
FIG. 9 , thevehicle lamp 100 includes the vehicle luminaire 1, thehousing 101, acover 102, anoptical element part 103, a sealingmember 104, and theconnector 105. - The vehicle luminaire 1 is attached to the
housing 101. Thehousing 101 holds the mountingpart 11. Thehousing 101 has a box shape in which one end side is opened. Thehousing 101 can be formed, for example, by a resin which does not transmit light, or the like. Anattachment hole 101 a is provided at the bottom face of thehousing 101. A part of the mountingpart 11 on which thebayonet 12 is provided is inserted into theattachment hole 101 a. A concave part is provided at a circumferential edge of theattachment hole 101 a. Thebayonet 12 provided at the mountingpart 11 is inserted into the concave part. Note that, although the example in which theattachment hole 101 a is provided directly in thehousing 101 is described, an attachment member having theattachment hole 101 a may be provided in thehousing 101. - When the vehicle luminaire 1 is attached to the
vehicle lamp 100, the part of the mountingpart 11 on which thebayonet 12 is provided is inserted into theattachment hole 101 a and the vehicle luminaire 1 is rotated. In this way, thebayonet 12 is held at the concave part provided at the circumferential edge of theattachment hole 101 a. Such an attachment method is called twist lock. - The
cover 102 is provided to cover the opening of thehousing 101. Thecover 102 can be formed by a resin with translucency, or the like. Thecover 102 can also have a function of a lens or the like. - Light emitted from the vehicle luminaire 1 enters the
optical element part 103. Theoptical element part 103, for example, reflects, diffuses, guides, and condenses the light emitted from the vehicle luminaire 1, and forms a predetermined light distribution pattern. - For example, the
optical element part 103 illustrated inFIG. 9 is a reflector. In this case, theoptical element part 103 reflects the light emitted from the vehicle luminaire 1 to form a predetermined light distribution pattern. - The sealing
member 104 is provided between theflange 13 and thehousing 101. The sealingmember 104 can be formed in an annular shape. The sealingmember 104 can be formed by a material with elasticity such as rubber or a silicone resin. - When the vehicle luminaire 1 is attached to the
vehicle lamp 100, the sealingmember 104 is sandwiched between theflange 13 and thehousing 101. Therefore, an internal space of thehousing 101 is sealed by the sealingmember 104. In addition, thebayonet 12 is pressed against thehousing 101 by elastomeric force of the sealingmember 104. Therefore, detachment of the vehicle luminaire 1 from thehousing 101 can be suppressed. - The
connector 105 is fitted to ends of the plurality of power-supply terminals 31 exposed to the inside of thehole 10 b. A power-supply or the like (not illustrated) is electrically connected to theconnector 105. Therefore, by fitting theconnector 105 to the ends of the plurality of power-supply terminals 31, the power-supply or the like (not illustrated) is electrically connected to the light-emittingelement 22. - Further, the
connector 105 has a step portion. Then, the sealingmember 105 a is attached to the step portion. The sealingmember 105 a is provided to prevent water from infiltrating to the inside of thehole 10 b. When theconnector 105 having the sealingmember 105 a is inserted into thehole 10 b, thehole 10 b is watertightly sealed. - The sealing
member 105 a can be formed in an annular shape. The sealingmember 105 a can be formed by a material with elasticity such as rubber or a silicone resin. Theconnector 105 can also be bonded to an element at thesocket 10 side, for example, using an adhesive or the like. - While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions. Moreover, above-mentioned embodiments can be combined mutually and can be carried out.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2018033110A JP6944660B2 (en) | 2018-02-27 | 2018-02-27 | Vehicle lighting equipment and vehicle lighting equipment |
JP2018-033110 | 2018-02-27 |
Publications (1)
Publication Number | Publication Date |
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US20190267518A1 true US20190267518A1 (en) | 2019-08-29 |
Family
ID=63014355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US16/045,807 Abandoned US20190267518A1 (en) | 2018-02-27 | 2018-07-26 | Vehicle Luminaire, Vehicle Lamp, and Method for Manufacturing Vehicle Luminaire |
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Country | Link |
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US (1) | US20190267518A1 (en) |
EP (1) | EP3531014A1 (en) |
JP (1) | JP6944660B2 (en) |
CN (1) | CN208750635U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US10845018B1 (en) | 2019-05-29 | 2020-11-24 | Toshiba Lighting & Technology Corporation | Vehicle luminaire and vehicle lamp |
US11028991B1 (en) * | 2019-11-28 | 2021-06-08 | Toshiba Lighting & Technology Corporation | Vehicle lighting device and vehicle lamp |
US11473751B2 (en) * | 2020-10-27 | 2022-10-18 | Toshiba Lighting & Technology Corporation | Vehicle luminaire and vehicle lighting tool |
US11640038B2 (en) * | 2018-08-31 | 2023-05-02 | Nichia Corporation | Lens, light emitting device and method of manufacturing the lens and the light emitting device |
US11644635B2 (en) | 2018-08-31 | 2023-05-09 | Nichia Corporation | Lens, light emitting device and method of manufacturing the lens and the light emitting device |
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JP7209222B2 (en) * | 2019-06-11 | 2023-01-20 | 東芝ライテック株式会社 | Vehicle lighting device and vehicle lamp |
JP7385444B2 (en) | 2019-11-25 | 2023-11-22 | 株式会社小糸製作所 | Light source unit and vehicle lamp equipped with the same |
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Also Published As
Publication number | Publication date |
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CN208750635U (en) | 2019-04-16 |
EP3531014A1 (en) | 2019-08-28 |
JP2019149282A (en) | 2019-09-05 |
JP6944660B2 (en) | 2021-10-06 |
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