US20190210184A1 - Split-window CMP polishing pad and preparation method thereof - Google Patents

Split-window CMP polishing pad and preparation method thereof Download PDF

Info

Publication number
US20190210184A1
US20190210184A1 US16/358,033 US201916358033A US2019210184A1 US 20190210184 A1 US20190210184 A1 US 20190210184A1 US 201916358033 A US201916358033 A US 201916358033A US 2019210184 A1 US2019210184 A1 US 2019210184A1
Authority
US
United States
Prior art keywords
window
backing
substrate
adhesive
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/358,033
Other languages
English (en)
Inventor
Siqi Song
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Times Live Science And Technology Co Ltd
Original Assignee
Chengdu Times Live Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Times Live Science And Technology Co Ltd filed Critical Chengdu Times Live Science And Technology Co Ltd
Publication of US20190210184A1 publication Critical patent/US20190210184A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing

Definitions

  • the present invention relates to the field of chemical mechanical polishing (CMP), and more particularly to a split-window CMP polishing pad and a preparation method thereof.
  • CMP chemical mechanical polishing
  • CMP refers to chemical mechanical polishing. It basic principle is as follows. A rotated wafer to be polished is pressed on an elastic polishing pad rotating in a same direction with the rotated wafer, and the polishing slurry continuously flows between the wafer and a bottom plate; the upper and lower plates are reversely rotated at high speed, the reaction product on the surface of the wafer to be polished is continuously peeled off, the new polishing slurry is replenished, and the reaction product is taken away with the polishing slurry; the newly exposed surface of the wafer undergoes a chemical reaction, and the product is peeled off again and recycled, so that a super-precision surface is formed under the combined action of the substrate, abrasive particles and chemical reactants.
  • a complete polishing pad comprises a backing, an adhesive and a substrate from top to bottom, wherein the backing is the part that is in contact with the wafer and mainly for grinding and polishing; the adhesive is adapted for bonding the backing with the substrate; and the substrate plays a support role.
  • a groove is usually engraved on the backing to store the polishing liquid; and at the same time, voids of the backing itself also store the polishing liquid and the abrasive particles, increasing the contact time and area of the abrasive particles with the wafer.
  • a sliced integrated-window polishing pad produced by Dow, USA.
  • the sliced integrated-window is the main product of the Dow, USA. Its preparation method includes placing a pre-formed columnar window structure into a columnar mold and fixing, injecting a prepared polyurethane into the mold, and slicing an integrally formed columnar backing into a plurality of sheets after a whole is cured, so that the sliced integrated-window is formed.
  • Its preparation method includes placing a pre-formed columnar window structure into a columnar mold and fixing, injecting a prepared polyurethane into the mold, and slicing an integrally formed columnar backing into a plurality of sheets after a whole is cured, so that the sliced integrated-window is formed.
  • temperature unevenness may occur, so that the local properties of the cured backing may be different.
  • uneven temperature affects the degree of cross-linking, which is manifested as fluctuations in tensile strength; the prepolymer of the mixed filler has a large viscosity and poor fluidity, only can slowly flow in the columnar mold, and the density after curing is not uniform, thereby generating a large amount of substandard waste; the uneven density will also affect the storage of the polishing liquid during the use of the backing, thereby affecting the polishing efficiency and the degree of flattening; the integrally formed columnar window is unstable in the mold, and there is also a window offset, which affects the infrared penetration window when counting.
  • An object of the present invention is to provide a split-window CMP (chemical mechanical polishing) polishing pad and a preparation method thereof, both of which solve problems that a sliced integrated-window backing has uneven temperature during curing, which causes fluctuation of a tensile strength of the backing, and a density of the backing is not uniform and a scrap rate thereof is high after curing.
  • CMP chemical mechanical polishing
  • the present invention provides technical solutions as follows.
  • a preparation method of a split-window CMP (chemical mechanical polishing) polishing pad comprises steps of:
  • the window portion is oval with a long side in a range of 35 to 41 mm, an arc radius in a range of 8.6 to 10.6 mm, and a distance between a center of the window portion and a center of the backing in a range of 98.5 to 104.5 mm.
  • the window portion has the long side of 38 mm, the arc radius of 9.5 mm, and the distance between the center of the window portion and the center of the backing of 101.5 mm.
  • the substrate punching mold is oval, wherein a diameter of the hole is 2.7-3.3 mm smaller than a window size of the window portion.
  • a size of the window punching mold is as same as that of the window portion.
  • the primer is Primer 94 .
  • a CMP (chemical mechanical polishing) polishing pad comprises a backing, a substrate, a first adhesive and a second adhesive, wherein: multiple grooves are provided on the backing, the backing comprises a window portion which defines a window, the substrate has a hole, a window material is accommodated within the window portion, and two window support blocks are respectively located at two sides of a bottom of the window portion.
  • both the window and the hole have a same hole center, and a diameter of the hole is smaller than that of the window.
  • the diameter of the hole is 2.7-3.3 mm smaller than that of the window.
  • the two window support blocks are centrally symmetrically distributed to each other relatively to the window and the hole.
  • the present invention has some beneficially effects as follows.
  • the backing and the window material of the present invention are separately manufactured, and the materials do not affect each other during the manufacturing process, so that the problem of uneven density distribution of the backing after curing can be solved, and the fluctuation of the tensile strength caused by uneven temperature is reduced.
  • FIG. 1 is a location diagram of a window of a CMP polishing pad provided by the present invention.
  • FIG. 2 shows a shape of the window of the CMP polishing pad provided by the present invention.
  • FIG. 3 is a side view of the CMP polishing pad provided by the present invention.
  • FIG. 4 is a tensile strength fluctuation comparison chart of a split-window backing provided by the present invention and an integrated-window backing.
  • FIG. 5 is a density fluctuation comparison chart of the split-window backing provided by the present invention and the integrated-window backing.
  • FIG. 6 is a scrap rate comparison chart of the split-window backing provided by the present invention and the integrated-window backing.
  • a preparation method of a split-window CMP (chemical mechanical polishing) polishing pad comprises steps of:
  • the window portion 2 is oval with a long side of 35 mm, an arc radius of 8.6 mm, and a distance between a center of the window portion and a center of the backing 1 of 98.5 mm.
  • the substrate punching mold is oval, wherein a diameter of the hole is 2.7 mm smaller than a window size of the window portion 2 .
  • a size of the window punching mold is as same as that of the window portion 2 .
  • the primer is Primer 94 .
  • a CMP (chemical mechanical polishing) polishing pad comprises a backing 1 , a substrate 4 , a first adhesive 9 and a second adhesive 3 , wherein: multiple grooves 6 are provided on the backing 1 , the backing 1 comprises a window portion 2 which defines a window, the substrate 4 has a hole 5 , a window material 8 is accommodated within the window portion 2 , and two window support blocks 7 are respectively located at two sides of a bottom of the window portion 2 .
  • both the window and the hole 5 have a same hole center, and a diameter of the hole 5 is smaller than that of the window.
  • the diameter of the hole 5 is 2.7 mm smaller than that of the window.
  • the two window support blocks 7 are centrally symmetrically distributed to each other relatively to the window and the hole 5 .
  • a preparation method of a split-window CMP (chemical mechanical polishing) polishing pad comprises steps of:
  • the window portion 2 is oval with a long side of 38 mm, an arc radius of 9.5 mm, and a distance between a center of the window portion and a center of the backing 1 of 101.5 mm.
  • the substrate punching mold is oval, wherein a diameter of the hole is 3.0 mm smaller than a window size of the window portion 2 .
  • a size of the window punching mold is as same as that of the window portion 2 .
  • the primer is Primer 94 .
  • a CMP (chemical mechanical polishing) polishing pad comprises a backing 1 , a substrate 4 , a first adhesive 9 and a second adhesive 3 , wherein: multiple grooves 6 are provided on the backing 1 , the backing 1 comprises a window portion 2 which defines a window, the substrate 4 has a hole 5 , a window material 8 is accommodated within the window portion 2 , and two window support blocks 7 are respectively located at two sides of a bottom of the window portion 2 .
  • both the window and the hole 5 have a same hole center, and a diameter of the hole 5 is smaller than that of the window.
  • the diameter of the hole 5 is 3.0 mm smaller than that of the window.
  • the two window support blocks 7 are centrally symmetrically distributed to each other relatively to the window and the hole 5 .
  • a preparation method of a split-window CMP (chemical mechanical polishing) polishing pad comprises steps of:
  • the window portion 2 is oval with a long side of 41 mm, an arc radius of 10.6 mm, and a distance between a center of the window portion and a center of the backing 1 of 104.5 mm.
  • the substrate punching mold is oval, wherein a diameter of the hole is 3.3 mm smaller than a window size of the window portion 2 .
  • a size of the window punching mold is as same as that of the window portion 2 .
  • the primer is Primer 94 .
  • a CMP (chemical mechanical polishing) polishing pad comprises a backing 1 , a substrate 4 , a first adhesive 9 and a second adhesive 3 , wherein: multiple grooves 6 are provided on the backing 1 , the backing 1 comprises a window portion 2 which defines a window, the substrate 4 has a hole 5 , a window material 8 is accommodated within the window portion 2 , and two window support blocks 7 are respectively located at two sides of a bottom of the window portion 2 .
  • both the window and the hole 5 have a same hole center, and a diameter of the hole 5 is smaller than that of the window.
  • the diameter of the hole 5 is 3.3 mm smaller than that of the window.
  • the two window support blocks 7 are centrally symmetrically distributed to each other relatively to the window and the hole 5 .
  • two types of backings are respectively prepared by two different preparation methods, namely, the split-window and the integrated window, based on the same batch of raw materials provided by the present invention, and then the two backings are respectively sampled and tested. The tensile strength stability and the density uniformity of the backing are tested, and the scrap rate of the backing during processing is recorded. Test data and comparing results are shown in FIGS. 4 to 6 .
  • the split-window backing has less tensile strength fluctuation and more stable tensile strength than the integrated-window backing; within a certain density range, the split-window backing has less density fluctuation and more uniform density than the integrated-window backing. Moreover, the split-window backing has a lower scrap rate during processing.
US16/358,033 2018-08-03 2019-03-19 Split-window CMP polishing pad and preparation method thereof Abandoned US20190210184A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810877758.1A CN108818300A (zh) 2018-08-03 2018-08-03 一种分体式窗口cmp抛光垫的制备方法及cmp抛光垫
CN201810877758.1 2018-08-03

Publications (1)

Publication Number Publication Date
US20190210184A1 true US20190210184A1 (en) 2019-07-11

Family

ID=64152624

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/358,033 Abandoned US20190210184A1 (en) 2018-08-03 2019-03-19 Split-window CMP polishing pad and preparation method thereof

Country Status (2)

Country Link
US (1) US20190210184A1 (zh)
CN (1) CN108818300A (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8758659B2 (en) * 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US20140256231A1 (en) * 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad

Also Published As

Publication number Publication date
CN108818300A (zh) 2018-11-16

Similar Documents

Publication Publication Date Title
TWI457201B (zh) Laminated mats
JP4151799B2 (ja) モザイク研磨パッド及びこれに関連する方法
KR102063846B1 (ko) 양면연마장치용 캐리어의 제조방법 및 웨이퍼의 양면연마방법
US8409308B2 (en) Process for manufacturing polishing pad
TWI428204B (zh) 改良的化學機械研磨墊及其製造及使用方法
US8348724B2 (en) Polishing pad manufacturing method
US20130102231A1 (en) Organic particulate loaded polishing pads and method of making and using the same
CN104285281A (zh) 印刷式化学机械研磨垫
KR20140097486A (ko) 기초 레이어 및 연마면 레이어를 가진 연마 패드
US9636796B2 (en) Laminated polishing pad and method for producing same
TWI535526B (zh) 研磨物件、固定研磨物件及拋光工件表面之方法
TW200406287A (en) Subpad having robust, sealed edges
KR20140039043A (ko) 연마 패드
TWI551396B (zh) 拋光墊及其製造方法
US20190210184A1 (en) Split-window CMP polishing pad and preparation method thereof
TW201402275A (zh) 用於離心鑄造聚合物拋光墊之方法及系統及由該方法製得之拋光墊
TW200831236A (en) Method for producing long polishing pad
JP4695236B2 (ja) Ｃｍｐコンディショナの製造方法
US20140110058A1 (en) Polishing pad, polishing apparatus, and method for making the polishing pad
TW201021972A (en) Polishing pad
WO2020255744A1 (ja) 研磨パッド、研磨パッドの製造方法及び研磨方法
US20080268227A1 (en) Complex polishing pad and method for making the same
JP2009101447A (ja) 電解研磨パッドの製造方法
JP2009241207A (ja) 研磨パッドの製造方法
JP2009072876A (ja) 研磨パッドの製造方法

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION