US20190189841A1 - Ultraviolet light emitting devices having a dielectric layer and a transparent electrode layer disposed in between patterned nitride semiconductor layers - Google Patents
Ultraviolet light emitting devices having a dielectric layer and a transparent electrode layer disposed in between patterned nitride semiconductor layers Download PDFInfo
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- US20190189841A1 US20190189841A1 US16/012,831 US201816012831A US2019189841A1 US 20190189841 A1 US20190189841 A1 US 20190189841A1 US 201816012831 A US201816012831 A US 201816012831A US 2019189841 A1 US2019189841 A1 US 2019189841A1
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- ultraviolet light
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 139
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 101
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 9
- 229910004140 HfO Inorganic materials 0.000 claims description 5
- 229910004541 SiN Inorganic materials 0.000 claims description 5
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- 229910052905 tridymite Inorganic materials 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 14
- 238000002310 reflectometry Methods 0.000 description 8
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- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
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- 239000010980 sapphire Substances 0.000 description 2
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- 239000011787 zinc oxide Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910010092 LiAlO2 Inorganic materials 0.000 description 1
- 229910010936 LiGaO2 Inorganic materials 0.000 description 1
- 229910026161 MgAl2O4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
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- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H01L33/145—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
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- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H01L33/42—Transparent materials
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- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Definitions
- Embodiments relate to an ultraviolet light emitting device.
- ultraviolet light sources have been employed in devices such as sterilizers, disinfection devices, UV curing devices and the like for various purposes.
- environmentally friendly semiconductor light-emitting diodes LED having high efficiency characteristics have received considerable attention.
- nitride semiconductor light-emitting diodes have been considered.
- the embodiments may be realized by providing an ultraviolet light emitting device including a first conductivity-type AlGaN semiconductor layer; an active layer disposed on the first conductivity-type AlGaN semiconductor layer and having an AlGaN semiconductor; a second conductivity-type AlGaN semiconductor layer disposed on the active layer and having an upper surface divided into a first region and a second region; second conductivity-type nitride patterns disposed on the first region of the second conductivity-type AlGaN semiconductor layer and having an energy band gap that is smaller than an energy band gap of the second conductivity-type AlGaN semiconductor layer; a transparent electrode layer covering the second conductivity-type nitride patterns and the second region of the second conductivity-type AlGaN semiconductor layer; a light-transmissive dielectric layer disposed on the transparent electrode layer between the second conductivity-type nitride patterns; and a metal electrode disposed on the transparent electrode layer overlying the second conductivity type nitride patterns and on the light-transmissive dielectric layer
- the embodiments may be realized by providing an ultraviolet light emitting device including a light-emitting laminate including a first conductivity-type semiconductor layer including a Al x1 Ga 1-x1 N semiconductor, in which 0 ⁇ x1 ⁇ 1, a second conductivity-type semiconductor layer including a Al x2 Ga 1-x2 N semiconductor, in which 0 ⁇ x2 ⁇ 1, and an active layer disposed between the first and second conductivity-type semiconductor layers and including a Al x3 Ga 1-x3 N semiconductor, in which 0 ⁇ x3 ⁇ x1 and 0 ⁇ x3 ⁇ x2; second conductivity-type nitride patterns partially disposed on the second conductivity-type semiconductor layer and including a Al x4 Ga 1-x4 N semiconductor, in which 0 ⁇ x4 ⁇ x2; a transparent electrode layer disposed on upper surfaces of the second conductivity-type nitride patterns; a light-transmissive dielectric layer disposed on a region of the second conductivity-type semiconductor layer that is between the second conductivity-type nitride patterns;
- the embodiments may be realized by providing an ultraviolet light emitting device including a first conductivity-type AlGaN semiconductor layer; an active layer disposed on the first conductivity-type AlGaN semiconductor layer and having an AlGaN semiconductor; a second conductivity-type AlGaN semiconductor layer disposed on the active layer and having an upper surface divided into a first region and a second region; second conductivity-type nitride patterns partially formed on the second conductivity-type semiconductor layer and including a GaN semiconductor; an ITO layer disposed at least on upper surfaces of the second conductivity-type nitride patterns; a light-transmissive dielectric layer disposed on the second conductivity-type semiconductor layer between the second conductivity-type nitride patterns; and a metal electrode disposed on regions of the transparent electrode layer overlying the second conductivity type nitride patterns and on the light-transmissive dielectric layer.
- FIG. 1 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment
- FIG. 2 illustrates a top plan view of the ultraviolet light emitting device shown in FIG. 1 ;
- FIG. 3 illustrates an enlarged view of a portion A of the ultraviolet light emitting device shown in FIG. 1 ;
- FIG. 4 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment
- FIG. 5 illustrates a top plan view of the ultraviolet light emitting device shown in FIG. 4 ;
- FIG. 6A through FIG. 6F illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment
- FIG. 7 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment
- FIG. 8A through FIG. 8E illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment.
- FIG. 1 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment.
- FIG. 2 illustrates a top plan view taken along line I 1 -I 1 ′ of the ultraviolet light emitting device shown in FIG. 1 .
- an ultraviolet light emitting device 10 may include a substrate 11 and a semiconductor laminate S disposed on the substrate 11 for emission of ultraviolet light.
- the semiconductor laminate S may include a first conductivity-type semiconductor layer 13 and a second conductivity-type semiconductor layer 16 , and an active layer 14 disposed between the first and second conductivity-type semiconductor layers 13 and 16 .
- the substrate 11 may be an insulating, conductive, or semiconductor substrate.
- the substrate 11 may include sapphire, AlN, SiC, MgAl 2 O 4 , MgO, LiAlO 2 , or LiGaO 2 .
- the term “or” is not an exclusive term.
- the semiconductor laminate S employed in the embodiment may include a base layer 12 formed on the substrate 11 and provided for the growth of the first conductivity-type AlGaN semiconductor layer.
- the base layer 12 may be formed of a nitride such as AlN or AlGaN.
- the first conductivity-type semiconductor layer 13 may include, e.g., an n-type nitride semiconductor represented by Al x1 Ga 1-x1 N, in which 0 ⁇ x1 ⁇ 1, and an n-type impurity may be silicon (Si).
- the first conductivity-type semiconductor layer 13 may contain n-type AlGaN.
- the second conductivity-type semiconductor layer 16 may include, e.g., a p-type nitride semiconductor represented by Al x2 Ga 1-x2 N, in which 0 ⁇ x2 ⁇ 1, and a p-type impurity may be Mg.
- the second conductivity-type semiconductor layer 16 may contain p-type AlGaN.
- an Al composition ratio x1 of the first conductivity-type semiconductor layer 13 may be in a range of 0.45 to 0.99, e.g., may be in the range of 0.60 to 0.65.
- an Al composition ratio x2 of the second conductivity-type semiconductor layer 16 may be in a range of 0.45 to 0.99, e.g., may be in the range of 0.75 to 0.85.
- the active layer 14 employed in the embodiment may have a quantum well formed of Al x3 Ga 1-x3 N, in which 0 ⁇ x3 ⁇ 1.
- the active layer 14 may have, e.g., a single quantum well (SQW) structure having a single quantum well.
- the active layer 14 may have a multiple quantum well (MQW) structure in which a plurality of quantum well layers and a plurality of quantum barrier layers are alternately stacked (see FIG. 4 ).
- the quantum well of the active layer 14 may have a band gap that determines a wavelength of ultraviolet light, and the active layer 14 employed in this embodiment may be configured to emit light having a wavelength of 210 nm to 315 nm.
- the first and second conductivity-type semiconductor layers 13 and 16 may have a band gap that is greater than the band gap of the quantum well so that ultraviolet light generated from the active layer 14 is not absorbed thereby.
- an Al composition ratio x3 of the quantum well may be smaller than the Al composition ratios x1 and x2 of the first and second conductivity-type semiconductor layers 13 , 16 .
- the Al composition ratio x3 of the quantum well may range from 0.35 to 0.5.
- the ultraviolet light emitting device 10 may include a first electrode 18 and a second electrode 19 connected to the first and second conductivity-type semiconductor layers 13 and 16 , respectively.
- the semiconductor laminate S may have an area exposing one region of the first conductivity-type semiconductor layer 13 by partially removing the second conductivity-type semiconductor layer 16 and the active layer 14 .
- the first electrode 18 may be disposed on the exposed region of the first conductivity-type semiconductor layer 13 .
- the first electrode 18 may be an n-electrode, may be formed of Al, Ti, Ni, Cr, Au, Ag, or ITO, or may be a multilayer structure configured of the composition thereof.
- the second electrode 19 employed in the embodiment may be provided not only as an ohmic-contact structure but may also be provided as an omnidirectional reflector (ODR) for improving light extraction efficiency.
- ODR omnidirectional reflector
- the second electrode 19 employed in this embodiment may provide a reflective structure for improving light extraction efficiency.
- it may be difficult to obtain desired reflectivity with a reflective electrode of a blue light-emitting diode.
- the reflectivity of most reflective metals may be much lower than that of other visible light such as blue light.
- the reflectivity of ultraviolet light is as low as 20%.
- a metal e.g., aluminum
- a second conductivity-type semiconductor layer e.g., a p-type AlGaN layer
- the Al composition ratio of a second conductivity-type semiconductor layer were to be lowered, the ultraviolet light may be absorbed, so that the light efficiency may be lowered.
- second conductivity-type nitride patterns 17 p (having an energy band gap that is smaller than the energy band gap of the second conductivity-type semiconductor layer 16 ) may be formed on some regions of the second conductivity-type semiconductor layer 16 (e.g., may be discontinuously formed on the second conductivity-type semiconductor layer 16 ).
- the second conductivity-type nitride patterns 17 p are represented by or include p-type Al x4 Ga 1-x4 N, an Al composition ratio x4 may be lower than the Al composition ratio x2 of the second conductivity-type semiconductor layer 16 .
- the second conductivity-type nitride patterns 17 p may be formed of p-type GaN.
- the second conductivity-type nitride patterns 17 p may only be formed on some regions of the second conductivity-type semiconductor layer 16 .
- the second conductivity-type nitride patterns 17 p may be formed as a plurality of circular patterns (e.g., rounded, island shaped patterns).
- the second conductivity-type nitride patterns 17 p may be formed in various other shapes of patterns and/or arrangements.
- a transparent electrode layer 19 a formed on the regions in which the second conductivity-type nitride patterns 17 p are formed may be provided as an ohmic-contact structure.
- the transparent electrode layer 19 a employed in this embodiment may also be disposed on another region of the second conductivity-type semiconductor layer 16 , e.g., in a region in which no second conductivity-type nitride pattern 17 p is formed, while covering the second conductivity-type nitride patterns 17 p.
- the transparent electrode layer 19 a may be on the second conductivity-type nitride patterns 17 p and on portions of the second conductivity-type semiconductor layer 16 exposed between the second conductivity-type nitride patterns 17 p.
- the second conductivity-type nitride patterns 17 p may be formed of p-type GaN, and the transparent electrode layer 19 a may be an ITO layer.
- the transparent electrode layer 19 a may be advantageously used for a transparent electrode material having light transmittance while forming an ohmic-contact with the second conductivity-type nitride patterns 17 p.
- the transparent electrode layer 19 a may include ITO, and the transparent electrode layer 10 may have a thickness of 1 nm to 50 nm.
- the transparent electrode layer 19 a may include, e.g., ITO
- Zinc Oxide Indium Tin Oxide, ZITO (Zinc-doped Indium Tin Oxide), ZIO (Zinc Indium Oxide), GIO (Gallium Indium Oxide), ZTO (Zinc Tin Oxide), FTO (Fluorine-doped Tin Oxide), AZO (Aluminum-doped Zinc Oxide), GZO (Gallium-doped Zinc Oxide), In 4 Sn 3 O 12 , or Zn (1-x) Mg x O (Zinc Magnesium Oxide, in which 0 ⁇ x ⁇ 1).
- the second conductivity-type nitride patterns 17 p may be formed on some regions of the second conductivity-type semiconductor layer 16 , and light extraction efficiency may be adversely affected.
- an omnidirectional reflector (ODR) having high reflectivity may be formed in another region of the second conductivity-type semiconductor layer 16 , e.g., the region in which no second conductivity-type nitride pattern 17 p is formed (e.g., between the second conductivity-type nitride patterns 17 p ).
- a light-transmissive dielectric layer 19 b may be formed in the region in which no second conductivity-type nitride pattern 17 p is formed.
- the light-transmissive dielectric layer 19 b may have a low refractive index (e.g., 2or less).
- the light-transmissive dielectric layer 19 b may include SiO 2 , SiN, TiO 2 , HfO, or MgF 2 .
- a metal electrode 19 c may be formed on the light-transmissive dielectric layer 19 b.
- the metal electrode 19 c employed in this embodiment may not only be formed on a surface of the light-transmissive dielectric layer 19 b but also on the transparent electrode layer 19 a.
- the metal electrode 19 c may be combined with the light-transmissive dielectric layer 19 b, a low refractive layer, and may serve as an omnidirectional reflector to thereby supply current to the transparent electrode layer 19 a.
- the metal electrode 19 c may include, e.g., Al, Rh, or Ru.
- the second electrode 19 may be provided as an omnidirectional reflector as well as an ohmic-contact structure.
- a main current flow I may be formed through the second conductivity-type nitride patterns 17 p and the transparent electrode layer 19 a, and ultraviolet light R 2 traveling in the same region may be absorbed by the second conductivity-type nitride patterns 17 p and may have low reflectivity, while ultraviolet light R 1 traveling from the light-transmissive dielectric layer 19 b to the metal electrode 19 c has high reflectivity due to the ODR structure.
- an ohmic-contact structure realized by a combination of the second conductivity-type nitride pattern 17 p and the transparent electrode layer 19 a may be formed in a form in which it is widely dispersed on an upper surface (e.g., surface that faces away from the active layer 14 ) of the second conductivity-type semiconductor layer 16 , so that uniform current distribution may be achieved over the entire region of the active layer.
- the second conductivity-type nitride patterns 17 p may be formed in various shapes such as polygonal shapes, e.g., quadrangular shapes, or line shapes, as well as circular shapes.
- the second conductivity-type nitride patterns 17 p may not be formed as embossed patterns as shown in FIG. 2 , but second conductivity-type nitride patterns 17 p ′ may be formed as engraved patterns, as shown in FIGS. 4 and 5 (e.g., in a continuous grid pattern).
- FIG. 4 illustrates a side cross-sectional view of an ultraviolet light emitting device according an example embodiment.
- FIG. 5 illustrates a top plan view taken along line I 2 -I 2 ′ of the ultraviolet light emitting device shown in FIG. 4 .
- an ultraviolet light emitting device 10 A is similar to the ultraviolet light emitting device 10 shown in FIGS. 1 and 2 , with the exception that a second electrode 19 ′ and the active layer 14 have structures different from those shown in FIGS. 1 and 2 and an electron blocking layer is included in the ultraviolet light-emitting semiconductor device 10 A.
- Descriptions of components of this embodiment may refer to the description of the same or similar components of the ultraviolet light emitting device 10 shown in FIGS. 1 and 2 , unless otherwise specified.
- the second conductivity-type nitride pattern 17 p ′ may be formed to have an engraved pattern layer having a hole with a quadrangular planar surface or quadrangular shape. Similar to the previous embodiment, a transparent electrode layer 19 a ′ (e.g., including ITO) may be formed on the upper surface of the second conductivity-type semiconductor layer 16 (e.g., in the hole or holes within the second conductivity-type nitride pattern 17 p ′) and on the second conductivity-type nitride pattern 17 p ′.
- a transparent electrode layer 19 a ′ e.g., including ITO
- the light-transmissive dielectric layer 19 b ′ may be formed in the region of the quadrangular hole (e.g., on the transparent electrode layer 19 a ′), and the metal electrode 19 c may be formed on the transparent electrode layer 19 a ′ and the light-transmissive dielectric layer 19 b ′.
- the active layer 14 employed in the embodiment may have a multiple quantum well (MQW) structure in which a plurality of quantum well layers formed of Al xa Ga 1-xa N (in which 0 ⁇ xa ⁇ 1) and a plurality of quantum barrier layers formed of Al xb Ga 1-xb N (in which xa ⁇ xb ⁇ 1) are alternately stacked.
- the quantum well of the active layer 14 may have a band gap that determines a wavelength of ultraviolet light, and the active layer 14 employed in this embodiment may be configured to emit light having a wavelength of 210 nm to 315 nm.
- an Al composition ratio xa of the quantum well may be in a range of 0.40 to 1.0, and the Al composition ratio xa may be varied depending on a desired wavelength.
- the semiconductor laminate S employed in the embodiment may further include an electron blocking layer (EBL) 15 disposed between the second conductivity-type semiconductor layer 16 and the active layer 14 .
- the electron blocking layer 15 may have a band gap that is higher than that of the second conductivity-type semiconductor layer 16 , and may include a p-type nitride semiconductor represented by Al x5 Ga 1-x5 N (in which x2 ⁇ x5 ⁇ 1).
- an Al composition ratio X5 of the electron blocking layer 15 may be 0.8 or more.
- FIG. 6A through FIG. 6F illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment.
- the base layer 12 , the first conductivity-type semiconductor layer 13 , the active layer 14 , and the second conductivity-type semiconductor layer 16 may be sequentially stacked on the substrate 11 to form a semiconductor laminate for emission of ultraviolet light.
- a second conductivity-type nitride layer 17 (having a relatively small band gap) may be formed on the second conductivity-type semiconductor layer 16 .
- the second conductivity-type nitride layer 17 may be, e.g., an AlGaN layer or a GaN layer having an Al composition ratio smaller than the Al composition ratio of the second conductivity-type semiconductor layer 16 .
- the substrate 11 may be formed of sapphire or AlN, as described above.
- the first conductivity-type semiconductor layer 13 may be an n-type nitride semiconductor represented by Al x1 Ga 1-x1 N (in which 0 ⁇ x1 ⁇ 1), e.g., may contain n-type AlGaN.
- the second conductivity-type semiconductor layer 16 may be a p-type nitride semiconductor represented by Al x2 Ga 1-x2 N (in which 0 ⁇ x2 ⁇ 1), e.g., may contain p-type AlGaN.
- the active layer 14 employed in the embodiment may have a quantum well formed of Al x3 Ga 1-x3 N (in which 0 ⁇ x3 ⁇ 1).
- the active layer 14 may be a multiple quantum well (MQW) structure.
- MQW multiple quantum well
- the base layer 12 , the first conductivity-type semiconductor layer 13 , the active layer 14 , and the second conductivity-type semiconductor layer 16 may be grown by, e.g., a metal organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HVPE) or MBE (Molecular Beam Epitaxy) process.
- MOCVD metal organic chemical vapor deposition
- HVPE hydride vapor phase epitaxy
- MBE Molecular Beam Epitaxy
- the second conductivity-type nitride layer 17 may be selectively etched to form the second conductivity-type nitride patterns 17 p having a desired shape and arrangement.
- the second conductivity-type nitride patterns 17 p may only remain on some regions of the second conductivity-type semiconductor layer 16 , and other regions of the second conductivity-type semiconductor layer 16 may be exposed to form an omnidirectional reflector ODR.
- the second conductivity-type nitride patterns 17 p may be formed as a plurality of circular patterns.
- the second conductivity-type nitride patterns 17 p may be formed in various other shapes of patterns and/or arrangements.
- the process may be performed by a reactive ion etching (RIE) process using photolithography.
- RIE reactive ion etching
- the transparent electrode layer 19 a may be formed on the second conductivity-type semiconductor layer 16 so as to cover the second conductivity-type nitride patterns 17 p.
- the transparent electrode layer 19 a may form an ohmic-contact with the second conductivity-type nitride patterns 17 p.
- the transparent electrode layer 19 a located between the second conductivity-type nitride patterns 17 p may directly contact the second conductivity-type semiconductor layer 16 , and thus, may have high contact resistance.
- the second conductivity-type nitride patterns 17 p may be formed of p-type GaN, and the transparent electrode layer 19 a may be an ITO layer.
- the transparent electrode layer 19 a is ITO, the transparent electrode layer 10 may be formed to have a thickness of 1 nm or more.
- the light-transmissive dielectric layer 19 b may be formed on the transparent electrode layer 19 a so as to fill a space between the second conductivity-type nitride patterns 17 p. As shown in FIG. 6E , the light-transmissive dielectric layer 19 b may be selectively etched to expose regions e of the transparent electrode layer 19 a corresponding to the second conductivity-type nitride patterns 17 p.
- the light-transmissive dielectric layer 19 b may have a low refractive index (e.g., 2 or less).
- the light-transmissive dielectric layer 19 b may include SiO 2 , SiN, TiO 2 , HfO or MgF 2 .
- the exposed region e of the transparent electrode layer 19 a may be provided as a contact region with the metal electrode 19 c to be formed in a subsequent process.
- the metal electrode 19 c may be formed on the exposed region e of the transparent electrode layer 19 a and on the light-transmissive dielectric layer 19 b.
- the metal electrode 19 c formed in this process may be formed on the light-transmissive dielectric layer 19 b as well as on the exposed region e of the transparent electrode layer 19 a.
- the metal electrode 19 c may be provided as an omnidirectional reflector in combination with the light-transmissive dielectric layer 19 b, e.g., a low refractive layer.
- the metal electrode 19 c may be connected to the transparent electrode layer 19 a and serve to supply current.
- the metal electrode 19 c may include Al, Rh, or Ru.
- the respective processes may be variously modified and performed.
- the transparent electrode layer 19 a may be exposed (see FIG. 6E ) by a selective etching process after the light-transmissive dielectric layer 19 b is entirely deposited (see FIG. 6D ).
- the transparent electrode layer 19 a may be formed to only fill a region between the second conductivity-type nitride patterns 17 p by using a mask in the deposition process of the light-transmissive dielectric layer 19 b.
- FIG. 7 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment.
- an ultraviolet light emitting device 20 is similar to the ultraviolet light emitting device 10 shown in FIGS. 1 and 2 , with the exception that a second electrode 29 has a structure different from those shown in FIGS. 1 and 2 , and the ultraviolet light emitting device 20 further includes an electron blocking layer 15 .
- Descriptions of components of this embodiment may refer to the description of the same or similar components of the ultraviolet light emitting device 10 shown in FIGS. 1 and 2 , unless otherwise specified.
- the ultraviolet light emitting device 20 may include the electron blocking layer 15 disposed between the second conductivity-type semiconductor layer 16 and the active layer 14 .
- the electron blocking layer 15 may be formed of a nitride semiconductor having an Al composition ratio that is greater than the Al composition ratio of the second conductivity-type semiconductor layer 16 .
- the second conductivity-type nitride patterns 17 p may be partially (e.g., discontinuously) disposed on the second conductivity-type semiconductor layer 16 .
- the transparent electrode layer 29 a may be disposed on the upper surfaces (e.g., surfaces that face away from the second conductivity-type semiconductor layer 16 ) of the second conductivity-type nitride patterns 17 p and may not be disposed in the region between the second conductivity-type nitride patterns 17 p.
- a light-transmissive dielectric layer 29 b may be formed on the upper surface of the second conductivity-type semiconductor layer 16 between the second conductivity-type nitride patterns 17 p.
- the metal electrode 29 c may be disposed on the transparent electrode layer 29 a and the light-transmissive dielectric layer 29 b.
- the transparent electrode layer 29 a may not be formed in the region that provides the omnidirectional reflector.
- FIG. 8A through FIG. 8E illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device illustrated in FIG. 7 .
- the second conductivity-type nitride layer 17 may be selectively etched to form the second conductivity-type nitride patterns 17 p having a desired shape and arrangement.
- the second conductivity-type nitride patterns 17 p may only remain in some regions of the second conductivity-type semiconductor layer 16 , and other regions of the second conductivity-type semiconductor layer 16 may be exposed to later form an omnidirectional reflector ODR.
- the process may be performed by a dry etching process such as an RIE process, similarly to the case of the previous embodiments.
- the light-transmissive dielectric layer 29 b may be formed so as to cover the second conductivity-type nitride patterns 17 p on the second conductivity-type semiconductor layer 16 and the regions of the second conductivity-type semiconductor layer 16 between the second conductivity-type nitride patterns 17 p .
- the light-transmissive dielectric layer 29 b may be selectively etched to expose upper surface regions e of the second conductivity-type nitride patterns 17 p.
- the light-transmissive dielectric layer 29 b may have a low refractive index (e.g., 2 or less).
- the light-transmissive dielectric layer 29 b may include, e.g., SiO 2 , SiN, TiO 2 , HfO, or MgF 2 .
- the exposed region e of the second conductivity-type nitride patterns 17 p obtained after the selective etching of the light-transmissive dielectric layer 29 b may be provided as a contact region with the transparent electrode layer 29 a to be formed in the subsequent process.
- the transparent electrode layer 29 a may be formed on the exposed region of the second conductivity-type nitride pattern 17 p.
- the metal electrode 29 c may be formed on the transparent electrode layer 29 a and on the light-transmissive dielectric layer 29 b.
- the transparent electrode layer 29 a may be formed on the exposed region e of the second conductivity-type nitride patterns 17 p by a selective deposition process using a mask. Then, the metal electrode 29 c formed in the present process may be provided onto the transparent electrode layer 29 a and the light-transmissive dielectric layer 29 b to supply current to the transparent electrode layer 29 a and at the same time, to combine with the light-transmissive dielectric layer 29 b, thereby being provided as an omnidirectional reflector.
- the metal electrode 29 c may include, e.g., Al, Rh, or Ku.
- the respective processes may be variously modified.
- the transparent electrode layer 29 a may be selectively deposited (see FIG. 8D ) after selective etching of the light-transmissive dielectric layer 29 b (see FIG. 8C ).
- the transparent electrode layer 29 a after forming the transparent electrode layer 29 a on a nitride layer (before patterning, see FIG. 6A ) for the second conductivity-type nitride patterns 17 p, the transparent electrode layer 29 a may be patterned simultaneously with a patterning process for forming the second conductivity-type nitride patterns 17 p.
- the external quantum efficiency thereof could be degraded because of Auger recombination due to crystal defects and a low carrier concentration (e.g., in the case of holes), and they may be configured of highly refractive semiconductors, thereby resulting in low light extraction efficiency.
- nitride semiconductor LEDs for a short-wavelength region e.g., UV-B and UV-C
- light extraction efficiency may be extremely low (e.g., 2% to 3%), and the commercialization of nitride semiconductor LEDs may be difficult.
- nitride semiconductor layers having a wide band gap e.g., AlGaN
- nitride semiconductor layers having a wide band gap may be used so as not to absorb ultraviolet light having a short wavelength therein, and it could be difficult to form an ohmic-contact with an electrode (e.g., a p-type electrode).
- the ultraviolet light emitting devices may help improve contact resistance by using the transparent electrode layer such as ITO, together with nitride patterns having a relatively small band gap, and at the same time, may help increase light extraction efficiency by providing an omnidirectional reflector with the use of the light-transmissive dielectric layer having a refractive index and the metal electrode.
- the transparent electrode layer (such as ITO) may extend to a surface of the first conductivity-type semiconductor layer contacting the light-transmissive dielectric layer, and light efficiency may be significantly improved.
- the embodiments may provide an ultraviolet light emitting device having an electrode structure capable of improving light extraction efficiency while allowing for formation of an excellent ohmic-contact.
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Abstract
Description
- Korean Patent Application No. 10-2017-0175149 filed on Dec. 19, 2017 in the Korean Intellectual Property Office, and entitled: “Ultraviolet Light Emitting Devices,” is incorporated by reference herein in its entirety.
- Embodiments relate to an ultraviolet light emitting device.
- Recently, ultraviolet light sources have been employed in devices such as sterilizers, disinfection devices, UV curing devices and the like for various purposes. As ultraviolet light sources, environmentally friendly semiconductor light-emitting diodes (LED) having high efficiency characteristics have received considerable attention. For example, nitride semiconductor light-emitting diodes have been considered.
- The embodiments may be realized by providing an ultraviolet light emitting device including a first conductivity-type AlGaN semiconductor layer; an active layer disposed on the first conductivity-type AlGaN semiconductor layer and having an AlGaN semiconductor; a second conductivity-type AlGaN semiconductor layer disposed on the active layer and having an upper surface divided into a first region and a second region; second conductivity-type nitride patterns disposed on the first region of the second conductivity-type AlGaN semiconductor layer and having an energy band gap that is smaller than an energy band gap of the second conductivity-type AlGaN semiconductor layer; a transparent electrode layer covering the second conductivity-type nitride patterns and the second region of the second conductivity-type AlGaN semiconductor layer; a light-transmissive dielectric layer disposed on the transparent electrode layer between the second conductivity-type nitride patterns; and a metal electrode disposed on the transparent electrode layer overlying the second conductivity type nitride patterns and on the light-transmissive dielectric layer.
- The embodiments may be realized by providing an ultraviolet light emitting device including a light-emitting laminate including a first conductivity-type semiconductor layer including a Alx1Ga1-x1N semiconductor, in which 0<x1<1, a second conductivity-type semiconductor layer including a Alx2Ga1-x2N semiconductor, in which 0<x2<1, and an active layer disposed between the first and second conductivity-type semiconductor layers and including a Alx3Ga1-x3N semiconductor, in which 0<x3<x1 and 0<x3<x2; second conductivity-type nitride patterns partially disposed on the second conductivity-type semiconductor layer and including a Alx4Ga1-x4N semiconductor, in which 0<x4<x2; a transparent electrode layer disposed on upper surfaces of the second conductivity-type nitride patterns; a light-transmissive dielectric layer disposed on a region of the second conductivity-type semiconductor layer that is between the second conductivity-type nitride patterns; and a metal electrode disposed on the transparent electrode layer and the light-transmissive dielectric layer.
- The embodiments may be realized by providing an ultraviolet light emitting device including a first conductivity-type AlGaN semiconductor layer; an active layer disposed on the first conductivity-type AlGaN semiconductor layer and having an AlGaN semiconductor; a second conductivity-type AlGaN semiconductor layer disposed on the active layer and having an upper surface divided into a first region and a second region; second conductivity-type nitride patterns partially formed on the second conductivity-type semiconductor layer and including a GaN semiconductor; an ITO layer disposed at least on upper surfaces of the second conductivity-type nitride patterns; a light-transmissive dielectric layer disposed on the second conductivity-type semiconductor layer between the second conductivity-type nitride patterns; and a metal electrode disposed on regions of the transparent electrode layer overlying the second conductivity type nitride patterns and on the light-transmissive dielectric layer.
- Features will be apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
-
FIG. 1 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment -
FIG. 2 illustrates a top plan view of the ultraviolet light emitting device shown inFIG. 1 ; -
FIG. 3 illustrates an enlarged view of a portion A of the ultraviolet light emitting device shown inFIG. 1 ; -
FIG. 4 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment; -
FIG. 5 illustrates a top plan view of the ultraviolet light emitting device shown inFIG. 4 ; -
FIG. 6A throughFIG. 6F illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment; -
FIG. 7 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment; and -
FIG. 8A throughFIG. 8E illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment. -
FIG. 1 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment.FIG. 2 illustrates a top plan view taken along line I1-I1′ of the ultraviolet light emitting device shown inFIG. 1 . - Referring to
FIGS. 1 and 2 , an ultravioletlight emitting device 10 according to the example embodiment may include asubstrate 11 and a semiconductor laminate S disposed on thesubstrate 11 for emission of ultraviolet light. The semiconductor laminate S may include a first conductivity-type semiconductor layer 13 and a second conductivity-type semiconductor layer 16, and anactive layer 14 disposed between the first and second conductivity-type semiconductor layers - The
substrate 11 may be an insulating, conductive, or semiconductor substrate. For example, thesubstrate 11 may include sapphire, AlN, SiC, MgAl2O4, MgO, LiAlO2, or LiGaO2. As used herein, the term “or” is not an exclusive term. The semiconductor laminate S employed in the embodiment may include abase layer 12 formed on thesubstrate 11 and provided for the growth of the first conductivity-type AlGaN semiconductor layer. For example, thebase layer 12 may be formed of a nitride such as AlN or AlGaN. - In an implementation, the first conductivity-
type semiconductor layer 13 may include, e.g., an n-type nitride semiconductor represented by Alx1Ga1-x1N, in which 0<x1≤1, and an n-type impurity may be silicon (Si). For example, the first conductivity-type semiconductor layer 13 may contain n-type AlGaN. In an implementation, the second conductivity-type semiconductor layer 16 may include, e.g., a p-type nitride semiconductor represented by Alx2Ga1-x2N, in which 0<x2≤1, and a p-type impurity may be Mg. For example, the second conductivity-type semiconductor layer 16 may contain p-type AlGaN. - In an implementation, an Al composition ratio x1 of the first conductivity-
type semiconductor layer 13 may be in a range of 0.45 to 0.99, e.g., may be in the range of 0.60 to 0.65. In an implementation, an Al composition ratio x2 of the second conductivity-type semiconductor layer 16 may be in a range of 0.45 to 0.99, e.g., may be in the range of 0.75 to 0.85. - The
active layer 14 employed in the embodiment may have a quantum well formed of Alx3Ga1-x3N, in which 0<x3<1. In an implementation, theactive layer 14 may have, e.g., a single quantum well (SQW) structure having a single quantum well. In an implementation, theactive layer 14 may have a multiple quantum well (MQW) structure in which a plurality of quantum well layers and a plurality of quantum barrier layers are alternately stacked (seeFIG. 4 ). - The quantum well of the
active layer 14 may have a band gap that determines a wavelength of ultraviolet light, and theactive layer 14 employed in this embodiment may be configured to emit light having a wavelength of 210 nm to 315 nm. The first and second conductivity-type semiconductor layers active layer 14 is not absorbed thereby. In an implementation, an Al composition ratio x3 of the quantum well may be smaller than the Al composition ratios x1 and x2 of the first and second conductivity-type semiconductor layers - The ultraviolet
light emitting device 10 according to the embodiment may include afirst electrode 18 and asecond electrode 19 connected to the first and second conductivity-type semiconductor layers - As illustrated in
FIG. 1 , the semiconductor laminate S may have an area exposing one region of the first conductivity-type semiconductor layer 13 by partially removing the second conductivity-type semiconductor layer 16 and theactive layer 14. Thefirst electrode 18 may be disposed on the exposed region of the first conductivity-type semiconductor layer 13. Thefirst electrode 18 may be an n-electrode, may be formed of Al, Ti, Ni, Cr, Au, Ag, or ITO, or may be a multilayer structure configured of the composition thereof. - The
second electrode 19 employed in the embodiment may be provided not only as an ohmic-contact structure but may also be provided as an omnidirectional reflector (ODR) for improving light extraction efficiency. - The
second electrode 19 employed in this embodiment may provide a reflective structure for improving light extraction efficiency. In an ultraviolet light emitting device, it may be difficult to obtain desired reflectivity with a reflective electrode of a blue light-emitting diode. For example, the reflectivity of most reflective metals may be much lower than that of other visible light such as blue light. - For example, in the case of silver (Ag), an ohmic-contact material having very high reflectivity in blue light, the reflectivity of ultraviolet light is as low as 20%. On the other hand, in the case of a metal (e.g., aluminum) having higher reflectivity than blue light, it may be difficult to form an ohmic-contact with the second conductivity-
type semiconductor layer 16. For example, a second conductivity-type semiconductor layer (e.g., a p-type AlGaN layer) may have considerable contact resistance with the electrode, and it may be necessary to lower the Al composition ratio or replace it with the p-type GaN in order to form the ohmic-contact. However, if the Al composition ratio of a second conductivity-type semiconductor layer were to be lowered, the ultraviolet light may be absorbed, so that the light efficiency may be lowered. - In an implementation, second conductivity-
type nitride patterns 17 p (having an energy band gap that is smaller than the energy band gap of the second conductivity-type semiconductor layer 16) may be formed on some regions of the second conductivity-type semiconductor layer 16 (e.g., may be discontinuously formed on the second conductivity-type semiconductor layer 16). When the second conductivity-type nitride patterns 17 p are represented by or include p-type Alx4Ga1-x4N, an Al composition ratio x4 may be lower than the Al composition ratio x2 of the second conductivity-type semiconductor layer 16. In an implementation, the second conductivity-type nitride patterns 17 p may be formed of p-type GaN. The second conductivity-type nitride patterns 17 p may only be formed on some regions of the second conductivity-type semiconductor layer 16. In an implementation, as shown inFIG. 2 , the second conductivity-type nitride patterns 17 p may be formed as a plurality of circular patterns (e.g., rounded, island shaped patterns). In an implementation, the second conductivity-type nitride patterns 17 p may be formed in various other shapes of patterns and/or arrangements. - A
transparent electrode layer 19 a formed on the regions in which the second conductivity-type nitride patterns 17 p are formed (e.g., formed on the second conductivity-type nitride patterns 17 p) may be provided as an ohmic-contact structure. Thetransparent electrode layer 19 a employed in this embodiment may also be disposed on another region of the second conductivity-type semiconductor layer 16, e.g., in a region in which no second conductivity-type nitride pattern 17 p is formed, while covering the second conductivity-type nitride patterns 17 p. For example, thetransparent electrode layer 19 a may be on the second conductivity-type nitride patterns 17 p and on portions of the second conductivity-type semiconductor layer 16 exposed between the second conductivity-type nitride patterns 17 p. - In an implementation, the second conductivity-
type nitride patterns 17 p may be formed of p-type GaN, and thetransparent electrode layer 19 a may be an ITO layer. In an implementation, thetransparent electrode layer 19 a may be advantageously used for a transparent electrode material having light transmittance while forming an ohmic-contact with the second conductivity-type nitride patterns 17 p. In an implementation, thetransparent electrode layer 19 a may include ITO, and thetransparent electrode layer 10 may have a thickness of 1 nm to 50 nm. - In an implementation, the
transparent electrode layer 19 a may include, e.g., ITO - (Indium Tin Oxide), ZITO (Zinc-doped Indium Tin Oxide), ZIO (Zinc Indium Oxide), GIO (Gallium Indium Oxide), ZTO (Zinc Tin Oxide), FTO (Fluorine-doped Tin Oxide), AZO (Aluminum-doped Zinc Oxide), GZO (Gallium-doped Zinc Oxide), In4Sn3O12, or Zn(1-x)MgxO (Zinc Magnesium Oxide, in which 0≤x≤1).
- The second conductivity-
type nitride patterns 17 p (having a relatively small band gap) may be formed on some regions of the second conductivity-type semiconductor layer 16, and light extraction efficiency may be adversely affected. However, in order to complement such a limitation, an omnidirectional reflector (ODR) having high reflectivity may be formed in another region of the second conductivity-type semiconductor layer 16, e.g., the region in which no second conductivity-type nitride pattern 17 p is formed (e.g., between the second conductivity-type nitride patterns 17 p). - A light-
transmissive dielectric layer 19 b may be formed in the region in which no second conductivity-type nitride pattern 17 p is formed. The light-transmissive dielectric layer 19 b may have a low refractive index (e.g., 2or less). In an implementation, the light-transmissive dielectric layer 19 b may include SiO2, SiN, TiO2, HfO, or MgF2. - A
metal electrode 19 c may be formed on the light-transmissive dielectric layer 19 b. Themetal electrode 19 c employed in this embodiment may not only be formed on a surface of the light-transmissive dielectric layer 19 b but also on thetransparent electrode layer 19 a. Themetal electrode 19 c may be combined with the light-transmissive dielectric layer 19 b, a low refractive layer, and may serve as an omnidirectional reflector to thereby supply current to thetransparent electrode layer 19 a. In an implementation, themetal electrode 19 c may include, e.g., Al, Rh, or Ru. - As such, the
second electrode 19 according to the embodiment may be provided as an omnidirectional reflector as well as an ohmic-contact structure. As shown inFIG. 3 , a main current flow I may be formed through the second conductivity-type nitride patterns 17 p and thetransparent electrode layer 19 a, and ultraviolet light R2 traveling in the same region may be absorbed by the second conductivity-type nitride patterns 17 p and may have low reflectivity, while ultraviolet light R1 traveling from the light-transmissive dielectric layer 19 b to themetal electrode 19 c has high reflectivity due to the ODR structure. - In an implementation, as illustrated in
FIG. 2 , an ohmic-contact structure realized by a combination of the second conductivity-type nitride pattern 17 p and thetransparent electrode layer 19 a may be formed in a form in which it is widely dispersed on an upper surface (e.g., surface that faces away from the active layer 14) of the second conductivity-type semiconductor layer 16, so that uniform current distribution may be achieved over the entire region of the active layer. - As described above, the second conductivity-
type nitride patterns 17 p may be formed in various shapes such as polygonal shapes, e.g., quadrangular shapes, or line shapes, as well as circular shapes. In an implementation, the second conductivity-type nitride patterns 17 p may not be formed as embossed patterns as shown inFIG. 2 , but second conductivity-type nitride patterns 17 p′ may be formed as engraved patterns, as shown inFIGS. 4 and 5 (e.g., in a continuous grid pattern). -
FIG. 4 illustrates a side cross-sectional view of an ultraviolet light emitting device according an example embodiment.FIG. 5 illustrates a top plan view taken along line I2-I2′ of the ultraviolet light emitting device shown inFIG. 4 . - Referring to
FIGS. 4 and 5 , it may be understood that an ultravioletlight emitting device 10A according to the embodiment is similar to the ultravioletlight emitting device 10 shown inFIGS. 1 and 2 , with the exception that asecond electrode 19′ and theactive layer 14 have structures different from those shown inFIGS. 1 and 2 and an electron blocking layer is included in the ultraviolet light-emittingsemiconductor device 10A. Descriptions of components of this embodiment may refer to the description of the same or similar components of the ultravioletlight emitting device 10 shown inFIGS. 1 and 2 , unless otherwise specified. - The second conductivity-
type nitride pattern 17 p′ may be formed to have an engraved pattern layer having a hole with a quadrangular planar surface or quadrangular shape. Similar to the previous embodiment, atransparent electrode layer 19 a′ (e.g., including ITO) may be formed on the upper surface of the second conductivity-type semiconductor layer 16 (e.g., in the hole or holes within the second conductivity-type nitride pattern 17 p′) and on the second conductivity-type nitride pattern 17 p′. The light-transmissive dielectric layer 19 b′ may be formed in the region of the quadrangular hole (e.g., on thetransparent electrode layer 19 a′), and themetal electrode 19 c may be formed on thetransparent electrode layer 19 a′ and the light-transmissive dielectric layer 19 b′. - The
active layer 14 employed in the embodiment may have a multiple quantum well (MQW) structure in which a plurality of quantum well layers formed of AlxaGa1-xaN (in which 0<xa<1) and a plurality of quantum barrier layers formed of AlxbGa1-xbN (in which xa<xb<1) are alternately stacked. The quantum well of theactive layer 14 may have a band gap that determines a wavelength of ultraviolet light, and theactive layer 14 employed in this embodiment may be configured to emit light having a wavelength of 210 nm to 315 nm. In an implementation, an Al composition ratio xa of the quantum well may be in a range of 0.40 to 1.0, and the Al composition ratio xa may be varied depending on a desired wavelength. - The semiconductor laminate S employed in the embodiment may further include an electron blocking layer (EBL) 15 disposed between the second conductivity-
type semiconductor layer 16 and theactive layer 14. Theelectron blocking layer 15 may have a band gap that is higher than that of the second conductivity-type semiconductor layer 16, and may include a p-type nitride semiconductor represented by Alx5Ga1-x5N (in which x2<x5≤1). In an implementation, an Al composition ratio X5 of theelectron blocking layer 15 may be 0.8 or more. -
FIG. 6A throughFIG. 6F illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device according to an example embodiment. - Referring to
FIG. 6A , thebase layer 12, the first conductivity-type semiconductor layer 13, theactive layer 14, and the second conductivity-type semiconductor layer 16 may be sequentially stacked on thesubstrate 11 to form a semiconductor laminate for emission of ultraviolet light. - In addition, a second conductivity-type nitride layer 17 (having a relatively small band gap) may be formed on the second conductivity-
type semiconductor layer 16. The second conductivity-type nitride layer 17 may be, e.g., an AlGaN layer or a GaN layer having an Al composition ratio smaller than the Al composition ratio of the second conductivity-type semiconductor layer 16. In an implementation, thesubstrate 11 may be formed of sapphire or AlN, as described above. - The first conductivity-
type semiconductor layer 13 may be an n-type nitride semiconductor represented by Alx1Ga1-x1N (in which 0<x1≤1), e.g., may contain n-type AlGaN. The second conductivity-type semiconductor layer 16 may be a p-type nitride semiconductor represented by Alx2Ga1-x2N (in which 0<x2≤1), e.g., may contain p-type AlGaN. In an implementation, theactive layer 14 employed in the embodiment may have a quantum well formed of Alx3Ga1-x3N (in which 0<x3<1). In an implementation, theactive layer 14 may be a multiple quantum well (MQW) structure. - The
base layer 12, the first conductivity-type semiconductor layer 13, theactive layer 14, and the second conductivity-type semiconductor layer 16 may be grown by, e.g., a metal organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HVPE) or MBE (Molecular Beam Epitaxy) process. - Next, referring to
FIG. 6B , the second conductivity-type nitride layer 17 may be selectively etched to form the second conductivity-type nitride patterns 17 p having a desired shape and arrangement. - The second conductivity-
type nitride patterns 17 p may only remain on some regions of the second conductivity-type semiconductor layer 16, and other regions of the second conductivity-type semiconductor layer 16 may be exposed to form an omnidirectional reflector ODR. In an implementation, as shown inFIG. 2 , the second conductivity-type nitride patterns 17 p may be formed as a plurality of circular patterns. In an implementation, the second conductivity-type nitride patterns 17 p may be formed in various other shapes of patterns and/or arrangements. In an implementation, the process may be performed by a reactive ion etching (RIE) process using photolithography. - Next, referring to
FIG. 6C , thetransparent electrode layer 19 a may be formed on the second conductivity-type semiconductor layer 16 so as to cover the second conductivity-type nitride patterns 17 p. - The
transparent electrode layer 19 a may form an ohmic-contact with the second conductivity-type nitride patterns 17 p. Thetransparent electrode layer 19 a located between the second conductivity-type nitride patterns 17 p may directly contact the second conductivity-type semiconductor layer 16, and thus, may have high contact resistance. In an implementation, the second conductivity-type nitride patterns 17 p may be formed of p-type GaN, and thetransparent electrode layer 19 a may be an ITO layer. When thetransparent electrode layer 19 a is ITO, thetransparent electrode layer 10 may be formed to have a thickness of 1 nm or more. - Next, referring to
FIG. 6D , the light-transmissive dielectric layer 19 b may be formed on thetransparent electrode layer 19 a so as to fill a space between the second conductivity-type nitride patterns 17 p. As shown inFIG. 6E , the light-transmissive dielectric layer 19 b may be selectively etched to expose regions e of thetransparent electrode layer 19 a corresponding to the second conductivity-type nitride patterns 17 p. - The light-
transmissive dielectric layer 19 b may have a low refractive index (e.g., 2 or less). For example, the light-transmissive dielectric layer 19 b may include SiO2, SiN, TiO2, HfO or MgF2. The exposed region e of thetransparent electrode layer 19 a may be provided as a contact region with themetal electrode 19 c to be formed in a subsequent process. - Next, referring to
FIG. 6F , themetal electrode 19 c may be formed on the exposed region e of thetransparent electrode layer 19 a and on the light-transmissive dielectric layer 19 b. - The
metal electrode 19 c formed in this process may be formed on the light-transmissive dielectric layer 19 b as well as on the exposed region e of thetransparent electrode layer 19 a. Themetal electrode 19 c may be provided as an omnidirectional reflector in combination with the light-transmissive dielectric layer 19 b, e.g., a low refractive layer. In addition, themetal electrode 19 c may be connected to thetransparent electrode layer 19 a and serve to supply current. In an implementation, themetal electrode 19 c may include Al, Rh, or Ru. - In an implementation, the respective processes may be variously modified and performed. In an implementation, the
transparent electrode layer 19 a may be exposed (seeFIG. 6E ) by a selective etching process after the light-transmissive dielectric layer 19 b is entirely deposited (seeFIG. 6D ). In an implementation, thetransparent electrode layer 19 a may be formed to only fill a region between the second conductivity-type nitride patterns 17 p by using a mask in the deposition process of the light-transmissive dielectric layer 19 b. -
FIG. 7 illustrates a side cross-sectional view of an ultraviolet light emitting device according to an example embodiment. - Referring to
FIG. 7 , it may be understood that an ultravioletlight emitting device 20 according to the embodiment is similar to the ultravioletlight emitting device 10 shown inFIGS. 1 and 2 , with the exception that asecond electrode 29 has a structure different from those shown inFIGS. 1 and 2 , and the ultravioletlight emitting device 20 further includes anelectron blocking layer 15. Descriptions of components of this embodiment may refer to the description of the same or similar components of the ultravioletlight emitting device 10 shown inFIGS. 1 and 2 , unless otherwise specified. - The ultraviolet
light emitting device 20 may include theelectron blocking layer 15 disposed between the second conductivity-type semiconductor layer 16 and theactive layer 14. Theelectron blocking layer 15 may be formed of a nitride semiconductor having an Al composition ratio that is greater than the Al composition ratio of the second conductivity-type semiconductor layer 16. - Similar to the previous embodiment, the second conductivity-
type nitride patterns 17 p may be partially (e.g., discontinuously) disposed on the second conductivity-type semiconductor layer 16. Thetransparent electrode layer 29 a may be disposed on the upper surfaces (e.g., surfaces that face away from the second conductivity-type semiconductor layer 16) of the second conductivity-type nitride patterns 17 p and may not be disposed in the region between the second conductivity-type nitride patterns 17 p. A light-transmissive dielectric layer 29 b may be formed on the upper surface of the second conductivity-type semiconductor layer 16 between the second conductivity-type nitride patterns 17 p. Themetal electrode 29 c may be disposed on thetransparent electrode layer 29 a and the light-transmissive dielectric layer 29 b. In the embodiment, unlike the previous embodiments, thetransparent electrode layer 29 a may not be formed in the region that provides the omnidirectional reflector. -
FIG. 8A throughFIG. 8E illustrate cross-sectional views of stages in a method of manufacturing the ultraviolet light emitting device illustrated inFIG. 7 . - Referring to
FIG. 8A , similarly to the embodiment shown inFIG. 6B , the second conductivity-type nitride layer 17 may be selectively etched to form the second conductivity-type nitride patterns 17 p having a desired shape and arrangement. - The second conductivity-
type nitride patterns 17 p may only remain in some regions of the second conductivity-type semiconductor layer 16, and other regions of the second conductivity-type semiconductor layer 16 may be exposed to later form an omnidirectional reflector ODR. The process may be performed by a dry etching process such as an RIE process, similarly to the case of the previous embodiments. - Next, as shown in
FIG. 8B , the light-transmissive dielectric layer 29 b may be formed so as to cover the second conductivity-type nitride patterns 17 p on the second conductivity-type semiconductor layer 16 and the regions of the second conductivity-type semiconductor layer 16 between the second conductivity-type nitride patterns 17 p. As shown inFIG. 8C , the light-transmissive dielectric layer 29 b may be selectively etched to expose upper surface regions e of the second conductivity-type nitride patterns 17 p. - The light-
transmissive dielectric layer 29 b may have a low refractive index (e.g., 2 or less). In an implementation, the light-transmissive dielectric layer 29 b may include, e.g., SiO2, SiN, TiO2, HfO, or MgF2. The exposed region e of the second conductivity-type nitride patterns 17 p obtained after the selective etching of the light-transmissive dielectric layer 29 b may be provided as a contact region with thetransparent electrode layer 29 a to be formed in the subsequent process. - Next, as shown in
FIG. 8D , thetransparent electrode layer 29 a may be formed on the exposed region of the second conductivity-type nitride pattern 17 p. As shown inFIG. 8E , themetal electrode 29 c may be formed on thetransparent electrode layer 29 a and on the light-transmissive dielectric layer 29 b. - The
transparent electrode layer 29 a may be formed on the exposed region e of the second conductivity-type nitride patterns 17 p by a selective deposition process using a mask. Then, themetal electrode 29 c formed in the present process may be provided onto thetransparent electrode layer 29 a and the light-transmissive dielectric layer 29 b to supply current to thetransparent electrode layer 29 a and at the same time, to combine with the light-transmissive dielectric layer 29 b, thereby being provided as an omnidirectional reflector. In an implementation, themetal electrode 29 c may include, e.g., Al, Rh, or Ku. - In an implementation, the respective processes may be variously modified. In an implementation, the
transparent electrode layer 29 a may be selectively deposited (seeFIG. 8D ) after selective etching of the light-transmissive dielectric layer 29 b (seeFIG. 8C ). In an implementation, after forming thetransparent electrode layer 29 a on a nitride layer (before patterning, seeFIG. 6A ) for the second conductivity-type nitride patterns 17 p, thetransparent electrode layer 29 a may be patterned simultaneously with a patterning process for forming the second conductivity-type nitride patterns 17 p. - By way of summation and review, in the case of UV nitride semiconductor LEDs, the external quantum efficiency thereof could be degraded because of Auger recombination due to crystal defects and a low carrier concentration (e.g., in the case of holes), and they may be configured of highly refractive semiconductors, thereby resulting in low light extraction efficiency. For example, in the case of nitride semiconductor LEDs for a short-wavelength region (e.g., UV-B and UV-C) in an ultraviolet band, light extraction efficiency may be extremely low (e.g., 2% to 3%), and the commercialization of nitride semiconductor LEDs may be difficult. Meanwhile, nitride semiconductor layers having a wide band gap, e.g., AlGaN, may be used so as not to absorb ultraviolet light having a short wavelength therein, and it could be difficult to form an ohmic-contact with an electrode (e.g., a p-type electrode).
- The ultraviolet light emitting devices according to the embodiments may help improve contact resistance by using the transparent electrode layer such as ITO, together with nitride patterns having a relatively small band gap, and at the same time, may help increase light extraction efficiency by providing an omnidirectional reflector with the use of the light-transmissive dielectric layer having a refractive index and the metal electrode. For example, the transparent electrode layer (such as ITO) may extend to a surface of the first conductivity-type semiconductor layer contacting the light-transmissive dielectric layer, and light efficiency may be significantly improved.
- The embodiments may provide an ultraviolet light emitting device having an electrode structure capable of improving light extraction efficiency while allowing for formation of an excellent ohmic-contact.
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116936711A (en) * | 2023-09-19 | 2023-10-24 | 江西兆驰半导体有限公司 | Vertical light emitting diode, preparation method thereof and LED lamp panel |
JP7405902B2 (en) | 2022-05-20 | 2023-12-26 | 日機装株式会社 | Nitride semiconductor light emitting device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110459660B (en) * | 2019-08-06 | 2021-04-16 | 天津三安光电有限公司 | Light-emitting diode, manufacturing process and light-emitting device |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481994B1 (en) | 1996-08-27 | 2005-12-01 | 세이코 엡슨 가부시키가이샤 | Stripping method, transfer method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device manufactured using the same |
USRE38466E1 (en) | 1996-11-12 | 2004-03-16 | Seiko Epson Corporation | Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device |
EP1071143A4 (en) * | 1997-12-08 | 2004-06-30 | Mitsubishi Cable Ind Ltd | GaN-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF PRODUCING GaN-BASED CRYSTAL |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
JP3906654B2 (en) | 2000-07-18 | 2007-04-18 | ソニー株式会社 | Semiconductor light emitting device and semiconductor light emitting device |
WO2003019678A1 (en) | 2001-08-22 | 2003-03-06 | Sony Corporation | Nitride semiconductor element and production method for nitride semiconductor element |
US8545629B2 (en) * | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
JP2003218034A (en) | 2002-01-17 | 2003-07-31 | Sony Corp | Method for selective growth, semiconductor light- emitting element, and its manufacturing method |
JP3815335B2 (en) | 2002-01-18 | 2006-08-30 | ソニー株式会社 | Semiconductor light emitting device and manufacturing method thereof |
KR100499129B1 (en) | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | Light emitting laser diode and fabricatin method thereof |
US7002182B2 (en) | 2002-09-06 | 2006-02-21 | Sony Corporation | Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit |
US6943377B2 (en) | 2002-11-21 | 2005-09-13 | Sensor Electronic Technology, Inc. | Light emitting heterostructure |
KR100714639B1 (en) | 2003-10-21 | 2007-05-07 | 삼성전기주식회사 | light emitting device |
KR100506740B1 (en) | 2003-12-23 | 2005-08-08 | 삼성전기주식회사 | Nitride semiconductor light emitting device and method of manufacturing the same |
KR100586949B1 (en) * | 2004-01-19 | 2006-06-07 | 삼성전기주식회사 | Flip chip type nitride semiconductor light emitting diode |
KR100601945B1 (en) * | 2004-03-10 | 2006-07-14 | 삼성전자주식회사 | Top emitting light emitting device and method of manufacturing thereof |
KR100664985B1 (en) | 2004-10-26 | 2007-01-09 | 삼성전기주식회사 | Nitride based semiconductor device |
KR100665222B1 (en) | 2005-07-26 | 2007-01-09 | 삼성전기주식회사 | Led package with diffusing material and method of manufacturing the same |
KR100661614B1 (en) | 2005-10-07 | 2006-12-26 | 삼성전기주식회사 | Nitride semiconductor light emitting device and method of manufacturing the same |
KR100723247B1 (en) | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | Chip coating type light emitting diode package and fabrication method thereof |
KR100735325B1 (en) | 2006-04-17 | 2007-07-04 | 삼성전기주식회사 | Light emitting diode package and fabrication method thereof |
KR100930171B1 (en) | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | White light emitting device and white light source module using same |
KR100855065B1 (en) | 2007-04-24 | 2008-08-29 | 삼성전기주식회사 | Light emitting diode package |
KR100982980B1 (en) | 2007-05-15 | 2010-09-17 | 삼성엘이디 주식회사 | Plane light source and lcd backlight unit comprising the same |
KR101164026B1 (en) | 2007-07-12 | 2012-07-18 | 삼성전자주식회사 | Nitride semiconductor light emitting device and fabrication method thereof |
KR100891761B1 (en) | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | Semiconductor light emitting device, manufacturing method thereof and semiconductor light emitting device package using the same |
US9331240B2 (en) * | 2008-06-06 | 2016-05-03 | University Of South Carolina | Utlraviolet light emitting devices and methods of fabrication |
KR101332794B1 (en) | 2008-08-05 | 2013-11-25 | 삼성전자주식회사 | Light emitting device, light emitting system comprising the same, and fabricating method of the light emitting device and the light emitting system |
KR20100030470A (en) | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | Light emitting device and system providing white light with various color temperatures |
KR101530876B1 (en) | 2008-09-16 | 2015-06-23 | 삼성전자 주식회사 | Light emitting element with increased light emitting amount, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device |
US8008683B2 (en) | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
JP5641173B2 (en) * | 2009-02-27 | 2014-12-17 | 独立行政法人理化学研究所 | Optical semiconductor device and manufacturing method thereof |
DE102009034359A1 (en) | 2009-07-17 | 2011-02-17 | Forschungsverbund Berlin E.V. | P-contact and LED for the ultraviolet spectral range |
JP5849215B2 (en) | 2010-06-21 | 2016-01-27 | パナソニックIpマネジメント株式会社 | Ultraviolet semiconductor light emitting device |
CN103069584A (en) | 2010-08-11 | 2013-04-24 | 首尔Opto仪器股份有限公司 | Uv light emitting diode and method of manufacturing the same |
US8822976B2 (en) | 2011-03-23 | 2014-09-02 | Soko Kagaku Co., Ltd. | Nitride semiconductor ultraviolet light-emitting element |
US9112115B2 (en) | 2011-04-21 | 2015-08-18 | Soko Kagaku Co., Ltd. | Nitride semiconductor ultraviolet light-emitting element |
KR101813934B1 (en) * | 2011-06-02 | 2018-01-30 | 엘지이노텍 주식회사 | A light emitting device and a light emitting devcie package |
JP5988568B2 (en) * | 2011-11-14 | 2016-09-07 | Dowaエレクトロニクス株式会社 | Semiconductor light emitting device and manufacturing method thereof |
CN102810609B (en) | 2012-08-16 | 2015-01-21 | 厦门市三安光电科技有限公司 | Ultraviolet semiconductor light emitting device and manufacturing method thereof |
KR20140086624A (en) | 2012-12-28 | 2014-07-08 | 삼성전자주식회사 | Nitride-based semiconductor light-emitting device |
KR102076241B1 (en) * | 2013-08-07 | 2020-02-12 | 엘지이노텍 주식회사 | Ultraviolet Light Emitting Device |
KR102050056B1 (en) * | 2013-09-09 | 2019-11-28 | 엘지이노텍 주식회사 | Light Emitting Device |
-
2017
- 2017-12-19 KR KR1020170175149A patent/KR102524809B1/en active IP Right Grant
-
2018
- 2018-06-20 US US16/012,831 patent/US10333025B1/en active Active
- 2018-12-06 CN CN201811486130.5A patent/CN110010740A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7405902B2 (en) | 2022-05-20 | 2023-12-26 | 日機装株式会社 | Nitride semiconductor light emitting device |
CN116936711A (en) * | 2023-09-19 | 2023-10-24 | 江西兆驰半导体有限公司 | Vertical light emitting diode, preparation method thereof and LED lamp panel |
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