US20180342656A1 - Cover for light emitter - Google Patents
Cover for light emitter Download PDFInfo
- Publication number
- US20180342656A1 US20180342656A1 US15/980,907 US201815980907A US2018342656A1 US 20180342656 A1 US20180342656 A1 US 20180342656A1 US 201815980907 A US201815980907 A US 201815980907A US 2018342656 A1 US2018342656 A1 US 2018342656A1
- Authority
- US
- United States
- Prior art keywords
- face
- glass plate
- frame
- low melting
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims abstract description 189
- 238000002844 melting Methods 0.000 claims abstract description 85
- 230000008018 melting Effects 0.000 claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims description 39
- 238000007789 sealing Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005549 size reduction Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/044—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Definitions
- the disclosures herein relate to a cover for a light emitter.
- a light emitter having one or more light emitting devices such as laser diodes is known in the art.
- a light emitter cover having a glass plate sealed to a frame via low melting glass is mounted to a case in which one or more light emitting devices are placed, for example.
- the method of applying low melting glass described above needs a large quantity of low melting glass in order to wet the entire peripheral side surface of a glass plate.
- the size of a light emitter cover increases, giving rise to the problem of an increase in the size of the light emitter.
- Reducing the quantity of low melting glass to facilitate size reduction results in a failure to wet the entire peripheral side surface of a glass plate with low melting glass. This causes the problem of a lowered sealing reliability between the glass plate and the frame.
- Patent Document 1 Japanese Patent Application Publication No. 2006-156528
- a cover for a light emitter having one or more light emitting devices includes a glass plate having an upper face, a lower face, and a peripheral side surface, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step formed on a side thereof to which the glass plate is sealed, wherein the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame, the placement face being in contact with a perimeter of the lower face of the glass plate to have the glass plate placed thereon, and a wall face connecting the upper surface of the frame and the placement face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall
- FIGS. 1A through 1C are drawings illustrating an example of a light emitter cover according to a first embodiment
- FIG. 2 is an axonometric view illustrating an example of the glass plate of the light emitter cover according to the first embodiment
- FIGS. 3A and 3B are axonometric views illustrating an example of the frame of the light emitter cover according to the first embodiment
- FIGS. 4A and 4B are drawings illustrating a method of sealing the glass plate to the frame with low melting glass
- FIG. 5 is a drawing illustrating the method of sealing the glass plate to the frame with low melting glass
- FIGS. 6A through 6C are drawings illustrating the method of sealing the glass plate to the frame with low melting glass
- FIGS. 7A through 7C are drawings illustrating the method of sealing the glass plate to the frame with low melting glass
- FIGS. 8A and 8B are drawings illustrating a method of sealing a frame according to a comparative example
- FIGS. 9A through 9C are drawings illustrating the method of sealing a frame according to the comparative example.
- FIGS. 10A through 10C are drawings illustrating the method of sealing a frame according to the comparative example
- FIG. 11 is an axonometric partial view illustrating an example of a frame of a light emitter cover according to a first variation of the first embodiment.
- FIGS. 12A and 12B are cross-sectional partial views illustrating the example of the frame of a light emitter cover according to the first variation of the first embodiment.
- FIGS. 1A through 1C are drawings illustrating an example of a light emitter cover according to the first embodiment.
- FIG. 1A is an axonometric view.
- FIG. 1B is a partial cross-sectional view taken along a line A-A in FIG. 1A .
- FIG. 1C is a partial cross-sectional view taken along a line B-B in FIG. 1A .
- a light emitter cover 1 includes a glass plate 10 , a frame 20 , and low melting glass 40 .
- the glass plate 10 is sealed to the frame 20 via the low melting glass 40 such as to close an opening 20 x (see FIG. 3 ) of the frame 20 .
- the light emitter cover 1 which is used as a cover for a light emitter having one or more light emitting devices such as laser diodes or photo diodes, serves as a member for hermetically sealing the light emitting devices inside the light emitter.
- FIG. 2 is an axonometric view illustrating an example of the glass plate of the light emitter cover according to the first embodiment.
- the glass plate 10 is a rectangular shape, having an upper face 10 t , a lower face 10 b , and a peripheral side surface 10 s .
- the glass plate 10 is formed in conformity to the specification of the frame 20 .
- the size is not limited to particular dimensions, the glass plate 10 may be approximately 20-mm long, 30-mm wide, and 1-mm thick, for example.
- Borosilicate glass may be used as the glass plate 10 .
- the glass plate 10 serves as a window which allows the passage of light emitted from the light emitting devices.
- transmissivity for the wavelengths of the light emitting devices is designed to be greater or equal to a predetermined value (e.g., 99%).
- the upper face 10 t and the lower face 10 b of the glass plate 10 may have an antireflection film formed thereon.
- FIGS. 3A and 3B are axonometric views illustrating an example of the frame of the light emitter cover according to the first embodiment.
- FIG. 3A illustrates the whole view
- FIG. 3B illustrates a partial enlarged view of a portion C illustrated in FIG. 3A .
- the frame 20 is, a metal member having the opening 20 x smaller than the glass plate 10 , and may be a picture frame shape, for example.
- the metal that forms the frame 20 may be an alloy of nickel and iron, for example.
- the surface of the frame 20 may have a surface treatment, such as plating, applied thereto.
- the frame 20 has an encircling (i.e., ring-shaped) step 30 formed on the side toward the opening 20 x .
- the step 30 includes a placement face 31 and wall faces 32 .
- the placement face 31 extends substantially parallel to an upper face 20 t of the frame 20 at a recessed position relative to (i.e., at a lower vertical position than) the upper face 20 t of the frame 20 .
- the placement face 31 comes in contact with the lower face 10 b of the glass plate 10 so as to provide support for the glass plate 10 .
- the placement face 31 suffices as long as some portions thereof extend substantially parallel to the upper face of the frame 20 , and may have a portion that is not parallel to the upper face of the frame 20 .
- the expression “extending substantially parallel to the upper face of the frame 20 ” refers to the fact that the face is substantially parallel to the upper face of the frame 20 to the extent that the placement of the glass plate 10 is not impaired.
- the wall faces 32 are portions connecting the placement face 31 to the upper face 20 t of the frame 20 .
- the wall faces 32 include first wall faces 32 a situated near the opposite ends of each of the four inner sides of the encircling step 30 , and include a second wall face 32 b situated between the first wall faces 32 a .
- the term “the four inner sides of the encircling step 30 ” refers to the four sides forming the perimeter of the opening 20 x when viewed in the direction perpendicular to the upper face 20 t of the frame 20 .
- the first wall faces 32 a extend perpendicularly to the placement face 31 for the purpose of aligning the glass plate 10 .
- This “perpendicular” condition does not require an exact right angle, and only requires that the faces are perpendicular to the placement face 31 to the extent that the alignment of the glass plate 10 is not impaired. This definition of the condition will hereinafter be applicable in similar situations.
- a minute gap i.e., clearance
- the gap between the first wall faces 32 a and the peripheral side surface 10 s of the glass plate 10 may be approximately 100 micrometers, for example.
- the second wall face 32 b has an inclination angle ⁇ (see FIG. 10 ) that is less steep than the first wall faces 32 a .
- the second wall face 32 b is tilted with respect to the placement face 31 such that the distance between the second wall face 32 b and the peripheral side surface 10 s of the glass plate 10 increases toward the upper face 20 t of the frame 20 .
- the inclination angle ⁇ is set greater than or equal to the minimum angle at which the melted mass of the low melting glass 40 starts sliding on its own weight.
- the inclination angle ⁇ may be approximately 30 to 60 degrees, for example.
- the second wall face 32 b preferably extend the same distance toward the opposite ends from the center (i.e., a midpoint between the opposite ends) of each inner side of the step 30 , for example.
- the ratio of the length of the first wall faces 32 a to the length of the second wall face 32 b along the inner side is preferably about 1:1 to 1:9. These conditions serve to reliably seal the glass plate 10 to the frame 20 .
- the low melting glass 40 which is a member for sealing the glass plate 10 to the frame 20 , is made of a material having a lower melting point than the glass plate 10 .
- Low melting glass containing bismuth as a main component without containing lead or low melting glass containing vanadium without containing lead may be used as the low melting glass 40 , for example.
- the gap between the first wall faces 32 a and the peripheral side surface 10 s of the glass plate 10 and the gap between the second wall face 32 b and the peripheral side surface 10 s of the glass plate 10 are filled with the low melting glass 40 .
- the upper face 10 t of the glass plate 10 is situated above the upper face 20 t of the frame 20 .
- the low melting glass 40 covers the portion of the peripheral side surface 10 s of the glass plate 10 that is situated above the upper face 20 t of the frame 20 . Namely, the entire peripheral side surface 10 s of the glass plate 10 is in contact with the low melting glass 40 (i.e., wetted by the low melting glass 40 ).
- the low melting glass 40 may flow into between the placement face 31 and the perimeter of the lower face 10 b of the glass plate 10 .
- FIGS. 4A and 4B to FIGS. 7A through 7C are drawings illustrating the method of sealing the glass plate to the frame with the low melting glass.
- the frame 20 having the opening 20 x and the step 30 is prepared.
- the frame 20 may be made by a stamping process using a metal material such as an alloy of nickel and iron, for example.
- the surface of the frame 20 may have a surface treatment such as plating applied thereto after the stamping process.
- the glass plate having a rectangular shape is cut from a large size glass plate made of borosilicate glass or the like, for example.
- the glass plate 10 is placed in the opening 20 x of the frame 20 such that the perimeter of the lower face 10 b (see FIG. 2 , for example) of the glass plate 10 comes in contact with the placement face 31 .
- the upper face 10 t and the lower face 10 b of the glass plate 10 may have an antireflection film formed thereon.
- low melting glass particles 40 a are formed into a picture frame shape, followed by being sintered at a predetermined temperature to create a low melting glass 40 b illustrated in a lower part of FIG. 5 .
- the sintered low melting glass 40 b contracts relative to the shape of the low melting glass particles 40 a , with the center area of each inner side and each outer side bulging outwardly.
- the low melting glass particles 40 a , the sintered low melting glass 40 b , and the sealed low melting glass 40 are denoted with respective reference numerals.
- FIGS. 6A through 6C the low melting glass 40 b is placed on the frame 20 having the glass plate 10 seated thereon (see FIG. 4B ).
- FIG. 6A is a plan view.
- FIG. 6B is a partial cross-sectional view taken along a line A-A in FIG. 6A .
- FIG. 6C is a partial cross-sectional view taken along a line B-B in FIG. 6A .
- Each inner side and each outer side of the low melting glass 40 b has an outwardly bulging center area, so that a gap between the low melting glass 40 b and the peripheral side surface 10 s of the glass plate 10 increases around the center area of each inner side and each outer side.
- FIGS. 7A through 7C the low melting glass 40 b is melted at or above a predetermined temperature and then cured, so that the glass plate 10 is sealed to the frame 20 .
- the cured glass is referred to as the low melting glass 40 .
- the light emitter cover 1 is completed in final form.
- FIG. 7A is a plan view.
- FIG. 7B is a partial cross-sectional view taken along a line A-A in FIG. 7A .
- FIG. 7C is a partial cross-sectional view taken along a line B-B in FIG. 7A .
- FIGS. 8A and 8B through FIGS. 10A through 10C are drawings illustrating a method of sealing a frame according to a comparative example.
- a frame 200 having an opening 200 x is prepared.
- the frame 200 has an encircling (i.e., ring-shaped) step 300 formed on the side toward the opening 200 x .
- the step 300 includes a placement face 310 and wall faces 320 .
- the placement face 310 extends substantially parallel to an upper face 200 t of the frame 200 at a recessed position relative to (i.e., at a lower vertical position than) the upper face 200 t of the frame 200 .
- the placement face 31 comes in contact with the lower face 10 b of the glass plate 10 so as to provide support for the glass plate 10 .
- the wall faces 320 are portions connecting the placement face 310 to the upper face 200 t of the frame 200 .
- the entirety of the wall faces 320 extends perpendicularly to the placement face 310 . There is no inclined face corresponding to the second wall face 32 b of the frame 20 .
- the same rectangular-shaped glass plate 10 as the one shown in FIG. 4B is prepared, and is placed in the opening 200 x of the frame 200 such that the perimeter of the lower face 10 b of the glass plate 10 (see FIG. 2 ) comes in contact with the placement face 310 .
- FIG. 9A is a plan view.
- FIG. 9B is a partial cross-sectional view taken along a line A-A in FIG. 9A .
- FIG. 9C is a partial cross-sectional view taken along a line B-B in FIG. 9A .
- Each inner side and each outer side of the low melting glass 40 b has an outwardly bulging center area, so that a gap between the low melting glass 40 b and the peripheral side surface 10 s of the glass plate 10 increases around the center area of each inner side and each outer side. Because of this, the center area of each inner side of the low melting glass 40 b does not reach the position of the step 300 .
- FIGS. 10A through 10C the low melting glass 40 b is melted at or above a predetermined temperature and then cured, so that the glass plate 10 is sealed to the frame 200 .
- the cured glass is referred to as the low melting glass 40 .
- FIG. 10A is a plan view.
- FIG. 10B is a partial cross-sectional view taken along a line A-A in FIG. 10A .
- FIG. 100 is a partial cross-sectional view taken along a line B-B in FIG. 10A .
- the center area of each inner side and each outer side of the low melting glass 40 b bulges outwardly, so that the center area of each inner side of the low melting glass 40 b does not reach the position of the step 300 . Because of this, the melted mass of the low melting glass 40 b does not readily flow toward the peripheral side surface 10 s at the center area of each inner side and each outer side of the low melting glass 40 b .
- a likely resulting condition is that the peripheral side surface 10 s of the glass plate 10 is not wetted (as illustrated in FIG. 100 ), or only partly wetted, by the low melting glass 40 at the center area of each inner side and each outer side of the low melting glass 40 b . It is thus difficult to reliably seal the entire peripheral side surface 10 s of the glass plate 10 .
- the frame 20 of the light emitter cover 1 has the second wall face 32 b , at the position corresponding to the bulges of the low melting glass 40 b , extending at an inclination angle greater than or equal to the minimum angle at which the melted mass of the low melting glass 40 b starts sliding on its own weight.
- the melted liquid mass of the low melting glass 40 b flows on the second wall face 32 b toward the peripheral side surface 10 s of the glass plate 10 , resulting in being cured while being in contact with the peripheral side surface 10 s .
- the entire peripheral side surface 10 s of the glass plate 10 is reliably sealed with the low melting glass 40 , which improves sealing reliability between the glass plate 10 and the frame 20 .
- Lead-free low melting glass has poor wettability unlike low melting glass containing lead. Because of this, the use of the tilted second wall face 32 b is advantageous especially when lead-free low melting glass is used as a seal between the glass plate 10 and the frame 20 .
- a method of applying a large quantity of low melting glass to seal a glass plate to a frame is not used for the light emitter cover 1 , which facilitates the size reduction of the light emitter cover 1 .
- the first wall faces 32 a extend perpendicularly to the placement face 31 .
- the low melting glass 40 b have no bulges or only minute bulges, so that a gap between the low melting glass 40 b and the peripheral side surface 10 s of the glass plate 10 is small.
- the entire peripheral side surface 10 s of the glass plate 10 is reliably sealed even in the absence of inclined faces such as the second wall face 32 b .
- the first wall faces 32 a may be provided as inclined faces at the inclination angle ⁇ similarly to the second wall face 32 b .
- the entire wall faces 32 may be provided as inclined faces at the inclination angle ⁇ .
- first wall faces 32 a extending perpendicularly to the placement face 31 is advantageous from the viewpoint of alignment of the glass plate 10 relative to the frame 20 , and is also advantageous when considering the tilt of the glass plate 10 relative to the placement face 31 . Namely, the perimeter of the lower face 10 b of the glass plate 10 is prevented from climbing over the inclined second wall face 32 b.
- the first variation of the first embodiment is directed to an example of a light emitter cover with a step having a different shape than the first embodiment.
- a description of the same or similar constituent elements as those of the previously provided descriptions may be omitted as appropriate.
- FIG. 11 is an axonometric partial view of the frame of a light emitter cover according to the first variation of the first embodiment.
- FIG. 11 illustrates the portion corresponding to FIG. 3B .
- FIGS. 12A and 12B are partial cross-sectional views of the light emitter cover according to the first variation of the first embodiment.
- FIGS. 12A and 12B illustrate cross-sections corresponding to FIG. 1B and FIG. 10 , respectively.
- a light emitter cover 1 A according to the first variation of the first embodiment differs from the light emitter cover 1 (see FIGS. 1A through 1C to FIGS. 3A and 3B ) in that a frame 20 A replaces the frame 20 .
- the frame 20 A is a metal member having the opening 20 x smaller than the glass plate 10 , and may be a picture frame shape, for example.
- the metal that forms the frame 20 A may be an alloy of nickel and iron, for example.
- the surface of the frame 20 A may have a surface treatment, such as plating, applied thereto.
- the frame 20 A has an encircling (i.e., ring-shaped) step 30 A formed on the side toward the opening 20 x .
- the step 30 A includes a placement face 31 and wall faces 32 A.
- the placement face 31 is the same as that of the frame 20 .
- the wall faces 32 A are portions connecting the placement face 31 to the upper face 20 t of the frame 20 A.
- the wall faces 32 A include first wall faces 32 a situated near the opposite ends of each of the four inner sides of the encircling step 30 A, and include a second wall face 32 c situated between the first wall faces 32 a .
- the second wall face 32 c includes a first face 321 situated toward the upper face 20 t of the frame 20 A and a second face 322 situated between the first face 321 and the placement face 31 .
- the first face 321 extends at an inclination angle smaller than the first wall faces 32 a with respect to the placement face 31 .
- the first face 321 is tilted with respect to the placement face 31 such that the distance between the first face 321 and the peripheral side surface 10 s of the glass plate 10 increases toward the upper face 20 t of the frame 20 A.
- the inclination angle ⁇ is set greater than or equal to the minimum angle at which the melted mass of the low melting glass 40 starts sliding on its own weight.
- the inclination angle ⁇ may be approximately 30 to 60 degrees, for example.
- the second face 322 has an inclination angle steeper than the first face 321 with respect to the placement face 31 .
- the second face 322 may extend perpendicularly to the placement face 31 , for example.
- a minute gap i.e., clearance
- the gap between the second face 322 and the peripheral side surface 10 s of the glass plate 10 may be approximately 100 micrometers, for example.
- the frame 20 A of the light emitter cover 1 A has the first face 321 of the second wall face 32 c , at the position corresponding to the bulges of the low melting glass 40 b (see FIG. 5 , for example), extending at an inclination angle greater than or equal to the minimum angle at which the melted mass of the low melting glass 40 b starts sliding on its own weight.
- the melted liquid mass of the low melting glass 40 b flows on the first face 321 toward the peripheral side surface 10 s of the glass plate 10 , resulting in being cured while being in contact with the peripheral side surface 10 s .
- the entire peripheral side surface 10 s of the glass plate 10 is reliably sealed.
- the second face 322 as a vertical wall, for example, on the side of the first face 321 toward the placement face 31 allows the glass plate 10 to be more readily aligned in the opening 20 x of the frame 20 A.
- the plane shape of the glass plate does not have to be rectangular, and may alternatively be a hexagonal shape, for example.
- a cover for a light emitter that has an improved sealing reliability between a glass plate and a frame while facilitating size reduction.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Joining Of Glass To Other Materials (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
- The present application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2017-104714 filed on May 26, 2017, with the Japanese Patent Office, the entire contents of which are incorporated herein by reference.
- The disclosures herein relate to a cover for a light emitter.
- A light emitter having one or more light emitting devices such as laser diodes is known in the art. When the airtightness of a light emitter matters, a light emitter cover having a glass plate sealed to a frame via low melting glass is mounted to a case in which one or more light emitting devices are placed, for example.
- With the advancement of technology, heat quantity generated by a light emitting device increases, which makes it necessary to bond the glass plate and the frame together more firmly than ever for a light emitter cover. For the purpose of firm bonding, there is a need to fill a gap, with low melting glass, between the peripheral side surface of a glass plate and the inner wall face of a frame so that the low melting glass wets the entire peripheral side surface of the glass plate.
- For example, there is a method of filling a gap with low melting glass by applying low melting glass in paste form to the gap between the peripheral side surface of a glass plate and the inner sidewall of a frame, followed by curing the paste.
- The method of applying low melting glass described above needs a large quantity of low melting glass in order to wet the entire peripheral side surface of a glass plate. As a result, the size of a light emitter cover increases, giving rise to the problem of an increase in the size of the light emitter. Reducing the quantity of low melting glass to facilitate size reduction results in a failure to wet the entire peripheral side surface of a glass plate with low melting glass. This causes the problem of a lowered sealing reliability between the glass plate and the frame.
- According to an aspect of the embodiment, a cover for a light emitter having one or more light emitting devices includes a glass plate having an upper face, a lower face, and a peripheral side surface, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step formed on a side thereof to which the glass plate is sealed, wherein the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame, the placement face being in contact with a perimeter of the lower face of the glass plate to have the glass plate placed thereon, and a wall face connecting the upper surface of the frame and the placement face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face, and wherein gaps between the first wall faces and the peripheral side surface of the glass plate and a gap between the second wall face and the peripheral side surface of the glass plate are filled with the low melting glass.
- The object and advantages of the embodiment will be realized and attained by means of the elements and combinations particularly pointed out in the claims. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
-
FIGS. 1A through 1C are drawings illustrating an example of a light emitter cover according to a first embodiment; -
FIG. 2 is an axonometric view illustrating an example of the glass plate of the light emitter cover according to the first embodiment; -
FIGS. 3A and 3B are axonometric views illustrating an example of the frame of the light emitter cover according to the first embodiment; -
FIGS. 4A and 4B are drawings illustrating a method of sealing the glass plate to the frame with low melting glass; -
FIG. 5 is a drawing illustrating the method of sealing the glass plate to the frame with low melting glass; -
FIGS. 6A through 6C are drawings illustrating the method of sealing the glass plate to the frame with low melting glass; -
FIGS. 7A through 7C are drawings illustrating the method of sealing the glass plate to the frame with low melting glass; -
FIGS. 8A and 8B are drawings illustrating a method of sealing a frame according to a comparative example; -
FIGS. 9A through 9C are drawings illustrating the method of sealing a frame according to the comparative example; -
FIGS. 10A through 10C are drawings illustrating the method of sealing a frame according to the comparative example; -
FIG. 11 is an axonometric partial view illustrating an example of a frame of a light emitter cover according to a first variation of the first embodiment; and -
FIGS. 12A and 12B are cross-sectional partial views illustrating the example of the frame of a light emitter cover according to the first variation of the first embodiment. - In the following, embodiments will be described by referring to the accompanying drawings. In these drawings, the same elements are referred to by the same references, and a duplicate description thereof may be omitted.
-
FIGS. 1A through 1C are drawings illustrating an example of a light emitter cover according to the first embodiment.FIG. 1A is an axonometric view.FIG. 1B is a partial cross-sectional view taken along a line A-A inFIG. 1A .FIG. 1C is a partial cross-sectional view taken along a line B-B inFIG. 1A . - Referring to
FIGS. 1A through 1C , alight emitter cover 1 includes aglass plate 10, aframe 20, andlow melting glass 40. Theglass plate 10 is sealed to theframe 20 via thelow melting glass 40 such as to close an opening 20 x (seeFIG. 3 ) of theframe 20. Thelight emitter cover 1, which is used as a cover for a light emitter having one or more light emitting devices such as laser diodes or photo diodes, serves as a member for hermetically sealing the light emitting devices inside the light emitter. -
FIG. 2 is an axonometric view illustrating an example of the glass plate of the light emitter cover according to the first embodiment. As illustrated inFIG. 2 , theglass plate 10 is a rectangular shape, having anupper face 10 t, alower face 10 b, and aperipheral side surface 10 s. Theglass plate 10 is formed in conformity to the specification of theframe 20. Although the size is not limited to particular dimensions, theglass plate 10 may be approximately 20-mm long, 30-mm wide, and 1-mm thick, for example. - Borosilicate glass may be used as the
glass plate 10. When thelight emitter cover 1 is used as the cover for a package in which light emitting devices are placed, theglass plate 10 serves as a window which allows the passage of light emitted from the light emitting devices. For this purpose, transmissivity for the wavelengths of the light emitting devices is designed to be greater or equal to a predetermined value (e.g., 99%). Theupper face 10 t and thelower face 10 b of theglass plate 10 may have an antireflection film formed thereon. -
FIGS. 3A and 3B are axonometric views illustrating an example of the frame of the light emitter cover according to the first embodiment.FIG. 3A illustrates the whole view, andFIG. 3B illustrates a partial enlarged view of a portion C illustrated inFIG. 3A . As is illustrated inFIGS. 3A and 3B , theframe 20 is, a metal member having the opening 20 x smaller than theglass plate 10, and may be a picture frame shape, for example. The metal that forms theframe 20 may be an alloy of nickel and iron, for example. The surface of theframe 20 may have a surface treatment, such as plating, applied thereto. - The
frame 20 has an encircling (i.e., ring-shaped)step 30 formed on the side toward theopening 20 x. Thestep 30 includes aplacement face 31 and wall faces 32. Theplacement face 31 extends substantially parallel to anupper face 20 t of theframe 20 at a recessed position relative to (i.e., at a lower vertical position than) theupper face 20 t of theframe 20. Theplacement face 31 comes in contact with thelower face 10 b of theglass plate 10 so as to provide support for theglass plate 10. Theplacement face 31 suffices as long as some portions thereof extend substantially parallel to the upper face of theframe 20, and may have a portion that is not parallel to the upper face of theframe 20. The expression “extending substantially parallel to the upper face of theframe 20” refers to the fact that the face is substantially parallel to the upper face of theframe 20 to the extent that the placement of theglass plate 10 is not impaired. - The wall faces 32 are portions connecting the
placement face 31 to theupper face 20 t of theframe 20. The wall faces 32 include first wall faces 32 a situated near the opposite ends of each of the four inner sides of the encirclingstep 30, and include asecond wall face 32 b situated between the first wall faces 32 a. The term “the four inner sides of the encirclingstep 30” refers to the four sides forming the perimeter of theopening 20 x when viewed in the direction perpendicular to theupper face 20 t of theframe 20. - The first wall faces 32 a extend perpendicularly to the
placement face 31 for the purpose of aligning theglass plate 10. This “perpendicular” condition does not require an exact right angle, and only requires that the faces are perpendicular to theplacement face 31 to the extent that the alignment of theglass plate 10 is not impaired. This definition of the condition will hereinafter be applicable in similar situations. A minute gap (i.e., clearance) is formed between the first wall faces 32 a and theperipheral side surface 10 s of theglass plate 10. The gap between the first wall faces 32 a and theperipheral side surface 10 s of theglass plate 10 may be approximately 100 micrometers, for example. - The
second wall face 32 b has an inclination angle θ (seeFIG. 10 ) that is less steep than the first wall faces 32 a. Thesecond wall face 32 b is tilted with respect to theplacement face 31 such that the distance between thesecond wall face 32 b and theperipheral side surface 10 s of theglass plate 10 increases toward theupper face 20 t of theframe 20. The inclination angle θ is set greater than or equal to the minimum angle at which the melted mass of thelow melting glass 40 starts sliding on its own weight. The inclination angle θ may be approximately 30 to 60 degrees, for example. - The
second wall face 32 b preferably extend the same distance toward the opposite ends from the center (i.e., a midpoint between the opposite ends) of each inner side of thestep 30, for example. On each inner side of thestep 30, the ratio of the length of the first wall faces 32 a to the length of thesecond wall face 32 b along the inner side is preferably about 1:1 to 1:9. These conditions serve to reliably seal theglass plate 10 to theframe 20. - By referring to
FIGS. 1A through 1C again, thelow melting glass 40, which is a member for sealing theglass plate 10 to theframe 20, is made of a material having a lower melting point than theglass plate 10. Low melting glass containing bismuth as a main component without containing lead or low melting glass containing vanadium without containing lead may be used as thelow melting glass 40, for example. - The gap between the first wall faces 32 a and the
peripheral side surface 10 s of theglass plate 10 and the gap between thesecond wall face 32 b and theperipheral side surface 10 s of theglass plate 10 are filled with thelow melting glass 40. Theupper face 10 t of theglass plate 10 is situated above theupper face 20 t of theframe 20. Thelow melting glass 40 covers the portion of theperipheral side surface 10 s of theglass plate 10 that is situated above theupper face 20 t of theframe 20. Namely, the entireperipheral side surface 10 s of theglass plate 10 is in contact with the low melting glass 40 (i.e., wetted by the low melting glass 40). Thelow melting glass 40 may flow into between theplacement face 31 and the perimeter of thelower face 10 b of theglass plate 10. - In the following, a description will be given of the method of sealing the
glass plate 10 to theframe 20 with thelow melting glass 40.FIGS. 4A and 4B toFIGS. 7A through 7C are drawings illustrating the method of sealing the glass plate to the frame with the low melting glass. As illustrated inFIG. 4A , theframe 20 having the opening 20 x and thestep 30 is prepared. Theframe 20 may be made by a stamping process using a metal material such as an alloy of nickel and iron, for example. The surface of theframe 20 may have a surface treatment such as plating applied thereto after the stamping process. - As illustrated in
FIG. 4B , the glass plate having a rectangular shape is cut from a large size glass plate made of borosilicate glass or the like, for example. Theglass plate 10 is placed in theopening 20 x of theframe 20 such that the perimeter of thelower face 10 b (seeFIG. 2 , for example) of theglass plate 10 comes in contact with theplacement face 31. Theupper face 10 t and thelower face 10 b of theglass plate 10 may have an antireflection film formed thereon. - Subsequently, as illustrated in an upper part of
FIG. 5 , for example, lowmelting glass particles 40 a are formed into a picture frame shape, followed by being sintered at a predetermined temperature to create alow melting glass 40 b illustrated in a lower part ofFIG. 5 . The sinteredlow melting glass 40 b contracts relative to the shape of the lowmelting glass particles 40 a, with the center area of each inner side and each outer side bulging outwardly. For the sake of convenience of explanation, the lowmelting glass particles 40 a, the sinteredlow melting glass 40 b, and the sealedlow melting glass 40 are denoted with respective reference numerals. - As illustrated in
FIGS. 6A through 6C , thelow melting glass 40 b is placed on theframe 20 having theglass plate 10 seated thereon (seeFIG. 4B ).FIG. 6A is a plan view.FIG. 6B is a partial cross-sectional view taken along a line A-A inFIG. 6A .FIG. 6C is a partial cross-sectional view taken along a line B-B inFIG. 6A . Each inner side and each outer side of thelow melting glass 40 b has an outwardly bulging center area, so that a gap between thelow melting glass 40 b and theperipheral side surface 10 s of theglass plate 10 increases around the center area of each inner side and each outer side. - As illustrated in
FIGS. 7A through 7C , thelow melting glass 40 b is melted at or above a predetermined temperature and then cured, so that theglass plate 10 is sealed to theframe 20. The cured glass is referred to as thelow melting glass 40. With this, thelight emitter cover 1 is completed in final form.FIG. 7A is a plan view.FIG. 7B is a partial cross-sectional view taken along a line A-A inFIG. 7A .FIG. 7C is a partial cross-sectional view taken along a line B-B inFIG. 7A . - In the following, the characteristic advantages of the
light emitter cover 1 will be described by referring to a comparative example.FIGS. 8A and 8B throughFIGS. 10A through 10C are drawings illustrating a method of sealing a frame according to a comparative example. - As illustrated in
FIG. 8A , aframe 200 having anopening 200 x is prepared. Theframe 200 has an encircling (i.e., ring-shaped)step 300 formed on the side toward theopening 200 x. Thestep 300 includes aplacement face 310 and wall faces 320. Theplacement face 310 extends substantially parallel to anupper face 200 t of theframe 200 at a recessed position relative to (i.e., at a lower vertical position than) theupper face 200 t of theframe 200. Theplacement face 31 comes in contact with thelower face 10 b of theglass plate 10 so as to provide support for theglass plate 10. The wall faces 320 are portions connecting theplacement face 310 to theupper face 200 t of theframe 200. The entirety of the wall faces 320 extends perpendicularly to theplacement face 310. There is no inclined face corresponding to thesecond wall face 32 b of theframe 20. - As illustrated in
FIG. 8B , the same rectangular-shapedglass plate 10 as the one shown inFIG. 4B is prepared, and is placed in theopening 200 x of theframe 200 such that the perimeter of thelower face 10 b of the glass plate 10 (seeFIG. 2 ) comes in contact with theplacement face 310. - As illustrated in
FIG. 9A , the samelow melting glass 40 b as the one shown inFIG. 5 is prepared, and is placed on theframe 200 having theglass plate 10 seated thereon (seeFIG. 8B ).FIG. 9A is a plan view.FIG. 9B is a partial cross-sectional view taken along a line A-A inFIG. 9A .FIG. 9C is a partial cross-sectional view taken along a line B-B inFIG. 9A . Each inner side and each outer side of thelow melting glass 40 b has an outwardly bulging center area, so that a gap between thelow melting glass 40 b and theperipheral side surface 10 s of theglass plate 10 increases around the center area of each inner side and each outer side. Because of this, the center area of each inner side of thelow melting glass 40 b does not reach the position of thestep 300. - As illustrated in
FIGS. 10A through 10C , thelow melting glass 40 b is melted at or above a predetermined temperature and then cured, so that theglass plate 10 is sealed to theframe 200. The cured glass is referred to as thelow melting glass 40.FIG. 10A is a plan view.FIG. 10B is a partial cross-sectional view taken along a line A-A inFIG. 10A .FIG. 100 is a partial cross-sectional view taken along a line B-B inFIG. 10A . - As is illustrated in
FIGS. 9A through 9C , the center area of each inner side and each outer side of thelow melting glass 40 b bulges outwardly, so that the center area of each inner side of thelow melting glass 40 b does not reach the position of thestep 300. Because of this, the melted mass of thelow melting glass 40 b does not readily flow toward theperipheral side surface 10 s at the center area of each inner side and each outer side of thelow melting glass 40 b. A likely resulting condition is that theperipheral side surface 10 s of theglass plate 10 is not wetted (as illustrated inFIG. 100 ), or only partly wetted, by thelow melting glass 40 at the center area of each inner side and each outer side of thelow melting glass 40 b. It is thus difficult to reliably seal the entireperipheral side surface 10 s of theglass plate 10. - In contrast, the
frame 20 of thelight emitter cover 1 has thesecond wall face 32 b, at the position corresponding to the bulges of thelow melting glass 40 b, extending at an inclination angle greater than or equal to the minimum angle at which the melted mass of thelow melting glass 40 b starts sliding on its own weight. As illustrated inFIG. 7C , therefore, the melted liquid mass of thelow melting glass 40 b flows on thesecond wall face 32 b toward theperipheral side surface 10 s of theglass plate 10, resulting in being cured while being in contact with theperipheral side surface 10 s. With this arrangement, the entireperipheral side surface 10 s of theglass plate 10 is reliably sealed with thelow melting glass 40, which improves sealing reliability between theglass plate 10 and theframe 20. - If there is a gap between the
low melting glass 40 and part of theperipheral side surface 10 s of theglass plate 10 as a result of a failure to seal the entireperipheral side surface 10 s of theglass plate 10 with thelow melting glass 40, there is a risk that a crack starts from the gap and develops in thelow melting glass 40 upon thermal impact. Securely sealing the entireperipheral side surface 10 s of theglass plate 10 with thelow melting glass 40 can prevent a crack from developing in thelow melting glass 40 upon thermal impact. It may be noted that thermal impact may occur when thelight emitter cover 1 is placed in the environment in which the temperature frequently alternates between a high temperature and a low temperature, for example. - Lead-free low melting glass has poor wettability unlike low melting glass containing lead. Because of this, the use of the tilted
second wall face 32 b is advantageous especially when lead-free low melting glass is used as a seal between theglass plate 10 and theframe 20. - A method of applying a large quantity of low melting glass to seal a glass plate to a frame is not used for the
light emitter cover 1, which facilitates the size reduction of thelight emitter cover 1. - The first wall faces 32 a extend perpendicularly to the
placement face 31. At the positions of the first wall faces 32 a, however, thelow melting glass 40 b have no bulges or only minute bulges, so that a gap between thelow melting glass 40 b and theperipheral side surface 10 s of theglass plate 10 is small. At these positions, therefore, the entireperipheral side surface 10 s of theglass plate 10 is reliably sealed even in the absence of inclined faces such as thesecond wall face 32 b. Notwithstanding this, the first wall faces 32 a may be provided as inclined faces at the inclination angle θ similarly to thesecond wall face 32 b. Namely, the entire wall faces 32 may be provided as inclined faces at the inclination angle θ. With such an arrangement, aligning theglass plate 10 with respect to theframe 20 becomes more difficult. A dedicated tool for alignment, for example, may be made to cope with this issue. - Use of the first wall faces 32 a extending perpendicularly to the
placement face 31 is advantageous from the viewpoint of alignment of theglass plate 10 relative to theframe 20, and is also advantageous when considering the tilt of theglass plate 10 relative to theplacement face 31. Namely, the perimeter of thelower face 10 b of theglass plate 10 is prevented from climbing over the inclinedsecond wall face 32 b. - The first variation of the first embodiment is directed to an example of a light emitter cover with a step having a different shape than the first embodiment. In connection with the first variation of the first embodiment, a description of the same or similar constituent elements as those of the previously provided descriptions may be omitted as appropriate.
-
FIG. 11 is an axonometric partial view of the frame of a light emitter cover according to the first variation of the first embodiment.FIG. 11 illustrates the portion corresponding toFIG. 3B .FIGS. 12A and 12B are partial cross-sectional views of the light emitter cover according to the first variation of the first embodiment.FIGS. 12A and 12B illustrate cross-sections corresponding toFIG. 1B andFIG. 10 , respectively. - As illustrated in
FIG. 11 andFIGS. 12A and 12B , alight emitter cover 1A according to the first variation of the first embodiment differs from the light emitter cover 1 (seeFIGS. 1A through 1C toFIGS. 3A and 3B ) in that aframe 20A replaces theframe 20. - Similarly to the
frame 20, theframe 20A is a metal member having the opening 20 x smaller than theglass plate 10, and may be a picture frame shape, for example. The metal that forms theframe 20A may be an alloy of nickel and iron, for example. The surface of theframe 20A may have a surface treatment, such as plating, applied thereto. - The
frame 20A has an encircling (i.e., ring-shaped)step 30A formed on the side toward theopening 20 x. Thestep 30A includes aplacement face 31 and wall faces 32A. Theplacement face 31 is the same as that of theframe 20. The wall faces 32A are portions connecting theplacement face 31 to theupper face 20 t of theframe 20A. The wall faces 32A include first wall faces 32 a situated near the opposite ends of each of the four inner sides of theencircling step 30A, and include asecond wall face 32 c situated between the first wall faces 32 a. Thesecond wall face 32 c includes afirst face 321 situated toward theupper face 20 t of theframe 20A and asecond face 322 situated between thefirst face 321 and theplacement face 31. - The
first face 321 extends at an inclination angle smaller than the first wall faces 32 a with respect to theplacement face 31. Thefirst face 321 is tilted with respect to theplacement face 31 such that the distance between thefirst face 321 and theperipheral side surface 10 s of theglass plate 10 increases toward theupper face 20 t of theframe 20A. The inclination angle θ is set greater than or equal to the minimum angle at which the melted mass of thelow melting glass 40 starts sliding on its own weight. The inclination angle θ may be approximately 30 to 60 degrees, for example. - The
second face 322 has an inclination angle steeper than thefirst face 321 with respect to theplacement face 31. Thesecond face 322 may extend perpendicularly to theplacement face 31, for example. A minute gap (i.e., clearance) is formed between thesecond face 322 and theperipheral side surface 10 s of theglass plate 10. The gap between thesecond face 322 and theperipheral side surface 10 s of theglass plate 10 may be approximately 100 micrometers, for example. - The
frame 20A of thelight emitter cover 1A has thefirst face 321 of thesecond wall face 32 c, at the position corresponding to the bulges of thelow melting glass 40 b (seeFIG. 5 , for example), extending at an inclination angle greater than or equal to the minimum angle at which the melted mass of thelow melting glass 40 b starts sliding on its own weight. As illustrated inFIGS. 12A and 12B , therefore, the melted liquid mass of thelow melting glass 40 b flows on thefirst face 321 toward theperipheral side surface 10 s of theglass plate 10, resulting in being cured while being in contact with theperipheral side surface 10 s. With this arrangement, the entireperipheral side surface 10 s of theglass plate 10 is reliably sealed. - With respect to the
second wall face 32 c, provision of thesecond face 322 as a vertical wall, for example, on the side of thefirst face 321 toward theplacement face 31 allows theglass plate 10 to be more readily aligned in theopening 20 x of theframe 20A. - Further, although the preferred embodiments have been described, the present invention is not limited to these embodiments, and various variations and modifications may be made without departing from the scope of the present invention.
- For example, the plane shape of the glass plate does not have to be rectangular, and may alternatively be a hexagonal shape, for example.
- According to at least one embodiment, a cover for a light emitter is provided that has an improved sealing reliability between a glass plate and a frame while facilitating size reduction.
- All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment(s) of the present inventions have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017104714A JP6805081B2 (en) | 2017-05-26 | 2017-05-26 | Lid for light emitting device |
JP2017-104714 | 2017-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
US10141487B1 US10141487B1 (en) | 2018-11-27 |
US20180342656A1 true US20180342656A1 (en) | 2018-11-29 |
Family
ID=62530074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/980,907 Active US10141487B1 (en) | 2017-05-26 | 2018-05-16 | Cover for light emitter |
Country Status (4)
Country | Link |
---|---|
US (1) | US10141487B1 (en) |
EP (1) | EP3407395B1 (en) |
JP (1) | JP6805081B2 (en) |
CN (1) | CN108962829B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020145390A (en) * | 2019-03-08 | 2020-09-10 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4944301B2 (en) * | 2000-02-01 | 2012-05-30 | パナソニック株式会社 | Optoelectronic device and manufacturing method thereof |
JP2002033519A (en) * | 2000-07-14 | 2002-01-31 | Sumitomo Electric Ind Ltd | Package for optical communication, its window member, and its manufacturing method |
JP4894987B2 (en) * | 2001-06-29 | 2012-03-14 | 三洋電機株式会社 | Manufacturing method of display panel |
JP3669351B2 (en) * | 2001-10-04 | 2005-07-06 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
DE10224710B4 (en) | 2002-06-04 | 2005-12-08 | Schott Ag | Method for the hermetic packaging of optical components and optical components produced according to the method |
US20050140913A1 (en) * | 2002-08-29 | 2005-06-30 | Masahiro Yokota | Flat display device |
KR100529071B1 (en) * | 2002-11-26 | 2005-11-15 | 삼성에스디아이 주식회사 | Plasma display panel having sealing structure for reducing noise |
JP2006019633A (en) * | 2004-07-05 | 2006-01-19 | Canon Inc | Structure for mounting photoelectric conversion element |
JP2006156528A (en) * | 2004-11-26 | 2006-06-15 | Kyocera Corp | Semiconductor device |
JP4796518B2 (en) * | 2007-02-06 | 2011-10-19 | 株式会社住友金属エレクトロデバイス | Ceramic lid |
JP2009131999A (en) * | 2007-11-29 | 2009-06-18 | Nissha Printing Co Ltd | Mold for glass insert molding |
JP2009150604A (en) * | 2007-12-20 | 2009-07-09 | Nippon Electric Glass Co Ltd | Top plate for cooker |
JP2010171379A (en) * | 2008-12-25 | 2010-08-05 | Seiko Instruments Inc | Light-emitting device |
WO2011052672A1 (en) * | 2009-10-29 | 2011-05-05 | 日亜化学工業株式会社 | Light emitting device and method for manufacturing same |
KR101230774B1 (en) * | 2010-09-03 | 2013-02-06 | 알프스 덴키 가부시키가이샤 | Glass composite, electronic device using glass composite, and input device, and method for manufacturing glass composite |
WO2012073868A1 (en) * | 2010-11-30 | 2012-06-07 | 三洋電機株式会社 | Photoelectric conversion device and method for manufacturing same |
EP2773596B1 (en) * | 2011-11-02 | 2020-07-15 | Ferro Corporation | Microwave sealing of inorganic substrates using low melting glass systems |
JP2013222522A (en) * | 2012-04-13 | 2013-10-28 | Panasonic Corp | Organic electroluminescent element and method for manufacturing the same |
JP2014138131A (en) * | 2013-01-18 | 2014-07-28 | Takara Kasei Kogyo Kk | Housing cover made of glass sheet, method for integrally molding housing and glass sheet, and structure of integrally molded housing and glass sheet |
JP6400980B2 (en) * | 2013-08-26 | 2018-10-03 | 京セラ株式会社 | Cover member for optical device and optical device |
EP3038173B1 (en) * | 2014-12-23 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting device |
JP2017059617A (en) * | 2015-09-15 | 2017-03-23 | パナソニックIpマネジメント株式会社 | Light emitting device |
-
2017
- 2017-05-26 JP JP2017104714A patent/JP6805081B2/en active Active
-
2018
- 2018-05-16 US US15/980,907 patent/US10141487B1/en active Active
- 2018-05-18 EP EP18173164.7A patent/EP3407395B1/en active Active
- 2018-05-21 CN CN201810490718.1A patent/CN108962829B/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020145390A (en) * | 2019-03-08 | 2020-09-10 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
JP7152666B2 (en) | 2019-03-08 | 2022-10-13 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
JP2022179560A (en) * | 2019-03-08 | 2022-12-02 | 日亜化学工業株式会社 | light emitting device |
JP7348570B2 (en) | 2019-03-08 | 2023-09-21 | 日亜化学工業株式会社 | light emitting device |
Also Published As
Publication number | Publication date |
---|---|
JP6805081B2 (en) | 2020-12-23 |
EP3407395A1 (en) | 2018-11-28 |
EP3407395B1 (en) | 2019-10-09 |
US10141487B1 (en) | 2018-11-27 |
CN108962829B (en) | 2023-08-29 |
CN108962829A (en) | 2018-12-07 |
JP2018200946A (en) | 2018-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018043094A1 (en) | Optical semiconductor device and optical semiconductor device production method | |
US11217730B2 (en) | Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus | |
JP2943760B2 (en) | Hermetic sealing method and hermetic sealing structure for optical fiber introduction section | |
TW200403455A (en) | Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs | |
JP7469728B2 (en) | Light emitting device and base | |
JP2007096079A (en) | Semiconductor light emitting device | |
CN113451875B (en) | Laser device | |
US6841731B1 (en) | Terminal assembly | |
JP2007206336A (en) | Optical module and manufacturing method thereof | |
US10141487B1 (en) | Cover for light emitter | |
JP2007206337A (en) | Manufacturing method of optical module | |
US10411167B2 (en) | Semiconductor light emitting apparatus, stem part | |
JP2009111205A (en) | Hollow package, manufacturing method thereof, assembling method thereof, and photographing device | |
JP2006145610A (en) | Package for housing optical component | |
US20090020866A1 (en) | Semiconductor devices and manufacturing methods therefor | |
JP2003133626A (en) | Light-emitting device package and sealing method of light-emitting device | |
CN219106132U (en) | Air tightness packaging structure of 3D box dam product | |
JP7554647B2 (en) | Semiconductor light emitting device and its manufacturing method | |
WO2022163393A1 (en) | Optical modulator and optical transmission device using same | |
JPS6259887B2 (en) | ||
CN117561656A (en) | Laser and laser projection device | |
JPH041500B2 (en) | ||
JPH09191067A (en) | Stem for airtight terminal and its manufacture | |
JP2023076215A (en) | Surface emitting module and manufacturing method thereof | |
JPS63122250A (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SHINKO ELECTRIC INDUSTRIES CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KUBOTA, MAKOTO;REEL/FRAME:045816/0357 Effective date: 20180406 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |