US20180286739A1 - Pickup unit and pickup system of semiconductor device including the same - Google Patents
Pickup unit and pickup system of semiconductor device including the same Download PDFInfo
- Publication number
- US20180286739A1 US20180286739A1 US15/798,686 US201715798686A US2018286739A1 US 20180286739 A1 US20180286739 A1 US 20180286739A1 US 201715798686 A US201715798686 A US 201715798686A US 2018286739 A1 US2018286739 A1 US 2018286739A1
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- United States
- Prior art keywords
- space adjusting
- adjusting plates
- space
- pickers
- guide rail
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
- B25J15/0061—Gripping heads and other end effectors multiple gripper units or multiple end effectors mounted on a modular gripping structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/02—Gripping heads and other end effectors servo-actuated
- B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
- B25J15/0226—Gripping heads and other end effectors servo-actuated comprising articulated grippers actuated by cams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Definitions
- One or more embodiments described herein relate to a pickup unit and a pickup system of a semiconductor device including a pickup unit.
- One type of semiconductor device may be manufactured by packaging a semiconductor chip on a wafer.
- a test procedure may be performed to inspect the device.
- the test process may be performed using a test apparatus operated by computer programs.
- the purpose of the test is to, for example, inspect the electrical properties of the device and its operation under severe test conditions.
- the test apparatus may include a pickup apparatus which picks up and places a semiconductor device on a tray.
- the pickup apparatus may include a plurality of pickup cylinders configured to vacuum suction the semiconductor device. Because shapes, sizes, volumes, and pitches of a user tray and a test tray may be different, a space adjusting device may be used to adjust distances between the cylinders.
- the user tray may have relatively small pitches in order to receive as many semiconductor devices as possible. In this case, the test tray may have relatively large pitches in order to secure reliability of the test apparatus.
- a pickup apparatus includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portion of each of the plurality of pickers contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein at least one of the plurality of space adjusting plates is to move along a second direction crossing the first direction and wherein a width in the first direction of each of the plurality of space adjusting plates varying along the second direction.
- a pickup apparatus includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portions contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein a width in the first direction of each of the plurality of space adjusting plates is adjusted by the protruding portions on sidewalls of respective ones of the space adjusting plates.
- a pickup system of a semiconductor device includes a first tray including a plurality of semiconductor devices spaced apart from each other by a first distance; a second tray including a plurality of semiconductor devices spaced apart from each other by a second distance different from the first distance; and a pickup to transfer the semiconductor device to the first tray or the second tray.
- the pickup includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portion of each of the plurality of pickers contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein at least one of the plurality of space adjusting plates is to move along a second direction crossing the first direction, and wherein widths in the first direction of the plurality of space adjusting plates vary along the second direction.
- FIG. 1 illustrates an embodiment of a pickup system
- FIG. 2 illustrates an embodiment of a pickup unit
- FIG. 3 illustrates an example perspective view of the pickup unit
- FIG. 4 illustrates another example perspective view of pickup unit
- FIG. 5 illustrates an example front view of the pickup unit
- FIG. 6 illustrates an embodiment of a plurality of pickers
- FIG. 7 illustrates an embodiment of a space adjusting part
- FIG. 8 illustrates another embodiment of a space adjusting part
- FIGS. 9 and 10 illustrate embodiments of operations of the pickup unit
- FIGS. 11 and 12 illustrate embodiments of operations of the space adjusting part
- FIG. 13 illustrates an embodiment of a pressurizing portion
- FIGS. 14 to 17 illustrate embodiments of operations of the space adjusting part
- FIGS. 18 and 19 an embodiment of a pressurizing portion
- FIGS. 20 and 21 illustrate other embodiments of operations of the space adjusting part
- FIG. 22 illustrates another embodiment of a pickup unit.
- FIG. 1 illustrates an embodiment of a pickup system 10 .
- FIG. 2 illustrates an embodiment of a perspective view of a pickup unit 100 in FIG. 1 .
- FIG. 3 illustrates an embodiment of an exploded perspective view of the pickup unit 100 .
- FIG. 4 illustrates an embodiment of a perspective view of the pickup unit 100 when viewed at a different angle.
- FIG. 5 illustrates an embodiment of a front view of the pickup unit 100 .
- FIG. 6 illustrates an embodiment of a front view of a plurality of pickers 1000 in FIG. 5 .
- FIG. 7 illustrates an embodiment of a front view of a space adjusting part 3000 in FIG. 5 .
- the pickup system 10 may include a first tray T 1 , a second tray T 2 , and the pickup unit 100 .
- the pickup unit 100 may transfer semiconductor devices S to the first tray T 1 and the second tray T 2 .
- the semiconductor devices S may be spaced apart from one another by different distances in the first tray T 1 and the second tray T 2 .
- the pickup unit 100 may transfer the semiconductor device S from the first tray T 1 to the second tray T 2 , or may transfer the semiconductor device S from the second tray T 2 to the first tray T 1 .
- the semiconductor devices S may be placed in the first tray T 1 and spaced apart from one another by a first distance W 1 .
- the semiconductor devices S may be placed in the second tray T 2 and spaced apart from one another by a second distance W 2 different from the first distance W 1 .
- the first tray T 1 may be a transfer tray which transfers a packaged semiconductor device S.
- the second tray T 2 may be a test tray which transfers the semiconductor device S to a test board to be tested.
- the pickup unit 100 may, for example, automatically control spaces between the plurality of pickers 1000 , which pick up and place the semiconductor devices S and transfer the semiconductor device S to the first tray T 1 and the second tray T 2 .
- the pickup unit 100 may include the plurality of pickers 1000 and a space adjusting part (or adjuster) 3000 .
- the pickers 1000 may pick up or place the semiconductor devices S.
- the space adjusting part 3000 may control distances between the pickers 1000 .
- pickers 1000 may attach and detach semiconductor devices S and may be arranged to be slidable along a first direction (X axis). The distances between the pickers 1000 may be controllable.
- Each picker 1000 may include a picker body 1100 , a holding portion 1700 , a protruding portion 1300 , and a sixth guide rail 1500 .
- the picker body 1100 may extend along a second direction (Y axis) and may form a negative pressure or a positive pressure for attaching or removing the semiconductor device S with the holding portion 1700 .
- the picker body 1100 may form the negative pressure to suction the semiconductor device S with the holding portion 1700 which is combined with a lower portion of the picker body 1100 .
- the picker body 1100 may form the positive pressure to remove the semiconductor device S from the holding portion 1700 .
- the picker body 1100 may directly form the negative pressure or the positive pressure therein or may receive the negative pressure or the positive pressure from an outer supply source.
- the holding portion 1700 may be arranged under the picker body 1100 and may have an opening in a middle portion, which is in communication with the picker body 1100 .
- the holding portion 1700 may be formed, for example, of a resilient material to prevent the semiconductor device S from being damaged when suctioned with the holding portion 1700 .
- the holding portion 1700 may include, for example, rubber or silicon material.
- the pickers 1000 may be combined with the sixth guide rail 1500 .
- the sixth guide rail 1500 may guide the pickers 1100 to be slidable along the first direction (X axis).
- the sixth guide rail 1500 may be, for example, a bar member extending in the first direction (X axis).
- the protruding portion 1300 may be combined with the picker body 110 to protrude in a third direction (Y direction). Sidewalls of the protruding portion 1300 may contact a pair of space adjusting plates 3100 adjacent to the protruding portion 1300 . In these embodiments, when the pickers 1000 slide along the first direction (X axis), the protruding portion 1300 may slide while contacting the space adjusting plate 3100 .
- the protruding portion 1300 may include at least one roller 1300 ′.
- the roller 1300 ′ may rotate about its own axis parallel with the third direction (Y axis).
- the roller 1300 ′ may be between the pair of space adjusting plates 3100 and may rotate while contacting the space adjusting plate 3100 .
- Sizes of the rollers applied to the protruding portions 1300 e.g., diameters of the rollers may be the same.
- the space adjusting part 3000 may include a plurality of space adjusting plates 3100 , a first guide rail 3300 , a second guide rail 3500 , and a pressurizing portion 3700 .
- the space adjusting plates 3100 may be arranged along the first direction (X axis) and side by side.
- One protruding portion 1300 may be between a pair of adjacent space adjusting plates 3100 .
- the roller 1300 ′ of the picker 1000 may be between the pair of space adjusting plates 3100 while contacting the pair of space adjusting plates 3100 .
- each of the space adjusting plates 3100 may decrease gradually from top to bottom along the second direction (Z axis).
- the space adjusting plate 3100 may have a symmetrical shape with respect to an axis parallel with the second direction (Z axis).
- the space adjusting plate 3100 may have a triangle shape.
- the space adjusting plate 3100 may have an inverted triangle shape.
- the space adjusting plate 3100 may have a different shape in another embodiment.
- the space adjusting plate 3100 may have a trapezoid shape ( FIG. 8A ), a semicircle shape ( FIG. 8B ), or an oval shape ( FIG. 8C ).
- the space adjusting plate 3100 may have a triangle shape symmetric with an inverted triangle shape.
- some of the space adjusting plates 3100 may be installed in the first guide rail 3300 .
- Other space adjusting plates 3100 may be installed in the second guide rail 3500 .
- the first guide rail 3300 may be movable upward and downward along the second direction (Z axis).
- some of the space adjusting plates 3100 installed in the first guide rail 300 may be movable along the second direction (Z axis).
- the second guide rail 3500 may be fixed not to be movable along the second direction (Z axis).
- some space adjusting plates 3100 installed in the second guide rail 3500 may not be movable along the second direction (Z axis).
- the second guide rail 3500 may be movable along the second direction (Z axis) and the first guide rail 3300 may be fixed.
- the space adjusting plates 3100 installed in the first guide rail 3300 and the second guide rail 3500 may be slidable along the first direction (X axis).
- the space adjusting plates 3100 may slide along the first guide rail 3300 and the second guide rail 3500 in the first direction (X axis).
- the pressurizing portion 3700 may pressurize at least one of a pair of pickers 1000 positioned at both edges of the plurality of pickers 1000 in the first direction (X axis).
- the pressurizing portion 3700 may pressurize the pair of the pickers 1000 toward a middle of the plurality of pickers 1000 .
- the pressurizing portion 3700 may pressurize the pair of pickers 1000 , to thereby stick the protruding portions 1300 and the space adjusting plates 3100 to each other.
- the protruding portion 1300 and the space adjusting plates 3100 in both sidewalls of the protruding portion 1300 may not be spaced apart from one another, by the pressurizing portion 3700 .
- only one pair of pressurizing portions 3700 may pressurize the picker.
- the pressurizing portion 3700 may include, for example, a hydraulic damper, an air damper, a spring or another pressurizing device for pressurizing the space adjusting plate 3100 and the protruding portion 1300 to stick each other.
- the pressurizing portion 3700 may directly pressurize at least one pair of pickers 1000 positioned in both edges of the plurality of pickers 1000 in the first direction (X axis).
- the pressurizing portion 3700 may pressure the pair of the pickers 1000 toward a middle of the plurality of pickers 1000 .
- the pressurizing portion 3700 may pressurize the pair of pickers 1000 , to thereby stick the protruding portions 1300 and the space adjusting plates 3100 to each other.
- the protruding portion 1300 and the space adjusting plates 3100 in both sidewalls of the protruding portion 1300 may not be spaced apart from one another, by the pressurizing portion 3700 .
- a plurality of picker bodies 1100 may be arranged along the first direction (X axis).
- Picker bodies 1107 , 1108 , 1101 , 1102 , 1103 , 1104 , 1105 , 1106 , 1109 , and 1110 may be arranged sequentially along the first direction (X axis).
- a protruding portion 1307 may be combined with the picker body 1107
- a protruding portion 1308 may be combined with the picker body 1108
- a protruding portion 1301 may be combined with the picker body 1101
- a protruding portion 1302 may be combined with the picker body 1102
- a protruding portion 1302 may be combined with the picker body 1102
- a protruding portion 1303 may be combined with the picker body 1103
- a protruding portion 1304 may be combined with the picker body 1104
- a protruding portion 1305 may be combined with the picker body 1105
- a protruding portion 1306 may be combined with the picker body 1106
- a protruding portion 1309 may be combined with the picker body 1109
- a protruding portion 1310 may be combined with the picker body 1110 .
- the protruding portion may be, for example, a roller.
- the picker bodies 1107 , 1108 , 1101 , 1102 , 1103 , 1104 , 1105 , 1106 , 1109 , and 1110 may be slidable along the sixth guide rail 1500 .
- a plurality of sixth guide rails 1500 may be arranged parallel with each other.
- a plurality of space adjusting plates 3100 may be arranged along the first direction (X axis).
- Space adjusting plates 3116 , 3117 , 3111 , 3112 , 3113 , 3114 , 3115 , 3118 , and 3119 may be arranged sequentially along the first direction (X axis).
- connection bar 3136 may be combined with the space adjusting plate 3116
- a connection bar 3137 may be combined with the space adjusting plate 3117
- a connection bar 3131 may be combined with the space adjusting plate 3111
- a connection bar 3132 may be combined with the space adjusting plate 3112
- a connection bar 3133 may be combined with the space adjusting plate 3113
- a connection bar 3134 may be combined with the space adjusting plate 3114
- a connection bar 3135 may be combined with the space adjusting plate 3115
- a connection bar 3138 may be combined with the space adjusting plate 3118
- a connection bar 3139 may be combined with the space adjusting plate 3119 .
- the connection bars 3131 , 3132 , 3133 , 3134 , 3135 , 3136 , 3137 , 3138 , and 3139 may have, for example, a bar shape extending in the second direction (Z axis).
- the space adjusting plates 3116 , 3111 , 3113 , 3115 , and 3119 may be installed in the first guide rail 3300 .
- the space adjusting plates 3116 , 3111 , 3113 , 3115 , and 3119 may be installed to be slidable along the first guide rail 3300 in the first direction (X axis).
- the space adjusting plate 3113 of the space adjusting plates 3116 , 3111 , 3113 , 3115 , and 3119 may be fixed not to be slidable along the first direction (X axis).
- the first guide rail 3300 may be movable upward and downward along the second direction (Z axis).
- the space adjusting plates 3116 , 3111 , 3113 , 3115 , and 3119 may be movable along the second direction (Z axis).
- the first guide rail 3300 may be movable along the second direction (Z axis) by a motor and a ball screw.
- the space adjusting plates 3117 , 3112 , 3114 , and 3118 may be installed in the second guide rail 3500 .
- the space adjusting plates 3117 , 3112 , 3114 , and 3118 may be installed to be slidable along the second guide rail 3500 in the second direction (X axis).
- the second guide rail 3500 may not be movable upward and downward along the second direction (Z axis).
- the space adjusting plates 3117 , 3112 , 3114 and 3118 may not be movable along the second direction (Z axis).
- the space adjusting plate 3116 may be between the protruding portion 1307 and the protruding portion 1308 .
- the space adjusting plate 3117 may be between the protruding portion 1308 and the protruding portion 1301 .
- the space adjusting plate 3111 may be between the protruding portion 1301 and the protruding portion 1302 .
- the space adjusting plate 3112 may be between the protruding portion 1302 and the protruding portion 1303 .
- the space adjusting plate 3113 may be between the protruding portion 1303 and the protruding portion 1304 .
- the space adjusting plate 3114 may be between the protruding portion 1304 and the protruding portion 1305 .
- the space adjusting plate 3115 may be between the protruding portion 1305 and the protruding portion 1306 .
- the space adjusting plate 3118 may be between the protruding portion 1306 and the protruding portion 1309 .
- the space adjusting plate 3119 may be between the protruding portion 1309 and the protruding portion 1310 .
- the pressurizing portions 3700 may be engaged with the protruding portion 1307 and the protruding portion 1310 respectively.
- the pressurizing portion 3700 engaged with the protruding portion 1307 may pressurize the protruding portion 1307 from the left to the right (when viewed in FIG. 5 ).
- the pressurizing portion 3700 engaged with the protruding portion 1310 may pressurize the protruding portion 1310 from the right to the left (when viewed in FIG. 5 ).
- FIGS. 9 and 10 illustrate embodiments of processes for controlling distances of the pickers 1000 using the space adjusting part 300 .
- FIGS. 9 and 10 illustrate embodiments of the operation of pickup unit in FIG. 2 , along with a portion of the pickers 1000 and the space adjusting part 3000 in FIG. 5 .
- space adjusting plate 3111 may be between the protruding portion 1301 and the protruding portion 1302 .
- the space adjusting plate 3112 may be between the protruding portion 1302 and the protruding portion 1303 .
- the space adjusting plate 3113 may be between the protruding portion 1303 and the protruding portion 1304 .
- the space adjusting plate 3114 may be between the protruding portion 1304 and the protruding portion 1305 .
- the space adjusting plate 3115 may be between the protruding portion 1305 and the protruding portion 1306 . Centers of protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 may be aligned on imaginary line N.
- the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 may be arranged along the first direction (X axis), for example, at a same height. Because the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 has the same inverted triangle shape, distances between the protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 between the space adjusting plates 3111 , 3112 , 3113 , 3114 and 3115 may be the same. The distance between a pair of adjacent ones of the protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 may be the same.
- pitches P 1 between the picker bodies 1101 , 1102 , 1103 , 1104 , 1105 , and 1106 may be the same.
- the pitch P 1 between a pair of adjacent ones of the picker bodies 1101 , 1102 , 1103 , 1104 , 1105 , and 1106 may be the same.
- the space adjusting plates 3111 , 3113 , and 3115 may be installed in the first guide rail 3300 (e.g., see FIG. 5 ).
- the first guide rail 3300 may be referred to as an imaginary line A 1 .
- the space adjusting plates 3112 and 3114 may be installed in the second guide rail 3500 .
- the second guide rail 3500 may be referred to as an imaginary line A 2 .
- the first guide rail A 1 may move upward along the second direction (Z axis).
- the space adjusting plates 3111 , 3113 , and 3115 installed in the first guide rail A 1 may move upward along the second direction (Z axis).
- the space adjusting plates 3112 and 3114 may not move.
- the distances between the protruding portions 1301 , 1302 , 1304 , 1305 , and 1306 contacting sidewalls of the space adjusting plates 3111 , 3113 , and 3115 may be changed.
- the distance between the protruding portions 1301 and 1302 contacting sidewalls of the space adjusting plate 3111 may be decreased.
- the distance between the protruding portions 1303 and 1304 contacting sidewalls of the space adjusting plate 3113 may be decreased.
- the distance between the protruding portions 1305 and 1306 contacting sidewalls of the space adjusting plate 3115 may be decreased.
- the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1303 and 1304 , and the distance between the protruding portions 1305 and 1306 may be determined, for example, by widths of the space adjusting plates 3111 , 3113 , and 3115 between the protruding portions respectively.
- the distance between the protruding portions 1301 and 1302 may be determined by the width of the space adjusting plate 3111 .
- the distance between the protruding portions 1303 and 1304 may be determined by the width of the space adjusting plate 3113 .
- the distance between the protruding portions 1305 and 1306 may be determined by the width of the space adjusting plate 3115 .
- the widths of the space adjusting plates 3111 , 3113 , and 3115 between the protruding portions may be decreased.
- the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1303 and 1304 , and the distance between the protruding portions 1305 and 1306 are decreased respectively, the distance between the picker bodies 1101 and the 1102 , the distance between the picker bodies 1103 and 1104 , and the distance between the picker bodies 1105 and 1107 may be decreased from the pitch P 1 to a second pitch P 2 .
- the distance between the protruding portions 1302 and 1303 and the distance between the protruding portions 1304 and 1305 may be determined based on the widths of the space adjusting plates 3112 and 3114 between the protruding portions respectively.
- the distance between the protruding portions 1302 and 1303 may be determined by the width of the space adjusting plate 3112 between the protruding portions 1302 and 1303 .
- the distance between the protruding portions 1304 and 1305 may be determined by the width of the space adjusting plate 3114 between the protruding portions 1304 and 1305 .
- the widths of the space adjusting plates 3112 and 3114 may remain P 1 .
- the first guide rail A 1 moves upward along the second direction (Z axis) and the second guide rail A 2 does not move.
- the second guide rail A 2 may move upward along the second direction (Z axis). In this case, because the second guide rail A 2 moves upward at a height equal to the first guide rail A 1 , the distance between the picker bodies 1102 and 1103 and the distance between the picker bodies 1104 and 1105 may be decreased from pitch P 1 to second pitch P 2 .
- the second guide rail A 2 may move upward at a height different from the height at which the first guide rail A 1 moves upward.
- the distance between the picker bodies 1102 and 1103 and the distance between the picker bodies 1104 and 1105 may be adjusted so that the pitch is different from pitch P 1 or pitch P 2 in FIG. 9 .
- FIGS. 11 and 12 illustrates additional embodiments of operations of the space adjusting part in FIG. 9 .
- space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 may be installed in a third guide rail A 3 .
- the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 may move upward along the second direction (Z axis).
- some of the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 and others of the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 may be installed in the first guide rail A 1 and the second guide rail A 2 , respectively.
- the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 may be installed in one third guide rail A 3 .
- the distance between protruding portions 1301 and 1302 , the distance between protruding portions 1302 and 1303 , the distance between protruding portions 1303 and 1304 , the distance between protruding portions 1304 and 1305 , and the distance between protruding portions 1305 and 1306 may decrease from pitch P 1 to pitch P 3 .
- the pressurizing portion 3700 may pressurize the protruding portions 1301 and 1306 , to thereby stick the space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 to the protruding portions 1301 , 1302 , 1303 , 1304 , 1305 and 1306 .
- the pressurizing portion 3700 may include a hydraulic damper, an air damper, a spring, or another type of pressurizing apparatus.
- springs 3703 may be combined between the adjacent space adjusting plates 3111 , 3112 , 3113 , 3114 , and 3115 .
- the spring 3703 may be connected between the space adjusting plate 3111 and 3112
- the spring 3703 may be connected between the space adjusting plate 3112 and 3113
- the spring 3703 may be connected between the space adjusting plate 3113 and 3114
- the spring 3703 may be connected between the space adjusting plate 3114 and 3115 .
- FIGS. 14 to 17 illustrates additional embodiments of operations of the space adjusting part in FIG. 9 .
- a plurality of space adjusting plates 3100 may include a first row of space adjusting plates 3140 and a second row of space adjusting plates 3150 .
- the first row of space adjusting plates 3140 may be arranged along a first direction (X axis) and may have a width which increases gradually from top to bottom.
- the first row of space adjusting plates 3140 may have a triangle shape.
- the first row of space adjusting plates 3140 may have another shape, e.g., a trapezoid shape, a semicircle shape, an oval shape, or another shape.
- the first row of space adjusting plates 3140 may be installed in a fourth guide rail A 4 .
- the fourth guide rail A 4 may move upward and downward along a second direction (Z axis).
- the first row of space adjusting plates 3140 installed in the fourth guide rail A 4 may move along the second direction (Z axis).
- the first row of the space adjusting plates 3140 may be installed in the fourth guide rail A 4 to be slidable along the first direction (X axis).
- the first row of space adjusting plates 3140 may slide along the fourth guide rail A 4 in the first direction (X axis).
- the second row of space adjusting plates 3150 may be arranged along the first direction (X axis) and may have a width which decreases gradually from top to bottom.
- the second row of space adjusting plates 3150 may have an inverted triangle shape.
- the second row of space adjusting plate 3150 may have a symmetric shape with the first row of space adjusting plate 3140 on an axis parallel with the first direction (X axis).
- Each of the second row of space adjusting plates 3150 may be between a pair of the first row of space adjusting plates 3140 adjacent to each other.
- the second row of space adjusting plate 3151 may be between a pair of the first row of space adjusting plates 3141 and 3142 .
- the second row of space adjusting plate 3152 may be between a pair of the second row of space adjusting plates 3142 and 3143 .
- the second row of space adjusting plates 3150 may be installed in a fifth guide rail A 5 .
- the fifth guide rail A 5 may move upward and downward along the second direction (Z axis).
- the second row of space adjusting plates 3150 installed in the fifth guide rail A 5 may move along the second direction (Z axis).
- the second row of the space adjusting plates 3150 may be installed in the fifth guide rail A 5 to be slidable along the first direction (X axis). That is, the second row of space adjusting plates 3150 may slide along the fifth guide rail A 5 in the first direction (X axis).
- first row of space adjusting plates 3140 and the second row of space adjusting plates 3150 may be symmetrical with respect to the axis parallel with the first direction (X axis) and may have same size.
- the first row of space adjusting plate 3141 may be between the protruding portions 1301 and 1302 .
- the second row of space adjusting plate 3151 may be between the protruding portions 1302 and 1303 .
- the first row of space adjusting plate 3142 may be between the protruding portions 1303 and 1304 .
- the second row of space adjusting plate 3152 may be between the protruding portions 1304 and 1305 .
- the first row of space adjusting plate 3143 may be between the protruding portions 1305 and 1306 .
- the first row of space adjusting plates 3140 and the second row of space adjusting plates 3150 may be positioned so that distances between pairs of adjacent protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 may be the same.
- the fifth guide rail A 5 may move upward along the second direction (Z axis).
- the second row of space adjusting plates 3150 installed in the fifth guide rail A 5 may move upward along the second direction (Z axis).
- the fourth guide rail A 4 does not move along the second direction (Z axis)
- the first row of space adjusting plates 3140 may not move.
- the distance between the protruding portions 1302 and 1303 and the distance between the protruding portions 1304 and 1305 may be decreased, while the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1303 and 1304 , and the distance between the protruding portions 1305 and 1306 may remain the same.
- the distance between the picker bodies 1102 and 1103 and the distance between the picker bodies 1104 and 1105 may be decreased from pitch P 1 to pitch P 4 .
- the distance between the picker bodies 1101 and 1102 , the distance between the picker bodies 1103 and 1104 , and the distance between the picker bodies 1105 and 1106 may remain the pitch P 1 .
- the fourth guide rail A 4 may move downward along the second direction (Z axis).
- the first row of space adjusting plates 3140 installed in the fourth guide rail A 4 may move downward along the second direction (Z axis).
- the fifth guide rail A 5 does not move along the second direction (Z axis)
- the second row of space adjusting plates 3150 may not move.
- the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1303 and 1304 , and the distance between the protruding portions 1305 and 1306 may be decreased, while the distance between the protruding portions 1302 and 1303 and the distance between the protruding portions 1304 and 1305 may remain the same.
- the distance between the picker bodies 1101 and 1102 and the distance between the picker bodies 1105 and 1106 may be decreased from pitch P 1 to pitch P 5 .
- the distance between the picker bodies 1102 and 1103 and the distance between the picker bodies 1104 and 1105 may remain the pitch P 1 .
- the fourth guide rail A 4 may move downward from the second direction (Z axis) and the fifth guide rail A 5 may move upward along the second direction (Z axis).
- the first row of space adjusting plates 3140 installed in the fourth guide rail A 4 may move downward along the second direction (Z axis) and the second row of space adjusting plates 3150 installed in the fifth guide rail A 5 may move upward along the second direction (Z axis).
- the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1303 and 1304 , and the distance between the protruding portions 1305 and 1306 may be decreased.
- the distance between the protruding portions 1302 and 1303 and the distance between the protruding portions 1304 and 1305 may be decreased.
- the distance between the picker bodies 1101 and 1102 and the distance between the picker bodies 1105 and 1106 may be decreased from pitch P 1 to pitch P 6 .
- the distance between the picker bodies 1102 and 1103 and the distance between the picker bodies 1104 and 1105 may be decreased from pitch P 1 to pitch P 6 .
- the distances between the picker bodies 1101 , 1102 , 1103 , 1104 , 1105 , and 1106 may be adjusted the same or different by the space adjusting part 3000 as illustrated in FIGS. 14 to 17 .
- springs 3705 may be combined between the first row of space adjusting plates 3140 adjacent to each other, to thereby stick the first row of space adjusting plates 3140 , the second row of space adjusting plates 3150 , and the protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 to each other.
- the spring 3705 may be connected between the first row of adjacent space adjusting plates 3141 and 3142
- the spring 3705 may be connected between the first row of adjacent space adjusting plates 3142 and 3143 .
- spring 3706 may be combined between the second row of adjacent space adjusting plates 3150 .
- the spring 3706 may be connected between the second row of space adjusting plates 3151 and 3152 .
- wires may be connected between the first row of space adjusting plates 3140 and the second row of space adjusting plates 3150 , to thereby stick the first row of space adjusting plates 3140 , the second row of space adjusting plates 3150 , and the protruding portions 1301 , 1302 , 1303 , 1304 , 1305 , and 1306 to each other.
- springs 3706 may be combined with the wires.
- FIGS. 20 and 21 illustrate additional embodiments of operations of the space adjusting part in FIG. 9 .
- space adjusting plates 3801 , 3802 , 3803 , 3804 , and 3805 may have a tube shape.
- the widths of the space adjusting plates 3801 , 3802 , 3803 , 3804 , and 3805 in a first direction (X axis) may be changed by an external force.
- the space adjusting plates 3801 , 3802 , 3803 , 3804 , and 3805 may include a metal tube having elasticity.
- the space adjusting plates 3801 , 3802 , 3803 , 3804 , and 3805 may have a predetermined shape, e.g., an oval shape or circular shape as illustrated in FIG. 20 .
- the space adjusting plate 3801 may be between the adjacent protruding portions 1301 and 1302 .
- the space adjusting plate 3802 may be between the adjacent protruding portions 1302 and 1303 .
- the space adjusting plate 3803 may be between the adjacent protruding portions 1303 and 1304 .
- the space adjusting plate 3804 may be between the adjacent protruding portions 1304 and 1305 .
- the space adjusting plate 3805 may be between the adjacent protruding portions 1305 and 1306 .
- the widths of the space adjusting plates 3801 , 3802 , 3803 , 3804 , and 3805 may be decreased.
- the distance between the protruding portions 1301 and 1302 , the distance between the protruding portions 1302 and 1303 , the distance between the protruding portions 1303 and 1304 , the distance between the protruding portions 1304 and 1305 , and the distance between the protruding portions 1305 and 1306 may be decreased.
- the distance between the picker bodies 1101 and 1102 , the distance between the picker bodies 1102 and 1103 , the distance between the picker bodies 1103 and 1104 , the distance between the picker bodies 1104 and 1105 , and the distance between the picker bodies 1105 and 1106 may be decreased from pitch P 1 to pitch P 7 .
- pickup unit 100 applied to pickup system 10 of a semiconductor device may include a first row of pickup unit 110 and a second row of pickup unit 130 .
- the first row of pickup unit 100 and the second row of pickup unit 130 may be spaced apart from each other along a third direction (Y axis).
- Y axis a third direction
- a plurality of the pickup units 100 in FIG. 2 may be arranged in this embodiment.
- the distance L spaced between the first row of pickup unit 110 and the second row of pickup unit 130 in the third direction (Y axis) may be controlled.
- a pickup system of a semiconductor device may automatically adjust distances between a plurality of pickers of a pickup unit corresponding to different distances between the semiconductor devices disposed in a first tray and a second tray T 2 .
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise indicated. Accordingly, various changes in form and details may be made without departing from the spirit and scope of the embodiments set forth in the claims.
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Abstract
Description
- Korean Patent Application No. 10-2017-0039078, filed on Mar. 28, 2017, and entitled, “Pickup Unit and Pickup System of Semiconductor Device Including the Same,” is incorporated by reference herein in its entirety.
- One or more embodiments described herein relate to a pickup unit and a pickup system of a semiconductor device including a pickup unit.
- A variety of semiconductor devices have been developed. One type of semiconductor device may be manufactured by packaging a semiconductor chip on a wafer. At the end of the manufacturing process, a test procedure may be performed to inspect the device. The test process may be performed using a test apparatus operated by computer programs. The purpose of the test is to, for example, inspect the electrical properties of the device and its operation under severe test conditions.
- The test apparatus may include a pickup apparatus which picks up and places a semiconductor device on a tray. The pickup apparatus may include a plurality of pickup cylinders configured to vacuum suction the semiconductor device. Because shapes, sizes, volumes, and pitches of a user tray and a test tray may be different, a space adjusting device may be used to adjust distances between the cylinders. The user tray may have relatively small pitches in order to receive as many semiconductor devices as possible. In this case, the test tray may have relatively large pitches in order to secure reliability of the test apparatus.
- In accordance with one or more embodiments, a pickup apparatus includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portion of each of the plurality of pickers contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein at least one of the plurality of space adjusting plates is to move along a second direction crossing the first direction and wherein a width in the first direction of each of the plurality of space adjusting plates varying along the second direction.
- In accordance with one or more other embodiments, a pickup apparatus includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portions contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein a width in the first direction of each of the plurality of space adjusting plates is adjusted by the protruding portions on sidewalls of respective ones of the space adjusting plates.
- In accordance with one or more other embodiments, a pickup system of a semiconductor device includes a first tray including a plurality of semiconductor devices spaced apart from each other by a first distance; a second tray including a plurality of semiconductor devices spaced apart from each other by a second distance different from the first distance; and a pickup to transfer the semiconductor device to the first tray or the second tray. The pickup includes a plurality of pickers to slide along a first direction, each of the plurality of pickers including a protruding portion combined with a picker body; and a space adjuster including a plurality of space adjusting plates, each of the plurality of space adjusting plates between a respective pair of adjacent pickers of the plurality of pickers, the protruding portion of each of the plurality of pickers contacting sidewalls of adjacent ones of the plurality of space adjusting plates, wherein at least one of the plurality of space adjusting plates is to move along a second direction crossing the first direction, and wherein widths in the first direction of the plurality of space adjusting plates vary along the second direction.
- Features will become apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
-
FIG. 1 illustrates an embodiment of a pickup system; -
FIG. 2 illustrates an embodiment of a pickup unit; -
FIG. 3 illustrates an example perspective view of the pickup unit; -
FIG. 4 illustrates another example perspective view of pickup unit; -
FIG. 5 illustrates an example front view of the pickup unit; -
FIG. 6 illustrates an embodiment of a plurality of pickers; -
FIG. 7 illustrates an embodiment of a space adjusting part; -
FIG. 8 illustrates another embodiment of a space adjusting part; -
FIGS. 9 and 10 illustrate embodiments of operations of the pickup unit; -
FIGS. 11 and 12 illustrate embodiments of operations of the space adjusting part; -
FIG. 13 illustrates an embodiment of a pressurizing portion; -
FIGS. 14 to 17 illustrate embodiments of operations of the space adjusting part; -
FIGS. 18 and 19 an embodiment of a pressurizing portion; -
FIGS. 20 and 21 illustrate other embodiments of operations of the space adjusting part; and -
FIG. 22 illustrates another embodiment of a pickup unit. -
FIG. 1 illustrates an embodiment of apickup system 10.FIG. 2 illustrates an embodiment of a perspective view of apickup unit 100 inFIG. 1 .FIG. 3 illustrates an embodiment of an exploded perspective view of thepickup unit 100.FIG. 4 illustrates an embodiment of a perspective view of thepickup unit 100 when viewed at a different angle.FIG. 5 illustrates an embodiment of a front view of thepickup unit 100.FIG. 6 illustrates an embodiment of a front view of a plurality ofpickers 1000 inFIG. 5 .FIG. 7 illustrates an embodiment of a front view of aspace adjusting part 3000 inFIG. 5 . - Referring to
FIG. 1 , thepickup system 10 may include a first tray T1, a second tray T2, and thepickup unit 100. Thepickup unit 100 may transfer semiconductor devices S to the first tray T1 and the second tray T2. The semiconductor devices S may be spaced apart from one another by different distances in the first tray T1 and the second tray T2. Thepickup unit 100 may transfer the semiconductor device S from the first tray T1 to the second tray T2, or may transfer the semiconductor device S from the second tray T2 to the first tray T1. - The semiconductor devices S may be placed in the first tray T1 and spaced apart from one another by a first distance W1. The semiconductor devices S may be placed in the second tray T2 and spaced apart from one another by a second distance W2 different from the first distance W1. The first tray T1 may be a transfer tray which transfers a packaged semiconductor device S. The second tray T2 may be a test tray which transfers the semiconductor device S to a test board to be tested. The
pickup unit 100 may, for example, automatically control spaces between the plurality ofpickers 1000, which pick up and place the semiconductor devices S and transfer the semiconductor device S to the first tray T1 and the second tray T2. - Referring to
FIGS. 2 to 7 , thepickup unit 100 may include the plurality ofpickers 1000 and a space adjusting part (or adjuster) 3000. Thepickers 1000 may pick up or place the semiconductor devices S. Thespace adjusting part 3000 may control distances between thepickers 1000. - Referring to
FIGS. 2 to 4 ,pickers 1000 may attach and detach semiconductor devices S and may be arranged to be slidable along a first direction (X axis). The distances between thepickers 1000 may be controllable. Eachpicker 1000 may include apicker body 1100, aholding portion 1700, a protrudingportion 1300, and asixth guide rail 1500. - The
picker body 1100 may extend along a second direction (Y axis) and may form a negative pressure or a positive pressure for attaching or removing the semiconductor device S with theholding portion 1700. For example, thepicker body 1100 may form the negative pressure to suction the semiconductor device S with theholding portion 1700 which is combined with a lower portion of thepicker body 1100. Thepicker body 1100 may form the positive pressure to remove the semiconductor device S from theholding portion 1700. Thepicker body 1100 may directly form the negative pressure or the positive pressure therein or may receive the negative pressure or the positive pressure from an outer supply source. - The holding
portion 1700 may be arranged under thepicker body 1100 and may have an opening in a middle portion, which is in communication with thepicker body 1100. The holdingportion 1700 may be formed, for example, of a resilient material to prevent the semiconductor device S from being damaged when suctioned with the holdingportion 1700. The holdingportion 1700 may include, for example, rubber or silicon material. - The
pickers 1000 may be combined with thesixth guide rail 1500. Thesixth guide rail 1500 may guide thepickers 1100 to be slidable along the first direction (X axis). Thesixth guide rail 1500 may be, for example, a bar member extending in the first direction (X axis). - The protruding
portion 1300 may be combined with thepicker body 110 to protrude in a third direction (Y direction). Sidewalls of the protrudingportion 1300 may contact a pair ofspace adjusting plates 3100 adjacent to the protrudingportion 1300. In these embodiments, when thepickers 1000 slide along the first direction (X axis), the protrudingportion 1300 may slide while contacting thespace adjusting plate 3100. - The protruding
portion 1300 may include at least oneroller 1300′. Theroller 1300′ may rotate about its own axis parallel with the third direction (Y axis). Theroller 1300′ may be between the pair ofspace adjusting plates 3100 and may rotate while contacting thespace adjusting plate 3100. Sizes of the rollers applied to the protruding portions 1300 (e.g., diameters of the rollers) may be the same. - In example embodiments, the
space adjusting part 3000 may include a plurality ofspace adjusting plates 3100, afirst guide rail 3300, asecond guide rail 3500, and a pressurizingportion 3700. Thespace adjusting plates 3100 may be arranged along the first direction (X axis) and side by side. One protrudingportion 1300 may be between a pair of adjacentspace adjusting plates 3100. Theroller 1300′ of thepicker 1000 may be between the pair ofspace adjusting plates 3100 while contacting the pair ofspace adjusting plates 3100. - The width of each of the
space adjusting plates 3100 may decrease gradually from top to bottom along the second direction (Z axis). Thespace adjusting plate 3100 may have a symmetrical shape with respect to an axis parallel with the second direction (Z axis). For example, thespace adjusting plate 3100 may have a triangle shape. As illustrated inFIG. 7 , thespace adjusting plate 3100 may have an inverted triangle shape. - The
space adjusting plate 3100 may have a different shape in another embodiment. For example, as illustrated inFIG. 8 , thespace adjusting plate 3100 may have a trapezoid shape (FIG. 8A ), a semicircle shape (FIG. 8B ), or an oval shape (FIG. 8C ). In one embodiment, thespace adjusting plate 3100 may have a triangle shape symmetric with an inverted triangle shape. - Referring again to
FIGS. 2 to 4 , some of thespace adjusting plates 3100 may be installed in thefirst guide rail 3300. Otherspace adjusting plates 3100 may be installed in thesecond guide rail 3500. In these embodiments, thefirst guide rail 3300 may be movable upward and downward along the second direction (Z axis). Thus, some of thespace adjusting plates 3100 installed in the first guide rail 300 may be movable along the second direction (Z axis). - On the other hand, the
second guide rail 3500 may be fixed not to be movable along the second direction (Z axis). For example, somespace adjusting plates 3100 installed in thesecond guide rail 3500 may not be movable along the second direction (Z axis). In one embodiment, thesecond guide rail 3500 may be movable along the second direction (Z axis) and thefirst guide rail 3300 may be fixed. - In example embodiments, the
space adjusting plates 3100 installed in thefirst guide rail 3300 and thesecond guide rail 3500 may be slidable along the first direction (X axis). Thespace adjusting plates 3100 may slide along thefirst guide rail 3300 and thesecond guide rail 3500 in the first direction (X axis). - The pressurizing
portion 3700 may pressurize at least one of a pair ofpickers 1000 positioned at both edges of the plurality ofpickers 1000 in the first direction (X axis). The pressurizingportion 3700 may pressurize the pair of thepickers 1000 toward a middle of the plurality ofpickers 1000. For example, the pressurizingportion 3700 may pressurize the pair ofpickers 1000, to thereby stick the protrudingportions 1300 and thespace adjusting plates 3100 to each other. The protrudingportion 1300 and thespace adjusting plates 3100 in both sidewalls of the protrudingportion 1300 may not be spaced apart from one another, by the pressurizingportion 3700. In one embodiment, only one pair of pressurizingportions 3700 may pressurize the picker. - The pressurizing
portion 3700 may include, for example, a hydraulic damper, an air damper, a spring or another pressurizing device for pressurizing thespace adjusting plate 3100 and the protrudingportion 1300 to stick each other. - In one embodiment, the pressurizing
portion 3700 may directly pressurize at least one pair ofpickers 1000 positioned in both edges of the plurality ofpickers 1000 in the first direction (X axis). The pressurizingportion 3700 may pressure the pair of thepickers 1000 toward a middle of the plurality ofpickers 1000. For example, the pressurizingportion 3700 may pressurize the pair ofpickers 1000, to thereby stick the protrudingportions 1300 and thespace adjusting plates 3100 to each other. The protrudingportion 1300 and thespace adjusting plates 3100 in both sidewalls of the protrudingportion 1300 may not be spaced apart from one another, by the pressurizingportion 3700. - Referring to
FIGS. 5 to 7 , a plurality ofpicker bodies 1100 may be arranged along the first direction (X axis).Picker bodies portion 1307 may be combined with thepicker body 1107, a protrudingportion 1308 may be combined with thepicker body 1108, a protrudingportion 1301 may be combined with thepicker body 1101, a protrudingportion 1302 may be combined with thepicker body 1102, a protrudingportion 1302 may be combined with thepicker body 1102, a protrudingportion 1303 may be combined with thepicker body 1103, a protrudingportion 1304 may be combined with thepicker body 1104, a protrudingportion 1305 may be combined with thepicker body 1105, a protrudingportion 1306 may be combined with thepicker body 1106, a protrudingportion 1309 may be combined with thepicker body 1109, and a protrudingportion 1310 may be combined with thepicker body 1110. The protruding portion may be, for example, a roller. - The
picker bodies sixth guide rail 1500. In these embodiments, a plurality ofsixth guide rails 1500 may be arranged parallel with each other. - A plurality of
space adjusting plates 3100 may be arranged along the first direction (X axis).Space adjusting plates - A
connection bar 3136 may be combined with thespace adjusting plate 3116, aconnection bar 3137 may be combined with thespace adjusting plate 3117, aconnection bar 3131 may be combined with thespace adjusting plate 3111, aconnection bar 3132 may be combined with thespace adjusting plate 3112, aconnection bar 3133 may be combined with thespace adjusting plate 3113, aconnection bar 3134 may be combined with thespace adjusting plate 3114, aconnection bar 3135 may be combined with thespace adjusting plate 3115, aconnection bar 3138 may be combined with thespace adjusting plate 3118, and aconnection bar 3139 may be combined with thespace adjusting plate 3119. The connection bars 3131, 3132, 3133, 3134, 3135, 3136, 3137, 3138, and 3139 may have, for example, a bar shape extending in the second direction (Z axis). - The
space adjusting plates first guide rail 3300. Thespace adjusting plates first guide rail 3300 in the first direction (X axis). In these embodiments, thespace adjusting plate 3113 of thespace adjusting plates - The
first guide rail 3300 may be movable upward and downward along the second direction (Z axis). Thus, thespace adjusting plates first guide rail 3300 may be movable along the second direction (Z axis) by a motor and a ball screw. - The
space adjusting plates second guide rail 3500. Thespace adjusting plates second guide rail 3500 in the second direction (X axis). In these embodiments, thesecond guide rail 3500 may not be movable upward and downward along the second direction (Z axis). Thus, thespace adjusting plates - Referring to
FIG. 5 , thespace adjusting plate 3116 may be between the protrudingportion 1307 and the protrudingportion 1308. Thespace adjusting plate 3117 may be between the protrudingportion 1308 and the protrudingportion 1301. Thespace adjusting plate 3111 may be between the protrudingportion 1301 and the protrudingportion 1302. Thespace adjusting plate 3112 may be between the protrudingportion 1302 and the protrudingportion 1303. Thespace adjusting plate 3113 may be between the protrudingportion 1303 and the protrudingportion 1304. Thespace adjusting plate 3114 may be between the protrudingportion 1304 and the protrudingportion 1305. Thespace adjusting plate 3115 may be between the protrudingportion 1305 and the protrudingportion 1306. Thespace adjusting plate 3118 may be between the protrudingportion 1306 and the protrudingportion 1309. Thespace adjusting plate 3119 may be between the protrudingportion 1309 and the protrudingportion 1310. - The pressurizing
portions 3700 may be engaged with the protrudingportion 1307 and the protrudingportion 1310 respectively. For example, the pressurizingportion 3700 engaged with the protrudingportion 1307 may pressurize the protrudingportion 1307 from the left to the right (when viewed inFIG. 5 ). The pressurizingportion 3700 engaged with the protrudingportion 1310 may pressurize the protrudingportion 1310 from the right to the left (when viewed inFIG. 5 ). -
FIGS. 9 and 10 illustrate embodiments of processes for controlling distances of thepickers 1000 using the space adjusting part 300. For example,FIGS. 9 and 10 illustrate embodiments of the operation of pickup unit inFIG. 2 , along with a portion of thepickers 1000 and thespace adjusting part 3000 inFIG. 5 . - Referring to
FIG. 9 ,space adjusting plate 3111 may be between the protrudingportion 1301 and the protrudingportion 1302. Thespace adjusting plate 3112 may be between the protrudingportion 1302 and the protrudingportion 1303. Thespace adjusting plate 3113 may be between the protrudingportion 1303 and the protrudingportion 1304. Thespace adjusting plate 3114 may be between the protrudingportion 1304 and the protrudingportion 1305. Thespace adjusting plate 3115 may be between the protrudingportion 1305 and the protrudingportion 1306. Centers of protrudingportions - The
space adjusting plates space adjusting plates portions space adjusting plates portions - Because the distances between the protruding portions are the same, pitches P1 between the
picker bodies picker bodies - The
space adjusting plates FIG. 5 ). InFIGS. 9 and 10 , thefirst guide rail 3300 may be referred to as an imaginary line A1. Thespace adjusting plates second guide rail 3500. InFIGS. 9 and 10 , thesecond guide rail 3500 may be referred to as an imaginary line A2. - Referring to
FIG. 10 , the first guide rail A1 may move upward along the second direction (Z axis). Thus, thespace adjusting plates space adjusting plates - As illustrated in
FIG. 10 , as thespace adjusting plates portions space adjusting plates portions space adjusting plate 3111 may be decreased. The distance between the protrudingportions space adjusting plate 3113 may be decreased. The distance between the protrudingportions space adjusting plate 3115 may be decreased. - In these embodiments, the distance between the protruding
portions portions portions space adjusting plates portions space adjusting plate 3111. The distance between the protrudingportions space adjusting plate 3113. The distance between the protrudingportions space adjusting plate 3115. - In
FIG. 10 , as thespace adjusting plates space adjusting plates portions portions portions picker bodies 1101 and the 1102, the distance between thepicker bodies picker bodies - Additionally, the distance between the protruding
portions portions space adjusting plates portions space adjusting plate 3112 between the protrudingportions portions space adjusting plate 3114 between the protrudingportions FIG. 10 , because thespace adjusting plates space adjusting plates - In these embodiments, the first guide rail A1 moves upward along the second direction (Z axis) and the second guide rail A2 does not move. In one embodiment, the second guide rail A2 may move upward along the second direction (Z axis). In this case, because the second guide rail A2 moves upward at a height equal to the first guide rail A1, the distance between the
picker bodies picker bodies - In one embodiment, the second guide rail A2 may move upward at a height different from the height at which the first guide rail A1 moves upward. Thus, the distance between the
picker bodies picker bodies FIG. 9 . -
FIGS. 11 and 12 illustrates additional embodiments of operations of the space adjusting part inFIG. 9 . Referring toFIGS. 11 and 12 ,space adjusting plates space adjusting plates FIGS. 9 and 10 , some of thespace adjusting plates space adjusting plates FIGS. 11 and 12 , thespace adjusting plates - Thus, as the third guide rail A3 moves upward along the second direction (Z axis), the distance between protruding
portions portions portions portions portions - In
FIGS. 11 and 12 , the pressurizing portion 3700 (e.g., seeFIG. 5 ) may pressurize the protrudingportions space adjusting plates portions portion 3700 may include a hydraulic damper, an air damper, a spring, or another type of pressurizing apparatus. - Referring to
FIG. 13 , springs 3703 may be combined between the adjacentspace adjusting plates spring 3703 may be connected between thespace adjusting plate spring 3703 may be connected between thespace adjusting plate spring 3703 may be connected between thespace adjusting plate spring 3703 may be connected between thespace adjusting plate -
FIGS. 14 to 17 illustrates additional embodiments of operations of the space adjusting part inFIG. 9 . Referring toFIG. 14 , a plurality ofspace adjusting plates 3100 may include a first row ofspace adjusting plates 3140 and a second row ofspace adjusting plates 3150. - The first row of
space adjusting plates 3140 may be arranged along a first direction (X axis) and may have a width which increases gradually from top to bottom. For example, the first row ofspace adjusting plates 3140 may have a triangle shape. In one embodiment, the first row ofspace adjusting plates 3140 may have another shape, e.g., a trapezoid shape, a semicircle shape, an oval shape, or another shape. - The first row of
space adjusting plates 3140 may be installed in a fourth guide rail A4. The fourth guide rail A4 may move upward and downward along a second direction (Z axis). Thus, the first row ofspace adjusting plates 3140 installed in the fourth guide rail A4 may move along the second direction (Z axis). The first row of thespace adjusting plates 3140 may be installed in the fourth guide rail A4 to be slidable along the first direction (X axis). For example, the first row ofspace adjusting plates 3140 may slide along the fourth guide rail A4 in the first direction (X axis). - The second row of
space adjusting plates 3150 may be arranged along the first direction (X axis) and may have a width which decreases gradually from top to bottom. For example, the second row ofspace adjusting plates 3150 may have an inverted triangle shape. For example, the second row ofspace adjusting plate 3150 may have a symmetric shape with the first row ofspace adjusting plate 3140 on an axis parallel with the first direction (X axis). - Each of the second row of
space adjusting plates 3150 may be between a pair of the first row ofspace adjusting plates 3140 adjacent to each other. For example, the second row ofspace adjusting plate 3151 may be between a pair of the first row ofspace adjusting plates space adjusting plate 3152 may be between a pair of the second row ofspace adjusting plates - The second row of
space adjusting plates 3150 may be installed in a fifth guide rail A5. The fifth guide rail A5 may move upward and downward along the second direction (Z axis). Thus, the second row ofspace adjusting plates 3150 installed in the fifth guide rail A5 may move along the second direction (Z axis). The second row of thespace adjusting plates 3150 may be installed in the fifth guide rail A5 to be slidable along the first direction (X axis). That is, the second row ofspace adjusting plates 3150 may slide along the fifth guide rail A5 in the first direction (X axis). - In this case, the first row of
space adjusting plates 3140 and the second row ofspace adjusting plates 3150 may be symmetrical with respect to the axis parallel with the first direction (X axis) and may have same size. - The first row of
space adjusting plate 3141 may be between the protrudingportions space adjusting plate 3151 may be between the protrudingportions space adjusting plate 3142 may be between the protrudingportions space adjusting plate 3152 may be between the protrudingportions space adjusting plate 3143 may be between the protrudingportions FIG. 14 , the first row ofspace adjusting plates 3140 and the second row ofspace adjusting plates 3150 may be positioned so that distances between pairs of adjacent protrudingportions - Referring to
FIG. 15 , the fifth guide rail A5 may move upward along the second direction (Z axis). Thus, the second row ofspace adjusting plates 3150 installed in the fifth guide rail A5 may move upward along the second direction (Z axis). Because the fourth guide rail A4 does not move along the second direction (Z axis), the first row ofspace adjusting plates 3140 may not move. - As the second row of
space adjusting plates 3150 moves upward, the distance between the protrudingportions portions portions portions portions - As the distance between the between the protruding
portions portions picker bodies picker bodies picker bodies picker bodies picker bodies - Referring to
FIG. 16 , the fourth guide rail A4 may move downward along the second direction (Z axis). Thus, the first row ofspace adjusting plates 3140 installed in the fourth guide rail A4 may move downward along the second direction (Z axis). Because the fifth guide rail A5 does not move along the second direction (Z axis), the second row ofspace adjusting plates 3150 may not move. - As the first row of
space adjusting plates 3140 moves downward, the distance between the protrudingportions portions portions portions portions - As the distance between the between the protruding
portions portions portions picker bodies picker bodies picker bodies picker bodies - Referring to
FIG. 17 , the fourth guide rail A4 may move downward from the second direction (Z axis) and the fifth guide rail A5 may move upward along the second direction (Z axis). Thus, the first row ofspace adjusting plates 3140 installed in the fourth guide rail A4 may move downward along the second direction (Z axis) and the second row ofspace adjusting plates 3150 installed in the fifth guide rail A5 may move upward along the second direction (Z axis). - As the first row of
space adjusting plates 3140 moves downward, the distance between the protrudingportions portions portions space adjusting plates 3150 moves upward, the distance between the protrudingportions portions - As the distance between the protruding
portions portions portions picker bodies picker bodies - As the distance between the between the protruding
portions portions picker bodies picker bodies - Thus, the distances between the
picker bodies space adjusting part 3000 as illustrated inFIGS. 14 to 17 . - Referring to
FIG. 18 , springs 3705 may be combined between the first row ofspace adjusting plates 3140 adjacent to each other, to thereby stick the first row ofspace adjusting plates 3140, the second row ofspace adjusting plates 3150, and the protrudingportions spring 3705 may be connected between the first row of adjacentspace adjusting plates spring 3705 may be connected between the first row of adjacentspace adjusting plates - Additionally,
spring 3706 may be combined between the second row of adjacentspace adjusting plates 3150. For example, thespring 3706 may be connected between the second row ofspace adjusting plates - Referring to
FIG. 19 , wires may be connected between the first row ofspace adjusting plates 3140 and the second row ofspace adjusting plates 3150, to thereby stick the first row ofspace adjusting plates 3140, the second row ofspace adjusting plates 3150, and the protrudingportions -
FIGS. 20 and 21 illustrate additional embodiments of operations of the space adjusting part inFIG. 9 . Referring toFIG. 20 ,space adjusting plates space adjusting plates space adjusting plates space adjusting plates space adjusting plates FIG. 20 . - The
space adjusting plate 3801 may be between the adjacent protrudingportions space adjusting plate 3802 may be between the adjacent protrudingportions space adjusting plate 3803 may be between the adjacent protrudingportions space adjusting plate 3804 may be between the adjacent protrudingportions space adjusting plate 3805 may be between the adjacent protrudingportions - Referring to
FIG. 21 , as an external force is exerted on the protrudingportions space adjusting plates portions portions portions portions portions - Accordingly, the distance between the
picker bodies picker bodies picker bodies picker bodies picker bodies - Referring to
FIG. 22 ,pickup unit 100 applied topickup system 10 of a semiconductor device according to this embodiment may include a first row ofpickup unit 110 and a second row ofpickup unit 130. The first row ofpickup unit 100 and the second row ofpickup unit 130 may be spaced apart from each other along a third direction (Y axis). For example, a plurality of thepickup units 100 inFIG. 2 may be arranged in this embodiment. The distance L spaced between the first row ofpickup unit 110 and the second row ofpickup unit 130 in the third direction (Y axis) may be controlled. - In accordance with one or more of the aforementioned embodiments, a pickup system of a semiconductor device may automatically adjust distances between a plurality of pickers of a pickup unit corresponding to different distances between the semiconductor devices disposed in a first tray and a second tray T2.
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise indicated. Accordingly, various changes in form and details may be made without departing from the spirit and scope of the embodiments set forth in the claims.
Claims (20)
Applications Claiming Priority (2)
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KR1020170039078A KR101951288B1 (en) | 2017-03-28 | 2017-03-28 | Pickup unit and pickup system of semiconductor package including the same |
KR10-2017-0039078 | 2017-03-28 |
Publications (2)
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US20180286739A1 true US20180286739A1 (en) | 2018-10-04 |
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US15/798,686 Active US10109518B1 (en) | 2017-03-28 | 2017-10-31 | Pickup unit and pickup system of semiconductor device including the same |
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US (1) | US10109518B1 (en) |
KR (1) | KR101951288B1 (en) |
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WO2020077863A1 (en) * | 2018-10-16 | 2020-04-23 | 广东工业大学 | Mass transfer apparatus and transfer method for micro-led |
US20230113869A1 (en) * | 2021-10-08 | 2023-04-13 | Samsung Electronics., Ltd | Substrate transfer apparatus |
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KR20200140158A (en) | 2019-06-05 | 2020-12-15 | 주식회사 에이트론 | Apparatus for picker |
KR102235451B1 (en) * | 2019-07-17 | 2021-04-01 | 손규창 | Pitch control apparatus and pick-up device for semiconductor having the same |
KR102170329B1 (en) * | 2020-06-16 | 2020-10-26 | 정봉진 | Multiple picker device |
KR102419848B1 (en) | 2020-12-15 | 2022-07-22 | 이정현 | Variable controlling apparatus for picker |
CN113394155B (en) * | 2021-06-06 | 2022-10-21 | 深圳市昂科技术有限公司 | Suction nozzle adjusting mechanism, chip carrying device and method |
KR102532913B1 (en) * | 2021-06-28 | 2023-05-17 | 피에스엠피주식회사 | Apparatus for adjusting pitch of pickers for semiconductor device |
KR102642736B1 (en) | 2022-03-29 | 2024-03-04 | 이재웅 | pickup system of semiconductor package |
CN117088130B (en) * | 2023-10-16 | 2023-12-26 | 无锡超通智能制造技术研究院有限公司 | Fine metal mask grabbing device and grabbing method thereof |
CN117800089A (en) * | 2024-01-29 | 2024-04-02 | 北京沃华慧通测控技术有限公司 | Annular workpiece conveying equipment and conveying method |
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2018
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US20230113869A1 (en) * | 2021-10-08 | 2023-04-13 | Samsung Electronics., Ltd | Substrate transfer apparatus |
Also Published As
Publication number | Publication date |
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KR101951288B1 (en) | 2019-02-22 |
CN108663609A (en) | 2018-10-16 |
CN108663609B (en) | 2022-03-01 |
KR20180109398A (en) | 2018-10-08 |
US10109518B1 (en) | 2018-10-23 |
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