US20180245207A1 - Homogeneous linear evaporation source - Google Patents
Homogeneous linear evaporation source Download PDFInfo
- Publication number
- US20180245207A1 US20180245207A1 US15/753,462 US201615753462A US2018245207A1 US 20180245207 A1 US20180245207 A1 US 20180245207A1 US 201615753462 A US201615753462 A US 201615753462A US 2018245207 A1 US2018245207 A1 US 2018245207A1
- Authority
- US
- United States
- Prior art keywords
- heater
- region
- openings
- crucible
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
Definitions
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates, and more particularly to an apparatus and method of depositing a material using a physical vapor deposition process on large substrates in a vacuum environment.
- a roll-to-roll deposition process is commonly used to form CIGS (copper-indium-gallium-(di)selenide) solar cell devices.
- CIGS copper-indium-gallium-(di)selenide
- a flexible substrate is generally unwound from a roll and moved past a series of evaporation sources to deposit the different precursor elements used to form the CIGS absorber layer of the solar cell.
- Each evaporation source includes a crucible to heat and vaporize source material that deposits onto the flexible substrate as the substrate moves past the evaporation source. Uniform deposition of the different elements is necessary to produce a high-quality CIGS solar cell.
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates, and more particularly to an apparatus and method of depositing a material using a physical vapor deposition process on large substrates in a vacuum environment.
- an evaporation source for depositing a source material on a substrate.
- the evaporation source includes a crucible including a base; a plurality of walls surrounding an interior region of the crucible, the plurality of walls including a first end wall spaced apart from a second end wall in a first direction.
- the evaporation source further includes a lid disposed over the interior region, the lid including a first outer section including a first plurality of openings, a second outer section including a second plurality of openings, and an inner section including a third plurality of openings, where the first outer section is spaced apart from the second outer section in the first direction.
- the inner section is disposed between the first outer section and the second outer section.
- the openings in the third plurality of openings are spaced farther apart from each other than the openings in the first plurality of openings are from each other.
- an evaporation source for depositing a source material on a substrate.
- the evaporation source includes a crucible including a base, a plurality of walls surrounding an interior region of the crucible, the plurality of walls including a first end wall spaced apart from a second end wall in a first direction.
- the interior region includes a first outer region, a second outer region and a central region.
- the central region is disposed between the first outer region and the second outer region.
- Each of the first outer region, the second outer region, and the central region has a same width in the first direction.
- the evaporation source further includes a first heater disposed in the base, the first heater configured to provide heat at a higher rate to the first outer region than to the central region.
- a method of depositing a source material on a substrate includes placing deposition material in an interior region of a crucible.
- the crucible includes a base and a plurality of walls surrounding the interior region of the crucible.
- the plurality of walls include a first end wall spaced apart from a second end wall in a first direction.
- the interior region includes a first outer region, a second outer region, and a central region.
- the central region is disposed between the first outer region and the second outer region.
- Each of the first outer region, the second outer region, and the central region has a same width in the first direction.
- the method further includes heating the deposition material by providing more heat to the first outer region than to the central region.
- FIG. 1A is a side cross-sectional view of a vapor deposition system, according to one embodiment.
- FIG. 1B is a side cross-sectional view of an evaporation source, according to one embodiment.
- FIG. 1C is a perspective view of the crucible assembly, according to one embodiment.
- FIG. 1D is a side cross-sectional view of a crucible, a first heater, a second heater, a lid assembly, and a substrate, according to one embodiment.
- FIG. 1E is a top view of the first heater, according to one embodiment.
- FIG. 1F is a side view of a heater, according to another embodiment.
- FIG. 1G is a side sectional view of a heater, according to another embodiment.
- FIG. 1H shows a heat output profile for the heater shown in FIG. 1F , according to one embodiment.
- FIG. 1I shows a heat output profile for the heater shown in FIG. 1G , according to one embodiment.
- FIG. 2A is a side cross-sectional view of an evaporation source, according to another embodiment.
- FIG. 2B is a side cross-sectional view of an evaporation source, according to another embodiment.
- FIG. 3 is a process flow diagram of a method for depositing a source material on a substrate, according to one embodiment.
- FIG. 4 is a side view of a heater, according to another embodiment.
- FIG. 5 is a top view of a heating system, according to another embodiment.
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of copper, indium, gallium, selenium, tellurium, cadmium, or zinc on flexible substrates.
- Said evaporation sources may, for example, be used within vacuum chambers where a plurality of evaporation source types, some of which may have physical and design characteristics different from the evaporation source 100 described below, are configured to implement a co-evaporation process.
- FIG. 1A is a side cross-sectional view of a vapor deposition system 10 , according to one embodiment.
- the vapor deposition system 10 is a roll-to-roll type vapor deposition system for depositing material layers onto a flexible substrate 50 .
- the vapor deposition system 10 includes a vacuum chamber 11 including one or more walls 12 for enclosing a processing region 15 of the vapor deposition system 10 .
- the vapor deposition system 10 can further include one or more evaporation sources 100 , which are disposed within the processing region 15 .
- the processing region 15 of the vacuum chamber 11 is maintained at a constant vacuum pressure.
- the vapor deposition system 10 includes one or more sets 22 , 23 of two or more evaporation sources 100 that are positioned within the processing region 15 to deposit material layer(s) onto the substrate 50 as the substrate 50 is transferred through the processing region 15 .
- the substrate 50 can include a web of flexible polyimide or flexible stainless steel material. The substrate 50 can be transferred through the processing region 15 from a feed roll 41 , over tensioning rolls 51 , 52 , 53 , 54 and to a take-up roll 42 .
- the evaporation sources 100 can each contain material that can be heated to a molten state, so that the heated material evaporates to coat portions of the substrate 50 as the substrate 50 passes near each evaporation source 100 .
- the sets 22 and 23 of evaporation sources 100 may be oriented so as to follow the path of the substrate 50 through the processing region 15 .
- the vapor deposition system 10 is particularly appropriate for deposition of materials to create photovoltaic cells, particularly CIGS (copper-indium-gallium-(di)selenide) solar cells or CdTe (cadmium-tellurium) solar cells.
- CIGS copper-indium-gallium-(di)selenide
- CdTe cadmium-tellurium
- at least one GIGS-containing semiconductive photovoltaic layer, also known as the absorber layer is deposited onto a portion of the substrate 50 .
- the semiconductive photovoltaic layer may, for example, be made of an “ABC” material, wherein “A” represents elements in group 11 of the periodic table of chemical elements (e.g., copper (Cu) or silver (Ag)), “B” represents elements in group 13 of the periodic table (e.g., indium (In), gallium (Ga), or aluminum (Al)), and “C” represents elements in group 16 of the periodic table (e.g., sulfur (S), selenium (Se), or tellurium (Te)).
- An example of an ABC 2 material is the Cu(In,Ga)Se 2 semiconductor also known as a CIGS material.
- thin-film absorber materials include cadmium telluride (CdTe) and its variants, perovskites, amorphous silicon, thin-film silicon, as well as absorber materials used to manufacture dye-sensitized solar cells or organic solar cells.
- FIG. 1B is a side cross-sectional view of one of the evaporation sources 100 , according to one embodiment.
- the evaporation source 100 includes a crucible assembly 200 that includes a crucible 201 and a first heater 210 H.
- the first heater 210 H includes a heating cable 210 .
- the crucible 201 can be formed of a material having high-thermal conductivity, such as molybdenum, graphite or stainless steel.
- the crucible 201 includes one or more walls 202 , a base 203 , and a top 206 .
- the one or more walls 202 surround the interior region 204 of the crucible 201 .
- the crucible 201 further includes an opening 208 above the interior region 204 of the crucible 201 and surrounded by the top 206 of the crucible 201 .
- Deposition material 75 e.g., a precursor element such as copper, indium, gallium, or selenium
- vapor of the deposition material 75 can be directed through the opening 208 of the crucible 201 to deposit on the substrate 50 (see FIG. 1A ).
- the first heater 210 H provides heat to melt and evaporate the deposition material 75 (e.g., copper, indium, gallium, or selenium) in the interior region 204 of the crucible 201 during processing.
- the first heater 210 H can be disposed within the base 203 of the crucible 201 to provide heat from below the deposition material 75 .
- the first heater 210 H can include a heating cable 210 ; such as a sheathed heating cable, powered by electrical connections (not shown). Further details of the first heater 210 H are described below in reference to FIGS. 1C and 1D .
- the evaporation source 100 can further include a thermal distributor 300 disposed within the interior region 204 of the crucible 201 .
- the thermal distributor 300 may be omitted.
- the thermal distributor 300 can be used to uniformly distribute heat to the deposition material 75 during processing.
- the thermal distributor 300 can be fabricated from a material that is heat-resistant, chemically compatible with the deposition material 75 and has a high thermal conductivity, such as refractory metals, such as molybdenum.
- the thermal distributor 300 can be sized in relation to interior region 204 of the crucible 201 to ensure good thermal contact between the thermal distributor 300 and the one or more walls 202 of the crucible 201 .
- the evaporation source 100 can further include a second heater 220 H.
- the first heater 220 H includes a corresponding heating cable 220 .
- the second heater 220 H can be disposed in the interior region 204 of the crucible 201 above the thermal distributor 300 .
- the deposition material 75 can be maintained at levels below the top of the thermal distributor 300 , which keeps the second heater 220 H in a position that contacts vapor of deposition material 75 , but the not the liquid deposition material 75 .
- the second heater 220 H can be used to provide heat to the deposition material 75 and to control the evaporation rate of the deposition material 75 .
- the second heater 220 H can include a heating cable 220 , such as a sheathed heating cable, powered by electrical connections (not shown).
- the first heater 210 H can be used to control the temperature of the liquid deposition material 75 and the second heater 220 H can be used to control the temperature of the vapor of the deposition material 75 .
- a first temperature control loop e.g., PID loop
- a first temperature sensor configured to sense the temperature of deposition material 75 is the input to the first temperature control loop and the power provided to the first heater 210 H is the output of the first temperature control loop.
- a second temperature control loop (e.g., PID loop) can be executed by the controller 80 , where a second temperature sensor (not shown) configured to sense the temperature of the vapor of the deposition material 75 is the input to the second temperature control loop and the power provided to the second heater 220 H is the output of the second temperature control loop.
- a second temperature sensor (not shown) configured to sense the temperature of the vapor of the deposition material 75 is the input to the second temperature control loop and the power provided to the second heater 220 H is the output of the second temperature control loop.
- both heaters 210 H, 220 H can be used to control the temperature of the deposition material 75 . Further details of the second heater 220 H are described below in reference to FIGS. 1D and 1E . However, in some embodiments the first heater 210 H and/or the second heater 220 H may be omitted.
- the evaporation source 100 further includes a lid assembly 400 disposed above the thermal distributor 300 .
- the lid assembly 400 can be positioned on a supporting ridge 209 of the crucible 201 .
- the lid assembly 400 thermally isolates the interior region 204 of the crucible 201 from the areas above the crucible 201 .
- the lid assembly 400 may be formed from a heat resistant and thermally conductive material, such as molybdenum or graphite.
- the lid assembly 400 includes openings 402 to direct evaporated deposition material towards the substrate 50 (see FIG. 1A ) during processing. In one configuration, the openings 402 are sized to control the effusion of material from the evaporation source 100 .
- the diameters of the openings 402 are from about 1 millimeter (mm) to about 40 mm, such as from about 2 mm to about 20 mm in size, and are spaced apart from each other by a distance from about 5 mm to about 400 mm, such as from about 10 mm to about 200 mm.
- one or more of the openings 402 can have a shape of a slot having a length from about 20 mm to about 80 mm, such as about 40 mm.
- the evaporation source 100 further includes a thermal isolation assembly 500 disposed around the crucible 201 .
- the thermal isolation assembly 500 includes one or more vertical walls 502 and a top plate 504 .
- the one or more vertical walls 502 can surround the one or more walls 202 of the crucible 201 .
- the top plate 504 can be disposed over the top 206 of the crucible 201 .
- the thermal isolation assembly 500 isolates the walls and top of the crucible 201 from variations in thermal loads coming from outside of the thermal isolation assembly 500 , such as heat coming from one of the other evaporation sources 100 in the vacuum chamber 11 .
- the crucible assembly 200 would receive heat from other sources in the vacuum chamber 11 , such as other evaporation sources 100 .
- the one or more of the walls 502 can be formed of a material having high thermal conductivity, such as copper.
- the thermal isolation assembly 500 can further include one or more cooling tubes 520 .
- the cooling tubes 520 can be disposed around and/or adjacent to the one or more walls 502 . Cooling fluid may be distributed through the cooling tube(s) 520 to prevent external sources of heat from causing thermal disturbances within the interior region 204 of the crucible 201 .
- the evaporation source 100 can further include a cooling assembly 600 .
- the cooling assembly 600 may be omitted.
- the cooling assembly 600 includes a cooling plate 602 disposed below the crucible 201 .
- the cooling plate 602 can be used too rapidly cool the deposition material 75 when processing is completed or stopped.
- the cooling assembly 600 may further include one or more cooling tubes 604 .
- a sheet 616 material having a high thermal conductivity, such as graphite may be disposed between the cooling plate 602 and the crucible 201 to further promote thermal contact between the cooling plate 601 and the crucible 201 .
- the sheet 616 may also help provide some temperature regulation, control of the crucible 201 temperature and reduced stress in the cooling plate 601 and crucible 201 due to a difference in temperature between the cooling plate 601 and the crucible 201 during processing.
- the evaporation source 100 further includes a heat shield assembly 700 disposed around the thermal isolation assembly 500 and the cooling assembly 600 to further prevent external heat loads from causing thermal disturbances within the interior region 204 of the crucible 201 .
- the heat shield assembly 700 includes one or more side wall portions 710 , one or more base portions 720 , and a lid portion 730 .
- the one or more materials used for the side wall portions 710 can be chosen to be chemically compatible with the material evaporated by the evaporation source 100 , and such materials can include stainless steel and molybdenum as these materials pose a low risk of contaminating the evaporation process.
- the one or more base portions 720 can be disposed below the cooling assembly 600 .
- the lid portion 730 can be disposed above the top plate 504 of the thermal isolation assembly 500 .
- the lid portion 730 may be supported by the one or more side wall portions 710 .
- Each portion 710 , 720 , 730 can be formed of a highly reflective and heat-resistant material, such as molybdenum.
- each portion 710 , 720 , 730 can include two or more sheets of the highly reflective, heat-resistant material, such as molybdenum.
- the evaporation source 100 further includes a leg assembly 800 .
- the leg assembly 800 provides support for other assemblies within the evaporation source 100 , such as the thermal isolation assembly 500 , the cooling assembly 600 , and the heat shield assembly 700 . Adjustment and positioning of the leg assembly 800 also determines where the evaporation source 100 is positioned within the vacuum chamber 11 ( FIG. 1A ). In some embodiments, the feet 820 of the leg assembly 800 are positioned on a portion of the wall 12 of the vapor deposition system 10 .
- the leg assembly 800 includes a plurality of legs 810 and a plurality of feet 820 that are used to level and vertically position the evaporation source 100 relative to the substrate 50 and thermally isolate the evaporation source 100 from portions of the vapor deposition system 10 .
- FIG. 1C is a perspective view of the crucible assembly 200 , according to one embodiment.
- the crucible 201 can have a shape substantially similar to a rectangular prism having an open top.
- An evaporation source 100 having a crucible with a substantially rectangular shape, such as the crucible 201 is referred to herein as a linear evaporation source.
- the substrate 50 FIG. 1A
- the substrate 50 can be moved linearly above the linear evaporation source including the crucible 201 in the X-direction.
- the walls 202 can include a first end wall 202 1 , a second end wall 202 2 opposite to the first end wall 202 1 , a first side wall 202 3 , and a second side wall 202 4 opposite to the first side wall 202 3 .
- the first side wall 202 3 connects the first end wall 202 1 to the second end wall 202 2 along a first side 201 1 of the crucible 201 .
- the second side wall 202 4 connects the first end wall 202 1 to the second end wall 202 2 along a second side 201 2 of the crucible 201 .
- the side walls 202 3 , 202 4 each have a horizontal length (Y-direction in FIG. 2A ) extending in a direction from the first end wall 202 1 to the second end wall 202 2 .
- the end walls 202 1 , 202 2 each have a horizontal length (X-direction in FIG. 1C ) extending in a direction from the first side wall 202 3 to the second side wall 202 4 .
- the side walls 202 3 , 202 4 generally have a horizontal length that is longer than the length of the end walls 202 1 , 202 2 .
- the substrate 50 ( FIG. 1A ) moves above the crucible 201 in the X-direction and the width of the substrate 50 in the Y-direction can be disposed over most of opening 208 of the crucible 201 in the Y-direction, such as 60% or more of the opening 208 in the Y-direction.
- a ratio of the length of the side walls 202 3 , 202 4 in the Y-direction to the length of the end walls 202 1 , 202 2 in the X-direction can be from about 5:1 to about 500:1.
- the length of the side walls 202 3 , 202 4 in the Y-direction is related to the width of the substrate 50 in the Y-direction.
- the length of the side walls 202 3 , 202 4 in the Y-direction may be longer than the width of the substrate 50 in the Y-direction by about 20 mm to about 400 mm, such as by about 200 mm.
- the length of the side walls 202 3 , 202 4 in the Y-direction may be longer than the width of the substrate 50 in the Y-direction by a first distance (FD) that is related to the distance (i.e., second distance (SD)) between the opening 208 of the crucible 201 to the substrate 50 in the Z-direction.
- the first distance (FD) has a magnitude that is between the second distance divided by five (SD/5) and about five times the second distance (5 ⁇ SD).
- FIG. 1D is a side cross-sectional view of the crucible 201 , the first heater 210 H, the second heater 220 H, the lid assembly 400 , and the substrate 50 , according to one embodiment.
- the view in FIG. 1D shows a cross-section of the Y-Z plane, which is perpendicular to the movement of the substrate 50 in the X-direction as shown in FIG. 1A .
- the opening 208 of the crucible 201 has a width 207 ( FIG. 1D ) in the Y-direction that is greater than a width 55 of the substrate 50 .
- Vapor from the deposition material 75 ( FIG. 1A ) can be directed towards a lower surface 57 of the substrate 50 through all or substantially all of the width 207 of the opening 208 of the crucible 201 .
- Having the width 207 of the opening 208 be wider than the width 55 of the substrate 50 can help to ensure the lower surface 57 of the substrate 50 is fully and homogeneously coated by the vapor of the deposition material 75 .
- the heating cable 210 of the first heater 210 H can extend in the Y-direction from a first end 211 to a second end 212 for a length that is substantially as long as the width 207 of the opening 208 , such as a length that is at least 75% of the width 207 , such as a length that is at least 90% of the width 207 .
- the heating cable 220 of the second heater 220 H can extend in the Y-direction from a first end 221 to a second end 222 for a length that is substantially as long as the width 207 of the opening 208 , such as a length that is at least 75% of the width 207 , such as a length that is at least 90% of the width 207 .
- the lid assembly 400 can include a first outer section 410 , a second outer section 420 , and an inner section 430 .
- the first outer section 410 can be disposed on the supporting ridge 209 of the crucible 201 at or proximate to the first end wall 202 1 .
- the second outer section 420 can be disposed on the supporting ridge 209 of the crucible 201 at or proximate to the second end wall 202 2 .
- the inner section 430 can be disposed between the first outer section 410 and the second outer section 420 .
- the inner section 430 can be substantially centered in the crucible 201 in the Y-direction.
- the lid assembly 400 can include different groups of openings.
- the first outer section 410 can include a first plurality of openings 412 that are spaced apart from each other in the Y-direction by a first distance 416 .
- the second outer section 420 can include a second plurality of openings 422 that are also spaced apart from each other in the Y-direction by the first distance 416 .
- the inner section 430 can include a third plurality of openings 432 that are spaced apart from each other in the Y-direction by a second distance 436 .
- the second distance 436 can be greater than the first distance 416 , which can allow for a greater concentration of openings in the, outer sections 410 , 420 than in the inner section 430 .
- the greater concentration of openings in the outer sections 410 , 420 can help to increase the flux of vapor of the deposition material 75 ( FIG. 1B ) towards the substrate 50 through the openings in the outer sections 410 , 420 relative to outer sections (not shown) that include the same concentration of openings as the inner section 430 .
- the increased heat loss can slow the flux of vapor of deposition material 75 at outer sections that include the same concentration of openings as the inner section 430 .
- the increased flux of vapor through the outer sections 410 , 420 having a greater concentration of openings 412 , 422 than the openings 432 in the inner section 430 can help reduce the variability of the deposition rate on the lower surface 57 of the substrate 50 in the Y-direction.
- the openings in the first plurality of openings 412 and the second plurality of openings 422 in the outer sections 410 , 420 can have a width 415 (e.g., a diameter) in the Y-direction that is greater than a width 435 (e.g., a diameter) in the Y-direction of the third plurality of openings 432 in the inner section 430 .
- the increased width 415 of the openings 412 , 422 relative to the width 435 of the openings 432 is another way to increase the flux of vapor of the deposition material 75 towards the substrate 50 through the openings in the outer sections 410 , 420 , which serves as a another way of reducing the variability of the deposition rate on the lower surface 57 of the substrate 50 in the Y-direction.
- the lid assembly 400 can include a plurality of openings that are spaced apart from each other in the Y-direction by distances that vary, such as increase or decrease (e.g., between each pair of openings), based on how far the openings are from a center of the lid assembly in the Y-direction.
- the openings that are closest to the center of the lid assembly in the Y-direction could be spaced apart from each other by the greatest distance
- the openings that are closest to either one of the crucible walls, such as the first end wall 202 1 could be spaced apart from each other by the shortest distance.
- the width of the openings could increase for each opening based on how far the openings are from a center of the lid assembly in the Y-direction.
- the openings located closest to the center of the lid assembly in the Y-direction could have the narrowest width in the Y-direction
- the openings located closest to either one of the crucible end walls 202 1 , 202 2 could have the widest width in the Y-direction.
- the interior 204 of the crucible 201 can include a first outer region 204 1 , a second outer region 204 2 , and a central region 204 3 .
- the central region 204 3 can be disposed between the first outer region 204 1 and the second outer region 204 2 .
- Each region 204 1 , 204 2 , 204 3 can extend for a same distance in the Y-direction.
- Each region 204 1 , 204 2 , 204 3 can include a respective temperature sensor 271 , 272 , 273 ( FIG. 1D ) to measure the temperature in the respective region 204 1 , 204 2 , 204 3 .
- each temperature sensor 271 , 272 , 273 can be placed at a height in the Z-direction so that the temperature sensor is always within the molten deposition material 75 (see FIG. 1B ). In other embodiments one or more of the temperature sensors 271 , 272 , 273 can be placed at a height in the Z-direction to measure a temperature of the vapor of the deposition material 75 (e.g., within region 204 ( FIG. 1B )).
- FIG. 1E is a top view of the first heater 210 H (e.g., looking -Z-direction), according to one embodiment.
- FIG. 1E is described in reference to the first heater 210 H, the second heater 220 H can have a similar shape and have similarities to other features of the first heater 210 H described in FIG. 1E .
- the heating cable 210 of the first heater 210 H extends from the first end 211 to the second end 212 in the Y-direction.
- the first heater 210 H includes a first curved portion 213 located at the first end 211 .
- the first heater 210 H includes a second curved portion 214 located at the second end 212 .
- the first heater 210 H has a first side 210 1 spaced apart from a second side 210 2 in the X-direction.
- the heating cable 210 includes a first segment 215 extending along the first side 210 1 of the first heater 210 H and connecting the first curved portion 213 to the second curved portion 214 .
- FIG. 1D is a side view of the first segment 215 extending from the first curved portion 213 to the second curved portion 214 . Furthermore, the similar view of the second heater 220 H in FIG. 1D can be a side view of a corresponding first segment extending between corresponding curved portions on the second heater 220 H.
- the heating cable 210 further includes a first inner segment 216 extending along the second side 210 2 of the first heater 210 H from the first curved portion 213 towards a center 210 C of the first heater 210 H in the Y-direction.
- the heating cable 210 further includes a second inner segment 217 extending along the second side 210 2 from the second curved portion 214 towards the center 210 C of the first heater in the Y-direction.
- the heating cable 210 can further include a first inner end 218 and a second inner end 219 spaced apart from each other in the Y-direction.
- the first inner segment 216 can be connected to the first inner end 218 .
- the second inner segment 217 can be connected to the second inner end 219 .
- Electrical current can flow through the heating cable 210 of the first heater 210 H from the first inner end 218 , through the first inner segment 216 , through the first curved portion 213 , through the first segment 215 , through the second curved portion 214 , through the second inner segment 217 , and to the second inner end 219 .
- the overall shape of the first heater 210 H can be an open loop with the spacing between the first inner end 218 and the second inner end 219 representing the opening in the loop. Electrical connections (not shown) can be made to the first inner end 218 and the second inner end 219 to provide power to the first, heater 210 H.
- FIG. 1F is a side view of a heater 230 H, according to one embodiment.
- the heater 230 H can be used, for example, in place of the first heater 210 H (see FIG. 1D ) in some embodiments and is referred to in the following description as the first heater 230 H.
- the top view (not shown) of the first heater 230 H can be the same as the top view of the first heater 210 H shown in FIG. 1E .
- the view of the first heater 230 H shown in FIG. 1F can correspond to the side view shown in FIG. 1D of the first heater 210 H.
- the first heater 230 H can include a heating cable 230 including a first segment 235 extending from a first curved portion 233 located at a first end 231 of the heating cable 230 to a second curved portion 234 located at a second end 232 of the heating cable 230 . Because the top view (not shown) of the first heater 230 H can be the same as the top view of the first heater 210 H shown in FIG. 1E , the first heater 230 H can also include portions (not shown) corresponding to the first inner segment 216 and the second inner segment 217 shown in FIG. 1E .
- the first heater 230 H is similar to the first heater 210 H described above except that the first heater 230 H includes one or more portions having a varying power output per unit length.
- the Y-direction i.e., the direction that corresponds to the width 55 of the substrate disposed above the crucible 201 as shown in FIG. 1D
- the increased thickness can be in more than one direction or all directions (e.g., a rounded cable having an increased thickness), the increased thickness is shown here for the first heater 230 H in the Z-direction.
- the first heater 230 H has a center 230 C in the Y-direction.
- the heating cable 230 of the first heater 230 H can include two first portions 237 having an increased thickness relative to the remainder of the first segment 235 that is not part of a portion having an increased thickness, such as the portion of first segment 235 shown in region 247 .
- Each first portion 237 having an increased thickness can be spaced apart from the center 230 C in the Y-direction by a first distance 241 , wherein the first portions 237 are disposed on opposing sides of the center 230 C from each other in the Y-direction.
- Each first portion 237 has an increased thickness that can extend for a first length 243 in the Y-direction.
- the heating cable 230 of the first heater 230 H can further include two second portions 238 having an increased thickness relative to the remainder of the first segment 235 that is not part of a portion having an increased thickness, such as the portion of first segment 235 shown in region 247 .
- Each second portion 238 having an increased thickness can be spaced apart from the center 230 C in the Y-direction by a second distance 242 , wherein the second portions 238 are disposed on opposing sides of the center 230 C from each other in the Y-direction.
- Each second portion 238 has an increased thickness that extends for a second length 244 in the Y-direction.
- the portions 237 , 238 having increased thickness are used to alter the amount of heat emitted along the lengths 243 , 244 of the portions 237 , 238 relative to corresponding lengths in the first segment 235 not having an increased thickness, such as the portion of first segment 235 shown in region 247 .
- the increased thickness of the portions 237 , 238 lowers the electrical impedance of the portions 237 , 238 across the respective lengths 243 , 244 relative to the electrical impedance of corresponding lengths of the first segment 235 not having an increased thickness.
- the portions 237 , 238 emit less heat than portions of the first segment 235 having the same length in the Y-direction but not having an increased thickness.
- the first distance 241 is less than the second distance 242 , so the first portions 237 are located closer to the center 230 C than the second portions 238 are to the center 230 C. Furthermore, the first length 243 is longer than the second length 244 , so the first portions 237 extend for a longer length in the Y-direction than the second portions 238 extend in the Y-direction.
- the locations of the first portions 237 which are closer to the center 230 C, and the longer lengths of the first portions 237 relative to the second portions 238 , causes the first heater 230 H to emit less heat to regions that are closer to the center 230 C than to similarly sized regions that are further from the center 230 C.
- the first heater 230 H emits more heat to regions not including a portion having an increased thickness. For example, for three regions of the same size including a first region 245 surrounding one of the first portions 237 , a second region 246 surrounding one of the second portions 238 , and a third region 247 surrounding a portion of the first segment 235 not having an increased cross-sectional area, the least amount of heat is emitted to the first region 245 , the most amount of heat is emitted to the third region 247 , and the heat emitted to the second region 246 is greater than the first region 245 but less than the third region 247 .
- the amount of heat provided by the first heater 230 H generally increases in the Y-direction as the heating cable 230 extends away from the center 230 C.
- FIG. 1D by providing more heat from portions of the first heater 230 H that are further away from the center 230 C, more heat can be provided to the outer regions 204 1 , 204 2 of the interior region 204 of the crucible 201 , such as regions of the interior region 204 of the crucible 201 near or bordering the first end wall 202 1 and the second end wall 202 2 .
- the variability in the evaporation rate of the deposition material 75 see FIG.
- the evaporation rate of the deposition material 75 in the Y-direction can be reduced.
- the evaporation rate of the deposition material 75 in the Y-direction can be lower at the outer regions of the interior region 204 of the crucible 201 due to the increased heat losses around these outer regions.
- the first heater 230 H accounts for the additional heat loss at the outer regions, and the variability in the evaporation rate of the deposition material 75 (see FIG. 1B ) in the Y-direction can be reduced.
- FIG. 1G is a side sectional view of a heater 250 H, according to one embodiment.
- the heater 250 H can be used, for example, in place of the second heater 220 H (see FIG. 1D ) in some embodiments and is referred to in the following description as the second heater 250 H.
- the view of the heater 250 H shown in FIG. 1F can correspond to the view shown in FIG. 1D of the second heater 220 H.
- the top view (not shown) of the heater 250 H can be the same as the top view of the first heater 210 H shown in FIG. 1E .
- the heater 250 H can include a heating cable 250 including a first segment 255 extending from a first curved portion 253 located at a first end 251 of the second heater 250 H to a second curved portion 254 located at a second end 252 of the second heater 250 H. Because the top view (not shown) of the second heater 250 H can be the same as the top view of the first heater 210 H shown in FIG. 1E , the second heater 250 H can also include portions (not shown) corresponding to the first inner segment 216 and the second inner segment 217 shown in FIG. 1E .
- the second heater 250 H can be the same as the first heater 230 H except that the heater 250 H can include portions having larger increased thicknesses than the portions 237 , 238 of the first heater 230 H.
- the first portions 237 from the first heater 230 H are replaced with larger first portions 257 .
- These larger first portions 257 extend for a first distance 263 in the Y-direction that is longer than the first length 243 that the first portions 237 extended for in the Y-direction.
- these larger first portions 257 can extend further in the Z-direction than the first portions 237 .
- the second portions 238 from the first heater 230 H are replaced with larger second portions 258 .
- These larger second portions 258 extend for a second distance 264 in the Y-direction that is longer than the second length 244 that the second portions 238 extended for in the Y-direction. Furthermore, these larger second portions 258 can extend further in the Z-direction than the second portions 238 .
- the portions 257 , 258 are located closer a center 250 C of the second heater 250 H in the Y-direction than the portions 237 , 238 are to the center 2300 of the first heater 230 H described above.
- the first portions 257 are located a first distance 261 from the center 250 C, which is less than the first distance 241 of the first portions 237 to the center 2300 of the first heater 230 H described above.
- the second portions 258 are located a second distance 262 from the center 250 C, which is less than the second distance 242 of the second portions 238 to the center 230 C of the first heater 230 H described above.
- the heater second 250 H provides less heat to a central region surrounding the center of the second heater 250 H than a central region of the same size surrounding the first heater 230 H when both heaters 230 H, 250 H are supplied with the same power.
- FIG. 1F shows a central region 248 surrounding both of the first portions 237 of the first heater 230 H
- FIG. 1F shows a central region 248 surrounding both of the first portions 237 of the first heater 230 H
- 1G shows a central region 268 surrounding both of the first portions 257 of the second heater 250 H, where the central region 248 and the central region 268 are the same size.
- the larger size and closer location to the center 250 C of the first portions 257 causes the second heater 250 H to provide less heat to the central region 268 than the first heater 230 H provides to the central region 248 , which has the same size as the central region 268 when the heaters 230 H, 250 H are supplied with the same power.
- FIG. 1F shows an outer region 249 surrounding an outer portion of the first heater 230 H.
- the outer region 249 can be the same size as the central region 248 .
- FIG. 1G shows an outer region 269 surrounding an outer portion of the second heater 250 H.
- the outer region 269 can be the same size as the central region 268 in FIG. 1G and can also be the same size as the regions 248 , 249 in FIG. 1F .
- the portion of the first heater 230 H surrounded by the region 249 can be identical to the portion of the second heater 250 H surrounded by the region 269 .
- the second heater 250 H includes larger first portions 257 than the first portions 237 of the first heater 230 H and because the portions of the heaters 230 H, 250 H surrounded by the respective regions 249 , 269 can be identical, the reduced heat provided to the central region 268 by the second heater 250 H relative to the heat provided to the central region 248 by the first heater 230 H causes the difference in heat provided to the central region 268 relative to the outer region 269 to be larger than the difference in heat provided to the central region 248 relative to the outer region 249 .
- the second heater 250 H can be described as providing a steeper heating profile in the Y-direction than the first heater 230 H due to the larger changes in heat provided in the Y-direction for the second heater 250 H than the changes in heat provided by the first heater 230 H in the Y-direction.
- FIGS. 1H and 1I show the difference between the heating profiles of the first heater 230 H and the second heater 250 H.
- FIG. 1H shows a heat output profile for the first heater 230 H, according to one embodiment.
- FIG. 1I shows a heat output profile for the second heater 250 H, according to one embodiment.
- the first heater 230 H generates more at the ends 231 , 232 than at the center 230 C, and the additional heat produced at the ends 231 , 232 relative to the center 230 C can be represented by a first difference 239 .
- the first heater 250 H generates more at the ends 251 , 252 than at the center 250 C, and the additional heat produced at the ends 251 , 252 relative to the center 250 C can be represented by a second difference 259 .
- the second difference 259 is greater than the first difference 239 , and thus the second heater 250 H has a steeper heating profile than the first heater 230 H.
- the two heaters 230 H, 250 H can be used together to reduce the variability of the temperature of the deposition material 75 (see FIG. 1B ) and vapor of the deposition material 75 in the Y-direction. For example, if temperatures of the deposition material 75 are higher in central region 204 3 of the interior region 204 of the crucible 201 (see FIG.
- power provided to the second heater 250 H can be increased because the steeper heating profile of the second heater 250 H causes increases in power to the second heater 250 H to have a greater effect on heating outer regions 204 1 , 204 2 (see FIG. 1D ) of the interior region 204 of the crucible 201 than central regions 204 3 of the interior region 204 of the crucible 201 .
- reducing the power provided to the first heater 230 H would have a greater effect on reducing the temperature of central region 204 3 of the interior region 204 of the crucible 201 than outer regions 204 1 , 204 2 of the interior region 204 the crucible 201 .
- the varying amount of heat that the heaters 230 H, 250 H can provide can be explained relative to having regions that deliver varying amounts of power, such as by use of the larger sections of the heater. Because the exact positon of the portions having increased thicknesses (e.g., portions 237 , 238 ) can be adjusted, an explanation relative to larger sections of the heaters 230 H, 250 H can be applicable to a wider set of the embodiments contemplated by the disclosure provided herein.
- the heaters 230 H, 250 H can each have a respective length 230 L, 250 L extending in the Y-direction.
- Each length 230 L, 250 L can be divided into thirds of equal length including a respective first outer section 230 L 1 , 250 L 1 , and a respective second outer section 230 L 2 , 250 L 2 , and a respective inner section 230 L 3 , 250 L 3 .
- more heat can be generated by the first outer section 230 L 1 , 250 L 1 or the second outer section 230 L 2 , 250 L 2 than is generated by the inner section 230 L 3 , 250 L 3 .
- the heat generated by the first outer section 230 L 1 , 250 L 1 can be substantially equal to the heat generated by the second outer section 230 L 2 , 250 L 2 .
- the heaters 230 H, 250 H are largely described as having two sets of portions having increased thicknesses (i.e., portions 237 , 238 for the first heater 230 H and portions 257 , 258 for the second heater 250 H) relative to the remainder of the heaters 230 H, 250 H, other embodiments may include more or less portions having varying power output (e.g., increased thicknesses) or have different designs for varying the amount of heat provided in the Y-direction.
- the cross-sectional area of the heating cable of a heater can continuously decrease in the Y-direction from the center of the heating cable in the Y-direction.
- the portions 237 , 238 of the first heater 230 H see FIG.
- the heaters 230 H, 250 H can also include corresponding portions 237 , 238 , 257 , 258 extending from the segments of the heaters 230 H, 250 H corresponding to the inner segments 216 , 217 shown in FIG. 1E , so that the heaters 230 H, 250 H provide an amount of heat that is balanced in the X-direction.
- each heater 230 H, 250 H can be replaced by two heaters (e.g., FIG. 5 described below), so that a temperature variability of the deposition material 75 in the interior region 204 of the crucible 201 that is not symmetrical about a center in the Y-direction of the interior region 204 of the crucible 201 can be controlled.
- FIG. 1D it is possible that there may be greater heat loss on the left side of the crucible 201 (i.e., at first end wall 202 1 ) than there is for on the right side of the crucible 201 (i.e., at second end wall 202 1 ).
- the heaters 230 H, 250 H see FIG.
- 1F, 1G having the open loop design (see FIG. 1E ) could each be replaced by, for example, two heaters having an open loop design that does not extend as far in the Y-direction, so that the two heaters may be placed side-by-side in the X-Y plane at the locations in the Z-direction for each of the heaters 210 H, 220 H shown in FIG. 1B .
- FIG. 2A is a side cross-sectional view of an evaporation source 100 A, according to one embodiment.
- the evaporation source 100 A is similar to the evaporation source 100 described above (see FIG. 1B ) except that the evaporation source 100 A includes a crucible assembly 200 A that is different from the crucible assembly 200 described above, and the evaporation source 100 A also does not include the second heater 220 H described above.
- the crucible assembly 200 A includes a heater 280 disposed around the walls 202 of the crucible 201 .
- the heater 280 can include a heating cable, such as a sheathed heating cable. The heating cable can be distributed across each of the walls 202 in a pattern using a plurality of loops.
- FIG. 2A A portion of two of these loops is visible in FIG. 2A .
- the loops allow thermal expansion of the heating cable of the heater 280 with respect to the crucible 201 .
- Electric power may be applied to the heating cable of the heater 280 to provide the heat to the crucible 201 by a power supply that is coupled to a temperature control system.
- the heater 282 direct heat through the crucible walls 202 , the variability in the temperature of the deposition material 75 in the X-direction and the Y-direction can be reduced. This is because the additional heat losses that occur around the perimeter of the crucible 201 can be substantially negated by providing the heat through the perimeter of the crucible 201 .
- the heater 280 may be placed in the crucible walls 202 to place the heater 280 closer to the material being heated. In yet another embodiment, the heater 280 may surround the crucible 201 , a heater similar to the heater 280 may be placed below the crucible 201 , and an additional heater, such as the heater 220 H (See FIG. 1B ) or heater 250 H ( FIG. 1G ) may disposed in the interior region 204 of the crucible 201 above the thermal distributor 300 .
- FIG. 2B is a side cross-sectional view of an evaporation source 100 B, according to one embodiment.
- the evaporation source 100 B is similar to the evaporation source 100 described above (see FIG. 1B ) except that the evaporation source 100 B includes a crucible assembly 200 B that is different from the crucible assembly 200 described above, the evaporation source 100 B also does not include the second heater 220 H described above, and the evaporation source 100 B includes a lid assembly 400 B that is different from the lid assembly 400 described above.
- the lid assembly 400 B includes openings 402 B disposed in a central location in the X-direction. The openings 402 B can be wider in the X-direction than the openings 402 (see FIG.
- the openings 402 B can be distributed in the Y-direction using a pattern similar to the distribution of the openings 402 shown in FIG. 1D .
- the openings 402 B can be narrower at the center in the Y-direction of the lid assembly 400 B than openings 402 B at outer regions of the lid assembly 400 B, and the openings 402 B can be spaced further apart at the center of the lid assembly 400 B in the Y-direction than openings 402 B at outer regions of the lid assembly 400 B.
- the crucible assembly 200 B includes a crucible 201 B that is different from the crucible 201 described above.
- the crucible 201 B includes a top 206 B extending over the interior region 204 of the crucible 201 B.
- the top 206 B includes a first portion 206 B 1 extending from the first side wall 202 3 and a second portion 206 B 2 extending from the second side wall 202 4 .
- the crucible assembly 200 B can further include a heater 290 H including a corresponding cable 290 disposed in the top 206 B of the crucible 201 B.
- the crucible assembly 200 B is shown including two heaters 210 H, 290 H, in some embodiments only one heater may be included.
- a top view of the heater 290 H can have the same shape as the top view of the first heater 210 H shown in FIG. 1E .
- the top 206 B can also include portions (not shown) extending in from the walls 202 1 , 202 2 to house the curved portions of the heater 290 H, which can have a similar shape to the curved portions 213 , 214 of the first heater 210 H.
- the high thermal mass of the top 206 B of the crucible 201 B can prevent small changes in the power provided to the heater 290 H from causing large changes to the temperature of the vapor of the deposition material 75 because the high thermal mass of the top 206 B allows the heat released into the interior region 204 by the top 206 B to respond slowly to changes in heat provided to the top 206 B.
- the heaters 210 H, 290 H can also be replaced with the heaters 230 H, 250 H described above in reference to FIGS. 1F, 1G , so that temperature variations in the Y-direction can be reduced as described above.
- either the first heater 210 H or the heater 290 H may be omitted.
- FIG. 3 is a process flow diagram of a method 301 for depositing a source material on a substrate, according to one embodiment.
- the method 301 can be performed using the evaporation source 100 to deposit vapor of the deposition material 75 (see FIG. 1B ) on the substrate 50 (see FIG. 1D ).
- the heaters 230 H, 250 H are used in place of the heaters 210 H, 220 H in the evaporation source 100 .
- deposition material 75 is placed in the interior region 204 of the crucible 201 .
- the heaters 230 H, 250 H heat the deposition material 75 .
- the heaters 230 H, 250 H provide heat at a higher rate to the first outer region 204 1 (see FIG. 1D ) than to the central region 204 3 as well as heat at a higher rate to the second outer region 204 2 than to the central region 204 3 .
- the second heater 250 H provides a greater proportion of its heat to the outer regions 204 1 , 204 2 than the proportion the first heater 230 H provides to the outer regions 204 1 , 204 2 .
- the heat transfer rate provided by the first heater 230 H to the first outer region 204 1 relative to the heat transfer rate provided by the first heater 230 H to the central region 204 3 can be expressed as a first ratio
- the heat transfer rate provided by the second heater 250 H to the, first outer region 204 1 relative to the heat transfer rate provided by the second heater 250 H to the central region 204 3 can be expressed as a second ratio
- the second ratio is greater than the first ratio.
- a first temperature is measured in the first outer region 204 1 using the temperature sensor 271 ( FIG. 1D ) and a second temperature is measured in the central region 204 3 using the temperature sensor 273 ( FIG. 1D ).
- a third temperature can also be measured in the second outer region 204 2 .
- a difference between the first temperature and the second temperature can be calculated, for example by the controller 80 ( FIG. 1D ).
- a rate of heat provided by the first heater 230 H to the interior region 204 relative to a rate of heat provided by the second heater 250 H to the interior region 204 is adjusted, for example by the controller 80 , based on the difference between the first temperature and the second temperature.
- the rates of heat may be adjusted based on measurements of evaporation rates or measurements of thicknesses on different portions of the substrate 50 .
- the controller 80 ( FIG. 1 ) if the second temperature is greater than the first temperature, then (1) the rate of heat provided by the second heater 250 H to the interior region 204 can be increased relative to the rate of heat provided by the first heater 230 H to the interior region 204 , or (2) the rate of heat provided by the first heater 230 H to the interior region 204 can be decreased relative to the rate of heat provided by the second heater 250 H to the interior region 204 .
- the controller 80 FIG.
- 1D can calculate a difference between a temperature setpoint for the interior region 204 and an average of the first temperature and the second temperature to determine whether to increase the rate of heat provided by the second heater 250 H or to decrease the rate of heat provided by the first heater 230 H when the second temperature is greater than the first temperature.
- the controller 80 can adjust an output from the controller to increase the rate of heat provided, by the second heater 250 H, so that the overall temperature of the interior region 204 increases and the difference between the first temperature and the second temperature is reduced.
- the method 301 can continue cycling through blocks 310 through 325 to maintain a low level of variability of the temperature in the interior region 204 in the Y-direction.
- FIG. 4 is a side view of a heater 410 H, according to one embodiment.
- the heater 410 H can be used, for example, in place of one or more of the heaters 210 H, 220 H, and 290 H described above.
- the heater 410 H can have a shape of the heater 210 H as shown in FIG. 1E .
- the heater 410 H includes a core 420 .
- the core extends from a first end 421 to a second end 422 .
- the core further includes a center 420 C.
- the core 420 may be formed of a heat resistant electrically insulating material (e.g., a ceramic material or in some embodiments a graphitic material with an insulating and heat resistant coating).
- the heater 410 H may further include a heating cable 430 , which can be wrapped around the core 420 .
- the heating cable 430 can be wrapped around the core 420 in a helical pattern to form a series of rings 435 extending substantially from the first end 421 to the second 422 of the core 420 .
- the heating cable 430 can be disposed within slots or cavities formed within a surface of the core 420 in a helical pattern that extends along the length of the core 420 .
- the spacing between the rings 435 can vary from the first end 421 to the center 420 C and from the center 420 C to the second end 422 .
- the rings 435 can include an outer section 435 O at the first end 421 , a central section 435 C at the center 420 C, and an intermediate section 435 I located between the outer section 435 O and the central section 435 C.
- the cable can also include corresponding intermediate and outer sections on the right side of the center 420 C.
- the rings 435 in the central section 435 C can be spaced apart further from each other than the rings 435 in the intermediate section 435 I are spaced apart from each other, and the rings 435 in the intermediate section 435 I can be spaced apart further from each other than the rings 435 in the outer section 435 O are spaced apart from each other.
- Sections of the heater 410 H having closely packed rings 435 can produce more heat than sections of the heater 410 H having loosely packed rings 435 .
- the outer region 435 O having the most closely packed rings 435 can produce more heat along a given length in the Y-direction than the heat produced by the intermediate section 435 I or the central region 435 C along the same length in the Y-direction.
- the central region 435 C having the most loosely packed rings 435 produces less heat than the heat produced by the intermediate region 435 I or the outer region 435 O.
- the spacing between the rings 435 can be varied as needed along the length of the core 420 to produce the desired heating profile in the Y-direction.
- the spacing between the rings 435 in the different heaters can vary according to different profiles in the Y-direction, so that the two heaters can be used together to independently reduce the variability of the temperature of the deposition material 75 (see FIG. 1B ) in the Y-direction and the temperature of the vapor of the deposition material 75 in the Y-direction.
- FIG. 5 is a top view of a heating system 900 , according to one embodiment.
- the heating system 900 can be used, for example, in place of one or more of the heaters 210 H, 220 H, 290 H, and 410 H described above.
- the heating system 900 includes a first heater 910 H and a second heater 920 H.
- the first heater 910 H and the second heater 920 H can be spaced apart from each other in the Y-direction to enable independent heating of areas of the evaporation source (e.g., evaporation source 100 described above) that are spaced apart in the Y-direction.
- the evaporation source e.g., evaporation source 100 described above
- the heaters 910 H, 920 H can be symmetrically positioned around a center 200 C of the crucible assembly (e.g., crucible assembly 200 described above). Independent heating of different portions of the crucible assembly spaced apart in the Y-direction can be useful when the heat loss at opposing ends of the crucible assembly differ from each other.
- the first heater 910 H includes a first heating cable 910 having a first leg 911 and a second leg 912 .
- the first leg 911 extends from a first inner end 913 to a curved portion 915 .
- the second leg 912 extends from a second inner end 914 to the curved portion 915 .
- the curved portion 915 connects the first leg 911 to the second leg 912 .
- the curved portion 915 can be disposed in the Y-direction in a corresponding position to the curved portion 213 described above in reference to the heater 210 H of FIG. 1E .
- the second heater 920 H includes a second heating cable 920 having a first leg 921 and a second leg 922 .
- the first leg 921 extends from a first inner end 923 to a curved portion 925 .
- the second leg 922 extends from a second inner end 924 to the curved portion 925 .
- the curved portion 925 connects the first leg 921 to the second leg 922 .
- the curved portion 925 can be disposed in the Y-direction in a corresponding position to the curved portion 214 described above in reference to the heater 210 H of FIG. 1E .
Abstract
Description
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates, and more particularly to an apparatus and method of depositing a material using a physical vapor deposition process on large substrates in a vacuum environment.
- A roll-to-roll deposition process is commonly used to form CIGS (copper-indium-gallium-(di)selenide) solar cell devices. During processing, a flexible substrate is generally unwound from a roll and moved past a series of evaporation sources to deposit the different precursor elements used to form the CIGS absorber layer of the solar cell. Each evaporation source includes a crucible to heat and vaporize source material that deposits onto the flexible substrate as the substrate moves past the evaporation source. Uniform deposition of the different elements is necessary to produce a high-quality CIGS solar cell. It can be challenging to control the evaporation rate of the source material during processing, which makes it difficult to obtain a uniform deposition across the width of the substrate (e.g., the direction perpendicular to which the substrate is moving) as the substrate is moved past the evaporation source during processing. The evaporation rate of the source material is not easily measured, so it can be difficult to control the evaporation rate, especially when faced with changing conditions, such as thermal disturbances from other evaporation sources and a varying fill level of source material in the crucible during processing. It is also desirable during production to maintain a constant evaporation rate over a long duration such as several days, preferably one week. Therefore, there is a need for an evaporation source that can improve the deposition uniformity of source material.
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates, and more particularly to an apparatus and method of depositing a material using a physical vapor deposition process on large substrates in a vacuum environment.
- In one embodiment, an evaporation source for depositing a source material on a substrate is provided. The evaporation source includes a crucible including a base; a plurality of walls surrounding an interior region of the crucible, the plurality of walls including a first end wall spaced apart from a second end wall in a first direction. The evaporation source further includes a lid disposed over the interior region, the lid including a first outer section including a first plurality of openings, a second outer section including a second plurality of openings, and an inner section including a third plurality of openings, where the first outer section is spaced apart from the second outer section in the first direction. The inner section is disposed between the first outer section and the second outer section. The openings in the third plurality of openings are spaced farther apart from each other than the openings in the first plurality of openings are from each other.
- In another embodiment, an evaporation source for depositing a source material on a substrate is provided. The evaporation source includes a crucible including a base, a plurality of walls surrounding an interior region of the crucible, the plurality of walls including a first end wall spaced apart from a second end wall in a first direction. The interior region includes a first outer region, a second outer region and a central region. The central region is disposed between the first outer region and the second outer region. Each of the first outer region, the second outer region, and the central region has a same width in the first direction. The evaporation source further includes a first heater disposed in the base, the first heater configured to provide heat at a higher rate to the first outer region than to the central region.
- In another embodiment, a method of depositing a source material on a substrate is provided. The method includes placing deposition material in an interior region of a crucible. The crucible includes a base and a plurality of walls surrounding the interior region of the crucible. The plurality of walls include a first end wall spaced apart from a second end wall in a first direction. The interior region includes a first outer region, a second outer region, and a central region. The central region is disposed between the first outer region and the second outer region. Each of the first outer region, the second outer region, and the central region has a same width in the first direction. The method further includes heating the deposition material by providing more heat to the first outer region than to the central region.
- So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, and may admit to other equally effective embodiments.
-
FIG. 1A is a side cross-sectional view of a vapor deposition system, according to one embodiment. -
FIG. 1B is a side cross-sectional view of an evaporation source, according to one embodiment. -
FIG. 1C is a perspective view of the crucible assembly, according to one embodiment. -
FIG. 1D is a side cross-sectional view of a crucible, a first heater, a second heater, a lid assembly, and a substrate, according to one embodiment. -
FIG. 1E is a top view of the first heater, according to one embodiment. -
FIG. 1F is a side view of a heater, according to another embodiment. -
FIG. 1G is a side sectional view of a heater, according to another embodiment. -
FIG. 1H shows a heat output profile for the heater shown inFIG. 1F , according to one embodiment. -
FIG. 1I shows a heat output profile for the heater shown inFIG. 1G , according to one embodiment. -
FIG. 2A is a side cross-sectional view of an evaporation source, according to another embodiment. -
FIG. 2B is a side cross-sectional view of an evaporation source, according to another embodiment. -
FIG. 3 is a process flow diagram of a method for depositing a source material on a substrate, according to one embodiment. -
FIG. 4 is a side view of a heater, according to another embodiment. -
FIG. 5 is a top view of a heating system, according to another embodiment. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- In the following, reference is made to embodiments. However, it should be understood that the disclosure is not limited to specific described embodiments. Instead, any combination of the following features and elements, whether related to different embodiments or not, is contemplated to implement and practice the claimed subject matter. Furthermore, although embodiments described herein may achieve advantages over other possible solutions and/or over the prior art, whether or not a particular advantage is achieved by a given embodiment is not limiting of the claimed subject matter. Thus, the following aspects, features, embodiments and advantages are merely illustrative and are not considered elements or limitations of the appended claims except where explicitly recited in a claim(s).
- Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of copper, indium, gallium, selenium, tellurium, cadmium, or zinc on flexible substrates. Said evaporation sources may, for example, be used within vacuum chambers where a plurality of evaporation source types, some of which may have physical and design characteristics different from the
evaporation source 100 described below, are configured to implement a co-evaporation process. -
FIG. 1A is a side cross-sectional view of avapor deposition system 10, according to one embodiment. While not intending to limit the scope of the disclosure provided herein, in one embodiment, thevapor deposition system 10 is a roll-to-roll type vapor deposition system for depositing material layers onto aflexible substrate 50. Thevapor deposition system 10 includes avacuum chamber 11 including one ormore walls 12 for enclosing aprocessing region 15 of thevapor deposition system 10. Thevapor deposition system 10 can further include one ormore evaporation sources 100, which are disposed within theprocessing region 15. - Typically, the
processing region 15 of thevacuum chamber 11 is maintained at a constant vacuum pressure. Thevapor deposition system 10 includes one ormore sets more evaporation sources 100 that are positioned within theprocessing region 15 to deposit material layer(s) onto thesubstrate 50 as thesubstrate 50 is transferred through theprocessing region 15. In some embodiments, thesubstrate 50 can include a web of flexible polyimide or flexible stainless steel material. Thesubstrate 50 can be transferred through theprocessing region 15 from afeed roll 41, over tensioning rolls 51, 52, 53, 54 and to a take-up roll 42. - The
evaporation sources 100 can each contain material that can be heated to a molten state, so that the heated material evaporates to coat portions of thesubstrate 50 as thesubstrate 50 passes near eachevaporation source 100. Thesets evaporation sources 100 may be oriented so as to follow the path of thesubstrate 50 through theprocessing region 15. - A person of ordinary skill in the art will recognize that any appropriate material may be deposited on a substrate using the
vapor deposition system 10. Thevapor deposition system 10 is particularly appropriate for deposition of materials to create photovoltaic cells, particularly CIGS (copper-indium-gallium-(di)selenide) solar cells or CdTe (cadmium-tellurium) solar cells. In one example, at least one GIGS-containing semiconductive photovoltaic layer, also known as the absorber layer, is deposited onto a portion of thesubstrate 50. The semiconductive photovoltaic layer may, for example, be made of an “ABC” material, wherein “A” represents elements ingroup 11 of the periodic table of chemical elements (e.g., copper (Cu) or silver (Ag)), “B” represents elements in group 13 of the periodic table (e.g., indium (In), gallium (Ga), or aluminum (Al)), and “C” represents elements in group 16 of the periodic table (e.g., sulfur (S), selenium (Se), or tellurium (Te)). An example of an ABC2 material is the Cu(In,Ga)Se2 semiconductor also known as a CIGS material. Other thin-film absorber materials include cadmium telluride (CdTe) and its variants, perovskites, amorphous silicon, thin-film silicon, as well as absorber materials used to manufacture dye-sensitized solar cells or organic solar cells. -
FIG. 1B is a side cross-sectional view of one of theevaporation sources 100, according to one embodiment. Theevaporation source 100 includes acrucible assembly 200 that includes acrucible 201 and afirst heater 210H. Thefirst heater 210H includes aheating cable 210. Thecrucible 201 can be formed of a material having high-thermal conductivity, such as molybdenum, graphite or stainless steel. Thecrucible 201 includes one ormore walls 202, abase 203, and a top 206. The one ormore walls 202 surround theinterior region 204 of thecrucible 201. Thecrucible 201 further includes anopening 208 above theinterior region 204 of thecrucible 201 and surrounded by the top 206 of thecrucible 201. Deposition material 75 (e.g., a precursor element such as copper, indium, gallium, or selenium) can be placed in aninterior region 204 of thecrucible 201 and heated, so that vapor of thedeposition material 75 can be directed through theopening 208 of thecrucible 201 to deposit on the substrate 50 (seeFIG. 1A ). - The
first heater 210H provides heat to melt and evaporate the deposition material 75 (e.g., copper, indium, gallium, or selenium) in theinterior region 204 of thecrucible 201 during processing. In some embodiments, thefirst heater 210H can be disposed within thebase 203 of thecrucible 201 to provide heat from below thedeposition material 75. In some embodiments, thefirst heater 210H can include aheating cable 210; such as a sheathed heating cable, powered by electrical connections (not shown). Further details of thefirst heater 210H are described below in reference toFIGS. 1C and 1D . - In some embodiments, the
evaporation source 100 can further include athermal distributor 300 disposed within theinterior region 204 of thecrucible 201. However, in some embodiments thethermal distributor 300 may be omitted. Thethermal distributor 300 can be used to uniformly distribute heat to thedeposition material 75 during processing. Thethermal distributor 300 can be fabricated from a material that is heat-resistant, chemically compatible with thedeposition material 75 and has a high thermal conductivity, such as refractory metals, such as molybdenum. Thethermal distributor 300 can be sized in relation tointerior region 204 of thecrucible 201 to ensure good thermal contact between thethermal distributor 300 and the one ormore walls 202 of thecrucible 201. - The
evaporation source 100 can further include asecond heater 220H. Thefirst heater 220H includes acorresponding heating cable 220. Although theevaporation source 100 is shown including twoheaters second heater 220H can be disposed in theinterior region 204 of thecrucible 201 above thethermal distributor 300. In some embodiments, thedeposition material 75 can be maintained at levels below the top of thethermal distributor 300, which keeps thesecond heater 220H in a position that contacts vapor ofdeposition material 75, but the not theliquid deposition material 75. Thesecond heater 220H can be used to provide heat to thedeposition material 75 and to control the evaporation rate of thedeposition material 75. In some embodiments, thesecond heater 220H can include aheating cable 220, such as a sheathed heating cable, powered by electrical connections (not shown). - In some embodiments, the
first heater 210H can be used to control the temperature of theliquid deposition material 75 and thesecond heater 220H can be used to control the temperature of the vapor of thedeposition material 75. For example, a first temperature control loop (e.g., PID loop) can be executed by acontroller 80, where a first temperature sensor (not shown) configured to sense the temperature ofdeposition material 75 is the input to the first temperature control loop and the power provided to thefirst heater 210H is the output of the first temperature control loop. Similarly, a second temperature control loop (e.g., PID loop) can be executed by thecontroller 80, where a second temperature sensor (not shown) configured to sense the temperature of the vapor of thedeposition material 75 is the input to the second temperature control loop and the power provided to thesecond heater 220H is the output of the second temperature control loop. In other embodiments, bothheaters deposition material 75. Further details of thesecond heater 220H are described below in reference toFIGS. 1D and 1E . However, in some embodiments thefirst heater 210H and/or thesecond heater 220H may be omitted. - The
evaporation source 100 further includes alid assembly 400 disposed above thethermal distributor 300. Thelid assembly 400 can be positioned on a supportingridge 209 of thecrucible 201. Thelid assembly 400 thermally isolates theinterior region 204 of thecrucible 201 from the areas above thecrucible 201. Thelid assembly 400 may be formed from a heat resistant and thermally conductive material, such as molybdenum or graphite. Thelid assembly 400 includesopenings 402 to direct evaporated deposition material towards the substrate 50 (seeFIG. 1A ) during processing. In one configuration, theopenings 402 are sized to control the effusion of material from theevaporation source 100. In one example, the diameters of theopenings 402 are from about 1 millimeter (mm) to about 40 mm, such as from about 2 mm to about 20 mm in size, and are spaced apart from each other by a distance from about 5 mm to about 400 mm, such as from about 10 mm to about 200 mm. Furthermore, in some embodiments, one or more of theopenings 402 can have a shape of a slot having a length from about 20 mm to about 80 mm, such as about 40 mm. - The
evaporation source 100 further includes athermal isolation assembly 500 disposed around thecrucible 201. Thethermal isolation assembly 500 includes one or morevertical walls 502 and atop plate 504. The one or morevertical walls 502 can surround the one ormore walls 202 of thecrucible 201. Thetop plate 504 can be disposed over the top 206 of thecrucible 201. Thethermal isolation assembly 500 isolates the walls and top of thecrucible 201 from variations in thermal loads coming from outside of thethermal isolation assembly 500, such as heat coming from one of theother evaporation sources 100 in thevacuum chamber 11. For example, without thethermal isolation assembly 500, thecrucible assembly 200 would receive heat from other sources in thevacuum chamber 11, such asother evaporation sources 100. In some embodiments, the one or more of thewalls 502 can be formed of a material having high thermal conductivity, such as copper. Thethermal isolation assembly 500 can further include one ormore cooling tubes 520. The coolingtubes 520 can be disposed around and/or adjacent to the one ormore walls 502. Cooling fluid may be distributed through the cooling tube(s) 520 to prevent external sources of heat from causing thermal disturbances within theinterior region 204 of thecrucible 201. - In some embodiments, the
evaporation source 100 can further include acooling assembly 600. However, in some embodiments, the coolingassembly 600 may be omitted. The coolingassembly 600 includes acooling plate 602 disposed below thecrucible 201. Thecooling plate 602 can be used too rapidly cool thedeposition material 75 when processing is completed or stopped. The coolingassembly 600 may further include one ormore cooling tubes 604. In some embodiments, asheet 616 material having a high thermal conductivity, such as graphite, may be disposed between the coolingplate 602 and thecrucible 201 to further promote thermal contact between the cooling plate 601 and thecrucible 201. Thesheet 616 may also help provide some temperature regulation, control of thecrucible 201 temperature and reduced stress in the cooling plate 601 andcrucible 201 due to a difference in temperature between the cooling plate 601 and thecrucible 201 during processing. - The
evaporation source 100 further includes aheat shield assembly 700 disposed around thethermal isolation assembly 500 and thecooling assembly 600 to further prevent external heat loads from causing thermal disturbances within theinterior region 204 of thecrucible 201. Theheat shield assembly 700 includes one or moreside wall portions 710, one ormore base portions 720, and alid portion 730. The one or more materials used for theside wall portions 710 can be chosen to be chemically compatible with the material evaporated by theevaporation source 100, and such materials can include stainless steel and molybdenum as these materials pose a low risk of contaminating the evaporation process. The one ormore base portions 720 can be disposed below the coolingassembly 600. Thelid portion 730 can be disposed above thetop plate 504 of thethermal isolation assembly 500. Thelid portion 730 may be supported by the one or moreside wall portions 710. Eachportion portion - The
evaporation source 100 further includes aleg assembly 800. Theleg assembly 800 provides support for other assemblies within theevaporation source 100, such as thethermal isolation assembly 500, the coolingassembly 600, and theheat shield assembly 700. Adjustment and positioning of theleg assembly 800 also determines where theevaporation source 100 is positioned within the vacuum chamber 11 (FIG. 1A ). In some embodiments, thefeet 820 of theleg assembly 800 are positioned on a portion of thewall 12 of thevapor deposition system 10. In one configuration, theleg assembly 800 includes a plurality oflegs 810 and a plurality offeet 820 that are used to level and vertically position theevaporation source 100 relative to thesubstrate 50 and thermally isolate theevaporation source 100 from portions of thevapor deposition system 10. -
FIG. 1C is a perspective view of thecrucible assembly 200, according to one embodiment. In some embodiments, thecrucible 201 can have a shape substantially similar to a rectangular prism having an open top. Anevaporation source 100 having a crucible with a substantially rectangular shape, such as thecrucible 201, is referred to herein as a linear evaporation source. The substrate 50 (FIG. 1A ) can be moved linearly above the linear evaporation source including thecrucible 201 in the X-direction. - In embodiments including a linear evaporation source such as the
crucible 201, thewalls 202 can include afirst end wall 202 1, asecond end wall 202 2 opposite to thefirst end wall 202 1, afirst side wall 202 3, and asecond side wall 202 4 opposite to thefirst side wall 202 3. Thefirst side wall 202 3 connects thefirst end wall 202 1 to thesecond end wall 202 2 along afirst side 201 1 of thecrucible 201. Thesecond side wall 202 4 connects thefirst end wall 202 1 to thesecond end wall 202 2 along asecond side 201 2 of thecrucible 201. Theside walls FIG. 2A ) extending in a direction from thefirst end wall 202 1 to thesecond end wall 202 2. Theend walls FIG. 1C ) extending in a direction from thefirst side wall 202 3 to thesecond side wall 202 4. - The
side walls end walls FIG. 1A ) moves above thecrucible 201 in the X-direction and the width of thesubstrate 50 in the Y-direction can be disposed over most ofopening 208 of thecrucible 201 in the Y-direction, such as 60% or more of theopening 208 in the Y-direction. In some embodiments, a ratio of the length of theside walls end walls side walls substrate 50 in the Y-direction. For example, the length of theside walls substrate 50 in the Y-direction by about 20 mm to about 400 mm, such as by about 200 mm. In some embodiments, the length of theside walls substrate 50 in the Y-direction by a first distance (FD) that is related to the distance (i.e., second distance (SD)) between the opening 208 of thecrucible 201 to thesubstrate 50 in the Z-direction. In one example, the first distance (FD) has a magnitude that is between the second distance divided by five (SD/5) and about five times the second distance (5×SD). -
FIG. 1D is a side cross-sectional view of thecrucible 201, thefirst heater 210H, thesecond heater 220H, thelid assembly 400, and thesubstrate 50, according to one embodiment. The view inFIG. 1D shows a cross-section of the Y-Z plane, which is perpendicular to the movement of thesubstrate 50 in the X-direction as shown inFIG. 1A . - The
opening 208 of thecrucible 201 has a width 207 (FIG. 1D ) in the Y-direction that is greater than a width 55 of thesubstrate 50. Vapor from the deposition material 75 (FIG. 1A ) can be directed towards alower surface 57 of thesubstrate 50 through all or substantially all of thewidth 207 of theopening 208 of thecrucible 201. Having thewidth 207 of theopening 208 be wider than the width 55 of thesubstrate 50 can help to ensure thelower surface 57 of thesubstrate 50 is fully and homogeneously coated by the vapor of thedeposition material 75. Theheating cable 210 of thefirst heater 210H can extend in the Y-direction from afirst end 211 to asecond end 212 for a length that is substantially as long as thewidth 207 of theopening 208, such as a length that is at least 75% of thewidth 207, such as a length that is at least 90% of thewidth 207. Theheating cable 220 of thesecond heater 220H can extend in the Y-direction from afirst end 221 to asecond end 222 for a length that is substantially as long as thewidth 207 of theopening 208, such as a length that is at least 75% of thewidth 207, such as a length that is at least 90% of thewidth 207. - The
lid assembly 400 can include a firstouter section 410, a secondouter section 420, and aninner section 430. The firstouter section 410 can be disposed on the supportingridge 209 of thecrucible 201 at or proximate to thefirst end wall 202 1. The secondouter section 420 can be disposed on the supportingridge 209 of thecrucible 201 at or proximate to thesecond end wall 202 2. Theinner section 430 can be disposed between the firstouter section 410 and the secondouter section 420. Theinner section 430 can be substantially centered in thecrucible 201 in the Y-direction. - Although the openings of the
lid assembly 400 are collectively referred to as openings 402 (FIG. 1B ), thelid assembly 400 can include different groups of openings. The firstouter section 410 can include a first plurality ofopenings 412 that are spaced apart from each other in the Y-direction by afirst distance 416. The secondouter section 420 can include a second plurality ofopenings 422 that are also spaced apart from each other in the Y-direction by thefirst distance 416. Theinner section 430 can include a third plurality ofopenings 432 that are spaced apart from each other in the Y-direction by asecond distance 436. Thesecond distance 436 can be greater than thefirst distance 416, which can allow for a greater concentration of openings in the,outer sections inner section 430. The greater concentration of openings in theouter sections FIG. 1B ) towards thesubstrate 50 through the openings in theouter sections inner section 430. The increased heat loss can slow the flux of vapor ofdeposition material 75 at outer sections that include the same concentration of openings as theinner section 430. Thus, the increased flux of vapor through theouter sections openings openings 432 in theinner section 430 can help reduce the variability of the deposition rate on thelower surface 57 of thesubstrate 50 in the Y-direction. - Furthermore, in some embodiments the openings in the first plurality of
openings 412 and the second plurality ofopenings 422 in theouter sections openings 432 in theinner section 430. The increasedwidth 415 of theopenings width 435 of theopenings 432 is another way to increase the flux of vapor of thedeposition material 75 towards thesubstrate 50 through the openings in theouter sections lower surface 57 of thesubstrate 50 in the Y-direction. - In other embodiments, the
lid assembly 400 can include a plurality of openings that are spaced apart from each other in the Y-direction by distances that vary, such as increase or decrease (e.g., between each pair of openings), based on how far the openings are from a center of the lid assembly in the Y-direction. For example, the openings that are closest to the center of the lid assembly in the Y-direction could be spaced apart from each other by the greatest distance, and the openings that are closest to either one of the crucible walls, such as thefirst end wall 202 1 could be spaced apart from each other by the shortest distance. Similarly, in some embodiments the width of the openings could increase for each opening based on how far the openings are from a center of the lid assembly in the Y-direction. For example, the openings located closest to the center of the lid assembly in the Y-direction could have the narrowest width in the Y-direction, and the openings located closest to either one of thecrucible end walls lower surface 57 of thesubstrate 50 in the Y-direction can be further reduced. - The
interior 204 of thecrucible 201 can include a firstouter region 204 1, a secondouter region 204 2, and acentral region 204 3. Thecentral region 204 3 can be disposed between the firstouter region 204 1 and the secondouter region 204 2. Eachregion region respective temperature sensor FIG. 1D ) to measure the temperature in therespective region temperature sensor FIG. 1B ). In other embodiments one or more of thetemperature sensors FIG. 1B )). -
FIG. 1E is a top view of thefirst heater 210H (e.g., looking -Z-direction), according to one embodiment. AlthoughFIG. 1E is described in reference to thefirst heater 210H, thesecond heater 220H can have a similar shape and have similarities to other features of thefirst heater 210H described inFIG. 1E . - As described above, the
heating cable 210 of thefirst heater 210H extends from thefirst end 211 to thesecond end 212 in the Y-direction. Thefirst heater 210H includes a firstcurved portion 213 located at thefirst end 211. Thefirst heater 210H includes a secondcurved portion 214 located at thesecond end 212. Thefirst heater 210H has afirst side 210 1 spaced apart from asecond side 210 2 in the X-direction. Theheating cable 210 includes afirst segment 215 extending along thefirst side 210 1 of thefirst heater 210H and connecting the firstcurved portion 213 to the secondcurved portion 214. The view of thefirst heater 210H inFIG. 1D is a side view of thefirst segment 215 extending from the firstcurved portion 213 to the secondcurved portion 214. Furthermore, the similar view of thesecond heater 220H inFIG. 1D can be a side view of a corresponding first segment extending between corresponding curved portions on thesecond heater 220H. - The
heating cable 210 further includes a firstinner segment 216 extending along thesecond side 210 2 of thefirst heater 210H from the firstcurved portion 213 towards acenter 210C of thefirst heater 210H in the Y-direction. Theheating cable 210 further includes a secondinner segment 217 extending along thesecond side 210 2 from the secondcurved portion 214 towards thecenter 210C of the first heater in the Y-direction. Theheating cable 210 can further include a firstinner end 218 and a secondinner end 219 spaced apart from each other in the Y-direction. The firstinner segment 216 can be connected to the firstinner end 218. The secondinner segment 217 can be connected to the secondinner end 219. Electrical current can flow through theheating cable 210 of thefirst heater 210H from the firstinner end 218, through the firstinner segment 216, through the firstcurved portion 213, through thefirst segment 215, through the secondcurved portion 214, through the secondinner segment 217, and to the secondinner end 219. The overall shape of thefirst heater 210H can be an open loop with the spacing between the firstinner end 218 and the secondinner end 219 representing the opening in the loop. Electrical connections (not shown) can be made to the firstinner end 218 and the secondinner end 219 to provide power to the first,heater 210H. -
FIG. 1F is a side view of aheater 230H, according to one embodiment. Theheater 230H can be used, for example, in place of thefirst heater 210H (seeFIG. 1D ) in some embodiments and is referred to in the following description as thefirst heater 230H. The top view (not shown) of thefirst heater 230H can be the same as the top view of thefirst heater 210H shown inFIG. 1E . The view of thefirst heater 230H shown inFIG. 1F can correspond to the side view shown inFIG. 1D of thefirst heater 210H. Thefirst heater 230H can include aheating cable 230 including afirst segment 235 extending from a firstcurved portion 233 located at afirst end 231 of theheating cable 230 to a secondcurved portion 234 located at asecond end 232 of theheating cable 230. Because the top view (not shown) of thefirst heater 230H can be the same as the top view of thefirst heater 210H shown inFIG. 1E , thefirst heater 230H can also include portions (not shown) corresponding to the firstinner segment 216 and the secondinner segment 217 shown inFIG. 1E . - The
first heater 230H is similar to thefirst heater 210H described above except that thefirst heater 230H includes one or more portions having a varying power output per unit length. In one configuration, thefirst heater 230H is similar to thefirst heater 210H described above except that thefirst heater 230H includes one or more portions having an increased thickness, so that the amount of heat emitted by thefirst heater 230H (e.g., power=I2R=V2/R) can vary in the Y-direction (i.e., the direction that corresponds to the width 55 of the substrate disposed above thecrucible 201 as shown inFIG. 1D ) as a current is delivered through, and/or voltage is applied across, the length of thefirst heater 230H. Although the increased thickness can be in more than one direction or all directions (e.g., a rounded cable having an increased thickness), the increased thickness is shown here for thefirst heater 230H in the Z-direction. Thefirst heater 230H has acenter 230C in the Y-direction. Theheating cable 230 of thefirst heater 230H can include twofirst portions 237 having an increased thickness relative to the remainder of thefirst segment 235 that is not part of a portion having an increased thickness, such as the portion offirst segment 235 shown inregion 247. Eachfirst portion 237 having an increased thickness can be spaced apart from thecenter 230C in the Y-direction by afirst distance 241, wherein thefirst portions 237 are disposed on opposing sides of thecenter 230C from each other in the Y-direction. Eachfirst portion 237 has an increased thickness that can extend for afirst length 243 in the Y-direction. - The
heating cable 230 of thefirst heater 230H can further include twosecond portions 238 having an increased thickness relative to the remainder of thefirst segment 235 that is not part of a portion having an increased thickness, such as the portion offirst segment 235 shown inregion 247. Eachsecond portion 238 having an increased thickness can be spaced apart from thecenter 230C in the Y-direction by asecond distance 242, wherein thesecond portions 238 are disposed on opposing sides of thecenter 230C from each other in the Y-direction. Eachsecond portion 238 has an increased thickness that extends for asecond length 244 in the Y-direction. - The
portions lengths portions first segment 235 not having an increased thickness, such as the portion offirst segment 235 shown inregion 247. The increased thickness of theportions portions respective lengths first segment 235 not having an increased thickness. Thus, theportions first segment 235 having the same length in the Y-direction but not having an increased thickness. - The
first distance 241 is less than thesecond distance 242, so thefirst portions 237 are located closer to thecenter 230C than thesecond portions 238 are to thecenter 230C. Furthermore, thefirst length 243 is longer than thesecond length 244, so thefirst portions 237 extend for a longer length in the Y-direction than thesecond portions 238 extend in the Y-direction. The locations of thefirst portions 237, which are closer to thecenter 230C, and the longer lengths of thefirst portions 237 relative to thesecond portions 238, causes thefirst heater 230H to emit less heat to regions that are closer to thecenter 230C than to similarly sized regions that are further from thecenter 230C. Furthermore, thefirst heater 230H emits more heat to regions not including a portion having an increased thickness. For example, for three regions of the same size including afirst region 245 surrounding one of thefirst portions 237, asecond region 246 surrounding one of thesecond portions 238, and athird region 247 surrounding a portion of thefirst segment 235 not having an increased cross-sectional area, the least amount of heat is emitted to thefirst region 245, the most amount of heat is emitted to thethird region 247, and the heat emitted to thesecond region 246 is greater than thefirst region 245 but less than thethird region 247. - Thus, in some embodiments, the amount of heat provided by the
first heater 230H generally increases in the Y-direction as theheating cable 230 extends away from thecenter 230C. Referring toFIG. 1D , by providing more heat from portions of thefirst heater 230H that are further away from thecenter 230C, more heat can be provided to theouter regions interior region 204 of thecrucible 201, such as regions of theinterior region 204 of thecrucible 201 near or bordering thefirst end wall 202 1 and thesecond end wall 202 2. By providing more heat to the outer regions of theinterior region 204 of thecrucible 201, the variability in the evaporation rate of the deposition material 75 (seeFIG. 1B ) in the Y-direction can be reduced. For example, if a constant rate of heat is provided in the Y-direction, then the evaporation rate of the deposition material 75 (seeFIG. 1B ) can be lower at the outer regions of theinterior region 204 of thecrucible 201 due to the increased heat losses around these outer regions. Thus, by providing additional heat to these outer regions using thefirst heater 230H accounts for the additional heat loss at the outer regions, and the variability in the evaporation rate of the deposition material 75 (seeFIG. 1B ) in the Y-direction can be reduced. -
FIG. 1G is a side sectional view of aheater 250H, according to one embodiment. Theheater 250H can be used, for example, in place of thesecond heater 220H (seeFIG. 1D ) in some embodiments and is referred to in the following description as thesecond heater 250H. The view of theheater 250H shown inFIG. 1F can correspond to the view shown inFIG. 1D of thesecond heater 220H. The top view (not shown) of theheater 250H can be the same as the top view of thefirst heater 210H shown inFIG. 1E . Theheater 250H can include aheating cable 250 including afirst segment 255 extending from a firstcurved portion 253 located at afirst end 251 of thesecond heater 250H to a secondcurved portion 254 located at asecond end 252 of thesecond heater 250H. Because the top view (not shown) of thesecond heater 250H can be the same as the top view of thefirst heater 210H shown inFIG. 1E , thesecond heater 250H can also include portions (not shown) corresponding to the firstinner segment 216 and the secondinner segment 217 shown inFIG. 1E . - The
second heater 250H can be the same as thefirst heater 230H except that theheater 250H can include portions having larger increased thicknesses than theportions first heater 230H. For example, in thesecond heater 250H thefirst portions 237 from thefirst heater 230H are replaced with largerfirst portions 257. These largerfirst portions 257 extend for afirst distance 263 in the Y-direction that is longer than thefirst length 243 that thefirst portions 237 extended for in the Y-direction. Furthermore, these largerfirst portions 257 can extend further in the Z-direction than thefirst portions 237. Similarly, in thesecond heater 250H thesecond portions 238 from thefirst heater 230H are replaced with largersecond portions 258. These largersecond portions 258 extend for asecond distance 264 in the Y-direction that is longer than thesecond length 244 that thesecond portions 238 extended for in the Y-direction. Furthermore, these largersecond portions 258 can extend further in the Z-direction than thesecond portions 238. - Furthermore, the
portions center 250C of thesecond heater 250H in the Y-direction than theportions first heater 230H described above. For example, thefirst portions 257 are located afirst distance 261 from thecenter 250C, which is less than thefirst distance 241 of thefirst portions 237 to the center 2300 of thefirst heater 230H described above. Thesecond portions 258 are located asecond distance 262 from thecenter 250C, which is less than thesecond distance 242 of thesecond portions 238 to thecenter 230C of thefirst heater 230H described above. - By making the
portions heater 250H larger than therespective portions first heater 230H, and by positioning theportions center 250C of thesecond heater 250H than therespective portions center 230C of thefirst heater 230H, the heater second 250H provides less heat to a central region surrounding the center of thesecond heater 250H than a central region of the same size surrounding thefirst heater 230H when bothheaters FIG. 1F shows acentral region 248 surrounding both of thefirst portions 237 of thefirst heater 230H, andFIG. 1G shows acentral region 268 surrounding both of thefirst portions 257 of thesecond heater 250H, where thecentral region 248 and thecentral region 268 are the same size. The larger size and closer location to thecenter 250C of thefirst portions 257 causes thesecond heater 250H to provide less heat to thecentral region 268 than thefirst heater 230H provides to thecentral region 248, which has the same size as thecentral region 268 when theheaters - Furthermore, there is a larger difference in heat provided between central regions relative to outer regions in the
second heater 250H than there is for a difference in heat provided between central regions relative to outer regions for thefirst heater 230H when bothheaters FIG. 1F shows anouter region 249 surrounding an outer portion of thefirst heater 230H. Theouter region 249 can be the same size as thecentral region 248.FIG. 1G shows anouter region 269 surrounding an outer portion of thesecond heater 250H. Theouter region 269 can be the same size as thecentral region 268 inFIG. 1G and can also be the same size as theregions FIG. 1F . Furthermore, the portion of thefirst heater 230H surrounded by theregion 249 can be identical to the portion of thesecond heater 250H surrounded by theregion 269. Because thesecond heater 250H includes largerfirst portions 257 than thefirst portions 237 of thefirst heater 230H and because the portions of theheaters respective regions central region 268 by thesecond heater 250H relative to the heat provided to thecentral region 248 by thefirst heater 230H causes the difference in heat provided to thecentral region 268 relative to theouter region 269 to be larger than the difference in heat provided to thecentral region 248 relative to theouter region 249. Thus, thesecond heater 250H can be described as providing a steeper heating profile in the Y-direction than thefirst heater 230H due to the larger changes in heat provided in the Y-direction for thesecond heater 250H than the changes in heat provided by thefirst heater 230H in the Y-direction. - For example, the difference between the heating profiles of the
first heater 230H and thesecond heater 250H are shown inFIGS. 1H and 1I .FIG. 1H shows a heat output profile for thefirst heater 230H, according to one embodiment. Similarly,FIG. 1I shows a heat output profile for thesecond heater 250H, according to one embodiment. Thefirst heater 230H generates more at theends center 230C, and the additional heat produced at theends center 230C can be represented by afirst difference 239. Thefirst heater 250H generates more at theends center 250C, and the additional heat produced at theends center 250C can be represented by asecond difference 259. Thesecond difference 259 is greater than thefirst difference 239, and thus thesecond heater 250H has a steeper heating profile than thefirst heater 230H. - By having two
heaters heaters 250H provide a steeper heating profile, the twoheaters FIG. 1B ) and vapor of thedeposition material 75 in the Y-direction. For example, if temperatures of thedeposition material 75 are higher incentral region 204 3 of theinterior region 204 of the crucible 201 (seeFIG. 1D ) thanouter regions interior region 204 of thecrucible 201, then power provided to thesecond heater 250H can be increased because the steeper heating profile of thesecond heater 250H causes increases in power to thesecond heater 250H to have a greater effect on heatingouter regions 204 1, 204 2 (seeFIG. 1D ) of theinterior region 204 of thecrucible 201 thancentral regions 204 3 of theinterior region 204 of thecrucible 201. Similarly, reducing the power provided to thefirst heater 230H would have a greater effect on reducing the temperature ofcentral region 204 3 of theinterior region 204 of thecrucible 201 thanouter regions interior region 204 thecrucible 201. On the other hand, if the temperatures of thedeposition material 75 are higher inouter regions interior region 204 of thecrucible 201 thancentral region 204 3 of theinterior region 204 of thecrucible 201, then opposite actions can be taken with the power provided to theheaters deposition material 75 in the Y-direction (e.g., reducing the power provided to thesecond heater 250H, or increasing the power provided to thefirst heater 230H). - Referring to
FIGS. 1D, 1F and 1G , the varying amount of heat that theheaters portions 237, 238) can be adjusted, an explanation relative to larger sections of theheaters heaters respective length length outer section outer section inner section heater outer section outer section inner section heater outer section outer section - Although the
heaters portions first heater 230H andportions second heater 250H) relative to the remainder of theheaters portions first heater 230H (seeFIG. 1F ) and theportions second heater 250H (seeFIG. 1G ) are described as extending from respectivefirst segments first segment 215 shown inFIG. 1E , theheaters portions heaters inner segments FIG. 1E , so that theheaters - In some embodiments, each
heater FIG. 5 described below), so that a temperature variability of thedeposition material 75 in theinterior region 204 of thecrucible 201 that is not symmetrical about a center in the Y-direction of theinterior region 204 of thecrucible 201 can be controlled. For example, referring toFIG. 1D it is possible that there may be greater heat loss on the left side of the crucible 201 (i.e., at first end wall 202 1) than there is for on the right side of the crucible 201 (i.e., at second end wall 202 1). Thus, theheaters FIG. 1F, 1G ) having the open loop design (seeFIG. 1E ) could each be replaced by, for example, two heaters having an open loop design that does not extend as far in the Y-direction, so that the two heaters may be placed side-by-side in the X-Y plane at the locations in the Z-direction for each of theheaters FIG. 1B . -
FIG. 2A is a side cross-sectional view of anevaporation source 100A, according to one embodiment. Theevaporation source 100A is similar to theevaporation source 100 described above (seeFIG. 1B ) except that theevaporation source 100A includes acrucible assembly 200A that is different from thecrucible assembly 200 described above, and theevaporation source 100A also does not include thesecond heater 220H described above. Thecrucible assembly 200A includes aheater 280 disposed around thewalls 202 of thecrucible 201. Theheater 280 can include a heating cable, such as a sheathed heating cable. The heating cable can be distributed across each of thewalls 202 in a pattern using a plurality of loops. A portion of two of these loops is visible inFIG. 2A . The loops allow thermal expansion of the heating cable of theheater 280 with respect to thecrucible 201. Electric power may be applied to the heating cable of theheater 280 to provide the heat to thecrucible 201 by a power supply that is coupled to a temperature control system. By using the heater 282 direct heat through thecrucible walls 202, the variability in the temperature of thedeposition material 75 in the X-direction and the Y-direction can be reduced. This is because the additional heat losses that occur around the perimeter of thecrucible 201 can be substantially negated by providing the heat through the perimeter of thecrucible 201. In another embodiment, theheater 280 may be placed in thecrucible walls 202 to place theheater 280 closer to the material being heated. In yet another embodiment, theheater 280 may surround thecrucible 201, a heater similar to theheater 280 may be placed below thecrucible 201, and an additional heater, such as theheater 220H (SeeFIG. 1B ) orheater 250H (FIG. 1G ) may disposed in theinterior region 204 of thecrucible 201 above thethermal distributor 300. -
FIG. 2B is a side cross-sectional view of anevaporation source 100B, according to one embodiment. Theevaporation source 100B is similar to theevaporation source 100 described above (seeFIG. 1B ) except that theevaporation source 100B includes acrucible assembly 200B that is different from thecrucible assembly 200 described above, theevaporation source 100B also does not include thesecond heater 220H described above, and theevaporation source 100 B includes alid assembly 400B that is different from thelid assembly 400 described above. Thelid assembly 400B includesopenings 402B disposed in a central location in the X-direction. Theopenings 402B can be wider in the X-direction than the openings 402 (seeFIG. 1B ) described above. Theopenings 402B can be distributed in the Y-direction using a pattern similar to the distribution of theopenings 402 shown inFIG. 1D . For example, theopenings 402B can be narrower at the center in the Y-direction of thelid assembly 400B thanopenings 402B at outer regions of thelid assembly 400B, and theopenings 402B can be spaced further apart at the center of thelid assembly 400B in the Y-direction thanopenings 402B at outer regions of thelid assembly 400B. - The
crucible assembly 200B includes acrucible 201B that is different from thecrucible 201 described above. Thecrucible 201B includes a top 206B extending over theinterior region 204 of thecrucible 201B. The top 206B includes afirst portion 206B1 extending from thefirst side wall 202 3 and asecond portion 206B2 extending from thesecond side wall 202 4. Thecrucible assembly 200B can further include aheater 290H including acorresponding cable 290 disposed in the top 206B of thecrucible 201B. Although thecrucible assembly 200B is shown including twoheaters heater 290H can have the same shape as the top view of thefirst heater 210H shown inFIG. 1E . The top 206B can also include portions (not shown) extending in from thewalls heater 290H, which can have a similar shape to thecurved portions first heater 210H. By disposing theheater 290H in the top 206B of thecrucible 201B, temperature variations in the interior of thecrucible 201B above thethermal distributor 300 can be reduced. For example, the high thermal mass of the top 206B of thecrucible 201B can prevent small changes in the power provided to theheater 290H from causing large changes to the temperature of the vapor of thedeposition material 75 because the high thermal mass of the top 206B allows the heat released into theinterior region 204 by the top 206B to respond slowly to changes in heat provided to the top 206B. Theheaters heaters FIGS. 1F, 1G , so that temperature variations in the Y-direction can be reduced as described above. Furthermore, in some embodiments, either thefirst heater 210H or theheater 290H may be omitted. -
FIG. 3 is a process flow diagram of amethod 301 for depositing a source material on a substrate, according to one embodiment. Referring toFIGS. 1B, 1D, 1F, and 1G , themethod 301 is described. Themethod 301 can be performed using theevaporation source 100 to deposit vapor of the deposition material 75 (seeFIG. 1B ) on the substrate 50 (seeFIG. 1D ). Theheaters heaters evaporation source 100. - At
block 305,deposition material 75 is placed in theinterior region 204 of thecrucible 201. Atblock 310, theheaters deposition material 75. As described above, in order to reduce the variability of the temperature of thedeposition material 75 in the Y-direction, theheaters FIG. 1D ) than to thecentral region 204 3 as well as heat at a higher rate to the secondouter region 204 2 than to thecentral region 204 3. - Furthermore, the
second heater 250H provides a greater proportion of its heat to theouter regions first heater 230H provides to theouter regions first heater 230H to the firstouter region 204 1 relative to the heat transfer rate provided by thefirst heater 230H to thecentral region 204 3 can be expressed as a first ratio, and (2) the heat transfer rate provided by thesecond heater 250H to the, firstouter region 204 1 relative to the heat transfer rate provided by thesecond heater 250H to thecentral region 204 3 can be expressed as a second ratio, then the second ratio is greater than the first ratio. - At
block 315, a first temperature is measured in the firstouter region 204 1 using the temperature sensor 271 (FIG. 1D ) and a second temperature is measured in thecentral region 204 3 using the temperature sensor 273 (FIG. 1D ). In some embodiments, a third temperature can also be measured in the secondouter region 204 2. Atblock 320, a difference between the first temperature and the second temperature can be calculated, for example by the controller 80 (FIG. 1D ). - At
block 325, a rate of heat provided by thefirst heater 230H to theinterior region 204 relative to a rate of heat provided by thesecond heater 250H to theinterior region 204 is adjusted, for example by thecontroller 80, based on the difference between the first temperature and the second temperature. Although the following describes adjusting the rates of heat based on temperature measurements, in some embodiments the rates of heat may be adjusted based on measurements of evaporation rates or measurements of thicknesses on different portions of thesubstrate 50. For example, if the second temperature is greater than the first temperature, then (1) the rate of heat provided by thesecond heater 250H to theinterior region 204 can be increased relative to the rate of heat provided by thefirst heater 230H to theinterior region 204, or (2) the rate of heat provided by thefirst heater 230H to theinterior region 204 can be decreased relative to the rate of heat provided by thesecond heater 250H to theinterior region 204. In one embodiment, the controller 80 (FIG. 1D ) can calculate a difference between a temperature setpoint for theinterior region 204 and an average of the first temperature and the second temperature to determine whether to increase the rate of heat provided by thesecond heater 250H or to decrease the rate of heat provided by thefirst heater 230H when the second temperature is greater than the first temperature., For example, if second temperature is greater than the first temperature, the temperature setpoint is 900° C., and the average of the first temperature and the second temperature is 899.5° C., then thecontroller 80 can adjust an output from the controller to increase the rate of heat provided, by thesecond heater 250H, so that the overall temperature of theinterior region 204 increases and the difference between the first temperature and the second temperature is reduced. After adjusting the rate of heat provided by theheaters block 325, themethod 301 can continue cycling throughblocks 310 through 325 to maintain a low level of variability of the temperature in theinterior region 204 in the Y-direction. -
FIG. 4 is a side view of aheater 410H, according to one embodiment. Theheater 410H can be used, for example, in place of one or more of theheaters heater 410H can have a shape of theheater 210H as shown inFIG. 1E . Theheater 410H includes acore 420. The core extends from afirst end 421 to asecond end 422. The core further includes acenter 420C. In some embodiments, thecore 420 may be formed of a heat resistant electrically insulating material (e.g., a ceramic material or in some embodiments a graphitic material with an insulating and heat resistant coating). Theheater 410H may further include aheating cable 430, which can be wrapped around thecore 420. For example, in some embodiments, theheating cable 430 can be wrapped around thecore 420 in a helical pattern to form a series ofrings 435 extending substantially from thefirst end 421 to the second 422 of thecore 420. Theheating cable 430 can be disposed within slots or cavities formed within a surface of the core 420 in a helical pattern that extends along the length of thecore 420. - The spacing between the
rings 435 can vary from thefirst end 421 to thecenter 420C and from thecenter 420C to thesecond end 422. For example, therings 435 can include an outer section 435O at thefirst end 421, acentral section 435C at thecenter 420C, and an intermediate section 435I located between the outer section 435O and thecentral section 435C. The cable can also include corresponding intermediate and outer sections on the right side of thecenter 420C. Therings 435 in thecentral section 435C can be spaced apart further from each other than therings 435 in the intermediate section 435I are spaced apart from each other, and therings 435 in the intermediate section 435I can be spaced apart further from each other than therings 435 in the outer section 435O are spaced apart from each other. Sections of theheater 410H having closelypacked rings 435 can produce more heat than sections of theheater 410H having loosely packed rings 435. Thus, the outer region 435O having the most closelypacked rings 435 can produce more heat along a given length in the Y-direction than the heat produced by the intermediate section 435I or thecentral region 435C along the same length in the Y-direction. Furthermore, thecentral region 435C having the most loosely packedrings 435 produces less heat than the heat produced by the intermediate region 435I or the outer region 435O. The spacing between therings 435 can be varied as needed along the length of the core 420 to produce the desired heating profile in the Y-direction. Furthermore, in embodiments including two or more heaters (e.g., theevaporation source 100 ofFIG. 1B ) the spacing between therings 435 in the different heaters can vary according to different profiles in the Y-direction, so that the two heaters can be used together to independently reduce the variability of the temperature of the deposition material 75 (seeFIG. 1B ) in the Y-direction and the temperature of the vapor of thedeposition material 75 in the Y-direction. -
FIG. 5 is a top view of aheating system 900, according to one embodiment. Theheating system 900 can be used, for example, in place of one or more of theheaters heating system 900 includes afirst heater 910H and asecond heater 920H. Thefirst heater 910H and thesecond heater 920H can be spaced apart from each other in the Y-direction to enable independent heating of areas of the evaporation source (e.g.,evaporation source 100 described above) that are spaced apart in the Y-direction. For example, in some embodiments theheaters center 200C of the crucible assembly (e.g.,crucible assembly 200 described above). Independent heating of different portions of the crucible assembly spaced apart in the Y-direction can be useful when the heat loss at opposing ends of the crucible assembly differ from each other. - The
first heater 910H includes afirst heating cable 910 having afirst leg 911 and asecond leg 912. Thefirst leg 911 extends from a firstinner end 913 to acurved portion 915. Thesecond leg 912 extends from a secondinner end 914 to thecurved portion 915. Thecurved portion 915 connects thefirst leg 911 to thesecond leg 912. Thecurved portion 915 can be disposed in the Y-direction in a corresponding position to thecurved portion 213 described above in reference to theheater 210H ofFIG. 1E . - The
second heater 920H includes asecond heating cable 920 having afirst leg 921 and asecond leg 922. Thefirst leg 921 extends from a firstinner end 923 to acurved portion 925. Thesecond leg 922 extends from a secondinner end 924 to thecurved portion 925. Thecurved portion 925 connects thefirst leg 921 to thesecond leg 922. Thecurved portion 925 can be disposed in the Y-direction in a corresponding position to thecurved portion 214 described above in reference to theheater 210H ofFIG. 1E . - While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/753,462 US10982319B2 (en) | 2015-08-21 | 2016-08-19 | Homogeneous linear evaporation source |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562208417P | 2015-08-21 | 2015-08-21 | |
US201662371545P | 2016-08-05 | 2016-08-05 | |
US15/753,462 US10982319B2 (en) | 2015-08-21 | 2016-08-19 | Homogeneous linear evaporation source |
PCT/IB2016/001196 WO2017033053A1 (en) | 2015-08-21 | 2016-08-19 | Homogeneous linear evaporation source |
Publications (2)
Publication Number | Publication Date |
---|---|
US20180245207A1 true US20180245207A1 (en) | 2018-08-30 |
US10982319B2 US10982319B2 (en) | 2021-04-20 |
Family
ID=56979601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/753,462 Active 2037-10-03 US10982319B2 (en) | 2015-08-21 | 2016-08-19 | Homogeneous linear evaporation source |
Country Status (4)
Country | Link |
---|---|
US (1) | US10982319B2 (en) |
MY (1) | MY190445A (en) |
WO (1) | WO2017033053A1 (en) |
ZA (1) | ZA201801346B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111655898A (en) * | 2018-01-23 | 2020-09-11 | 应用材料公司 | Evaporator for evaporating source material, material deposition source, deposition apparatus and method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030168013A1 (en) * | 2002-03-08 | 2003-09-11 | Eastman Kodak Company | Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device |
US20070119849A1 (en) * | 2005-08-30 | 2007-05-31 | Jeong Min J | Heater and vapor deposition source having the same |
Family Cites Families (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3971334A (en) * | 1975-03-04 | 1976-07-27 | Xerox Corporation | Coating device |
US5037624A (en) | 1987-03-24 | 1991-08-06 | Advanced Technology Materials Inc. | Composition, apparatus, and process, for sorption of gaseous compounds of group II-VII elements |
JP2000252269A (en) | 1992-09-21 | 2000-09-14 | Mitsubishi Electric Corp | Equipment and method for liquid vaporization |
US5480678A (en) | 1994-11-16 | 1996-01-02 | The B. F. Goodrich Company | Apparatus for use with CVI/CVD processes |
JP3417751B2 (en) | 1995-02-13 | 2003-06-16 | 株式会社東芝 | Method for manufacturing semiconductor device |
FR2733254B1 (en) | 1995-04-18 | 1997-07-18 | Europ Propulsion | CHEMICAL VAPOR INFILTRATION PROCESS FOR THE DENSIFICATION OF POROUS SUBSTRATES DISPOSED IN RING STACKS |
US6056820A (en) | 1998-07-10 | 2000-05-02 | Northrop Grumman Corporation | Advanced physical vapor transport method and apparatus for growing high purity single crystal silicon carbide |
US6669988B2 (en) | 2001-08-20 | 2003-12-30 | Goodrich Corporation | Hardware assembly for CVI/CVD processes |
EP1041169B1 (en) | 1999-03-29 | 2007-09-26 | ANTEC Solar Energy AG | Apparatus and method for coating substrates by a PVD process |
US6406539B1 (en) | 1999-04-28 | 2002-06-18 | Showa Denko K.K, | Process for producing silicon carbide single crystal and production apparatus therefor |
US20050147753A1 (en) | 1999-10-22 | 2005-07-07 | Kurt J. Lesker Company | Material deposition system and a method for coating a substrate or thermally processing a material in a vacuum |
FR2818291B1 (en) | 2000-12-19 | 2003-11-07 | Snecma Moteurs | DENSIFICATION OF HOLLOW POROUS SUBSTRATES BY CHEMICAL STEAM INFILTRATION |
FR2821859B1 (en) | 2001-03-06 | 2004-05-14 | Snecma Moteurs | PROCESS FOR THE DENSIFICATION BY CHEMICAL VAPOR INFILTRATION OF POROUS SUBSTRATES HAVING A CENTRAL PASSAGE |
JP4704605B2 (en) * | 2001-05-23 | 2011-06-15 | 淳二 城戸 | Continuous vapor deposition apparatus, vapor deposition apparatus and vapor deposition method |
US6793966B2 (en) | 2001-09-10 | 2004-09-21 | Howmet Research Corporation | Chemical vapor deposition apparatus and method |
US6953605B2 (en) | 2001-12-26 | 2005-10-11 | Messier-Bugatti | Method for densifying porous substrates by chemical vapour infiltration with preheated gas |
FR2834713B1 (en) | 2002-01-15 | 2004-04-02 | Snecma Moteurs | PROCESS AND PLANT FOR DENSIFICATION OF SUBSTRATES BY CHEMICAL STEAM INFILTRATION |
US6921062B2 (en) | 2002-07-23 | 2005-07-26 | Advanced Technology Materials, Inc. | Vaporizer delivery ampoule |
US7300038B2 (en) | 2002-07-23 | 2007-11-27 | Advanced Technology Materials, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
UA84862C2 (en) | 2003-03-03 | 2008-12-10 | Месье-Бугатти | Substrate |
FR2854168B1 (en) | 2003-04-28 | 2007-02-09 | Messier Bugatti | CONTROL OR MODELING OF CHEMICAL VAPOR INFILTRATION PROCESS FOR THE DENSIFICATION OF POROUS SUBSTRATES WITH CARBON |
KR20050004379A (en) | 2003-07-02 | 2005-01-12 | 삼성전자주식회사 | Gas supplying apparatus for atomic layer deposition |
US8123862B2 (en) | 2003-08-15 | 2012-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Deposition apparatus and manufacturing apparatus |
US7339139B2 (en) | 2003-10-03 | 2008-03-04 | Darly Custom Technology, Inc. | Multi-layered radiant thermal evaporator and method of use |
US20060037540A1 (en) | 2004-08-20 | 2006-02-23 | Rohm And Haas Electronic Materials Llc | Delivery system |
US7488512B2 (en) | 2004-11-29 | 2009-02-10 | Tokyo Electron Limited | Method for preparing solid precursor tray for use in solid precursor evaporation system |
US20060185597A1 (en) | 2004-11-29 | 2006-08-24 | Kenji Suzuki | Film precursor evaporation system and method of using |
DE102004062552A1 (en) | 2004-12-24 | 2006-07-06 | Aixtron Ag | Apparatus for vaporizing condensed substances |
SG160401A1 (en) | 2005-03-16 | 2010-04-29 | Advanced Tech Materials | System for delivery of reagents from solid sources thereof |
US7651570B2 (en) | 2005-03-31 | 2010-01-26 | Tokyo Electron Limited | Solid precursor vaporization system for use in chemical vapor deposition |
US7691443B2 (en) | 2005-05-31 | 2010-04-06 | Goodrich Corporation | Non-pressure gradient single cycle CVI/CVD apparatus and method |
US8057855B1 (en) | 2005-05-31 | 2011-11-15 | Goodrich Corporation | Non-pressure gradient single cycle CVI/CVD apparatus and method |
KR100712217B1 (en) | 2005-09-30 | 2007-04-27 | 삼성에스디아이 주식회사 | evaporating source and vacuum evaporating apparatus using the same |
US7967911B2 (en) | 2006-04-11 | 2011-06-28 | Applied Materials, Inc. | Apparatus and methods for chemical vapor deposition |
JP5209899B2 (en) | 2006-05-22 | 2013-06-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Delivery device |
US20080241805A1 (en) | 2006-08-31 | 2008-10-02 | Q-Track Corporation | System and method for simulated dosimetry using a real time locating system |
US9109287B2 (en) | 2006-10-19 | 2015-08-18 | Air Products And Chemicals, Inc. | Solid source container with inlet plenum |
JP4768584B2 (en) | 2006-11-16 | 2011-09-07 | 財団法人山形県産業技術振興機構 | Evaporation source and vacuum deposition apparatus using the same |
US7959973B2 (en) | 2006-11-29 | 2011-06-14 | Honeywell International Inc. | Pressure swing CVI/CVD |
US7846256B2 (en) | 2007-02-23 | 2010-12-07 | Tokyo Electron Limited | Ampule tray for and method of precursor surface area |
JP4992703B2 (en) | 2007-12-25 | 2012-08-08 | 住友電気工業株式会社 | Group III nitride semiconductor crystal growth method |
US9034105B2 (en) | 2008-01-10 | 2015-05-19 | American Air Liquide, Inc. | Solid precursor sublimator |
KR101015277B1 (en) | 2008-12-10 | 2011-02-15 | 삼성모바일디스플레이주식회사 | evaporation source |
JP5779171B2 (en) | 2009-03-26 | 2015-09-16 | トゥー‐シックス・インコーポレイテッド | Method and apparatus for sublimation growth of SiC single crystal |
JP4782219B2 (en) | 2009-07-02 | 2011-09-28 | 三菱重工業株式会社 | Vacuum deposition equipment |
JP4831841B2 (en) | 2009-07-10 | 2011-12-07 | 三菱重工業株式会社 | Vacuum deposition apparatus and method |
JP5244723B2 (en) | 2009-07-10 | 2013-07-24 | 株式会社日立ハイテクノロジーズ | Deposition equipment |
KR101030005B1 (en) | 2009-09-25 | 2011-04-20 | 삼성모바일디스플레이주식회사 | Deposition source |
US20130340680A1 (en) | 2011-03-11 | 2013-12-26 | Sharp Kabushiki Kaisha | Vapor deposition particle projection device and vapor deposition device |
JP2012207238A (en) | 2011-03-29 | 2012-10-25 | Hitachi High-Technologies Corp | Vapor deposition method and vapor deposition apparatus |
KR101854727B1 (en) | 2011-06-24 | 2018-05-04 | 엘지이노텍 주식회사 | Apparatus for fabricating ingot |
JP5728341B2 (en) | 2011-09-13 | 2015-06-03 | 東京エレクトロン株式会社 | Exhaust trap |
JP2013211138A (en) | 2012-03-30 | 2013-10-10 | Hitachi High-Technologies Corp | Evaporation source and vacuum deposition device using the same |
KR20210135341A (en) | 2012-05-31 | 2021-11-12 | 엔테그리스, 아이엔씨. | Source reagent-based delivery of fluid with high material flux for batch deposition |
FR2993044B1 (en) | 2012-07-04 | 2014-08-08 | Herakles | LOADING DEVICE AND INSTALLATION FOR THE DENSIFICATION OF POROUS, TRUNCONIC AND STACKABLE PREFORMS |
JP6078335B2 (en) | 2012-12-27 | 2017-02-08 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, vaporization system, vaporizer, and program |
JP2015010257A (en) | 2013-06-28 | 2015-01-19 | 株式会社日立ハイテクファインシステムズ | Evaporation source for vacuum deposition apparatus, and vacuum vapor deposition apparatus and vacuum deposition method using the evaporation source |
FR3018526B1 (en) | 2014-03-14 | 2021-06-11 | Herakles | CVI DENSIFICATION INSTALLATION INCLUDING A HIGH-CAPACITY PREHEATING ZONE |
WO2015164029A1 (en) | 2014-04-21 | 2015-10-29 | Entegris, Inc. | Solid vaporizer |
US9982341B2 (en) | 2015-01-30 | 2018-05-29 | Lam Research Corporation | Modular vaporizer |
KR20170096265A (en) | 2016-02-15 | 2017-08-24 | 삼성디스플레이 주식회사 | Metal deposition source assembly and the depositing apparatus comprising the same |
US9963779B2 (en) | 2016-02-29 | 2018-05-08 | Goodrich Corporation | Methods for modifying pressure differential in a chemical vapor process |
US10533252B2 (en) | 2016-03-31 | 2020-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Showerhead, semicondcutor processing apparatus having the same and semiconductor process |
JP6891018B2 (en) | 2017-03-27 | 2021-06-18 | 株式会社Kokusai Electric | Manufacturing method for substrate processing equipment, vaporization system, mist filter, and semiconductor equipment |
US11104993B2 (en) | 2017-07-28 | 2021-08-31 | Entegris, Inc. | Modular tray ampoule |
US10147597B1 (en) | 2017-09-14 | 2018-12-04 | Lam Research Corporation | Turbulent flow spiral multi-zone precursor vaporizer |
-
2016
- 2016-08-19 US US15/753,462 patent/US10982319B2/en active Active
- 2016-08-19 WO PCT/IB2016/001196 patent/WO2017033053A1/en active Application Filing
- 2016-08-19 MY MYPI2018000241A patent/MY190445A/en unknown
-
2018
- 2018-02-27 ZA ZA2018/01346A patent/ZA201801346B/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030168013A1 (en) * | 2002-03-08 | 2003-09-11 | Eastman Kodak Company | Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device |
US20070119849A1 (en) * | 2005-08-30 | 2007-05-31 | Jeong Min J | Heater and vapor deposition source having the same |
Also Published As
Publication number | Publication date |
---|---|
WO2017033053A1 (en) | 2017-03-02 |
MY190445A (en) | 2022-04-21 |
ZA201801346B (en) | 2021-05-26 |
US10982319B2 (en) | 2021-04-20 |
WO2017033053A9 (en) | 2018-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10676812B2 (en) | Evaporation source | |
EP3559303A1 (en) | Linear evaporation source | |
US9062369B2 (en) | Deposition of high vapor pressure materials | |
KR100495751B1 (en) | Method and apparatus for coating a substrate in a vacuum | |
EP3559302A1 (en) | Linear source for vapor deposition with heat shields | |
EP3559305B1 (en) | Roll-to roll vapor deposition system | |
EP3494243B1 (en) | Homogeneous linear evaporation source with heater | |
WO2018114377A1 (en) | Linear vapor source | |
US10982319B2 (en) | Homogeneous linear evaporation source | |
US20120052189A1 (en) | Vapor deposition system | |
EP3559306B1 (en) | Linear source for vapor deposition with at least three electrical heating elements | |
KR102080764B1 (en) | Linear source, and substrate processing apparatus | |
EP3314034B1 (en) | Evaporation crucible with floater | |
KR101266584B1 (en) | Evaporation source for Large scale deposition using parallel connection of point source | |
WO2018153859A1 (en) | Evaporation source with leg assembly | |
WO2018153857A1 (en) | Evaporation source with heat shield assembly | |
US20120234314A1 (en) | Roll-to-roll reactor for processing flexible continuous workpiece | |
EP3899085A1 (en) | Vapor deposition apparatus and method for coating a substrate in a vacuum chamber | |
WO2018153850A1 (en) | Evaporation source with thermal distributor | |
WO2018153851A1 (en) | Evaporation source with thermal isolation assembly | |
WO2018153853A1 (en) | Evaporation source with cooling assembly | |
WO2018153847A1 (en) | Evaporation source with lid | |
CN117488265A (en) | Multi-point heating structure for reel-to-reel vacuum coating system | |
KR20020089288A (en) | source for vapor deposition of organic layers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
AS | Assignment |
Owner name: FLISOM AG, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:RUTH, MARTA;PFEIFFER, RETO;SIGNING DATES FROM 20180522 TO 20190928;REEL/FRAME:053449/0440 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |