US20180142961A1 - Heat dissipation element with heat resistant mechanism - Google Patents

Heat dissipation element with heat resistant mechanism Download PDF

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Publication number
US20180142961A1
US20180142961A1 US15/806,817 US201715806817A US2018142961A1 US 20180142961 A1 US20180142961 A1 US 20180142961A1 US 201715806817 A US201715806817 A US 201715806817A US 2018142961 A1 US2018142961 A1 US 2018142961A1
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United States
Prior art keywords
heat
pipe
resistant layer
heat resistant
heat pipe
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Abandoned
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US15/806,817
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English (en)
Inventor
An-Chih Wu
Hung-Chi Su
Chih-Wei Chen
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Auras Technology Co Ltd
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Auras Technology Co Ltd
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Priority to US15/806,817 priority Critical patent/US20180142961A1/en
Assigned to AURAS TECHNOLOGY CO., LTD. reassignment AURAS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIH-WEI, SU, HUNG-CHI, WU, AN-CHIH
Publication of US20180142961A1 publication Critical patent/US20180142961A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling

Definitions

  • the present invention relates to a heat dissipation element, and more particularly to a heat dissipation element with a heat resistant mechanism.
  • a handheld electronic device such as a mobile phone, a tablet computer or a small-sized NB is equipped with a two-phase heat dissipation element for removing the heat from a chip, a memory or another electronic component of the handheld electronic device. Consequently, the handheld electronic device can be maintained in the normal working state.
  • the two-phase heat dissipation element includes a heat pipe, a loop-type heat pipe or a vapor chamber.
  • FIG. 1A is a schematic perspective view illustrating an inner heat pipe and a heat generation element in a conventional handheld electronic device.
  • FIG. 1B is a schematic cross-sectional view illustrating the inner structure of the conventional handheld electronic device of FIG. 1A and taken along the line 1 B- 1 B.
  • a heat dissipation element installed in a handheld electronic device 1 is a heat pipe 2 .
  • the heat pipe 2 comprises a closed pipe body 21 and a capillary structure 22 .
  • the capillary structure 22 is disposed within the pipe body 21 and filled with a working medium (not shown).
  • the pipe body 21 is at least divided into an evaporation section (or a heat absorbing section) 21 A and a condensation section (or a heat removing section) 21 B.
  • a heat generation element 11 e.g., a chip or a memory
  • the working medium absorbs the heat from the heat generation element 11 . Consequently, the working medium is changed from a liquid state to a vapor state.
  • the working medium in the vapor state is moved toward the condensation section 21 B. Then, the working medium releases the heat in the condensation section 21 B.
  • the working medium is condensed from the vapor state to the liquid state. Due to the capillary action of the capillary structure 22 , the working liquid in the liquid state is returned from the condensation section 21 B to the evaporation section 21 A. Consequently, a next liquid/gas change process is performed.
  • the pipe body of the heat dissipation element is usually made of a metallic material
  • the heat dissipation element still has some drawbacks. For example, while the heat is absorbed by the evaporation section 21 A and transferred to the condensation section 21 B, the heat is still exhausted to the surroundings through conduction. Under this circumstance, the ambient temperature near the heat dissipation element of the handheld electronic device 1 is largely increased. Moreover, if the heat is transferred to the casing of the handheld electronic device 1 , the tactile temperature of holding the handheld electronic device 1 by the user is affected.
  • a heat insulation layer is directly attached on an inner frame of the handheld electronic device.
  • a heat insulation layer is directly attached on an inner portion of the handheld electronic device near the casing. Since the available space inside the handheld electronic device is insufficient, it is difficult to attach the heat insulation layer. Therefore, there is a need of providing an effective approach to solve the drawbacks of the conventional technologies.
  • the present invention provides a novel design to solve the drawbacks of the conventional technologies.
  • the heat dissipation element is improved and equipped with an effective heat resistant mechanism to reduce or avoid heat release during the transfer process. Consequently, the ambient temperature near the heat dissipation element is decreased, and the tactile temperature of holding the handheld electronic device by the user is not affected.
  • the heat resistant mechanism of the present invention is directly formed on the heat dissipation element. In comparison with the conventional technology requiring the subsequent processing operation of the back-end system vendor, the wishes of the brand manufacturer to purchase the heat dissipation element of the present invention will be increased.
  • An object of the present invention is to avoid the problem of largely increasing or centralizing the ambient temperature of the heat dissipation element in the handheld electronic device, so that the normal operation of the nearby electronic component is not adversely affected. Moreover, the heat dissipation element does not increase the tactile temperature of the casing of the handheld electronic device.
  • the heat resistant mechanism is the heat dissipation element itself, is formed on the inner side of the heat dissipation element itself, or is formed on the outer side of the heat dissipation element itself. Consequently, the heat dissipation element is applied to the handheld electronic device.
  • the technology of the present invention can reduce the ambient temperature of the handheld electronic device or the tactile temperature of the casing of the handheld electronic device.
  • a heat pipe in accordance with an aspect of the present invention, there is provided a heat pipe.
  • the heat pipe includes a pipe body, a capillary structure and a heat resistant layer.
  • the pipe body includes an evaporation section, a heat resistant section and a condensation section.
  • the heat resistant section is arranged between the evaporation section and the condensation section.
  • the capillary structure is disposed within the pipe body.
  • the heat resistant layer is disposed within the pipe body and located at the heat resistant section.
  • the capillary structure is arranged between the pipe body and the heat resistant layer.
  • the capillary structure is a fiber bundle.
  • the capillary structure is a fiber bundle.
  • the heat resistant layer is located beside the fiber bundle. Moreover, the heat resistant layer and the fiber bundle are not overlapped with each other.
  • a heat pipe In accordance with an aspect of the present invention, there is provided a heat pipe.
  • the heat pipe is in contact with a heat generation element.
  • the heat pipe includes a pipe body, a capillary structure and a heat resistant layer.
  • the pipe body includes an evaporation section and a condensation section.
  • the capillary structure is disposed within the pipe body.
  • the heat resistant layer is disposed within the pipe body.
  • the pipe body has a far side away from the heat generation element. The heat resistant layer is located at the far side of the pipe body.
  • the heat resistant layer is formed on an inner side of the capillary structure.
  • the heat resistant layer is located at the evaporation section or the condensation section of the pipe body.
  • a loop-type heat pipe is in contact with a heat generation element.
  • the loop-type heat pipe includes a top plate and a bottom plate.
  • the bottom plate is in contact with the heat generation element.
  • the top plate and the bottom plate are stacked on each other to define an evaporation section, a vapor channel, a condensation section and a liquid channel.
  • a thermal conductivity of the bottom plate is higher than a thermal conductivity of the top plate.
  • a loop-type heat pipe is in contact with a heat generation element.
  • the loop-type heat pipe includes a top plate, a bottom plate, a vapor channel and a liquid channel.
  • the bottom plate is in contact with the heat generation element.
  • the top plate and the bottom plate are stacked on each other to define an evaporation section and a condensation section.
  • a thermal conductivity of the bottom plate is higher than a thermal conductivity of the top plate.
  • the vapor channel is connected with the evaporation section and the condensation section.
  • the liquid channel is connected with the condensation section and the evaporation section.
  • a vapor chamber in contact with a heat generation element.
  • the vapor chamber includes a top thin plate and a bottom thin plate.
  • the bottom thin plate is in contact with the heat generation element.
  • a thermal conductivity of the bottom thin plate is higher than a thermal conductivity of the top thin plate.
  • a vapor chamber in contact with a heat generation element.
  • the vapor chamber includes a top thin plate, a bottom thin plate and a heat resistant layer.
  • the bottom thin plate is in contact with the heat generation element.
  • the heat resistant layer is formed on an inner side of the top thin plate.
  • FIG. 1A is a schematic perspective view illustrating an inner heat pipe and a heat generation element in a conventional handheld electronic device
  • FIG. 1B is a schematic cross-sectional view illustrating the inner structure of the conventional handheld electronic device of FIG. 1A and taken along the line 1 B- 1 B;
  • FIG. 2A is a schematic perspective view illustrating a heat dissipation element (e.g., a heat pipe) according to a first embodiment of the present invention and a handheld electronic device with the heat dissipation element;
  • a heat dissipation element e.g., a heat pipe
  • FIG. 2B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 2A and taken along the line 2 B- 2 B;
  • FIGS. 3A-3E schematically illustrate some variant examples of the heat dissipation element (e.g., a heat pipe) of the first embodiment installed in the handheld electronic device;
  • the heat dissipation element e.g., a heat pipe
  • FIG. 4A is a schematic perspective view illustrating a heat dissipation element (e.g., a heat pipe) according to a second embodiment of the present invention and a handheld electronic device using the heat dissipation element;
  • a heat dissipation element e.g., a heat pipe
  • FIG. 4B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 4A and taken along the line 4 B- 4 B;
  • FIGS. 4C and 4D schematically illustrate some variant examples of the heat dissipation element (e.g., a heat pipe) of the second embodiment installed in the handheld electronic device;
  • the heat dissipation element e.g., a heat pipe
  • FIG. 5A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a third embodiment of the present invention and a handheld electronic device using the heat dissipation element;
  • a heat dissipation element e.g., a loop-type heat pipe
  • FIG. 5B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 5A and taken along the line 5 B- 5 B;
  • FIG. 6A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a fourth embodiment of the present invention and a handheld electronic device using the heat dissipation element;
  • a heat dissipation element e.g., a loop-type heat pipe
  • FIG. 6B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 6A and taken along the line 6 B- 6 B;
  • FIG. 7A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a fifth embodiment of the present invention and a handheld electronic device using the heat dissipation element;
  • a heat dissipation element e.g., a loop-type heat pipe
  • FIG. 7B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 7A and taken along the line 7 B- 7 B;
  • FIG. 7C schematically illustrates a variant example of the heat dissipation element (e.g., a loop-type heat pipe) of the fifth embodiment installed in the handheld electronic device;
  • the heat dissipation element e.g., a loop-type heat pipe
  • FIG. 8A is a schematic perspective view illustrating a heat dissipation element (e.g., a vapor chamber) according to a sixth embodiment of the present invention and a handheld electronic device using the heat dissipation element;
  • a heat dissipation element e.g., a vapor chamber
  • FIG. 8B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 8A and taken along the line 8 B- 8 B;
  • FIGS. 8C and 8D schematically illustrate some variant examples of the heat dissipation element (e.g., a vapor chamber) of the sixth embodiment installed in the handheld electronic device.
  • the heat dissipation element e.g., a vapor chamber
  • FIG. 2A is a schematic perspective view illustrating a heat dissipation element (e.g., a heat pipe) according to a first embodiment of the present invention and a handheld electronic device with the heat dissipation element.
  • FIG. 2B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 2A and taken along the line 2 B- 2 B.
  • the heat dissipation element is a heat pipe 2 .
  • the inner portion of the handheld electronic device 1 comprises an accommodation space.
  • the accommodation space is defined by a backside wall 1 A, a lateral wall 1 B and a front wall 1 C.
  • the heat pipe 2 comprises a closed pipe body 21 and a capillary structure 22 .
  • the capillary structure 22 is disposed within the pipe body 21 and filled with a working medium (not shown).
  • the pipe body 21 is at least divided into an evaporation section (or a heat absorbing section) 21 A, a heat resistant section 21 C and a condensation section (or a heat removing section) 21 B.
  • a heat generation element 11 e.g., a chip or a memory
  • the working medium absorbs the heat from the heat generation element 11 . Consequently, the working medium is changed from a liquid state to a vapor state.
  • the working medium in the vapor state is moved toward the condensation section 21 B through the heat resistant section 21 C.
  • the condensation section 21 B itself can remove the heat.
  • the condensation section 21 B is in cooperation with another heat dissipation mechanism (e.g., a heat sink 3 as shown in the drawing) to remove the heat. Consequently, the working medium in the condensation section 21 B is condensed from the vapor state to the liquid state. Due to the capillary action of the capillary structure 22 , the working liquid in the liquid state is returned from the condensation section 21 B to the evaporation section 21 A. Consequently, a next liquid/gas change process is performed.
  • the heat pipe 2 is further equipped with a heat resistant layer 23 .
  • the heat resistant layer 23 is located at the heat resistant section 21 C between the evaporation section 21 A and the condensation section 21 B and arranged around the pipe body 21 . Consequently, while the working medium in the heat pipe 2 is transferred from the evaporation section 21 A to the condensation section 21 B, the heat can be transferred to the pipe body 21 . Moreover, since the heat resistant layer 23 is arranged around the pipe body 21 , the heat cannot be transferred along the radial direction. That is, the heat is guided to be transferred toward the condensation section 21 B along the axial direction.
  • the ambient temperature of an electronic component 12 near the heat resistant section 21 C of the heat pipe 2 is not increased by the heat pipe 2 , and the electronic component 12 is maintained in the normal working state.
  • the heat pipe 2 is installed in the handheld electronic device 1 and arranged near the backside wall 1 A of the casing. Consequently, the tactile temperature near the backside wall 1 A of the casing is not locally or intensively increased by the heat dissipation element.
  • the heat resistant layer 23 is formed on the outer side of the pipe body 21 of the heat pipe 2 .
  • the heat resistant layer 23 is formed on the inner side of the pipe body 21 .
  • FIGS. 3A-3E schematically illustrate some variant examples of the heat dissipation element of the first embodiment installed in the handheld electronic device.
  • the capillary structure 22 is disposed within the pipe body 21 of the heat pipe 2 . Consequently, the forming sequences, the relative positions and the structures of the heat resistant layer 23 and the capillary structure 22 are diversified and not restricted. Please refer to FIG. 3A .
  • the heat resistant layer 23 is formed on the inner side of the capillary structure 22 . That is, the heat pipe 2 is a three-layered structure that comprises the pipe body 21 , the capillary structure 22 and the heat resistant layer 23 from outside to inside. Please refer to FIG. 3B .
  • the capillary structure 22 is formed on the inner side of the heat resistant layer 23 . That is, the heat pipe 2 is a three-layered structure that comprises the pipe body 21 , the heat resistant layer 23 and the capillary structure 22 from outside to inside. There are many types of capillary structures.
  • the capillary structure includes a sintered capillary structure, a recessed capillary structure, a mesh-type capillary structure or a fiber-type capillary structure.
  • the three-layered structure cannot be obviously defined by the pipe body, the capillary structure and the heat resistant layer.
  • a fiber bundle 22 A is used as the capillary structure of the heat pipe 2
  • the heat resistant layer 23 is located beside the fiber bundle 22 A, which is disposed within the pipe body 21 of the heat pipe 2 .
  • the heat resistant layer 23 and the fiber bundle 22 A are not overlapped with each other. Please refer to FIG. 3D . After the heat resistant layer 23 is formed on the inner side of the pipe body 21 of the heat pipe 2 , the fiber bundle 22 A is placed in the inner side of the heat resistant layer 23 .
  • the heat resistant layer and the capillary structure are two individual components structurally.
  • the heat resistant layer and the capillary structure are combined as a single component, or the heat resistant layer and the capillary structure are formed as a structure with the functions of the two components.
  • a capillary structure with a low thermal conductivity to provide the function of the heat resistant layer or a heat resistant layer with a capillary structure is feasible.
  • FIG. 3E After the heat resistant layer 23 is formed on the inner side of the pipe body 21 of the heat pipe 2 , the heat resistant layer 23 is machined to create a recessed structure 22 B on the surface of the heat resistant layer 23 . Under this circumstance, the heat resistant layer not only has the heat resistant efficacy but also provides the structure and function of the capillary structure.
  • the heat resistant layer is located at the heat resistance section. It is noted that the position of the heat resistant layer is not restricted to the heat resistance section.
  • the heat resistant layer may be located at the evaporation section of the heat pipe or located at the condensation section of the heat pipe as long as the normal heat absorbing efficacy of the evaporation section and the normal heat radiating efficacy of the condensation section are not adversely affected.
  • FIG. 4A is a schematic perspective view illustrating a heat dissipation element (e.g., a heat pipe) according to a second embodiment of the present invention and a handheld electronic device using the heat dissipation element.
  • FIG. 4B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 4A and taken along the line 4 B- 4 B.
  • the heat dissipation element is a heat pipe 2 .
  • the arrangement of the heat pipe 2 in the handheld electronic device 1 and the relationships between the heat pipe 2 and the adjacent electronic components 11 , 12 are similar to those of the first embodiment, and are not redundantly described herein.
  • the heat resistant layer 23 is located at the evaporation section 21 A or the condensation section 21 B of the heat pipe 2 .
  • the heat pipe of the second embodiment is further improved.
  • the heat resistant layer is located at the evaporation section of the heat pipe.
  • the heat resistant layer is formed on a specified site where the pipe body of the heat pipe is not in direct thermal contact with the heat generation element. Consequently, the normal heat absorbing efficacy of the heat pipe can be maintained. Please refer to FIGS. 4A and 4B .
  • the heat resistant layer 23 is formed on an outer side of the pipe body 21 of the heat pipe 2 corresponding to the evaporation section 21 A.
  • the heat pipe 2 has a far side away from the heat generation element 11 , and the heat resistant layer 23 is located at the far side of the heat pipe 2 .
  • the heat pipe 2 is covered by the heat resistant layer 23 along a horizontal direction.
  • the far side of the heat pipe 2 is partially covered by the heat resistant layer 23 , and the both ends of the heat pipe 2 are exposed.
  • the far side of the pipe body 21 of the heat pipe 2 is completely covered by the heat resistant layer 23 . That is, the both ends of the heat pipe 2 are also covered.
  • FIG. 4A the heat resistant layer 23 is formed on an outer side of the pipe body 21 of the heat pipe 2 corresponding to the evaporation section 21 A.
  • the heat pipe 2 has a far side away from the heat generation element 11 , and the heat resistant layer 23 is located at the far side of the heat pipe 2 .
  • the heat pipe 2 is covered by the
  • the pipe body 21 is covered by the heat resistant layer 23 along a vertical direction.
  • the far side of the heat pipe 2 is covered by the heat resistant layer 23 from the top surface of the heat pipe 2 , but the heat resistant layer 23 is not extended to the bottom surface of the heat pipe 2 . Consequently, the thermal contact between the heat pipe 2 and the heat generation element 11 is not affected.
  • the above design has the following advantages. After the heat is absorbed by the heat pipe 2 in the evaporation section 21 A, the possibility of directly transferring the heat to the casing of the handheld electronic device 1 (e.g., the backside wall 1 A of the handheld electronic device 1 ) is reduced or minimized. Consequently, the tactile temperature of the casing of the handheld electronic device 1 corresponding to the evaporation section 21 A of the heat pipe 2 is not largely increased or centralized.
  • the heat resistant layer 23 is formed on the outer side of the pipe body 21 of the heat pipe 2 corresponding to the evaporation section 21 A.
  • the heat resistant layer 23 is formed on an inner side of the pipe body 21 of the heat pipe 2 corresponding to the evaporation section 21 A, and the heat resistant layer 23 is located at the far side of the heat pipe 2 away from the heat generation element 11 .
  • FIGS. 4C and 4D schematically illustrate some variant examples of the heat dissipation element (e.g., a heat pipe) of the second embodiment installed in the handheld electronic device. Please refer to FIG. 4C .
  • the heat resistant layer 23 is formed on the inner side of the capillary structure 22 .
  • the capillary structure 22 is formed on the inner side of the heat resistant layer 23 and the inner side of the pipe body 21 .
  • the heat resistant layer 23 is located at the far side of the heat pipe 2 away from the heat generation element 11 . Consequently, the normal heat absorbing efficacy of the heat pipe 2 can be maintained.
  • the capillary structure 22 used in this embodiment is similar to that of the first embodiment. That is, the fiber bundle or the recessed capillary structure is suitably used as the capillary structure 22 of the second embodiment while the teachings about the heat resistant concept of the first embodiment are retained.
  • the heat resistant layer 23 is located at the evaporation section 21 A of the heat pipe 2 .
  • the heat resistant layer 23 is located at the condensation section 21 B of the heat pipe 2 .
  • the region covered by the heat resistant layer 23 or the way of forming the heat resistant layer 23 on the inner side or the outer side of the heat pipe 2 is similar to that of forming the heat resistant layer 23 on the evaporation section 21 A of the heat pipe 2 . That is, the heat pipe 2 in the condensation section is partially or completely covered by the heat resistant layer 23 along the horizontal direction.
  • the region covered by the heat resistant layer 23 along the vertical position is a specified site where the heat pipe is not in direct thermal contact with the heat sink 3 in the condensation section 21 B.
  • the normal heat radiating efficacy of the heat pipe 2 can be maintained.
  • the evaporation section 21 A, the heat resistant section 21 C and the condensation section 21 B of the heat pipe 2 near the casing of the handheld electronic device 1 are all covered by the heat resistant layer 23 , the possibility of transferring the heat to the casing of the handheld electronic device 1 is largely reduced. Consequently, the tactile temperature of the casing of the handheld electronic device 1 is controlled to be in a more suitable range.
  • FIG. 5A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a third embodiment of the present invention and a handheld electronic device using the heat dissipation element.
  • FIG. 5B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 5A and taken along the line 5 B- 5 B.
  • the heat dissipation element is a loop-type heat pipe 4 .
  • the operating principles of the loop-type heat pipe are similar to those of the heat pipe.
  • the working medium in the loop-type heat pipe is continuously circulated within a closed loop along a single direction.
  • the loop-type heat pipe 4 comprises an evaporation section 4 A, a vapor channel 4 B, a condensation section 4 C and a liquid channel 4 D.
  • the heat resistant layer 41 is formed on an outer side or an inner side of the vapor channel 4 B. As shown in FIGS. 5A and 5B , the heat resistant layer 41 is arranged around the vapor channel 4 B.
  • the heat resistant layer is formed on the inner side of the vapor channel 4 B of the loop-type heat pipe 4 of the third embodiment.
  • the heat resistant layer is formed on the outer side or the inner side of the vapor channel of the loop-type heat pipe.
  • the heat resistant layer is arranged around the evaporation section, the condensation section or even the liquid channel of the loop-type heat pipe as long as the normal heat absorbing efficacy of the evaporation section and the normal heat radiating efficacy of the condensation section are not adversely affected.
  • FIG. 6A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a fourth embodiment of the present invention and a handheld electronic device using the heat dissipation element.
  • FIG. 6B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 6A and taken along the line 6 B- 6 B.
  • the heat is absorbed by a surface of the loop-type heat pipe in the evaporation section, a portion of the heat is radiated to the surroundings from another surface of the loop-type heat pipe and the tactile temperature of the casing of the handheld electronic device is increased or centralized.
  • the loop-type heat pipe of the fourth embodiment is further improved.
  • the heat resistant layer is located at the evaporation section of the loop-type heat pipe.
  • the heat resistant layer is formed on a specified site where the pipe body of the loop-type heat pipe is not in direct thermal contact with the heat generation element. Consequently, the normal heat absorbing efficacy of the loop-type heat pipe can be maintained.
  • the heat resistant layer 41 is formed on an outer side of the loop-type heat pipe 4 corresponding to the evaporation section 4 A.
  • the loop-type heat pipe 4 has a far side away from the heat generation element 11 , and the heat resistant layer 41 is located at the far side of the loop-type heat pipe 4 .
  • the loop-type heat pipe 4 is covered by the heat resistant layer 41 along a horizontal direction.
  • the far side of the loop-type heat pipe 4 is partially or completely covered by the heat resistant layer 41 as long as the normal heat absorbing efficacy of the evaporation section is not adversely affected.
  • the possibility of directly transferring the heat to the casing of the handheld electronic device 1 is reduced or minimized. Consequently, the tactile temperature of the casing of the handheld electronic device 1 corresponding to the evaporation section 4 A of the loop-type heat pipe 4 is not largely increased or centralized.
  • the heat resistant layer 41 is located at the evaporation section 4 A of the loop-type heat pipe 4 .
  • the heat resistant layer 41 is located at the condensation section 4 C of the loop-type heat pipe 4 .
  • the loop-type heat pipe 4 in the condensation section 4 C is partially or completely covered by the heat resistant layer along the horizontal direction.
  • the region covered by the heat resistant layer is a specified site where the condensation section is not in direct thermal contact with other heat dissipation element (e.g., the heat sink 3 ). Consequently, the normal heat radiating efficacy of the loop-type heat pipe 4 can be maintained.
  • the evaporation section 4 A, the vapor channel 4 B, the condensation section 4 C and the liquid channel 4 D of the loop-type heat pipe 4 near the casing of the handheld electronic device 1 are all covered by the heat resistant layer 41 , the possibility of transferring the heat to the casing of the handheld electronic device 1 is largely reduced. Consequently, the tactile temperature of the casing of the handheld electronic device 1 is controlled to be in a more suitable range.
  • FIG. 7A is a schematic perspective view illustrating a heat dissipation element (e.g., a loop-type heat pipe) according to a fifth embodiment of the present invention and a handheld electronic device using the heat dissipation element.
  • FIG. 7B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 7A and taken along the line 7 B- 7 B.
  • the loop-type heat pipe 4 comprises a top plate 42 and a bottom plate 43 .
  • the thermal conductivity of the bottom plate 43 is higher than the thermal conductivity of the top plate 42 , or the top plate 42 is made of a material with a lower thermal conductivity.
  • the bottom plate 43 is in direct contact with the heat generation element 11 .
  • the heat of the heat generation element 11 is absorbed by the bottom plate in the evaporation section 4 A, the heat is not easily transferred to the casing of the handheld electronic device 1 (e.g., the backside wall 1 A of the handheld electronic device 1 ) through the top plate 42 because the thermal conductivity of the top plate 42 is lower. Consequently, the tactile temperature of the casing of the handheld electronic device 1 near the evaporation section is controlled to be in a more suitable range.
  • the top plate 42 with the lower thermal conductivity is also located at the vapor channel 4 B and the condensation section 4 C of the loop-type heat pipe 4 .
  • the tactile temperature of the casing of the handheld electronic device 1 near the vapor channel 4 B and the condensation section 4 C is controlled to be in a more suitable range.
  • the condensation section 4 C of the loop-type heat pipe 4 is still able to dissipate heat normally.
  • the heat is transferred along the horizontal direction or the heat is further dissipated by another heat dissipation mechanism (e.g., the underlying heat sink 3 ).
  • FIG. 7C schematically illustrates a variant example of the heat dissipation element (e.g., a loop-type heat pipe) of the fifth embodiment installed in the handheld electronic device.
  • the evaporation section 4 A of the loop-type heat pipe 4 is a combination of a top plate 4 A 1 and a bottom plate 4 A 2
  • the condensation section 4 C of the loop-type heat pipe 4 is a combination of a top plate 4 C 1 and a bottom plate 4 C 2 .
  • the vapor channel 4 B between the evaporation section 4 A and the condensation section 4 C and the liquid channel 4 D between the condensation section 4 C and the evaporation section 4 A are not divided into two layers. That is, the vapor channel 4 B and the liquid channel 4 D are tubes that are made of the same material. Since the bottom plate 4 A 2 in the evaporation section 4 A is in contact with the heat generation element 11 , the thermal conductivity of the bottom plate 4 A 2 is higher than the thermal conductivity of the top plate 4 A 1 , or the thermal conductivity of the bottom plate 4 A 2 is higher than the thermal conductivity of the vapor channel 4 B. In this embodiment, the bottom plate 4 A 2 is in direct contact with the heat generation element 11 .
  • the heat of the heat generation element 11 is absorbed by the bottom plate 4 A 2 in the evaporation section 4 A, the heat is not easily transferred to the casing of the handheld electronic device 1 (e.g., the backside wall 1 A of the handheld electronic device 1 ) through the top plate 4 A 1 or the vapor channel 4 B because the thermal conductivity of the top plate 4 A 1 is lower or the thermal conductivity of the vapor channel 4 B is lower.
  • the condensation section 4 C of the loop-type heat pipe 4 is a combination of the top plate 4 C 1 and the bottom plate 4 C 2 .
  • the thermal conductivity of the bottom plate 4 C 2 is higher than the thermal conductivity of the top plate 4 C 1
  • the thermal conductivity of the bottom plate 4 CA 2 is higher than the thermal conductivity of the liquid channel 4 D. Since the heat is not easily transferred to the casing of the handheld electronic device 1 (e.g., the backside wall 1 A of the handheld electronic device 1 ) through the top plate 4 C 1 or the liquid channel 4 D, the heat resistant efficacy is enhanced.
  • FIG. 8A is a schematic perspective view illustrating a heat dissipation element (e.g., a vapor chamber) according to a sixth embodiment of the present invention and a handheld electronic device using the heat dissipation element.
  • FIG. 8B is a schematic cross-sectional view illustrating the inner structure of the handheld electronic device of FIG. 8A and taken along the line 8 B- 8 B.
  • FIGS. 8C and 8D schematically illustrate some variant examples of the heat dissipation element (e.g., a vapor chamber) of the sixth embodiment installed in the handheld electronic device.
  • the operating principles of the vapor chamber 5 are similar to those of the heat pipe.
  • the heat pipe is used for transferring heat linearly along a one-dimensional direction.
  • the vapor chamber 5 is used for transferring heat along a two-dimensional direction.
  • the vapor chamber 5 comprises a top thin plate 51 and a bottom thin plate 52 .
  • the bottom thin plate 52 is in contact with the heat generation element 11 .
  • the heat resistant mechanism for the vapor chamber 5 of the present invention has various types. In the example of FIG. 8B , the vapor chamber 5 is a combination of the top thin plate 51 and the bottom thin plate 52 .
  • the thermal conductivity of the bottom thin plate 52 is higher than the thermal conductivity of the top thin plate 51 , or the top thin plate 51 is made of a material with a lower thermal conductivity. Consequently, while the heat is transferred and released, the heat is not centralized to the top thin plate 51 of the vapor chamber 5 or the center of the top thin plate 51 . That is, the heat can be transferred along the horizontal direction more uniformly. Due to the heat resistant mechanism of the present invention, the ambient temperature outside the top thin plate 51 or the tactile temperature of the casing of the handheld electronic device near the top thin plate 51 (e.g., the backside wall 1 A of the handheld electronic device 1 ) is improved or controlled. As mentioned above, the thermal conductivity of the top thin plate and the thermal conductivity of the bottom thin plate are different.
  • the above heat resistant mechanisms of the heat pipe and the loop-type heat pipe may be applied to the vapor chamber.
  • the vapor chamber 5 is a combination of the top thin plate 51 and the bottom thin plate 52 .
  • a heat resistant layer 53 is formed on an outer side of the top thin plate 51 and arranged near the casing of the handheld electronic device 1 .
  • the heat resistant layer 53 is disposed within the vapor chamber 5 and formed on an inner side of the top thin plate 51 . Consequently, while the heat is transferred and released, the heat is not transferred to the casing of the handheld electronic device 1 . Consequently, the tactile temperature is controlled to be in a more suitable range
  • the heat resistant layer is made of a material with low thermal conductivity.
  • the heat resistant layer is made of aluminum, glass fiber, ceramic, rubber, asbestos, rock wool, aerogel, stainless steel, ceramic paint, aerogel paint, insulation resin paint or silicate paint.
  • the way of forming the heat resistant layer is not restricted.
  • the heat resistant layer is produced by a coating process, a sputtering process, a deposition process, a sintering process, an etching process, an anodizing process, an electroplating process, an electroless plating process or an attaching process.
  • the heat resistant layer is firstly formed as a hollow tube, and then the hollow tube is sheathed around the heat pipe.
  • the heat dissipation element and the heat generation component within the handheld electronic component are in thermal contact with each other.
  • the structure of the thermal contact includes a direction contact mechanism or an indirect contact mechanism.
  • a thermal grease, a heat dissipation plate or a heat conduction block is arranged between the heat dissipation element and the heat generation element.
  • the relative positions between the casing of the handheld electronic device and the heat dissipation element and the installation of the heat dissipation element in the handheld electronic device are not restricted.
  • the heat resistant mechanism of the present invention may be applied to an electronic product and modified according to practical requirements.
  • the installation position of the heat dissipation element is at the edge frame near the two lateral walls 1 B
  • the tactile temperature of the two lateral walls of the handheld electronic device is not very high.
  • the technology of the present invention can be employed to reduce the tactile temperature of the top edge frame, the bottom edge frame or the front wall 1 C (e.g., the display screen) of the handheld electronic device.
US15/806,817 2016-11-18 2017-11-08 Heat dissipation element with heat resistant mechanism Abandoned US20180142961A1 (en)

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TWI641796B (zh) 2018-11-21

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