US20180102410A1 - Semiconductor wafer and method of manufacturing semiconductor element - Google Patents
Semiconductor wafer and method of manufacturing semiconductor element Download PDFInfo
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- US20180102410A1 US20180102410A1 US15/681,696 US201715681696A US2018102410A1 US 20180102410 A1 US20180102410 A1 US 20180102410A1 US 201715681696 A US201715681696 A US 201715681696A US 2018102410 A1 US2018102410 A1 US 2018102410A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 150
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 235000012431 wafers Nutrition 0.000 description 87
- 239000000126 substance Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 19
- 230000007423 decrease Effects 0.000 description 9
- 230000003247 decreasing effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Definitions
- An art disclosed herein relates to a semiconductor wafer and a method of manufacturing a semiconductor element.
- Japanese Patent Application Publication No. 2009-279661 discloses a semiconductor wafer including a thick region with a greater thickness than that of its central region along its outer circumferential surface.
- Such a semiconductor wafer is a semi-finished product produced in a process of manufacturing a semiconductor element.
- a semiconductor wafer having a uniform thickness is first prepared, and a partial structure of the semiconductor element is formed in its central region of the semiconductor wafer.
- the central region of the semiconductor wafer is ground from one main surface side such that the semiconductor element has a desired thickness.
- a region along the outer circumferential surface of the semiconductor wafer is left without being ground, and the semiconductor wafer having the above-mentioned thick region is thus manufactured. Thereafter, a remaining partial structure of the semiconductor element is formed in the central region of the semiconductor wafer, and the semiconductor wafer is diced such that individual semiconductor elements are cut out from the semiconductor wafer.
- the semiconductor wafer if the thickness of the semiconductor wafer is abruptly changed between the central region and the thick region, a high stress is likely to be generated at a boundary between the central region and the thick region, and the semiconductor wafer may be damaged.
- one or more slope surfaces are provided between the central region and the thick region, and the thickness of the semiconductor wafer is made to be gradually changed between the central region and the thick region.
- a slope surface between a central region and a thick region can suppress chipping of a semiconductor wafer, and an effect of suppressing the chipping increases as a slope angle of the slope surface becomes small. Further, it was also proved that the slope surface between the central region and the thick region could suppress residue of chemical solution used in a process of manufacturing a semiconductor element, and a higher effect could be obtained for suppressing the residue of chemical solution as the slope angle of the slope surface became smaller.
- a width dimension of the slope surface (dimension of the slope surface in a radial direction of the semiconductor wafer) becomes wider, and an area in the central region or an area in the thick region decreases.
- a number of semiconductor elements that can be manufactured from a single semiconductor wafer decreases.
- the strength of the semiconductor wafer decreases.
- the slope angle is constant on each of the slope surfaces, the above-mentioned trade-off problem cannot be solved.
- the chipping of the semiconductor wafer mainly occurs at an outer circumferential portion of the slope surface. Therefore, so long as a slope angle of the outer circumferential portion of the slope surface is made small, even if a slope angle of another portion of the slope surface is made relatively large, the chipping of the semiconductor wafer can be significantly suppressed.
- the residue of chemical solution may mainly occur at an inner circumferential portion of the slope surface. Accordingly, so long as the slope angle of the inner circumferential portion of the slope surface is made small, even if the slope angle of the other portion of the slope surface is made relatively large, the residue of the chemical solution can be significantly suppressed.
- the slope angle of the slope surface is made inconstant such that the slope angle of at least one of the outer circumferential portion and the inner circumferential portion is made smaller than the slope angle of an intermediate portion located therebetween, and thereby the width dimension of the slope surface can be suppressed from increasing and at least one of the above-mentioned effects due to the slope surface can be improved.
- This semiconductor wafer may comprise a central region in a planer view and a thick region extending along an outer circumferential surface of the semiconductor wafer in the planer view, the thick region being greater in thickness than the central region.
- One of main surfaces of the semiconductor wafer may comprise a slope surface located between the central region and the thick region.
- the slope surface may comprises an inner circumferential edge located on a side of central region; and an outer circumferential edge located on a side of the thick region, and the slope surface slopes such that the thickness of the semiconductor wafer increases from the inner circumferential edge to the outer circumferential edge.
- the slope surface may comprise an inner circumferential portion including the inner circumferential edge, an outer circumferential portion including the outer circumferential edge, and an intermediate portion located between the inner circumferential portion and the outer circumferential portion. At least one of a slope angle of the inner circumferential portion and a slope angle of the outer circumferential portion may be smaller than a slope angle of the intermediate portion.
- the semiconductor wafer disclosed herein is a semi-finished product produced in a process of manufacturing a semiconductor element.
- a method for manufacturing a semiconductor element may comprise: forming a partial structure of the semiconductor elements within a central portion of a semiconductor wafer in a planer view; forming a thick region that extends along an outer circumferential surface of the semiconductor wafer in the planer view by grinding the central portion from one of main surfaces of the semiconductor wafer, the thick region being greater in thickness than the central region; and forming another partial structure of the semiconductor element within the central portion of the semiconductor wafer from the one of the main surfaces of the semiconductor wafer.
- a slope surface having the above-described structure may further be formed between the central region and the thick region on the one of the main surfaces of the semiconductor wafer.
- FIG. 1 is a view showing one step of a manufacturing method of a semiconductor element, showing a prepared semiconductor wafer 10 .
- FIG. 2 is a view showing one step of the manufacturing method of the semiconductor element, and showing how a partial structure of the semiconductor element is formed from a first main surface 10 a side of the semiconductor wafer 10 .
- FIG. 3 is a view showing one step of the manufacturing method of the semiconductor element, showing how the semiconductor wafer 10 is ground from a second main surface 10 b side.
- FIG. 4 is a view showing one step of the manufacturing method of the semiconductor element, showing how a partial structure of the semiconductor element is formed from the second main surface 10 b side of the semiconductor wafer 10 .
- FIG. 5 is a view showing one step of the manufacturing method of the semiconductor element, showing how chemical solution 6 is used.
- FIG. 6 is a view for explaining a structure of a slope surface 20 .
- FIG. 7 is experimental data showing a relationship between a slope angle ⁇ of the slope surface 20 and a number of chippings.
- FIG. 8 is experimental data showing a relationship between the slope angle ⁇ of the slope surface 20 and a residual amount of the chemical solution 6 .
- FIG. 9 is a view showing an example of the slope surface 20 in which a slope angle ⁇ 1 of an outer circumferential portion 20 a is made smaller than a slope angle ⁇ 3 of an intermediate portion 20 c.
- FIG. 10 is a view showing an example of the slope surface 20 in which a slope angle 92 of an inner circumferential portion 20 b is made smaller than the slope angle ⁇ 3 of the intermediate portion 20 c.
- FIG. 11 is a view showing an example of the slope surface 20 in which both of the slope angles ⁇ 1 and 02 of the outer circumferential portion 20 a and the inner circumferential portion 20 b are made smaller than the slope angle ⁇ 3 of the intermediate portion 20 c.
- FIG. 12 is experimental data showing an effect for suppressing the chippings for the example of the slope angle 20 shown in FIG. 9 .
- a slope angle of an outer circumferential portion of a slope surface may be smaller than a slope angle of an intermediate portion of the slope surface. According to this configuration, an effect of suppressing chippings by the slope surface can be enhanced while suppressing an increase in a width dimension of the slope surface.
- the slope angle of the inner circumferential portion of the slope surface may be equal to the slope angle of the intermediate portion of the slope surface. According to this configuration, for example, since the inner circumferential portion and the intermediate portion can be formed of a same grindstone, manufacturing processes of the semiconductor element can be prevented from being complicated.
- the slope angle of the inner circumferential portion of the slope surface may be smaller than the slope angle of the intermediate portion of the slope surface. According to this configuration, an effect of suppressing residue of chemical solution by the slope surface can be enhanced while suppressing the increase in the width dimension of the slope surface.
- the slope angle of the outer circumferential portion of the slope surface may be equal to the slope angle of the intermediate portion of the slope surface. According to this configuration, for example, since the outer circumferential portion and the intermediate portion can be formed by a same grindstone, manufacturing processes of the semiconductor element can be prevented from being complicated.
- the slope angle of both the outer circumferential portion and the inner circumferential portion of the slope surface may be smaller than the slope angle of the intermediate portion of the slope surface. According to this configuration, both of the effect of suppressing chippings by the slope surface and the effect of suppressing the residue of chemical solution by the slope surface can be enhanced while suppressing the increase in the width dimension of the slope surface.
- the semiconductor wafer 10 is a semi-finished product produced in a process of manufacturing a semiconductor element. Thus, a method of manufacturing the semiconductor element will be described first, and the semiconductor wafer 10 will be described in detail thereafter.
- the semiconductor element to be manufactured is not particularly limited, however, it may include at least one of, for example, an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), or a diode.
- the semiconductor wafer 10 is prepared.
- the semiconductor wafer 10 is placed on a stage 2 .
- the semiconductor wafer 10 is constituted of a semiconductor-material such as silicon (Si) or silicon carbide (SiC), for example.
- the semiconductor wafer 10 has a disk shape, and has a first main surface 10 a , a second main surface 10 b , and an outer circumferential surface 10 e .
- the first main surface 10 a and the second main surface 10 b are planes parallel to each other, and each has a circular shape.
- the outer circumferential surface 10 e is a cylindrically curved surface and extends between the first main surface 10 a and the second main surface 10 b .
- the semiconductor wafer 10 has a constant thickness throughout its entirety.
- the semiconductor wafer 10 usually contains n-type or p-type conductive impurities.
- a partial structure of the semiconductor element is formed in a central region 10 c of the semiconductor wafer 10 .
- this step for example, ion implantation of n-type or p-type conductive impurities and formation of a first electrode layer 12 to serve as a main electrode of the semiconductor element are performed mainly from a first main surface 10 a side of the semiconductor wafer 10 .
- specific processes performed in this step are not particularly limited, and necessary processes may be performed according to the structure of the semiconductor element.
- Arrows P 1 in FIG. 2 schematically show various kinds of processes that can be performed in this step, and do not indicate any specific process.
- the semiconductor wafer 10 is turned over, and the semiconductor wafer 10 is ground from a second main surface 10 b side, for example, by a grinding head 4 having a plurality of grinding stones 4 a . Due to this, a thickness of the central region 10 c of the semiconductor wafer 10 is adjusted to a thickness required for the semiconductor element.
- a region along the outer circumferential surface 10 e of the semiconductor wafer 10 is left without being ground.
- a thick region 10 t having a thickness greater than the thickness of the central region 10 c is formed along the outer circumferential surface 10 e of the semiconductor wafer 10 .
- a slope surface 20 is further formed between the central region 10 c and the thick region 10 t on the second main surface 10 b of the semiconductor wafer 10 . Details of the slope surface 20 will be described later.
- the thick region 10 t protrudes in a frame-like manner, and a height difference is generated between the central region 10 c and the thick region 10 t .
- the slope surface 20 extends between the central region 10 c and the thick region 10 t in a ring shape along a circumferential direction of the semiconductor wafer 10 .
- FIG. 4 another partial structure of the semiconductor element is further formed in the central region 10 c of the semiconductor wafer 10 .
- this step for example, ion implantation of n-type or p-type conductive impurities and formation of a second electrode layer 14 to serve as another main electrode of the semiconductor element are mainly performed from the second main surface 10 b side of the semiconductor wafer 10 .
- the specific processes performed in this step are not particularly limited, and necessary processes may be performed according to the structure of the semiconductor element.
- Arrows P 2 in FIG. 4 schematically show various kinds of processes that can be performed in this step, and do not indicate any specific process.
- FIG. 4 schematically show various kinds of processes that can be performed in this step, and do not indicate any specific process.
- various kinds of chemical solution 6 are used, for example, in formation of a mask through a photoresist in manufacturing of the semiconductor element.
- the chemical solution 6 is removed from the semiconductor wafer 10 by using a centrifugal force generated by a rotation of the stage 2 .
- the semiconductor wafer 10 is diced such that individual semiconductor elements are cut out therefrom.
- the thick region 10 t being greater in thickness than the central region 10 c is formed along the outer circumferential surface 10 e on the second main surface 10 b of the semiconductor wafer 10 .
- the central region 10 c of the semiconductor wafer 10 can be processed thin while securing the strength of the semiconductor wafer 10 .
- the semiconductor wafer 10 is ground while forming the thick region 10 t on the semiconductor wafer 10 (see FIG. 3 ), there is a problem that chippings are likely to occur in the semiconductor wafer 10 .
- the slope surface 20 is formed between the central region 10 c and the thick region 10 t on the second main surface 10 b of the semiconductor wafer 10 .
- the slope surface 20 has an inner circumferential edge 20 f positioned on a central region 10 c side and an outer circumferential edge 20 e positioned on a thick region 10 t side.
- the slope surface 20 slopes such that the thickness of the semiconductor wafer 10 increases from the inner circumferential edge 20 f toward the outer circumferential edge 20 e .
- a slope angle ⁇ is constant from the inner circumferential edge 20 f to the outer circumferential edge 20 e .
- a minute step 16 shown in FIG. 6 is a step generated when a surface of the central region 10 c is finished smooth and flat.
- FIG. 7 shows an example of experimental results by the present inventors, and shows a relationship between the slope angle ⁇ of the slope surface 20 and a number of chippings occurred.
- the slope angle ⁇ was changed between 30 degrees, 45 degrees, 60 degrees, 75 degrees, and 90 degrees, as a result of which it was confirmed that the number of chippings decreased as the slope angle ⁇ became small.
- FIG. 8 shows an example of experimental results by the present inventors and shows a relationship between the slope angle ⁇ of the slope surface 20 and the residual amount of the chemical liquid 6 .
- the slope angle ⁇ between 45 degrees, 60 degrees, 75 degrees, and 90 degrees, it was confirmed that the residual amount of the chemical solution 6 decreased as the slope angle ⁇ became small.
- the slope angle ⁇ was set to be equal to or smaller than 75 degrees, the residual amount of the chemical solution 6 became zero. It should be noted that the slope angle ⁇ at which the residual amount of the chemical solution 6 becomes zero can change according to a type, properties, and a supplying amount of the chemical solution 6 , a rotation speed and time of the stage 2 , and/or a material and/or size of the semiconductor wafer 10 .
- the slope angle ⁇ of the slope surface 20 is small, and thereby the above-described effects of the slope surface 20 can be enhanced.
- a width dimension W of the slope surface 20 (dimension of the slope surface 20 in a radial direction of the semiconductor wafer 10 ) becomes wide, and an area of the central region 10 c or the thick region 10 t decreases.
- the area of the central region 10 c decreases, a number of semiconductor elements that can be manufactured from one semiconductor wafer 10 decreases.
- the strength of the semiconductor wafer 10 weakens.
- the present inventors further advanced the research on the above-mentioned trade-off problem, and obtained the following findings.
- the chipping of the semiconductor wafer 10 mainly occurs at the outer circumferential edge 20 e of the slope surface 20 and in a vicinity thereof (that is, an outer circumferential portion 20 a including the outer circumferential edge 20 e ).
- the chipping of the semiconductor wafer 10 can be suppressed significantly.
- the residue of the chemical solution 6 mainly occurs at the inner circumferential edge 20 f of the slope surface 20 and in a vicinity thereof (that is, the inner circumferential portion 20 b including the inner circumferential edge 20 f ).
- the residue of the chemical solution 6 can be suppressed significantly.
- the slope angle ⁇ of the slope surface 20 is not made constant and at least one of the slope angles ⁇ 1 , ⁇ 2 of the outer circumferential portion 20 a and the inner circumferential portion 20 b is made smaller than a slope angle ⁇ 3 of the intermediate portion 20 c , at least one of the above-mentioned effects of the slope surface 20 can be enhanced while suppressing the increase in the width dimension W of the slope surface 20 .
- the slope angle ⁇ 1 of the outer circumferential portion 20 a is smaller than the slope angle ⁇ 3 of the intermediate portion 20 c . According such a configuration, the effect of the slope surface 20 suppressing the chippings can be enhanced while suppressing the increase in the width dimension W of the slope surface 20 .
- the slope angle ⁇ 2 of the inner circumferential portion 20 b can be made equal to the slope angle ⁇ 3 of the intermediate portion 20 c . According to such a configuration, for example, since the inner circumferential portion 20 b and the intermediate portion 20 c can be formed by the grinding stones 4 a of the same shape, it is possible to avoid complicating the manufacturing process of the semiconductor element.
- the slope angle ⁇ 2 of the inner circumferential portion 20 b may be larger than the slope angle ⁇ 3 of the intermediate portion 20 c.
- the slope angle ⁇ 2 of the inner circumferential portion 20 b is smaller than the slope angle ⁇ 3 of the intermediate portion 20 c .
- the effect of suppressing the residue of the chemical solution 6 by the slope surface 20 can be enhanced while suppressing the increase in the width dimension W of the slope surface 20 .
- the slope angle ⁇ 1 of the outer circumferential portion 20 a can be made equal to the slope angle ⁇ 3 of the intermediate portion 20 c .
- the slope angle ⁇ 1 of the outer circumferential portion 20 a may be larger than the slope angle ⁇ 3 of the intermediate portion 20 c.
- the slope angles ⁇ 1 , ⁇ 2 of both the outer circumferential portion 20 a and the inner circumferential portion 20 b of the slope surface 20 are smaller than the slope angle ⁇ 3 of the intermediate portion 20 c of the slope surface 20 . According to such a configuration, while suppressing the increase in the width dimension W of the slope surface 20 , both of the effect of suppressing the chippings by the slope surface 20 and the effect of suppressing the residue of the chemical solution 6 by the slope surface 20 can be enhanced.
- FIG. 12 is a graph indicating experimental data by which the effect of suppressing the chipping for the slope surface 20 according to the embodiment shown in FIG. 9 was confirmed.
- the slope angle ⁇ 1 of the outer circumferential portion 20 a of the slope surface 20 was set to 34 degrees
- the slope angles ⁇ 2 and ⁇ 3 of the inner circumferential portion 20 b and the intermediate portion 20 c were set to 90 degrees.
- slope angles ⁇ 2 and ⁇ 3 of the inner circumferential portion 20 b and the intermediate portion 20 c are usually set to degrees smaller than 90 degrees
- the slope angles ⁇ 2 and ⁇ 3 of the inner circumferential portion 20 b and the intermediate portion 20 c were set to 90 degrees which are most disadvantageous, in order to clarify an effect obtained in a case where only the slope angle ⁇ 1 of the outer circumferential portion 20 a is made small.
- Samples S 1 to S 12 of twelve semiconductor wafers 10 were manufactured under the above-described conditions, and a number of chippings having a dimension of 50 mictometers or more was counted for each of the samples S 1 to S 12 . As shown in FIG.
- each of the slope angles ⁇ 1 , ⁇ 2 , and ⁇ 3 is not limited to a specific angle. Each of the slope angles ⁇ 1 , ⁇ 2 , and ⁇ 3 may be set to any value within a range of smaller than 90 degrees. Further, although in the examples of FIGS. 9, 10 and 11 only one slope surface is provided between the central region 10 c and the thick region 10 t , two or more slope surfaces 20 may be provided between the central region 10 c and the thick region 10 t with a space therebetween. In this case, the structure exemplified in any of FIGS. 9, 10 and 11 may be employed for at least one of the slope surfaces 20 .
- the outer circumferential surface portion 20 a , the intermediate portion 20 c , and the inner circumferential surface portion 20 b are arranged continuously, another portion having another slope angle may be provided between the outer circumferential portion 20 a and the intermediate portion 20 c and/or between the intermediate portion 20 c and the inner circumferential portion 20 b.
Abstract
Description
- An art disclosed herein relates to a semiconductor wafer and a method of manufacturing a semiconductor element.
- Japanese Patent Application Publication No. 2009-279661 discloses a semiconductor wafer including a thick region with a greater thickness than that of its central region along its outer circumferential surface. Such a semiconductor wafer is a semi-finished product produced in a process of manufacturing a semiconductor element. In manufacturing of the semiconductor element, a semiconductor wafer having a uniform thickness is first prepared, and a partial structure of the semiconductor element is formed in its central region of the semiconductor wafer. Next, the central region of the semiconductor wafer is ground from one main surface side such that the semiconductor element has a desired thickness. At this occasion, in order to secure a strength of the semiconductor wafer, a region along the outer circumferential surface of the semiconductor wafer is left without being ground, and the semiconductor wafer having the above-mentioned thick region is thus manufactured. Thereafter, a remaining partial structure of the semiconductor element is formed in the central region of the semiconductor wafer, and the semiconductor wafer is diced such that individual semiconductor elements are cut out from the semiconductor wafer.
- In the above-described semiconductor wafer, if the thickness of the semiconductor wafer is abruptly changed between the central region and the thick region, a high stress is likely to be generated at a boundary between the central region and the thick region, and the semiconductor wafer may be damaged. Regarding this point, in the semiconductor wafer described in Japanese Patent Application Publication No. 2009-279661, one or more slope surfaces are provided between the central region and the thick region, and the thickness of the semiconductor wafer is made to be gradually changed between the central region and the thick region.
- According to researches by the inventors of the present teachings, it was proved that a slope surface between a central region and a thick region can suppress chipping of a semiconductor wafer, and an effect of suppressing the chipping increases as a slope angle of the slope surface becomes small. Further, it was also proved that the slope surface between the central region and the thick region could suppress residue of chemical solution used in a process of manufacturing a semiconductor element, and a higher effect could be obtained for suppressing the residue of chemical solution as the slope angle of the slope surface became smaller. However, as the slope angle of the slope surface is made smaller in order to enhance the above-mentioned effects, a width dimension of the slope surface (dimension of the slope surface in a radial direction of the semiconductor wafer) becomes wider, and an area in the central region or an area in the thick region decreases. As the area of the central region decreases, a number of semiconductor elements that can be manufactured from a single semiconductor wafer decreases. As the area of the thick-region decreases, the strength of the semiconductor wafer decreases. In the semiconductor wafer described in Japanese Patent Application Publication No. 2009-279661, since the slope angle is constant on each of the slope surfaces, the above-mentioned trade-off problem cannot be solved.
- It is an object of the present etchings to provide a technique that can solve such a trade-off problem at least partially.
- According to further research by the present inventors, the chipping of the semiconductor wafer mainly occurs at an outer circumferential portion of the slope surface. Therefore, so long as a slope angle of the outer circumferential portion of the slope surface is made small, even if a slope angle of another portion of the slope surface is made relatively large, the chipping of the semiconductor wafer can be significantly suppressed. On the other hand, the residue of chemical solution may mainly occur at an inner circumferential portion of the slope surface. Accordingly, so long as the slope angle of the inner circumferential portion of the slope surface is made small, even if the slope angle of the other portion of the slope surface is made relatively large, the residue of the chemical solution can be significantly suppressed. In this way, the slope angle of the slope surface is made inconstant such that the slope angle of at least one of the outer circumferential portion and the inner circumferential portion is made smaller than the slope angle of an intermediate portion located therebetween, and thereby the width dimension of the slope surface can be suppressed from increasing and at least one of the above-mentioned effects due to the slope surface can be improved.
- The present teachings disclose a semiconductor wafer based on the above-described findings. This semiconductor wafer may comprise a central region in a planer view and a thick region extending along an outer circumferential surface of the semiconductor wafer in the planer view, the thick region being greater in thickness than the central region. One of main surfaces of the semiconductor wafer may comprise a slope surface located between the central region and the thick region. The slope surface may comprises an inner circumferential edge located on a side of central region; and an outer circumferential edge located on a side of the thick region, and the slope surface slopes such that the thickness of the semiconductor wafer increases from the inner circumferential edge to the outer circumferential edge. The slope surface may comprise an inner circumferential portion including the inner circumferential edge, an outer circumferential portion including the outer circumferential edge, and an intermediate portion located between the inner circumferential portion and the outer circumferential portion. At least one of a slope angle of the inner circumferential portion and a slope angle of the outer circumferential portion may be smaller than a slope angle of the intermediate portion.
- The semiconductor wafer disclosed herein is a semi-finished product produced in a process of manufacturing a semiconductor element. A method for manufacturing a semiconductor element may comprise: forming a partial structure of the semiconductor elements within a central portion of a semiconductor wafer in a planer view; forming a thick region that extends along an outer circumferential surface of the semiconductor wafer in the planer view by grinding the central portion from one of main surfaces of the semiconductor wafer, the thick region being greater in thickness than the central region; and forming another partial structure of the semiconductor element within the central portion of the semiconductor wafer from the one of the main surfaces of the semiconductor wafer. Further, in the forming of the thick region a slope surface having the above-described structure may further be formed between the central region and the thick region on the one of the main surfaces of the semiconductor wafer.
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FIG. 1 is a view showing one step of a manufacturing method of a semiconductor element, showing a preparedsemiconductor wafer 10. -
FIG. 2 is a view showing one step of the manufacturing method of the semiconductor element, and showing how a partial structure of the semiconductor element is formed from a firstmain surface 10 a side of thesemiconductor wafer 10. -
FIG. 3 is a view showing one step of the manufacturing method of the semiconductor element, showing how thesemiconductor wafer 10 is ground from a secondmain surface 10 b side. -
FIG. 4 is a view showing one step of the manufacturing method of the semiconductor element, showing how a partial structure of the semiconductor element is formed from the secondmain surface 10 b side of thesemiconductor wafer 10. -
FIG. 5 is a view showing one step of the manufacturing method of the semiconductor element, showing howchemical solution 6 is used. -
FIG. 6 is a view for explaining a structure of aslope surface 20. -
FIG. 7 is experimental data showing a relationship between a slope angle θ of theslope surface 20 and a number of chippings. -
FIG. 8 is experimental data showing a relationship between the slope angle θ of theslope surface 20 and a residual amount of thechemical solution 6. -
FIG. 9 is a view showing an example of theslope surface 20 in which a slope angle θ1 of an outercircumferential portion 20 a is made smaller than a slope angle θ3 of anintermediate portion 20 c. -
FIG. 10 is a view showing an example of theslope surface 20 in which a slope angle 92 of an innercircumferential portion 20 b is made smaller than the slope angle θ3 of theintermediate portion 20 c. -
FIG. 11 is a view showing an example of theslope surface 20 in which both of the slope angles θ1 and 02 of the outercircumferential portion 20 a and the innercircumferential portion 20 b are made smaller than the slope angle θ3 of theintermediate portion 20 c. -
FIG. 12 is experimental data showing an effect for suppressing the chippings for the example of theslope angle 20 shown inFIG. 9 . - In one embodiment of a semiconductor wafer, a slope angle of an outer circumferential portion of a slope surface may be smaller than a slope angle of an intermediate portion of the slope surface. According to this configuration, an effect of suppressing chippings by the slope surface can be enhanced while suppressing an increase in a width dimension of the slope surface.
- In the above embodiment, the slope angle of the inner circumferential portion of the slope surface may be equal to the slope angle of the intermediate portion of the slope surface. According to this configuration, for example, since the inner circumferential portion and the intermediate portion can be formed of a same grindstone, manufacturing processes of the semiconductor element can be prevented from being complicated.
- In another embodiment of the semiconductor wafer, the slope angle of the inner circumferential portion of the slope surface may be smaller than the slope angle of the intermediate portion of the slope surface. According to this configuration, an effect of suppressing residue of chemical solution by the slope surface can be enhanced while suppressing the increase in the width dimension of the slope surface.
- In the above embodiment, the slope angle of the outer circumferential portion of the slope surface may be equal to the slope angle of the intermediate portion of the slope surface. According to this configuration, for example, since the outer circumferential portion and the intermediate portion can be formed by a same grindstone, manufacturing processes of the semiconductor element can be prevented from being complicated.
- In another embodiment of the semiconductor wafer, the slope angle of both the outer circumferential portion and the inner circumferential portion of the slope surface may be smaller than the slope angle of the intermediate portion of the slope surface. According to this configuration, both of the effect of suppressing chippings by the slope surface and the effect of suppressing the residue of chemical solution by the slope surface can be enhanced while suppressing the increase in the width dimension of the slope surface.
- Representative, non-limiting examples of the present invention will now be described in further detail with reference to the attached drawings. This detailed description is merely intended to teach a person of skill in the art further details for practicing preferred aspects of the present teachings and is not intended to limit the scope of the invention. Furthermore, each of the additional features and teachings disclosed below may be utilized separately or in conjunction with other features and teachings to provide improved semiconductor wafer, as well as methods for manufacturing semiconductor elements.
- Moreover, combinations of features and steps disclosed in the following detailed description may not be necessary to practice the invention in the broadest sense, and are instead taught merely to particularly describe representative examples of the invention. Furthermore, various features of the above-described and below-described representative examples, as well as the various independent and dependent claims, may be combined in ways that are not specifically and explicitly enumerated in order to provide additional useful embodiments of the present teachings.
- All features disclosed in the description and/or the claims are intended to be disclosed separately and independently from each other for the purpose of original written disclosure, as well as for the purpose of restricting the claimed subject matter, independent of the compositions of the features in the embodiments and/or the claims. In addition, all value ranges or indications of groups of entities are intended to disclose every possible intermediate value or intermediate entity for the purpose of original written disclosure, as well as for the purpose of restricting the claimed subject matter.
- A semiconductor wafer 10 of an embodiment will be described with reference to the drawings. The
semiconductor wafer 10 is a semi-finished product produced in a process of manufacturing a semiconductor element. Thus, a method of manufacturing the semiconductor element will be described first, and thesemiconductor wafer 10 will be described in detail thereafter. The semiconductor element to be manufactured is not particularly limited, however, it may include at least one of, for example, an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), or a diode. - First, as shown in
FIG. 1 , thesemiconductor wafer 10 is prepared. Thesemiconductor wafer 10 is placed on astage 2. Thesemiconductor wafer 10 is constituted of a semiconductor-material such as silicon (Si) or silicon carbide (SiC), for example. Thesemiconductor wafer 10 has a disk shape, and has a firstmain surface 10 a, a secondmain surface 10 b, and an outercircumferential surface 10 e. The firstmain surface 10 a and the secondmain surface 10 b are planes parallel to each other, and each has a circular shape. The outercircumferential surface 10 e is a cylindrically curved surface and extends between the firstmain surface 10 a and the secondmain surface 10 b. At this stage, thesemiconductor wafer 10 has a constant thickness throughout its entirety. Thesemiconductor wafer 10 usually contains n-type or p-type conductive impurities. - Next, as shown in
FIG. 2 , a partial structure of the semiconductor element is formed in acentral region 10 c of thesemiconductor wafer 10. In this step, for example, ion implantation of n-type or p-type conductive impurities and formation of afirst electrode layer 12 to serve as a main electrode of the semiconductor element are performed mainly from a firstmain surface 10 a side of thesemiconductor wafer 10. It should be noted that specific processes performed in this step are not particularly limited, and necessary processes may be performed according to the structure of the semiconductor element. Arrows P1 inFIG. 2 schematically show various kinds of processes that can be performed in this step, and do not indicate any specific process. - Next, as shown in
FIG. 3 , thesemiconductor wafer 10 is turned over, and thesemiconductor wafer 10 is ground from a secondmain surface 10 b side, for example, by a grindinghead 4 having a plurality of grindingstones 4 a. Due to this, a thickness of thecentral region 10 c of thesemiconductor wafer 10 is adjusted to a thickness required for the semiconductor element. Here, in order to secure a strength of thesemiconductor wafer 10, a region along the outercircumferential surface 10 e of thesemiconductor wafer 10 is left without being ground. As a result, athick region 10 t having a thickness greater than the thickness of thecentral region 10 c is formed along the outercircumferential surface 10 e of thesemiconductor wafer 10. At this occasion, aslope surface 20 is further formed between thecentral region 10 c and thethick region 10 t on the secondmain surface 10 b of thesemiconductor wafer 10. Details of theslope surface 20 will be described later. At this stage, in the secondmain surface 10 b of thesemiconductor wafer 10, thethick region 10 t protrudes in a frame-like manner, and a height difference is generated between thecentral region 10 c and thethick region 10 t. Theslope surface 20 extends between thecentral region 10 c and thethick region 10 t in a ring shape along a circumferential direction of thesemiconductor wafer 10. - Next, as shown in
FIG. 4 , another partial structure of the semiconductor element is further formed in thecentral region 10 c of thesemiconductor wafer 10. In this step, for example, ion implantation of n-type or p-type conductive impurities and formation of asecond electrode layer 14 to serve as another main electrode of the semiconductor element are mainly performed from the secondmain surface 10 b side of thesemiconductor wafer 10. It should be noted that the specific processes performed in this step are not particularly limited, and necessary processes may be performed according to the structure of the semiconductor element. Arrows P2 inFIG. 4 schematically show various kinds of processes that can be performed in this step, and do not indicate any specific process. Here, as shown inFIG. 5 , various kinds ofchemical solution 6 are used, for example, in formation of a mask through a photoresist in manufacturing of the semiconductor element. Thechemical solution 6 is removed from thesemiconductor wafer 10 by using a centrifugal force generated by a rotation of thestage 2. - Finally, the
semiconductor wafer 10 is diced such that individual semiconductor elements are cut out therefrom. - As described above, in the process of manufacturing the semiconductor element, the
thick region 10 t being greater in thickness than thecentral region 10 c is formed along the outercircumferential surface 10 e on the secondmain surface 10 b of thesemiconductor wafer 10. By forming thethick region 10 t, thecentral region 10 c of thesemiconductor wafer 10 can be processed thin while securing the strength of thesemiconductor wafer 10. However, when thesemiconductor wafer 10 is ground while forming thethick region 10 t on the semiconductor wafer 10 (seeFIG. 3 ), there is a problem that chippings are likely to occur in thesemiconductor wafer 10. Further, there is also a problem that, if thethick region 10 t is formed on thesemiconductor wafer 10, when thechemical solution 6 is used in the process of manufacturing the semiconductor element (seeFIG. 5 ), thechemical solution 6 is likely to remain on the secondmain surface 10 b of thesemiconductor wafer 10. - With respect to the above problems, the
slope surface 20 is formed between thecentral region 10 c and thethick region 10 t on the secondmain surface 10 b of thesemiconductor wafer 10. As shown inFIG. 6 , theslope surface 20 has an innercircumferential edge 20 f positioned on acentral region 10 c side and an outercircumferential edge 20 e positioned on athick region 10 t side. Theslope surface 20 slopes such that the thickness of thesemiconductor wafer 10 increases from the innercircumferential edge 20 f toward the outercircumferential edge 20 e. In theslope surface 20 shown inFIG. 6 , a slope angle θ is constant from the innercircumferential edge 20 f to the outercircumferential edge 20 e. It should be noted that aminute step 16 shown inFIG. 6 is a step generated when a surface of thecentral region 10 c is finished smooth and flat. - According to studies of the present inventors, it was proved that by providing the
slope surface 20 between thecentral region 10 c and thethick region 10 t, the chippings of thesemiconductor wafer 10 were suppressed and as the slope angle θ of theslope surface 20 became small, the effect of suppressing the chippings was enhanced.FIG. 7 shows an example of experimental results by the present inventors, and shows a relationship between the slope angle θ of theslope surface 20 and a number of chippings occurred. In this experiment, the slope angle θ was changed between 30 degrees, 45 degrees, 60 degrees, 75 degrees, and 90 degrees, as a result of which it was confirmed that the number of chippings decreased as the slope angle θ became small. - Further, according to the studies conducted by the present inventors, it was also proved that by providing the
slope surface 20 between thecentral region 10 c and thethick region 10 t, the residue of thechemical solution 6 was suppressed, and the effect of suppressing the residue of thechemical solution 6 was enhanced as the slope angle θ of theslope surface 20 became small.FIG. 8 shows an example of experimental results by the present inventors and shows a relationship between the slope angle θ of theslope surface 20 and the residual amount of thechemical liquid 6. In this experiment, as a result of changing the slope angle θ between 45 degrees, 60 degrees, 75 degrees, and 90 degrees, it was confirmed that the residual amount of thechemical solution 6 decreased as the slope angle θ became small. In this experiment, it was confirmed that when the slope angle θ was set to be equal to or smaller than 75 degrees, the residual amount of thechemical solution 6 became zero. It should be noted that the slope angle θ at which the residual amount of thechemical solution 6 becomes zero can change according to a type, properties, and a supplying amount of thechemical solution 6, a rotation speed and time of thestage 2, and/or a material and/or size of thesemiconductor wafer 10. - According to the above-described experimental results, it is preferable that the slope angle θ of the
slope surface 20 is small, and thereby the above-described effects of theslope surface 20 can be enhanced. However, if the slope angle θ of theslope surface 20 is reduced to become smaller, a width dimension W of the slope surface 20 (dimension of theslope surface 20 in a radial direction of the semiconductor wafer 10) becomes wide, and an area of thecentral region 10 c or thethick region 10 t decreases. As the area of thecentral region 10 c decreases, a number of semiconductor elements that can be manufactured from onesemiconductor wafer 10 decreases. As the area of thethick region 10 t decreases, the strength of thesemiconductor wafer 10 weakens. - The present inventors further advanced the research on the above-mentioned trade-off problem, and obtained the following findings. The chipping of the
semiconductor wafer 10 mainly occurs at the outercircumferential edge 20 e of theslope surface 20 and in a vicinity thereof (that is, an outercircumferential portion 20 a including the outercircumferential edge 20 e). Thus, by decreasing a slope angle θ1 of the outercircumferential portion 20 a of theslope surface 20, even if slope angles θ2, θ3 ofother portions slope surface 20 are made relatively large, the chipping of thesemiconductor wafer 10 can be suppressed significantly. On the other hand, the residue of thechemical solution 6 mainly occurs at the innercircumferential edge 20 f of theslope surface 20 and in a vicinity thereof (that is, the innercircumferential portion 20 b including the innercircumferential edge 20 f). Thus, by decreasing the slope angle θ2 of the innercircumferential portion 20 b of theslope surface 20, even if the slope angles θ1, θ3 of theother portions slope surface 20 are made relatively large, the residue of thechemical solution 6 can be suppressed significantly. In this way, if the slope angle θ of theslope surface 20 is not made constant and at least one of the slope angles θ1, θ2 of the outercircumferential portion 20 a and the innercircumferential portion 20 b is made smaller than a slope angle θ3 of theintermediate portion 20 c, at least one of the above-mentioned effects of theslope surface 20 can be enhanced while suppressing the increase in the width dimension W of theslope surface 20. - In an example of the
slope surface 20 shown inFIG. 9 , the slope angle θ1 of the outercircumferential portion 20 a is smaller than the slope angle θ3 of theintermediate portion 20 c. According such a configuration, the effect of theslope surface 20 suppressing the chippings can be enhanced while suppressing the increase in the width dimension W of theslope surface 20. Further, the slope angle θ2 of the innercircumferential portion 20 b can be made equal to the slope angle θ3 of theintermediate portion 20 c. According to such a configuration, for example, since the innercircumferential portion 20 b and theintermediate portion 20 c can be formed by the grindingstones 4 a of the same shape, it is possible to avoid complicating the manufacturing process of the semiconductor element. However, as another embodiment, the slope angle θ2 of the innercircumferential portion 20 b may be larger than the slope angle θ3 of theintermediate portion 20 c. - In a
slope surface 20 of another example shown inFIG. 10 , the slope angle θ2 of the innercircumferential portion 20 b is smaller than the slope angle θ3 of theintermediate portion 20 c. According to such a configuration, the effect of suppressing the residue of thechemical solution 6 by theslope surface 20 can be enhanced while suppressing the increase in the width dimension W of theslope surface 20. Further, the slope angle θ1 of the outercircumferential portion 20 a can be made equal to the slope angle θ3 of theintermediate portion 20 c. According to such a configuration, for example, since the outercircumferential portion 20 a and theintermediate portion 20 c can be formed by the grindingstones 4 a of the same shape, it is possible to avoid complicating the manufacturing process of the semiconductor element. However, as another embodiment, the slope angle θ1 of the outercircumferential portion 20 a may be larger than the slope angle θ3 of theintermediate portion 20 c. - In another example of a
slope surface 20 shown inFIG. 11 , the slope angles θ1, θ2 of both the outercircumferential portion 20 a and the innercircumferential portion 20 b of theslope surface 20 are smaller than the slope angle θ3 of theintermediate portion 20 c of theslope surface 20. According to such a configuration, while suppressing the increase in the width dimension W of theslope surface 20, both of the effect of suppressing the chippings by theslope surface 20 and the effect of suppressing the residue of thechemical solution 6 by theslope surface 20 can be enhanced. -
FIG. 12 is a graph indicating experimental data by which the effect of suppressing the chipping for theslope surface 20 according to the embodiment shown inFIG. 9 was confirmed. In this experiment, the slope angle θ1 of the outercircumferential portion 20 a of theslope surface 20 was set to 34 degrees, the slope angles θ2 and θ3 of the innercircumferential portion 20 b and theintermediate portion 20 c were set to 90 degrees. Although the slope angles θ2 and θ3 of the innercircumferential portion 20 b and theintermediate portion 20 c are usually set to degrees smaller than 90 degrees, in this experiment the slope angles θ2 and θ3 of the innercircumferential portion 20 b and theintermediate portion 20 c were set to 90 degrees which are most disadvantageous, in order to clarify an effect obtained in a case where only the slope angle θ1 of the outercircumferential portion 20 a is made small. Samples S1 to S12 of twelvesemiconductor wafers 10 were manufactured under the above-described conditions, and a number of chippings having a dimension of 50 mictometers or more was counted for each of the samples S1 to S12. As shown inFIG. 12 , it was confirmed that an average number of chippings occurred among the twelve samples S1 to S12 was seven, which is within an acceptable range. It should be noted that the experimental data shown inFIG. 12 is an example, and a number of chippings can change, for example, depending on a material and/or dimension of thesemiconductor wafer 10. - In the slope surfaces 20 exemplified in
FIGS. 9, 10 and 11 , each of the slope angles θ1, θ2, and θ3 is not limited to a specific angle. Each of the slope angles θ1, θ2, and θ3 may be set to any value within a range of smaller than 90 degrees. Further, although in the examples ofFIGS. 9, 10 and 11 only one slope surface is provided between thecentral region 10 c and thethick region 10 t, two or more slope surfaces 20 may be provided between thecentral region 10 c and thethick region 10 t with a space therebetween. In this case, the structure exemplified in any ofFIGS. 9, 10 and 11 may be employed for at least one of the slope surfaces 20. Further, although in the slope surfaces 20 exemplified inFIGS. 9, 10 and 11 the outercircumferential surface portion 20 a, theintermediate portion 20 c, and the innercircumferential surface portion 20 b are arranged continuously, another portion having another slope angle may be provided between the outercircumferential portion 20 a and theintermediate portion 20 c and/or between theintermediate portion 20 c and the innercircumferential portion 20 b.
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