US20170345908A1 - Method for producing semiconductor device - Google Patents

Method for producing semiconductor device Download PDF

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Publication number
US20170345908A1
US20170345908A1 US15/680,631 US201715680631A US2017345908A1 US 20170345908 A1 US20170345908 A1 US 20170345908A1 US 201715680631 A US201715680631 A US 201715680631A US 2017345908 A1 US2017345908 A1 US 2017345908A1
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sectional
taken along
insulating film
along line
view taken
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US15/680,631
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Fujio Masuoka
Hiroki Nakamura
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Unisantis Electronics Singapore Pte Ltd
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Unisantis Electronics Singapore Pte Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
    • H01L29/42392—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8221—Three dimensional integrated circuits stacked in different levels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823885—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688—Integrated circuits having a three-dimensional layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66666—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827—Vertical transistors

Definitions

  • the present invention relates to a method for producing a semiconductor device and a semiconductor device.
  • MOS transistors used in integrated circuits has been decreased to nano-scale dimensions.
  • Such a decrease in the size of MOS transistors causes difficulty in suppressing leak currents, which poses a problem in that it is hard to reduce the area occupied by the circuits because of the requirements of the secure retention of necessary currents.
  • SGT surrounding gate transistor having a structure in which a source, a gate, and a drain are arranged vertically with respect to a substrate and a gate electrode surrounds a pillar-shaped semiconductor layer
  • SGT surrounding gate transistor
  • a single transistor is formed in a single silicon pillar, and an nMOS transistor constituted by a single silicon pillar and a pMOS transistor constituted by a single silicon pillar are formed on a plane (e.g., refer to Japanese Unexamined Patent Application Publication No. 2008-300558). Since at least two silicon pillars are formed on a plane, an area corresponding to the at least two silicon pillars is required.
  • a plurality of gates are formed in a single silicon pillar (e.g., refer to Japanese Unexamined Patent Application Publication No. 2014-57068).
  • a gate insulating film is formed on a sidewall of the silicon pillar, and a source line and a bit line are connected to an upper end and a lower end of the silicon pillar, respectively.
  • an object is to provide an inverter circuit formed of a single semiconductor pillar.
  • a semiconductor device includes a third first-conductivity-type semiconductor layer formed on a semiconductor substrate; a first pillar-shaped semiconductor layer formed on the semiconductor substrate, the first pillar-shaped semiconductor layer including a first first-conductivity-type semiconductor layer, a first body region, a second first-conductivity-type semiconductor layer, a first second-conductivity-type semiconductor layer, a second body region, a second second-conductivity-type semiconductor layer, and a third second-conductivity-type semiconductor layer formed from a substrate side in that order; a first gate insulating film formed around the first body region; a first gate formed around the first gate insulating film; a second gate insulating film formed around the second body region; a second gate formed around the second gate insulating film; an output terminal connected to the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer; and a first contact that connects the first gate and the second gate.
  • the first gate insulating film may be further formed on an upper surface and a lower surface of the first gate, and the second gate insulating film may be further formed on an upper surface and a lower surface of the second gate.
  • the semiconductor device may include a first connection region formed between the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer.
  • the semiconductor device may include a first insulating film that surrounds the first first-conductivity-type semiconductor layer, a second insulating film that surrounds the second first-conductivity-type semiconductor layer, a third insulating film that surrounds the first second-conductivity-type semiconductor layer, and a fourth insulating film that surrounds the second second-conductivity-type semiconductor layer.
  • the first insulating film contains the same impurity as that of the first first-conductivity-type semiconductor layer
  • the second insulating film contains the same impurity as that of the second first-conductivity-type semiconductor layer
  • the third insulating film contains the same impurity as that of the first second-conductivity-type semiconductor layer
  • the fourth insulating film contains the same impurity as that of the second second-conductivity-type semiconductor layer.
  • a method for producing a semiconductor device includes depositing a second insulating film that is an oxide film containing an impurity having a first conductivity type on a substrate, depositing a sixth insulating film that is a nitride film, depositing a third insulating film that is an oxide film containing an impurity having a second conductivity type which is a conductivity type different from the first conductivity type, etching the second insulating film, the sixth insulating film, and the third insulating film to form a contact hole, performing epitaxial growth in the contact hole to form a first pillar-shaped silicon layer; and removing the sixth insulating film and depositing a metal to form an output terminal.
  • a second first-conductivity-type semiconductor layer and a first second-conductivity-type semiconductor layer may be formed in the first pillar-shaped silicon layer.
  • an inverter circuit formed of a single semiconductor pillar.
  • An inverter formed of a single semiconductor pillar is constituted by a third first-conductivity-type semiconductor layer formed on a semiconductor substrate; a first pillar-shaped semiconductor layer formed on the semiconductor substrate, the first pillar-shaped semiconductor layer including a first first-conductivity-type semiconductor layer, a first body region, a second first-conductivity-type semiconductor layer, a first second-conductivity-type semiconductor layer, a second body region, a second second-conductivity-type semiconductor layer, and a third second-conductivity-type semiconductor layer formed from a substrate side in that order; a first gate insulating film formed around the first body region; a first gate formed around the first gate insulating film; a second gate insulating film formed around the second body region; a second gate formed around the second gate insulating film; an output terminal connected to the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer; and a first contact that connects the first gate and the second gate. Therefore, an invert
  • the first gate insulating film is further formed on an upper surface and a lower surface of the first gate, and the second gate insulating film is further formed on an upper surface and a lower surface of the second gate. Therefore, insulation of the first gate in a vertical direction and insulation of the second gate in a vertical direction can be achieved with certainty.
  • the semiconductor device includes a first connection region formed between the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer. Therefore, the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer can be separated from each other, and the second first-conductivity-type semiconductor layer that extends to the connection region and the first second-conductivity-type semiconductor layer that extends to the connection region can be connected to the output terminal.
  • the semiconductor device includes a first insulating film that surrounds the first first-conductivity-type semiconductor layer, a second insulating film that surrounds the second first-conductivity-type semiconductor layer, a third insulating film that surrounds the first second-conductivity-type semiconductor layer, and a fourth insulating film that surrounds the second second-conductivity-type semiconductor layer.
  • the first insulating film contains the same impurity as that of the first first-conductivity-type semiconductor layer
  • the second insulating film contains the same impurity as that of the second first-conductivity-type semiconductor layer
  • the third insulating film contains the same impurity as that of the first second-conductivity-type semiconductor layer
  • the fourth insulating film contains the same impurity as that of the second second-conductivity-type semiconductor layer. Therefore, semiconductor layers having different conductivity types can be formed in a single pillar-shaped semiconductor layer through solid-state diffusion.
  • FIG. 1A is a plan view illustrating a semiconductor device according to an embodiment of the present invention
  • FIG. 1B is a sectional view taken along line x-x′ of FIG. 1A
  • FIG. 1C is a sectional view taken along line y-y′ of FIG. 1A ;
  • FIG. 2A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 2B is a sectional view taken along line x-x′ of FIG. 2A
  • FIG. 2C is a sectional view taken along line y-y′ of FIG. 2A ;
  • FIG. 3A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 3B is a sectional view taken along line x-x′ of FIG. 3A
  • FIG. 3C is a sectional view taken along line y-y′ of FIG. 3A ;
  • FIG. 4A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 4B is a sectional view taken along line x-x′ of FIG. 4A
  • FIG. 4C is a sectional view taken along line y-y′ of FIG. 4A ;
  • FIG. 5A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 5B is a sectional view taken along line x-x′ of FIG. 5A
  • FIG. 5C is a sectional view taken along line y-y′ of FIG. 5A ;
  • FIG. 6A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 6B is a sectional view taken along line x-x′ of FIG. 6A
  • FIG. 6C is a sectional view taken along line y-y′ of FIG. 6A ;
  • FIG. 7A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 7B is a sectional view taken along line x-x′ of FIG. 7A
  • FIG. 7C is a sectional view taken along line y-y′ of FIG. 7A ;
  • FIG. 8A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 8B is a sectional view taken along line x-x′ of FIG. 8A
  • FIG. 8C is a sectional view taken along line y-y′ of FIG. 8A ;
  • FIG. 9A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 9B is a sectional view taken along line x-x′ of FIG. 9A
  • FIG. 9C is a sectional view taken along line y-y′ of FIG. 9A ;
  • FIG. 10A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 10B is a sectional view taken along line x-x′ of FIG. 10A
  • FIG. 10C is a sectional view taken along line y-y′ of FIG. 10A ;
  • FIG. 11A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 11B is a sectional view taken along line x-x′ of FIG. 11A
  • FIG. 11C is a sectional view taken along line y-y′ of FIG. 11A ;
  • FIG. 12A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 12B is a sectional view taken along line x-x′ of FIG. 12A
  • FIG. 12C is a sectional view taken along line y-y′ of FIG. 12A ;
  • FIG. 13A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 13B is a sectional view taken along line x-x′ of FIG. 13A
  • FIG. 13C is a sectional view taken along line y-y′ of FIG. 13A ;
  • FIG. 14A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 14B is a sectional view taken along line x-x′ of FIG. 14A
  • FIG. 14C is a sectional view taken along line y-y′ of FIG. 14A ;
  • FIG. 15A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 15B is a sectional view taken along line x-x′ of FIG. 15A
  • FIG. 15C is a sectional view taken along line y-y′ of FIG. 15A ;
  • FIG. 16A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 16B is a sectional view taken along line x-x′ of FIG. 16A
  • FIG. 16C is a sectional view taken along line y-y′ of FIG. 16A ;
  • FIG. 17A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 17B is a sectional view taken along line x-x′ of FIG. 17A
  • FIG. 17C is a sectional view taken along line y-y′ of FIG. 17A ;
  • FIG. 18A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 18B is a sectional view taken along line x-x′ of FIG. 18A
  • FIG. 18C is a sectional view taken along line y-y′ of FIG. 18A ;
  • FIG. 19A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 19B is a sectional view taken along line x-x′ of FIG. 19A
  • FIG. 19C is a sectional view taken along line y-y′ of FIG. 19A ;
  • FIG. 20A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 20B is a sectional view taken along line x-x′ of FIG. 20A
  • FIG. 20C is a sectional view taken along line y-y′ of FIG. 20A ;
  • FIG. 21A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 21B is a sectional view taken along line x-x′ of FIG. 21A
  • FIG. 21C is a sectional view taken along line y-y′ of FIG. 21A ;
  • FIG. 22A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 22B is a sectional view taken along line x-x′ of FIG. 22A
  • FIG. 22C is a sectional view taken along line y-y′ of FIG. 22A ;
  • FIG. 23A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 23B is a sectional view taken along line x-x′ of FIG. 23A
  • FIG. 23C is a sectional view taken along line y-y′ of FIG. 23A ;
  • FIG. 24A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 24B is a sectional view taken along line x-x′ of FIG. 24A
  • FIG. 24C is a sectional view taken along line y-y′ of FIG. 24A ;
  • FIG. 25A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 25B is a sectional view taken along line x-x′ of FIG. 25A
  • FIG. 25C is a sectional view taken along line y-y′ of FIG. 25A ;
  • FIG. 26A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 26B is a sectional view taken along line x-x′ of FIG. 26A
  • FIG. 26C is a sectional view taken along line y-y′ of FIG. 26A ;
  • FIG. 27A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 27B is a sectional view taken along line x-x′ of FIG. 27A
  • FIG. 27C is a sectional view taken along line y-y′ of FIG. 27A ;
  • FIG. 28A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 28B is a sectional view taken along line x-x′ of FIG. 28A
  • FIG. 28C is a sectional view taken along line y-y′ of FIG. 28A ;
  • FIG. 29A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 29B is a sectional view taken along line x-x′ of FIG. 29A
  • FIG. 29C is a sectional view taken along line y-y′ of FIG. 29A ;
  • FIG. 30A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 30B is a sectional view taken along line x-x′ of FIG. 30A
  • FIG. 30C is a sectional view taken along line y-y′ of FIG. 30A ;
  • FIG. 31A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 31B is a sectional view taken along line x-x′ of FIG. 31A
  • FIG. 31C is a sectional view taken along line y-y′ of FIG. 31A ;
  • FIG. 32A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 32B is a sectional view taken along line x-x′ of FIG. 32A
  • FIG. 32C is a sectional view taken along line y-y′ of FIG. 32A ;
  • FIG. 33A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 33B is a sectional view taken along line x-x′ of FIG. 33A
  • FIG. 33C is a sectional view taken along line y-y′ of FIG. 33A ;
  • FIG. 34A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 34B is a sectional view taken along line x-x′ of FIG. 34A
  • FIG. 34C is a sectional view taken along line y-y′ of FIG. 34A ;
  • FIG. 35A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 35B is a sectional view taken along line x-x′ of FIG. 35A
  • FIG. 35C is a sectional view taken along line y-y′ of FIG. 35A ;
  • FIG. 36A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 36B is a sectional view taken along line x-x′ of FIG. 36A
  • FIG. 36C is a sectional view taken along line y-y′ of FIG. 36A ;
  • FIG. 37A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 37B is a sectional view taken along line x-x′ of FIG. 37A
  • FIG. 37C is a sectional view taken along line y-y′ of FIG. 37A ;
  • FIG. 38A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 38B is a sectional view taken along line x-x′ of FIG. 38A
  • FIG. 38C is a sectional view taken along line y-y′ of FIG. 38A ;
  • FIG. 39A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 39B is a sectional view taken along line x-x′ of FIG. 39A
  • FIG. 39C is a sectional view taken along line y-y′ of FIG. 39A ;
  • FIG. 40A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 40B is a sectional view taken along line x-x′ of FIG. 40A
  • FIG. 40C is a sectional view taken along line y-y′ of FIG. 40A ;
  • FIG. 41A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 41B is a sectional view taken along line x-x′ of FIG. 41A
  • FIG. 41C is a sectional view taken along line y-y′ of FIG. 41A ;
  • FIG. 42A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 42B is a sectional view taken along line x-x′ of FIG. 42A
  • FIG. 42C is a sectional view taken along line y-y′ of FIG. 42A ;
  • FIG. 43A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 43B is a sectional view taken along line x-x′ of FIG. 43A
  • FIG. 43C is a sectional view taken along line y-y′ of FIG. 43A ;
  • FIG. 44A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 44B is a sectional view taken along line x-x′ of FIG. 44A
  • FIG. 44C is a sectional view taken along line y-y′ of FIG. 44A ;
  • FIG. 45A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 45B is a sectional view taken along line x-x′ of FIG. 45A
  • FIG. 45C is a sectional view taken along line y-y′ of FIG. 45A ;
  • FIG. 46A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 46B is a sectional view taken along line x-x′ of FIG. 46A
  • FIG. 46C is a sectional view taken along line y-y′ of FIG. 46A ;
  • FIG. 47A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 47B is a sectional view taken along line x-x′ of FIG. 47A
  • FIG. 47C is a sectional view taken along line y-y′ of FIG. 47A ;
  • FIG. 48A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 48B is a sectional view taken along line x-x′ of FIG. 48A
  • FIG. 48C is a sectional view taken along line y-y′ of FIG. 48A ;
  • FIG. 49A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 49B is a sectional view taken along line x-x′ of FIG. 49A
  • FIG. 49C is a sectional view taken along line y-y′ of FIG. 49A ;
  • FIG. 50A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 50B is a sectional view taken along line x-x′ of FIG. 50A
  • FIG. 50C is a sectional view taken along line y-y′ of FIG. 50A ;
  • FIG. 51A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 51B is a sectional view taken along line x-x′ of FIG. 51A
  • FIG. 51C is a sectional view taken along line y-y′ of FIG. 51A ;
  • FIG. 52A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 52B is a sectional view taken along line x-x′ of FIG. 52A
  • FIG. 52C is a sectional view taken along line y-y′ of FIG. 52A ;
  • FIG. 53A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 53B is a sectional view taken along line x-x′ of FIG. 53A
  • FIG. 53C is a sectional view taken along line y-y′ of FIG. 53A ;
  • FIG. 54A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 54B is a sectional view taken along line x-x′ of FIG. 54A
  • FIG. 54C is a sectional view taken along line y-y′ of FIG. 54A ;
  • FIG. 55A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 55B is a sectional view taken along line x-x′ of FIG. 55A
  • FIG. 55C is a sectional view taken along line y-y′ of FIG. 55A ;
  • FIG. 56A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 56B is a sectional view taken along line x-x′ of FIG. 56A
  • FIG. 56C is a sectional view taken along line y-y′ of FIG. 56A ;
  • FIG. 57A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 57B is a sectional view taken along line x-x′ of FIG. 57A
  • FIG. 57C is a sectional view taken along line y-y′ of FIG. 57A ;
  • FIG. 58A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 58B is a sectional view taken along line x-x′ of FIG. 58A
  • FIG. 58C is a sectional view taken along line y-y′ of FIG. 58A ;
  • FIG. 59A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 59B is a sectional view taken along line x-x′ of FIG. 59A
  • FIG. 59C is a sectional view taken along line y-y′ of FIG. 59A ;
  • FIG. 60A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 60B is a sectional view taken along line x-x′ of FIG. 60A
  • FIG. 60C is a sectional view taken along line y-y′ of FIG. 60A ;
  • FIG. 61A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 61B is a sectional view taken along line x-x′ of FIG. 61A
  • FIG. 61C is a sectional view taken along line y-y′ of FIG. 61A ;
  • FIG. 62A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 62B is a sectional view taken along line x-x′ of FIG. 62A
  • FIG. 62C is a sectional view taken along line y-y′ of FIG. 62A ;
  • FIG. 63A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 63B is a sectional view taken along line x-x′ of FIG. 63A
  • FIG. 63C is a sectional view taken along line y-y′ of FIG. 63A ;
  • FIG. 64A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 64B is a sectional view taken along line x-x′ of FIG. 64A
  • FIG. 64C is a sectional view taken along line y-y′ of FIG. 64A ;
  • FIG. 65A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 65B is a sectional view taken along line x-x′ of FIG. 65A
  • FIG. 65C is a sectional view taken along line y-y′ of FIG. 65A ;
  • FIG. 66A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 66B is a sectional view taken along line x-x′ of FIG. 66A
  • FIG. 66C is a sectional view taken along line y-y′ of FIG. 66A ;
  • FIG. 67A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 67B is a sectional view taken along line x-x′ of FIG. 67A
  • FIG. 67C is a sectional view taken along line y-y′ of FIG. 67A ;
  • FIG. 68A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 68B is a sectional view taken along line x-x′ of FIG. 68A
  • FIG. 68C is a sectional view taken along line y-y′ of FIG. 68A ;
  • FIG. 69A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 69B is a sectional view taken along line x-x′ of FIG. 69A
  • FIG. 69C is a sectional view taken along line y-y′ of FIG. 69A ;
  • FIG. 70A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention
  • FIG. 70B is a sectional view taken along line x-x′ of FIG. 70A
  • FIG. 70C is a sectional view taken along line y-y′ of FIG. 70A .
  • FIGS. 1A to 1C illustrate a structure of a semiconductor device according to an embodiment of the present invention.
  • silicon is used as a semiconductor, but a material other than silicon may be used as a semiconductor.
  • the semiconductor device includes a third first-conductivity-type silicon layer 102 formed on a silicon substrate 101 and a first pillar-shaped silicon layer 116 formed on the silicon substrate 101 .
  • the first pillar-shaped silicon layer 116 includes a first first-conductivity-type silicon layer 131 , a first body region 202 , a second first-conductivity-type silicon layer 130 , a first second-conductivity-type silicon layer 129 , a second body region 201 , a second second-conductivity-type silicon layer 128 , and a third second-conductivity-type silicon layer 117 formed from the substrate side in that order.
  • the semiconductor device also includes a first gate insulating film 125 formed around the first body region 202 , a first gate 126 formed around the first gate insulating film 125 , a second gate insulating film 120 formed around the second body region 201 , a second gate 121 formed around the second gate insulating film 120 , an output terminal 123 connected to the second first-conductivity-type silicon layer 130 and the first second-conductivity-type silicon layer 129 , and a first contact 142 that connects the first gate 126 and the second gate 121 .
  • the first gate 126 and the second gate 121 are preferably made of a metal to adjust the threshold of transistors.
  • the metal is preferably titanium nitride or titanium aluminum nitride.
  • the first gate insulating film 125 and the second gate insulating film 120 are each preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • the first gate insulating film 125 is also formed on the upper surface and lower surface of the first gate 126 .
  • the second gate insulating film 120 is also formed on the upper surface and lower surface of the second gate 121 .
  • the semiconductor device includes a first connection region 203 formed between the second first-conductivity-type silicon layer 130 and the first second-conductivity-type silicon layer 129 .
  • the semiconductor device also includes a first insulating film 103 that surrounds the first first-conductivity-type silicon layer 131 and a second insulating film 105 that surrounds the second first-conductivity-type silicon layer 130 .
  • the first insulating film 103 contains the same impurity as that of the first first-conductivity-type silicon layer 131
  • the second insulating film 105 contains the same impurity as that of the second first-conductivity-type silicon layer 130 .
  • the semiconductor device also includes a third insulating film 109 that surrounds the first second-conductivity-type silicon layer 129 and a fourth insulating film 111 that surrounds the second second-conductivity-type silicon layer 128 .
  • the third insulating film 109 contains the same impurity as that of the first second-conductivity-type silicon layer 129
  • the fourth insulating film 111 contains the same impurity as that of the second second-conductivity-type silicon layer 128 .
  • the first insulating film 103 and the second insulating film 105 are each preferably an oxide film containing phosphorus or arsenic in a high concentration.
  • the third insulating film 109 and the fourth insulating film 111 are each preferably an oxide film containing boron in a high concentration.
  • the first insulating film 103 and the second insulating film 105 are each preferably an oxide film containing boron in a high concentration.
  • the third insulating film 109 and the fourth insulating film 111 are each preferably an oxide film containing phosphorus or arsenic in a high concentration.
  • the substrate is made of silicon, but may be made of another semiconductor.
  • nMOS is formed in a lower portion of a pillar-shaped semiconductor layer and pMOS is formed in an upper portion of the pillar-shaped semiconductor layer.
  • pMOS may be formed in the lower portion and nMOS may be formed in the upper portion.
  • an impurity is introduced into a silicon substrate 101 to form a third first-conductivity-type silicon layer 102 .
  • a first insulating film 103 is formed.
  • the first insulating film 103 is preferably an oxide film and more preferably an oxide film containing phosphorus or arsenic in a high concentration.
  • an impurity may be implanted to form an oxide film containing phosphorus or arsenic in a high concentration.
  • the fifth insulating film 104 is formed.
  • the fifth insulating film 104 is preferably a nitride film.
  • a second insulating film 105 is formed.
  • the second insulating film 105 is preferably an oxide film and more preferably an oxide film containing phosphorus or arsenic in a high concentration.
  • an impurity may be implanted to form an oxide film containing phosphorus or arsenic in a high concentration.
  • a sixth insulating film 106 is formed.
  • the sixth insulating film 106 is preferably a nitride film.
  • a first resist 107 is formed.
  • the sixth insulating film 106 is etched.
  • the first resist 107 is removed.
  • a seventh insulating film 108 is formed to perform planarization.
  • the seventh insulating film 108 is preferably an oxide film.
  • the seventh insulating film 108 is etched back to expose the sixth insulating film 106 .
  • a third insulating film 109 is formed.
  • the third insulating film 109 is preferably an oxide film and more preferably an oxide film containing boron in a high concentration.
  • an impurity may be implanted to form an oxide film containing boron in a high concentration.
  • an eighth insulating film 110 is formed.
  • the eighth insulating film 110 is preferably a nitride film.
  • a fourth insulating film 111 is formed.
  • the fourth insulating film 111 is preferably an oxide film and more preferably an oxide film containing boron in a high concentration.
  • an impurity may be implanted to form an oxide film containing boron in a high concentration.
  • a second resist 112 is formed.
  • the fourth insulating film 111 , the eighth insulating film 110 , the third insulating film 109 , the seventh insulating film 108 , the sixth insulating film 106 , the second insulating film 105 , the fifth insulating film 104 , and the first insulating film 103 are etched.
  • the second resist 112 is stripped.
  • a ninth insulating film 113 is deposited to perform planarization.
  • the ninth insulating film 113 is preferably an oxide film. The presence of the ninth insulating film 113 can prevent a pillar-shaped semiconductor layer from bending or toppling when the eighth insulating film 110 , the sixth insulating film 106 , and the fifth insulating film 104 are removed later.
  • a third resist 114 is formed.
  • the ninth insulating film 113 , the fourth insulating film 111 , the eighth insulating film 110 , the third insulating film 109 , the sixth insulating film 106 , the second insulating film 105 , the fifth insulating film 104 , and the first insulating film 103 are etched to form a contact hole 115 .
  • the third resist 114 is removed.
  • a first pillar-shaped silicon layer 116 is formed by performing epitaxial growth.
  • a polysilicon may be deposited.
  • boron is introduced as an impurity to form a third second-conductivity-type silicon layer 117 .
  • a polysilicon 118 is deposited.
  • a polysilicon is used herein, but any material that serves as a hard mask may be used.
  • a fourth resist 119 is formed.
  • the polysilicon 118 , the ninth insulating film 113 , and the fourth insulating film 111 are etched.
  • the fourth resist 119 is removed.
  • the eighth insulating film 110 is etched. Wet etching is preferably employed.
  • a second gate insulating film 120 is formed.
  • the second gate insulating film 120 is preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • a metal 121 to be a second gate 121 is formed.
  • the metal 121 is preferably titanium nitride or titanium aluminum nitride.
  • the metal 121 is etched to form a second gate 121 .
  • the exposed second gate insulating film 120 and the third insulating film 109 are etched to expose the sixth insulating film 106 .
  • a tenth insulating film 122 is deposited.
  • the tenth insulating film 122 is preferably an oxide film.
  • the tenth insulating film 122 is etched so as to be left as a sidewall.
  • the sixth insulating film 106 is etched. Wet etching is preferably employed.
  • a metal 123 to be an output terminal 123 is formed.
  • the metal 123 is preferably titanium nitride, titanium aluminum nitride, or tungsten.
  • the metal 123 is etched to form an output terminal 123 .
  • the second insulating film 105 is etched to expose the fifth insulating film 104 .
  • an eleventh insulating film 124 is deposited.
  • the eleventh insulating film 124 is preferably an oxide film.
  • the eleventh insulating film 124 is etched so as to be left as a sidewall.
  • the fifth insulating film 104 is etched. Wet etching is preferably employed.
  • the first gate insulating film 125 is preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • a metal 126 to be a first gate 126 is formed.
  • the metal 126 is preferably titanium nitride or titanium aluminum nitride.
  • the metal 126 is etched to form a first gate 126 .
  • the exposed first gate insulating film 125 is etched.
  • a first interlayer insulating film 127 is deposited to perform planarization.
  • the polysilicon 118 is exposed.
  • the polysilicon 118 is etched.
  • part of the third second-conductivity-type silicon layer 117 is etched.
  • a heat treatment is performed to form a first first-conductivity-type silicon layer 131 , a second first-conductivity-type silicon layer 130 , a first second-conductivity-type silicon layer 129 , and a second second-conductivity-type silicon layer 128 through solid-state diffusion.
  • the heat treatment may be performed before the formation of the second gate 121 .
  • a fifth resist 132 is formed.
  • the ninth insulating film 113 and the second gate insulating film 120 are etched.
  • the second gate 121 is etched.
  • the second gate insulating film 120 is etched.
  • the fifth resist 132 is removed.
  • a second interlayer insulating film 133 is deposited to perform planarization.
  • the second interlayer insulating film 133 is etched back to expose the third second-conductivity-type silicon layer 117 .
  • a sixth resist 134 is formed.
  • the first interlayer insulating film 127 is etched to form a contact hole 135 .
  • the sixth resist 134 is removed.
  • a seventh resist 136 is formed.
  • the second interlayer insulating film 133 is etched to form a contact hole 137 .
  • the seventh resist 136 is removed.
  • an eighth resist 138 is formed.
  • the ninth insulating film 113 and the second gate insulating film 120 are etched.
  • the second gate 121 is etched.
  • the second gate insulating film 120 , the third insulating film 109 , the seventh insulating film 108 , the second insulating film 105 , and the first gate insulating film 125 are etched to form a contact hole 139 .
  • the eighth resist 138 is removed.
  • a metal 143 is deposited to form contacts 140 and 141 and a first contact 142 .
  • ninth resists 144 , 145 , 146 , and 147 are formed.
  • the metal 143 is etched to form metal wirings 143 a, 143 b, 143 c, and 143 d.
  • the ninth resists 144 , 145 , 146 , and 147 are removed.
  • a method for producing a semiconductor device in which the p-type (including the p + -type) and the n-type (including the n ⁇ -type) are each changed to the opposite conductivity type in the above embodiment, and a semiconductor device produced by the method are also obviously included in the technical scope of the present invention.

Abstract

A method for producing a semiconductor device includes depositing an oxide film containing an impurity having a first conductivity type on a substrate. A nitride film and an oxide film containing an impurity having a second conductivity type different from the first conductivity type are deposited. The oxide film having the first conductivity type, the nitride film, and the oxide film having the second conductivity type are etched to form a contact hole. Epitaxial growth is performed in the contact hole to form a pillar-shaped silicon layer. The nitride film is removed and a metal is deposited to form an output terminal.

Description

    RELATED APPLICATIONS
  • The present application is a divisional application of U.S. application Ser. No. 14/743,570 filed Jun. 18, 2015, which claims priority to PCT/JP2014/068707, filed Jul. 14, 2014, the entire contents of which are incorporated herein by reference.
    • BACKGROUND 1. Technical Field
  • The present invention relates to a method for producing a semiconductor device and a semiconductor device.
    • 2. Description of the Related Art
  • The degree of integration of semiconductor integrated circuits, in particular, integrated circuits using MOS transistors has been increasing. With the increasing degree of integration, the size of MOS transistors used in integrated circuits has been decreased to nano-scale dimensions. Such a decrease in the size of MOS transistors causes difficulty in suppressing leak currents, which poses a problem in that it is hard to reduce the area occupied by the circuits because of the requirements of the secure retention of necessary currents. To address the problem, a surrounding gate transistor (hereinafter referred to as an “SGT”) having a structure in which a source, a gate, and a drain are arranged vertically with respect to a substrate and a gate electrode surrounds a pillar-shaped semiconductor layer has been proposed (e.g., refer to Japanese Unexamined Patent Application Publication Nos. 2-71556, 2-188966, and 3-145761).
  • In known inverters that use an SGT, a single transistor is formed in a single silicon pillar, and an nMOS transistor constituted by a single silicon pillar and a pMOS transistor constituted by a single silicon pillar are formed on a plane (e.g., refer to Japanese Unexamined Patent Application Publication No. 2008-300558). Since at least two silicon pillars are formed on a plane, an area corresponding to the at least two silicon pillars is required.
  • In known nonvolatile memories, a plurality of gates are formed in a single silicon pillar (e.g., refer to Japanese Unexamined Patent Application Publication No. 2014-57068). A gate insulating film is formed on a sidewall of the silicon pillar, and a source line and a bit line are connected to an upper end and a lower end of the silicon pillar, respectively.
    • SUMMARY
  • Accordingly, an object is to provide an inverter circuit formed of a single semiconductor pillar.
  • A semiconductor device according to an embodiment of the present invention includes a third first-conductivity-type semiconductor layer formed on a semiconductor substrate; a first pillar-shaped semiconductor layer formed on the semiconductor substrate, the first pillar-shaped semiconductor layer including a first first-conductivity-type semiconductor layer, a first body region, a second first-conductivity-type semiconductor layer, a first second-conductivity-type semiconductor layer, a second body region, a second second-conductivity-type semiconductor layer, and a third second-conductivity-type semiconductor layer formed from a substrate side in that order; a first gate insulating film formed around the first body region; a first gate formed around the first gate insulating film; a second gate insulating film formed around the second body region; a second gate formed around the second gate insulating film; an output terminal connected to the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer; and a first contact that connects the first gate and the second gate.
  • The first gate insulating film may be further formed on an upper surface and a lower surface of the first gate, and the second gate insulating film may be further formed on an upper surface and a lower surface of the second gate.
  • The semiconductor device may include a first connection region formed between the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer.
  • The semiconductor device may include a first insulating film that surrounds the first first-conductivity-type semiconductor layer, a second insulating film that surrounds the second first-conductivity-type semiconductor layer, a third insulating film that surrounds the first second-conductivity-type semiconductor layer, and a fourth insulating film that surrounds the second second-conductivity-type semiconductor layer. The first insulating film contains the same impurity as that of the first first-conductivity-type semiconductor layer, the second insulating film contains the same impurity as that of the second first-conductivity-type semiconductor layer, the third insulating film contains the same impurity as that of the first second-conductivity-type semiconductor layer, and the fourth insulating film contains the same impurity as that of the second second-conductivity-type semiconductor layer.
  • A method for producing a semiconductor device according to an embodiment of the present invention includes depositing a second insulating film that is an oxide film containing an impurity having a first conductivity type on a substrate, depositing a sixth insulating film that is a nitride film, depositing a third insulating film that is an oxide film containing an impurity having a second conductivity type which is a conductivity type different from the first conductivity type, etching the second insulating film, the sixth insulating film, and the third insulating film to form a contact hole, performing epitaxial growth in the contact hole to form a first pillar-shaped silicon layer; and removing the sixth insulating film and depositing a metal to form an output terminal.
  • By performing a heat treatment after the step of performing epitaxial growth in the contact hole to form a first pillar-shaped silicon layer, a second first-conductivity-type semiconductor layer and a first second-conductivity-type semiconductor layer may be formed in the first pillar-shaped silicon layer.
  • According to the present invention, there can be provided an inverter circuit formed of a single semiconductor pillar.
  • An inverter formed of a single semiconductor pillar is constituted by a third first-conductivity-type semiconductor layer formed on a semiconductor substrate; a first pillar-shaped semiconductor layer formed on the semiconductor substrate, the first pillar-shaped semiconductor layer including a first first-conductivity-type semiconductor layer, a first body region, a second first-conductivity-type semiconductor layer, a first second-conductivity-type semiconductor layer, a second body region, a second second-conductivity-type semiconductor layer, and a third second-conductivity-type semiconductor layer formed from a substrate side in that order; a first gate insulating film formed around the first body region; a first gate formed around the first gate insulating film; a second gate insulating film formed around the second body region; a second gate formed around the second gate insulating film; an output terminal connected to the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer; and a first contact that connects the first gate and the second gate. Therefore, an inverter can be achieved in an area corresponding to a single semiconductor pillar.
  • The first gate insulating film is further formed on an upper surface and a lower surface of the first gate, and the second gate insulating film is further formed on an upper surface and a lower surface of the second gate. Therefore, insulation of the first gate in a vertical direction and insulation of the second gate in a vertical direction can be achieved with certainty.
  • The semiconductor device includes a first connection region formed between the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer. Therefore, the second first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer can be separated from each other, and the second first-conductivity-type semiconductor layer that extends to the connection region and the first second-conductivity-type semiconductor layer that extends to the connection region can be connected to the output terminal.
  • The semiconductor device includes a first insulating film that surrounds the first first-conductivity-type semiconductor layer, a second insulating film that surrounds the second first-conductivity-type semiconductor layer, a third insulating film that surrounds the first second-conductivity-type semiconductor layer, and a fourth insulating film that surrounds the second second-conductivity-type semiconductor layer. The first insulating film contains the same impurity as that of the first first-conductivity-type semiconductor layer, the second insulating film contains the same impurity as that of the second first-conductivity-type semiconductor layer, the third insulating film contains the same impurity as that of the first second-conductivity-type semiconductor layer, and the fourth insulating film contains the same impurity as that of the second second-conductivity-type semiconductor layer. Therefore, semiconductor layers having different conductivity types can be formed in a single pillar-shaped semiconductor layer through solid-state diffusion.
    • BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1A is a plan view illustrating a semiconductor device according to an embodiment of the present invention, FIG. 1B is a sectional view taken along line x-x′ of FIG. 1A, and FIG. 1C is a sectional view taken along line y-y′ of FIG. 1A;
  • FIG. 2A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 2B is a sectional view taken along line x-x′ of FIG. 2A, and FIG. 2C is a sectional view taken along line y-y′ of FIG. 2A;
  • FIG. 3A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 3B is a sectional view taken along line x-x′ of FIG. 3A, and FIG. 3C is a sectional view taken along line y-y′ of FIG. 3A;
  • FIG. 4A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 4B is a sectional view taken along line x-x′ of FIG. 4A, and FIG. 4C is a sectional view taken along line y-y′ of FIG. 4A;
  • FIG. 5A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 5B is a sectional view taken along line x-x′ of FIG. 5A, and FIG. 5C is a sectional view taken along line y-y′ of FIG. 5A;
  • FIG. 6A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 6B is a sectional view taken along line x-x′ of FIG. 6A, and FIG. 6C is a sectional view taken along line y-y′ of FIG. 6A;
  • FIG. 7A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 7B is a sectional view taken along line x-x′ of FIG. 7A, and FIG. 7C is a sectional view taken along line y-y′ of FIG. 7A;
  • FIG. 8A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 8B is a sectional view taken along line x-x′ of FIG. 8A, and FIG. 8C is a sectional view taken along line y-y′ of FIG. 8A;
  • FIG. 9A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 9B is a sectional view taken along line x-x′ of FIG. 9A, and FIG. 9C is a sectional view taken along line y-y′ of FIG. 9A;
  • FIG. 10A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 10B is a sectional view taken along line x-x′ of FIG. 10A, and FIG. 10C is a sectional view taken along line y-y′ of FIG. 10A;
  • FIG. 11A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 11B is a sectional view taken along line x-x′ of FIG. 11A, and FIG. 11C is a sectional view taken along line y-y′ of FIG. 11A;
  • FIG. 12A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 12B is a sectional view taken along line x-x′ of FIG. 12A, and FIG. 12C is a sectional view taken along line y-y′ of FIG. 12A;
  • FIG. 13A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention,
  • FIG. 13B is a sectional view taken along line x-x′ of FIG. 13A, and FIG. 13C is a sectional view taken along line y-y′ of FIG. 13A;
  • FIG. 14A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 14B is a sectional view taken along line x-x′ of FIG. 14A, and FIG. 14C is a sectional view taken along line y-y′ of FIG. 14A;
  • FIG. 15A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 15B is a sectional view taken along line x-x′ of FIG. 15A, and FIG. 15C is a sectional view taken along line y-y′ of FIG. 15A;
  • FIG. 16A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 16B is a sectional view taken along line x-x′ of FIG. 16A, and FIG. 16C is a sectional view taken along line y-y′ of FIG. 16A;
  • FIG. 17A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 17B is a sectional view taken along line x-x′ of FIG. 17A, and FIG. 17C is a sectional view taken along line y-y′ of FIG. 17A;
  • FIG. 18A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 18B is a sectional view taken along line x-x′ of FIG. 18A, and FIG. 18C is a sectional view taken along line y-y′ of FIG. 18A;
  • FIG. 19A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 19B is a sectional view taken along line x-x′ of FIG. 19A, and FIG. 19C is a sectional view taken along line y-y′ of FIG. 19A;
  • FIG. 20A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 20B is a sectional view taken along line x-x′ of FIG. 20A, and FIG. 20C is a sectional view taken along line y-y′ of FIG. 20A;
  • FIG. 21A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 21B is a sectional view taken along line x-x′ of FIG. 21A, and FIG. 21C is a sectional view taken along line y-y′ of FIG. 21A;
  • FIG. 22A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 22B is a sectional view taken along line x-x′ of FIG. 22A, and FIG. 22C is a sectional view taken along line y-y′ of FIG. 22A;
  • FIG. 23A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 23B is a sectional view taken along line x-x′ of FIG. 23A, and FIG. 23C is a sectional view taken along line y-y′ of FIG. 23A;
  • FIG. 24A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 24B is a sectional view taken along line x-x′ of FIG. 24A, and FIG. 24C is a sectional view taken along line y-y′ of FIG. 24A;
  • FIG. 25A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 25B is a sectional view taken along line x-x′ of FIG. 25A, and FIG. 25C is a sectional view taken along line y-y′ of FIG. 25A;
  • FIG. 26A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 26B is a sectional view taken along line x-x′ of FIG. 26A, and FIG. 26C is a sectional view taken along line y-y′ of FIG. 26A;
  • FIG. 27A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 27B is a sectional view taken along line x-x′ of FIG. 27A, and FIG. 27C is a sectional view taken along line y-y′ of FIG. 27A;
  • FIG. 28A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 28B is a sectional view taken along line x-x′ of FIG. 28A, and FIG. 28C is a sectional view taken along line y-y′ of FIG. 28A;
  • FIG. 29A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 29B is a sectional view taken along line x-x′ of FIG. 29A, and FIG. 29C is a sectional view taken along line y-y′ of FIG. 29A;
  • FIG. 30A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 30B is a sectional view taken along line x-x′ of FIG. 30A, and FIG. 30C is a sectional view taken along line y-y′ of FIG. 30A;
  • FIG. 31A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 31B is a sectional view taken along line x-x′ of FIG. 31A, and FIG. 31C is a sectional view taken along line y-y′ of FIG. 31A;
  • FIG. 32A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 32B is a sectional view taken along line x-x′ of FIG. 32A, and FIG. 32C is a sectional view taken along line y-y′ of FIG. 32A;
  • FIG. 33A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 33B is a sectional view taken along line x-x′ of FIG. 33A, and FIG. 33C is a sectional view taken along line y-y′ of FIG. 33A;
  • FIG. 34A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 34B is a sectional view taken along line x-x′ of FIG. 34A, and FIG. 34C is a sectional view taken along line y-y′ of FIG. 34A;
  • FIG. 35A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 35B is a sectional view taken along line x-x′ of FIG. 35A, and FIG. 35C is a sectional view taken along line y-y′ of FIG. 35A;
  • FIG. 36A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 36B is a sectional view taken along line x-x′ of FIG. 36A, and FIG. 36C is a sectional view taken along line y-y′ of FIG. 36A;
  • FIG. 37A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 37B is a sectional view taken along line x-x′ of FIG. 37A, and FIG. 37C is a sectional view taken along line y-y′ of FIG. 37A;
  • FIG. 38A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 38B is a sectional view taken along line x-x′ of FIG. 38A, and FIG. 38C is a sectional view taken along line y-y′ of FIG. 38A;
  • FIG. 39A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 39B is a sectional view taken along line x-x′ of FIG. 39A, and FIG. 39C is a sectional view taken along line y-y′ of FIG. 39A;
  • FIG. 40A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 40B is a sectional view taken along line x-x′ of FIG. 40A, and FIG. 40C is a sectional view taken along line y-y′ of FIG. 40A;
  • FIG. 41A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 41B is a sectional view taken along line x-x′ of FIG. 41A, and FIG. 41C is a sectional view taken along line y-y′ of FIG. 41A;
  • FIG. 42A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 42B is a sectional view taken along line x-x′ of FIG. 42A, and FIG. 42C is a sectional view taken along line y-y′ of FIG. 42A;
  • FIG. 43A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 43B is a sectional view taken along line x-x′ of FIG. 43A, and FIG. 43C is a sectional view taken along line y-y′ of FIG. 43A;
  • FIG. 44A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 44B is a sectional view taken along line x-x′ of FIG. 44A, and FIG. 44C is a sectional view taken along line y-y′ of FIG. 44A;
  • FIG. 45A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 45B is a sectional view taken along line x-x′ of FIG. 45A, and FIG. 45C is a sectional view taken along line y-y′ of FIG. 45A;
  • FIG. 46A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 46B is a sectional view taken along line x-x′ of FIG. 46A, and FIG. 46C is a sectional view taken along line y-y′ of FIG. 46A;
  • FIG. 47A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 47B is a sectional view taken along line x-x′ of FIG. 47A, and FIG. 47C is a sectional view taken along line y-y′ of FIG. 47A;
  • FIG. 48A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 48B is a sectional view taken along line x-x′ of FIG. 48A, and FIG. 48C is a sectional view taken along line y-y′ of FIG. 48A;
  • FIG. 49A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 49B is a sectional view taken along line x-x′ of FIG. 49A, and FIG. 49C is a sectional view taken along line y-y′ of FIG. 49A;
  • FIG. 50A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 50B is a sectional view taken along line x-x′ of FIG. 50A, and FIG. 50C is a sectional view taken along line y-y′ of FIG. 50A;
  • FIG. 51A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 51B is a sectional view taken along line x-x′ of FIG. 51A, and FIG. 51C is a sectional view taken along line y-y′ of FIG. 51A;
  • FIG. 52A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 52B is a sectional view taken along line x-x′ of FIG. 52A, and FIG. 52C is a sectional view taken along line y-y′ of FIG. 52A;
  • FIG. 53A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 53B is a sectional view taken along line x-x′ of FIG. 53A, and FIG. 53C is a sectional view taken along line y-y′ of FIG. 53A;
  • FIG. 54A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 54B is a sectional view taken along line x-x′ of FIG. 54A, and FIG. 54C is a sectional view taken along line y-y′ of FIG. 54A;
  • FIG. 55A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 55B is a sectional view taken along line x-x′ of FIG. 55A, and FIG. 55C is a sectional view taken along line y-y′ of FIG. 55A;
  • FIG. 56A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 56B is a sectional view taken along line x-x′ of FIG. 56A, and FIG. 56C is a sectional view taken along line y-y′ of FIG. 56A;
  • FIG. 57A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 57B is a sectional view taken along line x-x′ of FIG. 57A, and FIG. 57C is a sectional view taken along line y-y′ of FIG. 57A;
  • FIG. 58A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 58B is a sectional view taken along line x-x′ of FIG. 58A, and FIG. 58C is a sectional view taken along line y-y′ of FIG. 58A;
  • FIG. 59A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 59B is a sectional view taken along line x-x′ of FIG. 59A, and FIG. 59C is a sectional view taken along line y-y′ of FIG. 59A;
  • FIG. 60A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 60B is a sectional view taken along line x-x′ of FIG. 60A, and FIG. 60C is a sectional view taken along line y-y′ of FIG. 60A;
  • FIG. 61A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 61B is a sectional view taken along line x-x′ of FIG. 61A, and FIG. 61C is a sectional view taken along line y-y′ of FIG. 61A;
  • FIG. 62A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 62B is a sectional view taken along line x-x′ of FIG. 62A, and FIG. 62C is a sectional view taken along line y-y′ of FIG. 62A;
  • FIG. 63A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 63B is a sectional view taken along line x-x′ of FIG. 63A, and FIG. 63C is a sectional view taken along line y-y′ of FIG. 63A;
  • FIG. 64A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 64B is a sectional view taken along line x-x′ of FIG. 64A, and FIG. 64C is a sectional view taken along line y-y′ of FIG. 64A;
  • FIG. 65A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 65B is a sectional view taken along line x-x′ of FIG. 65A, and FIG. 65C is a sectional view taken along line y-y′ of FIG. 65A;
  • FIG. 66A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 66B is a sectional view taken along line x-x′ of FIG. 66A, and FIG. 66C is a sectional view taken along line y-y′ of FIG. 66A;
  • FIG. 67A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 67B is a sectional view taken along line x-x′ of FIG. 67A, and FIG. 67C is a sectional view taken along line y-y′ of FIG. 67A;
  • FIG. 68A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 68B is a sectional view taken along line x-x′ of FIG. 68A, and FIG. 68C is a sectional view taken along line y-y′ of FIG. 68A;
  • FIG. 69A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 69B is a sectional view taken along line x-x′ of FIG. 69A, and FIG. 69C is a sectional view taken along line y-y′ of FIG. 69A; and
  • FIG. 70A is a plan view illustrating a method for producing a semiconductor device according to an embodiment of the present invention, FIG. 70B is a sectional view taken along line x-x′ of FIG. 70A, and FIG. 70C is a sectional view taken along line y-y′ of FIG. 70A.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Hereafter, embodiments of the present invention will be described. FIGS. 1A to 1C illustrate a structure of a semiconductor device according to an embodiment of the present invention. In this embodiment, silicon is used as a semiconductor, but a material other than silicon may be used as a semiconductor.
  • The semiconductor device includes a third first-conductivity-type silicon layer 102 formed on a silicon substrate 101 and a first pillar-shaped silicon layer 116 formed on the silicon substrate 101. The first pillar-shaped silicon layer 116 includes a first first-conductivity-type silicon layer 131, a first body region 202, a second first-conductivity-type silicon layer 130, a first second-conductivity-type silicon layer 129, a second body region 201, a second second-conductivity-type silicon layer 128, and a third second-conductivity-type silicon layer 117 formed from the substrate side in that order. The semiconductor device also includes a first gate insulating film 125 formed around the first body region 202, a first gate 126 formed around the first gate insulating film 125, a second gate insulating film 120 formed around the second body region 201, a second gate 121 formed around the second gate insulating film 120, an output terminal 123 connected to the second first-conductivity-type silicon layer 130 and the first second-conductivity-type silicon layer 129, and a first contact 142 that connects the first gate 126 and the second gate 121.
  • The first gate 126 and the second gate 121 are preferably made of a metal to adjust the threshold of transistors. The metal is preferably titanium nitride or titanium aluminum nitride. The first gate insulating film 125 and the second gate insulating film 120 are each preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • The first gate insulating film 125 is also formed on the upper surface and lower surface of the first gate 126. The second gate insulating film 120 is also formed on the upper surface and lower surface of the second gate 121.
  • The semiconductor device includes a first connection region 203 formed between the second first-conductivity-type silicon layer 130 and the first second-conductivity-type silicon layer 129.
  • The semiconductor device also includes a first insulating film 103 that surrounds the first first-conductivity-type silicon layer 131 and a second insulating film 105 that surrounds the second first-conductivity-type silicon layer 130. The first insulating film 103 contains the same impurity as that of the first first-conductivity-type silicon layer 131, and the second insulating film 105 contains the same impurity as that of the second first-conductivity-type silicon layer 130. The semiconductor device also includes a third insulating film 109 that surrounds the first second-conductivity-type silicon layer 129 and a fourth insulating film 111 that surrounds the second second-conductivity-type silicon layer 128. The third insulating film 109 contains the same impurity as that of the first second-conductivity-type silicon layer 129, and the fourth insulating film 111 contains the same impurity as that of the second second-conductivity-type silicon layer 128.
  • When the transistor in a lower portion is an nMOS transistor, the first insulating film 103 and the second insulating film 105 are each preferably an oxide film containing phosphorus or arsenic in a high concentration. When the transistor in an upper portion is a pMOS transistor, the third insulating film 109 and the fourth insulating film 111 are each preferably an oxide film containing boron in a high concentration. When the transistor in a lower portion is a pMOS transistor, the first insulating film 103 and the second insulating film 105 are each preferably an oxide film containing boron in a high concentration. When the transistor in an upper portion is an nMOS transistor, the third insulating film 109 and the fourth insulating film 111 are each preferably an oxide film containing phosphorus or arsenic in a high concentration.
  • A production process for forming a structure of an SGT according to an embodiment of the present invention will be described with reference to FIG. 2A to FIG. 70C. In this embodiment, the substrate is made of silicon, but may be made of another semiconductor. In the process of this embodiment, nMOS is formed in a lower portion of a pillar-shaped semiconductor layer and pMOS is formed in an upper portion of the pillar-shaped semiconductor layer. However, pMOS may be formed in the lower portion and nMOS may be formed in the upper portion.
  • As illustrated in FIGS. 2A to 2C, an impurity is introduced into a silicon substrate 101 to form a third first-conductivity-type silicon layer 102.
  • As illustrated in FIGS. 3A to 3C, a first insulating film 103 is formed. The first insulating film 103 is preferably an oxide film and more preferably an oxide film containing phosphorus or arsenic in a high concentration. Alternatively, after the formation of the first insulating film 103, an impurity may be implanted to form an oxide film containing phosphorus or arsenic in a high concentration.
  • As illustrated in FIGS. 4A to 4C, a fifth insulating film 104 is formed. The fifth insulating film 104 is preferably a nitride film.
  • As illustrated in FIGS. 5A to 5C, a second insulating film 105 is formed. The second insulating film 105 is preferably an oxide film and more preferably an oxide film containing phosphorus or arsenic in a high concentration. Alternatively, after the formation of the second insulating film 105, an impurity may be implanted to form an oxide film containing phosphorus or arsenic in a high concentration.
  • As illustrated in FIGS. 6A to 6C, a sixth insulating film 106 is formed. The sixth insulating film 106 is preferably a nitride film.
  • As illustrated in FIGS. 7A to 7C, a first resist 107 is formed.
  • As illustrated in FIGS. 8A to 8C, the sixth insulating film 106 is etched.
  • As illustrated in FIGS. 9A to 9C, the first resist 107 is removed.
  • As illustrated in FIGS. 10A to 10C, a seventh insulating film 108 is formed to perform planarization. The seventh insulating film 108 is preferably an oxide film.
  • As illustrated in FIGS. 11A to 11C, the seventh insulating film 108 is etched back to expose the sixth insulating film 106.
  • As illustrated in FIGS. 12A to 12C, a third insulating film 109 is formed. The third insulating film 109 is preferably an oxide film and more preferably an oxide film containing boron in a high concentration. Alternatively, after the formation of the third insulating film 109, an impurity may be implanted to form an oxide film containing boron in a high concentration.
  • As illustrated in FIGS. 13A to 13C, an eighth insulating film 110 is formed. The eighth insulating film 110 is preferably a nitride film.
  • As illustrated in FIGS. 14A to 14C, a fourth insulating film 111 is formed. The fourth insulating film 111 is preferably an oxide film and more preferably an oxide film containing boron in a high concentration. Alternatively, after the formation of the fourth insulating film 111, an impurity may be implanted to form an oxide film containing boron in a high concentration.
  • As illustrated in FIGS. 15A to 15C, a second resist 112 is formed.
  • As illustrated in FIGS. 16A to 16C, the fourth insulating film 111, the eighth insulating film 110, the third insulating film 109, the seventh insulating film 108, the sixth insulating film 106, the second insulating film 105, the fifth insulating film 104, and the first insulating film 103 are etched.
  • As illustrated in FIGS. 17A to 17C, the second resist 112 is stripped.
  • As illustrated in FIGS. 18A to 18C, a ninth insulating film 113 is deposited to perform planarization. The ninth insulating film 113 is preferably an oxide film. The presence of the ninth insulating film 113 can prevent a pillar-shaped semiconductor layer from bending or toppling when the eighth insulating film 110, the sixth insulating film 106, and the fifth insulating film 104 are removed later.
  • As illustrated in FIGS. 19A to 19C, a third resist 114 is formed.
  • As illustrated in FIGS. 20A to 20C, the ninth insulating film 113, the fourth insulating film 111, the eighth insulating film 110, the third insulating film 109, the sixth insulating film 106, the second insulating film 105, the fifth insulating film 104, and the first insulating film 103 are etched to form a contact hole 115.
  • As illustrated in FIGS. 21A to 21C, the third resist 114 is removed.
  • As illustrated in FIGS. 22A to 22C, a first pillar-shaped silicon layer 116 is formed by performing epitaxial growth. A polysilicon may be deposited.
  • As illustrated in FIGS. 23A to 23C, boron is introduced as an impurity to form a third second-conductivity-type silicon layer 117.
  • As illustrated in FIGS. 24A to 24C, a polysilicon 118 is deposited. A polysilicon is used herein, but any material that serves as a hard mask may be used.
  • As illustrated in FIGS. 25A to 25C, a fourth resist 119 is formed.
  • As illustrated in FIGS. 26A to 26C, the polysilicon 118, the ninth insulating film 113, and the fourth insulating film 111 are etched.
  • As illustrated in FIGS. 27A to 27C, the fourth resist 119 is removed.
  • As illustrated in FIGS. 28A to 28C, the eighth insulating film 110 is etched. Wet etching is preferably employed.
  • As illustrated in FIGS. 29A to 29C, a second gate insulating film 120 is formed. The second gate insulating film 120 is preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • As illustrated in FIGS. 30A to 30C, a metal 121 to be a second gate 121 is formed. The metal 121 is preferably titanium nitride or titanium aluminum nitride.
  • As illustrated in FIGS. 31A to 31C, the metal 121 is etched to form a second gate 121.
  • As illustrated in FIGS. 32A to 32C, the exposed second gate insulating film 120 and the third insulating film 109 are etched to expose the sixth insulating film 106.
  • As illustrated in FIGS. 33A to 33C, a tenth insulating film 122 is deposited. The tenth insulating film 122 is preferably an oxide film.
  • As illustrated in FIGS. 34A to 34C, the tenth insulating film 122 is etched so as to be left as a sidewall.
  • As illustrated in FIGS. 35A to 35C, the sixth insulating film 106 is etched. Wet etching is preferably employed.
  • As illustrated in FIGS. 36A to 36C, a metal 123 to be an output terminal 123 is formed. The metal 123 is preferably titanium nitride, titanium aluminum nitride, or tungsten.
  • As illustrated in FIGS. 37A to 37C, the metal 123 is etched to form an output terminal 123.
  • As illustrated in FIGS. 38A to 38C, the second insulating film 105 is etched to expose the fifth insulating film 104.
  • As illustrated in FIGS. 39A to 39C, an eleventh insulating film 124 is deposited. The eleventh insulating film 124 is preferably an oxide film.
  • As illustrated in FIGS. 40A to 40C, the eleventh insulating film 124 is etched so as to be left as a sidewall.
  • As illustrated in FIGS. 41A to 41C, the fifth insulating film 104 is etched. Wet etching is preferably employed.
  • As illustrated in FIGS. 42A to 42C, a first gate insulating film 125 is formed. The first gate insulating film 125 is preferably an oxide film, an oxynitride film, or a high-K dielectric film.
  • As illustrated in FIGS. 43A to 43C, a metal 126 to be a first gate 126 is formed. The metal 126 is preferably titanium nitride or titanium aluminum nitride.
  • As illustrated in FIGS. 44A to 44C, the metal 126 is etched to form a first gate 126.
  • As illustrated in FIGS. 45A to 45C, the exposed first gate insulating film 125 is etched.
  • As illustrated in FIGS. 46A to 46C, a first interlayer insulating film 127 is deposited to perform planarization. Thus, the polysilicon 118 is exposed.
  • As illustrated in FIGS. 47A to 47C, the polysilicon 118 is etched. Herein, part of the third second-conductivity-type silicon layer 117 is etched.
  • As illustrated in FIGS. 48A to 48C, a heat treatment is performed to form a first first-conductivity-type silicon layer 131, a second first-conductivity-type silicon layer 130, a first second-conductivity-type silicon layer 129, and a second second-conductivity-type silicon layer 128 through solid-state diffusion. The heat treatment may be performed before the formation of the second gate 121.
  • As illustrated in FIGS. 49A to 49C, a fifth resist 132 is formed.
  • As illustrated in FIGS. 50A to 50C, the ninth insulating film 113 and the second gate insulating film 120 are etched.
  • As illustrated in FIGS. 51A to 51C, the second gate 121 is etched.
  • As illustrated in FIGS. 52A to 52C, the second gate insulating film 120 is etched.
  • As illustrated in FIGS. 53A to 53C, the fifth resist 132 is removed.
  • As illustrated in FIGS. 54A to 54C, a second interlayer insulating film 133 is deposited to perform planarization.
  • As illustrated in FIGS. 55A to 55C, the second interlayer insulating film 133 is etched back to expose the third second-conductivity-type silicon layer 117.
  • As illustrated in FIGS. 56A to 56C, a sixth resist 134 is formed.
  • As illustrated in FIGS. 57A to 57C, the first interlayer insulating film 127 is etched to form a contact hole 135.
  • As illustrated in FIGS. 58A to 58C, the sixth resist 134 is removed.
  • As illustrated in FIGS. 59A to 59C, a seventh resist 136 is formed.
  • As illustrated in FIGS. 60A to 60C, the second interlayer insulating film 133 is etched to form a contact hole 137.
  • As illustrated in FIGS. 61A to 61C, the seventh resist 136 is removed.
  • As illustrated in FIGS. 62A to 62C, an eighth resist 138 is formed.
  • As illustrated in FIGS. 63A to 63C, the ninth insulating film 113 and the second gate insulating film 120 are etched.
  • As illustrated in FIGS. 64A to 64C, the second gate 121 is etched.
  • As illustrated in FIGS. 65A to 65C, the second gate insulating film 120, the third insulating film 109, the seventh insulating film 108, the second insulating film 105, and the first gate insulating film 125 are etched to form a contact hole 139.
  • As illustrated in FIGS. 66A to 66C, the eighth resist 138 is removed.
  • As illustrated in FIGS. 67A to 67C, a metal 143 is deposited to form contacts 140 and 141 and a first contact 142.
  • As illustrated in FIGS. 68A to 68C, ninth resists 144, 145, 146, and 147 are formed.
  • As illustrated in FIGS. 69A to 69C, the metal 143 is etched to form metal wirings 143 a, 143 b, 143 c, and 143 d.
  • As illustrated in FIGS. 70A to 70C, the ninth resists 144, 145, 146, and 147 are removed.
  • The method for producing a semiconductor device according to an embodiment of the present invention has been described above.
  • In the present invention, various embodiments and modifications can be made without departing from the broad sprit and scope of the present invention. Furthermore, the above-described embodiment is provided to describe one embodiment of the present invention, and the scope of the present invention is not limited thereto.
  • For example, a method for producing a semiconductor device in which the p-type (including the p+-type) and the n-type (including the n−-type) are each changed to the opposite conductivity type in the above embodiment, and a semiconductor device produced by the method are also obviously included in the technical scope of the present invention.

Claims (2)

1. A method for producing a semiconductor device comprising:
depositing an oxide film containing an impurity having a first conductivity type on a substrate;
depositing a nitride film;
depositing an oxide film containing an impurity having a second conductivity type different from the first conductivity type;
etching the oxide film having the first conductivity type, the nitride film, and the oxide film having the second conductivity type to form a contact hole;
performing epitaxial growth in the contact hole to form a pillar-shaped silicon layer;
removing the nitride film; and
depositing a metal to form an output terminal.
2. The method for producing a semiconductor device according to claim 1, further comprising:
performing a heat treatment after the performing epitaxial growth in the contact hole to form a first pillar-shaped silicon layer; and
forming a first-conductivity-type semiconductor layer and a second-conductivity-type semiconductor layer in the pillar-shaped silicon layer.
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