US20170023990A1 - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- US20170023990A1 US20170023990A1 US15/000,748 US201615000748A US2017023990A1 US 20170023990 A1 US20170023990 A1 US 20170023990A1 US 201615000748 A US201615000748 A US 201615000748A US 2017023990 A1 US2017023990 A1 US 2017023990A1
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- module
- electronic apparatus
- adapter plate
- node
- fan
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Images
Classifications
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- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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- G—PHYSICS
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G—PHYSICS
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
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- G06F13/4022—Coupling between buses using switching circuits, e.g. switching matrix, connection or expansion network
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- G06F2213/40—Bus coupling
- G06F2213/4004—Universal serial bus hub with a plurality of upstream ports
Definitions
- the present invention relates to the communication field, and specifically to an electronic apparatus of high density.
- an object of the present invention is to provide an input/output apparatus and an electronic apparatus, used to solve the problem in the prior art that arrangement of elements inside the electronic apparatus cannot well meet high-density and high-performance characteristics.
- the present invention provides an electronic apparatus, comprising an input/output unit; the input/output unit comprising: a housing comprising a bottom plate, the housing having a first end along a direction of the bottom plate and a second end opposite the first end; an adapter plate fixed onto the bottom plate, comprising an adapter plate body and an adapter plate inserting portion, the adapter plate body having a first slot and a second slot towards a direction away from the bottom plate, the adapter plate inserting portion being adjacent to the second end of the housing and exposed to the second end, and the adapter plate being electrically connected with an external electronic device through the adapter plate inserting portion; a PCIE card disposed adjacent to the first end and on the adapter plate, comprising a PCIE card body and a PCIE port, the PCIE card body being disposed on the adapter plate along the direction of the adapter plate and perpendicular to the adapter plate, the PCIE card body being inserted to the first slot of the adapter plate through a PCIE card disposed adjacent to the first end
- the housing further comprises two sidewalls connecting the bottom plate.
- the housing has a first receiving space adjacent to the first end, and a case is provided with a second receiving space adjacent to the second end; the PCIE card is disposed in the first receiving space, and the fan module is disposed in the second receiving space.
- the fan module is fixed with the two sidewalls through screws.
- the number of the PCIE card is 3.
- the input/output apparatus further comprises an upper cover, used to partially cover the PCIE card.
- the number of the fan module is two, and one of the two fan modules is a fan module that provides redundant backup.
- the housing is provided with a snap structure adjacent to the first end, used to be in a snap connection with an external device.
- the electronic apparatus is a server.
- the size of the electronic apparatus is 2 U.
- the electronic apparatus consistent with the present invention integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost.
- the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit.
- FIG. 1 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention.
- FIG. 2 is a rear view of FIG. 1 .
- FIG. 3 is a front view of FIG. 1 .
- FIG. 4 is a schematic view of the whole structure of a case in a specific embodiment of the present invention.
- FIG. 5 is a schematic structural view of a first end portion side of the case shown in FIG. 4 .
- FIG. 6 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention.
- FIG. 7 is a schematic structural view of a node I/O module in a specific embodiment of the present invention.
- FIG. 8 is a schematic disassembled view of the node I/O module shown in FIG. 7 .
- FIG. 9 is a front view of the node I/O module shown in FIG. 7 .
- FIG. 10 is a schematic structural view of a shared I/O module in a specific embodiment of the present invention.
- FIG. 11 is a disassembled view of the shared I/O module shown in FIG. 10 .
- FIG. 12 is a schematic structural view of a back plate in a specific embodiment of the present invention.
- FIG. 13 is a disassembled view of the back plate shown in FIG. 12 .
- FIG. 14 is a schematic modular view of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- FIG. 15 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- FIG. 16 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- FIG. 17 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- FIG. 18 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention.
- FIG. 19 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention.
- FIG. 20 is a schematic structural view of a disk support portion in a specific embodiment of the present invention.
- FIG. 21 is a schematic structural view showing that the disk support portion shown in FIG. 20 is used to assemble a disk.
- FIG. 1 to FIG. 20 Please refer to FIG. 1 to FIG. 20 .
- the structures, scales, sizes and the like drawn in the drawings of the specification are merely used to match the contents disclosed in the specification for understanding and reading of those skilled in the art, but are not used to limit limited conditions under which the present invention can be implemented, and thus do not have technical substantive meanings, and any structural modification, change in the proportional relationship or size adjustment should fall within the scope that the technical contents disclosed in the present invention can cover without affecting the effects and objects that can be achieved by the present invention.
- the electronic apparatus consistent with the present invention is an OTT (Over The Top) high-density server, which preferably uses a 2 U case, “U” of the server is a unit that indicates an external size of the server, and is an abbreviated form of unit, and a detailed size is decided by American electronics industries association (EIA) that serves as an industry group.
- EIA American electronics industries association
- the reason for specifying the size of the server is to make the server keep a suitable size to be placed on an iron or aluminum rack.
- the rack has a screw hole that fixes the server, which is aligned with a screw hole of the server, and is fixed with a screw.
- racks that meet such a specification are also called “19-inch racks” sometimes.
- the thickness takes 4.445 cm as a basic unit. 1 U is 4.445 cm, and 2 U is double 1 U, that is, 8.89 cm (and so on). That is to say, the so-called “1 U server” is a product whose shape meets EIA specifications and thickness is 4.445 cm. Products designed to be capable of being placed to a 19-inch cabinet are generally called rack servers.
- rack servers are generally called rack servers.
- FIG. 1 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention.
- the electronic apparatus comprises a case 1 , a back plate 2 , at least one I/O (input/output) module 3 , at least one power supply module 4 and at least one node module 5 .
- FIG. 2 is a rear view of the electronic apparatus shown in FIG. 1
- FIG. 3 is a front view of the electronic apparatus shown in FIG. 1 .
- the case 1 comprises two sidewalls 11 and a bottom plate 12 connecting the two sidewalls 11 , the sidewalls 11 and the bottom plate 12 can be fixedly connected through screws or snaps or may be an integral structure, the case 1 has a first end 13 along a direction of the sidewalls 11 and a second end 14 opposite the first end, the case has a first receiving space 15 adjacent to the first end 13 , and the case has a second receiving space 16 adjacent to the second end 14 .
- the first receiving space 15 is used to receive the I/O module 3 and the power supply module 4 , wherein the first receiving space 15 is divided into multiple rear-end regions having the same height and arranged side by side, and each of the rear-end regions is used to receive at least one I/O module 3 or at least one power supply module 4 .
- the rear-end region is divided into 6 regions, which are respectively a rear-end region A, a rear-end region B, a rear-end region C, a rear-end region D, a rear-end region E and a rear-end region F.
- the second receiving space 16 is used to receive the node module 5 , wherein the second receiving space 16 is further divided into multiple front-end regions, and each of the front-end regions is provided with at least one node module 5 . Moreover, in combination with FIG. 4 , the second receiving space 16 is divided into two front-end regions G and a front-end region H, the front-end regions G and the front-end region H can accommodate two node modules 5 stacked respectively.
- the case 1 of a finished electronic apparatus further comprises an upper cover 17
- the upper cover 17 is an integral structure, disposed, opposite the bottom plate 12 , to the top of the electronic apparatus, or as in this embodiment, the upper cover 17 comprises two parts, that is, a front upper cover that covers the second receiving space 16 and the back plate 2 and a rear upper cover that covers the first receiving space 15 , and the two parts cover can be fixedly connected through corresponding screw holes.
- the back plate 2 is disposed, perpendicular to the two sidewalls 11 , between the first receiving space 15 and the second receiving space 16 , and in combination with FIG. 6 ( FIG. 6 is a schematic structural view of the electronic apparatus of FIG. 1 whose upper cover has been removed), has a first insertion and extraction portion 21 towards the first receiving space 15 and a second insertion and extraction portion 22 towards the second receiving space 16 , preferably, the first insertion and extraction portion 21 and the second insertion and extraction portion 22 are, for example, high-speed back plate connectors, or for example, may be slots, used to match a golden finger and make electrical connections, and such design can avoid use of a tool and can also make the interior of the case 1 much cleaner and neater.
- the back plate 2 can make individual electrical modules (the I/O module 3 , the power supply module 4 and the node module 5 ) disposed in the first receiving space 15 and the second receiving space 16 connected with each other, equivalent to a bridge, so that the electrical modules can cooperate with each other, to implement particular electrical functions.
- individual electrical modules the I/O module 3 , the power supply module 4 and the node module 5
- the I/O module 3 has an I/O module assembling portion, and is pluggably electrically connected to the first insertion and extraction portion 21 of the back plate 2 , and the I/O module assembling portion is preferably a golden finger structure or a back plate connector electrically connected with the first insertion and extraction portion 21 of the back plate of the slot structure.
- the power supply module 4 has a power supply module assembling portion, and is pluggably electrically connected to the first insertion and extraction portion 21 of the back plate 2 , used to supply power of the electronic apparatus.
- the number of the power supply module 4 is two, one of the two power supply modules 4 is a power supply module 4 that provides redundant backup, and the two power supply modules 4 are stacked into one of the rear-end regions.
- the power supply modules 4 supply power for other electrical components in the electrical apparatus through the back plate, and more preferably, the power supply modules 4 communicate with the other electrical components in the electrical apparatus through a I2C bus.
- the power supply module assembling portion is preferably a golden finger structure and electrically connected with the first insertion and extraction portion of the back plate of the slot structure.
- the I/O module 3 preferably comprises a node I/O module 31 and a shared I/O module 32 .
- each node I/O module 31 is electrically connected with the node module 5 through the back plate 2 , and specific reference can be made to FIG. 7 , FIG. 8 and FIG. 9 for the structure of the node I/O module 31 , and the node I/O module 31 comprises:
- a housing 311 comprising two sidewalls 3111 and a bottom plate 3112 connecting the two sidewalls 3111 , the housing 311 having a first end 3113 along a direction of the two sidewalls 3111 and a second end 3114 opposite the first end 3113 , the housing 311 having a first receiving space 3115 adjacent to the first end 3113 , and the housing 311 having a second receiving space 3116 adjacent to the second end 3114 ; in this embodiment, the housing 311 further comprises a top plate 3117 that covers part of the first receiving space 3115 , the top plate 3117 mainly plays a role of protecting electronic elements received in the first receiving space 3115 , and in other specific embodiments, the size of the top plate 3117 may be shorter or longer, or the top plate 3117 may be omitted.
- an adapter plate (not shown) disposed in the housing 311 , fixed, parallel to the bottom plate 3112 , onto the bottom plate 3112 , and comprising an adapter plate body and an adapter plate inserting portion, the adapter plate body having a first slot and a second slot towards a direction away from the bottom plate 3112 , the adapter plate inserting portion being adjacent to the second end 3114 of the housing 311 and exposed to the second end 3114 , and the adapter plate being electrically connected with the first insertion and extraction portion 21 of the back plate 2 through the adapter plate inserting portion.
- a PCIE card 312 disposed in the first receiving space 3115 , comprising a PCIE card body 3121 and a PCIE port 3122 , the PCIE port is a PCIE 10 port in specific application, the PCIE card body 3121 being disposed parallel to the sidewalls 3111 and perpendicular to the bottom plate 3112 , the PCIE card body 3121 being inserted to the first slot of the adapter plate through a golden finger, and the PCIE port 3122 being located at the first end 3113 of the housing 311 ; in this embodiment, the number of the PCIE card 312 is preferably 3.
- the fan unit 313 comprises a fan frame 3131 and a fan 3132 , the fan 3132 is disposed in the fan frame 3131 , and the fan unit 313 is inserted to the second slot of the adapter plate through a connector, wherein the connector is preferably a golden finger or a wirecable.
- the fan 3132 is a hot plug structure.
- the node I/O module 31 when it is necessary to replace the fan unit 313 or repair the fan unit 313 , it is feasible to directly take out the node I/O module 31 from the receiving space without removing the housing of the server case (most fans in the existing server case need to open the top cover in the case of maintenance or replacement), so operations are convenient and maintenance efficiency is increased.
- the fan unit 313 can be fixed to the housing 311 through screws.
- the node I/O module may be a drawer-type structure, the two sidewalls may be omitted, and the fan unit 313 is directly fixed onto the adapter plate.
- the shared I/O module 32 is selectively electrically connected with one node module 5 through the back plate 2 ; preferably, the electronic apparatus further comprises a switch module, used to, according to a switch signal, cause the shared I/O module 32 to communicate with one of the node modules 5 .
- the switch module is a toggle button (for example, a toggle button controlled by a mouse or a keyboard), the node module 5 that communicates with the shared I/O module 32 is switched by pressing the button, or the node module 5 that communicates with the shared I/O module 32 is switched according to a remote network control signal.
- FIG. 10 and FIG. 11 for the structure of the shared I/O module 32 , which comprises:
- a housing 321 comprising two sidewalls 3211 , and a top plate 3212 and a bottom plate 3213 connecting the two sidewalls 3211 , the housing 321 having a first end 3214 along a direction of the two sidewalls 3211 and a second end 3215 opposite the first end 3214 ;
- two main modules (two shared I/O units) 322 respectively disposed on inner side surfaces of the top plate 3212 and the bottom plate 3213 of the housing 321 and form a receiving space with the two sidewalls 3211 of the housing 321 , that is, the thickness of one end of the main modules 322 is less than that of the other end, and such design can form the receiving space on the side with less thickness, used to receive fans and other units, which can maximize use of the space.
- Each main module 322 comprises a first I/O interface 3221 connected with an external device and a second I/O interface 3222 electrically connected with one of the at least two node modules 5 ;
- the first I/O interface 3221 for example, comprises one or more combinations of a USB port interface, a VGA port interface and a network port interface, and the two main modules 322 are mutual redundancy design.
- a fan unit 323 received in the receiving space comprising a fan frame 3231 and a fan 3232 , the fan 3232 being disposed in the fan frame 3231 .
- the fan 3232 is a hot plug structure.
- modular design of the shared I/O module 32 when it is necessary to replace the fan unit 323 or repair the fan unit 323 , it is feasible to directly take out the shared I/O module 32 from the receiving space without removing the housing of the server case (most fans in the existing server case need to open the top cover in the case of maintenance or replacement), so operations are convenient and maintenance efficiency is increased, which, while ensuring that the temperature of the case reaches the standard, makes the fan unit assembled and disassembled conveniently and easy to maintain.
- the back plate 2 is provided with an air vent, and the air vents correspond to the fan unit 313 of the node I/O module 31 , the fan unit 323 of the shared I/O module 32 and elements to be cooled, to cause the air vents to cooperate with the fan units 313 and 323 and the elements to be cooled, to form an air flow channel.
- the back plate 2 is transversely opened with multiple evenly-distributed first air vents 23 corresponding to the fan unit 313 of the node I/O module 31 and second air vents 24 corresponding to the fan unit 323 of the shared I/O module 32 , the arrangement of the first air vents 23 and the second air vents 24 can make air flows of the fan unit 313 and the fan unit 323 more flow towards units to be cooled (for example, processors and DDRs) on the node module 5 , and sockets on the back plate 2 are reasonably disposed on two sides of the first air vents 23 and the second air vents 24 , that is, cooling demands of the server case can be met in the event that reasonable arrangement of the sockets on the back plate 2 is ensured.
- the first air vent 23 is of evenly-distributed strip-type holes
- the second air vent 24 is of rectangle holes.
- heights of the node I/O module 31 , the shared I/O module 32 and the power supply module 4 are preferably the same as that of the rear-end regions, and their lengths correspond to that of the rear-end regions, so that more modules can be laid out in a limited case space; specifically, the node I/O module 31 , the shared I/O module 32 and the power supply module 4 are respectively received in one corresponding rear-end region, and there are an even number of node I/O modules 31 , which are bilaterally symmetrically disposed in the corresponding rear-end regions relative to the shared I/O module 32 .
- the number of the rear-end regions is preferably an even number greater than or equal to 4.
- the number of the node I/O module 31 is four
- the number of the shared I/O module 32 is one
- the node I/O modules 31 , the shared I/O module 32 and the power supply module 4 are disposed in the rear-end regions from left to right or from right to left in a sequence as follows: the power supply module 4 , two node I/O modules 31 , the shared I/O module 32 , two node I/O modules 31 . That is, in combination with FIG. 1 , FIG. 2 and FIG.
- the power supply module 4 is disposed in the rear-end region F, the power supply module 4 comprises two power supply units which are mutually redundant and stacked in the rear-end region F, the shared I/O module 32 is disposed in the rear-end region C, and the node I/O modules 31 are respectively disposed in the rear-end regions A, B, D and E, and comprise four node modules 5 each two of which are stacked in the second receiving space 16 .
- the shared I/O module 32 is placed in the middle, to make distances from signals of the node modules 5 in the second receiving space 16 of the electronic apparatus to the shared I/O module 32 basically the same and ensure symmetry of performance of signal transmission, and the four node I/O modules 31 are disposed on two sides of the shared I/O module 32 , to make distances from the signals of the node modules 5 in the second receiving space 16 of the electronic apparatus to the corresponding node I/O modules 31 equal and ensure symmetry of performance of signal transmission.
- lengths of the power supply module 4 , the shared I/O module 32 and the node I/O modules 31 are basically the same, in terms of height, the height of the power supply module 4 and the shared I/O module 32 is basically half of the receiving height of the first receiving space 15 , and the height of the node I/O modules 31 is basically the same as the receiving height of the first receiving space 15 , to maximize space utilization in the first receiving space 15 of the case of the electronic apparatus, and such length and height setting shares a front-end module partition to the maximum possible extent, thus achieving the effect of cost reduction.
- the port interface of the I/O module 3 and the port interface of the power supply module 4 are at the first end 13 . That is, the port interface of the I/O module 3 , as shown in FIG. 7 , the PCIE port of the PCIE card, is at the first end 13 , and the port interface of the shared I/O module 32 comprises a USB port, a VGA port and a network port, which are also at the first end 13 , and in another specific embodiment, the port of the shared I/O module 32 may also be of other port type. More preferably, designing the shared I/O module 32 matching different port types can make replacement according to application requirements.
- the node module 5 has a node module assembling portion, is pluggably electrically connected to the second insertion and extraction portion 22 of the back plate 2 , and communicates with the corresponding I/O module (the node I/O module 31 or the shared I/O module 32 ) through the back plate 2 .
- the node module 5 comprises a mainboard 51 as shown in the FIG. 6 , the mainboard 51 comprises a first electrical connection portion (not shown) and a second electrical connection portion (not shown), and the first electrical connection portion can be electrically connected with electrical modules (a node I/O module 31 , a shared I/O module 32 and a power supply module 4 ) in the first receiving space 15 through the back plate 2 .
- the second electrical connection portion is electrically connected with a plurality of expansion disks through an anode back-plate 57 of the node module 5 .
- the node module 5 further comprises two processors (CPUs) disposed at the mainboard along the node length direction, which are respectively a first processor 52 and a second processor 53 , the first processor 52 and the second processor 53 are electrically connected and disposed on the mainboard 51 , to form a dual-processor, and the model of the first processor 52 and the second processor 53 is, for example, Skylake; the processors have great heat productivity during operation, therefore, heat sinks are disposed on the top of the first processor 52 and the second processor 53 , the first processor 52 is provided with a memory module 54 electrically connected with the first processor 52 respectively along two sides of the width direction of the node module 5 , which are disposed on the mainboard, in this embodiment, each memory module 54 is selected to comprise 6 DDRs (Double Data Rate, double data rate synchronous dynamic random memory), so, the first processor is electrically connected with 12 DDRs.
- processors CPUs
- a heat sink is correspondingly disposed above each memory module 54 as desired; the second processor 53 is provided with a memory module 54 electrically connected with the second processor 23 along two sides of the width direction of the node module 5 , which are disposed on the mainboard 51 , in this embodiment, each memory module 54 is selected to comprise 6 DDRs (Double Data Rate, double data rate synchronous dynamic random memory), so, the second processor 53 is electrically connected with 12 DDRs and a heat sink is correspondingly disposed above each memory module 54 .
- DDRs Double Data Rate, double data rate synchronous dynamic random memory
- the node module 5 is provided with a South Bridge chip 55 and a BMC (not shown) (Baseboard Management Controller) near the first electrical connection portion on the mainboard 51 , and in this embodiment, the first processor 52 directly communicates with the PCIE card of the corresponding node I/O module 31 , and the number of the PCIE card of the corresponding node I/O module 31 is preferably 3.
- the first processor 52 is electrically connected with the shared I/O module 32 through the South Bridge chip 55 and the BMC.
- the node module 5 is also provided with a disk module and according to the specific configuration condition of the disk module, the second processor 53 is directly electrically connected with the disk module, or is electrically connected with the disk module through a SAS adapter card 56 as shown in FIG. 6 .
- the type of the SAS adapter card 56 is SAS3008 produced by LSI company.
- the disk module consists of a plurality of disks 58 as shown in FIG. 6 , and in the present embodiment, the disk module comprises six disks 58 .
- the case 1 is provided with a slide track at the inner side of the second side wall 11 of the second receiving space 16
- the node module 5 and the disk module are provided with a slideway corresponding to the slide track, for facilitating the arrangement or extraction of the node module 5 in the second receiving space 16 .
- an electrical connection relationship between the shared I/O module 32 and the node module 5 is as shown in FIG. 14 , and the shared I/O module 32 is electrically connected with at least two node modules 5 through a switch module to receive the switch signal when receiving the switch signal, and to cause the shared I/O module 32 to communicate with one node module 5 of the at least two node modules 5 .
- the shared I/O module 32 is electrically connected with at least two node modules 5 through a switch module to receive the switch signal when receiving the switch signal, and to cause the shared I/O module 32 to communicate with one node module 5 of the at least two node modules 5 .
- FIG. 15 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- the two main modules 322 respectively comprise a network card port, a USB port and a video port.
- the first I/O interface 3221 comprises a network card port interface, a USB port interface and a video port interface.
- the USB port and the video port are electrically connected with the node modules 5 through the switch module, used to cause the USB port and the video port to be electrically connected with one node module 5 according to a selection signal when receiving the selection signal.
- the node module 5 comprises a South Bridge chip and a BMC electrically connected with the South Bridge chip, each of the network card ports is electrically connected with the South Bridge chip 55 and the BMC of the corresponding node module 5 respectively, the USB port is electrically connected with the South Bridge chip through the switch module, and the video port interface is electrically connected with the BMC through the switch module.
- the model of the South Bridge chip is, for example, Intel Lewisburg.
- FIG. 16 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- the two main modules 322 respectively comprise a network card port, a USB port, a video port, 1G Ethernet switch, 10G Ethernet switch and a small pluggable optical module.
- the optical module is preferably a quad small form-factor pluggable (QSFP) optical module; the network card port is electrically connected with the 1G Ethernet switch, and the small form-factor pluggable optical module is electrically connected with the 10G Ethernet switch; and the first I/O interface 3221 comprises a network card port interface, a USB port interface, a video port interface and an optical module port interface.
- QSFP quad small form-factor pluggable
- the node module 5 comprises a South Bridge chip 55 , a BMC electrically connected with the South Bridge chip 55 and a physical layer chip electrically connected with the BMC.
- the USB port is electrically connected with the South Bridge chip 55 through the switch module, the video port interface is electrically connected with the BMC through the switch module, and the number of the physical layer chip corresponds to that of the shared I/O unit; the 1G Ethernet switch of each shared I/O unit is electrically connected with the corresponding physical layer chip, and the 10G Ethernet switches of the shared I/O units are all electrically connected with the South Bridge chip.
- the model of the South Bridge chip 55 is, for example, Intel Lewisburg.
- FIG. 17 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.
- the two main modules 322 respectively comprise a network card port, a USB port, a video port, 1G Ethernet switch, a disk port and a disk expander.
- the disk port is a disk expansion port.
- the disk port is preferably a MiniSAS port, the network card port is electrically connected with the 1G Ethernet switch, the disk port is electrically connected with the disk expander, and the first I/O interface further comprises a disk port interface.
- the first I/O interface 3221 comprises a network card port interface, a USB port interface, a video port interface and a disk port interface.
- the node module 5 comprises a South Bridge chip 55 , a BMC electrically connected with the South Bridge chip 55 , a physical layer chip and a disk expansion card; the USB port is electrically connected with the South Bridge chip 55 through the switch module, and the video port interface is electrically connected with the BMC through the switch module, and the number of the physical layer chip corresponds to that of the shared I/O unit; the 1G Ethernet switch of each shared I/O unit is electrically connected with the corresponding physical layer chip, and the disk expanders of the shared I/O units are all electrically connected with the SAS adapter card 56 .
- the model of the South Bridge chip 55 is, for example, Intel Lewisburg.
- the node module 5 comprises the node back-plate 57 , and a disk 58 electrically connected with the second processor 53 through the node back-plate 57 ; in this embodiment, each node module 5 comprises six disks 58 , which are stacked up and down (i.e., a manner of 3*2) in a cavity of the node module 5 .
- the second receiving space 16 is divided into two front-end regions bilaterally symmetrical and having the same shape, that is, a front-end region G and a front-end region H.
- the height of the node module 5 is half of that of the second receiving space 16 , the number of the node module 5 is four, and in the front-end region G and the front-end region H, two node modules 5 are respectively stacked up and down.
- the two front-end regions G and H bilaterally symmetrical are two cavities having the same shape, an inner side of each cavity is provided with two opposite support portions G 1 and H 1 along the direction of the sidewalls, wherein the support portions G 1 and H 1 are in positions of half of the height of the second receiving space 16 , in each of the front-end cavities G and H, two node modules 5 are respectively stacked up and down, wherein one is placed on the bottom plate 11 , and the other end is placed on the support portion G 1 or H 1 .
- corresponding positions of the bottom plate 11 and the support portion G 1 or H 1 can be provided with a sliding-rail structure
- the node modules 5 are preferably provided with pulley structures, which can make the node modules 5 slide into the front-end region G or H or extracted from the front-end region G or H.
- the case 1 is provided with a slide track at the inner side of the second side wall 11 of the second receiving space 16
- the node module 5 and the disk module are provided with a slideway corresponding to the slide track.
- the node modules 5 stacked up and down in the electronic apparatus are replaced with a memory module 6 , to implement the function of storing the server.
- the support unit 59 corresponding to each disk 58 is preferably as shown in FIG. 20 and FIG. 21 , comprising:
- a first support portion 591 which is a plane structure and has a first fixing portion 5911 ;
- a second support portion 592 which is a plane structure, is in the same plane with the first support portion 591 and has a second fixing portion 5921 ; the second support portion 592 , preferably, is further provided with an LED light pipe 5922 in this embodiment, so that the installation position of the disk 58 can be found easily in a darker state; of course, in other embodiments, the LED light pipe 5922 also may be disposed in the first support portion 591 ; and preferably, in this embodiment, around the first fixing portion 5911 and the second fixing portion 5912 is provided vibration-absorptive material, so as to reduce the vibration frequency of the disk during the movement of the electronic apparatus, to protect the safety of the disk;
- a retaining portion 593 which connects the first support portion 591 and the second support portion 592 , to form a U-shaped space, and the retaining portion 593 is perpendicular to the first support portion 591 and the second support portion 592 ; preferably, the retaining portion 593 , the first support portion 591 and the second support portion 592 are an integral structure.
- the disk 58 can be placed at the first support portion 591 and the second support portion 592 , and be fixed to the first fixing portion 5911 and the second fixing portion 5921 by way of screw fixation or weld, etc.
- the support unit 59 abandons the traditional half-surround manner, and reduces transverse space after installation of the disk 58 in the second receiving space 16 , that is, plenty of disks can be installed in a limited space. More preferably, multiple heat-dissipating holes can be disposed on the first support portion 591 and the second support portion 592 , to devote greater efforts to heat dissipation while support of the disk 58 is met.
- the retaining portion 593 is further provided with a hand-held portion 594 outside, the hand-held portion 594 is provided with a lock unit, which is locked into a place or re-locked from the place by its inner spring-like structure, so that the support portion 59 may be flexibly fixed to or extracted from a corresponding position in the second receiving space 16 .
- the electronic apparatus consistent with the present invention integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost.
- the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.
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Abstract
Description
- The present application claims the priority of U.S. 62/195,767 filed Jul. 22, 2015, which application is incorporated herein by reference.
- Field of Invention
- The present invention relates to the communication field, and specifically to an electronic apparatus of high density.
- Description of Related Arts
- With development of communication industry, structural design of communication devices, especially high-density, high-performance design of the devices also has higher requirements, the existing communication devices, in order to implement more functions, often dispose lots of electronic modules in their case, and thus laying out more modules reasonably and neatly in a limited space to increase price performance of products and bring about better experience to users will become a direction of development of the communication devices.
- In view of the shortcomings of the prior art, an object of the present invention is to provide an input/output apparatus and an electronic apparatus, used to solve the problem in the prior art that arrangement of elements inside the electronic apparatus cannot well meet high-density and high-performance characteristics.
- To achieve the foregoing object and other related objects, the present invention provides an electronic apparatus, comprising an input/output unit; the input/output unit comprising: a housing comprising a bottom plate, the housing having a first end along a direction of the bottom plate and a second end opposite the first end; an adapter plate fixed onto the bottom plate, comprising an adapter plate body and an adapter plate inserting portion, the adapter plate body having a first slot and a second slot towards a direction away from the bottom plate, the adapter plate inserting portion being adjacent to the second end of the housing and exposed to the second end, and the adapter plate being electrically connected with an external electronic device through the adapter plate inserting portion; a PCIE card disposed adjacent to the first end and on the adapter plate, comprising a PCIE card body and a PCIE port, the PCIE card body being disposed on the adapter plate along the direction of the adapter plate and perpendicular to the adapter plate, the PCIE card body being inserted to the first slot of the adapter plate through a golden finger, and the PCIE port being located at the first end of the housing; and a fan module disposed adjacent to the second end and on the adapter plate, comprising a fan frame and a fan, the fan being disposed in the fan frame, and the fan module being inserted to the second slot of the adapter plate through a golden finger.
- In one implementation of the present invention, the housing further comprises two sidewalls connecting the bottom plate.
- In one implementation of the present invention, the housing has a first receiving space adjacent to the first end, and a case is provided with a second receiving space adjacent to the second end; the PCIE card is disposed in the first receiving space, and the fan module is disposed in the second receiving space.
- In one implementation of the present invention, the fan module is fixed with the two sidewalls through screws.
- In one implementation of the present invention, the number of the PCIE card is 3.
- In one implementation of the present invention, the input/output apparatus further comprises an upper cover, used to partially cover the PCIE card.
- In one implementation of the present invention, the number of the fan module is two, and one of the two fan modules is a fan module that provides redundant backup.
- In one implementation of the present invention, the housing is provided with a snap structure adjacent to the first end, used to be in a snap connection with an external device.
- In one implementation of the present invention, the electronic apparatus is a server.
- In one implementation of the present invention, the size of the electronic apparatus is 2 U.
- As stated above, the electronic apparatus consistent with the present invention integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost. Moreover, the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit.
-
FIG. 1 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention. -
FIG. 2 is a rear view ofFIG. 1 . -
FIG. 3 is a front view ofFIG. 1 . -
FIG. 4 is a schematic view of the whole structure of a case in a specific embodiment of the present invention. -
FIG. 5 is a schematic structural view of a first end portion side of the case shown inFIG. 4 . -
FIG. 6 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention. -
FIG. 7 is a schematic structural view of a node I/O module in a specific embodiment of the present invention. -
FIG. 8 is a schematic disassembled view of the node I/O module shown inFIG. 7 . -
FIG. 9 is a front view of the node I/O module shown inFIG. 7 . -
FIG. 10 is a schematic structural view of a shared I/O module in a specific embodiment of the present invention. -
FIG. 11 is a disassembled view of the shared I/O module shown inFIG. 10 . -
FIG. 12 is a schematic structural view of a back plate in a specific embodiment of the present invention. -
FIG. 13 is a disassembled view of the back plate shown inFIG. 12 . -
FIG. 14 is a schematic modular view of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. -
FIG. 15 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. -
FIG. 16 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. -
FIG. 17 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. -
FIG. 18 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention. -
FIG. 19 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention. -
FIG. 20 is a schematic structural view of a disk support portion in a specific embodiment of the present invention. -
FIG. 21 is a schematic structural view showing that the disk support portion shown inFIG. 20 is used to assemble a disk. -
-
- 1 case
- 11 sidewall
- 12 bottom plate
- 13 first end
- 14 second end
- 15 first receiving space
- A, B, C, D, E, F rear-end region
- 16 second receiving space
- G, H front-end region
- G1, H1 support portion
- 17 upper cover
- 2 back plate
- 21 first insertion and extraction portion
- 22 second insertion and extraction portion
- 23 first air vent
- 24 second air vent
- 3 I/O module
- 31 node I/O module
- 311 housing
- 3111 sidewall
- 3112 bottom plate
- 3113 first end
- 3114 second end
- 3115 first receiving space
- 3116 second receiving space
- 3117 top plate
- 312 PCIE card
- 3121 PCIE card body
- 3122 PCIE port
- 313 fan unit
- 3131 fan frame
- 3132 fan
- 32 shared I/O module
- 321 housing
- 3211 sidewall
- 3212 top plate
- 3213 bottom plate
- 3214 first end
- 3215 second end
- 322 main module
- 3221 first I/O interface
- 3222 second I/O interface
- 323 fan unit
- 3231 fan frame
- 3232 fan
- 4 power supply module
- 5 node module
- 51 mainboard
- 52 first processor
- 53 second processor
- 54 memory module
- 55 South Bridge chip
- 56 SAS adapter card
- 57 node back-plate
- 58 disk
- 59 support unit
- 591 first support portion
- 5911 first fixing portion
- 592 second support portion
- 5921 second fixing portion
- 5922 LED light pipe
- 593 retaining portion
- 594 hand-held portion
- Implementations of the present invention are described below through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention according to the contents disclosed in the specification.
- Please refer to
FIG. 1 toFIG. 20 . It should be known that the structures, scales, sizes and the like drawn in the drawings of the specification are merely used to match the contents disclosed in the specification for understanding and reading of those skilled in the art, but are not used to limit limited conditions under which the present invention can be implemented, and thus do not have technical substantive meanings, and any structural modification, change in the proportional relationship or size adjustment should fall within the scope that the technical contents disclosed in the present invention can cover without affecting the effects and objects that can be achieved by the present invention. At the same time, the terms such as “up”, “down”, “left”, “right”, “middle” and “a/an” used in the specification are merely intended to facilitate clear statement, but are not used to limit the scope in which the present invention can be implemented, and change or adjustment of the relative relationship thereof should be regarded as the category in which the present invention can be implemented if the technical contents are not essentially changed. - In actual applications, the electronic apparatus consistent with the present invention, for example, is an OTT (Over The Top) high-density server, which preferably uses a 2 U case, “U” of the server is a unit that indicates an external size of the server, and is an abbreviated form of unit, and a detailed size is decided by American electronics industries association (EIA) that serves as an industry group. The reason for specifying the size of the server is to make the server keep a suitable size to be placed on an iron or aluminum rack. The rack has a screw hole that fixes the server, which is aligned with a screw hole of the server, and is fixed with a screw. The specified size is the width (48.26 cm=19 inches) and height (a multiple of 4.445 cm) of the server. As the width is 19 inches, racks that meet such a specification are also called “19-inch racks” sometimes. The thickness takes 4.445 cm as a basic unit. 1 U is 4.445 cm, and 2 U is double 1 U, that is, 8.89 cm (and so on). That is to say, the so-called “1 U server” is a product whose shape meets EIA specifications and thickness is 4.445 cm. Products designed to be capable of being placed to a 19-inch cabinet are generally called rack servers. Certainly, in actual applications, the size of the electronic apparatus consistent with the present invention is not limited thereto, and electronic apparatuses with other size specifications also apply to the technical solution of the present invention.
- Referring to
FIG. 1 ,FIG. 1 is a schematic structural view of an electronic apparatus in a specific embodiment of the present invention. The electronic apparatus comprises acase 1, aback plate 2, at least one I/O (input/output)module 3, at least onepower supply module 4 and at least onenode module 5.FIG. 2 is a rear view of the electronic apparatus shown inFIG. 1 , andFIG. 3 is a front view of the electronic apparatus shown inFIG. 1 . - In combination with
FIG. 4 , which is a schematic structural view of a case of the present invention in a specific embodiment, thecase 1 comprises twosidewalls 11 and a bottom plate 12 connecting the twosidewalls 11, thesidewalls 11 and the bottom plate 12 can be fixedly connected through screws or snaps or may be an integral structure, thecase 1 has a first end 13 along a direction of thesidewalls 11 and asecond end 14 opposite the first end, the case has afirst receiving space 15 adjacent to the first end 13, and the case has asecond receiving space 16 adjacent to thesecond end 14. Thefirst receiving space 15 is used to receive the I/O module 3 and thepower supply module 4, wherein thefirst receiving space 15 is divided into multiple rear-end regions having the same height and arranged side by side, and each of the rear-end regions is used to receive at least one I/O module 3 or at least onepower supply module 4. In this embodiment, for example, in combination withFIG. 5 , the rear-end region is divided into 6 regions, which are respectively a rear-end region A, a rear-end region B, a rear-end region C, a rear-end region D, a rear-end region E and a rear-end region F. Thesecond receiving space 16 is used to receive thenode module 5, wherein thesecond receiving space 16 is further divided into multiple front-end regions, and each of the front-end regions is provided with at least onenode module 5. Moreover, in combination withFIG. 4 , thesecond receiving space 16 is divided into two front-end regions G and a front-end region H, the front-end regions G and the front-end region H can accommodate twonode modules 5 stacked respectively. - Moreover, in actual applications, the
case 1 of a finished electronic apparatus further comprises anupper cover 17, theupper cover 17 is an integral structure, disposed, opposite the bottom plate 12, to the top of the electronic apparatus, or as in this embodiment, theupper cover 17 comprises two parts, that is, a front upper cover that covers thesecond receiving space 16 and theback plate 2 and a rear upper cover that covers thefirst receiving space 15, and the two parts cover can be fixedly connected through corresponding screw holes. - The
back plate 2 is disposed, perpendicular to the twosidewalls 11, between thefirst receiving space 15 and thesecond receiving space 16, and in combination withFIG. 6 (FIG. 6 is a schematic structural view of the electronic apparatus ofFIG. 1 whose upper cover has been removed), has a first insertion andextraction portion 21 towards thefirst receiving space 15 and a second insertion andextraction portion 22 towards thesecond receiving space 16, preferably, the first insertion andextraction portion 21 and the second insertion andextraction portion 22 are, for example, high-speed back plate connectors, or for example, may be slots, used to match a golden finger and make electrical connections, and such design can avoid use of a tool and can also make the interior of thecase 1 much cleaner and neater. Theback plate 2 can make individual electrical modules (the I/O module 3, thepower supply module 4 and the node module 5) disposed in thefirst receiving space 15 and thesecond receiving space 16 connected with each other, equivalent to a bridge, so that the electrical modules can cooperate with each other, to implement particular electrical functions. - The I/
O module 3 has an I/O module assembling portion, and is pluggably electrically connected to the first insertion andextraction portion 21 of theback plate 2, and the I/O module assembling portion is preferably a golden finger structure or a back plate connector electrically connected with the first insertion andextraction portion 21 of the back plate of the slot structure. - The
power supply module 4 has a power supply module assembling portion, and is pluggably electrically connected to the first insertion andextraction portion 21 of theback plate 2, used to supply power of the electronic apparatus. In this embodiment, preferably, the number of thepower supply module 4 is two, one of the twopower supply modules 4 is apower supply module 4 that provides redundant backup, and the twopower supply modules 4 are stacked into one of the rear-end regions. Preferably, thepower supply modules 4 supply power for other electrical components in the electrical apparatus through the back plate, and more preferably, thepower supply modules 4 communicate with the other electrical components in the electrical apparatus through a I2C bus. - The power supply module assembling portion is preferably a golden finger structure and electrically connected with the first insertion and extraction portion of the back plate of the slot structure.
- In a specific embodiment of the present invention, the I/
O module 3 preferably comprises a node I/O module 31 and a shared I/O module 32. - Wherein, each node I/
O module 31 is electrically connected with thenode module 5 through theback plate 2, and specific reference can be made toFIG. 7 ,FIG. 8 andFIG. 9 for the structure of the node I/O module 31, and the node I/O module 31 comprises: - a housing 311 comprising two sidewalls 3111 and a bottom plate 3112 connecting the two sidewalls 3111, the housing 311 having a
first end 3113 along a direction of the two sidewalls 3111 and asecond end 3114 opposite thefirst end 3113, the housing 311 having a first receiving space 3115 adjacent to thefirst end 3113, and the housing 311 having asecond receiving space 3116 adjacent to thesecond end 3114; in this embodiment, the housing 311 further comprises a top plate 3117 that covers part of the first receiving space 3115, the top plate 3117 mainly plays a role of protecting electronic elements received in the first receiving space 3115, and in other specific embodiments, the size of the top plate 3117 may be shorter or longer, or the top plate 3117 may be omitted. - an adapter plate (not shown) disposed in the housing 311, fixed, parallel to the bottom plate 3112, onto the bottom plate 3112, and comprising an adapter plate body and an adapter plate inserting portion, the adapter plate body having a first slot and a second slot towards a direction away from the bottom plate 3112, the adapter plate inserting portion being adjacent to the
second end 3114 of the housing 311 and exposed to thesecond end 3114, and the adapter plate being electrically connected with the first insertion andextraction portion 21 of theback plate 2 through the adapter plate inserting portion. - a PCIE card 312 disposed in the first receiving space 3115, comprising a PCIE card body 3121 and a PCIE port 3122, the PCIE port is a
PCIE 10 port in specific application, the PCIE card body 3121 being disposed parallel to the sidewalls 3111 and perpendicular to the bottom plate 3112, the PCIE card body 3121 being inserted to the first slot of the adapter plate through a golden finger, and the PCIE port 3122 being located at thefirst end 3113 of the housing 311; in this embodiment, the number of the PCIE card 312 is preferably 3. - a fan unit 313 disposed in the
second receiving space 3116; in this embodiment, the number of the fan unit is two, and one of the two fan units 313 is a fan unit 313 that provides redundant backup. The fan unit 313 comprises a fan frame 3131 and afan 3132, thefan 3132 is disposed in the fan frame 3131, and the fan unit 313 is inserted to the second slot of the adapter plate through a connector, wherein the connector is preferably a golden finger or a wirecable. Thefan 3132 is a hot plug structure. Moreover, with modular design of the node I/O module 31, when it is necessary to replace the fan unit 313 or repair the fan unit 313, it is feasible to directly take out the node I/O module 31 from the receiving space without removing the housing of the server case (most fans in the existing server case need to open the top cover in the case of maintenance or replacement), so operations are convenient and maintenance efficiency is increased. The fan unit 313 can be fixed to the housing 311 through screws. - In another specific embodiment, the node I/O module may be a drawer-type structure, the two sidewalls may be omitted, and the fan unit 313 is directly fixed onto the adapter plate.
- The shared I/
O module 32 is selectively electrically connected with onenode module 5 through theback plate 2; preferably, the electronic apparatus further comprises a switch module, used to, according to a switch signal, cause the shared I/O module 32 to communicate with one of thenode modules 5. For example, the switch module is a toggle button (for example, a toggle button controlled by a mouse or a keyboard), thenode module 5 that communicates with the shared I/O module 32 is switched by pressing the button, or thenode module 5 that communicates with the shared I/O module 32 is switched according to a remote network control signal. Specific reference can be made toFIG. 10 andFIG. 11 for the structure of the shared I/O module 32, which comprises: - a
housing 321 comprising twosidewalls 3211, and atop plate 3212 and abottom plate 3213 connecting the twosidewalls 3211, thehousing 321 having afirst end 3214 along a direction of the twosidewalls 3211 and asecond end 3215 opposite thefirst end 3214; - two main modules (two shared I/O units) 322 respectively disposed on inner side surfaces of the
top plate 3212 and thebottom plate 3213 of thehousing 321 and form a receiving space with the twosidewalls 3211 of thehousing 321, that is, the thickness of one end of the main modules 322 is less than that of the other end, and such design can form the receiving space on the side with less thickness, used to receive fans and other units, which can maximize use of the space. Each main module 322 comprises a first I/O interface 3221 connected with an external device and a second I/O interface 3222 electrically connected with one of the at least twonode modules 5; the first I/O interface 3221, for example, comprises one or more combinations of a USB port interface, a VGA port interface and a network port interface, and the two main modules 322 are mutual redundancy design. - a
fan unit 323 received in the receiving space, comprising afan frame 3231 and afan 3232, thefan 3232 being disposed in thefan frame 3231. Thefan 3232 is a hot plug structure. Moreover, with modular design of the shared I/O module 32, when it is necessary to replace thefan unit 323 or repair thefan unit 323, it is feasible to directly take out the shared I/O module 32 from the receiving space without removing the housing of the server case (most fans in the existing server case need to open the top cover in the case of maintenance or replacement), so operations are convenient and maintenance efficiency is increased, which, while ensuring that the temperature of the case reaches the standard, makes the fan unit assembled and disassembled conveniently and easy to maintain. - Moreover, heat dissipation of the server case has relative great influence on ensuring efficient operation thereof, herein, in combination with schematic structural views of the
back plate 2, i.e.,FIG. 12 andFIG. 13 , theback plate 2 is provided with an air vent, and the air vents correspond to the fan unit 313 of the node I/O module 31, thefan unit 323 of the shared I/O module 32 and elements to be cooled, to cause the air vents to cooperate with thefan units 313 and 323 and the elements to be cooled, to form an air flow channel. Theback plate 2 is transversely opened with multiple evenly-distributed first air vents 23 corresponding to the fan unit 313 of the node I/O module 31 and second air vents 24 corresponding to thefan unit 323 of the shared I/O module 32, the arrangement of the first air vents 23 and the second air vents 24 can make air flows of the fan unit 313 and thefan unit 323 more flow towards units to be cooled (for example, processors and DDRs) on thenode module 5, and sockets on theback plate 2 are reasonably disposed on two sides of the first air vents 23 and the second air vents 24, that is, cooling demands of the server case can be met in the event that reasonable arrangement of the sockets on theback plate 2 is ensured. Preferably, in the figure, the first air vent 23 is of evenly-distributed strip-type holes, and the second air vent 24 is of rectangle holes. - In one implementation of the present invention, heights of the node I/
O module 31, the shared I/O module 32 and thepower supply module 4 are preferably the same as that of the rear-end regions, and their lengths correspond to that of the rear-end regions, so that more modules can be laid out in a limited case space; specifically, the node I/O module 31, the shared I/O module 32 and thepower supply module 4 are respectively received in one corresponding rear-end region, and there are an even number of node I/O modules 31, which are bilaterally symmetrically disposed in the corresponding rear-end regions relative to the shared I/O module 32. In order to accommodate all the node I/O modules 31, the shared I/O module 32 and thepower supply module 4, the number of the rear-end regions is preferably an even number greater than or equal to 4. - Specifically, for example, the number of the node I/
O module 31 is four, the number of the shared I/O module 32 is one, and the node I/O modules 31, the shared I/O module 32 and thepower supply module 4 are disposed in the rear-end regions from left to right or from right to left in a sequence as follows: thepower supply module 4, two node I/O modules 31, the shared I/O module 32, two node I/O modules 31. That is, in combination withFIG. 1 ,FIG. 2 andFIG. 3 , thepower supply module 4 is disposed in the rear-end region F, thepower supply module 4 comprises two power supply units which are mutually redundant and stacked in the rear-end region F, the shared I/O module 32 is disposed in the rear-end region C, and the node I/O modules 31 are respectively disposed in the rear-end regions A, B, D and E, and comprise fournode modules 5 each two of which are stacked in thesecond receiving space 16. - The shared I/
O module 32 is placed in the middle, to make distances from signals of thenode modules 5 in thesecond receiving space 16 of the electronic apparatus to the shared I/O module 32 basically the same and ensure symmetry of performance of signal transmission, and the four node I/O modules 31 are disposed on two sides of the shared I/O module 32, to make distances from the signals of thenode modules 5 in thesecond receiving space 16 of the electronic apparatus to the corresponding node I/O modules 31 equal and ensure symmetry of performance of signal transmission. - Moreover, in this embodiment, more preferably, lengths of the
power supply module 4, the shared I/O module 32 and the node I/O modules 31 are basically the same, in terms of height, the height of thepower supply module 4 and the shared I/O module 32 is basically half of the receiving height of thefirst receiving space 15, and the height of the node I/O modules 31 is basically the same as the receiving height of thefirst receiving space 15, to maximize space utilization in thefirst receiving space 15 of the case of the electronic apparatus, and such length and height setting shares a front-end module partition to the maximum possible extent, thus achieving the effect of cost reduction. - Please refer to
FIG. 2 , the port interface of the I/O module 3 and the port interface of thepower supply module 4 are at the first end 13. That is, the port interface of the I/O module 3, as shown inFIG. 7 , the PCIE port of the PCIE card, is at the first end 13, and the port interface of the shared I/O module 32 comprises a USB port, a VGA port and a network port, which are also at the first end 13, and in another specific embodiment, the port of the shared I/O module 32 may also be of other port type. More preferably, designing the shared I/O module 32 matching different port types can make replacement according to application requirements. - Herein, refer to
FIG. 6 , thenode module 5 has a node module assembling portion, is pluggably electrically connected to the second insertion andextraction portion 22 of theback plate 2, and communicates with the corresponding I/O module (the node I/O module 31 or the shared I/O module 32) through theback plate 2. - The
node module 5 comprises amainboard 51 as shown in theFIG. 6 , themainboard 51 comprises a first electrical connection portion (not shown) and a second electrical connection portion (not shown), and the first electrical connection portion can be electrically connected with electrical modules (a node I/O module 31, a shared I/O module 32 and a power supply module 4) in thefirst receiving space 15 through theback plate 2. The second electrical connection portion is electrically connected with a plurality of expansion disks through an anode back-plate 57 of thenode module 5. Thenode module 5 further comprises two processors (CPUs) disposed at the mainboard along the node length direction, which are respectively afirst processor 52 and asecond processor 53, thefirst processor 52 and thesecond processor 53 are electrically connected and disposed on themainboard 51, to form a dual-processor, and the model of thefirst processor 52 and thesecond processor 53 is, for example, Skylake; the processors have great heat productivity during operation, therefore, heat sinks are disposed on the top of thefirst processor 52 and thesecond processor 53, thefirst processor 52 is provided with amemory module 54 electrically connected with thefirst processor 52 respectively along two sides of the width direction of thenode module 5, which are disposed on the mainboard, in this embodiment, eachmemory module 54 is selected to comprise 6 DDRs (Double Data Rate, double data rate synchronous dynamic random memory), so, the first processor is electrically connected with 12 DDRs. In another embodiment, a heat sink is correspondingly disposed above eachmemory module 54 as desired; thesecond processor 53 is provided with amemory module 54 electrically connected with the second processor 23 along two sides of the width direction of thenode module 5, which are disposed on themainboard 51, in this embodiment, eachmemory module 54 is selected to comprise 6 DDRs (Double Data Rate, double data rate synchronous dynamic random memory), so, thesecond processor 53 is electrically connected with 12 DDRs and a heat sink is correspondingly disposed above eachmemory module 54. Thenode module 5 is provided with aSouth Bridge chip 55 and a BMC (not shown) (Baseboard Management Controller) near the first electrical connection portion on themainboard 51, and in this embodiment, thefirst processor 52 directly communicates with the PCIE card of the corresponding node I/O module 31, and the number of the PCIE card of the corresponding node I/O module 31 is preferably 3. Thefirst processor 52 is electrically connected with the shared I/O module 32 through theSouth Bridge chip 55 and the BMC. Thenode module 5 is also provided with a disk module and according to the specific configuration condition of the disk module, thesecond processor 53 is directly electrically connected with the disk module, or is electrically connected with the disk module through aSAS adapter card 56 as shown inFIG. 6 . In the present embodiment, the type of theSAS adapter card 56 is SAS3008 produced by LSI company. In actual application, the disk module consists of a plurality ofdisks 58 as shown inFIG. 6 , and in the present embodiment, the disk module comprises sixdisks 58. Preferably, thecase 1 is provided with a slide track at the inner side of thesecond side wall 11 of thesecond receiving space 16, thenode module 5 and the disk module are provided with a slideway corresponding to the slide track, for facilitating the arrangement or extraction of thenode module 5 in thesecond receiving space 16. - In the present invention, an electrical connection relationship between the shared I/
O module 32 and thenode module 5 is as shown inFIG. 14 , and the shared I/O module 32 is electrically connected with at least twonode modules 5 through a switch module to receive the switch signal when receiving the switch signal, and to cause the shared I/O module 32 to communicate with onenode module 5 of the at least twonode modules 5. Specifically: - In one specific embodiment, referring to
FIG. 15 ,FIG. 15 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively comprise a network card port, a USB port and a video port. The first I/O interface 3221 comprises a network card port interface, a USB port interface and a video port interface. The USB port and the video port are electrically connected with thenode modules 5 through the switch module, used to cause the USB port and the video port to be electrically connected with onenode module 5 according to a selection signal when receiving the selection signal. Thenode module 5 comprises a South Bridge chip and a BMC electrically connected with the South Bridge chip, each of the network card ports is electrically connected with theSouth Bridge chip 55 and the BMC of thecorresponding node module 5 respectively, the USB port is electrically connected with the South Bridge chip through the switch module, and the video port interface is electrically connected with the BMC through the switch module. The model of the South Bridge chip is, for example, Intel Lewisburg. - In another specific embodiment, referring to
FIG. 16 ,FIG. 16 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively comprise a network card port, a USB port, a video port, 1G Ethernet switch, 10G Ethernet switch and a small pluggable optical module. The optical module is preferably a quad small form-factor pluggable (QSFP) optical module; the network card port is electrically connected with the 1G Ethernet switch, and the small form-factor pluggable optical module is electrically connected with the 10G Ethernet switch; and the first I/O interface 3221 comprises a network card port interface, a USB port interface, a video port interface and an optical module port interface. Thenode module 5 comprises aSouth Bridge chip 55, a BMC electrically connected with theSouth Bridge chip 55 and a physical layer chip electrically connected with the BMC. The USB port is electrically connected with theSouth Bridge chip 55 through the switch module, the video port interface is electrically connected with the BMC through the switch module, and the number of the physical layer chip corresponds to that of the shared I/O unit; the 1G Ethernet switch of each shared I/O unit is electrically connected with the corresponding physical layer chip, and the 10G Ethernet switches of the shared I/O units are all electrically connected with the South Bridge chip. The model of theSouth Bridge chip 55 is, for example, Intel Lewisburg. - In another specific embodiment, referring to
FIG. 17 ,FIG. 17 is a schematic view of a principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively comprise a network card port, a USB port, a video port, 1G Ethernet switch, a disk port and a disk expander. In specific application, the disk port is a disk expansion port. The disk port is preferably a MiniSAS port, the network card port is electrically connected with the 1G Ethernet switch, the disk port is electrically connected with the disk expander, and the first I/O interface further comprises a disk port interface. The first I/O interface 3221 comprises a network card port interface, a USB port interface, a video port interface and a disk port interface. Thenode module 5 comprises aSouth Bridge chip 55, a BMC electrically connected with theSouth Bridge chip 55, a physical layer chip and a disk expansion card; the USB port is electrically connected with theSouth Bridge chip 55 through the switch module, and the video port interface is electrically connected with the BMC through the switch module, and the number of the physical layer chip corresponds to that of the shared I/O unit; the 1G Ethernet switch of each shared I/O unit is electrically connected with the corresponding physical layer chip, and the disk expanders of the shared I/O units are all electrically connected with theSAS adapter card 56. The model of theSouth Bridge chip 55 is, for example, Intel Lewisburg. - Referring to
FIG. 6 again, thenode module 5 comprises the node back-plate 57, and adisk 58 electrically connected with thesecond processor 53 through the node back-plate 57; in this embodiment, eachnode module 5 comprises sixdisks 58, which are stacked up and down (i.e., a manner of 3*2) in a cavity of thenode module 5. - In one implementation of the present invention, in combination with
FIG. 4 , thesecond receiving space 16 is divided into two front-end regions bilaterally symmetrical and having the same shape, that is, a front-end region G and a front-end region H. The height of thenode module 5 is half of that of thesecond receiving space 16, the number of thenode module 5 is four, and in the front-end region G and the front-end region H, twonode modules 5 are respectively stacked up and down. - In specific applications, preferably, the two front-end regions G and H bilaterally symmetrical are two cavities having the same shape, an inner side of each cavity is provided with two opposite support portions G1 and H1 along the direction of the sidewalls, wherein the support portions G1 and H1 are in positions of half of the height of the
second receiving space 16, in each of the front-end cavities G and H, twonode modules 5 are respectively stacked up and down, wherein one is placed on thebottom plate 11, and the other end is placed on the support portion G1 or H1. More preferably, in another specific embodiment, corresponding positions of thebottom plate 11 and the support portion G1 or H1 can be provided with a sliding-rail structure, thenode modules 5 are preferably provided with pulley structures, which can make thenode modules 5 slide into the front-end region G or H or extracted from the front-end region G or H. Or, preferably, thecase 1 is provided with a slide track at the inner side of thesecond side wall 11 of thesecond receiving space 16, thenode module 5 and the disk module are provided with a slideway corresponding to the slide track. - In another specific embodiment, for example, referring to
FIG. 18 andFIG. 19 , thenode modules 5 stacked up and down in the electronic apparatus are replaced with a memory module 6, to implement the function of storing the server. - Moreover, preferably, the
support unit 59 corresponding to eachdisk 58 is preferably as shown inFIG. 20 andFIG. 21 , comprising: - a
first support portion 591, which is a plane structure and has afirst fixing portion 5911; - a
second support portion 592, which is a plane structure, is in the same plane with thefirst support portion 591 and has asecond fixing portion 5921; thesecond support portion 592, preferably, is further provided with anLED light pipe 5922 in this embodiment, so that the installation position of thedisk 58 can be found easily in a darker state; of course, in other embodiments, theLED light pipe 5922 also may be disposed in thefirst support portion 591; and preferably, in this embodiment, around thefirst fixing portion 5911 and the second fixing portion 5912 is provided vibration-absorptive material, so as to reduce the vibration frequency of the disk during the movement of the electronic apparatus, to protect the safety of the disk; - a retaining
portion 593, which connects thefirst support portion 591 and thesecond support portion 592, to form a U-shaped space, and the retainingportion 593 is perpendicular to thefirst support portion 591 and thesecond support portion 592; preferably, the retainingportion 593, thefirst support portion 591 and thesecond support portion 592 are an integral structure. - The
disk 58 can be placed at thefirst support portion 591 and thesecond support portion 592, and be fixed to thefirst fixing portion 5911 and thesecond fixing portion 5921 by way of screw fixation or weld, etc. - The
support unit 59 abandons the traditional half-surround manner, and reduces transverse space after installation of thedisk 58 in thesecond receiving space 16, that is, plenty of disks can be installed in a limited space. More preferably, multiple heat-dissipating holes can be disposed on thefirst support portion 591 and thesecond support portion 592, to devote greater efforts to heat dissipation while support of thedisk 58 is met. - In the present embodiment, as shown in
FIGS. 20 and 21 , the retainingportion 593 is further provided with a hand-heldportion 594 outside, the hand-heldportion 594 is provided with a lock unit, which is locked into a place or re-locked from the place by its inner spring-like structure, so that thesupport portion 59 may be flexibly fixed to or extracted from a corresponding position in thesecond receiving space 16. - To sum up, the electronic apparatus consistent with the present invention integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost. Moreover, the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.
- The embodiments merely exemplarily describe the principle and effects of the present invention, but are not to limit the present invention. Any person skilled in the art can make modifications and variations to the embodiments without departing from the spirit and category of the present invention. Therefore, all modifications or variations completed by those with ordinary skill in the art without departing from the spirit and technical thoughts disclosed by the present invention should be covered by the claims of the present invention
Claims (10)
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- 2016-01-19 US US15/000,779 patent/US20170023988A1/en not_active Abandoned
- 2016-01-19 US US15/000,936 patent/US10191520B2/en active Active
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US10362708B2 (en) * | 2017-09-06 | 2019-07-23 | Facebook, Inc. | Fan cartridge |
WO2022025731A1 (en) * | 2020-07-31 | 2022-02-03 | 엘지이노텍 주식회사 | Power module |
Also Published As
Publication number | Publication date |
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US9568961B1 (en) | 2017-02-14 |
US10191520B2 (en) | 2019-01-29 |
US20170023988A1 (en) | 2017-01-26 |
US20170027073A1 (en) | 2017-01-26 |
US9817450B2 (en) | 2017-11-14 |
US20170024347A1 (en) | 2017-01-26 |
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