TWI634831B - Power supply module with better heat dissipation effect - Google Patents

Abstract

A power supply module having a heat dissipation effect, comprising: a frame having an opening and an accommodating space connected to the opening; and at least one mounting area inserted from the opening and disposed in the accommodating space And a power supply of the heat dissipation section extending from the opening toward the outside of the opening, wherein the power supply is disposed in the heat dissipation section with a plurality of heat dissipation holes, so that a gas can enter the power supply from the output end Forming thermal convection with the heat dissipation holes to form a heat dissipation effect on the power supply.

Description

Power supply module with better heat dissipation effect

The invention relates to a power supply module, in particular to a power supply module with better heat dissipation effect.

The power supply module, such as the Patent No. I536711 of the Republic of China, is a patent case previously filed by the applicant, and discloses a "redundant power supply module" comprising a chassis, a power integrated backplane, and a plurality of power supply modes. Group and a power modulation module. The chassis has a mounting space and defines a first mounting area and a second mounting area. The power integration backplane is disposed in the installation space, the power supply modules are disposed in the first installation area and connected to the power integration backplane, and the power modulation module is disposed in the second installation area and connected to the power Integrated backplane. After the power supply module is started, a working power is outputted to the power integrated backplane, and the power modulation module obtains the working power from the power integrated backplane, and the modulated output generates an auxiliary working power output to the power integrated back The board allows the power integrated backplane to supply the working power and the auxiliary working power to an external device, thereby simplifying the maintenance of the modular redundant power supply, and modularizing the design The personnel must select the required power conversion module according to the implementation requirements. As shown in FIG. 1, the power supply 20a is completely covered in the chassis 10a. Therefore, in order to increase the heat dissipation effect of the power supply 20a, a cooling fan 50a is disposed on the front end of the power supply 20a. The heat energy that operates inside the power supply 20a is discharged outward through the heat dissipation fan 50a.

In order to solve the heat dissipation problem of the power supply, as disclosed in the U.S. Patent No. 6,246,580, a "POWER SUPPLY FOR COMPUTER SYSTEM" is disclosed in which a power supply is provided in a rack, and the rack is completely equipped with the power supply. The cover is only for one hand to protrude from the outside of the frame, so that the power supply can only discharge the heat generated by the operation through the plurality of heat dissipation holes disposed in the front.

As shown in FIG. 2, the power supply 20b is provided with a heat dissipation hole 21b in front of the power supply 20b, and a plurality of heat dissipation holes 21b are disposed in front of the power supply 20b. The electrical connector 40b electrically connected to an external power source causes the reserved area of the heat dissipation hole 21b to be limited, so that the power supply 20b is provided when the at least one cooling fan 50b disposed inside the power supply 20b is operated. The heat energy generated inside is discharged to the outside through the heat dissipation holes 21b to achieve the purpose of heat dissipation.

However, since the power supply 20b is generally provided with a rectifying and filtering unit, a power factor correcting unit, a secondary rectifying and filtering unit, a transformer, a pulse width control unit and the like, the space inside the power supply 20b becomes When the heat-dissipating fan 50b is operated to generate an airflow through the components, the airflow cannot be smoothly discharged directly through the heat dissipation holes 21b, so that part of the heat energy is accumulated behind the electrical connector 40b. The accumulated thermal energy is likely to cause damage to the electrical connector 40b over time, and more likely to cause burnt of the electrical connector 40b.

In addition, as disclosed in U.S. Patent No. 2017027073 and the Republic of China Publication No. 201208550, in order to improve the heat dissipation effect of the overall power supply module, a plurality of heat dissipation holes are formed in the frame to increase the heat dissipation effect of the power supply. However, the power supply is disposed inside the rack and is disposed on the rack The heat dissipation holes are not able to directly enter the power supply to generate heat convection and direct the heat energy, which has a limited heat dissipation effect for improving the power supply.

In view of this, the main object of the present invention is to provide a power supply module with better heat dissipation effect.

According to the above object, the present invention provides a power supply module having a better heat dissipation effect, comprising a frame and at least one power supply. The frame has an opening and an accommodating space connected to the opening. The power supply has an input external to the opening of the frame for an external power connection and having a plurality of front heat dissipation holes, an output terminal located in the accommodation space for a power integrated backplane connection, and a connection a body portion between the input end and the output end, the body portion is divided into an assembly section inserted from the opening and disposed in the accommodating space and connected to the output end, and an opening from the opening toward the opening a heat dissipation section extending between the assembly section and the input end, wherein the body portion includes a top plate disposed with the plurality of upper heat dissipation holes in the heat dissipation section, opposite to the top plate and spaced apart from each other a bottom plate having a plurality of lower heat dissipation holes and two side plates respectively disposed on the two sides of the top plate and the bottom plate to connect the top plate and the bottom plate, and each of the side plates is disposed with a plurality of side heat dissipation holes in the heat dissipation portion a hole, a gas can enter the power supply from the output end, and the upper heat dissipation holes, the lower heat dissipation holes, the side heat dissipation holes, and the front heat dissipation holes are formed Convection, the cooling effect to form a power supply.

In one embodiment, each of the side panels further includes an upper side panel connected to the top panel and a lower side panel connected to the bottom panel, and the side heat dissipation holes are distributed on the upper side panel and the lower side panel.

In an embodiment, the input terminal further includes a power connector for electrically connecting the external power source.

In an embodiment, the input end is further provided with a handle for holding the power supply to perform a plug-in state on the rack.

In an embodiment, the power supply further includes a heat dissipating fan disposed in the body portion to introduce the gas from the output end and guide the gas toward the heat dissipating portion.

With the above technical solution, the present invention can effectively achieve the following beneficial effects as compared with the prior art: the present invention mainly provides the upper heat dissipation holes, the lower heat dissipation holes and the side heat dissipation holes through the power supply device. The heat dissipating portion protrudes from the outside of the opening of the frame, so that the gas can enter the power supply from the output end, and the upper heat dissipation holes, the lower heat dissipation holes, The side heat dissipation holes and the front heat dissipation holes form a heat convection to form a heat dissipation effect on the power supply, so that the power supply module of the present invention has a better heat dissipation effect.

(Preferred technical symbol description)

10a‧‧‧Chassis

20a‧‧‧Power supply

50a‧‧‧ cooling fan

20b‧‧‧Power supply

21b‧‧‧ vents

40b‧‧‧Electrical connector

50b‧‧‧ cooling fan

(Illustration of the symbol of the present invention)

10‧‧‧Rack

11‧‧‧ openings

12‧‧‧ accommodating space

20‧‧‧Power supply

21‧‧‧ input

211‧‧‧ front vent

22‧‧‧ Output

23‧‧‧ Body Department

231‧‧‧ top board

232‧‧‧floor

233‧‧‧ side panels

234‧‧‧Upper vent

235‧‧‧low vents

236‧‧‧ side vents

237‧‧‧Upper side panel

238‧‧‧ lower side panel

24‧‧‧ Assembly section

25‧‧‧Heat section

30‧‧‧Hands

40‧‧‧Power connector

50‧‧‧ cooling fan

1 is a schematic diagram of a conventional power supply module.

2 is a schematic diagram of another conventional power supply.

Figure 3 is a perspective view of the present invention.

Figure 4 is an exploded perspective view of the present invention.

Figure 5 is a perspective view of another perspective of the present invention.

Figure 6 is a schematic plan view of the side of the present invention.

Figure 7 is a schematic view of the path of the airflow through the power supply of the present invention.

The detailed description and the technical content of the present invention are as follows with reference to the following drawings: Referring to FIG. 3 to FIG. 5, the redundant power supply module with better heat dissipation effect proposed by the present invention, in particular Referring to one application, a rack 10 and at least one power supply 20 are included.

The frame 10 has an opening 11 and an accommodating space 12 connected and extending from the opening 11. In this embodiment, the power supply 20 is disposed in the rack 10 as a main implementation, but in practical applications, the power supply 20 may be disposed in the rack 10 or may be configured at the same time. Or the power supply 20 of the above.

The power supply unit 20 has an input end 21 , an output end 22 , and a body portion 23 connected between the input end 21 and the output end 22 . The input end 21 is located outside the opening 11 of the rack 10 . There is a handle 30 for holding the power supply 20 on the rack 10 for plugging and unplugging, and an external power supply (not shown in the drawings, which is known in the art). The power connector 40 is connected without further elaboration. The output end 22 is located on the other side of the accommodating space 12 relative to the opening 11 and is integrated with a power in the accommodating space 12 (not shown in the drawings, which is not described herein for the prior art) connection. The main body portion 23 is partitioned by an assembly portion 24 inserted from the opening 11 and disposed in the accommodating space 12 and connected to the output end 22, and an extension from the opening 11 toward the outside of the opening 11 and connected to the assembly A heat dissipating section 25 between the section 24 and the input end 21.

In this embodiment, the main body portion 23 includes a top plate 231, a bottom plate 232 opposite to the top plate 231 and spaced apart from each other, and two bottom plates 231 and two sides of the bottom plate 232 respectively connected to the top plate 231 and the bottom plate 232. a side plate 233, the top plate 231 is disposed at a position of the heat dissipation portion 25, and a plurality of upper heat dissipation holes 234 are disposed, and the bottom plate 232 is disposed at a position of the heat dissipation portion 25. There are a plurality of lower heat dissipation holes 235, and each of the side plates 233 is disposed at a position of the heat dissipation portion 25, and a plurality of front heat dissipation holes 236 are disposed, and the input end 21 is provided with a plurality of front heat dissipation holes 211.

In addition, in the embodiment, each of the side plates 233 is further composed of an upper side plate 237 and a lower side plate 238. Each of the upper side plates 237 and the top plate 231 are connected to each other, and each of the lower side plates 238 is connected to the bottom plate. The side holes 236 are connected to each other, and the side heat dissipation holes 236 on each side plate 233 are distributed on the upper side plate 237 and the lower side plate 238.

As shown in FIG. 6 and FIG. 7 , since the heat dissipation portion 25 of the power supply 20 protrudes outside the opening 11 of the frame 10, the upper heat dissipation holes 234, the lower heat dissipation holes 235, and the The side heat dissipation holes 236 and the front heat dissipation holes 211 are also protruded outside the opening 11 along with the heat dissipation portion 25 .

Therefore, when the power supply module is in practical use, a gas can be introduced into the gas through the output end 22, and the gas passes through the main body portion 23, and then through the upper heat dissipation holes 234 and the lower heat dissipation holes. 235. The side heat dissipation holes 236 and the front heat dissipation holes 211 form a heat convection, thereby preventing thermal energy generated when the power supply device 20 operates from accumulating inside the power supply 20 .

In this embodiment, in order to increase the speed of the flow of the airflow inside the power supply 20, at least one cooling fan 50 may be disposed in the power supply 20 to be introduced from the output end 22 by the cooling fan 50. The gas is used to guide the heat energy generated when the power supply device 20 is operated by the gas to the heat dissipation portion 25, and then the heat energy is used to pass the gas through the upper heat dissipation holes 234 and the lower heat dissipation holes 235. The side heat dissipation holes 236 and the front heat dissipation holes 211 form a heat convection, thereby preventing the thermal energy from accumulating in the power supply 20, and avoiding the phenomenon that the power supply 20 is caused to crash or burn due to excessive temperature.

However, in practical applications, the cooling fan 50 can also be disposed outside the output end 22 of the power supply 20, and the same can be used to guide the gas from the output terminal 22 to the power supply through the cooling fan 50. The inside of the supplier 20.

Compared with the prior art, the present invention mainly provides the heat dissipating section through the heat dissipating holes 234 of the power supply 20, the lower heat dissipating holes 235, and the side heat dissipating holes 236. The protrusion 24 is disposed outside the opening 11 of the frame 10, so that the gas can enter the power supply 20 from the output end 22, and the upper heat dissipation holes 234, the lower heat dissipation holes 235, and the sides. The heat dissipation holes 236 and the front heat dissipation holes 211 form a heat convection to form a heat dissipation effect on the power supply 20, so that the power supply module of the present invention has a better heat dissipation effect.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements may be made by those skilled in the art without departing from the spirit and scope of the invention. In the present invention, the scope of the present invention is therefore defined by the scope of the appended claims.

Claims (5)

A power supply module having a better heat dissipation effect, comprising: a frame having an opening and an accommodating space connected to the opening; and at least one power supply having a outside of the opening of the frame An input terminal for connecting an external power source and having a plurality of front heat dissipation holes, an output terminal disposed in the accommodation space for connecting a power integrated backplane, and a body portion connected between the input end and the output end, The body portion is divided into an assembly section that is inserted from the opening and disposed in the accommodating space and connected to the output end, and an extension from the opening toward the outside of the opening and connected between the assembly section and the input end a heat dissipation section, wherein the body portion includes a top plate disposed with the plurality of heat dissipation holes in the heat dissipation portion, a bottom plate opposite to the top plate and spaced apart from each other, and a plurality of lower heat dissipation holes are disposed in the heat dissipation portion The two sides are respectively disposed on the two sides of the top plate and the bottom plate to connect the top plate and the side plate of the bottom plate, and each of the side plates is disposed with a plurality of side heat dissipation holes in the heat dissipation portion to make a gas The heat output convection is formed in the power supply from the output end, and the heat dissipation holes, the lower heat dissipation holes, the side heat dissipation holes and the front heat dissipation holes are formed to form a heat dissipation effect on the power supply. . The power supply module of claim 1 , wherein each of the side plates further comprises an upper side plate connected to the top plate and a lower side plate connected to the bottom plate, and the side heat dissipation Holes are distributed on the upper side plate and the lower side plate. The power supply module of claim 1, wherein the input terminal further comprises a power connector for electrically connecting the external power source. The power supply module of claim 1, wherein the input end is further provided with a handle for holding the power supply to be plugged and unplugged on the rack. The power supply module of claim 1, wherein the power supply further includes a body disposed in the body to introduce the gas from the output and direct the gas toward the heat dissipation section. Cooling fan.