CN211607165U - Case for radiating light path component - Google Patents

Case for radiating light path component Download PDF

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Publication number
CN211607165U
CN211607165U CN201922362551.3U CN201922362551U CN211607165U CN 211607165 U CN211607165 U CN 211607165U CN 201922362551 U CN201922362551 U CN 201922362551U CN 211607165 U CN211607165 U CN 211607165U
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CN
China
Prior art keywords
light path
connecting plate
heat
circuit
optical circuit
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Active
Application number
CN201922362551.3U
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Chinese (zh)
Inventor
廖建
丁莽
冯宇
马骁萧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jingwei Shida Medical Technology Hubei Co ltd
Jingwei Shida Medical Technology Suzhou Co ltd
Original Assignee
Jingwei Shida Medical Technology Wuhan Co ltd
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Priority to CN201922362551.3U priority Critical patent/CN211607165U/en
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Abstract

The utility model discloses a be used for carrying out radiating quick-witted case to light path part, including the bottom plate, separately set up light path part on the bottom plate and place district, light path connecting plate, circuit connecting plate. The technical problem that a chassis used for radiating the light path component is poor in radiating effect is solved.

Description

Case for radiating light path component
Technical Field
The utility model belongs to the medical equipment field, more specifically relates to a be used for carrying out radiating quick-witted case to light path part.
Background
Some optical components, especially some high-end medical equipment cases, are usually placed in some existing cases, once the heat dissipation inside the cases is not good, the performance of the whole machine is reduced, and various required design parameters do not reach the standard. Therefore, the heat dissipation design of these chassis containing optical components plays a very critical role for the whole device.
The cabinets contain a plurality of control boards, but the control boards are connected into a whole, so that the heat emitted by the control boards is mutually conducted, the heat dissipation of each device is not ideal, and a large installation space is needed due to the fact that the control boards are connected into a whole.
In addition, some control boards are directly stacked on the optical path system or the optical path component, so that heat emitted by the control boards is directly transferred to the optical path system, and the heat cannot be led out. A chassis with a good heat dissipation effect on the optical path component is needed to be designed.
SUMMERY OF THE UTILITY MODEL
To the above defect or improvement demand of prior art, the utility model provides a be used for carrying out radiating quick-witted case to light path part, its aim at solves and is used for carrying out the not good technical problem of radiating effect that radiating quick-witted case exists to light path part.
In order to achieve the above object, the utility model provides a be used for carrying out radiating quick-witted case to light path part, including the bottom plate, separately set up light path part on the bottom plate places district, light path connecting plate, circuit connecting plate.
Preferably, the light path component placing area is L-shaped, and the light path connecting plate is located in a semi-open space surrounded by the L-shaped light path component placing area.
Preferably, an area, close to the circuit connecting plate, in the semi-open space on the bottom plate is further provided with a mounting hole, the light path connecting plate is located between the mounting hole and the light path component placing area, and the light path connecting plate is arranged in parallel with the circuit connecting plate.
Preferably, a plurality of heat dissipation holes are formed in the bottom plate.
Preferably, the heat dissipation hole is located between the mounting hole and the circuit connection board.
Preferably, the cooling device further comprises a fan, and the fan is arranged opposite to the heat dissipation hole.
Preferably, the optical circuit connecting plate and the circuit connecting plate are both L-shaped plates, and include a control plate mounting surface and a connecting plate mounting surface that are perpendicular to each other.
Preferably, the circuit connecting plate is provided with a threading hole.
Preferably, in general, by the above technical solution contemplated by the present invention, compared with the prior art, the following beneficial effects can be obtained:
(1) the utility model provides a be used for carrying out radiating quick-witted case to light path part, the light path part through placing the light path part that the light path part will be placed the district, place the light path connecting plate of light path control panel, place the circuit connecting plate of main circuit control panel and separately set up, make the heat that each control panel gived off can not conduct each other, and the radiating effect is good, can also save installation space simultaneously, the installation of being convenient for. In addition, the light path control plates are arranged side by side instead of being stacked on the light path components in the prior art, so that the heat dissipation effect can be further improved. The utility model provides a quick-witted case has strengthened the radiating effect greatly, has improved equipment performance, can extensively use in the industrial production field.
(2) Because this machine case is including being provided with the bottom plate of a plurality of louvres, can further improve the radiating effect.
(3) Because the case comprises the fan and the position of the fan is right corresponding to the position of the heat dissipation hole, the heat dissipation effect can be further improved.
Drawings
Fig. 1 is a schematic structural diagram of a chassis for dissipating heat of an optical path component according to the present invention;
FIG. 2 is a schematic structural diagram of an optical path connecting plate;
fig. 3 is a schematic structural diagram of the circuit connection board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, the utility model provides a be used for carrying out radiating quick-witted case to light path part, including box 1, bottom plate 6, separately set up light path part on bottom plate 6 and place district, light path connecting plate 4, circuit connecting plate 9. The light path component placing area is used for placing light path components, the light path connecting plate 4 is used for connecting the light path control plate, and the circuit connecting plate 9 is used for connecting the main circuit control plate. Through the light path part placing area that will place the light path part, the light path connecting plate of placing the light path control panel, the circuit connecting plate of placing the main circuit control panel separately sets up, makes the heat that each control panel gived off can not conduct each other, and the radiating effect is good, can also save installation space simultaneously, the installation of being convenient for.
As shown in fig. 1, the optical path component placement area is L-shaped, and the optical path connecting plate 4 is located in a semi-open space (space indicated by a letter a in fig. 1) surrounded by the L-shaped optical path component placement area, so that the installation space required by the optical path component and the optical path control plate can be further saved.
In this embodiment, the light path component 2 is placed in the light path component placing area, the light path connecting plate 4 is connected with the light path control plate, the circuit connecting plate 9 is connected with the main circuit control plate 8, and the main circuit control plate 8 can be used for controlling the light path control plate to work. The optical path component 2 is a common optical component, but needs to be used in cooperation with a control board, and is not limited to a single example due to a variety of types. In this embodiment, the optical path component 2 is taken as an example of a mechanical scanning galvanometer for optical imaging, the mechanical scanning galvanometer generally includes an X scanning motor and a Y scanning motor, the optical path control board of this embodiment includes an optical path control board one 3 and an optical path control board two 5, the optical path control board one 3 is used for controlling fast scanning in the mechanical scanning galvanometer, that is, controlling the X scanning motor, and the optical path control board two 5 is used for controlling slow scanning in the mechanical scanning galvanometer, that is, controlling the Y scanning motor.
The optical path connecting plate 4 and the circuit electrode plate 9 can be connected to the bottom plate 6 through an additional connecting piece; or may be L-shaped and connected to the bottom plate 6 through one side of the L-shape. In this embodiment, the optical path connection board 4 and the circuit connection board 9 are both L-shaped boards, and respectively include a control board mounting surface and a connection board mounting surface that are perpendicular to each other. As shown in fig. 2, a first connection hole 12 is formed in the connection plate mounting surface of the optical path connection plate 4, and is used for vertically connecting the optical path connection plate 4 to the bottom plate 6; and a first optical path control plate 3 is connected to the control plate mounting surface of the optical path connecting plate 4.
And a mounting hole is further formed in the area, close to the circuit connecting plate 9, in the semi-open space on the bottom plate 6 and used for mounting the circuit control board II 5. The second optical path control plate 5 is perpendicular to the first optical path control plate 3, so that the heat dissipation space between the two optical path control plates is larger, and the heat dissipation effect is further improved. Light path connecting plate 4 is located between mounting hole and the light path part and places the district, and light path connecting plate 4 and circuit connecting plate 9 parallel arrangement also can further facilitate the installation like this, increase the radiating effect simultaneously.
As another embodiment, the chassis further includes a motor control board 7 and a power supply 10, the motor control board 7 and the power supply 10 are separately disposed on the circuit connection board 9, and the motor control board 7 is separately disposed from other control boards and the optical path component 2, also for improving the heat dissipation effect. As shown in fig. 3, the main circuit control board 8, the motor control board 7 and the power supply 10 are all connected to the control board mounting surface of the circuit connection board 9, the main circuit control board 8 and the motor control board 7 are located on the same side of the circuit connection board 9, the power supply 10 is located on the other side of the circuit connection board 9, and the two control boards and the power supply 10 are separately arranged on two sides of the circuit connection board 9, so that the heat dissipation effect can be further improved. And a second connecting hole 13 is formed in the connecting plate mounting surface of the circuit connecting plate 9 and used for connecting the circuit connecting plate 9 to the bottom plate 6.
As another embodiment, the bottom plate 6 is provided with a plurality of heat dissipation holes, through which heat generated by the control board can be dissipated. Preferably, the heat dissipation holes are arranged in a rectangular shape to improve the heat dissipation effect.
As another embodiment, the heat dissipation holes are located between the mounting holes and the circuit connection board 9, and the control boards are arranged in two rows of the heat dissipation holes, so that the heat dissipated by the control boards can be quickly dissipated out of the chassis through the heat dissipation holes. Since the heat dissipation source in the case is mainly the place where the optical path control board, the main circuit control board 8 and the motor control board 7 are close to each other, preferably, the position including the heat dissipation holes on the bottom board 6 may only cover the portion between the optical path control board and the motor control board 7 close to the motor control board 7, and the cost required for opening the holes may also be saved.
As another embodiment, the cooling device further comprises a fan 11 disposed in the chassis, and the fan 11 is disposed opposite to the heat dissipation hole. Because the heat emitted by the control board is mainly concentrated on the heat dissipation holes, the fan 11 is arranged opposite to the heat dissipation holes, and the heat near the heat dissipation holes can be effectively blown away. Preferably, the fan 11 is in an air draft mode, and can conduct heat inside the case to the outside of the case.
As another embodiment, the circuit connecting board 9 is provided with a threading hole to facilitate wiring and wire connection between the control boards.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. A chassis used for carrying on the heat dissipation to the light path part, characterized by that, including the bottom plate (6), the light path part that is set up separately on the said bottom plate (6) places the area, light path joint bar (4), circuit joint bar (9); the light path component placing area is L-shaped, and the light path connecting plate (4) is located in a semi-open space surrounded by the L-shaped light path component placing area.
2. The chassis for dissipating heat from an optical circuit component according to claim 1, wherein a mounting hole is further formed in the bottom plate (6) at a region near the circuit connecting plate (9) in the semi-open space, the optical circuit connecting plate (4) is located between the mounting hole and the optical circuit component placement region, and the optical circuit connecting plate (4) is disposed in parallel with the circuit connecting plate (9).
3. The cabinet for dissipating heat from optical circuit components according to claim 2, wherein the bottom plate (6) is provided with a plurality of heat dissipating holes.
4. The chassis for dissipating heat from optical circuit components according to claim 3, wherein the heat dissipating holes are located between the mounting holes and the circuit connection board (9).
5. The cabinet for dissipating heat of optical path components according to claim 3 or 4, further comprising a fan (11), wherein the fan (11) is disposed opposite to the heat dissipating hole.
6. The chassis for dissipating heat from optical circuit components according to claim 1, wherein the optical circuit connection board (4) and the circuit connection board (9) are each an L-shaped board including a control board mounting surface and a connection board mounting surface perpendicular to each other.
7. The chassis for dissipating heat from optical circuit components according to claim 1, wherein the circuit connecting board (9) is provided with a threading hole.
CN201922362551.3U 2019-12-25 2019-12-25 Case for radiating light path component Active CN211607165U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922362551.3U CN211607165U (en) 2019-12-25 2019-12-25 Case for radiating light path component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922362551.3U CN211607165U (en) 2019-12-25 2019-12-25 Case for radiating light path component

Publications (1)

Publication Number Publication Date
CN211607165U true CN211607165U (en) 2020-09-29

Family

ID=72595383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922362551.3U Active CN211607165U (en) 2019-12-25 2019-12-25 Case for radiating light path component

Country Status (1)

Country Link
CN (1) CN211607165U (en)

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CP03 Change of name, title or address

Address after: Room 804 and 805, Building 1, No. 188 Fuchunjiang Road, High tech Zone, Suzhou City, Jiangsu Province, 215000

Patentee after: Jingwei Shida Medical Technology (Suzhou) Co.,Ltd.

Country or region after: Zhong Guo

Address before: 436000, the third floor, Phoenix Avenue, special area No. 1, Wutong Lake New District, Liangzi Lake, Ezhou, Hubei

Patentee before: JINGWEI SHIDA MEDICAL TECHNOLOGY (WUHAN) CO.,LTD.

Country or region before: Zhong Guo

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20240319

Address after: No. E02, Floor 1-3, Building E1E2, East Lake High tech Creative City, south of Phoenix Avenue, wutong Lake New District, Liangzihu District, Ezhou City, Hubei Province, 436000

Patentee after: Jingwei Shida Medical Technology (Hubei) Co.,Ltd.

Country or region after: Zhong Guo

Address before: Room 804 and 805, Building 1, No. 188 Fuchunjiang Road, High tech Zone, Suzhou City, Jiangsu Province, 215000

Patentee before: Jingwei Shida Medical Technology (Suzhou) Co.,Ltd.

Country or region before: Zhong Guo