US20160217929A1 - Multi-layer ceramic capacitor assembly - Google Patents
Multi-layer ceramic capacitor assembly Download PDFInfo
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- US20160217929A1 US20160217929A1 US14/990,332 US201614990332A US2016217929A1 US 20160217929 A1 US20160217929 A1 US 20160217929A1 US 201614990332 A US201614990332 A US 201614990332A US 2016217929 A1 US2016217929 A1 US 2016217929A1
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- ceramic capacitor
- layer ceramic
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- forming substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present disclosure relates to a multi-layer ceramic capacitor assembly.
- Multi-layer ceramic capacitors are popularly used in mobile terminals, such as mobile phones.
- An MLCC may be connected electrically and physically to a circuit board of a mobile terminal by placing an external electrode of the MLCC directly on a surface electrode for mounting to the circuit board and soldering the surface electrode with the external electrode of the MLCC.
- the MLCC may be mechanically deformed by a change of voltage applied thereto. Moreover, such a deformation may be transferred to the circuit board and cause the circuit board to vibrate, possibly causing acoustic noises that are audible to a human ear.
- One embodiment of the present invention provides a multi-layer ceramic capacitor assembly comprising a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.
- the multi-layer ceramic capacitor assembly may further comprise a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate.
- the first bonding part may comprise a pair of first bonding pads formed integrally with the multi-layer ceramic capacitor and the electrode-forming substrate, respectively; and a first soldering member configured for soldering the pair of first bonding pads with each other.
- the multi-layer ceramic capacitor assembly may further comprise a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes.
- the electrode-forming substrate may comprise current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes.
- the multi-layer ceramic capacitor assembly may further comprise second bonding parts disposed at portions of the electrode-forming substrate and the circuit board where the surface electrodes are formed and bonding the electrode-forming substrate with the circuit board.
- the second bonding parts each may comprise a second bonding pad integrally formed with the electrode-forming substrate; and a second soldering member connecting the second bonding pad with one of the surface electrodes.
- the current-carrying soldering member and the second soldering member may be integrally formed.
- surface electrodes formed on one surface of the circuit board may be electrically connected to the external electrodes of the multi-layer ceramic capacitor through the through-holes.
- FIG. 1 is a perspective view showing a multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 2 is an exploded perspective view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 4 is a detailed cross-sectional view showing a multi-layer ceramic capacitor in the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 1 is a perspective view showing a multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 2 is an exploded perspective view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- FIG. 4 is a detailed cross-sectional view showing a multi-layer ceramic capacitor in the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.
- a multi-layer ceramic capacitor assembly 1000 in accordance with an embodiment of the present invention includes a multi-layer ceramic capacitor 100 and an electrode-forming substrate 200 and may further include a first bonding part 300 , a circuit board 400 , and second bonding parts 500 .
- the multi-layer ceramic capacitor 100 may include a laminate 110 , which has dielectric layers 111 and internal electrodes 113 laminated alternately therein, and an external electrode 120 , which is electrically connected with the internal electrodes 113 and formed at an end portion of the laminate 110 .
- the laminate 110 of the multi-layer ceramic capacitor 100 is formed by successively laminating the dielectric layers 111 , which contain ceramic particles, and the internal electrodes 113 alternately.
- the external electrodes 120 are provided in a pair formed at either end portion of the laminate 110 , and the internal electrodes 113 may each be electrically connected with either of the pair of external electrodes 120 .
- the pair of external electrodes 120 may be formed at either end portion of the laminate 110 to face opposite to each other and may be made of a conductive material such as copper.
- the electrode-forming substrate 200 which has the multi-layer ceramic capacitor 100 coupled to one surface thereof and has through-holes 210 formed at portions corresponding to where the external electrodes 120 are formed, may be interposed between the multi-layer ceramic capacitor 100 and the circuit board 400 in order to carry out, for example, an insulation function in case the multi-layer ceramic capacitor 100 is mounted on the circuit board 400 .
- a surface on which the multi-layer ceramic capacitor 100 is mounted on the circuit board 400 may be entirely covered by the electrode-forming substrate 200 , but this may complicate the electrical connection between the multi-layer ceramic capacitor 100 and the circuit board 400 .
- the multi-layer ceramic capacitor assembly 1000 in accordance with the present embodiment may have the through-holes 210 formed in the electrode-forming substrate 200 covering the surface where the multi-layer ceramic capacitor 100 is installed and thus the multi-layer ceramic capacitor 100 may be electrically connected to the circuit board 400 through these through-holes 210 .
- the insulating performance may be enhanced, and the electrical connection may be readily made.
- the first bonding part 300 which is formed at portions of the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 where the external electrodes 120 are not formed, is configured to physically bond the multi-layer ceramic capacitor 100 with the electrode-forming substrate 200 .
- the first bonding part 300 may be formed at a middle portion of the laminate 110 .
- the first bonding part 300 may be variably configured, for example, by including an adhesive material to bond the multi-layer ceramic capacitor 100 with the electrode-forming substrate 200 or by including a binding member to lock the multi-layer ceramic capacitor 100 with the electrode-forming substrate 200 .
- the multi-layer ceramic capacitor assembly 1000 may separate an electrical connection path from a physical connection path between the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 .
- the first bonding part 300 may include a pair of first bonding pads 310 , which are integrally formed with the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 , respectively, and a first soldering member 320 configured for soldering the pair of first bonding pads 310 with each other.
- the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 may be bonded to each other more readily and effectively through soldering, which is the most widely used bonding method for mounting the multi-layer ceramic capacitor 100 on the circuit board 400 .
- the circuit board 400 which has surface electrodes 410 formed on one surface thereof and is coupled to the other surface of the electrode-forming substrate 200 in such a way that the surface electrodes 410 are electrically connected with the external electrodes 120 through the through-holes 210 , has a predetermined circuit pattern formed thereon to provide electrical signals to the multi-layer ceramic capacitor 100 .
- the vibrations of the multi-layer ceramic capacitor 100 may be minimally transferred directly to the circuit board 400 .
- the electrode-forming substrate 200 may include current-carrying soldering members 420 configured for soldering the surface electrodes 410 with the external electrodes 120 through the through-holes 210 in such a way that the surface electrodes 410 are electrically connected, respectively, with the external electrodes 120 .
- the surface electrodes 410 may be electrically connected with the external electrodes 120 , respectively, more readily and effectively through soldering.
- the current-carrying soldering members 420 may bulge up through the through-holes 210 to make contact with the external electrodes 120 .
- the second bonding parts 500 which are formed at portions of the electrode-forming substrate 200 and the circuit board 400 where the surface electrodes 410 are formed and are configured to bond the electrode-forming substrate 200 with the circuit board 400 , may physically bond the electrode-forming substrate 200 with the circuit board 400 .
- the second bonding parts 500 may also be variably configured, for example, by including an adhesive material to bond the electrode-forming substrate 200 with the circuit board 400 , or by including a binding member to lock the electrode-forming substrate 200 with the circuit board 400 .
- the electrode-forming substrate 200 and the circuit board 400 are physically bonded with each other through the second bonding parts 500 at portions where the surface electrodes 410 are formed, a physical coupling between the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 is made at a middle portion of the electrode-forming substrate 200 , and a physical coupling between the electrode-forming substrate 200 and the circuit board 400 is made at peripheral portions of the electrode-forming substrate 200 .
- the vibrations of the multi-layer ceramic capacitor 100 were transferred to the electrode-forming substrate 200 , the vibrations would have to be transferred to the peripheral portions of the electrode-forming substrate 200 before being eventually transferred to the circuit board 400 , providing a relatively inefficient transfer path and thereby possibly minimizing the transfer of the vibrations of the multi-layer ceramic capacitor 100 to the circuit board 400 .
- the second bonding parts 500 may each include a second bonding pad 510 , which is integrally formed with the electrode-forming substrate 200 , and a second soldering member 520 configured for soldering the second bonding pad 510 with one of the surface electrodes 410 .
- the soldering between the electrode-forming substrate 200 and the circuit board 400 may be performed in conjunction with the soldering between the multi-layer ceramic capacitor 100 and the electrode-forming substrate 200 through the first bonding part 300 , allowing the bonding processes to be performed more readily.
- the current-carrying soldering members 420 and the second soldering members 520 may each be integrally formed with each other. Specifically, instead of forming the current-carrying soldering members 420 and the second soldering members 520 separately, the partially fluid current-carrying soldering members 420 may be laminated, respectively, on the surface electrodes 410 , and then the electrode-forming substrate 200 may be pressed down over the current-carrying soldering members 420 .
- portions of the current-carrying soldering members 420 that bulge up through the through-holes 210 may naturally become the current-carrying soldering members 420 , and portions of the current-carrying soldering members 420 that escape the through-holes 210 and are interposed between the electrode-forming substrate 200 and the circuit board 400 may become the second soldering members 520 .
- the current-carrying soldering members 420 and the second soldering members 520 may be integrally formed, processes for electrical connection and physical bonding may be simultaneously performed.
Abstract
A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.
Description
- This application claims the benefit of priority to Korean Patent Application No. 10-2015-0012188, filed with the Korean Intellectual Property Office on Jan. 26, 2015, the entirety of which is incorporated herein by reference.
- The present disclosure relates to a multi-layer ceramic capacitor assembly.
- Multi-layer ceramic capacitors (MLCC) are popularly used in mobile terminals, such as mobile phones. An MLCC may be connected electrically and physically to a circuit board of a mobile terminal by placing an external electrode of the MLCC directly on a surface electrode for mounting to the circuit board and soldering the surface electrode with the external electrode of the MLCC.
- However, the MLCC may be mechanically deformed by a change of voltage applied thereto. Moreover, such a deformation may be transferred to the circuit board and cause the circuit board to vibrate, possibly causing acoustic noises that are audible to a human ear.
- One embodiment of the present invention provides a multi-layer ceramic capacitor assembly comprising a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.
- The multi-layer ceramic capacitor assembly may further comprise a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate.
- The first bonding part may comprise a pair of first bonding pads formed integrally with the multi-layer ceramic capacitor and the electrode-forming substrate, respectively; and a first soldering member configured for soldering the pair of first bonding pads with each other.
- The multi-layer ceramic capacitor assembly may further comprise a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes.
- The electrode-forming substrate may comprise current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes.
- The multi-layer ceramic capacitor assembly may further comprise second bonding parts disposed at portions of the electrode-forming substrate and the circuit board where the surface electrodes are formed and bonding the electrode-forming substrate with the circuit board.
- The second bonding parts each may comprise a second bonding pad integrally formed with the electrode-forming substrate; and a second soldering member connecting the second bonding pad with one of the surface electrodes.
- The current-carrying soldering member and the second soldering member may be integrally formed.
- Here, in the multi-layer ceramic capacitor assembly, while a circuit board is coupled to the other surface of the electrode-forming substrate, surface electrodes formed on one surface of the circuit board may be electrically connected to the external electrodes of the multi-layer ceramic capacitor through the through-holes.
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FIG. 1 is a perspective view showing a multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention. -
FIG. 2 is an exploded perspective view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention. -
FIG. 3 is a cross-sectional view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention. -
FIG. 4 is a detailed cross-sectional view showing a multi-layer ceramic capacitor in the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention. - The terms used in the description are intended to describe certain embodiments only, and shall by no means restrict the present invention. Unless clearly used otherwise, expressions in a singular form also include a meaning of a plural form.
- In the present description, when any part is described to “comprise” or “include” any element, it is intended to describe the possibility of encompassing additional element(s), rather than excluding any other element, unless otherwise described. Moreover, when any element is described to be “on,” “above” or “over” any part or element, it shall be understood that such element is placed above or below such part or element and not necessarily at a vertically higher position.
- When one element is described to be “coupled” to another element, it does not refer to a physical, direct contact between these elements only, but it shall also include the possibility of another element being interposed between these elements and each of these elements being in contact with the other element.
- Terms such as “first” and “second” may be used to distinguish one element from other identical or corresponding elements, but the above elements shall not be restricted to the above terms.
- The size and thickness of each element shown in the drawings are provided for the convenience of description, illustration, and understanding, and thus the present invention shall not be limited to how the drawings are illustrated.
- Hereinafter, an embodiment of a multi-layer ceramic capacitor assembly in accordance with the present invention will be described with reference to the accompanying drawings. In describing the present invention with reference to the accompanying drawings, any identical or corresponding elements will be assigned with same reference numerals, and their description will not be provided redundantly.
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FIG. 1 is a perspective view showing a multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.FIG. 2 is an exploded perspective view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.FIG. 3 is a cross-sectional view showing the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention.FIG. 4 is a detailed cross-sectional view showing a multi-layer ceramic capacitor in the multi-layer ceramic capacitor assembly in accordance with an embodiment of the present invention. - As illustrated in
FIG. 1 toFIG. 4 , a multi-layerceramic capacitor assembly 1000 in accordance with an embodiment of the present invention includes a multi-layerceramic capacitor 100 and an electrode-formingsubstrate 200 and may further include afirst bonding part 300, acircuit board 400, andsecond bonding parts 500. - The multi-layer
ceramic capacitor 100 may include alaminate 110, which hasdielectric layers 111 andinternal electrodes 113 laminated alternately therein, and anexternal electrode 120, which is electrically connected with theinternal electrodes 113 and formed at an end portion of thelaminate 110. - That is, as illustrated in
FIG. 4 , thelaminate 110 of the multi-layerceramic capacitor 100 is formed by successively laminating thedielectric layers 111, which contain ceramic particles, and theinternal electrodes 113 alternately. - The
external electrodes 120 are provided in a pair formed at either end portion of thelaminate 110, and theinternal electrodes 113 may each be electrically connected with either of the pair ofexternal electrodes 120. The pair ofexternal electrodes 120 may be formed at either end portion of thelaminate 110 to face opposite to each other and may be made of a conductive material such as copper. - The electrode-forming
substrate 200, which has the multi-layerceramic capacitor 100 coupled to one surface thereof and has through-holes 210 formed at portions corresponding to where theexternal electrodes 120 are formed, may be interposed between the multi-layerceramic capacitor 100 and thecircuit board 400 in order to carry out, for example, an insulation function in case the multi-layerceramic capacitor 100 is mounted on thecircuit board 400. - In order for the insulation function to be effective, a surface on which the multi-layer
ceramic capacitor 100 is mounted on thecircuit board 400 may be entirely covered by the electrode-formingsubstrate 200, but this may complicate the electrical connection between the multi-layerceramic capacitor 100 and thecircuit board 400. - On the other hand, if the multi-layer
ceramic capacitor 100 were physically bonded directly to thecircuit board 400 over a large area, vibrations generated by the multi-layerceramic capacitor 100 might be directly transferred to thecircuit board 400, possibly generating an acoustic noise. - Therefore, the multi-layer
ceramic capacitor assembly 1000 in accordance with the present embodiment may have the through-holes 210 formed in the electrode-formingsubstrate 200 covering the surface where the multi-layerceramic capacitor 100 is installed and thus the multi-layerceramic capacitor 100 may be electrically connected to thecircuit board 400 through these through-holes 210. - Accordingly, since a relatively minimum area of the surface where the multi-layer
ceramic capacitor 100 is mounted is exposed, the insulating performance may be enhanced, and the electrical connection may be readily made. - The
first bonding part 300, which is formed at portions of the multi-layerceramic capacitor 100 and the electrode-formingsubstrate 200 where theexternal electrodes 120 are not formed, is configured to physically bond the multi-layerceramic capacitor 100 with the electrode-formingsubstrate 200. - That is, as illustrated in
FIG. 1 toFIG. 3 , when theexternal electrodes 120 are formed at either end portion of thelaminate 110, thefirst bonding part 300 may be formed at a middle portion of thelaminate 110. - In such a configuration, the
first bonding part 300 may be variably configured, for example, by including an adhesive material to bond the multi-layerceramic capacitor 100 with the electrode-formingsubstrate 200 or by including a binding member to lock the multi-layerceramic capacitor 100 with the electrode-formingsubstrate 200. - As described above, by further including the
first bonding part 300, the multi-layerceramic capacitor assembly 1000 may separate an electrical connection path from a physical connection path between the multi-layerceramic capacitor 100 and the electrode-formingsubstrate 200. - Here, the
first bonding part 300 may include a pair offirst bonding pads 310, which are integrally formed with the multi-layerceramic capacitor 100 and the electrode-formingsubstrate 200, respectively, and afirst soldering member 320 configured for soldering the pair offirst bonding pads 310 with each other. - That is, the multi-layer
ceramic capacitor 100 and the electrode-formingsubstrate 200 may be bonded to each other more readily and effectively through soldering, which is the most widely used bonding method for mounting the multi-layerceramic capacitor 100 on thecircuit board 400. - The
circuit board 400, which hassurface electrodes 410 formed on one surface thereof and is coupled to the other surface of the electrode-formingsubstrate 200 in such a way that thesurface electrodes 410 are electrically connected with theexternal electrodes 120 through the through-holes 210, has a predetermined circuit pattern formed thereon to provide electrical signals to the multi-layerceramic capacitor 100. - As such, since the electrical connection between the multi-layer
ceramic capacitor 100 and thecircuit board 400 is made with a minimum area through the through-holes 210, the vibrations of the multi-layerceramic capacitor 100 may be minimally transferred directly to thecircuit board 400. - In the multi-layer
ceramic capacitor assembly 1000 in accordance with the present embodiment, the electrode-formingsubstrate 200 may include current-carryingsoldering members 420 configured for soldering thesurface electrodes 410 with theexternal electrodes 120 through the through-holes 210 in such a way that thesurface electrodes 410 are electrically connected, respectively, with theexternal electrodes 120. - That is, the
surface electrodes 410 may be electrically connected with theexternal electrodes 120, respectively, more readily and effectively through soldering. In such a case, by laminating the partially fluid current-carryingsoldering members 420 on thesurface electrodes 410 and then exerting downward force on the electrode-formingsubstrate 200 over the current-carryingsoldering members 420, the current-carryingsoldering members 420 may bulge up through the through-holes 210 to make contact with theexternal electrodes 120. - The
second bonding parts 500, which are formed at portions of the electrode-formingsubstrate 200 and thecircuit board 400 where thesurface electrodes 410 are formed and are configured to bond the electrode-formingsubstrate 200 with thecircuit board 400, may physically bond the electrode-formingsubstrate 200 with thecircuit board 400. - The
second bonding parts 500 may also be variably configured, for example, by including an adhesive material to bond the electrode-formingsubstrate 200 with thecircuit board 400, or by including a binding member to lock the electrode-formingsubstrate 200 with thecircuit board 400. - As such, by allowing the electrode-forming
substrate 200 and thecircuit board 400 to be physically bonded with each other through thesecond bonding parts 500 at portions where thesurface electrodes 410 are formed, a physical coupling between the multi-layerceramic capacitor 100 and the electrode-formingsubstrate 200 is made at a middle portion of the electrode-formingsubstrate 200, and a physical coupling between the electrode-formingsubstrate 200 and thecircuit board 400 is made at peripheral portions of the electrode-formingsubstrate 200. - Accordingly, even if the vibrations of the multi-layer
ceramic capacitor 100 were transferred to the electrode-formingsubstrate 200, the vibrations would have to be transferred to the peripheral portions of the electrode-formingsubstrate 200 before being eventually transferred to thecircuit board 400, providing a relatively inefficient transfer path and thereby possibly minimizing the transfer of the vibrations of the multi-layerceramic capacitor 100 to thecircuit board 400. - Here, the
second bonding parts 500 may each include asecond bonding pad 510, which is integrally formed with the electrode-formingsubstrate 200, and asecond soldering member 520 configured for soldering thesecond bonding pad 510 with one of thesurface electrodes 410. - In other words, it is possible to bond the electrode-forming
substrate 200 with thecircuit board 400 more readily and effectively through soldering. Particularly, the soldering between the electrode-formingsubstrate 200 and thecircuit board 400 may be performed in conjunction with the soldering between the multi-layerceramic capacitor 100 and the electrode-formingsubstrate 200 through thefirst bonding part 300, allowing the bonding processes to be performed more readily. - Moreover, in the multi-layer
ceramic capacitor assembly 1000 in accordance with the present embodiment, the current-carryingsoldering members 420 and thesecond soldering members 520 may each be integrally formed with each other. Specifically, instead of forming the current-carryingsoldering members 420 and thesecond soldering members 520 separately, the partially fluid current-carryingsoldering members 420 may be laminated, respectively, on thesurface electrodes 410, and then the electrode-formingsubstrate 200 may be pressed down over the current-carryingsoldering members 420. Then, portions of the current-carryingsoldering members 420 that bulge up through the through-holes 210 may naturally become the current-carryingsoldering members 420, and portions of the current-carryingsoldering members 420 that escape the through-holes 210 and are interposed between the electrode-formingsubstrate 200 and thecircuit board 400 may become thesecond soldering members 520. - As such, since the current-carrying
soldering members 420 and thesecond soldering members 520 may be integrally formed, processes for electrical connection and physical bonding may be simultaneously performed. - Although certain embodiments of the present invention have been described above, it shall be appreciated that there can be a variety of permutations and modifications of the present invention by those who are ordinarily skilled in the art to which the present invention pertains without departing from the technical ideas and scope of the present invention, which shall be defined by the appended claims. It shall be also appreciated that a large number of other embodiments than the above-described embodiment are included in the claims of the present invention.
Claims (8)
1. A multi-layer ceramic capacitor assembly comprising:
a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and
an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.
2. The multi-layer ceramic capacitor assembly of claim 1 , further comprising a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate.
3. The multi-layer ceramic capacitor assembly of claim 2 , wherein the first bonding part comprises:
a pair of first bonding pads formed integrally with the multi-layer ceramic capacitor and the electrode-forming substrate, respectively; and
a first soldering member configured for soldering the pair of first bonding pads with each other.
4. The multi-layer ceramic capacitor assembly of claim 1 , further comprising a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes.
5. The multi-layer ceramic capacitor assembly of claim 4 , wherein the electrode-forming substrate comprises current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes.
6. The multi-layer ceramic capacitor assembly of claim 5 , further comprising second bonding parts disposed at portions of the electrode-forming substrate and the circuit board where the surface electrodes are formed and bonding the electrode-forming substrate with the circuit board.
7. The multi-layer ceramic capacitor assembly of claim 6 , wherein the second bonding parts each comprise:
a second bonding pad integrally formed with the electrode-forming substrate; and
a second soldering member connecting the second bonding pad with one of the surface electrodes.
8. The multi-layer ceramic capacitor assembly of claim 6 , wherein the current-carrying soldering member and the second soldering member are integrally formed.
Priority Applications (1)
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US15/851,110 US10319525B2 (en) | 2015-01-26 | 2017-12-21 | Multi-layer ceramic capacitor assembly |
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KR10-2015-0012188 | 2015-01-26 | ||
KR1020150012188A KR102163037B1 (en) | 2015-01-26 | 2015-01-26 | Multi-layer ceramic capacitor assembly |
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US15/851,110 Continuation US10319525B2 (en) | 2015-01-26 | 2017-12-21 | Multi-layer ceramic capacitor assembly |
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US20160217929A1 true US20160217929A1 (en) | 2016-07-28 |
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US14/990,332 Abandoned US20160217929A1 (en) | 2015-01-26 | 2016-01-07 | Multi-layer ceramic capacitor assembly |
US15/851,110 Active 2036-01-08 US10319525B2 (en) | 2015-01-26 | 2017-12-21 | Multi-layer ceramic capacitor assembly |
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US15/851,110 Active 2036-01-08 US10319525B2 (en) | 2015-01-26 | 2017-12-21 | Multi-layer ceramic capacitor assembly |
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US (2) | US20160217929A1 (en) |
KR (1) | KR102163037B1 (en) |
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KR102374604B1 (en) * | 2020-04-02 | 2022-03-16 | (주)파트론 | Dielectric filter module |
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JPH08130364A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Ind Co Ltd | Mounting body of chip electronic part |
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JPH08222831A (en) * | 1995-02-09 | 1996-08-30 | Matsushita Electric Ind Co Ltd | Mounting body for surface mount parts |
KR20090097411A (en) | 2008-03-11 | 2009-09-16 | 엘지이노텍 주식회사 | Device for compressing noise and power supply system thereof |
WO2013008550A1 (en) * | 2011-07-11 | 2013-01-17 | 株式会社村田製作所 | Electronic component |
-
2015
- 2015-01-26 KR KR1020150012188A patent/KR102163037B1/en active IP Right Grant
-
2016
- 2016-01-07 US US14/990,332 patent/US20160217929A1/en not_active Abandoned
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- 2017-12-21 US US15/851,110 patent/US10319525B2/en active Active
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US4760948A (en) * | 1986-12-23 | 1988-08-02 | Rca Corporation | Leadless chip carrier assembly and method |
JPH08130364A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Ind Co Ltd | Mounting body of chip electronic part |
US5931371A (en) * | 1997-01-16 | 1999-08-03 | Ford Motor Company | Standoff controlled interconnection |
US6693243B1 (en) * | 1999-11-25 | 2004-02-17 | Murata Manufacturing Co, Ltd. | Surface mounting component and mounted structure of surface mounting component |
US20070007323A1 (en) * | 2005-07-06 | 2007-01-11 | International Business Machines Corporation | Standoff structures for surface mount components |
WO2014126084A1 (en) * | 2013-02-18 | 2014-08-21 | 太陽誘電株式会社 | Multilayer ceramic capacitor with interposer, and interposer for multilayer ceramic capacitor |
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Also Published As
Publication number | Publication date |
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KR20160091718A (en) | 2016-08-03 |
US20180114646A1 (en) | 2018-04-26 |
US10319525B2 (en) | 2019-06-11 |
KR102163037B1 (en) | 2020-10-08 |
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AS | Assignment |
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, SOON-JU;AHN, YOUNG-GHYU;JUN, KYOUNG-JIN;AND OTHERS;REEL/FRAME:037432/0369 Effective date: 20151230 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |