KR102374604B1 - Dielectric filter module - Google Patents

Abstract

The present invention relates to a dielectric filter module.
A dielectric filter module according to an example of the present invention includes a dielectric block having a resonance hole penetrating between the front and rear surfaces thereof, a plurality of terminal patterns extending from the front to the lower surface of the dielectric block, and the dielectric block as a whole, wherein the a dielectric filter including a plurality of terminal patterns and a ground pattern spaced apart from each other; and a substrate including a terminal electrode connected to the plurality of terminal patterns and a ground electrode electrically connected to the ground pattern, wherein the ground electrode is spatially spaced apart from each other on the upper surface of the substrate and made of a metallic material and a plurality of upper mounting pads.

Description

Dielectric filter module

The present invention relates to a dielectric filter module.

A typical wireless communication system divides a corresponding frequency band of a wireless communication signal having a specific frequency band into a plurality of frequency bands, and creates and uses a plurality of channels each having the divided frequency bands.

To this end, a filter for passing or blocking only a signal of a selected frequency band is mounted in a wireless communication base station, a repeater, a terminal, and the like.

Due to the development of wireless communication technology, a transmission speed of a communication signal has increased, and the size of a frequency band used has also increased. In response to this change, the performance of a filter used for wireless communication should also be improved.

Accordingly, there is an increasing need to use a band stop filter (BSF) as well as a band pass filter (BPF) which has been mainly used in the prior art.

Conventionally, in order to connect the dielectric filter to the circuit board, the entire ground portion provided on the lower surface of the dielectric filter is electrically connected to the ground electrode of the circuit board.

However, in this case, the characteristics of the dielectric filter may be weakened due to thermal expansion of the ground electrode during the process of connecting the dielectric filter to the ground electrode of the circuit board.

Korean Patent 10-2018-0082452

An object of the present invention is to provide a dielectric filter module having a structure capable of preventing deterioration of properties of a dielectric filter by improving a ground electrode of a substrate bonded to the dielectric filter.

The dielectric filter module according to an example of the present invention includes a dielectric block having a resonance hole penetrating between the front and rear surfaces thereof, a plurality of terminal patterns extending from the front to the lower surface of the dielectric block, and the dielectric block as a whole, wherein the a dielectric filter including a plurality of terminal patterns and a ground pattern spaced apart from each other; and a substrate including a terminal electrode connected to the plurality of terminal patterns and a ground electrode electrically connected to the ground pattern, wherein the ground electrode is spatially spaced apart from each other on the upper surface of the substrate and made of a metal material and a plurality of upper mounting pads.

The plurality of upper mounting pads may be connected to each other through a plurality of solder layers and the ground pattern positioned on a lower surface of the dielectric filter.

Here, the plurality of solder layers may be spaced apart from each other and positioned on each of the plurality of upper mounting pads to be electrically connected to the ground pattern.

The plurality of upper mounting pads may be connected to each other by a plurality of upper connection lines. Line widths of the plurality of upper connection lines may be smaller than widths of the plurality of upper mounting pads, and a solder resist layer made of an insulating material may be positioned on the plurality of upper connection lines except for the upper mounting pads.

The ground electrode is spatially spaced apart from each other on the lower surface of the substrate and includes a plurality of lower mounting pads made of a metal material, wherein the plurality of lower mounting pads are upper mounted along a plurality of through holes penetrating the substrate. It may be electrically connected to the pad. The plurality of through-holes may be located on the upper connection line.

The plurality of terminal patterns may include a transmission terminal to which a signal to be transmitted to the outside is input, an antenna terminal connected to the antenna, and a reception terminal to which a signal transmitted from the outside is input.

The terminal electrode is located on the upper surface of the substrate, and includes an upper transmitting pad electrically connected to the transmitting terminal, an upper antenna pad electrically connected to the antenna terminal, and an upper receiving pad electrically connected to the receiving terminal can do.

The terminal electrode further includes a lower transmitting pad, a lower antenna pad, and a lower receiving pad positioned on the lower surface of the substrate, wherein the lower transmitting pad is electrically connected to the upper transmitting pad through the through hole, and the lower An antenna pad may be electrically connected to the upper antenna pad through the through hole, and the lower receiving pad may be electrically connected to the upper receiving pad through a through hole formed in the substrate.

A metal shielding shield may be further provided that is spaced apart from the front surface of the dielectric filter, the upper end is electrically connected to the ground pattern located on the upper surface of the dielectric filter, and the lower end is electrically connected to the substrate.

An upper shielding pad electrically connected to a lower end of the shielding shield may be further provided on the upper surface of the substrate, and the upper shielding pad may be electrically connected to the upper mounting pad. In addition, a length of the upper shielding pad may be greater than a width of the upper mounting pad.

A plurality of lower shielding pads connected to the upper shielding pad may be further provided on a lower surface of the substrate through a through hole passing through the substrate, and the plurality of lower shielding pads may be electrically connected to the lower mounting pad.

The dielectric filter module according to an example of the present invention allows the ground electrode connected to the ground pattern of the dielectric filter on the substrate to be spatially spaced apart from each other, so that when the dielectric filter and the substrate are bonded to each other, heat and thermal expansion applied to the dielectric filter can be minimized. and, thereby, it is possible to minimize structural damage applied to the dielectric block by thermal expansion.

1 is a view for explaining a dielectric filter module according to an example of the present invention.
FIG. 2 is a diagram for explaining a dielectric filter in FIG. 1 .
FIG. 3 is a cross-sectional view taken along line AA in FIG. 1 .
FIG. 4 is an enlarged view of a cross section of part B in FIG. 3 .
5 is a view for explaining an upper surface pattern and a lower surface pattern of a substrate according to an example of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that adding a detailed description of a technique or configuration already known in the relevant field may make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, the terms used in this specification are terms used to properly express the embodiments of the present invention, which may vary according to a person or custom in the relevant field. Accordingly, definitions of these terms should be made based on the content throughout this specification.

The terminology used herein is for the purpose of referring to specific embodiments only, and is not intended to limit the invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. As used herein, the meaning of 'comprising' specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 is a diagram for explaining a dielectric filter module according to an example of the present invention, FIG. 2 is a diagram for explaining the dielectric filter 100 in FIG. 1, and FIG. 3 is a cross-section taken along line AA in FIG. did it

The dielectric filter 100 is a component that passes only a desired frequency and attenuates the rest, and may mainly contain ceramic. The dielectric filter 100 is strong against static electricity and can be quickly changed according to various frequencies.

Such a dielectric filter 100 may be connected to the substrate 200 and configured as a dielectric filter module in order to connect to an antenna and connect to other circuit elements together with input or output of a signal.

As an example, the dielectric filter module according to an example of the present invention may include a dielectric filter 100 and a substrate 200 as shown in FIG. 1 , to minimize the effect of electromagnetic waves on the dielectric filter 100 . For this, it is also possible that a shielding shield 300 for shielding electromagnetic waves is further provided. Since the performance of the dielectric filter module can be further improved when the shielding shield 300 is provided, a case in which the shielding shield 300 is provided in the dielectric field module will be described below as an example. In this way, the dielectric filter module in which the dielectric filter and the substrate are coupled may be used while being electrically connected to another circuit board.

As shown in FIG. 2 , the dielectric filter 100 may include a dielectric block 110 , a plurality of terminal patterns 140 , and a ground pattern 130 .

The dielectric block 110 may be formed of a ceramic material that is an insulating material, and the plurality of terminal patterns 140 and the ground pattern 130 may be formed of a conductive metal.

Specifically, the dielectric block 110 may include a plurality of resonance holes 120 penetrating between the front and rear surfaces of the dielectric block 110 to form the body of the dielectric filter 100 . Various metal patterns are formed inside the plurality of resonance holes 120 and at the front entrance, so that the resonance hole 120 functions as an inductor or a capacitor.

The plurality of terminal patterns 140 may extend from a front surface to a lower surface of the dielectric block 110 . The plurality of terminal patterns 140 may be spaced apart from the metal pattern of the resonance hole 120 on the front surface of the dielectric block 110 , and may extend to the lower surface of the dielectric block 110 .

For example, the plurality of terminal patterns 140 may include a transmitting terminal 141 to which a signal to be transmitted to the outside is input, an antenna terminal 142 connected to the antenna, and a receiving terminal 143 to which a signal transmitted from the outside is input. can Here, the transmitting terminal 141 , the antenna terminal 142 and the receiving terminal 143 are not limited to the positions of FIG. 1 , and may be partially changed or their positions may be changed depending on the characteristics and convenience of the dielectric filter 100 . .

The plurality of terminal patterns 140 may be electrically connected to terminal electrodes made of a conductive metal material formed on the substrate 200 on the lower surface of the dielectric block 110 .

The ground pattern 130 may entirely surround the dielectric block 110 , and may be provided to be spaced apart from the plurality of terminal patterns 140 . For example, the ground pattern 130 may be provided to completely cover the upper surface and both side surfaces of the dielectric block 110 , and the lower surface of the dielectric block 110 may be spaced apart from the plurality of terminal patterns 140 , the dielectric It may be formed to cover most of the block 110 .

The ground pattern 130 may be connected to a ground electrode made of a conductive material formed on the substrate 200 on the lower surface of the dielectric block 110 by a conductive solder layer.

The shielding shield 300 may perform a function of minimizing the influence of various metal patterns extending from the resonance hole 120 exposed on the front surface of the dielectric filter 100 from an external unwanted magnetic field. To this end, the shielding shield 300 is spaced apart from the front surface of the dielectric filter 100 as shown in FIG. 3 , and the upper end thereof may be electrically connected to the ground pattern 130 located on the upper surface of the dielectric filter 100 . , the lower end may be electrically connected to the substrate 200 by a conductive solder layer.

As shown in FIG. 3 , the dielectric filter 100 may be electrically connected to the substrate 200 . Here, the specific structure in which the dielectric filter 100 is connected to the substrate 200 and the structure of the substrate 200 will be described in more detail as follows.

FIG. 4 is an enlarged cross-section of part B in FIG. 3 , and FIG. 5 (a) is a diagram for explaining the upper surface pattern of the substrate 200 according to an example of the present invention, FIG. 5 (b) is a diagram for explaining a lower surface pattern of the substrate 200 according to an example of the present invention.

As shown in FIG. 4 , the ground pattern 130 provided in the dielectric block 110 is connected to the ground electrode 210 formed on the upper surface of the substrate 200 through a plurality of solder layers 500 spaced apart from each other. However, a plurality of solder layers 500 positioned between the dielectric filter 100 and the substrate 200 may be spaced apart from each other.

Here, the substrate 200 may include a substrate 200 body 250 of an insulating material forming the body of the substrate 200 , a ground electrode 210 , a terminal electrode 250 , and the like. Here, the terminal electrode 250 may be connected to the plurality of terminal patterns 140 formed on the lower surface of the dielectric filter 100 , and the ground electrode 210 is the ground pattern 130 formed on the lower surface of the dielectric filter 100 . ) can be electrically connected to.

As shown in FIGS. 4 and 5 (a) and (b), the ground electrode 210 includes an upper mounting pad 211a positioned on the upper surface of the substrate 200, an upper connection line 212a, and the substrate ( It may include a lower mounting pad 211b and a lower connection line 212b located on the lower surface of the 200 .

The upper mounting pad 211a has a conductive metal material such as copper (Cu), and as shown in FIGS. 4 and 5 (a), may be spatially spaced apart from each other on the upper surface of the substrate 200, They may be connected to each other by a plurality of upper connection lines 212a made of a conductive metal material such as copper (Cu). Accordingly, as shown in FIG. 5A , the upper mounting pad 211a may be positioned at the vertex of the lattice structure arranged by the upper connection line 212a.

In addition, a solder resist layer 220 made of an insulating material may be positioned on the plurality of upper connection lines 212a excluding the upper mounting pad 211a among the upper mounting pad 211a and the plurality of upper connection lines 212a. Such a solder resist layer 220 may be formed not only in the region on the upper connection line 212a, but also in the remaining region of the substrate 200 in which the ground electrode 210 is not formed.

Accordingly, in the area of the substrate 200 on which the ground electrode 210 is located, the remaining area except for the upper mounting pad 211a of the ground electrode 210 may be covered by the solder resist layer 220 , and the upper mounting pad may be covered by the solder resist layer 220 . The 211a may be exposed on the upper surface of the substrate 200 in the form of a grid.

Accordingly, when the dielectric filter 100 and the substrate 200 are electrically connected to each other, the plurality of solder layers 500 may be spaced apart from each other and positioned on each of the plurality of upper mounting pads 211a. The upper mounting pad 211a of FIG. 1 may be connected to each other through the ground pattern 130 positioned on the lower surface of the dielectric filter and the plurality of solder layers 500 .

Accordingly, according to the present invention, the solder layer 500 can be dividedly formed on the upper surface of the substrate 200 in a lattice form, and thermal expansion of the ground electrode 210 can be minimized, and the ground electrode 210 can be divided. ), structural damage to the dielectric block 110 due to thermal expansion can be minimized.

Here, in the present invention, in order to further minimize the thermal expansion of the ground electrode 210 , the line width D3 of the plurality of upper connection lines 212a may be smaller than the width D2 of the plurality of upper mounting pads 211a. For example, the ratio of the width D3 of the upper connection line 212a to the width D2 of the upper mounting pad 211a may be between 1:1.5 and 2.5. As a more specific example, the ratio of the width D3 of the upper connection line 212a to the width D2 of the upper mounting pad 211a may be approximately 1:2.

In addition, as shown in FIGS. 4 and 5 (a), a through hole 230 penetrating the substrate 200 is formed in the upper connection line 212a, and the substrate 200 through the through hole 230 is formed. ) may be electrically connected to the ground electrode 210 located on the lower surface.

More specifically, as shown in FIGS. 4 and 5B , the ground electrode 210 further includes a plurality of lower mounting pads 211b and a lower connection line 212b on the lower surface of the substrate 200 . can be provided

More specifically, the plurality of lower mounting pads 211b and the lower connection line 212b made of a metal material pass through the first region S1 of the lower surface of the substrate 200 as shown in FIG. 5B . It may be formed as an electrode, the solder resist layer 220 may be positioned on the lower connection line 212b , and the solder resist layer 220 may not be formed on the lower mounting pad 211b . Accordingly, as shown in FIG. 5B , the lower mounting pad 211b may be exposed to the outside of the solder resist layer 220 .

As described above, the plurality of lower mounting pads 211b and the lower connection line 212b formed of the conductive electrode may be electrically connected to the upper connection line 212a through the through hole 230 .

Accordingly, the plurality of lower mounting pads 211b may be spaced apart from each other on the lower surface of the substrate 200 and may be electrically connected to the upper mounting pad 211a along the through hole 230 .

Here, as shown in FIG. 5 , each area and spacing of the upper mounting pad 211a positioned on the upper surface of the substrate 200 is that of the lower mounting pad 211b positioned on the lower surface of the substrate 200 . It may be formed differently from each area and spacing. However, this is only an example, and it is possible to be formed identically to each other.

In addition, a terminal electrode 250 and a shielding pad 260 may be further provided on the upper surface of the substrate 200 .

The terminal electrode 250 is located on the upper surface of the substrate 200 , and includes an upper transmitting pad 251a electrically connected to the transmitting terminal 141 located on the lower surface of the dielectric filter 100 , an upper transmitting pad 251a , an antenna terminal 142 , and It may include an upper antenna pad 252a electrically connected to the upper antenna pad 252a and an upper receiving pad 253a electrically connected to the reception terminal 143 .

In addition, the terminal electrode 250 may further include a lower transmitting pad 251b, a lower antenna pad 252b, and a lower receiving pad 253b positioned on the lower surface of the substrate 200 . The lower transmission pad 251b is electrically connected to the upper transmission pad 251a through the through hole 230 , and the lower antenna pad 252b is electrically connected to the upper antenna pad 252a through the through hole 230 . The lower receiving pad 253b may be electrically connected to the upper receiving pad 253a through the through hole 230 formed in the substrate 200 .

As described above, the terminal electrode 250 and the ground electrode 210 formed on the substrate 200 may be spaced apart from each other and electrically insulated from each other.

The shielding pad 260 may be electrically connected to the lower end of the shielding shield 300 , and the upper shielding pad 260 positioned on the upper surface of the substrate 200 and the second region S2 on the lower surface of the substrate 200 . ) may be provided with a lower shielding pad 260 located in the.

Here, the length of the upper shielding pad 260 may be greater than the width of the upper mounting pad 211a. For example, the length of the upper shielding pad 260 to the width of the upper mounting pad 211a may have a ratio of 1: 3 to 6.

The upper shielding pad 260 may be electrically connected to the upper mounting pad 211a and the upper connection line 212a that are the ground electrodes 210 , and the upper shielding pad 260 and the lower shielding pad 260 may have a through hole ( 230 may be electrically connected to each other, and the lower shielding pad 260 may be electrically connected to the lower mounting pad 211b and the lower connection line 212b provided on the lower surface of the substrate 200 .

As such, in the dielectric filter module according to an example of the present invention, the upper mounting pad 211a electrically connected to the ground pattern 130 of the dielectric filter 100 is spatially spaced apart from each other on the upper surface of the substrate 200, and is formed. As a result, the solder layer 500 is dispersedly distributed on the upper mounting pad 211a during connection, thereby minimizing damage to the dielectric filter 100 due to thermal expansion, thereby reducing the characteristics of the dielectric filter 100 . can be prevented from becoming

The technical features disclosed in each embodiment of the present invention are not limited only to the embodiment, and unless they are mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to different embodiments.

Accordingly, in each embodiment, each technical feature will be mainly described, but unless the technical features are incompatible with each other, they may be merged and applied.

The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations will be possible from the point of view of those of ordinary skill in the art to which the present invention pertains. Accordingly, the scope of the present invention should be defined not only by the claims of the present specification, but also by those claims and their equivalents.

100: dielectric filter 110: dielectric block
120: resonance hole 130: ground pattern
140: terminal pattern 200: board
210: ground electrode 220: solder resist layer
230: through hole 250: terminal electrode
300: shielding shield 500: solder layer

Claims (11)

A dielectric block having a resonance hole penetrating between the front and rear surfaces thereof, a plurality of terminal patterns extending from the front to the lower surface of the dielectric block, and a ground pattern completely surrounding the dielectric block and spaced apart from the plurality of terminal patterns. a dielectric filter comprising; and
a substrate including a terminal electrode connected to the plurality of terminal patterns and a ground electrode electrically connected to the ground pattern;
The ground electrode is
A plurality of upper mounting pads spaced apart from each other in a region overlapping the lower surface of the dielectric filter among the upper surface of the substrate and made of a metal material;
and a plurality of lower mounting pads spaced apart from each other on the lower surface of the substrate and made of a metal material;
The plurality of upper mounting pads are connected to each other through the ground pattern and a plurality of solder layers positioned on the lower surface of the dielectric filter,
The plurality of upper mounting pads are connected to each other by a plurality of upper connection lines whose upper portions are covered by a solder resist layer made of an insulating material,
The plurality of upper mounting pads are electrically connected to the lower mounting pads through a plurality of through-holes penetrating the substrate,
The plurality of through-holes are located on the plurality of upper connection lines, but are spaced apart from the plurality of upper mounting pads. According to claim 1,
The plurality of solder layers are spaced apart from each other and positioned on each of the plurality of upper mounting pads to be electrically connected to the ground pattern. delete According to claim 1,
A line width of the plurality of upper connection lines is smaller than a width of the plurality of upper mounting pads. delete delete delete According to claim 1,
The plurality of terminal patterns includes a transmitting terminal to which a signal to be transmitted to the outside is input, an antenna terminal connected to the antenna, and a receiving terminal to which a signal transmitted from the outside is input,
The terminal electrode is located on the upper surface of the substrate,
A dielectric filter module comprising: an upper transmitting pad electrically connected to the transmitting terminal; an upper antenna pad electrically connected to the antenna terminal; and an upper receiving pad electrically connected to the receiving terminal. 9. The method of claim 8,
The terminal electrode further includes a lower transmitting pad, a lower antenna pad, and a lower receiving pad positioned on the lower surface of the substrate,
The lower transmission pad is electrically connected to the upper transmission pad through the through hole,
The lower antenna pad is electrically connected to the upper antenna pad through the through hole,
The lower receiving pad is electrically connected to the upper receiving pad through a through hole formed in the substrate. According to claim 1,
Doedoe spaced apart from the front surface of the dielectric filter, the upper end is electrically connected to the ground pattern located on the upper surface of the dielectric filter, the lower end is further provided with a metal shielding shield electrically connected to the substrate,
An upper shielding pad electrically connected to a lower end of the shielding shield is further provided on the upper surface of the substrate;
and the upper shielding pad is electrically connected to the upper mounting pad. 11. The method of claim 10,
A plurality of lower shielding pads connected to the upper shielding pad through a through hole passing through the substrate is further provided on the lower surface of the substrate;
The plurality of lower shielding pads are electrically connected to the lower mounting pads.

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