US20150346602A1 - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- US20150346602A1 US20150346602A1 US14/407,223 US201414407223A US2015346602A1 US 20150346602 A1 US20150346602 A1 US 20150346602A1 US 201414407223 A US201414407223 A US 201414407223A US 2015346602 A1 US2015346602 A1 US 2015346602A1
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- pattern
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- Embodiments of the present invention relate to a touch panel and a manufacturing method thereof.
- FIG. 1 A sectional view of a pixel region and a peripheral drive region of a touch panel is shown in FIG. 1 , and the touch panel comprises a pattern of a metal connecting layer 4 formed on a substrate 7 , a pattern of an insulating layer 5 on the pattern of the metal connecting layer 4 , a pattern of a driving electrode 2 that is provided on the pattern of the insulating layer 5 and is connected to the pattern of the metal connecting layer 4 through a via-hole in the pattern of the insulating layer 5 , a pattern of a sensing electrode 1 on the pattern of the insulating layer 5 , and a pattern of a protective layer 6 that is provided to cover the pattern of the driving electrode 2 and the pattern of the sensing electrode 1 .
- a via-hole is formed in the protective layer 6 in the peripheral drive region, so that the driving electrode 2 exposed by the via-hole is connected to a peripheral drive circuit (not shown); there is no via-hole in the protective layer 6 in the pixel region, and a downward concave happens to the protective layer 6 in the region as shown in FIG. 1 .
- the reason for this is that there are steps in the level (the lower level) under the protective layer 6 , and thus the protective layer 6 in the pixel region will be concaved downward to a certain degree.
- the manufacturing process of the above touch panel is usually as follows.
- a layer of metal thin film is formed on a substrate and patterned with a mask so as to form pattern of a metal connecting layer 4 .
- a layer of non-metal thin film is deposited on the substrate 7 with pattern of the metal connecting layer 4 formed thereon, and is patterned with a mask so as to form the pattern of an insulating layer 5 ; a via-hole in the insulating layer 5 in the pixel region is smaller, and a via-hole in the insulating layer 5 in the peripheral drive region is relatively larger.
- a layer of thin film of a transparent conductive material is formed on the substrate further, and is patterned to form the pattern of a driving electrode 2 and the pattern of a sensing electrode 1 through a mask.
- a layer of non-metal thin film is formed, and subjected to an exposure and development process with a mask, and etched to form a pattern of a protective layer 6 .
- the portion of the mask corresponding to the pixel region of the substrate is light-proof, and only the portion of the mask corresponding to the peripheral drive region of the substrate is transparent to light.
- a touch panel and a manufacturing method thereof capable of decreasing the number of mask during manufacture and saving the production cost.
- a manufacturing method of a touch panel which comprises forming pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode, a pattern of a sensing electrode and a pattern of a protective layer on a substrate; the pattern of the insulating layer and the pattern of the protective layer are formed through a same mask.
- a touch panel comprising a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode and a pattern of a sensing electrode, a pattern of a protective layer; and the pattern of the insulating layer and the pattern of the protective layer are produced by using the above method.
- FIG. 1 is a sectional view illustrating a pixel region and a peripheral drive region of a touch panel
- FIG. 2 is a schematic flowchart illustrating a manufacturing method of a touch panel according to an embodiment of the invention
- FIG. 3 is a structurally schematic view illustrating a substrate after formation of a metal connecting layer according to an embodiment of the invention
- FIG. 4 is a schematic view illustrating a patterning method of an insulating layer according to an embodiment of the invention.
- FIG. 5 is a structurally schematic view illustrating a substrate after formation of an insulating layer according to an embodiment of the invention
- FIG. 6 is a structurally schematic view illustrating a substrate after formation of pattern of a driving electrode and a sensing electrode according to an embodiment of the invention
- FIG. 7 is a schematic view illustrating a patterning method of a protective layer according to an embodiment of the invention.
- FIG. 8 is a schematic view illustrating a patterning method of a protective layer according to another embodiment of the invention.
- the pattern of the insulating layer 5 and the pattern of the protective layer 6 are produced by using a same mask, so that the production cost can be reduced.
- the area on the left side of the dotted line is a pixel region, and that on the right side of the dotted line is a peripheral drive region.
- a pixel region is formed in the central part, and a peripheral drive region is formed on one or more sides of the pixel region.
- FIG. 2 is a schematic flowchart illustrating a manufacturing method of a touch panel according to an embodiment of the invention. As shown in FIG. 2 , the method comprises the following steps.
- Step 201 a pattern of a metal connecting layer is formed on a substrate.
- a layer of metal thin film is deposited on a substrate 7 , and subjected to a patterning process.
- One example of the patterning process comprising exposure through a first mask, development and etching is conducted, so as to form a pattern of a metal connecting layer 4 , as shown in FIG. 3 .
- the substrate 7 is such as a glass substrate, a plastic substrate or the like.
- Step 202 a pattern of an insulating layer 5 is formed on the substrate with the pattern of the metal connecting layer formed thereon.
- a layer of non-metal (e.g., silicon nitride) thin film is deposited on the substrate 7 with the pattern of the metal connecting layer 4 formed thereon, and a photosensitive material (e.g., a photoresist or a photosensitive resin) is coated on the non-metal thin film.
- a photosensitive material e.g., a photoresist or a photosensitive resin
- a positive photoresist is used for example, that is, the photoresist is not soluble to a developing solution as it is, but converted into a soluble substance after exposure so as to expose the structure in a light-exposure region of the substrate. Accordingly, a photoresist fully-removed region is formed on the substrate in correspondence with a transmissive region of a mask used in at least one embodiment of the invention, and a photoresist fully-retained region is formed on the substrate in correspondence with an opaque (lightproof) region of the mask.
- the photosensitive material 10 is exposed and developed, so as to form a fully-removed region for the photosensitive material in a region corresponding to the pattern of an insulating layer 5 .
- the height of the second mask 9 from the photosensitive material 10 is about 1152 mm; the thickness and the amount of exposure of the photosensitive material 10 are adjusted, for allowing the photosensitive material 10 corresponding to via-holes in the insulating layer 5 to be exposed fully.
- the thickness of the photosensitive material 10 is in the range of 2 to 3 ⁇ m, and because the relationship between the thickness and the amount of exposure is not linear, the range of the amount of exposure given here is from 30 mj to 60 mj.
- the light-exposure portion 11 of the photosensitive material is shown in FIG. 4 .
- the amount of exposure can be adjusted by means of changing the scanning speed of the light source for emitting ultraviolet light 8 , such as, between 100 mm/s and 200 mm/s. The faster the scanning speed is, the smaller the amount of exposure is provided; and on the contrary, the greater the amount of exposure is provided.
- the size of the via-hole in the insulating layer 5 in correspondence with the pixel region is smaller, usually in the range of 2 to 3 ⁇ m; and the size of the via-hole in correspondence with the peripheral drive region is larger, usually in the range of 4 to 6 ⁇ m.
- Step 203 a pattern of a driving electrode and a pattern of a sensing electrode are formed on the substrate with the pattern of the insulating layer formed thereon.
- a layer of thin film of a transparent conductive material such as an indium tin oxide (ITO) thin film, is deposited on the substrate with the pattern of the insulating layer 5 formed thereon, and is subjected to exposure through a third mask, development and etching, so as to form the pattern of a driving electrode 2 and the pattern of a sensing electrode 1 , as shown in FIG. 6 .
- ITO indium tin oxide
- Step 204 a pattern of a protective layer is formed on the substrate with the pattern of the driving electrode and the pattern of the sensing electrode formed thereon.
- a layer of non-metal (e.g., SiNx or the like may be selected) thin film is deposited on the substrate with the pattern of the driving electrode and the pattern of the sensing electrode formed thereon, and a photosensitive material 10 (e.g., a photoresist) is coated on the non-metal thin film
- exposure with a second mask 9 and development are conducted upon the photosensitive material 100 so as to form a fully-removed region for the photosensitive material in a region in correspondence with pattern of the protective layer 6 in the peripheral drive region, and to form a partial-retained region in a region in correspondence with the pattern of the protective layer 6 in the pixel region.
- the thickness and the amount of exposure of the photosensitive material 100 can be adjusted by means of changing the scanning speed of a light source for emitting ultraviolet light 80 .
- the thickness of the photosensitive material 100 is in the range of 2 to 3 ⁇ m, and because the relationship between the thickness and the amount of exposure is not linear, the range of the amount of exposure given here is from 20 mj to 30 mj, and the scanning speed of the light source is in the range of 200 mm/s to 300 mm/s. It is realized that the photosensitive material 100 in correspondence with the via-hole in the periphery region is fully exposed, and the photosensitive material 100 in correspondence with the via-hole in the protective layer 6 in the pixel region is partially exposed. A light-exposure portion 110 of the photosensitive material is shown in FIG. 7 .
- a via-hole is formed in the protective layer 6 in the peripheral drive region, and no via-hole is formed in the protective layer 6 in the pixel region.
- a manufacturing method of another touch panel there is further provided a manufacturing method of another touch panel.
- the processes for forming pattern of an insulating layer 5 and the pattern of a driving electrode and the pattern of a sensing electrode are the same as the foregoing, and details are omitted here.
- a same mask is used for forming the pattern of the insulating layer 5 and the pattern of the protective layer 6 , and the portion corresponding to a via-hole in the insulating layer in the pixel region is half-transparent (e.g., light transmittance is 50%), and this half-transparent can be achieved by arranging a translucent membrane at a corresponding location, as shown in FIG. 8 .
- the thickness (2-3 ⁇ m) of the photosensitive material 10 and the scanning speed (100-200 mm/s) of the light source are adjusted, for allowing the photosensitive material 10 corresponding to the via-holes in the insulating layer 5 to be exposed fully.
- the thickness (2-3 ⁇ m) of the photosensitive material 10 and the scanning speed (200-300 mm/s) of the light source are adjusted, so as to form a fully-removed region of the photosensitive material in a region in correspondence with the pattern of the protective layer 6 in the peripheral drive region, and to form a partial-retained region in a region in correspondence with the pattern of the protective layer 6 in the pixel region, as shown in FIG. 8 .
- a manufacturing method of a touch panel which comprises forming a pattern of a metal connecting layer on a substrate through a first mask, forming a pattern of an insulating layer through a second mask, forming a pattern of a driving electrode and a pattern of a sensing electrode through a third mask; and forming a pattern of a protective layer through the second mask again.
- a touch panel comprising a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode and a pattern of a sensing electrode, a pattern of a protective layer.
- the pattern of the insulating layer and the pattern of the protective layer are produced by using the method as stated above.
- a touch panel display comprising an individual layer of touch panel as stated above.
- the method comprises forming a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode, a pattern of a sensing electrode and a pattern of a protective layer on a substrate; the pattern of the insulating layer and the pattern of the protective layer are formed through the same mask.
- the masks used in patterning processes can be reduced from the original four masks to three masks in the course of manufacturing the touch panel according to embodiments of the invention, so that the number of mask can be decreased. Thus, the production cost is reduced.
Abstract
Description
- Embodiments of the present invention relate to a touch panel and a manufacturing method thereof.
- Currently, touch panel displays have been developed rapidly, and have become the mainstream of the flat panel displays gradually. A sectional view of a pixel region and a peripheral drive region of a touch panel is shown in
FIG. 1 , and the touch panel comprises a pattern of ametal connecting layer 4 formed on asubstrate 7, a pattern of aninsulating layer 5 on the pattern of themetal connecting layer 4, a pattern of adriving electrode 2 that is provided on the pattern of theinsulating layer 5 and is connected to the pattern of themetal connecting layer 4 through a via-hole in the pattern of theinsulating layer 5, a pattern of a sensing electrode 1 on the pattern of theinsulating layer 5, and a pattern of aprotective layer 6 that is provided to cover the pattern of the drivingelectrode 2 and the pattern of the sensing electrode 1. A via-hole is formed in theprotective layer 6 in the peripheral drive region, so that the drivingelectrode 2 exposed by the via-hole is connected to a peripheral drive circuit (not shown); there is no via-hole in theprotective layer 6 in the pixel region, and a downward concave happens to theprotective layer 6 in the region as shown inFIG. 1 . The reason for this is that there are steps in the level (the lower level) under theprotective layer 6, and thus theprotective layer 6 in the pixel region will be concaved downward to a certain degree. - The manufacturing process of the above touch panel is usually as follows.
- Firstly, a layer of metal thin film is formed on a substrate and patterned with a mask so as to form pattern of a
metal connecting layer 4. - Secondly, a layer of non-metal thin film is deposited on the
substrate 7 with pattern of themetal connecting layer 4 formed thereon, and is patterned with a mask so as to form the pattern of aninsulating layer 5; a via-hole in theinsulating layer 5 in the pixel region is smaller, and a via-hole in theinsulating layer 5 in the peripheral drive region is relatively larger. - Next, a layer of thin film of a transparent conductive material is formed on the substrate further, and is patterned to form the pattern of a driving
electrode 2 and the pattern of a sensing electrode 1 through a mask. - Finally, a layer of non-metal thin film is formed, and subjected to an exposure and development process with a mask, and etched to form a pattern of a
protective layer 6. Here, the portion of the mask corresponding to the pixel region of the substrate is light-proof, and only the portion of the mask corresponding to the peripheral drive region of the substrate is transparent to light. - As can be seen, four masks are demanded in the manufacturing procedure of the above touch panel for patterning processes, the number of required masks is larger, and the production cost is relatively high.
- According to at least one embodiment of the present invention, there are provided a touch panel and a manufacturing method thereof, capable of decreasing the number of mask during manufacture and saving the production cost.
- According to at least one embodiment of the invention, there is provided a manufacturing method of a touch panel, which comprises forming pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode, a pattern of a sensing electrode and a pattern of a protective layer on a substrate; the pattern of the insulating layer and the pattern of the protective layer are formed through a same mask.
- According to at least one embodiment of the invention, there is further provided a touch panel, comprising a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode and a pattern of a sensing electrode, a pattern of a protective layer; and the pattern of the insulating layer and the pattern of the protective layer are produced by using the above method.
- In order to illustrate the technical solution of the embodiments of the invention more clearly, the drawings of the embodiments will be briefly described below; it is obvious that the drawings as described below are only related to some embodiments of the invention, but not limitative of the invention.
-
FIG. 1 is a sectional view illustrating a pixel region and a peripheral drive region of a touch panel; -
FIG. 2 is a schematic flowchart illustrating a manufacturing method of a touch panel according to an embodiment of the invention; -
FIG. 3 is a structurally schematic view illustrating a substrate after formation of a metal connecting layer according to an embodiment of the invention; -
FIG. 4 is a schematic view illustrating a patterning method of an insulating layer according to an embodiment of the invention; -
FIG. 5 is a structurally schematic view illustrating a substrate after formation of an insulating layer according to an embodiment of the invention; -
FIG. 6 is a structurally schematic view illustrating a substrate after formation of pattern of a driving electrode and a sensing electrode according to an embodiment of the invention; -
FIG. 7 is a schematic view illustrating a patterning method of a protective layer according to an embodiment of the invention; and -
FIG. 8 is a schematic view illustrating a patterning method of a protective layer according to another embodiment of the invention. - 1-sensing electrode; 2-driving electrode; 3-half-transparent film;
- 4-metal connecting layer; 5-insulating layer; 6-protective layer;
- 7-substrate; 8, 80-ultraviolet light; 9-second mask;
- 10-photosensitive material;
- 11-light-exposure portion of the photosensitive material.
- In at least one embodiment of the present invention, the pattern of the
insulating layer 5 and the pattern of theprotective layer 6 are produced by using a same mask, so that the production cost can be reduced. - Further detailed descriptions will be given below in connection with accompanied drawings In each of the drawings, the area on the left side of the dotted line is a pixel region, and that on the right side of the dotted line is a peripheral drive region. In one display screen, generally a pixel region is formed in the central part, and a peripheral drive region is formed on one or more sides of the pixel region.
-
FIG. 2 is a schematic flowchart illustrating a manufacturing method of a touch panel according to an embodiment of the invention. As shown inFIG. 2 , the method comprises the following steps. -
Step 201, a pattern of a metal connecting layer is formed on a substrate. - For example, a layer of metal thin film is deposited on a
substrate 7, and subjected to a patterning process. One example of the patterning process comprising exposure through a first mask, development and etching is conducted, so as to form a pattern of ametal connecting layer 4, as shown inFIG. 3 . Thesubstrate 7 is such as a glass substrate, a plastic substrate or the like. -
Step 202, a pattern of aninsulating layer 5 is formed on the substrate with the pattern of the metal connecting layer formed thereon. - For example, firstly, a layer of non-metal (e.g., silicon nitride) thin film is deposited on the
substrate 7 with the pattern of themetal connecting layer 4 formed thereon, and a photosensitive material (e.g., a photoresist or a photosensitive resin) is coated on the non-metal thin film. - Here, a positive photoresist is used for example, that is, the photoresist is not soluble to a developing solution as it is, but converted into a soluble substance after exposure so as to expose the structure in a light-exposure region of the substrate. Accordingly, a photoresist fully-removed region is formed on the substrate in correspondence with a transmissive region of a mask used in at least one embodiment of the invention, and a photoresist fully-retained region is formed on the substrate in correspondence with an opaque (lightproof) region of the mask.
- Next, as shown in
FIG. 4 , exposure and development are conducted on thephotosensitive material 10 with asecond mask 9, so as to form a fully-removed region for the photosensitive material in a region corresponding to the pattern of aninsulating layer 5. For example, the height of thesecond mask 9 from thephotosensitive material 10 is about 1152 mm; the thickness and the amount of exposure of thephotosensitive material 10 are adjusted, for allowing thephotosensitive material 10 corresponding to via-holes in theinsulating layer 5 to be exposed fully. The thickness of thephotosensitive material 10 is in the range of 2 to 3 μm, and because the relationship between the thickness and the amount of exposure is not linear, the range of the amount of exposure given here is from 30 mj to 60 mj. The light-exposure portion 11 of the photosensitive material is shown inFIG. 4 . Here, the amount of exposure can be adjusted by means of changing the scanning speed of the light source for emittingultraviolet light 8, such as, between 100 mm/s and 200 mm/s. The faster the scanning speed is, the smaller the amount of exposure is provided; and on the contrary, the greater the amount of exposure is provided. - Finally, development and etching are carried out, so as to obtain the pattern of the
insulating layer 5, as shown inFIG. 5 . The size of the via-hole in theinsulating layer 5 in correspondence with the pixel region is smaller, usually in the range of 2 to 3 μm; and the size of the via-hole in correspondence with the peripheral drive region is larger, usually in the range of 4 to 6 μm. -
Step 203, a pattern of a driving electrode and a pattern of a sensing electrode are formed on the substrate with the pattern of the insulating layer formed thereon. - For example, a layer of thin film of a transparent conductive material, such as an indium tin oxide (ITO) thin film, is deposited on the substrate with the pattern of the
insulating layer 5 formed thereon, and is subjected to exposure through a third mask, development and etching, so as to form the pattern of adriving electrode 2 and the pattern of a sensing electrode 1, as shown inFIG. 6 . -
Step 204, a pattern of a protective layer is formed on the substrate with the pattern of the driving electrode and the pattern of the sensing electrode formed thereon. - For example, firstly, a layer of non-metal (e.g., SiNx or the like may be selected) thin film is deposited on the substrate with the pattern of the driving electrode and the pattern of the sensing electrode formed thereon, and a photosensitive material 10 (e.g., a photoresist) is coated on the non-metal thin film
- Secondly, as shown in
FIG. 7 , exposure with asecond mask 9 and development are conducted upon thephotosensitive material 100 so as to form a fully-removed region for the photosensitive material in a region in correspondence with pattern of theprotective layer 6 in the peripheral drive region, and to form a partial-retained region in a region in correspondence with the pattern of theprotective layer 6 in the pixel region. Here, the thickness and the amount of exposure of thephotosensitive material 100 can be adjusted by means of changing the scanning speed of a light source for emittingultraviolet light 80. The thickness of thephotosensitive material 100 is in the range of 2 to 3 μm, and because the relationship between the thickness and the amount of exposure is not linear, the range of the amount of exposure given here is from 20 mj to 30 mj, and the scanning speed of the light source is in the range of 200 mm/s to 300 mm/s. It is realized that thephotosensitive material 100 in correspondence with the via-hole in the periphery region is fully exposed, and thephotosensitive material 100 in correspondence with the via-hole in theprotective layer 6 in the pixel region is partially exposed. A light-exposure portion 110 of the photosensitive material is shown inFIG. 7 . - At last, development and etching are carried out, so as to obtain the pattern of the
protective layer 6. As shown inFIG. 1 , a via-hole is formed in theprotective layer 6 in the peripheral drive region, and no via-hole is formed in theprotective layer 6 in the pixel region. - According to at least one embodiment of the invention, there is further provided a manufacturing method of another touch panel. The processes for forming pattern of an insulating
layer 5 and the pattern of a driving electrode and the pattern of a sensing electrode are the same as the foregoing, and details are omitted here. A same mask is used for forming the pattern of the insulatinglayer 5 and the pattern of theprotective layer 6, and the portion corresponding to a via-hole in the insulating layer in the pixel region is half-transparent (e.g., light transmittance is 50%), and this half-transparent can be achieved by arranging a translucent membrane at a corresponding location, as shown inFIG. 8 . - During manufacture, during the process of forming the pattern of the insulating
layer 5, the thickness (2-3 μm) of thephotosensitive material 10 and the scanning speed (100-200 mm/s) of the light source are adjusted, for allowing thephotosensitive material 10 corresponding to the via-holes in the insulatinglayer 5 to be exposed fully. When the pattern of theprotective layer 6 is formed, the thickness (2-3 μm) of thephotosensitive material 10 and the scanning speed (200-300 mm/s) of the light source are adjusted, so as to form a fully-removed region of the photosensitive material in a region in correspondence with the pattern of theprotective layer 6 in the peripheral drive region, and to form a partial-retained region in a region in correspondence with the pattern of theprotective layer 6 in the pixel region, as shown inFIG. 8 . - According to at least one embodiment of the invention, there is further provided a manufacturing method of a touch panel, which comprises forming a pattern of a metal connecting layer on a substrate through a first mask, forming a pattern of an insulating layer through a second mask, forming a pattern of a driving electrode and a pattern of a sensing electrode through a third mask; and forming a pattern of a protective layer through the second mask again.
- According to at least one embodiment of the invention, there is further provided a touch panel, comprising a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode and a pattern of a sensing electrode, a pattern of a protective layer. The pattern of the insulating layer and the pattern of the protective layer are produced by using the method as stated above.
- According to at least one embodiment of the invention, there is further provided a touch panel display, comprising an individual layer of touch panel as stated above.
- With respect to the touch panel and the manufacturing method thereof provided by at least one embodiment of the invention, the method comprises forming a pattern of a metal connecting layer, a pattern of an insulating layer, a pattern of a driving electrode, a pattern of a sensing electrode and a pattern of a protective layer on a substrate; the pattern of the insulating layer and the pattern of the protective layer are formed through the same mask. The masks used in patterning processes can be reduced from the original four masks to three masks in the course of manufacturing the touch panel according to embodiments of the invention, so that the number of mask can be decreased. Thus, the production cost is reduced.
- The foregoing are merely exemplary embodiments of the invention, but are not used to limit the protection scope of the invention.
- This application claims the benefit of priority from Chinese patent application No. 201310616927.3, filed on Nov. 27, 2013, the disclosure of which is incorporated herein in its entirety by reference as a part of the present application.
Claims (16)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CN201310616927 | 2013-11-27 | ||
CN201310616927.3 | 2013-11-27 | ||
CN201310616927.3A CN104571672B (en) | 2013-11-27 | 2013-11-27 | A kind of touch-screen and preparation method thereof |
PCT/CN2014/077142 WO2015078146A1 (en) | 2013-11-27 | 2014-05-09 | Touch screen and manufacturing method therefor |
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US20150346602A1 true US20150346602A1 (en) | 2015-12-03 |
US9442378B2 US9442378B2 (en) | 2016-09-13 |
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US14/407,223 Active 2034-06-06 US9442378B2 (en) | 2013-11-27 | 2014-05-09 | Touch panel and manufacturing method thereof |
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CN104571672B (en) | 2018-05-08 |
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