US20150092119A1 - Electrode structure for touchscreen - Google Patents
Electrode structure for touchscreen Download PDFInfo
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- US20150092119A1 US20150092119A1 US14/040,836 US201314040836A US2015092119A1 US 20150092119 A1 US20150092119 A1 US 20150092119A1 US 201314040836 A US201314040836 A US 201314040836A US 2015092119 A1 US2015092119 A1 US 2015092119A1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
Definitions
- the instant disclosure relates to an electrode structure for touchscreen; in particular, to an electrode structure for a flexible touch panel.
- ITO indium tin oxide
- the touch panel using metal conductor as the electrodes often occurs the electrodes peeling due to the bad adhesion between the metal conductor and the common substrate, thereby affecting the performance of the touch panel. If applied to the flexible touch panel, it will exacerbate the occurrence of electrode peeling because the substrate is frequently deformed by the change of the environmental conditions.
- the metal conductor is liable to produce metallic luster and be observed easily by the human eyes. Therefore, it is the goal of this industry must strive to develop a steady and invisible electrode structure for a flexible touch panel in conjunction with the imperceptibleness at the same time.
- the object of the instant disclosure is to provide an electrode structure for touchscreen which can be attached to flexible substrate firmly and reduce metallic luster at the same time.
- the instant disclosure is to provide an electrode structure for touchscreen comprising a flexible substrate and a plurality of electrode lines set on the flexible substrate, wherein the electrode lines includes a first adhesive layer set on the flexible substrate, a second adhesive layer set on the first adhesive layer, a conductive layer set on the second adhesive layer and a first resist layer set on the conductive layer.
- the electrode lines may further comprise a second resist layer which at least cover side of the conductive layer and also can cover the first resist layer, the conductive layer, the second adhesive layer and the first adhesive layer on the flexible substrate entirely.
- the second resist layer can reflect the light to different angles to make human eye not come into contact with reflected light, thereby achieve the antireflection effect.
- the first adhesive layer is used to enhance the adhesion to the flexible substrate
- the second adhesive layer is used to enhance the adhesion between the conductive layer and the first adhesive layer
- the instant disclosure can produce a strong adhesion to the flexible substrate through the first adhesive layer, along with the enhance to the adhesion between the conductive layer and the first adhesive layer through the second adhesive layer, thereby the conductive layer can be firmly adhered to the flexible substrate even if the substrate shape changes, the electrodes are not easy to fall off. Furthermore, by controlling the etching rate of each layer to produce the electrode structure with a cascading surface, it can further scatter the light to reducing the visibility.
- FIG. 1 is a sectional drawing of an electrode structure in accordance with first embodiment of the instant disclosure
- FIG. 2 is a sectional drawing of an electrode structure in accordance with second embodiment of the instant disclosure
- FIG. 3 is a sectional drawing of an electrode structure in accordance with third embodiment of the instant disclosure.
- FIG. 4 is a sectional drawing of an electrode structure in accordance with fourth embodiment of the instant disclosure.
- FIG. 5 is a sectional drawing of an electrode structure in accordance with fifth embodiment of the instant disclosure.
- FIG. 6 is a schematic diagram illustrating the electrode structure of the instant disclosure being applied on a touch panel.
- the electrode structure of the instant disclosure comprises a flexible substrate 11 and a plurality of electrode lines 19 (only one line illustrated in FIG. 1 ), and in practice, the electrode lines 19 can be set on the flexible substrate 11 in parallel.
- the electrode lines 19 includes a first adhesive layer 12 set on the flexible substrate 11 , a second adhesive layer 13 set on the first adhesive layer 12 , a conductive layer 14 set on the second adhesive layer 13 and a first resist layer 15 set on the conductive layer 14 .
- the material to form the flexible substrate 11 may comprise one of the groups consisting of PET, PEI, PPSU, PI and its complex.
- the material to form the first adhesive layer 12 may comprise one of the groups consisting of polymer, oxide, metal and its complex, in detail, the polymer is used for improving the adhesion between the first adhesive layer 12 and the flexible substrate 11 ; the oxide is used for the anti-reflective, anti-interference, anti-rainbow pattern, anti-abrasion and anti-scratch; the metal is used for improving the adhesion between the first adhesive layer 12 and the second adhesive layer 13 .
- the polymer may comprise one of the groups consisting of acrylic, PET, PEI, PPSU, PI, PEDOT, polyaniline, polypyrrole and its complex;
- the oxide could be amorphous or polycrystalline oxide film or powder which may comprise one of the groups consisting of titanium oxide, tantalum oxide, silicon oxide, aluminum oxide and its complex;
- the metal may comprise copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, silicon, tin, zinc, iron and its alloys.
- the above polymer, oxide and metal all can use individually or be mixed in two/three material to form complex, for example: a complex with polymer and oxide, a complex with polymer and metal, a complex with oxide and metal, a complex with polymer, oxide and metal. If the complex is used, the ratio range of polymer is between 10-90%, of oxide is between 10-90% and of metal is between 10-90%.
- the oxide also could be a poly-layer complex, in an embodiment, titanium oxide with 900 nm in thickness and silicon oxide with 100 nm in thickness can be chosen. Additionally, as a whole, the thickness of the first adhesive layer 12 is preferred to between 0.001 ⁇ m and 1 ⁇ m; the reflectivity of the first adhesive layer 12 is between 1% and 50% and is preferred under 30%.
- the material to form the second adhesive layer 13 may comprise one of the groups consisting of copper, silver, molybdenum, nickel, chromium, tungsten, titanium, tin, zinc, aluminum, iron and its alloys, and the thickness of the second adhesive layer 13 is preferred between 0.001 ⁇ m and 1 ⁇ m.
- the reflectivity of the second adhesive layer 13 is between 1% and 50% and is preferred under 30%. Additionally, as a whole, the total reflectivity of the first adhesive layer 12 and the second adhesive layer 13 is preferred under 30%.
- the material to form the conductive layer 14 may comprise one of the groups consisting of copper, gold, silver, aluminum, tungsten, iron, nickel, chromium, titanium, molybdenum, tin, zinc and its alloys, and the thickness of the conductive layer 14 is preferred between 0.001 ⁇ m and 5 ⁇ m.
- the material of the second adhesive layer 13 contains the pure metal over than 50% and the material of the first adhesive layer 12 contains the pure metal less than 50%.
- the conductive layer 14 could be straight copper wires
- the first adhesive layer 12 could be a nickel-copper-chromium-iron alloy with the composition ratio of 60:30:10:0 or 80:10:5:5 or a nickel-tungsten alloy with the composition ratio of 50:50, and the first adhesive layer 12 also could contain other trace elements such as silicon, phosphorous and etc
- the second adhesive layer 13 could be a copper-nickel-chromium alloy with the composition ratio of 60:30:10 or a copper-nickel-tungsten alloy with the composition ratio of 60:20:20, and the second adhesive layer 13 also could contain other trace elements such as silicon, phosphorous and etc.
- the material to form the first resist layer 15 may comprise one of the groups consisting of copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, silicon, tin, zinc, iron, and its alloys, and the thickness of the first resist layer 15 is preferred between 0.001 ⁇ m and 1 ⁇ m in an embodiment.
- the reflectivity of the first resist layer 15 is between 1% and 50% and is preferred under 30%.
- a cascading surface (as shown in FIG. 1 ) can be formed with the first adhesive layer 12 , the second adhesive layer 13 , the conductive layer 14 and the first resist layer 15 on the flexible substrate 11 through controlling the etching proportion of the individual layer, and the cascading surface is an irregular surface so when the light reflected from the electrode, the reflective light will be scattered to different angles to make the electrode structure imperceptible for human eyes.
- FIG. 2 is a sectional drawing of an electrode structure in accordance with second embodiment of the instant disclosure.
- the electrode lines 19 may further comprise a second resist layer 26 set on the first resist layer 15 and at least cover the side of the conductive layer 14 , if need be, the electrode lines 19 can entirely cover the first resist layer 15 , the conductive layer 14 , the second adhesive layer 13 and the first adhesive layer 12 on the flexible substrate 11 .
- the second resist layer 26 covers the first resist layer 15 to improve the corrosion resistance of the conductive layer 14 , to reduce the chance of foreign body rubbing metal electrodes to damage and lower the front and side reflective of metal electrodes.
- the material to form the second resist layer 26 may comprise one of the groups consisting of oxide, polymer, carbon and its complex.
- the oxide may comprise silicon oxide, titanium oxide, aluminum oxide and its complex; the polymer may comprise PEDOT, polyaniline, polypyrrole and its complex. If the complex is utilized, the ratio of the polymer is 10-90% and the oxide is 10-90%. Additionally, as a whole, the thickness of the second resist layer 26 is preferred between 0.001 ⁇ m and 1 ⁇ m.
- the reflectivity of the second resist layer 26 is between 1%-50% and is preferred under 30%. Additionally, as a whole, the total reflectivity of the first resist layer 15 and the second resist layer 26 is preferred under 30%.
- FIG. 3 is a sectional drawing of an electrode structure in accordance with third embodiment of the instant disclosure.
- FIG. 4 is a sectional drawing of an electrode structure in accordance with fourth embodiment of the instant disclosure.
- the second resist layer 36 is a thin layer with a cascading surface in FIG. 3 ;
- the second resist layer 46 includes a granular surface and the diameter of the granule thereon is less than 900 nm and is preferred between 300 nm and 800 nm in FIG. 4 ;
- the second resist layer 26 is a thin layer with curved surface in FIG. 2 .
- FIG. 5 is a sectional drawing of an electrode structure in accordance with fifth embodiment of the instant disclosure.
- the second resist layer 26 , 56 both include curved thin layer in electrode structure but the different to FIG. 5 and FIG. 2 is that the first adhesive layer 52 , the second adhesive layer 53 , the conductive layer 54 , the first resist layer 55 all have irregular and rough surfaces, so that the reflective effect of metal electrodes can further be reduced.
- FIG. 6 is a schematic diagram illustrating the electrode structure of the instant disclosure being applied on a touch panel.
- the instant disclosure provides a electrode structure for touchscreen which produces a strong adhesion to the flexible substrate 11 through the first adhesive layer 12 , along with the enhance to the adhesion between the first adhesive layer 12 and the conductive layer 14 through the second adhesive layer 13 , thereby the electrode lines 19 can be firmly adhered to the flexible substrate 11 .
- the first resist layer 15 postpones the oxidation or corrosion to the conductive layer 14
- the second resist layer 26 , 36 , 46 , 56 at least cover the side of the conductive layer 14 , this two protection mechanisms can effectively prevent the electrode contacts form oxidation or corrosion and prolong the durability.
- controlling the etching rate of each layer to produce the electrode structure with a cascading surface it can further scatter the light to reducing the visibility.
- the reflective of the metal electrodes will be reduced, superadded forming the second adhesive layer 13 and the second resist layer 26 , 36 , 46 , 56 further having the effect of anti-reflective, anti-interference, anti-rainbow pattern, to reach vision comfortable.
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Abstract
Description
- 1. Field of the Invention
- The instant disclosure relates to an electrode structure for touchscreen; in particular, to an electrode structure for a flexible touch panel.
- 2. Description of Related Art
- Conventional touch panel generally use indium tin oxide (ITO) to form the electrodes to make the electrodes imperceptible. However, with the gradual development to the large-size touch panel, some defects of ITO electrodes are emerged such as high resistance, slow response and etc. Therefore, the industry has been trying to use thin metal wires to form the electrodes.
- In general, the touch panel using metal conductor as the electrodes often occurs the electrodes peeling due to the bad adhesion between the metal conductor and the common substrate, thereby affecting the performance of the touch panel. If applied to the flexible touch panel, it will exacerbate the occurrence of electrode peeling because the substrate is frequently deformed by the change of the environmental conditions.
- In addition, the metal conductor is liable to produce metallic luster and be observed easily by the human eyes. Therefore, it is the goal of this industry must strive to develop a steady and invisible electrode structure for a flexible touch panel in conjunction with the imperceptibleness at the same time.
- The object of the instant disclosure is to provide an electrode structure for touchscreen which can be attached to flexible substrate firmly and reduce metallic luster at the same time.
- The instant disclosure is to provide an electrode structure for touchscreen comprising a flexible substrate and a plurality of electrode lines set on the flexible substrate, wherein the electrode lines includes a first adhesive layer set on the flexible substrate, a second adhesive layer set on the first adhesive layer, a conductive layer set on the second adhesive layer and a first resist layer set on the conductive layer.
- According to an embodiment of the instant disclosure, the electrode lines may further comprise a second resist layer which at least cover side of the conductive layer and also can cover the first resist layer, the conductive layer, the second adhesive layer and the first adhesive layer on the flexible substrate entirely. The second resist layer can reflect the light to different angles to make human eye not come into contact with reflected light, thereby achieve the antireflection effect.
- In the instant disclosure, the first adhesive layer is used to enhance the adhesion to the flexible substrate, and the second adhesive layer is used to enhance the adhesion between the conductive layer and the first adhesive layer.
- By the above configuration, the instant disclosure can produce a strong adhesion to the flexible substrate through the first adhesive layer, along with the enhance to the adhesion between the conductive layer and the first adhesive layer through the second adhesive layer, thereby the conductive layer can be firmly adhered to the flexible substrate even if the substrate shape changes, the electrodes are not easy to fall off. Furthermore, by controlling the etching rate of each layer to produce the electrode structure with a cascading surface, it can further scatter the light to reducing the visibility.
- In order to further understand the instant disclosure, the following embodiments and illustrations are provided. However, the detailed description and drawings are merely illustrative of the disclosure, rather than limiting the scope being defined by the appended claims and equivalents thereof.
-
FIG. 1 is a sectional drawing of an electrode structure in accordance with first embodiment of the instant disclosure; -
FIG. 2 is a sectional drawing of an electrode structure in accordance with second embodiment of the instant disclosure; -
FIG. 3 is a sectional drawing of an electrode structure in accordance with third embodiment of the instant disclosure; -
FIG. 4 is a sectional drawing of an electrode structure in accordance with fourth embodiment of the instant disclosure; -
FIG. 5 is a sectional drawing of an electrode structure in accordance with fifth embodiment of the instant disclosure; and -
FIG. 6 is a schematic diagram illustrating the electrode structure of the instant disclosure being applied on a touch panel. - An electrode structure of the instant disclosure will be explained below through the embodiments. It has to be mentioned, the embodiments of the present invention are not intended to limit the present invention implementing in any specific environment, applications, or particular manner as described below. Therefore, the description of the embodiments only explains the purpose of the invention, not to limit the present invention.
- Please refer to
FIG. 1 as a sectional drawing of an electrode structure in accordance with first embodiment of the instant disclosure. In this embodiment, the electrode structure of the instant disclosure comprises aflexible substrate 11 and a plurality of electrode lines 19 (only one line illustrated inFIG. 1 ), and in practice, theelectrode lines 19 can be set on theflexible substrate 11 in parallel. Wherein theelectrode lines 19 includes a firstadhesive layer 12 set on theflexible substrate 11, a secondadhesive layer 13 set on the firstadhesive layer 12, aconductive layer 14 set on the secondadhesive layer 13 and afirst resist layer 15 set on theconductive layer 14. - In detail, the first
adhesive layer 12 covers on theflexible substrate 11 to improve the adhesion to theflexible substrate 11 and with the effect of anti-reflective, anti-interference, anti-rainbow pattern, anti-abrasion, anti-scratch and enhance the comfort to human eyes. The secondadhesive layer 13 covers on the firstadhesive layer 12 to improve the adhesion between theconductive layer 14 and the firstadhesive layer 12 and maintains the total conductivity of theelectrode lines 19. Theconductive layer 14 covers on the secondadhesive layer 13 to keep conduct. Thefirst resist layer 15 which has better corrosion resistance than theconductive layer 14 covers on theconductive layer 14 to prevent theconductive layer 14 from lateral etching severely thereby theelectrode lines 19 can retain a normal width. - As a whole, the first
adhesive layer 12 can form a strong adhesion with theflexible substrate 11 along with enhance of the adhesion between theconductive layer 14 and the firstadhesive layer 12 by the secondadhesive layer 13. By this double-layer structure, theconductive layer 14 can be firmly adhered to theflexible substrate 11 with not easy falling off and have the effect of anti-reflective, anti-interference, anti-rainbow pattern, anti-abrasion, anti-scratch and improve the comfort to human eyes. Thefirst resist layer 15 can postpone the oxidation or corrosion to the metal electrode. - To achieve the above effect, the material to form the
flexible substrate 11 may comprise one of the groups consisting of PET, PEI, PPSU, PI and its complex. - Furthermore, the material to form the first
adhesive layer 12 may comprise one of the groups consisting of polymer, oxide, metal and its complex, in detail, the polymer is used for improving the adhesion between the firstadhesive layer 12 and theflexible substrate 11; the oxide is used for the anti-reflective, anti-interference, anti-rainbow pattern, anti-abrasion and anti-scratch; the metal is used for improving the adhesion between the firstadhesive layer 12 and the secondadhesive layer 13. The polymer may comprise one of the groups consisting of acrylic, PET, PEI, PPSU, PI, PEDOT, polyaniline, polypyrrole and its complex; the oxide could be amorphous or polycrystalline oxide film or powder which may comprise one of the groups consisting of titanium oxide, tantalum oxide, silicon oxide, aluminum oxide and its complex; the metal may comprise copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, silicon, tin, zinc, iron and its alloys. It should be emphasized, the above polymer, oxide and metal all can use individually or be mixed in two/three material to form complex, for example: a complex with polymer and oxide, a complex with polymer and metal, a complex with oxide and metal, a complex with polymer, oxide and metal. If the complex is used, the ratio range of polymer is between 10-90%, of oxide is between 10-90% and of metal is between 10-90%. The oxide also could be a poly-layer complex, in an embodiment, titanium oxide with 900 nm in thickness and silicon oxide with 100 nm in thickness can be chosen. Additionally, as a whole, the thickness of the firstadhesive layer 12 is preferred to between 0.001 μm and 1 μm; the reflectivity of the firstadhesive layer 12 is between 1% and 50% and is preferred under 30%. - In the instant disclosure, the material to form the second
adhesive layer 13 may comprise one of the groups consisting of copper, silver, molybdenum, nickel, chromium, tungsten, titanium, tin, zinc, aluminum, iron and its alloys, and the thickness of the secondadhesive layer 13 is preferred between 0.001 μm and 1 μm. The reflectivity of the secondadhesive layer 13 is between 1% and 50% and is preferred under 30%. Additionally, as a whole, the total reflectivity of the firstadhesive layer 12 and the secondadhesive layer 13 is preferred under 30%. - In the instant disclosure, the material to form the
conductive layer 14 may comprise one of the groups consisting of copper, gold, silver, aluminum, tungsten, iron, nickel, chromium, titanium, molybdenum, tin, zinc and its alloys, and the thickness of theconductive layer 14 is preferred between 0.001 μm and 5 μm. - To achieve the optimizing of adhesion and conductivity, if the
conductive layer 14 is formed with pure metal, the material of the secondadhesive layer 13 contains the pure metal over than 50% and the material of the firstadhesive layer 12 contains the pure metal less than 50%. In an embodiment, theconductive layer 14 could be straight copper wires, the firstadhesive layer 12 could be a nickel-copper-chromium-iron alloy with the composition ratio of 60:30:10:0 or 80:10:5:5 or a nickel-tungsten alloy with the composition ratio of 50:50, and the firstadhesive layer 12 also could contain other trace elements such as silicon, phosphorous and etc; the secondadhesive layer 13 could be a copper-nickel-chromium alloy with the composition ratio of 60:30:10 or a copper-nickel-tungsten alloy with the composition ratio of 60:20:20, and the secondadhesive layer 13 also could contain other trace elements such as silicon, phosphorous and etc. - In the instant disclosure, the material to form the
first resist layer 15 may comprise one of the groups consisting of copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, silicon, tin, zinc, iron, and its alloys, and the thickness of thefirst resist layer 15 is preferred between 0.001 μm and 1 μm in an embodiment. The reflectivity of thefirst resist layer 15 is between 1% and 50% and is preferred under 30%. - During the process to manufacturing the electrode structure of the instant disclosure, a cascading surface (as shown in
FIG. 1 ) can be formed with the firstadhesive layer 12, the secondadhesive layer 13, theconductive layer 14 and thefirst resist layer 15 on theflexible substrate 11 through controlling the etching proportion of the individual layer, and the cascading surface is an irregular surface so when the light reflected from the electrode, the reflective light will be scattered to different angles to make the electrode structure imperceptible for human eyes. -
FIG. 2 is a sectional drawing of an electrode structure in accordance with second embodiment of the instant disclosure. In the instant disclosure, theelectrode lines 19 may further comprise asecond resist layer 26 set on thefirst resist layer 15 and at least cover the side of theconductive layer 14, if need be, theelectrode lines 19 can entirely cover thefirst resist layer 15, theconductive layer 14, the secondadhesive layer 13 and the firstadhesive layer 12 on theflexible substrate 11. Thesecond resist layer 26 covers thefirst resist layer 15 to improve the corrosion resistance of theconductive layer 14, to reduce the chance of foreign body rubbing metal electrodes to damage and lower the front and side reflective of metal electrodes. - In the instant disclosure, the material to form the
second resist layer 26 may comprise one of the groups consisting of oxide, polymer, carbon and its complex. The oxide may comprise silicon oxide, titanium oxide, aluminum oxide and its complex; the polymer may comprise PEDOT, polyaniline, polypyrrole and its complex. If the complex is utilized, the ratio of the polymer is 10-90% and the oxide is 10-90%. Additionally, as a whole, the thickness of the second resistlayer 26 is preferred between 0.001 μm and 1 μm. The reflectivity of the second resistlayer 26 is between 1%-50% and is preferred under 30%. Additionally, as a whole, the total reflectivity of the first resistlayer 15 and the second resistlayer 26 is preferred under 30%. -
FIG. 3 is a sectional drawing of an electrode structure in accordance with third embodiment of the instant disclosure.FIG. 4 is a sectional drawing of an electrode structure in accordance with fourth embodiment of the instant disclosure. The different betweenFIG. 3 ,FIG. 4 andFIG. 2 is that the second resistlayer 36 is a thin layer with a cascading surface inFIG. 3 ; the second resistlayer 46 includes a granular surface and the diameter of the granule thereon is less than 900 nm and is preferred between 300 nm and 800 nm inFIG. 4 ; the second resistlayer 26 is a thin layer with curved surface inFIG. 2 . In addition to the second resistlayer FIG. 5 is a sectional drawing of an electrode structure in accordance with fifth embodiment of the instant disclosure. Compared toFIG. 5 andFIG. 2 , the second resistlayer FIG. 5 andFIG. 2 is that the firstadhesive layer 52, the secondadhesive layer 53, theconductive layer 54, the first resistlayer 55 all have irregular and rough surfaces, so that the reflective effect of metal electrodes can further be reduced. - It should be mentioned that the materials and the preferred thickness described in the above components are only to detail the effect of each component and the achievement to reach, not to limit the instant disclosure, as long as the same effect can be achieved, the materials and thickness are not be limited here.
- Next refer to
FIG. 6 , is a schematic diagram illustrating the electrode structure of the instant disclosure being applied on a touch panel. The general situation in practical application to theflexible substrate 11 and the plurality ofelectrode lines 19 as shown in the drawing, the electrode lines 19 on the two surfaces of theflexible substrate 11 are insulated overlapping to each other, and the capacitor value is detecting when the electrode lines 19 is conduction. It should be emphasized, theelectrode lines 19 protrude over theflexible substrate 11 as shown in Fig. is for convenience descriptions and are not actual situation. - In summary, the instant disclosure provides a electrode structure for touchscreen which produces a strong adhesion to the
flexible substrate 11 through the firstadhesive layer 12, along with the enhance to the adhesion between the firstadhesive layer 12 and theconductive layer 14 through the secondadhesive layer 13, thereby theelectrode lines 19 can be firmly adhered to theflexible substrate 11. Furthermore, the first resistlayer 15 postpones the oxidation or corrosion to theconductive layer 14, the second resistlayer conductive layer 14, this two protection mechanisms can effectively prevent the electrode contacts form oxidation or corrosion and prolong the durability. by controlling the etching rate of each layer to produce the electrode structure with a cascading surface, it can further scatter the light to reducing the visibility. Due to a cascading surface included in the electrode structure of the instant disclosure, the reflective of the metal electrodes will be reduced, superadded forming the secondadhesive layer 13 and the second resistlayer - The figures and descriptions supra set forth illustrated the preferred embodiments of the instant disclosure; however, the characteristics of the instant disclosure are by no means restricted thereto. All changes, alternations, combinations or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the instant disclosure delineated by the following claims.
Claims (21)
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