CN207909096U - Electrode structure, Trackpad and touch device - Google Patents

Electrode structure, Trackpad and touch device Download PDF

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Publication number
CN207909096U
CN207909096U CN201721924180.8U CN201721924180U CN207909096U CN 207909096 U CN207909096 U CN 207909096U CN 201721924180 U CN201721924180 U CN 201721924180U CN 207909096 U CN207909096 U CN 207909096U
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layer
molybdenum
blackening
electrode structure
niobium
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王士敏
赵湘辉
朱泽力
古海裕
宋小来
李宝会
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Chongqing Lai Bao Science And Technology Ltd
Shenzhen Laibao Hi Tech Co Ltd
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Chongqing Lai Bao Science And Technology Ltd
Shenzhen Laibao Hi Tech Co Ltd
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Abstract

The utility model is related to a kind of electrode structure, Trackpad and touch devices.A kind of electrode structure is used for touch device, and electrode structure includes the first blackening layer, transition zone and the conductive layer of lamination successively.First blackening layer is the oxynitride layer of the oxide skin(coating) of molybdenum, the nitride layer of molybdenum, the oxynitride layer of molybdenum, the oxide skin(coating) of niobium, the nitride layer of niobium, the oxynitride layer of niobium, the oxide skin(coating) of chromium, the nitride layer of chromium, the oxynitride layer of chromium, titanyl compound layer, the nitride layer of titanium, the oxynitride layer of titanium, the oxide skin(coating) of tungsten, the nitride layer of tungsten or tungsten.Transition zone is molybdenum layer or Mo alloy.Conductive layer is conductive metal layer.Above-mentioned electrode structure has excellent disappear shadow effect, adhesion and sensitivity.

Description

Electrode structure, Trackpad and touch device
Technical field
The utility model is related to touch-control fields, more particularly to a kind of electrode structure, Trackpad and touch device.
Background technology
Current global economy by means of mobile communication, mobile Internet, cloud computing, Internet of Things, e-commerce development, letter The market demand of breath technology soars, and wide application field is provided for new electronic product.Touching display technology only needs Corresponding pattern is touched on a display screen or type options can be achieved with, to showing the operation of content, man-machine exchange being made to become more Add succinct intuitive.
Touch device mainly uses tin indium oxide (ITO) formation figure to be used as touch control electrode at present.But since touch-control is aobvious Show that panel develops towards the directions such as large scale, highly sensitive, low-response time, ITO electrode resistance is big, the factors such as of high cost limit ITO's further applies.Therefore, the touch technology Metal Mesh (metal meshes of new generation with low resistance and low-cost advantage Lattice) become ITO in middle large scale development formidable opponent.But since metal is nontransparent, while metal is with high reflectance and slightly The problems such as metallic luster so that human eye is easy to find that metal electrode is reflective, experience lf being influenced effect.
Have at present and metal reflective is eliminated using anti-hyun film (AG films), but translucency and display quality can be reduced, also adopts The reflective technology of metal electrode is solved the problems, such as with re-plating blackening layer after metal electrode figure, but existing blackening layer is resistance to The property changed is bad, with the poor adhesive force of metal electrode, and complex process, of high cost and yield are low.
Utility model content
Based on this, a kind of endurance of the utility model offer is excellent with adhesion and can be substantially reduced wherein metal grill The reflective electrode structure of structure, Trackpad and touch device.
A kind of electrode structure is used for touch device, and the electrode structure includes the first blackening layer of lamination successively, transition Layer and conductive layer;
First blackening layer is the oxide of the oxide skin(coating) of molybdenum, the nitride layer of molybdenum, the oxynitride layer of molybdenum, niobium Layer, the nitride layer of niobium, the oxynitride layer of niobium, the oxide skin(coating) of chromium, the nitride layer of chromium, the oxynitride layer of chromium, titanium The nitrogen oxides of oxide skin(coating), the nitride layer of titanium, the oxynitride layer of titanium, the oxide skin(coating) of tungsten, the nitride layer of tungsten or tungsten Layer;The transition zone is molybdenum layer or Mo alloy;The conductive layer is conductive metal layer.
Above-mentioned electrode structure, including the first blackening layer, transition zone and the conductive layer of lamination, the first blackening layer can have successively Effect reduces the reflection of conductive layer surface of metal electrode light, achievees the purpose that reduce reflection, conductive metal disappears shadow, while can expire The preferable endurance requirement that sufficient electrode needs.Transition zone can increase the adhesive force of the first blackening layer and conductive layer, prevent from adding During work, the first blackening layer falls off from conductive electrode.In addition through measuring, transition zone can also further reduce gold Belong to the reflection of electrode surface light, improves the shadow effect that disappears.Conductive layer is the conductive metal layers such as Ag layers, Cu layers or Al layers, compared to biography The touch control electrode ITO of system, the sheet resistance of conductive layer is small, and signal-to-noise ratio is big, effectively improves the sensitivity of touch control electrode.
First blackening layer is molybdenum oxide layer, Molybdenum nitride layers, nitrogen oxidation molybdenum layer, oxidation in one of the embodiments, Niobium layer, niobium nitride layer, nitrogen oxidation niobium layer, chromium oxide layer, chromium nitride layer, nitrogen oxidation layers of chrome, titanium oxide layer, titanium nitride layer, nitrogen oxygen Change titanium layer, tungsten oxide layer, tungsten nitride layer, nitrogen oxidation tungsten layer.
The thickness of first blackening layer is 10nm~100nm in one of the embodiments,;The thickness of the transition zone For 10nm~150nm;The thickness of the conductive layer is 50nm~800nm.
The thickness of first blackening layer is 10nm~50nm in one of the embodiments,.
Further include the protective layer for being laminated in the conductive layer surface in one of the embodiments, the protective layer is molybdenum Layer or Mo alloy.Protective layer can prevent conductive layer as the metal of electrode by corrosion resistance and oxidative resistance, to carry The electrical efficiency of high connductivity layer.
Further include second blackening layer on the surface for being stacked on the protective layer in one of the embodiments,.Described second Blackening layer is oxide skin(coating), the nitride layer of molybdenum or the oxynitride layer of molybdenum of molybdenum.The presence of second blackening layer makes electrode have The structure for having two-sided melanism avoids the melanism layer surface for differentiating electrode and non-melanism layer surface, improves installation and applied metal Packaging efficiency when electrode.In addition, the electric conductivity of the metal with two-sided blackening layer and disappearing shadow effect also more preferably.
The thickness of second blackening layer is 10nm~100nm in one of the embodiments,.
Also lamination has buffer layer and protective layer or described successively on the surface of the conductive layer in one of the embodiments, Protective layer is molybdenum layer or Mo alloy.
A kind of Trackpad, including substrate and the above-mentioned electrode structure for being stacked on the substrate surface.
A kind of touch device, including above-mentioned electrode structure.
Description of the drawings
Fig. 1 is the structural schematic diagram of the Trackpad of an embodiment.
Specific implementation mode
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model, It states.The section Example of the utility model is given in attached drawing.But the utility model can in many different forms come in fact It is existing, however it is not limited to embodiment described herein.Make in the utility model discloses on the contrary, purpose of providing these embodiments is Hold more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Such as Fig. 1, the Trackpad 10 of an embodiment, including substrate 100 and the electrode structure 200 for being stacked on substrate 100.
There is substrate 100 first surface 110, electrode structure 200 to be laminated in first surface 110, and substrate 100 can be glass Substrate, CF substrates (colored filter substrate) or TFT substrate (thin film field effect transistor substrate), or it is well known that Other substrates.
In the illustrated embodiment, electrode structure 200, including it is stacked on the first blackening layer of first surface 110 successively 210, transition zone 220, conductive layer 230, buffer layer 240, protective layer 250 and the second blackening layer 260.
First blackening layer 210 is stacked on the first surface 110 of substrate 100, the first blackening layer 210 be molybdenum oxide skin(coating), The oxidation of the nitride layer of molybdenum, the oxynitride layer of molybdenum, the oxide skin(coating) of niobium, the nitride layer of niobium, the oxynitride layer of niobium, chromium Nitride layer, the nitride layer of chromium, the oxynitride layer of chromium, titanyl compound layer, the nitride layer of titanium, the oxynitride layer of titanium, tungsten Oxide skin(coating), the nitride layer of tungsten or the oxynitride layer of tungsten.The thickness of first blackening layer 210 is 0nm~100nm, preferably For 20nm~50nm.
The first blackening layer 210 is molybdenum oxide layer, Molybdenum nitride layers, nitrogen oxidation molybdenum layer, niobium oxide in one of the embodiments, Layer, niobium nitride layer, nitrogen oxidation niobium layer, chromium oxide layer, chromium nitride layer, nitrogen oxidation layers of chrome, titanium oxide layer, titanium nitride layer, nitrogen oxidation Titanium layer, tungsten oxide layer, tungsten nitride layer, nitrogen oxidation tungsten layer.
The first blackening layer 210 is molybdenum niobium oxide layer or molybdenum niobium nitride layer, molybdenum niobium nitrogen oxygen in one of the embodiments, Compound layer.Molybdenum niobium oxide layer, molybdenum niobium nitride layer, molybdenum niobium oxynitride layer, molybdenum niobium nitrogen oxides have more as blackening layer Good endurance.
The first blackening layer 210 is molybdenum oxide layer, Molybdenum nitride layers or nitrogen oxidation molybdenum layer in one of the embodiments,.
First blackening layer 210 can effectively reduce the reflection of conductive metal layer surface light, reach reduction reflection, metal disappears The purpose of shadow.
In the illustrated embodiment, transition zone 220 is stacked on the surface of the first blackening layer 210.Transition zone 220 is molybdenum layer Or Mo alloy.Thickness 10nm~150nm of transition zone 220, preferably 20nm~100nm.
Mo alloy is molybdenum niobium alloy layer, molybdenum chromium alloy layer, molybdenum titanium alloy layer, the conjunction of molybdenum tungsten in one of the embodiments, Layer gold, molybdenum Nb-Cr alloy layer, molybdenum niobium titanium alloy layer, molybdenum niobium tungsten alloy layer, molybdenum niobium chromium titanium alloy layer, molybdenum niobium chromium tungsten alloy layer, molybdenum Niobium chromium titanium-tungsten layer, molybdenum chromium titanium alloy layer, molybdenum chromium tungsten alloy layer or molybdenum titanium-tungsten layer, preferably molybdenum niobium alloy layer, molybdenum chromium Alloy-layer, molybdenum titanium alloy layer, molybdenum Nb-Cr alloy layer, molybdenum niobium titanium alloy layer, molybdenum niobium chromium titanium alloy layer or molybdenum chromium titanium alloy layer.
The mass content of molybdenum is 60%~95% in Mo alloy in one of the embodiments,.
Transition zone 220 can increase the adhesive force of the first blackening layer and conductive layer, and during preventing processed and applied, first is black Change layer to fall off from conductive layer, enhances the stability of the first blackening layer and conductive layer.
In the illustrated embodiment, conductive layer 230 is stacked on the surface of transition zone 220.Conductive layer 230 is conductive metal Layer.The thickness of conductive layer 230 is 50nm~800nm, preferably 70nm~600nm.
Conductive layer 230 is Ag layers, Cu layers or Al layers in one of the embodiments,.Certainly, in other embodiments, lead Electric layer 230 can also be other conductive metal layers.
Conductive layer 230 is Ag layers, Cu layers in one of the embodiments,.The ductility of metallic copper and silver is fine so that on Electrode structure is stated to can also be applied in flexible touch control device.
Conductive layer 230 is Cu layers in one of the embodiments,.The cost of copper is relatively low, and electric conductivity and ductility are preferable.
Conductive layer 230, as touch control electrode, compares traditional touch control electrode ITO, the sheet resistance of conductive metal layer using metal Small, signal-to-noise ratio is big, effectively improves the sensitivity of touch control electrode.
In the illustrated embodiment, buffer layer 240 is stacked on the surface of conductive layer 230.The thickness of buffer layer 240 is 10nm~80nm, preferably 20nm~60nm.
Buffer layer 240 is albronze layer, ormolu layer, copper-titanium alloy layer, cupro-nickel conjunction in one of the embodiments, Layer gold, copper alumin(i)um zinc alloy layer, copper aluminum titanium alloy layer, batterium alloy layer gold, copper aluminium zinc titanium alloy layer, copper aluminium zinc-nickel alloy layer, copper Aluminium zinc Ti-Ni alloy layer, copper zinc titanium alloy layer, Alfenide layer, copper zinc Ti-Ni alloy layer or copper Ti-Ni alloy layer, preferably Albronze layer, copper-titanium alloy layer, albata layer, copper aluminum titanium alloy layer, batterium alloy layer gold or copper Ti-Ni alloy layer, into one Step is preferably corronil.
Buffer layer 240 is copper alloy layer in one of the embodiments,.The metal of copper alloy layer and conductive layer 230 has Good adhesion, even if conductive layer 230 is not Cu layers, copper alloy layer similarly may serve as buffer layer 240.
240 one side of buffer layer can protect the metal of conductive layer 230 not oxidized and corrode, on the other hand, buffer layer 240 can improve the adhesive force between conductive layer 230 and protective layer 250, improve the stability of conductive layer 230 and protective layer 250.
In the illustrated embodiment, protective layer 250 is stacked on the surface of buffer layer 240.Protective layer 250 is molybdenum layer or molybdenum Alloy-layer.Protective layer 250, which is molybdenum or Mo alloy, to be had endurance, is easy to etching property, can effective protection touch control electrode not By oxidation corrosion.
250 thickness of protective layer is 10nm~100nm, preferably 15nm~70nm.
In one of the embodiments, protective layer 250 be molybdenum layer, molybdenum niobium alloy layer, ambrose alloy titanium alloy layer or copper zinc-aluminium layer, Preferably molybdenum layer or molybdenum niobium layer.
In the illustrated embodiment, the second blackening layer 260 is stacked on the surface of protective layer 250.It should be noted that In some embodiments, the second blackening layer 260 and the first blackening layer 210 can be identical film layer, certainly in some other implementation In mode, the second blackening layer 260 and the first blackening layer 210 are not all same film layer, as long as the second blackening layer 260 and first black Change layer 210 to select out of above-mentioned restriction film layer.Second blackening layer is that thickness is 10nm~100nm, preferably 20nm ~50nm.
The second blackening layer 260 and the first blackening layer 210 of electrode structure 200 form the effect of two-sided melanism, are answered in processing With the melanism layer surface and non-melanism layer surface for, avoiding differentiating in the process electrode, assembling when installation and application electrode is improved Efficiency.In addition, the electric conductivity of the metal with two-sided blackening layer and disappearing shadow effect also more preferably.
It is understood that in other embodiments, electrode structure 200 can be omitted buffer layer 240, protective layer 250 And second at least one of the blackening layer 260.
When 200 omission buffer layers 240 of electrode structure, protective layer 250 and blackening layer are stacked on conductive layer 230 successively Surface.When electrode structure 200 omits buffer layer 240 and protective layer 250, blackening layer 260 is stacked on the surface of conductive layer 230, When electrode structure 200 omits buffer layer 240 and blackening layer 260, protective layer 250 is stacked on the surface of conductive layer 230.
When 200 omission protective layers 250 of electrode structure, buffer layer 240 and blackening layer 260 are stacked on conductive layer successively 230 surface.When electrode structure 200 omits protective layer 250 and blackening layer 260, buffer layer 240 is stacked on conductive layer 230 Surface.
A kind of touch device, including above-mentioned electrode structure 200.
Touch device has good sensitivity.
The preparation method of above-mentioned metal electrode 200, includes the following steps:
S110, the first blackening layer 210 is prepared on substrate.
The first blackening layer 210 is prepared on substrate using magnetron sputtering in one of the embodiments,.
Target is molybdenum alloy or molybdenum, and molybdenum alloy is the alloy or molybdenum of at least one of niobium, chromium, titanium and tungsten with molybdenum, sputtering Gas is argon gas, and reaction gas is oxygen or nitrogen, and plated film power is 1kW~15kW, and coating speed is 0.2m/min~1.1m/ min。
S120, the first blackening layer 210 surface prepare transition zone 220.
Transition zone 220 is prepared on the surface of the first blackening layer 210 using magnetron sputtering in one of the embodiments,.Its In, target is molybdenum alloy or molybdenum, and molybdenum alloy is the alloy of niobium, chromium, titanium, at least one of tungsten with molybdenum, molybdenum in molybdenum alloy target Mass content is 60%~95%.Plated film power is 1kW~15kW, and coating speed is 0.2m/min~1.1m/min.
S130, transition zone 220 surface prepare conductive layer 230.
Conductive layer 230 is prepared on the surface of transition zone 220 using magnetron sputtering in one of the embodiments,.Wherein, target Material is Cu, Al or Ag.Sputter gas is argon gas, and plated film power is 1kW~15kW, and coating speed is 0.2m/min~1.1m/ min。
S140, conductive layer 230 surface prepare buffer layer 240.
Buffer layer 240 is prepared on the surface of conductive layer 230 using magnetron sputtering in one of the embodiments,.Wherein, target Material is the alloy of at least one of Al, Zn, Ti and Ni with copper.Wherein, in copper alloy target copper mass content be 65%~ 95%, sputter gas is argon gas, and plated film power is 1kW~15kW, and coating speed is 0.2m/min~1.1m/min.
S150, buffer layer 240 surface prepare protective layer 250.
Protective layer 250 is prepared on the surface of buffer layer 240 using magnetron sputtering in one of the embodiments,.Wherein, target Material is molybdenum or molybdenum alloy, and molybdenum alloy is the alloy of at least one of niobium, chromium, titanium, tungsten with molybdenum.The quality of molybdenum contains in molybdenum alloy target Amount is 60%~95%, and sputter gas is argon gas, and plated film power is 1kW~15kW, and coating speed is 0.2m/min~1.1m/ min。
The second blackening layer 260 of surface preparation of S160, protective layer 250.
Magnetron sputtering is used to prepare the second blackening layer 260 on the surface of protective layer 250 in one of the embodiments,.Its In,
Target is molybdenum alloy or molybdenum, and molybdenum alloy is the alloy or molybdenum of at least one of niobium, chromium, titanium and tungsten with molybdenum, and molybdenum closes The mass content of molybdenum is 60%~95% in gold target material, and sputter gas is argon gas, and reaction gas is oxygen or nitrogen, plated film power For 1kW~15kW, coating speed is 0.2m/min~1.1m/min.
The preparation method of above-mentioned metal electrode 200, simple process and low cost, it is easy to accomplish.
Specific embodiment
Embodiment 1
The first blackening layer, conductive layer, buffer layer and protective layer are sequentially prepared using magnetron sputtering on the glass substrate.First Blackening layer is molybdenum niobium oxide layer, and MoNb alloy target materials (Mo and Nb mass percents difference 80%, 20%) are the first blackening layer Sputtering target material.The sputter gas argon gas of first blackening layer, reaction gas are oxygen.Conductive layer is Cu layers, target material Cu, is delayed It is albata layer to rush layer, and (mass percent of Cu and Ni are respectively than being 75% for CuNi alloy target materials:25%) it is buffer layer Sputtering target material.Protective layer is molybdenum niobium alloy layer, and MoNb alloy target materials (Mo and Nb mass percents difference 80%, 20%) are protection The sputtering target material of layer.Preparing the first blackening layer, conductive layer, buffer layer and when protective layer, plated film power be respectively 1kW, 4kW, 1kW and 2kW, coating speed are respectively 1.1m/min, 0.4m/min, 1m/min and 0.5m/min.
The thickness for the first blackening layer, conductive layer, buffer layer and the protective layer that embodiment 1 is prepared is shown in Table 1.
Embodiment 2
The first blackening layer, transition zone, conductive layer, buffer layer and protection are sequentially prepared using magnetron sputtering on the glass substrate Layer.First blackening layer is molybdenum niobium oxide layer, and MoNb alloy target materials (Mo and Nb mass percents difference 80%, 20%) are first The sputtering target material of blackening layer, the sputter gas argon gas of the first blackening layer, reaction gas is oxygen.Transition zone is molybdenum niobium alloy layer, MoNb alloy target materials (Mo and Nb mass percents distinguish 80%, 20%) are the sputtering target material of transition zone.Conductive layer is Cu layers, target Material is Cu.Buffer layer is albata layer, and using CuNi alloy target materials, (mass percent of Cu and Ni are respectively than for 75%: 25%) it is buffer layer sputtering target material.Protective layer is molybdenum niobium alloy layer, and MoNb alloy target materials (distinguish by Mo and Nb mass percents 80%, 20%) be protective layer sputtering target material.When preparing the first blackening layer, transition zone, conductive layer, buffer layer and protective layer, plating Film power is respectively 7kW, 8kW, 5kW, 6kW and 4kW, coating speed be respectively 0.8m/min, 0.6m/min, 0.4m/min, 0.8m/min and 0.5m/min.
The thickness value for the first blackening layer, transition zone, conductive layer, buffer layer and the protective layer that embodiment 2 is prepared is shown in Table 1。
Embodiment 3
The first blackening layer, transition zone, conductive layer, protective layer and second are sequentially prepared using magnetron sputtering on the glass substrate Blackening layer.First blackening layer is the nitride layer of molybdenum, and molybdenum target is the sputtering target material of the first blackening layer, the sputtering gas of the first blackening layer Body argon gas, reaction gas are nitrogen.Transition zone is molybdenum layer, and molybdenum target is the sputtering target material of transition zone.Conductive layer is Al layers, target material For Al.Protective layer is molybdenum layer, and molybdenum target is protective layer sputtering target material.Second blackening layer is the nitride layer of molybdenum, and molybdenum target is second black Change the sputtering target material of layer, the sputter gas argon gas of the second blackening layer, reaction gas is nitrogen.Preparing the first blackening layer, transition When layer, conductive layer, protective layer and the second blackening layer, plated film power is respectively 10kW, 8kW, 6kW, 4kW and 7kW, coating speed point It Wei not 0.5m/min, 0.6m/min, 0.4m/min, 0.3m/min and 0.4m/min.
The thickness value of the first blackening layer, transition zone, conductive layer, protective layer and the second blackening layer that embodiment 3 is prepared It is shown in Table 1.
Embodiment 4
The first blackening layer, transition zone, conductive layer and protective layer are sequentially prepared using magnetron sputtering on the glass substrate.First Blackening layer is molybdenum titanium-nitrogen-oxygen compound layer, MoTi alloy target materials (Mo and Ti mass percents difference 90%:10%) it is the first melanism The sputtering target material of layer, the sputter gas argon gas of the first blackening layer, reaction gas are the mixed gas of oxygen and nitrogen, wherein oxygen Account for the 60% of mixed gas volume.Transition zone is molybdenum titanium alloy layer, and (mass percent of Mo and Ti compare MoTi alloy target materials respectively It is 90%:10%) it is the sputtering target material of transition zone.Conductive layer is Cu layers, target material Cu.Protective layer is molybdenum titanium alloy layer, (mass percent of Mo and Ti are respectively than being 90% for MoTi alloy target materials:10%) it is that protective layer sputtering target material is black in preparation first When changing layer, transition zone, conductive layer and protective layer, plated film power is respectively 15kW, 12kW, 10KW and 12KW, coating speed difference For 0.3m/min, 0.6m/min, 0.5m/min and 0.5m/min.
The thickness value for the first blackening layer, transition zone, conductive layer and the protective layer that embodiment 4 is prepared is shown in Table 1.
Table 1
Note:HAIndicate the thickness of corresponding first blackening layer, HBIndicate the thickness of transition zone, HCIndicate the thickness of conductive layer, HD Indicate the thickness of buffer layer, HEIndicate the thickness of protective layer, HFThe thickness of second blackening layer respectively;"/" indicate without.
Metal electrode obtained by Examples 1 to 4 is tested, wherein carrying out blackening layer attachment using hundred lattice test methods Power is tested, and conductive layer sheet resistance test is carried out using four-point probe, and metal electrode is tested using ultraviolet-visible spectrophotometer Visible light wave range reflectivity, test result are as shown in table 2.
Table 2
As can be seen from Table 2, the adhesive force of the blackening layer of embodiment 2~4 be far above embodiment 1, and 400nm~ Average reflectance at 760nm is again smaller than embodiment 1.
In addition, in the case of embodiment 2-4, the more excellent metal electrode of endurance can be obtained, touch-control is fully met The requirement of plate extends the service life of touch device.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of electrode structure is used for touch device, which is characterized in that the electrode structure includes the first melanism of lamination successively Layer, transition zone and conductive layer;
First blackening layer is the oxide skin(coating) of molybdenum, the nitride layer of molybdenum, the oxynitride layer of molybdenum, the oxide skin(coating) of niobium, niobium Nitride layer, the oxynitride layer of niobium, the oxide skin(coating) of chromium, the nitride layer of chromium, the oxynitride layer of chromium, titanyl compound The oxynitride layer of layer, the nitride layer of titanium, the oxynitride layer of titanium, the oxide skin(coating) of tungsten, the nitride layer of tungsten or tungsten;
The transition zone is molybdenum layer or Mo alloy;
The conductive layer is conductive metal layer.
2. electrode structure according to claim 1, which is characterized in that first blackening layer is molybdenum oxide layer, molybdenum nitride Layer, nitrogen oxidation molybdenum layer, niobium oxide layer, niobium nitride layer, nitrogen oxidation niobium layer, chromium oxide layer, chromium nitride layer, nitrogen oxidation layers of chrome, oxidation Titanium layer, titanium nitride layer, nitrogen oxidation titanium layer, tungsten oxide layer, tungsten nitride layer, nitrogen oxidation tungsten layer.
3. electrode structure according to claim 1, which is characterized in that the thickness of first blackening layer be 10nm~ 100nm;The thickness of the transition zone is 10nm~150nm;The thickness of the conductive layer is 50nm~800nm.
4. electrode structure according to claim 1, which is characterized in that the conductive layer is layers of copper, silver layer or aluminium layer.
5. electrode structure according to claim 1, which is characterized in that further include the protection for being laminated in the conductive layer surface Layer, the protective layer are molybdenum layer or Mo alloy.
6. electrode structure according to claim 5, which is characterized in that further include the of the surface for being laminated in the protective layer Two blackening layers, second blackening layer are oxide skin(coating), the nitride layer of molybdenum or the oxynitride layer of molybdenum of molybdenum.
7. electrode structure according to claim 6, which is characterized in that the thickness of second blackening layer be 10nm~ 100nm。
8. electrode structure according to claim 1, which is characterized in that further include stacking gradually in the surface of the conductive layer Buffer layer and protective layer;The protective layer is molybdenum layer or Mo alloy.
9. a kind of Trackpad, which is characterized in that including substrate and be stacked on any one of the claim 1~8 of the substrate surface The electrode structure.
10. a kind of touch device, which is characterized in that including claim 1~8 any one of them electrode structure.
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CN109343749A (en) * 2018-12-21 2019-02-15 信利光电股份有限公司 A kind of touch-control sensor and a kind of touch-control display panel
CN109917968A (en) * 2019-03-28 2019-06-21 京东方科技集团股份有限公司 A kind of conductive structure, touch-control structure and touch control display apparatus
CN109917975A (en) * 2019-03-07 2019-06-21 信利光电股份有限公司 Red touch module of one and preparation method thereof and touch control display apparatus
WO2020124919A1 (en) * 2018-12-18 2020-06-25 武汉华星光电半导体显示技术有限公司 Touch screen assembly, manufacturing method for touch screen assembly, and touch device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020124919A1 (en) * 2018-12-18 2020-06-25 武汉华星光电半导体显示技术有限公司 Touch screen assembly, manufacturing method for touch screen assembly, and touch device
CN109343749A (en) * 2018-12-21 2019-02-15 信利光电股份有限公司 A kind of touch-control sensor and a kind of touch-control display panel
CN109343749B (en) * 2018-12-21 2021-12-17 信利光电股份有限公司 Touch sensor and touch display panel
CN109917975A (en) * 2019-03-07 2019-06-21 信利光电股份有限公司 Red touch module of one and preparation method thereof and touch control display apparatus
CN109917968A (en) * 2019-03-28 2019-06-21 京东方科技集团股份有限公司 A kind of conductive structure, touch-control structure and touch control display apparatus

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