US20150050866A1 - Polishing pad, polishing apparatus and method for manufacturing polishing pad - Google Patents

Polishing pad, polishing apparatus and method for manufacturing polishing pad Download PDF

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Publication number
US20150050866A1
US20150050866A1 US14/456,237 US201414456237A US2015050866A1 US 20150050866 A1 US20150050866 A1 US 20150050866A1 US 201414456237 A US201414456237 A US 201414456237A US 2015050866 A1 US2015050866 A1 US 2015050866A1
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US
United States
Prior art keywords
polishing pad
polishing
fiber filaments
foaming resin
auxiliary fiber
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/456,237
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English (en)
Inventor
Chung-Chih Feng
I-Peng Yao
Yung-Chang Hung
Wen-Chieh Wu
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San Fang Chemical Industry Co Ltd
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San Fang Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Fang Chemical Industry Co Ltd filed Critical San Fang Chemical Industry Co Ltd
Assigned to SAN FANG CHEMICAL INDUSTRY CO., LTD. reassignment SAN FANG CHEMICAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, CHUNG-CHIH, HUNG, YUNG-CHANG, WU, WEN-CHIEH, YAO, I-PENG
Publication of US20150050866A1 publication Critical patent/US20150050866A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Definitions

  • the present invention relates to a polishing pad, a polishing apparatus, and a method for manufacturing the polishing pad.
  • Polishing generally refers to a wear control for a preliminary coarse surface in a process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a substrate against the polishing pad and then rubs the substrate repeatedly with a regular motion.
  • the substrate may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel.
  • a polishing pad must be used for polishing the substrate, and the quality of the polishing pad directly influences the polishing effect of the substrate.
  • FIG. 1 shows a schematic view of a polishing apparatus with a conventional polishing pad.
  • the polishing apparatus 1 includes a lower base plate 11 , a mounting sheet 12 , a substrate 13 , an upper base plate 14 , a polishing pad 15 and slurry 16 .
  • the lower base plate 11 is positioned opposite to the upper base plate 14 .
  • the mounting sheet 12 is adhered to the lower base plate 11 through an adhesive layer (not shown) and is used for carrying and mounting the substrate 13 .
  • the polishing pad 15 is mounted on the upper base plate 14 , and faces to the lower base plate 11 for polishing the substrate 13 .
  • the operation mode of the polishing apparatus 1 is as follows. First, the substrate 13 is mounted on the mounting sheet 12 , and then both the upper and lower base plates 14 and 11 are rotated and the lower base plate 11 is simultaneously moved downward, such that the polishing pad 15 contacts the surface of the substrate 13 , and a polishing operation for the substrate 13 may be performed by continuously supplementing the slurry 16 and using the effect of the polishing pad 15 .
  • FIG. 2 shows a sectional view of a first conventional polishing pad.
  • the polishing pad 25 is a non-woven-fabric-type polishing pad comprising a plurality of fiber filaments 251 and a resin 252 .
  • a method for manufacturing the polishing pad 25 is using a composite material including the velvet or suede-like fiber filaments 251 and the resin 252 .
  • the fiber filaments 251 are manufactured by a non-woven producing method such as needle felting, cotton carding or cotton folding, and the produced fiber filaments are intertwined with each other. Then, a non-woven fabrics formed by the fiber filaments 251 are immersed in a thermoplastic polyurethane resin 252 to form a softer thin slice having high compressed transformation by wet solidification.
  • the planarization of a polishing surface is poor. Furthermore, the hardness of the polishing pad 25 is not enough, so the polishing pad 25 is not suitable for coarse polishing, and the life span of the polishing pad 25 is short.
  • FIG. 3 shows a sectional view of a second conventional polishing pad.
  • U.S. Pat. No. 5,578,362 discloses a polishing pad 35 that is an independent foaming-type polishing pad comprising a plurality of holes 353 and a resin 352 .
  • a method for manufacturing the polishing pad 35 is filling the resin 352 (which is usually a foaming polymer formed by thermoplastic polyurethane) into a columnar mold. After cooling and solidifying, the polishing pad is produced by cutting the resin into slices.
  • the polishing pad 35 is harder and more wearable than the first conventional polishing pad 25 (shown in FIG. 2 ) and has an independent bubble structure, which is often used in high planarization polishing.
  • the biggest problem of the polishing pad 35 is that the concentration of the resin 352 is not easy to be uniformly distributed in the columnar mold.
  • the differences between the temperature distributions of each position in the columnar mold cause the various sizes and uneven distribution of the holes 353 , and the forming is difficult to be controlled.
  • the holes 353 with different sizes of a sliced surface are more obvious.
  • the holes 353 are not connected to each other and slurry is not easy to flow there between.
  • the slurry is unable to infiltrate into the interior region of the polishing pad, which reduces the slurry retention rate of the surface.
  • due to the high hardness, low heat compression rate it is easy to scrap the substrate to be polished and the polishing pad 35 is only suitable for coarse polishing.
  • the present invention is to add a plurality of auxiliary fiber filaments in an independent foaming-type polishing pad, and the polishing pad obtained has high hardness of the independent foaming-type polishing pad. Additionally, the polishing pad has advantages of a non-woven-fabric-type polishing pad such as improving polishing uniformity, and partial elasticity. Furthermore, slurry can also infiltrate into the interior region by the auxiliary fiber filaments which can increase the slurry retention rate of the polishing pad.
  • the present invention provides a polishing pad comprising:
  • the present invention also provides a polishing apparatus comprising:
  • the present invention further provides a method for manufacturing the aforementioned polishing pad comprising:
  • the present invention further provides a method for manufacturing the aforementioned polishing pad comprising:
  • FIG. 1 shows a schematic view of a polishing apparatus with a conventional polishing pad.
  • FIG. 2 shows a sectional view of a first conventional polishing pad
  • FIG. 3 shows a sectional view of a second conventional polishing pad
  • FIG. 4 shows a sectional view of a polishing pad according to the present invention.
  • FIG. 5 shows a schematic view of a polishing apparatus with a polishing pad according to the present invention.
  • the present invention provides a polishing pad (shown in FIG. 4 ) comprising:
  • foaming resin frame refers to a main part of a polishing pad which is substantially formed by a foaming resin.
  • the foaming resin according to the invention is, preferably, an elastomer.
  • the term “elastomer,” also known as “elastic polymer,” refers to a type of polymer that exhibits rubber-like qualities. When polishing, the elastomer serves as a good buffer to avoid scraping a surface of the substrate to be polished.
  • the term “foaming resin” refers to a material containing a thermoplastic resin and a thermodecomposing foaming agent.
  • the resin comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic rubber, polystyrene, poly aromatic molecules, fluorine-containing polymer, polyimide, crosslinked polyurethane, crosslinked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethene, poly (ethylene terephthalate), poly aromatic amide, polyarylalkene, polymethyl methacrylate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof.
  • a manner of foaming the resin according the invention can be chemically foaming or physically foaming, wherein the chemically foaming manner uses an agent to carry on a chemical reaction to yield gas for being evenly distributed in the resin composition.
  • the physically foaming manner comprises infiltrating gas into the resin composition for being evenly distributed in the resin composition by stirring.
  • the foaming resin frame according the invention comprises a plurality of holes which are formed by foaming.
  • the holes are continuous holes or independent holes.
  • continuous holes refers to at least two holes connecting to each other to form holes similar to ant nests.
  • the continuous holes are formed by chemically foaming
  • independent holes refers to holes which are independent without connecting to each other, and are similar to bubbles.
  • the independent holes are formed by physically foaming.
  • the holes are independent holes, wherein each of a plurality of holes is independent.
  • the term “fiber” as used herein refers to a single fiber or composite fiber; preferably, the fiber is a composite fiber. Artisans skilled in this field can choose the fiber according to the material to be polished. Artisans skilled in this field can choose suitable kinds of fibers according to the disclosure of the specification by coordination the compatibility between the foaming resin frame and fibers.
  • the auxiliary fiber filaments according the invention have a filamentous structure; preferably, the filamentous structure is a short filamentous or short rod-like structure.
  • each of the auxiliary fiber filaments is independent which does not form a net structure, and the auxiliary fiber filaments are not interlaced, also not bonded, weaved, knitted, piled or stitched to form a fabric.
  • the length of the auxiliary fiber filaments is from about 0.1 mm to about 1.0 mm; preferably from about 0.2 mm to about 0.8 mm; more preferably from about 0.4 mm to about 0.6 mm.
  • the thickness of the auxiliary fiber filaments is from about 2 denier to about 5 denier.
  • the auxiliary fiber filaments are made of at least one material selected from the group consisting of polyamide, terephthalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, and polyacrylonitrile, and many kinds of materials of the auxiliary fiber filaments can be applied in the same polishing pad.
  • a suitable content of the auxiliary fiber filaments according to the invention can be chosen by the hardness, the removing rate and the slurry retention rate.
  • the ratio of the auxiliary fiber filaments is from about 1% to about 30% by weight; more preferably from about 5% to about 20% by weight.
  • a plurality of the auxiliary fiber filaments protrude from a surface of the foaming resin frame, wherein the auxiliary fiber filaments are semi-inlaid or semi-sunk in the foaming resin frame and semi-exposed on the surface of a polishing pad which form a structure similar to fluff.
  • the polishing pad according to the embodiment due to the soft auxiliary fiber filaments protruding on the surface can further reduce the scratche probability of a substrate to be polished, and it can also increase the slurry retention rate on the surface of the polishing pad which can promote the polishing effect.
  • a plurality of the auxiliary fiber filaments are added in the polishing pad, preferably in the independent foaming-type polishing pad which has the advantages of the independent foaming-type polishing pad such as high hardness. Additionally, the polishing pad has advantages of the non-woven-fabric-type polishing pad such as improving polishing uniformity, and partial elasticity. Furthermore, slurry can also infiltrate into the interior region by the auxiliary fiber filaments which can increase the slurry retention rate of the polishing pad
  • the polishing pad further comprises a plurality of polishing particles which are dispersed randomly in the foaming resin frame and can locate in a resin part or in a hole part of the foaming resin frame.
  • the polishing particles comprise cerium dioxide, silicon dioxide, aluminum oxide, yttrium oxide, or ferric oxide. Additionally, the particle diameter of the polishing particle is from 0.01 ⁇ M to 10 ⁇ M.
  • the invention also provides a polishing apparatus comprising:
  • polishing apparatus further comprising:
  • FIG. 5 shows a schematic view of a polishing apparatus according to the polishing pad of the invention.
  • the polishing apparatus 5 includes a lower base plate 51 , a mounting sheet 52 , a substrate 53 , an upper base plate 54 , a polishing pad 55 and slurry 56 .
  • the lower base plate 51 is positioned opposite to the upper base plate 54 .
  • the mounting sheet 52 is adhered to the lower base plate 51 through an adhesive layer (not shown) and is used for carrying and mounting the substrate 53 .
  • the polishing pad 55 is mounted on the upper base plate 54 , and faces to the lower base plate 51 for polishing the substrate 53 .
  • the operation mode of the polishing apparatus 5 is as follows. First, the substrate 53 is mounted on the mounting sheet 52 , and then both the upper and lower base plates 54 and 51 are rotated and the lower base plate 51 is simultaneously moved downward, such that the polishing pad 55 contacts the surface of the substrate 53 , and the substrate 53 may be performed by continuously supplementing the slurry 56 and using the effect of the polishing pad 55 .
  • the present invention also provides a first method for manufacturing the aforementioned polishing pad comprising:
  • carrier refers to an element which allows the foaming resin composition formed thereon and the foaming resin composition can be easily removed after curing.
  • the carrier is a sheet; in another aspect, the carrier is a releasing material.
  • releasing material refers to a material which does not react with the foaming resin composition in the polishing pad manufacturing process and the foaming resin composition can be easily removed after the curing.
  • the releasing material is “a film with low permeability.”
  • film with low permeability refers to a film or thin film that substantially prevents the foaming resin composition on an upper surface of the film with low permeability according to the invention from permeating to a lower surface of the film with low permeability.
  • the film with low permeability can be formed on a base material, for example, a paper.
  • the carrier comprises a polyethylene glycol terephthalate film, a polypropylene film, a polycarbonate film, a polyethylene film, a polyethylene terephthalate film, a releasing paper or a releasing fabric.
  • the preferable polypropylene is oriented polypropylene.
  • the carrier is continuously provided, for example, is a rolling releasing material.
  • the rolling releasing material can be used by roll to roll. Comparing to the conventional manufacture relative to molding or casting a single polishing pad, the method according to the invention improves batch uniformity.
  • the foaming resin composition comprises a resin, a foaming agent, and a bridging agent.
  • bridging agent refers to an agent that may generate a crosslinked reaction with the resin according to the invention and cure the resin under an appropriate condition.
  • the kind of the bridging agent is determined according to the kind of the resin.
  • the step (d) according to the invention is randomly dispersing the auxiliary fiber filaments of the step (c) in the foaming resin composition of the step (b).
  • the manner may be chosen by artisans skilled in this field, for example, mixing or stirring together with components of the foaming resin composition to obtain the foaming resin composition and randomly dispersing the auxiliary fiber filaments in the foaming resin composition at the same time.
  • the steps (b), (c), and (d) can be performed at the same time.
  • the step (d) comprises blade coating, printing wheel coating, roll extrusion coating or spraying.
  • the manner of coating may be chosen by artisans skilled in this field. Besides, the preferred coating is continuously coating.
  • the step (f) is curing the foaming resin composition of the step (e).
  • the manner of curing may be chosen by artisans skilled in this field according to the kind of the curing resin and the optional bridging agent.
  • the curing step is curing the foaming resin composition which has been dried at a high temperature of 60° C. to 130° C.
  • the method further comprises a step (g) of removing the carrier.
  • the step of removing the carrier is removing the polishing pad from manufacturing equipment after the manufacture method is completed.
  • the step of removing the carrier is removing the carrier from the polishing pad when polishing.
  • the specific manner of the removing depends on the carrier, for example, the manner is peeling.
  • the present invention also provides a second method for manufacturing the aforementioned polishing pad comprising:
  • the steps (b), (c), (d), and (f) are practiced in the same manners of the aforementioned first method for manufacturing the polishing pad.
  • the mold of the step (a) is a cylindrical mold.
  • the manner may be chosen by artisans skilled in this field.
  • the step (e) is to fill the foaming resin composition with the randomly dispersed auxiliary fiber filaments of the step (d) in the cavity of the mold of the step (a).
  • the manner may be chosen by artisans skilled in this field.
  • the step (g) according to the invention is to slice the cured foaming resin composition of the step (f) for obtaining the polishing pad.
  • the manner may be chosen by artisans skilled in this field, for example, using a knife to shave a cured resin into slices for manufacturing the polishing pad.
  • the first or second method for manufacturing the polishing pad further comprises a surface finishing step, which is finishing a surface of the cured resin composition.
  • the embodiment of finishing is polishing or shaving a part of the surface.
  • the manner of polishing or shaving the part of the surface may be chosen by artisans skilled in this field, for example, using sandpaper to polish or a knife to shave; wherein the manners of the polishing or shaving are well known to artisans skilled in this field.
  • a resin composition is stirred uniformly and air is infiltrated into the resin composition at a rate of 1000 rpm to 4000 rpm. Then, the resin composition is coated on a releasing paper with a scraper. The resin composition is cured at 110° C. for 1 minute, and then dried at 80° C. for 30 seconds in an oven, and the surface is shaved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US14/456,237 2013-08-16 2014-08-11 Polishing pad, polishing apparatus and method for manufacturing polishing pad Abandoned US20150050866A1 (en)

Applications Claiming Priority (2)

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TW102129406 2013-08-16
TW102129406A TWI590918B (zh) 2013-08-16 2013-08-16 硏磨墊、硏磨裝置及製造硏磨墊之方法

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Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871393A (en) * 1996-03-25 1999-02-16 Chiyoda Co., Ltd. Mounting member for polishing
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US6454633B1 (en) * 1997-04-04 2002-09-24 Rodel Holdings Inc. Polishing pads of flocked hollow fibers and methods relating thereto
US6623341B2 (en) * 2000-01-18 2003-09-23 Applied Materials, Inc. Substrate polishing apparatus
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2004202668A (ja) * 2002-12-26 2004-07-22 Rodel Nitta Co 研磨クロス
US20050079805A1 (en) * 2000-06-23 2005-04-14 International Business Machines Corporation Fiber embedded polishing pad
US20050112354A1 (en) * 2003-11-25 2005-05-26 Fuji Spinning Co., Ltd. Polishing sheet and manufacturing method of elastic plastic foam sheet
US20050250431A1 (en) * 2004-05-05 2005-11-10 Iv Technologies Co., Ltd. Single-layer polishing pad and method of producing the same
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
US20080064310A1 (en) * 2006-09-08 2008-03-13 Chung-Chih Feng Polishing pad having hollow fibers and the method for making the same
US20110177305A1 (en) * 2010-01-20 2011-07-21 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same
US20110223844A1 (en) * 2010-03-10 2011-09-15 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same
US20130012108A1 (en) * 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
US8546260B2 (en) * 2008-09-04 2013-10-01 Innopad, Inc. Fabric containing non-crimped fibers and methods of manufacture
US20150099439A1 (en) * 2013-10-03 2015-04-09 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5871393A (en) * 1996-03-25 1999-02-16 Chiyoda Co., Ltd. Mounting member for polishing
US6454633B1 (en) * 1997-04-04 2002-09-24 Rodel Holdings Inc. Polishing pads of flocked hollow fibers and methods relating thereto
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US6623341B2 (en) * 2000-01-18 2003-09-23 Applied Materials, Inc. Substrate polishing apparatus
US20050079805A1 (en) * 2000-06-23 2005-04-14 International Business Machines Corporation Fiber embedded polishing pad
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
JP2004202668A (ja) * 2002-12-26 2004-07-22 Rodel Nitta Co 研磨クロス
US20050112354A1 (en) * 2003-11-25 2005-05-26 Fuji Spinning Co., Ltd. Polishing sheet and manufacturing method of elastic plastic foam sheet
US20050250431A1 (en) * 2004-05-05 2005-11-10 Iv Technologies Co., Ltd. Single-layer polishing pad and method of producing the same
US20080064310A1 (en) * 2006-09-08 2008-03-13 Chung-Chih Feng Polishing pad having hollow fibers and the method for making the same
US8546260B2 (en) * 2008-09-04 2013-10-01 Innopad, Inc. Fabric containing non-crimped fibers and methods of manufacture
US20130012108A1 (en) * 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
US20110177305A1 (en) * 2010-01-20 2011-07-21 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same
US20110223844A1 (en) * 2010-03-10 2011-09-15 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same
US20150099439A1 (en) * 2013-10-03 2015-04-09 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same

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